JP2005311104A - Electronic component mounting device - Google Patents

Electronic component mounting device Download PDF

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JP2005311104A
JP2005311104A JP2004126632A JP2004126632A JP2005311104A JP 2005311104 A JP2005311104 A JP 2005311104A JP 2004126632 A JP2004126632 A JP 2004126632A JP 2004126632 A JP2004126632 A JP 2004126632A JP 2005311104 A JP2005311104 A JP 2005311104A
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electronic component
substrate
linear motion
component mounting
moving
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JP4352979B2 (en
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Takahiro Komiya
隆宏 小宮
Kazuhide Nagao
和英 永尾
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and inexpensive electronic component mounting device in which versatility corresponding to many forms is secured. <P>SOLUTION: In the electronic component mounting device where an electronic component taken out from a parts feeder is mounted on a substrate, a tray feeder 24 is loaded on a component supply 4A so as to use it. When a moving stroke in the Y direction of a moving beam 8A on which a loading head 9A is loaded is required to be extended for more than a basic moving stroke S, an additional linear motion unit 6a is added to the tip of a Y linear motion mechanism 6 driven by a linear motor, and the stroke is extended only by S1. Thus, versatility corresponding to the many forms is secured, and the compact and inexpensive electronic component mounting device is realized. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、基板に電子部品を実装する電子部品実装装置に関するものである。   The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.

基板に電子部品を搭載するために用いられる電子部品実装装置は、電子部品を保持する搭載ヘッドを部品供給部と基板位置決め部に位置決めされた基板との間で移動させる搭載ヘッド移動機構を備えている。部品実装動作においては、部品供給部にセットされたパーツフィーダから搭載ヘッドによって電子部品を取り出し、搭載ヘッドを基板へ移動させることによって電子部品を基板に移送搭載する。搭載ヘッドの移動機構としては２軸の直動機構が多用され、１軸によって搭載ヘッドを一方向へ移動させ、他の１軸によって搭載ヘッドを装着した移動ビームを直交方向へ移動させる。   An electronic component mounting apparatus used for mounting an electronic component on a substrate includes a mounting head moving mechanism that moves a mounting head that holds the electronic component between a component supply unit and a substrate positioned by the substrate positioning unit. Yes. In the component mounting operation, the electronic component is taken out from the parts feeder set in the component supply unit by the mounting head, and the mounting head is moved to the substrate to transfer and mount the electronic component on the substrate. A biaxial linear motion mechanism is often used as the mounting head moving mechanism. The mounting head is moved in one direction by one axis, and the moving beam on which the mounting head is mounted is moved in the orthogonal direction by the other one axis.

ところで電子部品実装装置の作業対象となる基板や電子部品の種類・サイズは様々であり、電子部品実装装置には基板や電子部品に応じて多品種対応機能を備えたものが求められている。このような多品種対応型の電子部品実装装置として、搭載ヘッド移動機構のストロークを想定される作業対象基板や電子部品のうちの最大サイズのものに応じて設定しておき、対象品種に応じて移動範囲を調整することにより汎用性を確保するようにしたものが知られている（例えば特許文献１参照）。
特開平９−２０５２９９号公報 By the way, there are various types and sizes of substrates and electronic components to be worked by the electronic component mounting apparatus, and electronic component mounting apparatuses are required to have a function corresponding to various types according to the substrate and electronic components. As such a multi-variety type electronic component mounting device, the stroke of the mounting head moving mechanism is set according to the maximum size of the target work board or electronic component, and according to the target product type There is known one that ensures versatility by adjusting the movement range (see, for example, Patent Document 1).
JP-A-9-205299

しかしながら上述の特許文献例に示す電子部品実装装置では、想定される最大品種に対応して装置本体部のサイズが決定されるため、装置サイズが大型化せざるを得ず、装置コンパクト化の要請に反することとなっていた。このためこのような汎用型装置に用いられる機構ユニットは、コンパクト性を追求した通常型の装置との共用化を実現することが困難で、装置コストの低減を阻害する要因となっていた。   However, in the electronic component mounting apparatus shown in the above-mentioned patent document example, the size of the apparatus main body is determined corresponding to the assumed maximum product type, so the apparatus size must be increased, and there is a demand for a compact apparatus. It was to go against. For this reason, it is difficult for the mechanism unit used in such a general-purpose apparatus to be shared with a normal apparatus pursuing compactness, which has been a factor that hinders reduction in apparatus cost.

