JP2006128517A - Method for manufacturing electronic component - Google Patents
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- JP2006128517A JP2006128517A JP2004317136A JP2004317136A JP2006128517A JP 2006128517 A JP2006128517 A JP 2006128517A JP 2004317136 A JP2004317136 A JP 2004317136A JP 2004317136 A JP2004317136 A JP 2004317136A JP 2006128517 A JP2006128517 A JP 2006128517A
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Abstract
Description
本発明は、一方の主面に開口して底の有る空間を形成した容器が多数個連続して形成されて成るシート状基板の空間に圧電振動子や半導体などの電子部品を搭載し、それぞれの容器開口部にリッドを被せて気密封止して個割りする電子部品の製造方法に関する。 In the present invention, an electronic component such as a piezoelectric vibrator or a semiconductor is mounted in a space of a sheet-like substrate formed by continuously forming a plurality of containers that are open on one main surface to form a space with a bottom. The present invention relates to a method for manufacturing an electronic component in which a lid is put on a container opening of the container and hermetically sealed and divided into pieces.
従来の圧電振動子や圧電発振器といった電子部品の製造方法においては、一辺を開口して底の有る空間を形成した容器内部の底部側の絶縁された基板上に、圧電振動子や半導体などの電子部品を搭載し、その容器開口部に金属から成るリッドを被せて気密封止していた。 In a conventional method of manufacturing an electronic component such as a piezoelectric vibrator or a piezoelectric oscillator, an electron such as a piezoelectric vibrator or a semiconductor is formed on an insulated substrate on the bottom side inside a container in which one side is opened to form a bottomed space. The parts were mounted, and the container opening was covered with a metal lid and hermetically sealed.
しかしながら、一方、最近の傾向では通信分野の伝送系装置等を中核として、その搭載部品についての非常に急激な市場からの小型化や低背化、更に加えて軽量化や低価格化の要求があり、圧電振動子や圧電発振器といった電子部品に関しても、内部に圧電振動子や半導体部品を気密封止しながら、その外形サイズが2.5ｍｍ×2.0ｍｍといったように非常に小型と成って来ており、そのため従来行われて来た、ひとつひとつの電子部品を個別に製造する方法よりも生産効率の良い製造方法が必要とされ、このような背景の下、多数個の電子部品の容器が連なって形成されたシート状の基板のそれぞれの空間部に圧電振動子や半導体といった部品を搭載して、更に先の電子部品容器を封止する蓋体であるリッドが多数個形成されたシート状リッドを被せて、シート状の基板のそれぞれの空間部を封止した後に、個々の電子部品に個割りする本発明の電子部品の製造方法が考え出されたものである。 On the other hand, however, the recent trend is centered on transmission systems in the communications field, and there is a very rapid demand for miniaturization and low profile from the market, as well as weight reduction and price reduction. Yes, electronic parts such as piezoelectric vibrators and piezoelectric oscillators have become very small, such as 2.5 mm x 2.0 mm, while the piezoelectric vibrator and semiconductor parts are hermetically sealed inside. Therefore, a manufacturing method with higher production efficiency than the conventional method of manufacturing individual electronic components is required, and in this background, a large number of electronic component containers are formed in series. A sheet-like lid in which parts such as piezoelectric vibrators and semiconductors are mounted in the respective space portions of the formed sheet-like substrate, and a number of lids are formed as lids for sealing the electronic component container. Covered by, after sealing the respective space portions of a sheet-like substrate, in which method for manufacturing an electronic component of the present invention into individual split into individual electronic components are devised.
先記のように、ひとつひとつの電子部品を溶融接合を用いて封止する従来の特許には、その電子部品のパッケ−ジ構造に関するものとして以下のものがある。 As described above, the conventional patents for sealing each electronic component by using melt bonding include the following regarding the package structure of the electronic component.
なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を本件出願時までに発見するに至らなかった。 In addition, the applicant did not find any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.
