JP2005340392A - Light irradiation device - Google Patents

Light irradiation device Download PDF

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JP2005340392A
JP2005340392A JP2004155210A JP2004155210A JP2005340392A JP 2005340392 A JP2005340392 A JP 2005340392A JP 2004155210 A JP2004155210 A JP 2004155210A JP 2004155210 A JP2004155210 A JP 2004155210A JP 2005340392 A JP2005340392 A JP 2005340392A
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heat
substrate
peltier module
light emitting
emitting diode
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Goji Inui
剛司 乾
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

<P>PROBLEM TO BE SOLVED: To perform efficient irradiation with light by improving the cooling efficiency of a light emitting diode by a Peltier module while suppressing an increase in the size of a heat radiation body. <P>SOLUTION: A heat insulator 5 has the same external shape and size with a substrate 2 and a heat radiation plate 4a, and is formed in a rectangular frame shape such that a fitting hole 5a with the Peltier module 3 penetrates the center and is interposed between the substrate 2 and the heat radiation plate 4a while the Peltier module 3 is fitted in the fitting hole 5a. Thus, the heat insulator 5 is arranged in a space where the reverse surface of the substrate 2 and the top surface of the heat radiation plate 4a face each other, so that a heat leak can be suppressed and consequently the cooling efficiency of the light emitting diode 1 by the Peltier module 3 is improved while an increase in the size of the heat radiation body 4 is suppressed to enable efficient irradiation with light. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光ダイオードを光源とする光照射装置に関し、特に光硬化性樹脂を硬化させるために紫外線を照射する紫外線硬化装置に用いるのに好適な光照射装置に関するものである。   The present invention relates to a light irradiation apparatus using a light emitting diode as a light source, and more particularly to a light irradiation apparatus suitable for use in an ultraviolet curing apparatus that irradiates ultraviolet rays to cure a photocurable resin.

従来、光硬化性樹脂に紫外線などの光を照射して硬化させる紫外線硬化装置においては、放電ランプやレーザ発振器を光源とする光照射装置が用いられていたが、近年では発光ダイオードを光源とする光照射装置が普及しつつある。光源に発光ダイオードを用いる際に最も問題となるのが発光ダイオードからの発熱である。すなわち、発光ダイオードは低温の方が発光効率が良く、高温になるほど発光効率が低下し、照射する光のエネルギも減少してしまう。   Conventionally, in an ultraviolet curing device that irradiates and cures light such as ultraviolet rays to a photocurable resin, a light irradiation device using a discharge lamp or a laser oscillator as a light source has been used, but recently, a light emitting diode is used as a light source. Light irradiation devices are becoming widespread. When the light emitting diode is used as the light source, the most serious problem is heat generated from the light emitting diode. That is, the light emitting diode has a higher light emission efficiency at a low temperature, and the light emission efficiency decreases as the temperature increases, and the energy of the irradiated light also decreases.

これに対して本出願人は、複数の発光ダイオードが表面に実装された基板の裏面にペルチェ効果を利用した冷却体（ペルチェモジュール）を貼着し、このペルチェモジュールに直流電流を流してその吸熱面から基板の熱を吸収することにより発光ダイオードを冷却し、発光効率の低下を抑制した光照射装置（照明装置）を既に提案している（特許文献１参照）。なお、ペルチェモジュールは吸熱面から吸収した熱を反対側の発熱面から放射しているので、放熱効果を高めるために発熱面には放熱体（例えば、放熱フィンを有する放熱板）が取着され、さらに放熱体には必要に応じて冷却ファンが取り付けられる。
特開平１１−１６３４１０号公報（段落００２３〜００２４及び図８参照） On the other hand, the present applicant attaches a cooling body (Peltier module) using the Peltier effect to the back surface of a substrate on which a plurality of light emitting diodes are mounted, and passes a direct current through the Peltier module to absorb its heat. There has already been proposed a light irradiation device (illumination device) in which the light emitting diode is cooled by absorbing the heat of the substrate from the surface to suppress a decrease in light emission efficiency (see Patent Document 1). Since the Peltier module radiates the heat absorbed from the heat absorbing surface from the heat generating surface on the opposite side, a heat radiator (for example, a heat radiating plate having heat radiating fins) is attached to the heat generating surface to enhance the heat dissipation effect. In addition, a cooling fan is attached to the radiator as necessary.
JP-A-11-163410 (see paragraphs 0023-0024 and FIG. 8)

