JP2005101226A - Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method - Google Patents

Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method Download PDF

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JP2005101226A
JP2005101226A JP2003332238A JP2003332238A JP2005101226A JP 2005101226 A JP2005101226 A JP 2005101226A JP 2003332238 A JP2003332238 A JP 2003332238A JP 2003332238 A JP2003332238 A JP 2003332238A JP 2005101226 A JP2005101226 A JP 2005101226A
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substrate
holding
stage
gas
substrate holding
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JP2005101226A5 (en
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Takahisa Tazoe
貴久 田添
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Hoya Corp
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Hoya Corp
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Priority to TW093126538A priority patent/TW200512795A/en
Priority to KR1020040076185A priority patent/KR100843413B1/en
Publication of JP2005101226A publication Critical patent/JP2005101226A/en
Publication of JP2005101226A5 publication Critical patent/JP2005101226A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method which can reduce the distortion or warping of a substrate by its own weight by using air blow, can efficiently mount and demount the substrate, and can cope with substrates of different sizes. <P>SOLUTION: The substrate holding device 1 holds a substrate 10 on a tabular stage 2, and has, above the stage 2, convex portions 21a, 21b, and 21c, each having a placement face 22, and a discharge hole 25 for blowing out a gas against the bottom face of the substrate 10. The convex portions 21a and 21b have each a suction hole 23 for sucking and holding the substrate 10, and the gas blown against the bottom face of the substrate 10 is exhausted horizontally. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、基板保持装置，基板処理装置，基板検査装置及び基板保持方法に関し、特に、エアーブローを利用して、基板の自重による歪み・撓みを低減することができ、また、好適に基板の取付け・取外しを行なうことのできる基板保持装置，基板処理装置，基板検査装置及び基板保持方法に関する。   The present invention relates to a substrate holding apparatus, a substrate processing apparatus, a substrate inspection apparatus, and a substrate holding method, and in particular, by using an air blow, distortion and deflection due to the weight of the substrate can be reduced. The present invention relates to a substrate holding apparatus, a substrate processing apparatus, a substrate inspection apparatus, and a substrate holding method that can be attached and detached.

フォトマスクに関連する分野、たとえば、描画・露光工程、フラットネス測定、座標測定等においては、基板をステージに保持したときの僅かな歪みであっても、位置ずれ不良や測定精度不良を引き起こすことが指摘されている。
すなわち、所定の設計パターンを電子線又はレーザーを用いて基板に描画する描画工程や、所定のマスクを用いて基板に露光を行なう露光工程においては、ステージに保持された基板に歪みがあると、パターンに位置ずれが発生する。また、基板のフラットネス測定や座標測定においては、ステージに保持された基板に歪みがあると、測定精度が低下する。
このため、従来、歪みを発生させずに基板を保持する基板保持装置が様々開発されてきた。 In fields related to photomasks, such as the drawing / exposure process, flatness measurement, coordinate measurement, etc., even a slight distortion when the substrate is held on the stage can cause misalignment and poor measurement accuracy. Has been pointed out.
That is, in a drawing process of drawing a predetermined design pattern on a substrate using an electron beam or a laser and an exposure process of exposing the substrate using a predetermined mask, if the substrate held on the stage is distorted, Misalignment occurs in the pattern. Further, in the flatness measurement and coordinate measurement of the substrate, if the substrate held on the stage is distorted, the measurement accuracy is lowered.
For this reason, conventionally, various substrate holding devices that hold a substrate without generating distortion have been developed.

たとえば、特許文献１には、プレートチャック本体の一部に一又は二以上の突出部を設け、突出部の上部を基準平面に平行となる平面に形成して一又は二以上の載置面を形成し、これら載置面の全体の面積を、載置面に載置されるフォトマスク基板の面積に比較して小さくし、かつ、載置面を、板状体の被載置面に対して摩擦係数の低い低摩擦部材で構成するとともに、載置面の少なくとも一つに真空吸着孔を設けたことを特徴とするフォトマスク基板保持用プレートチャックの技術が開示されている。
この技術によれば、大型のフォトマスク基板であっても全体的な歪みや部分的な歪みの発生を防止しつつ良好に固定・保持することができる。 For example, in Patent Document 1, one or two or more projecting portions are provided on a part of the plate chuck main body, and the upper portion of the projecting portion is formed in a plane parallel to the reference plane so that one or more mounting surfaces are provided. Forming the entire area of the mounting surface to be smaller than the area of the photomask substrate mounted on the mounting surface, and the mounting surface with respect to the mounting surface of the plate-like body In addition, there is disclosed a photomask substrate holding plate chuck technique characterized by comprising a low friction member having a low friction coefficient and having a vacuum suction hole in at least one of the mounting surfaces.
According to this technique, even a large photomask substrate can be fixed and held satisfactorily while preventing the occurrence of overall distortion or partial distortion.

また、特許文献２には、基板の一方の面に負荷を与える補正手段を備え、基板の表面形状を補正し、基板を支持部で支持することによりその姿勢を一意的に定めて保持するステージの技術が開示されている。
このステージは、基板の一方の面と相対する面との間に差圧を発生させる機構を具備し、基板の接触面の面精度に制約されることなく、基板の姿勢を一意的に定めて基板の変形にともなう位置精度のばらつきを抑制することができる。 Further, Patent Document 2 includes a correction unit that applies a load to one surface of the substrate, corrects the surface shape of the substrate, and supports the substrate by a support unit to uniquely determine and hold the posture. The technology is disclosed.
This stage is equipped with a mechanism that generates a differential pressure between one surface of the substrate and the opposite surface, and uniquely determines the posture of the substrate without being restricted by the surface accuracy of the contact surface of the substrate. Variations in positional accuracy due to the deformation of the substrate can be suppressed.

実開平６−７３７６０号公報（請求項１、図１）Japanese Utility Model Publication No. 6-73760 (Claim 1, FIG. 1) 特開２０００−２２３３８８号公報（請求項３、図１，７）JP 2000-223388 A (Claim 3, FIGS. 1 and 7)

しかしながら、特許文献１に開示されたフォトマスク基板保持用プレートチャックは、基板の被支持面を部分的に支持する構造なので、支持されていない基板の非接触部が自重により撓むことがあった。
また、基板を着脱するための工夫が施されていないので、支持面を大きくすると基板との接触面積が増大し、基板に傷をつける危険性が高くなるといった心配があった。 However, since the photomask substrate holding plate chuck disclosed in Patent Document 1 has a structure that partially supports the supported surface of the substrate, the non-contact portion of the unsupported substrate may be bent by its own weight. .
In addition, since a device for attaching and detaching the substrate is not provided, there is a concern that when the support surface is enlarged, a contact area with the substrate is increased and a risk of damaging the substrate is increased.

さらに、より高いレベルで基板の変形を抑制しようとすると、真空吸着やばねを用いただけの単純な基板保持方法では、基板をステージに保持するだけで基板を変形させてしまうこともあった。
このため、最新のＬＳＩ用マスクの座標測定機では三箇所のピンに基板を載せるだけのフリーな固定方法が用いられている。ただし、このフリーな固定方法は、自重により撓んでしまうような大型基板に適用することができない。 Furthermore, when trying to suppress the deformation of the substrate at a higher level, in a simple substrate holding method using only vacuum suction or a spring, the substrate may be deformed only by holding the substrate on the stage.
For this reason, the latest LSI mask coordinate measuring machine uses a free fixing method in which a substrate is placed on three pins. However, this free fixing method cannot be applied to a large substrate that is bent by its own weight.

