JP2005084150A - Color filter substrate and liquid crystal panel using same - Google Patents

Color filter substrate and liquid crystal panel using same Download PDF

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JP2005084150A
JP2005084150A JP2003313398A JP2003313398A JP2005084150A JP 2005084150 A JP2005084150 A JP 2005084150A JP 2003313398 A JP2003313398 A JP 2003313398A JP 2003313398 A JP2003313398 A JP 2003313398A JP 2005084150 A JP2005084150 A JP 2005084150A
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color filter
substrate
liquid crystal
counter electrode
filter substrate
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JP4059826B2 (en
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Shinichi Hirato
伸一 平戸
Hidehiko Yamaguchi
英彦 山口
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a color filter substrate having no problem caused by static electricity even when being attracted and held by an electrostatic chuck and a satisfactory adhesion property to a sealing member. <P>SOLUTION: A counter electrode film 14 is formed on the entire surface of a single side of an insulating substrate 11 so as to cover a color filter layer 12 formed on the insulating substrate 11. An aperture part 15 is provided at the part in contact with a sealing member 3 of the counter electrode film 14 and not opposed to a wiring 22 formed on an array substrate 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はカラーフィルタ基板及びこれを用いた液晶パネルに関し、より詳細には静電気による影響を受けない、静電チャックに好適なカラーフィルタ基板及びこれを用いた液晶パネルに関するものである。   The present invention relates to a color filter substrate and a liquid crystal panel using the same, and more particularly to a color filter substrate suitable for an electrostatic chuck that is not affected by static electricity and a liquid crystal panel using the same.

液晶パネルの製造工程において、カラーフィルタ基板とアレイ基板との間隙に液晶材料を封入する方法として真空方式が一般に採用されていた。この真空方式は次のよう方式である。まず、カラーフィルタ基板とアレイ基板とを貼り合わせる。この貼り合わせた基板には複数の液晶パネルが同時に形成されているので、張り合わせ基板から個々の液晶パネルを切断、分離する。次に、液晶パネルと液晶材料を入れた容器とを気密装置に入れ、気密装置内を真空に引く。液晶パネルの間隙が真空に達したら液晶パネルの注入口を液晶材料に浸した後、装置内を窒素ガスなどで大気圧に戻す。これにより、毛細管現象と圧力差によって液晶パネルの間隙内に液晶材料が充填される。   In the manufacturing process of a liquid crystal panel, a vacuum method has generally been adopted as a method for enclosing a liquid crystal material in a gap between a color filter substrate and an array substrate. This vacuum method is as follows. First, the color filter substrate and the array substrate are bonded together. Since a plurality of liquid crystal panels are simultaneously formed on the bonded substrate, the individual liquid crystal panels are cut and separated from the bonded substrate. Next, the liquid crystal panel and the container containing the liquid crystal material are placed in an airtight device, and the inside of the airtight device is evacuated. When the gap between the liquid crystal panels reaches a vacuum, the liquid crystal panel inlet is immersed in a liquid crystal material, and the inside of the apparatus is returned to atmospheric pressure with nitrogen gas or the like. As a result, the liquid crystal material is filled in the gaps of the liquid crystal panel by the capillary phenomenon and the pressure difference.

ところが液晶パネルの大型化に伴い前記真空方式では、液晶パネルの間隙への液晶材料の円滑な充填が行えず、また十分な位置合わせ精度が得られず、高品位な大型液晶パネルを効率的に生産することが困難となってきた。このため、液晶材料の封入方式として新たに滴下方式が採用されるようになってきた。この滴下方式は、カラーフィルタ基板とアレイ基板とを貼り合わせる前に、液晶材料を一方の基板上に滴下しておき、その後前記２つの基板を貼り合わせるというものである（例えば特許文献１）。   However, with the increase in size of liquid crystal panels, the above-mentioned vacuum system cannot smoothly fill liquid crystal material into the gaps of the liquid crystal panels, and sufficient alignment accuracy cannot be obtained. It has become difficult to produce. For this reason, a dripping method has been newly adopted as a liquid crystal material sealing method. In this dropping method, a liquid crystal material is dropped onto one substrate before the color filter substrate and the array substrate are bonded together, and then the two substrates are bonded together (for example, Patent Document 1).

図７に、滴下方式における基板貼り合わせに用いる装置の概説図を示す。この装置では、載置台５と、これに対向する上方に上下移動可能に取り付けられた、静電チャック４２を備えた吸着板４１とが真空槽６内に配設されている。そして、液晶材料（不図示）が滴下されたアレイ基板２を載置台５上に載せ、他方シール部材３が描画されたカラーフィルタ基板１を静電チャック４２で吸着して吸着板４１で支持し、アレイ基板２上に位置させる。真空槽６内を真空に引いた後、吸着板４１を下方に移動させ加圧してカラーフィルタ基板１とアレイ基板２とを貼り合わせる。次に、シール部材３に紫外線を照射してシール部材３を硬化させ、２つの基板をしっかりと接合させる。   FIG. 7 shows a schematic diagram of an apparatus used for bonding substrates in the dropping method. In this apparatus, a mounting table 5 and a suction plate 41 equipped with an electrostatic chuck 42, which is mounted so as to be movable up and down, facing the mounting table 5, are disposed in the vacuum chamber 6. Then, the array substrate 2 onto which a liquid crystal material (not shown) is dropped is placed on the mounting table 5, and the color filter substrate 1 on which the seal member 3 is drawn is sucked by the electrostatic chuck 42 and supported by the suction plate 41. , Located on the array substrate 2. After the vacuum chamber 6 is evacuated, the suction plate 41 is moved downward and pressed to bond the color filter substrate 1 and the array substrate 2 together. Next, the sealing member 3 is cured by irradiating the sealing member 3 with ultraviolet rays to firmly bond the two substrates.

