JP2005217215A - Tab tape for bga and its manufacturing method - Google Patents

Tab tape for bga and its manufacturing method Download PDF

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Publication number
JP2005217215A
JP2005217215A JP2004022508A JP2004022508A JP2005217215A JP 2005217215 A JP2005217215 A JP 2005217215A JP 2004022508 A JP2004022508 A JP 2004022508A JP 2004022508 A JP2004022508 A JP 2004022508A JP 2005217215 A JP2005217215 A JP 2005217215A
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tape
bga
tab tape
tab
insertion pin
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Hiroaki Hiratsuka
裕章 平塚
Teruyuki Omori
輝行 大森
Hidekazu Kojima
英一 小島
Fumiya Isaka
文哉 伊坂
Masahiko Saeki
雅彦 佐伯
Kazuhisa Kishino
和久 岸野
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a compact and inexpensive TAB tape for BGA without deteriorating the adhesiveness of an insulating tape and a solder ball land. <P>SOLUTION: The upper face and the lower face of an insulating tape 22 are conducted by conductive insertion pins 31 and 32. It is desired that the roots of the insertion pins 31 and 32 are formed with a plane pad 31b or a ball 32b. The insertion pins 31 and 32 are inserted from the lower face of the tape so that the tape can be connected to an electric wiring board by using the plane pad 31b or the ball 32b arranged on the lower face of the tape. It is desired that a repairing tool may be used for the inserting operation of the plurality of insertion pins. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はＴＡＢテープ、特にポリイミドテープ等の絶縁性テープを使用したＢＧＡ用のＴＡＢテープに関するものである。   The present invention relates to a TAB tape for BGA using an insulating tape such as a TAB tape, particularly a polyimide tape.

半導体実装技術の１つにＴＡＢ（Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）方式がある。この方式は、絶縁性のフィルムから成るテープ上に銅配線パターンを形成したテープキャリアのリードと半導体チップの電極を直接に接続する方法であり、ワイヤボンディング方式に比べて狭ピッチ接続やＩＣパッケージの小型・薄型化に最適であるため、広く用いられている。また、近年は、外部接続用端子を格子状に配列したはんだボール状の端子で形成したＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）パッケージの実装方法としても用いられている。   One of the semiconductor mounting techniques is a TAB (Tape Automated Bonding) method. This method is a method of directly connecting the lead of the tape carrier in which the copper wiring pattern is formed on the tape made of an insulating film and the electrode of the semiconductor chip. Widely used because it is optimal for miniaturization and thinning. In recent years, it has also been used as a mounting method for a BGA (Ball Grid Array) package formed by solder ball-like terminals in which external connection terminals are arranged in a grid.

図３に、半導体チップを搭載した従来のＢＧＡ用ＴＡＢテープの横断面図を示す。   FIG. 3 shows a cross-sectional view of a conventional BGA TAB tape on which a semiconductor chip is mounted.

ＴＡＢテープは、接着剤２１を貼り付けた絶縁性テープ２２（一般的にはポリイミドテープが用いられるので、以下の説明では単に「ポリイミドテープ」という。）上に、テープ状の上記接着剤２１を介して、熱と圧力により接着した銅箔等からなる電気配線２３を具備する。ポリイミドテープ２２と接着剤２１には、金型パンチもしくはレーザビームによりビアホール２４が形成される。このビアホール２４にはハンダボールが接着され、このハンダボールによって、ＴＡＢテープは半導体装置として電気配線板上に実装される。   The TAB tape has the tape-like adhesive 21 on the insulating tape 22 to which the adhesive 21 is attached (generally, a polyimide tape is used, and is simply referred to as “polyimide tape” in the following description). An electric wiring 23 made of copper foil or the like bonded by heat and pressure is provided. A via hole 24 is formed in the polyimide tape 22 and the adhesive 21 by a die punch or a laser beam. Solder balls are bonded to the via holes 24, and the TAB tape is mounted on the electric wiring board as a semiconductor device by the solder balls.