また、特許文献２に開示されたステージは、基板の裏面をその周縁部において密封させる構造なので、機密性を保つため複雑かつ大掛かりな構造となってしまうといった問題があった。
さらに、大型マスク用の通常のステージは、異なるサイズに対応できる構造としてあるが、このステージは、一つのサイズの基板にしか対応できず、ステージの共用化を図れないといった問題があった。 Moreover, since the stage disclosed in Patent Document 2 has a structure in which the back surface of the substrate is sealed at the peripheral edge thereof, there is a problem that the structure becomes complicated and large in order to maintain confidentiality.
Furthermore, the normal stage for large masks has a structure that can accommodate different sizes, but this stage can only accommodate a single size substrate, and there is a problem that the stage cannot be shared.

本発明は、上記諸問題を解決すべく、エアーブローを利用して、自重による基板の歪み・撓みを低減することができ、また、好適に基板の取付け・取外しを行なうことができ、さらに、異なるサイズの基板にも対応することの可能な基板保持装置，基板処理装置，基板検査装置及び基板保持方法の提供を目的とする。   In order to solve the above-mentioned problems, the present invention can reduce the distortion / deflection of the substrate due to its own weight by using an air blow, and can suitably attach / remove the substrate, It is an object of the present invention to provide a substrate holding apparatus, a substrate processing apparatus, a substrate inspection apparatus, and a substrate holding method capable of dealing with substrates of different sizes.

この目的を達成するために、本発明の基板保持装置は、基板をステージに保持する基板保持装置であって、前記ステージの上面に、凸部と、前記基板の下面に気体を吹き付けるための吐出孔とを備え、前記凸部が、前記基板を部分的に載置する載置面と前記基板を保持する保持手段を有し、かつ、前記基板の下面に吹き付けられた気体が、水平方向に排気される構成としてある。
このようにすると、基板に下方から気体を吹き付ける（エアーブローする）ことにより、自重による基板の撓みを低減することができる。また、吹き付けた気体を水平方向に排気することにより、基板のサイズに応じた補正手段等を設けなくてもすむので、異なるサイズの基板に対して共用化を図ることができる。
さらに、凸部により基板との接触面積が小さくなり、ステージと基板の間にごみ等の異物が介入して基板が撓むといった不具合を防止することができる。 In order to achieve this object, a substrate holding apparatus according to the present invention is a substrate holding apparatus that holds a substrate on a stage, and includes a projection on the upper surface of the stage and a discharge for blowing gas onto the lower surface of the substrate. And the convex portion has a mounting surface for partially mounting the substrate and a holding means for holding the substrate, and the gas blown to the lower surface of the substrate is in a horizontal direction. It is configured to be exhausted.
If it does in this way, the bending of the board | substrate by dead weight can be reduced by blowing gas on the board | substrate from the downward direction (air blow). Further, by exhausting the blown gas in the horizontal direction, it is not necessary to provide a correction means or the like corresponding to the size of the substrate, so that it is possible to share the substrate with different sizes.
Further, the contact area with the substrate is reduced by the convex portion, and it is possible to prevent a problem that the substrate is bent due to foreign matters such as dust intervening between the stage and the substrate.

また、本発明の基板保持装置は、保持手段を、基板を吸着して保持する吸着孔とした構成としてある。
このようにすると、基板を容易に保持することができる。さらに、基板に気体を吹き付けて基板の撓みを抑制するので、たとえば、大型基板に対しても支持部による三点支持が可能となり、吸着保持を行なってもほぼフリーな保持状態を実現することができる。 Further, the substrate holding apparatus of the present invention is configured such that the holding means is a suction hole that sucks and holds the substrate.
In this way, the substrate can be easily held. Further, since gas is blown onto the substrate to suppress the bending of the substrate, for example, it is possible to support a three-point support by a support portion even for a large substrate, and it is possible to realize a substantially free holding state even if suction holding is performed. it can.

また、本発明の基板保持装置は、前記基板を保持しているときに、前記基板が平坦状になる流量で前記基板の下面に前記吐出孔から前記気体を吹き付け、かつ、前記基板をステージへ取り付けるとき及び／又は前記基板をステージから取り外すとき、前記基板を浮上させる流量で前記基板の下面に前記吐出孔から前記気体を吹き付ける、送風手段を備えた構成としてある。
このように、ステージへの基板の取付け・取外しを行なうとき、基板に気体を吹き付けて浮上させることにより、凸部が基板と擦れて基板が損傷したり発塵したりする危険性を低減することができる。さらに、基板を保持している間、基板に気体を吹き付けて、歪みや撓みをより確実に抑制することができるので、基板を平坦性が高い状態で保持することができる。
ここで、「平坦」及び「平坦状」とは、平坦な状態は勿論のこと、平坦に近い状態、たとえば、基板処理や基板検査において、平坦性が問題とならない程度の歪みや撓みを残している場合をも含む意味である。
なお、基板を保持している間に基板に吹き付ける気体の流量は、基板が浮上せずに、基板の自重が最大限に低減できる圧力を発生させる流量とすることが好ましい。 In the substrate holding device of the present invention, when the substrate is held, the gas is blown from the discharge hole to the lower surface of the substrate at a flow rate at which the substrate becomes flat, and the substrate is moved to the stage. When attaching and / or removing the substrate from the stage, a blower is provided to blow the gas from the discharge holes onto the lower surface of the substrate at a flow rate that causes the substrate to float.
In this way, when attaching / removing the substrate to / from the stage, by blowing gas to the substrate and floating it, the risk of the projections rubbing against the substrate and damaging the substrate or generating dust is reduced. Can do. Furthermore, while holding the substrate, gas can be blown onto the substrate to more reliably suppress distortion and bending, so that the substrate can be held with high flatness.
Here, “flat” and “flat” mean not only a flat state but also a nearly flat state, for example, leaving distortion or deflection to such an extent that flatness does not become a problem in substrate processing or substrate inspection. It also means including the case.
Note that the flow rate of the gas blown to the substrate while holding the substrate is preferably set to a flow rate that generates a pressure at which the weight of the substrate can be reduced to the maximum without the substrate floating.

また、本発明の基板保持装置は、前記吐出孔を複数配設した構成としてある。
このように複数の吐出孔を均等に配設することにより、気体が均等に基板に吹き付けられるため、基板の浮上及び歪みや撓みの抑制を容易に行なうことができる。 Further, the substrate holding device of the present invention has a configuration in which a plurality of the discharge holes are provided.
By arranging the plurality of discharge holes uniformly in this way, the gas is evenly sprayed on the substrate, so that the floating of the substrate and the suppression of distortion and bending can be easily performed.

また、本発明の基板保持装置は、前記ステージと前記基板との間の空間の圧力を測定する圧力計を設けた構成としてある。
このようにすると、圧力計により測定された圧力値にもとづいて、基板の下面に気体を吹き付ける流量を制御することができ最適な気体流量を監視することができるため、基板の浮上及び歪みや撓みの抑制を容易に行なうことができる。 Further, the substrate holding device of the present invention is configured to include a pressure gauge for measuring the pressure in the space between the stage and the substrate.
In this way, the flow rate of blowing gas to the lower surface of the substrate can be controlled based on the pressure value measured by the pressure gauge, and the optimum gas flow rate can be monitored. Can be easily suppressed.

また、本発明の基板保持装置は、前記基板を、マスク用基板，マスクブランク，マスク又はこれらの中間形成物とした構成としてある。
このようにすると、たとえば、液晶表示装置製造用の大型フォトマスク（各辺が３００ｍｍ以上の矩形基板）等の大型基板に対して、歪みや撓みをより確実に抑制することができる。なお、マスクとしては、フォトマスク，Ｘ線マスク，電子線マスク，ＥＵＶ反射型マスクなどが挙げられる。 In the substrate holding device of the present invention, the substrate may be a mask substrate, a mask blank, a mask, or an intermediate product thereof.
If it does in this way, distortion and a bending can be suppressed more reliably with respect to large sized substrates, such as a large sized photomask for manufacturing a liquid crystal display device (rectangular substrate whose each side is 300 mm or more), for example. Examples of the mask include a photomask, an X-ray mask, an electron beam mask, and an EUV reflective mask.

