JP2005113048A - Method for producing resin molded article - Google Patents
Method for producing resin molded article Download PDFInfo
- Publication number
- JP2005113048A JP2005113048A JP2003350669A JP2003350669A JP2005113048A JP 2005113048 A JP2005113048 A JP 2005113048A JP 2003350669 A JP2003350669 A JP 2003350669A JP 2003350669 A JP2003350669 A JP 2003350669A JP 2005113048 A JP2005113048 A JP 2005113048A
- Authority
- JP
- Japan
- Prior art keywords
- coating film
- group
- resin molded
- coated film
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 33
- 229920005989 resin Polymers 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 55
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000004033 plastic Substances 0.000 claims abstract description 25
- 229920003023 plastic Polymers 0.000 claims abstract description 25
- 125000005372 silanol group Chemical group 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000000862 absorption spectrum Methods 0.000 claims abstract description 19
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 11
- 150000001282 organosilanes Chemical class 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 7
- 239000011230 binding agent Substances 0.000 claims abstract description 7
- 125000002252 acyl group Chemical group 0.000 claims abstract description 6
- 125000000962 organic group Chemical group 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims description 119
- 239000011248 coating agent Substances 0.000 claims description 116
- 238000001035 drying Methods 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 14
- 230000001699 photocatalysis Effects 0.000 claims description 12
- 239000011941 photocatalyst Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 3
- -1 polyethylene terephthalate Polymers 0.000 description 20
- 238000000034 method Methods 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 239000008119 colloidal silica Substances 0.000 description 13
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 9
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 9
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 8
- 239000007787 solid Substances 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- 238000002835 absorbance Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 230000002087 whitening effect Effects 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000003618 dip coating Methods 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 239000001632 sodium acetate Substances 0.000 description 3
- 235000017281 sodium acetate Nutrition 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000007754 air knife coating Methods 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- VUWVDNLZJXLQPT-UHFFFAOYSA-N tripropoxy(propyl)silane Chemical compound CCCO[Si](CCC)(OCCC)OCCC VUWVDNLZJXLQPT-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- RBEMUBNJBBFCGP-UHFFFAOYSA-N 2-methylpropyl(tripropoxy)silane Chemical compound CCCO[Si](CC(C)C)(OCCC)OCCC RBEMUBNJBBFCGP-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- RJUBITRLCAWKHI-UHFFFAOYSA-N 3,3,3-triphenylpropoxysilane Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(CCO[SiH3])C1=CC=CC=C1 RJUBITRLCAWKHI-UHFFFAOYSA-N 0.000 description 1
- RTGQKZXGRDZFNO-UHFFFAOYSA-N 4,4,4-triphenylbutoxysilane Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(CCCO[SiH3])C1=CC=CC=C1 RTGQKZXGRDZFNO-UHFFFAOYSA-N 0.000 description 1
- 229920006353 Acrylite® Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- GEXZUSWMGGSFGF-UHFFFAOYSA-N C(CC)C(C(=O)O[SiH3])(CCC)CCC Chemical compound C(CC)C(C(=O)O[SiH3])(CCC)CCC GEXZUSWMGGSFGF-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 101710178035 Chorismate synthase 2 Proteins 0.000 description 1
- 101710152694 Cysteine synthase 2 Proteins 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GEVLQTJAHGKELA-UHFFFAOYSA-N [acetyloxy(dibutyl)silyl] acetate Chemical compound CCCC[Si](OC(C)=O)(OC(C)=O)CCCC GEVLQTJAHGKELA-UHFFFAOYSA-N 0.000 description 1
- JQNJIBYLKBOSCM-UHFFFAOYSA-N [acetyloxy(diethyl)silyl] acetate Chemical compound CC(=O)O[Si](CC)(CC)OC(C)=O JQNJIBYLKBOSCM-UHFFFAOYSA-N 0.000 description 1
- RQVFGTYFBUVGOP-UHFFFAOYSA-N [acetyloxy(dimethyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(C)OC(C)=O RQVFGTYFBUVGOP-UHFFFAOYSA-N 0.000 description 1
- MBWVVLDGOMEXME-UHFFFAOYSA-N [acetyloxy(dipentyl)silyl] acetate Chemical compound C(CCCC)[Si](OC(C)=O)(OC(C)=O)CCCCC MBWVVLDGOMEXME-UHFFFAOYSA-N 0.000 description 1
- CNOSLBKTVBFPBB-UHFFFAOYSA-N [acetyloxy(diphenyl)silyl] acetate Chemical compound C=1C=CC=CC=1[Si](OC(C)=O)(OC(=O)C)C1=CC=CC=C1 CNOSLBKTVBFPBB-UHFFFAOYSA-N 0.000 description 1
- UYEHMPJXRDHGGY-UHFFFAOYSA-N [acetyloxy-bis(2-methylpropyl)silyl] acetate Chemical compound CC(C)C[Si](CC(C)C)(OC(C)=O)OC(C)=O UYEHMPJXRDHGGY-UHFFFAOYSA-N 0.000 description 1
- VVEUPQPNIPCUAP-UHFFFAOYSA-N [acetyloxy-di(propan-2-yl)silyl] acetate Chemical compound CC(=O)O[Si](C(C)C)(OC(C)=O)C(C)C VVEUPQPNIPCUAP-UHFFFAOYSA-N 0.000 description 1
- OCDDDGXATNYKNE-UHFFFAOYSA-N [diacetyloxy(2-methylpropyl)silyl] acetate Chemical compound CC(C)C[Si](OC(C)=O)(OC(C)=O)OC(C)=O OCDDDGXATNYKNE-UHFFFAOYSA-N 0.000 description 1
- LSDYFQXXPCPBQV-UHFFFAOYSA-N [diacetyloxy(butyl)silyl] acetate Chemical compound CCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O LSDYFQXXPCPBQV-UHFFFAOYSA-N 0.000 description 1
- KXJLGCBCRCSXQF-UHFFFAOYSA-N [diacetyloxy(ethyl)silyl] acetate Chemical compound CC(=O)O[Si](CC)(OC(C)=O)OC(C)=O KXJLGCBCRCSXQF-UHFFFAOYSA-N 0.000 description 1
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 1
- OJBYIHGSXQWCMB-UHFFFAOYSA-N [diacetyloxy(pentyl)silyl] acetate Chemical compound CCCCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O OJBYIHGSXQWCMB-UHFFFAOYSA-N 0.000 description 1
- VLFKGWCMFMCFRM-UHFFFAOYSA-N [diacetyloxy(phenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C1=CC=CC=C1 VLFKGWCMFMCFRM-UHFFFAOYSA-N 0.000 description 1
- IXUUFMQHBRPODL-UHFFFAOYSA-N [diacetyloxy(propan-2-yl)silyl] acetate Chemical compound CC(=O)O[Si](C(C)C)(OC(C)=O)OC(C)=O IXUUFMQHBRPODL-UHFFFAOYSA-N 0.000 description 1
- DKGZKEKMWBGTIB-UHFFFAOYSA-N [diacetyloxy(propyl)silyl] acetate Chemical compound CCC[Si](OC(C)=O)(OC(C)=O)OC(C)=O DKGZKEKMWBGTIB-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- HXJCDWAWBGSLST-UHFFFAOYSA-N bis(2-methylpropyl)-dipropoxysilane Chemical compound CCCO[Si](CC(C)C)(CC(C)C)OCCC HXJCDWAWBGSLST-UHFFFAOYSA-N 0.000 description 1
- PEJKHFKRSDGAQY-UHFFFAOYSA-N butoxy(tributyl)silane Chemical compound CCCCO[Si](CCCC)(CCCC)CCCC PEJKHFKRSDGAQY-UHFFFAOYSA-N 0.000 description 1
- HVCBWAHRVCPLEM-UHFFFAOYSA-N butoxy(triethyl)silane Chemical compound CCCCO[Si](CC)(CC)CC HVCBWAHRVCPLEM-UHFFFAOYSA-N 0.000 description 1
- YTJUXOIAXOQWBV-UHFFFAOYSA-N butoxy(trimethyl)silane Chemical compound CCCCO[Si](C)(C)C YTJUXOIAXOQWBV-UHFFFAOYSA-N 0.000 description 1
- GNKRIDSIINOYIE-UHFFFAOYSA-N butoxy(tripropyl)silane Chemical compound CCCCO[Si](CCC)(CCC)CCC GNKRIDSIINOYIE-UHFFFAOYSA-N 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- GNRBSDIBKIHSJH-UHFFFAOYSA-N butyl(tripropoxy)silane Chemical compound CCCC[Si](OCCC)(OCCC)OCCC GNRBSDIBKIHSJH-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- LLBLHAHQBJSHED-UHFFFAOYSA-N di(propan-2-yl)-dipropoxysilane Chemical compound CCCO[Si](C(C)C)(C(C)C)OCCC LLBLHAHQBJSHED-UHFFFAOYSA-N 0.000 description 1
