JP2006165646A - Image pickup apparatus - Google Patents

Image pickup apparatus Download PDF

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JP2006165646A
JP2006165646A JP2004349684A JP2004349684A JP2006165646A JP 2006165646 A JP2006165646 A JP 2006165646A JP 2004349684 A JP2004349684 A JP 2004349684A JP 2004349684 A JP2004349684 A JP 2004349684A JP 2006165646 A JP2006165646 A JP 2006165646A
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shield case
substrate
image pickup
voltage power
imaging device
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Koji Murai
康治 村井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel image pickup apparatus capable of suppressing unwanted radiation due to a high-voltage power source circuit for generating a driving voltage of an image pickup element, and being easily fixed on a mobile communication device such as a cellular phone. <P>SOLUTION: The image pickup apparatus is provided with a substrate, image pickup element provided on this substrate, optical unit provided on the image pickup element, high-voltage power source circuit provided on the substrate and generating a driving voltage of the image pickup element, shielding case exposing the surface portion of the optical unit and electromagnetically shielding the high-voltage power source circuit, and fixed portion continuing to the shielding case and extending to the outside of the shielding case and fixed on the mobile communication device. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、携帯電話等の移動体通信装置に搭載される撮像装置に関する。   The present invention relates to an imaging device mounted on a mobile communication device such as a mobile phone.

従来、この種の撮像装置に関し、例えば、特開平８−１９５８９９号公報に記載されたものがあった。   Conventionally, this type of imaging apparatus has been disclosed in, for example, Japanese Patent Laid-Open No. 8-195899.

公開特許公報 特開平８−１９５８９９号公報Japanese Patent Laid-Open No. 8-195899

特許文献１には、撮像素子を基板に固定し、その撮像素子を覆うレンズ鏡筒の外周面にレンズ鏡筒固定用のフランジを外方に突出させ、このフランジに穴を設け、この穴にねじを装着してレンズ鏡筒を基板に固定し、レンズ鏡筒の取り付け位置全体を覆うように、ノイズを遮光するためのシールドケースが基板の上面に取付けられるとともに、その基板にはビデオ回路が搭載され、シールドケース及びビデオ回路は上下側半体により覆うようにして撮像装置を完成させているものが記載されている。   In Patent Document 1, an imaging device is fixed to a substrate, a lens barrel fixing flange is projected outwardly on the outer peripheral surface of the lens barrel covering the imaging device, a hole is provided in the flange, A lens case is fixed to the board by attaching screws, and a shield case for shielding noise is attached to the upper surface of the board so as to cover the entire mounting position of the lens barrel, and a video circuit is mounted on the board. It is described that the image pickup apparatus is completed by covering the shield case and the video circuit with the upper and lower halves.

ところが、特許文献１に記載の発明では、レンズ鏡筒の外周面にレンズ鏡筒固定用のフランジを外方に突出させているので、レンズ鏡筒を備えた撮像装置を携帯電話に装着する場合に、撮像装置を取付ける位置やその周囲の形状等によってはそのフランジのレンズ鏡筒に対する配置を変更しないと、携帯電話に装着できない場合がある。このときには、そのフランジの配置を変更する際に、レンズ鏡筒全体を取り替える必要がある。しかし、レンズ鏡筒自体の変更・取り替えは、撮像素子に対するレンズ位置等の精度が要求されるため、レンズ鏡筒の変更・取り替えは必ずしも容易ではないという課題があった。なお、特許文献１には、各種の移動体通信装置（例えば、携帯電話）にかかる撮像装置を固定する場合における具体的な固定手段については記載されていないものである。   However, in the invention described in Patent Document 1, since the lens barrel fixing flange is protruded outwardly on the outer peripheral surface of the lens barrel, when an imaging device equipped with the lens barrel is mounted on a mobile phone In addition, depending on the position where the imaging device is attached and the surrounding shape, the arrangement of the flange with respect to the lens barrel may not be able to be attached to the mobile phone. At this time, when changing the arrangement of the flange, it is necessary to replace the entire lens barrel. However, the change / replacement of the lens barrel itself requires accuracy such as the lens position with respect to the image sensor, and thus there is a problem that the change / replacement of the lens barrel is not always easy. Note that Patent Document 1 does not describe specific fixing means when fixing an imaging device according to various mobile communication devices (for example, mobile phones).

