JP2005108899A - Power supply device, structure, and heat-dissipating assembly structure of the power semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power supply device which can be assembled easily. <P>SOLUTION: The power supply device 4 is equipped with a drive circuit board 21, FETs 12, and a pressing plate 23, interposed between the drive circuit board 21 and the FETs 12. The pressing plate 23 is equipped with a plurality of supports 33, a plurality of holders 35, and a plurality of insertion holes 37. The pressing plate 23 is supported by the supports 33 so as to assemble a pressing plate body 31 to the drive circuit board 21, with the body 31 kept separate from the drive circuit board 21. The FETs 12 are assembled to the drive circuit board 21, inserting their connection terminals 16 into fixing holes 45 bored in the drive circuit board 21 through the intermediary of the insertion holes 37; and FET bodies 48 are each pinched between the holding projections 35a and 35b of the holder unit 35, whereby the FETs 12 are held at the pressing plate 23, inserting the connection terminals 16 into the fixing holes 45. The drive circuit board 21 and a heat dissipating plate 27 are fixed together, whereby the FETs 12 are pressed against the heat-dissipating plate 27 by the pressing plate 23 and are coupled to the heat-dissipating plate 27 in heat conductible manner. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電力供給装置、構造体、及び電力半導体素子の放熱組立て構造に関するものである。   The present invention relates to a power supply device, a structure, and a heat dissipation assembly structure for a power semiconductor element.

パワーＭＯＳＦＥＴ等の電力半導体素子を用いた通電制御により、モータ等の車載負荷に駆動電力を供給する電力供給装置においては、電力半導体素子の発熱に伴うケース内温度の上昇により、電力供給回路（駆動回路）を構成するその他の半導体素子に発生する作動不具合を防止すべく、その発熱対策が重要な課題となっている。   In a power supply device that supplies drive power to a vehicle-mounted load such as a motor by energization control using a power semiconductor element such as a power MOSFET, the power supply circuit (drive) In order to prevent malfunctions occurring in other semiconductor elements constituting the circuit), countermeasures against heat generation are an important issue.

従来、このような電力半導体素子の発熱対策として、電力半導体素子をその他の半導体素子が実装される駆動回路基板の表面（実装面）から離れた場所に配置するとともに、その一部を放熱部材と伝熱可能に接続することにより、電力半導体素子が発する熱をケース外部に放出する組立構造を採用する電力供給装置がある。   Conventionally, as a countermeasure against heat generation of such a power semiconductor element, the power semiconductor element is disposed at a location away from the surface (mounting surface) of the drive circuit board on which the other semiconductor elements are mounted, and a part of the power semiconductor element is used as a heat dissipation member. There is a power supply device that employs an assembly structure in which heat generated by a power semiconductor element is released to the outside of the case by being connected so that heat can be transferred.

例えば、図５に示す従来の電力供給装置６０は、車載電源に接続される入力端子とモータ等の車載負荷に接続される出力端子との間に介在される複数のパワーＭＯＳＦＥＴ（以下、単にＦＥＴ）と、各ＦＥＴ６１の作動を制御する制御ＩＣ６２等の駆動回路を構成するその他の半導体素子が実装された駆動回路基板６３と、放熱板６４とを備えている。   For example, a conventional power supply device 60 shown in FIG. 5 includes a plurality of power MOSFETs (hereinafter simply referred to as FETs) interposed between an input terminal connected to an in-vehicle power source and an output terminal connected to an in-vehicle load such as a motor. ), And a drive circuit board 63 on which other semiconductor elements constituting a drive circuit such as a control IC 62 for controlling the operation of each FET 61 are mounted, and a heat radiating plate 64.

各ＦＥＴ６１は、その放熱面６１ａが放熱（絶縁）シート６５を介して密着するよう放熱板６４に螺子止めされ、その各接続端子（リード線）６６が駆動回路基板６３に形成された各取付孔６７に、制御ＩＣ６２やその他の半導体素子が実装される実装面６３ａの反対側から挿入された後、ハンダ付けにて駆動回路に接続される。そして、各ＦＥＴ６１は、駆動回路基板６３が支柱６８を介して放熱板６４に螺子止めされることにより、駆動回路基板６３に覆われるように同駆動回路基板６３から離間した位置に組み付けられている。   Each FET 61 is screwed to the heat radiating plate 64 so that the heat radiating surface 61a thereof is in close contact with the heat radiating (insulating) sheet 65, and each connection terminal (lead wire) 66 is formed in each mounting hole formed in the drive circuit board 63. The control IC 62 and other semiconductor elements are inserted into the connector 67 from the opposite side of the mounting surface 63a and then connected to the drive circuit by soldering. Each FET 61 is assembled at a position away from the drive circuit board 63 so that the drive circuit board 63 is covered with the drive circuit board 63 by screwing the drive circuit board 63 to the heat radiating plate 64 via the support column 68. .

このような組立構造を採用すれば、電力半導体素子としての各ＦＥＴ６１が発する熱を直接駆動回路基板６３に伝えることなく、効果的にケース外部に放出することができる。そして、例えば、特許文献１に示す電力供給装置のように、駆動回路基板６３の各ＦＥＴ６１と対向する面に伝熱層を形成し、この伝熱層を駆動回路基板６３を固定する伝熱部材としての金属螺子６９と接続する構成とすれば、各ＦＥＴ６１により加熱されたケース内部エアの放熱が可能になり、更に効果的に放熱を行うことができる。
特開２００２−２９３２０２号公報 If such an assembly structure is employed, the heat generated by each FET 61 as a power semiconductor element can be effectively released to the outside of the case without being directly transmitted to the drive circuit board 63. And, for example, as in the power supply device shown in Patent Document 1, a heat transfer layer is formed on the surface of the drive circuit board 63 facing each FET 61, and the heat transfer layer fixes the drive circuit board 63 to this heat transfer layer. If it is configured to be connected to the metal screw 69 as described above, it is possible to radiate the air inside the case heated by each FET 61, and more effectively radiate heat.
JP 2002-293202 A

しかし、上記のような従来の組立構造では、放熱板６４の螺子孔７０と放熱シート６５の貫通孔７１とが一致するよう位置決めしつつ各ＦＥＴ６１を一つづつ螺子止めしなけらばならない上に、駆動回路基板６３への各ＦＥＴ６１の接続時には、駆動回路基板６３の取付孔６７に各ＦＥＴ６１の各接続端子６６を一括で挿入する必要がある。   However, in the conventional assembly structure as described above, each FET 61 must be screwed one by one while being positioned so that the screw hole 70 of the heat radiating plate 64 and the through hole 71 of the heat radiating sheet 65 coincide. When the FETs 61 are connected to the drive circuit board 63, the connection terminals 66 of the FETs 61 need to be inserted into the mounting holes 67 of the drive circuit board 63 in a lump.

そのため、組み付け時には、治具等を用いて、各ＦＥＴ６１、放熱板６４、放熱シート６５、及び駆動回路基板６３間の相互の位置調整を繰り返す必要があるため、多大な時間と労力を要するという問題がある。   Therefore, when assembling, it is necessary to repeat the mutual position adjustment between each FET 61, the heat radiating plate 64, the heat radiating sheet 65, and the drive circuit board 63 by using a jig or the like, which requires a lot of time and labor. There is.

更には、例えば、組立て完了後に一部のＦＥＴ６１に不具合を発見した場合等には、各接続端子６６に施された全てのハンダを一度除去しなければ各ＦＥＴ６１を取り外すことができないという問題があり、その結果、メンテナンス時においても多大な時間と労力を要するという問題がある。   Furthermore, for example, when a defect is found in some FETs 61 after assembly, there is a problem that each FET 61 cannot be removed unless all the solder applied to each connection terminal 66 is removed once. As a result, there is a problem that a great deal of time and labor is required during maintenance.

本発明は、上記問題点を解決するためになされたものであって、その目的は、容易に組立てができる電力供給装置、構造体、及び電力半導体素子の放熱組立て構造を提供することにある。   The present invention has been made to solve the above problems, and an object of the present invention is to provide a power supply device, a structure, and a heat dissipation assembly structure for a power semiconductor element that can be easily assembled.

