JP2006135640A - Radio communication module - Google Patents

Radio communication module Download PDF

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JP2006135640A
JP2006135640A JP2004322127A JP2004322127A JP2006135640A JP 2006135640 A JP2006135640 A JP 2006135640A JP 2004322127 A JP2004322127 A JP 2004322127A JP 2004322127 A JP2004322127 A JP 2004322127A JP 2006135640 A JP2006135640 A JP 2006135640A
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wireless communication
communication module
substrate
electronic component
circuit
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Masaru Kosaka
優 小坂
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Sharp Corp
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a radio communication module which is easily produced and made thin sufficiently. <P>SOLUTION: The radio communication module is provided with a substrate 1 having a recessed part and an electronic component 5 constituting a circuit for radio communication, wherein the electronic component 5 is arranged in the recessed part, and the electronic component 5 is housed inside the area of the recessed part. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、無線通信用回路を構成する電子部品を基板に実装している無線通信モジュールに関する。   The present invention relates to a wireless communication module in which electronic components constituting a wireless communication circuit are mounted on a substrate.

無線通信機能を有する機器（以下、「無線通信機器」という）においては、近年、小型化、薄型化がますます進んでいる。そのため、無線通信機器に搭載される無線通信モジュールに対する小型化、薄型化の要求が高まっている。   In recent years, devices having wireless communication functions (hereinafter referred to as “wireless communication devices”) have been increasingly reduced in size and thickness. Therefore, there is an increasing demand for miniaturization and thinning of the wireless communication module mounted on the wireless communication device.

無線信号の送受信を行う無線通信機器の一般的な回路ブロック図を図５に示す。無線信号の送信を行うための高周波信号送信回路８と無線信号の受信を行うための高周波信号受信回路９とがそれぞれアンテナ７に接続されている。また、送受信データの誤り訂正符号の付加、拡散変調や逆拡散等の信号処理を行うベースバンド信号処理回路１０が高周波信号送信回路８及び高周波信号受信回路９に接続されている。   FIG. 5 shows a general circuit block diagram of a wireless communication device that transmits and receives wireless signals. A high-frequency signal transmitting circuit 8 for transmitting a radio signal and a high-frequency signal receiving circuit 9 for receiving a radio signal are connected to an antenna 7, respectively. Further, a baseband signal processing circuit 10 that performs signal processing such as addition of error correction codes of transmission / reception data, spread modulation, and despreading is connected to the high frequency signal transmission circuit 8 and the high frequency signal reception circuit 9.

なお、当然の事ながら、無線信号の送信のみを行う無線通信機器は高周波信号受信回路を有さない構成となり、無線信号の受信のみを行う無線通信機器は高周波信号送信回路を有さない構成となる。   As a matter of course, a radio communication device that only transmits a radio signal has a configuration that does not have a high-frequency signal receiving circuit, and a radio communication device that only receives a radio signal has a configuration that does not have a high-frequency signal transmission circuit. Become.

また、無線通信モジュールにおいては、高周波信号送信回路からの不要輻射や高周波信号受信回路への妨害電波の飛び込みを防ぐために、通常シールド用の金属ケースがこれらの回路を覆うように無線通信モジュール上面に配置されている。   In addition, in the wireless communication module, in order to prevent unwanted radiation from the high-frequency signal transmission circuit and interference radio waves from entering the high-frequency signal reception circuit, a metal case for a normal shield is usually placed on the upper surface of the wireless communication module so as to cover these circuits. Has been placed.

従来の無線通信モジュールにおいては、図３に示すように、高周波信号送信回路、高周波信号受信回路、及びベースバンド信号処理回路を構成する複数の電子部品５’が基板１’の表面上に実装されており、さらにシールド用の金属ケース３’が基板１’の実装面四隅に形成されている半田付けランド２’に半田付けされ基板１’の実装面を覆っている。
特開２００２−３４４１４６号公報 In the conventional wireless communication module, as shown in FIG. 3, a plurality of electronic components 5 ′ constituting a high-frequency signal transmitting circuit, a high-frequency signal receiving circuit, and a baseband signal processing circuit are mounted on the surface of the substrate 1 ′. Further, a shielding metal case 3 ′ is soldered to soldering lands 2 ′ formed at the four corners of the mounting surface of the substrate 1 ′ to cover the mounting surface of the substrate 1 ′.
JP 2002-344146 A

