JP2005351792A - Vibrating gyroscope and circuit board - Google Patents

Vibrating gyroscope and circuit board Download PDF

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JP2005351792A
JP2005351792A JP2004173789A JP2004173789A JP2005351792A JP 2005351792 A JP2005351792 A JP 2005351792A JP 2004173789 A JP2004173789 A JP 2004173789A JP 2004173789 A JP2004173789 A JP 2004173789A JP 2005351792 A JP2005351792 A JP 2005351792A
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vibration gyro
legs
vibrating gyroscope
electrically connected
connection pad
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Shigeo Matsunuma
繁男 松沼
Satoru Emoto
哲 江本
Naoki Ishikawa
直樹 石川
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Fujitsu Ltd
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Fujitsu Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a vibrating gyroscope which will not disturbed of secondary vibration, has proper characteristics and can reduce its size. <P>SOLUTION: The vibrating gyroscope 20 comprises a two-leg tuning fork type sensor body 13 consisting of a piezoelectric material, of which the two legs 11a, 11b are connected in parallel with a connection part 12, drive electrodes 14a, 14b, detection electrodes 15a, 15b and a connection pad provided to the connection part 12 and electrically connected each with the drive electrodes and the detection electrodes of each leg. The connection pad 21a to 21d are arranged on a hypothetical line A in parallel to the two legs 11a, 11b and at equal distances from the two legs 11a, 11b. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、振動ジャイロおよびこの振動ジャイロが搭載された回路基板に関する。   The present invention relates to a vibration gyro and a circuit board on which the vibration gyro is mounted.

振動ジャイロは、水晶、セラミック等の圧電材料を2脚音叉型に加工したものであり、物体の角加速度を検知する。その検知原理は、音叉の脚をある1方向に振動(一次振動)させたときに、その脚の質量に角速度が加わると、「コリオリ」効果でそれに直交する方向にも振動(二次振動)が発生することを利用するものである。   The vibrating gyroscope is obtained by processing a piezoelectric material such as crystal or ceramic into a two-leg tuning fork type, and detects the angular acceleration of an object. The principle of detection is that when a tuning fork leg is vibrated in one direction (primary vibration), if an angular velocity is applied to the mass of the leg, the "Coriolis" effect also vibrates in the direction perpendicular to it (secondary vibration). It is used to generate.

図5は従来の振動ジャイロ10の一例を示す説明図である。
振動ジャイロ10は、2本の脚11a、11bが平行に連結部12に連結された、圧電材料からなる2脚音叉型センサ本体13と、各脚11a、11bにそれぞれ設けられた駆動電極14a、14bおよび検出電極15a、15bとを有し、このセンサ本体13が、基台16に取り付けられ、基台16に設けた電極と対応する駆動電極14a、14bおよび検出電極15a、15bとの間がワイヤ17によって電気的に接続されて成る。振動ジャイロ10は、基台16を介して実装基板18に搭載される。
FIG. 5 is an explanatory view showing an example of a conventional vibrating gyroscope 10. As shown in FIG.
The vibrating gyroscope 10 includes a two-leg tuning fork type sensor main body 13 made of a piezoelectric material in which two legs 11a and 11b are connected in parallel to a connecting portion 12, and drive electrodes 14a provided on the legs 11a and 11b, respectively. 14b and detection electrodes 15a and 15b. The sensor body 13 is attached to the base 16, and the electrodes provided on the base 16 and the corresponding drive electrodes 14a and 14b and the detection electrodes 15a and 15b are connected to each other. The wire 17 is electrically connected. The vibrating gyroscope 10 is mounted on the mounting substrate 18 via the base 16.