ところで特許文献１に記載されている上記従来例では、発光ダイオードが実装された基板とペルチェモジュール及び放熱板の接触部分の形状及び寸法がほぼ等しくなっているが、ペルチェモジュールの冷却効果を高めて効率よく冷却するためには、ペルチェモジュールの発熱面に対して放熱板の面積を大きくすることが望ましい。しかしながら、単純に放熱板を大きくしただけでは装置全体も大型化して設置スペースの確保が難しくなるなどの新たな課題が生じてしまう。そこで、ペルチェモジュールによる放熱効果を高めつつ装置全体の大型化を抑えるために、放熱板と基板の寸法をほぼ等しくするとともにペルチェモジュールの寸法を基板及び放熱板よりも小さくすることでペルチェモジュールに対する放熱板の相対的な寸法を大きくする構造が考えられる。   By the way, in the above conventional example described in Patent Document 1, the shape and size of the contact portion between the substrate on which the light emitting diode is mounted, the Peltier module, and the heat sink are substantially equal, but the cooling effect of the Peltier module is enhanced. For efficient cooling, it is desirable to increase the area of the heat sink relative to the heat generating surface of the Peltier module. However, simply increasing the size of the heat radiating plate causes new problems such as an increase in the size of the entire device and difficulty in securing installation space. Therefore, to increase the heat dissipation effect of the Peltier module and suppress the overall size of the device, heat dissipation to the Peltier module is made by making the size of the heatsink and the substrate approximately equal and making the size of the Peltier module smaller than the substrate and heatsink. A structure in which the relative dimensions of the plates are increased is conceivable.

しかしながら、かかる構造においては、ペルチェモジュールの吸熱面と発熱面が基板と放熱板を介して対向するため、発熱面から放射する熱が吸熱面に干渉する現象（いわゆる熱リーク）が生じて冷却効率が低下してしまう虞がある。   However, in such a structure, since the heat absorption surface and the heat generation surface of the Peltier module face each other through the substrate and the heat sink, a phenomenon (so-called heat leak) in which the heat radiated from the heat generation surface interferes with the heat absorption surface occurs and cooling efficiency May decrease.

本発明は上記事情に鑑みて為されたものであり、その目的は、放熱体の大型化を抑えつつペルチェモジュールによる発光ダイオードの冷却効率を向上して光を効率よく照射できる光照射装置を提供することにある。   The present invention has been made in view of the above circumstances, and an object thereof is to provide a light irradiation device that can efficiently irradiate light by improving the cooling efficiency of the light emitting diode by the Peltier module while suppressing the increase in size of the heat radiator. There is to do.

請求項１の発明は、上記目的を達成するために、１乃至複数個の発光ダイオードと、熱の良導体からなり表面に前記発光ダイオードが実装された基板と、該基板よりも面積の小さい平板状に形成され表側の吸熱面を前記基板の裏面に密着させたペルチェモジュールと、該ペルチェモジュールよりも面積が大きい平坦部を有し該平坦部をペルチェモジュール裏側の発熱面に密着させた放熱体と、該放熱体の平坦部と前記基板裏面が対向する空間に配設されて前記ペルチェモジュールの周囲を囲む断熱体とを備えたことを特徴とする。   In order to achieve the above object, the invention of claim 1 provides one or more light-emitting diodes, a substrate made of a good heat conductor and having the light-emitting diode mounted on the surface thereof, and a flat plate having a smaller area than the substrate. A Peltier module having a front-side heat-absorbing surface in close contact with the back surface of the substrate, and a radiator having a flat portion having a larger area than the Peltier module and in close contact with the heat-generating surface on the back side of the Peltier module; And a heat insulator that surrounds the periphery of the Peltier module and is disposed in a space where the flat portion of the heat dissipating member and the back surface of the substrate face each other.

