JP2005183639A - Image recognizing method and device and semiconductor manufacturing device - Google Patents

Image recognizing method and device and semiconductor manufacturing device Download PDF

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JP2005183639A
JP2005183639A JP2003421736A JP2003421736A JP2005183639A JP 2005183639 A JP2005183639 A JP 2005183639A JP 2003421736 A JP2003421736 A JP 2003421736A JP 2003421736 A JP2003421736 A JP 2003421736A JP 2005183639 A JP2005183639 A JP 2005183639A
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workpiece
cover material
stage
image recognition
optical system
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Yoshikazu Tamura
佳和 田村
Yukinori Yamashita
幸典 山下
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an image recognizing method for executing highly precise recognition without fluctuation even when radiant heat is generated from a high temperature stage at the time of observing a workpiece in the stage whose heat insulation is fixed to 100 to 200°C. <P>SOLUTION: This image recognizing device is configured by arranging an auxiliary mirror cylinder 18 attached with transparent cover glass 19 between an object lens 4a and a workpiece 2, and making the tip of the auxiliary mirror cylinder 18 extremely approximate to the workpiece 2 and the high temperature stage 1. Thus, it is possible to reduce the temperature difference of a normal temperature space being the factor of flame at the time of recognition due to the temporary storage of radiant heat from the high temperature stage 1, and to carry out highly precise recognition. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、高温のステージ上に搭載された被加工物の認識精度向上に関するものである。   The present invention relates to an improvement in recognition accuracy of a workpiece mounted on a high-temperature stage.

半導体素子の製造工程では、ステージ上に配置された第１の被加工物を光学系を介して観察し、この観察から前記第１の被加工物の正確な位置を認識するために画像認識装置が使用されている。   In the manufacturing process of a semiconductor element, an image recognition device is used to observe a first workpiece placed on a stage through an optical system and recognize an accurate position of the first workpiece from this observation. Is used.

具体的には、図３に示すようにステージ１に配置された第１の被加工物２の位置を画像認識装置Ａで観察し、この第１の被加工物２に対してハンドリング装置Ｂが吸着保持している第２の被加工物１０を接合する半導体製造装置は、次のように構成されている。   Specifically, as shown in FIG. 3, the position of the first workpiece 2 arranged on the stage 1 is observed by the image recognition device A, and the handling device B is attached to the first workpiece 2. The semiconductor manufacturing apparatus that joins the second workpiece 10 held by suction is configured as follows.

高温（１００〜２００℃）のステージ１に吸着して保持された第１の被加工物２の形状あるいはパターンを認識するために前記画像認識装置Ｂが設けられており、高温のステージ１から（４０〜１１０ｍｍ位）離れた位置に４〜１２倍程度の光学系４が配置されている。光学系４には、この光学系４の対物レンズ４ａを介して高温のステージ１に光を投射するために光ファイバー６を介して光源７と接続されている。また、この光学系４には撮像用のＣＣＤカメラ５が設けられている。この光学系４はＸ−Ｙ軸とＺ軸の方向に移動自在に構成されている。光ファイバー６と光源７に代わって発光ダイオードを設けたものもある。図４は画像認識装置Ａの断面図である。また、光学系４からオフセット量１６だけ離れた位置にＺ軸先端の吸着コレット９を有するハンドリング装置Ｂが設けられており、吸着コレット９の先端には第２の被加工物１０が吸着されている。吸着コレット９の下方位置には、第２の被加工物１０の形状あるいはパターンを認識するために焦点距離１１（４０〜１００ｍｍ）離れた位置に別の光学系１２が配置されている。この光学系１２には対物レンズ１２ａを介して第２の被加工物１０に光を投射するために光ファイバー１４を介して光源１５が接続されている。光ファイバー１４と光源１５に代わって発光ダイオードを設けたものもある。また、この光学系１２には撮像用のＣＣＤカメラ１３が設けられている。   The image recognition apparatus B is provided for recognizing the shape or pattern of the first workpiece 2 held by being sucked and held on the high-temperature (100 to 200 ° C.) stage 1, and from the high-temperature stage 1 ( The optical system 4 having a magnification of about 4 to 12 times is disposed at a position separated by 40 to 110 mm. The optical system 4 is connected to a light source 7 via an optical fiber 6 in order to project light onto the high-temperature stage 1 via the objective lens 4 a of the optical system 4. The optical system 4 is provided with a CCD camera 5 for imaging. The optical system 4 is configured to be movable in the directions of the XY axis and the Z axis. In some cases, a light emitting diode is provided in place of the optical fiber 6 and the light source 7. FIG. 4 is a cross-sectional view of the image recognition apparatus A. Further, a handling device B having a suction collet 9 at the tip of the Z-axis is provided at a position separated from the optical system 4 by an offset amount 16, and the second workpiece 10 is sucked at the tip of the suction collet 9. Yes. Another optical system 12 is disposed below the suction collet 9 at a position away from the focal length 11 (40 to 100 mm) in order to recognize the shape or pattern of the second workpiece 10. A light source 15 is connected to the optical system 12 via an optical fiber 14 in order to project light onto the second workpiece 10 via the objective lens 12a. In some cases, a light emitting diode is provided in place of the optical fiber 14 and the light source 15. The optical system 12 is provided with a CCD camera 13 for imaging.

