JP2005109091A - Vacuum zipper for holding substrate - Google Patents

Vacuum zipper for holding substrate Download PDF

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JP2005109091A
JP2005109091A JP2003339546A JP2003339546A JP2005109091A JP 2005109091 A JP2005109091 A JP 2005109091A JP 2003339546 A JP2003339546 A JP 2003339546A JP 2003339546 A JP2003339546 A JP 2003339546A JP 2005109091 A JP2005109091 A JP 2005109091A
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substrate
holding
vacuum chuck
gas flow
flow path
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JP4229380B2 (en
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Yoshinori Shigeno
能徳 重野
Shinichi Ueda
慎一 植田
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Coorstek KK
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Toshiba Ceramics Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum zipper for holding a substrate which can suppress the diffuse reflection of an exposure and which can maintain the substrate in a high flatness state even when a light transparent substrate having a wide area used for a liquid crystal display, etc. is exposure-treated. <P>SOLUTION: The vacuum zipper 1, for holding the substrate having many small protrusion-like holding pins 3 arranged at an interval at a substrate holding surface side so that the gap of the holding pins 3 is formed in a gas channel 4, includes grooves each having a width of 0.1-1.0 mm and a depth of 0.05-0.5 mm or so that a dot-like recess corresponding to the groove width and depth is a pitch of twice to five times as large as the groove width at least at a bottom 4a of the gas channel 4 of the substrate holding surface and at least the top surface of the holding pin 3, and the front surface of the gas channel bottom 4a is formed in a surface roughness Ra=0.5-1.5 μm of a range. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、基板保持用真空チャックに関し、例えば、液晶ディスプレイ製作用の基板等の光透過性基板を露光処理する際、好適に用いることができる基板保持用真空チャックに関する。   The present invention relates to a substrate-holding vacuum chuck, and more particularly to a substrate-holding vacuum chuck that can be suitably used when exposing a light-transmitting substrate such as a substrate for producing a liquid crystal display.

液晶ディスプレイ素子の製作工程中には、透明なガラス基板等の光透過性基板上に回路パターンを形成する露光工程がある。
この露光工程は、通常、特定波長の光に感光するフォトレジストを光透過性基板、例えば、透明なガラス基板上にコーティングする工程と、回路パターンが形成されたマスク（レチクル）で前記ガラス基板を覆った状態で露光して、前記フォトレジストを感光させる工程とが含まれている。 During the manufacturing process of the liquid crystal display element, there is an exposure process for forming a circuit pattern on a light transmissive substrate such as a transparent glass substrate.
In this exposure process, the glass substrate is usually coated with a photoresist that is sensitive to light of a specific wavelength on a light-transmitting substrate, for example, a transparent glass substrate, and a mask (reticle) on which a circuit pattern is formed. Exposing in a covered state and exposing the photoresist.

このような露光工程で用いられる、例えば液晶ディスプレイ用の露光装置は、通常、前記マスク（レチクル）を装着するレチクルステージと、光透過性基板を吸着固定するプレートステージと、前記レチクルステージの上方に配置された露光光源と、前記露光光源からの光を集束させるレンズとを備えている。
そして、前記プレートステージには、一般に、光透過性基板を平らな状態で吸着固定する基板保持用真空チャックが設けられている。この基板保持用真空チャックは、プレートステージ上に装着されて、真空吸着される光透過性基板の平面性を保持し、かつプレートステージの移動時にも光透過性基板が動かないように固定する機能を有している。 An exposure apparatus for use in such an exposure process, for example, for a liquid crystal display usually has a reticle stage on which the mask (reticle) is mounted, a plate stage on which a light-transmitting substrate is sucked and fixed, and an upper side of the reticle stage. An exposure light source disposed; and a lens that focuses light from the exposure light source.
The plate stage is generally provided with a substrate holding vacuum chuck that sucks and fixes the light transmissive substrate in a flat state. This substrate holding vacuum chuck is mounted on the plate stage, maintains the flatness of the light transmissive substrate that is vacuum-adsorbed, and fixes the light transmissive substrate so that it does not move even when the plate stage moves. have.

この基板保持用真空チャックには、種々の構造、形状のものが知られ、実用化されているが、液晶ディスプレイ基板等の露光装置には、広面積でも比較的高い平面度が得られ、かつ、チャックと基板との接触面積が小さく、その間に塵埃等が挟まる不都合を可能な限り排除できるピン保持式の真空チャック、いわゆるピンチャック（真空ピンチャック）形式の基板保持用真空チャックが多く用いられる。   The substrate holding vacuum chucks are known in various structures and shapes and have been put into practical use. However, an exposure apparatus such as a liquid crystal display substrate can obtain a relatively high flatness even in a wide area, and A pin holding type vacuum chuck that can eliminate as much as possible the inconvenience that the contact area between the chuck and the substrate is small and dust is sandwiched between them, so-called pin chuck (vacuum pin chuck) type substrate holding vacuum chucks are often used. .

