JP2006042098A - High frequency wiring board - Google Patents

High frequency wiring board Download PDF

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JP2006042098A
JP2006042098A JP2004221187A JP2004221187A JP2006042098A JP 2006042098 A JP2006042098 A JP 2006042098A JP 2004221187 A JP2004221187 A JP 2004221187A JP 2004221187 A JP2004221187 A JP 2004221187A JP 2006042098 A JP2006042098 A JP 2006042098A
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differential signal
signal line
conductor layer
ground conductor
line
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Masanao Kabumoto
正尚 株元
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the reflection loss and transmission loss of a high frequency signal by reducing noise due to electric interference between differential signal lines and matching characteristic impedance in the differential signal lines. <P>SOLUTION: A plurality of through-conductors 7 are formed at both the sides of each differential signal line 8, which includes a pair of signal lines formed in parallel on the upper surface of a dielectric board 2, so as to make a column in parallel with a line direction. The arrayal distance of the through-conductors 7 is made to be not more than one-fourth of the wavelength of a high frequency signal to be transmitted in the differential signal lines. On a lower surface ground conductor layer 6, a pair of island-shape non-formation parts 9 is formed in a part just under the respective signal lines 3, 4, of the differential signal lines 8, so as to be orthogonal to the line direction. The plurality of the pairs of the non-formation parts are formed in the line direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ＧＨｚ帯の高周波帯域で使用されるＩＣ，ＬＳＩ等の高周波回路部品または高周波回路装置と入出力部との間にインピーダンス整合等の目的で設けられる高周波用配線基板に関し、特に高周波信号の伝送特性を改善した差動信号線路構造を有する高周波用配線基板に関する。   The present invention relates to a high-frequency circuit board provided for the purpose of impedance matching or the like between a high-frequency circuit component such as an IC or LSI or a high-frequency circuit device used in a high-frequency band in the GHz band and an input / output unit. The present invention relates to a high-frequency wiring board having a differential signal line structure with improved transmission characteristics.

近年の通信技術の高周波化および大容量化に伴い、ＩＣ，ＬＳＩ，半導体レーザ，フォトダイオード（Photo Diode：ＰＤ）等の通信用デバイスがより高周波で動作するようになってきており、この通信用デバイスを搭載するパッケージやそれを実装する回路基板に形成される信号線路においても、より高周波の高周波信号を低損失で伝送させる必要がある。このため、通信用デバイスのパッケージ内の信号線路や回路基板の信号線路を、高周波用の伝送線路として作製しなければならない。   With the recent increase in frequency and capacity of communication technologies, communication devices such as ICs, LSIs, semiconductor lasers, and photodiodes (Photo Diodes: PDs) are operating at higher frequencies. Even in a signal line formed on a package on which a device is mounted or a circuit board on which the device is mounted, it is necessary to transmit a high-frequency high-frequency signal with low loss. For this reason, the signal line in the package of the communication device and the signal line of the circuit board must be manufactured as a transmission line for high frequency.

また、ＭＵＸ（Multiplexer：多重回路），ＤＥＭＵＸ（Demultiplexer：多重分離回路），ＮＰＵ（Network Processor Unit）等の通信用デバイスの入出力端子数の増加に伴い、パッケージおよび回路基板の信号線路数が飛躍的に増加している。そのため、信号線路を高密度に形成しなければならず、自ずと信号線路間の間隔も狭くなる。しかしながら、高周波信号を伝送する信号線路同士を近接して配置すると、信号線路間に発生する寄生成分、特に信号線路間の電気的容量（浮遊容量）や相互インダクタンスによりノイズが発生して、アイソレーションの劣化、クロストークの発生等によって伝送損失が増大するという問題があった。   As the number of input / output terminals of communication devices such as MUX (Multiplexer), DEMUX (Demultiplexer), and NPU (Network Processor Unit) increases, the number of signal lines on the package and circuit board jumps. Is increasing. Therefore, the signal lines must be formed with high density, and the interval between the signal lines is naturally narrowed. However, if signal lines that transmit high-frequency signals are placed close to each other, noise is generated due to parasitic components generated between the signal lines, especially electrical capacitance (floating capacitance) between the signal lines and mutual inductance, and isolation. There has been a problem that transmission loss increases due to deterioration of the transmission and occurrence of crosstalk.

