JP2005138393A - Method for fixing ink tank and storage element together - Google Patents

Method for fixing ink tank and storage element together Download PDF

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Publication number
JP2005138393A
JP2005138393A JP2003376540A JP2003376540A JP2005138393A JP 2005138393 A JP2005138393 A JP 2005138393A JP 2003376540 A JP2003376540 A JP 2003376540A JP 2003376540 A JP2003376540 A JP 2003376540A JP 2005138393 A JP2005138393 A JP 2005138393A
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Prior art keywords
ink tank
adhesive
storage element
ink
memory element
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JP2003376540A
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Masashi Ogawa
将史 小川
亘 ▲高▼橋
Wataru Takahashi
Hiromasa Yasuma
弘雅 安間
Yasuo Kotaki
小瀧　　靖夫
Hideo Shidara
英男 設楽
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Canon Inc
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that cost is increased because management of each fixing state is required due to the fixation of the same member by a plurality of different methods, process management is required, and also management is required due to an increase in the number of components. <P>SOLUTION: Characteristically, an introduction passage, which can guide an adhesive for fixing a storage element and an ink tank together, is provided on the outer peripheries of a plurality of retaining surfaces for retaining the backside of the storage element, which serves as a sticking surface on the outer periphery of the ink tank, subjected to the sticking of the storage element for performing a predetermined operation by bringing about electric continuity between the ink tank mounted on an inkjet recording apparatus and having the function of holding the ink, and an ink ejection part having the function of ejecting the ink. Characteristically, the adhesive, which is a post-application delayed curing type one, singly makes the storage element and the ink tank fixed together after being completely cured. In addition, characteristically, the retaining surface is arranged in a position to face a contact area for bringing about the electric continuity. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

インクジェット記録を行うインクタンクに関する。   The present invention relates to an ink tank for performing ink jet recording.

インクタンクに半導体を内蔵した記憶素子を固定し、電気的接続によりプリンタの印字情報を通信する方法が用いられてきた。その際、記憶素子とインクタンクとの固定が不安定であると確実な電気的接続状態を維持できないという問題が発生する。   A method has been used in which a storage element containing a semiconductor is fixed in an ink tank, and print information of a printer is communicated by electrical connection. At that time, if the fixing between the storage element and the ink tank is unstable, there is a problem that a reliable electrical connection state cannot be maintained.

その為、これまでインクタンクに記憶素子を取り付ける方法として、インクタンクに設けたピンと記憶素子に設けた開口を勘合させた後、熱もしくはねじり振動によりカシメることにより固定する方法、記憶素子裏面に両面テープを貼り、インクタンクに固定する方法、接着剤にて記憶素子裏面とインクタンクを固定する方法が用いられてきた。   Therefore, as a method of attaching the storage element to the ink tank so far, after fixing the pin provided in the ink tank and the opening provided in the storage element and then fixing by crimping by heat or torsional vibration, A method of attaching a double-sided tape and fixing the ink tank to the ink tank, and a method of fixing the back surface of the storage element and the ink tank with an adhesive have been used.

特開平2001-212976などに示されるカシメを用いて固定する方法は、インクタンクにピンを設け、記憶素子に開口を設けなければならず、ピンと開口のクリアランス分のガタが発生し、また、ピンはカシメに必要な長さを確保する必要がある。ピンは、成型の際に形状が十分に得られない場合や、インクタンク製造工程において超音波溶着などを行った際に、ピン根元にエネルギが集中しもしくは、工程内でのハンドリングの際にピン折れ等が発生してしまい記憶素子を固定する事が出来なくなってしまう。   In the fixing method using caulking as disclosed in Japanese Patent Application Laid-Open No. 2001-212976 or the like, a pin is provided in the ink tank and an opening in the storage element must be provided, and a clearance corresponding to the clearance between the pin and the opening occurs. It is necessary to secure the length necessary for caulking. When a pin does not have a sufficient shape during molding, or when ultrasonic welding is performed in the ink tank manufacturing process, energy is concentrated at the root of the pin, or the pin is used for handling in the process. Breaking or the like occurs, and the memory element cannot be fixed.