図6は従来の振動ジャイロ10の他の一例を示す説明図である。
この従来例の振動ジャイロ10は、連結部12の前面側両サイドに接続パッド19a、19b、19c、19dが設けられていて、これら接続パッドと対応する駆動電極および検出電極との間がワイヤ17との間が電気的に接続されて成る。この振動ジャイロ10は適宜な取付治具を介して実装基板18に搭載され、接続パッド19a、19b、19c、19dと、実装基板18に設けられた接続パッド(図示せず)との間がワイヤ(図示せず)で電気的に接続される。
FIG. 6 is an explanatory view showing another example of the conventional vibrating gyroscope 10. As shown in FIG.
In this conventional vibrating gyroscope 10, connection pads 19a, 19b, 19c, and 19d are provided on both sides of the front surface of the connecting portion 12, and a wire 17 is provided between these connection pads and the corresponding drive electrode and detection electrode. Are electrically connected to each other. The vibrating gyroscope 10 is mounted on the mounting board 18 via an appropriate mounting jig, and a wire is formed between the connection pads 19a, 19b, 19c, and 19d and a connection pad (not shown) provided on the mounting board 18. (Not shown) are electrically connected.

図7〜図9は、振動ジャイロ10におけるセンサ10a、10bの振動の状態を示す模式図であり、図7は一次振動モードを、図8は二次振動モードを示す。
図5に示す従来の振動ジャイロ10の場合、駆動電極14a、14bおよび検出電極15a、15bが、これら電極に対して、下方かつ側方に位置する基台16上の部位に設けられた電極にワイヤ17により電気的に接続されているので、ワイヤ17がセンサ本体13の側方に突出し、大型化するだけでなく、図9に示すように、脚11a、11bが二次振動して捩れる際、ワイヤ17の剛性等により二次振動が阻害され、特性が劣化するおそれがある。
7 to 9 are schematic views showing the vibration states of the sensors 10a and 10b in the vibration gyro 10. FIG. 7 shows the primary vibration mode and FIG. 8 shows the secondary vibration mode.
In the case of the conventional vibrating gyroscope 10 shown in FIG. 5, the drive electrodes 14a and 14b and the detection electrodes 15a and 15b are electrodes provided at portions on the base 16 that are located below and on the side of the electrodes. Since the wires 17 are electrically connected to each other, the wires 17 protrude to the side of the sensor body 13 and increase in size, and as shown in FIG. 9, the legs 11a and 11b are secondarily vibrated and twisted. At this time, the secondary vibration is hindered by the rigidity of the wire 17 and the characteristics may be deteriorated.

図6に示す従来の振動ジャイロ10の場合も、接続パッド19a、19b、19c、19dが連結部12の両サイドに設けられているため、ワイヤ17の剛性により二次振動が阻害されるおそれがある。また、接続パッド19a、19b、19c、19dと実装基板18の接続パッドとを電気的に接続するワイヤもセンサ本体13の側方に突出するため、大型化するという課題がある。
そこで、本発明は上記課題を解決すべくなされたものであり、その目的とするところは、二次振動が阻害されず特性が良好で、かつ小型化も可能となる振動ジャイロおよびこの振動ジャイロを搭載した回路基板を提供するにある。
Also in the case of the conventional vibrating gyroscope 10 shown in FIG. 6, since the connection pads 19 a, 19 b, 19 c, 19 d are provided on both sides of the connecting portion 12, there is a possibility that the secondary vibration is hindered by the rigidity of the wire 17. is there. Further, since the wires for electrically connecting the connection pads 19a, 19b, 19c, and 19d and the connection pads of the mounting substrate 18 also protrude to the side of the sensor body 13, there is a problem that the size is increased.
Accordingly, the present invention has been made to solve the above-described problems, and the object of the present invention is to provide a vibrating gyroscope and a vibrating gyroscope that have good characteristics without being inhibited by secondary vibrations and can be downsized. To provide a mounted circuit board.