そこで本発明は、多品種対応の汎用性を確保するとともに、コンパクトで低コストの電子部品実装装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a compact and low-cost electronic component mounting apparatus while ensuring versatility for a wide variety of products.

本発明の電子部品実装用装置は、パーツフィーダから取り出した電子部品を基板に実装する電子部品実装装置であって、複数種類の前記パーツフィーダが装着可能な部品供給部と、前記基板を搬送し位置決めする基板位置決め部と、前記電子部品を保持する搭載ヘッドと、前記搭載ヘッドを基板搬送方向に移動させる移動ビームおよびこの移動ビームを前記基板搬送方向と直交する方向へ移動させるリニアモータ駆動の直動機構より成る搭載ヘッド移動機構とを備え、前記直動機構は、前記移動ビームの基本移動ストロークに対応した本体部と、前記本体部に継ぎ足される継足部とを含み、前記パーツフィーダおよびまたは基板の種類に応じて本体部と継足部とを着脱する。   An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for mounting an electronic component taken out from a parts feeder on a substrate, and transports the substrate, a component supply unit to which a plurality of types of the parts feeder can be mounted, and A substrate positioning unit for positioning, a mounting head for holding the electronic component, a moving beam for moving the mounting head in the substrate transport direction, and a linear motor driven direct drive for moving the moving beam in a direction orthogonal to the substrate transport direction. A mounting head moving mechanism comprising a moving mechanism, wherein the linear moving mechanism includes a main body portion corresponding to a basic moving stroke of the moving beam, and a joint portion added to the main body portion, and the parts feeder and / or The main body part and the joint part are attached and detached according to the type of the substrate.

本発明によれば、搭載ヘッドを移動させる移動ビームのリニアモータ駆動の直動機構を、移動ビームの基本移動ストロークに対応した本体部と本体部に継ぎ足される継足部とで構成しておき、パーツフィーダおよびまたは基板の種類に応じて本体部と継足し部とを着脱することにより、多品種対応の汎用性を確保するとともに、コンパクトで低コストの電子部品実装装置を実現することができる。   According to the present invention, the linear motion drive linear motion mechanism of the moving beam that moves the mounting head is composed of a main body portion corresponding to the basic moving stroke of the moving beam and a joint portion that is added to the main body portion, By attaching and detaching the main body part and the extension part according to the type of the parts feeder and / or the board, it is possible to ensure versatility for a wide variety of products and to realize a compact and low-cost electronic component mounting apparatus.

次に本発明の実施の形態を図面を参照して説明する。図１、図３は本発明の一実施の形態の電子部品実装装置の平面図、図２は本発明の一実施の形態の電子部品実装装置の断面図、図４は本発明の一実施の形態の電子部品実装装置の直動機構の部分側面図、図５は本発明の一実施の形態の電子部品実装装置の直動機構の断面図、図６は本発明の一実施の形態の電子部品実装装置のガイド機構の部分側面図である。   Next, embodiments of the present invention will be described with reference to the drawings. 1 and 3 are plan views of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 4 is an embodiment of the present invention. FIG. 5 is a sectional view of the linear motion mechanism of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 6 is the electronic circuit according to the embodiment of the present invention. It is a partial side view of the guide mechanism of a component mounting apparatus.

まず図１，図２を参照して電子部品実装装置の構造を説明する。図１において、電子部品実装装置の基台１上には、Ｘ方向に搬送路２が配設されている。搬送路２は電子部品が実装される基板３を搬送し、搬送路２上に設定された実装位置に基板３を位置決めする。搬送路２は、基板３を搬送し位置決めする基板位置決め部となっている。   First, the structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a conveyance path 2 is arranged in the X direction on a base 1 of an electronic component mounting apparatus. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 at a mounting position set on the transport path 2. The transport path 2 is a substrate positioning unit that transports and positions the substrate 3.

