JP2005093961A - Method for manufacturing multilayer ceramic substrate with cavity - Google Patents
Method for manufacturing multilayer ceramic substrate with cavity Download PDFInfo
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- JP2005093961A JP2005093961A JP2003329217A JP2003329217A JP2005093961A JP 2005093961 A JP2005093961 A JP 2005093961A JP 2003329217 A JP2003329217 A JP 2003329217A JP 2003329217 A JP2003329217 A JP 2003329217A JP 2005093961 A JP2005093961 A JP 2005093961A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本発明は、焼成収縮が少なく形状および寸法精度の高いキャビティ付き多層セラミック基板の製造方法に関する。 The present invention relates to a method for manufacturing a multilayer ceramic substrate with a cavity that has less firing shrinkage and high shape and dimensional accuracy.
複数のグリーンシートを積層し、その両面にかかるグリーンシートよりも焼結温度が高い収縮抑制シートをそれぞれ積層した状態で上記グリーンシートの焼結温度にて焼成した後、未焼成の収縮抑制シートを除去することにより、平面方向の寸法精度が高いキャビティ付き多層セラミック基板を得るための製造方法が提案されている。
例えば、ガラスセラミック・グリーンシートを積層して凹部を有する積層体を作製し、かかる凹部に拘束用無機組成物を充填し、この積層体の両面に密着剤層を介在させて、難焼結性無機材料および有機バインダを含む拘束グリーンシートをそれぞれ積層し、得られた積層体を焼成した後、上記拘束用無機組成物と拘束グリーンシートとを除去する、という工程からなるガラスセラミック基板の製造方法が提案されている(例えば、特許文献１参照)。
After laminating a plurality of green sheets and firing a shrinkage suppression sheet having a sintering temperature higher than that of the green sheets on both sides, the green sheet is fired at the sintering temperature. A manufacturing method for obtaining a multilayer ceramic substrate with a cavity having high dimensional accuracy in the planar direction by removing the substrate has been proposed.
For example, it is difficult to sinter by making a laminated body having concave portions by laminating glass ceramic green sheets, filling the concave portions with a restraining inorganic composition, and interposing an adhesive layer on both sides of the laminated body. A method for producing a glass ceramic substrate comprising the steps of laminating a constraining green sheet containing an inorganic material and an organic binder, firing the resulting laminate, and then removing the constraining inorganic composition and the constraining green sheet. Has been proposed (see, for example, Patent Document 1).
前記拘束用無機組成物は、ペースト状または粉体状のものであり、例えばペースト状の拘束用無機組成物を印刷法により前記凹部に充填した場合、かかる組成物と凹部(キャビティ)の内面との間には、密着が不十分で隙間を生じることがある。かかる隙間があると、凹部の底面を形成する前記グリーンシートに対する前記焼成工程での拘束が不十分になるため、当該グリーンシートにクラックを生じる、という問題があった。
一方、前記凹部に予め所定形状および寸法に成形した無機成形物を挿入する方法もあるが、当該凹部に見合った高い寸法精度の無機成形物でないと、その凹部が変形することがあり、しかも、凹部の寸法や形状が変更される度に成形型を変更する必要があるため、製造上の負担が大きい、という問題があった。
The restraining inorganic composition is in a paste or powder form.For example, when the concave inorganic composition is pasted into the recess by a printing method, the composition and the inner surface of the recess (cavity) In some cases, the gap is insufficient due to insufficient adhesion. If there is such a gap, there is a problem in that the green sheet forming the bottom surface of the recess is insufficiently restrained in the firing step, and thus the green sheet is cracked.
On the other hand, there is also a method of inserting an inorganic molded product that has been preliminarily molded into a predetermined shape and size into the recess, but the recess may be deformed if it is not an inorganic molded product with high dimensional accuracy corresponding to the recess, Since it is necessary to change the mold every time the dimensions and shape of the recesses are changed, there is a problem that the manufacturing burden is large.
本発明は、以上において説明した背景技術の問題点を解決し、焼成収縮が少なく形状および寸法精度の高いキャビティ付き多層セラミック基板を確実に得るための製造方法を提供する、ことを課題とする。 An object of the present invention is to solve the problems of the background art described above, and to provide a manufacturing method for reliably obtaining a multilayer ceramic substrate with a cavity having a small shape shrinkage and a high shape and dimensional accuracy.
本発明は、上記課題を解決するため、複数のグリーンシートを積層して形成したキャビティ内に無機組成物を充填するに際し、キャビティ内面と充填した無機組成物との間に隙間を生じないように減圧に伴う圧力差により強制的に充填する、ことに着目して成されたものである。
即ち、本発明のキャビティ付き多層セラミック基板の製造方法(請求項１)は、表面および裏面を有するグリーンシートと、表面および裏面を有し且つかかる表面と裏面との間を貫通する貫通孔を有するグリーンシートと、を積層してキャビティ付きグリーンシート積層体を形成する工程と、上記グリーンシートの焼結温度よりも高い焼結温度を有するペースト状の無機組成物を、上記キャビティ内に減圧しつつ充填するか、あるいは当該キャビティ内に充填した後に減圧する工程と、上記無機組成物を含むキャビティ付きグリーンシート積層体の両面に上記グリーンシートの焼結温度よりも高い焼結温度を有する焼成収縮抑制シートを積層して複合積層体を形成する工程と、かかる複合積層体を上記グリーンシートの焼結温度で焼成する工程と、焼成後の上記複合積層体から未焼結の上記焼成収縮抑制シートおよび未焼結の上記無機組成物を除去する工程と、を含む、ことを特徴とする。
In order to solve the above problems, the present invention prevents a gap from being formed between the cavity inner surface and the filled inorganic composition when filling the inorganic composition into the cavity formed by laminating a plurality of green sheets. It is made paying attention to forcibly filling by the pressure difference accompanying pressure reduction.
That is, the method for manufacturing a multilayer ceramic substrate with a cavity according to the present invention (Claim 1) has a green sheet having a front surface and a back surface, and a through-hole having the front surface and the back surface and penetrating between the front surface and the back surface. A step of laminating a green sheet to form a green sheet laminate with a cavity, and a paste-like inorganic composition having a sintering temperature higher than the sintering temperature of the green sheet while reducing the pressure in the cavity Filling or reducing pressure after filling into the cavity, and suppression of firing shrinkage having a sintering temperature higher than the sintering temperature of the green sheet on both sides of the green sheet laminate with the cavity containing the inorganic composition A step of laminating sheets to form a composite laminate, and a step of firing the composite laminate at the sintering temperature of the green sheet. , And a step of removing the firing shrinkage suppression sheet and unsintered inorganic composition of the green from the composite laminate after the firing, characterized in that.