上記問題点を解決するために、請求項１に記載の発明は、複数の電力半導体素子と、該各電力半導体素子の通電制御を行う駆動回路が実装される駆動回路基板と、前記各電力半導体素子の発熱を外部に放出するための放熱部材とを備えた電力供給装置であって、前記駆動回路基板と前記各電力半導体素子との間に介在され、前記各電力半導体素子を前記放熱部材に押し付ける押圧部と前記各電力半導体素子を保持する複数の保持部とを有する構造部材を備え、前記駆動回路基板は前記放熱部材に固定され、前記各電力半導体素子は、前記放熱部材と伝熱可能に接続されることを要旨とする。   In order to solve the above-described problems, the invention described in claim 1 includes a plurality of power semiconductor elements, a drive circuit board on which a drive circuit that controls energization of each power semiconductor element is mounted, and each power semiconductor. A power supply device including a heat radiating member for releasing heat generated from the element to the outside, wherein the power supply device is interposed between the drive circuit board and each power semiconductor element, and each power semiconductor element is used as the heat radiating member. A structural member having a pressing portion to be pressed and a plurality of holding portions for holding the power semiconductor elements; the drive circuit board is fixed to the heat dissipation member; and the power semiconductor elements can conduct heat to the heat dissipation member. The main point is to be connected to.

請求項２に記載の発明は、前記押圧部は、前記各電力半導体素子を押圧する押圧面を有する押圧板と、前記駆動回路基板に対して前記押圧板を支持する支持部とを備え、
前記押圧部は、前記駆動回路基板との当接面から前記押圧面までの距離と前記各電力半導体素子の厚みの和が、固定状態における前記駆動回路基板と前記放熱部材との距離よりも大きく設定されていることを要旨とする。 The invention according to claim 2 includes the pressing portion having a pressing plate having a pressing surface that presses each power semiconductor element, and a support portion that supports the pressing plate with respect to the drive circuit board,
In the pressing portion, the sum of the distance from the contact surface with the driving circuit board to the pressing surface and the thickness of each power semiconductor element is larger than the distance between the driving circuit board and the heat dissipation member in a fixed state. The gist is that it is set.

請求項３に記載の発明は、前記駆動回路基板には、前記各電力半導体素子を前記駆動回路に接続するための複数の取付孔が形成され、前記各保持部は、前記各取付孔に接続端子が挿入された前記各電力半導体素子の位置に対応して形成されることを要旨とする。   According to a third aspect of the present invention, the drive circuit board is formed with a plurality of attachment holes for connecting the power semiconductor elements to the drive circuit, and the holding portions are connected to the attachment holes. The gist is that the terminal is formed corresponding to the position of each power semiconductor element in which the terminal is inserted.

請求項４に記載の発明は、前記駆動回路基板と前記放熱部材と固定するための固定部材を備え、前記構造部材及び固定部材は、熱伝材料にて形成され、前記構造部材は、前記固定部材を介して伝熱可能に前記放熱部材と接続されることを要旨とする。   The invention according to claim 4 includes a fixing member for fixing the drive circuit board and the heat radiating member, wherein the structural member and the fixing member are formed of a heat transfer material, and the structural member is the fixed member. The gist is that the heat radiating member is connected to the heat dissipating member through the member.

請求項５に記載の発明は、複数の電力半導体素子と該各電力半導体素子の通電制御を行う駆動回路が実装される駆動回路基板との間に介在される構造体であって、前記各電力半導体素子を前記各電力半導体素子の発熱を外部に放出するための放熱部材に押し付ける押圧部と、前記各電力半導体素子を保持する複数の保持部とを備え、前記駆動回路基板と前記放熱部材とが固定されることにより、前記各電力半導体素子を前記放熱部材と伝熱可能に接続することを要旨とする。   The invention according to claim 5 is a structure that is interposed between a plurality of power semiconductor elements and a drive circuit board on which a drive circuit that controls energization of each power semiconductor element is mounted. A pressing portion that presses the semiconductor element against a heat radiating member for releasing heat generated by each power semiconductor element to the outside; and a plurality of holding portions that hold the power semiconductor elements; and the drive circuit board and the heat radiating member; By fixing the power semiconductor element, the power semiconductor element is connected to the heat radiating member so as to be able to transfer heat.

請求項６に記載の発明は、前記押圧部は、前記各電力半導体素子を押圧する押圧面を有する押圧板と、前記駆動回路基板に対して前記押圧板を支持する支持部とを備え、前記押圧部は、前記駆動回路基板との当接面から前記押圧面までの距離と前記各電力半導体素子の厚みの和が、固定状態における前記駆動回路基板と前記放熱部材との距離よりも大きく設定されていることを要旨とする。   The invention according to claim 6 is characterized in that the pressing portion includes a pressing plate having a pressing surface that presses each of the power semiconductor elements, and a support portion that supports the pressing plate with respect to the drive circuit board, The pressing portion is set such that the sum of the distance from the contact surface with the driving circuit board to the pressing surface and the thickness of each power semiconductor element is larger than the distance between the driving circuit board and the heat dissipation member in a fixed state. It is a summary.

請求項７に記載の発明は、前記各保持部は、前記駆動回路基板に形成された前記各電力半導体素子を前記駆動回路に接続するための複数の取付孔に接続端子が挿入された前記各電力半導体素子の位置に対応して形成されることを要旨とする。   According to a seventh aspect of the present invention, each of the holding portions has the connection terminals inserted in a plurality of mounting holes for connecting the power semiconductor elements formed on the drive circuit board to the drive circuit. The gist is that the power semiconductor element is formed corresponding to the position of the power semiconductor element.

請求項８に記載の発明は、前記各接続端子が挿通される複数の挿通孔と、前記固定するための螺子が挿通される複数の貫通孔と、前記駆動回路基板に形成された位置決め孔に挿入される位置決め突起とを備え、前記位置決め突起が挿入された場合に、前記各挿通孔と前記各取付孔との位置、及び前記各貫通孔と前記駆動回路基板に形成された複数の貫通孔との位置が一致するように形成されることを要旨とする。   The invention according to claim 8 includes a plurality of insertion holes through which the connection terminals are inserted, a plurality of through holes through which the fixing screws are inserted, and positioning holes formed in the drive circuit board. And a plurality of through holes formed in the through holes and the drive circuit board when the positioning protrusions are inserted, and positions of the through holes and the mounting holes. The gist is that they are formed so that their positions coincide with each other.

請求項９に記載の発明は、複数の電力半導体素子を、該各電力半導体素子の通電制御を行う駆動回路が実装される駆動回路基板から離間した位置に配置するとともに、前記各電力半導体素子の発熱を外部に放出するための放熱部材に伝熱可能に接続する電力半導体素子の放熱組立て構造であって、前記駆動回路基板と前記各電力半導体素子との間に介在され、前記各電力半導体素子を前記放熱部材に押し付ける押圧部と前記各電力半導体素子を保持する複数の保持部とを有する構造部材を備え、前記駆動回路基板は前記放熱部材に固定され、前記各電力半導体素子は、前記放熱部材と伝熱可能に接続されることを要旨とする。   According to the ninth aspect of the present invention, the plurality of power semiconductor elements are arranged at positions separated from the drive circuit board on which the drive circuit that controls energization of each power semiconductor element is mounted. A heat radiation assembly structure of a power semiconductor element connected to a heat radiation member for releasing heat to the outside so as to be able to conduct heat, and interposed between the drive circuit board and each power semiconductor element, and each power semiconductor element A structural member having a pressing portion that presses against the heat dissipation member and a plurality of holding portions that hold the power semiconductor elements, the drive circuit board is fixed to the heat dissipation member, and the power semiconductor elements are The gist is to be connected to the member so that heat can be transferred.