搬送路２の両側には複数のテープフィーダ５を並設した部品供給部４Ａ，４Ｂと、これらの部品供給部４Ａ，４Ｂから電子部品を取り出して基板３に搭載する搭載機構が配設されている。部品供給部４Ａ，４Ｂは複数種類のパーツフィーダが装着可能となっており、本実施の形態では、後述するように部品供給部４Ａにテープフィーダ５以外にトレイフィーダが装着される。   On both sides of the conveyance path 2, component supply units 4A and 4B in which a plurality of tape feeders 5 are arranged in parallel, and a mounting mechanism for taking out electronic components from these component supply units 4A and 4B and mounting them on the substrate 3 are arranged. Yes. A plurality of types of part feeders can be mounted on the component supply units 4A and 4B. In this embodiment, a tray feeder is mounted on the component supply unit 4A in addition to the tape feeder 5 as described later.

搭載機構について説明する。基台１の右端部および左端部には、それぞれＹ直動機構６およびガイドレール７がＹ方向に配設されている。図２に示すように、Ｙ直動機構６、ガイドレール７は、それぞれ基台１上面にＹ方向に配設されたフレーム１６，２２上に設けられている。Ｙ直動機構６は後述するようにリニアモータによって駆動される直動機構であり、この直動機構によってガイドレール７に左端部をガイドされた移動ビーム８Ａ，８ＢをＹ方向に移動させる。   The mounting mechanism will be described. A Y linear motion mechanism 6 and a guide rail 7 are disposed in the Y direction at the right end portion and the left end portion of the base 1, respectively. As shown in FIG. 2, the Y linear motion mechanism 6 and the guide rail 7 are provided on frames 16 and 22 disposed on the upper surface of the base 1 in the Y direction, respectively. The Y linear motion mechanism 6 is a linear motion mechanism driven by a linear motor as will be described later, and the linear motion mechanism moves the moving beams 8A and 8B guided at the left end by the guide rail 7 in the Y direction.

移動ビーム８Ａ，８Ｂは同様にリニアモータによって駆動されるＸ直動機構を内蔵しており、Ｘ直動機構によって搭載ヘッド９Ａ，９ＢをＸ方向（基板搬送方向）に移動させる。したがって、この電子部品実装装置は、搭載ヘッドを基板搬送方向に移動させる移動ビームおよびこの移動ビームを基板搬送方向と直交する方向へ移動させるリニアモータ駆動の直動機構より成る搭載ヘッド移動機構を備えた構成となっている。   Similarly, the moving beams 8A and 8B incorporate an X linear motion mechanism driven by a linear motor, and the mounting heads 9A and 9B are moved in the X direction (substrate transport direction) by the X linear motion mechanism. Therefore, the electronic component mounting apparatus includes a mounting head moving mechanism including a moving beam that moves the mounting head in the substrate transport direction and a linear motor-driven linear motion mechanism that moves the moving beam in a direction orthogonal to the substrate transport direction. It becomes the composition.

図２に示すように、搭載ヘッド９Ａ，９Ｂは複数の単位搭載ヘッド９ａを備えたマルチタイプの搭載ヘッドであり、各単位搭載ヘッド９ａに備えられた吸着ノズル９ｂによって電子部品を吸着保持する。また搭載ヘッド９Ａ，９Ｂには一体的に移動する基板認識カメラ９ｃが設けられており、基板認識カメラ９ｃは搭載ヘッド９Ａ，９Ｂとともに基板３上に移動してその位置を認識する。   As shown in FIG. 2, the mounting heads 9A and 9B are multi-type mounting heads including a plurality of unit mounting heads 9a, and hold electronic components by suction nozzles 9b provided in the unit mounting heads 9a. The mounting heads 9A and 9B are provided with a substrate recognition camera 9c that moves integrally. The substrate recognition camera 9c moves on the substrate 3 together with the mounting heads 9A and 9B to recognize the position.