これによれば、ペースト状の上記無機組成物は、キャビティ内に減圧しつつ充填されるか、あるいは当該キャビティ内に充填された後に減圧されるため、キャビティの内面との間に隙間を生じることなく均一に充填される。このため、グリーンシート積層体の焼成時において、かかる無機組成物によるキャビティの底面を形成するグリーンシートの焼成収縮を抑制できるので、形状および寸法精度の高いキャビティを有するキャビティ付き多層セラミック基板を確実に製造することが可能となる。
尚、前記表・裏面を有するグリーンシートや貫通孔を有するグリーンシートは、それぞれ単一のグリーンシートの形態の他、複数のグリーンシートを積層した形態も含まれ、これらの間には所定パターンの配線層が形成されている。
According to this, the paste-like inorganic composition is filled while reducing the pressure in the cavity, or is reduced in pressure after being filled in the cavity, so that a gap is formed between the inner surface of the cavity. Evenly filled. For this reason, when the green sheet laminate is fired, the firing shrinkage of the green sheet that forms the bottom surface of the cavity due to the inorganic composition can be suppressed, so that a multilayer ceramic substrate with a cavity having a cavity with high shape and dimensional accuracy can be reliably obtained. It can be manufactured.
The green sheet having the front and back surfaces and the green sheet having the through-holes include not only a single green sheet but also a plurality of stacked green sheets, each having a predetermined pattern between them. A wiring layer is formed.
また、本発明には、前記グリーンシートは、セラミックとガラス(成分)との混合物からなると共に、前記無機組成物は、前記焼成収縮抑制シートを構成するセラミックのみからなるか、あるいは上記セラミックとガラスとの混合物からなり且つかかるガラスの含有量は２０wt％以下で且つ上記グリーンシートのガラス含有量よりも少ない、キャビティ付き多層セラミック基板の製造方法(請求項２)も含まれる。これによれば、焼成工程において、無機組成物中のガラスが軟化した後、グリーンシートの表面に均一に拡散するため、キャビティの底面を形成するグリーンシートの焼成収縮を確実に抑制することができる。
尚、上記セラミックには、アルミナや窒化アルミニウム(ＡｌＮ)などが含まれ、上記ガラスには、アルミナ、ケイ酸、およびＢ２Ｏ３を主成分とするケイ酸ホウケイ酸系ガラスが含まれる。また、無機組成物におけるガラスの含有量が２０wt％を越えると、隣接し且つキャビティの底面を形成するグリーンシートとの間に、軟化および流動化したガラス(成分)が介在して固まるため、焼成後における無機組成物の除去が困難となり、キャビティの形状および寸法精度が低下する。これを防ぐため、上記範囲としたものである。
Further, in the present invention, the green sheet is made of a mixture of ceramic and glass (component), and the inorganic composition is made only of the ceramic constituting the fired shrinkage suppressing sheet, or the ceramic and glass are mixed. And a method for producing a multilayer ceramic substrate with a cavity, wherein the glass content is 20 wt% or less and less than the glass content of the green sheet (Claim 2). According to this, in the firing step, after the glass in the inorganic composition is softened, it is uniformly diffused on the surface of the green sheet, so that the firing shrinkage of the green sheet forming the bottom surface of the cavity can be reliably suppressed. .
The ceramic includes alumina, aluminum nitride (AlN), and the like, and the glass includes alumina, silicic acid, and silicate borosilicate glass mainly containing B 2 O 3 . In addition, when the glass content in the inorganic composition exceeds 20 wt%, the softened and fluidized glass (component) is interposed between the adjacent green sheets forming the bottom surface of the cavity and hardened. It becomes difficult to remove the inorganic composition later, and the shape and dimensional accuracy of the cavity are lowered. In order to prevent this, the above range is adopted.
更に、本発明には、前記無機組成物に含まれるガラスの軟化点は、前記グリーンシートに含まれるガラスの軟化点と同等またはそれ以下である、キャビティ付き多層セラミック基板の製造方法(請求項３)も含まれる。
これによれば、焼成工程において、無機組成物に含まれるガラスは、グリーンシートに含まれるガラスと同時に、あるいはこれよりも早く軟化するが、無機組成物に隣接し且つキャビティの底面を形成するグリーンシートに対して、かかる無機組成物中のガラス(成分)が、両者の界面を経て当該グリーンシート中に浸透(拡散)し易くなる。この結果、かかる無機組成物に隣接するグリーンシートの焼成収縮を確実に抑制できるため、クラックがなく形状および寸法精度の高いキャビティを形成できる。
Furthermore, the present invention provides a method for producing a multilayer ceramic substrate with a cavity, wherein the softening point of the glass contained in the inorganic composition is equal to or lower than the softening point of the glass contained in the green sheet. ) Is also included.
According to this, in the firing step, the glass contained in the inorganic composition is softened simultaneously with or earlier than the glass contained in the green sheet, but is adjacent to the inorganic composition and forms the bottom surface of the cavity. The glass (component) in the inorganic composition easily permeates (diffuses) into the green sheet through the interface between the two. As a result, since the firing shrinkage of the green sheet adjacent to the inorganic composition can be surely suppressed, a cavity having high shape and dimensional accuracy can be formed without cracks.
加えて、本発明には、前記無機組成物は、前記グリーンシートが溶解可能な有機溶媒を含む、キャビティ付き多層セラミック基板の製造方法(請求項４)も含まれる。これによれば、キャビティ内に均一に充填された無機組成物から有機触媒がかかる無機組成物に隣接するグリーンシートを溶解するため、当該無機組成物とグリーンシートとの密着性を更に高められる。このため、焼成工程におけるキャビティ底面を形成するグリーンシートのクラックの発生を防ぎ、且つかかるキャビティの形状および寸法精度を確保することが容易となる。
尚、有機溶媒は、例えば酢酸ブチルが用いられ、１〜５wt％の範囲で無機組成物に添加されるが、望ましい含有量は、１〜３wt％である。
In addition, the present invention includes a method for producing a multilayer ceramic substrate with a cavity, wherein the inorganic composition contains an organic solvent in which the green sheet can be dissolved (Claim 4). According to this, since the green sheet adjacent to the inorganic composition to which the organic catalyst is applied is dissolved from the inorganic composition uniformly filled in the cavity, the adhesion between the inorganic composition and the green sheet can be further enhanced. For this reason, it becomes easy to prevent generation | occurrence | production of the crack of the green sheet which forms the cavity bottom face in a baking process, and to ensure the shape and dimensional accuracy of this cavity.