請求項１０に記載の発明は、前記押圧部は、前記各電力半導体素子を押圧する押圧面を有する押圧板と、前記駆動回路基板に対して前記押圧板を支持する支持部とを備え、前記押圧部は、前記駆動回路基板との当接面から前記押圧面までの距離と前記各電力半導体素子の厚みの和が、固定状態における前記駆動回路基板と前記放熱部材との距離よりも大きく設定されていることを要旨とする。   The invention according to claim 10 is characterized in that the pressing portion includes a pressing plate having a pressing surface that presses each of the power semiconductor elements, and a support portion that supports the pressing plate with respect to the drive circuit board, The pressing portion is set such that the sum of the distance from the contact surface with the driving circuit board to the pressing surface and the thickness of each power semiconductor element is larger than the distance between the driving circuit board and the heat dissipation member in a fixed state. It is a summary.

請求項１１に記載の発明は、前記駆動回路基板には、前記各電力半導体素子を前記駆動回路に接続するための複数の取付孔が形成され、前記各保持部は、前記各取付孔に接続端子が挿入された前記各電力半導体素子の位置に対応して形成されることを特徴とする。   According to an eleventh aspect of the present invention, a plurality of mounting holes for connecting the power semiconductor elements to the driving circuit are formed in the driving circuit board, and the holding portions are connected to the mounting holes. It is formed corresponding to the position of each power semiconductor element in which a terminal is inserted.

請求項１２に記載の発明は、前記駆動回路基板と前記放熱部材と固定するための固定部材を備え、前記構造部材及び固定部材は、熱伝材料にて形成され、前記構造部材は、前記固定部材を介して伝熱可能に前記放熱部材と接続されることを要旨とする。   The invention according to claim 12 includes a fixing member for fixing the drive circuit board and the heat radiating member, wherein the structural member and the fixing member are formed of a heat transfer material, and the structural member is the fixed member. The gist is that the heat radiating member is connected to the heat dissipating member through the member.

（作用）
請求項１，５，９に記載の発明によれば、各電力半導体素子を放熱部材に直接固定しないので、従来のような各電力半導体素子を一つづつ放熱部材に螺子止めする工程を省略することが可能になり、更に各電力半導体素子の全て接続部を駆動回路基板側の接続部に一括で合わせる必要がなくなる。従って、組立てが容易になる。 (Function)
According to the first, fifth, and ninth aspects of the present invention, since each power semiconductor element is not directly fixed to the heat radiating member, the conventional step of screwing each power semiconductor element to the heat radiating member one by one is omitted. Furthermore, it is not necessary to match all the connection portions of the power semiconductor elements to the connection portions on the drive circuit board side at once. Therefore, assembly becomes easy.

また、従来のような各電力半導体素子の螺子止め工程を省略することにより、放熱部材への各電力半導体素子固定用の螺子穴形成工程が不要となるので、加工コストが低減される。加えて、特に、各電力半導体素子と放熱部材との間に放熱（絶縁）シートを介在させる構成を採用する場合には、放熱シートに螺子用孔を形成する工程が不要になるので、更に加工コストが低減されるとともに、放熱部材の各螺子穴と放熱シートの螺子用孔との位置決め工程が不要になるので、更に組立てが容易になる。   Further, by omitting the conventional screwing step for each power semiconductor element, the step of forming a screw hole for fixing each power semiconductor element to the heat radiating member becomes unnecessary, so that the processing cost is reduced. In addition, in particular, when adopting a configuration in which a heat dissipation (insulation) sheet is interposed between each power semiconductor element and the heat dissipation member, a process of forming screw holes in the heat dissipation sheet becomes unnecessary, and further processing is performed. The cost is reduced and the positioning step of each screw hole of the heat radiating member and the screw hole of the heat radiating sheet is not necessary, so that the assembly is further facilitated.

更に、各電力半導体素子が放熱部材に固定されていないので、各電力半導体素子と駆動回路との接続部を開放（一般的にはハンダ付けの除去）することなく、駆動回路基板を放熱部材から外すことが可能になる。従って、組立て後のメンテナンス性が向上する。   Furthermore, since each power semiconductor element is not fixed to the heat radiating member, the drive circuit board can be removed from the heat radiating member without opening the connection portion between each power semiconductor element and the drive circuit (generally, removal of soldering). It becomes possible to remove. Therefore, maintainability after assembly is improved.

請求項２，６，１０に記載の発明によれば、押圧部は、駆動回路基板との当接面から押圧面までの距離と各電力半導体素子の厚みの和が、固定状態における駆動回路基板と放熱部材との距離よりも大きく設定されている。従って、各電力半導体素子は、駆動回路基板と放熱部材とが固定されることにより、押圧部材に押圧され放熱部材と密着する。   According to the second, sixth, and tenth aspects of the present invention, the pressing portion is configured so that the distance from the contact surface to the pressing surface to the driving circuit board and the sum of the thicknesses of the respective power semiconductor elements are fixed. It is set to be larger than the distance between and the heat dissipating member. Therefore, each power semiconductor element is pressed by the pressing member and is in close contact with the heat radiating member when the drive circuit board and the heat radiating member are fixed.

請求項３，７，１１に記載の発明によれば、各電力半導体素子の接続端子にハンダ付けを行うことなく、各接続端子が駆動回路基板の取付孔に挿入された状態で駆動回路基板と放熱部材とを固定することが可能になり、ハンダ付け前に各電力半導体素子と放熱部材と伝熱可能に接続する、即ち各電力半導体素子を放熱部材に押し付けることが可能になる。従って、ハンダ付け後に各電力半導体素子を放熱部材に押し付ける構成のように、ハンダ付け部位に押し付け力が加わることがないので、ハンダの剥離、或いは駆動回路基板の変形や歪み等が防止される。その結果、組立て工程に起因する不具合の発生が低減される。   According to the third, seventh, and eleventh aspects of the present invention, the drive circuit board and the connection terminal of each power semiconductor element are inserted into the mounting hole of the drive circuit board without soldering to the connection terminal of each power semiconductor element. It becomes possible to fix the heat dissipating member, and to connect each power semiconductor element and the heat dissipating member in a heat transferable manner before soldering, that is, it is possible to press each power semiconductor element against the heat dissipating member. Therefore, unlike the configuration in which each power semiconductor element is pressed against the heat radiating member after soldering, no pressing force is applied to the soldering portion, so that peeling of the solder or deformation or distortion of the drive circuit board is prevented. As a result, the occurrence of problems due to the assembly process is reduced.

請求項４，１２に記載の発明によれば、各電力半導体素子が発する熱は、構造部材及び固定部材を介して放熱部材に伝達される。その結果、放熱性能が向上する。
請求項８に記載の発明によれば、位置決め突起を駆動回路基板に形成された位置決め孔に挿入するだけで、駆動回路基板に対する位置決めがなされ、各挿通孔と各取付孔との位置、及び各貫通孔と駆動回路基板の各貫通孔との位置が一致する。従って、駆動回路基板への組み付け及び各電力半導体素子の組み付けが容易になるので、更に組立てが容易になる。 According to invention of Claim 4, 12, the heat | fever which each electric power semiconductor element emits is transmitted to a heat radiating member via a structural member and a fixing member. As a result, the heat dissipation performance is improved.
According to the eighth aspect of the present invention, the positioning with respect to the driving circuit board is performed simply by inserting the positioning protrusions into the positioning holes formed in the driving circuit board, the positions of the insertion holes and the mounting holes, The positions of the through holes and the through holes of the drive circuit board coincide with each other. Therefore, the assembly to the drive circuit board and the assembly of each power semiconductor element are facilitated, and the assembly is further facilitated.

本発明によれば、容易に組立てができる電力供給装置、構造体、及び電力半導体素子の放熱組立て構造を提供することができる。   According to the present invention, it is possible to provide a power supply device that can be easily assembled, a structure, and a heat dissipation assembly structure for a power semiconductor element.

以下、本発明をブラシレスモータを駆動源とするウォータポンプの電力供給装置に具体化した一実施形態を図面に従って説明する。
図１に示すように、本実施形態のウォータポンプ１は、駆動源としてのモータ３と、モータ３に駆動電力を供給する電力供給装置４と、モータ３の回転軸５の一端（出力軸）に固定され同モータ３の回転により液体を圧送するインペラ６とを備えている。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment in which the present invention is embodied in a water pump power supply device using a brushless motor as a drive source will be described with reference to the drawings.
As shown in FIG. 1, a water pump 1 according to the present embodiment includes a motor 3 as a drive source, a power supply device 4 that supplies driving power to the motor 3, and one end (output shaft) of a rotating shaft 5 of the motor 3. And an impeller 6 that pumps liquid by rotation of the motor 3.

