JP2005153118A - Polishing device - Google Patents

Polishing device Download PDF

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JP2005153118A
JP2005153118A JP2003398438A JP2003398438A JP2005153118A JP 2005153118 A JP2005153118 A JP 2005153118A JP 2003398438 A JP2003398438 A JP 2003398438A JP 2003398438 A JP2003398438 A JP 2003398438A JP 2005153118 A JP2005153118 A JP 2005153118A
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surface plate
polishing
polishing apparatus
sun gear
carrier
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Mitsuto Fukushima
充人 福嶋
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Taisei Co Ltd
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Taisei Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To improve accuracy in plane surface polishing of a large work piece. <P>SOLUTION: The polishing device is constructed so that a lower surface plate 13 is divided into three of a lower inner surface plate 131, a lower middle surface plate 132 and a lower outer surface plate 133 on the same axis, an upper surface plate 14 is divided into three of an upper inner surface plate 141, an upper middle surface plate 142 and an upper outer surface plate 143 on the same axis, and both sides of the work piece 110 are polished with a carrier 100 accommodating the work piece 110 being rotated and revolved by a sun gear 11 and an internal gear 12 and with the respective surface plates being rotationally driven. At this time, at least the lower middle surface plate 132 is rotated at a rotation speed different from the lower inner surface plate 131 and the lower outer surface plate 133 and at least the upper middle surface plate 142 is rotated at a rotation speed different from the upper inner surface plate 141 and the upper outer surface plate 143 so that speeds at respective positions of the work piece 110 relative to the surface plates are equalized. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、研磨装置に関し、特に、大型の非研磨体の研磨に好適な技術に関するものである。   The present invention relates to a polishing apparatus, and more particularly to a technique suitable for polishing a large non-polishing body.

ワークと呼ばれる非研磨体を研磨する研磨装置としては、従来、たとえば、互いに異なる方向に回転する上定盤と下定盤との間に位置したキャリアを、太陽歯車と内歯歯車に噛合させて両定盤間で回転させることにより、キャリアに保持したワークの上下面を研磨する両面研磨装置が知られている（たとえば、特許文献１）。   Conventionally, as a polishing apparatus for polishing a non-abrasive body called a workpiece, for example, a carrier positioned between an upper surface plate and a lower surface plate rotating in different directions is engaged with a sun gear and an internal gear to 2. Description of the Related Art A double-side polishing apparatus that polishes the upper and lower surfaces of a work held on a carrier by rotating between surface plates is known (for example, Patent Document 1).

図４に、このような両面研磨装置の構造を模式的に示す。
図中ａは、垂直方向から見た場合の太陽歯車１、内歯歯車２、下定盤３、キャリア４の構造を模式的に示した図である。
図示するように、各キャリア４は、その外周に設けられた歯列によって太陽歯車１の外周に設けられた歯列と内歯歯車２の内周に設けられた歯列と噛合しており、太陽歯車１を回転させることにより、太陽歯車１の周りを公転しながら、自キャリア４の中心の周りを自転するようになっている。 FIG. 4 schematically shows the structure of such a double-side polishing apparatus.
In the figure, a is a diagram schematically showing the structure of the sun gear 1, the internal gear 2, the lower surface plate 3, and the carrier 4 when viewed from the vertical direction.
As shown in the drawing, each carrier 4 meshes with a tooth row provided on the outer periphery of the sun gear 1 and a tooth row provided on the inner periphery of the internal gear 2 by a tooth row provided on the outer periphery thereof. By rotating the sun gear 1, it rotates around the center of the carrier 4 while revolving around the sun gear 1.

次に、図中ｂは、水平方向から見た両面研磨装置の構造を模式的に示したものである。
図示するように、両面研磨装置は、垂直方向に上下する、水平方向断面が円環状（ドーナッツ状）の上定盤５を有し、この上定盤５を、下定盤３上に配置したキャリア４に上から押し下げ、研磨剤を供給しながら、下定盤３と上定盤５を逆回転方向に回転させると共に、太陽歯車１を回転させることにより、キャリア４に保持させたワークの上下両面を、ワークをキャリア４共々公転、自転させながら上定盤５と下定盤３で研磨する。なお、このような両面研磨装置において、さらに内歯歯車２を回転させる場合もある。 Next, b in the figure schematically shows the structure of the double-side polishing apparatus viewed from the horizontal direction.
As shown in the figure, the double-side polishing apparatus has an upper surface plate 5 that moves vertically and has an annular (doughnut shape) horizontal cross section, and the upper surface plate 5 is disposed on the lower surface plate 3. 4, the upper surface plate 5 and the upper surface plate 5 are rotated in the reverse rotation direction while supplying the abrasive, and the sun gear 1 is rotated so that the upper and lower surfaces of the work held by the carrier 4 are The workpiece is polished by the upper surface plate 5 and the lower surface plate 3 while rotating and rotating together with the carrier 4. In such a double-side polishing apparatus, the internal gear 2 may be further rotated.

