JP2005330537A - Vapor deposition apparatus - Google Patents

Vapor deposition apparatus Download PDF

Info

Publication number
JP2005330537A
JP2005330537A JP2004149834A JP2004149834A JP2005330537A JP 2005330537 A JP2005330537 A JP 2005330537A JP 2004149834 A JP2004149834 A JP 2004149834A JP 2004149834 A JP2004149834 A JP 2004149834A JP 2005330537 A JP2005330537 A JP 2005330537A
Authority
JP
Japan
Prior art keywords
vapor deposition
material passage
discharge
discharge container
passage outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004149834A
Other languages
Japanese (ja)
Other versions
JP4454387B2 (en
Inventor
Tetsuya Inoue
鉄也 井上
Hiroyuki Daiku
博之 大工
Kazuto Suzuki
和人 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Zosen Corp
Original Assignee
Hitachi Zosen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Zosen Corp filed Critical Hitachi Zosen Corp
Priority to JP2004149834A priority Critical patent/JP4454387B2/en
Publication of JP2005330537A publication Critical patent/JP2005330537A/en
Application granted granted Critical
Publication of JP4454387B2 publication Critical patent/JP4454387B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide more uniformly vapor-depositing an evaporated material onto a wide surface to be vapor-deposited of a material to be vapor-deposited. <P>SOLUTION: The vapor deposition apparatus for depositing an evaporated material onto a glass substrate W comprises: an emitting vessel 15 having a diffusion space 16 inside it, which communicates with an outlet 13a of an evaporated material passage 13 arranged so as to face the glass substrate W; a plurality of discharge holes 17 which are drilled on the glass substrate W side of the emitting vessel 15 and in a predetermined position except a part facing to the outlet 13a of the evaporated material passage 13; and a vessel-rotating device 21 for rotating the emitting vessel around a rotation shaft O which is centered on the outlet 13a of the emitting vessel 15. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、真空雰囲気または不活性ガス雰囲気中で、たとえば有機ＥＬディスプレイなどの画像表示部を製造するための蒸着装置に関するものである。   The present invention relates to a vapor deposition apparatus for manufacturing an image display unit such as an organic EL display in a vacuum atmosphere or an inert gas atmosphere.

近年、ディスプレイの薄型化が進み、この種のディスプレイとしては、液晶ディスプレイの実用化が非常に進んでいる。この液晶画面については、バックライトを必要とするもので、視野範囲、消費電力などの点で難点があり、最近、自発光性の有機ＥＬ方式のディスプレイが注目されている。   In recent years, thinning of displays has progressed, and as this type of display, liquid crystal displays have been put to practical use. This liquid crystal screen requires a backlight and has difficulties in view range, power consumption, etc. Recently, a self-luminous organic EL display has been attracting attention.

ところで、有機ＥＬディスプレイの基本構造は、ガラス基板上に、陽極（透明電極）を配置し、この上に、ホール輸送層および発光層が順番に配置され、さらに陰極が配置されたものであり、少なくとも前記発光層については、有機材料が蒸着により形成されている。   By the way, the basic structure of the organic EL display is an arrangement in which an anode (transparent electrode) is arranged on a glass substrate, a hole transport layer and a light emitting layer are arranged in this order, and a cathode is further arranged. At least for the light emitting layer, an organic material is formed by vapor deposition.

そして、基板上に蒸着により薄膜を形成する場合、真空容器内に有機材料の蒸発源を配置しておき、真空状態で蒸発源を加熱し、その蒸気を同じく真空容器内に配置された基板の表面に付着させることにより薄膜が形成されていた。   When a thin film is formed on the substrate by vapor deposition, an organic material evaporation source is placed in a vacuum vessel, the evaporation source is heated in a vacuum state, and the vapor is also emitted from the substrate placed in the vacuum vessel. A thin film was formed by adhering to the surface.

ところで、ディスプレイの大型化が促進され、また小型のものでも大型のガラス基板からダイシングして製造されることから、大型のガラス基板にも有機材料を均一に蒸着させることが重要となる。蒸発材料粒子などの希薄流体は、放出孔から放出されると、余弦則に従って広がってガラス基板表面に蒸着され、蒸着面の中央部で蒸着量が厚くなる傾向にある。   By the way, an increase in the size of a display is promoted, and even a small display is manufactured by dicing from a large glass substrate. Therefore, it is important to uniformly deposit an organic material on a large glass substrate. When the dilute fluid such as the evaporation material particles is discharged from the discharge hole, it spreads according to the cosine law and is deposited on the glass substrate surface, and the deposition amount tends to be thick at the center of the deposition surface.

特許文献１には、一端側に移送部（小径管）が接続された放出部（大径管）に形成する放出孔の径を、一端側を小径に、他端側を大径に形成している。
また特許文献２は、蒸着室内で、回転式ウェハテーブルの下方に、２つの蒸着源を旋回移動式蒸着ボートを介して移動可能に配置したもので、ウェハテーブルに支持されるウェハの中心からずれた位置に蒸着源を移動させるようにしたものである。これにより、蒸着源から放出させた蒸発材料を、ウェハを回転させつつその表面に均一に蒸着させるものである。
特開２００２−２４９８６８ 特開２００２−１６７６６４（図２） In Patent Document 1, the diameter of the discharge hole formed in the discharge part (large diameter pipe) connected to the transfer part (small diameter pipe) on one end side is formed with a small diameter on one end side and a large diameter on the other end side. ing.
In Patent Document 2, two vapor deposition sources are movably arranged below a rotary wafer table in a vapor deposition chamber via a swivel vapor deposition boat, which is displaced from the center of the wafer supported by the wafer table. The vapor deposition source is moved to a different position. Thus, the evaporation material released from the evaporation source is uniformly evaporated on the surface of the wafer while rotating the wafer.
JP 2002-249868 JP 2002-167664 A (FIG. 2)

しかしながら、特許文献１では、被蒸着部材の蒸着面積が小さい場合には問題がないが、蒸着面積が大きくなるに従って放出部の長さが長尺となり、放出孔の径を変化させるだけでは、蒸発材料を均等に放出させることが困難となるおそれがある。   However, in Patent Document 1, there is no problem when the vapor deposition area of the vapor deposition member is small, but the length of the discharge portion becomes longer as the vapor deposition area becomes larger. It may be difficult to release the material evenly.

また特許文献２では、被蒸着部材は吸着具により保持されるが、被蒸着部材の蒸着面積が大きくなり、かつ回転されるとなると、被蒸着部材を保持・回転させる機構が大きくなるとともに、回転時の被蒸着部材の精度が要求され、設計の負担が増えることになる。   Further, in Patent Document 2, the vapor deposition member is held by an adsorber, but when the vapor deposition area of the vapor deposition member becomes large and rotates, the mechanism for holding and rotating the vapor deposition member becomes large and rotates. The accuracy of the member to be deposited at the time is required, and the design burden increases.

本発明は上記問題点を解決して、被蒸着材の広い被蒸着面に、より均一に蒸着可能な蒸着装置を提供することを目的とする。   An object of the present invention is to solve the above problems and to provide a vapor deposition apparatus capable of vapor deposition more uniformly on a wide vapor deposition surface of a vapor deposition material.

請求項１記載の発明は、蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、放出容器を蒸発材料通路出口の中心を通る回転軸心周りに回転させる容器回転手段を設けたものである。   According to a first aspect of the present invention, in the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member, the vapor deposition device communicates with the vaporization material passage outlet disposed opposite to the vapor deposition member and has a diffusion space therein. A container rotating means provided with a discharge container, having a plurality of discharge holes formed at predetermined positions on the vapor deposition member side of the discharge container, and rotating the discharge container around a rotation axis passing through the center of the evaporating material passage outlet; It is provided.

請求項２記載の発明は、蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、放出用容器の拡散空間に、蒸発材料通路出口に対向して蒸発材料粒子を反射する反射部材を設け、放出容器を蒸発材料通路出口の中心を通る回転軸心周りに回転させる容器回転手段を設けたものである。   According to a second aspect of the present invention, in the vapor deposition apparatus for adhering the evaporated evaporation material to the vapor deposition member, the vapor deposition device communicates with the vaporization material passage outlet disposed opposite to the vapor deposition member and has a diffusion space therein. A discharge container is provided, a plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container, and the evaporation material particles are reflected in the diffusion space of the discharge container so as to face the evaporation material passage outlet. A reflecting member is provided, and a container rotating means for rotating the discharge container around a rotation axis passing through the center of the evaporating material passage outlet is provided.

請求項３記載の発明は、反射部材に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大するように配置された複数の調整用透孔を穿設したものである。   According to a third aspect of the present invention, the reflective member has a plurality of adjustment through holes arranged so that the opening area per unit area increases from the central portion facing the evaporative material passage outlet toward the outer peripheral side. It is set.

請求項４記載の発明は、蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、放出用容器の拡散空間に、蒸発材料通路出口側の空間部と放出孔側の空間部とを区画し多数の透孔を有する分散透過板を配置し、前記分散透過板の蒸発材料通路出口に対向する部位に、蒸発材料粒子を反射する反射部を設け、放出容器を蒸発材料通路出口の中心を通る回転軸心周りに回転させる容器回転手段を設けたものである。   According to a fourth aspect of the present invention, in the vapor deposition apparatus for adhering the evaporated evaporation material to the vapor deposition member, the vapor deposition material communicates with the vaporization material passage outlet disposed to face the vapor deposition member and has a diffusion space therein. A discharge container is provided, a plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container, and a space part on the evaporation material passage outlet side and a space on the discharge hole side are provided in the diffusion space of the discharge container. A dispersion transmitting plate having a large number of through holes is provided, a reflecting portion for reflecting the evaporation material particles is provided at a portion of the dispersion transmission plate facing the evaporating material passage outlet, and the discharge container is provided with the evaporating material passage. A container rotating means for rotating around a rotation axis passing through the center of the outlet is provided.

