JP2005217001A - Bridge prevention liquid of electroless metal plating and manufacturing method of printed wiring board using the same - Google Patents
Bridge prevention liquid of electroless metal plating and manufacturing method of printed wiring board using the same Download PDFInfo
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- JP2005217001A JP2005217001A JP2004019521A JP2004019521A JP2005217001A JP 2005217001 A JP2005217001 A JP 2005217001A JP 2004019521 A JP2004019521 A JP 2004019521A JP 2004019521 A JP2004019521 A JP 2004019521A JP 2005217001 A JP2005217001 A JP 2005217001A
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- wiring board
- plating
- resin
- electroless
- printed wiring
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- 238000007747 plating Methods 0.000 title claims abstract description 65
- 239000007788 liquid Substances 0.000 title claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 230000002265 prevention Effects 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000000126 substance Substances 0.000 claims abstract description 14
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 14
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011593 sulfur Substances 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 9
- 238000001465 metallisation Methods 0.000 claims description 7
- RLDQYSHDFVSAPL-UHFFFAOYSA-L calcium;dithiocyanate Chemical group [Ca+2].[S-]C#N.[S-]C#N RLDQYSHDFVSAPL-UHFFFAOYSA-L 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 239000000243 solution Substances 0.000 description 17
- 229910052759 nickel Inorganic materials 0.000 description 12
- 230000003405 preventing effect Effects 0.000 description 11
- -1 sodium thiosulfate Chemical compound 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 229910017604 nitric acid Inorganic materials 0.000 description 9
- 238000001556 precipitation Methods 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 229920006317 cationic polymer Polymers 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229920002006 poly(N-vinylimidazole) polymer Polymers 0.000 description 4
- 235000002639 sodium chloride Nutrition 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 229920002873 Polyethylenimine Polymers 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 150000003567 thiocyanates Chemical class 0.000 description 3
- 150000003573 thiols Chemical class 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 2
- 235000019345 sodium thiosulphate Nutrition 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 150000003585 thioureas Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- OXFSTTJBVAAALW-UHFFFAOYSA-N 1,3-dihydroimidazole-2-thione Chemical compound SC1=NC=CN1 OXFSTTJBVAAALW-UHFFFAOYSA-N 0.000 description 1
- WGJCBBASTRWVJL-UHFFFAOYSA-N 1,3-thiazolidine-2-thione Chemical compound SC1=NCCS1 WGJCBBASTRWVJL-UHFFFAOYSA-N 0.000 description 1
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 description 1
- YYYOQURZQWIILK-UHFFFAOYSA-N 2-[(2-aminophenyl)disulfanyl]aniline Chemical compound NC1=CC=CC=C1SSC1=CC=CC=C1N YYYOQURZQWIILK-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- GEHMBYLTCISYNY-UHFFFAOYSA-N Ammonium sulfamate Chemical compound [NH4+].NS([O-])(=O)=O GEHMBYLTCISYNY-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 description 1
- FULZLIGZKMKICU-UHFFFAOYSA-N N-phenylthiourea Chemical compound NC(=S)NC1=CC=CC=C1 FULZLIGZKMKICU-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- SOIFLUNRINLCBN-UHFFFAOYSA-N ammonium thiocyanate Chemical compound [NH4+].[S-]C#N SOIFLUNRINLCBN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910001504 inorganic chloride Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000005440 nitrobenzoic acid derivatives Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 1
- 229940116357 potassium thiocyanate Drugs 0.000 description 1
- BTAAXEFROUUDIL-UHFFFAOYSA-M potassium;sulfamate Chemical compound [K+].NS([O-])(=O)=O BTAAXEFROUUDIL-UHFFFAOYSA-M 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- WHMDPDGBKYUEMW-UHFFFAOYSA-N pyridine-2-thiol Chemical compound SC1=CC=CC=N1 WHMDPDGBKYUEMW-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- VGTPCRGMBIAPIM-UHFFFAOYSA-M sodium thiocyanate Chemical compound [Na+].[S-]C#N VGTPCRGMBIAPIM-UHFFFAOYSA-M 0.000 description 1
- QDWYPRSFEZRKDK-UHFFFAOYSA-M sodium;sulfamate Chemical compound [Na+].NS([O-])(=O)=O QDWYPRSFEZRKDK-UHFFFAOYSA-M 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical class S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 description 1
- DLFVBJFMPXGRIB-UHFFFAOYSA-N thioacetamide Natural products CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本発明は、無電解金属めっきのブリッジ防止液に関し、更に詳細には、プリント配線板上の銅回路パターン上に、更に無電解金属めっきを行う際に、めっきが必要とされない樹脂表面への無電解金属めっきの析出を防止するためのブリッジ防止液およびこれを用いたプリント配線板の製造方法に関する。 The present invention relates to an anti-electrolytic metal plating bridging prevention liquid. More specifically, the present invention relates to a non-electrolytic metal plating on a copper circuit pattern on a printed wiring board. The present invention relates to an anti-bridge solution for preventing deposition of electrolytic metal plating and a method for manufacturing a printed wiring board using the same.
