JP2005283425A - 温度センサ - Google Patents
温度センサ Download PDFInfo
- Publication number
- JP2005283425A JP2005283425A JP2004099740A JP2004099740A JP2005283425A JP 2005283425 A JP2005283425 A JP 2005283425A JP 2004099740 A JP2004099740 A JP 2004099740A JP 2004099740 A JP2004099740 A JP 2004099740A JP 2005283425 A JP2005283425 A JP 2005283425A
- Authority
- JP
- Japan
- Prior art keywords
- tube
- housing
- temperature sensor
- protective tube
- support tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000001681 protective effect Effects 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 13
- 238000005219 brazing Methods 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
【解決手段】 サーミスタ素子10を収納した保護管20の一端がハウジング80に固定された温度センサにおいて、保護管20の外周に支持管30を接合し、その支持管30とハウジング80の溶接筒部81を溶接にて接合する。これによると、支持管30は保護管20のように薄肉にする必要はないため、支持管30の肉厚を保護管20の肉厚よりも大きくすることができ、保護管20の穴あき等が発生するのを防止できる。また、支持管30の肉厚を大きくすることができれば、ハウジング80の溶接筒部81も薄肉にする必要がなくなるため、ハウジング80の加工が容易になる。
【選択図】 図1
Description
ハウジング80内には電気絶縁性を有するPPSが充填されて、コネクタハウジング部91が射出成形される。90は射出成形により形成された樹脂モールド部である。
Claims (4)
- 温度に応じた電気信号を出力する感温素子(10)が有底筒状の保護管(20)に収納され、前記保護管(20)の一端がハウジング(80)に挿入されて固定された温度センサにおいて、
前記保護管(20)の外周に装着されるととも前記保護管(20)に接合された支持管(30)を備え、前記支持管(30)と前記ハウジング(80)が溶接にて接合されていることを特徴とする温度センサ。 - 前記保護管(20)と前記支持管(30)は、ろう付けにて接合されていることを特徴とする請求項1に記載の温度センサ。
- ろう材(25)はニッケルであることを特徴とする請求項2に記載の温度センサ。
- 前記支持管(30)の肉厚が、前記保護管(20)の肉厚よりも大きいことを特徴とする請求項1ないし3のいずれか1つに記載の温度センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004099740A JP4059222B2 (ja) | 2004-03-30 | 2004-03-30 | 温度センサ及び温度センサの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004099740A JP4059222B2 (ja) | 2004-03-30 | 2004-03-30 | 温度センサ及び温度センサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005283425A true JP2005283425A (ja) | 2005-10-13 |
JP4059222B2 JP4059222B2 (ja) | 2008-03-12 |
Family
ID=35181967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004099740A Expired - Lifetime JP4059222B2 (ja) | 2004-03-30 | 2004-03-30 | 温度センサ及び温度センサの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4059222B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101168580B1 (ko) * | 2009-12-29 | 2012-07-25 | 주식회사 우진 | 수차 발전기 내의 측온 응답속도가 향상된 내진동 측온저항 온도감지기 조립체 |
JP2013195337A (ja) * | 2012-03-22 | 2013-09-30 | Ngk Spark Plug Co Ltd | センサ及びその製造方法 |
JP2013200263A (ja) * | 2012-03-26 | 2013-10-03 | Ngk Spark Plug Co Ltd | センサの製造方法 |
JP2014173963A (ja) * | 2013-03-08 | 2014-09-22 | Ngk Spark Plug Co Ltd | 温度センサ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5447484U (ja) * | 1977-09-08 | 1979-04-02 | ||
JPS6385323A (ja) * | 1986-09-30 | 1988-04-15 | Toshiba Corp | シ−ス熱電対装置の製造方法 |
JPH09257594A (ja) * | 1996-03-25 | 1997-10-03 | Kanebo Ltd | 温度検出装置 |
JP2001173559A (ja) * | 2000-11-09 | 2001-06-26 | Toshiba Kyaria Kk | コンプレッサ |
JP2002350241A (ja) * | 2001-03-23 | 2002-12-04 | Denso Corp | 温度センサ |
-
2004
- 2004-03-30 JP JP2004099740A patent/JP4059222B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5447484U (ja) * | 1977-09-08 | 1979-04-02 | ||
JPS6385323A (ja) * | 1986-09-30 | 1988-04-15 | Toshiba Corp | シ−ス熱電対装置の製造方法 |
JPH09257594A (ja) * | 1996-03-25 | 1997-10-03 | Kanebo Ltd | 温度検出装置 |
JP2001173559A (ja) * | 2000-11-09 | 2001-06-26 | Toshiba Kyaria Kk | コンプレッサ |
JP2002350241A (ja) * | 2001-03-23 | 2002-12-04 | Denso Corp | 温度センサ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101168580B1 (ko) * | 2009-12-29 | 2012-07-25 | 주식회사 우진 | 수차 발전기 내의 측온 응답속도가 향상된 내진동 측온저항 온도감지기 조립체 |
JP2013195337A (ja) * | 2012-03-22 | 2013-09-30 | Ngk Spark Plug Co Ltd | センサ及びその製造方法 |
JP2013200263A (ja) * | 2012-03-26 | 2013-10-03 | Ngk Spark Plug Co Ltd | センサの製造方法 |
JP2014173963A (ja) * | 2013-03-08 | 2014-09-22 | Ngk Spark Plug Co Ltd | 温度センサ |
Also Published As
Publication number | Publication date |
---|---|
JP4059222B2 (ja) | 2008-03-12 |
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