また、本発明の基板処理装置は、請求項１〜６のいずれかに記載の基板保持装置を有する基板処理装置であって、前記基板保持装置によって保持された前記基板の表面に、電子線又はレーザー光を照射する照射手段を有する構成としてある。このようにすると、歪みや撓みをより確実に抑制した基板に対して基板処理を行なうことができる。
すなわち、上記構成の基板保持装置は、平坦度を高精度に維持した状態で基板を保持する必要のあるあらゆる装置に適用が可能である。
この種の基板処理装置としては、例えば、フォトレジストがコーティングされたフォトマスクブランク等の基板を用い、これにレーザー光を照射してパターンを形成するための描画装置又は露光装置が挙げられる。
この他の基板処理装置として、レーザービームを用いて、イオン注入による照射損傷や注入不純物の活性化、及び、多結晶シリコンを再結晶化させることにより単結晶シリコンを作るＳＯＩ（Silicon on Insulator）技術等のアニール処理装置や、半導体基板上に選択的成膜を行なうＣＶＤ処理装置が挙げられる。 Moreover, the substrate processing apparatus of this invention is a substrate processing apparatus which has a substrate holding apparatus in any one of Claims 1-6, Comprising: On the surface of the said board | substrate hold | maintained by the said substrate holding apparatus, an electron beam or It has a configuration having irradiation means for irradiating laser light. If it does in this way, substrate processing can be performed to a substrate which controlled distortion and bending more certainly.
That is, the substrate holding device having the above-described configuration can be applied to any device that needs to hold a substrate while maintaining flatness with high accuracy.
Examples of this type of substrate processing apparatus include a drawing apparatus or an exposure apparatus for forming a pattern by irradiating a laser beam on a substrate such as a photomask blank coated with a photoresist.
As another substrate processing apparatus, SOI (Silicon on Insulator) technology for producing single crystal silicon by irradiating irradiation damage by ion implantation, activating implanted impurities, and recrystallizing polycrystalline silicon using a laser beam. An annealing processing apparatus such as the above, and a CVD processing apparatus that selectively forms a film on a semiconductor substrate.

また、本発明の基板検査装置は、請求項１〜６のいずれかに記載の基板保持装置を有する基板検査装置であって、前記基板保持装置によって保持された前記基板の表面に検査光を照射する検査光照射手段と、前記検査光にもとづく前記基板の表面の光を検出する光検出手段と、を有する構成としてある。このようにすると、歪みや撓みをより確実に抑制した基板に対して基板検査を行なうことができる。
この種の基板検査装置としては、例えば、基板の平坦度を測定する検査装置や基板表面に形成されたパターンの位置精度の測定を行なう座標測定装置が挙げられる。 Moreover, the board | substrate inspection apparatus of this invention is a board | substrate inspection apparatus which has a board | substrate holding apparatus in any one of Claims 1-6, Comprising: Inspection light is irradiated to the surface of the said board | substrate hold | maintained by the said board | substrate holding apparatus. Inspection light irradiating means, and light detecting means for detecting light on the surface of the substrate based on the inspection light. If it does in this way, a board | substrate test | inspection can be performed with respect to the board | substrate which suppressed distortion and bending more reliably.
Examples of this type of substrate inspection device include an inspection device that measures the flatness of a substrate and a coordinate measurement device that measures the positional accuracy of a pattern formed on the surface of the substrate.

また、本発明の基板保持方法は、基板をステージに保持する基板保持方法であって、前記基板をステージへ取り付けるとき及び／又は前記基板をステージから取り外すとき、前記基板を浮上させる流量で前記基板の下面に気体を吹き付け、前記基板を保持しているときに、前記基板が平坦状になる流量で前記基板の下面に気体を吹き付ける方法としてある。
このように、本発明は、基板保持方法としても有効であり、上述した各基板保持装置と同様の効果を発揮することができる。 The substrate holding method of the present invention is a substrate holding method for holding a substrate on a stage, and the substrate is flown at a flow rate that causes the substrate to float when the substrate is attached to the stage and / or when the substrate is removed from the stage. When a gas is blown onto the lower surface of the substrate and the substrate is held, the gas is blown onto the lower surface of the substrate at a flow rate at which the substrate becomes flat.
Thus, the present invention is also effective as a substrate holding method, and can exhibit the same effects as those of the above-described substrate holding devices.

本発明における基板保持装置によれば、基板に下方から気体を吹き付ける（エアーブローする）ことにより、自重による基板の撓みを低減することができる。また、吹き付けた気体を水平方向に排気することにより、基板のサイズに応じた補正手段等を設けなくてもすむので、異なるサイズの基板に対して共用化を図ることができる。
また、ステージへの基板の取付け・取外しを行なうとき、基板に気体を吹き付けることにより、凸部が基板と擦れて基板が損傷したり発塵したりする危険性を低減することができる。
さらに、基板を保持する前に基板に気体を吹き付け、平坦な状態とした基板を保持することにより、歪みや撓みをより確実に抑制することができる。 According to the substrate holding device of the present invention, the substrate can be flexed by its own weight by blowing a gas from below (air blowing) onto the substrate. Further, by exhausting the blown gas in the horizontal direction, it is not necessary to provide a correction means or the like corresponding to the size of the substrate, so that it is possible to share the substrate with different sizes.
In addition, when attaching / removing the substrate to / from the stage, by blowing gas onto the substrate, it is possible to reduce the risk that the convex portion rubs against the substrate and damages or generates dust.
Further, by blowing gas onto the substrate before holding the substrate and holding the substrate in a flat state, distortion and bending can be more reliably suppressed.

また、本発明の基板保持装置は、平坦度を高精度に維持した状態で基板を保持する必要のあるあらゆる装置、たとえば、基板処理装置や基板検査装置等に適用が可能である。
さらに、本発明は基板保持方法としても有効であり、上述した各基板保持装置と同様の効果を発揮することができる。 Further, the substrate holding apparatus of the present invention can be applied to any apparatus that needs to hold a substrate while maintaining the flatness with high accuracy, for example, a substrate processing apparatus or a substrate inspection apparatus.
Furthermore, the present invention is also effective as a substrate holding method, and can exhibit the same effects as the above-described substrate holding apparatuses.

[基板保持装置]
図１は、本発明にかかる基板保持装置の概略構成図を示している。
また、図２は、本発明にかかる基板保持装置のステージの概略平面図を示している。
図１において、基板保持装置１は、ステージ２，真空発生手段３，送風手段４，制御手段５，及び圧力計６とからなっている。
なお、基板保持装置１が保持する基板１０としては、マスク用基板，マスクブランク，マスク又はこれらの中間形成物等が挙げられる。 [Board holding device]
FIG. 1 shows a schematic configuration diagram of a substrate holding apparatus according to the present invention.
FIG. 2 is a schematic plan view of the stage of the substrate holding apparatus according to the present invention.
In FIG. 1, the substrate holding device 1 includes a stage 2, a vacuum generation unit 3, a blowing unit 4, a control unit 5, and a pressure gauge 6.
In addition, as the board | substrate 10 which the board | substrate holding | maintenance apparatus 1 hold | maintains, the board | substrate for masks, a mask blank, a mask, or these intermediate formations etc. are mentioned.