前記露光装置で一般に使用される従来の真空ピンチャックを図２の斜視図を参照して説明する。
図２に示すように、真空ピンチャック１０は、チャック本体２０と、そのチャック本体２０の基板保持面Ａのほぼ全面にわたって互いに所定の間隔をもって形成され、透明なガラス基板等の光透過性基板と接する頂面部３０ａを有する多数の小突起状の保持ピン３０とからなる。 A conventional vacuum pin chuck generally used in the exposure apparatus will be described with reference to a perspective view of FIG.
As shown in FIG. 2, the vacuum pin chuck 10 includes a chuck body 20 and a light-transmitting substrate such as a transparent glass substrate, which are formed at a predetermined distance from each other over almost the entire surface of the substrate holding surface A of the chuck body 20. It consists of a large number of small protrusion-shaped holding pins 30 each having a top surface portion 30a in contact therewith.

そして、光透過性基板の載置時において、各保持ピン３０によって形成される間隙と、載置された基板面により画定された空間は、互いに連通している。その結果、各保持ピン３０の間隙（空間）は、吸引孔５０から吸引した際、ガス流路４０として機能する。
また、前記チャック本体２０と保持ピン３０とは、例えばセラミックスよりなり、通常一体に形成されている。 When the light-transmitting substrate is placed, the gap formed by each holding pin 30 and the space defined by the placed substrate surface communicate with each other. As a result, the gaps (spaces) between the holding pins 30 function as gas flow paths 40 when sucked from the suction holes 50.
The chuck body 20 and the holding pin 30 are made of, for example, ceramics and are usually integrally formed.

上記チャックは、前記液晶ディスプレイ用ガラス基板等を平面状にかつ厳密に固定保持することが求められる関係から、一般に温度変化に対して形状変化を起こさない材質、例えば、フォルステライト等の硬質なセラミックで形成されることが多い。   The chuck is generally made of a material that does not change its shape with respect to a temperature change, for example, a hard ceramic such as forsterite, because the liquid crystal display glass substrate and the like are required to be held flat and strictly fixed. It is often formed with.

そして、このような材質で構成された真空ピンチャック１０の基板保持面Ａに、照射された露光光線が当たった場合には、該光線のほとんどが基板保持面Ａの表面で反射される。
そのため、フォトレジスト膜を形成した光透過性基板、例えば、透明なガラス基板を前記真空ピンチャック１０によって保持し、フォトレジスト膜を露光した場合には、露光光線がフォトレジスト膜より透明なガラス基板を透過して、基板保持面Ａに達し、そこで反射する。
この結果、フォトレジスト膜に乱反射光が入射し、形成されるレジストパターンの解像度、また形成されるレジストパターンの寸法精度が低下するという問題があった。 When the irradiated exposure light beam strikes the substrate holding surface A of the vacuum pin chuck 10 made of such a material, most of the light beam is reflected by the surface of the substrate holding surface A.
Therefore, when a light transmissive substrate on which a photoresist film is formed, for example, a transparent glass substrate is held by the vacuum pin chuck 10 and the photoresist film is exposed, the exposure light beam is more transparent than the photoresist film. , And reaches the substrate holding surface A where it is reflected.
As a result, irregularly reflected light is incident on the photoresist film, resulting in a problem that the resolution of the formed resist pattern and the dimensional accuracy of the formed resist pattern are lowered.

上記の不都合を回避するための方策もいくつか提案されており、例えば、特許文献１には、基板保持面の表面に露光波長の１／４の厚さの反射防止膜を形成した真空ピンチャックの発明、また基板保持面の表面に、露光光線を吸収する光吸収膜を形成し、更に前記膜の表面に露光波長の１／４の厚さの反射防止膜を形成した真空ピンチャックの発明が開示されている。   Several measures for avoiding the above inconvenience have been proposed. For example, Patent Document 1 discloses a vacuum pin chuck in which an antireflection film having a thickness of 1/4 of an exposure wavelength is formed on the surface of a substrate holding surface. And a vacuum pin chuck in which a light absorption film for absorbing exposure light is formed on the surface of the substrate holding surface, and an antireflection film having a thickness of 1/4 of the exposure wavelength is formed on the surface of the film. Is disclosed.

