JP2006066656A - Multiple patterning wiring substrate, electronic component housing package, and electronic device - Google Patents

Multiple patterning wiring substrate, electronic component housing package, and electronic device Download PDF

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JP2006066656A
JP2006066656A JP2004247659A JP2004247659A JP2006066656A JP 2006066656 A JP2006066656 A JP 2006066656A JP 2004247659 A JP2004247659 A JP 2004247659A JP 2004247659 A JP2004247659 A JP 2004247659A JP 2006066656 A JP2006066656 A JP 2006066656A
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wiring board
recess
dummy
region
recesses
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Kotaro Nakamoto
孝太郎 中本
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring substrate capable of being easily and correctly partitioned along partitioning grooves and reduced in the probability of generating burs, deformation or the like upon partitioning, and to provide a highly reliable electronic component receiving package and an electronic device. <P>SOLUTION: The electronic device comprises a matrix substrate 101 with a plurality of wiring substrate regions 102 formed transversely and laterally at the central part thereof; recesses 103 formed in the wiring substrate regions 102; level differences 104 formed on the bottom surface of the recesses 103 so as to be contacted with the inside surface of the recesses 103 and provided with a conductor layer 109 on the upper surface thereof; marginal regions 105 provided on the outer peripheral part of the matrix substrate 101; dummy recesses 106 formed in the throw-away regions 105; and dummy level difference sections 107 formed on the bottom surface of the dummy recesses 106 so as to be contacted with the inside surface of the wiring substrate region 102 side of the dummy recesses 106. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、複数の配線基板領域が縦横に形成された多数個取り配線基板、電子部品収納用パッケージおよび電子装置に関するものである。   The present invention relates to a multi-piece wiring board in which a plurality of wiring board regions are formed vertically and horizontally, an electronic component storage package, and an electronic device.

従来、半導体素子や圧電素子等の電子部品が収容される電子部品収納用パッケージは、上面の中央部に電子部品が収容される凹部を有する絶縁基板と、凹部の内側から絶縁基板の側面や下面にかけて導出された導体層とを備えている。なお、電子部品収納用パッケージには、凹部の底面に段差部が形成され、段差部の上面に導体層が形成されているものがある。   2. Description of the Related Art Conventionally, an electronic component storage package that stores electronic components such as semiconductor elements and piezoelectric elements includes an insulating substrate having a recess in which an electronic component is stored in the center of the upper surface, and a side surface and a lower surface of the insulating substrate from the inside of the recess. And a conductor layer led out. Some electronic component storage packages have a stepped portion formed on the bottom surface of the recess and a conductor layer formed on the top surface of the stepped portion.

この電子部品収納用パッケージは、母基板に複数の配線基板領域が縦横に形成されて成る多数個取り配線基板の形態で形成されるものがある（例えば、下記特許文献１を参照）。多数個取り配線基板は、母基板の各配線基板領域の境界線に分割溝が形成されている。多数個取り配線基板は、各配線基板領域の境界線（分割溝）に沿って分割されることにより、電子部品収納用パッケージに個片化される。   Some electronic component storage packages are formed in the form of a multi-piece wiring board in which a plurality of wiring board regions are formed vertically and horizontally on a mother board (see, for example, Patent Document 1 below). The multi-cavity wiring board has dividing grooves formed on the boundary lines of the wiring board regions of the mother board. The multi-piece wiring board is divided into electronic component storage packages by being divided along the boundary line (dividing groove) of each wiring board region.

そして、電子部品収納用パッケージには、凹部内に電子部品が収容されるとともに、電子部品の電極が凹部の底面の段差部に設けられた導体層にボンディングワイヤや導電性接着剤を介して電気的に接続され、上面に蓋体が接合されることにより、凹部内に電子部品が気密封止された電子装置となる。   In the electronic component storage package, the electronic component is accommodated in the recess, and the electrode of the electronic component is electrically connected to the conductor layer provided on the step portion on the bottom surface of the recess via a bonding wire or a conductive adhesive. Are connected to each other and the lid is bonded to the upper surface, whereby an electronic device in which the electronic component is hermetically sealed in the recess is obtained.

なお、多数個取り配線基板は、取り扱いを容易なものとするとともにめっき用の引き回し配線層を形成するために、母基板の外周部に捨て代領域が形成されている。分割溝は、捨て代領域と配線基板領域との間の境界にも形成されている。分割溝は、各配線基板領域同士の境界や配線基板領域と捨て代領域境界に、カッター刃を所定の深さまで切り込ませることにより形成される。
特開２００２−３２４８７０号公報 Note that the multi-cavity wiring board has a disposal margin area formed on the outer peripheral portion of the mother board in order to facilitate handling and form a lead wiring layer for plating. The dividing groove is also formed at the boundary between the disposal margin region and the wiring board region. The dividing groove is formed by cutting the cutter blade to a predetermined depth at the boundary between the wiring substrate regions or at the boundary between the wiring substrate region and the disposal margin region.
JP 2002-324870 A

しかしながら、このような多数個取り配線基板は、配線基板領域に電子部品が収容される凹部が形成されているため、配線基板領域は、捨て代領域よりも剛性が低くなる。そのため、配線基板領域と捨て代領域との境界の分割溝に沿って母基板を破断させる際に配線基板領域（特に最外周の配線基板領域）の凹部周辺にバリや割れ等が発生する可能性があった。特に、近年の電子装置の小型化に伴い、配線基板領域の凹部を取り囲む部位（枠部）の厚みが小さくなってきていため、配線基板領域（特に最外周の配線基板領域）の枠部にバリや割れ等が発生する可能性が高まってきた。   However, such a multi-cavity wiring board has a recess in which an electronic component is accommodated in the wiring board region, and thus the wiring board region has lower rigidity than the disposal margin region. Therefore, when the mother board is broken along the dividing groove at the boundary between the wiring board area and the disposal margin area, burrs, cracks, etc. may occur around the recesses in the wiring board area (especially the outermost wiring board area). was there. In particular, with the recent miniaturization of electronic devices, the thickness of the portion (frame portion) surrounding the concave portion of the wiring board region has been reduced, so that the frame portion of the wiring board region (especially the outermost wiring board region) has a variability. The possibility of occurrence of cracks and the like has increased.

また、多数個取り配線基板を作製する過程でも次のような問題が生じる可能性がある。すなわち、母基板となるグリーンシートに分割溝を形成する際に、剛性の高い捨て代領域側にはカッター刃による切り込みが開きにくく、グリーンシート自体の弾性で一旦開いた切り込みの幅が狭くなり、焼成の際に配線基板領域と捨て代領域との間に形成された分割溝が強固に癒着してしまいやすいという問題があった。この場合、母基板を分割溝に沿って分割することが困難となり、配線基板領域の特に最外周のものにバリや割れが発生する可能性があった。また、分割溝となる切り込みを形成する際に、最外周の配線基板領域において、捨て代領域側よりも剛性の低い配線基板領域に変形が生じる可能性があった。   In addition, the following problems may occur in the process of manufacturing a multi-piece wiring board. In other words, when forming the dividing groove in the green sheet as the mother substrate, the cutting edge by the cutter blade is difficult to open on the highly rigid disposal margin side, and the width of the cutting once opened is reduced by the elasticity of the green sheet itself, There has been a problem in that the dividing groove formed between the wiring board region and the abandon margin region is likely to be firmly adhered during firing. In this case, it becomes difficult to divide the mother board along the dividing groove, and there is a possibility that burrs and cracks may occur in the wiring board region, particularly in the outermost periphery. Further, when forming the cuts to be the dividing grooves, there is a possibility that the wiring substrate region having the lower rigidity than the disposal margin region side may be deformed in the outermost wiring substrate region.

本発明は、かかる従来の問題点に鑑み案出されたものであり、その目的は、母基板を分割溝に沿って容易かつ正確に分割することが可能で、分割の際にバリや変形等が発生する可能性を低減した多数個取り配線基板を提供することにある。また、本発明の目的は、信頼性の高い電子部品収納用パッケージおよび電子装置を提供することにある。   The present invention has been devised in view of such conventional problems, and an object of the present invention is to easily and accurately divide the mother board along the dividing groove. It is an object of the present invention to provide a multi-piece wiring board in which the possibility of occurrence of occurrence is reduced. Another object of the present invention is to provide a highly reliable electronic component storage package and electronic device.

