JP2006041925A - Package for housing piezoelectric resonator, and piezoelectric device - Google Patents

Package for housing piezoelectric resonator, and piezoelectric device Download PDF

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JP2006041925A
JP2006041925A JP2004218906A JP2004218906A JP2006041925A JP 2006041925 A JP2006041925 A JP 2006041925A JP 2004218906 A JP2004218906 A JP 2004218906A JP 2004218906 A JP2004218906 A JP 2004218906A JP 2006041925 A JP2006041925 A JP 2006041925A
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piezoelectric
semiconductor element
recesses
insulating base
vibrator
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JP4587727B2 (en
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Harumi Takeoka
治己 竹岡
Akira Akaeda
公 赤枝
Hitoshi Shirasawa
仁 白澤
Yoshio Saito
嘉雄 齋藤
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Kyocera Corp
Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Oscillators With Electromechanical Resonators (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for housing a piezoelectric resonator which can be miniaturized even if the piezoelectric resonator is housed together with the other electronic component such as a semiconductor element, is excellent in characteristics such as oscillation frequency characteristics of the piezoelectric resonator, and is excellent in the reliability of electric connection to an external electric circuit etc, and to provide a piezoelectric device. <P>SOLUTION: The apparatus is provided with an insulating base 1 having three recesses formed on its top surface, a frame 10 formed around the entire periphery of the three recesses 5 on the top surface of the insulating base 1, a wiring conductor 6 formed from the inside of the frame 10 toward the external surface of the insulating base 1, and a lid 7 attached on the top surface of the insulating base 1 so as to close the three recesses 5. Piezoelectric resonators 2, 3 are housed in the two out of the three recesses 5, respectively, and an electronic component 4 is housed in the other one, and a semiconductor element 8 is mounted on the top surface of the lid 7. Also, the electronic component 4 is housed, and the semiconductor element 8 is mounted on the top surface of the lid 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、水晶振動子等の圧電振動子を絶縁基体の内部に収容する圧電振動子収納用パッケージおよび圧電装置に関するものであり、特に、圧電振動子を、半導体素子等の他の電子部品とともに気密に収容する圧電振動子収納用パッケージおよびその圧電振動子収納用パッケージを用いた圧電装置に関するものである。   The present invention relates to a piezoelectric vibrator housing package and a piezoelectric device that house a piezoelectric vibrator such as a crystal vibrator inside an insulating base, and in particular, the piezoelectric vibrator together with other electronic components such as a semiconductor element. The present invention relates to a piezoelectric vibrator housing package for hermetically housing and a piezoelectric device using the piezoelectric vibrator housing package.

携帯電話や自動車電話等の通信機器、コンピュータ、ＩＣカード等の情報機器等の電子機器において、周波数や時間の基準となる発振器として、水晶振動子等の圧電振動子を圧電振動子収納用パッケージ（以下、単にパッケージともいう）内に気密に収納して成る圧電装置が広く使用されている。   In an electronic device such as a communication device such as a mobile phone or a car phone, or an information device such as a computer or an IC card, a piezoelectric vibrator such as a crystal vibrator is used as a reference for frequency and time. Hereinafter, piezoelectric devices that are hermetically housed in a package) are also widely used.

このような圧電装置として、近年、圧電振動子としてＡＴカット型水晶振動子と音叉型水晶振動子とを１つのパッケージ内に収納するとともに、そのパッケージに、発振回路を有する半導体素子等の制御用の電子部品を搭載し収納した構造の、複数の発振源を有する圧電装置、いわゆるデュアルクロックモジュールタイプの圧電装置が提案されている。   As such a piezoelectric device, in recent years, an AT-cut crystal resonator and a tuning-fork crystal resonator are housed in one package as a piezoelectric resonator, and the package is used for controlling a semiconductor element or the like having an oscillation circuit. There has been proposed a piezoelectric device having a plurality of oscillation sources, that is, a so-called dual clock module type piezoelectric device having a structure in which the electronic components are mounted and housed.

なお、ＡＴカット型水晶振動子は例えばＭＨz帯でメインクロック用の発振源として機能し、また音叉型水晶振動子は例えばｋＨｚ帯でサブクロック用（例えば待機動作用等）として機能する。   Note that the AT-cut crystal resonator functions as an oscillation source for a main clock in, for example, the MHz band, and the tuning fork crystal resonator functions as a sub-clock (for example, for standby operation) in, for example, the kHz band.

図３（ａ）は、従来の圧電装置の構成を概略的に示した平面図であり、図３（ｂ）は、その断面図である。同図において、５１は基板、５２は圧電振動子の発振周波数を制御するための発振回路を有する半導体素子、５３は圧電振動子としてのＡＴカット型水晶振動子、５４は圧電振動子としての音叉型水晶振動子である。発振回路を有する半導体素子５２は、基板５１上に導電性接着剤により固定され、さらにボンディングワイヤ５６等の電気的接続手段により接続用パッド５７に電気的に接続され、基板５１の外周部下面に配置された入出力用端子６０と電気的に接続されている。   FIG. 3A is a plan view schematically showing the configuration of a conventional piezoelectric device, and FIG. 3B is a cross-sectional view thereof. In the figure, 51 is a substrate, 52 is a semiconductor element having an oscillation circuit for controlling the oscillation frequency of the piezoelectric vibrator, 53 is an AT-cut crystal vibrator as a piezoelectric vibrator, and 54 is a tuning fork as a piezoelectric vibrator. Type crystal resonator. The semiconductor element 52 having an oscillation circuit is fixed on the substrate 51 with a conductive adhesive, and is further electrically connected to the connection pad 57 by an electrical connection means such as a bonding wire 56, and is formed on the lower surface of the outer peripheral portion of the substrate 51. The input / output terminal 60 is electrically connected.

また、所定周波数で発振するＡＴカット型水晶振動子５３および音叉型水晶振動子５４は、基板５１の上面に形成された凹部５５内の搭載部にそれぞれ接合され、基体５１の上面に凹部５５を取り囲むように形成された封止用メタライズ層５８に蓋体６２等を半田等のロウ材で接合することによりＡＴカット型水晶振動子５３および音叉型水晶振動子５４が気密に封止され、圧電装置が構成されている。   Further, the AT-cut crystal resonator 53 and the tuning-fork crystal resonator 54 that oscillate at a predetermined frequency are respectively joined to the mounting portion in the recess 55 formed on the upper surface of the substrate 51, and the recess 55 is formed on the upper surface of the base 51. The AT-cut crystal unit 53 and the tuning-fork type crystal unit 54 are hermetically sealed by bonding the lid 62 and the like to the sealing metallization layer 58 formed so as to be surrounded by a brazing material such as solder. The device is configured.

このような圧電装置は、例えば、携帯電話等の電子機器を構成する外部回路基板６１の所定位置に入出力用端子６０を半田等を介して接続することにより実装され、メインクロック用の発振源であるＡＴカット型水晶振動子５３から電子機器の電気回路に通信周波数等の基準信号が送信される。また、電子機器の主電源を切断したときにはサブクロック用（待機動作用）の音叉型水晶振動子５４が作動し続け、例えば計時やタイマーを継続する等の機能をなす。   Such a piezoelectric device is mounted, for example, by connecting an input / output terminal 60 to a predetermined position of an external circuit board 61 that constitutes an electronic device such as a mobile phone via solder or the like, and an oscillation source for a main clock. A reference signal such as a communication frequency is transmitted from the AT-cut crystal unit 53 to the electric circuit of the electronic device. Further, when the main power supply of the electronic device is turned off, the sub-clock (standby operation) tuning-fork type crystal resonator 54 continues to operate, and functions such as, for example, keeping time and timer.

なお、５９は、圧電振動子５３，５４や半導体素子５２とともに発振回路を形成する容量素子やインダクタ素子等の電子部品である。
特開平６−２３２６３１号公報 Reference numeral 59 denotes an electronic component such as a capacitive element or an inductor element that forms an oscillation circuit together with the piezoelectric vibrators 53 and 54 and the semiconductor element 52.
Japanese Patent Laid-Open No. 6-232631

しかしながら、このように１つのパッケージに複数の圧電振動子５３，５４と、半導体素子５２等の他の電子部品５９とを搭載し、収納した場合、それらの実装面積が大きくなるためにパッケージの外形が大きくなり、情報通信機器の小型化が困難であるという問題点があった。   However, when a plurality of piezoelectric vibrators 53 and 54 and another electronic component 59 such as the semiconductor element 52 are mounted and housed in one package in this way, the package mounting area increases, so that the outer shape of the package is increased. However, there is a problem that it is difficult to reduce the size of the information communication device.

