JP2006013420A - Package for electronic component housing, and electronic device - Google Patents

Package for electronic component housing, and electronic device Download PDF

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Publication number
JP2006013420A
JP2006013420A JP2004341671A JP2004341671A JP2006013420A JP 2006013420 A JP2006013420 A JP 2006013420A JP 2004341671 A JP2004341671 A JP 2004341671A JP 2004341671 A JP2004341671 A JP 2004341671A JP 2006013420 A JP2006013420 A JP 2006013420A
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Prior art keywords
copper
electronic component
heat radiating
radiating member
surface side
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JP2004341671A
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Japanese (ja)
Inventor
Masahiko Miyauchi
正彦 宮内
Junro Yoneda
淳郎 米田
Nobuyuki Tanaka
信幸 田中
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for accommodating electronic parts which can properly make the heat generated by an electronic part diffuse to the outside or to the atmosphere and firmly bond the electronic components to a heat-dissipating component, and electronic equipment that uses it. <P>SOLUTION: A package 8 for accommodating the electronic components comprises a heat dissipating component 1 shaped into a plate form which has a mounting portion 10 of an electronic component 11 on upper surface, and a frame member 5, having a plurality of a wiring conductors 6 which are fixed in an upper surface of the heat-dissipating component 1, in such a manner that they surround the mounting portion 10, extending from the inside to the outside. In the dissipating component 1, a penetrating metal member 3, consisting of copper or an alloy mainly composed of copper, is embedded across the upper surface and the lower surface of a center portion of a base member 2 shaped in frame which is formed by impregnating copper to a sintered body, consisting of tungsten or molybdenum, and each copper layer 4 is formed, by covering the upper/the lower surfaces of the base member 2 and the penetrating metal member 3 at the same time; furthermore, a copper layer 4a of the upper-surface side of the heat dissipating component 1 is thicker than a copper layer 4b of the lower-surface side. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は良好な放熱特性の放熱構造を有する、半導体素子などの電子部品を収納するための電子部品収納用パッケージおよびそれを用いた電子装置に関するものである。   The present invention relates to an electronic component storage package for storing an electronic component such as a semiconductor element, which has a heat dissipation structure with good heat dissipation characteristics, and an electronic device using the same.

従来、半導体素子や圧電振動子、発光素子などの電子部品を収容するための電子部品収納用パッケージは、一般に酸化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等の電気絶縁材料から成る枠体と、電子部品が搭載されてその動作時に発生する熱を外部もしくは大気中に良好に放散させるための銅とタングステンとの合金材料または銅とモリブデンとの合金材料から成る放熱部材と、蓋体とから構成されており、放熱部材の上面の電子部品の搭載部を取り囲むように枠体が配置されているとともに、これら枠体および放熱部材によって形成される凹部の内側から外側にかけて、タングステン，モリブデン，マンガン，銅，銀等から成る複数の配線導体が枠体に被着され導出されている。   Conventionally, electronic component storage packages for storing electronic components such as semiconductor elements, piezoelectric vibrators, and light emitting elements are generally made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, and a glass ceramic. A frame, a heat dissipating member made of an alloy material of copper and tungsten or an alloy material of copper and molybdenum for dissipating heat generated when the electronic component is mounted and operating to the outside or the atmosphere, and a lid And the frame is disposed so as to surround the electronic component mounting portion on the upper surface of the heat dissipation member, and from the inside to the outside of the recess formed by the frame and the heat dissipation member, tungsten, A plurality of wiring conductors made of molybdenum, manganese, copper, silver or the like are attached to the frame body and led out.

そして、放熱部材の上面の搭載部に電子部品をガラス，樹脂，ロウ材等の接着剤を介して接着固定するとともに、この電子部品の各電極をボンディングワイヤを介して配線導体に電気的に接続し、しかる後、枠体に蓋体をガラス，樹脂，ロウ材等から成る封止材を介して接合し、放熱部材と枠体と蓋体とから成る容器の内部に電子部品を収容することによって製品としての電子装置となる（例えば、下記の特許文献１参照）。この電子装置は、さらに放熱効率を向上させるために、ねじ止め等によって外部放熱板に搭載される場合もある。   Then, the electronic component is bonded and fixed to the mounting portion on the upper surface of the heat radiating member via an adhesive such as glass, resin, or brazing material, and each electrode of the electronic component is electrically connected to the wiring conductor via a bonding wire. After that, the lid body is joined to the frame body through a sealing material made of glass, resin, brazing material, etc., and the electronic component is accommodated in the container composed of the heat radiation member, the frame body, and the lid body. Thus, an electronic device as a product is obtained (for example, see Patent Document 1 below). This electronic device may be mounted on an external heat sink by screwing or the like in order to further improve the heat dissipation efficiency.

このようなタングステンと銅との合金材料等から成る放熱部材を具備した電子部品収納用パッケージは、放熱部材の熱伝導率が高く、なおかつ放熱部材の熱膨張係数が、電子部品としての半導体素子の構成材料であるシリコン，ガリウム砒素やパッケージの構成材料として使われるセラミック材料等と熱膨張係数が近似することから、パワーＩＣや高周波トランジスタ等の高発熱半導体素子を搭載する電子部品収納用パッケージとして注目されている。   An electronic component storage package having such a heat dissipation member made of an alloy material of tungsten and copper has a high thermal conductivity of the heat dissipation member, and the thermal expansion coefficient of the heat dissipation member is that of a semiconductor element as an electronic component. Since the thermal expansion coefficient is close to that of silicon, gallium arsenide, which is a component material, and ceramic materials, etc., which are used as the component material of the package, it is attracting attention as a package for storing electronic components in which high heat-generating semiconductor elements such as power ICs and high-frequency transistors are mounted. Has been.

また電子装置として、図５に示すように、第１の金属材料102の上下両面に第１の金属材料102よりも熱伝導率の高い第２の金属材料104ａ，104ｂをロウ付け接合して形成するとともに、第２の金属材料104ａの上面に搭載された電子部品111のほぼ直下の第１の金属材料102に貫通孔が形成され、貫通孔に第１の金属材料102よりも熱伝導率の高い第３の金属材料103が挿入された金属放熱体101と、金属放熱体101の上面に電子部品111が搭載され、電子部品111を包囲するように、金属放熱体101の上面に装着された枠体105と、枠体105の上面に載せた蓋体とを備えた電子装置114が提案されている（例えば、下記の特許文献２参照）。   Further, as an electronic device, as shown in FIG. 5, second metal materials 104a and 104b having higher thermal conductivity than the first metal material 102 are brazed and joined to the upper and lower surfaces of the first metal material 102. In addition, a through hole is formed in the first metal material 102 almost directly below the electronic component 111 mounted on the upper surface of the second metal material 104a. The through hole has a thermal conductivity higher than that of the first metal material 102. The metal heat sink 101 in which the high third metal material 103 is inserted, and the electronic component 111 is mounted on the upper surface of the metal heat sink 101, and is mounted on the upper surface of the metal heat sink 101 so as to surround the electronic component 111. An electronic device 114 including a frame body 105 and a lid body placed on the upper surface of the frame body 105 has been proposed (see, for example, Patent Document 2 below).

この電子装置114の第１の金属材料102はモリブデン，タングステン，鉄合金等から成り、第２の金属材料104ａ，104ｂは銅等から成り、第３の金属材料103は銅，銀，アルミニウム，ダイヤモンド等から成る。   The first metal material 102 of the electronic device 114 is made of molybdenum, tungsten, iron alloy or the like, the second metal materials 104a and 104b are made of copper or the like, and the third metal material 103 is copper, silver, aluminum or diamond. Etc.

この構成によって、金属放熱体101に反りが生じたり、金属放熱体101に接合する枠体105に割れが生じたりすることなく、良好な放熱性を備えた電子装置114を容易に得ることができる。
特開平９−312361号公報 特開2000−183222号公報 With this configuration, it is possible to easily obtain the electronic device 114 having good heat dissipation without causing warpage of the metal radiator 101 or cracking of the frame 105 joined to the metal radiator 101. .
Japanese Patent Laid-Open No. 9-312361 JP 2000-183222 A

近年、パワーＩＣや高周波トランジスタの高集積化に伴う発熱量の増大によって、現在では300Ｗ／ｍ・Ｋ以上の熱伝導率を持つ放熱部材が求められている。しかしながら、前述のタングステンと銅との合金材料またはモリブデンと銅との合金材料から成る放熱部材の熱伝導率は200Ｗ／ｍ・Ｋ程度とその要求に対して低いため、放熱特性が不十分であるという問題点があった。   In recent years, a heat dissipation member having a thermal conductivity of 300 W / m · K or more has been demanded due to an increase in the amount of heat generated with the high integration of power ICs and high-frequency transistors. However, the heat conductivity of the heat radiating member made of the above-mentioned alloy material of tungsten and copper or the alloy material of molybdenum and copper is about 200 W / m · K, which is low for that requirement, so the heat dissipation characteristics are insufficient. There was a problem.

これに対し、タングステンまたはモリブデンと銅とがマトリクス状に構成された複合材料、つまり、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る放熱部材を用いることが提案されている。   On the other hand, it has been proposed to use a heat dissipation member formed by impregnating copper into a composite material in which tungsten or molybdenum and copper are formed in a matrix, that is, a sintered body made of tungsten or molybdenum.

