JP2005277332A - Light emitting device and lighting device - Google Patents

Light emitting device and lighting device Download PDF

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JP2005277332A
JP2005277332A JP2004092209A JP2004092209A JP2005277332A JP 2005277332 A JP2005277332 A JP 2005277332A JP 2004092209 A JP2004092209 A JP 2004092209A JP 2004092209 A JP2004092209 A JP 2004092209A JP 2005277332 A JP2005277332 A JP 2005277332A
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light
light emitting
emitting element
phosphor
emitting device
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Toru Miyake
徹 三宅
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Kyocera Corp
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Kyocera Corp
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Priority to JP2004092209A priority Critical patent/JP2005277332A/en
Priority to US11/064,784 priority patent/US7507682B2/en
Priority to US11/088,238 priority patent/US20050211991A1/en
Priority to DE102005013802A priority patent/DE102005013802B4/en
Priority to TW094109171A priority patent/TWI251356B/en
Priority to KR1020050024858A priority patent/KR100700398B1/en
Priority to CNB2005100594922A priority patent/CN100373647C/en
Publication of JP2005277332A publication Critical patent/JP2005277332A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device that stably radiates desired color temperature using several phosphors. <P>SOLUTION: A light emitting device 1 comprises a substrate 2 having a mounter 2a for a light emitting element 4 on a top; a frame 3 attached to the outer circumference of the top of the substrate 2 so as to enclose the mounter 2a; a light emitting element 4 mounted on the mounter 2a; and a translucent member 5 that is provided within the frame 3 so as to cover the light emitting element 4, and comprises resin containing phosphors 6 for wavelength conversion of light emitted by the light emitting element 4; wherein the translucent member 5 has viscosity of 0.4 Pa s to 50 Pa s before curing, and the phosphors 6 comprises several kinds of phosphors. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光素子から発光される光を蛍光体で波長変換し外部に発光する発光装置および照明装置に関する。   The present invention relates to a light emitting device and a lighting device that emit light to the outside by converting the wavelength of light emitted from a light emitting element with a phosphor.

従来の発光ダイオード（ＬＥＤ）等の発光素子14から発光される近紫外光や青色光等の光を赤色，緑色，青色，黄色等の光に変換する蛍光体16により任意の色を発光する発光装置11を図６に示す。図６において、発光装置11は、上面の中央部に発光素子14を載置するための搭載部12ａを有し、搭載部12ａおよびその周辺から発光装置11の内外を電気的に導通接続するリード端子やメタライズ配線等からなる配線導体（図示せず）が形成された絶縁体からなる基体12と、基体12の上面に接着固定され、上側開口が下側開口より大きい貫通孔が形成されているとともに、内周面13ａが発光素子14から発光される光を反射する反射面とされている枠体13と、枠体13の内側に充填される、発光素子14の光を長波長変換する蛍光体16が含有された透光性部材15と、搭載部12ａに載置固定された発光素子14とから主に構成されている。   Emission that emits light of any color by phosphor 16 that converts light such as near-ultraviolet light and blue light emitted from light-emitting element 14 such as a conventional light-emitting diode (LED) into light of red, green, blue, yellow, etc. The device 11 is shown in FIG. In FIG. 6, the light emitting device 11 has a mounting portion 12a for mounting the light emitting element 14 at the center of the upper surface, and leads that electrically connect the inside and outside of the light emitting device 11 from the mounting portion 12a and its periphery. A base 12 made of an insulator on which a wiring conductor (not shown) made of a terminal, metallized wiring or the like is formed, and a through hole that is bonded and fixed to the upper surface of the base 12 and whose upper opening is larger than the lower opening. In addition, the frame 13 whose inner peripheral surface 13a is a reflecting surface that reflects the light emitted from the light emitting element 14, and the fluorescence that fills the inside of the frame 13 and converts the light of the light emitting element 14 to a long wavelength. It is mainly composed of a translucent member 15 containing the body 16 and a light emitting element 14 mounted and fixed on the mounting portion 12a.

基体12は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成る。基体12がセラミックスから成る場合、その上面に配線導体（図示せず）がタングステン（Ｗ），モリブデン（Ｍｏ）−Ｍｎ等から成る金属ペーストを高温で焼成して形成される。また、基体12が樹脂から成る場合、銅（Ｃｕ）や鉄（Ｆｅ）−ニッケル（Ｎｉ）合金等から成るリード端子がモールド成型されて基体12の内部に設置固定される。   The substrate 12 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin. When the substrate 12 is made of ceramics, a wiring conductor (not shown) is formed on its upper surface by firing a metal paste made of tungsten (W), molybdenum (Mo) -Mn, or the like at a high temperature. When the base 12 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 12.

また、枠体13は、上側開口が下側開口より大きい貫通孔が形成されるとともに内周面13ａに光を反射する反射面が設けられる枠状となっている。具体的には、アルミニウム（Ａｌ）やＦｅ−Ｎｉ−コバルト（Ｃｏ）合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。   Further, the frame body 13 has a frame shape in which a through hole having an upper opening larger than the lower opening is formed and a reflection surface for reflecting light is provided on the inner peripheral surface 13a. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

さらに、枠体13の内周面13ａは、研磨して平坦化することにより、あるいは、内周面13ａにＡｌ等の金属を蒸着法やメッキ法により被着することにより形成される。そして、枠体13は、半田，銀（Ａｇ）ペースト等のロウ材または樹脂接着材等の接合材により、搭載部12ａを枠体13の内周面13ａで取り囲むように基体12の上面に接合される。   Further, the inner peripheral surface 13a of the frame 13 is formed by polishing and flattening, or by depositing a metal such as Al on the inner peripheral surface 13a by vapor deposition or plating. The frame 13 is bonded to the upper surface of the base 12 by a brazing material such as solder, silver (Ag) paste, or a bonding material such as a resin adhesive so that the mounting portion 12a is surrounded by the inner peripheral surface 13a of the frame 13. Is done.

