JP2006163784A - Coin-type ic tag and its manufacturing method - Google Patents
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Abstract
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本発明は、アミューズメント施設に設置の遊戯機などに適した貨幣代用のコイン型ICタグ及びその製造方法に関するものである。 The present invention relates to a coin-type IC tag for a money substitute suitable for an amusement machine installed in an amusement facility and a method for manufacturing the same.
従来、ゲームセンターなどに設置されている遊戯機等には、ステンレスなどのように錆びにくく、摩耗、変形、割れ等が起きにくい金属製の円板が貨幣の代わりのコインとして用いられている（特許文献１を参照）。また、遊戯機の運転開始動作は遊戯機にコインを投入して行う。 Conventionally, in game machines installed in game centers, etc., metal discs that are not easily rusted, such as stainless steel, and are less likely to wear, deform, crack, etc. are used as coins instead of money ( (See Patent Document 1). In addition, the operation start operation of the game machine is performed by inserting coins into the game machine.
このコインには遊戯機店毎に特有の模様を刻印して他店のコインと区別しているが、大量のコインを模様だけでは判別できず、混入された状態で使用されている。 This coin is marked with a unique pattern for each amusement machine store to distinguish it from coins of other stores. However, a large amount of coins cannot be identified only by the pattern and are used in a mixed state.
またコインに使用される材質は限られた組成範囲の金属材料であるため、機械的に区別するには、寸法形状を変える以外に遊戯機店別にコインを判別するのは困難である。 In addition, since the material used for coins is a metal material with a limited composition range, it is difficult to distinguish coins by amusement machine store other than changing the size and shape in order to distinguish mechanically.
直径、厚さ、重量等を遊戯機店毎に変えると、それを測定検知する判別機で簡単に遊戯機店間での誤用を防止することができるが、コインの寸法を変えると従来設置している遊戯機や他の設備も全て新設又は再調整が必要になるなどの問題が生じる。 Changing the diameter, thickness, weight, etc. for each amusement machine store can easily prevent misuse between amusement machine stores with a discriminator that measures and detects it. Problems such as the need for new or re-adjustment of all the game machines and other equipment that arise.
この金属材料の代わりに硬度が高く摩耗しにくく、薬液による腐触又は酸化劣化が起きにくい材料であるセラミックスをコインとすることも第二次世界大戦末期日本で作製された例があるように従来から提案されているが、陶磁器に代表される従来のセラミックスはコンクリートの床に落とすと簡単に割れてしまい、脆く欠け易い欠点が有ることから実用化に至っていない。 Instead of this metal material, it is hard to wear and wear, and ceramic which is a material that does not easily cause corrosion or oxidative degradation due to chemicals is also used as a coin, as it has been made in Japan at the end of World War II. However, conventional ceramics represented by ceramics are not practically used because they are easily broken when dropped on a concrete floor, and are brittle and easily chipped.
一方、自動認識技術であるRF-ID（Radio Frequency-Identification）機能を有するＩＣチップを搭載したＩＣタグが開発され、実用段階に達しつつある。 On the other hand, an IC tag equipped with an IC chip having an RF-ID (Radio Frequency-Identification) function which is an automatic recognition technology has been developed and is reaching a practical stage.
中でも、非接触で信号の送受信を行う非接触ＩＣタグとして、質問器（リーダ／ライタ）が発した電磁波により、応答器（非接触式ＩＣタグ）のアンテナコイルに誘導電圧を発生させ電源として利用すると共に、データの通信を行うパッシブ型のものが注目されている。 Above all, as a non-contact IC tag that transmits and receives signals in a non-contact manner, an induction voltage is generated in the antenna coil of the responder (non-contact IC tag) by using electromagnetic waves emitted from an interrogator (reader / writer) and used as a power source. At the same time, a passive type that performs data communication is attracting attention.
このような非接触式ＩＣタグとして、その基本的な構成は、プラスチックフィルム上に銅又はアルミエッチングによりアンテナ形成し、異方導電フィルムを介してＩＣチップの電極に接続し、アンテナ基板の両側を接着剤付のプラスチックフィルムでラミネートしたもの又は、銅線でループ上に巻かれたアンテナコイルに超音波又はレーザーによりＩＣチップの電極に直接接続し、外層となるプラスチックフィルムでアンテナコイルの両側を挟んだＩＣタグが、既に実用化されている。 As such a non-contact type IC tag, the basic configuration is that an antenna is formed on a plastic film by copper or aluminum etching, connected to an IC chip electrode via an anisotropic conductive film, and both sides of the antenna substrate are connected. An antenna coil laminated with a plastic film with adhesive, or an antenna coil wound on a loop with copper wire, is directly connected to the IC chip electrode by ultrasonic or laser, and both sides of the antenna coil are sandwiched between plastic films as outer layers. IC tags have already been put into practical use.
しかしながら上述した従来のコインにおいては、ID又は認証機能がなく、コイン単体での偽造・変造が容易であるだけでなく、貨幣価値をコイン内部に取り込むことができない為、貨幣と等価に扱うことができないという問題がある。 However, the above-described conventional coins do not have an ID or authentication function, and are not only easy to forge or alter with a single coin, but also cannot be used for the equivalent of money because the value of money cannot be captured inside the coin. There is a problem that you can not.
しかるに本発明は上記問題に鑑み、遊戯機などで使用するコインにおいて、所定の強度と重量が得られ、セキュリティが高く、無線で外部の読み取り機との通信を可能にしたコイン型ICタグ及びその製造方法を提供することを目的とするものである。 However, in view of the above problems, the present invention provides a coin-type IC tag that has a predetermined strength and weight, high security, and enables wireless communication with an external reader in a coin used in a game machine or the like. The object is to provide a manufacturing method.
本発明は、上記の目的を達成する為に、摩耗しにくく、欠けにくく、光沢を出し易いセラミックスコインを用い、このコインにICとアンテナを内蔵することにより、以下のように実現するものである。 In order to achieve the above object, the present invention is realized as follows by using a ceramic coin that is not easily worn, chipped, and easily glossy, and an IC and an antenna are built in the coin. .