この発明によれば、発光ダイオードが実装された基板よりもペルチェモジュールを小型とすることでペルチェモジュールに対して放熱体の面積を大きくすることができ、しかも、基板と放熱体が対向する空間に配設した断熱体によりペルチェモジュールの発熱面から吸熱面への熱リークを防止しているから、放熱体の大型化を抑えつつペルチェモジュールによる発光ダイオードの冷却効率を向上して光を効率よく照射することができる。   According to the present invention, the area of the radiator can be increased with respect to the Peltier module by making the Peltier module smaller than the substrate on which the light emitting diode is mounted, and the substrate and the radiator are opposed to each other. The installed insulation prevents heat leakage from the heat generation surface to the heat absorption surface of the Peltier module. Therefore, while suppressing the increase in size of the heat dissipation body, the cooling efficiency of the light emitting diode by the Peltier module is improved and light is efficiently irradiated. can do.

請求項２の発明は、請求項１の発明において、前記基板、放熱体及び断熱体の周面を覆う第２の断熱体を備えたことを特徴とする。   According to a second aspect of the present invention, in the first aspect of the invention, the substrate, the heat radiating body, and a second heat insulating body that covers the peripheral surfaces of the heat insulating body are provided.

この発明によれば、第２の断熱体によって基板及び放熱体の周面からの熱リークを防止し、発光ダイオードの冷却効率がさらに向上できる。   According to this invention, the second heat insulator prevents heat leakage from the peripheral surfaces of the substrate and the heat radiating body, thereby further improving the cooling efficiency of the light emitting diode.

請求項３の発明は、請求項１又は２の発明において、前記基板は、表面と裏面が中間の絶縁層で電気的に絶縁された多層構造を有し、該表面には前記発光ダイオードのカソード及びアノードと接合されるランドと、該ランドに通電するための導電パターンとが形成されてなることを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, the substrate has a multilayer structure in which a front surface and a rear surface are electrically insulated by an intermediate insulating layer, and the surface has a cathode of the light emitting diode. And a land to be joined to the anode, and a conductive pattern for energizing the land.

この発明によれば、発光ダイオードへの配線路が容易に形成できる。   According to the present invention, the wiring path to the light emitting diode can be easily formed.

請求項４の発明は、請求項１又は２又は３の発明において、熱の非良導体により有底筒状に形成され、底面に設けられた貫通孔から前記発光ダイオードを外部に臨ませる形で前記基板並びに断熱体と放熱体の少なくとも一部とを内部に収納するカバーを備えたことを特徴とする。   According to a fourth aspect of the present invention, in the first, second or third aspect of the present invention, the light emitting diode is formed in a bottomed cylindrical shape by a heat non-defective conductor, and the light emitting diode is exposed to the outside from a through hole provided in a bottom surface. A cover is provided that houses the substrate, the heat insulator, and at least a part of the heat radiator.

この発明によれば、カバーの内部に収納することで周囲温度の影響を低減するとともに基板や基板に実装された発光ダイオードの結露を防ぐことができる。   According to the present invention, it is possible to reduce the influence of the ambient temperature by being housed in the cover, and to prevent condensation of the substrate and the light emitting diode mounted on the substrate.

本発明によれば、発光ダイオードが実装された基板よりもペルチェモジュールを小型とすることでペルチェモジュールに対して放熱体の面積を大きくすることができ、しかも、基板と放熱体が対向する空間に配設した断熱体によりペルチェモジュールの発熱面から吸熱面への熱リークを防止しているから、放熱体の大型化を抑えつつペルチェモジュールによる発光ダイオードの冷却効率を向上して光を効率よく照射することができるという効果がある。   According to the present invention, the area of the radiator can be increased with respect to the Peltier module by making the Peltier module smaller than the substrate on which the light-emitting diode is mounted, and the substrate and the radiator are opposed to each other. The installed insulation prevents heat leakage from the heat generation surface to the heat absorption surface of the Peltier module. Therefore, while suppressing the increase in size of the heat dissipation body, the cooling efficiency of the light emitting diode by the Peltier module is improved and light is efficiently irradiated. There is an effect that can be done.