発光素子14は、例えば、液相成長法やＭＯＣＶＤ法等により例えばサファイア基板上にガリウム（Ｇａ）−アルミニウム（Ａｌ）−窒素（Ｎ）、亜鉛（Ｚｎ）−硫黄（Ｓ）、Ｚｎ−セレン（Ｓｅ）、珪素（Ｓｉ）−炭素（Ｃ）、Ｇａ−リン（Ｐ）、Ｇａ−Ａｌ−砒素（Ａｓ）、Ａｌ−インジウム（Ｉｎ）−Ｇａ−Ｐ、Ｉｎ−Ｇａ−Ｎ、Ｇａ−Ｎ、Ａｌ−Ｉｎ−Ｇａ−Ｎ等の半導体を発光層として形成させたＬＥＤ等が用いられる。半導体の構造としては、ＭＩＳ接合やｐｎ接合を有したホモ構造、ヘテロ構造あるいはダブルへテロ構成のものが挙げられる。発光素子14は半導体層の材料やその混晶度によって、発光波長を紫外光から赤外光まで種々選択することができる。   For example, the light-emitting element 14 may be formed on a sapphire substrate by gallium (Ga) -aluminum (Al) -nitrogen (N), zinc (Zn) -sulfur (S), Zn-selenium (liquid crystal growth method, MOCVD method, or the like). Se), silicon (Si) -carbon (C), Ga-phosphorus (P), Ga-Al-arsenic (As), Al-indium (In) -Ga-P, In-Ga-N, Ga-N, An LED or the like in which a semiconductor such as Al—In—Ga—N is formed as a light emitting layer is used. Examples of the semiconductor structure include a homo structure having a MIS junction and a pn junction, a hetero structure, and a double hetero structure. The light emitting element 14 can select various emission wavelengths from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal.

そして、発光素子14を半田やＡｇペースト等の導電性を有する接着剤（図示せず）で搭載部12ａに実装し、搭載部12ａの周辺に配置した配線導体（図示せず）と発光素子14とをボンディングワイヤ（図示せず）を介して電気的に接続した後、蛍光体16を含有するエポキシ樹脂やシリコーン樹脂等の透光性部材15をディスペンサー等の注入機で発光素子14を覆うように枠体13の内部に充填しオーブンで熱硬化させることで、発光素子14からの光を蛍光体16により長波長変換し所望の波長スペクトルを有する光を取り出せる発光装置11となし得る。   Then, the light-emitting element 14 is mounted on the mounting portion 12a with a conductive adhesive (not shown) such as solder or Ag paste, and the wiring conductor (not shown) arranged around the mounting portion 12a and the light-emitting element 14 Are electrically connected to each other through a bonding wire (not shown), and a light-transmitting member 15 such as an epoxy resin or a silicone resin containing the phosphor 16 is covered with an injection machine such as a dispenser. Further, by filling the inside of the frame 13 and thermally curing it in an oven, the light emitting device 11 that can convert light from the light emitting element 14 to a long wavelength by the phosphor 16 and extract light having a desired wavelength spectrum can be obtained.

蛍光体16は、発光素子14から放出された発光波長である可視光や紫外光で励起し、他の長波長に変換するためのものである。したがって、発光素子14に用いられる発光層から発光される発光波長や発光装置11から放出される所望の光に応じて種々ものが用いられる。特に、発光素子14が発光した光と、発光素子14からの光によって励起され蛍光を発する蛍光体16からの光が補色関係にあるとき白色系の光を発光させることができる。このような蛍光体16として、セリウム（Ｃｅ）で付活されたイットリウム・アルミニウム・ガーネット系、ペリレン系誘導体、ＣｕやＡｌで付活された硫化亜鉛カドミウム、マンガン（Ｍｎ）で付活された酸化マグネシウム、マンガン（Ｍｎ）で付活されたチタンなど種々のものが挙げられる。これらの蛍光体16は、１種類で用いてもよいし、２種類以上混合して用いてもよい。
特開2003-298116号公報 特開2002-314142号公報 The phosphor 16 is excited by visible light or ultraviolet light, which is the emission wavelength emitted from the light emitting element 14, and is converted to another long wavelength. Accordingly, various materials are used according to the emission wavelength emitted from the light emitting layer used in the light emitting element 14 and the desired light emitted from the light emitting device 11. In particular, white light can be emitted when the light emitted from the light emitting element 14 and the light from the phosphor 16 that emits fluorescence when excited by the light from the light emitting element 14 have a complementary color relationship. Such phosphors 16 include yttrium, aluminum, garnet and perylene derivatives activated with cerium (Ce), zinc cadmium sulfide activated with Cu and Al, and oxidation activated with manganese (Mn). Various materials such as titanium activated by magnesium and manganese (Mn) can be used. These phosphors 16 may be used alone or in combination of two or more.
Japanese Patent Laid-Open No. 2003-298116 JP 2002-314142 A

しかしながら上記従来の発光装置11において、比重が大きい蛍光体16ａは透光性部材15の下側に偏り、比重が小さい蛍光体16ｂは比重が大きい蛍光体16ａの上側または透光性部材15の上側に偏りやすくなる。その結果、２種類以上の蛍光体16のうち発光素子14からの励起光が多く照射されるものと照射されにくいものとが存在して色温度がずれることとなる。そのため、色温度を制御することが困難になるという問題を有していた。   However, in the conventional light emitting device 11, the phosphor 16a having a large specific gravity is biased to the lower side of the translucent member 15, and the phosphor 16b having a small specific gravity is located above the phosphor 16a having a large specific gravity or above the translucent member 15. It tends to be biased. As a result, among the two or more types of phosphors 16, those that are irradiated with a lot of excitation light from the light emitting element 14 and those that are not easily irradiated exist, and the color temperature is shifted. For this reason, it has been difficult to control the color temperature.

したがって、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、複数の蛍光体によって所望の色温度を安定して放射することのできる発光装置を提供することである。   Accordingly, the present invention has been completed in view of the above-described conventional problems, and an object thereof is to provide a light emitting device that can stably emit a desired color temperature by a plurality of phosphors. .

本発明の発光装置は、上面に発光素子の搭載部を有する基体と、該基体の上面の外周部に前記搭載部を取り囲むように取着された枠体と、前記搭載部に搭載された前記発光素子と、前記枠体の内側に前記発光素子を覆うように設けられ、前記発光素子が発光する光を波長変換する蛍光体を含有した樹脂から成る透光性部材とを具備しており、該透光性部材は硬化前の粘度が0.4Ｐａ・ｓ乃至50Ｐａ・ｓであり、前記蛍光体は複数種類のものから成ることを特徴とする。   The light emitting device of the present invention includes a base having a light emitting element mounting portion on an upper surface, a frame attached to an outer peripheral portion of the upper surface of the base so as to surround the mounting portion, and the mounting mounted on the mounting portion. A light-emitting element, and a translucent member made of a resin containing a phosphor that is provided inside the frame so as to cover the light-emitting element and converts the wavelength of light emitted from the light-emitting element, The translucent member has a viscosity before curing of 0.4 Pa · s to 50 Pa · s, and the phosphor comprises a plurality of types.