本発明に係るコイン型ICタグは、張り合わせるとコイン型の形状となるセラミックによる第１及び第２の保護材と、外部とデータ通信を行う機能を有するIC及びアンテナを接続したモジュールとを含み、前記第１及び第２の保護材はそれぞれ凹部を有し、これらの凹部に前記モジュールを配置して前記第１及び第２の保護材を張り合わせることにより、前記第１及び第２の保護材に前記モジュールを格納してなる。 A coin-type IC tag according to the present invention includes first and second protective materials made of ceramic that become a coin-type shape when bonded together, an IC having a function of performing data communication with the outside, and a module connected to an antenna. The first and second protective materials each have a concave portion, and the first and second protective materials are provided by arranging the module in these concave portions and bonding the first and second protective materials together. The module is stored in a material.
コイン型の形状のセラミックによる保護材と、外部とデータ通信を行う機能を有するIC及びアンテナを接続したモジュールとを含み、前記保護材は凹部を有し、この凹部に前記モジュールを配置することにより、前記保護材に前記モジュールを格納してなることが望ましい。 Including a coin-shaped ceramic protective material, an IC having a function of performing data communication with the outside, and a module connected to an antenna. The protective material has a recess, and the module is disposed in the recess. The module is preferably stored in the protective material.
前記保護材は、ジルコニアとその安定化剤を５〜１００重量％及びアルミナを０〜９５重量％含有してなるセラミックスであることが望ましい。 The protective material is preferably a ceramic containing 5 to 100% by weight of zirconia and its stabilizer and 0 to 95% by weight of alumina.
ジルコニアの結晶形態が主として正方晶ジルコニアであることが望ましい。 It is desirable that the crystal form of zirconia is mainly tetragonal zirconia.
曲げ強さが５００MPa以上、破壊靭性が４．５MPa/m1/2以上及び吸水率が０．１重量％以下であることが望ましい。 It is desirable that the bending strength is 500 MPa or more, the fracture toughness is 4.5 MPa / m 1/2 or more, and the water absorption is 0.1 wt% or less.
前記モジュールの厚みが0.8mm以下かつ直径が20ｍｍ以下であることが望ましい。 The module preferably has a thickness of 0.8 mm or less and a diameter of 20 mm or less.
前記モジュールのどちらか一方の面に粘着剤が塗布されてなることが望ましい。 It is desirable that an adhesive is applied to one surface of the module.
前記モジュールのICの記憶部に貨幣価値を入力・記億させ、現金の代替手段として使用可能なことが望ましい。 It is desirable that a monetary value can be input and stored in the memory part of the IC of the module so that it can be used as an alternative means of cash.
前記保護材表面に印刷またはレーザーマーキング等の加工を施すことが可能な表示層を設けてなることが望ましい。 It is desirable to provide a display layer that can be subjected to processing such as printing or laser marking on the surface of the protective material.
前期保護材は、セラミックに代わって金属入りのナイロン樹脂にてなることが望ましい。 It is desirable that the protective material for the first period is made of nylon resin containing metal instead of ceramic.
前記モジュールのICに記憶された情報が外部の読み取り機によりアクセス毎にネットワークに接続されたサーバーに送信され、サーバーで情報が一元管理可能なことが望ましい。 It is desirable that the information stored in the IC of the module is transmitted to a server connected to the network for each access by an external reader, and the information can be centrally managed by the server.
本発明に係るコイン型ICタグの製造方法は、それぞれ凹部を有する、張り合わせるとコイン型の形状となるセラミックによる第１及び第２の保護材と、外部とデータ通信を行う機能を有するIC及びアンテナを接続したモジュールとを用い、前記第１及び第２の保護材の凹部に前記モジュールを配置して前記第１及び第２の保護材を張り合わせることにより、前記第１及び第２の保護材に前記モジュールを格納する。 A method for manufacturing a coin-type IC tag according to the present invention includes a first and a second protective material made of ceramic each having a concave portion and forming a coin-type shape when they are bonded together, an IC having a function of performing data communication with the outside, and The module is connected to an antenna, and the first and second protection members are disposed by bonding the first and second protection members by disposing the module in the recesses of the first and second protection members. The module is stored in a material.
それぞれ凹部を有する、コイン型の形状のセラミックによる保護材と、外部とデータ通信を行う機能を有するIC及びアンテナを接続したモジュールとを用い、前記保護材の凹部に前記モジュールを配置することにより、前記保護材に前記モジュールを格納することが望ましい。 By using a protective material made of a coin-shaped ceramic, each having a recess, and a module connected to an IC and an antenna having a function of performing data communication with the outside, by disposing the module in the recess of the protective material, It is desirable to store the module in the protective material.
本発明により、遊戯機で使用する本コイン型ICタグにおいて、摩耗しにくく、割れ・欠けにくく、光沢を出し易いセラミックスを用いることにより、所定の強度と重量が得られ、かつICとアンテナを内蔵することにより、セキュリティが高く、無線で外部の読み取り機との通信が可能となった。 In accordance with the present invention, the coin-type IC tag used in an amusement machine has a predetermined strength and weight by using ceramics that are not easily worn, cracked, chipped, and easily glossy, and has an IC and an antenna. As a result, security is high and communication with an external reader can be performed wirelessly.
又、本コイン型ICタグは、外部の読み取り機及び端末を介してネットワークに接続される為、読み取り機からのアクセス毎にネットワークに接続されたサーバーにICタグのデータが随時、送信することが可能となり、サーバーにおいてICタグの情報が一元管理されるので、管理コストを大幅に削減することができる。 In addition, since the coin-type IC tag is connected to the network via an external reader and terminal, the data of the IC tag can be transmitted to the server connected to the network whenever accessed from the reader. This makes it possible for the server to centrally manage the IC tag information, thus greatly reducing management costs.