そこで、この発明は、上記のような課題点を解消するためになされたもので、撮像素子の駆動電圧を生成する高圧電源回路による不要輻射を抑圧するとともに、携帯電話等の移動体通信装置に容易に固定し得る新規な撮像装置を提供することを目的とする。   Therefore, the present invention has been made to solve the above-described problems, and suppresses unnecessary radiation caused by a high-voltage power supply circuit that generates a driving voltage for an image sensor, and is applied to a mobile communication device such as a mobile phone. An object of the present invention is to provide a novel imaging device that can be easily fixed.

請求項１の発明に係る撮像装置は、基板と、この基板上に設けられた撮像素子と、この撮像素子上に設けられた光学ユニットと、前記基板上に設けられ、前記撮像素子の駆動電圧を生成する高圧電源回路と、前記光学ユニットの表面部を露出させ、前記高圧電源回路を電磁シールドするシールドケースと、このシールドケースに連続して前記シールドケースの外側に延び、移動体通信装置に固定される固定部とを備えたものである。   An image pickup apparatus according to a first aspect of the present invention includes a substrate, an image pickup device provided on the substrate, an optical unit provided on the image pickup device, a drive voltage of the image pickup device provided on the substrate. A high-voltage power supply circuit that generates a surface, a shield case that exposes a surface portion of the optical unit and electromagnetically shields the high-voltage power supply circuit, and extends continuously outside the shield case to the mobile communication device. And a fixed portion to be fixed.

請求項２の発明に係る撮像装置は、基板と、この基板上に設けられた撮像素子と、この撮像素子上に設けられた光学ユニットと、前記基板上に設けられ、前記撮像素子から出力される映像信号をＡＤ変換するＡＤ変換回路と、前記基板上に設けられ、前記撮像素子の駆動電圧を生成し、前記ＡＤ変換回路に電力を供給する高圧電源回路と、前記光学ユニットの表面部を露出させ、前記ＡＤ変換回路及び前記高圧電源回路を電磁シールドするシールドケースと、このシールドケースに連続して前記シールドケースの外側に延び、移動体通信装置に固定される固定部とを備えたものである。 An image pickup apparatus according to a second aspect of the present invention is a substrate, an image pickup device provided on the substrate, an optical unit provided on the image pickup device, and provided on the substrate and output from the image pickup device. An AD conversion circuit that AD converts a video signal to be generated, a high-voltage power supply circuit that is provided on the substrate, generates a drive voltage for the imaging device, and supplies power to the AD conversion circuit, and a surface portion of the optical unit. A shield case that is exposed and electromagnetically shields the AD converter circuit and the high-voltage power supply circuit, and a fixed portion that extends to the outside of the shield case continuously to the shield case and is fixed to the mobile communication device. It is.

請求項３の発明に係る撮像装置は、前記シールドケースの対向する両端部を屈曲させ、前記固定部をその屈曲した各先端に連続して形成した請求項１又は２に記載のものである。 An imaging device according to a third aspect of the present invention is the imaging device according to the first or second aspect, wherein both opposing ends of the shield case are bent, and the fixing portion is formed continuously at each bent tip.

請求項４の発明に係る撮像装置は、前記固定部と前記シールドケースとを一体成形した請求項１〜３のいずれかに記載のものである。 An imaging device according to a fourth aspect of the present invention is the imaging apparatus according to any one of the first to third aspects, wherein the fixed portion and the shield case are integrally molded.

請求項５の発明に係る撮像装置は、前記シールドケースを導電性樹脂により形成した請求項１〜４のいずれかに記載のものである。 The imaging device according to a fifth aspect of the present invention is the imaging apparatus according to any one of the first to fourth aspects, wherein the shield case is formed of a conductive resin.

請求項６の発明に係る撮像装置は、前記固定部を接地した請求項１〜５のいずれかに記載のものである。 An imaging device according to a sixth aspect of the present invention is the imaging apparatus according to any one of the first to fifth aspects, wherein the fixed portion is grounded.