（実施形態１）
本実施形態は、例えば、光硬化性樹脂を硬化させる紫外線硬化装置に用いるものであって、図１及び図２に示すように１乃至複数個の発光ダイオード１と、熱の良導体からなり表面（図１における下面）に発光ダイオード１が実装された基板２と、基板２よりも面積の小さい平板状に形成され表側の吸熱面を基板２の裏面（図１における上面）に密着させたペルチェモジュール３と、ペルチェモジュール３よりも面積が大きく且つペルチェモジュール３の裏側の発熱面に表面（図１における下面）を密着させた平坦部（放熱板４ａ）、並びに放熱板４ａの裏面（図１における上面）に密着させた放熱フィン４ｂからなる放熱体４と、放熱板４ａと基板２の裏面が対向する空間に配設されてペルチェモジュール３の周囲を囲む断熱体５と、放熱フィン４ｂの裏面（図１における上面）に密着させた冷却ファン６とを備えている。 (Embodiment 1)
The present embodiment is used for, for example, an ultraviolet curing device that cures a photocurable resin. As shown in FIG. 1 and FIG. 2, one or a plurality of light-emitting diodes 1 and a surface ( A substrate 2 on which the light emitting diode 1 is mounted on the lower surface in FIG. 1 and a Peltier module that is formed in a flat plate shape having a smaller area than the substrate 2 and has a heat absorption surface on the front side in close contact with the back surface (upper surface in FIG. 1). 3 and a flat portion (heat radiating plate 4a) having an area larger than that of the Peltier module 3 and having a surface (lower surface in FIG. 1) in close contact with the heat generating surface on the back side of the Peltier module 3, and the back surface of the heat radiating plate 4a (in FIG. 1) A heat dissipating member 4 composed of heat dissipating fins 4b in close contact with the upper surface, a heat dissipating member 5 disposed in a space where the heat dissipating plate 4a and the back surface of the substrate 2 face each other and surrounding the Peltier module 3; The rear surface of the fin 4b and a cooling fan 6 which is in close contact with the (upper surface in FIG. 1).

本実施形態における発光ダイオード１は表面実装型の素子であって紫外線を放射するものである。基板２は、アルミのような熱伝導度の高い材料からなる表面層と裏面層が中間の絶縁層で電気的に絶縁された多層構造を有し、図３に示すように表面には発光ダイオード１のカソード及びアノードと接合されるランド７及び電源線１１が接続されるランド８と、ランド７，８に通電するための導電パターン９と、発光ダイオード１の実装面におけるカソード及びアノードと絶縁された部分と接合されランド７，８及び導電パターン９と隔絶される形で略全面を覆う放熱パターン１０とが形成されている。そして、本実施形態においては、基板２の表面に形成されたランド７に表面実装型の４個の発光ダイオード１が一列に並べて実装され、ランド８に接続された電源線１１を通して外部から供給される直流電流により各発光ダイオード１が紫外線を放射するのである。また、通電により発光ダイオード１が発する熱が基板２の表面に形成された放熱パターン１０から放熱される。このようにランド７，８と導電パターン９により発光ダイオード１の配線路が容易に形成できるものである。   The light-emitting diode 1 in this embodiment is a surface-mount type element that emits ultraviolet rays. The substrate 2 has a multilayer structure in which a front surface layer and a back surface layer made of a material having high thermal conductivity such as aluminum are electrically insulated by an intermediate insulating layer. As shown in FIG. 1 is connected to the cathode 7 and the anode 8, the land 8 to which the power supply line 11 is connected, the conductive pattern 9 for energizing the lands 7 and 8, and the cathode and anode on the mounting surface of the light emitting diode 1. The heat radiation pattern 10 is formed so as to be bonded to the portion and separated from the lands 7 and 8 and the conductive pattern 9 so as to cover substantially the entire surface. In the present embodiment, four surface mount type light emitting diodes 1 are mounted in a line on a land 7 formed on the surface of the substrate 2, and supplied from the outside through a power line 11 connected to the land 8. Each light emitting diode 1 emits ultraviolet rays by a direct current. Further, the heat generated by the light emitting diode 1 by energization is radiated from the heat radiation pattern 10 formed on the surface of the substrate 2. As described above, the wiring path of the light emitting diode 1 can be easily formed by the lands 7 and 8 and the conductive pattern 9.