ここでの電子部品の製造に用いる技術は、多数個の電子部品の容器が連なって形成されたシート状の基板のそれぞれの空間部に圧電振動子や半導体といった部品を搭載して、更にそのシート状の基板の上から先の電子部品容器を封止する蓋体であるリッドが多数個形成されたシート状リッドを被せて、シート状の基板のそれぞれの空間部を、電子ビ−ム溶接や熱融着、あるいはパルスヒートやレーザービ−ム溶接といった溶接技術を用いてビ−ムをリッドの上から照射してリッドを加熱溶融して容器の開口頂部の金属メッキ層と溶融接合させて気密封止するというものである。 The technology used in the manufacture of electronic components here includes mounting a component such as a piezoelectric vibrator or a semiconductor in each space portion of a sheet-like substrate formed by connecting a large number of electronic component containers, and then the sheet. A sheet-like lid on which a large number of lids, which are lid bodies for sealing the electronic component container from the top of the board-like substrate, are covered, and the respective space portions of the sheet-like board are subjected to electron beam welding or Using heat welding or welding technology such as pulse heat or laser beam welding, the beam is irradiated from above the lid, the lid is heated and melted, and melt-bonded to the metal plating layer at the top of the opening of the container to be hermetically sealed. It is to stop.
しかしながら、電子部品の容器にセラミックパッケージを選択して、リッドには金属板、容器側開口縁部にはニッケルメッキ等を施し、リッドの上からレーザー、或いは電子ビームを照射してリッドと容器開口縁部を溶接する場合、レーザーなどにより封止するために使われるパワーと比例してリッドからの光線の反射も増加する傾向が有り、その為に本来封止に必要なビームのパワーが大きく成って、その結果、シート状の基板にシート状リッドを封止する場合、シート状リッドが熱膨張を起こしてその溶接後にリッドが自然収縮し、それにつれてシート状基板が反り、このことが非常に空間部の小さな電子部品の内部に搭載された圧電振動子といった電子部品が容器空間部の内壁に接触するといったおそれを発生するという問題があった。 However, the ceramic package is selected for the electronic component container, the lid is made of a metal plate, the container side opening edge is nickel-plated, etc., and laser or electron beam is irradiated from above the lid to open the lid and the container. When welding the edges, the reflection of light from the lid tends to increase in proportion to the power used to seal with the laser, etc., which increases the beam power that is originally required for sealing. As a result, when the sheet-like lid is sealed to the sheet-like substrate, the sheet-like lid undergoes thermal expansion and the lid spontaneously shrinks after the welding, and the sheet-like substrate warps accordingly. There is a problem that an electronic component such as a piezoelectric vibrator mounted inside an electronic component having a small space portion may come into contact with the inner wall of the container space portion.
従って、本発明は上記課題を解消するために成されたものであって、シート状リッドの形状に着目することでリッド自体の強度を落さずにレーザーのエネルギ−量を小さくしても確実な封止を実現し、封止の際の加熱に対してもシート状リッド、及びシート状基板に多数形成された容器の歪みの発生を抑えることにも配慮した電子部品の製造方法である。 Accordingly, the present invention has been made to solve the above-mentioned problems, and by paying attention to the shape of the sheet-like lid, it is possible to reliably reduce the energy amount of the laser without reducing the strength of the lid itself. It is a method for manufacturing an electronic component that realizes a proper sealing and also suppresses the occurrence of distortion of a sheet-shaped lid and a large number of containers formed on a sheet-shaped substrate even when heated during sealing.
上記の目的を達成するために、本発明は、一方の主面に開口して底の有る空間を形成した容器が多数個連続して形成されて成るシート状基板の空間に圧電振動子や半導体などの電子部品を搭載し、それぞれの容器開口部にリッドを被せて気密封止して個割りする電子部品の製造方法において、先記リッドの、少なくとも容器開口部に被さる外周端部板厚が、リッド主要部分よりも薄く形成された、及び/または、容器開口部に被さる外周端部に複数のスルーホールが形成されたリッドが、容器開口部に載置されるように多数個のリッドが連続して形成されて成るシート状リッドを先のシート状基板に載置する工程と、
先のリッドの外周端部と容器開口頂部とを溶接手段により加熱し溶融接合によりそれぞれの容器を気密封止する工程と、
それぞれの電子部品に個割りする工程とから成るものである。
In order to achieve the above object, the present invention provides a piezoelectric vibrator or a semiconductor in a space of a sheet-like substrate formed by continuously forming a plurality of containers that are open on one main surface to form a bottomed space. In the method of manufacturing an electronic component in which electronic parts such as the above are mounted and each container opening is covered with a lid and hermetically sealed and divided into pieces, the thickness of the outer peripheral edge part of the above-mentioned lid covering at least the container opening is A plurality of lids formed so that the lid is formed thinner than the main portion of the lid and / or a plurality of through-holes are formed on the outer peripheral end portion covering the container opening. Placing the sheet-like lid formed continuously on the previous sheet-like substrate;
Heating the outer peripheral end of the previous lid and the top of the container opening by welding means and hermetically sealing each container by melt bonding;
And a process of dividing each electronic component.