しかしながら、このタングステンまたはモリブデンと銅とがマトリクス状に構成された複合材料から成る放熱部材を用いた電子部品収納用パッケージでは、タングステンまたはモリブデンは熱伝導率，熱膨張係数が共に低く、銅は熱伝導率，熱膨張係数が共に高いため、銅の含有量を増加させるに伴って放熱部材の熱伝導率，熱膨張率も共に増加することとなる。よって、放熱部材の熱伝導率を向上させるために銅の含有量を増加させると、電子部品と放熱部材との熱膨張係数の差が大きくなり、電子部品を放熱部材に強固に接合することができなくなるという問題点があった。   However, in an electronic component storage package using a heat dissipation member made of a composite material in which tungsten or molybdenum and copper are formed in a matrix, tungsten or molybdenum has a low thermal conductivity and a low thermal expansion coefficient, and copper Since both the conductivity and the thermal expansion coefficient are high, the thermal conductivity and the thermal expansion coefficient of the heat radiating member are both increased as the copper content is increased. Therefore, if the copper content is increased in order to improve the thermal conductivity of the heat dissipation member, the difference in coefficient of thermal expansion between the electronic component and the heat dissipation member increases, and the electronic component can be firmly bonded to the heat dissipation member. There was a problem that it was impossible.

本発明は上記従来の技術における問題に鑑み案出されたものであり、その目的は、電子部品の発した熱を外部や大気中に良好に放散させることができ、かつ電子部品を放熱部材に強固に接合させることが可能な電子部品収納用パッケージおよびそれを用いた電子装置を提供することにある。   The present invention has been devised in view of the above problems in the prior art, and the purpose thereof is to dissipate the heat generated by the electronic component well to the outside or the atmosphere, and the electronic component is used as a heat dissipation member. An object of the present invention is to provide an electronic component storage package that can be firmly bonded and an electronic device using the same.

本発明の電子部品収納用パッケージは、上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、該放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出する複数の配線導体を有する枠体とを具備しており、前記放熱部材は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体が埋設されているとともに、前記基体および前記貫通金属体の上下面を覆ってそれぞれ銅層が形成されており、前記放熱部材の上面側の前記銅層は下面側の前記銅層より厚いことを特徴とする。   The electronic component storage package of the present invention includes a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface to an outer surface attached to the upper surface of the heat radiating member so as to surround the mounting portion. A frame having a plurality of wiring conductors to be led out, and the heat dissipating member is formed of copper from the upper surface to the lower surface of a central portion of a frame-shaped substrate formed by impregnating a sintered body made of tungsten or molybdenum with copper. Alternatively, a through metal body made of an alloy containing copper as a main component is embedded, and a copper layer is formed to cover the upper and lower surfaces of the base body and the through metal body, respectively, The copper layer is thicker than the copper layer on the lower surface side.

また、本発明の電子部品収納用パッケージは、上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、該放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出する複数の配線導体を有する枠体とを具備しており、前記放熱部材は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体が埋設されているとともに、前記基体および前記貫通金属体の上下面を覆ってそれぞれ銅板が銀を主成分とする合金から成るロウ材を介して接合されることによって銅層が形成されており、前記ロウ材は、前記放熱部材の上面側のものが下面側のものよりも厚いことを特徴とする。   The electronic component storage package of the present invention includes a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface attached to the upper surface of the heat radiating member so as to surround the mounting portion. A frame body having a plurality of wiring conductors led out to the outer surface, and the heat dissipation member is formed by impregnating a sintered body made of tungsten or molybdenum with copper to form a lower surface from the upper surface of the central portion of the frame-shaped substrate. A through metal body made of copper or an alloy containing copper as a main component is buried, and a brazing material covering the upper and lower surfaces of the base body and the through metal body, each of which is made of an alloy containing silver as a main component. A copper layer is formed by bonding, and the brazing material is characterized in that the upper surface side of the heat radiating member is thicker than the lower surface side.

本発明の電子部品収納用パッケージにおいて、好ましくは、前記ロウ材は、前記放熱部材の上面側の厚みと下面側の厚みの差が10μｍ乃至20μｍであることを特徴とする。   In the electronic component storage package of the present invention, it is preferable that the brazing material has a difference in thickness between the upper surface side and the lower surface side of the heat dissipation member of 10 μm to 20 μm.

本発明の電子部品収納用パッケージにおいて、好ましくは、前記放熱部材の前記基体は、その外側面に側面金属層が被着されていることを特徴とする。   In the electronic component storage package according to the present invention, preferably, the base of the heat radiating member has a side metal layer attached to an outer surface thereof.

本発明の電子部品収納用パッケージにおいて、好ましくは、前記放熱部材の上面側の前記銅層と下面側の前記銅層との厚みの差が100μｍ乃至200μｍであることを特徴とする。   In the electronic component storage package of the present invention, it is preferable that a difference in thickness between the copper layer on the upper surface side and the copper layer on the lower surface side of the heat radiating member is 100 μm to 200 μm.

本発明の電子部品収納用パッケージにおいて、好ましくは、前記放熱部材の上面側の前記銅層および下面側の前記銅層の少なくとも一方は、前記放熱部材の中央部から外周部にかけて漸次厚くなっていることを特徴とする。   In the electronic component storage package of the present invention, preferably, at least one of the copper layer on the upper surface side and the copper layer on the lower surface side of the heat dissipation member is gradually thicker from the center portion to the outer peripheral portion of the heat dissipation member. It is characterized by that.

本発明の電子装置は、上記本発明の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記枠体の上面に前記電子部品を覆うように取着された蓋体または前記枠体の内側に前記電子部品を覆うように充填された封止樹脂とを具備していることを特徴とする。   The electronic device according to the present invention includes the electronic component storage package according to the present invention, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the upper surface of the frame. A lid attached to cover the electronic component or a sealing resin filled to cover the electronic component is provided inside the frame.

本発明の電子部品収納用パッケージによれば、放熱部材は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体が埋設されているとともに、基体および貫通金属体の上下面を覆ってそれぞれ銅層が形成されており、放熱部材の上面側の銅層は下面側の銅層より厚いことから、従来のタングステンまたはモリブデンから成る焼結体に銅を含浸させて成る放熱部材に比べて、電子部品の搭載部の下に、より体積の大きい銅から成る高熱伝導部分を配置することができるので、電子部品で発生した熱を電子部品の搭載面に直角な方向により多く伝えることができ、また、枠状の基体がタングステンまたはモリブデンから成る焼結体に銅を含浸させて成ることにより、基体の熱伝導率が向上し、放熱部材の放熱特性をより優れたものとすることができる。その結果、電子部品に発生する熱をこの放熱部材を介して大気中あるいは外部放熱板に極めて良好に放散することができる。   According to the electronic component storage package of the present invention, the heat radiating member has copper or copper as a main component from the upper surface to the lower surface of the central portion of the frame-shaped substrate formed by impregnating a sintered body made of tungsten or molybdenum with copper. And a copper layer is formed covering the upper and lower surfaces of the base body and the through metal body, and the copper layer on the upper surface side of the heat dissipation member is thicker than the copper layer on the lower surface side. Therefore, it is possible to arrange a high heat conduction part made of copper with a larger volume under the mounting part of the electronic component, compared to a heat dissipation member made by impregnating a sintered body made of tungsten or molybdenum with copper. As a result, the heat generated in the electronic component can be transferred more in the direction perpendicular to the mounting surface of the electronic component, and the frame-shaped substrate is made of copper or copper on the sintered body made of tungsten or molybdenum. By comprising impregnated improves the thermal conductivity of the substrate, it is possible to improve further the heat dissipation properties of the heat radiating member. As a result, the heat generated in the electronic component can be dissipated very well to the atmosphere or to the external heat radiating plate through this heat radiating member.

また、銅または銅を主成分とする合金から成る貫通金属体が熱膨張しても、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体が貫通金属体を拘束して放熱部材全体の熱膨張を抑制することができる。よって、電子部品と放熱部材との強固な接合を維持することができる。   Further, even if a through metal body made of copper or an alloy containing copper as a main component is thermally expanded, a frame-like base body formed by impregnating copper into a sintered body made of tungsten or molybdenum restrains the through metal body. The thermal expansion of the whole heat radiating member can be suppressed. Therefore, it is possible to maintain strong bonding between the electronic component and the heat dissipation member.

さらに、放熱部材の上下面に形成された銅層により、電子部品が発生した熱を放熱部材の主面に平行な方向にもより多く伝えることができ、特に上面側の銅層が厚いので電子部品から発せられた熱を即時に、放熱部材の主面に直角な方向と平行な方向の両方に伝達することができ、電子部品の放熱性を極めて向上させることができる。その結果、電子部品を長期間にわたり正常かつ安定に作動させることが可能となる。   In addition, the copper layers formed on the upper and lower surfaces of the heat dissipation member can transfer more heat generated by the electronic components in the direction parallel to the main surface of the heat dissipation member. The heat generated from the component can be immediately transmitted in both the direction perpendicular to the main surface of the heat radiating member and the direction parallel to the main surface of the heat radiating member, so that the heat dissipation of the electronic component can be greatly improved. As a result, the electronic component can be operated normally and stably over a long period of time.

本発明の電子部品収納用パッケージによれば、放熱部材は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体が埋設されているとともに、基体および貫通金属体の上下面を覆ってそれぞれ銅板が銀を主成分とする合金から成るロウ材を介して接合されることによって銅層が形成されており、ロウ材は、放熱部材の上面側のものが下面側のものよりも厚いことから、従来のタングステンまたはモリブデンから成る焼結体に銅を含浸させて成る放熱部材に比べて、電子部品の搭載部の下により体積の大きい銅から成る高熱伝導部分を配置することができるので、電子部品で発生した熱を電子部品の搭載面に垂直な方向により多く伝えることができ、また、枠状の基体がタングステンまたはモリブデンから成る焼結体に銅を含浸させて成ることにより、基体の熱伝導率が向上し、放熱部材の放熱特性をより優れたものとすることができる。その結果、電子部品に発生する熱をこの放熱部材を介して大気中あるいは外部放熱板に極めて良好に放散することができる。   According to the electronic component storage package of the present invention, the heat radiating member has copper or copper as a main component from the upper surface to the lower surface of the central portion of the frame-shaped substrate formed by impregnating a sintered body made of tungsten or molybdenum with copper. The through metal body made of an alloy is embedded, and the copper layer is bonded to each other through a brazing material made of an alloy mainly composed of silver so as to cover the upper and lower surfaces of the base body and the through metal body. Since the brazing material is thicker on the upper surface side of the heat radiating member than on the lower surface side, compared with a heat radiating member formed by impregnating copper in a sintered body made of conventional tungsten or molybdenum, Since a high heat conduction part made of copper with a larger volume can be arranged under the mounting part of the electronic component, more heat generated in the electronic component is transmitted in a direction perpendicular to the mounting surface of the electronic component. In addition, since the frame-shaped substrate is made by impregnating a sintered body made of tungsten or molybdenum with copper, the thermal conductivity of the substrate is improved, and the heat dissipation characteristics of the heat dissipation member are improved. can do. As a result, the heat generated in the electronic component can be dissipated very well to the atmosphere or to the external heat radiating plate through this heat radiating member.