基板保持装置１は、基板１０を平板状のステージ２に保持する構成としてあり、図２に示すように、ステージ２の上面には、基板１０を部分的に保持する複数の凸部２１ａ，２１ｂ，２１ｃが突設してある。凸部２１ａ，２１ｂ，２１ｃは、縦方向に伸びた帯状の突起部であり、中央部に空隙２４が形成された状態で、横方向に等間隔で７列並設されている。このように、同一方向に凸部２１ａ，２１ｂ，２１ｃを並設することにより、容易に清掃することができる。また、空隙２４を設けることにより、エアーブローの圧力をより均一化することができる。   The substrate holding apparatus 1 is configured to hold a substrate 10 on a flat stage 2, and as shown in FIG. 2, a plurality of convex portions 21 a and 21 b that partially hold the substrate 10 are provided on the upper surface of the stage 2. , 21c is projected. The convex portions 21a, 21b, and 21c are band-like projections extending in the vertical direction, and are arranged in parallel in seven rows at equal intervals in the horizontal direction with a gap 24 formed in the central portion. Thus, it can clean easily by arranging the convex parts 21a, 21b, and 21c in the same direction. Further, by providing the gap 24, the air blow pressure can be made more uniform.

凸部２１ａ，２１ｂ，２１ｃは、上面が載置面２２となっており、基板１０が載置される。この際、基板１０の下面の一部が載置面２２と接触し接触面積が小さくなるので、ステージ２と基板１０の間にごみ等の異物が介入して基板１０が撓むといった不具合を防止することができる。
載置面２２は、基板１０が平坦な状態で載置されるように、平坦度及び高さが極めて精度よく加工されている。
ここで、載置面２２の高さＨ（図１参照）は、基板１０の浮上量（吐出孔２５から基板１０までの高さ）の１／２以下とすることが好ましい。この理由は、１／２以下とすることにより、基板１０を浮上させた際、載置面２２に基板１０が接触することを防ぐことができる。具体的には、基板１０の浮上する高さは、通常、約０．２ｍｍ〜約０．５ｍｍであるので、載置面２２の高さＨを約５０μｍ〜約１００μｍとすると、基板１０を容易に浮上させることができるとともに、基板１０を浮上させた際、載置面２２に基板１０が接触することを防ぐことができる。また、載置面２２の高さＨを約１００μｍより低くすると、吐出孔２５から基板１０の下面までの距離が必要以上に長くならず、基板１０を浮上させる際、大量かつ高い吐出圧の気体を必要とせず、また、約５０μｍより高くすると、摩擦などで発塵した異物が介入しても基板１０が撓んだりすることがない。 As for convex part 21a, 21b, 21c, the upper surface becomes the mounting surface 22, and the board | substrate 10 is mounted. At this time, since a part of the lower surface of the substrate 10 comes into contact with the mounting surface 22 and the contact area becomes small, it is possible to prevent a problem that the substrate 10 is bent due to foreign matters such as dust intervening between the stage 2 and the substrate 10. can do.
The mounting surface 22 is processed with extremely high flatness and height so that the substrate 10 is mounted in a flat state.
Here, the height H (see FIG. 1) of the mounting surface 22 is preferably set to be ½ or less of the flying height of the substrate 10 (height from the discharge hole 25 to the substrate 10). The reason is that the substrate 10 can be prevented from coming into contact with the mounting surface 22 when the substrate 10 is levitated by setting it to 1/2 or less. Specifically, since the floating height of the substrate 10 is normally about 0.2 mm to about 0.5 mm, the substrate 10 can be easily made when the height H of the mounting surface 22 is about 50 μm to about 100 μm. The substrate 10 can be prevented from coming into contact with the placement surface 22 when the substrate 10 is levitated. Further, when the height H of the mounting surface 22 is lower than about 100 μm, the distance from the discharge hole 25 to the lower surface of the substrate 10 is not longer than necessary, and a large amount of gas with a high discharge pressure is used when the substrate 10 is floated. If the height is higher than about 50 μm, the substrate 10 does not bend even if foreign matter generated by friction or the like intervenes.

また、載置面２２は、基板１０が簡単に滑らない範囲でより小さな摩擦係数を有することが好ましく、このようにすると、基板１０を滑らすことなく保持することができ、かつ、載置面２２と接触した状態で基板１０を移動させることができる。上記摩擦係数は、載置面２２の面粗度を粗くしたり、グリスを塗ったり、あるいは、オイル含浸材料を使用することにより実現することができる。
なお、本実施形態では、複数の凸部２１ａ，２１ｂ，２１ｃを配設した構造としてあるが、この構造に限定されるものではなく、たとえば、環状の凸部（図示せず）を一つ設ける構造としてもよい。 Further, it is preferable that the mounting surface 22 has a smaller coefficient of friction within a range in which the substrate 10 does not slide easily. In this way, the substrate 10 can be held without sliding, and the mounting surface 22 can be held. The substrate 10 can be moved while being in contact with the substrate. The coefficient of friction can be realized by increasing the surface roughness of the mounting surface 22, applying grease, or using an oil-impregnated material.
In addition, in this embodiment, although it is set as the structure which has arrange | positioned several convex part 21a, 21b, 21c, it is not limited to this structure, For example, one cyclic | annular convex part (not shown) is provided. It is good also as a structure.

また、凸部２１ａは、載置面２２の中央側端部に、基板１０の下面を吸着する吸着孔２３が一つ穿設され、凸部２１ｂは、載置面２２の中央側端部と載置面２２の中央部に吸着孔２３が二つ穿設してある。この凸部２１ａ，２１ｂは、吸着孔２３を介して真空吸着することにより、基板１０を容易に保持することができる。さらに、吸着孔２３を複数箇所に設け、使用する吸着孔２４を吸着用バルブ３１で選択することにより、簡単かつ短時間で、異なるサイズの基板１１に対応でき、保持力（吸着力）の大きさを調整することができる。
なお、凸部２１ｃは、吸着部を備えていないが、基板１０が載置されることにより、基板１０を保持する。 Further, the convex portion 21 a is formed with one suction hole 23 that sucks the lower surface of the substrate 10 at the central end portion of the mounting surface 22, and the convex portion 21 b is connected to the central end portion of the mounting surface 22. Two suction holes 23 are formed in the center of the mounting surface 22. The convex portions 21 a and 21 b can easily hold the substrate 10 by vacuum suction through the suction holes 23. Furthermore, by providing the suction holes 23 at a plurality of locations and selecting the suction holes 24 to be used by the suction valve 31, it is possible to cope with the substrates 11 of different sizes easily and in a short time, and the holding force (suction force) is large. Can be adjusted.
In addition, although the convex part 21c is not provided with the adsorption | suction part, the board | substrate 10 is mounted and the board | substrate 10 is hold | maintained.

ステージ２の上面には、凸部２１ａ，２１ｂ，２１ｃを避けて、ほぼ均等に、縦８列×横３段の位置に２４個の吐出孔２５が穿設してあり、この吐出孔２５から基板１０の下面に気体を吹き付ける。このように、基板１０に下方から気体を吹き付けることにより、基板１０を上方に押し上げ、載置面２２に載置されていない部分の基板１０が自重により撓むのを防止する。
また、本発明の基板保持装置１は、基板１０の下面に吹き付けた気体を、水平方向に排気する構成としており、これにより、基板１０のサイズに応じた補正手段等を設けなくてもすむので、異なるサイズの基板１１に対して共用化を図ることができる。特に、大型基板に対しても共用化を図ることができ、経済的に大きな効果を発揮することができる。 On the upper surface of the stage 2, 24 discharge holes 25 are formed at approximately 8 rows × 3 horizontal positions, avoiding the convex portions 21 a, 21 b, and 21 c, from the discharge holes 25. A gas is blown onto the lower surface of the substrate 10. In this way, by blowing gas onto the substrate 10 from below, the substrate 10 is pushed upward, and the portion of the substrate 10 that is not placed on the placement surface 22 is prevented from being bent by its own weight.
Further, the substrate holding device 1 of the present invention is configured to exhaust the gas blown to the lower surface of the substrate 10 in the horizontal direction, so that it is not necessary to provide a correction means or the like according to the size of the substrate 10. Therefore, it is possible to share the substrates 11 of different sizes. In particular, the large substrate can be shared, and a great economic effect can be achieved.