ＴＡＢテープ上には、半導体チップ２５がＡｇペーストまたは接着剤テープにより搭載される。半導体チップ２５は、Ａｕワイヤ２６により、ＴＡＢテープ上の銅箔等からなるワイヤボンディングパッド２７に電気的に接続される。ワイヤボンディングパッド２７は電気配線２３により、図示しないハンダボールを接着するハンダボールランド２８と電気的に接続される。ワイヤボンディングパッド２７は、Ａｕワイヤ２６を接続するため、ＡｕとＮｉによりメッキされる。   On the TAB tape, the semiconductor chip 25 is mounted by Ag paste or adhesive tape. The semiconductor chip 25 is electrically connected to a wire bonding pad 27 made of a copper foil or the like on a TAB tape by an Au wire 26. The wire bonding pad 27 is electrically connected to a solder ball land 28 to which a solder ball (not shown) is bonded by an electric wiring 23. The wire bonding pad 27 is plated with Au and Ni in order to connect the Au wire 26.

このように、従来のＢＧＡ用ＴＡＢテープは、半導体チップ搭載後のＴＡＢテープと電気配線板を接続するために、ＴＡＢテープにビアホールを設け、これにハンダボールを接着することにより、ＴＡＢテープ上に搭載された半導体チップと電気配線板の電気的導通を図っている。ポリイミドテープ上にビアホールを形成するための方法は、単一の加工径をもつ金型パンチ及びレーザビーム等を使用することにより穴開け加工を施している。また、プリント（リジット）基板上にビアホールを形成する場合は、ドリルを用いた加工が一般的なものとなっている。プリント（リジット）基板でのドリル加工は、数枚の基板を重ね合わせ、１本のドリルによりビアホール形成を行っていくが、ポリイミドテープのようなフレキシブルな材料を使用する場合のビアホール形成には、金型を用いたパンチ加工／レーザビームによる加工が一般的なものとなっている。   Thus, the conventional TAB tape for BGA has a via hole in the TAB tape to connect the TAB tape after mounting the semiconductor chip and the electric wiring board, and a solder ball is bonded to the TAB tape. Electrical conduction between the mounted semiconductor chip and the electric wiring board is achieved. As a method for forming a via hole on a polyimide tape, a punching process is performed by using a die punch having a single processing diameter, a laser beam, or the like. Further, when a via hole is formed on a printed (rigid) substrate, processing using a drill is common. In drilling with a printed (rigid) substrate, several substrates are stacked and a via hole is formed by one drill, but in the formation of a via hole when using a flexible material such as polyimide tape, Punch processing using a mold / processing by a laser beam has become common.

このように、ポリイミドテープのようなフレキシブルな材料にビアホールを開け、当該ビアホールにハンダボールを接合するように構成したテープキャリアは従来より多数知られている（その一例としては、例えば下記の特許文献１参照）。   As described above, a number of tape carriers configured to open a via hole in a flexible material such as polyimide tape and to join a solder ball to the via hole have been conventionally known (for example, the following patent document) 1).

上記の如く、従来のＢＧＡ用ＴＡＢテープは、半導体装置として電気配線板上に実装されるためにポリイミドテープ２２上にビアホール２４が形成され、ビアホール２４中にハンダボールが接着されるようになっている。近年の半導体パッケージの多ピン化とパッケージサイズの縮小化に伴い、ハンダボールランド２８の径が縮小化される傾向にあるが、これはビアホール２４の径も縮小化されることに繋がる。更には、ビアホール２４の径が小さくなることによりハンダボール径も小さくなることにも繋がり、これはハンダボール接続の信頼性を低下させる問題となる。そこで、ハンダボールランド２８の径は出来るだけ小さく、ビアホール２４の径は出来るだけ大きくとるデザインとなるが、ハンダボールランド２８とポリイミドテープ２２の接着面積が小さくなってしまうため、ハンダボールランド２８とポリイミドテープ２２との密着力低下、ひいてはハンダボールランドの剥がれの問題となっていた。   As described above, since the conventional TAB tape for BGA is mounted on an electric wiring board as a semiconductor device, a via hole 24 is formed on the polyimide tape 22, and a solder ball is bonded to the via hole 24. Yes. With the recent increase in the number of pins of a semiconductor package and the reduction in package size, the diameter of the solder ball land 28 tends to be reduced. This leads to the reduction in the diameter of the via hole 24. Furthermore, the diameter of the via hole 24 is reduced, so that the diameter of the solder ball is also reduced. This causes a problem that the reliability of the solder ball connection is lowered. Therefore, the design is such that the diameter of the solder ball land 28 is as small as possible and the diameter of the via hole 24 is as large as possible. However, since the bonding area between the solder ball land 28 and the polyimide tape 22 is reduced, the solder ball land 28 The adhesion strength with the polyimide tape 22 is reduced, and as a result, the solder ball land is peeled off.

