JP2005290409A5 - - Google Patents
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- JP2005290409A5 JP2005290409A5 JP2004102899A JP2004102899A JP2005290409A5 JP 2005290409 A5 JP2005290409 A5 JP 2005290409A5 JP 2004102899 A JP2004102899 A JP 2004102899A JP 2004102899 A JP2004102899 A JP 2004102899A JP 2005290409 A5 JP2005290409 A5 JP 2005290409A5
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Description
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004102899A JP4356071B2 (en) | 2004-03-31 | 2004-03-31 | Sputtering target material and manufacturing method thereof |
| US11/070,339 US20050230244A1 (en) | 2004-03-31 | 2005-03-03 | Sputter target material and method of producing the same |
| CNB2005100594763A CN100447290C (en) | 2004-03-31 | 2005-03-25 | Sputter target material and method of producing the same |
| TW094109924A TWI310407B (en) | 2004-03-31 | 2005-03-30 | Sputter target material and method of producing the same |
| KR1020050026676A KR100665243B1 (en) | 2004-03-31 | 2005-03-30 | Sputter target material and method of producing the same |
| KR1020060086790A KR20060102322A (en) | 2004-03-31 | 2006-09-08 | Sputter target material and method of producing the same |
| US12/479,121 US8409498B2 (en) | 2004-03-31 | 2009-06-05 | Method of producing a sputter target material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004102899A JP4356071B2 (en) | 2004-03-31 | 2004-03-31 | Sputtering target material and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005290409A JP2005290409A (en) | 2005-10-20 |
| JP2005290409A5 true JP2005290409A5 (en) | 2006-08-24 |
| JP4356071B2 JP4356071B2 (en) | 2009-11-04 |
Family
ID=35323679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004102899A Expired - Lifetime JP4356071B2 (en) | 2004-03-31 | 2004-03-31 | Sputtering target material and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4356071B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7108606B2 (en) | 2016-09-29 | 2022-07-28 | プランゼー エスエー | sputtering target |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008255440A (en) * | 2007-04-06 | 2008-10-23 | Hitachi Metals Ltd | MoTi ALLOY SPUTTERING TARGET MATERIAL |
| AT10578U1 (en) * | 2007-12-18 | 2009-06-15 | Plansee Metall Gmbh | DUNGOUS SOLAR CELL WITH MOLYBDAN-CONTAINING ELECTRODE LAYER |
| JP5518375B2 (en) * | 2008-09-19 | 2014-06-11 | 山陽特殊製鋼株式会社 | Formed body made of molybdenum alloy having excellent drillability for accelerating electrode and method for producing the same |
| JP5287669B2 (en) * | 2009-11-04 | 2013-09-11 | 住友金属鉱山株式会社 | Method for producing zinc oxide-based oxide pellets for vacuum deposition |
| US8449817B2 (en) | 2010-06-30 | 2013-05-28 | H.C. Stark, Inc. | Molybdenum-containing targets comprising three metal elements |
| US8449818B2 (en) | 2010-06-30 | 2013-05-28 | H. C. Starck, Inc. | Molybdenum containing targets |
| US9334565B2 (en) | 2012-05-09 | 2016-05-10 | H.C. Starck Inc. | Multi-block sputtering target with interface portions and associated methods and articles |
| AT13602U3 (en) | 2013-10-29 | 2014-08-15 | Plansee Se | Sputtering target and method of preparation |
| WO2016052371A1 (en) * | 2014-09-30 | 2016-04-07 | Ｊｘ金属株式会社 | Master alloy for sputtering target and method for manufacturing sputtering target |
| JP7205213B2 (en) * | 2018-03-27 | 2023-01-17 | 日立金属株式会社 | TiW alloy target and manufacturing method thereof |
| JP7267086B2 (en) * | 2019-05-07 | 2023-05-01 | 株式会社アルバック | Sputtering target manufacturing method |
| CN111850490B (en) * | 2020-07-29 | 2023-01-20 | 丰联科光电(洛阳)股份有限公司 | Binary molybdenum alloy sputtering target material and preparation method thereof |
-
2004
- 2004-03-31 JP JP2004102899A patent/JP4356071B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7108606B2 (en) | 2016-09-29 | 2022-07-28 | プランゼー エスエー | sputtering target |