本発明において、ＪＩＳ Ｒ １６０１に規定する三点曲げ強さは、５００MPa以上、好ましくは７００MPa以上、また破壊靭性は、４．５MPa/m1/2以上、好ましくは６．５MPa/m1/2以上である。曲げ強さが５００MPa未満及び／又は破壊靭性が４．５MPa/m1/2未満であると、セラミックス製コインを床に落としたり、コイン同士が衝突しただけで簡単に破壊するという欠点が生じる。なお破壊靭性は、ＪＩＳ Ｒ １６０７に規定する破壊靭性試験法に準じて測定する。 In the present invention, the three-point bending strength specified in JIS R 1601 is 500 MPa or more, preferably 700 MPa or more, and the fracture toughness is 4.5 MPa / m 1/2 or more, preferably 6.5 MPa / m 1/2. That's it. When the bending strength is less than 500 MPa and / or the fracture toughness is less than 4.5 MPa / m 1/2 , there is a drawback that ceramic coins are dropped on the floor or simply broken when the coins collide with each other. The fracture toughness is measured according to the fracture toughness test method specified in JIS R 1607.
吸水率は、ＪＩＳ Ｃ ２１４１に規定する試験法に準じて測定し、本発明においては０．１重量％以下、好ましくは０．０５重量％以下である。吸水率が０．１重量％を超えると取扱中に摩耗したり、変色したりする不都合が生じる。 The water absorption is measured according to a test method specified in JIS C 2141, and is 0.1% by weight or less, preferably 0.05% by weight or less in the present invention. When the water absorption exceeds 0.1% by weight, there is a problem that the product is worn or discolored during handling.
セラミックス製コインを構成するセラミックスとしては、上記の特性を全て満足する材料であれば特に制限はないが、製造し易く、価格の点でジルコニアとその安定化剤を５〜１００重量％及びアルミナを０〜９５重量％含有したものを用いることが好ましい。ジルコニアの安定化剤としては、酸化イットリウム、酸化セリウム等の希土類酸化物又は酸化マグネシウム、酸化カルシウムの一種以上を用いることが好ましい。 The ceramic constituting the ceramic coin is not particularly limited as long as it is a material that satisfies all of the above characteristics, but it is easy to manufacture, and in terms of price, 5 to 100% by weight of zirconia and its stabilizer and alumina. It is preferable to use one containing 0 to 95% by weight. As the zirconia stabilizer, it is preferable to use one or more of rare earth oxides such as yttrium oxide and cerium oxide, or magnesium oxide and calcium oxide.
またジルコニアとその安定化剤及びアルミナの混合比率を上記の範囲内で配合することにより、かさ密度を約４０００〜６０００kg/m3まで任意に変えることができ、しかも簡単な操作で表面を平滑にでき深みがある光沢が得られ、コバルト、クロム等を添加することで赤、青等広範囲に着色することができることから外観に優れ、色、密度等様々なセラミックスコインが得られる。従ってこれらの違いにより、遊戯機店別にセラミックスコインを簡単に識別することができる利点がある。 In addition, by blending the mixing ratio of zirconia, its stabilizer and alumina within the above range, the bulk density can be arbitrarily changed from about 4000 to 6000 kg / m 3 , and the surface can be smoothed by a simple operation. A gloss with a depth can be obtained, and by adding cobalt, chromium, etc., it can be colored in a wide range such as red, blue, etc., so that various ceramic coins with excellent appearance, color, density and the like can be obtained. Therefore, due to these differences, there is an advantage that ceramic coins can be easily identified for each amusement machine store.
なおセラミックスは上記の成分の他に、必要に応じアルミナの１〜５０重量％をムライト、スピネル等のセラミックス材料で置き換えることができる。 In addition to the above components, ceramics can replace 1 to 50% by weight of alumina with a ceramic material such as mullite or spinel as necessary.
本発明になるセラミックス製コインは、例えば酸化ジルコニウム粉とその安定化剤又は酸化ジルコニウム粉とその安定化剤及びアルミナ粉を均一に混合し、次いで結合剤を添加して再度混合し、噴霧乾燥した後成形、焼成し、その後必要に応じ表面を研磨して得られる。 The ceramic coin according to the present invention is, for example, uniformly mixed with zirconium oxide powder and its stabilizer or zirconium oxide powder with its stabilizer and alumina powder, then added with a binder, mixed again, and spray dried. It is obtained by post-molding and firing, and then polishing the surface as necessary.
ジルコニアの結晶形態は、摩耗しにくく、欠けにくく、そして光沢を出し易いという点で、主として正方晶ジルコニアであることが好ましく、例えばセラミックス中に正方晶ジルコニアを５０重量％以上含有することが好ましい。 The crystal form of zirconia is preferably mainly tetragonal zirconia in terms of being hard to wear, not easily chipped, and easily glossy. For example, it is preferable that the ceramic contains 50% by weight or more of tetragonal zirconia.
なおジルコニアの結晶形態を調べるのはセラミックス表面をそのままＸ線回折法で測定して、得られた回折図から含有率を算出することができる。 The crystal form of zirconia can be examined by measuring the ceramic surface as it is by X-ray diffractometry and calculating the content rate from the obtained diffractogram.
結晶形態を正方晶ジルコニアにするには、その安定化剤として酸化イットリウム、酸化セリウム等の希土類酸化物又は酸化マグネシウム、酸化カルシウムの一種以上を適量添加することで達成できる。 Tetragonal zirconia can be obtained by adding an appropriate amount of one or more of rare earth oxides such as yttrium oxide and cerium oxide, magnesium oxide, and calcium oxide as a stabilizer.
セラミックス製コインの形状は、円板状であることが好ましいが、中央部をくりぬいた円板状の凹部にICとアンテナを接続した円板状のモジュールを埋め込む形態、又はくりぬいた円板状の凹部にICとアンテナを接続した円板状のモジュールを埋め込み、円板状のセラミックで蓋をする等変化に富んだセラミックス製コインが得られる。 The shape of the ceramic coin is preferably a disk shape, but a disk-shaped module in which an IC and an antenna are connected is embedded in a disk-shaped recess having a hollowed central portion, or a hollow disk-shaped shape. A variety of ceramic coins can be obtained, such as a disk-shaped module in which the IC and antenna are connected in the recess, and a disk-shaped ceramic cover.