また、特許文献２には、本体部分がアルミナ燒結体からなるチャック本体の表面に表面反射率を低くするためのセラミック薄層、例えば、炭化珪素薄層（内部層）と透明アルミナ薄層（表面層）の２層構造のセラミック薄層を形成した露光用保持治具の発明が開示されている。   Further, in Patent Document 2, a ceramic thin layer for lowering the surface reflectivity on the surface of the chuck body whose main body portion is made of an alumina sintered body, for example, a silicon carbide thin layer (inner layer) and a transparent alumina thin layer (surface) An invention of an exposure holding jig in which a thin ceramic layer having a two-layer structure is formed is disclosed.

特開平５−２３４８４３号公報（第２頁第２欄第１９行〜第３６行）Japanese Patent Laid-Open No. 5-234443 (page 2, column 2, line 19 to line 36)

特開平８−１３９１６８号公報（第２頁第２欄第３行〜第２０行）JP-A-8-139168 (page 2, column 2, line 3 to line 20)

しかしながら、特許文献１に示された反射防止膜を表面被覆したチャックは、光透過性基板脱着の際に生じる摩擦により、基板保持面の被覆層が摩耗し、摩耗変形が生じる。また、露光時に発生する熱により熱変形が生じ、更に電気的不安定性により放電不良を起こし易い等の種々の不都合が生じるという課題がある。特に、広面積の液晶ディスプレイ等のような大型の光透過性基板において使用することは難しいという課題がある。   However, the chuck whose surface is coated with the antireflection film disclosed in Patent Document 1 wears the coating layer on the substrate holding surface due to friction generated when the light-transmitting substrate is detached, and wear deformation occurs. In addition, there is a problem in that various inconveniences such as thermal deformation caused by heat generated during exposure and electric discharge instability easily occur due to electrical instability. In particular, there is a problem that it is difficult to use in a large light-transmitting substrate such as a large area liquid crystal display.

また、特許文献２に示された真空ピンチャックにあっては、表面に多数の突起状ピンとガス流路が形成され、複雑な形状を有している。そのため、透明アルミナと炭化珪素の２層からなるセラミック薄膜層を、真空ピンチャック（基板保持面）の表面に均質に欠陥なく良好な状態で形成することは困難で、特に大型の真空ピンチャックの製作が難しいという課題がある。
このように、現在に至るも、前記した課題が回避され、かつ露光の乱反射が抑制された新たな真空ピンチャックの出現が強く求められている。 Moreover, in the vacuum pin chuck shown in Patent Document 2, a large number of protruding pins and gas flow paths are formed on the surface and have a complicated shape. Therefore, it is difficult to form a ceramic thin film layer composed of two layers of transparent alumina and silicon carbide on the surface of the vacuum pin chuck (substrate holding surface) in a uniform and good state without any defects. There is a problem that production is difficult.
Thus, even now, there has been a strong demand for the appearance of a new vacuum pin chuck that avoids the above-described problems and suppresses exposure irregular reflection.

本発明は、従来の真空ピンチャックの不都合を解消するためになされたものであり、例え、液晶ディスプレイ等に用いられる広面積の光透過性基板を露光処理する場合であっても、露光の乱反射を抑止でき、しかも、該基板を高い平面度状態に維持できる基板保持用真空チャックを提供することを目的とする。   The present invention has been made to eliminate the disadvantages of the conventional vacuum pin chuck. For example, even when a light-transmitting substrate having a large area used for a liquid crystal display or the like is subjected to exposure processing, diffuse reflection of exposure is performed. An object of the present invention is to provide a vacuum chuck for holding a substrate that can suppress the above-described problem and can maintain the substrate in a high flatness state.

上記目的を達成するためになされた本発明にかかる基板保持用真空チャックは、基板保持面側に互いに間隙をもって配列した多数の小突起状の保持ピンを備え、前記保持ピンの間隙をガス流路とした基板保持用真空チャックにおいて、前記基板保持面のガス流路の少なくとも底面部には、幅０．１〜１．０ｍｍで深さ０．０５〜０．５ｍｍの溝もしくは該溝幅及び深さに対応するドット状凹部が前記溝幅の２〜５倍のピッチで形成されていると共に、少なくとも、前記溝もしくは凹部の表面及び前記ガス流路底面部の表面が、表面粗さＲａ＝０．５〜１．５μｍの範囲に形成されていることを特徴としている。   A vacuum chuck for holding a substrate according to the present invention made to achieve the above object comprises a plurality of small projection-like holding pins arranged with gaps on the side of the substrate holding surface, and the gap between the holding pins is passed through a gas channel. In the substrate holding vacuum chuck, a groove having a width of 0.1 to 1.0 mm and a depth of 0.05 to 0.5 mm or a width and depth of the groove is provided on at least the bottom surface of the gas flow path of the substrate holding surface. Are formed at a pitch of 2 to 5 times the groove width, and at least the surface of the groove or the recess and the surface of the bottom surface of the gas flow path have a surface roughness Ra = 0. It is characterized by being formed in a range of 0.5 to 1.5 μm.