このような構成で、１００〜２００℃に一定保温された高温のステージ１上の第１の被加工物２を光学系４を介しＣＣＤカメラ５で撮像する。この際の画像は、高温のステージ１から発生する輻射熱１７の影響を受けている状態で観察されており、不鮮明である。この状態については後に詳しく説明する。   With such a configuration, the first workpiece 2 on the high-temperature stage 1 kept at a constant temperature of 100 to 200 ° C. is imaged by the CCD camera 5 via the optical system 4. The image at this time is observed under the influence of the radiant heat 17 generated from the high-temperature stage 1 and is unclear. This state will be described in detail later.

吸着コレット９の先端に吸着された第２の被加工物１０も光学系１２を介しＣＣＤカメラ１３で撮像する。その後、各被加工物のＣＣＤカメラ１３，１５の画像を認識処理し、重ね合わせ接合が可能なようにハンドリング装置Ｂに接続された制御装置Ｄを運転して、Ｘ−Ｙ軸及びＺ軸にてオフセット距離１６をプラスして認識補正量を動作させ、第１の被加工物２の上に第２の被加工物１０を搭載、接合している。   The second workpiece 10 adsorbed on the tip of the adsorption collet 9 is also imaged by the CCD camera 13 via the optical system 12. After that, the images of the CCD cameras 13 and 15 of the workpieces are recognized and processed, and the control device D connected to the handling device B is operated so as to be able to overlap and join the X and Y axes and the Z axis. Then, the offset correction distance 16 is added to operate the recognition correction amount, and the second workpiece 10 is mounted on and joined to the first workpiece 2.

加工部位をカメラを介して観察している別の半導体製造装置では、（特許文献１）などに見られるように輻射熱の影響を受けて画像が不鮮明にならないように、観察期間には空気を流すように構成したものがある。
特開平９−１３９３９９号公報 In another semiconductor manufacturing apparatus that observes a processing site via a camera, air is allowed to flow during the observation period so that the image is not blurred due to the influence of radiant heat as seen in (Patent Document 1) and the like. There is something configured as follows.
JP-A-9-139399

図３と図４に示す半導体製造装置では、１００〜２００℃に一定保温された高温のステージ１上に吸着搭載された第１の被加工物２の形状あるいはパターンの高精度認識時には、光学系４の対物レンズ４ａと高温のステージ１上の第１の被加工物２の間が、焦点距離３（４０〜１００ｍｍ位）だけ離れており、この常温空間が、高温のステージ１からの輻射熱１７の影響を受け、コントロール不可能な温度差が生じ、撮像画像が輻射熱１７によりもたらされる陽炎により揺らぎ、特に高倍率で高精度認識する際に悪影響を受けて不鮮明である。   In the semiconductor manufacturing apparatus shown in FIG. 3 and FIG. 4, an optical system is used at the time of highly accurate recognition of the shape or pattern of the first workpiece 2 sucked and mounted on the high-temperature stage 1 kept at a constant temperature of 100 to 200 ° C. 4 objective lens 4a and the first workpiece 2 on the high temperature stage 1 are separated by a focal length 3 (about 40 to 100 mm), and this room temperature space is radiant heat 17 from the high temperature stage 1. As a result, an uncontrollable temperature difference occurs, the captured image fluctuates due to the heat generated by the radiant heat 17, and is particularly unclear when it is adversely affected during high-precision recognition at high magnification.