本発明の多数個取り配線基板は、中央部に複数の配線基板領域が縦横に形成された母基板と、前記配線基板領域に形成された凹部と、該凹部の底面に前記凹部の内側面に接して形成され、上面に導体層が設けられた段差部と、前記母基板の外周部に設けられた捨て代領域と、該捨て代領域に形成されたダミー凹部と、該ダミー凹部の底面に前記ダミー凹部の前記配線基板領域側の内側面に接して形成されたダミー段差部とを備えていることを特徴とするものである。   The multi-cavity wiring board of the present invention includes a mother board in which a plurality of wiring board regions are formed vertically and horizontally in the center, a recess formed in the wiring board region, and a bottom surface of the recess on the inner surface of the recess. A step portion formed in contact with the conductor layer on the upper surface, a margin area provided on the outer periphery of the mother substrate, a dummy recess formed in the margin area, and a bottom surface of the dummy recess And a dummy step portion formed in contact with the inner surface of the dummy recess on the wiring board region side.

また、本発明の多数個取り配線基板は、好ましくは、前記ダミー凹部は、前記母基板の前記中央部の最外周に形成された前記凹部に隣り合うように形成されていることを特徴とするものである。   The multi-cavity wiring board of the present invention is preferably characterized in that the dummy recess is formed adjacent to the recess formed on the outermost periphery of the central portion of the mother board. Is.

また、本発明の多数個取り配線基板は、好ましくは、前記配線基板領域および前記凹部は四角形状であり、前記ダミー凹部は、隣り合う前記凹部と隣り合う内側面同士の長さが等しい四角形状であることを特徴とするものである。   Further, in the multi-cavity wiring board of the present invention, preferably, the wiring board region and the recess have a quadrangular shape, and the dummy recess has a quadrangular shape in which the lengths of the inner surfaces adjacent to the adjacent recess are equal. It is characterized by being.

また、本発明の多数個取り配線基板は、好ましくは、前記ダミー凹部は、深さが前記凹部の深さと同じであることを特徴とするものである。   In the multi-cavity wiring board of the present invention, preferably, the dummy recess has the same depth as the recess.

また、本発明の多数個取り配線基板は、好ましくは、前記ダミー段差部は、前記段差部と形状および寸法が同じであることを特徴とするものである。   In the multi-piece wiring board of the present invention, preferably, the dummy step portion has the same shape and size as the step portion.

また、本発明の多数個取り配線基板は、好ましくは、前記ダミー凹部および前記ダミー段差部は、前記捨て代領域に複数形成されており、前記中央部の最外周に形成された前記複数の配線基板領域の前記凹部および前記段差部と前記複数のダミー凹部および前記複数のダミー段差部とは、前記中央部の最外周に形成された前記配線基板領域と前記捨て代領域との境界線を基準に線対称に形成されていることを特徴とするものである。   In the multi-cavity wiring board of the present invention, preferably, a plurality of the dummy recesses and the dummy stepped portions are formed in the discard margin region, and the plurality of wirings formed on the outermost periphery of the central portion. The concave portion and the stepped portion of the substrate region and the plurality of dummy concave portions and the plurality of dummy stepped portions are based on a boundary line between the wiring substrate region and the discard margin region formed on the outermost periphery of the central portion. It is characterized by being formed in line symmetry.

また、本発明の電子部品収納用パッケージは、請求項１乃至請求項６のいずれかに記載された多数個取り配線基板を前記配線基板領域ごとに分割することにより個片化されたことを特徴とするものである。   According to another aspect of the invention, there is provided a package for storing electronic components, wherein the multi-piece wiring board according to any one of claims 1 to 6 is divided into pieces by dividing the wiring board area into the wiring board regions. It is what.

また、本発明の電子装置は、請求項７記載の電子部品収納用パッケージの前記凹部に収容され、前記段差部の前記導体層に電極が電気的に接続された電子部品と、前記電子部品収納用パッケージに前記凹部を塞ぐように接合された蓋体とを備えていることを特徴とするものである。   The electronic device of the present invention is housed in the recess of the electronic component housing package according to claim 7, and an electronic component in which an electrode is electrically connected to the conductor layer of the stepped portion, and the electronic component housing. And a lid bonded to the package so as to close the recess.

本発明の多数個取り配線基板は、配線基板領域に形成された凹部と、凹部の底面に凹部の内側面に接して形成され、上面に導体層が設けられた段差部と、捨て代領域に形成されたダミー凹部と、ダミー凹部の底面にダミー凹部の配線基板領域側の内側面に接して形成されたダミー段差部とを備えていることにより、捨て代領域の剛性を配線基板領域の剛性に近似させることができ、母基板を分割する際に（特に捨て代領域とそれに隣接する最外周の配線基板領域との間の分割溝に沿って母基板を分割する際に）配線基板領域側に大きな衝撃が印加されることを抑制することができる。その結果、配線基板領域（分割後の個々のパッケージ）に、バリや割れ等が発生する可能性を低減することができる。   The multi-cavity wiring board of the present invention includes a recess formed in the wiring board region, a step formed on the bottom surface of the recess in contact with the inner surface of the recess, a conductor layer provided on the top surface, and a disposal margin region. By providing a dummy recess formed and a dummy stepped portion formed on the bottom surface of the dummy recess in contact with the inner surface of the dummy recess on the side of the wiring board region, the rigidity of the disposal margin region is made to be the rigidity of the wiring substrate region. When dividing the mother board (particularly when dividing the mother board along the dividing groove between the abandon margin area and the outermost peripheral wiring board area adjacent thereto) It is possible to prevent a large impact from being applied to the surface. As a result, it is possible to reduce the possibility of occurrence of burrs, cracks, etc. in the wiring board region (individual packages after division).

また、ダミー凹部には、その底面に配線基板領域側の内側面に接してダミー段差部が形成されていることにより、配線基板領域の凹部の側壁に対する捨て代領域のダミー凹部の側壁の剛性が極端に低くなることを抑制でき、取り扱いが容易な多数個取り配線基板を提供することが可能となる。すなわち、ダミー凹部には、その底面に配線基板領域側の内側面に接してダミー段差部が形成されていることにより、単に捨て代領域にダミー凹部のみが形成された構造に比べて、ダミー凹部の側壁の剛性が極端に低くなることを抑制でき、ダミー凹部側から母基板に割れ等の機械的な破壊が生じる可能性を低減させることができ、取り扱いが容易な多数個取り配線基板を提供することが可能となる。   Further, the dummy recess has a dummy stepped portion formed on the bottom surface thereof in contact with the inner surface on the wiring board region side, so that the rigidity of the side wall of the dummy recess in the disposal margin region with respect to the side wall of the recess in the wiring substrate region is increased. It becomes possible to provide a multi-piece wiring board that can be suppressed from becoming extremely low and easy to handle. That is, the dummy recess has a dummy step formed on the bottom surface thereof in contact with the inner surface on the wiring board region side, so that the dummy recess is simply compared with a structure in which only the dummy recess is formed in the disposal margin region. Can provide a multi-piece wiring board that is easy to handle and can reduce the possibility of mechanical damage such as cracks from the dummy recess side to the mother board. It becomes possible to do.

また、ダミー凹部の底面に、配線基板領域側の内側面に接してダミー段差部が形成されていることにより、母基板となるセラミックグリーンシート（以下、グリーンシートという）にカッター刃を入れて分割溝を形成する際に、捨て代領域側に大きな変形が生じる可能性が低減され、分割溝は配線基板領域側と捨て代領域側とに均等な幅で開いた形状で設けられ、分割性が向上された多数個取り配線基板を提供することができる。   In addition, a dummy step is formed on the bottom surface of the dummy recess in contact with the inner surface on the wiring board region side, so that a cutter blade is inserted into a ceramic green sheet (hereinafter referred to as a green sheet) as a mother board and divided. When forming the groove, the possibility of large deformation on the discard margin area side is reduced, and the split groove is provided in an open shape with an equal width on the wiring board area side and the discard margin area side, so that the partitionability is improved. An improved multi-cavity wiring board can be provided.