また、圧電装置の凹部５５に収容するＡＴカット型水晶振動子５３と音叉型水晶振動子５４等の圧電振動子は、長期間の使用において安定した特定周波数の発振のために、凹部５５内に真空封止されることが一般的であり、基板５１上の半導体素子５２の搭載部以外に圧電振動子５３，５４を気密封止するための封止用メタライズ層５８を設けなければならず、それらの実装面積が大きくなるためパッケージの外形がさらに大きくなり、情報通信機器の小型化が困難であるという問題点があった。   Further, the piezoelectric vibrators such as the AT-cut type crystal vibrator 53 and the tuning-fork type crystal vibrator 54 accommodated in the concave portion 55 of the piezoelectric device are placed in the concave portion 55 for stable oscillation at a specific frequency during long-term use. Generally, it is vacuum-sealed, and a sealing metallization layer 58 for hermetically sealing the piezoelectric vibrators 53 and 54 must be provided in addition to the mounting portion of the semiconductor element 52 on the substrate 51. Since their mounting area is increased, the outer shape of the package is further increased, which makes it difficult to reduce the size of the information communication device.

特に、上記デュアルクロックモジュールタイプの圧電装置のように、基板５１にＡＴカット型水晶振動子５３および音叉型水晶振動子５４を同時に搭載すると、圧電装置として非常に大きなものとなる。   In particular, when the AT cut type crystal resonator 53 and the tuning fork type crystal resonator 54 are simultaneously mounted on the substrate 51 as in the dual clock module type piezoelectric device, the piezoelectric device becomes very large.

また、基板５１に半導体素子５２、ＡＴカット型水晶振動子５３や音叉型水晶振動子５４等の圧電振動子、および電子部品５９を同時に搭載し、収容する場合、圧電振動子においては、例えばＡＴカット型水晶振動子５３はＭＨz帯の高い周波数で機能し、音叉型水晶振動子５４は、例えばｋＨｚ帯の比較的低い周波数で機能することになり、凹部５５内に収容されて隣り合う箇所に搭載された圧電振動子５３，５４のそれぞれに発生する電磁波が圧電振動子５３，５４の発振周波数特性に悪影響を与えるという問題点があった。   In addition, when the semiconductor element 52, the piezoelectric vibrator such as the AT-cut type crystal vibrator 53 and the tuning fork type crystal vibrator 54, and the electronic component 59 are simultaneously mounted and accommodated on the substrate 51, the piezoelectric vibrator includes, for example, an AT. The cut crystal unit 53 functions at a high frequency in the MHz band, and the tuning fork type crystal unit 54 functions at a relatively low frequency in, for example, the kHz band. There is a problem in that electromagnetic waves generated in the mounted piezoelectric vibrators 53 and 54 adversely affect the oscillation frequency characteristics of the piezoelectric vibrators 53 and 54, respectively.

また、半導体素子５２や容量素子、インダクタ素子等の電子部品５９においても、凹部５５内に収容された圧電振動子５３，５４とともに発振回路を形成することになり、それぞれの電子部品で発生する電磁波が圧電振動子５３，５４の発振周波数特性に悪影響を与えるという問題点があった。   Further, in the electronic component 59 such as the semiconductor element 52, the capacitive element, and the inductor element, an oscillation circuit is formed together with the piezoelectric vibrators 53 and 54 accommodated in the recess 55, and electromagnetic waves generated in the respective electronic components are formed. However, there is a problem that the oscillation frequency characteristics of the piezoelectric vibrators 53 and 54 are adversely affected.

また、圧電装置の基板５１の外周部下面に配置された入出力用端子６０が接続される外部回路基板６１は、一般に、その材質がガラスエポキシ等からなる樹脂製であり、基板５１の材質として多用されるセラミックス（アルミナセラミックス等）とは熱膨張係数が異なることから、基板５１の外形寸法が大きくなるに伴って接続後の温度サイクルによって基板５１の下面の外周部に配置された入出力用端子６０と、外部回路基板６１の主面に形成された接続パッドとの間に熱応力が生じ易くなり、この熱応力により入出力用端子６０の接続部分において、半田クラックや断線等の不具合が発生するという問題点があった。   Further, the external circuit board 61 to which the input / output terminal 60 disposed on the lower surface of the outer peripheral portion of the substrate 51 of the piezoelectric device is connected is generally made of a resin made of glass epoxy or the like. Since the coefficient of thermal expansion is different from that of ceramics (alumina ceramics, etc.) frequently used, the input / output is arranged on the outer peripheral portion of the lower surface of the substrate 51 by the temperature cycle after connection as the outer dimension of the substrate 51 becomes larger. Thermal stress is likely to occur between the terminal 60 and the connection pad formed on the main surface of the external circuit board 61, and this thermal stress causes problems such as solder cracks and disconnection at the connection portion of the input / output terminal 60. There was a problem that it occurred.

本発明は、かかる従来の技術の問題点に鑑み案出されたものであり、その目的は、圧電振動子を半導体素子等の他の電子部品とともに収容しても小型化が可能であり、かつ圧電振動子の発振周波数特性等の特性に優れるとともに、外部の電気回路等に対する電気的な接続の信頼性に優れた圧電振動子収納用パッケージおよび圧電装置を提供することにある。   The present invention has been devised in view of the problems of the prior art, and the object thereof is to enable downsizing even if the piezoelectric vibrator is housed together with other electronic components such as a semiconductor element, and An object of the present invention is to provide a piezoelectric vibrator housing package and a piezoelectric device that are excellent in characteristics such as an oscillation frequency characteristic of a piezoelectric vibrator and that are excellent in reliability of electrical connection to an external electric circuit or the like.

本発明の圧電振動子収納用パッケージは、上面に３つの凹部が形成された絶縁基体と、該絶縁基体の上面の前記３つの凹部の周囲に全周にわたって形成された枠部と、前記枠部の内側から前記絶縁基体の外表面にかけて形成された配線導体と、前記絶縁基体の上面に前記３つの凹部を塞ぐように取着される蓋体とを具備しており、前記３つの凹部のうちの２つにそれぞれ圧電振動子が収容されるとともに他の１つに電子部品が収容され、前記蓋体の上面に半導体素子が搭載されることを特徴とするものである。   The piezoelectric vibrator housing package according to the present invention includes an insulating base having three recesses formed on the upper surface, a frame formed around the three recesses on the upper surface of the insulating base, and the frame. A wiring conductor formed from the inner side of the insulating base to the outer surface of the insulating base, and a lid attached to the top surface of the insulating base so as to close the three concaves. The piezoelectric vibrator is accommodated in each of the two, the electronic component is accommodated in the other, and a semiconductor element is mounted on the upper surface of the lid.

本発明の圧電振動子収納用パッケージにおいて、好ましくは、３つの前記凹部は列状に並んで形成されており、両端に位置する前記凹部にそれぞれ前記圧電振動子が収容され、中央に位置する前記凹部に前記電子部品が収容されることを特徴とするものである。   In the piezoelectric vibrator housing package according to the present invention, preferably, the three concave portions are formed in a line, and the piezoelectric vibrators are housed in the concave portions located at both ends, respectively, and the central portion is located in the central portion. The electronic component is accommodated in the recess.

本発明の圧電振動子収納用パッケージにおいて、好ましくは、前記圧電振動子は、一方がＡＴカット型水晶振動子であり、他方が音叉型水晶振動子あることを特徴とするものである。   In the piezoelectric vibrator housing package of the present invention, it is preferable that one of the piezoelectric vibrators is an AT cut type crystal vibrator and the other is a tuning fork type crystal vibrator.

本発明の圧電装置は、上記本発明の圧電振動子収納用パッケージと、前記凹部内に収納されるとともに電極が前記配線導体に電気的に接続された前記圧電振動子と、前記凹部内に収納されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記蓋体の上面に搭載されるとともに電極が前記配線導体に電気的に接続された前記半導体素子とを具備していることを特徴とするものである。   The piezoelectric device of the present invention includes the above-described piezoelectric vibrator housing package of the present invention, the piezoelectric vibrator housed in the recess and having an electrode electrically connected to the wiring conductor, and housed in the recess. The electronic component having an electrode electrically connected to the wiring conductor, and the semiconductor element mounted on the upper surface of the lid and having the electrode electrically connected to the wiring conductor. It is characterized by being.