そこで、特許文献１に示されるような、誘電体基板の上面に平行に２つの信号線路から成る差動信号線路が設けられている高周波用配線基板において、隣接する差動信号線路の間に、接地導体層または電源導体層に接続される貫通導体を信号伝送方向に沿って所定の間隔で形成することにより、隣接する差動信号線路間の電磁気的干渉によるノイズを小さくするものが提案されている。
特開２００３−２２４４０８号公報 Therefore, as shown in Patent Document 1, in a high-frequency wiring board in which a differential signal line composed of two signal lines is provided in parallel to the upper surface of a dielectric substrate, between adjacent differential signal lines, It has been proposed to reduce noise caused by electromagnetic interference between adjacent differential signal lines by forming through conductors connected to the ground conductor layer or power supply conductor layer at predetermined intervals along the signal transmission direction. Yes.
JP 2003-224408 A

しかしながら、上記従来の高周波用配線基板では、信号伝送方向に沿って所定の間隔で形成された貫通導体と貫通導体と隣接する信号線路との間で不要なキャパシタンス成分が発生し、貫通導体が存在する箇所において信号線路の特性インピーダンスが下がってしまい、差動信号線路の場合は対をなす各信号線路の特性インピーダンスの合計が差動信号線路としての特性インピーダンスとなるため、対をなす各信号線路の特性インピーダンスの寄生容量による微小な不整合が差動信号線路の特性インピーダンスとして大きな不整合を生じさせるという問題があった。   However, in the conventional high-frequency wiring board, an unnecessary capacitance component is generated between the through conductor formed at a predetermined interval along the signal transmission direction and the signal line adjacent to the through conductor, and the through conductor exists. The characteristic impedance of the signal line is lowered at the location where the signal line is applied. In the case of a differential signal line, the total characteristic impedance of each signal line forming a pair becomes the characteristic impedance of the differential signal line. There is a problem that a small mismatch due to the parasitic capacitance of the characteristic impedance causes a large mismatch as the characteristic impedance of the differential signal line.

本発明は、上記問題点を解決するために完成されたものであり、その目的は、差動信号線路間の電気的干渉によるノイズを小さくし、かつ差動信号線路の特性インピーダンスを整合させ、高周波信号の反射損失および伝送損失を低減することである。   The present invention has been completed in order to solve the above problems, and its purpose is to reduce noise due to electrical interference between differential signal lines, and to match the characteristic impedance of the differential signal lines, It is to reduce reflection loss and transmission loss of high-frequency signals.

本発明の高周波用配線基板は、複数の誘電体層を積層してなる誘電体基板の上面または前記誘電体層の層間に互いに平行に形成された一対の信号線路から成る差動信号線路と、該差動信号線路の両側に所定間隔をもって形成された同一面接地導体層と、前記誘電体基板の下面の全面に形成された下面接地導体層と、前記同一面接地導体層および前記下面接地導体層を電気的に接続するとともに前記差動信号線路の両側に線路方向と平行に列を成して形成された複数の貫通導体とを具備しており、前記複数の貫通導体は、前記線路方向における配列間隔が前記差動信号線路で伝送される高周波信号の波長の４分の１以下であるとともに、前記下面接地導体層は、前記差動信号線路の前記各信号線路の直下の部位に島状の非形成部が前記線路方向に直交する方向に対を成して形成されるとともに、前記対を成す非形成部が前記線路方向に複数対形成されていることを特徴とする。   The high-frequency wiring board of the present invention includes a differential signal line composed of a pair of signal lines formed in parallel with each other between the upper surface of a dielectric substrate formed by laminating a plurality of dielectric layers or between the dielectric layers; The same-surface ground conductor layer formed on both sides of the differential signal line with a predetermined interval, the lower-surface ground conductor layer formed on the entire lower surface of the dielectric substrate, the same-surface ground conductor layer, and the lower-surface ground conductor A plurality of through conductors formed in a row in parallel with the line direction on both sides of the differential signal line, and the plurality of through conductors are connected in the line direction. And the lower-surface ground conductor layer is formed in an area immediately below each signal line of the differential signal line at an area below the quarter of the wavelength of the high-frequency signal transmitted through the differential signal line. Non-formed part is the line direction Together they are formed in pairs in the direction orthogonal, non-formation portion that forms the pair, characterized in that it is a plurality of pairs formed in the line direction.

また、本発明の高周波用配線基板は好ましくは、前記複数の貫通導体は、前記線路方向に直交する方向に列を成して形成されており、前記対を成す非形成部は、前記線路方向に直交する方向に列を成す前記貫通導体同士の間に形成されていることを特徴とする。   In the high-frequency wiring board of the present invention, preferably, the plurality of through conductors are formed in a row in a direction perpendicular to the line direction, and the non-forming portions forming the pair are formed in the line direction. It is formed between the through conductors forming a row in a direction orthogonal to.

