JP2005072266A - Hybrid integrated circuit and method of manufacturing same - Google Patents

Hybrid integrated circuit and method of manufacturing same Download PDF

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JP2005072266A
JP2005072266A JP2003300339A JP2003300339A JP2005072266A JP 2005072266 A JP2005072266 A JP 2005072266A JP 2003300339 A JP2003300339 A JP 2003300339A JP 2003300339 A JP2003300339 A JP 2003300339A JP 2005072266 A JP2005072266 A JP 2005072266A
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lead frame
electronic component
circuit pattern
mounting portion
component mounting
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JP4461476B2 (en
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Hideo Nakamura
英雄 中村
Yasuo Nagasawa
康夫 長澤
Shuichi Sugimoto
周一 杉元
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OMURON TAKEO CO Ltd
TDK Lambda Corp
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OMURON TAKEO CO Ltd
TDK Lambda Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit which can process higher current, can easily analyze a trouble, and can surely prevent short-circuit between electrodes of an electronic component. <P>SOLUTION: The hybrid integrated circuit is constituted by a lead frame 1 including a circuit pattern 3 to form a component mounting portion 11 and a terminal piece 5 for external connection, an electronic component 6 bonded to the circuit pattern 3, and a frame 20 which is provided at the external side of the component mounting portion 11 to support the lead frame 1 to expose the component mounting portion 11. Since the circuit pattern 3 and the electronic component 6 are exposed for contact with the external air, heat may be radiated more effectively from the component mounting portion 11. Even if the solder between the electronic component 6 and circuit pattern 3 is fused through application of heat to the lead frame 1, the solder does not flow into the other area. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、リードフレームにより部品搭載部となる回路パターンを形成すると共に、この部品搭載部の外方に外部との接続を可能にする端子部を形成した混成集積回路およびその製造方法に関する。   The present invention relates to a hybrid integrated circuit in which a circuit pattern to be a component mounting portion is formed by a lead frame, and a terminal portion that enables connection to the outside is formed outside the component mounting portion, and a method for manufacturing the same.

従来、トランジスタ、ダイオード、ＩＣ、抵抗、コンデンサ、インダクタなどの電子部品を、金属製のリードフレーム上に配置してなる混成集積回路として、例えば特許文献１には、パッケージの内外に亘って延在したリードを、リードフレームのリード部分で形成すると共に、同じくリードフレームから形成される支持板の上面に、電子部品である半導体チップを実装した回路基板を固定し、この電子部品を含む回路基板全体を樹脂封止体である前記パッケージによりモールドするものが開示されている。そしてこの特許文献１では、パッケージにより密封された電子部品からの放熱性を向上させるために、リードフレーム材料を銅系のものに変更したり、高熱伝導性樹脂によるパッケージを使用したり、配線基板の一側に熱伝導性の良好な金属からなる放熱板を接着固定して、この放熱板の一面をパッケージから露出させたものが提案されている。
特開平８−１３９２１８号公報 Conventionally, as a hybrid integrated circuit in which electronic components such as a transistor, a diode, an IC, a resistor, a capacitor, and an inductor are arranged on a metal lead frame, Patent Document 1, for example, extends over the inside and outside of a package. In addition to forming the lead at the lead portion of the lead frame, a circuit board on which a semiconductor chip as an electronic component is mounted is fixed to the upper surface of a support plate also formed from the lead frame, and the entire circuit board including the electronic component is fixed. Is molded by the package which is a resin sealing body. And in this patent document 1, in order to improve the heat dissipation from the electronic component sealed by the package, the lead frame material is changed to a copper-based material, a package made of a high thermal conductive resin is used, or a wiring board is used. A heat dissipation plate made of a metal having good thermal conductivity is bonded and fixed to one side of the heat sink, and one surface of the heat dissipation plate is exposed from the package.
JP-A-8-139218