プリント配線板の製造工程において、積層樹脂上に回路を形成する場合は、樹脂基材上全面に無電解銅めっきをつけ、さらに電気銅めっきで１０〜２０μｍの銅層を形成した後にレジストを使用して不要な銅皮膜をエッチングすることにより回路を形成するという方法がとられている。そして、樹脂上に無電解銅めっきを析出させるために、前処理として樹脂表面にパラジウム触媒を付着させる工程がとられているが、回路形成後の樹脂表面は、下地の無電解銅めっき層がエッチングにより除去されていても、微量ながらパラジウム等の金属析出触媒が残留している場合が多い。 In the printed wiring board manufacturing process, when a circuit is formed on a laminated resin, electroless copper plating is applied to the entire surface of the resin substrate, and a resist is used after forming a copper layer of 10 to 20 μm by electrolytic copper plating. Then, a method of forming a circuit by etching an unnecessary copper film is employed. And, in order to deposit the electroless copper plating on the resin, a step of attaching a palladium catalyst to the resin surface as a pretreatment is taken, but the resin surface after the circuit is formed has an underlying electroless copper plating layer. Even if it is removed by etching, a metal deposition catalyst such as palladium remains in a small amount in many cases.
一方、プリント配線板製造の最終工程では、端子部分や部品の実装部分に金メッキを行う場合があるが、銅線上に直接金メッキを行うと、析出した金が銅層中に拡散してしまうため、通常は銅層上に下地めっきとして無電解ニッケルめっきを行い、その上に金メッキを行うことが多い。しかし、この無電解ニッケルめっきの際に、樹脂表面上にもめっきが析出し、回路配線が短絡してしまうブリッジと呼ばれる不良が発生する場合があった。このブリッジの主原因の１つは、樹脂上へのパラジウム等の金属析出触媒（以下、「触媒」という）の残留であるが、無電解ニッケルめっき自体の特性も原因となっている。具体的にはめっき析出反応時に発生する水素による還元作用や、ニッケルめっき皮膜が横へ広がりやすいという性質等が挙げられる。近年配線パターンの細線化、高密度化進んだため、ブリッジが発生しやすくなっており、特に次世代の製品ではさらに高密度となるため、ブリッジ防止が大きな課題となっている。 On the other hand, in the final process of printed wiring board production, there are cases where gold plating is performed on the terminal part and the mounting part of the component, but if gold plating is performed directly on the copper wire, the deposited gold diffuses into the copper layer, Usually, electroless nickel plating is often performed as a base plating on a copper layer, and gold plating is often performed thereon. However, during this electroless nickel plating, there is a case where a defect called a bridge occurs in which plating is deposited on the resin surface and the circuit wiring is short-circuited. One of the main causes of this bridge is a residue of a metal deposition catalyst such as palladium (hereinafter referred to as “catalyst”) on the resin, which is also caused by the characteristics of the electroless nickel plating itself. Specifically, there are a reduction action by hydrogen generated during the plating precipitation reaction, a property that the nickel plating film tends to spread sideways, and the like. In recent years, since the wiring patterns have been made thinner and higher in density, bridges are more likely to occur. Especially in the next generation products, the density is further increased, and thus bridge prevention is a major issue.
これまでパラジウム等の触媒によるブリッジを防止する技術としては、触媒が付着している表層の樹脂ごと除去するというものが多く、例えば、過マンガン酸処理、プラズマ処理、オゾン処理を行う方法（特許文献１）、レーザー照射による方法（特許文献２）が知られている。しかし、これらの方法では、コストがかかる上に、触媒に起因するブリッジは防止できても、ニッケルめっき自体の特性によるブリッジは防止できなかった。 Conventionally, as a technique for preventing bridging by a catalyst such as palladium, there are many techniques for removing the resin on the surface layer to which the catalyst is attached. For example, a method of performing permanganic acid treatment, plasma treatment, ozone treatment (Patent Document) 1) A method by laser irradiation (Patent Document 2) is known. However, these methods are costly and can prevent bridging due to the catalyst, but cannot prevent bridging due to the characteristics of the nickel plating itself.