以下本発明の実施例を説明する。なお本発明はこれらに制限されない。
＜実施例１＞
本発明の実施例１を示す。実施例１では、酸化ジルコニウム粉（第一希元素工業(株)製、商品名ＳＰＺ）８７０ｇ、安定化剤として酸化イットリウム粉（レアメタリック社製、純度９９．９９％）２６ｇ及び酸化セリウム粉（レアメタリック社製、純度９９．９９％）６７ｇを、直径が５mmのジルコニアボール１．５kg及び蒸留水８００ｇと共に合成樹脂製ボールミルに入れ、平均粒径が０．６μｍになるまで湿式混合粉砕した。
Examples of the present invention will be described below. The present invention is not limited to these.
<Example 1>
Example 1 of the present invention will be described. In Example 1, 870 g of zirconium oxide powder (manufactured by Daiichi Rare Element Industry Co., Ltd., trade name SPZ), 26 g of yttrium oxide powder (manufactured by Rare Metallic, purity 99.99%) as a stabilizer, and cerium oxide powder (rare) 67 g (purity 99.99%, manufactured by Metallic Co., Ltd.) was placed in a synthetic resin ball mill together with 1.5 kg of zirconia balls having a diameter of 5 mm and 800 g of distilled water, and wet-mixed and pulverized until the average particle size became 0.6 μm.
さらに該混合粉砕物にアルミナ粉（住友化学(株)製、商品名ＡＥ−１２）を１０ｇ加え、平均粒径が０．５μｍになるまで湿式混合粉砕した。 Furthermore, 10 g of alumina powder (manufactured by Sumitomo Chemical Co., Ltd., trade name AE-12) was added to the mixed pulverized product, and wet mixed and pulverized until the average particle size became 0.5 μm.
なおジルコニア粉とその安定化剤及びアルミナ粉の配合割合は、ジルコニア粉とその安定化剤９９．０重量％に対し、アルミナ粉は１．０重量％であった。 The blending ratio of zirconia powder and its stabilizer and alumina powder was 1.0% by weight for alumina powder and 99.0% by weight for zirconia powder and its stabilizer.
次に上記で得たアルミナ入り混合粉砕物にワックスエマルジョン（中京油脂(株)製、商品名Ｅ−５４２）を８０ｇ添加後、１時間湿式混合し、これを噴霧乾燥して成形用材料粉を得た。 Next, 80 g of wax emulsion (manufactured by Chukyo Yushi Co., Ltd., trade name E-542) is added to the mixed pulverized product containing alumina obtained above, and then wet-mixed for 1 hour, followed by spray drying to obtain a molding material powder. Obtained.
次いで該成形用材料粉を１５０MPaの圧力で円板状に成形し、大気中で１４８０℃で３時間焼成して直径が２５mmで、厚さが０．９mmの円板焼結体と寸法が４０mm×５０mm×４mmの角板焼結体を得た。 Next, the molding material powder was formed into a disk shape at a pressure of 150 MPa, and fired in the atmosphere at 1480 ° C. for 3 hours to sinter a disk sintered body having a diameter of 25 mm and a thickness of 0.9 mm, and a size of 40 mm. A square plate sintered body of × 50 mm × 4 mm was obtained.
この後、上記の焼結体のうち角板焼結体の表面をそのままＸ線回折法で測定したところ、正方晶ジルコニアの回折ピークだけが観察された。 Then, when the surface of the square plate sintered body was measured as it was by the X-ray diffraction method, only the diffraction peak of tetragonal zirconia was observed.
次いで該角板焼結体をダイヤモンド切断機と１０００番の砥石装着の平面研削盤で３mm×４mm×３５mmの寸法に切断研磨後、かさ密度、吸水率、曲げ強さ及び破壊靱性を測定した。
その結果、かさ密度は６０００kg/m3、吸水率は０．０３重量％、曲げ強さは９８０MPa及び破壊靱性は６．７MPa/m1/2であった。
Next, the square plate sintered body was cut and polished to a size of 3 mm × 4 mm × 35 mm with a diamond cutter and a surface grinder equipped with a No. 1000 grindstone, and then bulk density, water absorption, bending strength and fracture toughness were measured.
As a result, the bulk density was 6000 kg / m 3 , the water absorption was 0.03% by weight, the bending strength was 980 MPa, and the fracture toughness was 6.7 MPa / m 1/2 .
一方アルミナ製ボールミルに上記で得た円板焼結体、直径が３mmの炭化珪素質バレルボール及び水を重量比で２：１：１の割合にして入れ、２４時間回転して円板焼結体を磨いてセラミックス製コインを得た。 On the other hand, the disc sintered body obtained above, a silicon carbide barrel ball having a diameter of 3 mm, and water are placed in a weight ratio of 2: 1: 1 in an alumina ball mill, and the disc is sintered by rotating for 24 hours. I polished my body and got a ceramic coin.
得られたセラミックス製コインは、光沢をもった薄い黄白色を呈していた。 The obtained ceramic coin had a thin yellowish white color with gloss.
次いでこれを２ｍの高さからコンクリートの床に自由落下させて割れ、欠けの発生を調べた。 Next, it was dropped from a height of 2 m onto a concrete floor, cracked, and the occurrence of chips was examined.
その結果、試験枚数１００枚中、割れ及び欠けは皆無であった。
＜比較例１＞
比較例１では、焼成温度を１４３０℃とした以外、実施例１と同様の工程により、円板焼結体と角板焼結体を得た。
As a result, no cracks or chips were found in 100 test sheets.
<Comparative Example 1>
In Comparative Example 1, a disc sintered body and a square plate sintered body were obtained by the same process as Example 1 except that the firing temperature was 1430 ° C.
以下実施例１と同様の方法でかさ密度、吸水率、曲げ強さ及び破壊靱性を測定した。 Thereafter, the bulk density, water absorption, bending strength and fracture toughness were measured in the same manner as in Example 1.
その結果、かさ密度は５９８０kg/m3、吸水率は０．２重量％、曲げ強さは４３０MPa及び破壊靱性は５．１MPa/m1/2であった。 As a result, the bulk density was 5980 kg / m 3 , the water absorption rate was 0.2% by weight, the bending strength was 430 MPa, and the fracture toughness was 5.1 MPa / m 1/2 .