For example, butyl acetate is used as the organic solvent, and it is added to the inorganic composition in the range of 1 to 5 wt%, but the desirable content is 1 to 3 wt%.
以下において、本発明を実施するための最良の形態について説明する。
図１は、表面および裏面を有し且つかかる表面と裏面との間を貫通する貫通孔ｃを有するグリーンシートｓ１〜ｓ３と、表面および裏面を有するグリーンシートｓ４〜ｓ６との断面を示す。グリーンシートｓ１〜ｓ６は、重量比が１：１のホウケイ酸系ガラスとアルミナとを主成分とし、これらの粉末に有機バインダおよび可塑剤成分を添加して混合し、得られたセラミックスラリをドクターブレード法によりシート化したもので、それぞれ約１５０μｍの厚みを有する。また、貫通孔ｃは、平面視で正方形(例えば３ｍｍ×３ｍｍ)または長方形を呈する。
In the following, the best mode for carrying out the present invention will be described.
FIG. 1 shows cross sections of green sheets s1 to s3 having a front surface and a back surface and having through holes c penetrating between the front surface and the back surface, and green sheets s4 to s6 having a front surface and a back surface. The green sheets s1 to s6 are mainly composed of a borosilicate glass having a weight ratio of 1: 1 and alumina, and an organic binder and a plasticizer component are added to and mixed with these powders. Each of which is formed into a sheet by a blade method and has a thickness of about 150 μm. Moreover, the through-hole c exhibits a square (for example, 3 mm × 3 mm) or a rectangle in plan view.
図１に示すように、グリーンシートｓ１〜ｓ６の表面および裏面の少なくとも一方には、配線(表層電極)４，１０または所定パターンの配線層５〜９が形成されている。配線・配線層４〜１０は、厚みが約１５μｍのＡｇ粉などを含む導電性ペーストからなる。上記配線・配線層４〜１０には、グリーンシートｓ１〜ｓ６の表面と裏面との間を貫通する直径約１５０μｍのビア導体ｖが個別に接続され、かかるビア導体ｖもＡｇ粉などを含む導電性ペーストからなる。尚、グリーンシートｓ１〜ｓ６は、多数個取り用の大版のグリーンシートとしても良い。
次に、図１に示すように、グリーンシートｓ１〜ｓ６をそれらの順序で積層して圧着する。
As shown in FIG. 1, wirings (surface layer electrodes) 4 and 10 or
Next, as shown in FIG. 1, the green sheets s <b> 1 to s <b> 6 are stacked in that order and pressed.
その結果、図２に示すように、積層されたグリーンシートｓ１〜ｓ６からなり、表面１に開口するキャビティＣを有するキャビティ付きグリーンシート積層体ｓｓが形成され、キャビティＣの底面には、グリーンシートｓ４の表面が露出する。同時に、前記配線・配線層４〜１０間は、ビア導体ｖを介して接続される。また、上記積層体ｓｓの表面１と裏面２とには、配線４，１０が位置する。尚、上記キャビティＣは、平面視が一辺３ｍｍの正方形を呈し、その深さは約０．５ｍｍである。
次いで、キャビティ付きグリーンシート積層体ｓｓを図示しない気密チャンバ内に収容し、かかるチャンバ内を約２．５×１０４Ｐａに減圧する。
この減圧状態で、図３に示すように、キャビティ付きグリーンシート積層体ｓｓのキャビティＣの開口部付近にペースト状の無機組成物ｚを塗布する。かかる無機組成物ｚは、少なくともアルミナと１〜５wt％の酢酸ブチルとを含み、更にこれらに２０wt％以下のガラスを含んだものである。このガラスの軟化点は、グリーンシートｓ１〜ｓ６に含まれるガラスの軟化点と同じか、それ以下である。
As a result, as shown in FIG. 2, a green sheet laminate ss with cavities having cavities C opened on the
Next, the green sheet laminate ss with cavities is accommodated in an airtight chamber (not shown), and the inside of the chamber is decompressed to about 2.5 × 10 4 Pa.
In this reduced pressure state, as shown in FIG. 3, the paste-like inorganic composition z is applied in the vicinity of the opening of the cavity C of the green sheet laminate ss with cavities. Such an inorganic composition z contains at least alumina and 1 to 5 wt% of butyl acetate, and further contains 20 wt% or less of glass. The softening point of this glass is the same as or lower than the softening point of the glass contained in the green sheets s1 to s6.
次に、前記気密チャンバ内を約５．０×１０４Ｐａに加圧する。この結果、前記積層体ｓｓのキャビティＣ外の圧力ｐ１がキャビティＣ内の圧力ｐ２よりも相対的に高くなって差圧が生じるため、図３中の矢印で示すように、ペースト状の無機組成物ｚは、当該キャビティＣの底面寄りに強制的に吸引される。同時に、当該キャビティＣ中の残留エアは、泡状の気泡となって上記無機組成物ｚを通過し、キャビティＣの外側に放出される。即ち、上記無機組成物ｚは、減圧されつつあるキャビティＣ中に均一に充填される。尚、図示しないメタルマスクおよびスキージを用い、無機組成物ｚをキャビティＣに物理的に充填した後、前記気密チャンバ内を約１．０×１０４Ｐａに減圧して強制的に充填しても良い。この場合も、キャビティＣの底面内隅部に残る隙間のエアを気泡として放出できる。 Next, the inside of the airtight chamber is pressurized to about 5.0 × 10 4 Pa. As a result, the pressure p1 outside the cavity C of the laminate ss becomes relatively higher than the pressure p2 inside the cavity C, resulting in a differential pressure. Therefore, as shown by the arrows in FIG. The object z is forcibly sucked closer to the bottom surface of the cavity C. At the same time, the residual air in the cavity C becomes bubble-like bubbles, passes through the inorganic composition z, and is discharged to the outside of the cavity C. That is, the inorganic composition z is uniformly filled into the cavity C being decompressed. In addition, after physically filling the cavity C with the inorganic composition z using a metal mask and a squeegee (not shown), the inside of the airtight chamber may be reduced to about 1.0 × 10 4 Pa and forcibly filled. good. Also in this case, the air in the gap remaining at the inner corner of the bottom surface of the cavity C can be released as bubbles.