一方、ニッケルめっき自体の特性によるブリッジを防止するものとしては、チオ硫酸ナトリウムを主剤とする無電解ニッケルめっき用前処理液（特許文献３）が知られているが、その効果は弱く、現行では高密度とされるライン／スペース（Ｌ／Ｓ）＝５０／５０の配線パターンに対してブリッジを防止することはできなかった。 On the other hand, as a means for preventing bridging due to the characteristics of nickel plating itself, a pretreatment liquid for electroless nickel plating (Patent Document 3) mainly composed of sodium thiosulfate is known, but its effect is weak and currently Bridging could not be prevented with respect to a wiring pattern of line / space (L / S) = 50/50, which is considered to be high density.
本発明の課題は、複雑な装置や操作を必要とすることなしに、回路パターン形成後に行う無電解金属めっきが、配線基板の樹脂上に析出するブリッジを防止することのできる技術を提供することにある。 An object of the present invention is to provide a technique capable of preventing a bridge in which electroless metal plating performed after forming a circuit pattern is deposited on a resin of a wiring board without requiring a complicated apparatus or operation. It is in.
本発明者らは上記課題を解決するために鋭意研究した結果、上記無電解金属めっきを行う前に、含イオウ有機物を含有する溶液を配線基板の樹脂上に作用させることにより、ブリッジが防止できることを見出した。また、本発明者らは前記含イオウ有機物を含有する溶液を作用させる前に、触媒除去液を作用させることにより、より高密度な配線間であってもブリッジの発生が防げることを見出し、本発明を完成した。 As a result of diligent research to solve the above problems, the inventors of the present invention can prevent bridging by allowing a solution containing a sulfur-containing organic substance to act on the resin of the wiring board before performing the electroless metal plating. I found. Further, the present inventors have found that by causing the catalyst removal solution to act before the solution containing the sulfur-containing organic substance is acted on, the occurrence of bridging can be prevented even between denser wirings. Completed the invention.
すなわち、本発明は含イオウ有機物を含有することを特徴とする無電解金属めっきのブリッジ防止液を提供するものである。 That is, this invention provides the bridge | bridging prevention liquid of the electroless metal plating characterized by containing a sulfur containing organic substance.
また、本発明は配線基板の樹脂上に金属析出触媒を付与後、無電解銅めっきを行い、その後電気銅めっきを行い、次いで不要な銅皮膜をエッチングすることにより回路パターンを形成し、その回路上に無電解金属めっきを行うプリント配線板の製造方法において、前記エッチングと無電解金属めっき工程の間に、配線基板の樹脂上に上記のブリッジ防止液を作用させることを特徴とするプリント配線板の製造方法を提供するものである。 Also, the present invention provides a circuit pattern by applying a metal deposition catalyst on a resin of a wiring board, performing electroless copper plating, then performing electrolytic copper plating, and then etching an unnecessary copper film. In the printed wiring board manufacturing method for performing electroless metal plating on the printed wiring board, the bridge prevention liquid is allowed to act on the resin of the wiring board between the etching and the electroless metal plating step. The manufacturing method of this is provided.
更に、配線基板の樹脂上に金属析出触媒を付与後、無電解銅めっきを行い、その後電気銅めっきを行い、次いで不要な銅皮膜をエッチングすることにより回路パターンを形成し、その回路上に無電解金属めっきを行うプリント配線板の製造方法において、前記エッチングと無電解金属めっき工程の間に、配線基板の樹脂上に触媒除去液を作用させた後、更に上記のブリッジ防止液を作用させることを特徴とするプリント配線板の製造方法を提供するものである。 Furthermore, after providing a metal deposition catalyst on the resin of the wiring board, electroless copper plating is performed, and then electrolytic copper plating is performed, and then an unnecessary copper film is etched to form a circuit pattern. In the method of manufacturing a printed wiring board for performing electrolytic metal plating, after the catalyst removing liquid is applied on the resin of the wiring board between the etching and the electroless metal plating process, the above bridge prevention liquid is further applied. A printed wiring board manufacturing method characterized by the above is provided.
本発明の無電解金属めっきのブリッジ防止液は、複雑な装置や操作を行わなくとも、回路パターン形成後の無電解金属めっきが配線基板の樹脂上に析出するのを防止することができる。 The electroless metal plating bridging prevention liquid of the present invention can prevent the electroless metal plating after the formation of the circuit pattern from being deposited on the resin of the wiring board without performing a complicated apparatus or operation.
従って、本発明の無電解金属めっきのブリッジ防止液をプリント配線板の製造に利用することにより、ブリッジの生じることのないプリント配線板を製造することができる。 Therefore, by using the electroless metal plating bridging prevention liquid of the present invention for the production of a printed wiring board, a printed wiring board free from bridging can be produced.