本発明の圧電振動子収納用パッケージによれば、上面に３つの凹部が形成された絶縁基体と、絶縁基体の上面の前記３つの凹部の周囲に全周にわたって形成された枠部と、枠部の内側から絶縁基体の外表面にかけて形成された配線導体と、絶縁基体の上面に前記３つの凹部を塞ぐように取着される蓋体とを具備しており、３つの凹部のうちの２つにそれぞれ圧電振動子が収容されるとともに他の１つに電子部品が収容され、蓋体の上面に半導体素子が搭載されることから、圧電振動子と半導体素子とを、一定の間隔をおいて上下に並べて収容することができるので、例えば、半導体素子を搭載するのに最小限必要な絶縁基体の平面面積で、半導体素子だけでなく圧電振動子および電子部品も上下に配置して収容することができ、圧電振動子収納用パッケージを小型化することができる。   According to the piezoelectric vibrator housing package of the present invention, the insulating base having three recesses formed on the upper surface, the frame formed around the three recesses on the upper surface of the insulating base, and the frame A wiring conductor formed from the inside of the insulating base to the outer surface of the insulating base, and a lid attached to the top face of the insulating base so as to close the three concaves, and two of the three concaves Since each of the piezoelectric vibrators is housed and an electronic component is housed in the other one and a semiconductor element is mounted on the upper surface of the lid, the piezoelectric vibrator and the semiconductor element are spaced apart from each other by a certain distance. Since it can be accommodated side by side, for example, it is necessary to arrange not only the semiconductor element but also the piezoelectric vibrator and the electronic component up and down in the plane area of the insulating base necessary for mounting the semiconductor element. Can be obtained The use package can be reduced in size.

また、絶縁基体の平面面積が小さくなるため、外部回路基板に圧電振動子収納用パッケージを接続した際に、外部回路基板と絶縁基体との間で熱応力が生じたとしても、実装領域面積が小さいので外部回路基板の寸法変化による応力を低減することができ、圧電振動子収納用パッケージと外部回路基板との接続部に半田クラックや断線等の不具合が生じるのを効果的に防止して外部回路基板に対する接続を長期にわたって良好に維持することができる。   In addition, since the planar area of the insulating base is reduced, even when a thermal stress is generated between the external circuit board and the insulating base when the piezoelectric vibrator housing package is connected to the external circuit board, the mounting area is small. Because it is small, it can reduce the stress due to the dimensional change of the external circuit board, effectively preventing the occurrence of defects such as solder cracks and disconnection at the connection part between the piezoelectric vibrator housing package and the external circuit board. The connection to the circuit board can be maintained well over a long period of time.

さらに、圧電振動子や電子部品を収容する空間と半導体素子が搭載された空間とを蓋体によって効果的に電磁的に遮断することができ、半導体素子等で発生する電磁波が圧電振動子に与える悪影響を有効に防止し、圧電振動子の特性（例えば、圧電振動子の発振周波数特性）を良好に維持することができる。   Furthermore, the space for housing the piezoelectric vibrator and electronic components and the space on which the semiconductor element is mounted can be effectively electromagnetically blocked by the lid, and electromagnetic waves generated by the semiconductor element or the like are applied to the piezoelectric vibrator. An adverse effect can be effectively prevented, and the characteristics of the piezoelectric vibrator (for example, the oscillation frequency characteristics of the piezoelectric vibrator) can be maintained well.

また、２つの圧電振動子および電子部品が、それぞれ３つの凹部に分かれて収容され、各凹部は蓋体で塞がれているので、２つの圧電振動子および電子部品を、凹部を仕切る壁および蓋体により効果的に個別に電磁的に遮断することができ、電子部品で発生する電磁波が圧電振動子に与える悪影響や、２つの圧電振動子同士の間で互いに振動や電磁波等が干渉して影響を与え合うようなことを有効に防止し、圧電振動子の特性（例えば、圧電振動子の発振周波数特性）を良好に維持することができる。   In addition, the two piezoelectric vibrators and the electronic parts are divided and accommodated in three concave parts, respectively, and each concave part is closed with a lid, so that the two piezoelectric vibrators and the electronic parts are separated from each other by walls and The lid can effectively be electromagnetically cut off individually, and the electromagnetic waves generated by the electronic components can adversely affect the piezoelectric vibrator, and the two piezoelectric vibrators can interfere with each other. It is possible to effectively prevent such influences and maintain the characteristics of the piezoelectric vibrator (for example, the oscillation frequency characteristics of the piezoelectric vibrator) well.

また、本発明の圧電振動子収納用パッケージにおいて、好ましくは、３つの凹部は列状に並んで形成されており、両端に位置する凹部にそれぞれ圧電振動子が収容され、中央に位置する凹部に前記電子部品が収容されることから、中央の凹部の電子部品を収容する空間により、圧電振動子同士をそれぞれ間隔を大きくして隔離することができ、圧電振動子のそれぞれに発生する電磁波によりそれぞれの圧電振動子の発振周波数特性に悪影響を与えることをより効果的に防止することができる。   In the piezoelectric vibrator housing package of the present invention, preferably, the three concave portions are formed in a line, and the piezoelectric vibrators are accommodated in the concave portions located at both ends, respectively. Since the electronic parts are accommodated, the piezoelectric vibrators can be separated from each other with a large space by the space for accommodating the electronic parts in the central recess, and the electromagnetic waves generated in the piezoelectric vibrators respectively can be separated. It is possible to more effectively prevent adverse effects on the oscillation frequency characteristics of the piezoelectric vibrator.

また、本発明の圧電振動子収納用パッケージにおいて、好ましくは、前記圧電振動子は、一方がＡＴカット型水晶振動子であり、他方が音叉型水晶振動子あることから、いわゆるデュアルクロックモジュールタイプの圧電装置を小型に形成することができ、このような圧電装置が部品として使用される携帯電話等の電子機器の小型化を効果的に行なうことができる。さらに小型化により配線経路を短くすることができるため、消費電力を低減することができ、電子機器の低消費電力化を効果的に行なうことができる。   In the piezoelectric vibrator housing package of the present invention, preferably, one of the piezoelectric vibrators is an AT cut type crystal vibrator and the other is a tuning fork type crystal vibrator. The piezoelectric device can be formed in a small size, and electronic devices such as a mobile phone in which such a piezoelectric device is used as a component can be effectively downsized. Furthermore, since the wiring path can be shortened by downsizing, the power consumption can be reduced, and the power consumption of the electronic device can be effectively reduced.

また、本発明の圧電装置によれば、上記構成の圧電振動子収納用パッケージと、凹部内に収納されるとともに電極が配線導体に電気的に接続された圧電振動子と、凹部内に収納されるとともに電極が配線導体に電気的に接続された電子部品と、蓋体の上面に搭載されるとともに電極が配線導体に電気的に接続された半導体素子とを具備していることから、小型化が可能であり、かつ圧電振動子の発振周波数特性等の特性に優れるとともに、外部の電気回路等に対する電気的な接続の信頼性に優れたものとすることができる。   According to the piezoelectric device of the present invention, the piezoelectric vibrator housing package having the above-described configuration, the piezoelectric vibrator housed in the recess and the electrode electrically connected to the wiring conductor, and housed in the recess. And an electronic component in which the electrode is electrically connected to the wiring conductor and a semiconductor element mounted on the upper surface of the lid and the electrode is electrically connected to the wiring conductor. In addition, the piezoelectric vibrator can be excellent in characteristics such as the oscillation frequency characteristics, and can be excellent in reliability of electrical connection to an external electric circuit or the like.

次に、本発明の圧電振動子収納用パッケージおよび圧電装置を添付の図面を基に説明する。図１（ａ）は本発明の圧電振動子収納用パッケージおよび圧電装置の実施の形態の一例を示す平面図であり、図１（ｂ）はその断面図である。   Next, a piezoelectric vibrator housing package and a piezoelectric device according to the present invention will be described with reference to the accompanying drawings. FIG. 1A is a plan view showing an example of an embodiment of a piezoelectric vibrator housing package and a piezoelectric device according to the present invention, and FIG. 1B is a cross-sectional view thereof.