本実施形態のモータ３は、コイル７が巻回される複数のティース（図示せず）を備えたステータ８と、回転軸５に固定されステータ８に囲まれるよう軸支されるマグネットロータ９とを備えたＤＣブラシレスモータであり、電力供給装置４は、モータ３に供給する電力を制御すること（通電制御）によりモータ３の回転を制御する。   The motor 3 of the present embodiment includes a stator 8 having a plurality of teeth (not shown) around which a coil 7 is wound, and a magnet rotor 9 that is fixed to the rotary shaft 5 and pivotally supported so as to be surrounded by the stator 8. The power supply device 4 controls the rotation of the motor 3 by controlling the power supplied to the motor 3 (energization control).

図２は、本実施形態の電力供給装置の回路構成図であり、同図に示すように、電力供給装置４は、車載電源１０とモータ３との間に介在される複数（６個）のパワーＭＯＳＦＥＴ（以下、単にＦＥＴ）から構成される出力回路１１と、各ＦＥＴ１２（１２ａ〜１２ｆ）の作動を制御する制御ＩＣ１３を備えた駆動回路１４とを備えている。   FIG. 2 is a circuit configuration diagram of the power supply apparatus according to the present embodiment. As shown in FIG. 2, the power supply apparatus 4 includes a plurality (six) of power supplies 10 interposed between the in-vehicle power supply 10 and the motor 3. An output circuit 11 composed of a power MOSFET (hereinafter simply referred to as FET) and a drive circuit 14 including a control IC 13 for controlling the operation of each FET 12 (12a to 12f) are provided.

本実施形態では、各ＦＥＴ１２ａ〜１２ｃはＰチャネル型ＦＥＴであり、それらのソースは車載電源１０の正極に接続され、それぞれのドレインは、モータ３の接続端子１６ａ〜１６ｃに接続されている。一方、各ＦＥＴ１２ｄ〜１２ｆはＮチャネル型ＦＥＴであり、それらのソースは車載電源１０の負極に接続され、それぞれのドレインはモータ３の接続端子１６ａ〜１６ｃに接続されている。そして、各ＦＥＴ１２ｄ〜１２ｆのゲートには、制御ＩＣ１３の各制御出力端子１３ａ〜１３ｆが抵抗Ｒ１〜Ｒ６を介してそれぞれ接続されている。   In the present embodiment, each of the FETs 12 a to 12 c is a P-channel FET, and the source thereof is connected to the positive electrode of the in-vehicle power supply 10, and the respective drains are connected to the connection terminals 16 a to 16 c of the motor 3. On the other hand, each of the FETs 12 d to 12 f is an N-channel type FET, the source thereof is connected to the negative electrode of the in-vehicle power supply 10, and the respective drains are connected to the connection terminals 16 a to 16 c of the motor 3. The control output terminals 13a to 13f of the control IC 13 are connected to the gates of the FETs 12d to 12f via resistors R1 to R6, respectively.

そして、電力供給装置４は、制御ＩＣ１３にて各ＦＥＴ１２ａ〜１２ｆの通電制御を行うことにより、モータ３の各接続端子１６ａ〜１６ｃに三相（Ｕ，Ｖ，Ｗ）の駆動電力を供給し、これら三相のコイル電流の方向を順次切り換えることによりモータ３の回転を制御する。   And the electric power supply apparatus 4 supplies the drive power of three phases (U, V, W) to each connection terminal 16a-16c of the motor 3 by performing energization control of each FET12a-12f in control IC13, The rotation of the motor 3 is controlled by sequentially switching the directions of these three-phase coil currents.

図３に示すように、本実施形態の電力供給装置４は、駆動回路１４が実装される駆動回路基板２１と、駆動回路基板２１と各ＦＥＴ１２との間に介在される構造部材としての押え板２３とを備え、各ＦＥＴ１２は、押え板２３に保持されることにより、駆動回路１４が実装された実装面２１ａの反対側に配置される。そして、各ＦＥＴ１２は、複数の支柱２５を介して駆動回路基板２１と放熱板２７とが固定されることにより、押え板２３に押し付けられて放熱板２７と伝熱可能に接続される。   As shown in FIG. 3, the power supply device 4 of the present embodiment includes a drive circuit board 21 on which the drive circuit 14 is mounted, and a presser plate as a structural member interposed between the drive circuit board 21 and each FET 12. 23, and each FET 12 is disposed on the opposite side of the mounting surface 21a on which the drive circuit 14 is mounted by being held by the pressing plate 23. Each FET 12 is pressed against the holding plate 23 and connected to the heat radiating plate 27 so that heat can be transferred by fixing the drive circuit board 21 and the heat radiating plate 27 via the plurality of support columns 25.

詳述すると、押え板２３は、各ＦＥＴ１２を放熱板２７に押し付けるための押え板本体３１と、押え板本体３１を支持するための複数の支持部３３と、各ＦＥＴ１２を保持するための複数の保持部３５とを備え、押え板本体３１には、各ＦＥＴ１２の接続端子１６が挿通される複数の挿通孔３７が形成されている。尚、本実施形態では、押え板２３は金属にて形成され、各支持部３３及び各保持部３５は、押え板本体３１と一体的に形成されている。そして、押え板本体３１が押圧板を構成し、押え板本体３１及び支持部３３が押圧部を構成する。   Specifically, the presser plate 23 includes a presser plate main body 31 for pressing each FET 12 against the heat radiating plate 27, a plurality of support portions 33 for supporting the presser plate main body 31, and a plurality of support members for holding each FET 12. The holding plate 35 includes a plurality of insertion holes 37 through which the connection terminals 16 of the FETs 12 are inserted. In the present embodiment, the presser plate 23 is made of metal, and each support portion 33 and each holding portion 35 are formed integrally with the presser plate body 31. The presser plate main body 31 constitutes a pressing plate, and the presser plate main body 31 and the support portion 33 constitute a pressing portion.

各支持部３３は、押え板本体３１端部から駆動回路基板２１側に向かって延設された支持板３８を備え、支持板３８の先端には固定板３９が設けられている。そして、各固定板３９には、駆動回路基板２１側に向かって立設された位置決め突起４０、又は螺子用孔４２の少なくとも一方が形成されている。   Each support portion 33 includes a support plate 38 extending from the end portion of the presser plate main body 31 toward the drive circuit board 21, and a fixing plate 39 is provided at the tip of the support plate 38. Each fixing plate 39 is formed with at least one of a positioning protrusion 40 or a screw hole 42 erected toward the drive circuit board 21 side.

本実施形態では、駆動回路基板２１には、各ＦＥＴ１２を駆動回路１４に接続するための取付孔４５、駆動回路基板２１と放熱板２７とを固定するための螺子用孔４６、及び複数の位置決め孔４７が形成されており、押え板２３の各位置決め突起４０は、対応する各位置決め孔４７に挿入される。   In the present embodiment, the drive circuit board 21 has an attachment hole 45 for connecting each FET 12 to the drive circuit 14, a screw hole 46 for fixing the drive circuit board 21 and the heat radiating plate 27, and a plurality of positioning positions. Holes 47 are formed, and the positioning protrusions 40 of the presser plate 23 are inserted into the corresponding positioning holes 47.

尚、本実施形態の押え板２３は４つの支持部３３ａ〜３３ｄを有しており、押え板本体３１の対角位置に配設された２つの支持部３３ａ，３３ｂは螺子用孔４２ａ，４２ｂを備え、その他の支持部３３ｃ，３３ｄは位置決め突起４０ｃ，４０ｄを備えている。そして、駆動回路基板２１は、支持部３３ａ，３３ｂに対応する螺子用孔４６ａ，４６ｂ、及び支持部３３ｃ，３３ｄに対応する位置決め孔４７ｃ，４７ｄを備え、各位置決め突起４０ｃ，４０ｄは、それぞれ対応する位置決め孔４７ｃ，４７ｄに挿入される。   The presser plate 23 of the present embodiment has four support portions 33a to 33d, and the two support portions 33a and 33b disposed at the diagonal positions of the presser plate body 31 are screw holes 42a and 42b. The other support portions 33c and 33d include positioning protrusions 40c and 40d. The drive circuit board 21 includes screw holes 46a and 46b corresponding to the support portions 33a and 33b, and positioning holes 47c and 47d corresponding to the support portions 33c and 33d, and the positioning protrusions 40c and 40d correspond respectively. Are inserted into the positioning holes 47c and 47d.