次に、図中ｃにこのような従来の両面研磨装置におけるキャリア４の構造を示す。
ｃ１はキャリア４を垂直方向から見たようすを表しており、ｃ２はキャリア４を水平方向からみたようすを表している。
図示するように、キャリア４は外周に歯列が設けられた円形のシート状の部材であり、ワーク７を水平方に関し保持するための１または複数の孔６が設けられている。ここでキャリア４の厚さは、上定盤５、下定盤３のワーク７の研磨に干渉しないようにワーク７の目標研磨厚さより薄い厚さとなっている。
特開平５−３２９７６８号公報 Next, FIG. 3c shows the structure of the carrier 4 in such a conventional double-side polishing apparatus.
c1 represents the carrier 4 viewed from the vertical direction, and c2 represents the carrier 4 viewed from the horizontal direction.
As shown in the figure, the carrier 4 is a circular sheet-like member having teeth arranged on the outer periphery, and is provided with one or a plurality of holes 6 for holding the workpiece 7 in the horizontal direction. Here, the thickness of the carrier 4 is smaller than the target polishing thickness of the workpiece 7 so as not to interfere with the polishing of the workpiece 7 of the upper surface plate 5 and the lower surface plate 3.
Japanese Patent Laid-Open No. 5-329768

さて、近年では、液晶ガラスやシリコン基盤等に代表されるワーク７を使用する部品に対する大型化や、低コスト化の要請により、ワーク７のサイズが大型化している。
ここで、このような大型のワーク７を従来の研磨装置によって研磨する場合には、以下のような問題が生じる。
すなわち、たとえば、図４ｄに示すように、ワーク７がキャリア４に一つしか収まらない程度に大きいサイズを有するものである場合、ワーク７の中心に近い位置ほど、上定盤５及び下定盤３の回転中心からの距離の変化は小さくなり、また、ワーク７に対する上定盤５及び下定盤３の周速の変化は小さくなる。したがって、ワーク７の中心と外周部では、研磨作用平滑化の効果に差が生じ、ワーク７の表面が凸レンズ状になるなど、充分な平面度を得ることができなくなる。 In recent years, the size of the workpiece 7 has been increased due to demands for an increase in the size of parts using the workpiece 7 typified by liquid crystal glass and a silicon substrate, and a cost reduction.
Here, when such a large workpiece 7 is polished by a conventional polishing apparatus, the following problems occur.
That is, for example, as shown in FIG. 4 d, when the work 7 has a size large enough to fit in the carrier 4, the upper surface plate 5 and the lower surface plate 3 are closer to the center of the work 7. The change in the distance from the center of rotation is small, and the change in the peripheral speed of the upper surface plate 5 and the lower surface plate 3 with respect to the work 7 is small. Therefore, there is a difference in the effect of smoothing the polishing action between the center and the outer periphery of the work 7, and the surface of the work 7 has a convex lens shape, so that sufficient flatness cannot be obtained.

一方で、このような問題を解消するために、キャリア４内に多数のワーク７を配置できるように研磨装置を大型化すれば、研磨装置や研磨設備の高コスト化を招く他、研磨装置自体の研磨精度を保つことも困難となる。
そこで、本発明は、比較的小型の研磨装置によって、大型の非研磨体を精度良く研磨することのできる研磨装置を提供することを課題とする。 On the other hand, in order to solve such a problem, if the polishing apparatus is enlarged so that a large number of workpieces 7 can be arranged in the carrier 4, the polishing apparatus and the polishing equipment are not only costly, but also the polishing apparatus itself. It is also difficult to maintain the polishing accuracy.
Therefore, an object of the present invention is to provide a polishing apparatus capable of accurately polishing a large non-polishing body with a relatively small polishing apparatus.