角板焼結体の表面をそのままＸ線回折法で測定したところ、正方晶ジルコニアの回折ピークだけが観察された。 When the surface of the square plate sintered body was directly measured by the X-ray diffraction method, only the diffraction peak of tetragonal zirconia was observed.
また実施例１と同様の方法で割れ、欠けの発生を調べた結果、試験枚数１００枚中、割れが２２枚発生し、残りの７８枚には幅が０．２〜０．５mmの欠けが発生した。
＜ 比較例２＞
比較例２では、焼成温度を１６５０℃とした以外、実施例１と同様の工程により、円板焼結体と角板焼結体を得た。
Further, as a result of investigating the occurrence of cracks and chips by the same method as in Example 1, 22 cracks occurred in 100 test sheets, and the remaining 78 sheets had cracks with a width of 0.2 to 0.5 mm. Occurred.
<Comparative Example 2>
In Comparative Example 2, a disc sintered body and a square plate sintered body were obtained by the same process as Example 1 except that the firing temperature was 1650 ° C.
以下実施例１と同様の方法でかさ密度、吸水率、曲げ強さ及び破壊靱性を測定した。
その結果、かさ密度は５８３０kg/m3、吸水率は０．０３重量％、曲げ強さは４００MPa及び破壊靱性は３．５MPa/m1/2であった。
Thereafter, the bulk density, water absorption, bending strength and fracture toughness were measured in the same manner as in Example 1.
As a result, the bulk density was 5830 kg / m 3 , the water absorption was 0.03% by weight, the bending strength was 400 MPa, and the fracture toughness was 3.5 MPa / m 1/2 .
角板焼結体の表面をそのままＸ線回折法で測定したところ、立方晶ジルコニア結晶が４０重量％、単斜晶ジルコニア結晶が３０重量％及び正方晶ジルコニア結晶３０重量％が観察された。 When the surface of the square plate sintered body was directly measured by an X-ray diffraction method, 40 wt% of cubic zirconia crystals, 30 wt% of monoclinic zirconia crystals and 30 wt% of tetragonal zirconia crystals were observed.
また実施例１と同様の方法で割れ、欠けの発生を調べた結果、試験枚数１００枚中、ほぼ全数に割れ及び幅が０．２〜０．５mmの欠けが発生した。
＜実施例２＞
実施例２では、酸化ジルコニウム粉（第一希元素工業(株)製、商品名ＳＰＺ）９０６ｇ、安定化剤として酸化イットリウム粉（レアメタリック社製、純度９９．９９％）２６ｇ及び酸化セリウム粉（レアメタリック社製、純度９９．９９％）６８ｇを、直径が５mmのジルコニアボール１．５ｋｇ及び蒸留水８００ｇと共に合成樹脂製ボールミルに入れ、平均粒径が０．６μｍになるまで湿式混合粉砕した。
Further, as a result of investigating the occurrence of cracks and chips by the same method as in Example 1, cracks and chips with a width of 0.2 to 0.5 mm occurred in almost all of the 100 test sheets.
<Example 2>
In Example 2, 906 g of zirconium oxide powder (manufactured by Daiichi Rare Element Industries, Ltd., trade name SPZ), 26 g of yttrium oxide powder (rare metallic, purity 99.99%) as a stabilizer and cerium oxide powder (rare) 68 g (made by Metallic Co., Ltd., purity: 99.99%) was put into a synthetic resin ball mill together with 1.5 kg of zirconia balls having a diameter of 5 mm and 800 g of distilled water, and wet-mixed and pulverized until the average particle size became 0.6 μm.
さらに該混合粉砕物を乾燥したジルコニア組成物３００ｇ、アルミナ粉（住友化学(株)製、商品名ＡＥ−１２）６８００ｇ及び酸化コバルト（高純度化学研究所製）２０ｇを、直径が５mmのジルコニアボール１．５ｋｇ及び蒸留水６５０ｇと共に合成樹脂製ボールミルに入れ、平均粒径が０．５μｍになるまで湿式混合粉砕した。 Furthermore, 300 g of the zirconia composition obtained by drying the mixed pulverized product, 6800 g of alumina powder (trade name AE-12, manufactured by Sumitomo Chemical Co., Ltd.) and 20 g of cobalt oxide (manufactured by High-Purity Chemical Laboratory) were added to a zirconia ball having a diameter of 5 mm. The mixture was placed in a synthetic resin ball mill together with 1.5 kg and 650 g of distilled water, and wet-mixed and pulverized until the average particle size became 0.5 μm.
なおジルコニア粉とその安定化剤及びアルミナ粉の配合割合は、ジルコニア粉とその安定化剤３０．０重量％に対し、アルミナ粉は６８．０重量％であり、残りは酸化コバルトであった。 The blending ratio of zirconia powder, its stabilizer and alumina powder was 68.0% by weight for alumina powder and 30.0% by weight for zirconia powder and its stabilizer, and the rest was cobalt oxide.
以下焼成温度を１５８０℃とした以外は実施例１と同様の工程を経て円板焼結体と角板焼結体を得た。 Thereafter, a disc sintered body and a square plate sintered body were obtained through the same steps as in Example 1 except that the firing temperature was 1580 ° C.
この後実施例１と同様の方法でかさ密度、吸水率、曲げ強さ及び破壊靱性を測定した。 Thereafter, the bulk density, water absorption rate, bending strength and fracture toughness were measured in the same manner as in Example 1.
その結果、かさ密度は４４００kg/m3、吸水率は０．０３重量％、曲げ強さは７７０MPa及び破壊靱性は６．４MPa/m1/2であった。 As a result, the bulk density was 4400 kg / m 3 , the water absorption was 0.03% by weight, the bending strength was 770 MPa, and the fracture toughness was 6.4 MPa / m 1/2 .
また角板焼結体の表面をそのままＸ線回折法で測定したところ、正方晶ジルコニアとαアルミナの回折ピークだけが観察された。 Further, when the surface of the square plate sintered body was directly measured by the X-ray diffraction method, only the diffraction peaks of tetragonal zirconia and α-alumina were observed.