また、本発明の高周波用配線基板は好ましくは、前記非形成部は円形状であることを特徴とする。   The high-frequency wiring board of the present invention is preferably characterized in that the non-formed part is circular.

また、本発明の高周波配線基板は好ましくは、前記差動信号線路は、複数のものが平行に形成されていることを特徴とする。   The high-frequency wiring board of the present invention is preferably characterized in that a plurality of the differential signal lines are formed in parallel.

本発明の高周波用配線基板によれば、誘電体基板の上面または層間に互いに平行に形成された一対の信号線路から成る差動信号線路の両側に線路方向と平行に列を成して形成された複数の貫通導体を形成し、これらの貫通導体の配列間隔を差動信号線路で伝送される高周波信号の波長の４分の１以下としたことから、差動信号線路の両側に擬似的な導体壁が形成されたことになり、差動信号線路と隣接する他の信号線路との間に生じる電界の結合（カップリング）を抑制することができるため、電磁気的干渉によるノイズを小さくすることができる。さらに、下面接地導体層は、差動信号線路の各信号線路の直下の部位に島状の非形成部が線路方向に直交する方向に対を成して形成されるとともに、対を成す非形成部が線路方向に複数対形成されていることから、貫通導体と信号線路との間の不要なキャパシタンス成分による特性インピーダンスの低下分を、下面接地導体層の島状の非形成部とその直上の信号線路間のキャパシタンス成分の減少による特性インピーダンスの上昇分で相殺することができ、差動線路の特性インピーダンスを均一にすることができる。   The high-frequency wiring board of the present invention is formed in rows on both sides of a differential signal line composed of a pair of signal lines formed in parallel with each other on the upper surface or between layers of the dielectric substrate in parallel with the line direction. A plurality of through conductors are formed, and the arrangement interval of these through conductors is set to ¼ or less of the wavelength of the high-frequency signal transmitted through the differential signal line. Since the conductor wall is formed and the coupling (coupling) of the electric field generated between the differential signal line and other adjacent signal lines can be suppressed, the noise due to electromagnetic interference is reduced. Can do. Furthermore, the lower surface ground conductor layer is formed in pairs in the direction perpendicular to the line direction with island-shaped non-formed portions formed immediately below each signal line of the differential signal line. Since multiple pairs are formed in the line direction, the decrease in characteristic impedance due to unnecessary capacitance components between the through conductor and the signal line is reduced to the island-shaped non-formed portion of the bottom ground conductor layer and directly above it. The amount of increase in the characteristic impedance due to the decrease in the capacitance component between the signal lines can be canceled, and the characteristic impedance of the differential line can be made uniform.

また、本発明の高周波用配線基板は、複数の貫通導体は、線路方向に直交する方向に列を成して形成されており、対を成す非形成部は、線路方向に直交する方向に列を成す貫通導体同士の間に形成した場合には、下面接地導体層の島状の非形成部と貫通導体の距離が最も小さくなり、その結果、貫通導体と信号線路との間の不要なキャパシタンス成分による特性インピーダンスの低下分を、下面接地導体層の島状の非形成部とその直上の信号線路間のキャパシタンス成分の減少による特性インピーダンスの上昇分で効果的に相殺することができ、差動線路の特性インピーダンスを均一にすることができる。   In the high-frequency wiring board according to the present invention, the plurality of through conductors are formed in a row in a direction orthogonal to the line direction, and the non-forming portions forming the pair are arranged in a direction orthogonal to the line direction. The distance between the island-shaped non-formed portion of the bottom ground conductor layer and the through conductor is the smallest, resulting in unnecessary capacitance between the through conductor and the signal line. The decrease in the characteristic impedance due to the component can be effectively offset by the increase in the characteristic impedance due to the decrease in the capacitance component between the island-shaped non-formed portion of the bottom ground conductor layer and the signal line directly above it. The characteristic impedance of the line can be made uniform.

また、本発明の高周波用配線基板は、下面接地導体層の島状の非形成部を円形状とした場合には、差動信号線路の直下の下面接地導体層において、差動信号線路に伝達される信号の進行方向と逆向きに流れる帰路電流の流れをスムーズにすることができ、不要な電磁放射を抑制することができる。   In addition, when the island-shaped non-formed portion of the lower surface ground conductor layer is circular, the high frequency wiring board of the present invention transmits to the differential signal line at the lower surface ground conductor layer immediately below the differential signal line. The flow of the return current flowing in the direction opposite to the traveling direction of the transmitted signal can be made smooth, and unnecessary electromagnetic radiation can be suppressed.