そして、押え板２３は、押え板本体３１が各支持部３３に支持されることにより、同押え板本体３１が駆動回路基板２１と離間した位置に配置された状態で駆動回路基板２１に組み付けられる。   The presser plate 23 is assembled to the drive circuit board 21 in a state where the presser plate body 31 is disposed at a position separated from the drive circuit board 21 by the support plate body 31 being supported by the respective support portions 33. .

また、押え板２３は、その各位置決め突起４０が駆動回路基板２１の各位置決め孔４７に挿入された場合に、その各挿通孔３７と駆動回路基板２１の各取付孔４５との位置、及びその各螺子用孔４２と駆動回路基板２１の各螺子用孔４６との位置が一致するように形成されている。そして、各ＦＥＴ１２は、その接続端子１６が挿通孔３７を介して駆動回路基板２１の取付孔４５に挿入されることにより駆動回路基板２１に組み付けられる。   In addition, when the positioning projections 40 are inserted into the positioning holes 47 of the drive circuit board 21, the presser plate 23 has positions of the insertion holes 37 and the mounting holes 45 of the drive circuit board 21, and Each screw hole 42 and each screw hole 46 of the drive circuit board 21 are formed so as to coincide with each other. Each FET 12 is assembled to the drive circuit board 21 by inserting the connection terminal 16 into the mounting hole 45 of the drive circuit board 21 through the insertion hole 37.

本実施形態では、各保持部３５は、押え板本体３１から駆動回路基板２１の反対側に向かって立設された一対の保持突起３５ａ，３５ｂにより構成され、各保持突起３５ａ，３５ｂは、各ＦＥＴ１２の接続端子１６を取付孔４５に挿入した際にＦＥＴ本体４８が配置される位置に対応して形成されている。そして、各ＦＥＴ１２は、ＦＥＴ本体４８が各保持突起３５ａ，３５ｂに挟持されることにより、その接続端子１６が取付孔４５に挿入された状態で押え板２３に保持される。   In the present embodiment, each holding portion 35 is configured by a pair of holding projections 35a and 35b that are erected from the presser plate body 31 toward the opposite side of the drive circuit board 21, and each holding projection 35a and 35b When the connection terminal 16 of the FET 12 is inserted into the mounting hole 45, it is formed corresponding to the position where the FET body 48 is disposed. Each FET 12 is held by the holding plate 23 in a state where the connection terminal 16 is inserted into the mounting hole 45 when the FET main body 48 is sandwiched between the holding protrusions 35a and 35b.

そして、駆動回路基板２１は、その各螺子用孔４６、押え板２３の各螺子用孔４２、及び支柱２５に形成された貫通孔５０に螺子５１を挿通し、放熱板２７に形成された螺子穴５２にこの螺子５１を螺合することにより、各ＦＥＴ１２が押え板２３に保持された状態で放熱板２７に固定される。尚、本実施形態では、各支柱２５及び螺子５１が固定部材を構成する。   Then, the drive circuit board 21 is inserted into the screw holes 46, the screw holes 42 of the holding plate 23, and the through holes 50 formed in the support column 25, and the screws formed in the heat radiating plate 27. By screwing the screw 51 into the hole 52, each FET 12 is fixed to the heat radiating plate 27 while being held by the holding plate 23. In this embodiment, each support column 25 and screw 51 constitute a fixing member.

ここで、図４に示すように、押え板２３は、各支持部３３の駆動回路基板２１との当接面３９ａから押え板本体３１の各ＦＥＴ側の面、即ち押圧面３１ａまでの距離Ｄ１とＦＥＴ本体４８の厚みＤ２との和が、各固定板３９の厚みＤ３と支柱２５の固定軸方向の長さＤ４との和よりも大きくなるように形成されている。   Here, as shown in FIG. 4, the pressing plate 23 is a distance D1 from the contact surface 39a of each support portion 33 to the drive circuit board 21 to the surface of each pressing plate body 31 on the side of each FET, that is, the pressing surface 31a. And the thickness D2 of the FET main body 48 are formed to be larger than the sum of the thickness D3 of each fixing plate 39 and the length D4 of the support column 25 in the fixed axis direction.

つまり、押え板２３は、その当接面３９ａから押圧面３１ａまでの距離Ｄ１とＦＥＴ本体４８の厚みＤ２の和が、駆動回路基板２１と放熱板２７とが固定された状態における駆動回路基板２１と放熱板２７との距離Ｄ０（各支持板３８との接触面からＦＥＴ本体４８との接触面までの距離）よりも大きくなるように形成されている。   In other words, the holding plate 23 has the sum of the distance D1 from the contact surface 39a to the pressing surface 31a and the thickness D2 of the FET main body 48 so that the driving circuit substrate 21 and the heat radiating plate 27 are fixed. And the heat radiating plate 27 are formed so as to be larger than the distance D0 (the distance from the contact surface with each support plate 38 to the contact surface with the FET main body 48).

従って、各ＦＥＴ１２は、駆動回路基板２１と放熱板２７とが固定されることにより、ＦＥＴ本体４８が押え板本体３１に押し付けられ（押圧面３１ａに押圧され）、その放熱面４８ａが放熱板２７と密着することにより放熱板２７と伝熱可能に接続される。そして、各ＦＥＴ１２は、駆動回路基板２１の取付孔４５に挿入された接続端子１６がハンダ付けされることにより、駆動回路１４に接続される。   Therefore, each FET 12 is fixed to the drive circuit board 21 and the heat dissipation plate 27, whereby the FET main body 48 is pressed against the presser plate main body 31 (pressed against the pressing surface 31 a), and the heat dissipation surface 48 a is the heat dissipation plate 27. Is closely connected to the heat radiating plate 27. Each FET 12 is connected to the drive circuit 14 by soldering the connection terminal 16 inserted into the mounting hole 45 of the drive circuit board 21.

尚、本実施形態では、図３に示すように、各ＦＥＴ１２と放熱板２７の間には、絶縁部材を兼ねる放熱シート５３が配設されており、各ＦＥＴ１２は、この放熱シート５３を介して放熱板２７と伝熱可能に接続されている。また、各支柱２５及び螺子５１は、金属にて形成されており、各ＦＥＴ１２が発する熱は、ＦＥＴ本体４８の押え板本体３１に押圧される側の被押圧面４８ｂからも押え板２３、各支柱２５及び螺子５１を介して放熱板２７に伝達される。   In the present embodiment, as shown in FIG. 3, a heat radiating sheet 53 also serving as an insulating member is disposed between each FET 12 and the heat radiating plate 27, and each FET 12 is interposed via the heat radiating sheet 53. It is connected to the heat radiating plate 27 so that heat can be transferred. Further, each support column 25 and screw 51 are made of metal, and the heat generated by each FET 12 is transmitted from the pressed surface 48b of the FET main body 48 on the side pressed by the press plate main body 31 to The heat is transmitted to the heat radiating plate 27 through the support column 25 and the screw 51.

また、図１に示すように、本実施形態のウォータポンプ１においては、電力供給装置４は、その放熱板２７の放熱面２７ａが、ポンプケーシング５５内に形成された冷却流路５６内に面するよう同ポンプケーシング５５に装着される。そして、各ＦＥＴ１２が発する熱は、放熱面２７ａに接触する液体を冷媒として、電力供給装置４が配設されるポンプカバー５８の外部に放出される構成となっている。   As shown in FIG. 1, in the water pump 1 of the present embodiment, the power supply device 4 has a heat radiating surface 27 a of the heat radiating plate 27 in a cooling channel 56 formed in the pump casing 55. It is attached to the pump casing 55 to do this. The heat generated by each FET 12 is discharged to the outside of the pump cover 58 in which the power supply device 4 is disposed, using the liquid in contact with the heat radiation surface 27a as a refrigerant.