また、母基板となるセラミックグリーンシートにカッター刃を入れて分割溝を形成する際、最外周の配線基板領域において捨て代領域側と配線基板領域との間で剛性が近似しているため、カッター刃の侵入に伴うグリーンシートの変形が配線基板領域に大きく生じる可能性を低減でき、配線基板領域の凹部やそれを取り囲む枠部（側壁）が変形する可能性を低減させることができる。   In addition, when the cutter blade is inserted into the ceramic green sheet that forms the mother board to form the dividing groove, the rigidity is approximated between the abandon margin area side and the wiring board area in the outermost wiring board area. The possibility that the deformation of the green sheet due to the intrusion of the blade is greatly generated in the wiring board region can be reduced, and the possibility that the concave portion of the wiring board region and the frame portion (side wall) surrounding it are deformed can be reduced.

また、本発明の多数個取り配線基板は、好ましくは、ダミー凹部が、母基板の中央部の最外周に形成された凹部に隣り合うように形成されていることから、配線基板領域と隣接する捨て代領域との間で剛性をより近似させることができ、分割溝に沿った分割時の衝撃をより抑制するとともに、分割溝の癒着がさらに抑制され、バリや割れが発生する可能性を低減することができる。また、母基板を分割溝に沿ってより容易にかつ正確に分割することができる。   The multi-cavity wiring board of the present invention is preferably adjacent to the wiring board region because the dummy concave part is formed adjacent to the concave part formed on the outermost periphery of the central part of the mother board. Rigidity can be more approximated with the abandonment allowance area, and the impact when splitting along the split groove is further suppressed, and the adhesion of the split groove is further suppressed, reducing the possibility of burrs and cracks. can do. Further, the mother substrate can be more easily and accurately divided along the dividing groove.

また、グリーンシートのうち配線基板領域と捨て代領域との間で剛性がさらに近似するので、配線基板領域と捨て代領域との間に分割溝となる切り込みを形成する際に、配線基板領域側に変形が生じる可能性を低減することができる。   In addition, since the rigidity is further approximated between the wiring board region and the disposal margin region of the green sheet, when forming a cut that becomes a dividing groove between the wiring substrate region and the disposal margin region, the wiring substrate region side It is possible to reduce the possibility of deformation.

また、本発明の多数個取り配線基板は、好ましくは、配線基板領域および凹部が四角形状であり、ダミー凹部は、隣り合う凹部と隣り合う内側面同士の長さが等しい四角形状であることにより、配線基板領域と隣接する捨て代領域との間で機械的な強度や剛性をより近似させることができ、分割溝に沿った分割時の衝撃がより抑制されるとともに、分割溝の癒着がさらに効果的に防止され、バリや割れが発生する可能性を低減させることができる。また、母基板を分割溝に沿ってより容易に、かつ正確に分割することができる。   Further, in the multi-cavity wiring board of the present invention, preferably, the wiring board region and the concave portion are in a quadrangular shape, and the dummy concave portion is in a quadrangular shape in which the lengths of the inner surfaces adjacent to the adjacent concave portion are equal. In addition, the mechanical strength and rigidity can be more approximated between the wiring board region and the adjacent margin allowance region, the impact at the time of dividing along the dividing groove is further suppressed, and the adhesion of the dividing groove is further increased. It is effectively prevented and the possibility of occurrence of burrs and cracks can be reduced. Further, the mother substrate can be divided more easily and accurately along the dividing groove.

また、グリーンシートのうち配線基板領域と捨て代領域との間で剛性がさらに近似するので、配線基板領域と捨て代領域との間に分割溝となる切り込みを形成する際に、配線基板領域側に変形が生じる可能性をさらに低減することができる。   In addition, since the rigidity is further approximated between the wiring board region and the disposal margin region of the green sheet, when forming a cut that becomes a dividing groove between the wiring substrate region and the disposal margin region, the wiring substrate region side It is possible to further reduce the possibility of deformation.

また、本発明の多数個取り配線基板は、好ましくは、ダミー凹部の深さが、凹部の深さと同じであることにより、配線基板領域と隣接する捨て代領域との間で剛性をより近似させることができ、分割溝に沿った分割時の衝撃がより抑制されるとともに、分割溝の癒着がさらに抑制され、バリや割れが発生する可能性をさらに低減させることができる。また、母基板を分割溝に沿ってより容易にかつ正確に分割することができる。   In the multi-cavity wiring board of the present invention, preferably, the depth of the dummy recess is the same as the depth of the recess, so that the rigidity is more approximated between the wiring board region and the adjacent disposal margin region. It is possible to further suppress the impact at the time of dividing along the dividing groove, further suppress the adhesion of the dividing groove, and further reduce the possibility of occurrence of burrs and cracks. Further, the mother substrate can be more easily and accurately divided along the dividing groove.

また、グリーンシートのうち配線基板領域と捨て代領域との間で剛性がさらに近似するので、配線基板領域と捨て代領域との間に分割溝となる切り込みを形成する際に、配線基板領域側に変形が生じる可能性をさらに低減させることが可能となる。   In addition, since the rigidity is further approximated between the wiring board region and the disposal margin region of the green sheet, when forming a cut that becomes a dividing groove between the wiring substrate region and the disposal margin region, the wiring substrate region side It is possible to further reduce the possibility of deformation.

また、本発明の多数個取り配線基板は、好ましくは、ダミー段差部は、段差部と形状および寸法が同じであることにより、段差部が凹部の周囲の枠部を補強する効果と、ダミー段差部がダミー凹部の周囲の捨て代領域を補強する効果とを同じ程度にすることができ、配線基板領域と捨て代領域との間で剛性をより近似させることができる。   In the multi-piece wiring board of the present invention, preferably, the dummy step portion has the same shape and dimensions as the step portion, so that the step portion reinforces the frame portion around the recess, and the dummy step portion. The effect of reinforcing the discard margin area around the dummy recess can be made the same level, and the rigidity can be more approximated between the wiring board area and the discard margin area.

また、本発明の多数個取り配線基板は、好ましくは、ダミー凹部およびダミー段差部が、捨て代領域に複数形成されており、中央部の最外周に形成された複数の配線基板領域の凹部および段差部と複数のダミー凹部および複数のダミー段差部とは、中央部の最外周に形成された配線基板領域と捨て代領域との境界線を基準に線対称に形成されていることにより、段差部が凹部の周囲の枠部を補強する領域と、ダミー段差部がダミー凹部の周囲の捨て代側領域を補強する領域とを同じ程度にすることができ、配線基板領域と捨て代領域との間で剛性をより近似させることができる。   In the multi-cavity wiring board of the present invention, preferably, a plurality of dummy recesses and dummy step portions are formed in the disposal margin region, and the plurality of wiring substrate region recesses formed on the outermost periphery of the central portion and The step portion, the plurality of dummy recesses, and the plurality of dummy step portions are formed symmetrically with respect to the boundary line between the wiring board region formed on the outermost periphery of the center portion and the disposal margin region, thereby providing a step. The area where the part reinforces the frame around the recess and the area where the dummy step part reinforces the abandon margin side area around the dummy recess can be made the same level. The rigidity can be more approximated between.

また、配線基板領域とダミー領域との境界においても、グリーンシートに分割溝となる切り込みを形成する際に、配線基板領域側と捨て代領域側との両側により均等に切り込みを入れることができ、焼成後においても配線基板領域と捨て代領域との間で分割溝が癒着することを抑制でき、母基板を配線基板領域と捨て代領域との間で分割する際に配線基板領域にバリや割れが発生する可能性を低減させることができる。   In addition, even at the boundary between the wiring board area and the dummy area, when forming the cuts that become the dividing grooves in the green sheet, the cutting can be made equally on both sides of the wiring board area side and the disposal margin area side, Even after firing, it is possible to suppress the adhesion of the dividing groove between the wiring board area and the disposal margin area, and when the mother board is divided between the wiring board area and the disposal margin area, burrs and cracks are formed in the wiring board area. It is possible to reduce the possibility of occurrence.

また、本発明の電子部品収納用パッケージは、請求項１乃至請求項６のいずれかに記載された多数個取り配線基板を配線基板領域ごとに分割することにより個片化されたものであることにより、凹部を囲む枠部におけるバリや割れ等の発生の可能性が低減されており、信頼性に優れた電子部品収納用パッケージを提供することができる。   In addition, the electronic component storage package of the present invention is separated into pieces by dividing the multi-cavity wiring board according to any one of claims 1 to 6 into wiring board regions. Therefore, the possibility of occurrence of burrs, cracks, etc. in the frame portion surrounding the recess is reduced, and an electronic component storage package with excellent reliability can be provided.

