JP2005151560A - 多層セラミック音響変換器の作製方法 - Google Patents
多層セラミック音響変換器の作製方法 Download PDFInfo
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- JP2005151560A JP2005151560A JP2004326667A JP2004326667A JP2005151560A JP 2005151560 A JP2005151560 A JP 2005151560A JP 2004326667 A JP2004326667 A JP 2004326667A JP 2004326667 A JP2004326667 A JP 2004326667A JP 2005151560 A JP2005151560 A JP 2005151560A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/057—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49007—Indicating transducer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
【解決手段】 全体の電気インピーダンスが低い多層音響変換器の製造方法は、金属化された表面を薄い導電体に突き合わせる状態で2つの圧電セラミック層(2、4)を結合し、次いで、上部表面と底部表面とを電気的に接続してラップアラウンド型電極を形成すると共に、中心伝導体(6)が第2の電極を形成することに基づく。この方法で接続された圧電層からなる2層セラミックスタックの全体の電気インピーダンスは、同じ寸法の固体セラミック素子の電気インピーダンスの4分の1である。このことは、電気ケーブルのインピーダンスに対する音響スタックインピーダンス整合がより良好になされ、改良された音響素子感度を提供する。
【選択図】 図9
Description
4 セラミック材料
6 接地電極
10 誘電層
12 トレース
16 金属被覆
18 金属被覆
20 空隙
24 音響バッキング材料
26 トレース
Claims (10)
- 加工物の製造方法であって、
セラミック材料の2つのピース(2、4)を備え、これらの間に金属電極(6)を有する積層構造体を構成する段階と、
前記積層構造体を前記電極に垂直な平行平面に沿って切断し、それぞれの電極を有する複数の積層ピースを形成する段階と、
前記積層構造体を順に結合(8)して、前記電極が間隔を置いて配置され且つ実質的に互いに平行である結合スタックを形成する段階と、
前記電極の端部が露出している前記結合スタックの一方の側の表面上に誘電材料の層(10)を配置する段階と、
を含む方法。 - 前記構成する段階が、各セラミックピースの表面を金属化する段階を含む請求項1に記載の方法。
- 前記構成する段階が、
前記金属化された層が金属フォイルに接触する状態で該金属フォイルの両側に前記セラミックピースを配置する段階と、
前記金属化されたセラミックピースと金属とを共に積層して積層構造体を形成する段階と、
を更に含む請求項2に記載の方法。 - 前記誘電材料の層の表面をパターン形成された金属で被覆する段階を更に含む請求項1に記載の方法。
- 前記積層されたピースが結合されているそれぞれの平面に沿って前記結合スタックを切断し、これによって、各々が一方の側に誘電材料の層と他方の側にスペーサ材料の層とを備える複数の修正積層ピースを形成する段階と、
隣接する修正積層ピースの誘電材料の層に各修正積層ピースの前記スペーサ材料の層が突き合う状態で且つ前記電極が実質的に同一表面にある状態で、前記修正積層ピースをアレイで配置する段階と、
を更に含む請求項4に記載の方法。 - 前記同一平面の電極に実質的に平行な前記修正積層ピースの表面を金属化する段階を更に含む請求項5に記載の方法。
- 前記修正積層ピースの各々が縦軸に平行に配置されたバーであり、前記同一平面の電極によって定められる平面の一方側に配置された前記修正積層ピースのアレイの一部を切断する段階を更に含み、各切断部が前記縦軸に実質的に垂直なそれぞれの平面内にあり、前記切断する段階が前記金属化段階の前又は後に行われることを特徴とする請求項6に記載の方法。
- 電気信号コネクタ(26)のパターン形成されたアレイ上に前記修正積層ピースのアレイの切断された部分をセットする段階と、前記修正積層ピースのアレイの突き合わされている金属化表面のそれぞれの区域が前記電気信号コネクタに接触する状態で前記各ピースを互いに結合する段階と、
を更に含む請求項7に記載の方法。 - 前記中心金属層の同一平面区域によって定められる前記平面の他方側に配置された前記修正積層ピースの一部分を切断する段階を更に含み、各切断部が前記一方側のそれぞれの切断部と実質的に同一平面内にあることを特徴とする請求項8に記載の方法。
- 電気信号コネクタ(26)のパターン形成されたアレイを、前記電気信号コネクタのそれぞれの端部が前記本体の表面で露出された状態で音響減衰材料の本体(24)内に埋め込む段階を更に含み、前記修正積層ピースのアレイを前記電気信号コネクタのパターン形成されたアレイに結合する段階が前記修正積層ピースのアレイを前記本体に結合する段階を含むことを特徴とする請求項9に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/706,820 US7017245B2 (en) | 2003-11-11 | 2003-11-11 | Method for making multi-layer ceramic acoustic transducer |
US10/706,820 | 2003-11-11 |
Publications (2)
Publication Number | Publication Date |
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JP2005151560A true JP2005151560A (ja) | 2005-06-09 |
JP4702826B2 JP4702826B2 (ja) | 2011-06-15 |
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Family Applications (1)
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JP2004326667A Expired - Fee Related JP4702826B2 (ja) | 2003-11-11 | 2004-11-10 | 多層セラミック音響変換器の作製方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US7017245B2 (ja) |
JP (1) | JP4702826B2 (ja) |
DE (1) | DE102004054293A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015033409A (ja) * | 2013-08-07 | 2015-02-19 | コニカミノルタ株式会社 | 超音波探触子 |
CN109984771A (zh) * | 2019-05-06 | 2019-07-09 | 上海爱声生物医疗科技有限公司 | 一种超声换能器探头及超声成像仪 |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5067821B2 (ja) * | 2001-04-13 | 2012-11-07 | 古野電気株式会社 | 多周波送受波器 |