- URSLNVMUSKPBTL-UHFFFAOYSA-N dibutoxy(dibutyl)silane Chemical compound CCCCO[Si](CCCC)(CCCC)OCCCC URSLNVMUSKPBTL-UHFFFAOYSA-N 0.000 description 1
- MGQFVQQCNPBJKC-UHFFFAOYSA-N dibutoxy(diethyl)silane Chemical compound CCCCO[Si](CC)(CC)OCCCC MGQFVQQCNPBJKC-UHFFFAOYSA-N 0.000 description 1
- GQNWJCQWBFHQAO-UHFFFAOYSA-N dibutoxy(dimethyl)silane Chemical compound CCCCO[Si](C)(C)OCCCC GQNWJCQWBFHQAO-UHFFFAOYSA-N 0.000 description 1
- XLFXESZYAWMPRU-UHFFFAOYSA-N dibutoxy(dipentyl)silane Chemical compound CCCCC[Si](CCCCC)(OCCCC)OCCCC XLFXESZYAWMPRU-UHFFFAOYSA-N 0.000 description 1
- OSMIWEAIYFILPL-UHFFFAOYSA-N dibutoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCCCC)(OCCCC)C1=CC=CC=C1 OSMIWEAIYFILPL-UHFFFAOYSA-N 0.000 description 1
- BKGSSPASYNBWRR-UHFFFAOYSA-N dibutoxy(dipropyl)silane Chemical compound CCCCO[Si](CCC)(CCC)OCCCC BKGSSPASYNBWRR-UHFFFAOYSA-N 0.000 description 1
- BKEPBMAJEWRPRF-UHFFFAOYSA-N dibutoxy-bis(2-methylpropyl)silane Chemical compound CCCCO[Si](CC(C)C)(CC(C)C)OCCCC BKEPBMAJEWRPRF-UHFFFAOYSA-N 0.000 description 1
- WOMDWSFYXGEOTE-UHFFFAOYSA-N dibutoxy-di(propan-2-yl)silane Chemical compound CCCCO[Si](C(C)C)(C(C)C)OCCCC WOMDWSFYXGEOTE-UHFFFAOYSA-N 0.000 description 1
- DGPFXVBYDAVXLX-UHFFFAOYSA-N dibutyl(diethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)CCCC DGPFXVBYDAVXLX-UHFFFAOYSA-N 0.000 description 1
- YPENMAABQGWRBR-UHFFFAOYSA-N dibutyl(dimethoxy)silane Chemical compound CCCC[Si](OC)(OC)CCCC YPENMAABQGWRBR-UHFFFAOYSA-N 0.000 description 1
- ZDJARFQAQIQMOG-UHFFFAOYSA-N dibutyl(dipropoxy)silane Chemical compound CCCC[Si](CCCC)(OCCC)OCCC ZDJARFQAQIQMOG-UHFFFAOYSA-N 0.000 description 1
- SOWSAZZGDGKEQC-UHFFFAOYSA-N didecyl(diethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)CCCCCCCCCC SOWSAZZGDGKEQC-UHFFFAOYSA-N 0.000 description 1
- UDFQIGODCFRNJY-UHFFFAOYSA-N diethoxy(dihexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)CCCCCC UDFQIGODCFRNJY-UHFFFAOYSA-N 0.000 description 1
- YETKAVVSNLUTEQ-UHFFFAOYSA-N diethoxy(dioctyl)silane Chemical compound CCCCCCCC[Si](OCC)(OCC)CCCCCCCC YETKAVVSNLUTEQ-UHFFFAOYSA-N 0.000 description 1
- VDXFKFNGIDWIQQ-UHFFFAOYSA-N diethoxy(dipentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)CCCCC VDXFKFNGIDWIQQ-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
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- IUSYBNNQDKGFAJ-UHFFFAOYSA-N henicosan-11-yloxy(dimethoxy)silane Chemical compound C(CCCCCCCCC)C(O[SiH](OC)OC)CCCCCCCCCC IUSYBNNQDKGFAJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
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- 238000011835 investigation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- FABOKLHQXVRECE-UHFFFAOYSA-N phenyl(tripropoxy)silane Chemical compound CCCO[Si](OCCC)(OCCC)C1=CC=CC=C1 FABOKLHQXVRECE-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- IEKMLKYASCBALX-UHFFFAOYSA-N propoxy(tripropyl)silane Chemical compound CCCO[Si](CCC)(CCC)CCC IEKMLKYASCBALX-UHFFFAOYSA-N 0.000 description 1
- YFUOHLRSTYVNKU-UHFFFAOYSA-N silyl 2,2,2-triphenylacetate Chemical compound C1(=CC=CC=C1)C(C(=O)O[SiH3])(C1=CC=CC=C1)C1=CC=CC=C1 YFUOHLRSTYVNKU-UHFFFAOYSA-N 0.000 description 1
- OPQCZIORCQKSCY-UHFFFAOYSA-N silyl 2,2-dibutylhexanoate Chemical compound CCCCC(CCCC)(CCCC)C(=O)O[SiH3] OPQCZIORCQKSCY-UHFFFAOYSA-N 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
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- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- BQBHEHVXDMUSEJ-UHFFFAOYSA-N tributoxy(2-methylpropyl)silane Chemical compound CCCCO[Si](CC(C)C)(OCCCC)OCCCC BQBHEHVXDMUSEJ-UHFFFAOYSA-N 0.000 description 1
- DEKZKCDJQLBBRA-UHFFFAOYSA-N tributoxy(butyl)silane Chemical compound CCCCO[Si](CCCC)(OCCCC)OCCCC DEKZKCDJQLBBRA-UHFFFAOYSA-N 0.000 description 1
- GIHPVQDFBJMUAO-UHFFFAOYSA-N tributoxy(ethyl)silane Chemical compound CCCCO[Si](CC)(OCCCC)OCCCC GIHPVQDFBJMUAO-UHFFFAOYSA-N 0.000 description 1
- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 1
- QKERXNDNRCHDLW-UHFFFAOYSA-N tributoxy(pentyl)silane Chemical compound CCCCC[Si](OCCCC)(OCCCC)OCCCC QKERXNDNRCHDLW-UHFFFAOYSA-N 0.000 description 1
- INUOIYMEJLOQFN-UHFFFAOYSA-N tributoxy(phenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C1=CC=CC=C1 INUOIYMEJLOQFN-UHFFFAOYSA-N 0.000 description 1
- LEZQEMOONYYJBM-UHFFFAOYSA-N tributoxy(propan-2-yl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C(C)C LEZQEMOONYYJBM-UHFFFAOYSA-N 0.000 description 1
- WAAWAIHPWOJHJJ-UHFFFAOYSA-N tributoxy(propyl)silane Chemical compound CCCCO[Si](CCC)(OCCCC)OCCCC WAAWAIHPWOJHJJ-UHFFFAOYSA-N 0.000 description 1
- ZQJYXISBATZORI-UHFFFAOYSA-N tributyl(ethoxy)silane Chemical compound CCCC[Si](CCCC)(CCCC)OCC ZQJYXISBATZORI-UHFFFAOYSA-N 0.000 description 1
- NZINNJYWGLAHPB-UHFFFAOYSA-N tributyl(methoxy)silane Chemical compound CCCC[Si](CCCC)(CCCC)OC NZINNJYWGLAHPB-UHFFFAOYSA-N 0.000 description 1
- BTHRAJZNLDHYDE-UHFFFAOYSA-N tributyl(propoxy)silane Chemical compound CCCC[Si](CCCC)(CCCC)OCCC BTHRAJZNLDHYDE-UHFFFAOYSA-N 0.000 description 1
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- BJDLPDPRMYAOCM-UHFFFAOYSA-N triethoxy(propan-2-yl)silane Chemical compound CCO[Si](OCC)(OCC)C(C)C BJDLPDPRMYAOCM-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- HUZZQXYTKNNCOU-UHFFFAOYSA-N triethyl(methoxy)silane Chemical compound CC[Si](CC)(CC)OC HUZZQXYTKNNCOU-UHFFFAOYSA-N 0.000 description 1
- RXJWOBGGPLEFEE-UHFFFAOYSA-N triethyl(propoxy)silane Chemical compound CCCO[Si](CC)(CC)CC RXJWOBGGPLEFEE-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AAURKQPZJJMXER-UHFFFAOYSA-N triethylsilyl acetate Chemical compound CC[Si](CC)(CC)OC(C)=O AAURKQPZJJMXER-UHFFFAOYSA-N 0.000 description 1
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- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- HILHCDFHSDUYNX-UHFFFAOYSA-N trimethoxy(pentyl)silane Chemical compound CCCCC[Si](OC)(OC)OC HILHCDFHSDUYNX-UHFFFAOYSA-N 0.000 description 1
- LGROXJWYRXANBB-UHFFFAOYSA-N trimethoxy(propan-2-yl)silane Chemical compound CO[Si](OC)(OC)C(C)C LGROXJWYRXANBB-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- PHPGKIATZDCVHL-UHFFFAOYSA-N trimethyl(propoxy)silane Chemical compound CCCO[Si](C)(C)C PHPGKIATZDCVHL-UHFFFAOYSA-N 0.000 description 1
- QHUNJMXHQHHWQP-UHFFFAOYSA-N trimethylsilyl acetate Chemical compound CC(=O)O[Si](C)(C)C QHUNJMXHQHHWQP-UHFFFAOYSA-N 0.000 description 1
- KPCMGPQUQDHHRT-UHFFFAOYSA-N tripentyl(propoxy)silane Chemical compound CCCCC[Si](CCCCC)(CCCCC)OCCC KPCMGPQUQDHHRT-UHFFFAOYSA-N 0.000 description 1
- VKQBZOCATLGFBC-UHFFFAOYSA-N tris-decyl(ethoxy)silane Chemical compound CCCCCCCCCC[Si](CCCCCCCCCC)(CCCCCCCCCC)OCC VKQBZOCATLGFBC-UHFFFAOYSA-N 0.000 description 1
- QFMIQINBQZUFGL-UHFFFAOYSA-N tris-decyl(methoxy)silane Chemical compound CCCCCCCCCC[Si](CCCCCCCCCC)(CCCCCCCCCC)OC QFMIQINBQZUFGL-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Landscapes
- Paints Or Removers (AREA)
- Silicon Polymers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Catalysts (AREA)
Abstract
Description
本発明は、プラスチック基材上に下塗り層(第1塗膜)を形成し、さらにその上に光触媒性酸化チタンを含む塗膜(第2塗膜)を有する樹脂成形品の製造方法に関する。 The present invention relates to a method for producing a resin molded article having an undercoat layer (first coating film) formed on a plastic substrate and further having a coating film (second coating film) containing photocatalytic titanium oxide thereon.