その結果、図４に示すように、無機組成物ｚは、キャビティＣ中に隙間なく均一に充填される。尚、キャビティＣの開口部よりも上方の余分な無機組成物ｚは、スキージなどにより掻き出されるため、無機組成物ｚの上面は、キャビティ付きグリーンシート積層体ｓｓの表面１と面一となる。
更に、キャビティＣに無機組成物ｚが充填されたキャビティ付きグリーンシート積層体ｓｓを前記チャンバから取り出し、図５に示すように、その表面１および裏面２(両面)に、焼成収縮抑制シートｙ１，ｙ２を圧着し且つ積層して複合積層体ｆｓを形成する。かかる焼成収縮抑制シートｙ１，ｙ２は、アルミナ粉末に有機バインダおよび可塑剤成分を添加して得たセラミックスラリをドクターブレード法によって、厚さ約２５０μｍにシート化したものである。
尚、図６に示すように、焼成収縮抑制シートｙ１に替えて、前記同様の形状および大きさの貫通孔ｃを内側に有する焼成収縮抑制シートｙ３をグリーンシート積層体ｓｓの表面１上に積層し、上記貫通孔ｃの底面に無機組成物ｚの上面を位置させた複合積層体ｆｓを形成しても良い。
As a result, as shown in FIG. 4, the inorganic composition z is uniformly filled in the cavity C without a gap. In addition, since the excess inorganic composition z above the opening part of the cavity C is scraped out by a squeegee or the like, the upper surface of the inorganic composition z is flush with the
Furthermore, the green sheet laminate ss with cavities in which the cavity C is filled with the inorganic composition z is taken out of the chamber, and as shown in FIG. The composite laminate fs is formed by pressing and stacking y2. Such firing shrinkage-suppressing sheets y1 and y2 are obtained by forming a ceramic slurry obtained by adding an organic binder and a plasticizer component to alumina powder into a thickness of about 250 μm by a doctor blade method.
As shown in FIG. 6, instead of the firing shrinkage suppression sheet y1, a firing shrinkage suppression sheet y3 having a through-hole c having the same shape and size as described above is laminated on the
次に、複合積層体ｆｓを図示しない焼成炉に挿入し、グリーンシートｓ１〜ｓ６の焼結温度(８００〜１０００℃)で所要時間にわたり加熱して焼成する。この際、前記配線層５などやビア導体ｖも同時に焼結される。また、焼成後において、グリーンシートｓ１〜ｓ６が焼結したセラミック層は、未焼結の焼成収縮抑制シートｙ１，ｙ２に表面１および裏面２で拘束されるため、平面方向の焼成収縮を抑制される。しかも、キャビティＣの底面を形成するグリーンシートｓ４が焼結して得られるセラミック層も、隣接する未焼結の無機組成物ｚにより拘束されるため、平面方向の焼成収縮を抑制される。
Next, the composite laminate fs is inserted into a firing furnace (not shown), and fired at a sintering temperature (800 to 1000 ° C.) of the green sheets s1 to s6 for a required time. At this time, the
更に、焼成された複合積層体ｆｓから未焼結の焼成収縮抑制シートｙ１(ｙ３)，ｙ２およびキャビティＣ内の無機組成物ｚを除去する。かかる除去工程は、焼成後の複合積層体ｆｓを例えば２５℃において３０分以上保持した後、１０℃の冷水(冷却媒体)中に投入して浸漬し、焼成収縮抑制シートｙ１，ｙ２および無機組成物ｚ中の焼結時の残留応力を瞬時に開放する熱衝撃によって迅速に行える。
その結果、図７に示すように、前記グリーンシートｓ１〜ｓ６が焼結したセラミック層Ｓ１〜Ｓ６からなるセラミック基板ＳＫ、前記導電性ペーストが焼結した配線４，１０や所定パターンの配線層５〜９、ビア導体ｖ、および表面１に開口するキャビティＣを有するキャビティ付き多層セラミック基板Ｋ１を得ることができる。
尚、焼成収縮抑制シートｙ１，ｙ２および無機組成物ｚの除去は、水とアルミナなどの硬質粒子との混合物を吹き付ける方法により行っても良い。
Further, the unsintered firing shrinkage suppression sheets y1 (y3) and y2 and the inorganic composition z in the cavity C are removed from the fired composite laminate fs. In this removal step, the fired composite laminate fs is held, for example, at 25 ° C. for 30 minutes or more, and then poured into 10 ° C. cold water (cooling medium) and immersed therein, and the firing shrinkage suppression sheets y1, y2 and the inorganic composition Residual stress at the time of sintering in the object z can be quickly achieved by thermal shock that instantaneously releases the residual stress.
As a result, as shown in FIG. 7, the ceramic substrate SK composed of the ceramic layers S1 to S6 sintered with the green sheets s1 to s6, the
The removal of the firing shrinkage suppression sheets y1 and y2 and the inorganic composition z may be performed by a method of spraying a mixture of water and hard particles such as alumina.
尚、図７に示すように、キャビティＣ内に実装したＩＣチップ１２は、その上面に位置する図示しない接続端子が表面１の配線(表層電極)４との間でロウ付けされるワイヤｗを介して接続される。また、基板Ｋ１の裏面２の配線(表層電極)１０は、その表面にＡｕメッキおよびＮｉメッキが被覆され、図示しないマザーボードとの接続端子として活用される。
以上のような工程を経る製造方法によれば、平面方向の焼成収縮が抑制されたセラミック層Ｓ１〜Ｓ６および底面にクラックがなく且つ形状や寸法精度の高いキャビティＣを有するキャビティ付き多層セラミック基板Ｋ１を確実に提供することができる。尚、前述した多数個取り用の大版のグリーンシートを用いて、前記積層体ｓｓの形成工程、無機組成物ｚのキャビティＣへの充填工程、複合積層体ｆｓの形成工程、焼成工程、および無機組成物ｚなどの除去工程を行っても良い。この場合、上記除去工程の後、大版の多層セラミック基板の集合体を、例えばダイシング加工で個別のキャビティ付き多層セラミック基板Ｋ１に分割する。
As shown in FIG. 7, the
According to the manufacturing method through the steps as described above, the multilayer ceramic substrate K1 with the cavity having the ceramic layers S1 to S6 in which the firing shrinkage in the planar direction is suppressed and the cavity C having no cracks on the bottom surface and high shape and dimensional accuracy. Can be reliably provided. In addition, using the large-sized green sheet for multi-cavity described above, the step of forming the laminate ss, the step of filling the inorganic composition z into the cavity C, the step of forming the composite laminate fs, the firing step, You may perform the removal process of inorganic composition z. In this case, after the removing step, the large-sized multilayer ceramic substrate assembly is divided into individual multilayer ceramic substrates K1 with cavities, for example, by dicing.