一方実施例１と同様の方法で円板焼結体を磨いたところ、コバルトブルー色を呈していた。
次いで実施例１と同様の方法で割れ、欠けの発生を調べた結果、試験枚数１００枚中、割れ及び欠けは皆無であった。
＜比較例３＞
比較例３では、酸化ジルコニウム粉（第一希元素工業（株）製、商品名ＳＰＺ）１８１ｇ及び安定化剤として酸化セリウム粉（レアメタリック社製、純度９９．９９％）５ｇを、直径が５mmのジルコニアボール１．５kg及び蒸留水８００ｇと共に合成樹脂製ボールミルに入れ、平均粒径が０．６μｍになるまで湿式混合粉砕した。
On the other hand, when the disc sintered body was polished by the same method as in Example 1, it exhibited a cobalt blue color.
Next, as a result of investigating the occurrence of cracks and chips by the same method as in Example 1, no cracks or chips were found in 100 test sheets.
<Comparative Example 3>
In Comparative Example 3, 181 g of zirconium oxide powder (manufactured by Daiichi Rare Element Industrial Co., Ltd., trade name SPZ) and 5 g of cerium oxide powder (manufactured by Rare Metallic, purity 99.99%) as a stabilizer, having a diameter of 5 mm The mixture was placed in a synthetic resin ball mill together with 1.5 kg of zirconia balls and 800 g of distilled water, and wet mixed and pulverized until the average particle size became 0.6 μm.
さらに該混合粉砕物を乾燥したジルコニア組成物１８６ｇ及びアルミナ粉（住友化学(株)製、商品名ＡＥ−１２）８１４ｇを、直径が５mmのジルコニアボール１．５kg及び蒸留水６５０ｇと共に合成樹脂製ボールミルに入れ、平均粒径が０．５μｍになるまで湿式混合粉砕した。 Further, 186 g of the zirconia composition and 814 g of alumina powder (trade name AE-12, manufactured by Sumitomo Chemical Co., Ltd.) obtained by drying the mixed pulverized product and a ball mill made of synthetic resin together with 1.5 kg of zirconia balls having a diameter of 5 mm and 650 g of distilled water. And wet mixed and pulverized until the average particle size became 0.5 μm.
なおジルコニア粉とその安定化剤及びアルミナ粉の配合割合は、ジルコニア粉とその安定化剤１８．６重量％に対し、アルミナ粉は８１．４重量％であった。 The blending ratio of zirconia powder and its stabilizer and alumina powder was 81.4% by weight for alumina powder and 18.6% by weight for zirconia powder and its stabilizer.
以下焼成温度を１６００℃とした以外は実施例１と同様の工程を経て円板焼結体と角板焼結体を得た。 Thereafter, a disc sintered body and a square plate sintered body were obtained through the same steps as in Example 1 except that the firing temperature was 1600 ° C.
この後実施例１と同様の方法でかさ密度、吸水率、曲げ強さ及び破壊靱性を測定した。 Thereafter, the bulk density, water absorption rate, bending strength and fracture toughness were measured in the same manner as in Example 1.
その結果、かさ密度は４３４０kg/m3、吸水率は０．０３重量％、曲げ強さは５４０MPa及び破壊靱性は４．３MPa/m1/2であった。 As a result, the bulk density was 4340 kg / m 3 , the water absorption was 0.03% by weight, the flexural strength was 540 MPa, and the fracture toughness was 4.3 MPa / m 1/2 .
角板焼結体の表面をそのままＸ線回折法で測定したところ、α−アルミナの回折ピークと少量の正方晶ジルコニアの回折ピークが観察された。 When the surface of the square plate sintered body was directly measured by the X-ray diffraction method, an α-alumina diffraction peak and a small amount of tetragonal zirconia diffraction peak were observed.
また実施例１と同様の方法で割れ、欠けの発生を調べた結果、試験枚数１００枚中、割れは皆無であったが、７５枚に幅が０．２〜０．５mmの欠けが発生した。
＜ 実施例３＞
実施例３では、実施例２で用いた酸化コバルトに代えて酸化クロムを用いた以外は実施例２と同様の工程により、円板焼結体と角板焼結体を得た。
Further, as a result of examining the occurrence of cracks and chips by the same method as in Example 1, no cracks were found in 100 sheets of the test sheets, but chips having a width of 0.2 to 0.5 mm occurred in 75 sheets. .
<Example 3>
In Example 3, a disc sintered body and a square plate sintered body were obtained by the same process as Example 2 except that chromium oxide was used instead of the cobalt oxide used in Example 2.
この後これらを９００℃で１時間窒素ガス雰囲気中で熱処理し、以下実施例１と同様の方法で密度、吸水率、曲げ強さ及び破壊靱性を測定した。 Thereafter, these were heat-treated at 900 ° C. for 1 hour in a nitrogen gas atmosphere, and the density, water absorption rate, bending strength and fracture toughness were measured in the same manner as in Example 1.
その結果、かさ密度は４３００kg/m3、吸水率は０．０３重量％、
曲げ強さは７３０MPa及び破壊靱性は６．７MPa/m1/2であった。
As a result, the bulk density is 4300 kg / m 3 , the water absorption is 0.03% by weight,
The bending strength was 730 MPa and the fracture toughness was 6.7 MPa / m 1/2 .
また角板焼結体の表面をそのままＸ線回折法で測定したところ、正方晶ジルコニアとαアルミナの回折ピークだけが観察された。 Further, when the surface of the square plate sintered body was directly measured by the X-ray diffraction method, only the diffraction peaks of tetragonal zirconia and α-alumina were observed.
なおジルコニア粉とその安定化剤及びアルミナ粉の配合割合は、ジルコニア粉とその安定化剤３０．０重量％に対し、アルミナ粉は６８．０重量％であり、残りは酸化クロムであった。 The blending ratio of zirconia powder and its stabilizer and alumina powder was 68.0% by weight for alumina powder and 30.0% by weight for zirconia powder and its stabilizer, and the rest was chromium oxide.