環境汚染に伴い、建築外装材料、屋外建造物の汚れが問題となっている。この汚れを防止するために、光触媒の強い酸化力と親水性を利用した塗料が提案されている。 Along with environmental pollution, dirt on building exterior materials and outdoor buildings has become a problem. In order to prevent this contamination, a paint utilizing the strong oxidizing power and hydrophilicity of the photocatalyst has been proposed.
しかしながら、アクリル樹脂、ポリカーボネート樹脂、ポリエチレンテレフタレート樹脂等のプラスチックを基材とする樹脂成形品の場合、このプラスチック基材上に光触媒を含む塗膜を直接形成すると、プラスチック基材と光触媒を含む塗膜との親和性が良好とは言えず、密着性に劣る場合があった。また、光触媒の酸化作用によって、時間とともにプラスチック基材が白化したり、クッラックが発生したり、さらには光触媒を含む塗膜が剥離する等、耐候性に問題がある場合があった。 However, in the case of a resin molded product based on plastic such as acrylic resin, polycarbonate resin, polyethylene terephthalate resin, etc., if a coating film containing a photocatalyst is directly formed on this plastic substrate, a coating film containing a plastic substrate and a photocatalyst It could not be said that the affinity with was good, and there were cases where the adhesion was poor. In addition, due to the oxidizing action of the photocatalyst, the plastic substrate may be whitened over time, cracks may be generated, or the coating film containing the photocatalyst may be peeled off.
上記問題を解決するために、プラスチック基材上に、まず、下塗り層を施し、その上に光触媒を含む塗膜を形成する方法が提案されている。中でも、下塗り層としてアルコキシシランの加水分解物および/または縮合物を主原料とするシリカ系組成物等を乾燥硬化させたものが、耐磨耗性や透明性の点で優れており、最も広く用いられている。(特許文献1参照)。
しかし、樹脂成形品上に形成したシリカ系組成物からなる下塗り層は、乾燥硬化の条件によっては、プラスチック基材または/および光触媒を含む塗膜との密着性が低い場合があった。 However, an undercoat layer made of a silica-based composition formed on a resin molded product may have low adhesion to a plastic substrate and / or a coating film containing a photocatalyst depending on the drying and curing conditions.
本発明は、上記課題を解決するためになされたものである。すなわち、本発明の目的は、プラスチック基材と下塗り層(第1塗膜)、および下塗り層(第1塗膜)と光触媒を含む塗膜(第2塗膜)の密着性が優れ、光触媒の効果が長期にわたり持続する樹脂成形品の製造方法を提供することである。 The present invention has been made to solve the above problems. That is, an object of the present invention is to provide excellent adhesion of a plastic substrate, an undercoat layer (first coating film), and an undercoat layer (first coating film) and a coating film containing a photocatalyst (second coating film). It is to provide a method for producing a resin molded product whose effect is sustained for a long time.
本発明者らは、上述した各課題を解決するために鋭意検討した結果、プラスチック基材上に適度にシラノール基を残存させた第1塗膜を形成し、さらにその上に、光触媒性酸化チタンとシリカ系バインダーを含有する組成物を塗布し、乾燥硬化させ第2塗膜を形成することで、プラスチック基材、第1塗膜、第2塗膜の密着性が良好に得られ、光触媒の効果が長期にわたり持続する樹脂成形品が得られることを見出し、本発明に至った。 As a result of intensive investigations to solve the above-mentioned problems, the present inventors formed a first coating film on which a silanol group was appropriately left on a plastic substrate, and a photocatalytic titanium oxide was further formed thereon. And a composition containing a silica-based binder are applied, dried and cured to form a second coating film, whereby good adhesion of the plastic substrate, the first coating film, and the second coating film is obtained. The present inventors have found that a resin molded product having an effect that lasts for a long time can be obtained, and have reached the present invention.
すなわち、本発明は、プラスチック基材上に式(1)で表わされるオルガノシラン類の加水分解物および/またはその縮合物を含有する組成物を塗布し、シラノール基に起因する赤外吸収スペクトルのピーク面積(S1)とシロキサン結合に起因する赤外吸収スペクトルのピーク面積(S2)との比(S1/S2)が0.005〜0.250となるように乾燥硬化させて第1塗膜を形成し、その上に光触媒性酸化チタンとシリカ系バインダーを含有する組成物を塗布し乾燥硬化して第2塗膜を形成する樹脂成形品の製造方法である。
(R1)nSi(OR2)4-n (1)
(式中、R1は炭素数1〜10の有機基を示し、R2は炭素数1〜5のアルキル基または炭素数1〜4のアシル基を示す。nは0〜3の整数である。)
That is, the present invention applies a composition containing a hydrolyzate of organosilanes represented by formula (1) and / or a condensate thereof on a plastic substrate, and exhibits an infrared absorption spectrum caused by a silanol group. The first coating film is dried and cured so that the ratio (S1 / S2) of the peak area (S1) to the peak area (S2) of the infrared absorption spectrum due to the siloxane bond is 0.005 to 0.250. This is a method for producing a resin molded product, which is formed, coated with a composition containing photocatalytic titanium oxide and a silica-based binder, dried and cured to form a second coating film.
(R 1 ) n Si (OR 2 ) 4-n (1)
(In the formula, R 1 represents an organic group having 1 to 10 carbon atoms, R 2 represents an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms. N is an integer of 0 to 3). .)
本発明によれば、プラスチック基材、第1塗膜、第2塗膜の密着性が優れ、光触媒効果が長期にわたり持続する樹脂成形品とすることが出来る。 ADVANTAGE OF THE INVENTION According to this invention, it can be set as the resin molded product which is excellent in the adhesiveness of a plastic base material, a 1st coating film, and a 2nd coating film, and a photocatalytic effect continues over a long term.
以下、本発明の好適な実施形態について説明する。 Hereinafter, preferred embodiments of the present invention will be described.
本発明の樹脂成形品に利用できるプラスチック基材としては、特に限定されるものではないが、例えば、アクリル樹脂、ポリカーボネート樹脂、ポリ塩化ビニル樹脂、ウレタン樹脂、フェノール樹脂、エポキシ樹脂、ポリエステル樹脂、ポリエチレン樹脂、ポリプロピレン樹脂等のプラスチック成型品、プラスチックフィルムや繊維などをあげることが出来る。 The plastic base material that can be used in the resin molded product of the present invention is not particularly limited. For example, acrylic resin, polycarbonate resin, polyvinyl chloride resin, urethane resin, phenol resin, epoxy resin, polyester resin, polyethylene Examples thereof include plastic molded products such as resins and polypropylene resins, plastic films and fibers.
第1塗膜とは、式(1)で表わされるオルガノシラン類の加水分解物および/またはその縮合物を含有する組成物(第1塗膜形成用組成物)を塗布し、乾燥硬化して得られる塗膜である。
(R1)nSi(OR2)4-n (1)
(式中、R1は炭素数1〜10の有機基を示し、R2は炭素数1〜5のアルキル基または炭素数1〜4のアシル基を示す。nは0〜3の整数である。)
The first coating film is a composition (first coating film forming composition) containing a hydrolyzate of organosilanes represented by the formula (1) and / or a condensate thereof, dried and cured. It is a coating film obtained.
(R 1 ) n Si (OR 2 ) 4-n (1)
(In the formula, R 1 represents an organic group having 1 to 10 carbon atoms, R 2 represents an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms. N is an integer of 0 to 3). .)
また、これらの組成物にコロイド状シリカを配合したものを使用しても良い。 Moreover, you may use what mix | blended colloidal silica with these compositions.
第1塗膜形成用組成物は、固形分濃度の調整、固形分の分散安定性、保存安定性の向上のために有機溶剤を含有させて用いるのが一般的である。 The first coating film-forming composition is generally used by containing an organic solvent in order to adjust the solid content concentration, improve the dispersion stability of the solid content, and improve the storage stability.
式(1)において、R1は炭素数1〜10の有機基である。nが2または3の場合、R1は、全て同一である必要はなく、異なっていても良い。 In formula (1), R 1 is an organic group having 1 to 10 carbon atoms. When n is 2 or 3, all R 1 need not be the same and may be different.
R1の具体例としては、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、tert−ブチル基、n−ペンチル基、n−デシル基、アリル基、3−(2−アミノエチルアミノ)プロピル基、3−アミノプロピル基、ビニル基、3−グリシドキシプロピル基、3−メタクリロキシプロピル基、3−アクリロキシプロピル基、フェニル基、3−メルカプトプロピル基、3−クロロプロピル基、3−クロロブチル基、3,4−エポキシシクロヘキシルエチル基、3,3,3−トリフロロプロピル基等が挙げられる。 Specific examples of R 1 include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, n-decyl group, allyl group, 3- (2-aminoethylamino) propyl group, 3-aminopropyl group, vinyl group, 3-glycidoxypropyl group, 3-methacryloxypropyl group, 3-acryloxypropyl group, phenyl group, 3-mercaptopropyl group, Examples include 3-chloropropyl group, 3-chlorobutyl group, 3,4-epoxycyclohexylethyl group, 3,3,3-trifluoropropyl group, and the like.
