JP2006007669A - プリント基板の製造方法、プリント基板、インクジェットヘッド及びインクジェットヘッドの製造方法 - Google Patents
プリント基板の製造方法、プリント基板、インクジェットヘッド及びインクジェットヘッドの製造方法 Download PDFInfo
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- JP2006007669A JP2006007669A JP2004190205A JP2004190205A JP2006007669A JP 2006007669 A JP2006007669 A JP 2006007669A JP 2004190205 A JP2004190205 A JP 2004190205A JP 2004190205 A JP2004190205 A JP 2004190205A JP 2006007669 A JP2006007669 A JP 2006007669A
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- H—ELECTRICITY
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- H—ELECTRICITY
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Abstract
【解決手段】 フレキシブルプリント基板50を製造するには、まず、ベースフィルム46に周囲よりも厚みが小さい肉薄領域53を形成する。次に、ベースフィルム46の下面に、肉薄領域53と対向する位置に形成された端子部48aを含む導体パターン47を形成する。次に、パンチ91によって肉薄領域53をベースフィルム46の上面側から押圧し、ベースフィルム46に凸部51及び凹部52を形成する。
【選択図】 図16
Description
21 アクチュエータユニット(圧電アクチュエータ)
31〜34 圧電シート
35 個別電極
36 ランド部(端子)
37 共通電極
46 ベースフィルム(フレキシブル層)
48a 端子部(導電膜、接合部)
48b 配線
50 FPC(プリント基板、信号伝送基板)
51 凸部
52 凹部
53 肉薄領域
54 テーパ面
55 突出部
56 接着剤
91 パンチ(押圧部材)
Claims (14)
- 絶縁性のフレキシブル層に、周囲よりも厚みの小さい肉薄領域を形成する工程と、
前記フレキシブル層の一方の面に、少なくとも一部が前記肉薄領域内に存在する導電膜を形成する工程と、
前記フレキシブル層の前記肉薄領域をその他方の面から前記一方の面に向けて押圧し、先端が前記導電膜によって覆われた凸部を前記一方の面に形成する工程とを備えていることを特徴とするプリント基板の製造方法。 - 絶縁性のフレキシブル層の一方の面に導電膜を形成する工程と、
前記フレキシブル層に、周囲よりも厚みが小さく且つ前記一方の面に形成された前記導電膜の少なくとも一部が存在する肉薄領域を形成する工程と、
前記フレキシブル層の前記肉薄領域をその他方の面から前記一方の面に向けて押圧し、先端が前記導電膜によって覆われた凸部を前記一方の面に形成する工程とを備えていることを特徴とするプリント基板の製造方法。 - 前記肉薄領域を形成する工程において、前記フレキシブル層の前記他方の面に除去加工を施すことによって前記肉薄領域を形成することを特徴とする請求項1又は2に記載のプリント基板の製造方法。
- 前記肉薄領域を形成する工程において、前記フレキシブル層の前記他方の面からエッチングを施すことによって前記肉薄領域を形成することを特徴とする請求項1〜3のいずれか1項に記載のプリント基板の製造方法。
- 前記肉薄領域を形成する工程において、前記フレキシブル層の前記他方の面にレーザ光線を照射することによって前記肉薄領域を形成することを特徴とする請求項1〜3のいずれか1項に記載のプリント基板の製造方法。
- 前記凸部を形成する工程において、前記凸部の全域が前記肉薄領域に含まれるように押圧量を調整することを特徴とする請求項1〜5のいずれか1項に記載のプリント基板の製造方法。
- 前記導電膜を形成する工程において、前記導電膜に接続されて前記フレキシブル層上において延在する配線を、前記導電膜と共に前記一方の面に形成することを特徴とする請求項1〜6のいずれか1項に記載のプリント基板の製造方法。
- 一方の面に凸部が他方の面の前記凸部に対向する位置に凹部が形成された絶縁性のフレキシブル層と、
少なくとも前記一方の面に形成された前記凸部の先端を被覆する導電膜とを備えており、
前記フレキシブル層において少なくとも前記凸部の先端に対応した領域が、周囲よりも厚みが小さい肉薄領域であることを特徴とするプリント基板。 - 前記フレキシブル層において前記凸部の全域が前記肉薄領域であることを特徴とする請求項8に記載のプリント基板。
- 前記肉薄領域の周縁が外に開いたテーパー面となっていることを特徴とする請求項8又は9に記載のプリント基板。
- 前記一方の面に形成され、前記導電膜に接続されて前記フレキシブル層上において延在する配線をさらに備えていることを特徴とする請求項8〜10のいずれか1項に記載のプリント基板。
- 積層された複数の圧電シートと、最外層にある前記圧電シートの表面にインク吐出チャネル毎に対応するように形成された端子とを含む圧電アクチュエータと、
一方の面に凸部が他方の面の前記凸部に対向する位置に凹部が形成された絶縁性のフレキシブル層、及び、少なくとも前記一方の面に形成された前記凸部の先端を被覆する導電性の接合部を含んでいると共に、前記フレキシブル層において少なくとも前記凸部の先端に対応した領域が、周囲よりも厚みが小さい肉薄領域である信号伝送基板とを備えており、