また、先のシート状リッドのそれぞれの容器開口部に被さるリッドの外周端部の板厚が、このリッドの主要部分の側から外周端部の側に向かって薄くなるように形成されているシート状リッドを、シート状基板に載置するものである。 Further, the sheet thickness of the outer peripheral end of the lid covering each container opening of the previous sheet-like lid is formed so as to become thinner from the main part side to the outer peripheral end side. The lid is placed on a sheet-like substrate.
本発明の電子部品の製造方法により、従来に比べてレーザーといった小さな溶接の為のビームのパワーで確実な溶接が可能と成り、シート状リッドの熱膨張と溶接の為の加熱後の収縮が小さく成り、その結果、シート状基板の反りが縮小されて、圧電素板にパッケージからの歪の影響を小さくすることが出来、著しく信頼性の高い電子部品を多数同時に製造を可能とすることが出来る。 According to the method of manufacturing an electronic component of the present invention, it is possible to perform reliable welding with a beam power for small welding such as laser as compared with the conventional one, and thermal expansion of the sheet-like lid and shrinkage after heating for welding are small. As a result, the warpage of the sheet-like substrate is reduced, the influence of distortion from the package on the piezoelectric element plate can be reduced, and a large number of highly reliable electronic components can be manufactured simultaneously. .
また、シート状基板とシート状リッドを用いた電子部品の製造方法による生産効率を高めることが出来、その結果、著しくその生産コストを低減する。 Moreover, the production efficiency by the manufacturing method of the electronic component using a sheet-like board | substrate and a sheet-like lid can be improved, As a result, the production cost is reduced significantly.
以下に図面を参照しながら本発明の実施の一形態について説明する。なお、各図においての同一の符号は同じ対象を示すものとする。以下、本発明の実施の形態を、図面を参照しながら説明する。なお、それぞれの図においては、本発明を理解し易くするためにデフォルメした形で図示されている。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol in each figure shall show the same object. Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each figure is shown in a deformed form for easy understanding of the present invention.
図１は本発明の電子部品の製造方法を示したフローチャートである。即ち、本発明の電子部品の製造方法は、一方の主面に開口して底の有る空間を形成した容器が多数個連続して形成されて成るシート状基板の空間に圧電振動子や半導体などの電子部品を搭載し、それぞれの容器開口部にリッドを被せて気密封止して個割りする電子部品の製造方法において、まず、先のリッドの、少なくとも容器開口部に被さる外周端部板厚が、リッド主要部分よりも薄く形成された、及び/または、容器開口部に被さる外周端部に複数のスルーホールが形成されたリッドが、容器開口部に載置されるように多数個の該リッドが連続して形成されて成るシート状リッドをシート状基板に載置し（S101）、次にリッドの外周端部と容器開口頂部とを溶接手段により加熱し溶融接合によりそれぞれの容器を気密封止し(S102)、最後に、それぞれの電子部品に個割りする(S103)電子部品の製造方法である。 FIG. 1 is a flowchart showing a method of manufacturing an electronic component according to the present invention. That is, in the method of manufacturing an electronic component according to the present invention, a piezoelectric vibrator, a semiconductor, or the like is formed in a space of a sheet-like substrate in which a large number of containers each having an opening on one main surface and forming a bottomed space are formed. In the manufacturing method of the electronic component in which the electronic parts are mounted and each container opening is covered with a lid and hermetically sealed and divided into pieces, first, the outer peripheral end plate thickness covering at least the container opening of the previous lid However, a large number of the lids are formed so that the lid, which is formed thinner than the main portion of the lid and / or has a plurality of through holes formed at the outer peripheral end portion covering the container opening, is placed on the container opening. A sheet-like lid formed by continuously forming lids is placed on a sheet-like substrate (S101), and then the outer peripheral end of the lid and the top of the container opening are heated by welding means, and the respective containers are gasified by fusion bonding. Seal tightly (S102) and finally To number assigned to the electronic component respectively (S103) is a manufacturing method of the electronic component.