ペルチェモジュール３は上述のように従来周知であって、一対のリード線３ａを通して直流電流を流すと吸熱面（図１における下面）から吸収した熱を発熱面（図１における上面）から放出するものである。このペルチェモジュール３は吸熱面に熱伝導性グリスが塗布されて基板２の裏面中央に密着され、さらに発熱面にも熱伝導性グリスが塗布されて放熱体４の放熱板４ａが密着される。放熱板４ａは基板２とほぼ同寸法の矩形平板状に形成された金属板からなり、同じく金属材料からなる従来周知の放熱フィン４ｂが、熱伝導性グリスを塗布した裏面（図１における上面）に密着される。すなわち、発光ダイオード１の発する熱が基板２を通してペルチェモジュール３の吸熱面から吸熱されて発熱面より放出され、その放出された熱が放熱体４を介して放熱されるものであり、さらに従来周知の冷却ファン６を用いて放熱フィン４ｂが冷却されて冷却効率の向上が図られている。ここで、発光ダイオード１が実装された基板２よりもペルチェモジュール３を小型とすることでペルチェモジュール３に対して放熱体４（放熱板４ａ）の面積を大きくし、ペルチェモジュール３の発熱面から放出される熱の放熱効率を高めている。   The Peltier module 3 is conventionally known as described above, and releases a heat absorbed from the heat absorption surface (lower surface in FIG. 1) from the heat generation surface (upper surface in FIG. 1) when a direct current is passed through the pair of lead wires 3a. It is. The Peltier module 3 is coated with heat conductive grease on the heat absorbing surface and is in close contact with the center of the back surface of the substrate 2, and is further coated with heat conductive grease on the heat generating surface so that the heat radiating plate 4 a of the radiator 4 is in close contact. The heat radiating plate 4a is formed of a metal plate formed in a rectangular flat plate shape having substantially the same dimensions as the substrate 2, and a back surface (upper surface in FIG. 1) on which a conventionally well-known heat radiating fin 4b made of a metal material is coated with thermally conductive grease. It is closely attached to. That is, the heat generated by the light emitting diode 1 is absorbed from the heat absorbing surface of the Peltier module 3 through the substrate 2 and released from the heat generating surface, and the released heat is radiated through the heat radiator 4. The cooling fins 6 are used to cool the heat dissipating fins 4b, thereby improving the cooling efficiency. Here, by making the Peltier module 3 smaller than the substrate 2 on which the light emitting diode 1 is mounted, the area of the heat radiating body 4 (heat radiating plate 4 a) is increased with respect to the Peltier module 3. The heat dissipation efficiency of the released heat is increased.