式(1)において、R2は炭素数1〜5のアルキル基または炭素数1〜4のアシル基である。nが0〜2の場合、R2は、全て同一である必要はなく、異なっていても良い。 In the formula (1), R 2 is an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms. When n is 0 to 2, R 2 is not necessarily the same and may be different.
その具体例としては、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、tert−ブチル基、n−ペンチル基、アセチル基等が挙げられる。 Specific examples thereof include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, tert-butyl group, n-pentyl group, acetyl group and the like.
式(1)で表わされるオルガノシラン類の具体例としては、テトラメトキシシラン、テトラエトキシシラン、テトラプロポキシシラン、テトラブトキシシラン、テトラアセトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、メチルトリプロポキシシラン、メチルトリブトキシシラン、メチルトリアセトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、エチルトリプロポキシシラン、エチルトリブトキシシラン、エチルトリアセトキシシラン、n−プロピルトリメトキシシラン、n−プロピルトリエトキシシラン、n−プロピルトリプロポキシシラン、n−プロピルトリブトキシシラン、n−プロピルトリアセトキシシラン、イソプロピルトリメトキシシラン、イソプロピルトリエトキシシラン、イソプロピルトリプロポキシシラン、イソプロピルトリブトキシシラン、イソプロピルトリアセトキシシラン、n−ブチルトリメトキシシラン、n−ブチルトリエトキシシラン、n−ブチルトリプロポキシシラン、n−ブチルトリブトキシシラン、n−ブチルトリアセトキシシラン、イソブチルトリメトキシシラン、イソブチルトリエトキシシラン、イソブチルトリプロポキシシラン、イソブチルトリブトキシシラン、イソブチルトリアセトキシシラン、n−ペンチルトリメトキシシラン、n−ペンチルトリエトキシシラン、n−ペンチルトリプロポキシシラン、n−ペンチルトリブトキシシラン、n−ペンチルトリアセトキシシラン、n−ヘキシルトリメトキシシラン、n−ヘキシルトリエトキシシラン、n−オクチルトリメトキシシラン、n−オクチルトリエトキシシラン、n−デシルトリメトキシシラン、n−デシルトリエトキシシラン、フェニルトリメトキシシラン、フェニルトリエトキシシラン、フェニルトリプロポキシシラン、フェニルトリブトキシシラン、フェニルトリアセトキシシラン、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジメチルジプロポキシシラン、ジメチルジブトキシシラン、ジメチルジアセトキシシラン、ジエチルジメトキシシラン、ジエチルジエトキシシラン、ジエチルジプロポキシシラン、ジエチルジブトキシシラン、ジエチルジアセトキシシラン、ジ−n−プロピルジメトキシシラン、ジ−n−プロピルジエトキシシラン、ジ−n−プロピルジプロポキシシラン、ジ−n−プロピルジブトキシシラン、ジ−n−プロピルジアセトキシシラン、ジイソプロピルジメトキシシラン、ジイソプロピルジエトキシシラン、ジイソプロピルジプロポキシシラン、ジイソプロピルジブトキシシラン、ジイソプロピルジアセトキシシラン、ジ−n−ブチルジメトキシシラン、ジ−n−ブチルジエトキシシラン、ジ−n−ブチルジプロポキシシラン、ジ−n−ブチルジブトキシシラン、ジ−n−ブチルジアセトキシシラン、ジイソブチルジメトキシシラン、ジイソブチルジエトキシシラン、ジイソブチルジプロポキシシラン、ジイソブチルジブトキシシラン、ジイソブチルジアセトキシシラン、ジ−n−ペンチルジメトキシシラン、ジ−n−ペンチルジエトキシシラン、ジ−n−ペンチルジプロポキシシラン、ジ−n−ペンチルジブトキシシラン、ジ−n−ペンチルジアセトキシシラン、ジ−n−ヘキシルジメトキシシラン、ジ−n−ヘキシルジエトキシシラン、ジ−n−オクチルジメトキシシラン、ジ−n−オクチルジエトキシシラン、ジ−n−デシルトリメトキシシラン、ジ−n−デシルジエトキシシラン、ジフェニルジメトキシシラン、ジフェニルジエトキシシラン、ジフェニルジプロポキシシラン、ジフェニルジブトキシシラン、ジフェニルジアセトキシシラン、トリメチルメトキシシラン、トリメチルエトキシシラン、トリメチルプロポキシシラン、トリメチルブトキシシラン、トリメチルアセトキシシラン、トリエチルメトキシシラン、トリエチルエトキシシラン、トリエチルプロポキシシラン、トリエチルブトキシシラン、トリエチルアセトキシシラン、トリ−n−プロピルメトキシシラン、トリ−n−プロピルエトキシシラン、トリ−n−プロピルプロポキシシラン、トリ−n−プロピルブトキシシラン、トリ−n−プロピルアセトキシシラン、トリイソプロピルメトキシシラン、トリイソプロピルエトキシシラン、トリイソプロピルプロポキシシラン、トリイソプロピルブトキシシラン、トリイソプロピルアセトキシシラン、トリ−n−ブチルメトキシシラン、トリ−n−ブチルエトキシシラン、トリ−n−ブチルプロポキシシラン、トリ−n−ブチルブトキシシラン、トリ−n−ブチルアセトキシシラン、トリイソブチルメトキシシラン、トリイソブチルエトキシシラン、トリイソブチルプロポキシシラン、トリイソブチルブトキシシラン、トリイソブチルアセトキシシラン、トリ−n−ペンチルメトキシシラン、トリ−n−ペンチルエトキシシラン、トリ−n−ペンチルプロポキシシラン、トリ−n−ペンチルブトキシシラン、トリ−n−ペンチルアセトキシシラン、トリ−n−ヘキシルメトキシシラン、トリ−n−ヘキシルエトキシシラン、トリ−n−オクチルメトキシシラン、トリ−n−オクチルエトキシシラン、トリ−n−デシルメトキシシラン、トリ−n−デシルエトキシシラン、トリフェニルメトキシシラン、トリフェニルエトキシシラン、トリフェニルプロポキシシラン、トリフェニルブトキシシラン、トリフェニルアセトキシシラン等が挙げられる。 Specific examples of the organosilanes represented by the formula (1) include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, tetraacetoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltripropoxysilane. , Methyltributoxysilane, methyltriacetoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltripropoxysilane, ethyltributoxysilane, ethyltriacetoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, n-propyltripropoxysilane, n-propyltributoxysilane, n-propyltriacetoxysilane, isopropyltrimethoxysilane, isopropyltriethoxysilane, Propyltripropoxysilane, isopropyltributoxysilane, isopropyltriacetoxysilane, n-butyltrimethoxysilane, n-butyltriethoxysilane, n-butyltripropoxysilane, n-butyltributoxysilane, n-butyltriacetoxysilane, Isobutyltrimethoxysilane, isobutyltriethoxysilane, isobutyltripropoxysilane, isobutyltributoxysilane, isobutyltriacetoxysilane, n-pentyltrimethoxysilane, n-pentyltriethoxysilane, n-pentyltripropoxysilane, n-pentyltri Butoxysilane, n-pentyltriacetoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-octyltrimethoxysilane, -Octyltriethoxysilane, n-decyltrimethoxysilane, n-decyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, phenyltripropoxysilane, phenyltributoxysilane, phenyltriacetoxysilane, dimethyldimethoxysilane, dimethyl Diethoxysilane, dimethyldipropoxysilane, dimethyldibutoxysilane, dimethyldiacetoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldipropoxysilane, diethyldibutoxysilane, diethyldiacetoxysilane, di-n-propyldimethoxysilane Di-n-propyldiethoxysilane, di-n-propyldipropoxysilane, di-n-propyldibutoxysilane, di-n-propyldiacetoxy Sisilane, diisopropyldimethoxysilane, diisopropyldiethoxysilane, diisopropyldipropoxysilane, diisopropyldibutoxysilane, diisopropyldiacetoxysilane, di-n-butyldimethoxysilane, di-n-butyldiethoxysilane, di-n-butyldipropoxy Silane, di-n-butyldibutoxysilane, di-n-butyldiacetoxysilane, diisobutyldimethoxysilane, diisobutyldiethoxysilane, diisobutyldipropoxysilane, diisobutyldibutoxysilane, diisobutyldiacetoxysilane, di-n-pentyldimethoxy Silane, di-n-pentyldiethoxysilane, di-n-pentyldipropoxysilane, di-n-pentyldibutoxysilane, di-n-pentyldiacetoxysilane, -N-hexyldimethoxysilane, di-n-hexyldiethoxysilane, di-n-octyldimethoxysilane, di-n-octyldiethoxysilane, di-n-decyltrimethoxysilane, di-n-decyldiethoxysilane , Diphenyldimethoxysilane, diphenyldiethoxysilane, diphenyldipropoxysilane, diphenyldibutoxysilane, diphenyldiacetoxysilane, trimethylmethoxysilane, trimethylethoxysilane, trimethylpropoxysilane, trimethylbutoxysilane, trimethylacetoxysilane, triethylmethoxysilane, triethyl Ethoxysilane, triethylpropoxysilane, triethylbutoxysilane, triethylacetoxysilane, tri-n-propylmethoxysilane, tri-n-propyl Toxisilane, tri-n-propylpropoxysilane, tri-n-propylbutoxysilane, tri-n-propylacetoxysilane, triisopropylmethoxysilane, triisopropylethoxysilane, triisopropylpropoxysilane, triisopropylbutoxysilane, triisopropylacetoxysilane , Tri-n-butylmethoxysilane, tri-n-butylethoxysilane, tri-n-butylpropoxysilane, tri-n-butylbutoxysilane, tri-n-butylacetoxysilane, triisobutylmethoxysilane, triisobutylethoxysilane , Triisobutylpropoxysilane, triisobutylbutoxysilane, triisobutylacetoxysilane, tri-n-pentylmethoxysilane, tri-n-pentylethoxysila Tri-n-pentylpropoxysilane, tri-n-pentylbutoxysilane, tri-n-pentylacetoxysilane, tri-n-hexylmethoxysilane, tri-n-hexylethoxysilane, tri-n-octylmethoxysilane, Tri-n-octylethoxysilane, tri-n-decylmethoxysilane, tri-n-decylethoxysilane, triphenylmethoxysilane, triphenylethoxysilane, triphenylpropoxysilane, triphenylbutoxysilane, triphenylacetoxysilane, etc. Can be mentioned.