更に、上記プリント配線板の製造において、本発明の無電解金属めっきのブリッジ防止液に加えて触媒除去液を併用することにより、より高密度な配線間であってもブリッジの生じることのないプリント配線板を製造することができる。 Furthermore, in the production of the printed wiring board, by using a catalyst removing liquid in combination with the bridge preventing liquid for electroless metal plating according to the present invention, a printed circuit that does not cause bridging even between higher density wirings. A wiring board can be manufactured.
本発明の無電解金属めっきのブリッジ防止液（以下、「防止液」という）に使用される含イオウ有機物としては、化合物中に硫黄原子と炭素原子を含むものであれば、特に制限されないが、チオ硫酸ナトリウム等の硫黄を含んでいても炭素原子を含まないものは含まれない。このような含イオウ有機物としてはチオ尿素誘導体、チオール類、スルフィド、チオシアン酸塩類、スルファミン酸またはその塩類が挙げられる。 The sulfur-containing organic substance used in the bridge preventing solution for electroless metal plating of the present invention (hereinafter referred to as “preventing solution”) is not particularly limited as long as it contains a sulfur atom and a carbon atom in the compound, Even if it contains sulfur such as sodium thiosulfate, it does not contain carbon atoms. Examples of such sulfur-containing organic substances include thiourea derivatives, thiols, sulfides, thiocyanates, sulfamic acids or salts thereof.
このうち、チオ尿素誘導体の具体例としては、チオ尿素、ジエチルチオ尿素、テトラメチルチオ尿素、１−フェニル−２−チオ尿素、チオアセトアミドが挙げられる。また、チオール類としては２−メルカプトイミダゾール、２−メルカプトチアゾリン、３−メルカプト−１，２，４−トリアゾール、メルカプトベンゾイミダゾール、メルカプトベンゾキサゾール、メルカプトベンゾチアゾール、メルカプトピリジンが挙げられる。更に、スルフィドとしては、２−アミノフェニルジスルフィド、テトラメチルチウラムジスルフィド、チオジグリコール酸が挙げられる。 Among these, specific examples of thiourea derivatives include thiourea, diethylthiourea, tetramethylthiourea, 1-phenyl-2-thiourea, and thioacetamide. Examples of thiols include 2-mercaptoimidazole, 2-mercaptothiazoline, 3-mercapto-1,2,4-triazole, mercaptobenzimidazole, mercaptobenzoxazole, mercaptobenzothiazole, and mercaptopyridine. Furthermore, examples of the sulfide include 2-aminophenyl disulfide, tetramethylthiuram disulfide, and thiodiglycolic acid.
また、チオシアン酸塩類としては、チオシアン酸ナトリウム、チオシアン酸カリウム、チオシアン酸アンモニウムが挙げられる。また更に、スルファミン酸またはその塩類としては、スルファミン酸、スルファミン酸アンモニウム、スルファミン酸ナトリウム、スルファミン酸カリウムが挙げられる。 Examples of the thiocyanates include sodium thiocyanate, potassium thiocyanate, and ammonium thiocyanate. Still further, examples of sulfamic acid or salts thereof include sulfamic acid, ammonium sulfamate, sodium sulfamate, and potassium sulfamate.
これらの含イオウ有機物のうち、メルカプト基を有するチオール類またはチオシアン基を有するチオシアン酸塩類が好ましい。本発明防止液における含イオウ有機物の濃度は、０.１〜１００ｇ／Ｌが好ましく、特に０.２〜５０ｇ／Ｌが好ましい。 Of these sulfur-containing organic substances, thiols having a mercapto group or thiocyanates having a thiocyan group are preferable. The concentration of the sulfur-containing organic substance in the present prevention liquid is preferably 0.1 to 100 g / L, particularly preferably 0.2 to 50 g / L.
また、本発明防止液には、上記含イオウ有機物の溶解性を向上させるために、あるいは浸透性の向上等よる析出防止効果の向上のために、硫酸、塩酸、リン酸等の無機酸、水酸化ナトリウム、水酸化カリウム等のアルカリ塩類、アルコール、エーテル、ケトン等の有機溶媒、アルキル硫酸化ナトリウム、ポリオキシエチレンアルキルエーテル等の界面活性剤を本発明防止液の効果を損なわない程度で添加しても良い。 In addition, the present preventive liquid contains an inorganic acid such as sulfuric acid, hydrochloric acid, phosphoric acid, water, etc. in order to improve the solubility of the above-mentioned sulfur-containing organic matter or to improve the precipitation preventing effect by improving the permeability. An alkali salt such as sodium oxide and potassium hydroxide, an organic solvent such as alcohol, ether and ketone, and a surfactant such as sodium alkyl sulfate and polyoxyethylene alkyl ether are added to such an extent that the effect of the inhibitor solution of the present invention is not impaired. May be.
斯くして得られる本発明防止液の使用は、配線基板の樹脂上に金属析出触媒を付与後、無電解銅めっきを行い、その後電気銅めっきを行い、次いで不要な銅皮膜を例えば、レジスト等を使用してエッチングすることにより回路パターンを形成し、その回路上に無電解金属めっきを行うプリント配線板の製造方法において、最外層に端子部分を形成するために無電解ニッケルめっきや無電解金めっき等の無電解金属めっきを行う前、すなわち、前記エッチングと無電解金属めっき工程の間に、配線基板の樹脂上に作用させることにより行われる。これにより、高密度な配線間であってもブリッジが防止されたプリント配線板を製造することができる。 The use of the thus obtained prevention liquid of the present invention is to provide a metal deposition catalyst on the resin of the wiring board, then perform electroless copper plating, then perform electrolytic copper plating, and then apply an unnecessary copper film, for example, a resist or the like In a method for manufacturing a printed wiring board in which a circuit pattern is formed by etching using electroless plating and electroless metal plating is performed on the circuit, electroless nickel plating or electroless gold is used to form a terminal portion on the outermost layer. It is carried out by allowing the resin to act on the resin of the wiring board before performing electroless metal plating such as plating, that is, between the etching and the electroless metal plating process. As a result, a printed wiring board in which bridging is prevented even between high-density wirings can be manufactured.
本発明防止液を上記配線基板の樹脂上に作用させるには、配線基板そのものを本発明防止液に浸漬するか、配線基板の樹脂上に本発明防止液をスプレー等により噴射すればよい。また、本発明防止液の使用条件は、浸漬、スプレーとも、１０〜５０℃の液温で、１０秒〜５分作用させることが好ましい。 In order for the present invention preventing liquid to act on the resin of the wiring board, the wiring board itself may be immersed in the present invention preventing liquid, or the present invention preventing liquid may be sprayed onto the resin of the wiring board by spraying or the like. Moreover, as for the use conditions of this invention prevention liquid, it is preferable to make it act for 10 second-5 minutes at the liquid temperature of 10-50 degreeC also for immersion and a spray.
また、上記のように本発明防止液を配線基板の樹脂上に作用させる前に、触媒除去液を作用させることにより、より高密度な配線間（Ｌ／Ｓ（ライン／スペース）＝３０／３０μｍ以下）であってもブリッジが防止されたプリント配線板を製造することができる。 Further, by applying the catalyst removing liquid before the anti-inhibition liquid of the present invention is applied to the resin of the wiring board as described above, a higher density between the wirings (L / S (line / space) = 30/30 μm). Even below, a printed wiring board in which bridging is prevented can be manufactured.
ここで、触媒除去液とは、無電解銅めっき等に使用されるパラジウム等の触媒を配線基板の樹脂から除去することができるものである。このような触媒除去液としては、特開平７−２０７４６６号公報に記載されているシアン化物、ニトロ安息香酸誘導体を主成分とするものや、特開２００１−３３９１４２号公報に記載されている硝酸、塩素イオンを主成分とし、含窒素複素環化合物、多価アルコール、非イオン界面活性剤、カチオン系界面活性剤のうち１種以上を添加したもの等の公知のものを特に制限なく利用することができる。これらの公知の触媒除去液は公知の方法により樹脂に作用させればよい。 Here, the catalyst removing liquid is a liquid that can remove a catalyst such as palladium used for electroless copper plating or the like from the resin of the wiring board. Examples of such a catalyst removing liquid include cyanides described in JP-A-7-207466, those mainly composed of nitrobenzoic acid derivatives, nitric acid described in JP-A-2001-339142, It is possible to use, without particular limitation, known ones such as those containing chlorine ions as a main component and containing one or more of nitrogen-containing heterocyclic compounds, polyhydric alcohols, nonionic surfactants, and cationic surfactants. it can. These known catalyst removal solutions may be applied to the resin by a known method.
また、触媒除去液として、本発明者らが見出した、硝酸、塩素イオンおよびカチオン性ポリマーを含有することを特徴とする触媒除去液も使用することができる。 Moreover, the catalyst removal liquid which contains the nitric acid, the chlorine ion, and cationic polymer which the present inventors discovered as a catalyst removal liquid can also be used.
この触媒除去液における硝酸の含有量は、６７.５％硝酸として５０〜５００ｍＬ／Ｌが好ましく、特に１００〜４００ｍＬ／Ｌが好ましい。硝酸の含有量が５０ｍＬ／Ｌより少ないと触媒の除去効果がほとんど得られない。また、５００ｍＬ／Ｌより多いと触媒の除去効果が向上しないだけではなく、回路を形成した銅に対する溶解性も大きくなってしまう。 The content of nitric acid in this catalyst removal liquid is preferably 50 to 500 mL / L, particularly preferably 100 to 400 mL / L as 67.5% nitric acid. If the nitric acid content is less than 50 mL / L, the catalyst removal effect is hardly obtained. Moreover, when it exceeds 500 mL / L, not only the removal effect of a catalyst will not improve, but the solubility with respect to the copper which formed the circuit will also become large.
また、この触媒除去液における塩素イオンの供給源は、硝酸溶液中で溶解して液中に塩素イオンを生成させるもので、かつ触媒の除去能力に影響を及ぼさないものならば特に制限無く使用することができる。しかしながら、この触媒除去液は高濃度の硝酸を含むため、硝酸に対して安定な無機物の方が好ましい。このような無機物としては、塩酸または塩化ナトリウム、塩化カリウム、塩化アンモニウム、塩化銅、塩化鉄、塩化ニッケル、塩化コバルト、塩化スズ、塩化亜鉛、塩化リチウム等の無機塩化物が挙げられる。これらの無機物のうち、塩酸、塩化ナトリウムが好ましい。上記塩素イオンの含有量は、塩素イオンとして１〜６０ｇ／Ｌが好ましく、特に５〜５０ｇ／Ｌが好ましい、塩素イオンの含有量が１ｇ／Ｌより少ないと触媒の除去効果がほとんど得られない。また、６０ｇ／Ｌより多いと触媒の除去効果は向上しない。 The source of chlorine ions in the catalyst removal liquid is one that dissolves in a nitric acid solution to generate chlorine ions in the liquid and does not particularly affect the removal ability of the catalyst. be able to. However, since this catalyst removal solution contains a high concentration of nitric acid, an inorganic material that is stable against nitric acid is preferred. Examples of such inorganic substances include inorganic chlorides such as hydrochloric acid or sodium chloride, potassium chloride, ammonium chloride, copper chloride, iron chloride, nickel chloride, cobalt chloride, tin chloride, zinc chloride, and lithium chloride. Of these inorganic substances, hydrochloric acid and sodium chloride are preferred. The chlorine ion content is preferably 1 to 60 g / L, particularly preferably 5 to 50 g / L as chlorine ion. When the chlorine ion content is less than 1 g / L, the catalyst removal effect is hardly obtained. On the other hand, if it exceeds 60 g / L, the catalyst removal effect is not improved.
更に、この触媒除去液に添加されるカチオン性ポリマーは、回路パターンを形成する銅の溶解性を抑制するための成分である。このようなカチオン性ポリマーとしては、硝酸、塩素イオン含有する液に対して十分な溶解性があるものが好ましく、具体的にはポリエチレンイミン（ＰＥＩ）、ポリアミンスルホン（ＰＡＳ）、ポリビニルイミダゾール（ＰＶＩ）が挙げられる、より具体的なカチオン性ポリマーとしてはポリエチレンイミンであれば、エポミン（日本触媒（株）製）が挙げられ、ポリアミンスルホンであれば、ＰＡＳ（日東紡績（株）製）が挙げられ、ポリビニルイミダゾールであれば、ＢＡＳＴＲＯＮＩＣ
ＰＶＩ（ＢＡＳＦ製）が挙げられる。上記カチオン性ポリマーの含有量は０.０１〜５０ｇ／Ｌが好ましく、特に０.０５〜２０ｇ／Ｌが好ましい。カチオン性ポリマーの含有量が０.０１ｇ／Ｌより少ないと銅に対する溶解性を低下させる効果がほとんどなく、５０ｇ／Ｌより多いと銅に対する溶解性を低下させる効果が無いばかりでなく触媒の除去効果も低下する。
Furthermore, the cationic polymer added to the catalyst removal solution is a component for suppressing the solubility of copper forming the circuit pattern. As such a cationic polymer, those having sufficient solubility in a liquid containing nitric acid and chlorine ions are preferable. Specifically, polyethyleneimine (PEI), polyaminesulfone (PAS), and polyvinylimidazole (PVI). More specific cationic polymers include polyethyleneimine, epomin (manufactured by Nippon Shokubai Co., Ltd.), and polyamine sulfone, PAS (manufactured by Nitto Boseki Co., Ltd.). If it is polyvinyl imidazole, BASTRONIC
PVI (made by BASF) is mentioned. The content of the cationic polymer is preferably from 0.01 to 50 g / L, particularly preferably from 0.05 to 20 g / L. When the content of the cationic polymer is less than 0.01 g / L, there is almost no effect of lowering the solubility in copper, and when it is more than 50 g / L, there is not only an effect of lowering the solubility in copper but also the catalyst removal effect. Also decreases.
更にまた、この触媒除去液には上記成分の他、触媒の除去に影響を与えない量で樹脂や銅への浸透性や濡れ性の向上のために通常用いられる界面活性剤やＮＯｘ抑制剤を添加することもできる。界面活性剤としてはノニオン系のものが好ましく、具体的にはポリオキシエチレン・ポリオキシプロピレン共重合体、ポリオキシエチレンアルキルエーテルの構造のものが挙げられ、その添加量は１〜１０ｇ／Ｌが好ましい。また、ＮＯｘ抑制剤としては尿素、スルファミン酸が挙げられ、添加量は１〜１０ｇ／Ｌが好ましい。 Furthermore, this catalyst removal liquid addition to the above components in an amount that does not affect the removal of the catalyst to the resin and copper permeability and wettability surfactants commonly used for improving and NO x suppressing agent Can also be added. Nonionic surfactants are preferred as surfactants, and specific examples include polyoxyethylene / polyoxypropylene copolymers and polyoxyethylene alkyl ether structures, and the addition amount is 1 to 10 g / L. preferable. Examples of the NO x inhibitor include urea and sulfamic acid, and the addition amount is preferably 1 to 10 g / L.
この触媒除去液を本発明防止液に先立ち配線基板の樹脂に作用させるには、配線基板そのものをこの触媒除去液に浸漬するか、配線基板の樹脂上に触媒除去液をスプレー等により噴射すればよい。浸漬、スプレーとも、１０〜５０℃の液温で、３０秒〜３分作用させることが好ましい。 In order for this catalyst removal liquid to act on the resin of the wiring board prior to the prevention liquid of the present invention, the wiring board itself is immersed in this catalyst removal liquid or the catalyst removal liquid is sprayed onto the resin of the wiring board by spraying or the like. Good. Both immersion and spraying are preferably performed at a liquid temperature of 10 to 50 ° C. for 30 seconds to 3 minutes.
以下、実施例を挙げて本発明を更に詳細に説明するが、本発明はこれらの実施例に何ら制約されるものではない。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not restrict | limited at all by these Examples.
実 施 例 １
ブリッジ防止試験（１）：
銅張積層板（コア材：ＭＣＬ−Ｅ６７、日立化成工業（株）製）上の銅箔を硫酸２００ｍＬ／Ｌおよび過酸化水素１５０ｍＬ／Ｌからなる水溶液により剥離した樹脂基材を用い、これをセミアディティブ法により処理し、ライン／スペース（Ｌ／Ｓ）＝２０／２０、３０／３０、５０／５０、７５／７５（μｍ）の４種類の銅配線パターンを有する試験片を作製した。
Example 1
Bridge prevention test (1):
Using a resin base material obtained by peeling a copper foil on a copper clad laminate (core material: MCL-E67, manufactured by Hitachi Chemical Co., Ltd.) with an aqueous solution of 200 mL / L sulfuric acid and 150 mL / L hydrogen peroxide, The test piece which processed by the semi-additive method and has four types of copper wiring patterns of line / space (L / S) = 20/20, 30/30, 50/50, 75/75 (micrometer) was produced.
下記表１に示す各ブリッジ防止液を３０℃に加温し、これに各試験片を１分間浸漬した。その後、これらの各試験片に対し、下記工程の無電解ニッケルめっきを施した。各試験片のパターン間のめっき析出状態を調べ、下記評価基準により評価した。また、ブリッジ防止液に浸漬しなかった試験片についても同様にめっき析出状態を調べ、同様に評価した。その結果を表２に示す。 Each bridge prevention liquid shown in the following Table 1 was heated to 30 ° C., and each test piece was immersed in this for 1 minute. Then, the electroless nickel plating of the following process was performed with respect to each of these test pieces. The plating deposition state between the patterns of each test piece was examined and evaluated according to the following evaluation criteria. Moreover, the plating precipitation state was similarly investigated about the test piece which was not immersed in the bridge | bridging prevention liquid, and it evaluated similarly. The results are shown in Table 2.
＜無電解ニッケルめっき工程＞
触媒付与（ＰＢ−３００）、３０℃、３分
↓
水洗
↓
無電解ニッケルめっき（エニパックＡＣ−ＤＸ）、８５℃、２０分
（薬品は何れも荏原ユージライト（株）製）
<Electroless nickel plating process>
Catalyst application (PB-300), 30 ° C, 3 minutes ↓
Washing with water ↓
Electroless nickel plating (Enipack AC-DX), 85 ° C, 20 minutes
(All chemicals are manufactured by Ebara Eugleite Co., Ltd.)
＜めっき析出状態の評価基準＞
（評 価） （状 態）
◎ ： ほとんど析出がない
○ ： 部分的に析出がある（短絡はなし）
× ： 析出が多い（短絡がある）
×× ： 全面的に析出がある
<Evaluation criteria for plating deposition state>
(Evaluation) (State)
◎: Almost no precipitation ○: Partial precipitation (no short circuit)
×: A lot of precipitation (there is a short circuit)
XX: Precipitation is entirely present
以上の結果より、本発明のブリッジ防止液は狭い線間でもブリッジが生じない優れたものであった。 From the above results, the bridging prevention liquid of the present invention was excellent in that no bridging occurs even between narrow lines.
実 施 例 ２
ブリッジ防止試験（２）：
実施例１と同様に作製した各試験片を、下記表３に示す組成の各触媒除去液を３０℃に加温したものに１分間浸漬した。次いで、この各試験片を実施例１と同様に各ブリッジ防止液に浸漬した後、無電解ニッケルめっきを施した。これらの各試験片について実施例１と同様にパターン間のめっき析出状態を調べ、同様に評価した。その結果を表４に示す。
Example 2
Bridge prevention test (2):
Each test piece prepared in the same manner as in Example 1 was immersed for 1 minute in a solution obtained by heating each catalyst removal solution having the composition shown in Table 3 below to 30 ° C. Next, each test piece was dipped in each bridging prevention solution in the same manner as in Example 1, and then subjected to electroless nickel plating. About these each test piece, the plating precipitation state between patterns was investigated similarly to Example 1, and it evaluated similarly. The results are shown in Table 4.
以上の結果より、本発明のブリッジ防止液は、触媒除去液と組み合わせて使用することにより、ブリッジ防止液単独の場合より狭い線間でもブリッジが生じない優れたものであった。 From the above results, the anti-bridging solution of the present invention was excellent in that no bridging occurs even between narrower lines than in the case of the anti-bridging solution alone when used in combination with the catalyst removal solution.
本発明防止液は、回路パターン形成後の配線基板の樹脂上への不必要な無電解金属めっきの析出を防止することができるものものである。 The prevention liquid of the present invention can prevent unnecessary deposition of electroless metal plating on the resin of the wiring board after the circuit pattern is formed.
従って、本発明防止液は、より高密度な配線パターンが要求される多層プリント配線板の製造方法に利用することができる。
以 上
Therefore, this invention prevention liquid can be utilized for the manufacturing method of a multilayer printed wiring board by which a higher-density wiring pattern is requested | required.
that's all
Claims (5)
After providing a metal deposition catalyst on the resin of the wiring board, electroless copper plating is performed, then electrolytic copper plating is performed, and then an unnecessary copper film is etched to form a circuit pattern, and the electroless metal is formed on the circuit. 4. The method of manufacturing a printed wiring board for performing plating, further comprising: applying a catalyst removing solution on the resin of the wiring board between the etching and the electroless metal plating step, and further comprising any one of claims 1 to 3. A method for producing a printed wiring board, wherein the anti-bridging liquid according to any one of the above items is allowed to act.
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| JP2004019521A JP4351079B2 (en) | 2004-01-28 | 2004-01-28 | Electroless metal plating anti-bridging solution and method for producing printed wiring board using the same |
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| JP2004019521A JP4351079B2 (en) | 2004-01-28 | 2004-01-28 | Electroless metal plating anti-bridging solution and method for producing printed wiring board using the same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013204107A (en) * | 2012-03-29 | 2013-10-07 | Kanto Gakuin | Electroless plating method and wiring board |
| US8872692B2 (en) | 2010-09-15 | 2014-10-28 | Industry-Academic Cooperation Foundation, Yonsei University | Distance measuring device and receiving devices thereof |
| WO2014203649A1 (en) * | 2013-06-18 | 2014-12-24 | 株式会社Ｊｃｕ | Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same |
-
2004
- 2004-01-28 JP JP2004019521A patent/JP4351079B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8872692B2 (en) | 2010-09-15 | 2014-10-28 | Industry-Academic Cooperation Foundation, Yonsei University | Distance measuring device and receiving devices thereof |
| JP2013204107A (en) * | 2012-03-29 | 2013-10-07 | Kanto Gakuin | Electroless plating method and wiring board |
| WO2014203649A1 (en) * | 2013-06-18 | 2014-12-24 | 株式会社Ｊｃｕ | Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same |
| CN105264114A (en) * | 2013-06-18 | 2016-01-20 | 株式会社杰希优 | Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same |
| TWI586831B (en) * | 2013-06-18 | 2017-06-11 | Jcu Corp | A bridging liquid for preventing electroless metal plating, and a method of manufacturing the printed wiring board using the same |
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| JP4351079B2 (en) | 2009-10-28 |
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