本発明の発光装置において、好ましくは、前記蛍光体は、最も比重の大きなものと最も比重の小さなものとの比重差が3.5以下であることを特徴とする。   In the light emitting device of the present invention, preferably, the phosphor has a specific gravity difference of 3.5 or less between a phosphor having the largest specific gravity and a phosphor having the smallest specific gravity.

本発明の発光装置において、好ましくは、前記発光素子は450ｎｍ以下にピーク波長を有する光を発し、前記透光性部材はシリコーン樹脂またはフッ素樹脂から成ることを特徴とする。   In the light emitting device of the present invention, preferably, the light emitting element emits light having a peak wavelength of 450 nm or less, and the translucent member is made of silicone resin or fluororesin.

本発明の照明装置において、好ましくは、発光装置を所定の配置とするように設置したことを特徴とする。   In the illuminating device of the present invention, preferably, the light emitting device is installed so as to have a predetermined arrangement.

本発明の発光装置は、上面に発光素子の搭載部を有する基体と、基体の上面の外周部に搭載部を取り囲むように取着された枠体と、搭載部に搭載された発光素子と、枠体の内側に発光素子を覆うように設けられ、発光素子が発光する光を波長変換する蛍光体を含有した樹脂から成る透光性部材とを具備しており、透光性部材は硬化前の粘度が0.4Ｐａ・ｓ乃至50Ｐａ・ｓであり、蛍光体は複数種類のものから成ることにより、蛍光体の比重が異なっていても、それらの沈降や浮上を抑制することができ、蛍光体を透光性部材に均一に分散させて含有することができる。さらに、透光性部材を枠体の内部に充填する際に、基体や枠体または発光素子との隙間や、透光性部材や接合材（図示せず）内に残留する気泡を浮力によって容易に大気中に放出することができる。その結果、発光面や照射面における色むらや照度分布の偏りが抑制されるとともに、透光性部材内における光散乱が抑制された照明特性に優れる発光装置を作製することができる。   The light emitting device of the present invention includes a base having a light emitting element mounting portion on the upper surface, a frame attached to the outer peripheral portion of the upper surface of the base so as to surround the mounting portion, a light emitting element mounted on the mounting portion, A translucent member made of a resin containing a phosphor that is provided inside the frame so as to cover the light emitting element and that converts the wavelength of light emitted from the light emitting element, and the translucent member is uncured. The viscosity of the material is 0.4 Pa · s to 50 Pa · s, and the phosphor is composed of a plurality of types, so that even if the specific gravity of the phosphor is different, the sedimentation and floating of the phosphor can be suppressed. Can be uniformly dispersed in the translucent member. Further, when filling the inside of the frame with the translucent member, the gap between the base body, the frame or the light emitting element, and bubbles remaining in the translucent member or the bonding material (not shown) can be easily generated by buoyancy. Can be released into the atmosphere. As a result, it is possible to manufacture a light-emitting device that has excellent illumination characteristics in which unevenness in color and uneven illuminance distribution on the light-emitting surface and irradiation surface are suppressed and light scattering in the light-transmitting member is suppressed.

本発明の発光装置は、蛍光体は最も比重の大きなものと最も比重の小さなものとの比重差が3.5以下とすることにより、蛍光体の比重差によって生じる透光性部材内での蛍光体の浮上速度や沈降速度の差が小さくなり、透光性部材内における蛍光体の偏りをより有効に防止することができる。その結果、蛍光体を透光性部材に均一に分散させることができ、安定した色特性を有する発光装置を作製することができる。   In the light emitting device of the present invention, the phosphor has a specific gravity difference of 3.5 or less between the material having the largest specific gravity and the material having the smallest specific gravity, so that the phosphor in the translucent member caused by the difference in specific gravity of the phosphors. The difference between the flying speed and the sedimentation speed is reduced, and the bias of the phosphor in the translucent member can be more effectively prevented. As a result, the phosphor can be uniformly dispersed in the translucent member, and a light-emitting device having stable color characteristics can be manufactured.

本発明の発光装置は、発光素子は450ｎｍ以下にピーク波長を有する光を発し、透光性部材はシリコーン樹脂またはフッ素樹脂から成ることにより、発光素子のエネルギーの高い短波長の光による透光性部材の透過率の劣化や、発光素子や基体、枠体との接着強度の劣化を有効に抑制することができるとともに、蛍光体によって白色光や青色等の様々な色の光に変換可能となる。   In the light-emitting device of the present invention, the light-emitting element emits light having a peak wavelength of 450 nm or less, and the light-transmitting member is made of silicone resin or fluororesin, so that the light-emitting element has high light-transmitting property due to short-wavelength light. It is possible to effectively suppress the deterioration of the transmittance of the member and the deterioration of the adhesive strength with the light emitting element, the substrate, and the frame, and the phosphor can be converted into light of various colors such as white light and blue. .

本発明の照明装置は、発光装置を所定の配置となるように設置したことから、半導体から成る発光素子の電子の再結合による発光を利用しているため、従来の放電を用いた照明装置よりも低消費電力かつ長寿命とすることが可能な小型の照明装置とすることができる。その結果、発光素子から発生する光の中心波長の変動を抑制することができ、長期間にわたり安定した放射光強度かつ放射光角度（配光分布）で光を照射することができるとともに、照射面における色むらや照度分布の偏りが抑制された照明装置とすることができる。   Since the illuminating device of the present invention is installed so that the light emitting device is in a predetermined arrangement, it uses light emission by recombination of electrons of a light emitting element made of a semiconductor. In addition, a small illuminating device capable of low power consumption and long life can be obtained. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

また、本発明の発光装置を光源として所定の配置に設置するとともに、これらの発光装置の周囲に任意の形状に光学設計した反射治具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射する照明装置とすることができる。   In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

本発明の発光装置１について以下に詳細に説明する。図１は本発明の発光装置１の実施の形態の一例を示す断面図である。この図において、２は基体、３は枠体、４は発光素子、５は透光性部材、６は蛍光体であり、主としてこれらで本発明の発光装置１が構成されている。   The light emitting device 1 of the present invention will be described in detail below. FIG. 1 is a sectional view showing an example of an embodiment of a light emitting device 1 according to the present invention. In this figure, 2 is a substrate, 3 is a frame, 4 is a light emitting element, 5 is a translucent member, and 6 is a phosphor, which mainly constitute the light emitting device 1 of the present invention.

