JP2006016276A - Splitting method and apparatus therefor - Google Patents

Splitting method and apparatus therefor Download PDF

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JP2006016276A
JP2006016276A JP2004197678A JP2004197678A JP2006016276A JP 2006016276 A JP2006016276 A JP 2006016276A JP 2004197678 A JP2004197678 A JP 2004197678A JP 2004197678 A JP2004197678 A JP 2004197678A JP 2006016276 A JP2006016276 A JP 2006016276A
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cutting line
liquid crystal
crystal panel
heating means
cutting
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Japanese (ja)
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Akira Shirai
明 白井
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Shirai Tech Ltd
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Shirai Tech Ltd
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a split method and its apparatus for splitting a glass plate or a liquid crystal panel formed by sticking together two sheets of plate glasses and for causing no flow on the split surface by solving the problem that the scribing of a cutting line on the plate surface and the breaking thereof by giving impact on the cutting line cause the split surface with no right angle to the plate surface and with a flow. <P>SOLUTION: The method and apparatus comprises a plate glass A or a liquid crystal panel which is subjected to the scribing work with a cutting line (a) on the surface, a heating means 12 arranged oppositely over the whole length of the above cutting line, and a transferring means 11 for transferring this heating means or either the above plate glass or the liquid crystal panel to an approaching direction or a separating direction, and contrives to split and break the cutting line by the thermal stress while applying the heat by the heating means on the above cutting line. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、板ガラスや二枚の板ガラスを貼り合わせて形成してある液晶パネルの分断方法及びその装置に関する。   The present invention relates to a method and an apparatus for dividing a liquid crystal panel formed by laminating plate glass and two plate glasses.

液晶パネルは、二枚の板ガラスを貼り合わせて形成してある。   The liquid crystal panel is formed by bonding two plate glasses.

このような液晶パネルを製品サイズに分断するには、液晶パネルのA面に切断線をスクライブ(入れる)する。   In order to divide such a liquid crystal panel into product sizes, a cutting line is scribed (inserted) on the A surface of the liquid crystal panel.

液晶パネルのB面にも切断線をスクライブする。   A cutting line is also scribed on the B side of the liquid crystal panel.

上記の切断線は、例えば耳落し用や、大割用、小割用があり、周知のようにA面及びB面の切断線を合致させ、また辺縁に端子を形成する場合、合致させない。   The above cutting lines are, for example, for ear drop, for large splits, for small splits. As is well known, the cut lines on the A and B planes are matched, and when forming terminals on the edges, they do not match. .

勿論、単板の板ガラスの場合でも、板ガラスの表面に切断線を入れる。   Of course, even in the case of a single plate glass, a cutting line is made on the surface of the plate glass.

次に、折割装置のバー材やロールなどの折割部材により切断線上に衝撃を加えながら折割し切断線に切断を浸透させて分断する(例えば、特許文献1、特許文献2参照)
特開2003−119043号公報 特開2003−185987号公報
Next, the cracking member such as a bar member or a roll of the folding device applies the impact to the cutting line while breaking and penetrates the cutting line to divide it (see, for example, Patent Document 1 and Patent Document 2).
JP 2003-119043 A JP 2003-185987 A

ところで、バー材やロールなどの折割部材による衝撃を加える分断方式によると、分断面Xが図9、図10に示すよう板面に対し直角(垂直)に割れない(浸透しない)で流れる可能性が大きい。   By the way, according to the dividing method in which an impact is applied by a split member such as a bar material or a roll, the dividing section X can flow without breaking (permeating) at right angles (perpendicular) to the plate surface as shown in FIGS. The nature is great.

特に、スクライブするカッターホイールの切れ味によって流れる問題が発生する。   In particular, a problem of flowing due to the sharpness of the scribing cutter wheel occurs.

このため、分断後の基板とエッジに悪影響を与える。   This adversely affects the divided substrate and edge.

そこで、この発明の課題は、分断面に流れが発生しない分断方法及びその装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a cutting method and a device therefor in which no flow is generated in a divided section.