また、銅または銅を主成分とする合金から成る貫通金属体が熱膨張しても、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体が貫通金属体を拘束して放熱部材全体の熱膨張を抑制することができる。よって、放熱部材における銅の占める割合が大きいにもかかわらず、放熱部材全体の熱膨張を小さくすることができ、電子部品と放熱部材との強固な接合を維持することができる。   Further, even if a through metal body made of copper or an alloy containing copper as a main component is thermally expanded, a frame-like base body formed by impregnating copper into a sintered body made of tungsten or molybdenum restrains the through metal body. The thermal expansion of the whole heat radiating member can be suppressed. Therefore, although the proportion of copper in the heat radiating member is large, the thermal expansion of the entire heat radiating member can be reduced, and the strong bonding between the electronic component and the heat radiating member can be maintained.

さらに、放熱部材の上下に形成された銅層により、電子部品が発生した熱を放熱部材に平行な方向にもより多く伝えることができ、放熱部材に垂直な方向と平行な方向の両方に伝達することができ、電子部品の放熱性を極めて向上させることができる。その結果、電子部品を長期間にわたり正常かつ安定に作動させることが可能となる。   In addition, the copper layers formed on the top and bottom of the heat dissipation member can transfer more heat generated by the electronic components in the direction parallel to the heat dissipation member, and can be transmitted both in the direction perpendicular to the heat dissipation member and in the direction parallel to it. It is possible to greatly improve the heat dissipation of the electronic component. As a result, the electronic component can be operated normally and stably over a long period of time.

また、ロウ材は放熱部材の上面側のものが下面側のものよりも厚いことから、電子部品で発生した熱を熱伝導率のよい銀を主成分とする合金から成る厚い上面側のロウ材でより効率よく伝達することができる。また、放熱部材と枠体との接合時に、放熱部材と枠体との熱膨張係数の違いによって放熱部材に反りを生じさせようとする応力が生じても、上面側の厚いロウ材で良好に応力を緩和することができる。よって、放熱部材に反りが発生するのを有効に防止して放熱部材の下面の平坦性を維持し、外部基板への密着性を極めて良好にして放熱部材から外部基板へ効率よく熱伝導させることができる。その結果、放熱部材の良好な熱伝導性と外部基板への高効率な熱伝導によって、電子部品収納用パッケージの放熱性を極めて高くすることができる。   Also, since the brazing material on the upper surface side of the heat dissipation member is thicker than that on the lower surface side, the brazing material on the thick upper surface side made of an alloy whose main component is silver with good thermal conductivity is the heat generated in the electronic component. Can be transmitted more efficiently. In addition, even when a stress that causes warping of the heat dissipation member due to the difference in thermal expansion coefficient between the heat dissipation member and the frame occurs when the heat dissipation member and the frame are joined, the thick brazing material on the upper surface side is good. Stress can be relaxed. Therefore, it is possible to effectively prevent the heat radiating member from warping, maintain the flatness of the lower surface of the heat radiating member, make the adhesion to the external substrate extremely good, and efficiently conduct heat from the heat radiating member to the external substrate. Can do. As a result, the heat dissipation of the electronic component storage package can be made extremely high by the good heat conductivity of the heat dissipation member and the highly efficient heat conduction to the external substrate.

本発明の電子部品収納用パッケージによれば、好ましくは、ロウ材は放熱部材の上面側の厚みと下面側の厚みの差が10μｍ乃至20μｍであることから、上面側と下面側とのロウ材の厚みによるバランスがとれ、貫通金属体の周囲の隙間を通じて下面側にロウ材が引き寄せられるのを防止できるので、上面側のロウ材に厚みばらつきが生じたり空隙が生じたりするのを有効に防止することができ、放熱部材の熱伝導性を極めて良好にすることができる。   According to the electronic component storage package of the present invention, it is preferable that the brazing material has a difference in thickness between the upper surface side and the lower surface side of the heat dissipation member of 10 μm to 20 μm. The thickness of the brazing material is balanced, and it is possible to prevent the brazing material from being drawn toward the lower surface side through the gap around the penetrating metal body, so that it is possible to effectively prevent variation in thickness and voids from occurring in the brazing material on the upper surface side. The heat conductivity of the heat radiating member can be made extremely good.

また、この構成により、電子部品から発せられた熱を即時に、放熱部材の主面に直角な方向と平行な方向の両方に非常に良好に伝達して電子部品の放熱性を極めて向上させることができるとともに、放熱部材の上下のロウ材の厚みの差によって生じる放熱部材の歪を最小限に抑えることができる。   Also, with this configuration, the heat generated from the electronic component can be immediately and very well transmitted both in the direction perpendicular to the main surface of the heat dissipation member and in the direction parallel to the heat radiation member, thereby greatly improving the heat dissipation of the electronic component. In addition, the distortion of the heat radiating member caused by the difference in thickness between the upper and lower brazing members of the heat radiating member can be minimized.

本発明の電子部品収納用パッケージにおいて、好ましくは、放熱部材の基体は、その外側面に側面金属層が被着されていることから、電子部品から発生した熱のうち放熱部材の上面側の銅層の中央部から外周部に伝わったものを基体の側面で放熱部材の下面側に伝達させて放熱させることができ、上面側の銅層の中央部と外周部との温度差を大きくすることができるので、上面側の銅層の伝熱を効率的に行なわせることができる。そして、放熱部材を外部電気回路基板等に載置固定することによって、電子部品から発せられた熱を放熱部材の下面の外部電気回路基板等に効率よく放散させることができる。その結果、電子部品を効率的に冷却し、長期間にわたり正常かつ安定に作動させることが可能となる。   In the electronic component storage package of the present invention, preferably, the base of the heat dissipation member has a side metal layer attached to the outer surface thereof, so that the copper on the upper surface side of the heat dissipation member out of the heat generated from the electronic component. What is transmitted from the center of the layer to the outer periphery can be transferred to the lower surface side of the heat dissipation member on the side of the substrate to dissipate heat, and the temperature difference between the center and outer periphery of the upper copper layer is increased. Therefore, the heat transfer of the copper layer on the upper surface side can be performed efficiently. Then, by placing and fixing the heat dissipating member on the external electric circuit board or the like, the heat generated from the electronic component can be efficiently dissipated to the external electric circuit board or the like on the lower surface of the heat dissipating member. As a result, the electronic component can be efficiently cooled and can be operated normally and stably over a long period of time.

本発明の電子部品収納用パッケージにおいて、好ましくは、放熱部材の上面側の銅層と下面側の銅層との厚みの差が100μｍ乃至200μｍであることから、電子部品から発せられた熱を即時に、放熱部材の主面に直角な方向と平行な方向の両方に非常に良好に伝達して電子部品の放熱性を向上させることができるとともに、放熱部材の上下の銅層の厚さの差によって生じる熱膨張差で放熱部材が歪もうとしても、枠体で放熱部材を良好に拘束することができ、電子部品収納用パッケージの気密信頼性を良好に維持することができる。   In the electronic component storage package of the present invention, preferably, the difference in thickness between the copper layer on the upper surface side and the copper layer on the lower surface side of the heat dissipation member is 100 μm to 200 μm, so that heat generated from the electronic component is immediately generated. In addition, it is possible to improve the heat dissipation of electronic parts by transmitting very well both in the direction perpendicular to the main surface of the heat dissipation member and in the direction parallel to it, and the difference in the thickness of the copper layers above and below the heat dissipation member Even if the heat dissipation member tries to be distorted by the difference in thermal expansion caused by the heat dissipation member, the heat dissipation member can be favorably restrained by the frame, and the airtight reliability of the electronic component storage package can be maintained well.

本発明の電子部品収納用パッケージにおいて、好ましくは、放熱部材の上面側の銅層および下面側の銅層の少なくとも一方は、放熱部材の中央部から外周部にかけて漸次厚くなっていることから、銅層の外周部の厚い部位に熱をより移動しやすくすることができ、電子部品の放熱性をより向上させることができる。   In the electronic component storage package of the present invention, preferably, at least one of the copper layer on the upper surface side and the copper layer on the lower surface side of the heat dissipation member is gradually thickened from the center portion to the outer peripheral portion of the heat dissipation member. Heat can be more easily transferred to the thick part of the outer periphery of the layer, and the heat dissipation of the electronic component can be further improved.

本発明の電子装置は、上記本発明の電子部品収納用パッケージと、搭載部に搭載されるとともに電極が配線導体に電気的に接続された電子部品と、枠体の上面に電子部品を覆うように取着された蓋体または枠体の内側に電子部品を覆うように充填された封止樹脂とを具備していることから、本発明の電子部品収納用パッケージの特徴を備えた、電子部品の放熱特性が極めて良好な、長期にわたって安定して電子部品を作動させることができる電子装置を提供することができる。   An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on a mounting portion and having an electrode electrically connected to a wiring conductor, and an electronic component covered on an upper surface of a frame. And the sealing resin filled so as to cover the electronic component inside the lid or the frame attached to the electronic component, the electronic component having the characteristics of the electronic component storage package of the present invention It is possible to provide an electronic device capable of operating an electronic component stably over a long period of time with extremely good heat dissipation characteristics.