また、本発明の高周波用配線基板は、複数の差動信号線路を平行に形成した場合には、ＭＵＸ，ＤＥＭＵＸ，ＮＰＵ等の通信用デバイスの入出力端子数の増加に容易に対応可能なものとなる。   The high-frequency wiring board according to the present invention can easily cope with an increase in the number of input / output terminals of communication devices such as MUX, DEMUX, NPU, etc., when a plurality of differential signal lines are formed in parallel. It becomes.

本発明の高周波用配線基板（以下、高周波基板ともいう）について以下に詳細に説明する。図１（ａ），（ｂ），（ｃ），（ｄ）は、本発明の高周波基板について実施の形態の一例を示す平面図および断面図である。これらの図において、１は高周波基板、２は誘電体基板、３は差動信号線路８を成す第１の信号線路、４は差動信号線路８を成す第２の信号線路、５は同一面接地導体層、６は下面接地導体層、７は貫通導体、９は下面接地導体層６の島状の非形成部である。   The high-frequency wiring board of the present invention (hereinafter also referred to as a high-frequency board) will be described in detail below. 1A, 1B, 1C, and 1D are a plan view and a cross-sectional view showing an example of an embodiment of the high-frequency substrate of the present invention. In these figures, 1 is a high-frequency substrate, 2 is a dielectric substrate, 3 is a first signal line forming a differential signal line 8, 4 is a second signal line forming a differential signal line 8, and 5 is the same surface contact. A ground conductor layer, 6 is a bottom ground conductor layer, 7 is a through conductor, and 9 is an island-shaped non-formed portion of the bottom ground conductor layer 6.

本発明の高周波基板１は、誘電体基板２の上面に形成された、平行な２つの信号線路３，４から成る差動信号線路８と、差動信号線路８の両側に形成された同一面接地導体層５と、誘電体基板２の下面の全面に形成された下面接地導体層６と、同一面接地導体層５および下面接地導体層６を電気的に接続するとともに差動信号線路８の線路方向に平行に列を成して形成された複数の貫通導体７とを具備し、差動信号線路８の線路方向における貫通導体７の配列間隔が、差動信号線路８で伝送される高周波信号の波長の４分の１以下であり、下面接地導体層６は、差動信号線路８の各信号線路３，４の直下の部位に島状の非形成部９が線路方向に直交する方向に対を成して形成されるとともに、対を成す非形成部９が線路方向に複数対形成されている。これにより、差動信号線路８と同一面接地導体層５と下面接地導体層６とでコプレーナ線路を構成している。   The high-frequency substrate 1 of the present invention includes a differential signal line 8 formed of two parallel signal lines 3 and 4 formed on the upper surface of a dielectric substrate 2, and the same surface contact formed on both sides of the differential signal line 8. The ground conductor layer 5, the lower surface ground conductor layer 6 formed on the entire lower surface of the dielectric substrate 2, the same surface ground conductor layer 5 and the lower surface ground conductor layer 6 are electrically connected, and the differential signal line 8 A plurality of through conductors 7 formed in rows in parallel to the line direction, and the arrangement interval of the through conductors 7 in the line direction of the differential signal line 8 is a high frequency transmitted by the differential signal line 8 The lower-surface ground conductor layer 6 is a direction in which the island-shaped non-formed portion 9 is orthogonal to the line direction at a portion immediately below each signal line 3, 4 of the differential signal line 8. Are formed in pairs, and a plurality of pairs of non-forming portions 9 are formed in the line direction. There. As a result, the differential signal line 8 and the same-surface ground conductor layer 5 and the lower surface ground conductor layer 6 constitute a coplanar line.

そして、差動信号線路８の線路方向における貫通導体７の配列間隔が差動信号線路８で伝送される高周波信号の波長λの４分の１以下であることにより、差動信号線路８間に擬似的な導体壁が形成されたことになり、隣接し合う差動信号線路８間の容量結合が低減できる。その結果、隣接し合う差動信号線路８間のクロストークノイズが低減される。   And since the arrangement | positioning space | interval of the penetration conductor 7 in the line direction of the differential signal track | line 8 is below 1/4 of wavelength (lambda) of the high frequency signal transmitted with the differential signal track | line 8, A pseudo conductor wall is formed, and the capacitive coupling between the adjacent differential signal lines 8 can be reduced. As a result, crosstalk noise between the adjacent differential signal lines 8 is reduced.