また、ポリイミドテープを用いるＢＧＡ用ＴＡＢテープの場合、ビアホールを形成するために金型を用いるプレス加工もしくはレーザーによる加工法が一般的であるが、これらの方法は加工コストが大きくなり量産性の面において問題となっていた。
特開２００１−２０３２４１号公報 In the case of a TAB tape for BGA using a polyimide tape, a press working using a die or a laser processing method is generally used to form a via hole. However, these methods increase the processing cost and increase the productivity. Was a problem.
JP 2001-203241 A

上述の如く、従来のＢＧＡ用ＴＡＢテープは、ポリイミドテープの上面および下面で同一径となるビアホールが形成されているため、半導体パッケージの多ピン化とパッケージサイズの縮小化に伴うハンダボールランド径の小径化及びビアホール径の大径化の傾向下においては、ポリイミドテープとハンダボールランドとの十分な密着力強度が確保できない問題点があった。   As described above, the conventional BGA TAB tape has a via hole having the same diameter on the upper surface and the lower surface of the polyimide tape. Therefore, the solder ball land diameter of the semiconductor package is increased with the increase in the number of pins of the semiconductor package and the reduction of the package size. Under the trend of decreasing the diameter and increasing the via hole diameter, there is a problem that sufficient adhesion strength between the polyimide tape and the solder ball land cannot be secured.

また、ビアホールの小径化にともない金型ピンの製作が困難になり、それに付随して加工コストが増大し、多ピン化の面においても金型コストが増大するという問題があった。   In addition, it has become difficult to manufacture a mold pin as the diameter of the via hole is reduced, and the processing cost is increased accordingly, and there is a problem that the mold cost is increased in terms of increasing the number of pins.

そこで、本発明の目的とするところは、上記の問題点を解決し、ポリイミドテープとハンダボールランドとの密着力が低下することのない小型で安価なＢＧＡ用ＴＡＢテープおよびその製造方法を提供することにある。   Accordingly, an object of the present invention is to solve the above-described problems and provide a small and inexpensive BGA TAB tape and a method for manufacturing the same that does not reduce the adhesion between the polyimide tape and the solder ball land. There is.

上記の目的を達成するため、本発明は、次のように構成したものである。   In order to achieve the above object, the present invention is configured as follows.

請求項１の発明に係るＢＧＡ用ＴＡＢテープは、導電性の差込みピンにより絶縁性テープの上面と下面を導通せしめたことを特徴とする。   The TAB tape for BGA according to the invention of claim 1 is characterized in that the upper surface and the lower surface of the insulating tape are electrically connected by a conductive insertion pin.

請求項２の発明は、請求項1に記載のＢＧＡ用ＴＡＢテープにおいて、上記差込みピンの先端が、針状形状もしくは上記絶縁性テープに差込み可能な形状を有することを特徴とする。   According to a second aspect of the present invention, in the TAB tape for BGA according to the first aspect, the tip of the insertion pin has a needle shape or a shape that can be inserted into the insulating tape.