次に、本発明を添付図面に基づき詳細に説明する。   Next, the present invention will be described in detail with reference to the accompanying drawings.

図１は本発明の電子部品収納用パッケージおよびそれを用いた電子装置の実施の形態の一例を示す断面図であり、１は放熱部材、２は放熱部材１の基体、３は貫通金属体、４は銅層（４ａは上面側の銅層，４ｂは下面側の銅層）、５は枠体、６は配線導体である。これら放熱部材１と枠体５とで電子部品11を収納する電子部品収納用パッケージ８が構成される。また、この放熱部材１の搭載部10に電子部品11を搭載した後に、放熱部材１と枠体５とからなる凹部５ａに電子部品11を覆うように封止樹脂13を注入して電子部品11を覆うことにより、または、枠体５の上面に蓋体を凹部５ａを覆うように取着して電子部品11を封入することにより、本発明の電子装置14が構成される。   FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package and an electronic apparatus using the same according to the present invention, wherein 1 is a heat dissipation member, 2 is a base of the heat dissipation member 1, 3 is a through metal body, 4 is a copper layer (4a is a copper layer on the upper surface side, 4b is a copper layer on the lower surface side), 5 is a frame, and 6 is a wiring conductor. The heat radiation member 1 and the frame 5 constitute an electronic component storage package 8 for storing the electronic component 11. In addition, after mounting the electronic component 11 on the mounting portion 10 of the heat radiating member 1, the sealing resin 13 is injected into the recess 5 a composed of the heat radiating member 1 and the frame 5 so as to cover the electronic component 11. The electronic device 14 of the present invention is configured by covering the electronic device 11 by covering the upper surface of the frame body 5 or by attaching a lid body so as to cover the concave portion 5a.

枠体５は酸化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等から成り、銀ロウ，銀−銅ロウ等のロウ材を介して放熱部材１の上面に搭載部10を取り囲んで接着固定されることにより取着される。なお、このロウ材による接着固定に際しては、ロウ付け用の金属層（図示せず）が枠体５の放熱部材１との接合部に形成されてもよい。また、枠体５は金属から構成されていてもよく、その場合、配線導体６を枠体５を構成する金属と絶縁させるために配線導体６の周囲をセラミックスや樹脂、ガラス等の絶縁体で覆えばよい。   The frame 5 is made of an aluminum oxide sintered body, a mullite sintered body, glass ceramics, etc., and surrounds the mounting portion 10 on the upper surface of the heat radiating member 1 via a brazing material such as silver brazing or silver-copper brazing. It is attached by being fixed. Note that a brazing metal layer (not shown) may be formed at the joint portion of the frame body 5 with the heat radiating member 1 when this brazing material is bonded and fixed. The frame 5 may be made of metal. In that case, in order to insulate the wiring conductor 6 from the metal constituting the frame 5, the periphery of the wiring conductor 6 is made of an insulator such as ceramics, resin, or glass. Cover it.

以下、枠体５は四角枠状として説明するが、必ず四角枠状である必要はなく、多角形状，円形や楕円形状等の所要の形状とすることができる。   Hereinafter, although the frame 5 is described as a rectangular frame shape, the frame body 5 is not necessarily a rectangular frame shape, and may be a required shape such as a polygonal shape, a circular shape, or an elliptical shape.

また、放熱部材１には、その上面の中央部の搭載部10に電子部品11が樹脂，ガラス，ロウ材等の接着剤を介して固定される。なお、接着剤としてロウ材を用いる場合には、ロウ付け用の金属層（図示せず）が放熱部材１の電子部品11との接合部10に形成されてもよい。ただし、放熱部材１の上面の搭載部10に接合された銅層４ａにより十分なロウ付けができる場合には、ロウ付け用の金属層は特に必要ではない。   In addition, the heat dissipating member 1 has an electronic component 11 fixed to the mounting portion 10 at the center of the upper surface of the heat dissipating member 1 through an adhesive such as resin, glass, or brazing material. When a brazing material is used as the adhesive, a brazing metal layer (not shown) may be formed at the joint 10 of the heat dissipation member 1 with the electronic component 11. However, when sufficient brazing can be performed by the copper layer 4a bonded to the mounting portion 10 on the upper surface of the heat radiating member 1, a brazing metal layer is not particularly necessary.

以下、放熱部材１は、四角平板状として説明するが、必ず四角平板状である必要はなく、多角形状，円形や楕円形状等の所要の形状とすることができる。   Hereinafter, although the heat radiating member 1 is described as a rectangular flat plate shape, it is not necessarily a square flat plate shape, and may be a required shape such as a polygonal shape, a circular shape, or an elliptical shape.

枠体５は、例えば、酸化アルミニウム質焼結体から成る場合であれば、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダ，溶剤，可塑剤，分散剤等を混合添加して泥漿状となすとともに、これからドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート（セラミック生シート）を形成し、しかる後に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、タングステン，モリブデン，マンガン，銅，銀，ニッケル，パラジウム，金等の金属材料粉末に適当な有機バインダ，溶剤を混合してなる導電性ペーストをグリーンシートに予めスクリーン印刷法等により所定の配線導体６のパターンに印刷塗布した後に、このグリーンシートを複数枚積層し、約1600℃の温度で焼成することによって作製される。   If the frame 5 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, dispersant, etc. are added to the raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide. A ceramic green sheet (ceramic green sheet) is formed by mixing and adding to a mud-like shape, and then adopting a doctor blade method and a calender roll method. After that, the ceramic green sheet is appropriately punched. Conductive paste made by mixing an appropriate organic binder and solvent with powders of metal materials such as tungsten, molybdenum, manganese, copper, silver, nickel, palladium, gold, etc. After printing and applying to the pattern of 6, this green sheet Laminating several sheets, it is produced by firing at a temperature of about 1600 ° C..

また、枠体５には、放熱部材１と枠体５とで構成される凹部５ａの内面（搭載部10周辺）から枠体５の外面にかけて導出する配線導体６が形成されており、配線導体６の凹部５ａの内側の一端には電子部品11の各電極がボンディングワイヤ12を介して電気的に接続される。また、配線導体６の枠体５の外側の他端には外部電気回路基板との接続用のリード端子７が接続される。   In addition, a wiring conductor 6 is formed on the frame body 5 so as to be led out from the inner surface of the recess 5a formed by the heat radiating member 1 and the frame body 5 (around the mounting portion 10) to the outer surface of the frame body 5. Each electrode of the electronic component 11 is electrically connected via a bonding wire 12 to one end inside the recess 5a. A lead terminal 7 for connection to an external electric circuit board is connected to the other outer end of the frame 5 of the wiring conductor 6.

配線導体６はタングステン，モリブデン等の高融点金属から成り、タングステン，モリブデン等の金属粉末に適当な有機バインダ，溶剤等を添加混合して得た金属ペーストを枠体５となるセラミックグリーンシートに予めスクリーン印刷法等によって所定のパターンに印刷塗布しておくことによって、放熱部材１および枠体５による凹部５ａの内面から枠体５の外面にかけて被着形成される。   The wiring conductor 6 is made of a refractory metal such as tungsten or molybdenum, and a metal paste obtained by adding and mixing an appropriate organic binder, solvent or the like to a metal powder such as tungsten or molybdenum is preliminarily applied to the ceramic green sheet serving as the frame 5. By printing and applying in a predetermined pattern by a screen printing method or the like, the heat radiating member 1 and the frame body 5 are deposited from the inner surface of the recess 5 a to the outer surface of the frame body 5.

また、配線導体６はその露出する表面にニッケル，金等の耐食性に優れ、かつボンディングワイヤ12のボンディング性に優れる金属を１〜20μｍの厚みにメッキ法によって被着させておくと、配線導体６の酸化腐食を有効に防止できるとともに配線導体６へのボンディングワイヤ12の接続を強固となすことができる。従って、配線導体６は、その露出する表面にニッケル，金等の耐食性に優れ、かつボンディング性に優れる金属を１〜20μｍの厚みに被着させておくことが望ましい。   Further, when the wiring conductor 6 is coated with a metal having excellent corrosion resistance such as nickel and gold on the exposed surface and excellent bonding property of the bonding wire 12 to a thickness of 1 to 20 μm by a plating method, the wiring conductor 6 is obtained. As a result, it is possible to effectively prevent the oxidative corrosion of the bonding wire 12 and to strengthen the connection of the bonding wire 12 to the wiring conductor 6. Therefore, it is desirable that the wiring conductor 6 is coated with a metal having excellent corrosion resistance, such as nickel and gold, and excellent bonding properties on the exposed surface to a thickness of 1 to 20 μm.

本発明の放熱部材１は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体２の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体３が埋設されているとともに、基体２および貫通金属体３の上下面を覆ってそれぞれ銅層４ａ，４ｂが形成されており、放熱部材１の上面側の銅層４ａは下面側の銅層４ｂより厚くなっている。なお、貫通金属体３は必ずしも直方体状である必要はなく、多角柱状や円柱状等所要の形状とすることができる。   The heat dissipating member 1 of the present invention is a penetrating metal body made of copper or an alloy containing copper as a main component from the upper surface to the lower surface of the center portion of a frame-like substrate 2 formed by impregnating a sintered body made of tungsten or molybdenum with copper. 3 is embedded, and copper layers 4a and 4b are formed so as to cover the base 2 and the upper and lower surfaces of the through metal body 3, respectively. The copper layer 4a on the upper surface side of the heat radiating member 1 is the copper layer 4b on the lower surface side. It is thicker. The penetrating metal body 3 does not necessarily have a rectangular parallelepiped shape, and may have a required shape such as a polygonal column shape or a cylindrical shape.