以上、本実施形態によれば、以下のような特徴を得ることができる。
（１）電力供給装置４は、駆動回路基板２１と各ＦＥＴ１２との間に介在される押え板２３とを備える。押え板２３は、駆動回路基板２１側に向かって突設された複数の支持部３３と、各ＦＥＴ１２を保持するための複数の保持部３５とを備え、各支持部３３に支持されることにより押え板本体３１が駆動回路基板２１と離間した位置に配置された状態で駆動回路基板２１に組み付けられる。そして、押え板２３に各ＦＥＴ１２が保持された状態で、駆動回路基板２１と放熱板２７とが固定されることにより、各ＦＥＴ１２は、押え板２３に押し付けられて放熱板２７と密着し伝熱可能に接続される。 As described above, according to the present embodiment, the following features can be obtained.
(1) The power supply device 4 includes a pressing plate 23 interposed between the drive circuit board 21 and each FET 12. The holding plate 23 includes a plurality of support portions 33 projecting toward the drive circuit board 21 and a plurality of holding portions 35 for holding each FET 12, and is supported by each support portion 33. The presser plate body 31 is assembled to the drive circuit board 21 in a state where the presser plate body 31 is disposed at a position separated from the drive circuit board 21. Then, the drive circuit board 21 and the heat radiating plate 27 are fixed in a state where each FET 12 is held on the presser plate 23, so that each FET 12 is pressed against the presser plate 23 and is in close contact with the heat radiating plate 27. Connected as possible.

このような構成とすれば、各ＦＥＴ１２を一つづつ放熱板２７に螺子止めする工程を省略することができるとともに、各ＦＥＴ１２の全ての接続端子１６を一括で駆動回路基板２１の取付孔４５に挿入する必要がなくなるので、容易に組立てができる。   With such a configuration, the step of screwing each FET 12 to the heat dissipation plate 27 one by one can be omitted, and all the connection terminals 16 of each FET 12 can be collectively attached to the mounting holes 45 of the drive circuit board 21. Since it is not necessary to insert, it can be assembled easily.

また、各ＦＥＴ１２の螺子止め工程を省略することにより、放熱板２７への各ＦＥＴ１２固定用の螺子穴形成工程、及び放熱シート５３への螺子用孔を形成する工程が不要となるので、加工コストの低減を図ることができるとともに、各螺子穴と螺子用孔との位置決め工程が不要になるので、更に容易に組立てができる。   Further, by omitting the screwing process of each FET 12, the process of forming a screw hole for fixing each FET 12 to the heat radiating plate 27 and the process of forming a screw hole to the heat radiating sheet 53 are not required. Can be reduced, and the positioning step of each screw hole and screw hole is not required, so that the assembly can be further facilitated.

更に、各ＦＥＴ１２が放熱板２７に固定されていないので、各ＦＥＴ１２の接続端子１６に施されたハンダを除去しなくとも、駆動回路基板２１を放熱板２７から外すことができる。従って、組立て後であっても容易にメンテナンスを行うことができる。   Furthermore, since each FET 12 is not fixed to the heat sink 27, the drive circuit board 21 can be removed from the heat sink 27 without removing the solder applied to the connection terminal 16 of each FET 12. Therefore, maintenance can be easily performed even after assembly.

（２）押え板２３の各支持部３３には、駆動回路基板２１の各位置決め孔４７に挿入される位置決め突起４０、又は螺子用孔４２の少なくとも一方が形成される。そして、押え板２３は、各位置決め突起４０が対応する各位置決め孔４７に挿入された場合に、その各挿通孔３７と駆動回路基板２１の各取付孔４５との位置、及びその各螺子用孔４２と駆動回路基板２１の各螺子用孔４６との位置が一致するように形成される。   (2) At each support portion 33 of the holding plate 23, at least one of a positioning projection 40 inserted into each positioning hole 47 of the drive circuit board 21 or a screw hole 42 is formed. When the positioning projections 40 are inserted into the corresponding positioning holes 47, the presser plate 23 is positioned at the insertion holes 37 and the mounting holes 45 of the drive circuit board 21 and the screw holes. 42 and the screw holes 46 of the drive circuit board 21 are formed so as to coincide with each other.

このような構成とすれば、押え板２３の各位置決め突起４０を駆動回路基板２１の各位置決め孔４７に挿入するだけで、押え板２３と駆動回路基板２１との位置決めがなされ、押え板２３の各挿通孔３７と駆動回路基板２１の各取付孔４５、及びその各螺子用孔４２と駆動回路基板２１の各螺子用孔４６とが一致する。従って、駆動回路基板２１への押え板２３の組み付け、及び各ＦＥＴ１２の組み付けが容易になり、その結果、容易に組立てができる。   With this configuration, the presser plate 23 and the drive circuit board 21 are positioned by simply inserting the positioning protrusions 40 of the presser plate 23 into the respective positioning holes 47 of the drive circuit board 21. The insertion holes 37 and the mounting holes 45 of the drive circuit board 21, and the screw holes 42 and the screw holes 46 of the drive circuit board 21 coincide with each other. Therefore, the press plate 23 and the FET 12 can be easily assembled to the drive circuit board 21 and, as a result, can be easily assembled.

（３）各保持部３５は、押え板本体３１から駆動回路基板２１の反対側に向かって立設された一対の保持突起３５ａ，３５ｂにより構成され、各保持突起３５ａ，３５ｂは、各ＦＥＴ１２の接続端子１６を取付孔４５に挿入した際にＦＥＴ本体４８が配置される位置に対応して形成されている。そして、各ＦＥＴ１２は、ＦＥＴ本体４８が各保持突起３５ａ，３５ｂに挟持されることにより、その接続端子１６が取付孔４５に挿入された状態で押え板２３に保持される。   (3) Each holding portion 35 is constituted by a pair of holding projections 35a and 35b erected from the pressing plate main body 31 toward the opposite side of the drive circuit board 21. The holding projections 35a and 35b When the connection terminal 16 is inserted into the mounting hole 45, the FET terminal 48 is formed corresponding to the position where the FET body 48 is disposed. Each FET 12 is held by the holding plate 23 in a state where the connection terminal 16 is inserted into the mounting hole 45 when the FET main body 48 is sandwiched between the holding protrusions 35a and 35b.

このような構成とすれば、各ＦＥＴ１２の接続端子１６のハンダ付けを行うことなく、各接続端子１６が取付孔４５に挿入された状態にて駆動回路基板２１と放熱板２７とを固定することが可能になるので、接続端子１６のハンダ付けよりも先に各ＦＥＴ１２と放熱板２７とを密着させることができる。従って、ハンダ付け後に各ＦＥＴ１２と放熱板２７とを密着させる構成のように、各ハンダ付け部に押え板２３による押し付け力が加わることがないので、ハンダの剥離、或いは駆動回路基板２１の変形や歪み等を防止することができる。その結果、組立て工程に起因する不具合の発生を低減することができる。   With such a configuration, the drive circuit board 21 and the heat dissipation plate 27 are fixed in a state where each connection terminal 16 is inserted into the mounting hole 45 without soldering the connection terminal 16 of each FET 12. Therefore, each FET 12 and the heat radiating plate 27 can be brought into close contact with each other before the connection terminal 16 is soldered. Therefore, unlike the configuration in which each FET 12 and the heat dissipation plate 27 are brought into close contact with each other after soldering, the pressing force by the presser plate 23 is not applied to each soldering portion. Distortion and the like can be prevented. As a result, it is possible to reduce the occurrence of problems caused by the assembly process.

（４）押え板２３、各支柱２５及び螺子５１は、金属にて形成される。従って、各ＦＥＴ１２が発する熱は、ＦＥＴ本体４８の押え板本体３１に押圧される側の被押圧面４８ｂからも押え板２３、各支柱２５及び螺子５１を介して放熱板２７に伝達される。その結果、放熱性能の向上を図ることができる。   (4) The presser plate 23, each support column 25, and the screw 51 are formed of metal. Accordingly, the heat generated by each FET 12 is also transmitted to the heat radiating plate 27 from the pressed surface 48 b of the FET main body 48 on the side pressed against the presser plate main body 31 through the presser plate 23, the support columns 25, and the screws 51. As a result, the heat dissipation performance can be improved.