また、カシメを行った部分は記憶素子パッド部より凸となる為、記憶素子と接続するコネクタのピンを曲げてしまう場合や、カシメ部を脱落させる場合があり、記憶素子との電気的接続状態が得られなくなってしまう。   In addition, since the crimped part is convex from the memory element pad part, the pin of the connector connected to the memory element may be bent or the caulking part may be dropped, and the electrical connection state with the memory element Can no longer be obtained.

そのため、カシメ部がコネクタピンと干渉しないようにカシメ位置を配置することや、ピン曲げ対策および、記憶素子カシメ部を半抜きするなどの対策が必要となる。   For this reason, it is necessary to take measures such as arranging the caulking position so that the caulking portion does not interfere with the connector pin, countermeasures against pin bending, and half removal of the memory element caulking portion.

両面テープを用いる方法では、記憶素子貼り付け位置を組み立て時の装置精度にて決める事が可能であるが、両面テープの種類によっては経時変化により剥がれが発生する場合や、記憶素子と両面テープを貼り付ける工程・両面テープとインクタンクを貼り付ける工程各々に位置決めが必要となり、複雑化する為自動機による大量生産が困難となる場合がある。   In the method using double-sided tape, the storage element attachment position can be determined by the accuracy of the device at the time of assembly, but depending on the type of double-sided tape, peeling may occur due to aging, or the storage element and double-sided tape may be attached. Positioning is required for each of the attaching process and the attaching process of the double-sided tape and the ink tank, which may be complicated and difficult to mass-produce with an automatic machine.

接着剤を用いる方法では、接着剤の流れの制御が困難な為、両面テープのように部品にて厚み管理することは困難なことから貼り付け装置により傾斜して貼り付けられる場合がある。   In the method using an adhesive, since it is difficult to control the flow of the adhesive, it is difficult to control the thickness with a component such as a double-sided tape, and therefore, the adhesive may be attached with an inclination by an attaching device.

また、接着剤が記憶素子の接続領域と対向する部分に充填されず、電気的接触を行った際接点不良を引き起こしてしまう場合や、接着剤の種類によっては接続時の荷重にてたわみが発生する為同様に接点不良を引き起こしてしまう場合がある。   In addition, the adhesive is not filled in the area facing the connection area of the memory element, causing a contact failure when making electrical contact, and depending on the type of adhesive, deflection may occur due to the load at the time of connection. For this reason, a contact failure may occur as well.

そのため、貼り付け面とは別に記憶素子裏面に受け面を設ける場合や、転写もしくはスポット塗布等を行う場合がある。   Therefore, a receiving surface may be provided on the back surface of the memory element separately from the pasting surface, or transfer or spot coating may be performed.

転写は、使用する接着剤の粘度および非転写面側の形状に大きく依存し、粘度が高いもしくは形状が複雑な場合転写することができない。   The transfer greatly depends on the viscosity of the adhesive used and the shape on the non-transfer surface side, and cannot be transferred when the viscosity is high or the shape is complicated.

スポットによる塗布は記憶素子裏面の一部のみ固定する為剥離強度が低く、電気的接続を行う際に記憶素子が移動・脱落もしくはたわむ為安定した接続を得られない場合がある。   Since application by spot fixes only a part of the back surface of the memory element, the peel strength is low, and when the electrical connection is made, the memory element may move, drop or bend, and a stable connection may not be obtained.

その為、記憶素子裏面の一部に接着剤をスポット塗布することにより固定し、接続領域と対向するパッド裏面はインクタンクに設けた受け部に両面テープを貼る事により固定する方法がとられてきた。   For this reason, a method has been adopted in which adhesive is applied to a part of the back surface of the memory element by spot coating, and the back surface of the pad opposite to the connection area is fixed by attaching a double-sided tape to a receiving portion provided in the ink tank. It was.

また、接着剤と両面テープなど複数の固定方法を併用する場合、各々の貼り付け面高さを管理する必要があり、また接着剤を再溶融させるなどの方法が必要となる。   Further, when a plurality of fixing methods such as an adhesive and a double-sided tape are used in combination, it is necessary to manage the height of each affixed surface and to remelt the adhesive.

接着剤を再溶融させる場合、接着剤の劣化等により接着不良となる恐れがある。   When the adhesive is remelted, there is a risk of poor adhesion due to deterioration of the adhesive or the like.