前記課題達成のために、本発明は、同軸に配置された太陽歯車と内歯歯車を用いて所定数のキャリアを自転させながら太陽歯車の周囲に公転させ、前記キャリアに保持された被研磨体の上下面を下定盤と上定盤によって研磨する研磨装置において、前記下定盤を、同軸状に上面を揃えて配置された、複数の下部分定盤より構成し、前記上定盤を、同軸状に下面を揃えて配置された、複数の上部分定盤より構成すると共に、当該研磨装置に、前記各下部分定盤の各々をそれぞれ独立に回転駆動する下定盤駆動部と、前記各上部分定盤の各々をそれぞれ独立に回転駆動する上定盤駆動部とを備えたものである。
このように、本発明によれば、太陽歯車と内歯歯車を用いて公転及び自転させながら下定盤と上定盤によってワークの両面研磨を行う研磨装置において、下定盤と上定盤を同軸状に複数の部分定盤に分割し、それぞれを独立に回転駆動するようにしたので、分割した各部分定盤の回転を各々適当に制御することにより、キャリア内の各位置毎の公転中心からの距離の変化の程度の相違、すなわちキャリア内の各位置毎のワークに働く有効な研磨作用平滑化の効果の相違を打ち消すことができる。したがって、大型の非研磨体であっても、太陽歯車と内歯歯車を用いた公転及び自転機構を用いつつ、研磨装置を大型化することなく、精度の良い両面平面研磨を行うことができる。 In order to achieve the above object, the present invention provides an object to be polished which is revolved around a sun gear while rotating a predetermined number of carriers using a sun gear and an internal gear arranged coaxially and held by the carrier. In a polishing apparatus that polishes the upper and lower surfaces of the upper and lower surfaces with a lower surface plate and an upper surface plate, the lower surface plate is composed of a plurality of lower surface plates that are coaxially arranged with the upper surface aligned, and the upper surface plate is coaxial A plurality of upper partial surface plates arranged in the shape of the lower surface, and a lower surface plate driving unit for independently driving each of the lower partial surface plates to the polishing apparatus, and each upper surface plate An upper surface plate driving unit that rotates and drives each of the partial surface plates independently.
Thus, according to the present invention, in a polishing apparatus that performs double-side polishing of a workpiece with a lower surface plate and an upper surface plate while revolving and rotating using a sun gear and an internal gear, the lower surface plate and the upper surface plate are coaxial. Are divided into a plurality of partial surface plates, and each of them is driven to rotate independently, so by appropriately controlling the rotation of each of the divided partial surface plates, from the center of revolution at each position in the carrier The difference in the degree of change in distance, that is, the difference in the effect of smoothing the effective polishing action that acts on the work at each position in the carrier can be canceled out. Therefore, even if it is a large non-polishing body, accurate double-sided planar polishing can be performed without increasing the size of the polishing apparatus while using a revolution and rotation mechanism using a sun gear and an internal gear.

また、前記課題達成のために、本発明は、同軸に配置された太陽歯車と内歯歯車を用いて所定数のキャリアを自転させながら太陽歯車の周囲に公転させ、前記キャリアに保持された被研磨体の片面を定盤によって研磨する研磨装置において、前記定盤を、同軸状に研磨面を揃えて配置された複数の、部分定盤より構成すると共に、当該研磨装置に、前記各部分定盤の各々をそれぞれ独立に回転駆動する定盤駆動部を備えたものである。
このような研磨装置によれば、上記両面研磨を行う研磨装置と同様に、太陽歯車と内歯歯車を用いた公転及び自転機構を用いつつ、研磨装置を大型化することなく、大型の非研磨体であっても、精度の良い片面平面研磨を行うことができる。 In order to achieve the above object, the present invention revolves around a sun gear while rotating a predetermined number of carriers using a sun gear and an internal gear arranged coaxially, and is held by the carrier. In a polishing apparatus that polishes one surface of a polishing body with a surface plate, the surface plate is composed of a plurality of partial surface plates that are coaxially arranged with the polishing surface aligned, and each of the partial surface plates is attached to the polishing device. It is provided with a surface plate drive unit that rotates each of the panels independently.
According to such a polishing apparatus, similarly to the above-described polishing apparatus for performing double-side polishing, a large non-polishing is performed without using a revolving and rotating mechanism using a sun gear and an internal gear without increasing the size of the polishing apparatus. Even a body can perform single-side flat polishing with high accuracy.