なお、上記各実施形態は以下のように変更してもよい。
・本実施形態では、ウォータポンプ（のブラシレスモータ）の電力供給装置に具体化したが、パワーディストリビュータ等、その他の電力供給装置に具体化してもよい。 In addition, you may change each said embodiment as follows.
In the present embodiment, the power supply device for the water pump (brushless motor) is embodied. However, the power supply device may be embodied in another power supply device such as a power distributor.

・本実施形態では、電力半導体素子としてパワーＭＯＳＦＥＴを用いたが、パワートランジスタ等、その他のスイッチング素子を用いてもよい。
・本実施形態では、押え板２３の各位置決め突起４０を駆動回路基板２１の各位置決め孔４７に挿入することとしたが、例えば、位置決め孔４７に代えて切欠きを形成する等、その他の位置決め手段を採用する構成としてもよい。 In the present embodiment, the power MOSFET is used as the power semiconductor element, but other switching elements such as a power transistor may be used.
In the present embodiment, the positioning protrusions 40 of the presser plate 23 are inserted into the positioning holes 47 of the drive circuit board 21, but other positioning such as forming a notch in place of the positioning hole 47, for example. It is good also as composition which adopts a means.

・本実施形態では、押え板２３、各支柱２５及び螺子５１は、金属にて形成されることとしたが、金属以外の熱伝材料にて形成してもよい。
・また、本実施形態では、各支柱２５及び螺子５１により固定部材を構成し、駆動回路基板２１と放熱板２７と固定は、螺子５１により螺子止め固定することとしたが、固定方法は、螺子止め以外でもよく、各支柱２５及び螺子５１以外の固定部材を使用する構成としてもよい。 In the present embodiment, the presser plate 23, each support column 25, and the screw 51 are formed of metal, but may be formed of a heat transfer material other than metal.
Further, in this embodiment, the fixing members are constituted by the support columns 25 and the screws 51, and the driving circuit board 21 and the heat radiating plate 27 are fixed by screwing with the screws 51. Other than the stopper, a fixing member other than each support column 25 and the screw 51 may be used.

・本実施形態では、押え板本体３１には、各ＦＥＴ１２の接続端子１６が挿通される複数の挿通孔３７が形成され、各ＦＥＴ１２は、その接続端子１６が挿通孔３７を介して駆動回路基板２１の取付孔４５に挿入されることした。しかし、これに限らず、各挿通孔３７に代えて、全ての各接続端子が挿通可能な長孔を形成してもよく、押え板本体３１自体を切り欠いてもよい。つまり、各ＦＥＴ１２の接続端子１６が駆動回路基板２１の取付孔４５に挿入可能であればどのような構成であってもよい。   In the present embodiment, the presser plate body 31 is formed with a plurality of insertion holes 37 through which the connection terminals 16 of the FETs 12 are inserted, and each FET 12 is connected to the drive circuit board via the insertion holes 37. 21 was inserted into the attachment hole 45 of the 21. However, the present invention is not limited to this, and instead of the insertion holes 37, long holes through which all the connection terminals can be inserted may be formed, or the presser plate body 31 itself may be cut away. That is, any configuration may be used as long as the connection terminal 16 of each FET 12 can be inserted into the mounting hole 45 of the drive circuit board 21.

本実施形態のウォータポンプの断面図。Sectional drawing of the water pump of this embodiment. 本実施形態の電力供給装置の回路構成図。The circuit block diagram of the electric power supply apparatus of this embodiment. 本実施形態の電力供給装置の分解斜視図。The disassembled perspective view of the electric power supply apparatus of this embodiment. 本実施形態の電力供給装置の断面図。Sectional drawing of the electric power supply apparatus of this embodiment. 従来の電力供給装置の分解斜視図。The exploded perspective view of the conventional electric power supply apparatus.

符号の説明Explanation of symbols

４，６０…電力供給装置、１２，１２ａ〜１２ｃ，６１…パワーＭＯＳＦＥＴ、１４…駆動回路、１６，１６ａ〜１６ｃ，６６…接続端子、２１，６３…駆動回路基板、２１ａ，６３ａ…実装面、２３…押え板、２５，６８…支柱、２７，６４…放熱板、３１…押え板本体、３１ａ…押圧面、３３，３３ａ〜３３ｄ…支持部、３５…保持部、３７…挿通孔、３８…支持板、３９…固定板、３９ａ…当接面、４０，４０ｃ，４０ｄ…位置決め突起、４２，４２ａ，４２ｂ，４６，４６ａ，４６ｂ…螺子用孔、４５，６７…取付孔、４７，４７ｃ，４７ｄ…位置決め孔、５１…螺子、６９…金属螺子、Ｄ０，Ｄ１…距離、Ｄ２，Ｄ３…厚み、Ｄ４…長さ。   4, 60 ... power supply device, 12, 12a to 12c, 61 ... power MOSFET, 14 ... drive circuit, 16, 16a-16c, 66 ... connection terminal, 21, 63 ... drive circuit board, 21a, 63a ... mounting surface, DESCRIPTION OF SYMBOLS 23 ... Holding plate, 25, 68 ... Support | pillar, 27, 64 ... Radiating plate, 31 ... Holding plate main body, 31a ... Pressing surface, 33, 33a-33d ... Supporting part, 35 ... Holding part, 37 ... Insertion hole, 38 ... Support plate 39 ... fixing plate 39a ... contact surface 40, 40c, 40d ... positioning projection 42,42a, 42b, 46,46a, 46b ... screw hole 45,67 ... mounting hole 47,47c, 47d: positioning hole, 51: screw, 69: metal screw, D0, D1: distance, D2, D3: thickness, D4: length.

Claims (12)