請求項７の発明に係る撮像装置は、螺子により前記固定部を前記移動体通信装置に固定した請求項１〜６のいずれかに記載のものである。 An image pickup apparatus according to a seventh aspect of the present invention is the image pickup apparatus according to any one of the first to sixth aspects, wherein the fixed portion is fixed to the mobile communication device by a screw.

以上のようにこの発明によれば、撮像素子の駆動電圧を生成する高圧電源回路を電磁シールドするシールドケースに対し、このシールドケースにその外側に延びる固定部を設け、この固定部により移動体通信装置に取付けるため、その取付ける位置等によってもそのシールドケースを変更・取り替えるだけで携帯電話等の移動体通信装置に容易に固定することが可能とより、高圧電源回路による不要輻射をも抑圧することができるという効果を奏する。   As described above, according to the present invention, the shield case that electromagnetically shields the high-voltage power supply circuit that generates the drive voltage of the image sensor is provided with a fixed portion that extends to the outside of the shield case. Because it can be attached to a device, it can be easily fixed to a mobile communication device such as a mobile phone simply by changing or replacing the shield case depending on the mounting position, etc., and also suppresses unwanted radiation from the high-voltage power circuit. There is an effect that can be.

実施の形態
以下、この発明の実施の形態について、図１及び図２を用いて説明する。図１（ａ）（ｂ）は、それぞれこの実施の形態に係る撮像装置の平面図及び断面図である。図２は、この実施の形態に係る撮像装置の全体構成を説明するための構成説明図である。図１及び図２において、１は撮像装置、２は撮像装置１を載置する基板、３は基板２上に配設したＣＣＤ固体撮像素子（以下、単に「撮像素子」という。）、４は撮像素子３上に配設した光学ユニットで、レンズ及びレンズホルダを有する。５は、基板２上に設けた高圧電源回路で、電源より電力が供給され、撮像素子３の駆動電圧を生成するものである。６は、基板２上に配置し、撮像素子３を駆動制御する駆動制御回路である。７は、基板２上に配置し、撮像素子３から出力される映像信号をＡＤ変換してデジタル信号を出力するＡＤ変換回路である。８は、基板２上に配置し、デジタル信号を処理してデジタル画像データを出力するデジタル信号処理回路であり、リセット信号によりリセットされる。９は、基板２上に配置し、撮像素子３、駆動制御回路６及びＡＤ変換回路７のタイミングを制御するタイミング制御回路である。また、駆動制御回路６、ＡＤ変換回路７、デジタル信号処理回路８、及びタイミング制御回路９については、高圧電源回路５からそれぞれ電力が供給される。なお、撮像装置１は、接地端子に接続している。 Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2. FIGS. 1A and 1B are a plan view and a cross-sectional view, respectively, of the image pickup apparatus according to this embodiment. FIG. 2 is a configuration explanatory diagram for explaining the overall configuration of the imaging apparatus according to this embodiment. 1 and 2, 1 is an imaging device, 2 is a substrate on which the imaging device 1 is mounted, 3 is a CCD solid-state imaging device (hereinafter simply referred to as “imaging device”), and 4 is disposed on the substrate 2. An optical unit disposed on the image sensor 3 and having a lens and a lens holder. Reference numeral 5 denotes a high-voltage power supply circuit provided on the substrate 2, which is supplied with power from the power supply and generates a driving voltage for the image sensor 3. Reference numeral 6 denotes a drive control circuit that is disposed on the substrate 2 and drives and controls the image sensor 3. Reference numeral 7 denotes an AD conversion circuit that is arranged on the substrate 2 and AD-converts the video signal output from the image sensor 3 and outputs a digital signal. A digital signal processing circuit 8 is disposed on the substrate 2 and processes digital signals to output digital image data, and is reset by a reset signal. Reference numeral 9 denotes a timing control circuit which is disposed on the substrate 2 and controls the timings of the image pickup device 3, the drive control circuit 6 and the AD conversion circuit 7. The drive control circuit 6, AD conversion circuit 7, digital signal processing circuit 8, and timing control circuit 9 are each supplied with electric power from the high-voltage power supply circuit 5. Note that the imaging device 1 is connected to a ground terminal.