図１（ａ），（ｂ）において、１は絶縁基体、２は圧電振動子としてのＡＴカット型水晶振動子、３は圧電振動子としての音叉型水晶振動子、４は電子部品、１０は枠部、６は枠部の内側から絶縁基体１の外表面にかけて形成された配線導体、７は蓋体、８は半導体素子である。   1 (a) and 1 (b), 1 is an insulating substrate, 2 is an AT-cut crystal resonator as a piezoelectric resonator, 3 is a tuning fork crystal resonator as a piezoelectric resonator, 4 is an electronic component, A frame part, 6 is a wiring conductor formed from the inside of the frame part to the outer surface of the insulating substrate 1, 7 is a lid, and 8 is a semiconductor element.

絶縁基体１、配線導体６、枠部１０および蓋体７により本発明の圧電素子収納用パッケージが主に構成され、絶縁基体１の上面に形成されている３つの凹部５内に圧電振動子であるＡＴカット型水晶振動子２、音叉型水晶振動子３、および電子部品４を収納するとともに、絶縁基体１の上面の凹部５を塞ぐように蓋体７を取着することにより、絶縁基体１の各凹部５と蓋体７とで形成される各容器の内側にＡＴカット型水晶振動子２、音叉型水晶振動子３、および電子部品４が気密に収納され、さらに蓋体７の上面に半導体素子８を搭載することにより、本発明の圧電装置が基本的に形成される。この圧電装置は、携帯電話等の電子機器を構成する外部回路基板（図示せず）に実装されて使用される。なお、圧電振動子２，３は、３つの凹部５のうち２つに分けて収容され、他の１つの凹部５に電子部品４が収容される。   The insulating base 1, the wiring conductor 6, the frame portion 10, and the lid body 7 mainly constitute a package for housing a piezoelectric element of the present invention, and a piezoelectric vibrator is provided in three recesses 5 formed on the upper surface of the insulating base 1. The insulating base 1 is accommodated by housing a certain AT-cut type crystal resonator 2, tuning fork type crystal resonator 3, and electronic component 4 and attaching a lid 7 so as to close the concave portion 5 on the upper surface of the insulating base 1. The AT-cut crystal resonator 2, tuning fork crystal resonator 3, and electronic component 4 are housed in an airtight manner inside each container formed by the recesses 5 and the lid body 7. By mounting the semiconductor element 8, the piezoelectric device of the present invention is basically formed. This piezoelectric device is used by being mounted on an external circuit board (not shown) constituting an electronic device such as a mobile phone. The piezoelectric vibrators 2 and 3 are accommodated in two of the three recesses 5, and the electronic component 4 is accommodated in the other recess 5.

絶縁基体１は、上面に圧電振動子２，３および電子部品４を収容するための凹部５を３つ有し、この凹部５と蓋体７とで圧電振動子（ＡＴカット型水晶振動子２、音叉型水晶振動子３等）および電子部品４を気密に封止することができる。   The insulating substrate 1 has three concave portions 5 for accommodating the piezoelectric vibrators 2 and 3 and the electronic component 4 on the upper surface, and the concave portion 5 and the lid body 7 constitute a piezoelectric vibrator (AT-cut crystal vibrator 2). , Tuning fork type crystal resonator 3 and the like) and electronic component 4 can be hermetically sealed.

ここで、絶縁基体１は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体、ムライト質焼結体、ガラスセラミックス等のセラミックスやガラスエポキシ樹脂等の樹脂系材料等から成る電気絶縁材料から成り、例えば一辺の長さが５〜２０ｍｍ程度で厚みが１〜５ｍｍ程度の直方体状である。   Here, the insulating substrate 1 is made of an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin-based material such as glass epoxy resin. It is made of an insulating material and has, for example, a rectangular parallelepiped shape having a side length of about 5 to 20 mm and a thickness of about 1 to 5 mm.

絶縁基体１は、例えば、酸化アルミニウム質焼結体から成る場合であれば、以下のようにして作製される。まず、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バンイダ、溶剤、可塑剤等を添加混合して泥漿状となし、これを従来周知のドクタブレード法やカレンダーロール法等によりシート状に成形し、複数枚のセラミックグリーンシートを得る。しかる後、セラミックグリーンシートに適当な打ち抜き加工を施して四角板状のものと四角形状の打ち抜き部が中央部に３つ形成されたものを形成し、四角板状のものが下層に位置するとともに四角形状の打ち抜き部を有するものが上層に位置するように上下に積層することにより上面に３つの凹部５を有する積層体を形成し、その積層体を高温（約１６００℃）で焼成することにより作製される。   If the insulating base 1 is made of, for example, an aluminum oxide sintered body, it is manufactured as follows. First, an appropriate organic vanida, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc. to form a mud, which is a well-known doctor blade method or calendar roll method. Etc. to form a plurality of ceramic green sheets. After that, the ceramic green sheet is appropriately punched to form a rectangular plate-like one and three square-shaped punched portions formed at the center, and the square plate-like one is located in the lower layer. By laminating up and down so that the one having a rectangular punched portion is located in the upper layer, a laminated body having three concave portions 5 on the upper surface is formed, and the laminated body is baked at a high temperature (about 1600 ° C.) Produced.

この場合、グリーンシートのうち各打ち抜き部の間に残っている帯状等の部分が、それぞれの凹部５の間を区切る壁になる。   In this case, the strip-like portion remaining between the punched portions of the green sheet becomes a wall that separates the recesses 5.

なお、絶縁基体１の中央部に大きな凹部を形成しておいて、その大きな凹部の底面に壁材を取着して３つの凹部５に区切るようにしてもよい。   Alternatively, a large recess may be formed in the central portion of the insulating base 1, and a wall material may be attached to the bottom surface of the large recess so as to be divided into three recesses 5.

好ましくは、複数の凹部５同士を区切る壁の内部や表面に蓋体７に接合されるビアや側面導体が形成されているのがよい。これにより、蓋体７に搭載された半導体素子８から発生する熱を蓋体７、複数の凹部５同士を区切る壁に形成されたビア、および複数の凹部５同士を区切る壁に形成された側面導体よって良好に放散させることができ、半導体素子８を長期にわたり良好に作動させることができるとともに、複数の凹部５に収容された圧電振動子２，３および電子部品４をこのビアや側面導体によって良好に電磁的に遮断することができる。より好ましくは、複数の凹部５同士を区切る壁が金属から成るのがよい。これにより、半導体素子８から発生する熱の放熱性や電磁的遮断の効果がより向上する。   Preferably, vias and side conductors that are joined to the lid body 7 are formed inside and on the surface of the wall that partitions the plurality of recesses 5. Accordingly, the heat generated from the semiconductor element 8 mounted on the lid 7 is formed on the lid 7, the via formed in the wall separating the plurality of recesses 5, and the side surface formed on the wall separating the plurality of recesses 5. The conductor can be dissipated well, the semiconductor element 8 can be operated satisfactorily for a long time, and the piezoelectric vibrators 2 and 3 and the electronic component 4 accommodated in the plurality of recesses 5 can be connected by the vias and the side conductors. It is possible to cut off electromagnetically well. More preferably, the wall separating the plurality of recesses 5 is made of metal. Thereby, the heat dissipation of the heat generated from the semiconductor element 8 and the effect of electromagnetic shielding are further improved.

絶縁基体１の上面には、３つの凹部５を塞ぐようにして蓋体７が取着される。蓋体７は、凹部５を塞いで圧電振動子２、３および電子部品４を気密封止する機能をなす。また、蓋体７は、上面に半導体素子８が搭載される搭載部として機能したり、半導体素子８から発生する熱を外部に逃がすための放熱板としても機能する。   A lid 7 is attached to the upper surface of the insulating base 1 so as to close the three recesses 5. The lid 7 functions to seal the piezoelectric vibrators 2 and 3 and the electronic component 4 in an airtight manner by closing the recess 5. The lid 7 also functions as a mounting portion on which the semiconductor element 8 is mounted on the upper surface, and also functions as a heat radiating plate for releasing the heat generated from the semiconductor element 8 to the outside.

蓋体７は、鉄−ニッケル−コバルト合金や鉄−ニッケル合金等の金属や、酸化アルミニウム質焼結体、ガラスセラミックス等のセラミック材料、金属粉末を含む有機樹脂等により形成される。   The lid body 7 is formed of a metal such as an iron-nickel-cobalt alloy or an iron-nickel alloy, a ceramic material such as an aluminum oxide sintered body or glass ceramic, an organic resin containing metal powder, or the like.