中でも、膜の硬度、強度、耐摩耗性の点から、テトラメトキシシラン、テトラエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、フェニルトリメトキシラン、フェニルトリエトキシシラン、ジメチルジメトキシシラン、ジエチルジエトキシシランが好ましい。 Among these, from the viewpoint of film hardness, strength, and abrasion resistance, tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, phenyltrimethoxysilane, phenyltrimethoxysilane. Ethoxysilane, dimethyldimethoxysilane, and diethyldiethoxysilane are preferred.
コロイド状シリカの具体例としては、水分散コロイド状シリカ、メタノール分散コロイド状シリカ、エタノール分散コロイド状シリカ、イソプロパノール分散コロイド状シリカ、エチレングリコール分散コロイド状シリカ、イソブタノール分散コロイド状シリカ等が挙げられる。中でも、オルガノシラン類の加水分解物または/および縮合物と混合した際の安定性の点から、イソプロパノール分散コロイド状シリカが好ましい。市販品としては、スノーテックスIPA−ST(日産化学工業(株)製、商品名)、OSCAL1432(触媒化成工業(株)製、商品名)などが挙げられる。 Specific examples of colloidal silica include water-dispersed colloidal silica, methanol-dispersed colloidal silica, ethanol-dispersed colloidal silica, isopropanol-dispersed colloidal silica, ethylene glycol-dispersed colloidal silica, and isobutanol-dispersed colloidal silica. . Among these, isopropanol-dispersed colloidal silica is preferable from the viewpoint of stability when mixed with a hydrolyzate or / and condensate of organosilanes. Examples of commercially available products include Snowtex IPA-ST (manufactured by Nissan Chemical Industries, Ltd., trade name), OSCAL1432 (manufactured by Catalyst Chemical Industries, Ltd., trade name), and the like.
第1塗膜形成用組成物中に用いる有機溶媒としては、アルコール類、ケトン類、エーテル類、セロソルブ類、エステル類、芳香族化合物類などを挙げることができる。 Examples of the organic solvent used in the first coating film-forming composition include alcohols, ketones, ethers, cellosolves, esters, and aromatic compounds.
具体的には、メタノール、エタノール、n−プロパノール、イソプロパノール、n−ブタノール、sec−ブタノール、tert−ブタノール、イソブタノール、エチレングリコール、ジエチレングリコール、トリエチレングリコール、プロピレングリコールモノメチルエーテル、アセトン、メチルエチルケトン、メチルイソブチルケトン、ジイソブチルケトン、テトラヒドロフラン、ジオキサン、メチルセロソルブ、エチルセロソルブ、ブチルセロソルブ、トルエン、キシレン、酢酸エチル、酢酸ブチル、γ−ブチロラクトン、ジアセトンアルコール、1−アセトキシ−2−エトキシエタンなどを挙げることができる。これらは1種あるいは2種以上を混合して使用することもできる。 Specifically, methanol, ethanol, n-propanol, isopropanol, n-butanol, sec-butanol, tert-butanol, isobutanol, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol monomethyl ether, acetone, methyl ethyl ketone, methyl isobutyl Examples thereof include ketone, diisobutyl ketone, tetrahydrofuran, dioxane, methyl cellosolve, ethyl cellosolve, butyl cellosolve, toluene, xylene, ethyl acetate, butyl acetate, γ-butyrolactone, diacetone alcohol, 1-acetoxy-2-ethoxyethane, and the like. These can also be used 1 type or in mixture of 2 or more types.
第1塗膜形成用組成物中の有機溶媒の割合は、第1塗膜形成用組成物中の固形分濃度が0.05〜30.00重量%となるように用いるのが一般的である。固形分濃度が0.05重量%以上となるように有機溶媒を用いることは、固形分濃度が低くなりすぎて、第1塗膜が薄くなり、十分な密着性、耐候性が得られなくなるのを避ける点で有効である。また、30.00重量%以下となるように有機溶媒を用いる事は、分散安定性、および保存安定性の点、ならびに液の粘度が高くなりすぎるのを防止して良好な第1塗膜を得る点で有効である。 The proportion of the organic solvent in the first coating film forming composition is generally used so that the solid content concentration in the first coating film forming composition is 0.05 to 30.00% by weight. . Using an organic solvent so that the solid content concentration is 0.05% by weight or more causes the solid content concentration to be too low, the first coating film becomes thin, and sufficient adhesion and weather resistance cannot be obtained. It is effective in avoiding. Moreover, using an organic solvent so that it may become 30.00 weight% or less prevents the point of dispersion stability and storage stability, and the viscosity of a liquid from becoming too high, and makes a favorable 1st coating film. It is effective in getting.
第1塗膜に適した第1塗膜形成用組成物を調製する方法の好適な一例を説明する。 A suitable example of the method for preparing the first coating film forming composition suitable for the first coating film will be described.
まず、式(1)で表されるオルガノシラン類、場合によっては、さらにコロイド状シリカを加えよく混合する。この液を攪拌しながら、適量の水を入れ加水分解する。その際、加水分解を促進するために塩酸、酢酸などによりpHを酸性(例えば、2〜5)に調整する。3〜5時間程度攪拌を続けた後、NMR法により充分に加水分解されていることを確認した後、アンモニア、水酸化ナトリウム、酢酸ナトリウム水溶液などを添加し、pHを中性付近(例えば、6〜7)に調整し、約20時間程度攪拌を続け縮合を行なう。その後、有機溶媒、必要に応じ硬化剤、レベリング剤などを添加し、均一に混合して、第1塗膜形成用組成物を得ることができる。 First, an organosilane represented by the formula (1), and in some cases, colloidal silica is further added and mixed well. While stirring this liquid, an appropriate amount of water is added to hydrolyze. At that time, the pH is adjusted to acidic (for example, 2 to 5) with hydrochloric acid, acetic acid or the like in order to promote hydrolysis. After stirring for about 3 to 5 hours, after confirming that it is sufficiently hydrolyzed by NMR method, ammonia, sodium hydroxide, sodium acetate aqueous solution and the like are added, and the pH is adjusted to near neutral (for example, 6 To 7), stirring is continued for about 20 hours and condensation is carried out. Then, an organic solvent, a hardening | curing agent, a leveling agent, etc. are added as needed, and it can mix uniformly and can obtain the composition for 1st coating-film formation.
このような第1塗膜形成用組成物を用いて、第1塗膜を形成する方法としては、プラスチック基材上の少なくとも一部に第1塗膜形成用組成物を塗布し、乾燥硬化させる方法が挙げられる。 As a method of forming the first coating film using such a first coating film-forming composition, the first coating film-forming composition is applied to at least a part of the plastic substrate, and is dried and cured. A method is mentioned.
プラスチック基材上の少なくとも一部に第1塗膜形成用組成物を塗布する方法としては、刷毛塗り法、流延法、ローラーコート法、バーコート法、噴霧コート法、エアーナイフコート法、ディップコート法、スピンコート法等を挙げることが出来るが特に限定されない。 As a method for applying the first coating film forming composition to at least a part of the plastic substrate, a brush coating method, a casting method, a roller coating method, a bar coating method, a spray coating method, an air knife coating method, a dip Examples of the method include a coating method and a spin coating method, but the method is not particularly limited.
プラスチック基材上に第1塗膜形成用組成物を塗布した後は、乾燥硬化することにより、第1塗膜形成用組成物中のシラノール基が縮合反応し、シロキサン結合を形成することで架橋が進行し、硬化塗膜となる。 After applying the first coating film-forming composition on the plastic substrate, the silanol groups in the first coating film-forming composition undergo a condensation reaction and form a siloxane bond by drying and curing. Progresses to a cured coating film.
本発明は、この第1塗膜形成用組成物の乾燥条件を制御し、第1塗膜中のシラノール基をある範囲で残存させることにより、その上に形成される第2塗膜との密着性を発現させることを可能にしている。 The present invention controls the drying conditions of the composition for forming the first coating film, and allows the silanol groups in the first coating film to remain within a certain range, thereby adhering to the second coating film formed thereon. It is possible to express sex.
第1塗膜中に残存させるシラノール基の量は、塗膜中のシラノール基に起因する赤外吸収スペクトルのピーク面積(S1)とシロキサン結合に起因する赤外吸収スペクトルのピーク面積(S2)との比(S1/S2)で規定され、0.005〜0.250である。この密着性は、第1塗膜中のシラノール基と第2塗膜中のシラノール基が縮合することにより発現される。 The amount of silanol groups remaining in the first coating film is the peak area (S1) of the infrared absorption spectrum due to the silanol groups in the coating film and the peak area (S2) of the infrared absorption spectrum due to the siloxane bond. The ratio (S1 / S2) is 0.005 to 0.250. This adhesion is expressed by the condensation of the silanol group in the first coating film and the silanol group in the second coating film.