また、本発明の電子装置は、請求項７記載の電子部品収納用パッケージの凹部に収容され、段差部の導体層に電極が電気的に接続された電子部品と、電子部品収納用パッケージに凹部を塞ぐように接合された蓋体とを備えていることにより、電子部品が収容された凹部を囲む枠部におけるバリや割れ等の発生の可能性が低減されており、信頼性に優れた電子装置を提供することができる。 According to another aspect of the present invention, there is provided an electronic device housed in the recess of the electronic component storage package according to claim 7, wherein the electrode is electrically connected to the conductor layer of the step portion, and the electronic component storage package has the recess. With a lid that is joined so as to block the burrs, the possibility of occurrence of burrs, cracks, etc. in the frame surrounding the recesses in which the electronic components are housed is reduced. An apparatus can be provided.

本発明の多数個取り配線基板について図１，２を参照して詳細に説明する。図１（ａ）は、本発明の多数個取り配線基板の構造を示す平面図であり、図１（ｂ）は、図１（ａ）に示した多数個取り配線基板のＸ−Ｘ’線における断面図である。   The multi-piece wiring board of the present invention will be described in detail with reference to FIGS. FIG. 1A is a plan view showing the structure of a multi-cavity wiring board according to the present invention, and FIG. 1B is an XX ′ line of the multi-cavity wiring board shown in FIG. FIG.

本発明の多数個取り配線基板は、中央部に複数の配線基板領域１０２が縦横に形成された母基板１０１と、配線基板領域１０２に形成された凹部１０３と、凹部１０３に形成された段差部１０４と、母基板１０１の外周部に設けられた捨て代領域１０５と、捨て代領域１０５に形成されたダミー凹部１０６と、ダミー凹部１０６に形成されたダミー段差部１０７とを備えている。段差部１０４は、凹部１０３の底面に、凹部１０３の内側面に接して形成されている。また、段差部１０４は、上面に導体層が設けられている。ダミー段差部１０７は、ダミー凹部１０６の底面にダミー凹部１０６の配線基板領域１０２側の内側面に接して形成されている。   The multi-cavity wiring board of the present invention includes a mother board 101 in which a plurality of wiring board regions 102 are formed vertically and horizontally at a central portion, a recess 103 formed in the wiring substrate region 102, and a stepped portion formed in the recess 103. 104, a disposal margin area 105 provided on the outer peripheral portion of the mother substrate 101, a dummy recess 106 formed in the disposal margin area 105, and a dummy stepped section 107 formed in the dummy recess 106. The step 104 is formed on the bottom surface of the recess 103 in contact with the inner surface of the recess 103. Further, the stepped portion 104 has a conductor layer on the upper surface. The dummy step 107 is formed on the bottom surface of the dummy recess 106 in contact with the inner surface of the dummy recess 106 on the wiring board region 102 side.

母基板１０１は、酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミック材料から成る。母基板１０１は、セラミック材料から成る複数の絶縁層が積層することにより形成されている。母基板１０１は、例えば、酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム、酸化ケイ素等の原料粉末を有機溶剤，バインダーとともにシート状に成形して複数のセラミックグリーンシート（以下、グリーンシートという）を作製し、このセラミックグリーンシートに打ち抜き加工を施して所定の形状、寸法に加工するとともに上下に積層して積層体となし、１５００〜１６００℃程度で焼成することにより形成される。   The mother substrate 101 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or glass ceramics. The mother board 101 is formed by laminating a plurality of insulating layers made of a ceramic material. If the mother substrate 101 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide or silicon oxide is formed into a sheet shape together with an organic solvent and a binder to form a plurality of ceramic green sheets (hereinafter referred to as green). The ceramic green sheet is punched and processed into a predetermined shape and size, and is laminated up and down to form a laminate, which is fired at about 1500 to 1600 ° C.

配線基板領域１０２の凹部１０３は、積層されたときに上層側となるグリーンシートの各配線基板領域１０２の中央部分を打ち抜いて、グリーンシートの中央部に複数の開口部を縦横に形成しておくことにより形成される。配線基板領域１０２の凹部１０３は、半導体素子，圧電素子、容量素子、抵抗器等の電子部品（図示せず）を収納するためものである。例えば、凹部１０３を蓋体（図示せず）で塞ぐことにより、凹部１０３内に電子部品が気密封止される。   The concave portion 103 of the wiring board region 102 is formed by punching out the central portion of each wiring board region 102 of the green sheet that becomes the upper layer when stacked, and forming a plurality of openings vertically and horizontally in the central portion of the green sheet. Is formed. The concave portion 103 of the wiring board region 102 is for housing electronic components (not shown) such as a semiconductor element, a piezoelectric element, a capacitive element, and a resistor. For example, the electronic component is hermetically sealed in the recess 103 by closing the recess 103 with a lid (not shown).

蓋体は、鉄−ニッケル−コバルト合金や鉄−ニッケル合金等の金属材料、セラミック材料、樹脂材料等により形成される。例えば、鉄−ニッケル−コバルト合金から成る板材に打ち抜き加工やエッチング加工等の金属加工を施して、凹部１０３を塞ぐ板状に成形することにより作製される。蓋体は、例えば、シーム溶接や電子ビーム溶接等の溶接、ろう付け、樹脂やガラス等の接合材を介した接合等の手段で母基板１の凹部３を取り囲む枠状の部位（枠部）の上面に、凹部を塞ぐようにして接合される。この場合、枠部の上面に、溶接やろう付けによる接合を容易かつ強固なものとするために、メタライズ層１０８を形成しておいてもよい。   The lid is formed of a metal material such as an iron-nickel-cobalt alloy or an iron-nickel alloy, a ceramic material, a resin material, or the like. For example, the plate material made of iron-nickel-cobalt alloy is subjected to metal processing such as punching or etching and formed into a plate shape that closes the recess 103. The lid is, for example, a frame-shaped portion (frame portion) that surrounds the concave portion 3 of the mother substrate 1 by means such as seam welding or electron beam welding, brazing, or bonding via a bonding material such as resin or glass. It is joined to the upper surface of the substrate so as to close the recess. In this case, a metallized layer 108 may be formed on the upper surface of the frame portion in order to make the joining by welding or brazing easy and strong.

配線基板領域１０２の凹部１０３の底面には、凹部１０３の内側面に接して段差部１０４が形成され、段差部１０４の上面には導体層１０９が設けられている。導体層１０９は、凹部１０３に収納される電子部品の電極が電気的に接続される電極パッドや、その電極を凹部１０３の外側に導出する導電路の一部として機能する。   A stepped portion 104 is formed on the bottom surface of the recess 103 in the wiring board region 102 in contact with the inner surface of the recess 103, and a conductor layer 109 is provided on the top surface of the stepped portion 104. The conductor layer 109 functions as an electrode pad to which an electrode of an electronic component housed in the recess 103 is electrically connected and a part of a conductive path that leads the electrode to the outside of the recess 103.

導体層１０９には、電子部品の電極がボンディングワイヤや半田等の導電性接続材（図示せず）を介して電気的に接続される。そして、導体層１０９を母基板１０１（各配線基板領域１０２）の内部を通って下面側に導出しておくことにより、各配線基板領域１０２において、電子部品の電極が導体層１０９を介して母基板１０１の下面側に導出される。   Electrodes of electronic components are electrically connected to the conductor layer 109 via conductive connection materials (not shown) such as bonding wires and solder. Then, the conductor layer 109 is led out to the lower surface side through the inside of the mother board 101 (each wiring board region 102), so that the electrodes of the electronic components pass through the mother layer 101 in each wiring board region 102. Derived to the lower surface side of the substrate 101.

導体層１０９は、タングステン，モリブデン，マンガン，銅，銀，パラジウム，白金，金等の金属材料から成り、例えば、タングステンから成る場合であれば、タングステンのペーストをセラミックグリーンシートの段差部１１となる部位の上面に印刷塗布しておき、一体焼成することにより形成することができる。   The conductor layer 109 is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold. For example, if the conductor layer 109 is made of tungsten, the tungsten paste becomes the step portion 11 of the ceramic green sheet. It can be formed by printing on the upper surface of the part and baking it integrally.