蓋体７の凹部５の上面に対する取着は、例えば、ろう材や半田、ガラス、有機樹脂接着剤等の接合材を介して接合すること等により行なうことができる。   Attachment to the upper surface of the recessed part 5 of the cover body 7 can be performed by joining via joining materials, such as a brazing material, solder, glass, an organic resin adhesive, etc., for example.

この蓋体７の上面に半導体素子８が搭載される。半導体素子８は、例えば、リアルタイムクロック用の水晶振動子の発振周波数を制御するための発振回路を有する制御用の素子等であり、蓋体７の上面に半田や接着剤などによって取着される。特に金属製の蓋体７に半田や銀ペースト等の導電性，熱伝導性に優れた接着剤で接合固定すると、半導体素子８で発生した熱を良好に放散させることができ、半導体素子８の温度上昇による誤動作を有効に防止することができる。蓋体７は、例えば、鉄−ニッケル−コバルト合金から成る場合であれば、鉄−ニッケル−コバルト合金の板材に切削加工やエッチング加工等の所定の金属加工を施すことにより形成される。   A semiconductor element 8 is mounted on the upper surface of the lid body 7. The semiconductor element 8 is, for example, a control element having an oscillation circuit for controlling the oscillation frequency of a crystal oscillator for a real-time clock, and is attached to the upper surface of the lid body 7 with solder, an adhesive, or the like. . In particular, when the metal lid 7 is bonded and fixed with an adhesive having excellent conductivity and heat conductivity such as solder and silver paste, the heat generated in the semiconductor element 8 can be dissipated well, and the semiconductor element 8 It is possible to effectively prevent malfunction due to temperature rise. For example, if the lid 7 is made of an iron-nickel-cobalt alloy, the lid 7 is formed by subjecting a plate material of the iron-nickel-cobalt alloy to predetermined metal processing such as cutting or etching.

絶縁基体１の上面には、３つの凹部５の全体を取り囲むようにして枠部１０が形成されている。枠部１０は、絶縁基体１の上面に接着剤等で接合されてもよく、絶縁基体１と一体に形成されてもよい。なお、枠部１０は、蓋体７が取着される部位よりも外側に形成される。   A frame portion 10 is formed on the upper surface of the insulating base 1 so as to surround the entire three concave portions 5. The frame portion 10 may be bonded to the upper surface of the insulating base 1 with an adhesive or the like, or may be formed integrally with the insulating base 1. In addition, the frame part 10 is formed outside the part to which the lid body 7 is attached.

枠部１０は、封止用の樹脂９で半導体素子８を覆う場合に、封止用の樹脂９が絶縁基体１の側面等に流れ出さないようにするダム部材として機能するとともに、次に説明する配線導体６を引き回して形成するための絶縁体等として機能する。半導体素子８を封止用の樹脂９で封止することにより、外部の温度や湿度に対する耐久性を向上させ、より一層長期信頼性に優れた構造とすることができる。   The frame portion 10 functions as a dam member that prevents the sealing resin 9 from flowing out to the side surface or the like of the insulating base 1 when the semiconductor element 8 is covered with the sealing resin 9. It functions as an insulator or the like for drawing the wiring conductor 6 to be formed. By sealing the semiconductor element 8 with the sealing resin 9, durability against external temperature and humidity can be improved, and a structure with further excellent long-term reliability can be obtained.

なお、枠部１０の上面に金属やセラミック材料、樹脂等から成る蓋体を取着することにより半導体素子８を気密に封止してもよい。   The semiconductor element 8 may be hermetically sealed by attaching a lid made of metal, ceramic material, resin, or the like to the upper surface of the frame portion 10.

また、枠部１０の内側から絶縁基体１の下面や側面等の外表面にかけて配線導体６が形成されている。配線導体６は、蓋体７の上面に搭載される半導体素子８や、凹部５に収容される圧電振動子２，３および電子部品４を互いに電気的に接続したり、これらを絶縁基体１の外表面に導出して外部回路基板と電気的に接続したりするための導電経路として機能する。   A wiring conductor 6 is formed from the inner side of the frame portion 10 to the outer surface such as the lower surface and the side surface of the insulating base 1. The wiring conductor 6 electrically connects the semiconductor element 8 mounted on the upper surface of the lid 7, the piezoelectric vibrators 2 and 3 and the electronic component 4 accommodated in the recess 5, or connects them to the insulating base 1. It functions as a conductive path that leads to the outer surface and is electrically connected to the external circuit board.

この配線導体６のうち絶縁基体１の外表面に導出された部位（図１の例では絶縁基体１の下面の外周部に露出している部位）を外部回路基板の電気回路に半田や導電性接着剤等の導電性接合材を介して接合することにより、圧電装置が外部回路基板に電気的、機械的に接続され、配線導体６が外部回路基板の電気回路と電気的に接続される。   A portion of the wiring conductor 6 led out to the outer surface of the insulating base 1 (a portion exposed in the outer peripheral portion of the lower surface of the insulating base 1 in the example of FIG. 1) is soldered or electrically conductive to an electric circuit of the external circuit board. By bonding through a conductive bonding material such as an adhesive, the piezoelectric device is electrically and mechanically connected to the external circuit board, and the wiring conductor 6 is electrically connected to the electric circuit of the external circuit board.

そして、絶縁基体１の凹部５内に圧電振動子２，３および電子部品４を収容するとともにそれぞれの電極を配線導体６に半田やボンディングワイヤ等の導電性接続材（図示せず）を介して電気的に接続し、その後、凹部５を蓋体７で塞いでから蓋体７の上面に半導体素子８を搭載し、半導体素子８の電極を配線導体６の露出部位にボンディングワイヤ等を介して接続し、必要に応じて半導体素子８を封止用の樹脂９で封止することにより圧電装置が製作される。この場合、圧電振動子２，３と電子部品４および半導体素子８等の間で共振回路が形成される。   Then, the piezoelectric vibrators 2 and 3 and the electronic component 4 are accommodated in the recess 5 of the insulating base 1, and the respective electrodes are connected to the wiring conductor 6 via a conductive connecting material (not shown) such as solder or bonding wire. After electrically connecting, the recess 5 is closed with the lid 7, and then the semiconductor element 8 is mounted on the upper surface of the lid 7, and the electrode of the semiconductor element 8 is connected to the exposed portion of the wiring conductor 6 via a bonding wire or the like. The piezoelectric device is manufactured by connecting and sealing the semiconductor element 8 with a sealing resin 9 as necessary. In this case, a resonance circuit is formed between the piezoelectric vibrators 2 and 3, the electronic component 4, the semiconductor element 8, and the like.

なお、配線導体６は、凹部５の内側の絶縁基体１の上面に形成されていてもよく、図１に示すように、枠部１０の内周面に段差を形成し、この段差の上面に形成してもよい。   The wiring conductor 6 may be formed on the upper surface of the insulating base 1 inside the recess 5, and as shown in FIG. 1, a step is formed on the inner peripheral surface of the frame portion 10, and the upper surface of the step is formed. It may be formed.

上記の構成により、本発明の圧電振動子収納用パッケージおよび圧電装置においては、３つの凹部５は列状に並んで形成されており、両端に位置する凹部５にそれぞれ圧電振動子であるＡＴカット型水晶振動子２と音叉型水晶振動子３とが収容され、中央に位置する凹部５に電子部品４が収容されるので、例えば、半導体素子８を搭載するのに最小限必要な絶縁基体１の平面面積で、半導体素子８だけでなく圧電振動子２，３および電子部品４も収容することができ、圧電振動子収納用パッケージを小型化することができる。   With the above configuration, in the piezoelectric vibrator housing package and the piezoelectric device according to the present invention, the three concave portions 5 are formed in a line, and the AT cuts that are piezoelectric vibrators are formed in the concave portions 5 located at both ends, respectively. Since the quartz crystal resonator 2 and the tuning fork crystal resonator 3 are accommodated, and the electronic component 4 is accommodated in the recess 5 located in the center, for example, the insulating substrate 1 that is the minimum necessary for mounting the semiconductor element 8 is used. In this plane area, not only the semiconductor element 8 but also the piezoelectric vibrators 2 and 3 and the electronic component 4 can be housed, and the piezoelectric vibrator housing package can be downsized.