なお、各吐出孔２５と送風手段４の間には、流量調整バルブ４３が取り付けられており、基板１０の下面に吹き付ける気体の流量を調整し、また、必要としない吐出孔２５を閉めることができる。
ここで、好ましくは、気体の流量を調整する際、各吐出孔２５の近傍に埋設した圧力計６の圧力値にもとづいて流量を調整するとよく、このようにすると、最適な圧力とするための流量調整を精度よくかつ短時間で行なうことができる。
なお、本実施形態の圧力計６は、ゲージ式の圧力センサ６１と圧力表示部６２とからなっているが、このようなタイプの圧力計６に限定されるものではなく、たとえば、圧力測定孔（図示せず）を設けて、直接圧力を測定してもよい。また、圧力計は、ステージ２上の一箇所又は複数箇所に設ける構成としてもよい。 In addition, a flow rate adjusting valve 43 is attached between each discharge hole 25 and the air blowing means 4 to adjust the flow rate of the gas blown to the lower surface of the substrate 10 and to close the unnecessary discharge holes 25. it can.
Here, preferably, when adjusting the flow rate of the gas, the flow rate may be adjusted based on the pressure value of the pressure gauge 6 embedded in the vicinity of each discharge hole 25. The flow rate can be adjusted accurately and in a short time.
The pressure gauge 6 of this embodiment includes a gauge-type pressure sensor 61 and a pressure display unit 62, but is not limited to such a type of pressure gauge 6, and includes, for example, a pressure measurement hole. (Not shown) may be provided to measure the pressure directly. Further, the pressure gauge may be provided at one place or a plurality of places on the stage 2.

真空発生手段３は、図１に示すように、各吸着孔２３に対応した吸着用バルブ３１及び配管３２を介して、各吸着孔２３と接続されている。また、真空発生手段３の吸込み口には真空破壊用バルブ３３が設けてある。
真空発生手段３は、一般的に、小型の真空ポンプが使用されるが、これに限定されるものではなく、真空を発生させる手段であればよい。
また、吸着用バルブ３１と真空破壊用バルブ３３は、一般的に、電磁バルブが用いられ、真空発生手段３とともに制御手段５により制御される。 As shown in FIG. 1, the vacuum generating means 3 is connected to each suction hole 23 via a suction valve 31 and a pipe 32 corresponding to each suction hole 23. A vacuum breaker valve 33 is provided at the suction port of the vacuum generating means 3.
The vacuum generating means 3 is generally a small vacuum pump, but is not limited to this and may be any means for generating a vacuum.
The suction valve 31 and the vacuum breaking valve 33 are generally electromagnetic valves and are controlled by the control means 5 together with the vacuum generation means 3.

送風手段４は、一般的に、コンプレッサー（図示せず）からの圧縮気体を減圧するレギュレータ４１ａ，４１ｂと、吐出孔２５への送風をオンオフする電磁弁４２ａ，４２ｂとからなっている。
レギュレータ４１ａ及び電磁弁４２ａは、レギュレータ４１ｂ及び電磁弁４２ｂと並列に接続されている。また、レギュレータ４１ａは、基板１０を完全に浮上させることの可能な圧力に設定され、レギュレータ４１ｂは、基板１０を浮上させないが浮上させる直前の圧力であって、基板１０の撓みを抑制し平坦な状態で保持することの可能な圧力に設定されている。このようにすると、電磁弁４２ａ，４２ｂを制御することにより、二つの吐出圧の気体を連続的に吹き付けることができる。
電磁弁４２ａ，４２ｂは、吐出孔２５ごとに設けられた流量調整バルブ４３を介して、配管４４で各吐出孔２５と接続されている。また、電磁弁４２ａ，４２ｂは、制御手段５により制御される。
なお、圧縮気体は、一般的にエアを使用するが、装置や基板の種類，用途等によっては、窒素ガスその他の不活性ガスを使用してもよい。 The blowing means 4 is generally composed of regulators 41a and 41b for reducing the pressure of compressed gas from a compressor (not shown) and electromagnetic valves 42a and 42b for turning on and off the blowing to the discharge hole 25.
The regulator 41a and the electromagnetic valve 42a are connected in parallel with the regulator 41b and the electromagnetic valve 42b. Further, the regulator 41a is set to a pressure at which the substrate 10 can be completely lifted, and the regulator 41b is a pressure that does not lift the substrate 10 but is just before the substrate 10 is lifted. It is set to a pressure that can be maintained in a state. If it does in this way, the gas of two discharge pressures can be sprayed continuously by controlling electromagnetic valve 42a, 42b.
The electromagnetic valves 42 a and 42 b are connected to the discharge holes 25 by pipes 44 through flow rate adjusting valves 43 provided for the discharge holes 25. The electromagnetic valves 42a and 42b are controlled by the control means 5.
Note that air is generally used as the compressed gas, but nitrogen gas or other inert gas may be used depending on the type of device, substrate, application, and the like.

制御手段５は、一般的に、シーケンサ等が使用され、基板搬送装置（図示せず）から、搬送に関する外部入力信号を入力し、真空発生手段３，吸着用バルブ３１，真空破壊用バルブ３３及び電磁弁４２ａ，４２ｂを制御する。
なお、本実施形態では、制御手段５が真空発生手段３，吸着用バルブ３１，真空破壊用バルブ３３及び電磁弁４２ａ，４２ｂを制御する構成としてあるが、この構成に限定されるものではなく、たとえば、各圧力計６からの圧力値を入力して、流量調整バルブ４３を自動調整する構成としてもよい。 The control means 5 is generally a sequencer or the like, and receives an external input signal related to transfer from a substrate transfer device (not shown), and generates a vacuum generation means 3, a suction valve 31, a vacuum breaker valve 33, and The electromagnetic valves 42a and 42b are controlled.
In the present embodiment, the control means 5 is configured to control the vacuum generation means 3, the suction valve 31, the vacuum breaking valve 33, and the electromagnetic valves 42a and 42b, but is not limited to this configuration. For example, the pressure value from each pressure gauge 6 may be input to automatically adjust the flow rate adjustment valve 43.

次に、上記構成の基板保持装置１の動作について、図面を参照して説明する。
まず、基板保持装置１は、制御手段５が、基板搬送装置（図示せず）から、基板載置信号を入力する（ステップＳ１）と、電磁弁４２ａ，４２ｂをオンし、吐出孔２５から気体を吐出する（ステップＳ２）。このとき、流量調整バルブ４３の上流側における配管４４内の圧力は、レギュレータ４１により設定された基板１０を完全に浮上させる圧力となり、載置面２２の高さＨが、たとえば、約５０μｍ〜約１００μｍのときは、基板１０を吐出孔２５（吐出孔２５が穿設されたステージ２の上面）から約０．２ｍｍ〜約０．５ｍｍ浮上させる。 Next, the operation of the substrate holding apparatus 1 having the above configuration will be described with reference to the drawings.
First, in the substrate holding device 1, when the control means 5 inputs a substrate placement signal from a substrate transfer device (not shown) (step S <b> 1), the electromagnetic valves 42 a and 42 b are turned on and gas is discharged from the discharge hole 25. Is discharged (step S2). At this time, the pressure in the pipe 44 on the upstream side of the flow rate adjusting valve 43 becomes a pressure for completely floating the substrate 10 set by the regulator 41, and the height H of the mounting surface 22 is, for example, about 50 μm to about 50 μm. When the thickness is 100 μm, the substrate 10 is lifted from about 0.2 mm to about 0.5 mm from the discharge hole 25 (the upper surface of the stage 2 in which the discharge hole 25 is formed).

次に、基板搬送装置は、吐出孔２５の上方約０．２ｍｍ〜約０．５ｍｍの位置に基板１０を搬送し、この位置で基板１０を放すとともに基板開放信号を出力する。開放された基板１０は、ほぼ均等に配設された吐出孔２５から吹き付けられる気体により浮上し、自重により撓むことなく平坦な状態となる。   Next, the substrate transport device transports the substrate 10 to a position of about 0.2 mm to about 0.5 mm above the discharge hole 25, releases the substrate 10 at this position, and outputs a substrate open signal. The opened substrate 10 is floated by the gas blown from the discharge holes 25 arranged almost uniformly, and is flat without being bent by its own weight.