放熱部材１は、電子部品11の作動に伴い発生する熱を吸収するとともに大気中に放散させる、あるいは外部放熱板に伝導させる機能を有する。このような放熱部材１は、例えば、先ず平均粒径が５〜40μｍのタングステン粉末またはモリブデン粉末を、電子部品11の搭載部10となる部位に貫通穴が形成されるように加圧成形し、これを1300〜1600℃の雰囲気中で焼結することにより、電子部品11の搭載部10に上面から下面にかけて形成された貫通穴を持つ多孔体を作製する。そして、この多孔体に水素雰囲気下において約1200℃で10〜50質量％の銅を含浸させることにより、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る（タングステンまたはモリブデンと銅とのマトリクスから成る）平板状の基体２を作製する。この基体２の中央に形成された貫通穴に、基体２の上面から下面にかけて銅から成る貫通金属体３を埋設し、さらに、この基体２および貫通金属体３の上面を覆って銅層４ａならびに基体２および貫通金属体３の下面を覆って銅層４ｂを被着することによって形成される。   The heat radiating member 1 has a function of absorbing heat generated by the operation of the electronic component 11 and dissipating it into the atmosphere or conducting it to an external heat radiating plate. Such a heat radiating member 1 is, for example, first pressure-molded with tungsten powder or molybdenum powder having an average particle size of 5 to 40 μm so that a through hole is formed in a portion to be the mounting portion 10 of the electronic component 11, By sintering this in an atmosphere of 1300 to 1600 ° C., a porous body having through holes formed in the mounting portion 10 of the electronic component 11 from the upper surface to the lower surface is produced. Then, the porous body is impregnated with 10 to 50% by mass of copper at about 1200 ° C. in a hydrogen atmosphere, so that the sintered body made of tungsten or molybdenum is impregnated with copper (of tungsten or molybdenum and copper). A flat substrate 2 (made of a matrix) is produced. A through metal body 3 made of copper is embedded in the through hole formed in the center of the base body 2 from the upper surface to the lower surface of the base body 2, and the copper layer 4a and the upper surface of the base body 2 and the through metal body 3 are covered. It is formed by covering the lower surface of the substrate 2 and the penetrating metal body 3 with a copper layer 4b.

ここで、基体２はタングステンまたはモリブデンから成る焼結体に銅を含浸させて成ることにより、タングステン単体またはモリブデン単体からなる場合に比べて熱伝導率が向上し、放熱部材１の放熱特性をより優れたものとさせることができる。   Here, the base body 2 is formed by impregnating a sintered body made of tungsten or molybdenum with copper, so that the thermal conductivity is improved as compared with the case where it is made of tungsten alone or molybdenum alone, and the heat radiation characteristics of the heat radiating member 1 are further improved. It can be made excellent.

基体２の貫通穴への貫通金属体３の埋設方法、および、上下の銅層４の被着方法は、例えば、基体２にめっき処理をする方法、銅粉末を含む金属ペーストを印刷塗布した後、焼成する方法、あるいは、タングステンまたはモリブデンから成る焼結体と所定量の銅とを同時に加熱して銅を溶融させ、毛細管現象によって多孔質の焼結体に銅を含浸させるとともに貫通金属体３および銅層４を形成する方法が挙げられる。また、基体２の貫通穴へ貫通金属体３を埋設した後、基体２の上下面に上下の銅層４となる金属板を銀ロウ，銀−銅ロウ，金ロウ，金−銅ロウ等のロウ材を用いてのロウ付け、または超音波接合することにより形成してもよい。なお、超音波接合によって接合すると、基体２と銅層４となる金属板に高温を加えることなく接合でき、基体２と銅層４となる金属板との間に大きな熱膨張差を発生させることがない点で好ましい。   The method of embedding the through metal body 3 in the through hole of the base 2 and the method of depositing the upper and lower copper layers 4 include, for example, a method of plating the base 2 and printing and applying a metal paste containing copper powder. A method of firing, or a sintered body made of tungsten or molybdenum and a predetermined amount of copper are simultaneously heated to melt the copper, and the porous sintered body is impregnated with copper by capillary action and the through metal body 3 And a method of forming the copper layer 4. Further, after the through metal body 3 is embedded in the through hole of the base 2, a metal plate to be the upper and lower copper layers 4 on the upper and lower surfaces of the base 2 is made of silver solder, silver-copper solder, gold solder, gold-copper solder, or the like. You may form by brazing using a brazing material or ultrasonic bonding. In addition, when it joins by ultrasonic bonding, it can join, without applying high temperature to the metal plate used as the base | substrate 2 and the copper layer 4, and generates a big thermal expansion difference between the base | substrate 2 and the metal plate used as the copper layer 4. It is preferable in that there is no.

なお、貫通金属体３の材料は純銅に限られるものではなく、銅を主成分とする合金でもよい。このような銅を主成分とする合金とは、銅を50質量％より多く含む合金であり、例えば、銅−タングステン合金や銅−モリブデン合金，黄銅等が用いられる。また、基体２に含浸される銅も同様に純銅に限らず、貫通金属体３と同様の銅を主成分とする合金でもよい。   The material of the penetrating metal body 3 is not limited to pure copper, but may be an alloy containing copper as a main component. Such an alloy containing copper as a main component is an alloy containing more than 50% by mass of copper. For example, a copper-tungsten alloy, a copper-molybdenum alloy, brass, or the like is used. Similarly, the copper impregnated in the substrate 2 is not limited to pure copper, but may be an alloy mainly composed of copper similar to the through metal body 3.

銅層４は、上面側、即ち、電子部品11の搭載部10側の銅層４ａの厚みが、下面側の銅層４ｂの厚みより厚い。これにより、放熱部材１の上下に形成された銅層４により、電子部品11が発生した熱を放熱部材１の主面に平行な方向にもより多く伝えることができ、特に上面側の銅層４ａが厚いので電子部品11から発せられた熱を即時に、放熱部材１の主面に直角な方向と平行な方向の両方に良好に伝達することができ、電子部品11の放熱性を向上させることができる。その結果、電子部品11を長期間にわたり正常かつ安定に作動させることが可能となる。   In the copper layer 4, the thickness of the copper layer 4 a on the upper surface side, that is, the mounting portion 10 side of the electronic component 11 is thicker than the thickness of the copper layer 4 b on the lower surface side. As a result, the copper layers 4 formed above and below the heat radiating member 1 can transmit more heat generated by the electronic component 11 in the direction parallel to the main surface of the heat radiating member 1, and in particular, the copper layer on the upper surface side. Since the 4a is thick, the heat generated from the electronic component 11 can be immediately and satisfactorily transmitted in both the direction perpendicular to the main surface of the heat radiating member 1 and the direction parallel to it, and the heat dissipation of the electronic component 11 is improved. be able to. As a result, the electronic component 11 can be operated normally and stably over a long period of time.

本発明の放熱部材１は、図２に示すように、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体２の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体３が埋設されているとともに、基体２および貫通金属体３の上下面を覆ってそれぞれ銅板４ａ，４ｂが銀を主成分とするロウ材15（15ａは放熱部材１の上面側のロウ材、15ｂは放熱部材１の下面側のロウ材）で接合されていて、放熱部材１の上面側のロウ材15ａは下面側のロウ材15ｂよりも厚い構成であってもよい。   As shown in FIG. 2, the heat dissipating member 1 of the present invention has copper or copper as a main component from the upper surface to the lower surface of the central portion of a frame-like substrate 2 formed by impregnating a sintered body made of tungsten or molybdenum with copper. And a brazing material 15 (15a is the heat-dissipating member 1) and the copper plates 4a and 4b cover the upper and lower surfaces of the base 2 and the penetrating metal body 3, respectively. The brazing material 15b on the upper surface side is joined with the brazing material 15b on the lower surface side of the heat radiating member 1, and the brazing material 15a on the upper surface side of the heat radiating member 1 may be thicker than the brazing material 15b on the lower surface side. .

これにより、電子部品11で発生した熱を熱伝導率のよい銀を主成分とする合金から成る厚い上面側のロウ材15ａでより効率よく伝達することができる。また、放熱部材１と枠体５との接合時に、放熱部材１と枠体５との熱膨張係数の違いによって放熱部材１に反りを生じさせようとする応力が生じても、上面側の厚いロウ材15ａで良好に応力を緩和することができる。よって、放熱部材１に反りが発生するのを有効に防止して放熱部材１の下面の平坦性を維持し、外部基板への密着性を良好にして放熱部材１から外部基板へ効率よく熱伝導させることができる。その結果、放熱部材１の良好な熱伝導性と外部電気回路基板への高効率な熱伝導によって、電子部品収納用パッケージ８の放熱性を高くすることができる。   As a result, the heat generated in the electronic component 11 can be more efficiently transferred by the thick upper brazing material 15a made of an alloy whose main component is silver having good thermal conductivity. Further, even when a stress that causes warpage of the heat radiating member 1 due to a difference in thermal expansion coefficient between the heat radiating member 1 and the frame body 5 occurs when the heat radiating member 1 and the frame body 5 are joined, the upper surface side is thick. The brazing material 15a can relieve stress satisfactorily. Therefore, it is possible to effectively prevent the heat radiating member 1 from warping, maintain the flatness of the lower surface of the heat radiating member 1, improve the adhesion to the external substrate, and efficiently conduct heat from the heat radiating member 1 to the external substrate. Can be made. As a result, the heat dissipation of the electronic component housing package 8 can be increased by the good heat conductivity of the heat dissipating member 1 and the highly efficient heat conduction to the external electric circuit board.

また、上下の銅板４の形成方法は、例えば、基体２の貫通穴へ貫通金属体３を埋設した後、基体２の上下面に上下の銅板４ａ，４ｂを銀を主成分とするロウ材15で接合することにより形成することができる。   The upper and lower copper plates 4 are formed by, for example, embedding the through metal body 3 in the through holes of the base 2 and then forming the upper and lower copper plates 4a and 4b on the upper and lower surfaces of the base 2 with the brazing material 15 containing silver as a main component. It can form by joining by.

銀を主成分とするロウ材15とは、銀を50質量％以上含む合金であり、例えば、Ｂ銀合金（銀が72.0質量％および銅が28.0質量％）やＡ銀合金（銀が85.0質量％および銅が15.0質量％）、等が挙げられる。   The brazing material 15 mainly composed of silver is an alloy containing 50% by mass or more of silver, for example, a B silver alloy (72.0% by mass of silver and 28.0% by mass of copper) or an A silver alloy (85.0% by mass of silver). % And 15.0% by mass of copper).

放熱部材１は、好ましくは、ロウ材15の、放熱部材１の上面側の厚みと下面側の厚みとの差が10μｍ乃至20μｍであるのがよい。上面側と下面側のロウ材15の厚みは、ロウ材15のプリフォームの量で調整される。また、銅板４の基体２との接合面側に所定高さに調整された突起を設けておいてもよい。   The heat radiating member 1 preferably has a difference between the thickness of the brazing material 15 on the upper surface side and the lower surface side of the heat radiating member 1 of 10 μm to 20 μm. The thickness of the brazing material 15 on the upper surface side and the lower surface side is adjusted by the amount of the preform of the brazing material 15. Further, a protrusion adjusted to a predetermined height may be provided on the bonding surface side of the copper plate 4 with the base 2.

そして、厚みの差が10μｍ乃至20μｍの範囲であることにより、上面側と下面側とのロウ材15の厚みバランスがとれ、貫通金属体３の周囲の基体２との間隙を通じて、下面側にロウ材15が引き寄せられるのを防止できるので、放熱部材の上面側のロウ材15の厚みばらつきが生じたり、ロウ材15の内部に、引き寄せられた側のロウ材15が周囲の空気を巻き込むことによる空隙が生じたりするのを有効に防止することができ、放熱部材１の熱伝導性を良好にすることができる。   When the thickness difference is in the range of 10 μm to 20 μm, the thickness balance of the brazing material 15 on the upper surface side and the lower surface side is balanced, and the brazing material is brazed to the lower surface side through a gap with the base 2 around the penetrating metal body 3. Because the brazing material 15 can be prevented from being attracted, the thickness variation of the brazing material 15 on the upper surface side of the heat dissipation member occurs, or the brazing material 15 on the attracting side entrains the surrounding air inside the brazing material 15 It can prevent effectively that a space | gap arises and can make the thermal conductivity of the thermal radiation member 1 favorable.

上面側のロウ材15ａと下面側のロウ材15ｂとの厚みの差が10μｍ未満の場合、上面側と下面側とのロウ材15に起因する熱応力がほぼ同じ大きさになって、上面側と下面側の熱膨張も同じとなり、その結果、放熱部材１単体では上面側と下面側との熱応力のバランスがとれて反りのない状態となるが、放熱部材１の上面に枠体５が接合されると、放熱部材１は枠体５に拘束され、放熱熱材１の上面と下面とで熱膨張の大きさが異なるようになるので、放熱部材１が搭載部10側が外周部よりも高く凸になるような反りが発生し、外部電気回路基板への密着性が悪くなって放熱部材１から外部電気回路基板へ効率よく熱伝導させることが困難となる。また、電子部品11と放熱部材１との密着性も悪くなって電子部品11から放熱部材１への熱伝導性も低下しやすくなる。   When the difference in thickness between the brazing material 15a on the upper surface side and the brazing material 15b on the lower surface side is less than 10 μm, the thermal stress caused by the brazing material 15 on the upper surface side and the lower surface side becomes almost the same, and the upper surface side As a result, the thermal expansion of the heat radiating member 1 alone is balanced between the thermal stresses on the upper surface side and the lower surface side, and there is no warpage. When joined, the heat dissipating member 1 is constrained by the frame 5 and the thermal expansion of the heat dissipating heat material 1 is different between the upper surface and the lower surface. A warp that is highly convex occurs, the adhesion to the external electric circuit board is deteriorated, and it is difficult to efficiently conduct heat from the heat dissipation member 1 to the external electric circuit board. In addition, the adhesion between the electronic component 11 and the heat radiating member 1 is deteriorated, and the thermal conductivity from the electronic component 11 to the heat radiating member 1 is likely to be lowered.

また、厚みの差が20μｍを超える場合、上面側のロウ材15ａが厚くなるため、放熱部材１の上下のロウ材15ａ，15ｂの厚みの差によって生じる放熱部材１の歪が大きくなり易いとともに、上面側のロウ材15ａに厚みばらつきが生じたり空隙が生じたりしやすくなり、熱伝導効率が低下しやすくなる。   When the difference in thickness exceeds 20 μm, the brazing material 15a on the upper surface side becomes thick, so that the distortion of the heat radiating member 1 caused by the difference in thickness between the upper and lower brazing materials 15a and 15b of the heat radiating member 1 tends to increase. Variations in thickness or voids are likely to occur in the brazing material 15a on the upper surface side, and the heat conduction efficiency tends to be reduced.

また、好ましくは、放熱部材１の上面側の銅層４ａと下面側の銅層４ｂとの厚みの差が100μｍ乃至200μｍであるのがよい。これにより、電子部品11から発せられた熱を即時に、放熱部材１に直角な方向と平行な方向の両方に非常に良好に伝達して電子部品11の放熱性を極めて向上させることができるとともに、放熱部材１の上下の銅層４の厚さの差によって生じる熱膨張差で放熱部材１が歪もうとしても、枠体５で放熱部材１を良好に拘束することができ、電子部品収納用パッケージ８の気密信頼性を良好に維持することができる。   Preferably, the difference in thickness between the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side of the heat radiating member 1 is 100 μm to 200 μm. As a result, the heat generated from the electronic component 11 can be immediately and very well transmitted to both the direction perpendicular to the heat radiating member 1 and the direction parallel to the heat radiating member 1, thereby greatly improving the heat dissipation of the electronic component 11. Even if the heat radiating member 1 is distorted due to a difference in thermal expansion caused by the difference in thickness between the upper and lower copper layers 4 of the heat radiating member 1, the heat radiating member 1 can be well restrained by the frame 5, and the electronic component can be stored. The airtight reliability of the package 8 can be maintained satisfactorily.

また、放熱部材１を約780℃に加熱することにより銅層４を焼鈍してもよい。銅層４を焼鈍することにより、銅層４の延性が大きくなり、上面側の銅層４ａと下面側の銅層４ｂとの厚さの差によって生じる熱応力が小さくなるので、放熱部材１に生じる歪みを抑制できる。なお、銅層４を焼鈍することにより熱伝導率が損なわれることはほとんどない。   Further, the copper layer 4 may be annealed by heating the heat dissipating member 1 to about 780 ° C. By annealing the copper layer 4, the ductility of the copper layer 4 is increased, and the thermal stress caused by the difference in thickness between the upper copper layer 4a and the lower copper layer 4b is reduced. The distortion which arises can be suppressed. In addition, thermal conductivity is hardly impaired by annealing the copper layer 4.

さらに、好ましくは、図４に示すように、基体２は、側面に側面金属層４ｃが被着されているのがよい。この構成により、電子部品11から発生した熱のうち放熱部材１の上面側の銅層４ａの中央部から外周部に伝わったものを基体２の側面で側面金属層４ｃを通じて放熱部材１の下面側に伝達させて放熱させることができ、上面側の銅層４ａの中央部と外周部との温度差を大きくすることができるので、上面側の銅層４ａの伝熱を効率的に行なわせることができる。そして、放熱部材１を外部電気回路基板等に載置固定することによって、電子部品11から発せられた熱を放熱部材１の下面の外部電気回路基板等に効率よく放散させることができる。その結果、電子部品11を効率的に冷却し、長期間にわたり正常かつ安定に作動させることが可能となる。   Further, preferably, as shown in FIG. 4, the base 2 has a side metal layer 4 c attached to the side surface. With this configuration, the heat generated from the electronic component 11 that has been transmitted from the central part of the copper layer 4a on the upper surface side of the heat radiating member 1 to the outer peripheral part on the lower surface side of the heat radiating member 1 on the side surface of the base 2 through the side metal layer 4c. Heat can be dissipated to dissipate heat, and the temperature difference between the central portion and the outer peripheral portion of the copper layer 4a on the upper surface side can be increased, so that the heat transfer of the copper layer 4a on the upper surface side can be performed efficiently. Can do. Then, by placing and fixing the heat radiating member 1 on an external electric circuit board or the like, the heat generated from the electronic component 11 can be efficiently dissipated to the external electric circuit board or the like on the lower surface of the heat radiating member 1. As a result, the electronic component 11 can be efficiently cooled and operated normally and stably over a long period of time.

なお、側面金属層４ｃは、基体２の側面の全周にわたって被着されている必要はなく、一部分でも上面側の銅層４ａと下面側の銅層４ｂとに接している側面金属層４ｃが被着されていればよい。例えば、放熱部材１が四角形である場合、少なくとも対向する２辺の側面で、上面側の銅層４ａと下面側の銅層４ｂとに接している側面金属層４ｃが被着されていればよい。この構成においても、電子部品11から発生する熱を下面側の銅層４ｂから十分効率よく放散させることができる。   The side metal layer 4c does not have to be applied over the entire circumference of the side surface of the substrate 2, and the side metal layer 4c in contact with the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side at least partially. It only has to be attached. For example, when the heat radiating member 1 is a quadrangle, the side metal layer 4c in contact with the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side should be attached on at least two side surfaces facing each other. . Also in this configuration, the heat generated from the electronic component 11 can be dissipated sufficiently efficiently from the lower copper layer 4b.