１０は、金属製又は導電性樹脂により形成し、基板２上に配設したシールドケースで、図１（ｂ）に示すように、光学ユニットの表面部を露出させ、高圧電源回路５及びＡＤ変換回路７を電磁的にシールドする。この実施例では、この他に、駆動制御回路６、デジタル信号処理回路８、タイミング制御回路９をもシールドするよう構成している。また、シールドケース１０は、対向する両端部をそれぞれ屈曲させて基板２の端部にそれぞれ接続している。１１、１１は、シールドケース１０の対向する両端部にそれぞれ連続して外側に延びる固定部で、シールドケース１０と一体成形され、同じ金属製又は導電性樹脂により形成する。各固定部１１には、それぞれ穴部１２，１２を形成する。撮像素子３を駆動制御するための電圧を生成する高圧電源回路５やＡＤ変換回路７等をシールドケース１０により電磁的にシールドして携帯電話等の移動体通信装置に収納される。こうして、撮像装置１は、携帯電話等の移動体通信装置の所定に位置に取付けられる。なお、固定部１１，１１はシールドケース１０とは別個に形成してシールドケース１０に導電性接着剤により接着・固定してもよい。   Reference numeral 10 denotes a shield case made of metal or conductive resin and disposed on the substrate 2. As shown in FIG. 1B, the surface of the optical unit is exposed, and the high voltage power supply circuit 5 and the AD converter are exposed. The circuit 7 is electromagnetically shielded. In this embodiment, in addition to this, the drive control circuit 6, the digital signal processing circuit 8, and the timing control circuit 9 are also shielded. Further, the shield case 10 is connected to the end portion of the substrate 2 by bending both opposing end portions. Reference numerals 11 and 11 denote fixed portions that continuously extend to opposite ends of the shield case 10 and are formed integrally with the shield case 10 and are made of the same metal or conductive resin. Holes 12 and 12 are formed in each fixing part 11, respectively. The high voltage power supply circuit 5 that generates a voltage for driving and controlling the image sensor 3, the AD conversion circuit 7, and the like are electromagnetically shielded by the shield case 10 and stored in a mobile communication device such as a mobile phone. In this way, the imaging device 1 is attached to a predetermined position of a mobile communication device such as a mobile phone. The fixing portions 11 and 11 may be formed separately from the shield case 10 and bonded and fixed to the shield case 10 with a conductive adhesive.

図３は、この実施の形態における携帯電話の筐体内に撮像装置１を取付ける場合における斜視説明図である。図３において、１３は携帯電話の筐体である。１４は、金属製の螺子で、固定部１１，１１の穴部１２、１２にそれぞれ挿入して締結することで、筐体１３の所定位置に取付けている。１５は接地端子で、固定部１１，１１に対して接地しているか、或いは螺子１４，１４に対して接地している。こうして、シールドケース１０は、接地されることになり、高圧電源回路５やＡＤ変換回路７等を電磁的にシールドしている。
図４は、この実施の形態における固定部１１，１１を接地した様子を示す断面構成図である。図４において、１６、１６は、導電性接着剤で、基板２と固定部１１．１１とを電気的に接続し、固着している。 FIG. 3 is a perspective explanatory view in the case where the imaging device 1 is mounted in the casing of the mobile phone in this embodiment. In FIG. 3, reference numeral 13 denotes a cellular phone casing. Reference numeral 14 denotes a metal screw which is attached to a predetermined position of the housing 13 by being inserted into the holes 12 and 12 of the fixing portions 11 and 11 and fastened. A ground terminal 15 is grounded with respect to the fixing portions 11 and 11 or is grounded with respect to the screws 14 and 14. Thus, the shield case 10 is grounded, and electromagnetically shields the high-voltage power supply circuit 5, the AD conversion circuit 7, and the like.
FIG. 4 is a cross-sectional configuration diagram showing a state in which the fixing portions 11 are grounded in this embodiment. In FIG. 4, 16 and 16 are conductive adhesives that electrically connect and fix the substrate 2 and the fixing portion 11.11.