複数の電力半導体素子と、該各電力半導体素子の通電制御を行う駆動回路が実装される駆動回路基板と、前記各電力半導体素子の発熱を外部に放出するための放熱部材とを備えた電力供給装置であって、
前記駆動回路基板と前記各電力半導体素子との間に介在され、前記各電力半導体素子を前記放熱部材に押し付ける押圧部と前記各電力半導体素子を保持する複数の保持部とを有する構造部材を備え、
前記駆動回路基板は前記放熱部材に固定され、前記各電力半導体素子は、前記放熱部材と伝熱可能に接続されること、を特徴とする電力供給装置。 A power supply comprising a plurality of power semiconductor elements, a drive circuit board on which a drive circuit for controlling energization of each power semiconductor element is mounted, and a heat dissipation member for releasing heat generated by each power semiconductor element to the outside A device,
A structural member that is interposed between the drive circuit board and the power semiconductor elements and includes a pressing portion that presses the power semiconductor elements against the heat dissipation member and a plurality of holding portions that hold the power semiconductor elements; ,
The drive circuit board is fixed to the heat radiating member, and each power semiconductor element is connected to the heat radiating member so as to be able to transfer heat. 請求項１に記載の電力供給装置において、
前記押圧部は、前記各電力半導体素子を押圧する押圧面を有する押圧板と、前記駆動回路基板に対して前記押圧板を支持する支持部とを備え、
前記押圧部は、前記駆動回路基板との当接面から前記押圧面までの距離と前記各電力半導体素子の厚みの和が、固定状態における前記駆動回路基板と前記放熱部材との距離よりも大きく設定されていること、を特徴とする電力供給装置。 The power supply device according to claim 1,
The pressing portion includes a pressing plate having a pressing surface that presses each of the power semiconductor elements, and a support portion that supports the pressing plate with respect to the drive circuit board,
In the pressing portion, the sum of the distance from the contact surface with the driving circuit board to the pressing surface and the thickness of each power semiconductor element is larger than the distance between the driving circuit board and the heat dissipation member in a fixed state. A power supply device characterized by being set. 請求項１又は請求項２に記載の電力供給装置において、
前記駆動回路基板には、前記各電力半導体素子を前記駆動回路に接続するための複数の取付孔が形成され、
前記各保持部は、前記各取付孔に接続端子が挿入された前記各電力半導体素子の位置に対応して形成されること、を特徴とする電力供給装置。 In the electric power supply apparatus of Claim 1 or Claim 2,
A plurality of mounting holes for connecting each power semiconductor element to the drive circuit are formed in the drive circuit board,
Each said holding | maintenance part is formed corresponding to the position of each said power semiconductor element by which the connection terminal was inserted in each said attachment hole, The electric power supply apparatus characterized by the above-mentioned. 請求項１〜請求項３のうちの何れか一項に記載の電力供給装置において、
前記駆動回路基板と前記放熱部材と固定するための固定部材を備え、
前記構造部材及び固定部材は、熱伝材料にて形成され、
前記構造部材は、前記固定部材を介して伝熱可能に前記放熱部材と接続されること、
を特徴とする電力供給装置。 In the electric power supply apparatus as described in any one of Claims 1-3,
A fixing member for fixing the drive circuit board and the heat dissipation member;
The structural member and the fixing member are formed of a heat transfer material,
The structural member is connected to the heat radiating member so as to be capable of transferring heat through the fixing member,
A power supply device characterized by the above. 複数の電力半導体素子と該各電力半導体素子の通電制御を行う駆動回路が実装される駆動回路基板との間に介在される構造体であって、
前記各電力半導体素子を前記各電力半導体素子の発熱を外部に放出するための放熱部材に押し付ける押圧部と、前記各電力半導体素子を保持する複数の保持部とを備え、
前記駆動回路基板と前記放熱部材とが固定されることにより、前記各電力半導体素子を前記放熱部材と伝熱可能に接続すること、を特徴とする構造体。 A structure that is interposed between a plurality of power semiconductor elements and a drive circuit board on which a drive circuit that controls energization of each power semiconductor element is mounted,
A pressing portion that presses each power semiconductor element against a heat dissipating member for releasing heat generated by each power semiconductor element to the outside, and a plurality of holding portions that hold the power semiconductor elements.
The drive circuit board and the heat dissipating member are fixed to connect the power semiconductor elements to the heat dissipating member so that heat can be transferred. 請求項５に記載の構造体において、
前記押圧部は、前記各電力半導体素子を押圧する押圧面を有する押圧板と、前記駆動回路基板に対して前記押圧板を支持する支持部とを備え、
前記押圧部は、前記駆動回路基板との当接面から前記押圧面までの距離と前記各電力半導体素子の厚みの和が、固定状態における前記駆動回路基板と前記放熱部材との距離よりも大きく設定されていること、を特徴とする構造体。 The structure according to claim 5, wherein
The pressing portion includes a pressing plate having a pressing surface that presses each of the power semiconductor elements, and a support portion that supports the pressing plate with respect to the drive circuit board,
In the pressing portion, the sum of the distance from the contact surface with the driving circuit board to the pressing surface and the thickness of each power semiconductor element is larger than the distance between the driving circuit board and the heat dissipation member in a fixed state. A structure characterized by being set. 請求項５又は請求項６に記載の構造体において、
前記各保持部は、前記駆動回路基板に形成された前記各電力半導体素子を前記駆動回路に接続するための複数の取付孔に接続端子が挿入された前記各電力半導体素子の位置に対応して形成されること、を特徴とする構造体。 In the structure according to claim 5 or 6,
Each holding portion corresponds to the position of each power semiconductor element in which connection terminals are inserted into a plurality of mounting holes for connecting each power semiconductor element formed on the drive circuit board to the drive circuit. A structure characterized by being formed. 請求項７に記載の構造体において、
前記各接続端子が挿通される複数の挿通孔と、前記固定するための螺子が挿通される複数の貫通孔と、前記駆動回路基板に形成された位置決め孔に挿入される位置決め突起とを備え、
前記位置決め突起が挿入された場合に、前記各挿通孔と前記各取付孔との位置、及び前記各貫通孔と前記駆動回路基板に形成された複数の貫通孔との位置が一致するように形成されること、を特徴とする構造体。 The structure according to claim 7, wherein
A plurality of insertion holes through which the connection terminals are inserted; a plurality of through holes through which the fixing screws are inserted; and positioning protrusions to be inserted into positioning holes formed in the drive circuit board;
When the positioning protrusions are inserted, the positions of the insertion holes and the mounting holes and the positions of the through holes and the plurality of through holes formed in the drive circuit board are matched. A structure characterized by being made. 複数の電力半導体素子を、該各電力半導体素子の通電制御を行う駆動回路が実装される駆動回路基板から離間した位置に配置するとともに、前記各電力半導体素子の発熱を外部に放出するための放熱部材に伝熱可能に接続する電力半導体素子の放熱組立て構造であって、
前記駆動回路基板と前記各電力半導体素子との間に介在され、前記各電力半導体素子を前記放熱部材に押し付ける押圧部と前記各電力半導体素子を保持する複数の保持部とを有する構造部材を備え、
前記駆動回路基板は前記放熱部材に固定され、前記各電力半導体素子は、前記放熱部材と伝熱可能に接続されること、を特徴とする電力半導体素子の放熱組立て構造。 A plurality of power semiconductor elements are arranged at positions separated from a drive circuit board on which a drive circuit for controlling energization of each power semiconductor element is mounted, and heat dissipation for releasing heat generated by each power semiconductor element to the outside A heat dissipating assembly structure of a power semiconductor element connected to a member so that heat can be transferred,
A structural member that is interposed between the drive circuit board and the power semiconductor elements and includes a pressing portion that presses the power semiconductor elements against the heat dissipation member and a plurality of holding portions that hold the power semiconductor elements; ,
The drive circuit board is fixed to the heat dissipating member, and each power semiconductor element is connected to the heat dissipating member so as to be able to transfer heat. 請求項９に記載の電力半導体素子の放熱組立て構造において、
前記押圧部は、前記各電力半導体素子を押圧する押圧面を有する押圧板と、前記駆動回路基板に対して前記押圧板を支持する支持部とを備え、
前記押圧部は、前記駆動回路基板との当接面から前記押圧面までの距離と前記各電力半導体素子の厚みの和が、固定状態における前記駆動回路基板と前記放熱部材との距離よりも大きく設定されていること、を特徴とする電力半導体素子の放熱組立て構造。 In the heat dissipation assembly structure of the power semiconductor element according to claim 9,
The pressing portion includes a pressing plate having a pressing surface that presses each of the power semiconductor elements, and a support portion that supports the pressing plate with respect to the drive circuit board,
In the pressing portion, the sum of the distance from the contact surface with the driving circuit board to the pressing surface and the thickness of each power semiconductor element is larger than the distance between the driving circuit board and the heat dissipation member in a fixed state. A heat dissipating assembly structure of a power semiconductor element, characterized in that it is set. 請求項９又は請求項１０に記載の電力半導体素子の放熱組立て構造において、
前記駆動回路基板には、前記各電力半導体素子を前記駆動回路に接続するための複数の取付孔が形成され、
前記各保持部は、前記各取付孔に接続端子が挿入された前記各電力半導体素子の位置に対応して形成されること、を特徴とする電力半導体素子の放熱組立て構造。 In the heat radiation assembly structure of the power semiconductor element according to claim 9 or 10,
The drive circuit board is formed with a plurality of mounting holes for connecting the power semiconductor elements to the drive circuit,
Each holding part is formed corresponding to the position of each power semiconductor element in which a connection terminal is inserted into each mounting hole. 請求項９〜請求項１１のうちの何れか一項に記載の電力半導体素子の放熱組立て構造において、
前記駆動回路基板と前記放熱部材と固定するための固定部材を備え、
前記構造部材及び固定部材は、熱伝材料にて形成され、
前記構造部材は、前記固定部材を介して伝熱可能に前記放熱部材と接続されること、
を特徴とする電力半導体素子の放熱組立て構造。 In the heat dissipation assembly structure of the power semiconductor element according to any one of claims 9 to 11,
A fixing member for fixing the drive circuit board and the heat dissipation member;
The structural member and the fixing member are formed of a heat transfer material,
The structural member is connected to the heat radiating member so as to be capable of transferring heat through the fixing member,
A heat-dissipating assembly structure for a power semiconductor element.

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