図３に示す構造の従来の無線通信モジュールでは、図４から明らかなように、基板１’の厚みＨS’に金属ケース３’の厚みＨC’を加えたものがモジュール全体の厚みＨM’になるので、十分な薄型化を図ることができなかった。仮に金属ケース３’を設けない構成にしたとしても、複数の電子部品５’のうち最も厚みがある電子部品の厚みを基板１’の厚みに加えたものがモジュール全体の厚みになるので、十分な薄型化を図ることができなかった。 In the conventional wireless communication module having the structure shown in FIG. 3, the thickness H M of the entire module is obtained by adding the thickness H C ′ of the metal case 3 ′ to the thickness H S ′ of the substrate 1 ′, as is apparent from FIG. Because it becomes', it was not possible to make it thin enough. Even if the metal case 3 ′ is not provided, the thickness of the thickest electronic component among the plurality of electronic components 5 ′ is added to the thickness of the substrate 1 ′, so that the thickness of the entire module is sufficient. Thinning was not possible.

かかる問題を解決するために、特許文献１では電子部品を基板内部に埋め込んでいる高周波モジュールを提案している。しかしながら、特許文献１において提案されている高周波モジュールは半導体からなる電子部品を基板内部に埋め込んでいる構成であり、かかる構成の高周波モジュールを生産する場合、クリーン度が必要とされる基板作製工程が半導体実装工程から完全に分離された工程でないため、生産が困難であるという問題がある。また、特許文献１において提案されている高周波モジュールは、シールドとしての金属層を基板表面のみに有しており、基板側面のシールドに対しては効果がない構造となっている。   In order to solve this problem, Patent Document 1 proposes a high-frequency module in which electronic components are embedded in a substrate. However, the high-frequency module proposed in Patent Document 1 has a configuration in which an electronic component made of a semiconductor is embedded in a substrate, and when producing a high-frequency module having such a configuration, a substrate manufacturing process that requires cleanliness is required. There is a problem that production is difficult because the process is not completely separated from the semiconductor mounting process. Further, the high-frequency module proposed in Patent Document 1 has a metal layer as a shield only on the substrate surface, and has a structure that is not effective for the shield on the side surface of the substrate.

本発明は、上記の問題点に鑑み、生産が容易であって且つ十分な薄型化を図ることができる無線通信モジュールを提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a wireless communication module that is easy to produce and can be sufficiently thinned.

上記目的を達成するために本発明に係る無線通信モジュールは、凹部を有する基板と無線通信用回路を構成する電子部品とを備え、前記電子部品が前記凹部に配置され、前記電子部品が前記凹部の領域内に収まる構成である。前記無線通信用回路の例としては、高周波信号送信回路、高周波信号受信回路、及びベースバンド処理回路の少なくとも一つを有する回路が挙げられる。   In order to achieve the above object, a wireless communication module according to the present invention includes a substrate having a recess and an electronic component constituting a circuit for wireless communication, the electronic component is disposed in the recess, and the electronic component is the recess. This is a configuration that fits within the area. Examples of the wireless communication circuit include a circuit having at least one of a high-frequency signal transmitting circuit, a high-frequency signal receiving circuit, and a baseband processing circuit.

このような構成によると、モジュール全体の厚みを前記基板の厚みと等しくすることができるので、十分な薄型化を図ることができる。また、電子部品を基板内部に埋め込まない構造であるので、生産が容易である。また、前記凹部を設けている箇所の厚みが薄くなるが、凹部を設けていない箇所の厚みは従来基板と同程度にすることができるので、前記基板の強度低下を抑えることができる。   According to such a configuration, the thickness of the entire module can be made equal to the thickness of the substrate, so that a sufficient thickness reduction can be achieved. Further, since the electronic component is not embedded in the substrate, the production is easy. Moreover, although the thickness of the location in which the said recessed part is provided becomes thin, since the thickness of the location in which the recessed part is not provided can be made comparable as the conventional board | substrate, the strength reduction of the said board | substrate can be suppressed.

また、上記構成の無線通信モジュールにおいて、前記電子部品が樹脂封止され、その樹脂封止に用いられる樹脂が前記凹部の領域内に収まるようにしてもよい。   In the wireless communication module having the above configuration, the electronic component may be resin-sealed, and the resin used for the resin sealing may be accommodated in the region of the recess.