ここで本発明の具体的な実施例について、比較例と併せて説明する。
ケイ酸、アルミナ、およびＢ２Ｏ３を主成分とするホウケイ酸系ガラス粉末とアルミナ粉末とを、重量比が１：１で且つ総重量１ｋｇに秤量して、アルミナ製のポットに投入した。上記アルミナ粉末は、平均粒径：３μｍ、比表面積：１．０ｍ２／ｇである。また、上記ガラス粉末とアルミナ粉末との重量比１：１は、一般的な低温焼成基板に比べて、ガラス成分が過剰である。
上記ポット中に、アクリル樹脂系バインダ：１２０ｇと、適当なスラリ粘度およびシート強度を与えるのに必要な量の溶剤(ＭＥＫ：メチルエチルケトン)と可塑剤(ＤＯＰ：ジオクチルフタレート)とを添加した後、５時間にわたり混合することで、セラミックスラリを得た。かかるスラリをドクターブレード法によって、厚みが１５０μｍで且つ縦・横２００ｍｍずつの大版のグリーンシートに形成した。かかるグリーンシートを複数枚用意した。
Here, specific examples of the present invention will be described together with comparative examples.
A borosilicate glass powder mainly composed of silicic acid, alumina, and B 2 O 3 and alumina powder were weighed to a weight ratio of 1: 1 and a total weight of 1 kg, and charged into an alumina pot. The alumina powder has an average particle size of 3 μm and a specific surface area of 1.0 m 2 / g. Moreover, the weight ratio 1: 1 of the glass powder and the alumina powder has an excessive glass component as compared with a general low-temperature fired substrate.
After adding 120 g of an acrylic resin binder, an amount of a solvent (MEK: methyl ethyl ketone) and a plasticizer (DOP: dioctyl phthalate) necessary to give an appropriate slurry viscosity and sheet strength to the pot, 5 A ceramic slurry was obtained by mixing over time. This slurry was formed on a large green sheet having a thickness of 150 μm and a length and width of 200 mm by the doctor blade method. A plurality of such green sheets were prepared.
また、前記と同じアルミナ粉末のみからなる１組のアルミナ粉末と、アルミナ粉末および５〜２０wt％の前記と同じ種類のガラス粉末からなる複数組の混合粉末を用意した。尚、上記ガラス(成分)の軟化点は、前記グリーンシートに含まれるガラスの軟化点とほぼ同じである。
上記アルミナ粉末または混合粉末に、前記同様のアクリル樹脂系バインダを個別に添加し、更に１組の混合粉末を除き、１，３，５wt％の酢酸ブチル(有機溶媒)を添加して、合計９種類のペースト状の無機組成物を用意した。
更に、前記と同じアルミナ粉末に、アクリル樹脂系バインダ、溶剤(ＭＥＫ)、および可塑剤(ＤＯＰ)を前記同様に添加し且つ混合してセラミックスラリを得ると共に、かかるスラリをドクターブレード法により、厚みが２５０μｍの焼成収縮抑制シートを複数枚形成した。
A set of mixed powders consisting of only one set of alumina powder consisting of the same alumina powder as described above, and 5-20 wt% of the same kind of glass powder as described above were prepared. The softening point of the glass (component) is substantially the same as the softening point of the glass contained in the green sheet.
To the above-mentioned alumina powder or mixed powder, an acrylic resin binder similar to the above is added individually, and one set of mixed powder is removed, and 1,3,5 wt% of butyl acetate (organic solvent) is added, for a total of 9 Various types of paste-like inorganic compositions were prepared.
Further, an acrylic resin binder, a solvent (MEK), and a plasticizer (DOP) are added to the same alumina powder as described above and mixed in the same manner as described above to obtain a ceramic slurry, and the slurry is thickened by a doctor blade method. Were formed a plurality of baking shrinkage suppression sheets having a thickness of 250 μm.
前記大版のグリーンシートのうち、一部について縦・横：３ｍｍ×３ｍｍの貫通孔を縦×横方向にそれぞれ６個ずつ合計３６個穿孔した。かかる貫通孔付きのグリーンシート３枚と、貫通孔のないグリーンシート３枚とを積層して、９組の多数個取り用のキャビティ付きグリーンシート積層体を形成した。
各組の上記グリーンシート積層体における３６個のキャビティに対し、表１に示すように、先に減圧された気密チャンバ中に移し、各キャビティの開口部に無機組成物を塗布してから更にキャビティの内外に差圧を設けて減圧しつつ充填するか、予めキャビティにペースト状の無機組成物を物理的に充填した後に気密チャンバ中に移して減圧するか、あるいは、何れの減圧充填も行わずにメタルマスクとスキージとを用いて物理的に無機組成物を充填した。
A part of the large size green sheet was perforated with a total of 36 through-holes of 3 mm × 3 mm in the vertical and horizontal directions. Three green sheets with through-holes and three green sheets without through-holes were laminated to form nine sets of green sheet laminates with cavities for multi-cavity.
As shown in Table 1, the 36 cavities in each set of the green sheet laminates were transferred to an airtight chamber previously depressurized, and the inorganic composition was applied to the openings of the cavities, and then the cavities were further increased. Fill the cavity with a differential pressure inside and outside, or fill the cavity in advance with a paste-like inorganic composition and then transfer it into an airtight chamber to reduce the pressure, or do not perform any vacuum filling The inorganic composition was physically filled using a metal mask and a squeegee.
