JP2005136232A - Wiring board - Google Patents

Wiring board Download PDF

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JP2005136232A
JP2005136232A JP2003371298A JP2003371298A JP2005136232A JP 2005136232 A JP2005136232 A JP 2005136232A JP 2003371298 A JP2003371298 A JP 2003371298A JP 2003371298 A JP2003371298 A JP 2003371298A JP 2005136232 A JP2005136232 A JP 2005136232A
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main surface
layer
conductor
insulating substrate
wiring board
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Ryuichi Uenosono
竜一 上之園
Hiroshige Ito
広繁 伊藤
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a high reliability wiring board for effectively preventing generation of deformation, such as bending on an insulating substrate, even if the thinning and high functionality or the like of the wiring board make advanced, and for surely mounting electronic components on an external electric circuit board. <P>SOLUTION: This wiring board is provided with an insulating substrate 1 shaped into a rectangular parallelepiped, formed by laminating a plurality of ceramic layers 1a on whose main surface a mounting part 1b of electronic parts is formed, a wiring conductor 2 for signal formed either on the main surface or in between the ceramic layers 1a of the insulating substrate 1, and a full-surface conductive layer 3 for ground or power source formed either on the main surface or between the ceramic layers 1a of the insulating substrate 1. The wiring conductor 2 for signal and the full-surface conductive layer 3 are formed on a horizontal cross section orthogonal to the side of the main surface of the insulating substrate 1, so as to form a line symmetric with respect to a center line which is in parallel with the main surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、半導体素子や容量素子等の電子部品を搭載するための配線基板に関するものである。   The present invention relates to a wiring board for mounting electronic components such as semiconductor elements and capacitive elements.

従来、例えば半導体素子や容量素子等の電子部品を搭載するための配線基板は、酸化アルミニウム質焼結体等から成る四角板状のセラミック層を複数積層して成り、上面等の主面に電子部品が搭載される搭載部が形成された直方体状の絶縁基体と、タングステンや銅等の金属材料から成り、絶縁基体の主面およびセラミック層の層間の少なくとも一方に形成された信号用配線導体と、信号用配線導体と同様の金属材料から成り、絶縁基体の主面およびセラミック層の層間の少なくとも一方に形成された接地用または電源用の全面導体層とを具備した構造である。   Conventionally, for example, a wiring board for mounting electronic components such as semiconductor elements and capacitive elements is formed by laminating a plurality of square plate-like ceramic layers made of an aluminum oxide sintered body, etc. A rectangular parallelepiped insulating base formed with a mounting portion on which components are mounted, and a signal wiring conductor made of a metal material such as tungsten or copper and formed on at least one of the main surface of the insulating base and the interlayer of the ceramic layer; The structure is made of the same metal material as that of the signal wiring conductor, and has a grounding or power supply entire surface conductor layer formed on at least one of the main surface of the insulating base and the ceramic layer.

また、このような配線基板の搭載部には、通常、信号用配線導体や全面導体層と電気的に接続された接続用のパッドが形成されている。   In addition, a connection pad that is electrically connected to the signal wiring conductor or the entire surface conductor layer is usually formed on the mounting portion of such a wiring board.

この配線基板の搭載部に電子部品を搭載するとともに、電子部品の下面等に形成されている電極を半田やボンディングワイヤ等を介してパッドと電気的に接続することにより、電子部品の信号用や接地用、電源用等の電極が、対応する信号用配線導体や全面導体層と電気的に接続される。   The electronic component is mounted on the mounting portion of the wiring board, and the electrodes formed on the lower surface of the electronic component are electrically connected to the pad via solder, bonding wires, etc. The electrodes for grounding, power supply, etc. are electrically connected to the corresponding signal wiring conductor and the entire conductor layer.

その後、必要に応じて電子部品を蓋体や封止用樹脂等で封止することにより電子部品の実装が行なわれ、電子装置となる。   Thereafter, the electronic component is mounted as necessary by sealing the electronic component with a lid, a sealing resin, or the like, so that an electronic device is obtained.

実装された電子部品の電極は、パッドを介して対応する信号用配線導体や全面導体層に電気的に接続され、電気信号の入出力や、接地電位，電源の供給等が行なわれる。   The electrodes of the mounted electronic components are electrically connected to corresponding signal wiring conductors and full-surface conductor layers through pads, and input / output of electric signals, supply of ground potential, power supply, and the like are performed.