US7017245B2 (en) * | 2003-11-11 | 2006-03-28 | General Electric Company | Method for making multi-layer ceramic acoustic transducer |
US7156938B2 (en) * | 2003-11-11 | 2007-01-02 | General Electric Company | Method for making multi-layer ceramic acoustic transducer |
JP4805254B2 (ja) * | 2004-04-20 | 2011-11-02 | ビジュアルソニックス インコーポレイテッド | 配列された超音波トランスデューサ |
US20070222339A1 (en) * | 2004-04-20 | 2007-09-27 | Mark Lukacs | Arrayed ultrasonic transducer |
US20080229749A1 (en) * | 2005-03-04 | 2008-09-25 | Michel Gamil Rabbat | Plug in rabbat engine |
CA2628100C (en) | 2005-11-02 | 2016-08-23 | Visualsonics Inc. | High frequency array ultrasound system |
US7622848B2 (en) * | 2006-01-06 | 2009-11-24 | General Electric Company | Transducer assembly with z-axis interconnect |
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DE102006025960B4 (de) * | 2006-06-02 | 2011-04-07 | Infineon Technologies Ag | Verfahren zur Herstellung einer integrierten Halbleitereinrichtung |
AT503816B1 (de) * | 2006-06-06 | 2008-01-15 | Piezocryst Advanced Sensorics | Piezoelektrischer sensor |
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US7573721B2 (en) * | 2007-05-17 | 2009-08-11 | Kinsus Interconnect Technology Corp. | Embedded passive device structure and manufacturing method thereof |
WO2009011089A1 (ja) * | 2007-07-19 | 2009-01-22 | Panasonic Corporation | 超音波探触子とこれを用いた超音波診断装置および超音波探傷装置 |
US20090183350A1 (en) * | 2008-01-17 | 2009-07-23 | Wetsco, Inc. | Method for Ultrasound Probe Repair |
WO2009099438A1 (en) * | 2008-02-05 | 2009-08-13 | Morgan Advanced Ceramics, Inc. | Encapsulation coating to reduce particle shedding |
US9184369B2 (en) | 2008-09-18 | 2015-11-10 | Fujifilm Sonosite, Inc. | Methods for manufacturing ultrasound transducers and other components |
WO2010033867A1 (en) * | 2008-09-18 | 2010-03-25 | Visualsonics Inc. | Methods for acquisition and display in ultrasound imaging |
US9173047B2 (en) | 2008-09-18 | 2015-10-27 | Fujifilm Sonosite, Inc. | Methods for manufacturing ultrasound transducers and other components |
US7842613B1 (en) * | 2009-01-07 | 2010-11-30 | Integrated Device Technology, Inc. | Methods of forming microelectronic packaging substrates having through-substrate vias therein |
US8237334B2 (en) | 2009-04-22 | 2012-08-07 | Parker-Hannifin Corporation | Piezo actuator |
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US8680745B2 (en) | 2010-07-21 | 2014-03-25 | General Electric Company | Device for measuring material thickness |
US8264129B2 (en) | 2010-07-21 | 2012-09-11 | General Electric Company | Device and system for measuring material thickness |
US9237880B2 (en) * | 2011-03-17 | 2016-01-19 | Koninklijke Philips N.V. | Composite acoustic backing with high thermal conductivity for ultrasound transducer array |
JP5729280B2 (ja) * | 2011-11-30 | 2015-06-03 | ヤマハ株式会社 | 静電型スピーカ |
US8857261B2 (en) | 2012-04-12 | 2014-10-14 | General Electric Company | Sensing device and method of attaching the same |
JP5963603B2 (ja) * | 2012-08-03 | 2016-08-03 | オリンパス株式会社 | 超音波振動デバイス、超音波振動デバイスの製造方法および超音波医療装置 |
US9432788B2 (en) * | 2013-10-17 | 2016-08-30 | Audeze Llc | Thin film circuit for acoustic transducer and methods of manufacture |