上記のような課題を解決するために、この発明は、板ガラスや液晶パネルの表面スクライブ加工した切断線の全長に渡り加熱手段の熱を加えて、熱応力により上記切断線の分断破壊を図るようにした方法を採用する。   In order to solve the problems as described above, the present invention applies heat of the heating means over the entire length of the cutting line subjected to surface scribing processing of a plate glass or a liquid crystal panel so as to break the cutting line by thermal stress. Adopt the method that was made.

そして、前記熱応力による切断線の分断破壊の際に、板ガラスや液晶パネルに分断助長の牽引力を作用させることもある。   In the case of the breakage of the cutting line due to the thermal stress, a traction force for promoting the breakage may be applied to the plate glass or the liquid crystal panel.

また、表面に切断線をスクライブ加工した板ガラスや液晶パネルと、上記切断線の全長に渡って対向するように配置した加熱手段と、この加熱手段或いは上記板ガラスや液晶パネルの接近、離反方向に移動させる移動手段とからなり、上記切断線に加熱手段の熱を作用させるようにした装置を採用する。   Also, a plate glass or liquid crystal panel with a cutting line scribed on the surface, a heating means arranged so as to face the entire length of the cutting line, and the heating means or the plate glass or the liquid crystal panel move in the approaching or separating direction. An apparatus is adopted which comprises a moving means for causing the heat of the heating means to act on the cutting line.

そして、前記板ガラスや液晶パネルに、加熱手段の熱による分断破壊の際分断助長を図る牽引力を作用させるような牽引手段を設けることもある。   Further, traction means may be provided on the glass plate or the liquid crystal panel so as to act a traction force for promoting the division when the heating means is divided by heat.

すると、切断線に加えた熱によって熱破壊による強い応力を持って切断線の浸透が板面に対し直角になって垂直な分断(熱割れ)が行なわれ、切断面に流れがない。   Then, the heat applied to the cutting line has a strong stress due to thermal destruction, and the penetration of the cutting line is perpendicular to the plate surface, so that vertical division (thermal cracking) is performed, and there is no flow on the cutting surface.

また、牽引手段により板ガラスや液晶パネルに牽引力を作用(切断線に対し直角に交差する方向へ)させて、加熱手段の熱による分断破壊の際の分断助長を図るので、熱分解時間が大幅に短縮させて、分断能率を著しく向上する。   In addition, the pulling force is applied to the glass sheet or the liquid crystal panel by the pulling means (in the direction perpendicular to the cutting line) to promote the breaking in the case of the breaking break due to the heat of the heating means. By shortening, the cutting efficiency is remarkably improved.

以上のように、この発明の板ガラスや液晶パネルの分断方法や分断装置によれば、スクライブした切断線に加熱手段の熱を加えることで、熱応力に熱破壊が成長して切断線の分断(熱割れ)浸透を図ると共に、切断面が板面に対し直角となって垂直な切断面となり、切断面に流れ現象が起きない。   As described above, according to the cutting method and the cutting apparatus for the plate glass and the liquid crystal panel of the present invention, by applying the heat of the heating means to the scribed cutting line, the thermal stress grows in the thermal stress and the cutting line is divided ( (Heat cracking) Penetration and cutting surface become perpendicular to the plate surface at right angles, and no flow phenomenon occurs on the cutting surface.

このため、衝撃を加えた分断のように流れの発生にともなう基板とエッジに悪影響を与えることがない。   For this reason, there is no adverse effect on the substrate and the edge due to the flow as in the case of the division with impact.

また、スクライブするカッターホイールの切れ味が低下しても何ら影響を受けることもない。   Moreover, even if the sharpness of the scribe cutter wheel is lowered, it is not affected at all.

さらに、牽引手段により板ガラスや液晶パネルに牽引力を作用(切断線に対し直角に交差する方向へ)させて、加熱手段の熱による分断破壊の際の分断助長を図るので、熱分解に要する時間を大幅に短縮して、能率の著しい向上を図ることができる。   Furthermore, the pulling force is applied to the glass sheet or the liquid crystal panel by the pulling means (in a direction perpendicular to the cutting line) to promote the breaking in the case of the breaking break due to the heat of the heating means. It can be greatly shortened to achieve a significant improvement in efficiency.