このような配線基板は、例えば、絶縁基体が酸化アルミニウムから成る場合、まず、酸化アルミニウムや酸化ケイ素等の原料粉末を有機溶剤，バインダーとともにシート状に成形して複数のセラミックグリーンシート（以下、グリーンシートともいう）を形成し、次に、これらのグリーンシートに、タングステン等の金属の粉末に有機溶剤，バインダーを添加混練して成る金属ペーストを所定パターンに印刷し、次に、これらのグリーンシートを積層するとともに高温で焼成することにより作製される。
特開２００３−１８８０４８号公報 特開２００２−２０３７２０号公報 For example, when the insulating substrate is made of aluminum oxide, such a wiring substrate is formed by first forming a raw material powder such as aluminum oxide or silicon oxide into a sheet shape together with an organic solvent and a binder to form a plurality of ceramic green sheets (hereinafter referred to as green Next, these green sheets are printed in a predetermined pattern with a metal paste formed by adding and kneading an organic solvent and a binder to a metal powder such as tungsten, and then to these green sheets. And is fired at a high temperature.
JP 2003-1888048 A JP 2002-203720 A

しかしながら、上記の従来の配線基板においては、一般に、信号用配線導体や全面導体層の配置形態が各絶縁層の層間同士や層間と絶縁基体の主面との間等で不均一であること、信号用配線導体や全面導体層となる金属ペーストを印刷した複数のグリーンシートを積層して焼成する際に、金属ペーストとグリーンシートとの間で焼成時の収縮率が異なること等から、絶縁基体となるグリーンシートの積層体の全体に対し、焼成時に上または下に凸状に反るような方向に応力が作用する。その結果、焼成して得られた配線基板の絶縁基体に、上方向または下方向に凸となるような反り等の変形が生じてしまうという問題があった。絶縁基体に反り等の変形が生じると、搭載部に電子部品を正確に搭載することが難しくなり、実装の信頼性が低くなってしまう。   However, in the above conventional wiring board, in general, the arrangement of the signal wiring conductor and the entire surface conductor layer is non-uniform between layers of each insulating layer, between the interlayer and the main surface of the insulating substrate, When a plurality of green sheets printed with a metal paste to be used as signal wiring conductors or entire-surface conductor layers are laminated and fired, the shrinkage ratio during firing differs between the metal paste and the green sheet. Stress is applied to the entire green sheet laminate to be warped upward or downward in a convex shape during firing. As a result, there has been a problem that the insulating base of the wiring board obtained by firing is subject to deformation such as warping that protrudes upward or downward. When deformation such as warpage occurs in the insulating base, it becomes difficult to accurately mount the electronic component on the mounting portion, and the mounting reliability is lowered.

特に、近時、配線基板の薄型化，高機能化等に応じて、絶縁層の厚さが薄くなり、また、信号用配線導体や全面導体層が各絶縁層に高密度で形成されたり、絶縁層の上層と下層との間で信号用配線導体と全面導体層の配置が偏りやすい、たとえば電子部品が搭載される搭載部に近い上層側ほど信号用配線導体が全面導体層よりも多くなることから、上記のような反り変形の発生が顕著なものとなってきている。   In particular, in recent years, the thickness of the insulating layer is reduced in accordance with the thinning and high functionality of the wiring board, and the signal wiring conductor and the entire surface conductor layer are formed at a high density on each insulating layer. The arrangement of the signal wiring conductor and the entire surface conductor layer tends to be biased between the upper layer and the lower layer of the insulating layer. For example, the signal wiring conductor is larger than the entire surface conductor layer on the upper layer side closer to the mounting portion on which the electronic component is mounted. Therefore, the occurrence of warp deformation as described above has become remarkable.

本発明は、上記従来の技術における問題点に鑑みて完成されたものであり、その目的は、配線基板の薄型化，高機能化等が進んだとしても、絶縁基体に反り等の変形が生じることが効果的に防止され、電子部品を確実に実装したり、外部電気回路基板に確実に実装することができる信頼性に優れた配線基板を提供することにある。   The present invention has been completed in view of the above problems in the prior art, and its purpose is to deform the insulating substrate, such as warping, even if the wiring board is made thinner and more functional. Accordingly, it is an object of the present invention to provide a highly reliable wiring board that can effectively prevent electronic components from being mounted on an external electric circuit board.