なお、導体層１０９は、その露出された表面にニッケル，金等のめっき層（図示せず）が被着されていることが好ましい。これにより、導体層１０９の酸化を効果的に防止することができるとともに、導体層１０９に対するボンディングワイヤの接続性や半田の濡れ性等を向上させることができ、電気的接続の信頼性を向上させることができる。このようなめっき層は、母基板１０１の外周部にめっき導通用パターンを形成しておき、このめっき導通用パターンをめっき用治具で保持し、めっき液中で治具の端子からめっき導通用パターン経由して導体層１０９に電流を供給することにより形成される。   In addition, it is preferable that the conductor layer 109 has a plating layer (not shown) made of nickel, gold, or the like on the exposed surface. As a result, the oxidation of the conductor layer 109 can be effectively prevented, the bonding wire connectivity to the conductor layer 109 and the solder wettability can be improved, and the reliability of electrical connection is improved. be able to. In such a plating layer, a plating conduction pattern is formed on the outer peripheral portion of the mother substrate 101, the plating conduction pattern is held by a plating jig, and the plating conduction is performed from a terminal of the jig in a plating solution. It is formed by supplying a current to the conductor layer 109 via a pattern.

なお、メタライズ層１０８は、導体層１０９と同様の材料を用い、同様の手段で形成することができる。また、メタライズ層１０８も、その表面にめっき層を被着させておいてもよい。   Note that the metallized layer 108 can be formed using the same material as that of the conductor layer 109 by the same means. Further, the metallized layer 108 may have a plating layer deposited on the surface thereof.

母基板１０１は、配線基板領域１０２同士の境界に分割溝１１０が形成されている。この分割溝１１０に沿って母基板１０１に応力を加えて破断させることにより、各配線基板領域１０２に分割される。分割溝１１０は、図１に示した多数個取り配線基板においては、母基板１０１の上下面にそれぞれ平面視で同じ位置となるように形成されている。この場合、母基板１０１の上下いずれかの分割溝１１０の先端（底部）から対向する分割溝１１０の先端に向かって亀裂が進み、各配線基板領域１０２をバリや欠け等が生じる可能性を抑制し分割することができる。なお、母基板１０１の厚さ等に対応して、分割溝１１０を母基板１０１の上面または下面のいずれか一方にのみ形成するようにして、生産性を向上させるようにしてもよい。母基板１０１の上面または下面のいずれか一方にのみ分割溝１１０が形成されている場合、母基板１０１を分割するための曲げ応力は、分割溝１１０が開く方向に加えられる。   In the mother board 101, a dividing groove 110 is formed at the boundary between the wiring board regions 102. By dividing the mother board 101 by applying stress along the dividing grooves 110, the wiring board areas 102 are divided. In the multi-cavity wiring board shown in FIG. 1, the division grooves 110 are formed on the upper and lower surfaces of the mother board 101 so as to be at the same position in plan view. In this case, it is possible to suppress the possibility that a crack progresses from the tip (bottom) of one of the upper and lower divided grooves 110 of the mother substrate 101 toward the tip of the opposing divided groove 110, and burrs and chips are generated in each wiring board region 102. Can be divided. Note that the productivity may be improved by forming the dividing grooves 110 only on either the upper surface or the lower surface of the mother substrate 101 in accordance with the thickness of the mother substrate 101 or the like. When the dividing groove 110 is formed only on either the upper surface or the lower surface of the mother substrate 101, the bending stress for dividing the mother substrate 101 is applied in the direction in which the dividing groove 110 opens.

分割溝１１０は、母基板１０１となるグリーンシートの積層体の上下面に、カッター刃や金型を押し当てて切り込みを入れる等の方法により形成される。また、分割溝１１０の深さは、分割時のクラックやバリ、欠けを抑制するために、母基板１０１となるグリーンシートの厚みに対して、その深さが２０〜７０％程度に設定されるのがよい。   The dividing grooves 110 are formed on the upper and lower surfaces of the green sheet laminate to be the mother substrate 101 by a method such as pressing a cutter blade or a die to make a cut. Further, the depth of the dividing groove 110 is set to about 20 to 70% with respect to the thickness of the green sheet serving as the mother substrate 101 in order to suppress cracks, burrs, and chips during the division. It is good.

また、このような分割溝１１０は、捨て代領域１０５において、ダミー凹部１０６を越える（分割溝１１０の両端がダミー凹部１０６よりも母基板１０１の外周側に位置する）ように形成されていることが好ましい。これは、ダミー凹部１０６の外周においてバリ、欠けが発生する可能性を低減させるためである。分割溝１１０の端部がダミー凹部１０６に隣接していると、ダミー凹部１０６の端部から亀裂が生じる可能性があるためである。   Further, such a dividing groove 110 is formed so as to exceed the dummy recess 106 in the disposal margin region 105 (both ends of the dividing groove 110 are located on the outer peripheral side of the mother substrate 101 with respect to the dummy recess 106). Is preferred. This is to reduce the possibility of burrs and chips occurring on the outer periphery of the dummy recess 106. This is because if the end of the dividing groove 110 is adjacent to the dummy recess 106, a crack may occur from the end of the dummy recess 106.

なお、母基板１０１が、搬送や電子部品の搭載作業等の取り扱い中に分割溝１１０に沿った部位で破断されてしまうことを抑制するために、分割溝１１０の深さは、母基板１０１の厚みの２分の１未満であることが好ましい。また、分割溝１１０の交点には、貫通孔１１１が形成されていることが好ましい。   In order to prevent the mother substrate 101 from being broken at a site along the dividing groove 110 during handling such as transportation or mounting of electronic components, the depth of the dividing substrate 110 is set to a depth of the mother substrate 101. The thickness is preferably less than half of the thickness. Further, it is preferable that a through hole 111 is formed at the intersection of the dividing grooves 110.

捨て代領域１０５は、多数個取り配線基板の取り扱いを容易とするためのものである。また、上述のように各配線基板領域１０２にめっき用の電流を供給する際に、導電路（図示せず）を引き回すためのスペースとしても機能する。   The discard margin area 105 is for facilitating handling of the multi-piece wiring board. Further, as described above, when supplying a current for plating to each wiring board region 102, it also functions as a space for routing a conductive path (not shown).

本発明の多数個取り配線基板は、配線基板領域１０２に形成された凹部１０３と、凹部１０３の底面に凹部１０３の内側面に接して形成され、上面に導体層が設けられた段差部１０４と、捨て代領域１０５に形成されたダミー凹部１０６と、ダミー凹部１０６の底面にダミー凹部１０６の配線基板領域１０２側の内側面に接して形成されたダミー段差部１０７とを備えていることにより、捨て代領域１０５の剛性を配線基板領域１０２の剛性に近似させることができ、母基板１０１を分割する際に（特に捨て代領域１０５とそれに隣接する最外周の配線基板領域１０２との間の分割溝１１０に沿って母基板１０１を分割する際に）配線基板領域１０２側に大きな衝撃が加わることを抑制することができる。その結果、配線基板領域１０２（分割後の個々の配線基板（パッケージ））に、バリや割れ等が発生する可能性を低減させることができる。   The multi-piece wiring board of the present invention includes a recess 103 formed in the wiring board region 102, a step 104 formed on the bottom surface of the recess 103 in contact with the inner surface of the recess 103, and provided with a conductor layer on the upper surface. By providing the dummy recess 106 formed in the disposal margin region 105 and the dummy stepped portion 107 formed on the bottom surface of the dummy recess 106 in contact with the inner surface of the dummy recess 106 on the wiring board region 102 side, The rigidity of the discard margin area 105 can be approximated to the rigidity of the wiring board area 102. When the mother board 101 is divided (particularly, the division between the discard margin area 105 and the outermost peripheral wiring board area 102 adjacent thereto). It is possible to prevent a large impact from being applied to the wiring board region 102 side (when dividing the mother board 101 along the groove 110). As a result, it is possible to reduce the possibility of occurrence of burrs, cracks, and the like in the wiring board region 102 (individual wiring boards (packages) after division).