ここで、溶接時に使用されるレーザーにいて簡単に説明する。溶接に用いるレーザーとしてはエキシマレーザー、炭酸ガスレーザー、ＹＡＧレーザーなどが知られている。この中で、封止溶接やスポット溶接、またシ−ム溶接に適したものとしてはＹＡＧレーザーが挙げられる。このＹＡＧレーザーは、波長が短く、集光性に優れることから、本発明の如き小さな電子部品の溶接に必要とされるφ０．２〜０．３ミリ程度の微小なスポット径を得る事が容易であり、加工材料に対して与える熱の影響を比較的少なく抑えることが期待出来るレーザーである。したがって、ＹＡＧレーザーでは、低い出力で微小なエリアの加工が可能となるので、加工に適した材料として、光の吸収率が高い金属、セラミック等に対して歪みの少ない溶接加工を期待出来るものである。また、炭酸ガスレーザーの場合は、加工に適した材料としては金属があり、エキシマレーザーの場合は、加工に適した材料としては、ガラスや樹脂、また、本発明で容器に使用されるセラミック等を挙げることが出来る。 Here, the laser used for welding will be briefly described. As lasers used for welding, excimer lasers, carbon dioxide lasers, YAG lasers and the like are known. Among these, a YAG laser is mentioned as a thing suitable for sealing welding, spot welding, and seam welding. Since this YAG laser has a short wavelength and excellent light collecting properties, it is easy to obtain a small spot diameter of about 0.2 to 0.3 mm required for welding of small electronic parts such as the present invention. It is a laser that can be expected to suppress the influence of heat on the processed material to a relatively low level. Therefore, YAG laser enables processing of minute areas with low output, so it can be expected that welding with less distortion is applied to metals, ceramics, etc. with high light absorption as materials suitable for processing. is there. In the case of a carbon dioxide laser, there are metals as materials suitable for processing. In the case of an excimer laser, materials suitable for processing include glass and resin, and ceramics used for containers in the present invention. Can be mentioned.
図２は本発明の電子部品の製造方法に使用されるシート状リッドの概略の側面模式図である。図２のシート状リッドは、シート状基板に形成されたそれぞれの容器開口部に被さるリッドの外周端部板厚が、リッド主要部分よりも薄く形成されている。これにより、封止の際に、ＹＡＧレーザーが照射するエネルギ−を、溶融するリッドの外周端部の板厚を従来のそれと較べて薄くなった分だけ抑えることが出来るので、従来に比べてレーザーといった小さな溶接の為のビームのパワーで確実な溶接が可能と成る効果を奏するものである。例えば、これまでの従来のリッドの外周端部の板厚と較べて半分の厚さで形成した場合には、目安としてはその照射するレーザーのエネルギ−の量、照射のパワーをほぼ半分に減らすことが期待出来ることに成る。 FIG. 2 is a schematic side view of a sheet-like lid used in the method for manufacturing an electronic component of the present invention. The sheet-like lid of FIG. 2 is formed such that the outer peripheral end plate thickness of the lid covering each container opening formed on the sheet-like substrate is thinner than the main part of the lid. As a result, the energy irradiated by the YAG laser at the time of sealing can be suppressed by the thickness of the outer peripheral edge of the lid to be melted, which is thinner than that of the conventional one. Such an effect that enables reliable welding with the beam power for small welding. For example, when the conventional lid is formed with a thickness that is half the thickness of the outer peripheral edge of the conventional lid, as a guide, the amount of laser energy to be irradiated and the irradiation power are reduced to almost half. It can be expected.
このことにより、照射するエネルギ−量の減少とともに容器の開口頂部へのダメ−ジも減らすことが出来るので、溶接時のレーザーによる加熱を原因とする容器への穴あき、クラックの発生等、最終製品である電子部品の信頼性を損なうおそれのある影響を減少することが出来るものである。 As a result, the amount of energy to be irradiated can be reduced and damage to the top of the opening of the container can be reduced, so that the final drilling of the container due to heating by laser during welding, the occurrence of cracks, etc. It is possible to reduce the influence that may impair the reliability of the electronic parts as products.