このような構成によると、前記電子部品が封止用樹脂により保護されるとともに、その樹脂封止により前記電子部品を前記基板に固着させることができる。また、前記電子部品の樹脂封止に用いられる樹脂が前記凹部領域内に収まっているので、上記構成の無線通信モジュールと同様にモジュール全体の厚みを前記基板の厚みと等しくすることができる。   According to such a configuration, the electronic component is protected by the sealing resin, and the electronic component can be fixed to the substrate by the resin sealing. In addition, since the resin used for resin sealing of the electronic component is contained in the recessed region, the thickness of the entire module can be made equal to the thickness of the substrate in the same manner as the wireless communication module having the above configuration.

また、上記各構成の無線通信モジュールにおいて、シールド部材が前記凹部の領域内に収まるように配置されているようにしてもよい。   In the wireless communication module having each of the above configurations, the shield member may be disposed so as to be within the region of the recess.

このような構成によると、前記シールド部材を設けているので、ノイズ特性を向上させることができる。また、前記シールド部材を設けても前記シールド部材が前記凹部領域内に収まっているので、上記各構成の無線通信モジュールと同様にモジュール全体の厚みを前記基板の厚みと等しくすることができる。   According to such a configuration, since the shield member is provided, noise characteristics can be improved. Further, even if the shield member is provided, the shield member is accommodated in the recessed region, so that the thickness of the entire module can be made equal to the thickness of the substrate in the same manner as the wireless communication modules having the above-described configurations.

また、上記シールド部材を有する構成の無線通信モジュールにおいて、前記凹部の底部に段差部を設け、前記段差部を前記シールド部材の取り付けランドにしてもよい。   In the wireless communication module having the shield member, a step portion may be provided at the bottom of the recess, and the step portion may be an attachment land for the shield member.

このような構成によると、前記シールド部材が前記段差部により決められた位置で固定されるので、前記シールド部材と前記電子部品との接触を防止することができる。また、前記シールド部材が前記段差部に取り付けられるので、モジュールが落下した場合においても、前記シールド部材の離脱を回避することができる。   According to such a configuration, since the shield member is fixed at a position determined by the stepped portion, contact between the shield member and the electronic component can be prevented. In addition, since the shield member is attached to the stepped portion, it is possible to avoid detachment of the shield member even when the module falls.

また、上記シールド部材を有する各構成の無線通信モジュールにおいて、前記シールド部材が開口部を有するようにしてもよい。   Moreover, in the radio | wireless communication module of each structure which has the said shield member, you may make it the said shield member have an opening part.

このような構成によると、前記シールド部材を前記凹部に配置した後であっても、前記開口部を通して封止用樹脂を前記凹部の底部側に進入させて前記電子部品を樹脂封止することができるので、生産がより一層容易になる。また、樹脂封止をしない場合には、前記開口部によって放熱性が向上する。   According to such a configuration, even after the shield member is disposed in the recess, the electronic component can be resin-sealed by allowing the sealing resin to enter the bottom of the recess through the opening. This makes production even easier. Further, when the resin sealing is not performed, the heat dissipation is improved by the opening.

また、上記シールド部材を有する各構成の無線通信モジュールにおいて前記シールド部材が樹脂封止され、その樹脂封止により前記シールド部材が前記基板に固着されるようにしてもよい。   Further, in the wireless communication module having each configuration having the shield member, the shield member may be resin-sealed, and the shield member may be fixed to the substrate by the resin sealing.

このような構成によると、前記シールド部材が封止用樹脂により保護されるとともに、その樹脂封止により前記シールド部材を前記基板に固着させることができる。これにより、前記シールド部材と前記基板との結合が強固となり、モジュールが落下した場合においても、前記シールド部材の離脱を回避することができる。また、前記シールド部材の樹脂封止に用いられる樹脂が前記凹部領域内に収まっているので、上記各構成の無線通信モジュールと同様にモジュール全体の厚みを前記基板の厚みと等しくすることができる。   According to such a configuration, the shield member is protected by the sealing resin, and the shield member can be fixed to the substrate by the resin sealing. Thereby, the coupling | bonding of the said shield member and the said board | substrate becomes firm, and detachment | leave of the said shield member can be avoided even when a module falls. In addition, since the resin used for resin sealing of the shield member is accommodated in the recessed region, the thickness of the entire module can be made equal to the thickness of the substrate in the same manner as the wireless communication modules having the above-described configurations.

本発明によると、生産が容易であって且つ十分な薄型化を図ることができる無線通信モジュールを実現することができる。   According to the present invention, it is possible to realize a wireless communication module that is easy to produce and can be sufficiently thinned.