請求項５記載の発明は、反射部に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大される配置された複数の調整用透孔を穿設したものである。   According to a fifth aspect of the present invention, a plurality of adjustment through holes arranged so that an opening area per unit area is enlarged from the central portion facing the evaporative material passage outlet toward the outer peripheral side are formed in the reflecting portion. It is a thing.

請求項６記載の発明は、蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、放出用容器の拡散空間に、蒸発材料通路出口に対向して蒸発材料粒子を反射する反射部材を設けたものである。   According to a sixth aspect of the present invention, in the vapor deposition apparatus for adhering the evaporated evaporation material to the vapor deposition member, the vapor deposition device communicates with the vaporization material passage outlet disposed opposite to the vapor deposition member and has a diffusion space therein. A discharge container is provided, a plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container, and the evaporation material particles are reflected in the diffusion space of the discharge container so as to face the evaporation material passage outlet. A reflecting member is provided.

請求項７記載の発明は、反射部材に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大するように配置された複数の調整用透孔を穿設したものである。   According to a seventh aspect of the present invention, the reflective member has a plurality of adjustment through holes arranged so that the opening area per unit area increases from the central portion facing the evaporating material passage outlet toward the outer peripheral side. It is set.

請求項８記載の発明は、蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、放出用容器の拡散空間に、蒸発材料通路出口側の空間部と放出孔側の空間部とを区画し多数の透孔を有する分散透過板を配置し、前記分散透過板の蒸発材料通路出口に対向する部位に、蒸発材料粒子を反射する反射部を設けたものである。   According to an eighth aspect of the present invention, in the vapor deposition apparatus for adhering the evaporated evaporation material to the vapor deposition member, the vapor deposition device communicates with the vaporization material passage outlet disposed to face the vapor deposition member and has a diffusion space therein. A discharge container is provided, a plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container, and a space part on the evaporation material passage outlet side and a space on the discharge hole side are provided in the diffusion space of the discharge container. A dispersion transmission plate having a large number of through holes is arranged, and a reflection portion for reflecting the evaporation material particles is provided at a portion of the dispersion transmission plate facing the evaporation material passage outlet.

請求項９記載の発明は、反射部に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大される配置された複数の調整用透孔を穿設したものである。   According to a ninth aspect of the present invention, a plurality of adjustment through-holes are provided in the reflecting portion so that the opening area per unit area is increased from the central portion facing the evaporative material passage outlet toward the outer peripheral side. It is a thing.

請求項１０記載の発明は、蒸発材料通路に、蒸発材料の流れを緩衝する緩衝部材を設けたものである。   According to a tenth aspect of the present invention, a buffer member for buffering the flow of the evaporation material is provided in the evaporation material passage.

請求項１記載の発明によれば、蒸着材料通路出口から拡散空間に放出された蒸発材料粒子は、放出用容器の内面に反射されつつ拡散されるため放出用容器内の各放出孔付近での蒸発材料の分布が平坦化され、さらに放出用容器の回転により旋回移動する放出孔から蒸発材料粒子が放出されることにより、被蒸着部材に向って効果的に広がって拡散され被蒸着面に蒸着される（余弦則による膜厚分布が平坦化される）ので、被蒸着面が広くても蒸発材料の膜厚が均一に蒸着させることができる。また中空部材を用いるため軽量であり、被蒸着部材の吸着・回転手段を大型化するのに比較して、簡略に構成できて容易に製造することができる。   According to the first aspect of the present invention, the evaporated material particles discharged from the vapor deposition material passage outlet to the diffusion space are diffused while being reflected by the inner surface of the discharge container. The distribution of the evaporation material is flattened, and further, the evaporation material particles are discharged from the discharge holes that are swung by the rotation of the discharge container, so that they are effectively spread and diffused toward the member to be evaporated and deposited on the surface to be deposited. Since the film thickness distribution according to the cosine law is flattened, the film thickness of the evaporation material can be uniformly deposited even if the deposition surface is wide. Further, since the hollow member is used, it is lightweight, and can be easily configured and easily manufactured as compared with an increase in the size of the adsorption / rotation means for the member to be deposited.

請求項２記載の発明によれば、蒸発材料通路の出口から拡散空間に中心側ほど高密度で放出された蒸発材料粒子を、反射部材により反射させて拡散し、蒸発材料通路出口と反対側の放出容器の内面に達する蒸発材料の密度を低減することができる。したがって、蒸発材料粒子の密度が集中するために、蒸発材料通路出口の反対側の放出容器の内面に放出孔を形成できないという制限を受けるところ、反射部材により放出孔の形成位置の制限がなくなる。これにより、蒸発材料粒子を被蒸着面に均一に蒸着させることができる任意位置に放出孔を穿設配置することができ、各放出孔から放出される蒸発材料を均等化して、より均一な蒸着膜厚を実現することができる。   According to the second aspect of the present invention, the evaporating material particles emitted from the outlet of the evaporating material passage to the diffusion space at a higher density toward the center are reflected and diffused by the reflecting member, and are opposite to the evaporating material passage outlet. The density of the evaporating material reaching the inner surface of the discharge container can be reduced. Therefore, when the density of the evaporation material particles is concentrated, there is a restriction that the discharge hole cannot be formed on the inner surface of the discharge container on the opposite side of the outlet of the evaporation material passage. As a result, the discharge holes can be drilled and arranged at arbitrary positions where the evaporation material particles can be uniformly deposited on the surface to be evaporated, and the evaporation material discharged from each discharge hole is equalized to provide more uniform evaporation. A film thickness can be realized.

請求項３記載の発明によれば、反射部材は、調整用透孔により中央部で蒸発材料粒子の透過率が小さく、外周部で大きくすることで、蒸発材料通路出口の反対側の蒸発材料粒子の密度を、他の拡散空間の部位と均等化することができる。これにより各放出孔から放出される蒸発材料をさらに均一化して、均一な厚みの蒸着膜の形成に寄与することができる。   According to the third aspect of the present invention, the reflective member has a small transmittance at the central portion by the through-hole for adjustment and a large transmittance at the outer peripheral portion, so that the vaporized material particles on the opposite side of the vaporized material passage outlet. Can be equalized with other diffused space portions. Thereby, the evaporation material discharged from each discharge hole can be made more uniform and contribute to the formation of a vapor deposition film having a uniform thickness.

請求項４記載の発明によれば、蒸発材料通路出口から空間部に放出された蒸発材料粒子が、放出用容器の内面と分散透過板とに反射されつつ拡散し、さらに分散透過板の透孔を介して放出孔側の空間部に通過しつつ拡散され、蒸発材料粒子の密度が均一化されて、旋回移動する放出孔から放出することができる。また分散透過板の反射部により、放出孔の形成位置の制限がなくなって、蒸発材料粒子を被蒸着面に均一に蒸着させるように放出孔を穿設配置することができ、蒸発材料を被蒸着面に均一な膜厚で蒸着させることができる。   According to the fourth aspect of the present invention, the evaporation material particles discharged from the outlet of the evaporation material passage to the space are diffused while being reflected by the inner surface of the discharge container and the dispersion transmission plate, and further the through holes of the dispersion transmission plate The vaporized material particles are diffused while passing through the space on the discharge hole side, and the density of the vaporized material particles is made uniform, so that the discharge hole can be discharged from the swiveling discharge hole. In addition, the reflecting part of the dispersion transmission plate eliminates the restriction on the formation position of the discharge hole, and the discharge hole can be drilled and arranged so that the evaporation material particles are uniformly deposited on the deposition surface. The surface can be deposited with a uniform film thickness.

請求項５記載の発明によれば、反射部に穿設した調整用透孔により、反射部の中央部で蒸発材料粒子の透過率が少なく、外周部で透過率を多くすることができ、反射部の放出孔側の空間部における蒸発材料粒子の密度をさらに均一化することができ、被蒸着面に均一な厚みの蒸着膜を形成することができる。   According to the fifth aspect of the present invention, the adjustment through-hole formed in the reflecting portion can reduce the transmittance of the evaporation material particles at the central portion of the reflecting portion, and can increase the transmittance at the outer peripheral portion. The density of the evaporation material particles in the space on the discharge hole side of the part can be further uniformed, and a vapor deposition film having a uniform thickness can be formed on the vapor deposition surface.

請求項６記載の発明によれば、放出用容器の内面に反射されつつ拡散された蒸発材料粒子が、旋回移動する放出容器の放出孔から放出されるので、蒸発材料粒子が効果的に拡散されて、被蒸着部材の被蒸着面が広くても均一に蒸発材料を蒸着させることができる（余弦則による膜厚分布が平坦化される）。また、蒸発材料通路の出口から中心側ほど高密度で拡散空間に放出された蒸発材料粒子を、反射部材により反射させて拡散するので、蒸発材料通路出口に対向する部位（反射部材の蒸発材料通路出口の反対側）に達する蒸発材料の密度を低減することができる。したがって、従来では、蒸発材料粒子の密度が集中するために、蒸発材料通路出口に対向する部位に放出孔を形成できないという制限を受けていたが、反射部材により放出孔の形成位置の制限がなくなる。これにより、蒸発材料粒子を被蒸着面に均一に蒸着させることができる放出用容器の任意位置に放出孔を穿設配置することができ、より均一な蒸着を実現することができる。   According to the sixth aspect of the present invention, the evaporated material particles reflected and diffused on the inner surface of the discharge container are discharged from the discharge holes of the rotating discharge container, so that the evaporated material particles are effectively diffused. Thus, even if the deposition surface of the deposition member is wide, the evaporation material can be uniformly deposited (the film thickness distribution according to the cosine law is flattened). In addition, since the evaporation material particles discharged to the diffusion space at a higher density from the outlet of the evaporation material passage to the diffusion space are reflected and diffused by the reflection member, the portion facing the evaporation material passage outlet (the evaporation material passage of the reflection member) The density of the evaporating material reaching the other side of the outlet) can be reduced. Therefore, conventionally, since the density of the evaporating material particles is concentrated, there is a restriction that the discharge hole cannot be formed at a portion facing the evaporating material passage outlet. However, there is no restriction on the formation position of the emitting hole by the reflecting member. . As a result, the discharge holes can be drilled and arranged at arbitrary positions of the discharge container where the evaporation material particles can be uniformly deposited on the deposition surface, and more uniform deposition can be realized.