各組のキャビティへの無機組成物の充填方法、各組の無機組成物のガラス含有量、およびグリーンシートが溶解可能な有機溶媒成分(酢酸ブチル：有機溶媒)量によって、表１に示すように、実施例１〜６および比較例１〜３に区分した。
各例のキャビティに無機組成物を充填したグリーンシート積層体の両面に、焼成収縮抑制シートをそれぞれ圧着して積層し、各組ごとに複合積層体を得た。
各例の複合積層体を図示しない焼成炉に入れ、前記グリーンシートの焼結温度(約９００℃)で焼成した。焼成後の各例の複合積層体を２５℃に３０分以上保持した後、１０℃の冷水中に浸漬して、未焼成の焼成収縮抑制シートと無機組成物とを除去し、各例ごとにキャビティ付き多層セラミック基板(大版)を得た。
As shown in Table 1, depending on the filling method of the inorganic composition into each set of cavities, the glass content of each set of inorganic composition, and the amount of organic solvent component (butyl acetate: organic solvent) in which the green sheet can be dissolved These were divided into Examples 1 to 6 and Comparative Examples 1 to 3.
A fired shrinkage suppression sheet was laminated on both sides of a green sheet laminate in which the cavity of each example was filled with an inorganic composition, and a composite laminate was obtained for each set.
The composite laminate of each example was placed in a firing furnace (not shown) and fired at the green sheet sintering temperature (about 900 ° C.). After holding the composite laminate of each example after firing at 25 ° C. for 30 minutes or more, it was immersed in cold water at 10 ° C. to remove the unfired firing shrinkage suppression sheet and the inorganic composition, and for each example A multilayer ceramic substrate (large plate) with cavities was obtained.
各例の上記多層セラミック基板について、３６個のキャビティ全てを目視で観察した上、それらの底面にクラックが１箇所も発見されなかったものを「○無」とし、１箇所でもクラックが発見されたものを「×有」として、表１に示した。
また、前記除去工程で、各例のキャビティの全てから無機組成物が容易に除去できたものを「○容易」とし、１箇所のキャビティでも無機組成物の除去が困難であったものを「×困難」として、表１に示した。
Regarding the multilayer ceramic substrate in each example, all 36 cavities were visually observed, and no cracks were found on the bottom surface of the multilayer ceramic substrates. The results are shown in Table 1 as “x present”.
Further, in the removal step, the case where the inorganic composition could be easily removed from all the cavities of each example was “◯ easy”, and the case where it was difficult to remove the inorganic composition even at one cavity was “× It is shown in Table 1 as “difficult”.
表１によれば、実施例１〜６のキャビティ付き多層セラミック基板は、何れかの減圧充填方法で無機組成物がキャビティに均一に充填され、且つ用いた無機組成物のガラス含有量が無いか２０wt％以下であり、しかも、グリーンシートが溶解可能な成分の酢酸ブチル(有機溶媒)が１，３，５wt％の何れかであったため、全てのキャビティでクラックが発生しなかった。また、グリーンシートに含まれるガラスの一部が無機組成物に浸透したが、無機組成物のガラス含有量が無いか若しくは少ないため、キャビティの底面に溶出せず、焼成後での無機組成物の除去が容易に行え、且つ形状および寸法精度が高く清浄な底面のキャビティを得ることができた。
一方、表１によれば、比較例１のキャビティ付き多層セラミック基板は、無機組成物を物理的に充填したため、図８に示すように、キャビティＣの底面の内隅に沿って隙間ｑが形成されていた。かかる隙間ｑが残った状態で、焼成したため、隙間ｑの直下におけるセラミック層Ｓ４には、クラックｋが発生していた。
According to Table 1, the multilayer ceramic substrates with cavities of Examples 1 to 6 are filled with the inorganic composition uniformly by any vacuum filling method, and there is no glass content of the used inorganic composition. Since the content of butyl acetate (organic solvent), which is 20 wt% or less and the green sheet can be dissolved, was 1, 3, 5 wt%, cracks did not occur in all the cavities. In addition, a part of the glass contained in the green sheet penetrated into the inorganic composition, but since there is no or little glass content of the inorganic composition, it does not elute on the bottom of the cavity, and the inorganic composition after firing Removal was easy, and a clean bottom cavity with high shape and dimensional accuracy could be obtained.
On the other hand, according to Table 1, since the multilayer ceramic substrate with a cavity of Comparative Example 1 was physically filled with an inorganic composition, a gap q was formed along the inner corner of the bottom surface of the cavity C as shown in FIG. It had been. Since firing was performed with the gap q remaining, cracks k occurred in the ceramic layer S4 immediately below the gap q.
また、表１に示すように、比較例２のキャビティ付き多層セラミック基板は、無機組成物をキャビティに充填と同時に減圧して均一に充填したが、かかる無機組成物にはグリーンシート溶解可能な成分の酢酸ブチル(有機溶媒)に含まれていなかった。このため、キャビティの底面や側面のグリーンシートに対する拘束力が小さくなり、クラックキャビティの底面にクラックが発生した。
更に、表１に示すように、比較例３のキャビティ付き多層セラミック基板も、無機組成物をキャビティに充填と同時に減圧して均一に充填したが、かかる無機組成物のガラス含有量が３０wt％と過多であったため、隣接するグリーンシートへ浸透すべきガラス(成分)がキャビティ底面において溶出した。この結果、前記除去工程で、キャビティの底面やこれに近接する側面に固着したガラス(成分)が残ったため、無機組成物の除去が困難となった。
以上のような実施例１〜６の結果によって、本発明の製造方法における作用および効果が容易に理解されよう。
Moreover, as shown in Table 1, the multilayer ceramic substrate with cavity of Comparative Example 2 was uniformly filled by reducing the pressure simultaneously with filling the cavity with the inorganic composition. Of butyl acetate (organic solvent). For this reason, the restraining force with respect to the green sheet of the bottom face or side surface of the cavity was reduced, and a crack was generated on the bottom face of the crack cavity.
Furthermore, as shown in Table 1, the multilayer ceramic substrate with a cavity of Comparative Example 3 was also uniformly filled by reducing the pressure simultaneously with filling the cavity with the inorganic composition. The glass content of the inorganic composition was 30 wt%. Since it was excessive, the glass (component) to penetrate into the adjacent green sheet was eluted at the bottom of the cavity. As a result, since the glass (component) adhered to the bottom surface of the cavity and the side surface adjacent thereto remained in the removing step, it was difficult to remove the inorganic composition.
From the results of Examples 1 to 6 as described above, the operation and effect of the manufacturing method of the present invention will be easily understood.