本発明に係る振動ジャイロは、2本の脚が平行に連結部に連結された圧電材料からなる2脚音叉型センサ本体と、各脚にそれぞれ設けられた駆動電極および検出電極と、連結部に設けられ、各脚の駆動電極および検出電極にそれぞれ電気的に接続された接続パッドとを具備する振動ジャイロにおいて、前記接続パッドは、前記2本の脚と平行で、かつ2本の脚から等距離にある仮想直線上に配置されていることを特徴とする。
前記駆動電極と検出電極は、ワイヤにより対応する前記接続パッドに電気的に接続してもよいし、センサ本体に設けられた配線パターンにより接続してもよい。
A vibrating gyroscope according to the present invention includes a two-leg tuning fork type sensor main body made of a piezoelectric material having two legs connected in parallel to a connecting portion, a drive electrode and a detection electrode provided on each leg, and a connecting portion. And a connection pad electrically connected to the drive electrode and the detection electrode of each leg. The connection pad is parallel to the two legs and from the two legs. It is arranged on an imaginary straight line at a distance.
The drive electrode and the detection electrode may be electrically connected to the corresponding connection pad by a wire, or may be connected by a wiring pattern provided on the sensor body.

また、本発明に係る回路基板は、上記振動ジャイロが、取付治具により実装基板に固定され、振動ジャイロの前記接続パッドと、前記実装基板上に設けられた接続パッド間がフレキシブルプリント配線基板(FPC)により電気的に接続されていることを特徴とする。
回路基板。
Further, in the circuit board according to the present invention, the vibration gyro is fixed to the mounting board by a mounting jig, and a connection between the connection pad of the vibration gyro and the connection pad provided on the mounting board is a flexible printed wiring board ( FPC) is electrically connected.
Circuit board.

また、本発明に係る回路基板は、上記振動ジャイロが、該振動ジャイロの前記接続パッドと、実装基板上に設けられた接続パッド間がバンプにより電気的に接続されると共に、振動ジャイロが該バンプにより実装基板上に固定、支持されていることを特徴とする。   In the circuit board according to the present invention, the vibration gyro is electrically connected by a bump between the connection pad of the vibration gyro and the connection pad provided on the mounting substrate, and the vibration gyro has the bump. It is characterized by being fixed and supported on the mounting substrate.

本発明に係る振動ジャイロによれば、電極との接続パッドを、センサ本体の2本の脚と平行で、かつ2本の脚から等距離にある仮想直線上に配置したので、二次振動の際の振動阻害性が減少し、検出特性に優れる振動ジャイロが提供できる。
また、実装基板への接続用ワイヤ等が外方に突出せず、小型化が可能となる。
According to the vibration gyro according to the present invention, the connection pad with the electrode is arranged on a virtual straight line that is parallel to the two legs of the sensor body and is equidistant from the two legs. The vibration inhibition property at the time is reduced, and a vibration gyro having excellent detection characteristics can be provided.
Further, the connecting wire to the mounting substrate does not protrude outward, and the size can be reduced.

以下本発明における最良の実施の形態を添付図面と共に詳細に説明する。
図1は振動ジャイロ20の好適な実施の形態を示す説明斜視図である。
13は、図6に示すのと同様に、2本の脚11a、11bが平行に連結部12に連結された、水晶あるいは圧電セラミック等の圧電材料からなる2脚音叉型センサ本体である。各脚11a、11bにはそれぞれ駆動電極14a、14b、および検出電極15a、15bが設けられている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is an explanatory perspective view showing a preferred embodiment of the vibrating gyroscope 20.
As shown in FIG. 6, reference numeral 13 denotes a two-leg tuning fork type sensor body made of a piezoelectric material such as crystal or piezoelectric ceramic, in which two legs 11a and 11b are connected in parallel to the connecting portion 12. The legs 11a and 11b are provided with drive electrodes 14a and 14b and detection electrodes 15a and 15b, respectively.

そして、連結部12の表面上の、2本の脚11a、11bと平行で、かつ2本の脚11a、11bから等距離にある仮想直線A上に、4つの接続パッド21a、21b、21c、21dが設けられている。
そして、駆動電極14aと接続パッド21aとが、駆動電極14bと接続パッド21bとが、検出電極15aと接続パッド21cとが、検出電極15bと接続パッド21dとが、センサ本体13の表面上に形成した配線パターン22によって電気的に接続されている。
And on the surface of the connecting portion 12, on the virtual straight line A parallel to the two legs 11a, 11b and equidistant from the two legs 11a, 11b, four connection pads 21a, 21b, 21c, 21d is provided.
Then, the drive electrode 14a and the connection pad 21a, the drive electrode 14b and the connection pad 21b, the detection electrode 15a and the connection pad 21c, and the detection electrode 15b and the connection pad 21d are formed on the surface of the sensor body 13. The wiring pattern 22 is electrically connected.