次に、制御手段５は、基板開放信号を入力すると、必要な吸着用バルブ３１を開くとともに電磁弁４２ａを閉じて、基板１０を吸着する（ステップＳ３）。
なお、本実施形態では、基板載置信号を入力すると、制御手段５が、吸着用バルブ３１及び真空破壊用バルブ３３を閉じて、真空発生手段３を作動させ、吸着用バルブ３１より上流側の配管３２を真空状態としてあるので、吸着用バルブ３１を開くと、ただちに基板１０を吸着することができる。
また、電磁弁４２ａを閉じても、電磁弁４２ｂが開いているので、基板１０の撓みを抑制する気体を連続的に吹き付けることができる。 Next, when the substrate opening signal is input, the control means 5 opens the necessary suction valve 31 and closes the electromagnetic valve 42a to suck the substrate 10 (step S3).
In the present embodiment, when the substrate placement signal is input, the control means 5 closes the suction valve 31 and the vacuum breaker valve 33 to operate the vacuum generation means 3, and the upstream side of the suction valve 31. Since the pipe 32 is in a vacuum state, the substrate 10 can be immediately adsorbed when the adsorbing valve 31 is opened.
Even if the electromagnetic valve 42 a is closed, the electromagnetic valve 42 b is open, so that a gas that suppresses the bending of the substrate 10 can be continuously blown.

ここで、基板搬送装置が基板１０を放してから基板１０が吸着（保持）されるまでの時間は、コンマ数秒程度の短い時間である。
この間、基板搬送装置から開放された基板１０は、浮上しながら自重により撓むことなく平坦な状態となり、吸着用バルブ３１が開かれるのとほぼ同時に気体の流量が減らされると、この状態を維持したまま降下し、凸部２１ａ，２１ｂの吸着孔２３に保持される。したがって、撓みが抑制された状態の基板１０をそのまま保持するので、基板１０を吸着する際、基板１０が載置面２２と擦れ、基板１０に傷をつけたり発塵するといった不具合を防止することができる。
また、基板保持装置１は、基板１０に流量を減らした気体を吹き付けながら、基板１０を吸着するので、基板１０を保持する際の衝撃を緩衝することができ、さらに、基板１０に気体を吹き付け続けるので、平坦な状態で保持された基板１０が自重により撓んでしまうといった不具合を防止することができる。なお、このときの流量は、基板１０が浮上せず、かつ、基板１０の自重をより低減可能な圧力が基板下面にかかるように、適宜制御される。 Here, the time from when the substrate transport device releases the substrate 10 until the substrate 10 is attracted (held) is a short time of about several seconds of commas.
During this time, the substrate 10 released from the substrate transfer device is in a flat state without being bent due to its own weight while floating, and this state is maintained when the gas flow rate is reduced almost simultaneously with the opening of the suction valve 31. Then, it is lowered and held in the suction holes 23 of the convex portions 21a and 21b. Therefore, since the substrate 10 in a state in which the bending is suppressed is held as it is, it is possible to prevent a problem that the substrate 10 is rubbed with the mounting surface 22 when the substrate 10 is sucked, and the substrate 10 is damaged or generates dust. it can.
Further, the substrate holding device 1 adsorbs the substrate 10 while blowing a gas with a reduced flow rate on the substrate 10, so that it is possible to buffer an impact when holding the substrate 10, and further, a gas is blown onto the substrate 10. Since it continues, the malfunction that the board | substrate 10 hold | maintained in the flat state will bend by dead weight can be prevented. Note that the flow rate at this time is appropriately controlled so that the substrate 10 does not float and a pressure capable of further reducing the weight of the substrate 10 is applied to the lower surface of the substrate.

次に、制御手段５は、基板１０を正常に吸着すると、基板１０をステージ２に正常に保持した旨の保持完了信号を基板搬送装置に出力する（ステップＳ４）。
次に、基板処理装置又は基板測定装置（図示せず）が処理又は測定を行なう。 Next, when the control unit 5 normally sucks the substrate 10, the control unit 5 outputs a holding completion signal indicating that the substrate 10 is normally held on the stage 2 to the substrate transfer apparatus (step S <b> 4).
Next, a substrate processing apparatus or a substrate measuring apparatus (not shown) performs processing or measurement.

次に、基板の処理又は測定が終了すると、基板搬送装置は、ピックアップ部（図示せず）が基板１０を開放した位置に移動し、ピックアップ開始信号を出力する。
次に、制御手段５は、このピックアップ開始信号を入力し（ステップＳ５）、続いて、電磁弁４２ａを開くとともに真空発生手段３を停止し、真空破壊用バルブ３３を開放し、基板１０の吸着を解除する。ここで、電磁弁４２ａを開くと気体の流量が増加し、吐出孔２５の上方約０．２ｍｍ〜約０．５ｍｍの位置に、基板１０を完全に浮上させる（ステップＳ６）。このようにすると、ピックアップ部が基板１０を保持する際、基板１０が載置面２２上を移動し擦れるといった不具合を防止することができる。 Next, when the substrate processing or measurement is completed, the substrate transfer apparatus moves to a position where the pickup unit (not shown) opens the substrate 10 and outputs a pickup start signal.
Next, the control means 5 inputs this pickup start signal (step S5). Subsequently, the electromagnetic valve 42a is opened and the vacuum generating means 3 is stopped, the vacuum breaker valve 33 is opened, and the substrate 10 is adsorbed. Is released. Here, when the electromagnetic valve 42a is opened, the gas flow rate increases, and the substrate 10 is completely lifted to a position of about 0.2 mm to about 0.5 mm above the discharge hole 25 (step S6). In this way, when the pickup unit holds the substrate 10, it is possible to prevent a problem that the substrate 10 moves and rubs on the placement surface 22.

次に、基板搬送装置は、浮上してきた基板１０を保持すると、ピックアップ完了信号を出力する。
次に、基板保持装置１は、制御手段５がピックアップ完了信号を入力する（ステップＳ７）と、電磁弁４２ａ，４２ｂを閉じて吐出孔２５からの気体の吐出を停止する（ステップＳ８）。 Next, when the substrate transport apparatus holds the substrate 10 that has floated, it outputs a pickup completion signal.
Next, when the control means 5 inputs a pickup completion signal (step S7), the substrate holding device 1 closes the electromagnetic valves 42a and 42b and stops the discharge of gas from the discharge holes 25 (step S8).

上述したように、本発明にかかる基板保持装置１によれば、気体を水平方向に排気することにより、基板の大きさに応じた補正手段等を設けなくてもすむので、異なる大きさの基板に対して共用化を図ることができる。
また、基板保持装置１は、基板１０を保持しているときに、基板１０に気体を吹き付けているので、歪みや撓みをより確実に抑制し、平坦な状態とした基板１０を保持することができる。さらに、基板１０の取付け・取外しを行なう際、基板１０に気体を吹き付けて浮上させ、基板１０が載置面２２と擦れないようにすることによって、基板１０が損傷したり発塵したりする危険性を低減することができる。 As described above, according to the substrate holding device 1 according to the present invention, it is not necessary to provide a correction means according to the size of the substrate by exhausting the gas in the horizontal direction. Can be shared.
In addition, since the substrate holding device 1 blows gas to the substrate 10 while holding the substrate 10, it is possible to more reliably suppress distortion and bending and hold the substrate 10 in a flat state. it can. Furthermore, when attaching / removing the substrate 10, the substrate 10 may be damaged or generate dust by blowing a gas to the substrate 10 to float and prevent the substrate 10 from rubbing against the mounting surface 22. Can be reduced.