ここで、カラーフィルタ基板１を吸着保持するために静電チャック４２を用いているのは次の理由による。従来用いられてきた真空方式では、２つの基板の貼り合わせを大気圧下で行うことができるため、カラーフィルタ基板の吸着保持には一般に真空チャックを用いていた。しかし、滴下方式では真空槽内でカラーフィルタ基板を吸着保持しなければならず真空チャックを使用できない。   Here, the electrostatic chuck 42 is used to attract and hold the color filter substrate 1 for the following reason. In the conventional vacuum method, since two substrates can be bonded under atmospheric pressure, a vacuum chuck is generally used to hold the color filter substrate by suction. However, in the dripping method, the color filter substrate must be sucked and held in a vacuum chamber, and a vacuum chuck cannot be used.

しかし、カラーフィルタ基板の絶縁基板として通常使用されているガラス基板は誘電体であるので、カラーフィルタ基板を静電チャックで吸着保持した場合、カラーフィルタ基板が帯電する。図８に図７の部分断面図を示す。静電チャック４２の表面に正負の電荷が交互に発生されると、これに対向するガラス基板（絶縁基板）１１で分極が起こり、静電チャック４２の表面電荷と逆極性の電荷は静電チャック側に移動する。これによりガラス基板１１は静電チャック４２に吸着・保持される。一方、静電チャック４２の表面電荷と同極性の電荷はガラス基板１１の静電チャック４２と反対側に移動する。ガラス基板表面の対向電極膜１４が形成されている部分では、静電分極による前記電荷はこの対向電極膜１４によって除去されるが、対向電極膜１４が形成されていない、ガラス基板１１の周縁部では、前記電荷はそのまま残存する。このため、カラーフィルタ基板１がアレイ基板２に接近すると、カラーフィルタ基板１表面の電荷がアレイ基板２表面の配線２２などに移動し、アレイ基板２に形成されているトランジスタ２３などを破壊するといった問題が生じていた。それで、カラーフィルタ基板１の静電気を除去するために、カラーフィルタ基板１１の周縁部などの非表示領域に透明導電膜や導電性のブラックマトリックスを形成することが提案されている（例えば特許文献２）。
特開２０００−６６１６３号公報（第９頁、図３、図４） 特開２００１−１４７３１４号公報（特許請求の範囲、第３頁右欄、図１、図２） However, since the glass substrate normally used as an insulating substrate for the color filter substrate is a dielectric, the color filter substrate is charged when the color filter substrate is attracted and held by an electrostatic chuck. FIG. 8 is a partial sectional view of FIG. When positive and negative charges are alternately generated on the surface of the electrostatic chuck 42, polarization occurs in the glass substrate (insulating substrate) 11 facing the electrostatic charge 42, and the charge opposite in polarity to the surface charge of the electrostatic chuck 42 is electrostatic chuck. Move to the side. Thereby, the glass substrate 11 is attracted and held by the electrostatic chuck 42. On the other hand, the charge having the same polarity as the surface charge of the electrostatic chuck 42 moves to the opposite side of the glass substrate 11 from the electrostatic chuck 42. In the portion where the counter electrode film 14 is formed on the surface of the glass substrate, the charge due to electrostatic polarization is removed by the counter electrode film 14, but the peripheral portion of the glass substrate 11 where the counter electrode film 14 is not formed. Then, the electric charge remains as it is. For this reason, when the color filter substrate 1 approaches the array substrate 2, the charge on the surface of the color filter substrate 1 moves to the wiring 22 on the surface of the array substrate 2 and destroys the transistors 23 and the like formed on the array substrate 2. There was a problem. Therefore, in order to remove static electricity from the color filter substrate 1, it has been proposed to form a transparent conductive film or a conductive black matrix in a non-display area such as a peripheral portion of the color filter substrate 11 (for example, Patent Document 2). ).
Japanese Unexamined Patent Publication No. 2000-66163 (page 9, FIG. 3, FIG. 4) JP 2001-147314 A (Claims, page 3, right column, FIGS. 1 and 2)

しかしながら、カラーフィルタ基板の非表示領域に導電性のブラックマトリックスを形成すると、遮光領域が多くなり光硬化性のシール部材が使用できないという問題が生じる。また、カラーフィルタ基板の非表示領域に透明導電膜を形成すると、シール部材との密着性が低下しシール部材がカラーフィルタ基板から剥離するおそれがある。   However, when a conductive black matrix is formed in the non-display area of the color filter substrate, there is a problem that the light-shielding area increases and a photocurable sealing member cannot be used. In addition, when a transparent conductive film is formed in the non-display area of the color filter substrate, the adhesion with the seal member is lowered and the seal member may be peeled off from the color filter substrate.