同一部材を異なる複数の方法で固定する為各々の固定状態の管理が必要となり、工程管理が必要となり、部品点数の増加により管理も必要となり、コストUPにつながってしまう。   Since the same member is fixed by a plurality of different methods, it is necessary to manage each of the fixed states, process management is required, and management is also required due to an increase in the number of parts, leading to an increase in cost.

上記問題を解決するため、本発明のインクタンクは、インクジェット記録装置に搭載され、インクを保持する機能を持つインクタンクと、インクを吐出する機能を持つインク吐出部との間で電気的導通を行うことにより所定の動作を行う記憶素子を貼り付けるインクタンク外周の貼り付け面であって、記憶素子裏面を受ける複数からなる受け面外周に、記憶素子とインクタンクを固定するための接着剤を導くことが可能な導入路を持つことを特徴とする。   In order to solve the above problem, the ink tank of the present invention is mounted on an ink jet recording apparatus and has electrical continuity between an ink tank having a function of holding ink and an ink discharge unit having a function of discharging ink. An adhesive for fixing the storage element and the ink tank is provided on the outer peripheral surface of the ink tank that is attached to the outer periphery of the ink tank to which the storage element that performs a predetermined operation is performed. It is characterized by having an introduction path that can be guided.

また前期接着剤は、塗布後遅延硬化形の接着剤であって、完全硬化後記憶素子とインクタンクを単独で固定する事を特徴とする。   The first-stage adhesive is a delayed-cure type adhesive after application, and is characterized by fixing the memory element and the ink tank independently after complete curing.

また前記受け面は、電気的導通を行う接点領域に対向する位置に配置されている事を特徴とする。   In addition, the receiving surface is arranged at a position facing a contact area for conducting electrical conduction.

上記構成により、記憶素子の位置はインクタンクにて規制することが可能となり、接続部と対向する領域はインクタンクにて保持することが可能となり、安定した電気的接続状態を維持できると共に、貼り付け精度の向上が図れ、コストダウンを行う事が可能となる。   With the above configuration, the position of the storage element can be regulated by the ink tank, and the region facing the connection portion can be held by the ink tank, so that a stable electrical connection state can be maintained and affixed. It is possible to improve the attaching accuracy and reduce the cost.

また、単一の接着剤にて記憶素子の固定を行う事が可能となり管理や工程が容易になる事からコストダウンが可能となる。   Further, it is possible to fix the memory element with a single adhesive, and the management and the process become easy, so that the cost can be reduced.

次に本発明の実施例１について図面を参照して説明する。   Next, Embodiment 1 of the present invention will be described with reference to the drawings.

図１ａは記憶素子２貼り付け前のインクタンク１を示した物で、図１ｂは記憶素子２貼り付け後のインクタンク１を示した物である。   FIG. 1 a shows the ink tank 1 before the storage element 2 is attached, and FIG. 1 b shows the ink tank 1 after the storage element 2 is attached.

貼り付け面３は、記憶素子２の裏面に当接する、受け面４a、受け面４b、受け面４cを3カ所配置し、その中央は、記憶素子２の凸部（図示せず）を逃げるポッティング逃げ５を設けている。   The affixing surface 3 has three receiving surfaces 4a, 4b, and 4c that are in contact with the back surface of the memory element 2, and the center thereof is a potting that escapes a convex portion (not shown) of the memory element 2. Escape 5 is provided.

図２は貼り付け面３を拡大したもので、受け面４a、受け面４b、は記憶素子２を貼り付けた際、記憶素子２表面に配置した電気的接続を行うパッド７（ハッチング領域）と、インクタンク１装着状態に於いてパッド７に接触し電気的接続を行うコネクタ接触領域８と対向する位置に配置している。   FIG. 2 is an enlarged view of the attaching surface 3. The receiving surface 4a and the receiving surface 4b are pads 7 (hatching regions) for electrical connection arranged on the surface of the storage element 2 when the storage element 2 is attached. In the state where the ink tank 1 is mounted, it is arranged at a position facing the connector contact area 8 which contacts the pad 7 and performs electrical connection.