乾燥条件は得られた第1塗膜のS1/S2が0.005〜0.250となる条件であれば、特に限定されないが、通常、乾燥温度10〜150℃、乾燥時間30秒〜3600分の範囲で行なわれる。 The drying conditions are not particularly limited as long as S1 / S2 of the obtained first coating film is 0.005 to 0.250. Usually, the drying temperature is 10 to 150 ° C., and the drying time is 30 seconds to 3600 minutes. It is performed in the range.
シラノール基とシロキサン結合に起因する赤外吸収スペクトルの各ピーク面積S1、S2は以下のように求められる。なお、ここで赤外吸収スペクトルは表面ATR法により測定し、スペクトルは波数均等表示チャート記録による。 The peak areas S1 and S2 of the infrared absorption spectrum due to the silanol group and the siloxane bond are determined as follows. Here, the infrared absorption spectrum is measured by the surface ATR method, and the spectrum is based on the wave number uniform display chart recording.
図1は第1塗膜の赤外吸収スペクトル曲線の例である。用いるスペクトル曲線は波数対吸光度のスペクトル曲線である。シラノール基(Si−OH)に起因するピークP1は、図1の900cm-1付近にあらわれるので、その両側の二点A、Bを結ぶ線分AB、具体的には850cm-1での吸光度を示す点Aと950cm-1で示す吸光度を示す点Bを結ぶ線分ABとこの間のスペクトル曲線とで囲まれる面積をシラノール基に起因するピーク面積(S1)とする。同様にシロキサン結合(Si−O−Si)に起因するピークP2は1060cm-1付近にあらわれるので、その両側の二点B,Cを結ぶ線分BC、具体的には950cm-1での吸光度を示す点Bと1250cm-1での吸光度を示す点Cとを結ぶ線分BCとこの間のスペクトル曲線で囲まれる面積をシロキサン結合に起因するピーク面積(S2)とする。 FIG. 1 is an example of an infrared absorption spectrum curve of the first coating film. The spectral curve used is a spectral curve of wave number versus absorbance. Since the peak P1 due to the silanol group (Si—OH) appears in the vicinity of 900 cm −1 in FIG. 1, the absorbance at the line segment AB connecting the two points A and B on both sides, specifically, the absorbance at 850 cm −1 is obtained. The area surrounded by the line segment AB connecting the point A shown and the point B showing the absorbance shown at 950 cm −1 and the spectrum curve therebetween is defined as the peak area (S1) due to the silanol group. Since Similarly peak P2 due to siloxane bond (Si-O-Si) appears near 1060 cm -1, two points B on both sides of the line segment connecting the C BC, the absorbance at the particular 950 cm -1 The area surrounded by the line segment BC connecting the point B shown and the point C showing the absorbance at 1250 cm −1 and the spectrum curve between them is defined as the peak area (S2) due to the siloxane bond.
第1塗膜の縮合反応の進行程度は、S1とS2の比率(S1/S2)であらわすことができる。 The progress degree of the condensation reaction of the first coating film can be expressed by the ratio of S1 and S2 (S1 / S2).
S1/S2が小さい程、縮合反応が進み、残存するシラノール基が少ない状態を表し、S1/S2が大きい程縮合反応が進んでおらず、シラノール基が多く残存する状態を表している。S1/S2が0.005未満の場合、第1塗膜上に第2塗膜形成用組成物を塗布し乾燥硬化させ第2塗膜を形成させても、第1塗膜中には、第2塗膜中のシラノール基と結合する十分なシラノール基が存在しないため第1塗膜と第2塗膜の密着性が得られない。また、S1/S2が0.250より大きい場合、第1塗膜上に第2塗膜形成用組成物を塗布し乾燥硬化すると、第1塗膜の縮合があまり進んでいないため、第2塗膜形成用組成物を塗布する際に、第1塗膜が膨潤し、プラスチック基材から剥離したり、プラスチック基材との密着性が低下したりする。 The smaller S1 / S2, the more the condensation reaction proceeds and the less silanol groups remain. The larger the S1 / S2, the less the condensation reaction proceeds and the more silanol groups remain. When S1 / S2 is less than 0.005, even if the second coating film-forming composition is applied on the first coating film and dried and cured to form the second coating film, 2 Adhesiveness between the first coating film and the second coating film cannot be obtained because there are not enough silanol groups that bind to the silanol groups in the coating film. In addition, when S1 / S2 is larger than 0.250, when the second coating film-forming composition is applied onto the first coating film and dried and cured, the condensation of the first coating film has not progressed so much. When the film-forming composition is applied, the first coating film swells and peels off from the plastic substrate, or the adhesion with the plastic substrate decreases.
すなわち、S1/S2を0.005以上とすることで樹脂成形品の第1塗膜と第2塗膜との密着性を発現することができる。また0.250以下とすることでプラスチック基材と第1塗膜との密着性を発現することが出来る。さらに好ましいS1/S2の範囲は0.010〜0.200である。 That is, by setting S1 / S2 to 0.005 or more, it is possible to develop the adhesion between the first coating film and the second coating film of the resin molded product. Moreover, the adhesiveness of a plastic base material and a 1st coating film can be expressed by setting it as 0.250 or less. A more preferable range of S1 / S2 is 0.010 to 0.200.
第1塗膜の膜厚は、1〜20μmとなるように形成するのがよい。第1塗膜の膜厚を1μm以上とすることにより、後述する光触媒性酸化チタンを含む層(第2塗膜)によるプラスチック基材の劣化を長期間抑えることが出来る。また、膜厚を20μm以下とすることで硬化時のクラック発生を抑制することが出来る。好ましくは2〜10μmである。 The film thickness of the first coating film is preferably 1 to 20 μm. By setting the film thickness of the first coating film to 1 μm or more, deterioration of the plastic substrate due to a layer (second coating film) containing photocatalytic titanium oxide described later can be suppressed for a long period of time. Moreover, the crack generation at the time of hardening can be suppressed by making a film thickness into 20 micrometers or less. Preferably it is 2-10 micrometers.
本発明の第2塗膜は、光触媒性酸化チタンとシリカ系バインダーを含有する組成物(第2塗膜形成用組成物)を第1塗膜上の少なくとも一部に塗布し、乾燥硬化を行なうことにより得られる。 In the second coating film of the present invention, a composition containing a photocatalytic titanium oxide and a silica-based binder (a composition for forming a second coating film) is applied to at least a part of the first coating film, and is dried and cured. Can be obtained.
この第2塗膜形成用組成物は、光触媒性酸化チタンとシリカ系バインダーを含有すれば特に限定はなく、水系・有機溶媒系を問わず用いることが出来る。光触媒性酸化チタンは、特に限定されないが、アナタース型酸化チタン、ブルッカイト型酸化チタンのいずれか一方または両方であることが好ましい。シリカ系バインダーは、特に限定されないが、オルガノシラン類の加水分解物、縮合物のいずれか一方または両方を主成分とする組成物等があげられ、例えば、エチルシリケートに代表されるアルキルシリケート類(SinOn-1(OR)2n+2(但し、nは整数であり、Rは1〜4のアルキル基が一般的である。))、メチルトリメトキシシランに代表されるオルガノシラン類(R1 nSi(OR2)4-n(但し、nは0〜3の整数であり、R1は炭素数1〜10の有機基を示し、R2は炭素数1〜5のアルキル基または炭素数1〜4のアシル基が一般的である。))の加水分解物、縮合物のいずれか一方、または両方を主成分とする組成物が例示できる。 The composition for forming the second coating film is not particularly limited as long as it contains a photocatalytic titanium oxide and a silica-based binder, and can be used regardless of whether it is aqueous or organic solvent. The photocatalytic titanium oxide is not particularly limited, but is preferably one or both of anatase type titanium oxide and brookite type titanium oxide. The silica-based binder is not particularly limited, and examples thereof include a composition mainly composed of one or both of hydrolyzate and condensate of organosilanes. For example, alkyl silicates represented by ethyl silicate ( Si n O n-1 (OR) 2n + 2 (where n is an integer and R is generally an alkyl group of 1 to 4)), organosilanes represented by methyltrimethoxysilane ( R 1 n Si (OR 2 ) 4-n (where n is an integer of 0 to 3, R 1 represents an organic group having 1 to 10 carbon atoms, and R 2 is an alkyl group having 1 to 5 carbon atoms or A C1-C4 acyl group is common.))) A hydrolyzate, a condensate, or the composition which has as a main component can be illustrated.
第2塗膜形成用組成物中の光触媒性酸化チタンの含有率は、0.05〜10質量%であることが好ましい。 It is preferable that the content rate of the photocatalytic titanium oxide in the composition for 2nd coating film formation is 0.05-10 mass%.
このような第2塗膜形成用組成物として、一般に市販されているものを用いることもできる。例えば、ST−K211(石原産業(株)製、商品名)、NTB-30(昭和電工(株)製、商品名)等があげられる。なお、第2塗膜形成用組成物は、これらに限定されるものではない。 What is generally marketed can also be used as such a composition for 2nd coating-film formation. For example, ST-K211 (Ishihara Sangyo Co., Ltd., trade name), NTB-30 (Showa Denko Co., Ltd., trade name) and the like can be mentioned. In addition, the composition for 2nd coating film formation is not limited to these.
第2塗膜を形成する方法としては、S1/S2が0.005〜0.250となるよう乾燥硬化させた第1塗膜上の少なくとも一部に第2塗膜形成用組成物を塗布し、乾燥硬化させる方法が挙げられる。 As a method of forming the second coating film, the composition for forming the second coating film is applied to at least a part of the first coating film dried and cured so that S1 / S2 is 0.005 to 0.250. And a method of drying and curing.