本発明の配線基板は、複数のセラミック層が積層されて成るとともに主面に電子部品の搭載部が形成された直方体状の絶縁基体と、該絶縁基体の主面および前記セラミック層の層間の少なくとも一方に形成された信号用配線導体と、前記絶縁基体の主面および前記セラミック層の層間の少なくとも一方に形成された接地用または電源用の全面導体層とを具備しており、前記信号用配線導体および前記全面導体層は、前記絶縁基体の前記主面の辺に直交する縦断面において前記主面に平行な中心線に対して線対称とされて形成されていることを特徴とするものである。   A wiring board according to the present invention comprises a rectangular parallelepiped insulating base formed by laminating a plurality of ceramic layers and having an electronic component mounting portion formed on the main surface, and at least between the main surface of the insulating base and the ceramic layer. A signal wiring conductor formed on one side, and a grounding or power supply whole conductor layer formed on at least one of the main surface of the insulating base and the ceramic layer, and the signal wiring The conductor and the entire conductor layer are formed so as to be axisymmetric with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the side of the main surface of the insulating base. is there.

本発明の配線基板によれば、信号用配線導体および全面導体層は、絶縁基体の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称とされて形成されていることから、絶縁基体となるグリーンシートの積層体の各層に信号用配線導体や全面導体層となる金属ペーストを印刷形成して焼成することにより、配線基板を形成する際に絶縁基体となるグリーンシートの積層体の厚み方向の中心線に対して上層側と下層側とが線対称となるように信号用配線導体および全面導体層が均一に配置され、上層側と下層側とで絶縁基体となる積層体を反らせようとする応力が、大きさが同じで逆方向のものとなる。そのため、この積層体を上方向に反らせようとする応力と下方向に反らせようとする応力とを相殺させることができ、絶縁基体に反り等の変形が発生することは効果的に防止される。   According to the wiring board of the present invention, the signal wiring conductor and the entire surface conductor layer are formed so as to be symmetrical with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the side of the main surface of the insulating base. Therefore, by forming and printing the signal wiring conductor and the metal paste that will be the entire conductor layer on each layer of the laminate of the green sheet that will be the insulating substrate, the green that will be the insulating substrate when forming the wiring board The signal wiring conductor and the entire surface conductor layer are uniformly arranged so that the upper layer side and the lower layer side are axisymmetric with respect to the center line in the thickness direction of the laminated body of the sheet. The stress that tends to warp the resulting laminate is the same in the opposite direction. For this reason, it is possible to cancel out the stress that causes the laminated body to be warped upward and the stress that is likely to warp downward, and it is effectively prevented that deformation such as warpage occurs in the insulating substrate.

本発明の配線基板について添付図面に基づき以下に説明する。図１は、本発明の配線基板の実施の形態の一例を示す断面図である。図１において、１は絶縁基体、２は信号用配線導体、３は全面導体層である。これら絶縁基体１，信号用配線導体２，全面導体層３により、本発明の配線基板が基本的に構成される。   The wiring board of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of a wiring board according to the present invention. In FIG. 1, 1 is an insulating substrate, 2 is a signal wiring conductor, and 3 is an entire conductor layer. The insulating substrate 1, the signal wiring conductor 2, and the entire surface conductor layer 3 basically constitute the wiring board of the present invention.

絶縁基体１は、酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，ムライト質焼結体，窒化珪素質焼結体，炭化珪素質焼結体，ガラスセラミックス焼結体等の電気絶縁材料から成るセラミック層１ａが複数積層されることにより形成されている。この絶縁基体１の主面（図１の例では上面）には、電子部品（図示せず）を搭載する搭載部１ｂが形成されている。   The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon nitride sintered body, a silicon carbide sintered body, or a glass ceramic sintered body. It is formed by laminating a plurality of ceramic layers 1a. On the main surface (upper surface in the example of FIG. 1) of the insulating base 1, a mounting portion 1b for mounting an electronic component (not shown) is formed.