また、側面金属層４ｃは、上面側の銅層４ａおよび下面側の銅層４ｂと一体に連続的に形成されているのが最も好ましいが、上面側の銅層４ａと下面側の銅層４ｂとを接続するようにロウ材15を介して銅板が接合された形態、または、側面金属層４ｃが例えば上下に２分割され、間にわずかな空隙を介して隣接したり空隙にロウ材15を埋め込んだりするような形態でも十分効果を奏することができる。   The side metal layer 4c is most preferably formed integrally and continuously with the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side, but the copper layer 4a on the upper surface side and the copper layer 4b on the lower surface side. A form in which a copper plate is joined via a brazing material 15 so as to connect to each other, or the side metal layer 4c is divided into two parts, for example, vertically, and the brazing material 15 is placed adjacent to or through a slight gap between them. Even if it is embedded, the effect can be sufficiently obtained.

また、側面金属層４ｃの厚みは、上面側の銅層４ａよりも電子部品11からの距離が離れており、伝熱量を多く必要としないので上面側の銅層４ａより薄くても機能させることができ、放熱部材１の熱膨張が大きくなるのを抑制することができる。   Further, the thickness of the side metal layer 4c is such that the distance from the electronic component 11 is larger than that of the copper layer 4a on the upper surface side, and does not require a large amount of heat transfer. It is possible to suppress the thermal expansion of the heat radiating member 1 from increasing.

また、側面金属層４ｃの表面粗さは、銅層４ａの表面粗さよりも粗いのがよい。この構成により、面粗な側面金属層４ｃの表面から直接外部に放散される熱量を増大させることができ、放熱部材１の熱放散性をさらに高めることが可能となる。   Further, the surface roughness of the side metal layer 4c is preferably rougher than the surface roughness of the copper layer 4a. With this configuration, the amount of heat dissipated directly from the surface of the rough side metal layer 4c to the outside can be increased, and the heat dissipating property of the heat radiating member 1 can be further enhanced.

側面金属層４ｃは、銅，銀，銀−銅合金等の熱伝導率が高く熱伝達性に優れた材料から成るのがよい。また、側面金属層４ｃの基体２への被着方法は、上面側の銅層４ａと下面側の銅層４ｂと同様の方法によって被着させたり、放熱部材１と枠体５との接着固定用のロウ材が銀ロウ，銀−銅ロウ等のロウ材である場合には、このロウ材を基体２の側面に垂れ込ませたりすることによって形成されるロウ材層により実現してもよい。   The side metal layer 4c is preferably made of a material having high thermal conductivity such as copper, silver, or a silver-copper alloy and having excellent heat transfer properties. The side metal layer 4c is attached to the base 2 by the same method as that for the upper surface copper layer 4a and the lower surface copper layer 4b, or the heat radiating member 1 and the frame 5 are bonded and fixed. When the brazing material used is a brazing material such as silver brazing or silver-copper brazing, the brazing material may be realized by brazing the brazing material to the side surface of the base 2. .

また、好ましくは、図３に示すように、貫通金属体３の外周は、電子部品11の外周より大きくなっているのがよく、特に好ましくは、貫通金属体３の側面と電子部品11の側面との間の距離が基体２の厚みＴであるように大きくなっているのがよい。これにより、電子部品11で発生した熱を放熱部材１の上面の電子部品11の搭載部10から放熱部材１の下面へと垂直な方向に多く伝えることができるとともに、貫通金属体３内においても電子部品11の外周から外側へ放熱部材１の主面に平行な方向への熱の広がりを持たせることが可能となり、放熱性をより向上させることができる。   Preferably, as shown in FIG. 3, the outer periphery of the through metal body 3 is larger than the outer periphery of the electronic component 11, and particularly preferably the side surface of the through metal body 3 and the side surface of the electronic component 11. It is preferable that the distance between the two is large so as to be the thickness T of the base 2. As a result, a large amount of heat generated in the electronic component 11 can be transmitted from the mounting portion 10 of the electronic component 11 on the upper surface of the heat radiating member 1 to the lower surface of the heat radiating member 1 and also in the through metal body 3. It becomes possible to give heat spread in a direction parallel to the main surface of the heat dissipation member 1 from the outer periphery to the outside of the electronic component 11, and heat dissipation can be further improved.

なお、貫通金属体３の外周は、電子部品11の外周に対して基体２の厚みＴよりも大きくなると、貫通金属体３の熱膨張が大きくなって搭載部10が歪みやすくなる。その結果、電子部品11が剥離しやすくなる。   When the outer periphery of the through metal body 3 is larger than the thickness T of the base 2 with respect to the outer periphery of the electronic component 11, the thermal expansion of the through metal body 3 increases and the mounting portion 10 is easily distorted. As a result, the electronic component 11 is easily peeled off.

また、放熱部材１の下面側、即ち、電子部品11が搭載される搭載部10とは反対側の銅層４ｂの表面の算術平均粗さＲａは、Ｒａ≦30μｍであることが好ましい。通常、電子部品収納用パッケージ８は、アルミニウムや銅等の金属体あるいは、高熱伝導を有するセラミック体から成る支持基板へネジ止めにより、またははんだ等の溶融金属やロウ材を用いて接続される。このとき、基体２の下面の銅層４ｂの下面の算術平均粗さＲａがＲａ＞30μｍの場合には、電子部品収納用パッケージ８と支持基板とを十分に密着させることが困難となり、両者の間に空隙やボイドが発生しやすくなり、その結果、電子部品11で発生した熱を電子部品収納用パッケージ８からこの支持基板へ効率よく伝達させることができなくなるおそれがある。従って、下面の銅層４ｂの外側表面となる下面は、支持基板との良好な密着性が得られるように、Ｒａ≦30μｍの平滑面であることが望ましい。   In addition, the arithmetic average roughness Ra of the surface of the copper layer 4b on the lower surface side of the heat dissipation member 1, that is, the side opposite to the mounting portion 10 on which the electronic component 11 is mounted, is preferably Ra ≦ 30 μm. Usually, the electronic component storage package 8 is connected to a support substrate made of a metal body such as aluminum or copper or a ceramic body having high thermal conductivity by screwing or using a molten metal such as solder or a brazing material. At this time, when the arithmetic average roughness Ra of the lower surface of the copper layer 4b on the lower surface of the base 2 is Ra> 30 μm, it is difficult to sufficiently bring the electronic component storage package 8 and the support substrate into close contact with each other. Air gaps and voids are likely to occur between them, and as a result, there is a possibility that heat generated in the electronic component 11 cannot be efficiently transferred from the electronic component storage package 8 to the support substrate. Therefore, the lower surface, which is the outer surface of the lower copper layer 4b, is preferably a smooth surface with Ra ≦ 30 μm so that good adhesion to the support substrate can be obtained.

銅層４ａ，４ｂの厚みは、それぞれ800μｍより厚くなると厚み１〜３ｍｍの基体２と銅層４ａ，４ｂとの熱膨張差によって発生する応力が大きくなり十分な接合強度が得られない傾向があることから、800μｍ以下としておくことが望ましい。また、銅層４ａ，４ｂの厚みが50μｍ以上であれば、電子部品11の作動に伴い発生する熱が銅層４ａ，４ｂの平面方向に十分広がるので、放熱部材１の熱放散性はさらに向上することから50μｍ以上としておくことが望ましい。   If the thickness of each of the copper layers 4a and 4b is greater than 800 μm, the stress generated by the difference in thermal expansion between the base body 2 having a thickness of 1 to 3 mm and the copper layers 4a and 4b tends to increase, and sufficient bonding strength tends not to be obtained. Therefore, it is desirable that the thickness is 800 μm or less. Further, if the thickness of the copper layers 4a and 4b is 50 μm or more, the heat generated by the operation of the electronic component 11 is sufficiently spread in the plane direction of the copper layers 4a and 4b. Therefore, it is desirable to set it to 50 μm or more.

なお、放熱部材１の基体２の上下面に接合される銅層４（４ａ，４ｂ）の材料は、純銅に限られるものではなく、熱伝導性が良好でタングステンまたはモリブデンと銅とのマトリックスである基体２と十分な接合強度が得られるものであれば、銅を主成分とする各種の銅合金であっても構わない。   The material of the copper layer 4 (4a, 4b) bonded to the upper and lower surfaces of the base 2 of the heat radiating member 1 is not limited to pure copper, but has a good thermal conductivity and is a matrix of tungsten or molybdenum and copper. Various copper alloys containing copper as a main component may be used as long as sufficient bonding strength with a certain substrate 2 can be obtained.

また、放熱部材１の基体２の上下面に接合される銅層４（４ａ，４ｂ）は、少なくとも放熱部材１と枠体５とからなる凹部５ａの底面と同じ面積で上下面に形成されれば十分であり、必ずしも図１，図２に示すように放熱部材１の上下面の全面を覆うように形成される必要はない。側面金属層４ｃを設ける場合は、側面金属層４ｃが設けられている側面方向にのみ延在するように銅層４を設ければよい。   Also, the copper layers 4 (4a, 4b) bonded to the upper and lower surfaces of the base 2 of the heat radiating member 1 are formed on the upper and lower surfaces at least in the same area as the bottom surface of the recess 5a made of the heat radiating member 1 and the frame body 5. 1 and FIG. 2, it is not always necessary to cover the entire upper and lower surfaces of the heat dissipating member 1 as shown in FIGS. When the side metal layer 4c is provided, the copper layer 4 may be provided so as to extend only in the side surface direction where the side metal layer 4c is provided.