これに対して（特許文献１）の構成では、陽炎による揺らぎを無くして画像を観察できるものの、高温のステージ１ならびに第１の被加工物２の温度が低下して、第１の被加工物２と第２の被加工物１０との接合作業の品質が低下する。   On the other hand, in the configuration of (Patent Document 1), although the image can be observed without fluctuation due to the heat, the temperature of the high-temperature stage 1 and the first workpiece 2 is lowered, and the first workpiece The quality of the joining work between 2 and the second workpiece 10 is degraded.

本発明は高倍率で認識する際も鮮明で、しかも被加工物の接合作業の品質を良好に維持できる画像認識方法と画像認識装置および半導体製造装置を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide an image recognition method, an image recognition apparatus, and a semiconductor manufacturing apparatus that are clear even when recognizing at a high magnification and that can maintain the quality of the joining work of workpieces well.

本発明の請求項１記載の画像認識方法は、ステージにセットされた被加工物を上方位置から光学系を介して観察するに際し、前記光学系の対物側のレンズと前記被加工物の間の空間で前記被加工物に近接して透光性のカバー材を配設して前記ステージから発生する陽炎の影響を低減し、前記透光性のカバー材を通して被加工物を観察することを特徴とする。   In the image recognition method according to claim 1 of the present invention, when observing the workpiece set on the stage from the upper position through the optical system, the object recognition lens between the optical system and the workpiece is interposed. A translucent cover material is disposed in proximity to the work piece in a space to reduce the influence of the heat generated from the stage, and the work piece is observed through the translucent cover material. And

本発明の請求項２記載の画像認識方法は、請求項１において、前記カバー材として、このカバー材の配設位置から前記ステージまでの距離と同一以上、またはこのカバー材の配設位置から前記被加工物までの距離と同一以上の大きさのものを使用することを特徴とする。   The image recognition method according to claim 2 of the present invention is the image recognition method according to claim 1, wherein the cover material is equal to or more than a distance from the position where the cover material is disposed to the stage, or the position where the cover material is disposed. It is characterized by using a thing having a size equal to or larger than the distance to the workpiece.

本発明の請求項３記載の画像認識装置は、ステージにセットされた被加工物を上方位置から光学系を介して観察する画像認識装置であって、前記光学系の対物側のレンズの先端に装着され前記被加工物に近接する端部が透光性のカバー材によって閉塞された補助鏡筒を設け、前記透光性のカバー材を通して被加工物を観察するよう構成したことを特徴とする。   An image recognition apparatus according to a third aspect of the present invention is an image recognition apparatus for observing a workpiece set on a stage from an upper position through an optical system, at the tip of a lens on the objective side of the optical system. An auxiliary lens barrel that is mounted and has an end close to the workpiece closed by a light-transmitting cover material is provided, and the workpiece is observed through the light-transmitting cover material. .

本発明の請求項４記載の画像認識装置は、請求項３において、前記カバー材として、このカバー材の配設位置から前記ステージまでの距離と同一以上の半径、またはこのカバー材の配設位置から前記被加工物までの距離と同一以上の半径としたことを特徴とする。   The image recognition apparatus according to claim 4 of the present invention is the image recognition apparatus according to claim 3, wherein the cover member has a radius equal to or greater than a distance from the position where the cover member is disposed to the stage, or the position where the cover member is disposed. The radius is equal to or greater than the distance from the workpiece to the workpiece.