Ｙ直動機構６および移動ビーム８Ａ，８ＢのＸ直動機構を駆動することにより、搭載ヘッド９Ａ，９ＢはＸＹ方向に移動し、これにより部品供給部４Ａ，４Ｂのテープフィーダ５から電子部品をピックアップし、基板３に移送搭載する。部品供給部４Ａ，４Ｂと搬送路２との間には、ラインカメラ１０およびノズルストッカ１１が配設されている。部品供給部４から電子部品を取り出した搭載ヘッド９Ａ，９Ｂがラインカメラ１０の上方を通過することにより、搭載ヘッド９Ａ，９Ｂに保持された電子部品が認識される。ノズルストッカ１１は、各単位搭載ヘッド９ａに装着される吸着ノズル９ｂを電子部品の種類毎に収納しており、搭載ヘッド９Ａ，９Ｂがノズルストッカ１１にアクセスすることにより、吸着ノズル９ｂの交換が自動的に行われる。   By driving the Y linear movement mechanism 6 and the X linear movement mechanism of the moving beams 8A and 8B, the mounting heads 9A and 9B move in the XY direction, whereby electronic components are transferred from the tape feeder 5 of the component supply units 4A and 4B. Pick up and transfer to substrate 3. A line camera 10 and a nozzle stocker 11 are disposed between the component supply units 4A and 4B and the transport path 2. When the mounting heads 9A and 9B that have taken out the electronic components from the component supply unit 4 pass above the line camera 10, the electronic components held by the mounting heads 9A and 9B are recognized. The nozzle stocker 11 stores the suction nozzles 9b mounted on the unit mounting heads 9a for each type of electronic component, and the mounting heads 9A and 9B access the nozzle stocker 11 so that the suction nozzles 9b can be replaced. Done automatically.

Ｙ直動機構６のリニアモータの構成について説明する。図２に示すように、フレーム１６の上面には３つのフレーム部材１５ａ、１５ｂ、１５ｃが、コ字形状を形成してＹ方向
に配設されている。フレーム１５ｂの下面側およびフレーム１５ｃの上面には、それぞれリニアモータの固定子を構成するマグネット部材１４が水平姿勢で相対向して装着されている。 The configuration of the linear motor of the Y linear motion mechanism 6 will be described. As shown in FIG. 2, three frame members 15 a, 15 b, and 15 c are formed in the Y direction on the upper surface of the frame 16 so as to form a U shape. Magnet members 14 constituting a stator of the linear motor are mounted on the lower surface side of the frame 15b and the upper surface of the frame 15c so as to face each other in a horizontal posture.

移動ビーム８Ａ，８Ｂの右端部には垂直な移動プレート１２が結合されており、移動プレート１２の外側の側面には、可動子１３、スライダ１７およびリニアヘッド１９が固着されている。またベースフレーム１６の内側側面には、ガイドレール１８およびリニアスケール２０を保持するスケールガイド２１が、それぞれＹ方向に配設されている。そして可動子１３は対向した２つのマグネット部材１４の間に嵌入しており、スライダ１７はガイドレール１８にＹ方向にスライド自在に嵌合している。またリニアヘッド１９は、スケールガイド２１に保持されたリニアスケール２０と所定間隔で対向した位置にあり、リニアヘッド１９はリニアスケール２０に対する相対位置を検出する。   A vertical moving plate 12 is coupled to the right ends of the moving beams 8A and 8B, and a movable element 13, a slider 17 and a linear head 19 are fixed to the outer side surface of the moving plate 12. On the inner side surface of the base frame 16, a scale guide 21 that holds the guide rail 18 and the linear scale 20 is disposed in the Y direction. The mover 13 is fitted between the two magnet members 14 facing each other, and the slider 17 is fitted to the guide rail 18 so as to be slidable in the Y direction. The linear head 19 is located at a position facing the linear scale 20 held by the scale guide 21 at a predetermined interval, and the linear head 19 detects a relative position with respect to the linear scale 20.