請求項７記載の発明によれば、反射部材の中央部の透過率が少なく、外周部の透過率を多くすることで、反射部材の蒸発材料通路出口の反対側における蒸発材料粒子の密度を、他の拡散空間の部位とさらに均一化することができ、各放出孔から蒸発材料の放出量を均一化して、被蒸着面に均一な厚みの蒸着膜を形成することができる。   According to the invention of claim 7, the density of the evaporating material particles on the opposite side of the evaporating material passage outlet of the reflecting member is reduced by increasing the transmissivity of the outer peripheral portion of the reflecting member at the central portion of the reflecting member. It can be made more uniform with other diffusion space parts, and the amount of vaporized material released from each discharge hole can be made uniform, so that a vapor deposition film having a uniform thickness can be formed on the vapor deposition surface.

請求項８記載の発明によれば、蒸発材料通路出口から拡散空間部に放出された蒸発材料粒子が、放出用容器の内面と分散透過板とに反射されつつ拡散し、さらに分散透過板の透孔を介して放出孔側の空間部に通過しつつ拡散され、蒸発材料粒子の密度が均一化されて放出孔から放出することができる。また分散透過板の反射部により、放出孔の形成位置の制限がなくなって、蒸発材料粒子を被蒸着面に均一に蒸着させるように放出孔を穿設配置することができ、蒸発材料を被蒸着面に均一な膜厚で蒸着させることができる。   According to the eighth aspect of the present invention, the evaporation material particles released from the outlet of the evaporation material passage to the diffusion space are diffused while being reflected by the inner surface of the discharge container and the dispersion transmission plate, and further the transmission of the dispersion transmission plate. It is diffused while passing through the hole to the space on the discharge hole side, and the density of the evaporated material particles is made uniform and can be discharged from the discharge hole. In addition, the reflecting part of the dispersion transmission plate eliminates the restriction on the formation position of the discharge hole, and the discharge hole can be drilled and arranged so that the evaporation material particles are uniformly deposited on the deposition surface. The surface can be deposited with a uniform film thickness.

請求項９記載の発明によれば、調整用透孔により反射部の中央部の透過率が少なく、外周部の透過率を多くすることで、反射部の放出孔側の空間部における蒸発材料粒子の密度を、他の拡散空間の部位と均一化することができ、各放出孔からの蒸発材料の放出量を均一化して、均一な厚みの蒸着膜を形成することができる。   According to the ninth aspect of the present invention, the adjustment material has a small transmittance at the central portion of the reflecting portion and a large transmittance at the outer peripheral portion, whereby the evaporated material particles in the space on the discharge hole side of the reflecting portion. Can be made uniform with other diffusion space portions, and the amount of vaporized material released from each discharge hole can be made uniform to form a vapor deposition film having a uniform thickness.

請求項１０記載の発明によれば、蒸発材料通路に緩衝部材を設けたので、蒸発材料通路に蒸発材料が急速に流入することがあっても、これを緩衝して蒸発材料の流速を均一化することができ、被蒸着面への膜厚制御を適正に行うことができる。   According to the tenth aspect of the present invention, since the buffer member is provided in the evaporating material passage, even if the evaporating material may flow into the evaporating material passage rapidly, this is buffered and the flow rate of the evaporating material is made uniform. Therefore, film thickness control on the deposition surface can be appropriately performed.

以下、本発明の実施の形態を図１および図２に基づいて説明する。
［実施の形態１］
図１，図２に示すように、蒸着用容器２内に、真空雰囲気中で被蒸着部材であるガラス基板Ｗの表面（下面）に、たとえば有機ＥＬ材料を蒸着する蒸着室１が設けられており、蒸着用容器２には、図示しない真空ユニットにより真空雰囲気にされる真空ポート４Ａと、被蒸着材であるガラス基板Ｗを出し入れ可能なゲートバルブ（仕切弁）付きの基板交換ポート４Ｂとが形成されている。蒸着用容器２の上部にはガラス基板Ｗを保持するワーク保持具３が設けられており、ワーク保持具３に保持されたガラス基板Ｗの下面（被蒸着面）に下方から蒸発材料を蒸着するアップブロータイプに構成されている。 Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.
[Embodiment 1]
As shown in FIGS. 1 and 2, a deposition chamber 1 for depositing, for example, an organic EL material is provided in a deposition container 2 on the surface (lower surface) of a glass substrate W that is a member to be deposited in a vacuum atmosphere. The vapor deposition container 2 includes a vacuum port 4A that is brought into a vacuum atmosphere by a vacuum unit (not shown), and a substrate exchange port 4B with a gate valve (gate valve) through which a glass substrate W as a vapor deposition material can be taken in and out. Is formed. A work holder 3 for holding the glass substrate W is provided on the upper part of the vapor deposition container 2, and the evaporation material is evaporated from below on the lower surface (deposition surface) of the glass substrate W held by the work holder 3. It is configured as an up-blow type.

蒸着用容器２の下部には蒸発室５を形成する蒸発用容器６が設けられ、蒸発用容器６内に材料を加熱して蒸発させる加熱用電熱線（加熱手段）８ａを有する容器載置台８に材料収納容器７が収容されている。この蒸発用容器６には、材料収納容器７を交換するためのゲートバルブ（仕切弁）付きの容器交換ポート９と、図示しない真空ユニットにより真空雰囲気にされる真空ポート１０が設けられている。また蒸発用容器６には、上部に蒸発材料を放出・閉止または流量調整可能な開閉弁１２を介して接続部材１１が接続され蒸発材料通路１３が形成されている。   An evaporation container 6 for forming an evaporation chamber 5 is provided below the evaporation container 2, and a container mounting table 8 having a heating heating wire (heating means) 8 a for heating and evaporating the material in the evaporation container 6. The material container 7 is accommodated in the container. The evaporation container 6 is provided with a container exchange port 9 with a gate valve (gate valve) for exchanging the material storage container 7 and a vacuum port 10 that is brought into a vacuum atmosphere by a vacuum unit (not shown). Further, the evaporation container 6 is connected to a connection member 11 via an opening / closing valve 12 capable of discharging / closing the evaporation material or adjusting the flow rate, and an evaporation material passage 13 is formed in the evaporation container 6.

接続部材１１は、蒸発用容器６に接続された固定管体１１Ａと、この固定管体１１Ａに回転継手１１Ｂを介して回転自在に接続された回転管体１１Ｃとで構成されており、回転管体１１Ｃは蒸着容器２の底部の開口部に回転軸受１４を介して接続されるとともに、蒸着室１内に突出された上端部に放出用容器１５が固定されて回転管体１１Ｃの回転軸心Ｏを中心に回転自在に支持されている。   The connecting member 11 is composed of a fixed tube 11A connected to the evaporation container 6, and a rotary tube 11C rotatably connected to the fixed tube 11A via a rotary joint 11B. The body 11C is connected to the opening at the bottom of the vapor deposition vessel 2 via a rotary bearing 14, and the discharge vessel 15 is fixed to the upper end protruding into the vapor deposition chamber 1 so that the rotation axis of the rotary tube 11C. It is supported rotatably around O.

放出用容器１５は、平面視が矩形（または円形や多角形であってもよい）の箱体形で内部に拡散空間１６が形成され、底部中央部に貫設固定された回転管体１１Ｃに蒸発材料通路１３の出口１３ａが開口されている。また放出用容器１５でガラス基板Ｗに対向する上面板１５ａには、中央部（蒸発材料通路１３の出口１３ａの対向部位）を除く外周部の所定の対称位置に複数の放出孔１７が穿設されている。   The discharge container 15 has a rectangular box shape (or may be circular or polygonal) in plan view, has a diffusion space 16 formed therein, and evaporates into a rotating tube body 11C that is fixedly penetrated at the center of the bottom. An outlet 13a of the material passage 13 is opened. Further, a plurality of discharge holes 17 are formed in a predetermined symmetrical position on the outer peripheral portion excluding the central portion (a portion facing the outlet 13a of the evaporating material passage 13) in the upper surface plate 15a facing the glass substrate W in the discharge container 15. Has been.

この蒸着用容器２には、放出用容器１３を回転駆動する容器回転装置（容器回転手段）２１が設けられている。この容器回転装置２１は、蒸着室１内で回転管体１１Ｃに固定された従動プーリ（歯付きプーリ）２１ａと、蒸着用容器１３の底板に軸受を介して回転自在に貫通支持された駆動軸２１ｂを回転駆動する回転駆動装置（電動モータ）２１ｃと、前記駆動軸２１ｂに取り付けられた駆動プーリ（歯付きプーリ）２１ｄと、駆動プーリ２１ｄと従動プーリ２１ａとに巻張されたベルト（タイミングベルト）２１ｅとで構成されている。   The deposition container 2 is provided with a container rotating device (container rotating means) 21 that rotationally drives the discharge container 13. The container rotating device 21 includes a driven pulley (toothed pulley) 21a fixed to the rotating tube 11C in the vapor deposition chamber 1 and a drive shaft that is rotatably supported by a bottom plate of the vapor deposition container 13 through a bearing. Rotation drive device (electric motor) 21c for rotating and driving 21b, drive pulley (toothed pulley) 21d attached to the drive shaft 21b, belt (timing belt) wound around the drive pulley 21d and the driven pulley 21a ) 21e.