本発明の請求項５に記載の半導体製造装置は、ステージにセットされた第１の被加工物を上方位置から光学系を介して観察する画像認識装置と、前記画像認識装置とは所定のオフセット位置に配設されるとともに前記第１の被加工物に接合する第２の被加工物を保持する吸着コレットを有するハンドリング装置とを有する半導体製造装置であって、画像認識装置の前記光学系の対物側のレンズの先端に装着され前記被加工物に近接する端部が透光性のカバー材によって閉塞された補助鏡筒を設け、前記透光性のカバー材を通して被加工物を観察して決定された前記第１の被加工物に前記第２の被加工物を接合するように前記ハンドリング装置を運転制御する制御装置を設けたことを特徴とする。   According to a fifth aspect of the present invention, there is provided a semiconductor manufacturing apparatus in which an image recognition apparatus for observing a first workpiece set on a stage from an upper position through an optical system, and the image recognition apparatus have a predetermined offset. A semiconductor manufacturing apparatus having a suction collet disposed at a position and holding a second workpiece to be joined to the first workpiece, wherein the optical system of the image recognition apparatus includes: An auxiliary lens barrel that is attached to the tip of the objective lens and close to the workpiece is closed with a light-transmitting cover material, and the workpiece is observed through the light-transmitting cover material. A control device is provided that controls the operation of the handling device so that the second workpiece is joined to the determined first workpiece.

本発明によると、光学系の対物側のレンズと被加工物の間の空間で前記被加工物に近接して透光性のカバー材を配設することによって、高温のステージからの輻射熱の一時蓄積により認識時に陽炎の原因となる常温空間の温度差減少を図ることができ、高温のステージ上の被加工物を高精度で認識可能で、しかも前記ステージの温度低下を伴わないため、被加工物の接合作業の品質を良好に維持できる。   According to the present invention, by providing a translucent cover material close to the workpiece in the space between the objective lens of the optical system and the workpiece, temporary radiation heat from the high-temperature stage can be obtained. Accumulation can reduce the temperature difference in the room temperature that causes heat during recognition, and the workpiece on the high temperature stage can be recognized with high accuracy, and the temperature of the stage does not decrease. The quality of the joining operation of the objects can be maintained well.

具体的には、透光性のカバー材としては、透明カバーガラス（厚さ０．５〜２ｍｍ）付きの補助鏡筒を設け、光学系の光路を可能な限り囲むことにより被加工物とレンズ間の温度変動の最小化を図ることと、補助鏡筒の先端を被加工物及び高温のステージと極力接近させることができる。   Specifically, as the light-transmitting cover material, an auxiliary lens barrel with a transparent cover glass (thickness 0.5 to 2 mm) is provided, and the workpiece and lens are enclosed by enclosing the optical path of the optical system as much as possible. It is possible to minimize temperature fluctuations between them and to bring the tip of the auxiliary lens barrel as close as possible to the workpiece and the high-temperature stage.

以下、本発明の画像認識方法を図１と図２に示す具体例に基づいて説明する。
図１と図２は本発明の画像認識方法を実施する画像認識装置を備えた半導体製造装置を示す。 The image recognition method of the present invention will be described below based on the specific examples shown in FIGS.
1 and 2 show a semiconductor manufacturing apparatus equipped with an image recognition apparatus for implementing the image recognition method of the present invention.

なお、従来例で説明した図３と異なるところは、光学系４に透光性のカバー材としての透明カバーガラス１９付きの補助鏡筒１８が設けられている点で、その他は図３の構成と同じである。   The difference from FIG. 3 described in the prior art is that the optical system 4 is provided with an auxiliary lens barrel 18 with a transparent cover glass 19 as a translucent cover material. Is the same.

更に具体的に説明すると、ステージ１に吸着搭載された第１の被加工物２の形状あるいはパターンを認識する光学系４の先端には、この光学系４の光路を妨げない中空形状の補助鏡筒１８が取付けられている。   More specifically, a hollow auxiliary mirror that does not obstruct the optical path of the optical system 4 is provided at the tip of the optical system 4 for recognizing the shape or pattern of the first workpiece 2 mounted on the stage 1 by suction. A tube 18 is attached.

この補助鏡筒１８の先端は透明石英カバーガラス（厚さ０．５〜２ｍｍ）１９によって閉塞されている。
このような構成で、高温のステージ１上の第１の被加工物２を光学系４及び透明石英カバーガラス１９、補助鏡筒１８を介しＣＣＤカメラ５で撮像する。 The tip of the auxiliary lens barrel 18 is closed with a transparent quartz cover glass (thickness 0.5 to 2 mm) 19.
With such a configuration, the first workpiece 2 on the high-temperature stage 1 is imaged by the CCD camera 5 through the optical system 4, the transparent quartz cover glass 19, and the auxiliary lens barrel 18.