本発明にかかる基板保持用真空チャックは、互いに間隔をもって配列された小突起状の保持ピンの間に形成されるガス流路の底面部に、特定幅、特定深さの溝または該溝に対応するドット状凹部が特定ピッチで形成されていること、及び、少なくとも前記溝もしくは凹部の表面及びガス流路底面部の表面が、特定粗度に粗面形成されていることが構成上の特徴である。   The vacuum chuck for holding a substrate according to the present invention corresponds to a groove having a specific width and a specific depth on the bottom surface portion of a gas flow path formed between holding pins having small protrusions arranged at intervals. The dot-shaped concave portions to be formed are formed at a specific pitch, and at least the surface of the groove or the concave portion and the surface of the gas flow path bottom surface portion are roughened to a specific roughness. is there.

前記したように、本発明にかかる基板保持用真空チャックに形成された、ガス流路の底面部に特定のピッチで形成された溝またはドット状凹部は、光透過性基板を透過した露光光線が、基板保持面で反射されて生じる乱反射光の前記光透過性基板への再侵入を低減させる作用効果を奏する。   As described above, the grooves or dot-like recesses formed at a specific pitch on the bottom surface of the gas flow path formed in the substrate holding vacuum chuck according to the present invention have the exposure light beam transmitted through the light transmissive substrate. There is an effect of reducing the re-entry of the irregularly reflected light generated by being reflected by the substrate holding surface into the light-transmitting substrate.

本来的には反射防止は基板保持面の全面で機能させることが好ましいが、基板等のワークと接触する保持ピンの頂面部（ピントップ）は、鋭い凹凸や角等の存在がなく、滑らかな平面であることが、基板面との接触の際の基板損傷防止や歪み抑制の観点から必要である。
一方、本発明にかかる基板保持用真空チャックにあっては、保持ピンの頂面部の全面積と、ガス流路の底面部の全面積との比が１：１０〜１：１００であるため、ガス流路の底面部での反射を抑制でき、前記乱反射量をレジストの閾値以下に有効に低減できる。 In principle, it is preferable that the antireflection function is performed on the entire surface of the substrate holding surface, but the top surface portion (pin top) of the holding pin that comes into contact with the workpiece such as the substrate has no sharp irregularities or corners and is smooth. A flat surface is necessary from the viewpoint of preventing damage to the substrate and suppressing distortion during contact with the substrate surface.
On the other hand, in the substrate holding vacuum chuck according to the present invention, the ratio of the total area of the top surface portion of the holding pin and the total area of the bottom surface portion of the gas channel is 1:10 to 1: 100. Reflection at the bottom of the gas flow path can be suppressed, and the amount of irregular reflection can be effectively reduced below the resist threshold.

また、本発明にかかる基板保持用真空チャックは、その保持ピンは、その頂面部の相当径が０．５〜１．５ｍｍ、ガス流路の底面部からの高さが０．１〜１．０ｍｍ、配列ピッチが３．０〜６．０ｍｍであることが、ガス逃げ部流路に形成される溝もしくはドット状凹部の形状、寸法、及びピッチに対する整合性が良く、前記乱反射光の低減効果が優れている点から好ましい。
また、その構成材は、硬脆材料が好ましく、炭化珪素であることが、黒色で耐熱性に優れ、熱膨張性が小さく、耐摩耗性に優れ、かつ妥当なコストで容易に入手できる等の観点からより好ましい。
更に、保持ピン頂面部の全面積とガス流路部の底面部の全面積との比が１：１０〜１：１００の範囲にあることが有効な乱反射光低減効果達成の観点から好ましい。 In the vacuum chuck for holding a substrate according to the present invention, the holding pin has an equivalent diameter of the top surface portion of 0.5 to 1.5 mm, and a height from the bottom surface portion of the gas channel of 0.1 to 1. 0 mm and an arrangement pitch of 3.0 to 6.0 mm have good consistency with the shape, size, and pitch of the grooves or dot-like recesses formed in the gas escape passage, and the effect of reducing the irregularly reflected light Is preferable from the viewpoint of superiority.
In addition, the constituent material is preferably a hard and brittle material, being silicon carbide, black, excellent in heat resistance, small in thermal expansion, excellent in wear resistance, and easily available at a reasonable cost, etc. More preferable from the viewpoint.
Furthermore, it is preferable that the ratio of the total area of the top surface portion of the holding pin and the total area of the bottom surface portion of the gas flow path portion is in the range of 1:10 to 1: 100 from the viewpoint of achieving an effective diffused light reduction effect.