またこの回転管体１１Ｃに設けられたスリップリング１１Ｄを介して放出用容器１５および回転管体１１Ｃの加熱用電熱線（加熱手段）１８に電源が供給され、蒸発材料の付着を防止している。   In addition, power is supplied to the discharge container 15 and the heating heating wire (heating means) 18 of the rotating tube 11C via a slip ring 11D provided in the rotating tube 11C, thereby preventing the evaporation material from adhering. .

上記構成において、蒸発室５内で加熱用電熱線８ａにより材料収納容器１３内の材料が加熱され蒸発されると、蒸発材料通路１３の出口１３ａから放出用容器１５の拡散空間１６に導入される。この拡散空間では、蒸発材料粒子が放出用容器１５の内面に反射して効果的に拡散され、各放出孔１７から均一に放出されるとともに、容器回転装置２１により放出用容器１５が回転軸心Ｏを中心に回転されることから、一定位置から放出されるのに比較して、蒸発材料粒子が各放出孔１７から効果的に分散され、ガラス基板Ｗの表面に均一に蒸着される。
[実施の形態２] In the above configuration, when the material in the material container 13 is heated and evaporated by the heating wire 8a in the evaporation chamber 5, the material is introduced from the outlet 13a of the evaporation material passage 13 into the diffusion space 16 of the discharge container 15. . In this diffusion space, the evaporated material particles are reflected and effectively diffused on the inner surface of the discharge container 15 and are uniformly discharged from each discharge hole 17, and the discharge container 15 is rotated by the container rotating device 21. Since it is rotated around O, the evaporation material particles are effectively dispersed from the respective emission holes 17 and uniformly deposited on the surface of the glass substrate W as compared with being emitted from a certain position.
[Embodiment 2]

この実施の形態２は、実施の形態１の放出用容器内に反射部材を設けたもので、図３〜図５を参照して説明する。なお、実施の形態１と同一部材には同一符号を付して説明を省略する。   In the second embodiment, a reflection member is provided in the discharge container of the first embodiment, and will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

放出用容器１５には、蒸発材料通路１３の出口１３ａと放出用容器１５の上面板１５ａとの間（中間部）で、出口１３ａの対向位置に、出口１３ａとの間に所定距離をあけて反射面板（反射部材）３１Ａ〜３１Ｃを設けたもので、図３（ａ）〜（ｃ）に示す第１例では、反射面板３１Ａは、蒸発材料通路１３の出口１３ａの開口面よりやや大きい円板形状に形成され、複数の脚部材３２により支持されている。   The discharge container 15 has a predetermined distance between the outlet 13a between the outlet 13a of the evaporating material passage 13 and the upper surface plate 15a of the discharge container 15 (intermediate portion) and at a position facing the outlet 13a. Reflecting surface plates (reflecting members) 31A to 31C are provided. In the first example shown in FIGS. 3A to 3C, the reflecting surface plate 31A is a circle slightly larger than the opening surface of the outlet 13a of the evaporating material passage 13. It is formed in a plate shape and is supported by a plurality of leg members 32.

また図４（ａ）〜（ｃ）に示す第２例は、出口１３ａの開口面の数倍（２〜４倍）の大きい径の大径の反射面板３１Ｂに形成され、複数の脚部材３２により支持されている。
さらに図５（ａ）〜（ｃ）に示す第３例は、開口面の数倍（２〜４倍）の大きい径の大径の反射面板３１Ｃで、かつ多数の透孔３３が穿設されたものである。反射面板３１Ｃは複数の脚部材３２により支持されるとともに、調整用透孔３３は蒸発材料通路１３の出口１３ａに対向する中心部から外周側に向って、単位面積当りの前記透孔３３の開口面積が順次拡大されるように形成されている。 The second example shown in FIGS. 4A to 4C is formed on a large-diameter reflecting surface plate 31B having a large diameter several times (2 to 4 times) the opening surface of the outlet 13a. Is supported by
Further, the third example shown in FIGS. 5A to 5C is a large-diameter reflecting surface plate 31C having a diameter several times (2 to 4 times) larger than the opening surface, and a large number of through holes 33 are formed. It is a thing. The reflecting face plate 31C is supported by a plurality of leg members 32, and the adjustment through-hole 33 is an opening of the through-hole 33 per unit area from the center facing the outlet 13a of the evaporating material passage 13 toward the outer peripheral side. It is formed so that the area is sequentially enlarged.

また第１例〜第３例とも、放出用容器１５の上面板１５ａに形成された複数の放出孔１７は、中央部（反射面板３１Ａ〜３１Ｃの蒸発材料通路１３の出口１３ａの反対面）を含めて所定位置に穿設されている。   Further, in both the first to third examples, the plurality of discharge holes 17 formed in the upper surface plate 15a of the discharge container 15 have a central portion (a surface opposite to the outlet 13a of the evaporation material passage 13 of the reflection surface plates 31A to 31C). It is drilled at a predetermined position.

先の上記実施の形態１においては、蒸発材料通路１３の出口１３ａから拡散空間１６に放出された蒸発材料粒子は、蒸発材料粒子の密度が出口１３ａの回転軸心Ｏ上に集中するため、この部位に放出孔１７を形成すると、他の部位の放出孔１７に比べて多量の蒸発材料粒子が放出され、出口１３ａの対向部位に放出孔１７を形成できないという制限を受ける。しかし、実施の形態２では、反射部材３１Ａ〜３１Ｃにより、蒸発材料通路１３の出口１３ａから放出された高密度の蒸発材料粒子を反射させることで、出口１３ａに対向する部位に形成された放出孔１７からの蒸発材料粒子の放出量を制限することができる。つまり拡散空間１６を放出用容器１５の内壁面で反射し迂回された蒸発材粒子が、出口１３ａに対向する部位に形成された放出孔１７に達するため、他の放出孔１７と同等の条件になるので、放出孔１７の形成位置の制限がなくなり、放出用容器１５の上面板１５ａに形成する放出孔１７を任意位置に穿設配置するとともに、容器回転装置２１により放出容器１５を回転軸心Ｏ周りに回転させることにより、蒸発材料粒子をガラス基板Ｗの被蒸着面に均一に蒸着させることができる。   In the above-described first embodiment, the density of the evaporated material particles discharged from the outlet 13a of the evaporated material passage 13 to the diffusion space 16 is concentrated on the rotation axis O of the outlet 13a. When the discharge hole 17 is formed in the part, a larger amount of evaporation material particles are discharged compared to the discharge hole 17 in the other part, and the discharge hole 17 cannot be formed in the part opposite to the outlet 13a. However, in the second embodiment, the high density evaporating material particles emitted from the outlet 13a of the evaporating material passage 13 are reflected by the reflecting members 31A to 31C, so that the emitting holes formed in the portion facing the outlet 13a. The amount of vaporized material particles released from 17 can be limited. That is, since the evaporation material particles reflected by the inner wall surface of the discharge container 15 and detoured in the diffusion space 16 reach the discharge hole 17 formed in the portion facing the outlet 13a, the conditions are the same as those of the other discharge holes 17. As a result, there is no restriction on the position where the discharge hole 17 is formed, and the discharge hole 17 formed in the upper surface plate 15a of the discharge container 15 is drilled and arranged at an arbitrary position. By rotating around O, the evaporation material particles can be uniformly deposited on the deposition surface of the glass substrate W.

また第３例の反射面板３１Ｃによれば、中央部を通過する蒸発材料粒子の透過率が小さく、外周側ほど調整用透孔３３を介して蒸発材料粒子の透過率を大きくすることで、反射面板３１Ｃによる蒸発材料通路１３の出口１３ａの反対側における蒸発材料粒子の密度を、他の拡散空間１６の部位と均一化することができ、各放出孔１７から放出される蒸発材料粒子量を均一化するとともに、容器回転装置２１により放出容器１５を回転軸心Ｏ周りに回転させることにより放出された蒸発材料粒子量を効果的に拡散し、ガラス基板Ｗの表面に均一な厚みの蒸着膜を形成することができる。   Further, according to the reflective face plate 31C of the third example, the transmittance of the evaporation material particles passing through the center is small, and the transmittance of the evaporation material particles is increased through the adjustment through hole 33 toward the outer peripheral side, thereby reflecting The density of the evaporated material particles on the opposite side of the outlet 13a of the evaporated material passage 13 by the face plate 31C can be made uniform with the other diffusion space 16 parts, and the amount of evaporated material particles discharged from each discharge hole 17 is made uniform. In addition, the amount of evaporated material particles released by rotating the discharge container 15 around the rotation axis O by the container rotating device 21 is effectively diffused, and a vapor deposition film having a uniform thickness is formed on the surface of the glass substrate W. Can be formed.

［実施の形態３］
この実施の形態３は、実施の形態１の放出用容器１５内の分散空間を区画する反射部材を設けたもので、図６および図７を参照して説明する。なお、先の実施の形態と同一部材には同一符号を付して説明を省略する。 [Embodiment 3]
The third embodiment is provided with a reflection member that partitions the dispersion space in the discharge container 15 of the first embodiment, and will be described with reference to FIGS. 6 and 7. Note that the same members as those of the previous embodiment are denoted by the same reference numerals and description thereof is omitted.

放出用容器１５の拡散空間１６には、拡散空間１６を上下、すなわち放出孔１７が形成された上面板１５ａ側の上部空間１６ｕと、蒸発材料通路１３の出口１３ａ側の下部空間１６ｄとに区画する分散透過板（反射部材）４１Ａ，４１Ｂが設けられている。   In the diffusion space 16 of the discharge container 15, the diffusion space 16 is divided into upper and lower portions, that is, an upper space 16 u on the upper plate 15 a side where the discharge holes 17 are formed, and a lower space 16 d on the outlet 13 a side of the evaporation material passage 13. Dispersive transmission plates (reflection members) 41A and 41B are provided.