本発明はこのような従来の問題に鑑みてなされたものであり、その目的とするところは、静電気による帯電が起こりにくく、しかもシール部材との密着性が良好なカラーフィルタ基板及び液晶パネルを提供することにある。   The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a color filter substrate and a liquid crystal panel that are less likely to be charged by static electricity and that have good adhesion to a seal member. There is to do.

また本発明の他の目的は、高湿度環境下においても基板間の電位差に起因する腐食が生じないカラーフィルタ基板及び液晶パネルを提供することにある。   Another object of the present invention is to provide a color filter substrate and a liquid crystal panel in which corrosion caused by a potential difference between the substrates does not occur even in a high humidity environment.

前記目的を達成するため本発明によれば、絶縁基板上に複数の薄膜トランジスタが配列されたアレイ基板と所定の間隙で対向配置され、その外周部をシール部材で封着され、前記間隙に液晶材料が封入されて液晶パネルを構成するカラーフィルタ基板であって、絶縁基板上に形成されたカラーフィルタ層を覆うように、前記絶縁基板の片側全面に対向電極膜が形成し、この対向電極膜における前記シール部材と接触する部分で、且つ前記アレイ基板上に形成された配線と対向しない部分に開口部が設けられたことを特徴とするカラーフィルタ基板が提供される。   In order to achieve the above object, according to the present invention, an array substrate in which a plurality of thin film transistors are arranged on an insulating substrate is opposed to each other with a predetermined gap, and an outer periphery thereof is sealed with a sealing member, and a liquid crystal material is placed in the gap. Is a color filter substrate constituting a liquid crystal panel, and a counter electrode film is formed on the entire surface of one side of the insulating substrate so as to cover the color filter layer formed on the insulating substrate. A color filter substrate is provided in which an opening is provided in a portion in contact with the seal member and in a portion not facing a wiring formed on the array substrate.

また本発明によれば、絶縁基板上に形成されたカラーフィルタ層とこれを覆うように形成された対向電極膜とを有するカラーフィルタ基板と、絶縁基板上に複数の薄膜トランジスタが配列され、前記カラーフィルタ基板と所定の間隙で対向配置されたアレイ基板と、前記対向配置された前記カラーフィルタ基板と前記アレイ基板の外周部を封着するシール部材と、前記間隙に封入される液晶材料とを備えた液晶パネルであって、前記対向電極膜を前記絶縁基板の片側全面に形成し、且つ前記対向電極膜における前記シール部材と接触する部分で、且つ前記アレイ基板上に形成された配線と対向しない部分に開口部を設けたことを特徴とする液晶パネルが提供される。   According to the invention, a color filter substrate having a color filter layer formed on an insulating substrate and a counter electrode film formed so as to cover the color filter layer, and a plurality of thin film transistors arranged on the insulating substrate, An array substrate disposed opposite to the filter substrate with a predetermined gap; a color filter substrate disposed opposite to the filter substrate; a seal member that seals an outer peripheral portion of the array substrate; and a liquid crystal material sealed in the gap. In the liquid crystal panel, the counter electrode film is formed on the entire surface of one side of the insulating substrate, and is a portion in contact with the seal member in the counter electrode film, and does not face the wiring formed on the array substrate. A liquid crystal panel characterized in that an opening is provided in the portion is provided.

ここで、対向電極膜を保護すると共に、シール部材との密着性を一層向上させ、また腐食を防止する観点から、対向電極膜のシール部材と接触している部分及びそこから外側の領域上に絶縁性樹脂膜をさらに形成してもよい。   Here, from the viewpoint of protecting the counter electrode film, further improving the adhesion with the seal member, and preventing corrosion, on the portion of the counter electrode film that is in contact with the seal member and on the outer region from there An insulating resin film may be further formed.

また高湿度環境下などにおける水分による腐食を防止する観点から、アレイ基板表面の、シール部材と接触している部分の少なくとも一部及びそこから外側の領域上に、絶縁層を介して導電層を形成してもよい。   In addition, from the viewpoint of preventing corrosion due to moisture in a high-humidity environment, a conductive layer is provided on at least a part of the surface of the array substrate that is in contact with the seal member and an area outside the insulating layer via an insulating layer. It may be formed.

本発明のカラーフィルタ基板及び液晶パネルでは、カラーフィルタ基板の対向電極膜を絶縁基板の片側全面に形成するので、静電気による帯電が起こりにくく、静電チャックによって吸着・保持されても静電気に起因する問題は発生しない。また対向電極膜におけるシール部材と接触する部分で、且つアレイ基板上に形成された配線と対向しない部分に開口部を設け、この開口部から露出する絶縁性基板表面とシール部材とを直接接着するようにしたので、シール部材の密着性が格段に向上する。   In the color filter substrate and the liquid crystal panel of the present invention, since the counter electrode film of the color filter substrate is formed on the entire surface of one side of the insulating substrate, charging due to static electricity hardly occurs, and even if it is attracted and held by the electrostatic chuck, it is caused by static electricity. There is no problem. In addition, an opening is provided in a portion of the counter electrode film that contacts the seal member and does not face the wiring formed on the array substrate, and the insulating substrate surface exposed from the opening is directly bonded to the seal member. Since it did in this way, the adhesiveness of a sealing member improves markedly.