また、ダミー凹部１０５には、その底面に配線基板領域１０２側の内側面に接してダミー段差部１０７が形成されていることにより、配線基板領域１０２の凹部１０３の側壁に対する捨て代領域１０５のダミー凹部１０６の側壁の剛性が極端に低くなることを抑制でき、取り扱いが容易な多数個取り配線基板を提供することが可能となる。すなわち、ダミー凹部１０６には、その底面に配線基板領域１０２側の内側面に接してダミー段差部１０７が形成されていることにより、単に捨て代領域１０５にダミー凹部１０６のみを形成された構造に比べて、ダミー凹部１０６の側壁の剛性が極端に低くなることを抑制でき、ダミー凹部１０６側から配線基板領域１０２へ母基板１０１に割れ等の機械的な破壊が生じる可能性を低減させることができ、取り扱いが容易な多数個取り配線基板を提供することが可能となる。   The dummy recess 105 has a dummy stepped portion 107 formed on the bottom surface thereof in contact with the inner surface on the wiring substrate region 102 side. The rigidity of the side wall of the recess 106 can be prevented from becoming extremely low, and a multi-piece wiring board that can be easily handled can be provided. That is, the dummy recess 106 has a structure in which only the dummy recess 106 is formed in the disposal margin region 105 by forming the dummy stepped portion 107 in contact with the inner surface on the wiring board region 102 side on the bottom surface. In comparison, the rigidity of the side wall of the dummy recess 106 can be suppressed from becoming extremely low, and the possibility of mechanical damage such as a crack in the mother board 101 from the dummy recess 106 side to the wiring board region 102 can be reduced. It is possible to provide a multi-piece wiring board that can be handled easily.

また、ダミー凹部１０６の底面に、配線基板領域１０２側の内側面に接してダミー段差部１０７が形成されていることにより、母基板１０１となるグリーンシートにカッター刃を入れて分割溝１１０を形成する際に、捨て代領域１０５側に大きな変形が生じる可能性が低減され、分割溝１１０は配線基板領域１０２側と捨て代領域１０５側とに均等な幅で開いた形状で設けられ、分割性が向上された多数個取り配線基板を提供することができる。   In addition, since the dummy stepped portion 107 is formed on the bottom surface of the dummy recess 106 in contact with the inner surface on the wiring substrate region 102 side, a cutter blade is inserted into the green sheet serving as the mother substrate 101 to form the dividing groove 110. In this case, the possibility that a large deformation is generated on the side of the discard margin area 105 is reduced, and the dividing groove 110 is provided in an open shape with a uniform width on the wiring board area 102 side and the discard margin area 105 side. Thus, it is possible to provide a multi-piece wiring board with improved resistance.

また、母基板１０１となるグリーンシートにカッター刃を入れて分割溝１１０を形成する際、最外周の配線基板領域１０２において捨て代領域１０５側と配線基板領域１０２側との間で剛性が近似しているため、カッター刃の侵入に伴うグリーンシートの変形が配線基板領域１０２に大きく生じる可能性を低減でき、配線基板領域１０２の凹部１０３やそれを取り囲む枠部（側壁）が変形する可能性を低減させることができる。   Further, when forming the dividing groove 110 by inserting a cutter blade into the green sheet to be the mother board 101, the rigidity approximates between the disposal margin area 105 side and the wiring board area 102 side in the outermost wiring board area 102. Therefore, the possibility that the deformation of the green sheet due to the intrusion of the cutter blade is greatly generated in the wiring board region 102 can be reduced, and the recess 103 of the wiring board region 102 and the frame portion (side wall) surrounding it can be deformed. Can be reduced.

また、本発明の多数個取り配線基板は、ダミー凹部１０６が、母基板１０１の中央部の最外周に形成された凹部１０３に隣り合うように形成されていることが好ましい。本発明の多数個取り配線基板は、配線基板領域１０２と隣接する捨て代領域１０５とで剛性をより近似させることができる。そして、分割溝１１０に沿った分割時の衝撃がより抑制されるとともに分割溝１１０が癒着する可能性をさらに低減することができ、バリや割れが発生する可能性をより低減することが可能となる。また、母基板１０１を分割溝１１０に沿ってより容易にかつ正確に分割することができる。   Further, in the multi-piece wiring board of the present invention, the dummy recess 106 is preferably formed so as to be adjacent to the recess 103 formed at the outermost periphery of the central portion of the mother substrate 101. In the multi-piece wiring board of the present invention, the rigidity can be more approximated between the wiring board region 102 and the adjacent margin allowance region 105. And the impact at the time of the division | segmentation along the division | segmentation groove | channel 110 can be suppressed more, the possibility that the division | segmentation groove | channel 110 adheres can further be reduced, and the possibility that a burr | flash and a crack will generate | occur | produce can be further reduced. Become. Further, the mother substrate 101 can be more easily and accurately divided along the dividing groove 110.

また、グリーンシートのうち配線基板領域１０２と捨て代領域１０５との間で剛性がさらに近似するので、配線基板領域１０２と捨て代領域１０５との間に、分割溝１１０となる切り込みを形成する際に配線基板領域１０２側に過剰な変形が生じる可能性を低減することができる。   In addition, since the rigidity is further approximated between the wiring board region 102 and the disposal margin region 105 in the green sheet, when the notch that forms the dividing groove 110 is formed between the wiring substrate region 102 and the disposal margin region 105. In addition, it is possible to reduce the possibility of excessive deformation on the wiring board region 102 side.

また、本発明の多数個取り配線基板は、配線基板領域１０２および凹部１０３が四角形状であり、ダミー凹部１０６は、隣り合う凹部１０３と隣り合う内側面同士の長さが等しい四角形状であることが好ましい。本発明の多数個取り配線基板は、このような構成により、配線基板領域１０２と隣接する捨て代領域１０５との間で機械的な強度や剛性をより近似させることができ、分割溝１１０に沿った分割時の衝撃がより抑制されるとともに分割溝１１０の癒着がさらに抑制され、バリや割れが発生する可能性を低減することができる。また、母基板１０１を分割溝１１０に沿ってより容易にかつ正確に分割することができる。   Further, in the multi-cavity wiring board of the present invention, the wiring board region 102 and the recess 103 are in a quadrangular shape, and the dummy recess 106 is in a quadrangular shape in which the lengths of the inner surfaces adjacent to the adjacent recess 103 are equal. Is preferred. With such a configuration, the multi-cavity wiring board according to the present invention can more closely approximate the mechanical strength and rigidity between the wiring board region 102 and the adjacent margin allowance region 105, along the dividing groove 110. Further, the impact at the time of splitting is further suppressed, and adhesion of the split grooves 110 is further suppressed, and the possibility of occurrence of burrs and cracks can be reduced. Further, the mother substrate 101 can be more easily and accurately divided along the dividing groove 110.

また、グリーンシートのうち配線基板領域１０２と捨て代領域１０５との間で剛性がさらに近似するので、配線基板領域１０２と捨て代領域１０５との間に分割溝１１０となる切り込みを形成する際に、配線基板領域１０２側に過剰な変形が生じる可能性をさらに低減することができる。   Further, since the rigidity is further approximated between the wiring board region 102 and the disposal margin region 105 in the green sheet, when forming a cut that becomes the dividing groove 110 between the wiring substrate region 102 and the disposal margin region 105. The possibility of excessive deformation on the wiring board region 102 side can be further reduced.

また、配線基板領域１０２は、グリーンシートに占める面積が大きいことと、凹部１０３が形成されていることから、焼成時の熱の影響を受け易く収縮率が大きくなる傾向がある。本発明の多数個取り配線基板においては、ダミー凹部１０６が、隣り合う凹部１０３と隣り合う内側面同士の長さが等しい四角形状に形成されていることにより、配線基板領域１０２と捨て代領域１０５との焼成時の収縮の違いによる変形を緩和することができる。   In addition, since the wiring board region 102 has a large area in the green sheet and the recess 103 is formed, the wiring substrate region 102 tends to be affected by heat during firing and tends to have a high shrinkage rate. In the multi-cavity wiring board of the present invention, the dummy recess 106 is formed in a quadrangular shape in which the lengths of the adjacent recesses 103 and the adjacent inner side surfaces are equal to each other. And deformation due to the difference in shrinkage during firing.