前記信号伝送基板は、前記接合部が前記端子に接触するように前記圧電アクチュエータに対して配置されていることを特徴とするインクジェットヘッド。 - 一面に複数の端子を有する圧電アクチュエータを備えたヘッド本体と、前記圧電アクチュエータと接合される信号伝送基板とを有するインクジェットヘッドの製造方法であって、
前記信号伝送基板を、
絶縁性を有するフレキシブル層に、周囲よりも厚みが小さい肉薄領域を形成する工程と、
前記フレキシブル層の一方の面に、少なくとも一部が前記肉薄領域内に存在する前記圧電アクチュエータの端子と接合される導電性の接合部と、前記接合部に電気的に接続された導電性の配線とを形成する工程と、
前記フレキシブル層の前記肉薄領域をその他方の面から前記一方の面に向けて押圧し、先端が前記接合部によって覆われた凸部を前記一方の面に形成する工程とを経て形成し、
さらに、前記端子と前記凸部の先端を覆う前記接合部とが互いに接触した状態で前記圧電アクチュエータと前記信号伝送基板とを接合する工程を備えていることを特徴とするインクジェットヘッドの製造方法。 - 一面に複数の端子を有する圧電アクチュエータを備えたヘッド本体と、前記圧電アクチュエータと接合される信号伝送基板とを有するインクジェットヘッドの製造方法であって、
前記信号伝送基板を、
絶縁性を有するフレキシブル層の一方の面に、前記圧電アクチュエータの端子と接合される導電性の接合部と、前記接合部に電気的に接続された導電性の配線とを形成する工程と、
前記フレキシブル層に、周囲よりも厚みが小さく且つ前記一方の面に形成された接合部の少なくとも一部が存在する肉薄領域を形成する工程と、
前記フレキシブル層の前記肉薄領域をその他方の面から前記一方の面に向けて押圧し、先端が前記接合部によって覆われた凸部を前記一方の面に形成する工程とを経て形成し、
さらに、前記端子と前記凸部の先端を覆う前記接合部とが互いに接触した状態で前記圧電アクチュエータと前記信号伝送基板とを接合する工程を備えていることを特徴とするインクジェットヘッドの製造方法。
Priority Applications (5)
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JP2004190205A JP2006007669A (ja) | 2004-06-28 | 2004-06-28 | プリント基板の製造方法、プリント基板、インクジェットヘッド及びインクジェットヘッドの製造方法 |
EP05254027A EP1612047B1 (en) | 2004-06-28 | 2005-06-28 | Flat connector, ink jet head and method of manufacturing them |
DE602005013609T DE602005013609D1 (de) | 2004-06-28 | 2005-06-28 | Flachverbinder, Tintenstrahlkopf und dazugehöriges Herstellungsverfahren |
US11/167,288 US7310869B2 (en) | 2004-06-28 | 2005-06-28 | Flat connector, ink jet head and method of manufacturing them |
US11/674,181 US7320603B2 (en) | 2004-06-28 | 2007-02-13 | Flat connector |
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JP2004190205A JP2006007669A (ja) | 2004-06-28 | 2004-06-28 | プリント基板の製造方法、プリント基板、インクジェットヘッド及びインクジェットヘッドの製造方法 |
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US (2) | US7310869B2 (ja) |
EP (1) | EP1612047B1 (ja) |
JP (1) | JP2006007669A (ja) |
DE (1) | DE602005013609D1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013067166A (ja) * | 2011-09-22 | 2013-04-18 | Xerox Corp | 密度が制限されたフレックス回路を使用した高密度電気相互接続 |
JP2016124222A (ja) * | 2015-01-05 | 2016-07-11 | セイコーエプソン株式会社 | 液体噴射ヘッドおよびその製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8628173B2 (en) * | 2010-06-07 | 2014-01-14 | Xerox Corporation | Electrical interconnect using embossed contacts on a flex circuit |
US8888254B2 (en) | 2012-09-13 | 2014-11-18 | Xerox Corporation | High density three-dimensional electrical interconnections |