本発明の要旨である断熱体５は、外形が基板２及び放熱板４ａと同形状、同寸法であって、中央部にペルチェモジュール３が嵌合する嵌合孔５ａが貫通した矩形枠状に形成され、嵌合孔５ａにペルチェモジュール３を嵌合させた状態で基板２と放熱板４ａとの間に介装される。すなわち、ペルチェモジュール３を基板２及び放熱板４ａよりも小型化したことにより、基板２と放熱板４ａとの間におけるペルチェモジュール３の周囲に、基板２の裏面と放熱板４ａの表面とが対向する空間が生じ、この空間を介して放熱板４ａの表面から放出される熱がペルチェモジュール３によって冷却されている基板２裏面に熱リークして冷却効率が低下する虞がある。しかしながら、本実施形態では基板２の裏面と放熱板４ａの表面とが対向する空間に断熱体５を配設しているため、上述のような熱リークの発生が抑制でき、その結果、放熱体４の大型化を抑えつつペルチェモジュール３による発光ダイオード１の冷却効率を向上して光を効率よく照射することのできる光照射装置が実現できるものである。   The heat insulator 5 which is the gist of the present invention has a rectangular frame shape in which the outer shape is the same shape and the same size as the substrate 2 and the heat radiating plate 4a, and the fitting hole 5a into which the Peltier module 3 is fitted passes through the central portion. The Peltier module 3 is formed and is interposed between the board 2 and the heat sink 4a in a state where the fitting hole 5a is fitted. That is, by making the Peltier module 3 smaller than the substrate 2 and the heat sink 4a, the back surface of the substrate 2 and the surface of the heat sink 4a face each other around the Peltier module 3 between the substrate 2 and the heat sink 4a. There is a risk that the heat released from the surface of the heat sink 4a through this space leaks to the back surface of the substrate 2 cooled by the Peltier module 3 and the cooling efficiency decreases. However, in this embodiment, since the heat insulator 5 is disposed in the space where the back surface of the substrate 2 and the surface of the heat sink 4a face each other, the occurrence of the heat leak as described above can be suppressed, and as a result, the heat radiator. Thus, it is possible to realize a light irradiation device that can efficiently irradiate light by improving the cooling efficiency of the light emitting diode 1 by the Peltier module 3 while suppressing the increase in size of the Peltier module 3.

（実施形態２）
本実施形態の分解斜視図及び断面図をそれぞれ図４及び図５に示す。但し、本実施形態の基本的な構成は実施形態１と共通であるから、共通の構成要素には同一の符号を付して説明を省略する。 (Embodiment 2)
An exploded perspective view and a sectional view of this embodiment are shown in FIGS. 4 and 5, respectively. However, since the basic configuration of the present embodiment is the same as that of the first embodiment, common constituent elements are denoted by the same reference numerals and description thereof is omitted.

本実施形態は、基板２、放熱板４ａ及び断熱体５の周面を覆う第２の断熱体１２と、基板２の表面（図５における下面）を覆う第３の断熱体１３と、熱の非良導体により有底筒状に形成され、底面に設けられた貫通孔１４ａから発光ダイオード１を外部に臨ませる形で基板２並びに断熱体５，１２，１３と放熱体４の少なくとも一部（例えば、放熱板４ａ）とを内部に収納するカバー１４とを備えた点に特徴がある。   In the present embodiment, the second heat insulator 12 covering the peripheral surfaces of the substrate 2, the heat radiating plate 4a and the heat insulator 5, the third heat insulator 13 covering the surface of the substrate 2 (the lower surface in FIG. 5), At least a part of the substrate 2 and the heat insulators 5, 12, 13 and the heat radiator 4 (for example, in a form in which the light emitting diode 1 is exposed to the outside through a through-hole 14 a provided on the bottom surface by a non-good conductor. And a cover 14 for accommodating the heat radiating plate 4a) therein.

カバー１４は、図６に示すように例えばポリアセタール樹脂により角筒状に形成され、その底面中央に矩形の貫通孔１４ａが貫設されている。この貫通孔１４ａは、基板２に実装されている発光ダイオード１がその内側に収まる寸法に形成されている。   As shown in FIG. 6, the cover 14 is formed, for example, in a rectangular tube shape from polyacetal resin, and a rectangular through hole 14a is formed through the center of the bottom surface. The through hole 14a is formed to have a size that allows the light-emitting diode 1 mounted on the substrate 2 to be accommodated therein.