受け面４cは、受け面４a、受け面４b、受け面４cの計3点を結ぶ三角形の内部に 記憶素子２の重心が入るように配置する事が望ましい。   The receiving surface 4c is preferably arranged so that the center of gravity of the storage element 2 enters the inside of a triangle connecting the receiving surface 4a, the receiving surface 4b, and the receiving surface 4c.

図３から８は、インクタンク１の記憶素子２を貼り付け面３に記憶素子２を貼り付ける工程示したものである。   3 to 8 show a process of attaching the storage element 2 to the attachment surface 3 of the storage element 2 of the ink tank 1.

本実施例にて用いた接着剤９は約190℃にて5000CPSの粘度を示し、完全硬化まで約45Sec.必要なホットメルト接着剤を用いた。   The adhesive 9 used in this example had a viscosity of 5000 CPS at about 190 ° C., and a hot-melt adhesive required about 45 Sec. Until complete curing was used.

記憶素子とインクタンクのX及びZ方向の位置決めを行い、Y方向より記憶素子をインクタンクに貼り付ける。   The storage element and the ink tank are positioned in the X and Z directions, and the storage element is attached to the ink tank from the Y direction.

第一の段階として図３a、図３bに示すようにインクタンク１の貼り付け面３に接着剤９を定量塗布する。（図３bは図３aにおけるA-Aでの断面を模式的に表したものである。）
第二の段階として図４a、図４bに示すように記憶素子裏面のポッティングと塗布した接着剤が当接する。（図４bは図４aにおけるA-Aでの断面を模式的に表したものである。）
この際、常温常圧下において約190℃にて塗布した接着剤９は塗布直後3秒にて表面温度は約20℃低下するが、完全硬化前の段階である為、接着剤９は記憶素子２貼り付け動作により追従する。 As a first step, as shown in FIGS. 3 a and 3 b, a predetermined amount of adhesive 9 is applied to the attachment surface 3 of the ink tank 1. (FIG. 3b schematically shows a cross section taken along line AA in FIG. 3a.)
As a second step, as shown in FIGS. 4a and 4b, the potting on the back surface of the memory element and the applied adhesive come into contact. (FIG. 4b schematically shows a cross section taken along line AA in FIG. 4a.)
At this time, the surface temperature of the adhesive 9 applied at about 190 ° C. under normal temperature and normal pressure drops by about 20 ° C. in 3 seconds immediately after the application. Follow by pasting operation.

第三の段階では図５a、図５bに示すように、記憶素子２をさらにインクタンク１の貼り付け面３側へ押し込むことにより接着剤９をポッティング及びポッティング逃げ５の間に形成される空間にならい記憶素子２裏面に充填させる。（図５bは図５aにおけるA-Aでの断面を模式的に表したものである。）
第四の段階として図６a、図６bに示すように、充填途中の接着剤９はインクタンク貼り付け面３に設けた受け面側壁１０が抵抗となる為、広がり方向を制限されより抵抗の少ない記憶素子底面側１１の導入路６bへ優先的に広がる。（図６bは図６aにおけるA-Aでの断面を模式的に表したものである。）
第五の段階では図７a、図７bに示すように、受け面４a、受け面４bとの間に設けた幅2mmの中央導入路１２に達した接着剤９は抵抗が減少する為中央導入路１２に接着剤９が充填される。（図７bは図７aにおけるA-Aでの断面を模式的に表したものである。）
第六の段階として図８a、図８b示すように、受け面４a、受け面４bとの間に設けた幅2mmの中央導入路１２より記憶素子２上部へ広がった接着剤９は受け面４外周に設けた導入路６aにより再度移動方向を規制される為、受け面４外周に接着剤９が充填される。（図８bは図８aにおけるA-Aでの断面を模式的に表したものである。）
第六の段階で、記憶素子２裏面とインクタンク貼り付け面３の受け面４とが当接することにより記憶素子１はとインクタンク１のY方向の位置決めが可能となる。 In the third stage, as shown in FIGS. 5a and 5b, the storage element 2 is further pushed into the affixing surface 3 side of the ink tank 1 so that the adhesive 9 is formed in the space formed between the potting and the potting relief 5. The back of the storage element 2 is filled. (FIG. 5b schematically shows a cross section taken along line AA in FIG. 5a.)
As a fourth stage, as shown in FIGS. 6a and 6b, the adhesive 9 in the middle of filling has resistance due to the receiving surface side wall 10 provided on the ink tank attaching surface 3, so that the spreading direction is limited and less resistance. It preferentially spreads to the introduction path 6b on the bottom surface side 11 of the storage element. (FIG. 6b schematically shows a cross section taken along line AA in FIG. 6a.)
In the fifth stage, as shown in FIGS. 7a and 7b, the adhesive 9 that reaches the central introduction path 12 having a width of 2 mm provided between the receiving surface 4a and the receiving surface 4b reduces the resistance, so that the central introduction path 12 is filled with the adhesive 9. (FIG. 7b schematically shows a cross section taken along line AA in FIG. 7a.)
As a sixth stage, as shown in FIGS. 8 a and 8 b, the adhesive 9 spreading to the upper part of the storage element 2 from the central introduction path 12 having a width of 2 mm provided between the receiving surface 4 a and the receiving surface 4 b is the outer periphery of the receiving surface 4. Since the direction of movement is again regulated by the introduction path 6a provided in the outer periphery, the outer periphery of the receiving surface 4 is filled with the adhesive 9. (FIG. 8b schematically shows a cross section taken along line AA in FIG. 8a.)
In the sixth stage, the back surface of the storage element 2 and the receiving surface 4 of the ink tank attachment surface 3 come into contact with each other, whereby the storage element 1 and the ink tank 1 can be positioned in the Y direction.