本発明の一実施形態について図面を参照して以下に説明する。本発明に係る無線通信モジュールの分解斜視図を図１に示す。本発明に係る無線通信モジュールは、基板１と、シールド用の金属ケース３と、高周波信号送信回路、高周波信号受信回路、及びベースバンド信号処理回路を構成する複数の電子部品５と、封止用樹脂（図１において不図示）とを備えている。   An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an exploded perspective view of a wireless communication module according to the present invention. A wireless communication module according to the present invention includes a substrate 1, a shielding metal case 3, a plurality of electronic components 5 constituting a high-frequency signal transmitting circuit, a high-frequency signal receiving circuit, and a baseband signal processing circuit, and a sealing Resin (not shown in FIG. 1).

図１に示されるように、基板１は凹部を有しており、前記凹部の底面上に回路配線がプリントされている。そして、複数の電子部品５が前記凹部の底面上に実装されており、複数の電子部品５が前記凹部の領域内に収まっている。なお、図１においては、基板１に設けられる凹部は一箇所であるが、数箇所であってもよい。また、図１においては、基板１の片面にのみ凹部を設けたが、反対面にも凹部を設けてその凹部にも電子部品やシールド用の金属ケースを実装するようにしてもよい。   As shown in FIG. 1, the substrate 1 has a recess, and circuit wiring is printed on the bottom surface of the recess. And the some electronic component 5 is mounted on the bottom face of the said recessed part, and the several electronic component 5 is settled in the area | region of the said recessed part. In FIG. 1, the concave portion provided in the substrate 1 is one place, but may be several places. In FIG. 1, the concave portion is provided only on one surface of the substrate 1, but a concave portion may be provided on the opposite surface, and an electronic component or a metal case for shielding may be mounted on the concave portion.

また、前記凹部の底面四隅には電子部品搭載面よりも１段高い半田付けランド２が設けられており、シールド用の金属ケース３が半田付けランド２に半田付けされ前記凹部底面の電子部品搭載面を覆っており、シールド用の金属ケース３が前記凹部の領域内に収まっている。このように、シールド用の金属ケース３が半田付けランド２により決められた位置で固定されるので、シールド用の金属ケース３と電子部品５との接触を防止することができる。また、シールド用の金属ケース３が半田付けランド２に取り付けられるので、モジュールが落下した場合においても、シールド用の金属ケース３の離脱を回避することができる。   In addition, solder lands 2 that are one step higher than the electronic component mounting surface are provided at the four corners of the bottom surface of the recess, and a metal case 3 for shielding is soldered to the soldering land 2 to mount the electronic component on the bottom surface of the recess. The metal case 3 for shielding is contained in the region of the recess. As described above, since the shielding metal case 3 is fixed at a position determined by the soldering land 2, the contact between the shielding metal case 3 and the electronic component 5 can be prevented. Further, since the shielding metal case 3 is attached to the soldering land 2, it is possible to avoid the detachment of the shielding metal case 3 even when the module is dropped.

シールド用の金属ケース３は、基板１の電子部品搭載面に対向する金属面の他に基板１の厚み方向に沿った金属面も有しているので、基板１の電子部品搭載面のみならず側面のシールドに対しても効果がある構造となっている。シールド用の金属ケース３は、高周波電波のシールド効果を妨げない程度の開口面積の穴４を複数有している。穴４の開口面積は、無線通信モジュールに搭載される高周波信号送信回路及び高周波信号受信回路が処理する高周波信号の周波数帯域に応じて、適宜設計することができる。   Since the metal case 3 for shielding has a metal surface along the thickness direction of the substrate 1 in addition to the metal surface facing the electronic component mounting surface of the substrate 1, not only the electronic component mounting surface of the substrate 1 The structure is also effective against the side shield. The shielding metal case 3 has a plurality of holes 4 having an opening area that does not hinder the shielding effect of high-frequency radio waves. The opening area of the hole 4 can be appropriately designed according to the frequency band of the high-frequency signal processed by the high-frequency signal transmitting circuit and the high-frequency signal receiving circuit mounted on the wireless communication module.

続いて、図２に示す本発明に係る無線通信モジュールの垂直断面図を参照して、本発明に係る無線通信モジュールの組み立て工程について説明する。まず、半田付けにより基板１の凹部の底面上に複数の電子部品５を実装し、その後半田付けによりシールド用の金属ケース３を基板１の半田付け用ランド２に実装する。ここで、複数の電子部品５及びシールド用の金属ケース３の基板１への半田付けは、同じ工程において行ってもよいし、電子部品５の基板１への半田付け工程の終了後、別工程にてシールド用の金属ケース３の基板１への半田付けを行ってもよい。   Next, an assembly process of the wireless communication module according to the present invention will be described with reference to a vertical sectional view of the wireless communication module according to the present invention shown in FIG. First, the plurality of electronic components 5 are mounted on the bottom surface of the concave portion of the substrate 1 by soldering, and then the metal case 3 for shielding is mounted on the soldering land 2 of the substrate 1 by soldering. Here, the soldering of the plurality of electronic components 5 and the metal case 3 for shielding to the substrate 1 may be performed in the same process, or after the soldering process of the electronic components 5 to the substrate 1 is completed. The metal case 3 for shielding may be soldered to the substrate 1 at.