また、前記溝もしくはドット状凹部は、レーザ加工により形成されたものであることが、その形状、サイズ、形成位置の正確な制御が容易である点から好ましい。
更に、前記溝もしくは凹部の表面及び前記ガス流路の底面部の表面が、ブラスト加工により粗面加工されていることが、粗面状態が好適で、適正な仕上が容易に達成できる観点から好ましい。 Moreover, it is preferable that the groove or the dot-shaped recess is formed by laser processing because the precise control of the shape, size, and formation position is easy.
Furthermore, it is preferable that the surface of the groove or the recess and the surface of the bottom surface of the gas flow path are roughened by blasting from the viewpoint that a rough surface state is suitable and proper finishing can be easily achieved. .

以上詳述したように、本発明にかかる基板保持用真空ピンチャックは、基板保持面のガス流路の底面部に特定幅、深さの溝またはドットが、特定ピッチで形成され、かつ、少なくとも前記溝もしくは凹部の表面及びガス流路底面部の表面が、特定の表面粗さに形成されていることにより、乱反射を抑制でき、しかも、光透過性基板の平面度を維持して保持することができる。   As described in detail above, the substrate holding vacuum pin chuck according to the present invention has grooves or dots having a specific width and depth formed at a specific pitch on the bottom surface of the gas flow path of the substrate holding surface, and at least The surface of the groove or recess and the surface of the gas channel bottom surface portion are formed with a specific surface roughness, so that irregular reflection can be suppressed, and the flatness of the light-transmitting substrate is maintained and maintained. Can do.

以下に本発明にかかる基板保持用真空チャックを図１に基づいて説明する。
図１は、本発明にかかる基板保持用真空チャック（真空ピンチャック）の一形態の一部構造を模式的に示した断面図である。
図１において、本発明にかかる基板保持用真空チャック（真空ピンチャック）１が、チャック本体２と多数の小突起状の保持ピン３とからなる点、及び該保持ピン３が光透過性基板と接する頂面部３ａを有する点、更に吸引孔（図示せず）が設けられている点は、図２に示した従来型の真空ピンチャックと同じである。 A substrate holding vacuum chuck according to the present invention will be described below with reference to FIG.
FIG. 1 is a cross-sectional view schematically showing a partial structure of an embodiment of a substrate holding vacuum chuck (vacuum pin chuck) according to the present invention.
In FIG. 1, a substrate holding vacuum chuck (vacuum pin chuck) 1 according to the present invention comprises a chuck body 2 and a number of small projection-like holding pins 3, and the holding pins 3 are formed of a light transmitting substrate. The point which has the top surface part 3a which touches, and the point provided with the suction hole (not shown) are the same as the conventional vacuum pin chuck shown in FIG.

本発明の基板保持用真空チャック１では、図１に示されているように、ガス流路４の底面４ａに微小な溝４ｂが形成されている点に特徴がある。
この溝４ｂは、幅０．１〜１．０ｍｍ、より好ましくは０．１〜０．３ｍｍ、深さ０．０５〜０．５ｍｍ、より好ましくは０．１〜０．３ｍｍに形成され、その形成密度は、この溝幅の２〜５倍のピッチ、より好ましくは該溝幅の２〜３倍のピッチで形成される。 The vacuum chuck 1 for holding a substrate according to the present invention is characterized in that a minute groove 4b is formed on the bottom surface 4a of the gas flow path 4 as shown in FIG.
The groove 4b is formed to have a width of 0.1 to 1.0 mm, more preferably 0.1 to 0.3 mm, a depth of 0.05 to 0.5 mm, and more preferably 0.1 to 0.3 mm. The formation density is 2 to 5 times the groove width, more preferably 2 to 3 times the groove width.