また、ダミー凹部１０６について、隣り合う凹部１０３と隣り合う内側面同士の長さが等しい四角形状とした場合、凹部１０３の内側面の長さを配線基板領域１０２の一つの並びの全てにおいて揃えることにより、配線基板領域１０２の一つの並びにおいて、凹部１０３と分割溝１１０との距離およびダミー凹部１０６と分割溝１１０との距離を等しくして母基板１０１の剛性を揃えることができる。そのため、分割溝１１０に沿って母基板１０１に曲げ応力が加えられたときに、一部の凹部１０３やダミー凹部１０６と分割溝１１０との間で亀裂が生じる可能性を低減させることができ、母基板１０１を分割溝１１０に沿ってより確実に分割することが可能となる。   Further, when the dummy recesses 106 are formed in a quadrangular shape in which the lengths of the adjacent recesses 103 and the adjacent inner side surfaces are equal, the lengths of the inner side surfaces of the recesses 103 are made uniform in all one row of the wiring board region 102. As a result, the rigidity of the mother board 101 can be made uniform by making the distance between the concave portion 103 and the dividing groove 110 and the distance between the dummy concave portion 106 and the dividing groove 110 equal in one row of the wiring board regions 102. Therefore, when a bending stress is applied to the mother substrate 101 along the dividing groove 110, it is possible to reduce the possibility of cracks occurring between some of the recesses 103 and the dummy recesses 106 and the dividing grooves 110. The mother board 101 can be more reliably divided along the dividing groove 110.

また、凹部１０３やダミー凹部１０６となる開口部をセラミックグリーンシートに打ち抜き形成するときの金型等の位置合わせを、凹部１０３側とダミー凹部１０６側とで同時に行なうことができ生産性を向上させることもできる。   In addition, the die and the like can be aligned at the same time on the concave portion 103 side and the dummy concave portion 106 side when the opening portion to be the concave portion 103 and the dummy concave portion 106 is punched and formed in the ceramic green sheet, thereby improving productivity. You can also

また、本発明の多数個取り配線基板は、ダミー凹部１０２１０６の深さが凹部１０３の深さと同じであることが好ましい。本発明の多数個取り配線基板は、このような構成により、配線基板領域１０２と隣接する捨て代領域１０５との間で剛性をより近似させることができ、分割溝１１０に沿った分割時の衝撃がより低減されるとともに、分割溝１１０の癒着がさらに抑制され、バリや割れが生じる可能性をさらに低減することができる。また、母基板１０１を分割溝１１０に沿ってより容易にかつ正確に分割することができる。   Further, in the multi-piece wiring board of the present invention, it is preferable that the depth of the dummy recess 102106 is the same as the depth of the recess 103. With such a configuration, the multi-cavity wiring board of the present invention can more closely approximate the rigidity between the wiring board region 102 and the adjacent disposal margin region 105, and the impact at the time of division along the dividing groove 110 can be made. Is further reduced, the adhesion of the dividing grooves 110 is further suppressed, and the possibility of occurrence of burrs and cracks can be further reduced. Further, the mother substrate 101 can be more easily and accurately divided along the dividing groove 110.

また、グリーンシートのうち配線基板領域１０２と捨て代領域１０５との間で剛性がさらに近似するので、配線基板領域１０２と捨て代領域１０５との間に分割溝１１０となる切り込みを形成する際に、配線基板領域１０２側に変形が生じる可能性を低減することができる。   Further, since the rigidity is further approximated between the wiring board region 102 and the disposal margin region 105 in the green sheet, when forming a cut that becomes the dividing groove 110 between the wiring substrate region 102 and the disposal margin region 105. The possibility of deformation on the wiring board region 102 side can be reduced.

なお、凹部１０３とダミー凹部１０６との深さを同じにするには、凹部１０３となる開口部と、ダミー凹部１０６となる開口部とを同じグリーンシートにのみ形成すればよい。この場合、一方の深さを深くする場合に比べて、金型等による打ち抜き加工の回数を低減することができ、多数個取り配線基板としての生産性を向上させることができる。   In order to make the depths of the recess 103 and the dummy recess 106 the same, it is only necessary to form the opening serving as the recess 103 and the opening serving as the dummy recess 106 only in the same green sheet. In this case, compared with the case where one of the depths is increased, the number of punching processes using a mold or the like can be reduced, and the productivity as a multi-piece wiring board can be improved.

また、本発明の多数個取り配線基板は、図２（ａ）および（ｂ）に示すように、ダミー段差部２０７は、段差部１０４と形状および寸法が同じであることが好ましい。図２（ａ）は、本発明の多数個取り配線基板の他の例の構造を示す平面図であり、図２（ｂ）は、図２（ａ）に示した多数個取り配線基板のＸ−Ｘ’線における断面図である。なお、図２に示した多数個取り配線基板において、図１に示した多数個取り配線基板と同一の構成には同一の符号を付している。本発明の多数個取り配線基板は、このような構成により、段差部１０４が凹部１０３の周囲の枠部（側壁）を補強する効果と、ダミー段差部２０７がダミー凹部１０６の周囲の側壁（捨て代領域１０５）を補強する効果とを同じ程度にすることができ、配線基板領域１０２と捨て代領域１０５との間で剛性をより近似させることができる。   Further, in the multi-piece wiring board of the present invention, as shown in FIGS. 2A and 2B, the dummy step portion 207 preferably has the same shape and dimensions as the step portion 104. FIG. 2A is a plan view showing the structure of another example of the multi-cavity wiring board of the present invention, and FIG. 2B is an X of the multi-cavity wiring board shown in FIG. It is sectional drawing in the -X 'line. In the multi-cavity wiring board shown in FIG. 2, the same components as those of the multi-cavity wiring board shown in FIG. The multi-piece wiring board according to the present invention has such a structure that the step 104 reinforces the frame (side wall) around the recess 103, and the dummy step 207 is disposed around the dummy recess 106. The effect of reinforcing the marginal area 105) can be made to the same extent, and the rigidity can be more approximated between the wiring board area 102 and the disposal marginal area 105.

また、本発明の多数個取り配線基板は、ダミー凹部１０６およびダミー段差部２０７が、捨て代領域１０５に複数形成されており、中央部の最外周に形成された複数の配線基板領域１０２の凹部１０３および段差部１０４と複数のダミー凹部１０６および複数のダミー段差部２０２とは、中央部の最外周に形成された配線基板領域１０２と捨て代領域１０５との境界線を基準に線対称に形成されていることが好ましい。本発明の多数個取り配線基板は、このような構成により、段差部１０４が凹部１０３の周囲の枠部を補強する領域と、ダミー段差部２０７がダミー凹部１０６の周囲の捨て代側領域１０５を補強する領域とを同じ程度に揃えることができ、配線基板領域１０２と捨て代領域１０５との間で剛性をより近似させることができる。   Further, in the multi-cavity wiring board of the present invention, a plurality of dummy recesses 106 and dummy stepped portions 207 are formed in the disposal margin region 105, and the recesses of the plurality of wiring substrate regions 102 formed on the outermost periphery of the central portion. 103 and the step 104, the plurality of dummy recesses 106, and the plurality of dummy steps 202 are formed symmetrically with respect to the boundary line between the wiring board region 102 and the disposal margin region 105 formed on the outermost periphery of the central portion. It is preferable that With this configuration, the multi-cavity wiring board according to the present invention has a region in which the step 104 reinforces the frame around the recess 103 and a dummy step 207 in the disposal margin side region 105 around the dummy recess 106. The regions to be reinforced can be aligned to the same extent, and the rigidity can be more approximated between the wiring board region 102 and the disposal margin region 105.

また、配線基板領域１０２と捨て代領域１０５との境界線においてグリーンシートに分割溝１１０となる切り込みを形成する際に、配線基板領域１０２と捨て代領域１０５との両側により均等に切り込みが開くことから、焼成後においても配線基板領域１０２と捨て代領域１０５との間で分割溝１１０が癒着することを抑制でき、母基板１０１を配線基板領域１０２と捨て代領域１０５との境界で分割する際に、配線基板領域１０２にバリや割れが発生する可能性をさらに低減することができる。   In addition, when the cuts that become the dividing grooves 110 are formed in the green sheet at the boundary line between the wiring board region 102 and the discard margin region 105, the cuts are equally opened on both sides of the wiring substrate region 102 and the discard margin region 105. Therefore, even after firing, it is possible to suppress the adhesion of the dividing groove 110 between the wiring board region 102 and the disposal margin region 105, and when dividing the mother substrate 101 at the boundary between the wiring substrate region 102 and the disposal margin region 105. In addition, the possibility of occurrence of burrs and cracks in the wiring board region 102 can be further reduced.