対向電極膜のシール部材と接触している部分及びそこから外側の領域上に絶縁性樹脂膜をさらに形成すると、対向電極膜の絶縁基板からの剥離を防止できると共に、水分による腐食を防止できる。   If an insulating resin film is further formed on a portion of the counter electrode film that is in contact with the seal member and an area outside thereof, peeling of the counter electrode film from the insulating substrate can be prevented and corrosion due to moisture can be prevented.

また、アレイ基板表面の、シール部材と接触している部分の少なくとも一部及びそこから外側の領域上に、絶縁層を介して導電層を形成しても、高湿度環境下などにおける水分による腐食を防止できる。   In addition, even if a conductive layer is formed on at least a part of the surface of the array substrate that is in contact with the sealing member and an outer region from the surface, the corrosion due to moisture in a high humidity environment, etc. Can be prevented.

以下、本発明のカラーフィルタ基板及び液晶パネルについて図に基づいて説明する。なお、本発明はこれらの実施形態に何ら限定されるものではない。   Hereinafter, the color filter substrate and the liquid crystal panel of the present invention will be described with reference to the drawings. The present invention is not limited to these embodiments.

図１に、カラーフィルタ基板及びアレイ基板の概略平面図を示す。同図（ａ）はアレイ基板２の概略平面図である。このアレイ基板２では、長方形状のガラス基板（絶縁基板）２１の表面に複数の薄膜トランジスタ（不図示）がマトリックス状に配列された表示部２４が形成され、この表示部２４を取り囲むようにシール部材３で土手が形成されている。そして各薄膜トタンジスタを作動させるためのゲート配線及びデータ配線などの配線２２が、ドライバ（不図示）などと接続するためにシール部材３を横切ってガラス基板２１の縁辺まで延設されている。   FIG. 1 is a schematic plan view of the color filter substrate and the array substrate. FIG. 2A is a schematic plan view of the array substrate 2. In the array substrate 2, a display unit 24 in which a plurality of thin film transistors (not shown) are arranged in a matrix is formed on the surface of a rectangular glass substrate (insulating substrate) 21, and a sealing member is provided so as to surround the display unit 24. 3 is the bank. A wiring 22 such as a gate wiring and a data wiring for operating each thin film transistor is extended to the edge of the glass substrate 21 across the seal member 3 so as to be connected to a driver (not shown).

一方、同図（ｂ）はカラーフィルタ基板１の概略平面図である。このカラーフィルタ基板１の、前記アレイ基板２の表示部２４に対向する部分にはカラーフィルタ層（不図示）が形成されている。そしてこのカラーフィルタ層を含むガラス基板１１の片側表面全体を対向電極膜１４で覆っている。この対向電極膜１４の、アレイ基板２のシール部材３と接触する領域の一部には開口部１５が形成されている。   On the other hand, FIG. 2B is a schematic plan view of the color filter substrate 1. A color filter layer (not shown) is formed on a portion of the color filter substrate 1 facing the display portion 24 of the array substrate 2. The entire surface of one side of the glass substrate 11 including the color filter layer is covered with the counter electrode film 14. An opening 15 is formed in a portion of the counter electrode film 14 in contact with the seal member 3 of the array substrate 2.

図２に、カラーフィルタ基板１とアレイ基板２とを貼り合わせたときの部分状態図を示す。カラーフィルタ基板の下面全体に対向電極膜１４が形成されている。また、この対向電極膜１４には、破線で示すシール部材３と接触する部分で、且つアレイ基板１の配線２２と対向しない部分に開口部１５が形成されている。換言すると、シール部材３は、開口部１５によって露出したカラーフィルタ基板１のガラス基板１１と多く接触し、且つアレイ基板２の配線２２と対向するカラーフィルタ基板表面には必ず対向電極膜１４が形成されている。これにより、図３に示すように、カラーフィルタ基板１が静電チャック４２で吸着・保持されたときに静電分極によって発生し、ガラス基板１１のアレイ基板側面に移動する電荷は、対向電極膜１４によって除去される。しかも、薄膜トランジスタ２３の形成領域および配線２２に対向するカラーフィルタ基板の部分には必ず対向電極膜１４が形成されているので、カラーフィルタ基板１をアレイ基板２に接近させても、前記電荷によるアレイ基板２上の薄膜トランジスタ２３の破壊といった問題を確実に防止できる。   FIG. 2 shows a partial state diagram when the color filter substrate 1 and the array substrate 2 are bonded together. A counter electrode film 14 is formed on the entire lower surface of the color filter substrate. In addition, an opening 15 is formed in the counter electrode film 14 at a portion that is in contact with the seal member 3 indicated by a broken line and that is not opposed to the wiring 22 of the array substrate 1. In other words, the seal member 3 makes a large amount of contact with the glass substrate 11 of the color filter substrate 1 exposed by the opening 15 and always forms the counter electrode film 14 on the surface of the color filter substrate facing the wiring 22 of the array substrate 2. Has been. As a result, as shown in FIG. 3, when the color filter substrate 1 is attracted and held by the electrostatic chuck 42, the charges generated by electrostatic polarization and moving to the side surface of the array substrate of the glass substrate 11 14 is removed. In addition, since the counter electrode film 14 is always formed on the formation region of the thin film transistor 23 and the portion of the color filter substrate facing the wiring 22, even if the color filter substrate 1 is brought close to the array substrate 2, Problems such as destruction of the thin film transistor 23 on the substrate 2 can be reliably prevented.