基体２は、酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、または、エポキシ樹脂や液晶ポリマー等の樹脂から成る絶縁体であり、その上面に形成された搭載部２ａに搭載する発光素子４の支持部材となる。   The substrate 2 is an insulator made of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a ceramic such as a glass ceramic, or a resin such as an epoxy resin or a liquid crystal polymer. It becomes a support member of the light emitting element 4 mounted in the formed mounting part 2a.

また、基体２の表面や内部には、発光装置１の内外を電気的に導通接続するためのＷ、Ｍｏ、Ｍｎ等の金属粉末から成るメタライズ配線層（図示せず）が形成されており、基体２の上面の搭載部２ａに露出したメタライズ配線層に発光素子４の電極がＡｕ−Ｓｎ共晶半田などの接合材やボンディングワイヤ等で電気的に接合され、基体２の下面等の外面に露出したメタライズ配線層にＣｕ、Ｆｅ−Ｎｉ合金等の金属から成るリード端子（図示せず）が接合される。   Further, a metallized wiring layer (not shown) made of a metal powder such as W, Mo, Mn for electrically connecting the inside and outside of the light emitting device 1 is formed on or inside the base 2. The electrode of the light emitting element 4 is electrically bonded to the metallized wiring layer exposed on the mounting portion 2a on the upper surface of the base 2 with a bonding material such as Au—Sn eutectic solder, a bonding wire, or the like. A lead terminal (not shown) made of a metal such as Cu or Fe—Ni alloy is joined to the exposed metallized wiring layer.

なお、メタライズ配線層の露出する表面にＮｉや金（Ａｕ）等の耐食性に優れる金属を１〜20μｍ程度の厚みで被着させておくのがよく、メタライズ配線層が酸化腐食するのを有効に防止できるとともに、メタライズ配線層と発光素子４との接続およびメタライズ配線層とボンディングワイヤとの接続を強固にすることができる。従って、メタライズ配線層の露出表面には、厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されていることがより好ましい。   It should be noted that a metal having excellent corrosion resistance, such as Ni or gold (Au), should be deposited on the exposed surface of the metallized wiring layer in a thickness of about 1 to 20 μm. In addition to preventing this, the connection between the metallized wiring layer and the light emitting element 4 and the connection between the metallized wiring layer and the bonding wire can be strengthened. Therefore, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the metallized wiring layer by an electrolytic plating method or an electroless plating method. Is more preferable.

さらに、基体２は、その上面に搭載部２ａに搭載された発光素子４を取り囲むように枠体３が、半田、ゾルゲルガラスや低融点ガラスなどの無機接着剤、エポキシ樹脂などの有機接着剤で取着される。なお、耐久性が必要な場合は無機接着剤の方が好ましい。   Furthermore, the base body 2 is made of an inorganic adhesive such as solder, sol-gel glass or low-melting glass, or an organic adhesive such as epoxy resin so as to surround the light emitting element 4 mounted on the mounting portion 2a on the upper surface thereof. To be attached. In addition, an inorganic adhesive is preferable when durability is required.

また、枠体３は、その内周面３ａにおいて発光素子４の光を高い反射率で反射させ得る反射面を有している。このような内周面３ａを有する枠体３は、Ａｌ，Ａｇ，金（Ａｕ），白金（Ｐｔ），チタン（Ｔｉ），クロム（Ｃｒ），Ｃｕ等の高反射率の金属を切削加工や金型成形等により形成したり、耐候性や耐湿性に優れるＣｕ−Ｗ合金やＳＵＳ合金等の枠体３の内周面３ａに、Ａｌ，Ａｇ，Ａｕ等の金属メッキや蒸着等の金属薄膜を形成したりすることにより作製することができる。   Moreover, the frame 3 has a reflective surface that can reflect the light of the light emitting element 4 with a high reflectance on the inner peripheral surface 3a thereof. The frame 3 having such an inner peripheral surface 3a is formed by cutting a metal having high reflectivity such as Al, Ag, gold (Au), platinum (Pt), titanium (Ti), chromium (Cr), Cu, or the like. Metal thin film such as metal plating or vapor deposition such as Al, Ag, Au, etc. formed on the inner peripheral surface 3a of the frame 3 such as Cu-W alloy or SUS alloy, which is formed by molding or the like, and is excellent in weather resistance and moisture resistance. Can be produced.

なお、内周面３ａは、ＡｇやＣｕ等の酸化により変色し易い金属からなる場合には、その表面に、紫外領域から可視光領域にわたり透過率の優れる低融点ガラスやゾル−ゲルガラス、または、シリコーン樹脂やエポキシ樹脂を被着するのが良く、これにより、枠体３の内周面３ａの耐腐食性、耐薬品性、耐候性を向上することができる。   In addition, when the inner peripheral surface 3a is made of a metal that is easily discolored by oxidation such as Ag or Cu, the surface thereof has a low melting point glass or sol-gel glass having excellent transmittance from the ultraviolet region to the visible light region, or Silicone resin or epoxy resin is preferably applied, whereby the corrosion resistance, chemical resistance, and weather resistance of the inner peripheral surface 3a of the frame 3 can be improved.

本発明の透光性部材５は、発光素子４との屈折率差が小さく、紫外線領域から可視光領域の光に対して透過率の高いものから成るのがよい。例えば、透光性部材５は、シリコーン樹脂やエポキシ樹脂、ユリア樹脂等の透明樹脂や低融点ガラスやゾル−ゲルガラス等から成る。これにより、発光素子４と透光性部材５との屈折率差により光の反射損失が発生するのを有効に抑制するとともに、発光装置１の外部へ高効率で所望の放射強度，角度分布で光を出射する発光装置１を製造できる。   The translucent member 5 of the present invention is preferably made of a material having a small refractive index difference from the light emitting element 4 and a high transmittance with respect to light in the ultraviolet region to the visible light region. For example, the translucent member 5 is made of a transparent resin such as a silicone resin, an epoxy resin, or a urea resin, a low-melting glass, a sol-gel glass, or the like. This effectively suppresses the occurrence of light reflection loss due to the difference in refractive index between the light emitting element 4 and the translucent member 5, and at the desired radiation intensity and angular distribution with high efficiency to the outside of the light emitting device 1. The light emitting device 1 that emits light can be manufactured.