また、絶縁基体１の平面面積が小さくなるため、外部回路基板に圧電振動子収納用パッケージを接続した際に、外部回路基板と絶縁基体１との間で熱応力が生じたとしても、実装領域面積が小さいので外部回路基板の寸法変化による応力を低減することができ、圧電振動子収納用パッケージと外部回路基板との接続部に半田クラックや断線等の不具合が生じるのを効果的に防止して外部回路基板に対する接続を長期にわたって良好に維持することができる。   Further, since the planar area of the insulating base 1 is reduced, even if a thermal stress is generated between the external circuit board and the insulating base 1 when the piezoelectric vibrator housing package is connected to the external circuit board, the mounting region Since the area is small, stress due to dimensional changes of the external circuit board can be reduced, and it is possible to effectively prevent defects such as solder cracks and disconnections at the connection between the piezoelectric vibrator housing package and the external circuit board. Thus, the connection to the external circuit board can be maintained well over a long period of time.

さらに、圧電振動子２，３や電子部品４を収容する空間と、半導体素子８が搭載された空間とを蓋体７によって効果的に電磁的に遮断することができ、半導体素子８や電子部品４等で発生する電磁波が圧電振動子２，３に与える悪影響を有効に防止し、圧電振動子２，３の特性（例えば、ＡＴカット型水晶振動子２や音叉型水晶振動子３等の圧電振動子の発振周波数特性）を良好に維持することができる。なお、このような電磁的遮断をより向上させる場合、蓋体７は、上述した電磁的な遮断を有効なものとするために、また温度サイクル時の絶縁基体１との線膨張係数の違いによる熱応力を考慮して、鉄−ニッケル−コバルト合金や鉄−ニッケル合金等の金属材料、またはセラミック板の全面にメタライズ層が形成された材料、または樹脂に金属粉を含有分散させて形成された材料で形成することが好ましい。   Furthermore, the space for housing the piezoelectric vibrators 2 and 3 and the electronic component 4 and the space in which the semiconductor element 8 is mounted can be effectively electromagnetically cut off by the lid body 7. 4 effectively prevents adverse effects of the electromagnetic waves generated by the piezoelectric vibrators 2 and 3 on the characteristics of the piezoelectric vibrators 2 and 3 (for example, piezoelectrics such as the AT-cut crystal vibrator 2 and the tuning-fork crystal vibrator 3). The oscillation frequency characteristics of the vibrator can be maintained satisfactorily. In addition, when improving such electromagnetic interruption | blocking more, the lid | cover body 7 is based on the difference in a linear expansion coefficient with the insulation base | substrate 1 at the time of a temperature cycle, in order to make the above-mentioned electromagnetic interruption | blocking effective. In consideration of thermal stress, metal material such as iron-nickel-cobalt alloy or iron-nickel alloy, or a material in which a metallized layer is formed on the entire surface of a ceramic plate, or formed by dispersing metal powder in resin It is preferable to form with a material.

なお、圧電振動子は、例えば、上述のようなＡＴカット型水晶振動子２や音叉型水晶振動子３等であり、所定周波数で発振して時間や通信用等の周波数等の基準信号を発振する機能をなす。この基準信号が、配線導体６を介して外部の電気回路に供給される。また、外部の電気回路から水晶振動子２，３や半導体素子８等の作動に要する電流が圧電装置内に供給される。圧電振動子２，３と配線導体６との接続は、導電性接着剤を介して接着すること等により行なわれる。   The piezoelectric vibrator is, for example, the AT-cut type crystal vibrator 2 or the tuning fork type crystal vibrator 3 as described above, and oscillates at a predetermined frequency to oscillate a reference signal such as a frequency for time or communication. Function. This reference signal is supplied to an external electric circuit via the wiring conductor 6. In addition, a current required for operating the crystal resonators 2 and 3 and the semiconductor element 8 is supplied from the external electric circuit into the piezoelectric device. The connection between the piezoelectric vibrators 2 and 3 and the wiring conductor 6 is performed by bonding with a conductive adhesive or the like.

また、電子部品４は、例えば、容量素子（周知のセラミックコンデンサ等）やインダクタ素子等の表面実装型の受動素子等であり、圧電振動子２，３や半導体素子８とともに発振回路を形成する。電子部品４の中央に位置する凹部５内への実装は、例えば、電極を配線導体６の露出部分に半田等を介して電気的、機械的に接続することにより行なわれる。   The electronic component 4 is, for example, a surface-mounted passive element such as a capacitive element (a known ceramic capacitor or the like) or an inductor element, and forms an oscillation circuit together with the piezoelectric vibrators 2 and 3 and the semiconductor element 8. Mounting in the recess 5 located at the center of the electronic component 4 is performed, for example, by electrically and mechanically connecting the electrode to the exposed portion of the wiring conductor 6 via solder or the like.

本発明の圧電振動子収納用パッケージおよび圧電装置において、圧電振動子は、ＡＴカット型水晶振動子２と音叉型水晶振動子３とから成ることが好ましい。この場合、ＡＴカット型水晶振動子２、音叉型水晶振動子３、電子部品４および半導体素子８の間で共振回路が形成され、いわゆるデュアルクロックモジュールタイプの圧電装置が形成される。   In the piezoelectric vibrator housing package and the piezoelectric device according to the present invention, the piezoelectric vibrator is preferably composed of an AT-cut crystal vibrator 2 and a tuning fork crystal vibrator 3. In this case, a resonance circuit is formed between the AT-cut crystal resonator 2, the tuning fork crystal resonator 3, the electronic component 4, and the semiconductor element 8, and a so-called dual clock module type piezoelectric device is formed.

なお、ＡＴカット型水晶振動子２は例えばＭＨz帯でメインクロック用の発振源として機能し、また音叉型水晶振動子３は例えばＫＨｚ帯でサブクロック用（例えば待機動作用等）として機能する。   The AT-cut crystal resonator 2 functions as a main clock oscillation source in the MHz band, for example, and the tuning fork crystal resonator 3 functions as a sub-clock (for example, standby operation) in the KHz band, for example.

本発明の圧電装置は、ＡＴカット型水晶振動子２と音叉型水晶振動子３とを搭載したデュアルクロックモジュールタイプとした場合に、同一の圧電装置内に半導体素子８とＡＴカット型水晶振動子２、音叉型水晶振動子３、および周辺の電子部品４を配線導体６とともに高密度に配置することができ、配線経路を短くとれるため、待機時の消費電力が極めて小さく、例えば、携帯電話に用いれば、長期にわたって充電することなく使用することが可能な使い勝手に優れたものを提供することができる。そして、このような圧電装置が部品として使用される携帯電話等の電子機器の小型化、低消費電力化等を効果的に行なわせることができる。   When the piezoelectric device of the present invention is a dual clock module type in which the AT cut type crystal resonator 2 and the tuning fork type crystal resonator 3 are mounted, the semiconductor element 8 and the AT cut type crystal resonator are included in the same piezoelectric device. 2. The tuning fork crystal unit 3 and peripheral electronic parts 4 can be arranged with high density along with the wiring conductor 6 and the wiring path can be shortened, so that power consumption during standby is extremely small. If it uses, the thing excellent in the usability which can be used without charging over a long term can be provided. In addition, it is possible to effectively reduce the size and power consumption of electronic devices such as mobile phones in which such piezoelectric devices are used as components.

また、上述したように、金属材料、またはセラミック板の全面にメタライズ層が形成された材料、または樹脂に金属粉を含有分散させて形成された材料で蓋体７を形成することにより、半導体素子８の作動時に流れる高周波電流による電磁波がＡＴカット型水晶振動子２、および音叉型水晶振動子３側へ漏れることが効果的に防止されるので、ＡＴカット型水晶振動子２、および音叉型水晶振動子３が収容される絶縁基体１の凹部５内で相互干渉を引き起こして発振が不安定になることを防止することができる。   Further, as described above, the lid 7 is formed of a metal material, a material in which a metallized layer is formed on the entire surface of a ceramic plate, or a material formed by containing and dispersing metal powder in a resin, thereby forming a semiconductor element. 8 is effectively prevented from leaking to the AT-cut quartz crystal resonator 2 and the tuning-fork crystal resonator 3 side due to the high-frequency current that flows during operation, so that the AT-cut crystal resonator 2 and the tuning-fork crystal It is possible to prevent oscillation from becoming unstable due to mutual interference in the recess 5 of the insulating base 1 in which the vibrator 3 is accommodated.