図４に、図２のＡ−Ａ線断面図を示す。カラーフィルタ基板１の対向電極膜１４は、アレイ基板２の配線２２と対向する部分を除いて除去され開口部１５となっているので、シール部材３の大半部分はカラーフィルタ基板１のガラス基板１１に直接接着している。対向電極膜１４は通常ＩＴＯ膜などの金属粒子膜であるため、シール部材３に比べガラス基板１１との密着性に劣る。したがって、図４に示すようにガラス基板１１とシール部材３を直接接着させることによって、対向電極膜１４を介して接触させるよりも接着力は格段に強くなる。   FIG. 4 is a cross-sectional view taken along line AA in FIG. Since the counter electrode film 14 of the color filter substrate 1 is removed except for a portion facing the wiring 22 of the array substrate 2 to form an opening 15, most of the seal member 3 is the glass substrate 11 of the color filter substrate 1. It is directly adhered to. Since the counter electrode film 14 is usually a metal particle film such as an ITO film, the adhesion with the glass substrate 11 is inferior to that of the seal member 3. Therefore, by directly bonding the glass substrate 11 and the seal member 3 as shown in FIG. 4, the adhesive force is much stronger than when the glass substrate 11 is contacted via the counter electrode film 14.

対向電極膜１４に形成する開口部１５の幅は、カラーフィルタ基板１とアレイ基板２とを貼り合わせたときのシール部材３の幅と略同等であるのが好ましい。なお、両基板の貼り合わせによってシール部材３は押し潰されて当初の幅よりも大きくなるので、前記開口部１５はこの幅の広がりを見込んでシール部材３の当初の幅よりも広い幅にしておくのがよい。   The width of the opening 15 formed in the counter electrode film 14 is preferably substantially equal to the width of the seal member 3 when the color filter substrate 1 and the array substrate 2 are bonded together. In addition, since the sealing member 3 is crushed and becomes larger than the original width by bonding the two substrates, the opening 15 is made wider than the original width of the sealing member 3 in anticipation of this widening. It is good to leave.

対向電極膜１４に開口部１５を形成する方法に特に限定はないが、例えば次のようにして作製すればよい。ガラス基板１１上にカラーフィルタ層１２を形成した後、カラーフィルタ層１２を覆うように、ガラス基板１１の片側全面に対向電極膜１４をスパッタリングで蒸着形成する。次に、ネガ型の感光性樹脂をガラス基板１１に塗布しプリベークさせた後、開口部１５を形成する部分に対応する部分をフォトマスクで遮光する。そして、現像、ポストベーク、エッチング、感光性樹脂の剥離、乾燥を行ってカラーフィルタ基板１を作製すればよい。なお、ポジ型感光性樹脂を用いる場合には、フォトマスクとして、開口部１５を形成する部分に対応する部分に穴が開けられたものを使用する。   The method for forming the opening 15 in the counter electrode film 14 is not particularly limited, but for example, it may be manufactured as follows. After the color filter layer 12 is formed on the glass substrate 11, the counter electrode film 14 is deposited on the entire surface of one side of the glass substrate 11 by sputtering so as to cover the color filter layer 12. Next, a negative photosensitive resin is applied to the glass substrate 11 and prebaked, and then a portion corresponding to a portion where the opening 15 is formed is shielded from light with a photomask. Then, the color filter substrate 1 may be manufactured by performing development, post-baking, etching, peeling of the photosensitive resin, and drying. In the case where a positive photosensitive resin is used, a photomask having a hole in a portion corresponding to a portion where the opening 15 is formed is used.

対向電極膜とガラス基板との密着性に関して、シール部材で囲まれた領域は液晶材料が封入されるので、前記密着性が問題となることは少ないが、対向電極膜の、シール部材と接触している部分から外側の領域は前記密着性が問題となるおそれがある。そこで、このような領域に絶縁性樹脂膜をさらに形成することが推奨される。図５にその一例を示す。図５は、絶縁性樹脂膜１６を形成したカラーフィルタ基板１の部分断面図であって、シール部材３の形成領域の一部からその外側領域に絶縁性樹脂膜１６が形成されている。これにより対向電極膜１４のガラス基板１１からの剥離が防止されると同時に、次に説明する水分による腐食も防止される。   Regarding the adhesion between the counter electrode film and the glass substrate, since the liquid crystal material is enclosed in the region surrounded by the seal member, the adhesion is less likely to be a problem, but the counter electrode film is in contact with the seal member. There is a possibility that the above-mentioned adhesion may be a problem in the outer area from the portion where the area is present. Therefore, it is recommended to further form an insulating resin film in such a region. An example is shown in FIG. FIG. 5 is a partial cross-sectional view of the color filter substrate 1 on which the insulating resin film 16 is formed. The insulating resin film 16 is formed from a part of the formation region of the seal member 3 to the outer region. Thereby, peeling of the counter electrode film 14 from the glass substrate 11 is prevented, and at the same time, corrosion due to moisture described below is also prevented.