上記段階まで約10秒以内であれば接着強度が大きく低下する事は無い。   If it is within about 10 seconds until the above stage, the adhesive strength is not greatly reduced.

第７の段階として、接着剤９の完全硬化まで記憶素子２とインクタンク１との当接状態を保持することにより固定を行う。   As a seventh stage, fixing is performed by maintaining the contact state between the storage element 2 and the ink tank 1 until the adhesive 9 is completely cured.

本実施例における、インクタンクは成型樹脂材料としてポリプロピレンを用い、容器自体からの蒸発を抑制している反面、表面エネルギが低いことから接着が困難な為、低表面エネルギ樹脂材料と電子部品との固定に優れた接着剤の一つとしてホットメルト剤を用いたが、インクタンク１の材質および使用環境・記憶素子２形状に合わせて適時選択することが望ましい。   In the present embodiment, the ink tank uses polypropylene as the molding resin material, and suppresses evaporation from the container itself, but because the surface energy is low, it is difficult to bond, so the low surface energy resin material and the electronic component Although a hot melt agent is used as one of the adhesives excellent in fixing, it is desirable to select it in accordance with the material of the ink tank 1 and the use environment / memory element 2 shape.

接着剤選定に当たっては、塗布後瞬間硬化する接着剤は貼り付け前に硬化する場合があり、使用および管理が困難となる為、塗布後遅延硬化する接着剤の方が望ましい。さらに、貼り付け後は短時間で硬化し接着強度が得られる接着剤を選択する方が望ましく、例えば、安価な遅延硬化型のUV接着剤や、2液混合接着剤などを用いる事も有用である。   In selecting an adhesive, an adhesive that cures instantaneously after application may be cured before application, and is difficult to use and manage. Therefore, an adhesive that is delayed and cured after application is preferable. In addition, it is desirable to select an adhesive that can be cured in a short time after bonding to obtain adhesive strength.For example, it is also useful to use an inexpensive delayed curing UV adhesive or a two-component mixed adhesive. is there.

その際、貼り付け面３表面をコロナ処理等により接着に適した表面状態に改質することにより、接着強度を向上させてもよい。   At that time, the adhesive strength may be improved by modifying the surface of the affixing surface 3 to a surface state suitable for adhesion by corona treatment or the like.