図５（ａ）（ｂ）（ｃ）（ｄ）は、それぞれ固定部１１の種々の配置状態を示した平面図である。図５（ａ）は、シールドケース１０の対向する長辺部及び短辺部に固定部１１を配置した状態を示し、図５（ｂ）は、シールドケース１０の対向する長辺部の光学ユニット４に対して対角位置に固定部１１を配置した状態を示し、図５（ｃ）は、シールドケース１０の対向する長辺部にそれぞれ固定部１１を配置した状態を示し、図５（ｄ）は、シールドケース１０の対向する短辺部の光学ユニット４に対して対角位置に固定部１１を配置した状態を示したものである。このように携帯電話に撮像装置を配置する場合の位置やその周辺部の空間状態によって、図５に示すような各種の固定部１１の構成とすることで、容易に携帯電話に撮像装置を装着することが可能となる。この場合に、固定部１１はシールドケース１０に、例えば一体成形することにより固定部１１のシールドケース１０に対する配置を容易に変更することもできる。   5A, 5B, 5C, and 5D are plan views showing various arrangement states of the fixing portion 11, respectively. FIG. 5A shows a state in which the fixing portions 11 are arranged on the long side portion and the short side portion facing the shield case 10, and FIG. 5B shows the optical unit of the long side portion facing the shield case 10. 4 shows a state in which the fixing portion 11 is arranged at a diagonal position, and FIG. 5C shows a state in which the fixing portion 11 is arranged on each of the opposing long sides of the shield case 10, and FIG. ) Shows a state in which the fixing portion 11 is arranged at a diagonal position with respect to the optical unit 4 of the short side portion of the shield case 10 facing each other. In this way, the configuration of various fixing parts 11 as shown in FIG. 5 can be easily attached to the mobile phone depending on the position when the imaging device is arranged on the mobile phone and the spatial state of the peripheral portion thereof. It becomes possible to do. In this case, the arrangement of the fixing portion 11 with respect to the shield case 10 can be easily changed by integrally forming the fixing portion 11 in the shield case 10, for example.

（ａ）（ｂ）はそれぞれ実施の形態に係る撮像装置の平面図及び断面図(A) and (b) are the top view and sectional drawing of the imaging device which concern on embodiment, respectively. この実施の形態に係る撮像装置の全体構成を説明するための構成説明図Configuration explanatory diagram for explaining the overall configuration of the imaging apparatus according to this embodiment この実施の形態における携帯電話の筐体内に撮像装置を取付ける場合における斜視説明図Explanatory perspective view in the case of mounting the imaging device in the case of the mobile phone in this embodiment この実施の形態における固定部を接地した様子を示す断面構成図Cross-sectional configuration diagram showing a state in which the fixing portion in this embodiment is grounded （ａ）（ｂ）（ｃ）（ｄ）は、それぞれ固定部１１の種々の配置状態を示した平面図(A) (b) (c) (d) is a plan view showing various arrangement states of the fixing portion 11 respectively.

符号の説明Explanation of symbols

１・・撮像装置、２・・基板、３・・撮像素子、４・・光学ユニット、５・・高圧電源回路、６・・駆動制御回路、７・・ＡＤ変換回路、８・・デジタル信号処理回路、９・・タイミング制御回路、１０・・シールドケース、１１・・固定部、１２・・穴部、１３・・筐体、１４・・螺子、１５・・接地端子、１６・・導電性接着剤


1 .... Imaging device 2 .... Board 3 .... Image sensor 4 .... Optical unit 5 .... High voltage power supply circuit 6 .... Drive control circuit 7 .... A / D converter circuit 8 .... Digital signal processing Circuit, 9 ·· Timing control circuit, 10 ·· Shield case, 11 ·· Fixing portion, 12 ·· Hole, 13 ·· Case, 14 ·· Screw, 15 ·· Ground terminal, 16 ·· Conductive bonding Agent


Claims (7)