第１例の分散透過板４１Ａは、図６（ａ）〜（ｃ）に示すように、出口１３ａに対向する部位に出口１３ａの開口面の数倍（２〜４倍）の大きい径の反射部４２が形成され、この反射部４２Ａは透孔１７を有しない板状に形成されている。反射部４２Ａ以外の分散透過板４１Ａには、一定ピッチで均一に透孔４３が形成されたいわゆるパンチングメタル状に形成されている。   As shown in FIGS. 6A to 6C, the dispersion / transmission plate 41A of the first example is a reflection having a large diameter several times (2 to 4 times) the opening surface of the outlet 13a at a portion facing the outlet 13a. A portion 42 is formed, and the reflecting portion 42 </ b> A is formed in a plate shape without the through-hole 17. The dispersion transmission plate 41A other than the reflection portion 42A is formed in a so-called punching metal shape in which the through holes 43 are uniformly formed at a constant pitch.

第２例の分散透過板４１Ｂは、図７（ａ）〜（ｃ）に示すように、出口１３ａに対向する部位に出口１３ａの開口面の数倍（２〜４倍）の大きい径の反射部４２Ｂが形成され、この反射部４２Ｂに調整用透孔４４が形成されている。これら調整用透孔４４は、蒸発材料通路１３の出口１３ａに対向する回転軸心Ｏから外周側に向って、単位面積当りの前記透孔３３の開口面積が順次拡大されるように形成されている。反射部４２Ｂ以外の分散透過板４１Ｂには、一定ピッチで透孔４３が多数形成されたいわゆるパンチングメタル状に形成されている。   As shown in FIGS. 7A to 7C, the dispersion transmission plate 41 </ b> B of the second example has a large-diameter reflection that is several times (2 to 4 times) the opening surface of the outlet 13 a at a portion facing the outlet 13 a. A portion 42B is formed, and an adjustment through hole 44 is formed in the reflection portion 42B. These adjustment through holes 44 are formed so that the opening area of the through holes 33 per unit area is sequentially enlarged from the rotation axis O facing the outlet 13a of the evaporating material passage 13 toward the outer peripheral side. Yes. The dispersion transmission plate 41B other than the reflection portion 42B is formed in a so-called punching metal shape in which a large number of through holes 43 are formed at a constant pitch.

上記実施の形態３によれば、放出用容器１５の拡散空間１６に上部空間１６ｕと下部空間１６ｄとに区画する分散透過板４１Ａ，４１Ｂを設けたので、蒸発材料通路１３の出口１３ａから放出された蒸発材料粒子は、下部空間１６ｄで分散透過板４１Ａと放出用容器１５の内面に反射されつつ透孔４３を介して上部空間１６ｕに導入され拡散される。また蒸発材料通路１３の出口１３ａに対向する部位は反射部４２Ａ，４２Ｂにより蒸発材料粒子の透過が制限されるので、上部空間１６ｕ内で蒸発材料粒子の密度がより均一化される。このように均一な密度で蒸発材料粒子を保持した上部空間１６ｕ内から放出孔１７を介して蒸発材料粒子をガラス基板Ｗに向って均一に放出するとともに、容器回転装置２１により放出容器１５を回転軸心Ｏ周りに回転させるので、放出孔１７から均等に放出された蒸発材料粒子をガラス基板Ｗの表面に蒸着させて均一な膜厚の蒸着膜を形成することができる。   According to the third embodiment, since the dispersion / transmission plates 41A and 41B which are divided into the upper space 16u and the lower space 16d are provided in the diffusion space 16 of the discharge container 15, it is discharged from the outlet 13a of the evaporation material passage 13. The evaporated material particles are introduced into the upper space 16u through the through holes 43 and diffused while being reflected on the inner surfaces of the dispersion transmission plate 41A and the discharge container 15 in the lower space 16d. In addition, since the portion of the evaporating material passage 13 that faces the outlet 13a is limited by the reflecting portions 42A and 42B, the evaporating material particles are restricted in transmission in the upper space 16u. In this way, the evaporation material particles are uniformly discharged toward the glass substrate W from the inside of the upper space 16 u holding the evaporation material particles at a uniform density through the discharge holes 17, and the discharge container 15 is rotated by the container rotating device 21. Since it rotates around the axis O, the vaporized material particles that are evenly discharged from the discharge holes 17 can be vapor-deposited on the surface of the glass substrate W to form a vapor-deposited film having a uniform thickness.

また第２例によれば、反射部４２Ｂで中央部で通過する蒸発材料粒子の透過率を少なくするとともに、外周側ほど調整用透孔４４を介して通過する蒸発材料粒子の透過率を多くすることで、反射部４２Ｂの上部空間１６ｕ側における蒸発材料粒子の密度を他の拡散空間１６の部位と均等化し、各放出孔１７からの蒸発材料粒子の放出量を均一化することができるとともに、容器回転装置２１により放出容器１５を回転軸心Ｏ周りに回転させることで、放出された蒸発材料粒子を効果的に拡散してガラス基板Ｗの表面に均一な厚みの蒸着膜を形成することができる。
[実施の形態４] Further, according to the second example, the transmittance of the evaporating material particles passing through the central portion in the reflecting portion 42B is decreased, and the transmittance of the evaporating material particles passing through the adjustment through hole 44 is increased toward the outer peripheral side. This makes it possible to equalize the density of the evaporation material particles on the upper space 16u side of the reflecting portion 42B with the part of the other diffusion space 16, and to uniformize the discharge amount of the evaporation material particles from each discharge hole 17, By rotating the discharge container 15 around the rotation axis O by the container rotating device 21, the discharged evaporation material particles can be effectively diffused to form a vapor deposition film having a uniform thickness on the surface of the glass substrate W. it can.
[Embodiment 4]

この実施の形態４は、実施の形態２の放出用容器１５を固定したもので、図８〜図１１を参照して説明する。なお、実施の形態２と同一部材には同一符号を付して説明を省略する。   In the fourth embodiment, the discharge container 15 of the second embodiment is fixed, and will be described with reference to FIGS. The same members as those of the second embodiment are denoted by the same reference numerals and description thereof is omitted.

放出用容器１５には、固定管体１１Ｅにより形成された蒸発材料通路１３の出口１３ａに所定距離をあけて対向位置に、反射面板（反射部材）６１Ａ〜６１Ｃが設けられている。   The discharge container 15 is provided with reflecting face plates (reflecting members) 61A to 61C at opposed positions with a predetermined distance from the outlet 13a of the evaporating material passage 13 formed by the fixed tube 11E.

図８，図９（ａ）〜（ｃ）に示す第１例では、反射面板６１Ａは、蒸発材料通路１３の出口１３ａの開口面よりやや大きい円板形状に形成され、複数の脚部材６２により支持されている。   In the first example shown in FIGS. 8 and 9A to 9C, the reflecting surface plate 61 </ b> A is formed in a disk shape slightly larger than the opening surface of the outlet 13 a of the evaporating material passage 13, and is formed by a plurality of leg members 62. It is supported.

また図１０（ａ）〜（ｃ）に示す第２例は、出口１３ａの開口面の数倍（２〜４倍）の大きい径の円板状の反射面板６１Ｂに形成され、複数の脚部材６２により支持されている。   The second example shown in FIGS. 10A to 10C is formed on a disc-shaped reflecting surface plate 61B having a diameter several times (2 to 4 times) larger than the opening surface of the outlet 13a, and includes a plurality of leg members. 62 is supported.

さらに図１１（ａ）〜（ｃ）に示す第３例は、開口面の数倍（２〜４倍）の大きい径の円板状の反射面板６１Ｃで、かつ多数の調整用透孔６３が穿設されたものである。反射面板６１Ｃは複数の脚部材６２により支持されるとともに、調整用透孔６３は蒸発材料通路１３の出口１３ａに対向する中心部から外周側に向って、単位面積当りの前記調整用透孔６３の開口面積が順次拡大されるように形成配置されている。   Further, the third example shown in FIGS. 11A to 11C is a disc-shaped reflecting surface plate 61C having a diameter several times (2 to 4 times) larger than the opening surface, and a large number of adjustment through holes 63. It has been drilled. The reflective face plate 61C is supported by a plurality of leg members 62, and the adjustment through-hole 63 extends from the central portion facing the outlet 13a of the evaporating material passage 13 toward the outer peripheral side, and the adjustment through-hole 63 per unit area. The openings are formed and arranged so that their opening areas are sequentially enlarged.

また第１例〜第３例とも、放出用容器１５の上面板１５ａに形成された複数の放出孔１７は、中央部（反射面板６１Ａ〜６１Ｃの蒸発材料通路１３の出口１３ａの反対面）を含めて所定位置に穿設されている。   In both the first to third examples, the plurality of discharge holes 17 formed in the upper surface plate 15a of the discharge container 15 have a central portion (a surface opposite to the outlet 13a of the evaporation material passage 13 of the reflection surface plates 61A to 61C). It is drilled at a predetermined position.

上記実施の形態４において、蒸発材料通路１３の出口１３ａから拡散空間１６に放出された蒸発材料粒子は、蒸発材料粒子の密度が出口１３ａの中心軸Ｏ’上に集中するため、この部位に放出孔１７を形成すると、他の部位の放出孔１７に比べて多量の蒸発材料粒子が放出されるため、出口１３ａの対向部位に放出孔１７を形成できないという制限を受ける。しかし、この実施の形態５では、反射部６１Ａ〜６１Ｃにより、蒸発材料通路１３の出口１３ａから放出された高密度の蒸発材料粒子を反射させることで、出口１３ａに対向する部位に形成された放出孔１７からの蒸発材料粒子の放出を制限することができる。これにより、放出孔の形成位置の制限がなくなり、放出用容器１５の上面板１５ａに形成する放出孔を、任意位置に穿設配置することにより、蒸発材料粒子を被蒸着面に均一に蒸着させることができる。   In the fourth embodiment, the evaporation material particles released from the outlet 13a of the evaporation material passage 13 into the diffusion space 16 are discharged to this portion because the density of the evaporation material particles is concentrated on the central axis O ′ of the outlet 13a. When the holes 17 are formed, a larger amount of vaporized material particles are discharged compared to the discharge holes 17 in other parts, and therefore, there is a restriction that the discharge holes 17 cannot be formed in the part facing the outlet 13a. However, in the fifth embodiment, the high density evaporating material particles emitted from the outlet 13a of the evaporating material passage 13 are reflected by the reflecting portions 61A to 61C, so that the emission formed at the portion facing the outlet 13a. The release of vaporized material particles from the holes 17 can be limited. As a result, there is no restriction on the formation position of the discharge hole, and the discharge hole formed in the upper surface plate 15a of the discharge container 15 is disposed at an arbitrary position so that the vaporized material particles are uniformly deposited on the deposition surface. be able to.