一方実施例１と同様の方法で円板焼結体を磨いたところ、黒色を帯びた絶色を呈していた。 On the other hand, when the disk sintered body was polished by the same method as in Example 1, it exhibited a blackish discoloration.
次いで実施例１と同様の方法で割れ、欠けの発生を調べた結果、試験枚数１００枚中、割れ及び欠けは皆無であった。 Next, as a result of investigating the occurrence of cracks and chips by the same method as in Example 1, no cracks or chips were found in 100 test sheets.
次に、上述したプロセスにて製造したセラミックス材料を用いてコイン型ICタグを構成した本発明を、図面を用いて説明する。図１は、本発明の実施の第一形態にかかる、製品構造の要部の概略を示すものであり、図１（ａ）は上面図、図１（ｂ）は断面図である。図２は、本発明の第一形態にかかる、製品製造の工程を示すフローチャートである。 Next, the present invention in which a coin-type IC tag is formed using a ceramic material manufactured by the above-described process will be described with reference to the drawings. 1A and 1B show an outline of a main part of a product structure according to a first embodiment of the present invention. FIG. 1A is a top view and FIG. 1B is a cross-sectional view. FIG. 2 is a flowchart showing a product manufacturing process according to the first embodiment of the present invention.
まず、第１及び第２の保護材となる円板焼結体（１）は、直径が２５mmで、厚さが０．９mm、比重が6g/ｃｍ３であり（図２（ａ））、片面の中央部にザグリ加工を施して凹部(直径；１０mm、厚さ;0.4mm)が形成される（図２（ｂ））。この凹部は、IC（３）とアンテナ（４）が接続線（７）によって接続され、略円板形状の保護材（５）で両側を挟まれたICモジュール（８）を組み込むスペースとなる。 First, the disk sintered body (1) serving as the first and second protective materials has a diameter of 25 mm, a thickness of 0.9 mm, and a specific gravity of 6 g / cm 3 (FIG. 2 (a)). A concave portion (diameter: 10 mm, thickness: 0.4 mm) is formed by applying a counterbore process to the central portion of one side (FIG. 2B). The concave portion is a space in which the IC (3) and the antenna (4) are connected by the connection line (7), and the IC module (8) sandwiched between both sides by the substantially disc-shaped protective material (5) is incorporated.
ザグリ加工後、円板焼結体の凹部に上記ICモジュール（８）を組み込み（図２（ｃ））、円板焼結体（１）の凹部が各々向き合うように上下重ね、円板焼結体（１）の接触面となる片面に接着剤（２）を塗布し、貼り合わせる（図２（ｄ））。 After counterboring, the IC module (8) is incorporated into the concave portion of the disc sintered body (FIG. 2 (c)), and the disc sintered body (1) is stacked one above the other so that the concave portions face each other. The adhesive (2) is applied to one side which becomes the contact surface of the body (1) and bonded (FIG. 2 (d)).
ICモジュール（８）については、表裏どちらか一方に粘着材（６）が塗布されているものを用い、円板焼結体（１）の凹部に組み込むときに、円板焼結体（１）に仮止めするほうが望ましい。 As for the IC module (8), when the adhesive (6) is applied on either the front or back side, when the IC module (8) is incorporated into the recess of the disk sintered body (1), the disk sintered body (1) It is better to temporarily fix the
又、図３は、本発明の実施の第二の形態にかかる、製品構造の要部の概略を示すものである。図１と同様に、円板焼結体（１１）は、直径が２５mmで、厚さが１．８mm、比重が6g/ｃｍ３であり、片面の中央部にザグリ加工を施して凹部(直径；１０mm、厚さ;0.８mm)が形成される。この凹部は、IC（３）とアンテナ（４）が接続されたICモジュール（８）を組み込むスペースとなる。 FIG. 3 shows an outline of the main part of the product structure according to the second embodiment of the present invention. Similar to FIG. 1, the disk sintered body (11) has a diameter of 25 mm, a thickness of 1.8 mm, and a specific gravity of 6 g / cm 3. 10 mm, thickness; 0.8 mm). This recess serves as a space for incorporating the IC module (8) in which the IC (3) and the antenna (4) are connected.
ザグリ加工後、表面がPET等の樹脂で覆われたICモジュール（８）を円板焼結体（１１）の凹部に組み込み、粘着剤（６）にてICモジュール（８）と円板焼結体（１１）を固定する。 After counterboring, the IC module (8) whose surface is covered with a resin such as PET is incorporated into the recess of the disc sintered body (11), and the IC module (8) and the disc are sintered with the adhesive (6). Fix the body (11).
円板焼結体（１１）にICモジュール（８）を組み込んだ後の重量は、5.05gであり、遊戯用で使用する場合の所定の重量を確保することはできた。 The weight after incorporating the IC module (8) into the disc sintered body (11) was 5.05 g, and a predetermined weight when used for amusement could be secured.
また、通信性能については、ICモジュールに搭載するIC：I-CODE SLI(フィリップス製)、リーダーライター；IM02-B/PB05(ジーエルサイエンス製)にてICのシリアルNO読み取った場合、最大３０ｍｍの通信距離を安定して確保することができた。 As for communication performance, IC mounted on the IC module: I-CODE SLI (manufactured by Philips), reader / writer; IM02-B / PB05 (manufactured by GL Sciences), when reading the serial number of the IC, communication up to 30 mm The distance could be secured stably.
次に、図３の構成に付加してICタグの表面に表示層（９）を設けたものを、図４に示す。表示層（９）には、適用されるアプリケーションによって印刷インキ層、リライト層、筆記層、刻印層等が付加される。 Next, FIG. 4 shows a display layer (9) provided on the surface of the IC tag in addition to the configuration of FIG. A printing ink layer, a rewrite layer, a writing layer, a marking layer, and the like are added to the display layer (9) depending on the application to be applied.