US10712457B2 (en) | 2013-11-20 | 2020-07-14 | Arizona Board Of Regents On Behalf Of Arizona State University | Microfabrication technology for producing sensing cells for molecular electronic transducer based seismometer |
CN103826190B (zh) * | 2014-02-13 | 2017-09-22 | 海鹰企业集团有限责任公司 | 小尺寸阵元及由该阵元组成的低旁瓣高频声基阵 |
JP6091460B2 (ja) * | 2014-04-11 | 2017-03-08 | シマネ益田電子株式会社 | 電子部品の製造方法 |
US10596598B2 (en) * | 2016-12-20 | 2020-03-24 | General Electric Company | Ultrasound transducer and method for wafer level front face attachment |
CN111684302A (zh) | 2018-01-02 | 2020-09-18 | 皇家飞利浦有限公司 | 高功率微波束形成器超声换能器探头 |
US11806191B2 (en) * | 2018-05-21 | 2023-11-07 | General Electric Company | Phased array transducers and wafer scale manufacturing for making the same |
CN109449282A (zh) * | 2018-10-24 | 2019-03-08 | 海鹰企业集团有限责任公司 | 一种提高高频多基元换能器电绝缘性能的方法 |
US11417309B2 (en) * | 2018-11-29 | 2022-08-16 | Ascent Venture, Llc. | Ultrasonic transducer with via formed in piezoelectric element and method of fabricating an ultrasonic transducer including milling a piezoelectric substrate |
CN115474128B (zh) * | 2022-10-19 | 2024-03-08 | 哈尔滨工业大学(威海) | 一种高灵敏度水声换能器 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0387076A (ja) * | 1989-08-30 | 1991-04-11 | Nec Corp | 圧電アクチュエータ及びその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217684A (en) * | 1979-04-16 | 1980-08-19 | General Electric Company | Fabrication of front surface matched ultrasonic transducer array |
DE3021449A1 (de) * | 1980-06-06 | 1981-12-24 | Siemens AG, 1000 Berlin und 8000 München | Ultraschallwandleranordnung und verfahren zu seiner herstellung |
US4460841A (en) * | 1982-02-16 | 1984-07-17 | General Electric Company | Ultrasonic transducer shading |
US5329496A (en) * | 1992-10-16 | 1994-07-12 | Duke University | Two-dimensional array ultrasonic transducers |
US5381385A (en) * | 1993-08-04 | 1995-01-10 | Hewlett-Packard Company | Electrical interconnect for multilayer transducer elements of a two-dimensional transducer array |
JP3846271B2 (ja) * | 2001-11-05 | 2006-11-15 | 松下電器産業株式会社 | 薄膜圧電体素子およびその製造方法 |
JP2003272324A (ja) * | 2002-03-15 | 2003-09-26 | Matsushita Electric Ind Co Ltd | 薄膜圧電体素子およびその製造方法並びにアクチュエータ |
US7017245B2 (en) * | 2003-11-11 | 2006-03-28 | General Electric Company | Method for making multi-layer ceramic acoustic transducer |
US7082655B2 (en) * | 2003-12-18 | 2006-08-01 | Ge Inspection Technologies, Lp | Process for plating a piezoelectric composite |
-
2003
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- 2004-11-09 DE DE102004054293A patent/DE102004054293A1/de not_active Withdrawn
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0387076A (ja) * | 1989-08-30 | 1991-04-11 | Nec Corp | 圧電アクチュエータ及びその製造方法 |
Cited By (3)
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---|---|---|---|---|
JP2015033409A (ja) * | 2013-08-07 | 2015-02-19 | コニカミノルタ株式会社 | 超音波探触子 |
CN109984771A (zh) * | 2019-05-06 | 2019-07-09 | 上海爱声生物医疗科技有限公司 | 一种超声换能器探头及超声成像仪 |
CN109984771B (zh) * | 2019-05-06 | 2021-12-31 | 上海爱声生物医疗科技有限公司 | 一种超声换能器探头及超声成像仪 |
Also Published As
Publication number | Publication date |
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US7148608B2 (en) | 2006-12-12 |
US7017245B2 (en) | 2006-03-28 |
JP4702826B2 (ja) | 2011-06-15 |
DE102004054293A1 (de) | 2005-06-02 |
US20060117551A1 (en) | 2006-06-08 |
US20050099096A1 (en) | 2005-05-12 |
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