また、本発明の圧電振動子収納用パッケージおよび圧電装置において、圧電振動子２，３および電子部品４の配置は、３つの凹部５のうち中央に位置する凹部５に電子部品を収容し、両端に位置する凹部５にそれぞれ圧電振動子２，３することにより、振幅の小さい振動を発生させるＡＴカット型水晶振動子２と、振幅の大きい振動を発生させる音叉型水晶振動子３とを最も外側の部分に配置して中央に位置する凹部５によりＡＴカット型水晶振動子２と音叉型水晶振動子３との干渉を抑制することが可能となる。   In the piezoelectric vibrator housing package and the piezoelectric device according to the present invention, the piezoelectric vibrators 2 and 3 and the electronic component 4 are arranged such that the electronic parts are housed in the concave part 5 located at the center of the three concave parts 5 and the both ends. By placing the piezoelectric vibrators 2 and 3 in the recesses 5 positioned at the center, the AT cut type crystal vibrator 2 that generates vibration with a small amplitude and the tuning fork type crystal vibrator 3 that generates vibration with a large amplitude are provided on the outermost side. It is possible to suppress interference between the AT-cut crystal resonator 2 and the tuning-fork crystal resonator 3 by the concave portion 5 that is disposed in the center and located in the center.

また、本発明において、図２（ｂ）の圧電振動子２，３の平面配置図に示すように、圧電振動子２，３が、長方形状のＡＴカット型水晶振動子２と長方形状の音叉型水晶振動子３とから成り、これらの長辺方向が互いに平行になるようにして両端に位置する凹部５に別々に収容されることが好ましい。圧電振動子２，３を、長辺方向が互いに平行になるようにして両端に位置する凹部５に別々に収容することにより、絶縁基体１上面に形成した３つの凹部５に圧電振動子２，３と電子部品４とを実装面積を小さく有効に収容することができる。   Further, in the present invention, as shown in the plan layout view of the piezoelectric vibrators 2 and 3 in FIG. 2B, the piezoelectric vibrators 2 and 3 are formed of a rectangular AT-cut crystal vibrator 2 and a rectangular tuning fork. The quartz crystal resonator 3 is preferably housed separately in the recesses 5 located at both ends so that the long side directions thereof are parallel to each other. The piezoelectric vibrators 2 and 3 are separately accommodated in the concave portions 5 positioned at both ends so that the long side directions are parallel to each other, so that the piezoelectric vibrators 2 and 3 are formed in the three concave portions 5 formed on the upper surface of the insulating substrate 1. 3 and the electronic component 4 can be effectively accommodated with a small mounting area.

このように、圧電振動子２，３が、長方形状のＡＴカット型水晶振動子２と長方形状の音叉型水晶振動子３とから成り、これらの長辺方向が互いに平行になるようにして両端の凹部５に別々に収容されていることから、圧電振動子２，３を同時に別々の凹部５に真空封止することができ、長期間にわたり圧電振動子２，３を安定して発振させることが可能となる。   As described above, the piezoelectric vibrators 2 and 3 are composed of the rectangular AT-cut crystal vibrator 2 and the rectangular tuning fork crystal vibrator 3, and both ends thereof are parallel to each other so that their long sides are parallel to each other. Since the piezoelectric vibrators 2 and 3 can be vacuum-sealed in the separate concave parts 5 at the same time, the piezoelectric vibrators 2 and 3 can stably oscillate for a long period of time. Is possible.

ここで、圧電振動子２，３の長辺方向が互いに平行になるようにして両端の凹部５に別々に収容する場合、圧電振動子２，３の導電性接着剤等により接続される端部は、それぞれ離間するように配置（例えば、図２の（ｂ）で示すようにＡＴカット型水晶振動子２の接続される端部と音叉型水晶振動子３の接続される端部とをそれぞれ上下に設けて離間させる）する構造となっていることが望ましい。このような構造とすることにより、自由端が上下方向に振動するＡＴカット型水晶振動子２の最も振動の大きい部位と、左右方向に振動する音叉型水晶振動子３の最も振動の大きい部位との間の間隔を広くすることができることから、共振作用により発振周波数の変化（発振ノイズ）が生じることを有効に防止することができ、より一層発振周波数の精度に優れた圧電装置を提供することができる。   Here, when the piezoelectric vibrators 2 and 3 are separately accommodated in the recesses 5 at both ends so that the long side directions thereof are parallel to each other, the ends connected by the conductive adhesive or the like of the piezoelectric vibrators 2 and 3 Are arranged so as to be separated from each other (for example, as shown in FIG. 2B, an end portion to which the AT-cut type crystal resonator 2 is connected and an end portion to which the tuning fork type crystal resonator 3 is connected are respectively arranged. It is desirable to have a structure that is provided vertically and spaced apart. With such a structure, the most vibrated portion of the AT-cut crystal resonator 2 whose free end vibrates in the vertical direction, and the most vibrated portion of the tuning fork type crystal resonator 3 that vibrates in the left-right direction, Since it is possible to widen the interval, it is possible to effectively prevent a change in oscillation frequency (oscillation noise) from being caused by a resonance action, and to provide a piezoelectric device that is further excellent in oscillation frequency accuracy Can do.

また、図２（ａ）の圧電装置の断面図に示すように、凹部５の圧電振動子２，３のどちらかを収容する側の凹部５の底面に段差を設け、圧電振動子２，３をそれぞれ高さが異なるように搭載することが好ましい。これにより、圧電振動子２，３の振動面の高さをそれぞれ異なるものとすることができ、互いの干渉をより有効に抑制して圧電振動子２，３の発振周波数特性をより一層優れたものとすることができる。凹部５の底面の段差は、例えば、絶縁基体１となるセラミックグリーンシートのうち凹部５の底面となる部位に、絶縁基体１を形成するのと同様のセラミックグリーンシートを所定寸法に切断したものを積層すること等により形成することができる。   Further, as shown in the cross-sectional view of the piezoelectric device in FIG. 2A, a step is provided on the bottom surface of the concave portion 5 on the side where either the piezoelectric vibrator 2 or 3 of the concave portion 5 is accommodated, and the piezoelectric vibrators 2 and 3 are provided. Are preferably mounted so that their heights are different. Thereby, the heights of the vibration surfaces of the piezoelectric vibrators 2 and 3 can be made different from each other, and the oscillation frequency characteristics of the piezoelectric vibrators 2 and 3 are further improved by effectively suppressing mutual interference. Can be. The step on the bottom surface of the recess 5 is obtained by cutting, for example, a ceramic green sheet, which is the same as that for forming the insulating substrate 1, into a portion that will be the bottom surface of the recess 5 in the ceramic green sheet that is to be the insulating substrate 1. It can be formed by laminating.

さらにまた、一方の圧電振動子２，３の振動波が凹部５の内面や蓋体７で反射して他方の圧電振動子２，３に影響するのを有効に防止するために、凹部５の内面や蓋体７の上面に凹凸を形成したり、凹部５の内面や蓋体７の下面に低弾性率材料や多孔質体を被着したりして、振動波の共振が生じるのを抑制してもよい。このような低弾性率材料としては、ゴム成分を含む樹脂材料等が挙げられ、また、多孔質体としては、多孔質セラミックスやゾルゲルガラス等の多孔質ガラス、シリカゲル等の多孔質粉末を含む樹脂材料等が挙げられる。   Furthermore, in order to effectively prevent the vibration wave of one of the piezoelectric vibrators 2 and 3 from being reflected by the inner surface of the recess 5 or the lid 7 and affecting the other piezoelectric vibrator 2 or 3, Suppressing vibration wave resonance by forming irregularities on the inner surface and the upper surface of the lid body 7, or by applying a low elastic modulus material or a porous body on the inner surface of the concave portion 5 and the lower surface of the lid body 7. May be. Examples of such a low elastic modulus material include a resin material containing a rubber component, and examples of the porous body include porous glass such as porous ceramics and sol-gel glass, and resin containing porous powder such as silica gel. Materials and the like.