次に、部品供給部４Ａにテープフィーダ５に替えてトレイフィーダを装着する場合の構成について説明する。図３に示すように、部品供給部４Ａにはトレイフィーダ２４が装着されている。トレイフィーダ２４は、電子部品を格子配列で保持したトレイ２５を、搭載ヘッド９Ａが電子部品を取り出し可能な位置に供給する。   Next, a configuration in the case where a tray feeder is mounted in place of the tape feeder 5 in the component supply unit 4A will be described. As shown in FIG. 3, a tray feeder 24 is mounted on the component supply unit 4A. The tray feeder 24 supplies the tray 25 holding the electronic components in a grid arrangement to a position where the mounting head 9A can take out the electronic components.

ここで、部品トレイ２５から電子部品を取り出す際には、図１に示す通常状態（テープフィーダ５を対象とする場合）におけるＹ方向の基本移動ストロークＳを超えて移動ビーム８ＡをＹ方向に移動させる必要がある。このため、本実施の形態においては、部品供給部４Ａにトレイフィーダ２４を装着する場合には、Ｙ直動機構６に追加ストロークＳ１分だけ継足部を追加することにより、必要移動ストロークを充足するようにしている。   Here, when the electronic component is taken out from the component tray 25, the moving beam 8A is moved in the Y direction beyond the basic movement stroke S in the Y direction in the normal state (when the tape feeder 5 is targeted) shown in FIG. It is necessary to let For this reason, in the present embodiment, when the tray feeder 24 is mounted on the component supply unit 4A, the necessary movement stroke is satisfied by adding the joint portion to the Y linear motion mechanism 6 by the additional stroke S1. Like to do.

すなわち、部品供給部４Ａにトレイフィーダ２４を装着して用いる場合には、図４に示すように、Ｙ直動機構６の先端部に継足部としての追加直動ユニット６ａを継ぎ足す。図５（ａ）は、Ｙ直動機構６のＡ−Ａ断面を示しており、図５（ｂ）は、追加直動ユニット６ａのＢ−Ｂ断面を示している。図５（ａ）、（ｂ）に示すように、追加直動ユニット６ａは、ベースフレーム１６、縦フレーム１５ａ、横フレーム１５ｂ、横フレーム１５ｃを組み合わせた断面形状と略同一形状の断面を有する追加フレーム２３を主体としている。   That is, when the tray feeder 24 is mounted on the component supply unit 4A, an additional linear motion unit 6a as a joint portion is added to the tip of the Y linear motion mechanism 6 as shown in FIG. 5A shows an AA section of the Y linear motion mechanism 6, and FIG. 5B shows a BB section of the additional linear motion unit 6a. As shown in FIGS. 5 (a) and 5 (b), the additional linear motion unit 6a has an additional cross section having substantially the same cross section as the combined cross section of the base frame 16, the vertical frame 15a, the horizontal frame 15b, and the horizontal frame 15c. The frame 23 is mainly used.

追加フレーム２３には、追加マグネット部材１４ａ、追加ガイドレール１８ａ、追加スケールガイド２１ａは、マグネット部材１４、ガイドレール１８、スケールガイド２１の位置に対応して取り付けられている。なお、追加フレーム２３は同一部材によって一体に設ける必要はなく、適宜複数部材に分割して構成してもよい。   The additional magnet member 14 a, the additional guide rail 18 a, and the additional scale guide 21 a are attached to the additional frame 23 corresponding to the positions of the magnet member 14, the guide rail 18, and the scale guide 21. Note that the additional frame 23 does not need to be provided integrally with the same member, and may be divided into a plurality of members as appropriate.

そして追加フレーム２３をベースフレーム１６および縦フレーム１５ａに、ボルトなどの締結手段によって固定締結することにより、追加直動ユニット６ａはＹ直動機構６に継ぎ足され、これによりマグネット部材１４、ガイドレール１８、スケールガイド２１は追加ストロークＳ１だけ延長される。   Then, the additional frame 23 is fixedly fastened to the base frame 16 and the vertical frame 15a by fastening means such as bolts, so that the additional linear motion unit 6a is added to the Y linear motion mechanism 6, whereby the magnet member 14 and the guide rail 18 are connected. The scale guide 21 is extended by an additional stroke S1.