この構成によると、ステージ１に近接して配置されたカバーガラス１９によって、補助鏡筒１８のカバーガラス１９と前記対物レンズ４ａとの空間が、輻射熱１７の影響を受けて揺らぐことがないため、高倍率の観察時にも良好な画像が得られる。   According to this configuration, the space between the cover glass 19 of the auxiliary lens barrel 18 and the objective lens 4a does not fluctuate due to the influence of the radiant heat 17 by the cover glass 19 disposed close to the stage 1. A good image can be obtained even during high-magnification observation.

補助鏡筒１８の形状が、光路を可能な限り囲むことにより被加工物とレンズ間の温度変動の最小化を図ることと、補助鏡筒の先端を被加工物及び高温のステージと極力接近させることで高温のステージからの輻射熱の一時蓄積により認識時に陽炎の原因となる空間温度差を減少させることができ、ステージ上の被加工物の高精度認識が可能となる。   The shape of the auxiliary barrel 18 surrounds the optical path as much as possible to minimize temperature fluctuation between the workpiece and the lens, and the tip of the auxiliary barrel is brought as close as possible to the workpiece and the high-temperature stage. Thus, the temporary accumulation of radiant heat from the high-temperature stage can reduce the spatial temperature difference that causes a positive flame during recognition, and the workpiece on the stage can be recognized with high accuracy.

カバーガラス１９の大きさは、ステージ１または第１の被加工物２からカバーガラス１９までの距離（１０〜２０ｍｍ程度）と同一以上を半径とし、厚さ０．５〜２ｍｍのものが好適であった。   The size of the cover glass 19 preferably has a radius equal to or greater than the distance (about 10 to 20 mm) from the stage 1 or the first workpiece 2 to the cover glass 19 and a thickness of 0.5 to 2 mm. there were.

このようにしてステージ１に配置された第１の被加工物２の位置を画像認識装置Ａで観察し、この第１の被加工物２に対して制御装置Ｄによってハンドリング装置Ｂを運転して、第２の被加工物１０を第１の被加工物２に搭載して接合されるが、第１の被加工物２の位置を画像認識装置Ａで観察する際に、（特許文献１）に見られたような空気の吹き付けを必要としないため、ステージ１ならびに第１の被加工物２の温度低下も無く、被加工物の接合作業の品質を良好に維持できる。   The position of the first workpiece 2 arranged on the stage 1 in this way is observed by the image recognition device A, and the handling device B is operated by the control device D with respect to the first workpiece 2. The second workpiece 10 is mounted on the first workpiece 2 and joined. When the position of the first workpiece 2 is observed with the image recognition apparatus A (Patent Document 1). Therefore, there is no need to reduce the temperature of the stage 1 and the first workpiece 2 and the quality of the joining work of the workpieces can be maintained well.

本発明は、被加工物の接合に際しての画像認識だけでなく、各種の半導体装置の高温試験や、各種表示装置などの高温試験の際の画像認識に採用することによって、品質の安定した製品の製造ならびに環境試験などの実現に寄与できる。   The present invention is used not only for image recognition when joining workpieces but also for high-temperature testing of various semiconductor devices and image recognition during high-temperature testing of various display devices. It can contribute to the realization of manufacturing and environmental testing.

本発明の実施の形態における半導体製造装置の斜視図The perspective view of the semiconductor manufacturing apparatus in embodiment of this invention 同実施の形態の要部である画像認識装置の断面図Sectional drawing of the image recognition apparatus which is the principal part of the embodiment 従来の半導体製造装置の斜視図Perspective view of conventional semiconductor manufacturing equipment 同従来例の要部である画像認識装置の断面図Sectional drawing of the image recognition apparatus which is the principal part of the conventional example

符号の説明Explanation of symbols

Ａ 画像認識装置
Ｂ ハンドリング装置
Ｄ 制御装置
１ ステージ
２ 第１の被加工物
４ 光学系
４ａ 対物レンズ
５ ＣＣＤカメラ
６ 光ファイバ
９ 吸着コレット
１０ 第２の被加工物
１６ オフセット距離
１７ 輻射熱
１８ 補助鏡筒
１９ 透明カバーガラス（カバー材） DESCRIPTION OF SYMBOLS A Image recognition apparatus B Handling apparatus D Control apparatus 1 Stage 2 1st workpiece 4 Optical system 4a Objective lens 5 CCD camera 6 Optical fiber 9 Adsorption collet 10 2nd workpiece 16 Offset distance 17 Radiation heat 18 Auxiliary lens barrel 19 Transparent cover glass (cover material)