また、透光性部材５の硬化前の粘度を0.4Ｐａ・ｓ乃至50Ｐａ・ｓの範囲にすることにより、蛍光体６の沈降と偏りを軽減して蛍光体６を透光性部材５に均一に分散させて含有させることができる。即ち、透光性部材５の硬化前の粘度が0.4Ｐａ・ｓ未満の場合、透光性部材５の粘度に対して、比重の大きい蛍光体６ａの沈降速度が比重の小さい蛍光体６ｂの沈降速度よりも大きくなることから、蛍光体６ａ，６ｂを透光性部材５の上側まで均一に分散させた状態に維持することが難しくなり、一定時間が経過すると蛍光体６ａが透光性部材５の下側に沈降して発光素子４の表面を被覆するようになる。その結果、発光装置１より放射される光の色温度がずれたり、発光素子４の光が蛍光体６により閉じ込められ、発光素子４から光を取り出す効率、所謂、外部量子効率が著しく低下する。   Further, by setting the viscosity of the translucent member 5 before curing in the range of 0.4 Pa · s to 50 Pa · s, the phosphor 6 is uniformly deposited on the translucent member 5 by reducing the sedimentation and bias of the phosphor 6. It can be dispersed and contained. That is, when the viscosity of the translucent member 5 before curing is less than 0.4 Pa · s, the sedimentation speed of the phosphor 6 a having a large specific gravity is set to the sediment of the phosphor 6 b having a small specific gravity with respect to the viscosity of the translucent member 5. Since it becomes larger than the speed, it becomes difficult to keep the phosphors 6a and 6b uniformly dispersed to the upper side of the translucent member 5, and the phosphor 6a becomes transparent after a certain period of time. It settles down to cover the surface of the light emitting element 4. As a result, the color temperature of the light emitted from the light emitting device 1 is shifted, the light of the light emitting element 4 is confined by the phosphor 6, and the efficiency of extracting light from the light emitting element 4, so-called external quantum efficiency, is significantly reduced.

また、透光性部材５の硬化前の粘度が50Ｐａ・ｓを超える場合、透光性部材５の硬化前の粘度が大きすぎることから、蛍光体６ａ，６ｂを透光性部材５の全体に均一に分散させることが難しくなるとともに、透光性部材５を枠体３の内部に充填する際に、基体２や枠体３または発光素子４との隙間や、透光性部材５や接合材（図示せず）内に残留する気泡を浮力によって大気中に放出するのが困難になる。その結果、発光装置１の発光面や照射面における色むらや照度分布に偏りが生じるとともに、透光性部材５内の気泡によって光散乱が生じ、透光性部材５内における光損失が増加して発光装置１の放射光強度が劣化する。   Moreover, when the viscosity before hardening of the translucent member 5 exceeds 50 Pa.s, since the viscosity before hardening of the translucent member 5 is too large, the phosphors 6 a and 6 b are put on the entire translucent member 5. It becomes difficult to disperse uniformly, and when the translucent member 5 is filled in the frame body 3, the gap between the base body 2, the frame body 3, or the light emitting element 4, the translucent member 5, or the bonding material. It becomes difficult to release bubbles remaining in the air (not shown) into the atmosphere by buoyancy. As a result, unevenness in color unevenness and illuminance distribution on the light emitting surface and irradiation surface of the light emitting device 1 occur, and light scattering occurs due to bubbles in the light transmissive member 5, increasing light loss in the light transmissive member 5. Thus, the emitted light intensity of the light emitting device 1 is deteriorated.

本発明の蛍光体６は、最も比重の大きなもの（蛍光体６ａ）と最も比重の小さなもの（蛍光体６ｂ）との比重比を３．５以下とすることが好ましい。これにより、蛍光体６の比重差によって生じる透光性部材５内での蛍光体６の浮上速度や沈降速度の差が小さくなり、透光性部材５内における蛍光体６の偏りを防止することができる。即ち、蛍光体６の最も比重の大きなものと最も比重の小さなものとの比重比が３．５を超える場合、複数の比重の異なる蛍光体６を透光性部材５に分散させて一定時間保持する際、比重の大きい蛍光体６ａから透光性部材５内に層状に堆積しやすくなる。その結果、発光素子４の光が下側に堆積した蛍光体６ａによって遮断され、上側に堆積した蛍光体６ａや蛍光体６ｂを励起することが困難になることから、それぞれの蛍光体６より放射される光の放射強度のバランスにズレが生じやすくなる。従って、発光装置１は、所望する色温度で光を放射するのが困難になる。   The phosphor 6 of the present invention preferably has a specific gravity ratio of 3.5 or less between the one with the highest specific gravity (phosphor 6a) and the one with the lowest specific gravity (phosphor 6b). Thereby, the difference in the floating speed and settling speed of the phosphor 6 in the translucent member 5 caused by the specific gravity difference of the phosphor 6 is reduced, and the bias of the phosphor 6 in the translucent member 5 is prevented. Can do. That is, when the specific gravity ratio of the phosphor 6 having the largest specific gravity and the smallest specific gravity exceeds 3.5, a plurality of phosphors 6 having different specific gravity are dispersed in the translucent member 5 and held for a certain period of time. In this case, the phosphor 6a having a large specific gravity is easily deposited in the translucent member 5 in layers. As a result, light from the light emitting element 4 is blocked by the phosphors 6a deposited on the lower side, and it becomes difficult to excite the phosphors 6a and 6b deposited on the upper side. Deviation tends to occur in the balance of the radiation intensity of the emitted light. Therefore, it becomes difficult for the light emitting device 1 to emit light at a desired color temperature.

なお、蛍光体６は、発光素子４の光で励起され電子の再結合により青色，赤色，緑色等に発光する、無機系，有機系の蛍光体６が透光性部材５に含有される。これにより、蛍光体６を任意の割合で配合することにより、所望の発光スペクトルと色を有する光を出力することができる。   The translucent member 5 contains an inorganic or organic phosphor 6 that is excited by the light of the light emitting element 4 and emits blue, red, green, or the like by recombination of electrons. Thereby, the light which has a desired light emission spectrum and color can be output by mix | blending the fluorescent substance 6 in arbitrary ratios.