上記電極14、15接続パッド21および配線パターン22は公知の薄膜技術によりセンサ本体13の表面上に形成することができる。
なお、上記電極14、15と、対応する各接続パッド21間はワイヤにより電気的に接続してもよい。
The electrodes 14 and 15 connection pads 21 and the wiring pattern 22 can be formed on the surface of the sensor body 13 by a known thin film technique.
The electrodes 14 and 15 and the corresponding connection pads 21 may be electrically connected by wires.

図2は、上記振動ジャイロ20の接続パッド21a、21b、21c、21dと、振動ジャイロ20を搭載する外部実装基板の電極とを電気的に接続するために、接続パッド21a、21b、21c、21dにフレキシブルプリント配線基板24を接続した図面を示す。   FIG. 2 shows the connection pads 21a, 21b, 21c, and 21d for electrically connecting the connection pads 21a, 21b, 21c, and 21d of the vibration gyro 20 and the electrodes of the external mounting board on which the vibration gyro 20 is mounted. The figure which connected the flexible printed wiring board 24 is shown.

図3は、振動ジャイロ20を取付治具25を用いて実装基板26に固定した状態を示す説明図である。振動ジャイロ20と取付治具25との間は例えば接着剤を用いて固定する。また、振動ジャイロ20と取付治具25との接合部は、シリコーン系樹脂27で被覆して補強するとよい。
接続パッド21a、21b、21c、21dに接続したフレキシブルプリント配線基板(FPC)24の他端側を実装基板26に設けた接続パッド(図示せず)に電気的に接続することで、振動ジャイロ20を搭載した回路基板28を得ることができる。
FIG. 3 is an explanatory view showing a state in which the vibrating gyroscope 20 is fixed to the mounting board 26 using the mounting jig 25. The vibration gyro 20 and the mounting jig 25 are fixed using, for example, an adhesive. Further, the joint between the vibrating gyroscope 20 and the mounting jig 25 may be reinforced by covering with a silicone resin 27.
By electrically connecting the other end of the flexible printed circuit board (FPC) 24 connected to the connection pads 21a, 21b, 21c, and 21d to a connection pad (not shown) provided on the mounting board 26, the vibration gyro 20 Can be obtained.

振動ジャイロ20は、図1に示されるように、駆動電極14a、14b、および検出電極15a、15bと電気的に接続される接続パッド21a、21b、21c、21dが、2本の脚11a、11bと平行で、かつ2本の脚11a、11bから等距離にある仮想直線A上に設けられているので、脚11a、11bの二次振動が阻害されることがなく、検出特性の優れた振動ジャイロ20を得ることができる。特に、配線パターン22を薄膜により形成すると振動阻害性が一層無くなる。   As shown in FIG. 1, the vibrating gyroscope 20 has connection pads 21a, 21b, 21c, and 21d that are electrically connected to the drive electrodes 14a and 14b and the detection electrodes 15a and 15b, and two legs 11a and 11b. Is provided on an imaginary straight line A that is equidistant from the two legs 11a and 11b, so that the secondary vibration of the legs 11a and 11b is not hindered and has excellent detection characteristics. The gyro 20 can be obtained. In particular, when the wiring pattern 22 is formed of a thin film, the vibration inhibiting property is further lost.

また、接続パッド21a、21b、21c、21dを、上記の仮想直線上に配置したので、振動ジャイロ20を実装基板26に電気的に接続するためのFPC24が、振動ジャイロ20の側方空間にはみ出すことがないので、振動ジャイロ20の小型化が図れる。   Further, since the connection pads 21a, 21b, 21c, and 21d are arranged on the imaginary straight line, the FPC 24 for electrically connecting the vibration gyro 20 to the mounting board 26 protrudes into the side space of the vibration gyro 20. Therefore, the vibration gyro 20 can be downsized.