第2塗膜形成用組成物を塗布する方法としては、刷毛塗り法、流延法、ローラーコート法、バーコート法、噴霧コート法、エアーナイフコート法、ディップコート法、スピンコート法等を挙げることが出来るが特に限定されない。 Examples of methods for applying the second coating film forming composition include brush coating, casting, roller coating, bar coating, spray coating, air knife coating, dip coating, and spin coating. It is possible, but not particularly limited.
第2塗膜の膜厚は0.01〜5μmとなるように形成させるのが好ましい。第2塗膜の膜厚を0.01μm以上とすることにより、樹脂成形品の汚れ防止機能、親水性を向上させる。また、膜厚を5μm以下とすることで、硬化時のクラック発生を抑制し、さらに耐擦傷性を向上することが出来る。好ましくは、0.02〜1μmである。 The film thickness of the second coating film is preferably formed to be 0.01 to 5 μm. By setting the film thickness of the second coating film to 0.01 μm or more, the antifouling function and hydrophilicity of the resin molded product are improved. Further, by setting the film thickness to 5 μm or less, it is possible to suppress the generation of cracks during curing and further improve the scratch resistance. Preferably, it is 0.02-1 micrometer.
第2塗膜は、第1塗膜上の少なくとも一部に塗布した第2塗膜形成用組成物を乾燥硬化することにより得られる。乾燥硬化は、室温で放置し乾燥硬化してもよいし、乾燥器や赤外線照射などを用いてもよい。また、室温で乾燥させた後、乾燥機や赤外線照射等により乾燥硬化させてもよい乾燥硬化温度は、第2塗膜塗膜形成用組成物の組成から判断して、適宜適切な温度を選択すればよい。ただし、このとき第1塗膜も乾燥されるため、劣化を抑えるために、第1塗膜の硬化温度+90℃以下とすることが好ましい。 The second coating film is obtained by drying and curing a second coating film forming composition applied to at least a part of the first coating film. The drying and curing may be carried out by drying at room temperature or using a dryer or infrared irradiation. In addition, after drying at room temperature, the drying and curing temperature that may be dried and cured by a dryer, infrared irradiation, or the like is appropriately selected based on the composition of the second coating film-forming composition. do it. However, since the first coating film is also dried at this time, it is preferable to set the curing temperature of the first coating film to 90 ° C. or lower in order to suppress deterioration.
以下に実施例を挙げ、本発明をさらに具体的に説明する。なお実施例中の樹脂成形品の物性は、下記の方法による測定結果を示したものである。 The following examples further illustrate the present invention. In addition, the physical property of the resin molded product in an Example shows the measurement result by the following method.
1)外観
目視にて樹脂成形品の透明性、クラック、白化、第1塗膜あるいは第2塗膜の剥離の有無を観察し、透明でクラック、白化、剥離がないものを良好(○)とした。不透明な部分のあったもの、クラック、白化、剥離があったものを不良(×)とした。
1) Appearance Visually observe the transparency, crack, whitening, and peeling of the first or second coating film of the resin molded product. did. Those with an opaque part, those with cracks, whitening and peeling were defined as defective (x).
2)密着性
樹脂成形品の第1塗膜および第2塗膜へ、カミソリの刃で1mm間隔に縦横11本ずつの切り目を入れて100個の碁盤目をつくり、それらの上にセロハンテープをよく密着させた後、45゜手前方向に急激に剥した時、第1塗膜および第2塗膜が剥離せずに残存したマス目の数により以下の基準で評価した。
○:剥離したマス目が無い(密着性良好)。
△:剥離したマス目が1/100以上5/100以下(密着性中程度)。
×:剥離したマス目が6/100以上(密着性不良)。
2) Adhesiveness First and second coatings of resin molded products are cut into 11 grids at 1 mm intervals with a razor blade to make 100 grids, and cellophane tape is placed on them. When the film was brought into close contact and then peeled off sharply in the direction of 45 °, the following criteria were evaluated based on the number of cells remaining without peeling off the first coating film and the second coating film.
◯: There are no peeled cells (good adhesion).
(Triangle | delta): The square which peeled is 1/100 or more and 5/100 or less (medium adhesion degree).
X: The peeled square is 6/100 or more (adhesion failure).
3)親水性(光触媒性)
樹脂成形品の親水性を水との接触角で評価した。協和界面化学(株)製CA−150型接触角計で測定を行なった。
○:樹脂成形品の水との接触角が15度以下であった。
△:樹脂成形品の水との接触角が15度より大きく20度より小さかった。
×:樹脂成形品の水との接触角が20度以上であった。
3) Hydrophilic (photocatalytic)
The hydrophilicity of the resin molded product was evaluated by the contact angle with water. Measurement was performed with a CA-150 contact angle meter manufactured by Kyowa Interface Chemical Co., Ltd.
A: The contact angle of the resin molded product with water was 15 degrees or less.
(Triangle | delta): The contact angle with water of the resin molded product was larger than 15 degree | times and smaller than 20 degree | times.
X: The contact angle with water of the resin molded product was 20 degrees or more.
4)耐候性
JIS K5400 サンシャインウエザーメーター加速曝露試験(ブラックパネル温度63℃、湿度50%RH、「12分雨あり→48分雨なし」を1サイクルとした。)を実施した。1000時間曝露(耐候性試験)後の1)外観(透明性、クラック、白化、塗膜の剥離)、2)密着性および3)親水性について上記と同様に評価した。
4) Weather resistance JIS K5400 Sunshine weather meter accelerated exposure test (black panel temperature 63 ° C., humidity 50% RH, “12-minute rain → 48-minute rain” as one cycle) was performed. 1) Appearance (transparency, crack, whitening, coating film peeling), 2) adhesion and 3) hydrophilicity after 1000 hours exposure (weather resistance test) were evaluated in the same manner as described above.
<調製例1> (第1塗膜形成用組成物1の調製)
メチルトリメトキシシラン40.8g(0.300mol)を撹拌しつつ、さらに水37.0gを徐々に加えて加水分解を行った。水を加えるにつれて溶液が発熱したので、水浴で冷却しつつ、液温を約10℃に維持しながら4時間攪拌を続けた。次いで、pHが6.6となるように酢酸ナトリウム水溶液(濃度15.2質量%)を加えた。湯浴で液温を35℃に維持しながら、さらに20時間攪拌した。有機溶媒としてγ−ブチロラクトン18.0gおよびブチルセロソルブ18.0gを加え攪拌して均一溶液とした。さらに、日本ユニカー(株)製シリコーン系界面活性剤L−7001(商品名)0.01gを添加し、約1時間室温で攪拌し、第1塗膜形成用組成物1を得た。
<Preparation Example 1> (Preparation of
While stirring 40.8 g (0.300 mol) of methyltrimethoxysilane, 37.0 g of water was gradually added for hydrolysis. The solution generated heat as water was added, and thus the solution was cooled in a water bath and stirred for 4 hours while maintaining the liquid temperature at about 10 ° C. Next, an aqueous sodium acetate solution (concentration 15.2% by mass) was added so that the pH was 6.6. The mixture was further stirred for 20 hours while maintaining the liquid temperature at 35 ° C. in a hot water bath. As an organic solvent, 18.0 g of γ-butyrolactone and 18.0 g of butyl cellosolve were added and stirred to obtain a uniform solution. Furthermore, 0.01 g of silicone surfactant L-7001 (trade name) manufactured by Nippon Unicar Co., Ltd. was added and stirred at room temperature for about 1 hour to obtain a first coating film-forming
<調製例2> (第1塗膜形成用組成物2の調製)
メチルトリメトキシシラン22.0g(0.162mol)、フェニルトリメトキシシラン3.56g(0.018mol)、ジメチルジメトキシシラン2.40g(0.020mol)およびイソプロピルアルコール分散コロイド状シリカ(粒子径10〜20nm、固形分30質量%、日産化学工業(株)製、商品名:スノーテックスIPA−ST)20.1g(0.100mol)を混合し、均一溶液とした。
<Preparation example 2> (Preparation of
Methyltrimethoxysilane 22.0 g (0.162 mol), phenyltrimethoxysilane 3.56 g (0.018 mol), dimethyldimethoxysilane 2.40 g (0.020 mol) and isopropyl alcohol-dispersed colloidal silica (particle size 10-20 nm) , 30 mass% solid content, manufactured by Nissan Chemical Industries, Ltd., trade name: Snowtex IPA-ST) 20.1 g (0.100 mol) was mixed to obtain a uniform solution.