上述したような混成集積回路において、とりわけＤＣ／ＤＣコンバータのようなスイッチング電源装置の電子部品は、取り扱う電流が次第に大きくなってきており、回路基板上に形成した配線パターンの厚みはせいぜい７０ミクロン程度であるので、配線パターンの幅を大きくしても回路基板に十分な電流が流せない。そのため、回路基板を介してではなく、電子部品をリードフレームに直接接続することが考えられるが、その場合はリードフレーム上に電子部品を実装した部品搭載部全体が、封止体でパッケージングされるので、電子部品そのもののトラブルや、電子部品を実装する際のトラブルが発生しても、その原因解析に多大な時間を必要とした。   In the hybrid integrated circuit as described above, in particular, electronic components of a switching power supply device such as a DC / DC converter handle a current that gradually increases, and the thickness of a wiring pattern formed on a circuit board is at most about 70 microns. Therefore, even if the width of the wiring pattern is increased, a sufficient current cannot flow through the circuit board. For this reason, it is conceivable that the electronic component is directly connected to the lead frame, not via the circuit board. In this case, the entire component mounting portion in which the electronic component is mounted on the lead frame is packaged with a sealing body. Therefore, even if a trouble with the electronic component itself or a trouble in mounting the electronic component occurs, it takes a lot of time to analyze the cause.

また、完成した混成集積回路としての製品を、プリント基板などの被取付け部に半田付け接続する際に、リードフレームを伝った熱が電子部品とリードフレームとの間に付着している半田を溶かし、この溶融した半田がパッケージ内部の僅かな隙間を伝って、電子部品の電極間をショートする懸念が指摘されていた。   In addition, when soldering and connecting a finished product as a hybrid integrated circuit to a mounted part such as a printed circuit board, the heat transmitted through the lead frame melts the solder attached between the electronic component and the lead frame. It has been pointed out that the melted solder travels through a slight gap inside the package and shorts between electrodes of the electronic component.

そこで本発明は上記問題点に鑑み、より大きな電流を取り扱うことができると共に、トラブルの解析が容易になり、しかも電子部品の電極間のショートを確実に防ぐことができる混成集積回路およびその製造方法を提供することをその目的とする。   Accordingly, in view of the above problems, the present invention can handle a larger current, facilitate trouble analysis, and reliably prevent a short circuit between electrodes of an electronic component, and a method for manufacturing the same The purpose is to provide.

本発明における請求項１の混成集積回路は、部品搭載部を形成する回路パターンと外部接続用の端子部とを含むリードフレームと、前記回路パターンに接着される電子部品と、前記部品搭載部の外側に設けられ、該部品搭載部が露出するように前記リードフレームを支持する枠体とからなることを特徴とする。   According to a first aspect of the present invention, there is provided a hybrid integrated circuit comprising: a lead frame including a circuit pattern forming a component mounting portion and a terminal portion for external connection; an electronic component bonded to the circuit pattern; and the component mounting portion. It is provided on the outer side and comprises a frame body that supports the lead frame so that the component mounting portion is exposed.

この場合、リードフレームは回路基板上に形成した配線パターンのような制約を受けず、配線パターンの数倍の厚さに形成することができるので、より大きな流すことができる。また、リードフレームを支持する枠体の内側では、部品搭載部である回路パターンや電子部品がいずれも外気に触れるように露出しているので、部品搭載部からの放熱性がよく、またリードフレームに熱が加わって電子部品と回路パターンとの間の半田が溶融しても、別の部位に流れることがない。さらに、電子部品そのもののトラブルや、電子部品の実装に関するトラブルを直接目視で確認でき、製品としての評価や故障解析が容易にできる。   In this case, the lead frame is not subject to the restrictions such as the wiring pattern formed on the circuit board, and can be formed with a thickness several times that of the wiring pattern. In addition, the circuit pattern and electronic components that are component mounting parts are exposed inside the frame that supports the lead frame so that they are exposed to the outside air. Even if heat is applied to the solder and the solder between the electronic component and the circuit pattern melts, it does not flow to another part. Furthermore, troubles in the electronic parts themselves and troubles related to the mounting of the electronic parts can be directly visually confirmed, and product evaluation and failure analysis can be facilitated.