以上の図２での実施形態の説明では、リッドの外周端部の板厚を薄くした例として段差を持たせたが、他の実施形態として、先のリッドの外周端部の板厚がその主要部分から外周端部側に向かって徐々に薄くなるように、明らかな段差を設けずにテ−パ−を持たせて形成した場合においても、本発明と同様の効果が得られることは言うまでもない。更に、リッドの外周端部にテ−パを形成する場合では、封止に用いるレーザービ−ムがテ−パーの角度によってそのままビ−ムの光源側に反射して戻ることがなくなることから、ビ−ム光源の損傷を防ぐ効果も期待出来るものである。 In the description of the embodiment in FIG. 2 described above, a step is provided as an example in which the thickness of the outer peripheral edge of the lid is reduced. However, as another embodiment, the thickness of the outer peripheral edge of the previous lid is Needless to say, the same effects as those of the present invention can be obtained even when the taper is formed without providing an obvious step so that the thickness gradually decreases from the main portion toward the outer peripheral end. Yes. Further, when a taper is formed on the outer peripheral edge of the lid, the laser beam used for sealing is not reflected and returned to the light source side of the beam depending on the taper angle. -The effect of preventing damage to the light source can also be expected.
また、図３は本発明の電子部品の製造方法に使用されるシート状リッドの概略の側面模式図である。図３のシート状リッドは、シート状基板に形成されたそれぞれの容器開口部に被さるリッドの外周端部に複数のスルーホールが形成されている。これにより、先の図２で示した場合と同様に、従来に比べてレーザーといった小さな溶接の為のビームのパワーで確実な溶接が可能と成る効果を奏するものである。 FIG. 3 is a schematic side view of a sheet-like lid used in the method for manufacturing an electronic component of the present invention. In the sheet-like lid of FIG. 3, a plurality of through holes are formed at the outer peripheral end portion of the lid covering each container opening formed on the sheet-like substrate. As a result, as in the case shown in FIG. 2, there is an effect that reliable welding can be performed with a beam power for a small welding such as a laser as compared with the conventional case.
図４は、図３でのシート状基板に形成されたそれぞれの容器開口部に被さるリッドの外周端部に複数のスルーホールが形成されているシート状基板のひとつのリッドをレーザーにより溶接する様子を示した概略の模式図である。なお、本図においてはレーザーのビームはひとつで、順次スルーホールの形成されたリッドの外周端部に照射されるように図示されているが、レーザーのビームは複数でも構わず、この場合も本発明の技術的範囲に含まれることは言うまでも無い。 FIG. 4 shows a state in which one lid of a sheet-like substrate in which a plurality of through holes are formed in the outer peripheral end portion of the lid covering each container opening formed in the sheet-like substrate in FIG. 3 is welded by laser. It is the schematic schematic diagram which showed. In this figure, there is only one laser beam, and it is shown that the outer peripheral edge of the lid in which the through-holes are sequentially formed is shown. However, a plurality of laser beams may be used. Needless to say, it is included in the technical scope of the invention.
図５は、シート状基板に形成されたそれぞれの容器開口部に被さるリッドの外周端部に複数のスルーホールが形成されているシート状リッドの概略の上面模式図である。本発明の電子部品の製造方法により最終的に個割りされるひとつの電子部品の大きさによって、シート状リッドに形成される、電子部品の容器の数量に対応するリッドの数は当然変化するものであり、本図５の場合は１２個の電子部品容器を封止するために同数のリッドがシート状リッドに形成されている。 FIG. 5 is a schematic top view of a sheet-like lid in which a plurality of through holes are formed at the outer peripheral end of the lid covering each container opening formed on the sheet-like substrate. The number of lids corresponding to the number of containers of electronic components formed on the sheet-like lid naturally changes depending on the size of one electronic component finally divided by the electronic component manufacturing method of the present invention. In the case of FIG. 5, the same number of lids are formed in a sheet-like lid in order to seal twelve electronic component containers.
また、実施例における溶接手段として、ＹＡＧレーザーを用いて説明したが、本発明では特にこれに限定されるものではなく、容器やリッドに使用する材質等に応じてその他の溶接手段、例えばエキシマレーザーや、炭酸ガスレーザー、あるいはその他の電子ビ−ムを適宜選択し、使用しても本発明の所期の目的を達成し、効果を得ることが期待出来るものであることは言うまでも無い。 Further, although the YAG laser is used as the welding means in the embodiments, the present invention is not particularly limited to this, and other welding means such as an excimer laser is used depending on the material used for the container and the lid. Needless to say, even if a carbon dioxide laser or other electron beam is appropriately selected and used, the intended purpose of the present invention can be achieved and an effect can be expected.