また、本発明においては、前記溝４ｂに代えて、その幅及び深さに対応するドット状凹部を形成してもよい。
この場合においてもその形成ピッチは前記溝形成のピッチと同じ範囲にする。
特にこれに限定されるものではないが、一つのドット状凹部の平均長さは０．０５ｍｍ〜０．１ｍｍ程度で、深さは０．０５ｍｍ〜０．１ｍｍ、各ドットの間隔はドット幅の２〜３倍程度が好ましい。
更に、本発明の基板保持用真空チャック１は、少なくとも保持ピン３の頂面部３ａ及び前記ガス流路の底面部４ａは、その表面が粗さＲａ＝０．５〜１．５μｍ、より好ましくは０．８〜１．０μｍの範囲に粗面形成される。基板保持面Ａの全表面が上記粗さに粗面加工されることが特に好ましい。
前記したように、保持ピン３の頂面部３ａの表面粗さが前記範囲にあることが、保持する光透過性基板（例えば、透明なガラス基板）に基板損傷防止、歪み抑制の観点から好ましい。 In the present invention, instead of the groove 4b, a dot-shaped recess corresponding to the width and depth may be formed.
Even in this case, the formation pitch is set in the same range as the groove formation pitch.
Although not particularly limited to this, the average length of one dot-like recess is about 0.05 mm to 0.1 mm, the depth is 0.05 mm to 0.1 mm, and the interval between each dot is the dot width. About 2 to 3 times is preferable.
Further, in the vacuum chuck 1 for holding a substrate of the present invention, at least the top surface portion 3a of the holding pin 3 and the bottom surface portion 4a of the gas flow path have a roughness Ra = 0.5 to 1.5 μm, more preferably A rough surface is formed in the range of 0.8 to 1.0 μm. It is particularly preferable that the entire surface of the substrate holding surface A is roughened to the above roughness.
As described above, the surface roughness of the top surface portion 3a of the holding pin 3 is preferably in the above range from the viewpoint of preventing damage to the substrate and suppressing distortion of the light transmissive substrate to be held (for example, a transparent glass substrate).

また、必ずしもこれに限定されるものではないが、本発明の基板保持用真空チャック１は、前記保持ピン３が、頂面部を有する柱状又は錐台状で、その頂面部３ａの相当径が０．５〜１．５ｍｍ、ガス流路４の底面部４ａからの高さが０．１〜１．０ｍｍ、配列ピッチが３．０〜６．０ｍｍであり、頂面部３ａの端縁が面取りされ、かつ頂面部３ａはほぼ円形であることが、乱反射を低減する上で好ましい。   Although not necessarily limited thereto, in the substrate holding vacuum chuck 1 according to the present invention, the holding pin 3 has a columnar or frustum shape having a top surface portion, and the equivalent diameter of the top surface portion 3a is 0. .5 to 1.5 mm, the height from the bottom surface portion 4 a of the gas flow path 4 is 0.1 to 1.0 mm, the arrangement pitch is 3.0 to 6.0 mm, and the edge of the top surface portion 3 a is chamfered. In addition, it is preferable that the top surface portion 3a is substantially circular in order to reduce irregular reflection.

ガス流路４の寸法、形状等はピン形状とその配列態様よりほぼ決定されるが、格子状あるいは同心円状であってよくまた不規則な形状であっても差し支えない。
また、前記保持ピン３の頂面部３ａの全面積とガス流路４の底面部４ａの全面積との比が１：１０〜１：１００であることが、乱反射光の低減の観点から好ましい。
ここで、ガス流路４の底面部４ａの全面積とは、溝部４ｂの面積も含めた総面積を意味し、保持ピン３の頂面部３ａ以外の総面積をいう。 The size, shape, and the like of the gas flow path 4 are substantially determined by the pin shape and the arrangement thereof, but may be a lattice shape or a concentric shape, or may be an irregular shape.
The ratio of the total area of the top surface portion 3a of the holding pin 3 to the total area of the bottom surface portion 4a of the gas flow path 4 is preferably 1:10 to 1: 100 from the viewpoint of reducing irregular reflection light.
Here, the total area of the bottom surface portion 4 a of the gas flow path 4 means the total area including the area of the groove portion 4 b and means the total area other than the top surface portion 3 a of the holding pin 3.

この基板保持用真空チャック１を構成する材料としては、炭化珪素（ＳｉＯ2）、アルミナ（Ａｌ2Ｏ3）、チタニア（ＴｉＯ2），窒化珪素（Ｓｉ3Ｎ4）等の他フォレストライト、コーディライト等を用いることができる。
本発明においては、素材自体が黒色軽量で、高温でも機械強度が大きく、低熱膨張性で、熱伝導性に優れ、適当な価格で容易に入手でき、かつ大径のチャック基板を容易に製作できる点、及び、本発明の表面形状を形成した場合に、その乱反射抑止性に優れている点から炭化珪素（ＳｉＯ2）が特に好ましい。 The material constituting the vacuum chuck 1 for holding the substrate includes silicon carbide (SiO 2 ), alumina (Al 2 O 3 ), titania (TiO 2 ), silicon nitride (Si 3 N 4 ), and other forest lights and cordies. A light or the like can be used.
In the present invention, the material itself is black and light, has high mechanical strength even at high temperatures, has low thermal expansion, excellent thermal conductivity, can be easily obtained at an appropriate price, and can easily produce a large-diameter chuck substrate. In terms of the point and when the surface shape of the present invention is formed, silicon carbide (SiO 2 ) is particularly preferable because of its excellent irregular reflection suppression property.