図９は、異なる形態のキャビティＣ１を有するキャビティ付きグリーンシート積層体ｓｓの断面を示す。この積層体ｓｓは、大きな貫通孔を有するグリーンシートｓ７とこれよりもやや小さな貫通孔を有するグリーンシートｓ８とを、前記と同じグリーンシートｓ３〜ｓ６の上方に積層したものであり、キャビティＣ１側のグリーンシートｓ７，ｓ８，ｓ３の間には段部ｄ１，ｄ２が階段状に位置している。尚、グリーンシートｓ７，ｓ８も前記同様の材料および厚みを有する。
図９に示すように、グリーンシートｓ７〜ｓ６間には、前記同様の導電性ペーストからなる配線層５〜９が所定パターンで形成され、且つ上記積層体ｓｓの表面１および裏面２には、表層電極の配線４，１０が前記同様に配置されると共に、これらの間はビア導体ｖを介して接続されている。また、配線層５，６から段部ｄ１，ｄ２上に接続端子である複数の配線５ａ，６ａが個別に延びている。
FIG. 9 shows a cross section of a green sheet laminate ss with cavities having cavities C1 of different forms. This laminated body ss is obtained by laminating a green sheet s7 having a large through hole and a green sheet s8 having a slightly smaller through hole above the same green sheets s3 to s6 as described above, and on the cavity C1 side. Between the green sheets s7, s8, and s3, step portions d1 and d2 are positioned stepwise. The green sheets s7 and s8 also have the same material and thickness as described above.
As shown in FIG. 9, between the green sheets s7 to s6,
次に、グリーンシート積層体ｓｓのキャビティＣ１に前記同様の材料からなるペースト状の無機組成物ｚを充填した後、図示しない気密チャンバに挿入して減圧する。その結果、図１０に示すように、無機組成物ｚは、側面が階段状のキャビティＣ１中に隙間なく均一になるよう強制的に充填される。
尚、グリーンシート積層体ｓｓを減圧した気密チャンバに挿入し、キャビティＣ１の開口部付近に無機組成物ｚを塗布した後、当該チャンバ内を加圧して、キャビティＣ１内との差圧により、上記無機組成物ｚを強制的に充填しても良い。
次いで、図１１に示すように、グリーンシート積層体ｓｓの表面１および裏面２(両面)に、前記同様の焼成収縮抑制シートｙ１，ｙ２を圧着し且つ積層して複合積層体ｆｓを形成する。
Next, after filling the cavity C1 of the green sheet laminate ss with the paste-like inorganic composition z made of the same material as described above, it is inserted into an airtight chamber (not shown) and decompressed. As a result, as shown in FIG. 10, the inorganic composition z is forcibly filled so that the side surface is uniform in the stepped cavity C <b> 1 without a gap.
The green sheet laminate ss is inserted into an airtight chamber having a reduced pressure, and after applying the inorganic composition z in the vicinity of the opening of the cavity C1, the inside of the chamber is pressurized and the pressure difference between the inside and the cavity C1 The inorganic composition z may be forcibly filled.
Next, as shown in FIG. 11, the same firing shrinkage suppression sheets y1 and y2 as those described above are pressure-bonded and laminated on the
更に、複合積層体ｆｓを図示しない焼成炉に挿入し、グリーンシートｓ３〜ｓ８の焼結温度(８００〜１０００℃)で所要時間にわたり加熱して焼成する。この際、前記配線層５などやビア導体ｖも同時に焼結される。また、焼成後において、グリーンシートｓ３〜ｓ８が焼結したセラミック層は、未焼結の焼成収縮抑制シートｙ１，ｙ２に表面１および裏面２で拘束されているため、平面方向の焼成収縮を抑制される。しかも、キャビティＣ１の底面を形成するグリーンシートｓ４やキャビティＣ１の段部ｄ１，ｄ２を形成するグリーンシートｓ３，ｓ８が焼結して得られるセラミック層も、隣接する未焼結の無機組成物ｚに拘束されるため、平面方向の焼成収縮を抑制される。
Further, the composite laminate fs is inserted into a firing furnace (not shown), and heated and fired at a sintering temperature (800 to 1000 ° C.) of the green sheets s3 to s8 for a required time. At this time, the
次に、焼成された複合積層体ｆｓから未焼結の焼成収縮抑制シートｙ１，ｙ２およびキャビティＣ１内の無機組成物ｚを除去する。かかる除去工程も、焼成後の複合積層体ｆｓを例えば２５℃において３０分以上保持した後、１０℃の冷水中に浸漬し、焼成収縮抑制シートｙ１，ｙ２および無機組成物ｚ中の焼結時における残留応力を瞬時に開放する熱衝撃によって迅速に行われる。
その結果、図１２に示すように、前記グリーンシートｓ３〜ｓ８が焼結したセラミック層Ｓ３〜Ｓ８からなるセラミック基板ＳＫ、前記導電性ペーストが焼結した配線４，１０や所定パターンの配線層５〜９、ビア導体ｖ、および表面１に開口するキャビティＣ１を有するキャビティ付き多層セラミック基板Ｋ２を得られる。
Next, the unsintered firing shrinkage suppression sheets y1 and y2 and the inorganic composition z in the cavity C1 are removed from the fired composite laminate fs. Also in this removal step, the fired composite laminate fs is held at, for example, 25 ° C. for 30 minutes or more, then immersed in cold water at 10 ° C., and sintered in the firing shrinkage suppression sheets y1, y2 and the inorganic composition z. This is done quickly by thermal shock that instantaneously releases the residual stress at.
As a result, as shown in FIG. 12, the ceramic substrate SK composed of the ceramic layers S3 to S8 sintered with the green sheets s3 to s8, the
尚、図１２に示すように、キャビティＣ１内に実装したＩＣチップ１２は、その上面に位置する図示しない接続端子が表面１の配線４や段部ｄ１，ｄ２の配線５ａ，６ａとの間でロウ付けされるワイヤｗを介して接続される。
以上のような工程を経る製造方法によれば、平面方向の焼成収縮が抑制されたセラミックＳ３〜Ｓ８と底面などにクラックがなく且つ形状や寸法精度の高いキャビティＣ１とを有するキャビティ付き多層セラミック基板Ｋ２を確実に提供できる。尚、前述した多数個取り用の大版のグリーンシートを用いて、前記積層体ｓｓの形成工程、無機組成物ｚのキャビティＣ１への充填工程、複合積層体ｆｓの形成工程、焼成工程、および無機組成物ｚなどの除去工程を行っても良い。
As shown in FIG. 12, the
According to the manufacturing method through the above steps, a multilayer ceramic substrate with a cavity having ceramics S3 to S8 in which firing shrinkage in the planar direction is suppressed and a cavity C1 having no cracks in the bottom surface and the like and having a high shape and dimensional accuracy. K2 can be reliably provided. In addition, using the large-sized green sheet for multi-cavity described above, the step of forming the laminate ss, the step of filling the inorganic composition z into the cavity C1, the step of forming the composite laminate fs, the firing step, and You may perform the removal process of inorganic composition z.