この発明の実施の形態を添付図面に基づいて説明する。   Embodiments of the present invention will be described with reference to the accompanying drawings.

第1の実施形態では、図1及び図2示すように、大判な板ガラスAの片面には、耳落しや、大割、小割の切断線aが前もって入れてある。   In 1st Embodiment, as shown in FIG.1 and FIG.2, the ear drop and the cutting line a of the large part and the subdivision are put in the single side | surface of the large plate glass A beforehand.

上記の切断線aは、周知のように、板ガラスAの板面にカッターホイール(図示省略)を押し付けると共に、押し付け状況下に板ガラス或いはカッターホイールのいずれか片方の走行によりスクライブする。   As is well known, the cutting line a presses a cutter wheel (not shown) against the plate surface of the plate glass A, and scribes by running either the plate glass or the cutter wheel under the pressing state.

また、図4及び図5に示すように、大判な二枚の板ガラスA、Aを貼り合わせて形成してある液晶パネルA′には、耳落しや製品サイズ、端子(所要の辺で、一辺四辺に)形成用の切断線aが入れてある。   Further, as shown in FIGS. 4 and 5, the liquid crystal panel A ′ formed by laminating two large plate glasses A and A has an ear drop, a product size, a terminal (one side on a required side). A cutting line a for forming is provided on the four sides.

上記の切断線aは、周知のように液晶パネルA′を形成する両板ガラスA、Aの板面にカッターホイール(図示省略)を押し付けると共に、押し付け状況下に液晶パネル或いはカッターホイールのいずれか片方の走行によりスクライブする。   The cutting line a is, as is well known, pressing the cutter wheel (not shown) against the plate surfaces of the two glass plates A and A forming the liquid crystal panel A ′, and either the liquid crystal panel or the cutter wheel under the pressing condition. Scribing by driving.

次に、切断線aの分断を説明する。   Next, the division of the cutting line a will be described.

移動手段11としてのシリンダの伸長作用によって加熱手段12としての例えば通電により発熱したニクローム線を切断線aの全長に渡って接近(接触或いは接触しない程度に)させる。   The extending portion of the cylinder as the moving means 11 causes the nichrome wire that has generated heat, for example, by energization as the heating means 12 to approach (contact or not come into contact) over the entire length of the cutting line a.

すると、切断線aの加熱にともなう熱応力により切断線aの分断破壊が図られて(成長して)、分断(熱割れによる)浸透し、図3、図6に示すように、分断面Sが板ガラスAの板面に対し直角となって垂直な分断面Sとなり、図8、9に示すような従来の衝撃分断にともない発生した流れがない。   Then, the breaking fracture of the cutting line a is achieved (growth) by the thermal stress accompanying the heating of the cutting line a, and penetrates and breaks (due to thermal cracking). As shown in FIG. 3 and FIG. Becomes a perpendicular section S perpendicular to the plate surface of the plate glass A, and there is no flow generated due to the conventional impact division as shown in FIGS.

勿論、カッターホイールの切れ味が低下しても、分断面Sに悪影響がない。   Of course, even if the sharpness of the cutter wheel is lowered, the dividing surface S is not adversely affected.

なお、切断線aに対する加熱手段12による加熱は、各切断線a毎に順次行なうか、或いは複数の切断線a又は全ての切断線aを同時に行なう。   Note that the heating by the heating means 12 for the cutting lines a is performed sequentially for each cutting line a, or a plurality of cutting lines a or all the cutting lines a are performed simultaneously.