Family Cites Families (13)
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US4036546A (en) * | 1973-11-26 | 1977-07-19 | Thompson John T | Parts comprising a metal strap, U-shaped metal clip, and adjustable clamping means, for making an electrical terminal assembly |
US4256359A (en) * | 1979-05-25 | 1981-03-17 | Thomas & Betts Corporation | Termination connector |
JPH0410360A (ja) | 1990-04-25 | 1992-01-14 | Fuji Electric Co Ltd | 燃料電池発電装置 |
JP2826172B2 (ja) | 1990-05-28 | 1998-11-18 | イビデン株式会社 | モータ |
US5213511A (en) | 1992-03-27 | 1993-05-25 | Hughes Aircraft Company | Dimple interconnect for flat cables and printed wiring boards |
US5288235A (en) | 1992-12-14 | 1994-02-22 | Hughes Aircraft Company | Electrical interconnects having a supported bulge configuration |
JPH08511114A (ja) * | 1993-05-14 | 1996-11-19 | アムフェノル−トゥヘル、エレクトロニクス、ゲー エム ベー ハー | チップカードのコンタクトシステム又は読み取り機 |
JP3589277B2 (ja) | 1997-01-27 | 2004-11-17 | セイコーエプソン株式会社 | インクジェット式記録ヘッド |
US5992996A (en) * | 1998-08-10 | 1999-11-30 | Sawyer; Robert N. | Protective eyewear including an integral thermoluminescent dosimetry chip for measuring facial exposure to ionizing radiation |
JP2001077495A (ja) | 1999-09-02 | 2001-03-23 | Fujitsu Ltd | 電子部品用コンタクタ及び電子部品の試験方法 |
JP3903893B2 (ja) | 2002-09-24 | 2007-04-11 | ブラザー工業株式会社 | インクジェットヘッド |
JP3885696B2 (ja) | 2002-09-24 | 2007-02-21 | ブラザー工業株式会社 | インクジェットヘッド |
JP4276881B2 (ja) * | 2003-04-30 | 2009-06-10 | 日本圧着端子製造株式会社 | 多層プリント配線板の接続構造 |
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2004
- 2004-06-28 JP JP2004190205A patent/JP2006007669A/ja active Pending
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2005
- 2005-06-28 EP EP05254027A patent/EP1612047B1/en not_active Expired - Fee Related
- 2005-06-28 US US11/167,288 patent/US7310869B2/en active Active
- 2005-06-28 DE DE602005013609T patent/DE602005013609D1/de active Active
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013067166A (ja) * | 2011-09-22 | 2013-04-18 | Xerox Corp | 密度が制限されたフレックス回路を使用した高密度電気相互接続 |
JP2016124222A (ja) * | 2015-01-05 | 2016-07-11 | セイコーエプソン株式会社 | 液体噴射ヘッドおよびその製造方法 |
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US20050287835A1 (en) | 2005-12-29 |
US20070128924A1 (en) | 2007-06-07 |
DE602005013609D1 (de) | 2009-05-14 |
EP1612047B1 (en) | 2009-04-01 |
US7320603B2 (en) | 2008-01-22 |
EP1612047A1 (en) | 2006-01-04 |
US7310869B2 (en) | 2007-12-25 |
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