前記基板保持面Ａガス逃げ通路部４の底面部４ａに溝４ｂを形成する具体的手段としては、例えば、保持ピン３が形成された基板保持面Ａのガス流路４の底面部４ａにレーザ光を照射してレーザ加工を施すことにより、所定の幅、深さの溝４ｂあるいはドット状凹部４ｂを形成する方法を挙げることができる。
この方法は、例えば、炭化珪素（ＳｉＣ）材からなる底面部に所望の形状及び大きさの溝あるいはドット状凹部を所望ピッチで正確に形成することができるため好ましい。 As a specific means for forming the groove 4b in the bottom surface portion 4a of the substrate holding surface A gas escape passage portion 4, for example, a laser is applied to the bottom surface portion 4a of the gas flow path 4 of the substrate holding surface A on which the holding pins 3 are formed. A method of forming a groove 4b or a dot-like recess 4b having a predetermined width and depth by irradiating light and performing laser processing can be exemplified.
This method is preferable because, for example, a groove or a dot-shaped recess having a desired shape and size can be accurately formed at a desired pitch on a bottom surface portion made of a silicon carbide (SiC) material.

また、この溝またはドット状凹部が形成された基板保持面Ａの表面を粗面化する方法としては、砥粒を用いたブラスト加工法を挙げることができる。
例えば、炭化珪素（ＳｉＣ）、窒化ホウ素（ＢＮ）等の＃１８０〜＃６００程度の粒度範囲の砥粒を用い、これを表面に向け噴射して該表面をブラスト加工により粗面化する。
このようにして形成された本発明にかかる基板保持用真空チャック１は、露光時に乱反射抑制作用を奏する。 An example of a method for roughening the surface of the substrate holding surface A on which the grooves or dot-like recesses are formed is a blasting method using abrasive grains.
For example, abrasive grains having a particle size range of about # 180 to # 600, such as silicon carbide (SiC) and boron nitride (BN), are used and sprayed toward the surface to roughen the surface by blasting.
The thus formed substrate holding vacuum chuck 1 according to the present invention exhibits an effect of suppressing irregular reflection during exposure.

まず、保持ピンを形成するため、保持ピンの形成パターンが形成されたマスク材を基体に付着させた後、ＳｉＣ＃４００砥粒を用いてブラスト加工する。このようにして保持ピンが形成された基体（ＳｉＣ円板：外径１０００ｍｍ、厚さ４０ｍｍ、保持ピン（頂面部）径１．０ｍｍ、ピッチ５．０ｍｍ、基板接触面積／ガス逃げ部面積＝１：２５）のガス流路の底面部に、レーザ加工にて幅０．８ｍｍ、深さ０．２ｍｍの溝を１．５ｍｍピッチで形成させた。
この溝形成後、前記マスク材を基体に付着させたまま、基板表面を再度ＳｉＣ＃６００砥粒でブラスト加工して粗面化し、本発明の基板保持用真空チャックを得た（Ｒａ＝１．０μｍ）。 First, in order to form a holding pin, a mask material on which a holding pin formation pattern is formed is attached to a substrate, and then blasted using SiC # 400 abrasive grains. Substrate (SiC disk: outer diameter 1000 mm, thickness 40 mm, holding pin (top surface) diameter 1.0 mm, pitch 5.0 mm, substrate contact area / gas escape area = 1) on which the holding pins are thus formed : 25) Grooves having a width of 0.8 mm and a depth of 0.2 mm were formed at a pitch of 1.5 mm on the bottom of the gas flow path.
After forming the groove, the substrate surface was blasted again with SiC # 600 abrasive grains while the mask material was adhered to the substrate to roughen the substrate surface, and the substrate holding vacuum chuck of the present invention was obtained (Ra = 1. 0 μm).

この基板保持面Ａを、露光波長に相当する波長の紫外光で反射率測定したところ、反射率は０．４％であった。
一方、保持ピンを形成したのみの基板（溝形成後、粗面加工をしていない基板）を同様の測定条件下に反射率測定したところ、その反射率は０．８〜１．０％であった。
尚、この実験に於いて測定した反射率とは、紫外線光を基板保持面に対し垂直に放射し、一定角度（３０度）の受光器に入る反射光量を前記放射光量に対する百分率として表示したものである。 When the reflectance of this substrate holding surface A was measured with ultraviolet light having a wavelength corresponding to the exposure wavelength, the reflectance was 0.4%.
On the other hand, when the reflectance of a substrate on which only the holding pins are formed (the substrate that has not been roughened after groove formation) was measured under the same measurement conditions, the reflectance was 0.8 to 1.0%. there were.
Note that the reflectance measured in this experiment is a value obtained by radiating ultraviolet light perpendicular to the substrate holding surface and displaying the amount of reflected light entering the light receiver at a certain angle (30 degrees) as a percentage of the amount of radiated light. It is.