以上のように、本発明によれば、比較的小型の研磨装置によって、大型の非研磨体を精度良く研磨することができる。   As described above, according to the present invention, a large non-polishing body can be accurately polished by a relatively small polishing apparatus.

以下、本発明に係る研磨装置の実施形態について説明する。
図１に、本実施形態に係る研磨装置の構造を模式的に示す。
図示するように、本研磨装置は、ベース２０と、太陽歯車１１、内歯歯車１２、下定盤１３を有している。ここで、下定盤１３は、図２ａに上方から下定盤１３を見たようすを示すように、同心環状に配置された下内定盤１３１、下中定盤１３２、下外定盤１３３の３つの、上面が水平に揃った定盤より構成されている。そして、この下定盤１３の周りに内歯歯車１２が配置され、下定盤１３の中心に太陽歯車１１が配置されている。 Hereinafter, embodiments of a polishing apparatus according to the present invention will be described.
FIG. 1 schematically shows the structure of a polishing apparatus according to this embodiment.
As shown in the figure, the polishing apparatus has a base 20, a sun gear 11, an internal gear 12, and a lower surface plate 13. Here, the lower surface plate 13 has three lower inner surface plates 131, lower middle surface plates 132, and lower outer surface plates 133 arranged concentrically as shown in FIG. It is composed of a surface plate whose upper surfaces are aligned horizontally. The internal gear 12 is disposed around the lower surface plate 13, and the sun gear 11 is disposed at the center of the lower surface plate 13.

太陽歯車１１は太陽歯車駆動軸１１１に連結し、太陽歯車駆動軸１１１下部の歯部１１２を駆動部１１３によって回転することにより、回転軸ＡＡを中心に回転する。また、内歯歯車１２は駆動部１２１によって、回転軸ＡＡを中心に回転駆動される。
また、下定盤１３の下内定盤１３１は、筒状の下内定盤駆動軸１３１１に連結し、下内定盤駆動軸下部の歯部１３１２を駆動部１３１３によって回転することにより、回転軸ＡＡを中心に回転する。また、下定盤１３の下中定盤１３２は、筒状の下内定盤駆動軸１３２１に連結し、下中定盤駆動軸下部の歯部１３２２を駆動部１３２３によって回転することにより、回転軸ＡＡを中心に回転する。また、下定盤１３の下外定盤１３３は、筒状の下外定盤駆動軸１３３１に連結し、下外定盤駆動軸下部の歯部１３３２を駆動部１３３３によって回転することにより、回転軸ＡＡを中心に回転する。 The sun gear 11 is connected to the sun gear drive shaft 111 and rotates around the rotation axis AA by rotating the tooth portion 112 below the sun gear drive shaft 111 by the drive portion 113. The internal gear 12 is driven to rotate about the rotation axis AA by the drive unit 121.
Further, the lower inner platen 131 is connected to a cylindrical lower inner platen drive shaft 1311, and a tooth portion 1312 below the lower inner platen drive shaft is rotated by the drive unit 1313, so that the rotation axis AA is centered. Rotate to. The lower middle platen 132 is connected to the cylindrical lower inner platen drive shaft 1321, and the tooth portion 1322 below the lower middle platen drive shaft is rotated by the drive unit 1323, thereby rotating the rotation axis AA. Rotate around. Further, the lower outer surface plate 133 of the lower surface plate 13 is connected to a cylindrical lower outer surface plate driving shaft 1331, and the tooth portion 1332 below the lower outer surface plate driving shaft is rotated by the driving portion 1333, thereby rotating the rotating shaft. Rotate around AA.