また、同様に振動波の共振を抑制するために蓋体７の内部に空洞を形成し、この空洞内に高分子ゲルやグリースなどのゲル状物質を充填して振動波を吸収するようにしてもよい。さらに、このゲル状物質に球状セラミックや球状樹脂などの粒子を分散させてもよい。これにより、振動波をより有効に吸収できる。   Similarly, in order to suppress vibration wave resonance, a cavity is formed inside the lid body 7, and a gel-like substance such as polymer gel or grease is filled in the cavity so as to absorb the vibration wave. Also good. Furthermore, particles such as spherical ceramics and spherical resins may be dispersed in this gel substance. Thereby, a vibration wave can be absorbed more effectively.

また、半導体素子８からの電磁波が圧電振動子２，３に影響を与えるのを防止するため、蓋体７の主面や枠部１０の内面に凹凸を形成したり、メタライズ層やめっき層、薄膜金属層、導電性樹脂層などの金属層１１を形成してシールドしてもよい。また、同様の目的で、絶縁基体１内部の凹部５の直下に金属層等のシールド層１２を形成してもよい。   Further, in order to prevent electromagnetic waves from the semiconductor element 8 from affecting the piezoelectric vibrators 2 and 3, irregularities are formed on the main surface of the lid 7 and the inner surface of the frame portion 10, or a metallized layer, a plating layer, A metal layer 11 such as a thin film metal layer or a conductive resin layer may be formed and shielded. For the same purpose, a shield layer 12 such as a metal layer may be formed immediately below the recess 5 in the insulating substrate 1.

さらに、圧電振動子２，３の振動波の反射防止、および半導体素子８からの電磁波が圧電振動子２，３に影響を与えるのを防止するため、蓋体７を金属粉末および多孔質粉末を含む樹脂で形成してもよく、これにより、蓋体７で振動波および電磁波を有効に吸収することができる。   Further, in order to prevent reflection of vibration waves of the piezoelectric vibrators 2 and 3 and to prevent electromagnetic waves from the semiconductor element 8 from affecting the piezoelectric vibrators 2 and 3, the lid 7 is made of metal powder and porous powder. It may be formed of a resin that contains the resin, whereby the lid body 7 can effectively absorb vibration waves and electromagnetic waves.

また、圧電振動子２，３と電子部品４との電磁的な影響をさらに軽減するために、圧電振動子２,３を収容する凹部５と電子部品４を収容する凹部５との間の壁部分を２重構造としても良い。   In order to further reduce the electromagnetic influence between the piezoelectric vibrators 2 and 3 and the electronic component 4, a wall between the concave portion 5 that houses the piezoelectric vibrators 2 and 3 and the concave portion 5 that houses the electronic component 4. The part may have a double structure.

なお、本発明は以上の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の変更を加えても何ら差し支えない。例えば、図１では半導体素子８の電極と配線導体６との接続をボンディングワイヤにより行なう例を示しているが、半田バンプ等を介して行なうフリップチップ接続としても良いことは言うまでもない。   It should be noted that the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the present invention. For example, FIG. 1 shows an example in which the connection between the electrode of the semiconductor element 8 and the wiring conductor 6 is made by a bonding wire, but it goes without saying that it may be a flip chip connection through a solder bump or the like.

（ａ）は本発明の圧電振動子収納用パッケージおよび圧電装置の実施の形態の一例を示す断面図、（ｂ）は（ａ）の圧電振動子収納用パッケージおよび圧電装置の平面図である。(A) is sectional drawing which shows an example of embodiment of the piezoelectric vibrator storage package and piezoelectric device of this invention, (b) is a top view of the piezoelectric vibrator storage package and piezoelectric device of (a). （ａ）は本発明の圧電振動子収納用パッケージおよび圧電装置の実施の形態の他の例を示す断面図、（ｂ）は（ａ）の圧電振動子収納用パッケージおよび圧電装置の平面図である。(A) is sectional drawing which shows the other example of embodiment of the piezoelectric vibrator accommodation package and piezoelectric device of this invention, (b) is a top view of the piezoelectric vibrator accommodation package and piezoelectric device of (a). is there. （ａ）は従来の圧電振動子収納用パッケージおよび圧電装置の平面図、（ｂ）は（ａ）の圧電振動子収納用パッケージおよび圧電装置の断面図である。(A) is a plan view of a conventional piezoelectric vibrator housing package and piezoelectric device, and (b) is a cross-sectional view of the piezoelectric vibrator housing package and piezoelectric device of (a).

符号の説明Explanation of symbols

１・・・・・絶縁基体
２・・・・・圧電振動子（ＡＴカット型水晶振動子）
３・・・・・圧電振動子（音叉型水晶振動子）
４・・・・・電子部品
５・・・・・凹部
６・・・・・配線導体
７・・・・・蓋体
８・・・・・半導体素子
１０・・・・枠部 DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... Piezoelectric vibrator (AT cut type crystal vibrator)
3 ... Piezoelectric vibrator (tuning fork type crystal vibrator)
4 ... Electronic components 5 ... Recess 6 ... Wiring conductor 7 ... Cover body 8 ... Semiconductor element 10 ... Frame

Claims (4)

上面に３つの凹部が形成された絶縁基体と、該絶縁基体の上面の前記３つの凹部の周囲に全周にわたって形成された枠部と、前記枠部の内側から前記絶縁基体の外表面にかけて形成された配線導体と、前記絶縁基体の上面に前記３つの凹部を塞ぐように取着される蓋体とを具備しており、前記３つの凹部のうちの２つにそれぞれ圧電振動子が収容されるとともに他の１つに電子部品が収容され、前記蓋体の上面に半導体素子が搭載されることを特徴とする圧電振動子収納用パッケージ。 An insulating base having three recesses formed on the upper surface, a frame formed around the three recesses on the upper surface of the insulating base, and an inner surface of the frame to the outer surface of the insulating base. Wiring conductors and a lid attached to the upper surface of the insulating base so as to close the three recesses, and two of the three recesses accommodate the piezoelectric vibrators, respectively. A package for accommodating a piezoelectric vibrator, wherein an electronic component is housed in the other one and a semiconductor element is mounted on the upper surface of the lid. ３つの前記凹部は列状に並んで形成されており、両端に位置する前記凹部にそれぞれ前記圧電振動子が収容され、中央に位置する前記凹部に前記電子部品が収容されることを特徴とする請求項１記載の圧電振動子収納用パッケージ。 The three recesses are formed in a line, the piezoelectric vibrators are accommodated in the recesses located at both ends, and the electronic components are accommodated in the recesses located in the center. The package for storing a piezoelectric vibrator according to claim 1. 前記圧電振動子は、一方がＡＴカット型水晶振動子であり、他方が音叉型水晶振動子あることを特徴とする請求項２記載の圧電振動子収納用パッケージ。 3. The piezoelectric vibrator housing package according to claim 2, wherein one of the piezoelectric vibrators is an AT cut type crystal vibrator and the other is a tuning fork type crystal vibrator. 請求項１乃至請求項３のいずれかに記載の圧電振動子収納用パッケージと、前記凹部内に収納されるとともに電極が前記配線導体に電気的に接続された前記圧電振動子と、前記凹部内に収納されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記蓋体の上面に搭載されるとともに電極が前記配線導体に電気的に接続された前記半導体素子とを具備していることを特徴とする圧電装置。 The piezoelectric vibrator housing package according to any one of claims 1 to 3, the piezoelectric vibrator housed in the recess and having an electrode electrically connected to the wiring conductor, and the recess And the electronic component having an electrode electrically connected to the wiring conductor and the semiconductor element mounted on the upper surface of the lid and having the electrode electrically connected to the wiring conductor. A piezoelectric device characterized by that.
JP2004218906A 2004-07-27 2004-07-27 Piezoelectric vibrator storage package and piezoelectric device Expired - Fee Related JP4587727B2 (en)

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JP2009232336A (en) * 2008-03-25 2009-10-08 Epson Toyocom Corp Piezoelectric oscillator
CN112311355A (en) * 2019-07-29 2021-02-02 三星电机株式会社 Semiconductor package

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JPH06283619A (en) * 1993-03-30 1994-10-07 Nippon Steel Corp High-frequency circuit element and its manufacture
JPH0983291A (en) * 1995-09-14 1997-03-28 Daishinku Co Piezoelectric vibration device with functional component
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009232336A (en) * 2008-03-25 2009-10-08 Epson Toyocom Corp Piezoelectric oscillator
CN112311355A (en) * 2019-07-29 2021-02-02 三星电机株式会社 Semiconductor package

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