Claims (5)

ステージにセットされた被加工物を上方位置から光学系を介して観察するに際し、
前記光学系の対物側のレンズと前記被加工物の間の空間で前記被加工物に近接して透光性のカバー材を配設して前記ステージから発生する陽炎の影響を低減し、前記透光性のカバー材を通して被加工物を観察する
画像認識方法。 When observing the workpiece set on the stage from above through the optical system,
A light-transmitting cover material is disposed in the space between the objective-side lens of the optical system and the work piece in the vicinity of the work piece to reduce the influence of the heat generated from the stage, An image recognition method for observing a workpiece through a translucent cover material. 前記カバー材として、このカバー材の配設位置から前記ステージまでの距離と同一以上、またはこのカバー材の配設位置から前記被加工物までの距離と同一以上の大きさのものを使用する
請求項１に記載の画像認識方法。 The cover material having a size equal to or greater than a distance from the position where the cover material is disposed to the stage or a distance equal to or greater than a distance from the position where the cover material is disposed to the workpiece is used. Item 8. The image recognition method according to Item 1. ステージにセットされた被加工物を上方位置から光学系を介して観察する画像認識装置であって、
前記光学系の対物側のレンズの先端に装着され前記被加工物に近接する端部が透光性のカバー材によって閉塞された補助鏡筒を設け、
前記透光性のカバー材を通して被加工物を観察するよう構成した
画像認識装置。 An image recognition apparatus for observing a workpiece set on a stage from above through an optical system,
An auxiliary lens barrel that is attached to the tip of a lens on the objective side of the optical system and that is close to the workpiece is closed by a translucent cover material is provided.
An image recognition apparatus configured to observe a workpiece through the translucent cover material. 前記カバー材として、このカバー材の配設位置から前記ステージまでの距離と同一以上の半径、またはこのカバー材の配設位置から前記被加工物までの距離と同一以上の半径とした
請求項３に記載の画像認識装置。 The radius of the cover material is equal to or greater than the distance from the position where the cover material is disposed to the stage, or the radius is equal to or greater than the distance from the position where the cover material is disposed to the workpiece. The image recognition apparatus described in 1. ステージにセットされた第１の被加工物を上方位置から光学系を介して観察する画像認識装置と、前記画像認識装置とは所定のオフセット位置に配設されるとともに前記第１の被加工物に接合する第２の被加工物を保持する吸着コレットを有するハンドリング装置とを有する半導体製造装置であって、
画像認識装置の前記光学系の対物側のレンズの先端に装着され前記被加工物に近接する端部が透光性のカバー材によって閉塞された補助鏡筒を設け、
前記透光性のカバー材を通して被加工物を観察して決定された前記第１の被加工物に前記第２の被加工物を接合するように前記ハンドリング装置を運転制御する制御装置を設けた
半導体製造装置。 An image recognition device for observing a first workpiece set on a stage from above via an optical system, and the image recognition device are disposed at a predetermined offset position and the first workpiece A semiconductor manufacturing apparatus having a handling device having a suction collet for holding a second workpiece to be bonded to
Provided is an auxiliary lens barrel attached to the tip of the objective lens of the optical system of the image recognition device and having an end close to the workpiece closed with a translucent cover material;
A control device is provided for operating and controlling the handling device so as to join the second workpiece to the first workpiece determined by observing the workpiece through the translucent cover material. Semiconductor manufacturing equipment.
JP2003421736A 2003-12-19 2003-12-19 Image recognizing method and device and semiconductor manufacturing device Pending JP2005183639A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025304A (en) * 2014-07-24 2016-02-08 キヤノンマシナリー株式会社 Position confirmation apparatus and die bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025304A (en) * 2014-07-24 2016-02-08 キヤノンマシナリー株式会社 Position confirmation apparatus and die bonder

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