また、発光素子４は、サファイア等の単結晶基板上にＧａＮ，ＡｌＧａＮ，ＩｎＧａＮ等から構成されるバッファ層，ｎ型層，発光層，ｐ型層を順次積層した窒化物半導体等の化合物半導体から成る。   The light emitting element 4 is made of a compound semiconductor such as a nitride semiconductor in which a buffer layer composed of GaN, AlGaN, InGaN or the like, an n-type layer, a light emitting layer, and a p-type layer are sequentially laminated on a single crystal substrate such as sapphire. Become.

そして、本発明の発光装置１は、基体２の搭載部２ａに発光素子４を搭載するとともに、発光素子４をワイヤボンディング（図示せず）やフリップチップ実装により配線導体（図示せず）を介して外部電気回路基板に電気的に導通させ、枠体３の内側に発光素子４を被覆するように蛍光体６を混入した透光性部材５を充填し熱硬化させることにより、発光素子４の光を蛍光体６により波長変換し所望の波長スペクトルを有する光を取り出すことができる。   In the light emitting device 1 of the present invention, the light emitting element 4 is mounted on the mounting portion 2a of the base body 2, and the light emitting element 4 is connected via a wiring conductor (not shown) by wire bonding (not shown) or flip chip mounting. The light-emitting element 4 is electrically connected to an external electric circuit board, filled with a translucent member 5 in which a phosphor 6 is mixed so as to cover the light-emitting element 4 inside the frame 3 and thermally cured. The light can be wavelength-converted by the phosphor 6 and light having a desired wavelength spectrum can be extracted.

また、発光装置１は、発光素子４は450ｎｍ以下にピーク波長を有する光を発し、透光性部材５はシリコーン樹脂またはフッ素樹脂から成るのがよい。これにより、発光素子４のエネルギーの高い短波長の光による透光性部材５の透過率の劣化や、発光素子４や基体２、枠体３との接着強度の劣化を有効に抑制することができるとともに、蛍光体６によって白色光や青色等の様々な色の光に変換可能となる。   In the light emitting device 1, the light emitting element 4 emits light having a peak wavelength of 450 nm or less, and the translucent member 5 is preferably made of silicone resin or fluororesin. This effectively suppresses deterioration of the transmittance of the translucent member 5 due to light having a short wavelength with high energy of the light emitting element 4 and deterioration of adhesive strength with the light emitting element 4, the base 2, and the frame 3. In addition, the phosphor 6 can be converted into light of various colors such as white light and blue.

さらに、発光装置１は、１個のものを所定の配置となるように設置したことにより、または複数個を、例えば、格子状や千鳥状，放射状，複数の発光装置１から成る、円状や多角形状の発光装置１群を同心状に複数群形成したもの等の所定の配置となるように設置したことにより、照明装置とすることができる。これにより、半導体から成る発光素子４の電子の再結合による発光を利用しているため、従来の放電を用いた照明装置よりも低消費電力かつ長寿命とすることが可能であり、発熱の小さな小型の照明装置とすることができる。その結果、発光素子４から発生する光の中心波長の変動を抑制することができ、長期間にわたり安定した放射光強度かつ放射光角度（配光分布）で光を照射することができるとともに、照射面における色むらや照度分布の偏りが抑制された照明装置とすることができる。   Furthermore, the light-emitting device 1 can be formed by arranging a single light-emitting device 1 in a predetermined arrangement, or a plurality of light-emitting devices 1 such as a lattice shape, a staggered shape, a radial shape, a plurality of light-emitting devices 1, By installing a group of polygonal light emitting devices in a predetermined arrangement such as a plurality of concentric groups, a lighting device can be obtained. Thereby, since light emission by electron recombination of the light emitting element 4 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a conventional lighting device using discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 4 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

また、本発明の発光装置１を光源として所定の配置に設置するとともに、これらの発光装置１の周囲に任意の形状に光学設計した反射治具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射できる照明装置とすることができる。   In addition, the light emitting device 1 of the present invention is installed in a predetermined arrangement as a light source, and a reflection jig, an optical lens, a light diffusing plate, or the like optically designed in an arbitrary shape is installed around the light emitting device 1 It can be set as the illuminating device which can radiate | emit light of arbitrary light distribution.

例えば、図２，図３に示す上面図，断面図のように複数個の発光装置１が発光装置駆動回路基板８に複数列に配置され、発光装置１の周囲に任意の形状に光学設計した反射治具７が設置されて成る照明装置の場合、隣接する一列上に配置された複数個の発光装置１において、隣り合う発光装置１との間隔が最短に成らないような配置、いわゆる千鳥状とすることが好ましい。即ち、発光装置１が格子状に配置される際には、光源となる発光装置１が直線上に配列されることによりグレアが強くなり、このような照明装置が人の視覚に入ってくることにより、不快感や目の障害を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人間の目に対する不快感や目に及ぼす障害を低減することができる。さらに、隣り合う発光装置１間の距離が長くなることにより、隣接する発光装置１間の熱的な干渉が有効に抑制され、発光装置１が実装された発光装置駆動回路基板８内における熱のこもりが抑制され、発光装置１の外部に効率よく熱が放散される。その結果、人の目に対しても障害の小さい長期間にわたり光学特性の安定した長寿命の照明装置を作製することができる。   For example, a plurality of light emitting devices 1 are arranged in a plurality of rows on the light emitting device drive circuit board 8 as shown in the top view and the cross-sectional view shown in FIGS. 2 and 3, and are optically designed in an arbitrary shape around the light emitting device 1. In the case of an illuminating device in which the reflecting jig 7 is installed, in a plurality of light emitting devices 1 arranged on an adjacent row, an arrangement in which the interval between adjacent light emitting devices 1 is not shortest, a so-called staggered pattern It is preferable that That is, when the light-emitting devices 1 are arranged in a grid, the light-emitting devices 1 serving as light sources are arranged on a straight line, so that glare is strong, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between the adjacent light emitting devices 1 is increased, thermal interference between the adjacent light emitting devices 1 is effectively suppressed, and the heat in the light emitting device driving circuit board 8 on which the light emitting device 1 is mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 1. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