図4は、振動ジャイロ20を実装基板26に搭載する他の実施の形態を示す、実装基板26の裏面側から見た透視図である(見やすくするために、実装基板26を透明板として示している)。
本実施の形態では、振動ジャイロ20の接続パッド21a、21b、21c、21dと、実装基板26側に形成した接続パッド26a、26b、26c、26dとの間をバンプ30によって接合している。バンプ30は金バンプが好適である。
FIG. 4 is a perspective view showing another embodiment in which the vibrating gyroscope 20 is mounted on the mounting board 26 as seen from the back side of the mounting board 26 (for the sake of clarity, the mounting board 26 is shown as a transparent plate). )
In the present embodiment, the connection pads 21a, 21b, 21c, and 21d of the vibration gyro 20 and the connection pads 26a, 26b, 26c, and 26d formed on the mounting substrate 26 side are joined by the bumps 30. The bump 30 is preferably a gold bump.

したがって、バンプ30は、振動ジャイロ20と実装基板26間の電気的接続をとる導通部材と、振動ジャイロ20を実装基板26に固定するための取付治具とを兼用するものであり、振動ジャイロ20の実装が容易で、かつ実装構造が簡易、小型となる利点がある。この両者間の接合部の隙間には、シリコーン系樹脂を充填するようにするとよい。   Therefore, the bump 30 serves both as a conductive member that establishes an electrical connection between the vibration gyro 20 and the mounting substrate 26 and a mounting jig for fixing the vibration gyro 20 to the mounting substrate 26. Is easy to mount, and the mounting structure is simple and small. It is preferable to fill a gap between the two portions with a silicone resin.

本実施の形態に係る振動ジャイロの説明図である。It is explanatory drawing of the vibration gyro which concerns on this Embodiment. 図1の振動ジャイロに外部接続用のFPCを取り付けた状態の説明図である。It is explanatory drawing of the state which attached FPC for external connection to the vibration gyro of FIG. 振動ジャイロを取付治具を用いて実装基板に実装した状態の説明図である。It is explanatory drawing of the state which mounted the vibration gyro on the mounting board | substrate using the attachment jig. 振動ジャイロを金バンプにより実装基板に実装した状態の透視図である。It is a perspective view of a state in which the vibration gyro is mounted on a mounting board with gold bumps. 従来の振動ジャイロの一例を示す説明図である。It is explanatory drawing which shows an example of the conventional vibration gyro. 従来の振動ジャイロの他の一例を示す説明図である。It is explanatory drawing which shows another example of the conventional vibration gyro. 振動ジャイロの一次振動の状態を示す説明図である。It is explanatory drawing which shows the state of the primary vibration of a vibration gyro. 振動ジャイロの二次振動の状態を示す説明図である。It is explanatory drawing which shows the state of the secondary vibration of a vibration gyro. 二次振動阻害性を示す説明図である。It is explanatory drawing which shows secondary vibration inhibition property.

符号の説明Explanation of symbols

11a、11b 脚
12 連結部
13 センサ本体
14a、14b 駆動電極
15a、15b 検出電極
20 振動ジャイロ
21a、21b、21c、21d 接続パッド
22 配線パターン
24 FPC
25 取付治具
26 実装基板
26a、21b、21c、21d 接続パッド
27 シリコーン樹脂被膜
28 回路基板
30 金バンプ
11a, 11b Leg 12 Connecting portion 13 Sensor body 14a, 14b Drive electrode 15a, 15b Detection electrode 20 Vibrating gyro 21a, 21b, 21c, 21d Connection pad 22 Wiring pattern 24 FPC
25 Mounting jig 26 Mounting board 26a, 21b, 21c, 21d Connection pad 27 Silicone resin coating 28 Circuit board 30 Gold bump

Claims (5)