本発明にかかる基板保持用真空ピンチャックは、例えば、液晶ディスプレイ製作用の基板等の光透過性基板を露光処理する際、好適に用いることができる。   The vacuum pin chuck for holding a substrate according to the present invention can be suitably used, for example, when an optically transparent substrate such as a substrate for producing a liquid crystal display is exposed.

本発明にかかる基板保持用真空ピンチャック（真空ピンチャック）の一形態の構造を模式的に示した断面図である。It is sectional drawing which showed typically the structure of one form of the vacuum pin chuck (vacuum pin chuck) for board | substrate holding concerning this invention. 露光装置で一般に使用される従来の真空ピンチャックの斜視図である。It is a perspective view of the conventional vacuum pin chuck generally used with exposure apparatus.

符号の説明Explanation of symbols

１ 基板保持用真空ピンチャック（真空ピンチャック）
２ チャック本体
３ 保持ピン
３ａ ピン頂面部
４ ガス流路
４ａ （ガス流路の）底面部
４ｂ 溝またはドット状凹部
Ａ 基板保持面 1 Substrate holding vacuum pin chuck (vacuum pin chuck)
2 chuck body 3 holding pin 3a pin top surface portion 4 gas flow path 4a (gas flow path) bottom surface portion 4b groove or dot-shaped recess A substrate holding surface

Claims (6)

基板保持面側に互いに間隙をもって配列した多数の小突起状の保持ピンを備え、前記保持ピンの間隙をガス流路とした基板保持用真空チャックにおいて、
前記基板保持面のガス流路の少なくとも底面部には、幅０．１〜１．０ｍｍで深さ０．０５〜０．５ｍｍの溝もしくは該溝幅及び深さに対応するドット状凹部が前記溝幅の２〜５倍のピッチで形成されていると共に、少なくとも、前記溝もしくは凹部の表面及び前記ガス流路底面部の表面が、表面粗さＲａ＝０．５〜１．５μｍの範囲に形成されていることを特徴とする基板保持用真空チャック。 In a substrate holding vacuum chuck comprising a large number of small protrusion-shaped holding pins arranged on the substrate holding surface side with gaps therebetween, and the gap between the holding pins as a gas flow path,
At least the bottom surface portion of the gas flow path of the substrate holding surface has a groove having a width of 0.1 to 1.0 mm and a depth of 0.05 to 0.5 mm or a dot-like recess corresponding to the groove width and depth. It is formed at a pitch of 2 to 5 times the groove width, and at least the surface of the groove or recess and the surface of the bottom surface of the gas flow path are in the range of surface roughness Ra = 0.5 to 1.5 μm. A vacuum chuck for holding a substrate, wherein the vacuum chuck is formed. 前記保持ピンは、その頂面部の相当径が０．５〜１．５ｍｍ、ガス流路の底面部からの高さが０．１〜１．０ｍｍ、配列ピッチが３．０〜６．０ｍｍであることを特徴とする請求項１に記載された基板保持用真空チャック。   The holding pins have an equivalent diameter of the top surface portion of 0.5 to 1.5 mm, a height from the bottom surface portion of the gas flow path of 0.1 to 1.0 mm, and an arrangement pitch of 3.0 to 6.0 mm. The vacuum chuck for holding a substrate according to claim 1, wherein the vacuum chuck is for holding a substrate. 炭化珪素材で形成されていることを特徴とする請求項１または請求項２に記載された基板保持用真空チャック。   3. The substrate holding vacuum chuck according to claim 1, wherein the substrate holding vacuum chuck is made of a silicon carbide material. 前記保持ピンの頂面部の全面積と、ガス流路の底面部の全面積との比が１：１０〜１：１００であることを特徴とする請求項１乃至請求項３のいずれかに記載された基板保持用真空チャック。   The ratio between the total area of the top surface portion of the holding pin and the total area of the bottom surface portion of the gas flow path is 1:10 to 1: 100. Substrate holding vacuum chuck. 前記溝もしくはドット状凹部は、レーザ加工により形成されたものであることを特徴とする請求項１乃至請求項４のいずれかに記載された基板保持用真空チャック。   5. The substrate-holding vacuum chuck according to claim 1, wherein the groove or the dot-shaped recess is formed by laser processing. 前記溝もしくは凹部の表面、及び前記ガス流路の底面部の表面が、ブラスト加工により粗面加工されていることを特徴とする請求項１乃至請求項５のいずれかに記載された基板保持用真空チャック。   6. The substrate holding device according to claim 1, wherein the surface of the groove or recess and the surface of the bottom surface of the gas flow path are roughened by blasting. Vacuum chuck.
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