このような絶縁性樹脂膜を形成する樹脂材料としては例えばアクリル樹脂やエポキシ樹脂、ポリイミド樹脂、シリコン樹脂などが挙げられる。絶縁性樹脂膜は、例えばガラス基板上に対向電極膜を形成した後、前記所定の領域に塗布し硬化させて形成すればよい。絶縁性樹脂膜の膜厚としては数μｍ程度が望ましい。   Examples of the resin material for forming such an insulating resin film include acrylic resin, epoxy resin, polyimide resin, and silicon resin. The insulating resin film may be formed, for example, by forming a counter electrode film on a glass substrate and then applying and curing the predetermined electrode region. The thickness of the insulating resin film is preferably about several μm.

また、液晶表示装置を高湿度環境下で使用した場合などには、カラーフィルタ基板とアレイ基板との間に水分が吸着し、基板に形成した金属部が腐食することがある。これは、基板間に電位差があるときに生じる現象であって、吸着した水分中を前記電位差によって不純物が移動し、基板に形成された金属部をこの不純物が浸食して起こる現象と推測される。そこで、本発明では、アレイ基板表面の、シール部材と接触している部分の少なくとも一部及びそこから外側の領域上に、絶縁層を介して導電層を形成することが推奨される。   Further, when the liquid crystal display device is used in a high humidity environment, moisture is adsorbed between the color filter substrate and the array substrate, and the metal part formed on the substrate may be corroded. This is a phenomenon that occurs when there is a potential difference between the substrates, and it is presumed that the impurities move in the adsorbed moisture due to the potential difference, and the metal portion formed on the substrate erodes the impurities. . Therefore, in the present invention, it is recommended to form a conductive layer via an insulating layer on at least a portion of the surface of the array substrate that is in contact with the seal member and an area outside thereof.

図６に、導電層を形成した液晶パネルの一例を示す部分断面図を示す。この図のアレイ基板２には、シール部材３と接触している部分とそこから外側の領域、そして若干の内側の領域上に、絶縁層２４と導電層２５がこの順で積層されている。なお、この絶縁層２４と導電層２５の外周端は、カラーフィルタ基板１の外周端よりも外側に位置させる。これにより、対向する両基板の表面すべては導電性部材で覆われることになり、両基板間に電位差は生じず、基板間に水分が吸着されても腐食は起こらなくなる。   FIG. 6 is a partial cross-sectional view showing an example of a liquid crystal panel on which a conductive layer is formed. In the array substrate 2 in this figure, an insulating layer 24 and a conductive layer 25 are laminated in this order on a portion in contact with the seal member 3, an outer region from the portion, and a slightly inner region. The outer peripheral ends of the insulating layer 24 and the conductive layer 25 are positioned outside the outer peripheral end of the color filter substrate 1. As a result, all the surfaces of the opposing substrates are covered with the conductive member, no potential difference occurs between the substrates, and no corrosion occurs even if moisture is adsorbed between the substrates.

ガラス基板上にブラックマトリックス及び赤、緑、青のカラーレジストを塗布しパターンニングによってカラーフィルタ層を形成した。そして、カラーフィルタ層を覆うように、ガラス基板の片側全面に対向電極膜としてのＩＴＯ膜をスパッタリングで蒸着した。次に、感光性樹脂（ネガ型）をガラス基板に塗布しプリベークさせた後、シール部材と接触する部分で、且つアレイ基板に形成された配線と対向しない部分をフォトマスクで遮光し露光を行った。その後、現像、ポストベーク、エッチング、感光性樹脂の剥離、乾燥を行い図１（ｂ）に示すカラーフィルタ基板を作製した。そして、ブラックマトリックス上にフォトスペーサ材を形成して最終的なカラーフィルタ基板を得た。この作製したカラーフィルタ基板を静電チャックで吸着保持し、カラーフィルタ基板下面のシール部材から外方部分の表面電位を測定した。なお、静電チャックの配線電位条件は±２ＫＶとした。また、シール部材の剥離強度として、液晶パネルの端子部を押した場合の液晶パネル破壊加重を測定した。測定結果を表１に合わせて示す。   A black matrix and red, green and blue color resists were applied on a glass substrate, and a color filter layer was formed by patterning. Then, an ITO film as a counter electrode film was deposited on the entire surface of one side of the glass substrate by sputtering so as to cover the color filter layer. Next, after photosensitive resin (negative type) is applied to the glass substrate and prebaked, the portion that comes into contact with the seal member and that does not face the wiring formed on the array substrate is shielded with a photomask and exposed. It was. Thereafter, development, post-baking, etching, peeling of the photosensitive resin, and drying were performed to produce a color filter substrate shown in FIG. Then, a photo spacer material was formed on the black matrix to obtain a final color filter substrate. The produced color filter substrate was sucked and held by an electrostatic chuck, and the surface potential of the outer portion from the seal member on the lower surface of the color filter substrate was measured. Note that the wiring potential condition of the electrostatic chuck was ± 2 KV. Moreover, the liquid crystal panel destruction load when the terminal part of a liquid crystal panel was pushed was measured as peeling strength of a sealing member. The measurement results are shown in Table 1.