上記切断線aに対する加熱用の加熱手段12は、図5に示すように液晶パネルA′の切断線aの加工面(両面)に対向させて加熱手段12を配置する場合と、図2に示すように板ガラスAの切断線aの加工していない面側で、切断線に対向するよう設けたが、板ガラスAの切断線aの加工面側に加熱手段12を設けても(図示省略)よい。   As shown in FIG. 5, the heating means 12 for heating the cutting line a is disposed as opposed to the processing surface (both sides) of the cutting line a of the liquid crystal panel A ′, as shown in FIG. Thus, although it provided so that the cutting line a of the plate glass A may face the cutting line, the heating means 12 may be provided on the processing surface side of the cutting line a of the plate glass A (not shown). .

要するに、切断線aを加熱することで、分断破壊を図るようにする。   In short, the cutting line a is heated so as to break the part.

この発明の第2の実施形態では、加熱手段12によって切断線aを加熱して、熱応力により切断線aの分断破壊を図る際、牽引手段31によって板ガラスAや液晶パネルA′に牽引力Gを作用させて分断助長する。   In the second embodiment of the present invention, when the cutting line a is heated by the heating unit 12 and the cutting line a is broken by the thermal stress, the pulling force 31 is applied to the glass sheet A or the liquid crystal panel A ′ by the pulling unit 31. Help to break up by acting.

上記の牽引手段31は、切断線aに対し直角に交差する方向に牽引するもので、例えば、図8に示すようにテーブルT上に板ガラスAや液晶パネルA′を押え込むための牽引手段31としてのシリンダ32により昇降させる加圧部材33と、板ガラスAや液晶パネルA′の辺縁をクランプするクランプ金具34と、このクランプ金具34を進退させるシリンダ35とで構成し、分断に際し加圧部材33を降下させて、テーブルT上に板ガラスAや液晶パネルA′を押え込み、またクランプ金具34によって板ガラスAや液晶パネルA′の辺縁(全長)をクランプする。   The pulling means 31 is pulled in a direction perpendicular to the cutting line a. For example, as shown in FIG. 8, the pulling means 31 for pressing the plate glass A and the liquid crystal panel A ′ onto the table T. A pressure member 33 that is moved up and down by a cylinder 32, a clamp fitting 34 that clamps the edge of the plate glass A and the liquid crystal panel A ', and a cylinder 35 that moves the clamp fitting 34 forward and backward. 33 is lowered to press the plate glass A and the liquid crystal panel A ′ onto the table T, and the edge (full length) of the plate glass A and the liquid crystal panel A ′ is clamped by the clamp fitting 34.

上記シリンダ35によるクランプ金具34の進退方向は、切断線aに対し直角に交差する方向にする。   The advancing and retreating direction of the clamp fitting 34 by the cylinder 35 is set to a direction that intersects the cutting line a at a right angle.

しかして、切断線aの加熱手段12による加熱にともなう熱応力により切断線aの分断破壊と同時にシリンダ35の収縮作用によってクランプ金具34によってクランプしてある辺縁に牽引力Gを作用させる。   Thus, the traction force G is applied to the edge clamped by the clamp fitting 34 by the contraction of the cylinder 35 simultaneously with the breaking of the cutting line a due to the thermal stress accompanying the heating of the cutting line a by the heating means 12.

すると、分断破壊が助長されて、分断がスムーズに、かつ大幅な時間短縮によって能率の向上をはかる。   Then, the breakage is promoted, the breakage is smooth, and the efficiency is improved by greatly reducing the time.

なお、図示の場合、耳落しの辺縁をクランプしたが、大割や小割の際分断位置の切断線aに平行する辺縁(全長)をクランプすればよい。そして、牽引手段も図示の方式に限定されない。   In the case of the illustration, the edge of the ear drop is clamped, but the edge (full length) parallel to the cutting line a at the dividing position may be clamped at the time of large split or small split. The traction means is not limited to the illustrated method.