この絶縁基体１は、例えば各セラミック層１ａが酸化アルミニウム質焼結体から成る場合には以下のようにして作製される。まず、酸化アルミニウム，酸化珪素，酸化カルシウム，酸化マグネシウム等の原料粉末に適当な有機バインダー，溶剤を添加混合して泥漿状のセラミックスラリーを作製し、このセラミックスラリーをドクターブレード法やカレンダーロール法等のシート成形技術を採用してシート状となすことによって、四角板状の複数のグリーンシート（セラミック生シート）を得る。しかる後、グリーンシートを所定の順に上下に積層してグリーンシートの積層体と成す。この積層体を還元雰囲気中で約１６００℃の高温で焼成することによって、直方体状の絶縁基体１が製作される。   For example, when each ceramic layer 1a is made of an aluminum oxide sintered body, the insulating base 1 is manufactured as follows. First, an appropriate organic binder and solvent are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide to produce a slurry-like ceramic slurry. A plurality of quadrangular green sheets (ceramic green sheets) are obtained by adopting the sheet forming technique to form a sheet. Thereafter, the green sheets are laminated in a predetermined order to form a green sheet laminate. By firing this laminated body at a high temperature of about 1600 ° C. in a reducing atmosphere, a rectangular parallelepiped insulating base 1 is manufactured.

この絶縁基体１の主面およびセラミック層１ａの層間の少なくとも一方に、信号用配線導体２が形成されている。また、絶縁基体１の主面およびセラミック層１ａの層間の少なくとも一方に、接地用または電源用の全面導体層３が形成されている。   A signal wiring conductor 2 is formed on at least one of the main surface of the insulating base 1 and the ceramic layer 1a. In addition, a grounding or power supply full-surface conductor layer 3 is formed on at least one of the main surface of the insulating base 1 and the ceramic layer 1a.

また、搭載部１ｂ、および搭載部１ｂが形成された主面と対向する絶縁基体１の主面には、信号用配線導体２や全面導体層３に電気的に接続された接続用のパッド１ｃが形成されている。これらの信号用配線導体２や全面導体層３，パッド１ｃは、タングステンやモリブデン，銅，銀等の金属材料から成る。例えば、タングステンから成る場合、タングステンの粉末に有機溶剤，バインダー等を添加混練して得た金属ペーストを、各セラミック層１ａとなるグリーンシートの表面に所定パターンに印刷しておくことにより形成される。   Further, on the main surface of the insulating base 1 facing the main surface on which the mounting portion 1b and the mounting portion 1b are formed, a connection pad 1c electrically connected to the signal wiring conductor 2 and the entire conductor layer 3 is provided. Is formed. The signal wiring conductor 2, the entire surface conductor layer 3, and the pad 1c are made of a metal material such as tungsten, molybdenum, copper, or silver. For example, in the case of tungsten, it is formed by printing a metal paste obtained by adding and kneading an organic solvent, a binder, etc. to a tungsten powder in a predetermined pattern on the surface of the green sheet to be each ceramic layer 1a. .

なお、信号用配線導体２や全面導体層３とパッド１ｃとの電気的接続は、セラミック層１ａを厚み方向に貫通する貫通導体（図示せず）等を介して行われる。このような貫通導体は、予め絶縁基体１となるグリーンシートに貫通孔を打抜き形成しておき、この貫通孔内に信号用配線導体２等を形成するのと同様の金属ペーストを印刷し充填しておくこと等により形成される。   The electrical connection between the signal wiring conductor 2 or the entire surface conductor layer 3 and the pad 1c is made through a through conductor (not shown) or the like that penetrates the ceramic layer 1a in the thickness direction. Such a through conductor is formed by punching a through hole in a green sheet to be the insulating base 1 in advance, and printing and filling the same metal paste as that for forming the signal wiring conductor 2 and the like in the through hole. And so on.

配線基板の搭載部１ｂに電子部品を搭載するとともに、電子部品の電極（図示せず）を半田やボンディングワイヤ等を介してパッド１ｃと電気的に接続することにより、電子部品の信号用や接地用、電源用等の電極が、対応する信号用配線導体２や全面導体層３と電気的に接続され、電子装置が作製される。この電子装置のうち、搭載部１ｂと対向する絶縁基体１の主面に形成されたパッド１ｃを外部電気回路に接続することにより、電子部品の電極が外部の電気回路に電気的に接続される。   An electronic component is mounted on the mounting portion 1b of the wiring board, and an electrode (not shown) of the electronic component is electrically connected to the pad 1c via solder, a bonding wire, etc. For example, the electrodes for the power supply and the power supply are electrically connected to the corresponding signal wiring conductor 2 and the entire conductor layer 3 to produce the electronic device. In this electronic device, the electrode 1 of the electronic component is electrically connected to the external electric circuit by connecting the pad 1c formed on the main surface of the insulating base 1 facing the mounting portion 1b to the external electric circuit. .