なお、上記基板保持装置１によれば、ガラス基板上にクロムからなる遮光膜パターンを形成した、大型のフォトマスク（たとえば、サイズ＝約３９０ｍｍ×約６１０ｍｍ×厚さ約６ｍｍ）に対して、歪み及び撓みを抑制した状態で保持することができる。
ここで、ほぼ均等に配設された複数の吐出孔２５から、大型のフォトマスクが浮上するような圧力を発生させる気体を吹き付けると、上記大型のフォトマスクを完全に浮上させることができる。また、大型のフォトマスクが浮上しない程度の気体を吹き付けながら保持することにより、大型のフォトマスクの歪みや撓みを抑制することができる。 In addition, according to the said board | substrate holding | maintenance apparatus 1, it is distortion with respect to the large sized photomask (for example, size = about 390 mm x about 610 mm x thickness about 6 mm) which formed the light shielding film pattern which consists of chromium on the glass substrate. And it can hold | maintain in the state which suppressed bending.
Here, when a gas that generates a pressure that causes the large photomask to float is blown from the plurality of discharge holes 25 that are substantially evenly disposed, the large photomask can be completely floated. In addition, by holding the gas so that the large photomask does not float, the distortion and bending of the large photomask can be suppressed.

［基板処理装置］
上記構成の基板保持装置１は、フォトマスクブランクやフォトマスク等を製造する際に用いる基板処理装置に利用することができる。
本発明にかかる基板処理装置は、基板保持装置１を有する基板処理装置であって、基板保持装置１によって保持された基板１０の表面に、電子線又はレーザー光を照射する照射手段を有する構成としてある。
このようにすると、基板処理装置は、基板１０を保持する際に発生する歪み及び撓みを低減した状態で、照射手段からの電子線又はレーザー光の照射により、精度よく基板１０にパターンを描画したり、基板１０に形成されたパターンを修正したりするなど、所定の処理を施すことができる。
また、このような基板処理装置としては、例えば、フォトレジストがコーティングされたフォトマスクブランク等の基板を用い、これにレーザー光を照射してパターン形成するための描画装置又は露光装置が挙げられる。 [Substrate processing equipment]
The substrate holding apparatus 1 having the above configuration can be used for a substrate processing apparatus used when manufacturing a photomask blank, a photomask, or the like.
The substrate processing apparatus according to the present invention is a substrate processing apparatus having the substrate holding apparatus 1 and has an irradiation means for irradiating the surface of the substrate 10 held by the substrate holding apparatus 1 with an electron beam or laser light. is there.
In this way, the substrate processing apparatus draws a pattern on the substrate 10 with high accuracy by irradiation with an electron beam or laser light from the irradiation means in a state where distortion and deflection generated when holding the substrate 10 are reduced. Or a predetermined process such as correcting a pattern formed on the substrate 10 can be performed.
Examples of such a substrate processing apparatus include a drawing apparatus or an exposure apparatus for forming a pattern by irradiating a laser beam on a substrate such as a photomask blank coated with a photoresist.

［基板検査装置］
上記構成の基板保持装置１は、基板１０を検査する基板検査装置に利用することができる。
本発明にかかる基板検査装置は、基板保持装置１を有する基板検査装置であって、基板保持装置１によって保持された基板１０の表面に検査光を照射する検査光照射手段と、検査光にもとづく基板１０の表面の光を検出する光検出手段とを有する構成としてある。
このようにすると、基板検査装置は、基板１０を保持する際に発生する歪み及び撓みを低減した状態で、検査光照射手段から検査光を照射し、光検出手段が検査光にもとづく基板１０の表面の光を検出することができ、検査の再現性及び精度を効果的に向上させることができる。
また、このような基板検査装置としては、例えば、基板の平坦度を測定する検査装置や基板表面に形成されたパターンの位置精度の測定を行なう座標測定装置が挙げられる。 [Board inspection equipment]
The substrate holding device 1 configured as described above can be used in a substrate inspection apparatus that inspects the substrate 10.
The substrate inspection apparatus according to the present invention is a substrate inspection apparatus having a substrate holding device 1, which is based on inspection light irradiation means for irradiating inspection light onto the surface of a substrate 10 held by the substrate holding device 1 and the inspection light. The light detection means detects the light on the surface of the substrate 10.
In this way, the substrate inspection apparatus irradiates the inspection light from the inspection light irradiating means in a state in which distortion and deflection generated when holding the substrate 10 are reduced, and the light detecting means causes the inspection of the substrate 10 based on the inspection light. The surface light can be detected, and the reproducibility and accuracy of the inspection can be effectively improved.
Examples of such a substrate inspection device include an inspection device that measures the flatness of a substrate and a coordinate measurement device that measures the positional accuracy of a pattern formed on the substrate surface.

［基板保持方法］
本発明は、基板保持方法としても有効であり、この基板保持方法は、基板１０を平板状のステージ２に保持する基板保持方法であって、基板１０をステージ２へ取り付けるとき及び／又は基板１０をステージ２から取り外すとき、基板１０を浮上させる流量で基板１０の下面に気体を吹き付け、基板１０を保持しているときに、基板１０の自重を低減し基板１０が平坦状になる流量で基板１０の下面に気体を吹き付ける方法としてある。
このようにすると、ステージ２への基板１０の取付け及び／又は取外しを行なうとき、凸部２１ａ，２１ｂ，２１ｃが基板１０と擦れることによって、基板１０が損傷したり発塵したりする危険性を低減することができる。
さらに、基板１０を保持するとき、基板１０に気体を吹き付けて自重を低減しながら保持することにより、撓みや歪みをより確実に抑制し平坦な状態とした基板１０を保持することができる。 [Board holding method]
The present invention is also effective as a substrate holding method, and this substrate holding method is a substrate holding method for holding the substrate 10 on the flat stage 2 when the substrate 10 is attached to the stage 2 and / or the substrate 10. When the substrate 10 is removed from the stage 2, gas is blown onto the lower surface of the substrate 10 at a flow rate that causes the substrate 10 to float, and when the substrate 10 is held, the substrate 10 is reduced in its own weight so that the substrate 10 becomes flat. This is a method of blowing a gas to the lower surface of 10.
If it does in this way, when attaching and / or removing the board | substrate 10 to the stage 2, there exists a danger that the board | substrate 10 will be damaged or dust generation | occurrence | production by the convex parts 21a, 21b, and 21c rubbing with the board | substrate 10. Can be reduced.
Furthermore, when the substrate 10 is held, the substrate 10 can be held in a flat state by suppressing the bending and distortion more reliably by blowing the gas to the substrate 10 and holding the substrate 10 while reducing its own weight.

また、本発明の基板保持装置，基板処理装置，基板検査装置及び基板保持方法について、好ましい実施形態を示して説明したが、本発明は、上述した実施形態にのみ限定されるものではなく、本発明の範囲で種々の変更実施が可能であることは言うまでもない。
たとえば、基板保持装置のステージは、上記実施形態のステージ１に限定されるものではなく、図４に示すステージ２ａを用いてもよい。
このステージ２ａは、ステージ２ａの上面の、二等辺三角形の頂点と対応する位置に、円形の載置面２２ａを有する凸部２１ｄを突設し、載置面２２ａに吸着孔２３を設け、基板保持装置１と同様に吐出孔２５及び圧力センサ６１を設けた構造としてある。なお、その他の構成は基板保持装置１のステージ２とほぼ同様としてある。このようにすると、基板１０を三つの凸部２１ｄによって三点支持することができ、歪みや撓みの抑制されたほぼフリーの状態の基板保持を実現することができる。 Further, the substrate holding apparatus, the substrate processing apparatus, the substrate inspection apparatus, and the substrate holding method according to the present invention have been described with reference to the preferred embodiments. However, the present invention is not limited to the above-described embodiments. It goes without saying that various modifications can be made within the scope of the invention.
For example, the stage of the substrate holding apparatus is not limited to the stage 1 of the above embodiment, and the stage 2a shown in FIG. 4 may be used.
This stage 2a is provided with a convex portion 21d having a circular mounting surface 22a at a position corresponding to the top of the isosceles triangle on the upper surface of the stage 2a, and a suction hole 23 is provided on the mounting surface 22a. Similar to the holding device 1, the discharge hole 25 and the pressure sensor 61 are provided. Other configurations are almost the same as those of the stage 2 of the substrate holding apparatus 1. In this way, the substrate 10 can be supported at three points by the three convex portions 21d, and the substrate can be held in a substantially free state in which distortion and deflection are suppressed.