そして、ベース２０は、以上各部を、油圧、ベアリング等の機構により回動可能に支持している。
また、本研磨装置は、上部研磨部３０と、ベース２０に支持された油圧等の伸縮シリンダ２２を介して上部研磨部３０を昇降可能に支持する吊り下げアーム部２１も有している。
そして、上部研磨部３０は、シリンダ下部に固定的に連結されたフレーム３１と、上定盤１４が設けられており、この上定盤１４も、図２ｂに下方から上定盤１４を見たようすを示すように、下定盤１３と同様に同心環状に配置された上内定盤１４１、上中定盤１４２、上外定盤１４３の３つの下面が水平に揃った定盤より構成されている。 And the base 20 supports each part so that rotation is possible by mechanisms, such as oil_pressure | hydraulic and a bearing.
The polishing apparatus also includes an upper polishing section 30 and a suspension arm section 21 that supports the upper polishing section 30 so as to be movable up and down via a telescopic cylinder 22 such as a hydraulic pressure supported by the base 20.
The upper polishing unit 30 is provided with a frame 31 fixedly connected to the lower part of the cylinder and an upper surface plate 14, and the upper surface plate 14 is also viewed from below in FIG. As shown, the upper and lower surface plates 141, 142, and 143, which are arranged concentrically like the lower surface plate 13, are composed of a surface plate in which the three lower surfaces of the upper and lower surface plates 143 are aligned horizontally. .

そして、上定盤１４の上内定盤１４１は、上内定盤駆動軸１４１１に連結し、上内定盤駆動軸下部の歯部１４１２を駆動部１４１３によって回転することにより、回転軸ＡＡを中心に回転する。また、上定盤１４の上中定盤１４２は、筒状の上内定盤駆動軸１４２１に連結し、上中定盤駆動軸下部の歯部１４２２を駆動部１４２３によって回転することにより、回転軸ＡＡを中心に回転する。また、上定盤１４の上外定盤１４３は、筒状の上外定盤駆動軸１４３１に連結し、上外定盤駆動軸下部の歯部１４３２を駆動部１４３３によって回転することにより、回転軸ＡＡを中心に回転する。   Then, the upper inner surface plate 141 of the upper surface plate 14 is connected to the upper inner surface plate driving shaft 1411 and rotates around the rotation axis AA by rotating the tooth portion 1412 below the upper inner surface plate driving shaft by the driving portion 1413. To do. Further, the upper / middle platen 142 is connected to the cylindrical upper / lower platen drive shaft 1421, and the tooth portion 1422 below the upper / middle platen drive shaft is rotated by the drive unit 1423, thereby rotating the rotation axis. Rotate around AA. Further, the upper and outer surface plates 143 of the upper surface plate 14 are connected to a cylindrical upper and outer surface plate driving shaft 1431 and rotated by rotating a tooth portion 1432 below the upper and outer surface plate driving shaft by the driving portion 1433. Rotate about axis AA.

ここで、以上の、太陽歯車１１、内歯歯車１２、下内定盤１３１、下中定盤１３２、下外定盤１３３、上内定盤１４１、上中定盤１４２、上外定盤１４３は、それぞれ駆動部１１３、１２１、１３１３、１３２３、１３３３、１４１３、１４２３、１４３３によって回転速度及び回転方向について独立に、各々を回転駆動することができる。そして、制御部５０は、各駆動部１１３、１２１、１３１３、１３２３、１３３３、１４１３、１４２３、１４３３の回転駆動動作を制御するものである。   Here, the sun gear 11, the internal gear 12, the lower inner surface plate 131, the lower middle surface plate 132, the lower outer surface plate 133, the upper inner surface plate 141, the upper middle surface plate 142, and the upper outer surface plate 143 are as follows. Each of the drive units 113, 121, 1313, 1323, 1333, 1413, 1423, and 1433 can be driven to rotate independently with respect to the rotation speed and the rotation direction. And the control part 50 controls the rotational drive operation | movement of each drive part 113, 121, 1313, 1323, 1333, 1413, 1423, 1433.

以下、このような研磨装置におけるワークの研磨動作について説明する。
研磨開始に先だって、作業者は、上部研磨部３０が下定盤１３から上方に離れた状態において、図２ｃに示す形状を有する大型の単一のワーク１１０用のキャリア１００を、複数、図２ｄに示すように、その外周の歯が太陽歯車１１と内歯歯車１２に噛み合うように、下定盤１３上に載置し、各キャリア１００の孔にワーク１１０を入れる。なお、ｃ１はキャリア１００を垂直方向から見たようすを表しており、ｃ２はキャリア１００を水平方向からみたようすを表している。 Hereinafter, a workpiece polishing operation in such a polishing apparatus will be described.
Prior to the start of polishing, the operator, in a state where the upper polishing portion 30 is separated from the lower surface plate 13 upward, includes a plurality of carriers 100 for a large single workpiece 110 having the shape shown in FIG. As shown, the workpiece 110 is placed in the hole of each carrier 100 so that the outer peripheral teeth mesh with the sun gear 11 and the internal gear 12. In addition, c1 represents the carrier 100 viewed from the vertical direction, and c2 represents the carrier 100 viewed from the horizontal direction.