実施例１と同様にして図１に示すカラーフィルタ基板を作製した後、フォトスペーサ形成前にカラーフィルタ基板の片側全面に絶縁性樹脂膜を塗布し、さらにその上に感光性樹脂（ネガ型）を塗布しプリベークを行った。そして、カラーフィルタ層領域およびシール部材領域の一部をフォトマスクで遮光し露光を行った。その後、現像、ポストベーク、エッチング、感光性樹脂の剥離、乾燥を行い、図５に示すカラーフィルタ基板を作製した。実施例１と同様にして、この作製したカラーフィルタ基板を静電チャックで吸着保持し、カラーフィルタ基板下面のシール部材から外方部分の表面電位を測定した。また液晶パネル破壊加重を測定した。測定結果を表１に合わせて示す。   After producing the color filter substrate shown in FIG. 1 in the same manner as in Example 1, an insulating resin film is applied to the entire surface of one side of the color filter substrate before forming the photo spacer, and a photosensitive resin (negative type) is further formed thereon. Was applied and prebaked. Then, the color filter layer region and part of the seal member region were shielded with a photomask and exposed. Thereafter, development, post-baking, etching, peeling of the photosensitive resin, and drying were performed to produce a color filter substrate shown in FIG. In the same manner as in Example 1, the produced color filter substrate was sucked and held by an electrostatic chuck, and the surface potential of the outer portion from the seal member on the lower surface of the color filter substrate was measured. The liquid crystal panel breaking load was also measured. The measurement results are shown in Table 1.

比較例１Comparative Example 1

ガラス基板上にブラックマトリックス及び赤、緑、青のカラーレジストを塗布しパターンニングによってカラーフィルタ層を形成した。そして、カラーフィルタ層を覆うように、ガラス基板の片側全面に対向電極膜としてのＩＴＯ膜をスパッタリングで蒸着した。次に、感光性樹脂（ネガ型）をガラス基板に塗布しプリベークさせた後、カラーフィルタ層部分以外をフォトマスクで遮光し露光を行った。その後、現像、ポストベーク、エッチング、感光性樹脂の剥離、乾燥を行い図８に示すカラーフィルタ基板を作製した。そして、ブラックマトリックス上にフォトスペーサ材を形成して最終的なカラーフィルタ基板を得た。実施例１と同様にして、この作製したカラーフィルタ基板を静電チャックで吸着保持し、カラーフィルタ基板下面のシール部材から外方部分の表面電位を測定した。また液晶パネル破壊加重を測定した。測定結果を表１に合わせて示す。   A black matrix and red, green and blue color resists were applied on a glass substrate, and a color filter layer was formed by patterning. Then, an ITO film as a counter electrode film was deposited on the entire surface of one side of the glass substrate by sputtering so as to cover the color filter layer. Next, a photosensitive resin (negative type) was applied to a glass substrate and prebaked, and then light exposure was performed by shielding light except for the color filter layer portion with a photomask. Thereafter, development, post-baking, etching, peeling of the photosensitive resin, and drying were performed to produce a color filter substrate shown in FIG. Then, a photo spacer material was formed on the black matrix to obtain a final color filter substrate. In the same manner as in Example 1, the produced color filter substrate was sucked and held by an electrostatic chuck, and the surface potential of the outer portion from the seal member on the lower surface of the color filter substrate was measured. The liquid crystal panel breaking load was also measured. The measurement results are shown in Table 1.

Figure 2005084150
表１から明らかなように、シール部材のカラーフィルタ基板への接着強度は実施例１及び実施例２のカラーフィルタ基板では、２．０〜５．０（６．０）ｋｇ／ｃｍ２と従来と同程度であった。また、これらのカラーフィルタ基板の表面電位は６０〜８０ｅＶと非常に低い値であった。これに対し比較例１のカラーフィルタ基板では、表面電位が−２００〜９００ｅＶと高い値であった。
Figure 2005084150
 As is clear from Table 1, the adhesive strength of the seal member to the color filter substrate is 2.0 to 5.0 (6.0) kg / cm 2 for the color filter substrates of Example 1 and Example 2, and It was about the same. Further, the surface potential of these color filter substrates was a very low value of 60 to 80 eV. In contrast, in the color filter substrate of Comparative Example 1, the surface potential was as high as -200 to 900 eV.