本実施例においては記憶素子２底面側の導入路６bの接着剤収容容積を基板上面側の導入路６aの接着剤収容容積より大きくし、受け面４aと受け面４bとの間の中央導入路１２の幅を2mmとすることにより、接着剤９を記憶素子１底面側に多く充填させる構造とし、貼り付けの際に接着剤９がパッド７へはみ出し、接点不良となる事を防止しているが、パッド７の位置・接着剤９の粘度・塗布量に合わせ、中央導入路１２の幅を適時設定する事が望ましい。   In this embodiment, the adhesive capacity of the introduction path 6b on the bottom surface side of the memory element 2 is made larger than the adhesive capacity of the introduction path 6a on the upper surface side of the substrate, and the central introduction path between the receiving surface 4a and the receiving surface 4b. By setting the width of 12 to 2 mm, the adhesive 9 is filled to the bottom side of the memory element 1 so that the adhesive 9 sticks out to the pad 7 at the time of sticking and prevents contact failure. However, it is desirable to set the width of the central introduction path 12 in a timely manner according to the position of the pad 7, the viscosity of the adhesive 9, and the coating amount.

また、貼り付けの際、記憶素子１の位置決めを行い保持する保持部を常温状態にて使用したが、保持部の内部にはヒータが埋め込んであり、貼り付けの際、接着剤９表面が硬化を始めた場合でも記憶素子２を介して再加熱することにより、硬化開始した接着剤９表面を再溶融させることで貼り付けまでの時間調整を行う事もが可能である。保持部１３の温度および再加熱時間は接着剤９の使用可能範囲内の接着強度に影響のない範囲で適時設定することが望ましい。   In addition, a holding unit that positions and holds the memory element 1 is used at room temperature during pasting, but a heater is embedded in the holding unit, and the surface of the adhesive 9 is cured during pasting. Even when the process is started, it is possible to adjust the time until application by re-melting the surface of the adhesive 9 which has been cured by reheating through the memory element 2. It is desirable that the temperature of the holding unit 13 and the reheating time be set in a timely manner within the range where the adhesive strength within the usable range of the adhesive 9 is not affected.

さらに、記憶素子２保持部１３周辺には冷却装置（不図示）を組み込み、強制的に冷却を行う事により固定までの時間短縮および、軟化した接着剤９が保持部１３側に付着する糸引き現象を緩和する事が可能である。   Further, a cooling device (not shown) is installed around the storage element 2 holding portion 13 to shorten the time until fixing by forcibly cooling, and stringing that causes the softened adhesive 9 to adhere to the holding portion 13 side. It is possible to alleviate the phenomenon.

本実施例において、導入溝６および中央導入溝１２は受け面４外周の一部にのみ配置しているが、受け面４の全周に配置してもよい。   In the present embodiment, the introduction groove 6 and the center introduction groove 12 are arranged only on a part of the outer periphery of the receiving surface 4, but may be arranged on the entire circumference of the receiving surface 4.

また、本実施例において、受け面４と貼り付け面３およびポッティング逃げ５はy方向の位置を変化させることにより段差を持たせた構成としているが、記憶素子２の形状に合わせ、ポッティング逃げ５が無くてもよい。   Further, in this embodiment, the receiving surface 4, the attaching surface 3 and the potting relief 5 are configured to have a step by changing the position in the y direction. However, the potting relief 5 is adapted to the shape of the memory element 2. There is no need.

また、貼り付け面３と受け面４のクリアランスは選択した接着剤９の粘度・硬化後の厚みや、記憶素子２裏面の形状に合わせて適時設定することが望ましい。   Further, the clearance between the attaching surface 3 and the receiving surface 4 is desirably set in a timely manner in accordance with the viscosity / cured thickness of the selected adhesive 9 and the shape of the back surface of the memory element 2.

また、導入溝６および中央導入溝１２は受け面４外周の一部にのみ配置しているが、受け面４の全周に配置してもよい。   In addition, the introduction groove 6 and the center introduction groove 12 are disposed only on a part of the outer periphery of the receiving surface 4, but may be disposed on the entire periphery of the receiving surface 4.

また、本実施例においては受け面４は3箇所にて構成しているが、図９に示すように1箇所もしくは2箇所にて構成してもよい。   Further, in the present embodiment, the receiving surface 4 is configured at three locations, but may be configured at one location or two locations as shown in FIG.

また、本実施例においては受け面４は3箇所にて構成しているが、図１０に示すように4箇所以上（灰色部）にて構成してもよい。   In the present embodiment, the receiving surface 4 is configured at three locations, but may be configured at four or more locations (gray portions) as shown in FIG.