また、本発明の高周波基板１は好ましくは、複数の貫通導体７は、線路方向に直交する方向に列を成して形成されており、対を成す非形成部９は、線路方向に直交する方向に列を成す貫通導体７同士の間に形成されている。これにより、貫通導体７と信号線路３，４との間の不要なキャパシタンス成分による特性インピーダンスの低下分を、下面接地導体層６の島状の非形成部９とその直上の信号線路３，４間のキャパシタンス成分の減少による特性インピーダンスの上昇分で相殺ことができる。その結果、特性インピーダンスの不整合による信号の劣化が少なく、良好な高周波特性を得ることができる。またこの場合、非形成部９により差動信号線路８の容量が減少する部分と貫通導体７により差動信号線路８の容量が増加する部分が一致するため、効果的に容量の増加分を相殺することができ、上記相殺の効果がより効果的に発揮される。   In the high-frequency substrate 1 of the present invention, preferably, the plurality of through conductors 7 are formed in a row in a direction orthogonal to the line direction, and the non-forming portions 9 forming a pair are orthogonal to the line direction. It is formed between the through conductors 7 forming a row in the direction. As a result, the decrease in characteristic impedance due to an unnecessary capacitance component between the through conductor 7 and the signal lines 3 and 4 is reduced to the island-shaped non-formed portion 9 of the lower ground conductor layer 6 and the signal lines 3 and 4 immediately above it. It can be offset by the increase in characteristic impedance due to a decrease in capacitance component between them. As a result, there is little signal degradation due to characteristic impedance mismatch, and good high frequency characteristics can be obtained. In this case, the portion where the capacitance of the differential signal line 8 decreases due to the non-forming portion 9 and the portion where the capacitance of the differential signal line 8 increases due to the through conductor 7 coincide with each other. And the offset effect is more effectively exhibited.

さらに、第１の信号線路３と第２の信号線路４との間の間隔は、高周波信号の波長λの４分の１以下になっており、第１の信号線路３と第２の信号線路４とが電磁的に結合して差動信号線路８として機能することとなる。   Further, the distance between the first signal line 3 and the second signal line 4 is equal to or less than a quarter of the wavelength λ of the high-frequency signal, and the first signal line 3 and the second signal line 4 and electromagnetically couple to function as the differential signal line 8.

また、差動信号線路８を挟んで形成される左右の同一面接地導体層５と下面接地導体層６とを接続する左右の貫通導体７間の距離は、高周波信号の波長λ以下が好ましい。この場合、第１の信号線路３と第２の信号線路４との電界のカップリングがさらに強くなり、コプレーナ線路構造とされた差動信号線路８においてさらに良好な高周波信号の伝送特性が実現される。   The distance between the left and right through conductors 7 connecting the left and right same-surface ground conductor layers 5 and the lower surface ground conductor layer 6 formed with the differential signal line 8 interposed therebetween is preferably equal to or less than the wavelength λ of the high-frequency signal. In this case, the electric field coupling between the first signal line 3 and the second signal line 4 is further strengthened, and better transmission characteristics of high-frequency signals are realized in the differential signal line 8 having a coplanar line structure. The

本発明の高周波基板１における誘電体基板２の材料としては、アルミナ（Ａｌ２Ｏ３）セラミックスやムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）セラミックス等のセラミックス，ガラスセラミックス等の無機材料、四フッ化エチレン樹脂（ポリテトラフルオロエチレン；ＰＴＦＥ），四フッ化エチレン−エチレン共重合樹脂（テトラフルオロエチレン−エチレン共重合樹脂；ＥＴＦＥ），四フッ化エチレン−パーフルオロアルコキシエチレン共重合樹脂（テトラフルオロエチレン−パーフルオロアルキルビニルエーテル共重合樹脂；ＰＦＡ）等のフッ素樹脂，ガラスエポキシ樹脂，ポリフェニレンエーテル樹脂，液晶ポリエステル，ポリイミド等の樹脂材料などが用いられる。また、誘電体基板２の形状、寸法（厚み、幅、長さ）は、高周波信号の周波数や特性インピーダンスなどに応じて適宜設定される。 Examples of the material of the dielectric substrate 2 in the high-frequency substrate 1 of the present invention include ceramics such as alumina (Al 2 O 3 ) ceramics and mullite (3Al 2 O 3 · 2SiO 2 ) ceramics, inorganic materials such as glass ceramics, and tetrafluoride. Ethylene resin (polytetrafluoroethylene; PTFE), tetrafluoroethylene-ethylene copolymer resin (tetrafluoroethylene-ethylene copolymer resin; ETFE), tetrafluoroethylene-perfluoroalkoxyethylene copolymer resin (tetrafluoroethylene- A fluorocarbon resin such as perfluoroalkyl vinyl ether copolymer resin (PFA), a resin material such as glass epoxy resin, polyphenylene ether resin, liquid crystal polyester, and polyimide is used. The shape and dimensions (thickness, width, length) of the dielectric substrate 2 are appropriately set according to the frequency of the high-frequency signal, the characteristic impedance, and the like.