2本の脚が平行に連結部に連結された圧電材料からなる2脚音叉型センサ本体と、各脚にそれぞれ設けられた駆動電極および検出電極と、連結部に設けられ、各脚の駆動電極および検出電極にそれぞれ電気的に接続された接続パッドとを具備する振動ジャイロにおいて、
前記接続パッドは、前記2本の脚と平行で、かつ2本の脚から等距離にある仮想直線上に配置されていることを特徴とする振動ジャイロ。
A two-leg tuning fork sensor body made of a piezoelectric material in which two legs are connected in parallel to the connecting portion, a drive electrode and a detection electrode provided on each leg, and a drive electrode on each leg provided on the connecting portion And a vibration gyro comprising connection pads electrically connected to the detection electrodes, respectively.
The vibration gyro is characterized in that the connection pads are arranged on a virtual straight line parallel to the two legs and equidistant from the two legs.
前記駆動電極と検出電極は、ワイヤにより対応する前記接続パッドに電気的に接続されていることを特徴とする請求項1記載の振動ジャイロ。   2. The vibrating gyroscope according to claim 1, wherein the drive electrode and the detection electrode are electrically connected to the corresponding connection pad by a wire. 前記駆動電極と検出電極は、前記センサ本体に設けられた配線パターンにより対応する前記接続パッドに電気的に接続されていることを特徴とする請求項1記載の振動ジャイロ。   2. The vibration gyro according to claim 1, wherein the drive electrode and the detection electrode are electrically connected to the corresponding connection pad by a wiring pattern provided on the sensor body. 請求項1〜3いずれか1項記載の振動ジャイロが、取付治具により実装基板に固定され、振動ジャイロの前記接続パッドと、前記実装基板上に設けられた接続パッド間がフレキシブルプリント配線基板により電気的に接続されていることを特徴とする回路基板。   The vibrating gyroscope according to any one of claims 1 to 3 is fixed to a mounting board by a mounting jig, and a connection between the connecting pad of the vibrating gyroscope and a connecting pad provided on the mounting board is a flexible printed wiring board. A circuit board which is electrically connected. 請求項1〜3いずれか1項記載の振動ジャイロが、該振動ジャイロの前記接続パッドと、実装基板上に設けられた接続パッド間がバンプにより電気的に接続されると共に、振動ジャイロが該バンプにより実装基板上に固定、支持されていることを特徴とする回路基板。   4. The vibration gyro according to claim 1, wherein the connection pad of the vibration gyro and the connection pad provided on the mounting substrate are electrically connected by a bump, and the vibration gyro is the bump. A circuit board characterized by being fixed and supported on a mounting board by
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029715A (en) * 2009-07-21 2011-02-10 Seiko Instruments Inc Piezoelectric vibrating reed, piezoelectric vibrator, oscillator, electronic apparatus, radio-controlled clock, and method for manufacturing piezoelectric vibrating reed

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09170926A (en) * 1995-12-21 1997-06-30 Matsushita Electric Ind Co Ltd Angular velocity sensor
JPH102741A (en) * 1996-06-17 1998-01-06 Murata Mfg Co Ltd Manufacture of piezoelectric transducer
JPH1194554A (en) * 1997-09-17 1999-04-09 Fujitsu Ltd Tuning fork type piezoelectric oscillation gyro
JPH11108665A (en) * 1997-09-30 1999-04-23 Kyocera Corp Piezoelectric vibrator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09170926A (en) * 1995-12-21 1997-06-30 Matsushita Electric Ind Co Ltd Angular velocity sensor
JPH102741A (en) * 1996-06-17 1998-01-06 Murata Mfg Co Ltd Manufacture of piezoelectric transducer
JPH1194554A (en) * 1997-09-17 1999-04-09 Fujitsu Ltd Tuning fork type piezoelectric oscillation gyro
JPH11108665A (en) * 1997-09-30 1999-04-23 Kyocera Corp Piezoelectric vibrator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029715A (en) * 2009-07-21 2011-02-10 Seiko Instruments Inc Piezoelectric vibrating reed, piezoelectric vibrator, oscillator, electronic apparatus, radio-controlled clock, and method for manufacturing piezoelectric vibrating reed

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