図３の構成で保護材としてセラミックスによる円板焼結体（１１）の代替え材料として比較的比重の高い金属入りナイロン樹脂による用いた直径２５ｍｍ、厚さ１．８ｍｍの円板体（１２）を用いたものを図５に示す。 In the structure of FIG. 3, a disk body (12) having a diameter of 25 mm and a thickness of 1.8 mm, which is made of a nylon resin containing metal having a relatively high specific gravity as a substitute material for a disk sintered body (11) made of ceramics as a protective material. What was used is shown in FIG.
また、本コイン型ICタグ（２０）がアミューズメント施設においてLAN、WAN、インターネット等のネットワークに接続されたファイルサーバー（２４）を用いたシステムとして運用されるシステム構成図を図６に示す。 FIG. 6 shows a system configuration diagram in which the coin-type IC tag (20) is operated as a system using a file server (24) connected to a network such as a LAN, WAN, or the Internet in an amusement facility.
本コイン型ICタグ（２０）のID及び金銭情報(データ)は、アンテナ（２１）及び読み取り機（２２）を介してPC端末（２３）に送信され、PC端末（２３）で処理されたデータは、ネットワークを経由してファイルサーバー（２４）に送信される。ファイルサーバー（２４）では、複数設置された読み取り機（２２）で読み取ったコイン型ICタグ（２０）の情報を所定のファルダに一元管理される。 The ID and monetary information (data) of the coin-type IC tag (20) are transmitted to the PC terminal (23) via the antenna (21) and the reader (22) and processed by the PC terminal (23). Is transmitted to the file server (24) via the network. In the file server (24), information on the coin-type IC tag (20) read by a plurality of readers (22) is centrally managed in a predetermined folder.
１．円板焼結体
２．接着剤
３．IC
４．アンテナ
５．保護材
６．粘着剤
７．接続線
８．ＩＣモジュール
９.文字・絵柄表示層
１１．円板焼結体
１２.円板体
２０．コイン型ICタグ
２１．アンテナ
２２．読み取り機
２３．PC端末
２４．ファイルサーバー
1. 1. Disc sintered
4).
Claims (13)
外部とデータ通信を行う機能を有するIC及びアンテナを接続したモジュールとを含み、
前記第１及び第２の保護材はそれぞれ凹部を有し、これらの凹部に前記モジュールを配置して前記第１及び第２の保護材を張り合わせることにより、前記第１及び第２の保護材に前記モジュールを格納してなるコイン型ICタグ。 First and second protective materials made of ceramic that form a coin shape when pasted together;
Including an IC having a function of performing data communication with the outside and a module connected to an antenna,
Each of the first and second protective materials has a recess, and the first and second protective materials are formed by placing the module in these recesses and bonding the first and second protective materials together. A coin-type IC tag in which the module is stored.
外部とデータ通信を行う機能を有するIC及びアンテナを接続したモジュールとを含み、
前記保護材は凹部を有し、この凹部に前記モジュールを配置することにより、前記保護材に前記モジュールを格納してなるコイン型ICタグ。 Protective material with coin-shaped ceramic,
Including an IC having a function of performing data communication with the outside and a module connected to an antenna,
The coin type IC tag in which the protective material has a concave portion, and the module is stored in the protective material by disposing the module in the concave portion.
前記第１及び第２の保護材の凹部に前記モジュールを配置して前記第１及び第２の保護材を張り合わせることにより、前記第１及び第２の保護材に前記モジュールを格納するコイン型ICタグの製造方法。 Using the first and second protective materials made of ceramic, each of which has a recess, which becomes a coin shape when pasted together, an IC having a function of performing data communication with the outside, and a module connected to an antenna,
A coin type in which the module is stored in the first and second protective members by arranging the modules in the recesses of the first and second protective members and bonding the first and second protective members together. IC tag manufacturing method.
前記保護材の凹部に前記モジュールを配置することにより、前記保護材に前記モジュールを格納するコイン型ICタグの製造方法。
Using a protective material made of a coin-shaped ceramic, each having a recess, and a module connected to an IC and antenna having a function of performing data communication with the outside,
A method for manufacturing a coin-type IC tag, wherein the module is stored in the protective material by disposing the module in a recess of the protective material.
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| JP2004354046A JP2006163784A (en) | 2004-12-07 | 2004-12-07 | Coin-type ic tag and its manufacturing method |
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| JP2004354046A JP2006163784A (en) | 2004-12-07 | 2004-12-07 | Coin-type ic tag and its manufacturing method |
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| JP2006236279A (en) * | 2005-02-28 | 2006-09-07 | Krd Corporation Kk | Ic tag |
| JP2010079532A (en) * | 2008-09-25 | 2010-04-08 | Kyocera Corp | Ic tag holder |
| JP2011218487A (en) * | 2010-04-09 | 2011-11-04 | Mitsubishi Heavy Ind Ltd | Attaching structure for ic tag |
| JP2012027517A (en) * | 2010-07-20 | 2012-02-09 | Taisei Corp | Ic tag holder |
| JP2013172771A (en) * | 2012-02-23 | 2013-09-05 | Japan Network System Kk | Game ball and method of manufacturing the same |
| JP2015087926A (en) * | 2013-10-30 | 2015-05-07 | ミズホ株式会社 | Two-dimensional symbol stamp method to small steel object |
| WO2021161885A1 (en) * | 2020-02-14 | 2021-08-19 | エンゼルグループ株式会社 | Game token and manufacturing method therefor |
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| JP2006236279A (en) * | 2005-02-28 | 2006-09-07 | Krd Corporation Kk | Ic tag |
| JP4536552B2 (en) * | 2005-02-28 | 2010-09-01 | ケイ・アール・ディコーポレーション株式会社 | IC tag |
| JP2010079532A (en) * | 2008-09-25 | 2010-04-08 | Kyocera Corp | Ic tag holder |
| JP2011218487A (en) * | 2010-04-09 | 2011-11-04 | Mitsubishi Heavy Ind Ltd | Attaching structure for ic tag |
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| WO2021161885A1 (en) * | 2020-02-14 | 2021-08-19 | エンゼルグループ株式会社 | Game token and manufacturing method therefor |
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| US11790202B2 (en) | 2020-02-14 | 2023-10-17 | Angel Group Co., Ltd. | Game token and method for manufacturing the same |
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