この溶液を撹拌しつつ、さらに水37.0gを徐々に加えて加水分解を行った。水を加えるにつれて溶液が発熱したので、水浴で冷却しつつ、液温を約10℃に維持しながら4時間攪拌を続けた。次いで、pHが6.6となるように酢酸ナトリウム水溶液(濃度15.2質量%)を加えた。湯浴で液温を35℃に維持しながら、さらに20時間攪拌した。有機溶媒としてγ−ブチロラクトン18.0gおよびブチルセロソルブ18.0gを加え攪拌し均一溶液とした。さらに、日本ユニカー(株)製シリコーン系界面活性剤L−7001(商品名)0.01gを添加し、約1時間室温で攪拌し、第1塗膜形成用組成物2を得た。
While stirring this solution, 37.0 g of water was gradually added to conduct hydrolysis. The solution generated heat as water was added, and thus the solution was cooled in a water bath and stirred for 4 hours while maintaining the liquid temperature at about 10 ° C. Next, an aqueous sodium acetate solution (concentration 15.2% by mass) was added so that the pH was 6.6. The mixture was further stirred for 20 hours while maintaining the liquid temperature at 35 ° C. in a hot water bath. As an organic solvent, 18.0 g of γ-butyrolactone and 18.0 g of butyl cellosolve were added and stirred to obtain a uniform solution. Furthermore, 0.01 g of silicone surfactant L-7001 (trade name) manufactured by Nippon Unicar Co., Ltd. was added and stirred at room temperature for about 1 hour to obtain a first coating film-forming
なお、上述のメチルトリメトキシシラン(MTS)のモル数、フェニルトリメトキシシラン(PTS)およびジメチルジメトキシシラン(DDS)のモル数は、以下の式で表わされる。
MTSのモル数=(MTSの仕込み質量)/(MTSの分子量;136.0)
PTSのモル数=(PTSの仕込み質量)/(PTSの分子量;198.0)
DDSのモル数=(DDSの仕込み質量)/(DDSの分子量;120.0)
The number of moles of methyltrimethoxysilane (MTS) and the number of moles of phenyltrimethoxysilane (PTS) and dimethyldimethoxysilane (DDS) are expressed by the following formula.
MTS moles = (MTS charge mass) / (MTS molecular weight; 136.0)
Number of moles of PTS = (PTS charge mass) / (Molecular weight of PTS; 198.0)
Number of moles of DDS = (DDS charge mass) / (Molecular weight of DDS; 120.0)
イソプロピルアルコール分散コロイド状シリカ(SRC)のモル数は、仕込みイソプロピルアルコール分散コロイド状シリカ中の固形分の質量をシリカの分子量(60.1(SiO2として))で除することで求められる。すなわち、
SRCのモル数=(仕込みSRCの固形分質量)/(シリカ分子量;60.1)
The number of moles of isopropyl alcohol-dispersed colloidal silica (SRC) can be obtained by dividing the mass of solids in the charged isopropyl alcohol-dispersed colloidal silica by the molecular weight of silica (60.1 (as SiO 2 )). That is,
Number of moles of SRC = (mass content of charged SRC) / (silica molecular weight; 60.1)
<実施例1>
アクリル樹脂板(三菱レイヨン(株)製、商品名:アクリライトEX、縦×横×厚=150×100×3mm)上に、乾燥硬化後の第1塗膜の膜厚が5μmとなるように引き上げ速度を調整し、ディップコート法により第1塗膜用形成用組成物1を塗工した。25℃、30分間の室温乾燥させた後、乾燥器により90℃で3分間乾燥硬化し、第1塗膜を形成した。このときの第1塗膜の赤外吸収スペクトルを赤外吸収スペクトロメーター(Perkin Elmer社製、Model 1710)を用い、表面ATR法により測定し、シラノール基に起因する赤外吸収スペクトルの面積S1とシロキサン結合に起因する赤外吸収スペクトルの面積S2の面積比S1/S2を求めたところ、0.200であった。
<Example 1>
On the acrylic resin plate (Mitsubishi Rayon Co., Ltd., trade name: Acrylite EX, length × width × thickness = 150 × 100 × 3 mm), the thickness of the first coating film after drying and curing is 5 μm. The pulling speed was adjusted, and the first coating film-forming
次いで、第1塗膜を形成したアクリル樹脂板上に、乾燥硬化後の第2塗膜の膜厚が0.1μmとなるように引き上げ速度を調整し、ディップコートにより第2塗膜形成用組成物(石原産業(株)製、アナタース型酸化チタン含有コーティング材、商品名:ST−K211)を塗工した。25℃で20分間乾燥した後、乾燥器により90℃で120分間乾燥硬化することで第2塗膜を形成し、樹脂成形品を得た。 Next, on the acrylic resin plate on which the first coating film is formed, the lifting speed is adjusted so that the film thickness of the second coating film after drying and curing is 0.1 μm, and the composition for forming the second coating film is formed by dip coating. A product (Ishihara Sangyo Co., Ltd., anatase-type titanium oxide-containing coating material, trade name: ST-K211) was applied. After drying at 25 ° C. for 20 minutes, the second coating film was formed by drying and curing at 90 ° C. for 120 minutes with a drier to obtain a resin molded product.
次に得られた樹脂成形品の物性評価を行なった。この樹脂成形品の初期物性は、外観は透明で、クラック、白化、塗膜剥離もなく良好(○)であり、密着性も良好(○)であり、水との接触角は11度と親水性は良好(○)であった。耐候性試験後の樹脂成形品の物性については、外観は透明で、クラック、白化、塗膜剥離もなく良好(○)であった。また、密着性も良好(○)であり、水との接触角は4度と良好な親水性(○)を示した。結果を表1に示した。 Next, physical properties of the obtained resin molded product were evaluated. The initial physical properties of this resin molded product are transparent in appearance, good (◯) without cracks, whitening, and peeling of the coating film, good adhesion (◯), and a contact angle with water of 11 degrees is hydrophilic. The property was good (◯). About the physical property of the resin molded product after a weather resistance test, the external appearance was transparent and it was favorable ((circle)) without a crack, whitening, and coating-film peeling. Moreover, adhesiveness was also favorable ((circle)) and the contact angle with water showed 4 degree and favorable hydrophilicity ((circle)). The results are shown in Table 1.
<実施例2〜8>
第1塗膜形成用組成物、および第1塗膜の乾燥条件を変化させることにより面積比(S1/S2)を表1に示すように変更したこと以外は、実施例1と同じ操作で第1塗膜と第2塗膜を有する樹脂成形品を得、評価した。結果を表1に示した。
<Examples 2 to 8>
The first operation was the same as in Example 1 except that the area ratio (S1 / S2) was changed as shown in Table 1 by changing the drying conditions of the first coating film-forming composition and the first coating film. A resin molded article having one coating film and a second coating film was obtained and evaluated. The results are shown in Table 1.
<比較例1〜6>
第1塗膜形成用組成物、および第1塗膜の乾燥条件を変化させることにより面積比(S1/S2)を表1に示すように変更したこと以外は、実施例1と同じ操作で第1塗膜と第2塗膜を有する樹脂成形品を得、評価した。いずれの樹脂成形品においても、初期の外観、密着性、親水性の少なくとも一つが本発明の目的が達成できなかった。結果を表1に示した。
<Comparative Examples 1-6>
The first operation was the same as in Example 1 except that the area ratio (S1 / S2) was changed as shown in Table 1 by changing the drying conditions of the first coating film-forming composition and the first coating film. A resin molded article having one coating film and a second coating film was obtained and evaluated. In any resin molded product, at least one of the initial appearance, adhesion, and hydrophilicity could not achieve the object of the present invention. The results are shown in Table 1.
以上説明したように、本発明によれば、プラスチック基材、第1塗膜、第2塗膜の密着性が優れ、光触媒効果が長期にわたり持続する樹脂成形品とすることが出来る。 As described above, according to the present invention, it is possible to obtain a resin molded article having excellent adhesion between the plastic substrate, the first coating film, and the second coating film and having a photocatalytic effect that lasts for a long time.
P1 シラノール基に起因する赤外吸収スペクトルのピーク
P2 シロキサン結合に起因する赤外吸収スペクトルのピーク
S1 シラノール基に起因する赤外吸収スペクトルのピーク面積
S2 シロキサン結合に起因する赤外吸収スペクトルのピーク面積
A S1の低波数側境界(850cm-1)
B S1とS2の境界点(950cm-1)
C S2の高波数側境界(1250cm-1)
P1 Infrared absorption spectrum peak due to silanol group P2 Infrared absorption spectrum peak due to siloxane bond S1 Infrared absorption spectrum peak area due to silanol group S2 Infrared absorption spectrum peak area due to siloxane bond A S1 low wavenumber side boundary (850cm -1 )
B Boundary point between S1 and S2 (950 cm -1 )
Claims (1)
(R1)nSi(OR2)4-n (1)
(式中、R1は炭素数1〜10の有機基を示し、R2は炭素数1〜5のアルキル基または炭素数1〜4のアシル基を示す。nは0〜3の整数である。)
A composition containing a hydrolyzate of organosilanes represented by formula (1) and / or a condensate thereof is applied onto a plastic substrate, and the peak area (S1) of the infrared absorption spectrum due to silanol groups is A first coating film is formed by drying and curing so that the ratio (S1 / S2) to the peak area (S2) of the infrared absorption spectrum caused by the siloxane bond is 0.005 to 0.250, and then the first coating film is formed thereon. A method for producing a resin molded article, wherein a composition containing a photocatalytic titanium oxide and a silica-based binder is applied and dried and cured to form a second coating film.
(R 1 ) n Si (OR 2 ) 4-n (1)
(In the formula, R 1 represents an organic group having 1 to 10 carbon atoms, R 2 represents an alkyl group having 1 to 5 carbon atoms or an acyl group having 1 to 4 carbon atoms. N is an integer of 0 to 3). .)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008142636A (en) * | 2006-12-11 | 2008-06-26 | National Institute Of Advanced Industrial & Technology | Method of applying photocatalyst on polyolefin based resin molding |
JP2021155664A (en) * | 2020-03-30 | 2021-10-07 | 大阪瓦斯株式会社 | Coating liquid |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008142636A (en) * | 2006-12-11 | 2008-06-26 | National Institute Of Advanced Industrial & Technology | Method of applying photocatalyst on polyolefin based resin molding |
JP2021155664A (en) * | 2020-03-30 | 2021-10-07 | 大阪瓦斯株式会社 | Coating liquid |
JP7463164B2 (en) | 2020-03-30 | 2024-04-08 | 大阪瓦斯株式会社 | Coating Fluid |
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