第３の断熱体１３は基板２とほぼ同形状及び同寸法の矩形平板状に形成されてカバー１４の底面に収められるものであって、その中央部にはカバー１４の貫通孔１４ａと連通する矩形の窓孔１３ａが設けられ、この窓孔１３ａを通して発光ダイオード１が貫通孔１４ａ内に収められる。   The third heat insulator 13 is formed in a rectangular flat plate shape having substantially the same shape and the same size as the substrate 2 and is accommodated in the bottom surface of the cover 14, and communicates with the through hole 14 a of the cover 14 at the center. A rectangular window hole 13a is provided, and the light emitting diode 1 is received in the through hole 14a through the window hole 13a.

第２の断熱体１２は、両側に開口する角筒状であってカバー１４内に収納された状態でカバー１４の底面及び内壁面に当接するとともに基板２並びに断熱体５，１３と放熱板４ａの一部（図５における下端部）を覆うことができる形状及び寸法に形成されている。   The second heat insulator 12 has a rectangular tube shape that opens on both sides and comes into contact with the bottom surface and the inner wall surface of the cover 14 while being accommodated in the cover 14, and the substrate 2, the heat insulators 5, 13 and the heat radiating plate 4a. It is formed in the shape and dimension which can cover a part (lower end part in FIG. 5).

而して、本実施形態を組み立てて基板２、ペルチェモジュール３、放熱板４ａ、断熱体５を第２及び第３の断熱体１２，１３とともにカバー１４内に収納すれば、図５に示すように基板２、放熱板４ａ及び断熱体５の周面が第２の断熱体１２で覆われるとともに基板２の表面が第３の断熱体１３で覆われることになる。すなわち、実施形態１のように基板２、放熱板４ａ及び断熱体５の周面が露出していると周面において熱リークが生じる虞があるが、基板２、放熱板４ａ及び断熱体５の周面を第２の断熱体１２で覆うことによって周面からの熱リークを防止し、発光ダイオード１の冷却効率がさらに向上できる。また、発光ダイオード１や基板２、ペルチェモジュール３などをカバー１４の内部に収納することで周囲温度の影響を低減するとともに基板２や基板２に実装された発光ダイオード１の結露を防ぐことができる。さらに、カバー１４の底面と基板２の表面との間に介装した第３の断熱体１３によって周囲温度の影響を一層低減できるとともに結露を確実に防ぐことができる。なお、実施形態１及び本実施形態では、基板２に複数個の発光ダイオード１を実装しているが、発光ダイオード１の個数は複数個に限定されるものではなく１個であっても構わない。基板２に１個の発光ダイオード１を実装する場合、図７に示すように基板２の表面には各一対のランド７，８、導電パターン９並びに放熱パターン１０が形成される。   Thus, when this embodiment is assembled and the substrate 2, the Peltier module 3, the heat radiating plate 4a, and the heat insulator 5 are housed in the cover 14 together with the second and third heat insulators 12 and 13, as shown in FIG. Further, the peripheral surfaces of the substrate 2, the heat radiating plate 4 a and the heat insulator 5 are covered with the second heat insulator 12, and the surface of the substrate 2 is covered with the third heat insulator 13. That is, if the peripheral surfaces of the substrate 2, the heat radiating plate 4a, and the heat insulating body 5 are exposed as in the first embodiment, there is a risk that heat leaks will occur on the peripheral surface, but the substrate 2, the heat radiating plate 4a, and the heat insulating body 5 By covering the peripheral surface with the second heat insulator 12, heat leakage from the peripheral surface can be prevented, and the cooling efficiency of the light emitting diode 1 can be further improved. Further, by housing the light emitting diode 1, the substrate 2, the Peltier module 3, etc. inside the cover 14, it is possible to reduce the influence of the ambient temperature and prevent condensation of the light emitting diode 1 mounted on the substrate 2 or the substrate 2. . Further, the third heat insulator 13 interposed between the bottom surface of the cover 14 and the surface of the substrate 2 can further reduce the influence of the ambient temperature and reliably prevent dew condensation. In the first embodiment and the present embodiment, a plurality of light emitting diodes 1 are mounted on the substrate 2, but the number of light emitting diodes 1 is not limited to a plurality, and may be one. . When one light emitting diode 1 is mounted on the substrate 2, a pair of lands 7, 8, a conductive pattern 9 and a heat radiation pattern 10 are formed on the surface of the substrate 2 as shown in FIG. 7.

実施形態１の断面図である。1 is a cross-sectional view of Embodiment 1. FIG. 同上の分解斜視図である。It is an exploded perspective view same as the above. 同上における基板の正面図である。It is a front view of the board | substrate in the same as the above. 実施形態２の分解斜視図である。6 is an exploded perspective view of Embodiment 2. FIG. 同上の断面図である。It is sectional drawing same as the above. 同上におけるカバーを示し、（ａ）は正面図、（ｂ）は右側面図である。The cover in the same as above is shown, (a) is a front view, and (b) is a right side view. 同上における１個の発光ダイオードに対応した基板の正面図である。It is a front view of the board | substrate corresponding to one light emitting diode in the same as the above.

符号の説明Explanation of symbols

１ 発光ダイオード
２ 基板
３ ペルチェモジュール
４ 放熱体
５ 断熱体 DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Board | substrate 3 Peltier module 4 Heat sink 5 Heat insulator

Claims (4)

１乃至複数個の発光ダイオードと、熱の良導体からなり表面に前記発光ダイオードが実装された基板と、該基板よりも面積の小さい平板状に形成され表側の吸熱面を前記基板の裏面に密着させたペルチェモジュールと、該ペルチェモジュールよりも面積が大きい平坦部を有し該平坦部をペルチェモジュール裏側の発熱面に密着させた放熱体と、該放熱体の平坦部と前記基板裏面が対向する空間に配設されて前記ペルチェモジュールの周囲を囲む断熱体とを備えたことを特徴とする光照射装置。   One or a plurality of light emitting diodes, a substrate made of a good heat conductor and having the light emitting diodes mounted on the surface thereof, a flat plate having a smaller area than that of the substrate, and a heat absorbing surface on the front side being closely attached to the back surface of the substrate A Peltier module, a radiator having a flat part having a larger area than the Peltier module, and the flat part in close contact with the heat generating surface on the back side of the Peltier module, and a space where the flat part of the radiator and the back of the substrate face each other And a heat insulator that surrounds the periphery of the Peltier module. 前記基板、放熱体及び断熱体の周面を覆う第２の断熱体を備えたことを特徴とする請求項１記載の光照射装置。   The light irradiation apparatus according to claim 1, further comprising a second heat insulator covering the peripheral surfaces of the substrate, the heat radiator, and the heat insulator. 前記基板は、表面と裏面が中間の絶縁層で電気的に絶縁された多層構造を有し、該表面には前記発光ダイオードのカソード及びアノードと接合されるランドと、該ランドに通電するための導電パターンとが形成されてなることを特徴とする請求項１又は２記載の光照射装置。   The substrate has a multilayer structure in which a front surface and a back surface are electrically insulated by an intermediate insulating layer, and the surface has a land bonded to a cathode and an anode of the light emitting diode, and a current for energizing the land. The light irradiation apparatus according to claim 1, wherein a conductive pattern is formed. 熱の非良導体により有底筒状に形成され、底面に設けられた貫通孔から前記発光ダイオードを外部に臨ませる形で前記基板並びに断熱体と放熱体の少なくとも一部とを内部に収納するカバーを備えたことを特徴とする請求項１又は２又は３記載の光照射装置。   A cover that is formed in a bottomed cylindrical shape by a heat non-defective conductor and that houses the substrate, the heat insulator, and at least a part of the heat sink in a form in which the light emitting diode is exposed to the outside through a through hole provided in the bottom surface The light irradiation apparatus according to claim 1, 2, or 3.
JP2004155210A 2004-05-25 2004-05-25 Light irradiation device Pending JP2005340392A (en)

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