本発明は、以上において説明した各形態に限定されるものではない。
例えば、前記配線層４などやビア導体ｖは、Ｗ、Ｍｏ、Ｃｕなどの金属、またはＡｇ−Ｃｕ、Ｃｕ−Ｗ、Ａｇ−Ｐｄ、Ａｇ−Ｐｔなどの合金としても良く、前記各製造方法の準備工程では、これらの金属粉末または合金粉末を含む導電性ペーストを用いて良い。
また、キャビティ付き多層セラミック基板Ｋ１，Ｋ２の裏面２に位置する表層電極の配線１０には、ＮｉメッキおよびＡｕメッキした表面１０ｂに、ハンダボールまたは導体ピンなどをハンダ付けしても良い。
更に、前記キャビティ付き多層セラミック基板Ｋ１，Ｋ２には、複数のキャビティＣ，Ｃ１を形成しても良く、この場合、前記グリーンシートｓ１〜ｓ３またはグリーンシートｓ３，ｓ７，ｓ８に複数の貫通孔ｃを予め開設しておく。
The present invention is not limited to the embodiments described above.
For example, the
Further, the surface
Furthermore, a plurality of cavities C, C1 may be formed in the multilayer ceramic substrates K1, K2 with cavities. In this case, a plurality of through holes c are formed in the green sheets s1 to s3 or the green sheets s3, s7, s8. Is established in advance.
１………………表面
２………………裏面
ｓ１〜ｓ８……グリーンシート
ｃ………………貫通孔
ｓｓ……………グリーンシート積層体
Ｃ，Ｃ１………キャビティ
ｚ………………無機組成物
ｙ１〜ｙ３……焼成収縮抑制シート
ｆｓ……………複合積層体
Ｋ１，Ｋ２……キャビティ付き多層セラミック基板
1 ………………
Claims (4)
上記グリーンシートの焼結温度よりも高い焼結温度を有するペースト状の無機組成物を、上記キャビティ内に減圧しつつ充填するか、あるいは当該キャビティ内に充填した後に減圧する工程と、
上記無機組成物を含むキャビティ付きグリーンシート積層体の両面に上記グリーンシートの焼結温度よりも高い焼結温度を有する焼成収縮抑制シートを積層して複合積層体を形成する工程と、
上記複合積層体を上記グリーンシートの焼結温度で焼成する工程と、
焼成後の上記複合積層体から未焼結の上記焼成収縮抑制シートおよび未焼結の上記無機組成物を除去する工程と、
を含む、ことを特徴とするキャビティ付き多層セラミック基板の製造方法。 A step of laminating a green sheet having a front surface and a back surface and a green sheet having a front surface and a back surface and having a through-hole penetrating between the front surface and the back surface to form a green sheet laminate with a cavity;
Filling the paste-like inorganic composition having a sintering temperature higher than the sintering temperature of the green sheet while reducing the pressure in the cavity, or reducing the pressure after filling the cavity;
Forming a composite laminate by laminating a firing shrinkage suppression sheet having a sintering temperature higher than the sintering temperature of the green sheet on both sides of the cavity-attached green sheet laminate containing the inorganic composition;
Firing the composite laminate at the sintering temperature of the green sheet;
Removing the unsintered firing shrinkage-suppressing sheet and unsintered inorganic composition from the composite laminate after firing;
A method for producing a multilayer ceramic substrate with cavities, comprising:
請求項１または２に記載のキャビティ付き多層セラミック基板の製造方法。 The softening point of the glass contained in the inorganic composition is equal to or less than the softening point of the glass contained in the green sheet.
The manufacturing method of the multilayer ceramic substrate with a cavity of Claim 1 or 2.
The said inorganic composition is a manufacturing method of the multilayer ceramic substrate with a cavity as described in any one of Claim 1 thru | or 3 containing the organic solvent in which the said green sheet can melt | dissolve.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042893A (en) * | 2005-08-03 | 2007-02-15 | Murata Mfg Co Ltd | Ceramic substrate and its manufacturing method |
| JP2010272751A (en) * | 2009-05-22 | 2010-12-02 | Mitsubishi Electric Corp | Method of manufacturing ceramic structure |
| JP2013028164A (en) * | 2011-07-18 | 2013-02-07 | Micro Systems Engineering Gmbh | Multilayer ceramic structure and method for producing the same |
| JP2020050533A (en) * | 2018-09-25 | 2020-04-02 | 日本特殊陶業株式会社 | Method of producing ceramic member |
| JP2020186151A (en) * | 2019-05-15 | 2020-11-19 | 日本特殊陶業株式会社 | METHOD FOR PRODUCING SiC SINTERED MEMBER |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007042893A (en) * | 2005-08-03 | 2007-02-15 | Murata Mfg Co Ltd | Ceramic substrate and its manufacturing method |
| JP2010272751A (en) * | 2009-05-22 | 2010-12-02 | Mitsubishi Electric Corp | Method of manufacturing ceramic structure |
| JP2013028164A (en) * | 2011-07-18 | 2013-02-07 | Micro Systems Engineering Gmbh | Multilayer ceramic structure and method for producing the same |
| JP2020050533A (en) * | 2018-09-25 | 2020-04-02 | 日本特殊陶業株式会社 | Method of producing ceramic member |
| JP7058580B2 (en) | 2018-09-25 | 2022-04-22 | 日本特殊陶業株式会社 | Manufacturing method of ceramic parts |
| JP2020186151A (en) * | 2019-05-15 | 2020-11-19 | 日本特殊陶業株式会社 | METHOD FOR PRODUCING SiC SINTERED MEMBER |
| JP7216611B2 (en) | 2019-05-15 | 2023-02-01 | 日本特殊陶業株式会社 | Manufacturing method of SiC sintered member |
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