本発明の配線基板において、信号用配線導体２および全面導体層３は、絶縁基体１の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称とされて形成されている。この構成により、絶縁基体１となるグリーンシートの積層体の各層に、信号用配線導体２や全面導体層３となる金属ペーストを印刷形成して焼成することにより配線基板を形成する際、絶縁基体１となる積層体の厚み方向の中心線に対して上層側と下層側に信号用配線導体２および全面導体層３が線対称に均一に配置される。その結果、上層側と下層側とで積層体を反らせようとする応力の大きさが同じで逆方向のものとなるため、絶縁基体１となる積層体を上方向に反らせようとする応力と、下方向に反らせようとする応力とを相殺させることができ、絶縁基体１に反り等の変形が発生することを効果的に防止することができる。   In the wiring board of the present invention, the signal wiring conductor 2 and the entire surface conductor layer 3 are formed symmetrically with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the side of the main surface of the insulating base 1. ing. With this configuration, when a wiring board is formed by printing and firing a metal paste that becomes the signal wiring conductor 2 or the entire surface conductor layer 3 on each layer of the green sheet laminate that becomes the insulating base 1, the insulating base is formed. The signal wiring conductor 2 and the entire surface conductor layer 3 are uniformly arranged in line symmetry on the upper layer side and the lower layer side with respect to the center line in the thickness direction of the laminated body 1. As a result, since the magnitude of the stress to bend the laminate on the upper layer side and the lower layer side is the same and in the opposite direction, the stress to bend the laminate to be the insulating base 1 upward, It is possible to cancel out the stress to be warped downward, and to effectively prevent deformation of the insulating substrate 1 such as warpage.

なお、信号用配線導体２および全面導体層３を、絶縁基体１の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称として形成する場合、信号用配線導体２や全面導体層３の配置形成の自由度が低下するおそれがあるが、セラミック層１ａを（たとえば１層）追加することにより、その追加したセラミック層１ａの表面にも信号用配線導体や全面導体層を形成することができるので、配線が困難であったものが追加されたセラミック層１ａで配線でき、支障なく信号用配線導体２や全面導体層３を形成することができる。   In the case where the signal wiring conductor 2 and the entire surface conductor layer 3 are formed symmetrically with respect to a center line parallel to the main surface in a longitudinal section orthogonal to the side of the main surface of the insulating base 1, the signal wiring conductor 2 However, if the ceramic layer 1a is added (for example, one layer), the signal wiring conductor and the entire conductor are also formed on the surface of the added ceramic layer 1a. Since a layer can be formed, it is possible to perform wiring with the added ceramic layer 1a that has been difficult to wire, and the signal wiring conductor 2 and the entire surface conductor layer 3 can be formed without hindrance.

また、信号用配線導体２および全面導体層３を、絶縁基体１の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称として形成する場合、中心線に近い層には全面導体層３を形成し、中心線から遠い層（絶縁基体１の主面に近い層）には信号用配線導体２を形成するようにすることが好ましい。これは、全面導体層３のほうが金属ペーストの印刷面積が大きく、金属ペーストとグリーンシートとの焼成時の収縮率の差に起因する応力がより大きく作用しやすいため、そのような応力が発生する部位を、極力線対称の中心に近い部位に配置することにより、応力の相殺をより確実なものとすることができるため、より一層確実に反りの発生を防止することができるからである。   When the signal wiring conductor 2 and the entire surface conductor layer 3 are formed symmetrically with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the side of the main surface of the insulating base 1, a layer close to the center line It is preferable to form the entire surface conductor layer 3 and the signal wiring conductor 2 in a layer far from the center line (a layer close to the main surface of the insulating substrate 1). This is because the entire conductor layer 3 has a larger printing area of the metal paste, and the stress caused by the difference in shrinkage rate during firing between the metal paste and the green sheet is more likely to act, so such stress is generated. This is because the stress can be more surely offset by arranging the part at a position close to the center of line symmetry as much as possible, so that the occurrence of warpage can be prevented more reliably.

また、これらの信号用配線導体２や全面導体層３と電気的に接続されたパッド１ｃを形成する場合、これらのパッド１ｃについても、絶縁基体１の搭載部１ｂが形成されている主面とこれに対向する主面との間で、絶縁基体１の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称として形成することが好ましい。   Further, when the pads 1c electrically connected to the signal wiring conductors 2 and the entire surface conductor layer 3 are formed, these pads 1c also have a main surface on which the mounting portion 1b of the insulating base 1 is formed. It is preferable to form it symmetrically with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the side of the main surface of the insulating base 1 between the main surface facing this.