第二の実施の形態として、使用する接着剤９の粘度が低い物を選択する事で、塗布後の接着剤９は受け面４外周の導入溝６の隅部に発生する毛管力により貼り付け面３全域に充填される為、記憶素子２のポッティングにて加圧することなく固定が可能である。   As a second embodiment, by selecting an adhesive 9 having a low viscosity, the applied adhesive 9 is applied by capillary force generated at the corner of the introduction groove 6 on the outer periphery of the receiving surface 4. Since the entire surface 3 is filled, the memory element 2 can be fixed without being pressurized by potting.

また、貼り付け面３と受け面４のクリアランスは選択した接着剤９の硬化後の厚みや、記憶素子２裏面の形状にに合わせて適時設定することが望ましい。   Moreover, it is desirable to set the clearance between the attachment surface 3 and the receiving surface 4 in a timely manner according to the thickness after curing of the selected adhesive 9 and the shape of the back surface of the memory element 2.

本実施例において、導入溝６および中央導入溝１２は受け面４外周の一部にのみ配置しているが、受け面４の全周に配置してもよい。   In the present embodiment, the introduction groove 6 and the center introduction groove 12 are arranged only on a part of the outer periphery of the receiving surface 4, but may be arranged on the entire circumference of the receiving surface 4.

また、本実施例において、受け面４と貼り付け面３およびポッティング逃げ５はy方向の位置を変化させることにより段差を持たせた構成としているが、記憶素子２の形状に合わせ、ポッティング逃げ５が無くてもよい。   In the present embodiment, the receiving surface 4, the bonding surface 3, and the potting relief 5 are configured to have a step by changing the position in the y direction, but the potting relief 5 is adapted to the shape of the memory element 2. There is no need.

また、導入溝６および中央導入溝１２は受け面４外周の一部にのみ配置しているが、受け面４の全周に配置してもよい。   In addition, the introduction groove 6 and the center introduction groove 12 are disposed only on a part of the outer periphery of the receiving surface 4, but may be disposed on the entire periphery of the receiving surface 4.

また、本実施例においては受け面４は3箇所にて構成しているが、1箇所もしくは2箇所にて構成してもよい。   Further, in the present embodiment, the receiving surface 4 is configured at three locations, but may be configured at one location or two locations.

また、本実施例においては受け面４は3箇所にて構成しているが、4箇所以上にて構成してもよい。   In the present embodiment, the receiving surface 4 is configured at three locations, but may be configured at four or more locations.

第三の実施の形態について図１１を用いて説明する。記憶素子２の受け面４に接着剤流路１３を設け、受け面４の表面に接着剤９を塗布することにより接着剤９は接着剤流路１３にて発生する毛管力により受け面４外周に充填することが可能である。   A third embodiment will be described with reference to FIG. The adhesive flow path 13 is provided on the receiving surface 4 of the storage element 2, and the adhesive 9 is applied to the surface of the receiving surface 4, so that the adhesive 9 is surrounded by the capillary force generated in the adhesive flow path 13. Can be filled.

ａは記憶素子貼り付け前のインクタンク背面の模式図、ｂは記憶素子貼り付け後のインクタンク背面の模式図a is a schematic diagram of the back surface of the ink tank before the memory element is pasted, and b is a schematic diagram of the back surface of the ink tank after the memory element is pasted. インクタンク背面の記憶素子貼り付け面の模式図Schematic diagram of the memory element pasting surface on the back of the ink tank 記憶素子貼り付け工程１模式図Memory element pasting process 1 schematic diagram 記憶素子貼り付け工程２模式図Memory element pasting process 2 schematic diagram 記憶素子貼り付け工程３模式図Memory element pasting process 3 schematic diagram 記憶素子貼り付け工程４模式図Memory element pasting process 4 schematic diagram 記憶素子貼り付け工程５模式図Memory element pasting process 5 schematic diagram 記憶素子貼り付け工程６模式図Memory element pasting process 6 schematic diagram 受け面１箇所の場合の模式図Schematic diagram with one receiving surface 受け面４箇所以上の場合の模式図Schematic diagram with four or more receiving surfaces 記憶素子保持部模式図Memory element holding part schematic diagram