本発明の基板保持装置，基板処理装置，基板検査装置及び基板保持方法は、保持対象を基板としてあるが、これに限定されるものではなく、たとえば、基板の代わりに板状部材でもよく、板状部材保持装置や板状部材保持方法等にも適用が可能である。   The substrate holding apparatus, substrate processing apparatus, substrate inspection apparatus, and substrate holding method of the present invention have a holding target as a substrate, but are not limited to this. For example, a plate-like member may be used instead of a substrate. The present invention can also be applied to a plate-like member holding device, a plate-like member holding method, and the like.

本発明にかかる基板保持装置の概略構成図を示している。1 is a schematic configuration diagram of a substrate holding device according to the present invention. 本発明にかかる基板保持装置のステージの概略平面図を示している。The schematic plan view of the stage of the substrate holding device concerning the present invention is shown. 本発明にかかる基板保持装置の動作を説明する概略フローチャート図を示している。The schematic flowchart figure explaining operation | movement of the board | substrate holding apparatus concerning this invention is shown. 本発明の応用例にかかる基板保持装置のステージの概略平面図を示している。The schematic plan view of the stage of the substrate holding apparatus concerning the application example of this invention is shown.

符号の説明Explanation of symbols

１ 基板保持装置
２，２ａ ステージ
３ 真空発生手段
４ 送風手段
５ 制御手段
６ 圧力計
１０，１１ 基板
２１ａ，２１ｂ，２１ｃ，２１ｄ 凸部
２２，２２ａ 載置面
２３ 吸着孔
２４ 空隙
２５ 吐出孔
３１ 吸着用バルブ
３２ 配管
３３ 真空破壊用バルブ
４１ａ，４１ｂ レギュレータ
４２ａ，４２ｂ 電磁弁
４３ 流量調整バルブ
４４ 配管
６１ 圧力センサ
６２ 圧力表示部 DESCRIPTION OF SYMBOLS 1 Substrate holding device 2, 2a Stage 3 Vacuum generating means 4 Blower means 5 Control means 6 Pressure gauge 10, 11 Substrate 21a, 21b, 21c, 21d Protrusion 22, 22a Placement surface 23 Adsorption hole 24 Gap 25 Discharge hole 31 Adsorption Valve 32 Piping 33 Vacuum break valve 41a, 41b Regulator 42a, 42b Solenoid valve 43 Flow rate adjusting valve 44 Piping 61 Pressure sensor 62 Pressure display

Claims (9)

基板をステージに保持する基板保持装置であって、
前記ステージの上面に、凸部と、前記基板の下面に気体を吹き付けるための吐出孔とを備え、
前記凸部が、前記基板を部分的に載置する載置面と前記基板を保持する保持手段を有し、かつ、前記基板の下面に吹き付けられた気体が、水平方向に排気されることを特徴とする基板保持装置。 A substrate holding device for holding a substrate on a stage,
On the upper surface of the stage, a convex portion, and a discharge hole for blowing gas to the lower surface of the substrate,
The convex part has a mounting surface for partially mounting the substrate and a holding means for holding the substrate, and the gas blown to the lower surface of the substrate is exhausted in the horizontal direction. A substrate holding device. 前記保持手段が、前記基板を吸着して保持する吸着孔である請求項１記載の基板保持装置。   The substrate holding apparatus according to claim 1, wherein the holding means is a suction hole that sucks and holds the substrate. 前記基板を保持しているときに、前記基板が平坦状になる流量で前記基板の下面に前記吐出孔から前記気体を吹き付け、かつ、前記基板をステージへ取り付けるとき及び／又は前記基板をステージから取り外すとき、前記基板を浮上させる流量で前記基板の下面に前記吐出孔から前記気体を吹き付ける、送風手段を備えた請求項１又は２記載の基板保持装置。   When the substrate is held, the gas is blown from the discharge hole to the lower surface of the substrate at a flow rate at which the substrate becomes flat, and the substrate is attached to the stage and / or the substrate is removed from the stage. 3. The substrate holding apparatus according to claim 1, further comprising a blowing unit that blows the gas from the discharge hole onto the lower surface of the substrate at a flow rate that causes the substrate to float when removed. 前記吐出孔を複数配設した請求項１〜３のいずれかに記載の基板保持装置。   The substrate holding device according to claim 1, wherein a plurality of the discharge holes are provided. 前記ステージと前記基板との間の空間の圧力を測定する圧力計を設けた請求項１〜４のいずれかに記載の基板保持装置。   The substrate holding device according to claim 1, further comprising a pressure gauge that measures a pressure in a space between the stage and the substrate. 前記基板を、マスク用基板，マスクブランク，マスク又はこれらの中間形成物とした請求項１〜５のいずれかに記載の基板保持装置。   The substrate holding apparatus according to claim 1, wherein the substrate is a mask substrate, a mask blank, a mask, or an intermediate product thereof. 請求項１〜６のいずれかに記載の基板保持装置を有する基板処理装置であって、
前記基板保持装置によって保持された前記基板の表面に、電子線又はレーザー光を照射する照射手段を有することを特徴とする基板処理装置。 A substrate processing apparatus having the substrate holding apparatus according to claim 1,
A substrate processing apparatus comprising irradiation means for irradiating the surface of the substrate held by the substrate holding apparatus with an electron beam or laser light. 請求項１〜６のいずれかに記載の基板保持装置を有する基板検査装置であって、
前記基板保持装置によって保持された前記基板の表面に検査光を照射する検査光照射手段と、
前記検査光にもとづく前記基板の表面の光を検出する光検出手段と、
を有することを特徴とする基板検査装置。 A substrate inspection apparatus comprising the substrate holding apparatus according to claim 1,
Inspection light irradiation means for irradiating the surface of the substrate held by the substrate holding device with inspection light;
Light detection means for detecting light on the surface of the substrate based on the inspection light;
A board inspection apparatus comprising: 基板をステージに保持する基板保持方法であって、
前記基板をステージへ取り付けるとき及び／又は前記基板をステージから取り外すとき、前記基板を浮上させる流量で前記基板の下面に気体を吹き付け、
前記基板を保持しているときに、前記基板が平坦状になる流量で前記基板の下面に気体を吹き付けることを特徴とする基板保持方法。 A substrate holding method for holding a substrate on a stage,
When attaching the substrate to the stage and / or removing the substrate from the stage, a gas is blown onto the lower surface of the substrate at a flow rate that causes the substrate to float,
A substrate holding method, comprising: blowing a gas onto a lower surface of the substrate at a flow rate at which the substrate becomes flat when the substrate is held.
JP2003332238A 2003-09-24 2003-09-24 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method Pending JP2005101226A (en)

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JP2003332238A JP2005101226A (en) 2003-09-24 2003-09-24 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method
TW093126538A TW200512795A (en) 2003-09-24 2004-09-02 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method
KR1020040076185A KR100843413B1 (en) 2003-09-24 2004-09-23 Substrate holding device, substrate treating device, substrate inspecting device, method for holding the substrate, and method for manufacturing photo mask

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JP2003332238A JP2005101226A (en) 2003-09-24 2003-09-24 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method

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