第1の実施形態の切断線のスクライブずみ板ガラスを示す斜視図The perspective view which shows the scribe plate glass of the cutting line of 1st Embodiment. 切断線の加熱を示す拡大正面図Enlarged front view showing heating of cutting line 同上の分断を示す正面図Front view showing the same division 切断線のスクライブずみ液晶パネルを示す斜視図Perspective view showing a scribed LCD panel along the cutting line 加熱線の加熱を示す拡大正面図Enlarged front view showing heating of heating wire 同上の分断を示す正面図Front view showing the same division 分断液晶パネルの斜視図Perspective view of a split LCD panel 第2の実施形態を示す拡大正面図Enlarged front view showing the second embodiment 従来の板ガラス分断を示す拡大正面図Enlarged front view showing conventional sheet glass cutting 従来の液晶パネルの分断を示す拡大正面図Enlarged front view showing the division of a conventional LCD panel

符号の説明Explanation of symbols

A 板ガラス
a 切断線
A′ 液晶パネル
11 移動手段
12 加熱手段
S 分断面
T テーブル
G 牽引力
31 牽引手段
32 シリンダ
33 加圧部材
34 クランプ金具
35 シリンダ
A plate glass a cutting line A ′ liquid crystal panel 11 moving means 12 heating means S sectional surface T table G traction force 31 traction means 32 cylinder 33 pressure member 34 clamp fitting 35 cylinder

Claims (4)

板ガラスや液晶パネルの表面スクライブ加工した切断線の全長に渡り加熱手段の熱を加えて、熱応力により上記切断線の分断破壊を図るようにしたことを特徴とする分断方法。 A cutting method characterized by applying heat of a heating means over the entire length of a cutting line subjected to surface scribing processing of a plate glass or a liquid crystal panel so as to break the cutting line by thermal stress. 前記熱応力による切断線の分断破壊の際に、板ガラスや液晶パネルに分断助長の牽引力を作用させたことを特徴とする請求項1に記載の分断方法。 The cutting method according to claim 1, wherein a traction force for promoting cutting is applied to a sheet glass or a liquid crystal panel when the cutting line is broken by the thermal stress. 表面に切断線をスクライブ加工した板ガラスや液晶パネルと、上記切断線の全長に渡って対向するように配置した加熱手段と、この加熱手段或いは上記板ガラスや液晶パネルの接近、離反方向に移動させる移動手段とからなり、上記切断線に加熱手段の熱を作用させるようにしたことを特徴とする分断装置。 A plate glass or liquid crystal panel having a cutting line scribed on the surface, a heating means arranged so as to face the entire length of the cutting line, and a movement for moving the heating means or the plate glass or liquid crystal panel in the approaching or separating direction. A cutting apparatus characterized in that the heat of the heating means acts on the cutting line. 前記板ガラスや液晶パネルに、加熱手段の熱による分断破壊の際分断助長を図る牽引力を作用させるような牽引手段を設けたことを特徴とする請求項3に記載の分断装置。


4. The cutting apparatus according to claim 3, wherein traction means is provided on the plate glass or the liquid crystal panel so as to apply a traction force for promoting the division when the heating means is broken by heat.


JP2004197678A 2004-07-05 2004-07-05 Splitting method and apparatus therefor Pending JP2006016276A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008056507A (en) * 2006-08-29 2008-03-13 Seiko Epson Corp Scribing method for stuck mother substrate and splitting method of stuck mother substrate
JP2014065614A (en) * 2012-09-24 2014-04-17 Masanobu Yae Method for thermally cutting brittle plate
CN104552623A (en) * 2013-10-25 2015-04-29 三星钻石工业股份有限公司 Breaking apparatus
CN106977088A (en) * 2015-12-04 2017-07-25 三星钻石工业股份有限公司 Cutting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008056507A (en) * 2006-08-29 2008-03-13 Seiko Epson Corp Scribing method for stuck mother substrate and splitting method of stuck mother substrate
JP2014065614A (en) * 2012-09-24 2014-04-17 Masanobu Yae Method for thermally cutting brittle plate
CN104552623A (en) * 2013-10-25 2015-04-29 三星钻石工业股份有限公司 Breaking apparatus
CN106977088A (en) * 2015-12-04 2017-07-25 三星钻石工业股份有限公司 Cutting device
CN106977088B (en) * 2015-12-04 2020-04-24 三星钻石工业股份有限公司 Cut-off device

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