また、各セラミック１ａ層は、応力を相殺させるという観点からは、その厚さを最上層から最下層にかけて均一な厚さとしておくことが好ましいが、セラミック層１ａの一部を静電容量を形成するための誘電体層として利用すること等の種々の設計上の都合により、部分的に厚みを変えてもよい。ただし、このようにセラミック層１ａの厚みを一部の層で異なるものとする場合、厚さの異なるセラミック層１ａを、絶縁基体１の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称として配置することが好ましい。   Further, from the viewpoint of canceling stress, it is preferable that each ceramic 1a layer has a uniform thickness from the uppermost layer to the lowermost layer. However, a part of the ceramic layer 1a forms a capacitance. The thickness may be partially changed due to various design conveniences such as use as a dielectric layer. However, in the case where the thickness of the ceramic layer 1a is different in some layers as described above, the ceramic layers 1a having different thicknesses are parallel to the main surface in a vertical cross section perpendicular to the side of the main surface of the insulating base 1. It is preferable to arrange them symmetrically with respect to the center line.

なお、信号用配線導体２や全面導体層３の厚さは５〜３０μｍ程度である。この厚さについても、絶縁基体１の主面の辺に直交する縦断面において主面に平行な中心線に対して線対称な配置となるようにしておくことが好ましい。   In addition, the thickness of the signal wiring conductor 2 and the entire surface conductor layer 3 is about 5 to 30 μm. This thickness is also preferably arranged symmetrically with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the main surface side of the insulating substrate 1.

また、信号用配線導体２や全面導体層３の厚さは、一つの層間においては均一な厚さとしておくことが好ましい。一つの層間において信号用配線導体２や全面導体層３の厚さが不均一であると、その信号用配線導体２や全面導体層３を挟む上下のセラミック層１ａ間の密着が、厚さの異なる信号用配線導体２や全面導体層３により妨げられるおそれがある。   Moreover, it is preferable that the thickness of the signal wiring conductor 2 and the entire surface conductor layer 3 is uniform between one layer. If the thickness of the signal wiring conductor 2 and the entire surface conductor layer 3 is not uniform in one layer, the adhesion between the upper and lower ceramic layers 1a sandwiching the signal wiring conductor 2 and the entire surface conductor layer 3 is reduced. There is a risk of being disturbed by different signal wiring conductors 2 and the entire surface conductor layer 3.

なお、本発明は上記の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内であれば種々の変更は可能である。例えば、信号用配線導体２や全面導体層３，パッド１ｃ等の露出表面に、ニッケル，銅，金等のめっき層を被着させて酸化腐食をより有効に防止するようにしてもよい。   The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, a plating layer of nickel, copper, gold, or the like may be deposited on the exposed surfaces of the signal wiring conductor 2, the entire surface conductor layer 3, the pad 1c, etc. to prevent oxidative corrosion more effectively.

本発明の配線基板の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the wiring board of this invention.

符号の説明Explanation of symbols

１・・・絶縁基体
１ａ・・・セラミック層
１ｂ・・・搭載部
２・・・信号用配線導体
３・・・全面導体層 DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ... Ceramic layer 1b ... Mounting part 2 ... Signal wiring conductor 3 ... Whole surface conductor layer

Claims (1)

複数のセラミック層が積層されて成るとともに主面に電子部品の搭載部が形成された直方体状の絶縁基体と、該絶縁基体の主面および前記セラミック層の層間の少なくとも一方に形成された信号用配線導体と、前記絶縁基体の主面および前記セラミック層の層間の少なくとも一方に形成された接地用または電源用の全面導体層とを具備しており、前記信号用配線導体および前記全面導体層は、前記絶縁基体の前記主面の辺に直交する縦断面において前記主面に平行な中心線に対して線対称とされて形成されていることを特徴とする配線基板。 A rectangular parallelepiped insulating base formed by laminating a plurality of ceramic layers and having an electronic component mounting portion formed on the main surface, and a signal signal formed on at least one of the main surface of the insulating base and the interlayer of the ceramic layer A wiring conductor, and a grounding or power entire conductor layer formed on at least one of the main surface of the insulating base and the ceramic layer, the signal wiring conductor and the entire conductor layer are A wiring board characterized in that the insulating substrate is symmetrical with respect to a center line parallel to the main surface in a longitudinal section perpendicular to the side of the main surface.
JP2003371298A 2003-10-30 2003-10-30 Wiring board Pending JP2005136232A (en)

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