複数の電子部品５及びシールド用の金属ケース３が基板１に実装された後、封止用樹脂６をシールド用の金属ケース３の上部からシールド用の金属ケース３の穴４を通して流し込み、封止用樹脂６をシールド用の金属ケース３の下部に充填する。さらに、封止用樹脂６がシールド用の金属ケース３の上部を完全に覆うようになるまで、封止用樹脂６をシールド用の金属ケース３の上部に流し込む。   After the plurality of electronic components 5 and the shielding metal case 3 are mounted on the substrate 1, the sealing resin 6 is poured from the upper part of the shielding metal case 3 through the holes 4 of the shielding metal case 3 to be sealed. The resin 6 is filled in the lower part of the shielding metal case 3. Further, the sealing resin 6 is poured into the upper part of the shielding metal case 3 until the sealing resin 6 completely covers the upper part of the shielding metal case 3.

このような工程が行われることによって、電子部品５及び金属ケース３が封止用樹脂６によって樹脂封止され、複数の電子部品５及びシールド用の金属ケース３が封止用樹脂６により保護されるとともに、その樹脂封止により複数の電子部品５及びシールド用の金属ケース３を基板１に固着させることができる。これにより、シールド用の金属ケース３と基板１との結合が強固となり、モジュールが落下した場合においても、シールド用の金属ケース３の離脱を回避することができる。   By performing such a process, the electronic component 5 and the metal case 3 are resin-sealed by the sealing resin 6, and the plurality of electronic components 5 and the shielding metal case 3 are protected by the sealing resin 6. In addition, the plurality of electronic components 5 and the shielding metal case 3 can be fixed to the substrate 1 by the resin sealing. Thereby, the connection between the shielding metal case 3 and the substrate 1 becomes strong, and the detachment of the shielding metal case 3 can be avoided even when the module falls.

ここで、封止用樹脂６が基板１の凹部の領域内に収まるようにしているので、モジュール全体の厚みを基板１の厚みＨSと等しくすることができる。 Here, since the sealing resin 6 fits within the region of the concave portion of the substrate 1, the thickness of the entire module can be made equal to the thickness H S of the substrate 1.

上述した本発明に係る無線通信モジュールによれば、モジュール全体の厚みを基板１の厚みＨSと等しくすることができるので、無線通信モジュールの十分な薄型化を図ることができ、ひいては無線通信機器の薄型化に寄与することができる。また、電子部品を基板内部に埋め込まない構造であるので、生産が容易である。また、基板１において、凹部を設けている箇所の厚みは薄くなるが、凹部を設けていない箇所の厚みは従来基板の厚みと同程度にすることができるので、前記基板の強度低下を抑えることができる。 According to the above-described wireless communication module according to the present invention, the thickness of the entire module can be made equal to the thickness H S of the substrate 1, so that the wireless communication module can be sufficiently thinned. This can contribute to the reduction in thickness. Further, since the electronic component is not embedded in the substrate, the production is easy. Further, in the substrate 1, the thickness of the portion where the concave portion is provided is reduced, but the thickness of the portion where the concave portion is not provided can be approximately the same as the thickness of the conventional substrate, thereby suppressing a decrease in strength of the substrate. Can do.

なお、当然の事ながら、無線信号の送信のみを行う無線通信機器向けの本発明に係る無線通信モジュールは高周波信号受信回路を構成する電子部品を有さない構成となり、無線信号の受信のみを行う無線通信機器向けの本発明に係る無線通信モジュールは高周波信号送信回路を構成する電子部品を有さない構成となる。   As a matter of course, the wireless communication module according to the present invention for a wireless communication device that only transmits a wireless signal has a configuration that does not include an electronic component that constitutes a high-frequency signal receiving circuit, and only receives a wireless signal. A wireless communication module according to the present invention for a wireless communication device has a configuration that does not include an electronic component that constitutes a high-frequency signal transmission circuit.