そして、上部研磨部３０をワーク１１０上に下降させ、図示を省略した研磨剤供給機構によって研磨剤をワーク位置に供給しながら、予め定めた研磨シーケンスに従って駆動部１１３、１２１、１３１３、１３２３、１３３３、１４１３、１４２３、１４３３を制御部５０によって制御して、内歯歯車１２、太陽歯車１１、下内定盤１３１、下中定盤１３２、下外定盤１３３、上内定盤１４１、上中定盤１４２、上外定盤１４３を、各々回転させる。   Then, the upper polishing unit 30 is lowered onto the workpiece 110, and the driving units 113, 121, 1313, 1323, and 1333 are driven in accordance with a predetermined polishing sequence while supplying the abrasive to the workpiece position by an abrasive supply mechanism (not shown). , 1413, 1423, 1433 are controlled by the control unit 50, and the internal gear 12, sun gear 11, lower inner surface plate 131, lower middle surface plate 132, lower outer surface plate 133, upper inner surface plate 141, upper middle surface plate 142 and the upper and outer surface plates 143 are rotated.

ここで、このときに用いる研磨シーケンスでは、ワーク１１０の各位置における定盤との相対速度の時間平均が平滑化されるように、少なくとも下中定盤１３２は、下内定盤１３１や下外定盤１３３とは異なる回転速度で回転し、少なくとも上中定盤１４２は、上内定盤１４１や上外定盤１４３とは異なる回転速度で回転する。   Here, in the polishing sequence used at this time, at least the lower middle surface plate 132 and the lower inner surface plate 131 and the lower and outer surface plates are set so that the time average of the relative speed with respect to the surface plate at each position of the work 110 is smoothed. The upper and lower surface plates 142 rotate at a rotational speed different from that of the upper and lower surface plates 141 and 143.

これにより、キャリア１００に保持された各ワーク１１０は、回転軸ＡＡの回りを公転しながら、キャリア中心回りに回転しつつ、下定盤１３と上定盤１４によって上下の両面が、高い平面度をもって研磨される。
以上、本発明の実施形態について説明した。
なお、以上の実施形態では、上定盤１４と下定盤１３の双方を同軸状に３分割した場合について説明したが、この分割数は３以上の任意の数としてかまわない。また、上定盤１４と下定盤１３で、分割数を異ならせるようにしても良い。
また、下定盤１３と上定盤１４の一方のみを分割するようにしてもよい。たとえば、片面研磨を行う場合には、図３に示すようにワーク１１０の下面の研磨を行う下定盤１３のみを分割するようにしてもよい。なお、図示した研磨装置の構成は、図１に示した研磨装置の構成において、上部研磨部３０の上定盤１４を単一の定盤１５に置き換えたものである。 As a result, the workpieces 110 held by the carrier 100 revolve around the rotation axis AA and rotate around the center of the carrier, while the lower and upper surfaces 13 and 14 have high flatness on both upper and lower surfaces. Polished.
The embodiment of the present invention has been described above.
In the above embodiment, the case where both the upper surface plate 14 and the lower surface plate 13 are divided into three coaxially has been described. However, the number of divisions may be an arbitrary number of 3 or more. Further, the upper surface plate 14 and the lower surface plate 13 may have different numbers of divisions.
Further, only one of the lower surface plate 13 and the upper surface plate 14 may be divided. For example, when performing single-side polishing, only the lower surface plate 13 for polishing the lower surface of the workpiece 110 may be divided as shown in FIG. The configuration of the illustrated polishing apparatus is obtained by replacing the upper surface plate 14 of the upper polishing unit 30 with a single surface plate 15 in the configuration of the polishing apparatus shown in FIG.