かくして、上述の電子部品収納用パッケージ８によれば、放熱部材１の搭載部10上に電子部品11をガラス，樹脂，ロウ材等から成る接着剤を介して接着固定するとともに、電子部品11の各電極をボンディングワイヤ12を介して所定の配線導体６に電気的に接続し、しかる後に、放熱部材１と枠体５とからなる凹部５ａの内側に電子部品11を覆うようにエポキシ樹脂等の封止樹脂13を充填して電子部品11を封入することによって、あるいは、樹脂や金属，セラミックス等から成る蓋体を枠体５の上面に凹部５ａを覆うように取着して電子部品11を封入することによって製品としての電子装置14となる。   Thus, according to the electronic component storage package 8 described above, the electronic component 11 is bonded and fixed onto the mounting portion 10 of the heat radiating member 1 via an adhesive made of glass, resin, brazing material, and the like. Each electrode is electrically connected to a predetermined wiring conductor 6 via a bonding wire 12, and then an epoxy resin or the like is applied so as to cover the electronic component 11 inside the recess 5a formed of the heat dissipation member 1 and the frame body 5. The electronic component 11 is sealed by filling the sealing resin 13 and enclosing the electronic component 11, or by attaching a lid made of resin, metal, ceramics, or the like so as to cover the recess 5 a on the upper surface of the frame 5. By encapsulating, it becomes the electronic device 14 as a product.

なお、本発明は以上の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更が可能である。例えば、電子部品11で発生した熱を放熱部材１から大気中に効率よく放散させるために、放熱部材１の基体２および貫通金属体３の下面に接合される銅層４ｂの下面が放熱フィンの形状に成形されたり、銅層４ｂに放熱フィンを接合して放熱フィンが放熱部材１の銅層４ｂと一体化した形状としたりしてもよく、これによって、電子部品11の作動に伴い発生する熱を放熱部材１により吸収するとともに大気中に放散させる作用をさらに向上することができる。   In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, in order to efficiently dissipate heat generated in the electronic component 11 from the heat radiating member 1 to the atmosphere, the lower surface of the copper layer 4b joined to the lower surface of the base 2 and the through metal body 3 of the heat radiating member 1 It may be formed into a shape, or a heat radiating fin may be joined to the copper layer 4b to form a shape in which the heat radiating fin is integrated with the copper layer 4b of the heat radiating member 1. The action of absorbing heat by the heat radiating member 1 and dissipating it into the atmosphere can be further improved.

本発明の電子部品収納用パッケージおよびそれを用いた本発明の電子装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention, and the electronic device of this invention using the same. 本発明の電子部品収納用パッケージおよびそれを用いた本発明の電子装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the electronic component storage package of this invention, and the electronic device of this invention using the same. 図１または図２の電子部品収納用パッケージの要部拡大平面図である。FIG. 3 is an enlarged plan view of a main part of the electronic component storage package of FIG. 1 or FIG. 2. 本発明の電子部品収納用パッケージおよびそれを用いた本発明の電子装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the electronic component storage package of this invention, and the electronic device of this invention using the same. 従来の電子装置の例を示す断面図である。It is sectional drawing which shows the example of the conventional electronic device.

符号の説明Explanation of symbols

１・・・・・・・・・・放熱部材
２・・・・・・・・・・基体
３・・・・・・・・・・貫通金属体
４、４ａ、４ｂ・・・・銅層
４ｃ・・・・・・・・・側面金属層
５・・・・・・・・・・枠体
５ａ・・・・・・・・・凹部
６・・・・・・・・・・配線導体
８・・・・・・・・・・電子部品収納用パッケージ
10・・・・・・・・・・搭載部
11・・・・・・・・・・電子部品
14・・・・・・・・・・電子装置
15、15ａ、15ｂ・・・ロウ材 DESCRIPTION OF SYMBOLS 1 ..... Radiation member 2 ...... Base | substrate 3 ..... Penetration metal body 4, 4a, 4b .... Copper layer 4c ··········· Side metal layer 5 ········································································ 8 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Electronic component storage package
10 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Mounting part
11 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Electronic parts
14 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Electronic equipment
15, 15a, 15b ... brazing material

Claims (7)

上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、該放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出する複数の配線導体を有する枠体とを具備しており、前記放熱部材は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体が埋設されているとともに、前記基体および前記貫通金属体の上下面を覆ってそれぞれ銅層が形成されており、前記放熱部材の上面側の前記銅層は下面側の前記銅層より厚いことを特徴とする電子部品収納用パッケージ。 A frame having a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and a plurality of wiring conductors that are attached to the upper surface of the heat radiating member so as to surround the mounting portion and lead out from the inner surface to the outer surface. The heat radiating member is made of copper or an alloy containing copper as a main component from the upper surface to the lower surface of a central portion of a frame-like base body formed by impregnating a sintered body made of tungsten or molybdenum with copper. A through metal body is embedded, and copper layers are formed to cover the upper surface and the lower surface of the base body and the through metal body, respectively, and the copper layer on the upper surface side of the heat radiating member is more than the copper layer on the lower surface side. Electronic component storage package characterized by being thick. 上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、該放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出する複数の配線導体を有する枠体とを具備しており、前記放熱部材は、タングステンまたはモリブデンから成る焼結体に銅を含浸させて成る枠状の基体の中央部の上面から下面にかけて銅または銅を主成分とする合金から成る貫通金属体が埋設されているとともに、前記基体および前記貫通金属体の上下面を覆ってそれぞれ銅板が銀を主成分とする合金から成るロウ材を介して接合されることによって銅層が形成されており、前記ロウ材は、前記放熱部材の上面側のものが下面側のものよりも厚いことを特徴とする電子部品収納用パッケージ。 A frame having a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and a plurality of wiring conductors that are attached to the upper surface of the heat radiating member so as to surround the mounting portion and lead out from the inner surface to the outer surface. The heat radiating member is made of copper or an alloy containing copper as a main component from the upper surface to the lower surface of a central portion of a frame-like base body formed by impregnating a sintered body made of tungsten or molybdenum with copper. A through metal body is embedded, and a copper layer is formed by bonding a copper plate covering the base and the top and bottom surfaces of the through metal body via a brazing material made of an alloy mainly composed of silver. The electronic component housing package is characterized in that the brazing material is thicker on the upper surface side of the heat radiating member than on the lower surface side. 前記ロウ材は、前記放熱部材の上面側の厚みと下面側の厚みの差が１０μｍ乃至２０μｍであることを特徴とする請求項２記載の電子部品収納用パッケージ。 3. The electronic component storage package according to claim 2, wherein the brazing material has a difference in thickness between the upper surface side and the lower surface side of the heat radiating member of 10 μm to 20 μm. 前記放熱部材の前記基体は、その外側面に側面金属層が被着されていることを特徴とする請求項１乃至請求項３のいずれかに記載の電子部品収納用パッケージ。 The electronic component storage package according to any one of claims 1 to 3, wherein a side metal layer is attached to an outer side surface of the base of the heat radiating member. 前記放熱部材の上面側の前記銅層と下面側の前記銅層との厚みの差が１００μｍ乃至２００μｍであることを特徴とする請求項１乃至請求項４のいずれかに記載の電子部品収納用パッケージ。 5. The electronic component storage device according to claim 1, wherein a difference in thickness between the copper layer on the upper surface side and the copper layer on the lower surface side of the heat radiating member is 100 μm to 200 μm. package. 前記放熱部材の上面側の前記銅層および下面側の前記銅層の少なくとも一方は、前記放熱部材の中央部から外周部にかけて漸次厚くなっていることを特徴とする請求項１乃至請求項５のいずれかに記載の電子部品収納用パッケージ。 The at least one of the copper layer on the upper surface side and the copper layer on the lower surface side of the heat radiating member is gradually thickened from the central portion to the outer peripheral portion of the heat radiating member. The electronic component storage package according to any one of the above. 請求項１乃至請求項６のいずれかに記載の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記枠体の上面に前記電子部品を覆うように取着された蓋体または前記枠体の内側に前記電子部品を覆うように充填された封止樹脂とを具備していることを特徴とする電子装置。 The electronic component storage package according to any one of claims 1 to 6, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an upper surface of the frame body An electronic device comprising: a lid attached to cover the electronic component; or a sealing resin filled inside the frame so as to cover the electronic component.
JP2004341671A 2004-01-28 2004-11-26 Package for electronic component housing, and electronic device Pending JP2006013420A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009016621A (en) * 2007-07-05 2009-01-22 Toshiba Corp Heat dissipation plate for semiconductor package, and semiconductor device
JP2009239299A (en) * 2007-07-09 2009-10-15 Jfe Seimitsu Kk Package constituted of heat-dissipation component for semiconductors as base material
US7732916B2 (en) 2007-02-15 2010-06-08 Kabushiki Kaisha Toshiba Semiconductor package
CN112005366A (en) * 2018-04-26 2020-11-27 京瓷株式会社 Heat dissipation substrate and electronic device
JP2021009934A (en) * 2019-07-01 2021-01-28 三井化学株式会社 Heat dissipation component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7732916B2 (en) 2007-02-15 2010-06-08 Kabushiki Kaisha Toshiba Semiconductor package
US7911794B2 (en) 2007-02-15 2011-03-22 Kabushiki Kaisha Toshiba Semiconductor package
US8049316B2 (en) 2007-02-15 2011-11-01 Kabushiki Kaisha Toshiba Semiconductor package
JP2009016621A (en) * 2007-07-05 2009-01-22 Toshiba Corp Heat dissipation plate for semiconductor package, and semiconductor device
US7745928B2 (en) 2007-07-05 2010-06-29 Kabushiki Kaisha Toshiba Heat dissipation plate and semiconductor device
JP4558012B2 (en) * 2007-07-05 2010-10-06 株式会社東芝 Semiconductor package heat dissipation plate and semiconductor device
JP2009239299A (en) * 2007-07-09 2009-10-15 Jfe Seimitsu Kk Package constituted of heat-dissipation component for semiconductors as base material
CN112005366A (en) * 2018-04-26 2020-11-27 京瓷株式会社 Heat dissipation substrate and electronic device
JP2021009934A (en) * 2019-07-01 2021-01-28 三井化学株式会社 Heat dissipation component

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