請求項３の発明は、請求項1に記載のＢＧＡ用ＴＡＢテープにおいて、上記差込みピンが、絶縁性テープに差し込まれる先端側とは反対側の根元部に平面パッド又はボールを有することを特徴とする。   The invention according to claim 3 is the TAB tape for BGA according to claim 1, wherein the insertion pin has a flat pad or a ball at a base portion on the opposite side to the tip side to be inserted into the insulating tape. To do.

請求項４の発明は、請求項1に記載のＢＧＡ用ＴＡＢテープにおいて、差込みピンがテープ下面より差し込まれテープ上面と導通せしめられたことを特徴とする。ここで「テープ下面」とは、半導体チップが搭載されていない側の面をいう。   The invention according to claim 4 is the TAB tape for BGA according to claim 1, wherein the insertion pin is inserted from the lower surface of the tape and is electrically connected to the upper surface of the tape. Here, the “tape lower surface” refers to the surface on which the semiconductor chip is not mounted.

請求項５の発明に係るＢＧＡ用ＴＡＢテープの製造方法は、ビアホールを形成することなくＢＧＡ用ＴＡＢテープを作製する工程と、導電性の差込みピンを作製する工程と、上記ＢＧＡ用ＴＡＢテープの所定箇所に上記差込みピンを差し込み、テープ上面と下面を導通せしめる工程と、を実行することを特徴とする。   According to a fifth aspect of the present invention, there is provided a method for producing a TAB tape for BGA, a step of producing a TAB tape for BGA without forming a via hole, a step of producing a conductive insertion pin, and a predetermined step for producing the TAB tape for BGA. The step of inserting the insertion pin into a place and conducting the upper surface and the lower surface of the tape is performed.

請求項６の発明は、請求項５に記載のＢＧＡ用ＴＡＢテープの製造方法において、ＢＧＡ用ＴＡＢテープの所定箇所に差込みピンを差し込む際に、１本以上の差込みピンをセットし得る治具を用いて当該差込み操作を行うことを特徴とする。   The invention of claim 6 is the method for manufacturing a BGA TAB tape according to claim 5, wherein a jig capable of setting one or more insertion pins when inserting the insertion pin into a predetermined position of the BGA TAB tape is provided. And performing the insertion operation.

＜発明の要点＞
ＴＡＢテープを製造する場合、通常はポリイミドテープにビアホールを形成し、その後銅箔ラミネートを行い、エッチングをしてハンダボールランドを設けるが、本発明においてはＴＡＢテープ製造時にはビアホールを形成せず、テープ完成後に導電性の差込みピンをテープ下面から差込むことによりテープ上面と下面の導通を図るものである。しかる後、これにハンダボールを接着する。差込みピンとしては、その根元部に、作業性の向上、ピンの過剰差込み防止、ハンダボールとして兼用する等の目的で、平面パッド若しくはボールを有するものが好適に用いられる。 <Key points of the invention>
When manufacturing a TAB tape, a via hole is usually formed in a polyimide tape, and then copper foil lamination is performed and etching is performed to provide a solder ball land. However, in the present invention, a via hole is not formed when a TAB tape is manufactured. After completion, a conductive insertion pin is inserted from the lower surface of the tape so as to achieve electrical connection between the upper surface and the lower surface of the tape. After that, a solder ball is bonded thereto. As the insertion pin, a pin having a flat pad or a ball is preferably used at the base portion for the purpose of improving workability, preventing excessive insertion of the pin, and also serving as a solder ball.

請求項１に記載の発明によれば、絶縁性テープの上面と下面が差込みピンによって導通せしめられ、ビアホールを設ける必要がないため、ハンダボールランドとポリイミドテープの接着面積を大きくすることが出来る。よって、ハンダボールランドとポリイミドテープの密着力強度を増加させることができ、剥がれ等の不良を防ぐことが出来る。   According to the first aspect of the present invention, since the upper surface and the lower surface of the insulating tape are made conductive by the insertion pin and there is no need to provide a via hole, the bonding area between the solder ball land and the polyimide tape can be increased. Therefore, the adhesion strength between the solder ball land and the polyimide tape can be increased, and defects such as peeling can be prevented.

請求項２に記載の発明によれば、絶縁性テープへの差込みピンの差込み操作が容易となり、絶縁性テープやその表面の銅箔に必要以上の損傷や剥がれを生じることがない。   According to the second aspect of the present invention, the insertion operation of the insertion pin into the insulating tape is facilitated, and the insulating tape and the copper foil on the surface thereof are not damaged or peeled more than necessary.

請求項３に記載の発明によれば、差込みピンの根元部の平面パッド又はボールによって、作業性の向上や、ピンの過剰差込み防止を図ることが出来る。また、平面パッド又はボールを電気配線板との接続パッドとして利用でき（従来はハンダボールで接続）、その径は従来のビアホール上のハンダボールのようにはテープデザインに影響を受けない。これはパッド径を大きくできることに繋がり、電気配線板との接続信頼性の高い半導体装置を提供できる。また、従来は実装工程でのボール搭載工程があったが、請求項３の発明のようにボール形状を有するパッドを用いれば、ボール搭載工程が省略できる。   According to the third aspect of the present invention, the workability can be improved and the excessive insertion of the pins can be prevented by the flat pad or ball at the base of the insertion pins. In addition, a flat pad or a ball can be used as a connection pad with an electric wiring board (conventionally connected with a solder ball), and its diameter is not affected by the tape design like a solder ball on a conventional via hole. This leads to an increase in the pad diameter and can provide a semiconductor device having high connection reliability with the electric wiring board. Conventionally, there has been a ball mounting process in the mounting process, but if a pad having a ball shape is used as in the invention of claim 3, the ball mounting process can be omitted.

請求項４に記載の発明によれば、平面パッド又はボールがテープ下面（半導体チップが搭載されない側の面）に配置され、電気配線板との接続が容易となる。   According to the fourth aspect of the present invention, the flat pad or the ball is disposed on the lower surface of the tape (the surface on which the semiconductor chip is not mounted), and the connection with the electric wiring board is facilitated.

請求項５に記載の発明によれば、請求項１に記載の前記の如き各種利点を有するＢＧＡ用ＴＡＢテープを効率よく製造出来る。   According to invention of Claim 5, the TAB tape for BGA which has the above various advantages of Claim 1 can be manufactured efficiently.

請求項６に記載の発明によれば、治具を利用することによって差込みピンの差込み操作を効率よく高精度に行うことが可能となり、特に複数本の差込みピンを一度に差し込む場合に効果的である。   According to the sixth aspect of the present invention, it is possible to perform the insertion operation of the insertion pin efficiently and with high accuracy by using a jig, which is particularly effective when inserting a plurality of insertion pins at a time. is there.

以下、本発明を図示の実施形態に基づいて説明する。   Hereinafter, the present invention will be described based on the illustrated embodiments.

図１に本発明に係るＢＧＡ用ＴＡＢテープの一実施例の横断面図を示す。   FIG. 1 shows a cross-sectional view of one embodiment of a TAB tape for BGA according to the present invention.

このＢＧＡ用ＴＡＢテープは、ポリイミドテープ（絶縁性テープ）２２の上面と下面を導電性の差込みピン３１により導通せしめたものであり、ＴＡＢテープの完成後、差込みピン３１をテープ下面より差込むことによりテープ上面のランドとの導通を図ったものである。図１に示す差込みピン３１は、針部３１ａとその根元部に設けられた平面パッド３１ｂとから成る。   In this TAB tape for BGA, the upper surface and the lower surface of a polyimide tape (insulating tape) 22 are electrically connected by a conductive insertion pin 31, and after the TAB tape is completed, the insertion pin 31 is inserted from the lower surface of the tape. Thus, conduction with the land on the upper surface of the tape is achieved. The insertion pin 31 shown in FIG. 1 includes a needle portion 31a and a flat pad 31b provided at the root portion thereof.

図２のＢＧＡ用ＴＡＢテープは、同様にＴＡＢテープの完成後、差込みピン３２をテープ下面より差込むことによりテープ上面のランドとの導通を図ったものであり、その差込みピン３２は、針部３２ａとその根元部に設けられたボール３２ｂとから成る。   The BGA TAB tape shown in FIG. 2 is designed to be electrically connected to the land on the upper surface of the tape by inserting the insertion pin 32 from the lower surface of the tape after the TAB tape is completed. 32a and a ball 32b provided at the base portion thereof.

上記差込みピン３１，３２の針部３１ａ，３２ａの先端は、針状形状をなし、ポリイミドテープ（絶縁性テープ）２２に容易に差込み可能なようになっている。   The tips of the needle portions 31 a and 32 a of the insertion pins 31 and 32 have a needle shape and can be easily inserted into the polyimide tape (insulating tape) 22.

差込みピンの針部３１ａ，３２ａの寸法（長さ）は、テープ基材厚と接着剤厚を加えた値を超えるものとし、これにより針部の先端位置は上面の銅箔内部もしくは銅箔を越えて反対側に突き出すように設定する。反対側に突き出すタイプのものは、突き出した部分を折り曲げるもしくは潰すことによりテープとの接続を機械的に増すことが可能となる。   The size (length) of the needle portions 31a and 32a of the insertion pin exceeds the value obtained by adding the tape base material thickness and the adhesive thickness, so that the tip position of the needle portion is within the copper foil on the upper surface or the copper foil. Set to protrude beyond the opposite side. The type protruding to the opposite side can mechanically increase the connection with the tape by bending or crushing the protruding portion.

差込みピンの差込み方法としては、１本ずつもしくはパターン全体に対して全ての差込みピンを配列可能な治具を用い、それらを上部に押し上げることによりテープに差込むようにする。その際、ハンダボールランドの剥がれを防ぐために、テープ上面の上から押さえを用いても良い。   As a method for inserting the insertion pins, a jig capable of arranging all the insertion pins one by one or the entire pattern is used, and they are inserted into the tape by pushing them upward. At that time, in order to prevent the solder ball land from peeling off, a presser may be used from above the upper surface of the tape.

図示する如く、差込みピン３１，３２を、テープ下面より差し込むことにより、テープ下面に配列される平面パッド３１ｂもしくはボール３２ｂを、電気配線板との接続パッドもしくはボールとして利用することができる。   As shown in the drawing, by inserting the insertion pins 31 and 32 from the lower surface of the tape, the flat pad 31b or the ball 32b arranged on the lower surface of the tape can be used as a connection pad or a ball to the electric wiring board.

本発明に従い、ポリイミドテープ基材を使用し、ビアホールを形成することなくＢＧＡ用ＴＡＢテープを作製すると共に、これとは別に、平面パッド３１ｂを有する導電性の差込みピン３１を多数本作製した。   In accordance with the present invention, a TAB tape for BGA was produced using a polyimide tape base material without forming a via hole, and separately from this, a large number of conductive insertion pins 31 having a planar pad 31b were produced.

上記ＢＧＡ用ＴＡＢテープの上面の回路パターン上において下面と導通すべき所要の複数位置に対応するように、予め用意した治具に複数の差込みピン３１を配列し、当該治具を上記ＴＡＢテープの下面に向けて押し出し、上記複数の差込みピン３１をＴＡＢテープの下面から一度にテープ内へ差し込んだ。これにより、図１に示す本発明のＢＧＡ用ＴＡＢテープが製造できた。   A plurality of insertion pins 31 are arranged in a jig prepared in advance so as to correspond to a plurality of required positions to be electrically connected to the lower surface on the circuit pattern on the upper surface of the TAB tape for BGA, and the jig is attached to the TAB tape. The plurality of insertion pins 31 were pushed into the tape at a time from the bottom surface of the TAB tape. Thereby, the TAB tape for BGA of this invention shown in FIG. 1 was manufactured.

これと同様に、ボール３２ｂを有する導電性の差込みピン３２を多数本作製し、これを治具に取り付けてＴＡＢテープの下面からテープ内へ差し込むことにより、図２に示す本発明のＢＧＡ用ＴＡＢテープが製造できた。   Similarly, a large number of conductive insertion pins 32 having balls 32b are prepared, and these are attached to a jig and inserted into the tape from the lower surface of the TAB tape, whereby the TAB for BGA of the present invention shown in FIG. The tape was manufactured.

得られた製品のいずれについても、ハンダボールランドとポリイミドテープの剥がれ等の不良は発見されなかった。   In any of the obtained products, no defects such as peeling of the solder ball land and the polyimide tape were found.

なお、上記の実施例では、平面パッドもしくはボールを有する差込みピンを作製、使用したが、パッドやボールを無くし針部のみから成る差込みピンを使用しても導通を図ることが出来る。また、ピンの差込み方向も、テープ下面のみからではなく、上面から差込むことも出来る。   In the above-described embodiment, the insertion pin having a flat pad or a ball is manufactured and used. However, even if the insertion pin made only of the needle portion without the pad or the ball is used, conduction can be achieved. Further, the inserting direction of the pins can be inserted not only from the lower surface of the tape but also from the upper surface.

また、上記実施例では、ポリイミドテープ基板を使用したＴＡＢテープを考えたが、ポリイミドテープ以外の基材（例えばカプトンテープ）への応用も可能である。   Moreover, in the said Example, although the TAB tape which uses a polyimide tape board | substrate was considered, the application to base materials (for example, Kapton tape) other than a polyimide tape is also possible.

本発明は以上の如く構成されるから、本発明によるときは、ポリイミドテープとハンダボールランドとの密着力を低下させることなく、小型で安価なＢＧＡ用ＴＡＢテープが得られる。   Since the present invention is configured as described above, according to the present invention, a small and inexpensive TAB tape for BGA can be obtained without reducing the adhesion between the polyimide tape and the solder ball land.

また、従来のビアホールを有するＢＧＡ用ＴＡＢテープでは、製品仕様によりビアホール径が異なるため、それを加工する際のプレス金型もそれぞれのサイズに合わせて製作する必要があったが、本発明によれば同一ボールピッチサイズであれば１種類のパッド差込用治具を製作し、所要のデザインにパッドの配列をあわせることにより様々な製品に応用できる。   In addition, in the conventional TAB tape for BGA having via holes, the via hole diameter differs depending on the product specifications, so it was necessary to manufacture the press dies when processing them according to the respective sizes. For example, if the ball pitch size is the same, one type of pad insertion jig can be manufactured and applied to various products by matching the arrangement of the pads with the required design.

また、差込みピンの先端がテープ上面と導通をとる際に接触するのは、最低でも当該先端の径のみのランドがあれば良いので、ボールランドの小径化が図れる。これによりランド間に通せる配線本数を増やすことができるためファインピッチ対応が可能となる。   Further, since the tip of the insertion pin contacts with the top surface of the tape only to have a land having at least the diameter of the tip, the diameter of the ball land can be reduced. As a result, the number of wires that can be passed between the lands can be increased, so that a fine pitch can be supported.

また、ＢＧＡ用ＴＡＢテープは薄型化及びファインピッチ化が可能であるが、量産時に金型が必要になることから、これまではリジット基板品が大勢を占めていた。しかしながら、本発明の採用により、ＢＧＡ用ＴＡＢテープ量産化の上で問題になっていた金型製作が必要なくなるため、テープ品の拡販が可能となる。   In addition, the TAB tape for BGA can be thinned and fine pitched. However, since a mold is required for mass production, rigid board products have so far been dominant. However, the adoption of the present invention eliminates the need for mold production, which has been a problem in mass production of TAB tapes for BGA, so that sales of tape products can be expanded.

本発明のＢＧＡ用ＴＡＢテープの一実施例の横断面図を示す。The cross-sectional view of one Example of the TAB tape for BGA of this invention is shown. 本発明のＢＧＡ用ＴＡＢテープのもう１つの実施例の横断面図を示す。The cross-sectional view of another Example of the TAB tape for BGA of this invention is shown. 従来の一般的なＢＧＡ用ＴＡＢテープの横断面図を示す。The cross-sectional view of the conventional common BGA TAB tape is shown.

符号の説明Explanation of symbols

２１ 接着剤
２２ ポリイミドテープ（絶縁性テープ）
２３ 電気配線
２４ ビアホール
２５ 半導体チップ
２６ Ａｕワイヤ
２７ ワイヤボンディングパッド
２８ ハンダボールランド
２９ Ａｕ／Ｎｉメッキ
３０ 銅箔
３１ 差込みピン
３２ 差込みピン 21 Adhesive 22 Polyimide tape (insulating tape)
23 Electrical wiring 24 Via hole 25 Semiconductor chip 26 Au wire 27 Wire bonding pad 28 Solder ball land 29 Au / Ni plating 30 Copper foil 31 Insertion pin 32 Insertion pin

Claims (6)

導電性の差込みピンにより絶縁性テープの上面と下面を導通せしめたことを特徴とするＢＧＡ用ＴＡＢテープ。   A TAB tape for BGA, wherein the upper surface and the lower surface of the insulating tape are made conductive by a conductive insertion pin. 請求項1に記載のＢＧＡ用ＴＡＢテープにおいて、
上記差込みピンの先端が、針状形状もしくは上記絶縁性テープに差込み可能な形状を有することを特徴とするＢＧＡ用ＴＡＢテープ。 In the TAB tape for BGA of Claim 1,
A TAB tape for BGA, wherein the tip of the insertion pin has a needle shape or a shape that can be inserted into the insulating tape. 請求項1に記載のＢＧＡ用ＴＡＢテープにおいて、
上記差込みピンが、絶縁性テープに差し込まれる先端側とは反対側の根元部に平面パッド又はボールを有することを特徴とするＢＧＡ用ＴＡＢテープ。 In the TAB tape for BGA of Claim 1,
A TAB tape for BGA, wherein the insertion pin has a flat pad or a ball at a base portion on the opposite side to the tip side to be inserted into the insulating tape. 請求項1に記載のＢＧＡ用ＴＡＢテープにおいて、
差込みピンがテープ下面より差し込まれテープ上面と導通せしめられたことを特徴とするＢＧＡ用ＴＡＢテープ。 In the TAB tape for BGA of Claim 1,
A TAB tape for BGA, wherein the insertion pin is inserted from the lower surface of the tape and is electrically connected to the upper surface of the tape. ビアホールを形成することなくＢＧＡ用ＴＡＢテープを作製する工程と、
導電性の差込みピンを作製する工程と、
上記ＢＧＡ用ＴＡＢテープの所定箇所に上記差込みピンを差し込み、テープ上面と下面を導通せしめる工程とからなることを特徴とするＢＧＡ用ＴＡＢテープの製造方法。 Producing a TAB tape for BGA without forming a via hole;
Producing a conductive plug pin;
A method for producing a TAB tape for BGA, comprising the step of inserting the insertion pin into a predetermined location of the TAB tape for BGA and conducting the upper surface and the lower surface of the tape. 請求項５に記載のＢＧＡ用ＴＡＢテープの製造方法において、
ＢＧＡ用ＴＡＢテープの所定箇所に差込みピンを差し込む際に、１本以上の差込みピンをセットし得る治具を用いて当該差込み操作を行うことを特徴とするＢＧＡ用ＴＡＢテープの製造方法。 In the manufacturing method of the TAB tape for BGAs of Claim 5,
A method of manufacturing a TAB tape for BGA, wherein the insertion operation is performed using a jig capable of setting one or more insertion pins when inserting the insertion pin into a predetermined portion of the TAB tape for BGA.
JP2004022508A 2004-01-30 2004-01-30 Tab tape for bga and its manufacturing method Pending JP2005217215A (en)

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