基板と、この基板上に設けられた撮像素子と、この撮像素子上に設けられた光学ユニットと、前記基板上に設けられ、前記撮像素子の駆動電圧を生成する高圧電源回路と、前記光学ユニットの表面部を露出させ、前記高圧電源回路を電磁シールドするシールドケースと、このシールドケースに連続して前記シールドケースの外側に延び、移動体通信装置に固定される固定部とを備えた撮像装置。 A substrate, an image sensor provided on the substrate, an optical unit provided on the image sensor, a high-voltage power supply circuit provided on the substrate and generating a drive voltage for the image sensor, and the optical unit An image pickup apparatus comprising: a shield case that exposes a surface portion of the high-voltage power supply circuit and electromagnetically shields the high-voltage power supply circuit; and a fixed portion that extends to the outside of the shield case continuously to the shield case and is fixed to the mobile communication device . 基板と、この基板上に設けられた撮像素子と、この撮像素子上に設けられた光学ユニットと、前記基板上に設けられ、前記撮像素子から出力される映像信号をＡＤ変換するＡＤ変換回路と、前記基板上に設けられ、前記撮像素子の駆動電圧を生成し、前記ＡＤ変換回路に電力を供給する高圧電源回路と、前記光学ユニットの表面部を露出させ、前記ＡＤ変換回路及び前記高圧電源回路を電磁シールドするシールドケースと、このシールドケースに連続して前記シールドケースの外側に延び、移動体通信装置に固定される固定部とを備えた撮像装置。 A substrate, an image sensor provided on the substrate, an optical unit provided on the image sensor, an AD conversion circuit provided on the substrate and AD-converting a video signal output from the image sensor; A high-voltage power supply circuit that is provided on the substrate and generates a drive voltage for the imaging device and supplies power to the AD conversion circuit; and a surface portion of the optical unit is exposed; the AD conversion circuit and the high-voltage power supply An imaging apparatus comprising: a shield case that electromagnetically shields a circuit; and a fixing portion that extends continuously from the shield case to the outside of the shield case and is fixed to a mobile communication device. 前記シールドケースは、その対向する両端部を屈曲させ、前記固定部はその屈曲した各先端に連続して形成した請求項１又は２に記載の撮像装置。 The imaging apparatus according to claim 1, wherein the shield case is bent at both opposing ends, and the fixed portion is formed continuously at each bent tip. 前記固定部は、前記シールドケースと一体成形された請求項１〜３のいずれかに記載の撮像装置。 The imaging device according to claim 1, wherein the fixing portion is integrally formed with the shield case. 前記シールドケースは、導電性樹脂により形成した請求項１〜４のいずれかに記載の撮像装置。 The imaging device according to claim 1, wherein the shield case is formed of a conductive resin. 前記固定部は、接地された請求項１〜５のいずれかに記載の撮像装置。 The imaging device according to claim 1, wherein the fixing unit is grounded. 前記固定部は、螺子により前記移動体通信装置に固定された請求項１〜６のいずれかに記載の撮像装置。

The imaging device according to claim 1, wherein the fixing unit is fixed to the mobile communication device with a screw.

JP2004349684A 2004-12-02 2004-12-02 Image pickup apparatus Withdrawn JP2006165646A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022910B1 (en) 2009-03-06 2011-03-16 삼성전기주식회사 Camera module
JP2011205221A (en) * 2010-03-24 2011-10-13 Toshiba Corp Camera module
JP2013046260A (en) * 2011-08-24 2013-03-04 Sharp Corp Electronic apparatus
KR101259189B1 (en) * 2006-11-27 2013-04-29 엘지이노텍 주식회사 Sensor package device include a lens and its produce method
WO2023282557A1 (en) * 2021-07-05 2023-01-12 삼성전자 주식회사 Electronic device grounding camera module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101259189B1 (en) * 2006-11-27 2013-04-29 엘지이노텍 주식회사 Sensor package device include a lens and its produce method
KR101022910B1 (en) 2009-03-06 2011-03-16 삼성전기주식회사 Camera module
JP2011205221A (en) * 2010-03-24 2011-10-13 Toshiba Corp Camera module
JP2013046260A (en) * 2011-08-24 2013-03-04 Sharp Corp Electronic apparatus
WO2023282557A1 (en) * 2021-07-05 2023-01-12 삼성전자 주식회사 Electronic device grounding camera module

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