は、本発明に係る無線通信モジュールの分解斜視図である。These are exploded perspective views of the wireless communication module according to the present invention. は、本発明に係る無線通信モジュールの垂直断面図である。These are vertical sectional views of the wireless communication module according to the present invention. は、従来の無線通信モジュールの分解斜視図である。FIG. 3 is an exploded perspective view of a conventional wireless communication module. は、従来の無線通信モジュールの垂直断面図である。FIG. 3 is a vertical sectional view of a conventional wireless communication module. は、無線信号の送受信を行う無線通信機器の一般的な回路ブロック図である。These are general circuit block diagrams of the radio | wireless communication apparatus which transmits / receives a radio signal.

符号の説明Explanation of symbols

１、１’ 基板
２、２’ 半田付けランド
３、３’ 金属ケース
４ 穴
５、５’ 電子部品
６ 封止用樹脂
７ アンテナ
８ 高周波信号送信回路
９ 高周波信号受信回路
１０ ベースバンド信号処理回路
ＨS、ＨS’ 基板の厚さ
ＨC’ 金属ケースの厚さ
ＨM’ モジュール全体の厚さ DESCRIPTION OF SYMBOLS 1, 1 'board | substrate 2, 2' soldering land 3, 3 'metal case 4 hole 5, 5' electronic component 6 sealing resin 7 antenna 8 high frequency signal transmission circuit 9 high frequency signal receiving circuit 10 baseband signal processing circuit H S , H S 'thickness of substrate H C ' thickness of metal case H M 'thickness of entire module

Claims (7)

凹部を有する基板と無線通信用回路を構成する電子部品とを備え、前記電子部品が前記凹部に配置され、前記電子部品が前記凹部の領域内に収まることを特徴とする無線通信モジュール。   A wireless communication module comprising a substrate having a recess and an electronic component constituting a circuit for wireless communication, wherein the electronic component is disposed in the recess, and the electronic component is accommodated in the region of the recess. 前記無線通信用回路が、高周波信号送信回路、高周波信号受信回路、及びベースバンド処理回路の少なくとも一つを有する回路である請求項１に記載の無線通信モジュール。   The wireless communication module according to claim 1, wherein the wireless communication circuit is a circuit having at least one of a high-frequency signal transmitting circuit, a high-frequency signal receiving circuit, and a baseband processing circuit. 前記電子部品が樹脂封止され、その樹脂封止に用いられる樹脂が前記凹部の領域内に収まる請求項１または請求項２に記載の無線通信モジュール。   The wireless communication module according to claim 1, wherein the electronic component is resin-sealed, and a resin used for the resin sealing is accommodated in the region of the recess. シールド部材が前記凹部の領域内に収まるように配置されている請求項１〜３のいずれかに記載の無線通信モジュール。   The radio | wireless communication module in any one of Claims 1-3 arrange | positioned so that a shield member may be settled in the area | region of the said recessed part. 前記凹部の底部に段差部を設け、前記段差部が前記シールド部材の取り付けランドである請求項４に記載の無線通信モジュール。   The wireless communication module according to claim 4, wherein a step portion is provided at a bottom portion of the concave portion, and the step portion is an attachment land for the shield member. 前記シールド部材が開口部を有する請求項４または請求項５に記載の無線通信モジュール。   The wireless communication module according to claim 4, wherein the shield member has an opening. 前記シールド部材が樹脂封止され、その樹脂封止に用いられる樹脂が前記凹部の領域内に収まる請求項４〜６のいずれかに記載の無線通信モジュール。   The wireless communication module according to claim 4, wherein the shield member is resin-sealed, and a resin used for the resin sealing is accommodated in the region of the recess.
JP2004322127A 2004-11-05 2004-11-05 Radio communication module Pending JP2006135640A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186289A1 (en) * 2014-06-03 2015-12-10 株式会社デンソー Electronic apparatus
JP2022516936A (en) * 2019-02-01 2022-03-03 ヒューレット－パッカード デベロップメント カンパニー エル．ピー． Cover for electronic devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015186289A1 (en) * 2014-06-03 2015-12-10 株式会社デンソー Electronic apparatus
JP2015230911A (en) * 2014-06-03 2015-12-21 株式会社デンソー Electronic device
JP2022516936A (en) * 2019-02-01 2022-03-03 ヒューレット－パッカード デベロップメント カンパニー エル．ピー． Cover for electronic devices
US11762427B2 (en) 2019-02-01 2023-09-19 Hewlett-Packard Development Company, L.P. Covers for electronic devices

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