符号の説明Explanation of symbols

１ インクタンク
２ 記憶素子
３ 貼り付け面
４ 受け面
５ ポッティング逃げ
６ 導入路
６a 記憶素子上部導入路
６b 記憶素子下部導入路
７ パッド
８ 接触領域
９ 接着剤
１０ 受け面壁
１１ 基盤底面
１２ 中央導入路
１３ 接着剤流路
DESCRIPTION OF SYMBOLS 1 Ink tank 2 Memory element 3 Adhesion surface 4 Receiving surface 5 Potting escape 6 Introduction path 6a Memory element upper introduction path 6b Memory element lower introduction path 7 Pad 8 Contact area 9 Adhesive 10 Receiving surface wall 11 Base bottom surface 12 Central introduction path 13 Adhesive flow path

Claims (3)

インクジェット記録装置に搭載され、インクを保持する機能を持つインクタンクと、インクを吐出する機能を持つインク吐出部との間で電気的導通を行うことにより所定の動作を行う記憶素子を貼り付けるインクタンク外周の貼り付け面であって、記憶素子裏面を受ける受け面外周に、記憶素子とインクタンクを固定するための接着剤を導くことが可能な導入路を持つことを特徴とするインクタンク。   Ink that is mounted on an ink jet recording apparatus and attaches a storage element that performs a predetermined operation by conducting electrical continuity between an ink tank having a function of holding ink and an ink discharge unit having a function of discharging ink An ink tank having an introduction path through which an adhesive for fixing the storage element and the ink tank can be guided to an outer peripheral surface of the tank, which is a sticking surface of the outer periphery of the tank, and receives the rear surface of the storage element. 請求項１に記載の接着剤は、塗布後遅延硬化型の接着剤であって、完全硬化後記憶素子とインクタンクを単独で固定する事を特徴とする請求項１に記載のインクタンク。   2. The ink tank according to claim 1, wherein the adhesive according to claim 1 is a delayed curing type adhesive after application, and fixes the memory element and the ink tank independently after complete curing. 前記受け面は、電気的導通を行う接点領域に対向する位置に配置されている事を特徴とする請求項２および３に記載のインクタンク。
4. The ink tank according to claim 2, wherein the receiving surface is disposed at a position facing a contact region that conducts electrical conduction. 5.
JP2003376540A 2003-11-06 2003-11-06 Method for fixing ink tank and storage element together Withdrawn JP2005138393A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170066249A1 (en) * 2015-09-07 2017-03-09 Brother Kogyo Kabushiki Kaisha Liquid cartridge provided with cartridge body and storage element fixed thereto by adhesive agent and method for manufacturing the same
JP2018012245A (en) * 2016-07-20 2018-01-25 ブラザー工業株式会社 Consumption material cartridge
JP2018012243A (en) * 2016-07-20 2018-01-25 ブラザー工業株式会社 Consumption material cartridge
JP2018012244A (en) * 2016-07-20 2018-01-25 ブラザー工業株式会社 Consumption material cartridge
JP2018109732A (en) * 2016-12-28 2018-07-12 ブラザー工業株式会社 Developing cartridge and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170066249A1 (en) * 2015-09-07 2017-03-09 Brother Kogyo Kabushiki Kaisha Liquid cartridge provided with cartridge body and storage element fixed thereto by adhesive agent and method for manufacturing the same
JP2017052121A (en) * 2015-09-07 2017-03-16 ブラザー工業株式会社 Liquid cartridge and manufacturing method for liquid cartridge
US9855757B2 (en) 2015-09-07 2018-01-02 Brother Kogyo Kabushiki Kaisha Liquid cartridge provided with cartridge body and storage element fixed thereto by adhesive agent and method for manufacturing the same
JP2018012245A (en) * 2016-07-20 2018-01-25 ブラザー工業株式会社 Consumption material cartridge
JP2018012243A (en) * 2016-07-20 2018-01-25 ブラザー工業株式会社 Consumption material cartridge
JP2018012244A (en) * 2016-07-20 2018-01-25 ブラザー工業株式会社 Consumption material cartridge
JP2018109732A (en) * 2016-12-28 2018-07-12 ブラザー工業株式会社 Developing cartridge and manufacturing method thereof

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