本発明の実施形態に係る研磨装置の構成を示す図である。It is a figure showing composition of a polish device concerning an embodiment of the present invention. 本発明の実施形態に係る定盤の分割構成を示す図である。It is a figure which shows the division | segmentation structure of the surface plate which concerns on embodiment of this invention. 本発明の実施形態に係る研磨装置の他の構成例を示す図である。It is a figure which shows the other structural example of the grinding | polishing apparatus which concerns on embodiment of this invention. 従来の研磨装置の構成を示す図である。It is a figure which shows the structure of the conventional grinding | polishing apparatus.

符号の説明Explanation of symbols

１１…太陽歯車、１２…内歯歯車、１３…下定盤、１４…上定盤、２０…ベース、２１…アーム部、２２…伸縮シリンダ、３０…上部研磨部、３１…フレーム、５０…制御部、１００…キャリア、１１０…ワーク、１１１…太陽歯車駆動軸、１３１…下内定盤、１３２…下中定盤、１３３…下外定盤、１４１…上内定盤、１４２…上中定盤、１４３…上外定盤。   DESCRIPTION OF SYMBOLS 11 ... Sun gear, 12 ... Internal gear, 13 ... Lower surface plate, 14 ... Upper surface plate, 20 ... Base, 21 ... Arm part, 22 ... Telescopic cylinder, 30 ... Upper grinding | polishing part, 31 ... Frame, 50 ... Control part , 100 ... carrier, 110 ... work, 111 ... sun gear drive shaft, 131 ... lower inner surface plate, 132 ... lower middle surface plate, 133 ... lower outer surface plate, 141 ... upper inner surface plate, 142 ... upper middle surface plate, 143 … Upper and outer surface plate.

Claims (2)

同軸に配置された太陽歯車と内歯歯車を用いて所定数のキャリアを自転させながら太陽歯車の周囲に公転させ、前記キャリアに保持された被研磨体の上下面を下定盤と上定盤によって研磨する研磨装置であって、
前記下定盤は、同軸状に上面を揃えて配置された、複数の下部分定盤より構成され、
前記上定盤は、同軸状に下面を揃えて配置された、複数の上部分定盤より構成され、
当該研磨装置は、
前記各下部分定盤の各々をそれぞれ独立に回転駆動する下定盤駆動部と、
前記各上部分定盤の各々をそれぞれ独立に回転駆動する上定盤駆動部とを有することを特徴とする研磨装置。 Using a sun gear and an internal gear arranged coaxially, a predetermined number of carriers are revolved around the sun gear while rotating, and the upper and lower surfaces of the object to be polished held by the carrier are lowered by the lower surface plate and the upper surface plate. A polishing apparatus for polishing,
The lower surface plate is composed of a plurality of lower partial surface plates arranged coaxially with the upper surface aligned.
The upper surface plate is composed of a plurality of upper partial surface plates that are coaxially arranged with the lower surface aligned.
The polishing apparatus
A lower surface plate driving section for independently rotating and driving each of the lower partial surface plates;
A polishing apparatus, comprising: an upper surface plate driving unit that rotationally drives each of the upper partial surface plates independently. 同軸に配置された太陽歯車と内歯歯車を用いて所定数のキャリアを自転させながら太陽歯車の周囲に公転させ、前記キャリアに保持された被研磨体の片面を定盤によって研磨する研磨装置であって、
前記定盤は、同軸状に研磨面を揃えて配置された、複数の部分定盤より構成され、
当該研磨装置は、
前記各部分定盤の各々をそれぞれ独立に回転駆動する定盤駆動部を有することを特徴とする研磨装置。 A polishing device that revolves around a sun gear while rotating a predetermined number of carriers using a sun gear and an internal gear arranged coaxially, and polishes one surface of the object to be polished held by the carrier with a surface plate. There,
The surface plate is composed of a plurality of partial surface plates arranged coaxially with the polishing surface aligned,
The polishing apparatus
A polishing apparatus, comprising: a surface plate driving unit that independently rotates each of the partial surface plates.
JP2003398438A 2003-11-28 2003-11-28 Polishing device Pending JP2005153118A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108312024A (en) * 2018-04-18 2018-07-24 安徽顺怡隆机械设备有限公司 A kind of indexing type mobile phone 3D curved surface polishing machines

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108312024A (en) * 2018-04-18 2018-07-24 安徽顺怡隆机械设备有限公司 A kind of indexing type mobile phone 3D curved surface polishing machines

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