また、照明装置が、図４，図５に示す上面図，断面図のような発光装置駆動回路基板８上に複数の発光装置１から成る円状や多角形状の発光装置１群を、同心状に複数群形成した照明装置の場合、１つの円状や多角形状の発光装置１群における発光装置１の配置数を照明装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置１同士の間隔を適度に保ちながら発光装置１をより多く配置することができ、照明装置の照度をより向上させることができる。また、照明装置の中央部の発光装置１の密度を低くして発光装置駆動回路基板８の中央部における熱のこもりを抑制することができる。よって、発光装置駆動回路基板８内における温度分布が一様となり、照明装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、発光装置１の温度上昇を抑制することができる。その結果、発光装置１は長期間にわたり安定して動作することができるとともに長寿命の照明装置を作製することができる。   Further, the lighting device is a concentric arrangement of a circular or polygonal light-emitting device group of a plurality of light-emitting devices 1 on the light-emitting device drive circuit board 8 as shown in the top view and the cross-sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable to increase the number of the light emitting devices 1 arranged in one circular or polygonal light emitting device 1 group toward the outer peripheral side from the center side of the illuminating device. Thereby, more light-emitting devices 1 can be arranged while keeping the interval between the light-emitting devices 1 moderately, and the illuminance of the illumination device can be further improved. Moreover, the density of the light-emitting device 1 in the center of the lighting device can be lowered to suppress heat accumulation in the center of the light-emitting device drive circuit board 8. Therefore, the temperature distribution in the light emitting device driving circuit board 8 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 1 can be suppressed. As a result, the light emitting device 1 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

このような照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装，展示用照明器具、街路用照明器具、誘導灯器具及び信号装置、舞台及びスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

本発明の発光装置１について図１にもとづき以下に実施例を示す。まず、基体２としてアルミナセラミックス基板を準備した。基体２は、一辺が６ｍｍで厚さ0.5ｍｍの四角柱板の上面中央部に発光素子４が搭載される搭載部２ａを有する。   Examples of the light emitting device 1 of the present invention will be described below based on FIG. First, an alumina ceramic substrate was prepared as the substrate 2. The base 2 has a mounting portion 2a on which the light emitting element 4 is mounted at the center of the upper surface of a square columnar plate having a side of 6 mm and a thickness of 0.5 mm.

さらにまた、枠体３を用意した。この枠体３は、外形の直径が3.5ｍｍで高さが1.5ｍｍとされ、上側開口直径が3.3ｍｍ、下側開口の直径が0.5ｍｍの円柱状とされた。   Furthermore, the frame 3 was prepared. The frame 3 had a cylindrical shape with an outer diameter of 3.5 mm and a height of 1.5 mm, an upper opening diameter of 3.3 mm, and a lower opening diameter of 0.5 mm.

次に、近紫外光を発する、Ａｕ−Ｓｎバンプが設けられた厚さ0.08ｍｍの発光素子４を、Ａｕ−Ｓｎバンプを介して基体２の上面に形成された配線導体に電気的に接合するとともに、基体２の上面に発光素子４を取り囲むように枠体３を樹脂等の接着剤で接合した。   Next, the 0.08 mm-thick light-emitting element 4 that emits near-ultraviolet light and is provided with Au—Sn bumps is electrically bonded to the wiring conductor formed on the upper surface of the substrate 2 via the Au—Sn bumps. At the same time, the frame 3 was joined to the upper surface of the base 2 with an adhesive such as a resin so as to surround the light emitting element 4.

次に、赤色発光，緑色発光，青色発光を行なう３種類の蛍光体６を含有したシリコーン樹脂（透光性部材５）をディスペンサーにて基体２と枠体３に囲まれた領域の枠体３の内周面３ａの最上端まで充填することにより、サンプルとしての発光装置１を作製した。   Next, a silicone resin (translucent member 5) containing three types of phosphors 6 that emit red light, green light, and blue light is used in a region surrounded by the base 2 and the frame 3 by a dispenser. By filling up to the uppermost end of the inner peripheral surface 3a, the light emitting device 1 as a sample was produced.

なお、蛍光体６の密度は、赤色蛍光体（Ｌａ２Ｏ２Ｓ：Ｅｕ）が5.8ｇ／ｃｍ３、緑色蛍光体（ＢａＭｇＡｌ10Ｏ17：Ｅｕ）が3.8ｇ／ｃｍ３、青色蛍光体（ＢａＭｇＡｌ10Ｏ17：Ｅｕ、Ｍｎ）が3.8ｇ／ｃｍ３であり、発光装置１より出射される光の色温度が6500Ｋとなるようにそれぞれ配合した。 The density of the phosphor 6, red phosphor (La 2 O 2 S: Eu ) is 5.8 g / cm 3, a green phosphor (BaMgAl 10 O 17: Eu) is 3.8 g / cm 3, a blue phosphor ( BaMgAl 10 O 17 : Eu, Mn) was 3.8 g / cm 3 , and the color temperature of the light emitted from the light emitting device 1 was 6500K.

また、透光性部材５は硬化前の粘度が0.4、1.3、1.7、50Ｐａ・ｓであるシリコーン樹脂を使用し、このシリコーン樹脂に赤色発光，緑色発光，青色発光を行なう３種類の蛍光体６を含有し、攪拌して蛍光体６を均一にした後、枠体３の内部で発光素子４を被覆するように透光性部材５を充填し、５分間の放置後硬化させた。   The translucent member 5 uses a silicone resin having a viscosity before curing of 0.4, 1.3, 1.7, and 50 Pa · s, and three types of phosphors 6 that emit red light, green light, and blue light on the silicone resin. After stirring to make the phosphor 6 uniform, the translucent member 5 was filled so as to cover the light emitting element 4 inside the frame 3 and allowed to cure after being left for 5 minutes.

このように作製した発光装置１について、それぞれのシリコーン樹脂の硬化前の粘度に対する色温度、演色性について評価結果を表１に示す。

Figure 2005277332
Table 1 shows the evaluation results of the light-emitting device 1 thus produced with respect to the color temperature and the color rendering properties with respect to the viscosity of each silicone resin before curing.
Figure 2005277332

表1から、今回の色温度の目標値である6500Ｋに対して、シリコーン樹脂の硬化前の粘度が0.3Ｐａ・ｓである発光装置１の場合、目標値である6500Ｋに対して10％を超える誤差を有する色温度のズレが生じた。また、シリコーン樹脂の硬化前の粘度が55Ｐａ・ｓである発光装置１の場合、シリコーン樹脂の硬化前の粘度が大きいことから、蛍光体６がシリコーン樹脂中に均一に分散させることができず、蛍光体６の偏りが生じて色温度が狙い値である6500Ｋに対して10％を超える誤差を有する色温度のズレが生じた。   From Table 1, the light-emitting device 1 in which the viscosity before curing of the silicone resin is 0.3 Pa · s exceeds 10% with respect to the target value of 6500K with respect to 6500K which is the target value of the current color temperature. A color temperature shift having an error occurred. Further, in the case of the light emitting device 1 in which the viscosity before curing of the silicone resin is 55 Pa · s, since the viscosity before curing of the silicone resin is large, the phosphor 6 cannot be uniformly dispersed in the silicone resin. A deviation of the color temperature having an error exceeding 10% with respect to the target value of 6500 K occurred due to the deviation of the phosphor 6.