また第３例の反射面板６１Ｃによれば、中央部では通過する蒸発材料粒子の透過率は殆ど無く、外周部で調整用透孔６３を介して通過する蒸発材料粒子の透過率を大きくすることで、反射面板６１Ｃによる蒸発材料通路１３の出口１３ａの反対側における蒸発材料粒子の密度を、他の拡散空間１６の部位と均一化することができるので、各放出孔１７から放出される蒸発材料粒子を均一化して、ガラス基板Ｗの表面に均一な厚みの蒸着膜を形成することができる。   Further, according to the reflective surface plate 61C of the third example, there is almost no transmittance of the evaporating material particles that pass through the central portion, and the transmittance of the evaporating material particles that pass through the adjustment through hole 63 at the outer peripheral portion is increased. Thus, the density of the vaporized material particles on the opposite side of the outlet 13a of the vaporized material passage 13 by the reflective face plate 61C can be made uniform with the other diffusion space 16, so that the vaporized material discharged from each discharge hole 17 The particles can be made uniform to form a deposited film having a uniform thickness on the surface of the glass substrate W.

［実施の形態５］
この実施の形態５は、実施の形態３の放出用容器１５内の分散空間を区画する反射部材を設けるとともに、放出用容器１５を固定したもので、図１２および図１３を参照して説明する。なお、実施の形態１と同一部材には同一符号を付して説明を省略する。 [Embodiment 5]
In the fifth embodiment, a reflection member for partitioning the dispersion space in the discharge container 15 of the third embodiment is provided and the discharge container 15 is fixed, and will be described with reference to FIGS. 12 and 13. . The same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

放出用容器１５の拡散空間１６には、拡散空間１６を上下、すなわち放出孔１７が形成された上面板１５ａ側の上部空間１６ｕと、蒸発材料通路１３の出口１３ａ側の下部空間１６ｄとに区画する分散透過板（反射部材）７１Ａ，７１Ｂが設けられている。   In the diffusion space 16 of the discharge container 15, the diffusion space 16 is divided into upper and lower portions, that is, an upper space 16 u on the upper plate 15 a side where the discharge holes 17 are formed, and a lower space 16 d on the outlet 13 a side of the evaporation material passage 13. Dispersive transmission plates (reflection members) 71A and 71B are provided.

第１例の分散透過板７１Ａは、図１２に示すように、出口１３ａに対向する部位に出口１３ａの開口面の数倍（２〜４倍）の大きい径の反射部７２Ａが形成され、この反射部７２Ａは透孔１７を有しない面板状に形成されている。反射部７２Ａ以外の分散透過板７１Ａには、一定ピッチで均一に透孔７３が多数形成されたいわゆるパンチングメタル状に形成されている。   As shown in FIG. 12, the first example of the dispersive transmission plate 71A has a reflecting portion 72A having a diameter that is several times (2 to 4 times) larger than the opening surface of the outlet 13a at a portion facing the outlet 13a. The reflecting portion 72A is formed in a face plate shape that does not have the through hole 17. The dispersion transmission plate 71A other than the reflection portion 72A is formed in a so-called punching metal shape in which a large number of through holes 73 are uniformly formed at a constant pitch.

第２例の分散透過板７１Ｂは、図１３に示すように、出口１３ａに対向する部位に出口１３ａの開口面の数倍（２〜４倍）の大きい径の反射部７２Ｂが形成され、この反射部７２Ｂに調整用透孔７４が形成されている。これら調整用透孔７４は、蒸発材料通路１３の出口１３ａに対向する中心軸Ｏ’から外周側に向って、単位面積当りの前記調整用透孔７４の開口面積が順次拡大されるように形成配置されている。反射部７２Ｂ以外の分散透過板７１Ｂには、一定ピッチで透孔７３が多数形成されたいわゆるパンチングメタル状に形成されている。   As shown in FIG. 13, the second example of the dispersion transmission plate 71 </ b> B is formed with a reflecting portion 72 </ b> B having a diameter that is several times (2 to 4 times) larger than the opening surface of the outlet 13 a at a portion facing the outlet 13 a. An adjusting through hole 74 is formed in the reflecting portion 72B. These adjustment through holes 74 are formed so that the opening area of the adjustment through holes 74 per unit area is sequentially enlarged from the central axis O ′ facing the outlet 13a of the evaporating material passage 13 toward the outer peripheral side. Has been placed. The dispersion transmission plate 71B other than the reflection portion 72B is formed in a so-called punching metal shape in which a large number of through holes 73 are formed at a constant pitch.

上記実施の形態５によれば、放出用容器１５の拡散空間１６に上部空間１６ｕと下部空間１６ｄとに区画する分散透過板７１Ａ，７１Ｂを設けたので、蒸発材料通路１３の出口１３ａから放出された蒸発材料粒子は、下部空間１６ｄで分散透過板７１Ａ，７１Ｂと放出用容器１５の内面に反射されつつ透孔７３を介して上部空間１６ｕに導入され拡散される。また蒸発材料通路１３の出口１３ａに対向する部位では反射部７２Ａ，７２Ｂにより蒸発材料粒子の透過が制限されるので、上部空間１６ｕ内で蒸発材料粒子の密度がより均一化される。この上部空間１６ｕ内から放出孔１７を介して蒸発材料粒子がガラス基板Ｗに向って均等に放出されるので、蒸発材料粒子をガラス基板Ｗの表面に蒸着させて均一な膜厚の蒸着膜を形成することができる。   According to the fifth embodiment, since the dispersion transmission plates 71A and 71B which are divided into the upper space 16u and the lower space 16d are provided in the diffusion space 16 of the discharge container 15, the dispersion and transmission plates 71A and 71B are discharged from the outlet 13a of the evaporation material passage 13. The evaporated material particles are introduced into the upper space 16u through the through holes 73 and diffused while being reflected by the dispersed transmission plates 71A and 71B and the inner surface of the discharge container 15 in the lower space 16d. Further, since the permeation of the evaporation material particles is restricted by the reflecting portions 72A and 72B at the portion facing the outlet 13a of the evaporation material passage 13, the density of the evaporation material particles is made more uniform in the upper space 16u. Since the evaporation material particles are evenly discharged from the upper space 16u through the discharge holes 17 toward the glass substrate W, the evaporation material particles are vapor-deposited on the surface of the glass substrate W to form a vapor deposition film having a uniform film thickness. Can be formed.

また第２例によれば、反射部７２Ｂでは、中央部側で通過する蒸発材料粒子の透過率が小さく、外周部で調整用透孔７４を介して通過する蒸発材料粒子の透過率を大きくすることで、反射部７２Ｂの上部空間１６ｕ側における蒸発材料粒子の密度を他の上部空間１６ｕと同じ程度にすることができ、各放出孔１７から放出される蒸発材料粒子を均一化して、ガラス基板Ｗの表面に均一な厚みの蒸着膜を形成することができる。   Further, according to the second example, in the reflecting portion 72B, the transmittance of the evaporating material particles passing through the central portion is small, and the transmittance of the evaporating material particles passing through the adjustment through hole 74 is increased at the outer peripheral portion. Thus, the density of the evaporation material particles on the upper space 16u side of the reflecting portion 72B can be made the same level as that of the other upper spaces 16u, and the evaporation material particles emitted from the respective emission holes 17 can be made uniform to make the glass substrate. A vapor deposition film having a uniform thickness can be formed on the surface of W.

［実施の形態６］
この実施の形態６は、実施の形態１〜５に示すように、蒸発された蒸発材料をガラス基板Ｗに付着させる蒸着装置において、ガラス基板Ｗに対向して配置される蒸発材料通路１３の出口１３ａに連通して、内部に拡散空間１６を有する放出用容器１５を設け、前記放出用容器１５の被蒸着部材側の所定位置に複数の放出孔１７を穿設し、前記蒸発材料通路１３に単数または複数の緩衝板（緩衝部材）８１Ａ，８１Ｂを配置したものである。 [Embodiment 6]
In this sixth embodiment, as shown in the first to fifth embodiments, in the vapor deposition apparatus that attaches the evaporated evaporation material to the glass substrate W, the outlet of the evaporation material passage 13 disposed to face the glass substrate W. 13a, a discharge container 15 having a diffusion space 16 therein is provided, and a plurality of discharge holes 17 are formed at predetermined positions on the vapor deposition member side of the discharge container 15, One or a plurality of buffer plates (buffer members) 81A and 81B are arranged.