ここで追加マグネット部材１４ａ、追加ガイドレール１８ａは必要寸法に切断したものをマグネット部材１４、ガイドレール１８の端面に突き合わせることにより追加継ぎ足しが可能であるが、リニアスケール２０についてはこのように部分的に継ぎ足しをすることが機能上不可能なため、Ｓ＋Ｓ１のストロークに対応した新たなリニアスケール２０をスケールガイド２１および追加スケールガイド２１ａに掛け渡して装着する。   Here, the additional magnet member 14a and the additional guide rail 18a can be added to each other by abutting against the end surfaces of the magnet member 14 and the guide rail 18 after being cut to the required dimensions. Therefore, since it is impossible to add a new one, the new linear scale 20 corresponding to the stroke of S + S1 is mounted over the scale guide 21 and the additional scale guide 21a.

また図６は、移動ビーム８Ａの左端部を支持してガイドするガイドレール７の継足し部を示している。すなわち、図２に示すベースフレーム２２と同様断面の追加フレーム２６に、追加ストロークＳ１に相当する長さの追加ガイドレール７ａを予め取り付けた継ぎ足
しユニットを準備しておき、トレイフィーダ２４を装着する場合には、ベースフレーム２２の端面に追加フレーム２６を同様にボルトなどの固定締結手段によって固定する。 FIG. 6 shows an extension portion of the guide rail 7 that supports and guides the left end portion of the moving beam 8A. That is, a case in which an add-on unit is prepared in which an additional guide rail 7a having a length corresponding to the additional stroke S1 is attached to the additional frame 26 having the same cross section as the base frame 22 shown in FIG. In this case, the additional frame 26 is similarly fixed to the end surface of the base frame 22 by a fixing fastening means such as a bolt.

すなわち、前述の直動機構は、移動ビーム８の基本移動ストロークＳに対応した本体部であるＹ直動機構６と、本体部に継ぎ足される継足部である追加直動ユニット６ａとを含んだ構成となっている。そして、生産品種に応じてパーツフィーダの種類や基板の種類が変更になったときには、これらの種類に応じてＹ直動機構６に追加直動ユニット６ａを適宜着脱するようにしている。   That is, the linear motion mechanism described above includes a Y linear motion mechanism 6 that is a main body portion corresponding to the basic movement stroke S of the moving beam 8 and an additional linear motion unit 6a that is a joint portion that is added to the main body portion. It has a configuration. When the type of parts feeder or the type of substrate is changed according to the production type, the additional linear motion unit 6a is appropriately attached to or detached from the Y linear motion mechanism 6 according to these types.

このような構成を採用することにより、多品種対応型の電子部品実装装置において、搭載ヘッド移動機構のストロークを作業対象基板や電子部品を供給するパーツフィーダの種類に応じて変更することができる。これにより、従来型の多品種対応型のように、基本移動ストロークを予め想定される最大品種に対応可能なサイズに設定することによる装置サイズの増大を招くことなく、多品種対応の汎用性を確保するとともに、コンパクトで低コストの電子部品実装装置を実現することができる。   By adopting such a configuration, it is possible to change the stroke of the mounting head moving mechanism in accordance with the type of part feeder that supplies the work target substrate and the electronic component in the multi-component electronic component mounting apparatus. As a result, the versatility for multi-product types can be increased without increasing the device size by setting the basic movement stroke to a size that can be assumed in advance for the maximum product type, as in the conventional multi-product type. In addition to ensuring, a compact and low-cost electronic component mounting apparatus can be realized.