これに対しシリコーン樹脂の効果前の粘度が0.4乃至50Ｐａ・ｓである本発明の発光装置１は、色温度の誤差が10％以内であり優れていることがわかった。   On the other hand, it was found that the light emitting device 1 of the present invention in which the viscosity before the effect of the silicone resin is 0.4 to 50 Pa · s is excellent with a color temperature error within 10%.

なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行うことは何等支障ない。例えば、枠体３の上面に発光素子４より出射される光を任意に集光し、また拡散させる光学レンズや平板状の透光性の蓋体を半田や樹脂接着剤等で接合することにより、所望する放射角度で光を取り出すことができるとともに発光装置１の内部への耐浸水性が改善され長期信頼性が向上する。また、枠体３の内周面３ａは、その断面形状が平坦（直線状）であってもよく、また、円弧状（曲線状）であってもよい。円弧状とする場合、発光素子４の光を万遍なく反射させて指向性の高い光を外部に均一に放射することができる。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. For example, an optical lens for arbitrarily collecting and diffusing the light emitted from the light emitting element 4 on the upper surface of the frame body 3 or a flat light-transmitting lid body is joined with solder or a resin adhesive. In addition, the light can be extracted at a desired radiation angle, and the water resistance to the inside of the light emitting device 1 is improved, thereby improving the long-term reliability. Further, the inner peripheral surface 3a of the frame 3 may have a flat (straight) cross-sectional shape or an arc (curved). In the case of the circular arc shape, the light of the light emitting element 4 can be uniformly reflected, and light with high directivity can be uniformly emitted to the outside.

また、本発明の照明装置は、複数個の発光装置１を所定の配置となるように設置したものだけでなく、１個の発光装置１を所定の配置となるように設置したものでもよい。   Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 1 are installed in a predetermined arrangement, but may be one in which one light emitting device 1 is installed in a predetermined arrangement.

本発明の発光装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. 本発明の照明装置の実施の形態の一例を示す上面図である。It is a top view which shows an example of embodiment of the illuminating device of this invention. 図２の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す上面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図４の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 従来の発光装置を示す断面図である。It is sectional drawing which shows the conventional light-emitting device.

符号の説明Explanation of symbols

１：発光装置
２：基体
２ａ：搭載部
３：枠体
４：発光素子
５：透光性部材
６：蛍光体
６ａ：比重の大きい蛍光体
６ｂ：比重の小さい蛍光体 1: Light-emitting device 2: Base 2a: Mounting portion 3: Frame body 4: Light-emitting element 5: Translucent member 6: Phosphor 6a: Phosphor 6b having a large specific gravity 6: Phosphor having a small specific gravity

Claims (4)

上面に発光素子の搭載部を有する基体と、該基体の上面の外周部に前記搭載部を取り囲むように取着された枠体と、前記搭載部に搭載された前記発光素子と、前記枠体の内側に前記発光素子を覆うように設けられ、前記発光素子が発光する光を波長変換する蛍光体を含有した樹脂から成る透光性部材とを具備しており、該透光性部材は硬化前の粘度が０．４Ｐａ・ｓ乃至５０Ｐａ・ｓであり、前記蛍光体は複数種類のものから成ることを特徴とする発光装置。 A base body having a light emitting element mounting portion on an upper surface, a frame body attached to an outer peripheral portion of the upper surface of the base body so as to surround the mounting portion, the light emitting element mounted on the mounting portion, and the frame body A light-transmitting member made of a resin containing a phosphor that converts the wavelength of light emitted from the light-emitting element, and the light-transmitting member is cured. A light-emitting device having a previous viscosity of 0.4 Pa · s to 50 Pa · s, and the phosphor is made of a plurality of types. 前記蛍光体は、最も比重の大きなものと最も比重の小さなものとの比重比が３．５以下であることを特徴とする請求請１記載の発光装置。 2. The light emitting device according to claim 1, wherein the phosphor has a specific gravity ratio of 3.5 or less between a phosphor having the largest specific gravity and a material having the smallest specific gravity. 前記発光素子は４５０ｎｍ以下にピーク波長を有する光を発し、前記透光性部材はシリコーン樹脂またはフッ素樹脂から成ることを特徴とする請求項１または請求項２記載の発光装置。 3. The light emitting device according to claim 1, wherein the light emitting element emits light having a peak wavelength of 450 nm or less, and the translucent member is made of a silicone resin or a fluororesin. 請求項１乃至請求項３のいずれかに記載の発光装置を所定の配置とするように設置したことを特徴とする照明装置。 An illuminating device, wherein the light emitting device according to any one of claims 1 to 3 is installed in a predetermined arrangement.
JP2004092209A 2004-02-24 2004-03-26 Light emitting device and lighting device Pending JP2005277332A (en)

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US11/088,238 US20050211991A1 (en) 2004-03-26 2005-03-22 Light-emitting apparatus and illuminating apparatus
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335495A (en) * 2006-06-13 2007-12-27 Fujikura Ltd Light emitter and method for manufacturing the same
JP2011066108A (en) * 2009-09-16 2011-03-31 Mitsubishi Electric Corp Light-emitting device and illuminator
JP2015142963A (en) * 2014-01-31 2015-08-06 トーカロ株式会社 Non-adhesive composite resin film coated member and method for producing the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007335495A (en) * 2006-06-13 2007-12-27 Fujikura Ltd Light emitter and method for manufacturing the same
JP2011066108A (en) * 2009-09-16 2011-03-31 Mitsubishi Electric Corp Light-emitting device and illuminator
JP2015142963A (en) * 2014-01-31 2015-08-06 トーカロ株式会社 Non-adhesive composite resin film coated member and method for producing the same

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