すなわち、図１４〜図１６に示すように、蒸発用容器６から開閉弁１２を介して放出容器１６に連通する接続部材１１，１１Ｅにより形成される蒸発材料通路１３に、単数または複数（図では２枚）の緩衝板８１Ａ，８１Ｂを所定間隔をあけて配置されている。前記緩衝板８１Ａ，８１Ｂは、多数の透孔８２Ａ，８２Ｂがそれぞれ形成されたパンチングメタル状に形成されるが、できれば図示したように、透孔８２Ａ，８２Ｂが位置ずれして形成されるほうが緩衝効果が高く、図１４では上段の緩衝板８１Ａの透孔８２Ａは外周部に多く分布され、下段の緩衝板８１Ｂの透孔８２Ｂは中央部に多く分布されて緩衝効果を向上させている。   That is, as shown in FIGS. 14 to 16, the evaporation material passage 13 formed by the connection members 11, 11 E communicating from the evaporation container 6 to the discharge container 16 through the on-off valve 12 is provided with one or a plurality (in the drawing). Two buffer plates 81A and 81B are arranged at a predetermined interval. The buffer plates 81A and 81B are formed in a punching metal shape in which a large number of through holes 82A and 82B are formed. If possible, the buffer holes 81A and 82B are formed so as to be displaced from each other as shown in the figure. In FIG. 14, the through holes 82A of the upper buffer plate 81A are distributed in the outer peripheral portion, and the through holes 82B of the lower buffer plate 81B are distributed in the central portion to improve the buffer effect.

これは、ガラス基板Ｗの交換時などで蒸発材料を放出しないまま加熱を続けていると、蒸発用容器６内の気圧が上昇する。この高圧の状態で開閉弁１２を開放すると、一気に蒸発材料が蒸発材料通路１３、放出用容器１５を介して蒸着用容器２に放出され、ガラス基板Ｗへの膜厚制御が困難になるという問題がある。このため、緩衝板８１Ａ，８１Ｂを蒸発材料通路１３に配置することで、蒸発材料の高速流を効果的に緩衝してガラス基板Ｗに蒸着される膜厚を良好に制御することができる。   If the heating is continued without releasing the evaporating material, for example, when the glass substrate W is replaced, the atmospheric pressure in the evaporating container 6 increases. If the on-off valve 12 is opened in this high pressure state, the evaporation material is released to the vapor deposition container 2 through the evaporation material passage 13 and the discharge container 15 at once, and it becomes difficult to control the film thickness on the glass substrate W. There is. For this reason, by arranging the buffer plates 81A and 81B in the evaporating material passage 13, the high-speed flow of the evaporating material can be effectively buffered and the film thickness deposited on the glass substrate W can be controlled well.

なお、緩衝板８１Ａ，８１Ｂの透孔８２Ａ，８２Ｂは、たとえば均等に分布させた同一形状のものでもよく、緩衝板８１Ａ，８１Ｂを回転して透孔８２Ａ，８２Ｂを位置ずれさせることにより、同様の作用効果を奏することができる。   The through holes 82A and 82B of the buffer plates 81A and 81B may have the same shape, for example, evenly distributed, and the same can be obtained by rotating the buffer plates 81A and 81B to shift the positions of the through holes 82A and 82B. The effect of this can be achieved.

本発明に係る蒸着装置の実施の形態１を示す全体縦断面図である。It is a whole longitudinal cross-sectional view which shows Embodiment 1 of the vapor deposition apparatus which concerns on this invention. 同蒸着室の放出容器を示す斜視図である。It is a perspective view which shows the discharge container of the vapor deposition chamber. （ａ）〜（ｃ）は本発明に係る蒸着装置の実施の形態２の第１例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 1st example of Embodiment 2 of the vapor deposition apparatus which concerns on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) ) Is a side cross-sectional view of the arrangement portion of the reflector. （ａ）〜（ｃ）は本発明に係る蒸着装置の実施の形態２の第２例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 2nd example of Embodiment 2 of the vapor deposition apparatus which concerns on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) ) Is a side cross-sectional view of the arrangement portion of the reflector. （ａ）〜（ｃ）は本発明に係る蒸着装置の実施の形態２の第３例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 3rd example of Embodiment 2 of the vapor deposition apparatus based on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) ) Is a side cross-sectional view of the arrangement portion of the reflector. （ａ）〜（ｃ）は本発明に係る蒸着装置の実施の形態３の第１例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 1st example of Embodiment 3 of the vapor deposition apparatus which concerns on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) ) Is a side cross-sectional view of the arrangement portion of the reflector. （ａ）〜（ｃ）は本発明に係る蒸着装置の実施の形態３の第２例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 2nd example of Embodiment 3 of the vapor deposition apparatus which concerns on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) ) Is a side cross-sectional view of the arrangement portion of the reflector. 本発明に係る蒸着装置の実施の形態４の第１例を示す全体縦断面図である。It is a whole longitudinal cross-sectional view which shows the 1st example of Embodiment 4 of the vapor deposition apparatus which concerns on this invention. （ａ）〜（ｃ）は実施の形態４の第１例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 1st example of Embodiment 4, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate FIG. （ａ）〜（ｃ）は実施の形態４の第２例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 2nd example of Embodiment 4, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate FIG. （ａ）〜（ｃ）は実施の形態４の第３例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 3rd example of Embodiment 4, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate FIG. （ａ）〜（ｃ）は本発明に係る蒸着装置の実施の形態５の第１例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 1st example of Embodiment 5 of the vapor deposition apparatus which concerns on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) ) Is a side cross-sectional view of the arrangement portion of the reflector. （ａ）〜（ｃ）は実施の形態５の第２例を示し、（ａ）は放出容器を示す分解斜視図、（ｂ）は反射板の平面図、（ｃ）は反射板の配置部の側面断面図である。(A)-(c) shows the 2nd example of Embodiment 5, (a) is an exploded perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate FIG. 本発明に係る実施の形態６を示し、緩衝板を示す蒸発材料通路の説明図である。It is explanatory drawing of the evaporating material channel | path which shows Embodiment 6 which shows this invention, and shows a buffer plate. 同緩衝板を実施の形態１に設けた全体縦断面図である。FIG. 3 is an overall longitudinal sectional view in which the buffer plate is provided in the first embodiment. 同緩衝板を実施の形態４に設けた全体縦断面図である。It is the whole longitudinal cross-sectional view which provided the buffer plate in Embodiment 4.

符号の説明Explanation of symbols

Ｏ 回転軸心
Ｏ’ 中心軸
Ｗ ガラス基板
１ 蒸着室
２ 蒸着用容器
５ 蒸発室
７ 材料収納容器
１１Ｃ 回転管体
１１Ｅ 固定管体
１３ 蒸発材料通路
１３ａ 出口
１５ 放出用容器
１６ 拡散空間
１６ｕ 上部空間
１６ｄ 下部空間
１７ 放出孔
２１ 容器回転装置
３１Ａ，６１Ａ 反射面板
３１Ｂ，６１Ｂ 反射面板
３１Ｃ，６１Ｃ 反射面板
３３ 調整用透孔
４１Ａ，７１Ａ 分散透過板
４１Ｂ，７１Ｂ 分散透過板
４２Ａ，４２Ｂ 反射部
４３ 透孔
４４ 調整用透孔
６３ 調整用透孔
７３ 透孔
７４ 調整用透孔
８１Ａ，８１Ｂ 緩衝板 O rotation axis O 'central axis W glass substrate 1 vapor deposition chamber 2 vapor deposition vessel 5 evaporation chamber 7 material storage vessel 11C rotary tube 11E fixed tube 13 evaporative material passage 13a outlet 15 discharge vessel 16 diffusion space 16u upper space 16d Lower space 17 Discharge hole 21 Container rotating device 31A, 61A Reflective surface plate 31B, 61B Reflective surface plate 31C, 61C Reflective surface plate 33 Adjustment through-hole 41A, 71A Dispersion transmission plate 41B, 71B Dispersion transmission plate 42A, 42B Reflection portion 43 Through hole 44 Adjustment through-hole 63 Adjustment through-hole 73 Through-hole 74 Adjustment through-hole 81A, 81B Buffer plate

Claims (10)

蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、
前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、
前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、
放出容器を蒸発材料通路出口の中心を通る回転軸心周りに回転させる容器回転手段を設けた
ことを特徴とする蒸着装置。 In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed facing the vapor deposition member, a discharge container having a diffusion space inside is provided,
A plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container,
A vapor deposition apparatus comprising a container rotating means for rotating the discharge container around a rotation axis passing through the center of the evaporating material passage outlet. 蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、
前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、
前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、
放出用容器の拡散空間に、蒸発材料通路出口に対向して蒸発材料粒子を反射する反射部材を設け、
放出容器を蒸発材料通路出口の中心を通る回転軸心周りに回転させる容器回転手段を設けた
ことを特徴とする蒸着装置。 In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed facing the vapor deposition member, a discharge container having a diffusion space inside is provided,
A plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container,
In the diffusion space of the discharge container, a reflecting member that reflects the evaporated material particles is provided facing the evaporated material passage outlet,
A vapor deposition apparatus comprising a container rotating means for rotating the discharge container around a rotation axis passing through the center of the evaporating material passage outlet. 反射部材に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大するように配置された複数の調整用透孔を穿設した
ことを特徴とする請求項２記載の蒸着装置。 The reflective member is provided with a plurality of adjustment through holes arranged so that an opening area per unit area is enlarged from a central portion facing the evaporative material passage outlet toward an outer peripheral side. Item 3. The vapor deposition apparatus according to Item 2. 蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、
前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、
前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、
放出用容器の拡散空間に、蒸発材料通路出口側の空間部と放出孔側の空間部とを区画し多数の透孔を有する分散透過板を配置し、
前記分散透過板の蒸発材料通路出口に対向する部位に、蒸発材料粒子を反射する反射部を設け、
放出容器を蒸発材料通路出口の中心を通る回転軸心周りに回転させる容器回転手段を設けた
ことを特徴とする蒸着装置。 In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed facing the vapor deposition member, a discharge container having a diffusion space inside is provided,
A plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container,
In the diffusion space of the discharge container, a dispersion transmission plate having a large number of through holes that divides the space part on the evaporating material passage outlet side and the space part on the discharge hole side is disposed
A reflection part for reflecting the evaporation material particles is provided at a portion facing the evaporation material passage outlet of the dispersion transmission plate,
A vapor deposition apparatus comprising a container rotating means for rotating the discharge container around a rotation axis passing through the center of the evaporating material passage outlet. 反射部に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大される配置された複数の調整用透孔を穿設した
ことを特徴とする請求項４記載の蒸着装置。 A plurality of adjustment through holes arranged so that an opening area per unit area is enlarged from the central portion facing the evaporating material passage outlet toward the outer peripheral side is formed in the reflecting portion. 4. The vapor deposition apparatus according to 4. 蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、
前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、
前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、
放出用容器の拡散空間に、蒸発材料通路出口に対向して蒸発材料粒子を反射する反射部材を設けた
ことを特徴とする蒸着装置。 In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed facing the vapor deposition member, a discharge container having a diffusion space inside is provided,
A plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container,
A vapor deposition apparatus, characterized in that a reflection member that reflects the vaporized material particles is provided in the diffusion space of the discharge container so as to face the vaporized material passage outlet. 反射部材に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大するように配置された複数の調整用透孔を穿設した
ことを特徴とする請求項６記載の蒸着装置。 The reflective member is provided with a plurality of adjustment through holes arranged so that an opening area per unit area is enlarged from a central portion facing the evaporative material passage outlet toward an outer peripheral side. Item 7. The vapor deposition apparatus according to Item 6. 蒸発された蒸発材料を被蒸着部材に付着させる蒸着装置において、
前記被蒸着部材に対向して配置される蒸発材料通路出口に連通して、内部に拡散空間を有する放出用容器を設け、
前記放出用容器の被蒸着部材側の所定位置に複数の放出孔を穿設し、
放出用容器の拡散空間に、蒸発材料通路出口側の空間部と放出孔側の空間部とを区画し多数の透孔を有する分散透過板を配置し、
前記分散透過板の蒸発材料通路出口に対向する部位に、蒸発材料粒子を反射する反射部を設けた
ことを特徴とする蒸着装置。 In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed opposite the vapor deposition member, a discharge container having a diffusion space inside is provided,
A plurality of discharge holes are formed at predetermined positions on the vapor deposition member side of the discharge container,
In the diffusion space of the discharge container, a dispersion transmission plate having a large number of through holes that divides the space part on the evaporative material passage outlet side and the space part on the discharge hole side is arranged,
A vapor deposition apparatus, characterized in that a reflective portion that reflects the vaporized material particles is provided at a portion of the dispersion transmitting plate that faces the vaporized material passage outlet. 反射部に、蒸発材料通路出口に対向する中心部から外周側に向って、単位面積当りの開口面積が拡大される配置された複数の調整用透孔を穿設した
ことを特徴とする請求項８記載の蒸着装置。 A plurality of adjustment through holes arranged so that an opening area per unit area is enlarged from the central portion facing the evaporating material passage outlet toward the outer peripheral side is formed in the reflecting portion. 8. The vapor deposition apparatus according to 8. 蒸発材料通路に、蒸発材料の流れを緩衝する緩衝部材を設けた
ことを特徴とする請求項１，２，４，６，８のいずれかに記載の蒸着装置。 The evaporation apparatus according to any one of claims 1, 2, 4, 6, and 8, wherein a buffer member for buffering a flow of the evaporation material is provided in the evaporation material passage.
JP2004149834A 2004-05-20 2004-05-20 Vapor deposition equipment Expired - Fee Related JP4454387B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004149834A JP4454387B2 (en) 2004-05-20 2004-05-20 Vapor deposition equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004149834A JP4454387B2 (en) 2004-05-20 2004-05-20 Vapor deposition equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009172603A Division JP4827953B2 (en) 2009-07-24 2009-07-24 Vapor deposition equipment

Publications (2)

Publication Number Publication Date
JP2005330537A true JP2005330537A (en) 2005-12-02
JP4454387B2 JP4454387B2 (en) 2010-04-21

Family

ID=35485405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004149834A Expired - Fee Related JP4454387B2 (en) 2004-05-20 2004-05-20 Vapor deposition equipment

Country Status (1)

Country Link
JP (1) JP4454387B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007097329A1 (en) * 2006-02-22 2007-08-30 Tokyo Electron Limited Film forming apparatus and method for manufacturing light emitting element
WO2008041558A1 (en) * 2006-09-27 2008-04-10 Tokyo Electron Limited Vapor deposition device, device for controlling vapor deposition device, method for controlling vapor deposition device, and method for using vapor deposition device
WO2009034916A1 (en) * 2007-09-10 2009-03-19 Ulvac, Inc. Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition
JP2009087910A (en) * 2007-09-10 2009-04-23 Ulvac Japan Ltd Vapor deposition apparatus and film forming method
JP2012107302A (en) * 2010-11-19 2012-06-07 Ulvac Japan Ltd Vapor deposition apparatus and vapor deposition method
JP2012140695A (en) * 2011-01-06 2012-07-26 Nitto Denko Corp Vapor deposition device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4827953B2 (en) * 2009-07-24 2011-11-30 日立造船株式会社 Vapor deposition equipment

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007097329A1 (en) * 2006-02-22 2007-08-30 Tokyo Electron Limited Film forming apparatus and method for manufacturing light emitting element
US8158012B2 (en) 2006-02-22 2012-04-17 Tokyo Electron Limited Film forming apparatus and method for manufacturing light emitting element
WO2008041558A1 (en) * 2006-09-27 2008-04-10 Tokyo Electron Limited Vapor deposition device, device for controlling vapor deposition device, method for controlling vapor deposition device, and method for using vapor deposition device
JP2008081778A (en) * 2006-09-27 2008-04-10 Tokyo Electron Ltd Vapor deposition apparatus, device for controlling vapor deposition apparatus, method for controlling vapor deposition apparatus, and method for operating vapor deposition apparatus
KR101230931B1 (en) 2006-09-27 2013-02-07 도쿄엘렉트론가부시키가이샤 Evaporating apparatus, apparatus for controlling evaporating apparatus, method for controlling evaporating apparatus and method for using evaporating apparatus
KR101199241B1 (en) * 2006-09-27 2012-11-08 도쿄엘렉트론가부시키가이샤 Evaporating apparatus, apparatus for controlling evaporating apparatus, method for controlling evaporating apparatus and method for using evaporating apparatus
JP2009087869A (en) * 2007-09-10 2009-04-23 Ulvac Japan Ltd Feed device and vapor deposition apparatus
JP2009084675A (en) * 2007-09-10 2009-04-23 Ulvac Japan Ltd Vapor-emitting device, apparatus for vapor-depositing organic thin film, and method for vapor-depositing organic thin film
JPWO2009034916A1 (en) * 2007-09-10 2010-12-24 株式会社アルバック Vapor release apparatus, organic thin film deposition apparatus, and organic thin film deposition method
KR101128745B1 (en) * 2007-09-10 2012-03-27 가부시키가이샤 알박 Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition
JP2009087931A (en) * 2007-09-10 2009-04-23 Ulvac Japan Ltd Film forming method, vapor deposition apparatus, and organic el manufacturing apparatus
JP2009087910A (en) * 2007-09-10 2009-04-23 Ulvac Japan Ltd Vapor deposition apparatus and film forming method
WO2009034916A1 (en) * 2007-09-10 2009-03-19 Ulvac, Inc. Vapor emission device, organic thin-film vapor deposition apparatus and method of organic thin-film vapor deposition
JP2012107302A (en) * 2010-11-19 2012-06-07 Ulvac Japan Ltd Vapor deposition apparatus and vapor deposition method
JP2012140695A (en) * 2011-01-06 2012-07-26 Nitto Denko Corp Vapor deposition device

Also Published As

Publication number Publication date
JP4454387B2 (en) 2010-04-21

Similar Documents

Publication Publication Date Title
JP4827953B2 (en) Vapor deposition equipment
TWI252872B (en) Thin film-forming apparatus
JP2004143521A (en) Thin-film deposition device
JP6513201B2 (en) Material deposition apparatus, vacuum deposition system, and material deposition method
JP4454387B2 (en) Vapor deposition equipment
US6142097A (en) Optical membrane forming apparatus and optical device produced by the same
US20080299311A1 (en) Process and Apparatus for Organic Vapor Jet Deposition
JP2011132596A (en) Evaporation source and vapor-deposition apparatus using the same
WO2003020999A1 (en) Process and apparatus for organic vapor jet deposition
KR20220123336A (en) Nozzle for a distribution assembly of a material deposition source arrangement, material deposition source arrangement, vacuum deposition system and method for depositing material
KR100434438B1 (en) Circular nozzle source for thermal evaporation process
JP2006249541A (en) Vapor deposition apparatus
TWI693859B (en) Deposition source having volume changeable type crucible
JP2014040665A (en) Selective linear evaporation device
KR20110033590A (en) Deposition source
JP2004010990A (en) Thin-film forming apparatus
TW201641730A (en) Nozzle for a material source arrangement, material source arrangement for vacuum deposition, vacuum deposition system therefor, and method for depositing material
KR102426163B1 (en) Crucible for linear evaporation source
KR101813151B1 (en) Substrate processing apparatus and deposition materials feeding module therefor
KR20050094305A (en) Oled evaporation system using shutter rotation for continuous deposition process
KR101980280B1 (en) Thin film deposition processing apparatus
KR100684739B1 (en) Apparatus for sputtering organic matter
KR20060040827A (en) Method of deposition and deposition apparatus for that method
FR2490250A1 (en) Appts. for prodn. of epitaxial layers by molecular jet - using conical crucible of narrow angle to ensure uniform coverage of substrate surface
JP6620234B2 (en) Carrier for holding a substrate, use of the carrier in a processing system, processing system using the carrier, and method for controlling the temperature of the substrate

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061221

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20080430

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090521

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090526

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090724

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100105

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100202

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130212

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130212

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140212

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees