JP2005276883A - Light source for white led - Google Patents

Light source for white led Download PDF

Info

Publication number
JP2005276883A
JP2005276883A JP2004084100A JP2004084100A JP2005276883A JP 2005276883 A JP2005276883 A JP 2005276883A JP 2004084100 A JP2004084100 A JP 2004084100A JP 2004084100 A JP2004084100 A JP 2004084100A JP 2005276883 A JP2005276883 A JP 2005276883A
Authority
JP
Japan
Prior art keywords
sealing resin
resin member
gap
light source
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004084100A
Other languages
Japanese (ja)
Other versions
JP4253768B2 (en
Inventor
Kenichi Ishii
健一 石井
Yasuo Imai
康雄 今井
Hiroyoshi Tanabe
浩義 田邊
Akito Tanaka
章人 田中
Takuo Murai
卓生 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Original Assignee
Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Mitsubishi Electric Lighting Corp filed Critical Mitsubishi Electric Corp
Priority to JP2004084100A priority Critical patent/JP4253768B2/en
Publication of JP2005276883A publication Critical patent/JP2005276883A/en
Application granted granted Critical
Publication of JP4253768B2 publication Critical patent/JP4253768B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source of white LED which has improved light emission efficiency. <P>SOLUTION: In the light source of white LED formed of an LED element, fluorescent material, and sealing resin member; the sealing resin member comprises a first sealing resin member having the semispherical external shape which is in close contact with the LED element for the sealing purpose; a second sealing resin member having the semispherical external shape which is allocated in the external side of the first sealing resin member keeping a gap thereto; and the fluorescent material which fills the gap between the first sealing resin member and the second sealing resin member. Moreover, this light source of white LED has the first sealing resin member formed as a double-layer member, formed of the sealing resin members of 1a and 1b or is formed as a triple-layer member, formed of the sealing resin members 1a, 1b, and 1c. In addition, the gap is determined in matching with the luminous intensity distribution curve of the LED element. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、白色LED光源に関し、その発光効率の向上に関するものである。   The present invention relates to a white LED light source, and relates to an improvement in luminous efficiency.

一般に発光ダイオード(LED)の光源色には、赤や橙、緑など様々な種類があり、この中で照明用光源としては、主として白色LEDが用いられる。この白色LEDを実現するには、青色光または近紫外光を発光する発光ダイオードと、それに装着された透光性被覆材中に含有された蛍光物質の組み合わせにより実現されている。
即ち、発光ダイオードに装着する透光性被覆材として、その被覆材中に蛍光物質を含有することを特徴とする発光ダイオード用透光性被覆材や、それを発光ダイオードと組み合わせて蛍光物質より固有波長の発光色を発光するようにした蛍光カラー光源などが開発されている。(例えば、特許文献1参照)
Generally, there are various kinds of light source colors of light emitting diodes (LEDs) such as red, orange, and green, and among these, white LEDs are mainly used as illumination light sources. This white LED is realized by a combination of a light emitting diode that emits blue light or near ultraviolet light and a fluorescent material contained in a light-transmitting coating material attached to the light emitting diode.
That is, as a translucent coating material to be attached to a light emitting diode, a translucent coating material for a light emitting diode characterized by containing a fluorescent material in the coating material, or in combination with a light emitting diode, it is more specific than a fluorescent material A fluorescent color light source that emits light of a wavelength is being developed. (For example, see Patent Document 1)

特開平11−087784号公報JP-A-11-087784

LED素子から放射される近紫外線を受光したときに赤色、緑色、青色に波長変換する3種類の蛍光体を適正な分量で混合することにより白色光が得られる。
しかし、LED素子からの放射出力の大きさは、その放射角度により異なる。
即ち、実際のLED素子の配光曲線は、理想的な放射角度0゜から180゜まで均等な配光曲線とは異なり、或る放射角度では放射出力の強度は弱く、また或る放射角度では強くなるというように、放射角度により強弱が生じる。
White light can be obtained by mixing three types of phosphors that convert wavelengths into red, green, and blue when receiving near-ultraviolet rays emitted from the LED elements in appropriate amounts.
However, the magnitude of the radiation output from the LED element varies depending on the radiation angle.
That is, the light distribution curve of an actual LED element is different from an ideal light distribution curve from an ideal radiation angle of 0 ° to 180 °, the intensity of radiation output is weak at a certain radiation angle, and at a certain radiation angle. As the intensity increases, the intensity varies depending on the radiation angle.

また、一定の放射強度の近紫外線が蛍光体にあたる場合、蛍光体の膜厚と蛍光体により波長変換された放射出力には或る関係が存在する。即ち、蛍光体の膜厚が小さい場合は、波長変換された放射出力は小さく、膜厚が大きくなるにつれて放射出力は上昇し或る膜厚に至って極大となり、それ以上膜厚を増やしても放射出力はむしろ減少する。
したがって、白色LED光源の発光効率を向上させるために、蛍光体の膜厚を適正量に制御することが強く望まれている。
Further, when near ultraviolet rays having a certain radiation intensity hit the phosphor, there is a relationship between the thickness of the phosphor and the radiation output wavelength-converted by the phosphor. In other words, when the phosphor film thickness is small, the wavelength-converted radiation output is small, and as the film thickness increases, the radiation output increases to reach a certain film thickness and becomes maximal. The output is rather reduced.
Therefore, in order to improve the luminous efficiency of the white LED light source, it is strongly desired to control the phosphor film thickness to an appropriate amount.

また、LED素子から放射される近紫外線を効率よく可視光線に変換するためには、LED素子と蛍光体との間が完全に封止されていることが必要であり、この封止条件と封止材料の構成により発光効率が大きく影響されるとの知見を得ている。
したがって、より発光効率の良い白色LED光源を得るために、より良き封止条件と封止材料の構成の開発が期待されている。
本発明は、封止樹脂部材を層状に分割することにより、封止条件と封止材料の構成を改善し、且つ適正な蛍光体の膜厚を実現させることにより発光効率の良い白色LED光源を得ることをその目的としている。
Further, in order to efficiently convert near ultraviolet rays emitted from the LED element into visible light, it is necessary that the LED element and the phosphor are completely sealed. It has been found that the luminous efficiency is greatly influenced by the structure of the stopping material.
Therefore, in order to obtain a white LED light source with higher luminous efficiency, development of better sealing conditions and a configuration of the sealing material is expected.
The present invention improves the sealing conditions and the composition of the sealing material by dividing the sealing resin member into layers, and realizes a suitable phosphor film thickness to achieve a white LED light source with good luminous efficiency. Its purpose is to obtain.

本発明に係る白色LED光源は、LED素子と蛍光体と封止樹脂部材とからなり、封止樹脂部材は、LED素子に密着して封止する外形が半球体形状をなす第1の封止樹脂部材と、第1の封止樹脂部材の外側に間隙をもって配置される外形が半球体形状をなす第2の封止樹脂部材と、第1の封止樹脂部材と第2の封止樹脂部材との間隙に充填された蛍光体よりなることを特徴としている。   The white LED light source according to the present invention includes an LED element, a phosphor, and a sealing resin member, and the sealing resin member is a first sealing whose outer shape is in close contact with the LED element and forms a hemispherical shape. A resin member, a second sealing resin member having a hemispherical outer shape arranged with a gap outside the first sealing resin member, a first sealing resin member, and a second sealing resin member It consists of the fluorescent substance with which it filled with the gap | interval.

本発明の白色LED光源によれば、第1の封止樹脂部材の外側形状と第2の封止樹脂部材の内側形状によって、第1の封止樹脂部材と第2の封止樹脂部材を組み合わせたときに任意の間隙が得られ、この間隙に蛍光体を封入することにより結果として蛍光体の膜厚を任意に設定でき発光効率の良い白色LED光源を得ることができる。
また、封止樹脂部材を層状に分割することにより、より良き封止条件と封止材料の構成を得ることが可能となり、白色LED光源の発光効率をより向上させることができる。
According to the white LED light source of the present invention, the first sealing resin member and the second sealing resin member are combined according to the outer shape of the first sealing resin member and the inner shape of the second sealing resin member. In this case, an arbitrary gap is obtained, and by enclosing the phosphor in this gap, as a result, the thickness of the phosphor can be arbitrarily set, and a white LED light source with good luminous efficiency can be obtained.
Further, by dividing the sealing resin member into layers, it becomes possible to obtain better sealing conditions and a structure of the sealing material, and it is possible to further improve the light emission efficiency of the white LED light source.

実施の形態1.
図1は、本発明の実施の形態1に係る断面説明図である。
図2は、LED素子の放射角度0゜〜180゜間で均等な配光曲線を示す図である。
図3は、LED素子の実際の放射角度により異なる配光曲線を示す図である。
図4は、蛍光体の膜厚と蛍光体の波長変換強度の関係を示す図である。
Embodiment 1 FIG.
FIG. 1 is an explanatory cross-sectional view according to Embodiment 1 of the present invention.
FIG. 2 is a diagram showing a uniform light distribution curve between the emission angles of the LED elements of 0 ° to 180 °.
FIG. 3 is a diagram showing different light distribution curves depending on the actual radiation angle of the LED element.
FIG. 4 is a diagram showing the relationship between the thickness of the phosphor and the wavelength conversion intensity of the phosphor.

図1において、 基板2の上側に凹部2aを設け、この凹部2aの底面にLED素子1を配置し、このLED素子1の全体を覆うように外形が半球体形状をなす第1の封止樹脂部材3を配置する。この第1の封止樹脂部材3の外側に配置される、内面に凹凸があり外形が半球体形状をなす第2の封止樹脂部材4と、この第2の封止樹脂部材4と前記第1の封止樹脂部材3との間隙5に蛍光体6が満たされている。第2の封止樹脂部材4の内面の凹凸形状により、蛍光体6の膜厚は任意に設計できる。   In FIG. 1, a recess 2 a is provided on the upper side of a substrate 2, an LED element 1 is disposed on the bottom surface of the recess 2 a, and a first sealing resin whose outer shape forms a hemispherical shape so as to cover the entire LED element 1. The member 3 is disposed. The second sealing resin member 4 disposed on the outer side of the first sealing resin member 3 and having an inner surface and an outer shape having a hemispherical shape, the second sealing resin member 4 and the first sealing resin member 4 A phosphor 5 is filled in a gap 5 with one sealing resin member 3. The film thickness of the phosphor 6 can be arbitrarily designed due to the uneven shape of the inner surface of the second sealing resin member 4.

前記膜厚、即ち、第2の封止樹脂部材4と第1の封止樹脂部材3との間隙5は、本LED光源の発光効率に極めて大きく影響する。この間隙5の量は、下記の諸条件を加味して決められる。
図2におけるように、LED素子1から放射される放射線の理想的な均一な分布状態である場合は、放射線を受けた蛍光体6からはより均一な強度分布の可視光線を得ることができる。しかしながら、実際のLED素子1からの配光曲線は、図3に示すように放射角度により異なる配光強度分布を示している。
The film thickness, that is, the gap 5 between the second sealing resin member 4 and the first sealing resin member 3 greatly affects the light emission efficiency of the LED light source. The amount of the gap 5 is determined in consideration of the following conditions.
As shown in FIG. 2, in the case of an ideal uniform distribution state of radiation emitted from the LED element 1, visible light having a more uniform intensity distribution can be obtained from the phosphor 6 that has received the radiation. However, the actual light distribution curve from the LED element 1 shows a different light distribution intensity distribution depending on the radiation angle as shown in FIG.

一方、図4に示すように、蛍光体6の膜厚により蛍光体の波長変換強度が異なり、或る膜厚において最も好ましい極大の波長変換強度が得られる。
膜厚の変化は、蛍光体6を構成する蛍光物質粉体の見掛けの密度が同じであれば、蛍光物質粉体の粒子量の変化となる。この粒子量が放射線の量に対して、少な過ぎれば粒子間をそのまま透過して、蛍光体6による可視化に寄与しない部分が多くなり発光効率が低下する。また、この粒子量が放射線の量に対して、多過ぎれば放射線により可視化されない蛍光体6部分が残り、同じく発光効率が低下する。
On the other hand, as shown in FIG. 4, the wavelength conversion intensity of the phosphor varies depending on the film thickness of the phosphor 6, and the most preferable maximum wavelength conversion intensity is obtained at a certain film thickness.
If the apparent density of the phosphor powder constituting the phosphor 6 is the same, the change in the film thickness is a change in the amount of particles of the phosphor powder. If this amount of particles is too small relative to the amount of radiation, there will be more parts that pass through the particles as they are and do not contribute to visualization by the phosphor 6, and the luminous efficiency will decrease. Moreover, if this particle amount is too much with respect to the amount of radiation, the fluorescent substance 6 part which is not visualized by radiation will remain, and the luminous efficiency will similarly decrease.

したがって、実測の配光曲線によりLED素子より放射される放射線の分布量を特定し、これに見合った蛍光体6の量を特定して、該蛍光体6の量に見合った間隙5を作成する。なお、蛍光体粉末の平均半径は5〜15μm程度、間隙5の値は、10〜200μm程度である。蛍光体6の間隙5内への装着は、充填法または印刷法により行う。   Therefore, the distribution amount of the radiation emitted from the LED element is specified by the actually measured light distribution curve, the amount of the phosphor 6 corresponding to this is specified, and the gap 5 corresponding to the amount of the phosphor 6 is created. . The average radius of the phosphor powder is about 5 to 15 μm, and the value of the gap 5 is about 10 to 200 μm. The phosphor 6 is mounted in the gap 5 by a filling method or a printing method.

封止樹脂部材は、多かれ少なかれ材料劣化を伴う。第1の封止樹脂部材3と第2の封止樹脂部材4とでは入射される波長が異なるため、特に、近紫外線が透過する第1の封止樹脂部材3では樹脂部材組織の劣化が多い。したがって、少なくとも第1の封止樹脂部材3の材料としては、イ)近紫外線による劣化の少ないもの、ロ)屈折率の大きいもの、が選ばれる必要がある。ガラスはこの条件にマッチするが、封止時の成形温度によりLED素子がもたず使用できない。Si系樹脂、フッ素系樹脂を使用することが好ましい。
本実施の形態1の発明により白色LED光源の発光効率を向上することができる。
The sealing resin member is more or less accompanied by material deterioration. Since the incident wavelength differs between the first sealing resin member 3 and the second sealing resin member 4, the resin member structure is often deteriorated particularly in the first sealing resin member 3 that transmits near ultraviolet rays. . Therefore, at least the material of the first sealing resin member 3 is required to be selected from (a) a material with little deterioration due to near ultraviolet rays and (b) a material with a high refractive index. Glass matches this condition, but the LED element does not hold due to the molding temperature at the time of sealing and cannot be used. It is preferable to use Si-based resin or fluorine-based resin.
The light emission efficiency of the white LED light source can be improved by the invention of the first embodiment.

実施の形態2.
図5は本発明の実施の形態2に係る断面説明図である。
本実施の形態2は、前記実施の形態1に対して、第1の封止樹脂部材3を、第1aの封止樹脂部材3aと第1bの封止樹脂部材3bの2層により構成したものである。
他の構成は、実施の形態1に準じており説明を省略する。
Embodiment 2. FIG.
FIG. 5 is a cross-sectional explanatory view according to Embodiment 2 of the present invention.
In the second embodiment, in contrast to the first embodiment, the first sealing resin member 3 is constituted by two layers of a first a sealing resin member 3a and a first b sealing resin member 3b. It is.
Other configurations are the same as those in the first embodiment, and the description thereof is omitted.

本実施の形態2においては、蛍光体および封止樹脂部材からなるLEDにおいて、封止樹脂部材はLED素子1に密着して封止する外形が半球体形状をなす第1aの封止樹脂部材3aと、第1aの封止樹脂部材3aの外側に配置される外形、内形が半球体形状をなす第1bの封止樹脂部材3bと、第1bの封止樹脂部材3bの外側に間隙5をもって配置される第2の封止樹脂部材4と、第1bの封止樹脂部材3bと第2の封止樹脂部材4との間隙5に充填された蛍光体6よりなるものである。   In the second embodiment, in an LED composed of a phosphor and a sealing resin member, the sealing resin member is a 1a sealing resin member 3a in which the outer shape sealed in close contact with the LED element 1 forms a hemispherical shape. And a 1b sealing resin member 3b whose outer shape and inner shape are arranged in the outer shape of the 1a sealing resin member 3a, and a gap 5 outside the 1b sealing resin member 3b. The second sealing resin member 4 is disposed, and the phosphor 6 is filled in the gap 5 between the first sealing resin member 3b and the second sealing resin member 4.

第1bの封止樹脂部材3bは、第1aの封止樹脂部材3aの合成樹脂材料に対して接着性がより優れた合成樹脂材料を使用する。これにより、間隙5に充填された蛍光体を第2の封止樹脂部材4との間でより確実に保持することができる。   The 1b sealing resin member 3b uses a synthetic resin material having better adhesion to the synthetic resin material of the 1a sealing resin member 3a. Thereby, the phosphor filled in the gap 5 can be more reliably held between the second sealing resin member 4.

実施の形態3.
図6は、本発明の実施の形態3に係る断面説明図である。
本実施の形態3は、前記実施の形態1に対して、第1の封止樹脂部材3を、外形が半球体形状をなす第1aの封止樹脂部材3aと、外形、内形が半球体形状をなす第1bの封止樹脂部材3bと、前記第1aの封止樹脂部材と前記第1bの封止樹脂部材との間に挟在された第1cの封止樹脂部材3cとの3層により構成したものである。
他の構成は、実施の形態1に準じており説明を省略する。
Embodiment 3 FIG.
FIG. 6 is an explanatory cross-sectional view according to the third embodiment of the present invention.
The third embodiment is different from the first embodiment in that the first sealing resin member 3 is a 1a sealing resin member 3a whose outer shape is a hemispherical shape, and the outer shape and inner shape are hemispherical. Three layers of a 1b sealing resin member 3b having a shape and a 1c sealing resin member 3c sandwiched between the 1a sealing resin member and the 1b sealing resin member It is comprised by.
Other configurations are the same as those in the first embodiment, and the description thereof is omitted.

第1bの封止樹脂部材3bは、第1aの封止樹脂部材3aの合成樹脂材料に対して接着性がより優れた合成樹脂材料を使用する。これにより、間隙5に充填された蛍光体を第2の封止樹脂部材4との間でより確実に保持することができる。
また、第1cの封止樹脂部材3cは、第1aの封止樹脂部材3aの合成樹脂材料に対して屈折率のより大きな材料を使用し、これにより発光強度分布を比較的に平準化することができ、外部への可視光発光がより均一となり、また発光効率を上げることができる。
The 1b sealing resin member 3b uses a synthetic resin material having better adhesion to the synthetic resin material of the 1a sealing resin member 3a. Thereby, the phosphor filled in the gap 5 can be more reliably held between the second sealing resin member 4.
Further, the 1c sealing resin member 3c uses a material having a higher refractive index than the synthetic resin material of the 1a sealing resin member 3a, thereby relatively leveling the emission intensity distribution. Visible light emission to the outside becomes more uniform, and the luminous efficiency can be increased.

実施の形態4.
図7、図8、及び図9は、図1、図5および図6における各間隙5を均一間隙とした場合の図である。
本実施の形態4は、前述の実施の形態1、2および3における間隙5が、LED素子1からの配光分布曲線に基づき構成されているのに対し、均一な配光分布曲線の場合を示している。各要素の構成、作用は実施の形態1、2および3における場合に準じており、説明を省略する。
これにより外部への発光分布が均一となり、発光効率が向上する。
Embodiment 4 FIG.
7, 8, and 9 are diagrams in the case where each gap 5 in FIGS. 1, 5, and 6 is a uniform gap.
In the fourth embodiment, the gap 5 in the first, second, and third embodiments is configured based on the light distribution distribution curve from the LED element 1, whereas the uniform light distribution distribution curve is used. Show. The configuration and operation of each element are the same as in the first, second, and third embodiments, and a description thereof is omitted.
Thereby, the light emission distribution to the outside becomes uniform, and the light emission efficiency is improved.

本発明は、白色LED光源につき述べてきたが、封止め被覆を多層にする構成効果については、一般の有色LED光源としても適用することができる   Although the present invention has been described with respect to a white LED light source, the configuration effect of forming a sealing coating in multiple layers can also be applied as a general colored LED light source.

本発明の実施の形態1に係る断面説明図である。It is a section explanatory view concerning Embodiment 1 of the present invention. LED素子の放射角度0゜〜180゜間で均等な配光曲線を示す図である。It is a figure which shows a uniform light distribution curve in the radiation angle 0 degree-180 degree of an LED element. LED素子の実際の放射角度により異なる配光曲線を示す図である。It is a figure which shows a light distribution curve which changes with the actual radiation angles of a LED element. 蛍光体の膜厚と蛍光体の波長変換強度の関係を示す図である。It is a figure which shows the relationship between the film thickness of a fluorescent substance, and the wavelength conversion intensity | strength of a fluorescent substance. 本発明の実施の形態2に係る断面説明図である。It is sectional explanatory drawing which concerns on Embodiment 2 of this invention. 本発明の実施の形態3に係る断面説明図である。It is sectional explanatory drawing which concerns on Embodiment 3 of this invention. 図1の間隙を均一間隙とした場合の図である。FIG. 2 is a diagram when the gap in FIG. 1 is a uniform gap. 図5の間隙を均一間隙とした場合の図である。FIG. 6 is a diagram when the gap in FIG. 5 is a uniform gap. 図6の間隙を均一間隙とした場合の図である。FIG. 7 is a diagram when the gap in FIG. 6 is a uniform gap.

符号の説明Explanation of symbols

1 LED素子、2 基板、2a 凹部、3 第1の封止樹脂部材、3a 第1aの封止樹脂部材、3b 第1bの封止樹脂部材、3c 第1cの封止樹脂部材、4 第2の封止樹脂部材、5 間隙、6 蛍光体。
DESCRIPTION OF SYMBOLS 1 LED element, 2 board | substrate, 2a recessed part, 3 1st sealing resin member, 3a 1a sealing resin member, 3b 1b sealing resin member, 3c 1c sealing resin member, 4 2nd Sealing resin member, 5 gap, 6 phosphor.

Claims (4)

LED素子と蛍光体と封止樹脂部材とからなる白色LED光源において、封止樹脂部材はLED素子に密着して封止する外形が半球体形状をなす第1の封止樹脂部材と、第1の封止樹脂部材の外側に間隙をもって配置される外形が半球体形状をなす第2の封止樹脂部材と、第1の封止樹脂部材と第2の封止樹脂部材との間隙に充填された蛍光体よりなることを特徴とする白色LED光源。   In the white LED light source including the LED element, the phosphor, and the sealing resin member, the sealing resin member is in contact with the LED element and sealed to form a hemispherical first sealing resin member; The outer shape disposed with a gap outside the sealing resin member is filled in the gap between the second sealing resin member having a hemispherical shape, and the first sealing resin member and the second sealing resin member. A white LED light source comprising a phosphor. 前記第1の封止樹脂部材が、LED素子に密着して封止する第1aの封止樹脂部材と、第1aの封止樹脂部材の外側にあって前記第2の封止樹脂部材との間に間隙をもって配設される外形、内形が半球体形状をなす第1bの封止樹脂部材との2層により構成されていることを特徴とする請求項1に記載の白色LED光源。   The first sealing resin member is a 1a sealing resin member that seals in close contact with the LED element, and the second sealing resin member that is outside the 1a sealing resin member 2. The white LED light source according to claim 1, comprising an outer shape and an inner shape disposed with a gap therebetween and a first-b sealing resin member having a hemispherical shape. 前記第1の封止樹脂部材が、LED素子に密着して封止する第1aの封止樹脂部材と、前記第2の封止樹脂部材との間に間隙をもって配設される外形、内形が半球体形状をなす第1bの封止樹脂部材と、第1aの封止樹脂部材と第1bの封止樹脂部材との間に挟在された第1cの封止樹脂部材との3層により構成されていることを特徴とする請求項1に記載の白色LED光源。   An outer shape and an inner shape in which the first sealing resin member is disposed with a gap between the first sealing resin member that is closely sealed to the LED element and the second sealing resin member. 1b sealing resin member having a hemispherical shape, and 1c sealing resin member sandwiched between the 1a sealing resin member and the 1b sealing resin member. It is comprised, The white LED light source of Claim 1 characterized by the above-mentioned. 前記間隙はLED素子の配光形状に対応した間隙であることを特徴とする請求項1乃至3のいずれか1項に記載の白色LED光源。
The white LED light source according to any one of claims 1 to 3, wherein the gap is a gap corresponding to a light distribution shape of the LED element.
JP2004084100A 2004-03-23 2004-03-23 White LED light source Expired - Fee Related JP4253768B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004084100A JP4253768B2 (en) 2004-03-23 2004-03-23 White LED light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004084100A JP4253768B2 (en) 2004-03-23 2004-03-23 White LED light source

Publications (2)

Publication Number Publication Date
JP2005276883A true JP2005276883A (en) 2005-10-06
JP4253768B2 JP4253768B2 (en) 2009-04-15

Family

ID=35176256

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004084100A Expired - Fee Related JP4253768B2 (en) 2004-03-23 2004-03-23 White LED light source

Country Status (1)

Country Link
JP (1) JP4253768B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008109113A (en) * 2006-09-28 2008-05-08 Sanyo Electric Co Ltd Light emitting device
WO2009028470A1 (en) * 2007-08-30 2009-03-05 Kyocera Corporation Light-emitting device and method for manufacturing the same
JP2009272628A (en) * 2008-05-07 2009-11-19 Samsung Electronics Co Ltd Method of manufacturing led semiconductor device, led semiconductor device, and system including led semiconductor device
US7790485B2 (en) 2007-05-18 2010-09-07 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method of manufacturing the same
JP2010278246A (en) * 2009-05-28 2010-12-09 Toshiba Lighting & Technology Corp Light emitting module and method of manufacturing the same
WO2011013188A1 (en) * 2009-07-27 2011-02-03 株式会社 東芝 Light-emitting device
JP2011029671A (en) * 2010-11-09 2011-02-10 Toshiba Corp Method of manufacturing light emitting device
WO2011021436A1 (en) * 2009-08-21 2011-02-24 コニカミノルタオプト株式会社 Light emitting device
US8294165B2 (en) 2006-03-30 2012-10-23 Kabushiki Kaisha Toshiba Semiconductor light-emitting device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8294165B2 (en) 2006-03-30 2012-10-23 Kabushiki Kaisha Toshiba Semiconductor light-emitting device
JP2008109113A (en) * 2006-09-28 2008-05-08 Sanyo Electric Co Ltd Light emitting device
US7790485B2 (en) 2007-05-18 2010-09-07 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method of manufacturing the same
WO2009028470A1 (en) * 2007-08-30 2009-03-05 Kyocera Corporation Light-emitting device and method for manufacturing the same
TWI427823B (en) * 2007-08-30 2014-02-21 Kyocera Corp Light emitting device
JP2009272628A (en) * 2008-05-07 2009-11-19 Samsung Electronics Co Ltd Method of manufacturing led semiconductor device, led semiconductor device, and system including led semiconductor device
KR101431711B1 (en) * 2008-05-07 2014-08-21 삼성전자 주식회사 Fabricating method of light emitting device and system, fabricated light emitting package and system using the same
JP2010278246A (en) * 2009-05-28 2010-12-09 Toshiba Lighting & Technology Corp Light emitting module and method of manufacturing the same
WO2011013188A1 (en) * 2009-07-27 2011-02-03 株式会社 東芝 Light-emitting device
US8071995B2 (en) 2009-07-27 2011-12-06 Kabushiki Kaisha Toshiba Light emitting device and a method for manufacturing the same
WO2011021436A1 (en) * 2009-08-21 2011-02-24 コニカミノルタオプト株式会社 Light emitting device
JP2011029671A (en) * 2010-11-09 2011-02-10 Toshiba Corp Method of manufacturing light emitting device

Also Published As

Publication number Publication date
JP4253768B2 (en) 2009-04-15

Similar Documents

Publication Publication Date Title
JP6063500B2 (en) Solid color lighting system with improved color quality
US7722211B2 (en) Light engine
JP5357379B2 (en) Light emitting device
JP5743548B2 (en) Lighting device
JP3185959U (en) 2 chip light emitting diode
JP2005260229A (en) Led display device with overlay
TWI614453B (en) Solid-state linear lighting arrangements including light emitting phosphor
JP2011249573A (en) Light emitting device, wavelength conversion sheet and illuminating device
JP6457225B2 (en) Light emitting device
KR20130139938A (en) Solid-state light emitting devices and signage with photoluminescence wavelength conversion
JP6093127B2 (en) Light emitting device and manufacturing method thereof
JP5484610B2 (en) Light emitting device
JP2010225791A (en) Semiconductor light emitting device
JP2007201301A (en) Light emitting device using white led
JP4253768B2 (en) White LED light source
JP2005332951A5 (en)
JPWO2015190242A1 (en) Light emitting device
US11538965B2 (en) Light-emitting diode filament structure and LED lighting lamp including the same
JP2008205170A (en) Light-emitting semiconductor device
JP2006179658A (en) Light emitting device
JP2005317881A (en) Light-emitting diode
JP5452747B2 (en) Light emitting device and lighting device
WO2015072120A1 (en) Light emitting device, light emitting module, lighting device and lamp
TWM460411U (en) Light-emitting structure
KR20130022251A (en) Led package

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061019

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081006

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081028

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081126

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090106

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090114

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120206

Year of fee payment: 3

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees