JP2005204151A - Patch antenna - Google Patents

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JP2005204151A
JP2005204151A JP2004009418A JP2004009418A JP2005204151A JP 2005204151 A JP2005204151 A JP 2005204151A JP 2004009418 A JP2004009418 A JP 2004009418A JP 2004009418 A JP2004009418 A JP 2004009418A JP 2005204151 A JP2005204151 A JP 2005204151A
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patch antenna
dielectric substrate
hole
holes
pin
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JP3983224B2 (en
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Masaru Yomo
勝 四方
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a patch antenna capable of easily ensuring desired antenna performance by feeding power to an optimum feeding point, even if dispersion exists in the mounting environment and parts material. <P>SOLUTION: The patch antenna 11 is configured mainly with a dielectric board 12, including a plurality of through-holes 12a to 12c formed to its plurality of positions; a radiative conductor 13 provided on the upper side of the dielectric board 12; a ground conductor 14 provided on the bottom side of the dielectric board 12; and a feed pin 15 penetrating through the dielectric board 12 and connected to the feed point of the radiative conductor 13, and the feed pin 15 is inserted in one of the through-holes 12a to 12c. That is, not only is the through-hole 12b provided in matching with the feed point discriminated as being optimal in the design stage, but also the other through-holes 12b, 12c are formed in the vicinity of the through-hole 12b. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、誘電体基板の片面に設けられた放射導体が給電ピンによって給電されるパッチアンテナに係り、特に、車載用として好適なパッチアンテナに関する。   The present invention relates to a patch antenna in which a radiating conductor provided on one surface of a dielectric substrate is fed by a feed pin, and more particularly to a patch antenna suitable for in-vehicle use.

近年、小型薄型化に好適な誘電体アンテナとしてパッチアンテナの需要が高まっており、その一例として図３の断面図に示すような構造のパッチアンテナが従来より知られている（例えば、特許文献１参照）。同図に示すパッチアンテナ１は、セラミック等の誘電体材料からなる誘電体基板２と、誘電体基板２の上面に設けられた放射導体（パッチ電極）３と、誘電体基板２の底面に設けられた接地導体（裏面電極）４と、誘電体基板２を貫通して放射導体３の給電点に接続された給電ピン５とによって主に構成されている。   In recent years, the demand for patch antennas as dielectric antennas suitable for miniaturization and thinning has increased, and as an example, a patch antenna having a structure as shown in the cross-sectional view of FIG. 3 has been conventionally known (for example, Patent Document 1). reference). The patch antenna 1 shown in FIG. 1 is provided on a dielectric substrate 2 made of a dielectric material such as ceramic, a radiation conductor (patch electrode) 3 provided on the top surface of the dielectric substrate 2, and a bottom surface of the dielectric substrate 2. The grounding conductor (back electrode) 4 and the feeding pin 5 that penetrates the dielectric substrate 2 and is connected to the feeding point of the radiation conductor 3 are mainly configured.

誘電体基板２には、給電点と対応する位置に給電ピン５を挿通させるための貫通孔２ａが設けられている。放射導体３と接地導体４は、銅箔等の良導電性金属からなり、エッチング加工等によってそれぞれ所定形状に形成されている。放射導体３は矩形や円形等の適宜形状に形成されており、円偏波アンテナとして動作させる場合、必要に応じて放射導体３に縮退分離素子が装荷される。接地導体４は、貫通孔２ａの周縁部を除いて誘電体基板２の底面のほぼ全面に形成されている。給電ピン５は良導電性の金属ピンであって、その上端部（頭部）は放射導体３に半田付けされている。また、給電ピン５の下端部は、接地導体４とは絶縁されて誘電体基板２の下方へ突出し、図示せぬ給電回路のランド部に半田付けされている。   The dielectric substrate 2 is provided with a through hole 2a for inserting the power supply pin 5 at a position corresponding to the power supply point. The radiation conductor 3 and the ground conductor 4 are made of a highly conductive metal such as a copper foil, and are formed in a predetermined shape by etching or the like. The radiation conductor 3 is formed in an appropriate shape such as a rectangle or a circle, and when operated as a circularly polarized antenna, a degenerate separation element is loaded on the radiation conductor 3 as necessary. The ground conductor 4 is formed on almost the entire bottom surface of the dielectric substrate 2 except for the peripheral edge of the through hole 2a. The power feed pin 5 is a highly conductive metal pin, and its upper end (head) is soldered to the radiation conductor 3. The lower end portion of the power supply pin 5 is insulated from the ground conductor 4 and protrudes downward from the dielectric substrate 2 and is soldered to a land portion of a power supply circuit (not shown).

このように概略構成されたパッチアンテナ１の共振周波数は、誘電体基板２の誘電率や厚みあるいは放射導体３の大きさや形状等によって決定される。また、かかるパッチアンテナ１を製造する際には、予め誘電体基板２の所定位置（給電点と対応する位置）に貫通孔２ａを設けておく。これにより、製造段階で給電ピン５を貫通孔２ａに挿入した後、この給電ピン５の頭部を放射導体３に半田付けすればアンテナ素子（パッチアンテナ１）が完成するため、製造工程が簡素化されて低コスト化が図りやすくなっている。
特開平６−１５２２３７号公報（第２頁、図５） The resonance frequency of the patch antenna 1 schematically configured as described above is determined by the dielectric constant and thickness of the dielectric substrate 2 or the size and shape of the radiation conductor 3. Further, when the patch antenna 1 is manufactured, the through hole 2a is provided in advance at a predetermined position (a position corresponding to the feeding point) of the dielectric substrate 2. As a result, the antenna element (patch antenna 1) is completed by inserting the power feed pin 5 into the through hole 2a in the manufacturing stage and then soldering the head of the power feed pin 5 to the radiation conductor 3, thereby simplifying the manufacturing process. This makes it easier to reduce costs.
JP-A-6-152237 (2nd page, FIG. 5)

前述した従来のパッチアンテナ１においては、その設計段階で、最適なインピーダンス整合が得られる位置（例えば放射導体３の中心点から５０Ωに相当する位置）に給電点が設定され、この給電点に合致する貫通孔２ａが誘電体基板２の成形時に形成されるため、貫通孔２ａに挿入した給電ピン５の頭部が所望の給電点に配置されるようになっている。しかしながら、パッチアンテナ１が例えば車載用ナビゲーションのＧＰＳアンテナとして使用される場合、アンテナ素子であるパッチアンテナ１は防塵用のレドームで覆われて金属製のブラケット上に設置されるため、これらレドームやブラケット等の後付け部材の影響によって入力インピーダンスが変化し、最適なインピーダンス整合が得られる給電点の位置がずれてしまう虞がある。もちろん、使用するレドームやブラケットが１種類であれば、その影響を予め考慮して給電点の位置を調整しておくことはできるが、実際には多種多様なレドームやブラケットに適用可能な汎用性に富むパッチアンテナが要求されるため、給電点が最適位置から大きくずれた状態で製品化されてしまうことがあり、その場合、利得の低下によりアンテナ性能は劣化する。また、製品化したときに所望のアンテナ性能が得られないパッチアンテナは不良品となってしまうため、かかる給電点の位置ずれは製造歩留まりを低下させる要因ともなっていた。   In the conventional patch antenna 1 described above, at the design stage, a feeding point is set at a position where an optimum impedance matching is obtained (for example, a position corresponding to 50Ω from the center point of the radiation conductor 3). Since the through-hole 2a to be formed is formed at the time of molding the dielectric substrate 2, the head of the feed pin 5 inserted into the through-hole 2a is arranged at a desired feed point. However, when the patch antenna 1 is used as, for example, a GPS antenna for in-vehicle navigation, the patch antenna 1 that is an antenna element is covered with a dust-proof radome and installed on a metal bracket. There is a possibility that the input impedance changes due to the influence of the retrofitting member, and the position of the feeding point where the optimum impedance matching is obtained shifts. Of course, if only one type of radome or bracket is used, the position of the feeding point can be adjusted in consideration of the effect in advance, but in reality it can be applied to a wide variety of radomes and brackets. Therefore, there are cases where the product is commercialized in a state where the feeding point is greatly deviated from the optimum position. In this case, the antenna performance is deteriorated due to a decrease in gain. In addition, since patch antennas that do not achieve desired antenna performance when commercialized are defective, such feed point misalignment has also been a factor in reducing manufacturing yield.

なお、給電点が最適位置からずれるという現象は、誘電体基板２の誘電体材料のばらつき（誘電率のばらつき）によっても発生する。また、給電点の位置ずれを回避するために、使用するレドームやブラケットに応じてその都度、最適形状の誘電体基板２を用意するとなると、誘電体基板２の金型が共通化できないため製造コストの高騰を余儀なくされる。   Note that the phenomenon that the feeding point deviates from the optimum position also occurs due to variations in the dielectric material of the dielectric substrate 2 (variations in dielectric constant). In addition, in order to avoid the displacement of the feeding point, if the dielectric substrate 2 having the optimum shape is prepared each time depending on the radome or bracket to be used, the mold of the dielectric substrate 2 cannot be made common, so that the manufacturing cost is reduced. Will be forced to soar.

本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、取付環境や部品材料にばらつきがあっても最適な給電点に給電して所望のアンテナ性能を確保することが容易なパッチアンテナを提供することにある。   The present invention has been made in view of the actual situation of the prior art, and its purpose is to ensure the desired antenna performance by supplying power to the optimum feeding point even if the mounting environment and component materials vary. Is to provide an easy patch antenna.

上述した目的を達成するため、本発明のパッチアンテナでは、誘電体基板と、該誘電体基板の片面に設けられた放射導体と、前記誘電体基板の他面に設けられた接地導体と、前記誘電体基板を貫通して一端が前記放射導体に接続され他端が給電回路に接続された給電ピンとを備え、前記誘電体基板が異なる給電点に対応する複数の貫通孔を有し、このうちの一つの貫通孔に前記給電ピンを挿入する構成とした。   In order to achieve the above-described object, in the patch antenna of the present invention, a dielectric substrate, a radiation conductor provided on one surface of the dielectric substrate, a ground conductor provided on the other surface of the dielectric substrate, A feed pin penetrating through the dielectric substrate and having one end connected to the radiation conductor and the other end connected to a feed circuit, the dielectric substrate having a plurality of through holes corresponding to different feed points, The power feed pin is inserted into one through hole.

このように構成されたパッチアンテナは、誘電体基板に予め複数の貫通孔が設けられているため、給電ピンを挿入する貫通孔を適宜選択することができる。つまり、設計段階で最適と判定された給電点と合致する位置に貫通孔を設けるだけでなく、レドームやブラケット等の後付け部材の多様性に起因する取付環境のばらつき、あるいは誘電体基板等の部品材料のばらつき等を考慮して、該貫通孔から若干ずらした位置に別の貫通孔を設けておくことにより、製品化したときに最適となる給電点と略合致する貫通孔を選択し、そこに給電ピンを挿入することができる。したがって、このパッチアンテナは、取付環境や部品材料にばらつきがあっても、常に最適な給電点に給電することが容易であり、製造コストが上昇する心配もない。   In the patch antenna configured as described above, since a plurality of through holes are provided in advance in the dielectric substrate, a through hole into which the feed pin is inserted can be appropriately selected. In other words, in addition to providing a through hole at a position that matches the feeding point determined to be optimal at the design stage, variations in the mounting environment due to the diversity of retrofit members such as radomes and brackets, or parts such as dielectric substrates In consideration of material variations, etc., by providing another through-hole at a position slightly shifted from the through-hole, a through-hole that substantially matches the optimum feeding point when commercialized is selected. A power supply pin can be inserted into the. Therefore, this patch antenna can easily feed power to the optimum feeding point even if there are variations in the mounting environment and component materials, and there is no fear that the manufacturing cost will increase.

本発明のパッチアンテナは、誘電体基板に異なる給電点に対応する複数の貫通孔が設けられており、このうちの一つの貫通孔を適宜選択して給電ピンを挿入するという構成になっているため、取付環境や部品材料にばらつきがあっても、常に最適な給電点に給電ピンを接続することが可能である。それゆえ、製造工程を複雑化することなく所望のアンテナ性能を容易に確保できると共に、製造歩留まりの向上が図れ、高信頼性のパッチアンテナを安価に提供することができる。   The patch antenna of the present invention has a structure in which a plurality of through holes corresponding to different feeding points are provided in a dielectric substrate, and one of these through holes is appropriately selected to insert a feeding pin. Therefore, it is possible to always connect the power feed pin to the optimum power feed point even if there are variations in the mounting environment and component materials. Therefore, desired antenna performance can be easily secured without complicating the manufacturing process, the manufacturing yield can be improved, and a highly reliable patch antenna can be provided at low cost.

発明の実施の形態を図面を参照して説明すると、図１は本発明の実施形態例に係るパッチアンテナの平面図、図２は該パッチアンテナを回路基板上に実装した状態を示す断面図である。   1 is a plan view of a patch antenna according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a state in which the patch antenna is mounted on a circuit board. is there.

これらの図に示すパッチアンテナ１１は、セラミック等の誘電体材料からなり３箇所に貫通孔１２ａ〜１２ｃを有する誘電体基板１２と、誘電体基板１２の上面に設けられた正方形状の放射導体（パッチ電極）１３と、誘電体基板１２の底面に設けられた接地導体（裏面電極）１４と、誘電体基板１２を貫通して放射導体１３の給電点に接続された給電ピン１５とによって主に構成されており、給電ピン１５は貫通孔１２ａ〜１２ｃのうちのいずれか一つ（図では貫通孔１２ｂ）に挿通されている。   The patch antenna 11 shown in these drawings includes a dielectric substrate 12 made of a dielectric material such as ceramic and having through holes 12a to 12c at three locations, and a square-shaped radiation conductor (provided on the upper surface of the dielectric substrate 12). Patch electrode) 13, ground conductor (back electrode) 14 provided on the bottom surface of dielectric substrate 12, and feed pin 15 that penetrates dielectric substrate 12 and is connected to the feed point of radiation conductor 13. The power feed pin 15 is inserted into any one of the through holes 12a to 12c (the through hole 12b in the figure).

誘電体基板１２の各貫通孔１２ａ〜１２ｃは、それぞれの上端が略等間隔な開口端として放射導体１３に露出し、かつ、各貫通孔１２ａ〜１２ｃから放射導体１３の中心点までの距離が少しずつ異なるような配置で形成されている。すなわち、放射導体１３の中心点に対し、貫通孔１２ａは最も近く、次いで貫通孔１２ｂが近く、貫通孔１２ｃは最も遠い位置に形成されている。このうち、貫通孔１２ｂの上端は、設計段階で最適なインピーダンス整合が得られると判定された給電点（具体的には放射導体１３の中心点から５０Ωに相当すると判定された地点）に位置している。   The through holes 12a to 12c of the dielectric substrate 12 are exposed to the radiating conductor 13 as open ends having substantially equal intervals at the upper ends, and the distance from the through holes 12a to 12c to the center point of the radiating conductor 13 is It is formed in a slightly different arrangement. That is, the through hole 12a is closest to the center point of the radiation conductor 13, the through hole 12b is next, and the through hole 12c is formed at the farthest position. Among these, the upper end of the through hole 12b is located at a feeding point (specifically, a point determined to correspond to 50Ω from the center point of the radiating conductor 13) at which the optimum impedance matching is determined at the design stage. ing.

放射導体１３と接地導体１４は銅箔等の良導電性金属からなり、エッチング加工等によってそれぞれ所定形状に形成されている。本実施形態例では、放射導体１３は正方形状に形成されているが、円形等であってもよい。接地導体１４は、貫通孔１２ａ〜１２ｃの周縁部を除いて、誘電体基板１２の底面のほぼ全面に形成されている。給電ピン１５は良導電性の金属ピンであって、その上端部（頭部）は放射導体１３に半田付けされている。また、給電ピン１５の下端部は、接地導体１４とは絶縁されて誘電体基板１２の下方へ突出し、回路基板２０の裏面で図示せぬ給電回路のランド部２１に半田付けされている。   The radiation conductor 13 and the ground conductor 14 are made of a highly conductive metal such as a copper foil, and are formed in a predetermined shape by etching or the like. In the present embodiment, the radiation conductor 13 is formed in a square shape, but may be a circular shape or the like. The ground conductor 14 is formed on substantially the entire bottom surface of the dielectric substrate 12 except for the peripheral portions of the through holes 12a to 12c. The power feed pin 15 is a highly conductive metal pin, and its upper end (head) is soldered to the radiation conductor 13. Further, the lower end portion of the power supply pin 15 is insulated from the ground conductor 14 and protrudes below the dielectric substrate 12, and is soldered to the land portion 21 of the power supply circuit (not shown) on the back surface of the circuit substrate 20.

このように構成されたパッチアンテナ１１は、製品化に際して、防塵用のレドームで覆われて金属製のブラケット上に設置されるが、一般にレドームやブラケットの形状や大きさは多種多様である。そのため、使用するレドームやブラケット等の影響によってパッチアンテナ１１の入力インピーダンスが変化し、最適なインピーダンス整合が得られる給電点の位置がずれてしまうことがある。また、誘電体基板１２の誘電体材料のばらつき（誘電率のばらつき）によっても、入力インピーダンスが変化して最適な給電点の位置がずれてしまうことがある。すなわち、図示したパッチアンテナ１１は、設計段階で最適位置と判定された給電点に対応する貫通孔１２ｂに給電ピン１５を挿入しているが、使用するレドームやブラケット等の後付け部材の多様性に起因する取付環境のばらつき、あるいは誘電体基板１２等の部品材料のばらつきによって、最適な給電点の位置が大きくずれてしまう可能性があり、その場合、製品化しても所望のアンテナ性能を得ることは困難となる。   The patch antenna 11 configured as described above is covered with a dust-proof radome and placed on a metal bracket when commercialized. Generally, the radome and the bracket have various shapes and sizes. For this reason, the input impedance of the patch antenna 11 may change due to the influence of a radome, a bracket, or the like to be used, and the position of the feeding point where optimum impedance matching is obtained may be shifted. In addition, variations in the dielectric material of the dielectric substrate 12 (variations in dielectric constant) may change the input impedance and shift the optimum feed point position. That is, the illustrated patch antenna 11 has the feed pin 15 inserted in the through hole 12b corresponding to the feed point determined to be the optimum position at the design stage. Due to variations in mounting environment due to variations in component materials such as the dielectric substrate 12, there is a possibility that the position of the optimum feeding point may be greatly shifted. In this case, the desired antenna performance can be obtained even if commercialized. Will be difficult.

そこで本実施形態例では、こうした取付環境や部品材料のばらつきによって最適な給電点の位置がパッチアンテナ１１の中心点側へ大きくずれる場合には、給電ピン１５を貫通孔１２ｂではなく貫通孔１２ａに挿入することとし、これによってほぼ最適な位置に給電点を設定することができる。また、取付環境や部品材料のばらつきによって最適な給電点の位置がパッチアンテナ１１の周縁側（中心点から離れる側）へ大きくずれる場合には、給電ピン１５を貫通孔１２ｂではなく貫通孔１２ｃに挿入することとし、これによってほぼ最適な位置に給電点を設定することができる。   Therefore, in this embodiment, when the position of the optimum feeding point greatly deviates toward the center point side of the patch antenna 11 due to the variation in the mounting environment and component materials, the feeding pin 15 is changed to the through hole 12a instead of the through hole 12b. Accordingly, the feeding point can be set at a substantially optimal position. Further, when the position of the optimum feeding point is greatly shifted to the peripheral side (the side away from the center point) of the patch antenna 11 due to variations in the mounting environment and component materials, the feeding pin 15 is changed to the through hole 12c instead of the through hole 12b. Accordingly, the feeding point can be set at a substantially optimal position.

なお、給電ピン１５を貫通孔１２ａや貫通孔１２ｃに挿入する場合、回路基板２０上におけるパッチアンテナ１１の搭載位置を適宜変更することによって、給電ピン１５の下端部を図２に示すランド部２１に半田付けすることができる。ただし、各貫通孔１２ａ〜１２ｃに別々に対応する複数のランド部を予め回路基板２０に設けておいてもよい。   When inserting the power feed pin 15 into the through hole 12a or the through hole 12c, the land portion 21 shown in FIG. 2 is formed at the lower end of the power feed pin 15 by appropriately changing the mounting position of the patch antenna 11 on the circuit board 20. Can be soldered to. However, a plurality of land portions corresponding respectively to the through holes 12a to 12c may be provided in the circuit board 20 in advance.

このように本実施形態例に係るパッチアンテナ１１は、誘電体基板１２に予め複数の貫通孔１２ａ〜１２ｃが設けられているため、給電ピン１５を挿入する貫通孔を適宜選択することができる。つまり、設計段階で最適と判定された給電点と合致する位置に貫通孔１２ｂを設けるだけでなく、レドームやブラケット等の後付け部材の多様性に起因する取付環境のばらつき、あるいは誘電体基板１２等の部品材料のばらつきを考慮して、貫通孔１２ｂから若干ずらした位置に別の貫通孔１２ａ，１２ｃを設けておくことにより、製品化したときに最適となる給電点と略合致する貫通孔を選択し、そこに給電ピン１５を挿入することができる。したがって、このパッチアンテナ１１は、取付環境や部品材料にばらつきがあっても常に最適な給電点に給電ピン１５を接続することが可能であり、製造工程を複雑化することなく所望のアンテナ性能が容易に確保できる。また、製造歩留まりが向上するため、コストダウンも期待できる。   As described above, the patch antenna 11 according to the present embodiment is provided with the plurality of through holes 12 a to 12 c in the dielectric substrate 12 in advance, so that a through hole into which the feed pin 15 is inserted can be appropriately selected. That is, not only the through hole 12b is provided at a position that matches the feeding point determined to be optimal in the design stage, but also variations in the mounting environment due to the diversity of retrofitting members such as radomes and brackets, or the dielectric substrate 12 and the like. In consideration of the variation of the parts materials, by providing another through hole 12a, 12c at a position slightly shifted from the through hole 12b, a through hole that substantially matches the optimum feeding point when commercialized is obtained. A power supply pin 15 can be inserted there. Therefore, the patch antenna 11 can always connect the power supply pin 15 to the optimal power supply point even if the mounting environment and the parts material vary, and the desired antenna performance can be obtained without complicating the manufacturing process. Easy to secure. Moreover, since the manufacturing yield is improved, cost reduction can be expected.

なお、上述した実施形態例では、直線偏波用のパッチアンテナについて例示しているが、円偏波用のパッチアンテナであっても本発明が適用できることは言うまでもない。また、給電ピンが選択的に挿入可能な貫通孔の数が２個または４個以上であってもよい。   In the above-described embodiment, the linearly polarized patch antenna is illustrated. However, it goes without saying that the present invention can be applied to a circularly polarized patch antenna. Further, the number of through holes into which the power supply pins can be selectively inserted may be two or four or more.

本発明の実施形態例に係るパッチアンテナの平面図である。It is a top view of the patch antenna concerning the example of an embodiment of the present invention. 回路基板上に実装した該パッチアンテナを示す断面図である。It is sectional drawing which shows this patch antenna mounted on the circuit board. 従来例に係るパッチアンテナの断面図である。It is sectional drawing of the patch antenna which concerns on a prior art example.

符号の説明Explanation of symbols

１１ パッチアンテナ
１２ 誘電体基板
１２ａ〜１２ｃ 貫通孔
１３ 放射導体
１４ 接地導体
１５ 給電ピン
２０ 回路基板
２１ ランド部 DESCRIPTION OF SYMBOLS 11 Patch antenna 12 Dielectric board 12a-12c Through-hole 13 Radiation conductor 14 Grounding conductor 15 Feeding pin 20 Circuit board 21 Land part

Claims (1)

誘電体基板と、該誘電体基板の片面に設けられた放射導体と、前記誘電体基板の他面に設けられた接地導体と、前記誘電体基板を貫通して一端が前記放射導体に接続され他端が給電回路に接続された給電ピンとを備え、前記誘電体基板が異なる給電点に対応する複数の貫通孔を有し、このうちの一つの貫通孔に前記給電ピンが挿入されていることを特徴とするパッチアンテナ。
A dielectric substrate, a radiation conductor provided on one side of the dielectric substrate, a ground conductor provided on the other surface of the dielectric substrate, and one end penetrating the dielectric substrate and connected to the radiation conductor. The other end of the dielectric substrate has a plurality of through holes corresponding to different power feeding points, and the power feeding pins are inserted into one of the through holes. A patch antenna characterized by.
JP2004009418A 2004-01-16 2004-01-16 Patch antenna Expired - Fee Related JP3983224B2 (en)

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JP2005204151A true JP2005204151A (en) 2005-07-28
JP3983224B2 JP3983224B2 (en) 2007-09-26

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG133500A1 (en) * 2005-12-08 2007-07-30 Alps Electric Co Ltd Patch antenna
JP5934453B1 (en) * 2016-03-15 2016-06-15 ソフトバンク株式会社 Antenna device
GB2556185A (en) * 2016-09-26 2018-05-23 Taoglas Group Holdings Ltd Patch antenna construction
WO2024041138A1 (en) * 2022-08-24 2024-02-29 Oppo广东移动通信有限公司 Antenna module, positioning system and electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG133500A1 (en) * 2005-12-08 2007-07-30 Alps Electric Co Ltd Patch antenna
JP5934453B1 (en) * 2016-03-15 2016-06-15 ソフトバンク株式会社 Antenna device
GB2556185A (en) * 2016-09-26 2018-05-23 Taoglas Group Holdings Ltd Patch antenna construction
WO2024041138A1 (en) * 2022-08-24 2024-02-29 Oppo广东移动通信有限公司 Antenna module, positioning system and electronic device

Also Published As

Publication number Publication date
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