本発明の第１の信号線路３、第２の信号線路４は、高周波信号伝送用として適した金属の導体層から成り、例えばＣｕ層、Ｍｏ−Ｍｎ層、Ｗ層、Ｍｏ−Ｍｎメタライズ層上にＮｉメッキ層およびＡｕメッキ層を被着させたもの、Ｗメタライズ層上にＮｉメッキ層およびＡｕメッキ層を被着させたもの、Ｃｒ−Ｃｕ合金層、Ｃｒ−Ｃｕ合金層上にＮｉメッキ層およびＡｕメッキ層を被着させたもの、Ｔａ２Ｎ層上にＮｉ−Ｃｒ合金層およびＡｕメッキ層を被着させたもの、Ｔｉ層上にＰｔ層およびＡｕメッキ層を被着させたもの、またはＮｉ−Ｃｒ合金層上にＰｔ層およびＡｕメッキ層を被着させたものから成り、厚膜印刷法あるいは各種の薄膜形成法やメッキ処理法などにより形成される。その厚みや幅も伝送される高周波信号の周波数や特性インピーダンスなどに応じて設定される。 The first signal line 3 and the second signal line 4 of the present invention are made of a metal conductor layer suitable for high-frequency signal transmission, for example, on a Cu layer, a Mo—Mn layer, a W layer, or a Mo—Mn metallized layer. With Ni plating layer and Au plating layer deposited thereon, with Ni plating layer and Au plating layer deposited on W metallized layer, Cr-Cu alloy layer, Ni plating layer on Cr-Cu alloy layer And an Au plated layer deposited, a Ni—Cr alloy layer and an Au plated layer deposited on a Ta 2 N layer, a Pt layer and an Au plated layer deposited on a Ti layer, Or it consists of what deposited Pt layer and Au plating layer on the Ni-Cr alloy layer, and is formed by the thick film printing method or various thin film formation methods, plating methods, etc. The thickness and width are also set according to the frequency and characteristic impedance of the transmitted high frequency signal.

また、同一面接地導体層５、下面接地導体層６は、第１の信号線路３や第２の信号線路４等と同様の材料で同様の方法により形成すればよく、差動信号線路８と同一面接地導体層５との間隔、差動信号線路８と下面接地導体層６との間隔は、高周波信号の周波数や差動信号線路８の特性インピーダンスなどに応じて適宜設定される。   The same-surface ground conductor layer 5 and the lower-surface ground conductor layer 6 may be formed of the same material as the first signal line 3 and the second signal line 4 by the same method. The distance between the same-surface ground conductor layer 5 and the distance between the differential signal line 8 and the lower surface ground conductor layer 6 are appropriately set according to the frequency of the high-frequency signal, the characteristic impedance of the differential signal line 8, and the like.

また、同一面接地導体層５と下面接地導体層６とを電気的に接続する複数の貫通導体７は、スルーホール導体やビアホール導体から成り、または金属板、金属棒、金属パイプ等を埋設することにより設けられる。   The plurality of through conductors 7 that electrically connect the same-surface ground conductor layer 5 and the lower-surface ground conductor layer 6 are made of through-hole conductors or via-hole conductors, or embed metal plates, metal bars, metal pipes, or the like. Is provided.

本発明の高周波基板１の作製は以下のように行なう。誘電体基板２がアルミナセラミックスからなる場合、まず誘電体基板２となるアルミナセラミックスのグリーンシートを準備し、これに所定の打ち抜き加工を施して貫通導体７となる貫通孔を形成する。その後、スクリーン印刷法によりＷやＭｏなどの導体ペーストを貫通孔に充填するとともに、第１の信号線路３や第２の信号線路４等となる導体パターンおよびその他の導体層となる導体パターンを印刷塗布する。次に、１６００℃で焼成を行い、最後に各導体層上にＮｉメッキおよびＡｕメッキを施すとよい。   The high frequency substrate 1 of the present invention is manufactured as follows. When the dielectric substrate 2 is made of alumina ceramic, first, an alumina ceramic green sheet to be the dielectric substrate 2 is prepared, and a predetermined punching process is performed thereon to form a through hole to be the through conductor 7. After that, a conductive paste such as W or Mo is filled in the through-holes by screen printing, and a conductor pattern that becomes the first signal line 3 or the second signal line 4 and a conductor pattern that becomes another conductor layer are printed. Apply. Next, baking is performed at 1600 ° C., and finally, Ni plating and Au plating may be performed on each conductor layer.

誘電体基板２の誘電体層間に差動信号線路８および同一面接地導体層５が形成される場合、誘電体基板２の上下主面に上下面導体層を形成し、貫通導体７にて同一面接地導体層５と下面接地導体層６とを電気的に接続する構造が好ましい。   When the differential signal line 8 and the same-surface ground conductor layer 5 are formed between the dielectric layers of the dielectric substrate 2, the upper and lower surface conductor layers are formed on the upper and lower main surfaces of the dielectric substrate 2, and the through conductor 7 is the same. A structure in which the surface ground conductor layer 5 and the lower surface ground conductor layer 6 are electrically connected is preferable.

なお、本発明は上記の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を行なっても何等差し支えない。例えば、下面接地導体層６に形成される島状の非形成部９は、矩形状、円形状の形状に限らず、台形状、三角形状、楕円形状等の形状であってもよい。   Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention. For example, the island-shaped non-forming portion 9 formed in the lower surface ground conductor layer 6 is not limited to a rectangular shape or a circular shape, but may be a trapezoidal shape, a triangular shape, an elliptical shape, or the like.

また、島状の非形成部９の線路方向における長さは、貫通導体７の幅（直径）と同じか、または図２に示すように貫通導体７の幅よりも小さいことが好ましい。この場合、貫通導体７と信号線路３，４との間に発生するキャパシタンス成分の増加を下面接地導体層６と信号線路３，４との間のキャパシタンス成分の減少でより確実にキャンセリングさせることができる。   Moreover, it is preferable that the length of the island-shaped non-forming portion 9 in the line direction is the same as the width (diameter) of the through conductor 7 or smaller than the width of the through conductor 7 as shown in FIG. In this case, the increase in the capacitance component generated between the through conductor 7 and the signal lines 3 and 4 can be canceled more reliably by the decrease in the capacitance component between the lower ground conductor layer 6 and the signal lines 3 and 4. Can do.

（ａ）〜（ｄ）は、本発明の高周波用配線基板についての実施の形態の一例を示す平面図および断面図であり、（ａ）は差動信号線路および同一面接地導体層を示す平面図、（ｂ）は下面接地導体層を示す平面図、（ｃ）は（ａ）のＡ−Ａ’線における断面図、（ｄ）は（ａ）のＢ−Ｂ’線における断面図である。(A)-(d) is the top view and sectional drawing which show an example of embodiment about the high frequency wiring board of this invention, (a) is a plane which shows a differential signal track | line and a coplanar grounding conductor layer FIG. 4B is a plan view showing the lower surface ground conductor layer, FIG. 4C is a cross-sectional view taken along the line AA ′ in FIG. 4A, and FIG. 4D is a cross-sectional view taken along the line BB ′ in FIG. . 本発明の高周波用配線基板について実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment about the wiring board for high frequencies of this invention.

符号の説明Explanation of symbols

１：高周波用配線基板
２：誘電体基板
３：第１の信号線路
４：第２の信号線路
５：同一面接地導体層
６：下面接地導体層
７：貫通導体
８：差動信号線路
９：島状の非形成部 1: High-frequency wiring board 2: Dielectric substrate 3: First signal line 4: Second signal line 5: Coplanar ground conductor layer 6: Bottom ground conductor layer 7: Through conductor 8: Differential signal line 9: Island-shaped non-formation part

Claims (4)

複数の誘電体層を積層してなる誘電体基板の上面または前記誘電体層の層間に互いに平行に形成された一対の信号線路から成る差動信号線路と、該差動信号線路の両側に所定間隔をもって形成された同一面接地導体層と、前記誘電体基板の下面の全面に形成された下面接地導体層と、前記同一面接地導体層および前記下面接地導体層を電気的に接続するとともに前記差動信号線路の両側に線路方向と平行に列を成して形成された複数の貫通導体とを具備しており、前記複数の貫通導体は、前記線路方向における配列間隔が前記差動信号線路で伝送される高周波信号の波長の４分の１以下であり、前記下面接地導体層は、前記差動信号線路の前記各信号線路の直下の部位に島状の非形成部が前記線路方向に直交する方向に対を成して形成されるとともに、前記対を成す非形成部が前記線路方向に複数対形成されていることを特徴とする高周波用配線基板。 A differential signal line composed of a pair of signal lines formed in parallel with each other between the upper surface of the dielectric substrate formed by laminating a plurality of dielectric layers or between the layers of the dielectric layers, and predetermined on both sides of the differential signal line The same-surface ground conductor layer formed at intervals, the lower-surface ground conductor layer formed on the entire lower surface of the dielectric substrate, and the same-surface ground conductor layer and the lower-surface ground conductor layer are electrically connected and A plurality of through conductors formed in rows on both sides of the differential signal line in parallel with the line direction, and the plurality of through conductors have an arrangement interval in the line direction of the differential signal line. The lower-surface ground conductor layer has an island-shaped non-formed portion in a portion immediately below each signal line of the differential signal line in the line direction. Formed in pairs in orthogonal directions Both high frequency wiring board-free portion said pair is characterized in that it is a plurality of pairs formed in the line direction. 前記複数の貫通導体は、前記線路方向に直交する方向に列を成して形成されており、前記対を成す非形成部は、前記線路方向に直交する方向に列を成す前記貫通導体同士の間に形成されていることを特徴とする請求項１記載の高周波用配線基板。 The plurality of through conductors are formed in a row in a direction orthogonal to the line direction, and the non-forming portions forming the pair are formed between the through conductors in a row in a direction orthogonal to the line direction. The high-frequency wiring board according to claim 1, wherein the high-frequency wiring board is formed therebetween. 前記非形成部は円形状であることを特徴とする請求項１または請求項２記載の高周波用配線基板。 The high-frequency wiring board according to claim 1, wherein the non-forming portion is circular. 前記差動信号線路は、複数のものが平行に形成されていることを特徴とする請求項１乃至請求項３のいずれかに記載の高周波用配線基板。 The high-frequency wiring board according to claim 1, wherein a plurality of the differential signal lines are formed in parallel.
JP2004221187A 2004-07-29 2004-07-29 High frequency wiring board Pending JP2006042098A (en)

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JP2012256853A (en) * 2011-05-18 2012-12-27 Japan Oclaro Inc Array type light receiving device, optical receiving module, and optical transceiver
JP2014194948A (en) * 2012-07-30 2014-10-09 Murata Mfg Co Ltd Flat cable
JP2015199330A (en) * 2014-04-08 2015-11-12 佳勝科技股▲ふん▼有限公司 composite substrate
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JP2020021876A (en) * 2018-08-02 2020-02-06 日本ルメンタム株式会社 Printed circuit board, optical module and light transmission device

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JP2003224408A (en) * 2002-01-30 2003-08-08 Kyocera Corp High-frequency wiring board
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US20020084876A1 (en) * 2000-12-29 2002-07-04 Wright Mitchel E. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP2003224408A (en) * 2002-01-30 2003-08-08 Kyocera Corp High-frequency wiring board
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755516B1 (en) 2006-06-27 2007-09-05 성균관대학교산학협력단 Differential line for signal integrity and method for fabricating the same
KR100844218B1 (en) 2006-12-13 2008-07-04 이해영 High-Frequency Transmission Line for filtering Common Mode
US8049111B2 (en) 2008-06-20 2011-11-01 Nitto Denko Corporation Printed circuit board and method of manufacturing the same
JP2010050253A (en) * 2008-08-21 2010-03-04 Toshiba Corp High-frequency wave substrate
JP2012256853A (en) * 2011-05-18 2012-12-27 Japan Oclaro Inc Array type light receiving device, optical receiving module, and optical transceiver
JP2014194948A (en) * 2012-07-30 2014-10-09 Murata Mfg Co Ltd Flat cable
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JP2015199330A (en) * 2014-04-08 2015-11-12 佳勝科技股▲ふん▼有限公司 composite substrate
WO2015178313A1 (en) * 2014-05-21 2015-11-26 株式会社フジクラ Printed wiring board
US9807870B2 (en) 2014-05-21 2017-10-31 Fujikura Ltd. Printed wiring board
JP2020021876A (en) * 2018-08-02 2020-02-06 日本ルメンタム株式会社 Printed circuit board, optical module and light transmission device

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