本発明のカラーフィルタ基板及びアレイ基板の各平面図である。It is each top view of the color filter substrate and array substrate of this invention. カラーフィルタ基板とアレイ基板とを貼り合わせたときの状態図である。It is a state figure when a color filter substrate and an array substrate are bonded together. 本発明のカラーフィルタ基板とアレイ基板とを貼り合わせる時の状態図である。FIG. 3 is a state diagram when the color filter substrate and the array substrate of the present invention are bonded together. 図２のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 本発明のカラーフィルタ基板の他の実施形態を示す部分断面図である。It is a fragmentary sectional view showing other embodiments of a color filter substrate of the present invention. 本発明の液晶パネルの他の実施形態を示す部分断面図である。It is a fragmentary sectional view which shows other embodiment of the liquid crystal panel of this invention. 滴下式の液晶材料封入を行う装置断面図である。It is sectional drawing of an apparatus which performs dripping type liquid crystal material enclosure. 従来の基板貼り合わせ示す断面図である。It is sectional drawing which shows the conventional board | substrate bonding.

符号の説明Explanation of symbols

１ カラーフィルタ基板
２ アレイ基板
３ シール部材
１１ ガラス基板（絶縁基板）
１２ カラーフィルタ層
１３ ブラックマトリックス層
１４ 対向電極膜
１５ 開口部
１６ 絶縁性樹脂層
２１ ガラス基板（絶縁基板）
２２ 配線
２３ 薄膜トランジスタ
２４ 絶縁層
２５ 導電層
４２ 静電チャック 1 Color filter substrate 2 Array substrate 3 Sealing member 11 Glass substrate (insulating substrate)
12 Color filter layer 13 Black matrix layer 14 Counter electrode film 15 Opening 16 Insulating resin layer 21 Glass substrate (insulating substrate)
22 wiring 23 thin film transistor 24 insulating layer 25 conductive layer 42 electrostatic chuck

Claims (5)

絶縁基板上に複数の薄膜トランジスタが配列されたアレイ基板と所定の間隙で対向配置され、その外周部をシール部材で封着され、前記間隙に液晶材料が封入されて液晶パネルを構成するカラーフィルタ基板であって、
絶縁基板上に形成されたカラーフィルタ層を覆うように、前記絶縁基板の片側全面に対向電極膜を形成し、この対向電極膜における前記シール部材と接触する部分で、且つ前記アレイ基板上に形成された配線と対向しない部分に開口部を設けたことを特徴とするカラーフィルタ基板。 A color filter substrate in which a plurality of thin film transistors are arranged on an insulating substrate so as to be opposed to each other with a predetermined gap, and an outer periphery thereof is sealed with a sealing member, and a liquid crystal material is sealed in the gap to constitute a liquid crystal panel Because
A counter electrode film is formed on the entire surface of one side of the insulating substrate so as to cover the color filter layer formed on the insulating substrate, and the counter electrode film is formed on the array substrate at a portion in contact with the seal member. A color filter substrate, wherein an opening is provided in a portion not facing the formed wiring. 前記対向電極膜の前記シール部材と接触している部分及びそこから外側の領域上に絶縁性樹脂膜をさらに形成した請求項１記載のカラーフィルタ基板。   The color filter substrate according to claim 1, further comprising an insulating resin film formed on a portion of the counter electrode film that is in contact with the seal member and on a region outside thereof. 絶縁基板上に形成されたカラーフィルタ層とこれを覆うように形成された対向電極膜とを有するカラーフィルタ基板と、絶縁基板上に複数の薄膜トランジスタが配列され、前記カラーフィルタ基板と所定の間隙で対向配置されたアレイ基板と、前記対向配置された前記カラーフィルタ基板と前記アレイ基板の外周部を封着するシール部材と、前記間隙に封入される液晶材料とを備えた液晶パネルであって、
前記対向電極膜を前記絶縁基板の片側全面に形成し、且つ前記対向電極膜における前記シール部材と接触する部分で、且つ前記アレイ基板上に形成された配線と対向しない部分に開口部を設けたことを特徴とする液晶パネル。 A color filter substrate having a color filter layer formed on an insulating substrate and a counter electrode film formed to cover the color filter layer, and a plurality of thin film transistors are arranged on the insulating substrate, with a predetermined gap from the color filter substrate. A liquid crystal panel comprising: an array substrate disposed opposite; a color filter substrate disposed opposite; a seal member that seals an outer periphery of the array substrate; and a liquid crystal material sealed in the gap,
The counter electrode film is formed on the entire surface of one side of the insulating substrate, and an opening is provided in a portion of the counter electrode film that is in contact with the seal member and not in opposition to the wiring formed on the array substrate. A liquid crystal panel characterized by that. 前記対向電極膜の前記シール部材と接触している部分及びそこから外側の領域上に絶縁性樹脂膜をさらに形成した請求項３記載の液晶パネル。   The liquid crystal panel according to claim 3, wherein an insulating resin film is further formed on a portion of the counter electrode film that is in contact with the seal member and a region outside the portion. 前記アレイ基板表面の、前記シール部材と接触している部分の少なくとも一部及びそこから外側の領域上に、絶縁層を介して導電層を形成した請求項３又は４記載の液晶パネル。   5. The liquid crystal panel according to claim 3, wherein a conductive layer is formed on at least a part of a portion of the surface of the array substrate that is in contact with the seal member and an area outside the portion through an insulating layer.
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