なお、リッドの溶融個所に対するレーザーの照射条件は、加熱による容器へのダメ−ジの影響を少しでも抑えることを考慮して、通常は常温、不活性ガスの雰囲気の環境下で行われるが、必ずしも不活性ガスの雰囲気の環境下である必要はなく、例えば真空の環境下であっても問題はない。 In addition, the laser irradiation condition for the melted portion of the lid is usually performed in an environment of normal temperature and an inert gas atmosphere in consideration of suppressing the influence of damage to the container due to heating as much as possible. It is not always necessary to be in an atmosphere of an inert gas atmosphere. For example, there is no problem even in a vacuum environment.
また、容器の材質の一実施形態として、セラミック材を用いて説明したが、絶縁体であれば他の材質でも問題はなく、例えば樹脂材で形成しても本発明の所期の効果が期待できることは言うまでも無い。 In addition, the ceramic material has been described as an embodiment of the material of the container. However, other materials can be used as long as they are insulators. For example, even if the material is formed of a resin material, the expected effect of the present invention is expected. Needless to say, you can.
図６は、従来の圧電振動子の概略の側面断面図である。ここに示されるように、底の有る容器内部に搭載された、水晶から成る水晶振動子の小片が電圧を印加されることによって、容器内の空間内において容器の内壁に触れること無く決められた周波数で振動するものである。 FIG. 6 is a schematic side sectional view of a conventional piezoelectric vibrator. As shown here, a crystal resonator piece made of quartz mounted inside a container with a bottom was determined without touching the inner wall of the container in the space in the container by applying a voltage. It vibrates at a frequency.
１ 容器
２ シート状基板
３ 容器内部
４ リッド
５ 外周端部板厚
６ リッド主要部分の板厚
７ 外周端部
８ スルーホール
９ シート状リッド
１０ 容器開口頂部
DESCRIPTION OF SYMBOLS 1
Claims (2)
該リッドの、少なくとも該容器開口部に被さる外周端部板厚が、該リッド主要部分よりも薄く形成された、及び/または、該容器開口部に被さる外周端部に複数のスルーホールが形成された該リッドが、該容器開口部に載置されるように多数個の該リッドが連続して形成されて成る該シート状リッドを該シート状基板に載置する工程と、
該リッドの外周端部と容器開口頂部とを溶接手段により加熱し溶融接合によりそれぞれの該容器を気密封止する工程と、
それぞれの電子部品に個割りする工程と、から成る電子部品の製造方法。 An electronic component such as a piezoelectric vibrator or a semiconductor is mounted in the space of the sheet-like substrate formed by continuously forming a plurality of containers that are open on one main surface to form a bottomed space. In the method of manufacturing an electronic component that covers the lid with a lid and hermetically seals and divides it,
The thickness of the outer peripheral end of the lid covering at least the container opening is formed thinner than the main portion of the lid, and / or a plurality of through holes are formed at the outer peripheral end of the lid covering the container opening. Placing the sheet-like lid formed by continuously forming a plurality of the lids on the sheet-like substrate so that the lid is placed on the container opening;
Heating the outer peripheral end of the lid and the top of the container opening by welding means and hermetically sealing each container by melt bonding;
A method of manufacturing an electronic component, comprising the step of individually dividing each electronic component.
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| JP2009099806A (en) * | 2007-10-17 | 2009-05-07 | Daishinku Corp | Electronic component, and sealing method therefor |
| JP2019216216A (en) * | 2018-06-14 | 2019-12-19 | Ｎｅｃスペーステクノロジー株式会社 | Manufacturing method for semiconductor device and semiconductor device |
| JP2020155706A (en) * | 2019-03-22 | 2020-09-24 | 三菱電機株式会社 | Power semiconductor device and manufacturing method of the same |
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| JP2004179373A (en) * | 2002-11-27 | 2004-06-24 | Kinseki Ltd | Electronic parts package and its sealing method |
| JP2005159257A (en) * | 2003-10-30 | 2005-06-16 | Kyocera Corp | Method for manufacturing electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009099806A (en) * | 2007-10-17 | 2009-05-07 | Daishinku Corp | Electronic component, and sealing method therefor |
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| JP2020155706A (en) * | 2019-03-22 | 2020-09-24 | 三菱電機株式会社 | Power semiconductor device and manufacturing method of the same |
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