本発明の電子部品実装装置は、多品種対応の汎用性を確保するとともに、コンパクトで低コストの電子部品実装装置を実現することができるという効果を有し、リニアモータによって駆動される方式の電子部品実装装置に対して有用である。   The electronic component mounting apparatus of the present invention has the effect of ensuring versatility for a wide variety of products and realizing a compact and low-cost electronic component mounting apparatus, and is an electronic device driven by a linear motor. This is useful for a component mounting apparatus.

本発明の一実施の形態の電子部品実装装置の平面図The top view of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品実装装置の断面図Sectional drawing of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品実装装置の平面図The top view of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品実装装置の直動機構の部分側面図The partial side view of the linear motion mechanism of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品実装装置の直動機構の断面図Sectional drawing of the linear motion mechanism of the electronic component mounting apparatus of one embodiment of this invention 本発明の一実施の形態の電子部品実装装置のガイド機構の部分側面図The partial side view of the guide mechanism of the electronic component mounting apparatus of one embodiment of this invention

符号の説明Explanation of symbols

１ 電子部品実装装置
２ 搬送路
３ 基板
４Ａ、４Ｂ 部品供給部
５ テープフィーダ
６ Ｙ直動機構
６ａ 追加直動ユニット
７ ガイドレール
７ａ 追加ガイドレール
８Ａ，８Ｂ 移動ビーム
９Ａ，９Ｂ 搭載ヘッド DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance path 3 Board | substrate 4A, 4B Component supply part 5 Tape feeder 6 Y linear motion mechanism 6a Additional linear motion unit 7 Guide rail 7a Additional guide rail 8A, 8B Moving beam 9A, 9B Mounting head

Claims (1)

パーツフィーダから取り出した電子部品を基板に実装する電子部品実装装置であって、複数種類の前記パーツフィーダが装着可能な部品供給部と、前記基板を搬送し位置決めする基板位置決め部と、前記電子部品を保持する搭載ヘッドと、前記搭載ヘッドを基板搬送方向に移動させる移動ビームおよびこの移動ビームを前記基板搬送方向と直交する方向へ移動させるリニアモータ駆動の直動機構より成る搭載ヘッド移動機構とを備え、
前記直動機構は、前記移動ビームの基本移動ストロークに対応した本体部と、前記本体部に継ぎ足される継足部とを含み、前記パーツフィーダおよびまたは基板の種類に応じて本体部と継足部とを着脱することを特徴とする電子部品実装装置。
An electronic component mounting apparatus for mounting an electronic component taken out from a parts feeder on a substrate, a component supply unit to which a plurality of types of the part feeders can be mounted, a substrate positioning unit for transporting and positioning the substrate, and the electronic component And a mounting head moving mechanism comprising a moving beam that moves the mounting head in the substrate transport direction and a linear motor-driven linear motion mechanism that moves the moving beam in a direction orthogonal to the substrate transport direction. Prepared,
The linear motion mechanism includes a main body corresponding to a basic movement stroke of the moving beam, and a joint part added to the main body part, and the main body part and the joint part according to the type of the parts feeder and / or the substrate. An electronic component mounting apparatus characterized by attaching and detaching.
JP2004126632A 2004-04-22 2004-04-22 Electronic component mounting equipment Expired - Fee Related JP4352979B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009296762A (en) * 2008-06-04 2009-12-17 Hitachi High-Tech Instruments Co Ltd Drive stage and chip mounter using the stage
JP2011238887A (en) * 2010-05-13 2011-11-24 Panasonic Corp Component mounting device and maintenance method
JP2013110445A (en) * 2005-12-28 2013-06-06 Fuji Mach Mfg Co Ltd Component mounting system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013110445A (en) * 2005-12-28 2013-06-06 Fuji Mach Mfg Co Ltd Component mounting system
JP2009296762A (en) * 2008-06-04 2009-12-17 Hitachi High-Tech Instruments Co Ltd Drive stage and chip mounter using the stage
JP4643685B2 (en) * 2008-06-04 2011-03-02 株式会社日立ハイテクインスツルメンツ Driving stage and chip mounter using the same
JP2011238887A (en) * 2010-05-13 2011-11-24 Panasonic Corp Component mounting device and maintenance method

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