なお、本発明は上記実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲で変更、改良を施すことは何ら差し支えない。例えば、図１，２に示した多数個取り配線基板においては、母基板１０１の上面のみにダミー凹部１０６とダミー段差部１０７（若しくは、ダミー段差部２０７）が形成されているが、上下両面に凹部が形成され、上下両面にダミー凹部１０６とダミー段差部１０７（若しくは、ダミー段差部２０７）が形成されていてもよい。   It should be noted that the present invention is not limited to the examples of the above-described embodiments, and changes and modifications can be made without departing from the scope of the present invention. For example, in the multi-cavity wiring board shown in FIGS. 1 and 2, the dummy recess 106 and the dummy step 107 (or the dummy step 207) are formed only on the upper surface of the mother board 101. A recess may be formed, and a dummy recess 106 and a dummy step 107 (or a dummy step 207) may be formed on both upper and lower surfaces.

また、本発明の電子部品収納用パッケージは、図１若しくは図２に示した多数個取り配線基板を配線基板領域１０２ごとに分割することにより個片化されたものである。本発明の電子部品収納用パッケージは、このような構成により、凹部１０３を囲む枠部におけるバリや割れ等の発生の可能性が低減されており、信頼性に優れた電子部品収納用パッケージを提供することができる。   In addition, the electronic component storage package of the present invention is obtained by dividing the multi-piece wiring board shown in FIG. 1 or FIG. With such a configuration, the electronic component storage package of the present invention reduces the possibility of occurrence of burrs, cracks, and the like in the frame portion surrounding the recess 103, and provides an electronic component storage package with excellent reliability. can do.

また、本発明の電子装置は、この電子部品収納用パッケージの凹部１０３に収容され、段差部１０４の導体層１０９に電極が電気的に接続された電子部品と、電子部品収納用パッケージに凹部１０３を塞ぐように接合された蓋体とを備えている。本発明の電子装置は、このような構成により、電子部品が収容された凹部１０３を囲む枠部におけるバリや割れ等の発生の可能性が低減されており、信頼性に優れた電子装置を提供することができる。なお、電子部品は、多数個取り配線基板の状態で凹部１０３に搭載されても、若しくは、多数個取り配線基板が分割された後の電子部品収納用パッケージの凹部１０３に搭載されてもよい。   Further, the electronic device of the present invention is housed in the recess 103 of the electronic component storage package, the electronic component having the electrode electrically connected to the conductor layer 109 of the stepped portion 104, and the recess 103 in the electronic component storage package. And a lid joined so as to close the cover. With such a configuration, the electronic device according to the present invention reduces the possibility of occurrence of burrs, cracks, and the like in the frame portion surrounding the recess 103 in which the electronic component is accommodated, and provides an electronic device with excellent reliability. can do. The electronic component may be mounted in the recess 103 in a state of a multi-piece wiring board, or may be mounted in the concave portion 103 of the electronic component storage package after the multi-piece wiring board is divided.

（ａ）は、本発明の多数個取り配線基板の構造を示す平面図であり、（ｂ）は、（ａ）に示した多数個取り配線基板のＸ−Ｘ’線における断面図である。(A) is a top view which shows the structure of the multi-cavity wiring board of this invention, (b) is sectional drawing in the X-X 'line | wire of the multi-cavity wiring board shown to (a). （ａ）は、本発明の多数個取り配線基板の他の例の構造を示す平面図であり、（ｂ）は、（ａ）に示した多数個取り配線基板のＸ−Ｘ’線における断面図である。(A) is a top view which shows the structure of the other example of the multi-cavity wiring board of this invention, (b) is the cross section in the XX 'line | wire of the multi-cavity wiring board shown to (a). FIG.

符号の説明Explanation of symbols

１０１・・・母基板
１０２・・・配線基板領域
１０３・・・凹部
１０４・・・段差部
１０５・・・捨て代領域
１０６・・・ダミー凹部
１０７・・・ダミー段差部
１０８・・・メタライズ層
１０９・・・導体層
１１０・・・分割溝
１１１・・・貫通孔 DESCRIPTION OF SYMBOLS 101 ... Mother board | substrate 102 ... Wiring board area | region 103 ... Concave part 104 ... Step part 105 ... Discard allowance area | region 106 ... Dummy recessed part 107 ... Dummy step part 108 ... Metallization layer 109 ... conductor layer 110 ... divided groove 111 ... through hole

Claims (8)

中央部に複数の配線基板領域が縦横に形成された母基板と、前記配線基板領域に形成された凹部と、該凹部の底面に前記凹部の内側面に接して形成され、上面に導体層が設けられた段差部と、前記母基板の外周部に設けられた捨て代領域と、該捨て代領域に形成されたダミー凹部と、該ダミー凹部の底面に前記ダミー凹部の前記配線基板領域側の内側面に接して形成されたダミー段差部とを備えていることを特徴とする多数個取り配線基板。 A mother board in which a plurality of wiring board regions are formed vertically and horizontally in the center, a recess formed in the wiring board area, a bottom surface of the recess is formed in contact with an inner surface of the recess, and a conductor layer is formed on the upper surface. A stepped portion provided, a discarding region provided in an outer peripheral portion of the mother substrate, a dummy recess formed in the discarding region, and a bottom surface of the dummy recess on the wiring substrate region side of the dummy recess. A multi-cavity wiring board comprising a dummy step portion formed in contact with an inner surface. 前記ダミー凹部は、前記母基板の前記中央部の最外周に形成された前記凹部に隣り合うように形成されていることを特徴とする請求項１記載の多数個取り配線基板。 2. The multi-cavity wiring board according to claim 1, wherein the dummy recess is formed adjacent to the recess formed on the outermost periphery of the central portion of the mother board. 前記配線基板領域および前記凹部は四角形状であり、前記ダミー凹部は、隣り合う前記凹部と隣り合う内側面同士の長さが等しい四角形状であることを特徴とする請求項２記載の多数個取り配線基板。 3. The multi-piece manufacturing method according to claim 2, wherein the wiring board region and the recess have a quadrangular shape, and the dummy recess has a quadrangular shape in which adjacent inner surfaces are equal in length to each other. Wiring board. 前記ダミー凹部は、深さが前記凹部の深さと同じであることを特徴とする請求項１乃至請求項３のいずれかに記載の多数個取り配線基板。 4. The multi-cavity wiring board according to claim 1, wherein the dummy recess has the same depth as the recess. 前記ダミー段差部は、前記段差部と形状および寸法が同じであることを特徴とする請求項１乃至請求項４のいずれかに記載の多数個取り配線基板。 5. The multi-piece wiring board according to claim 1, wherein the dummy step portion has the same shape and dimensions as the step portion. 前記ダミー凹部および前記ダミー段差部は、前記捨て代領域に複数形成されており、前記中央部の最外周に形成された前記複数の配線基板領域の前記凹部および前記段差部と前記複数のダミー凹部および前記複数のダミー段差部とは、前記中央部の最外周に形成された前記配線基板領域と前記捨て代領域との境界線を基準に線対称に形成されていることを特徴とする請求項１乃至請求項５のいずれかに記載の多数個取り配線基板。 A plurality of the dummy recesses and the dummy stepped portions are formed in the discard margin region, and the recesses and the stepped portions of the plurality of wiring board regions formed on the outermost periphery of the central portion and the plurality of dummy recesses The plurality of dummy stepped portions are formed symmetrically with respect to a boundary line between the wiring board region formed on the outermost periphery of the central portion and the discard margin region. The multi-piece wiring board according to any one of claims 1 to 5. 請求項１乃至請求項６のいずれかに記載された多数個取り配線基板を前記配線基板領域ごとに分割することにより個片化されたことを特徴とする電子部品収納用パッケージ。 7. A package for storing electronic parts, wherein the multi-piece wiring board according to claim 1 is separated into pieces by dividing the wiring board area into the wiring board regions. 請求項７記載の電子部品収納用パッケージの前記凹部に収容され、前記段差部の前記導体層に電極が電気的に接続された電子部品と、前記電子部品収納用パッケージに前記凹部を塞ぐように接合された蓋体とを備えていることを特徴とする電子装置。 An electronic component housed in the recess of the electronic component storage package according to claim 7, wherein an electrode is electrically connected to the conductor layer of the stepped portion, and the recess is closed by the electronic component storage package. An electronic device comprising: a joined lid.
JP2004247659A 2004-08-27 2004-08-27 Multiple patterning wiring substrate, electronic component housing package, and electronic device Pending JP2006066656A (en)

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015060976A (en) * 2013-09-19 2015-03-30 京セラ株式会社 Multi-piece wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015060976A (en) * 2013-09-19 2015-03-30 京セラ株式会社 Multi-piece wiring board

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