本発明における請求項２の混成集積回路の製造方法は、回路パターンとこの回路パターンに連結する外部接続用の端子部が周囲部に繋がるようにリードフレームを加工形成する工程と、前記リードフレームの回路パターンに電子部品を半田付け接続して部品搭載部を形成する工程と、前記部品搭載部の外側にあって、該部品搭載部が露出するように前記リードフレームを支持する枠体を形成する工程と、前記回路パターンと前記端子部を残して前記リードフレームの周囲部を除去する工程とを含んでいる。   According to a second aspect of the present invention, there is provided a method for manufacturing a hybrid integrated circuit, comprising: forming a lead frame so that a circuit pattern and a terminal portion for external connection connected to the circuit pattern are connected to a peripheral portion; Forming a component mounting portion by soldering and connecting an electronic component to the circuit pattern; and forming a frame that is outside the component mounting portion and supports the lead frame so that the component mounting portion is exposed. And a step of removing the peripheral portion of the lead frame leaving the circuit pattern and the terminal portion.

この場合も、電流が流れる箇所であるリードフレームの回路パターンや端子部は、回路基板上に形成した配線パターンのような制約を受けず、配線パターンの数倍の厚さに形成することができるので、より大きな流すことができる。また、リードフレームを支持する枠体の内側では、部品搭載部である回路パターンや電子部品がいずれも外気に触れるように露出しているので、部品搭載部からの放熱性がよく、またリードフレームに熱が加わって電子部品とリードとの間の半田が溶融しても、別の部位に流れることがない。さらに、電子部品そのもののトラブルや、電子部品の実装に関するトラブルを直接目視で確認でき、製品としての評価や故障解析が容易にできる。   Also in this case, the circuit pattern and the terminal part of the lead frame where the current flows are not restricted like the wiring pattern formed on the circuit board and can be formed several times thicker than the wiring pattern. So you can flow bigger. In addition, the circuit pattern and electronic components that are component mounting parts are exposed inside the frame that supports the lead frame so that they are exposed to the outside air. Even when heat is applied to the solder and the solder between the electronic component and the lead melts, it does not flow to another part. Furthermore, troubles in the electronic parts themselves and troubles related to the mounting of the electronic parts can be directly visually confirmed, and product evaluation and failure analysis can be facilitated.

本発明の請求項１における混成集積回路では、より大きな電流を取り扱うことができると共に、トラブルの解析が容易になり、しかも電子部品の電極間のショートを確実に防ぐことができる。   In the hybrid integrated circuit according to the first aspect of the present invention, a larger current can be handled, a trouble can be easily analyzed, and a short circuit between the electrodes of the electronic component can be surely prevented.

また、本発明の請求項２における混成集積回路の製造方法では、より大きな電流を取り扱うことができると共に、トラブルの解析が容易になり、しかも電子部品の電極間のショートを確実に防ぐことができる。   Further, in the hybrid integrated circuit manufacturing method according to the second aspect of the present invention, a larger current can be handled, a trouble can be easily analyzed, and a short circuit between the electrodes of the electronic component can be surely prevented. .

以下、本発明における回路基板および混成集積回路と、それらの製造方法の好ましい実施例について、添付図面である図１および図２を参照して詳細に説明する。   Hereinafter, preferred embodiments of a circuit board and a hybrid integrated circuit according to the present invention and manufacturing methods thereof will be described in detail with reference to FIGS. 1 and 2 which are attached drawings.

図１は本発明に係わる混成集積回路の斜視図である。同図において、１はリードフレームで、これは0.1mmから1.0mm程度の厚みの金属板２を加工したもので、必要な電流容量と機械的強度とから設計される。リードフレーム１の母材となる良導電性の金属板２は、リードフレーム１単体で後述する微細な回路パターン３を高密度で配線できるように、例えば0.25ｍｍの厚みを有する一様な圧延板からなる。また金属板２は、熱伝導性を考慮して、例えば銅，鉄，アルミニウム，ニッケルから選ばれた少なくとも１種を主成分とする金属から構成するのが好ましい。金属板２には、その両面に施された周知のエッチング処理またはプレス加工により、複数の分離溝４が形成される。各分離溝４は、いずれも金属板２の上面から下面を貫通して開口形成されており、この分離溝４によって複数の回路パターン３と、これに連なる外部接続用の端子片５が金属板２の平面方向に分離される。   FIG. 1 is a perspective view of a hybrid integrated circuit according to the present invention. In the figure, reference numeral 1 denotes a lead frame, which is a processed metal plate 2 having a thickness of about 0.1 mm to 1.0 mm, and is designed from a required current capacity and mechanical strength. The highly conductive metal plate 2 that is the base material of the lead frame 1 is a uniform rolled plate having a thickness of, for example, 0.25 mm so that a fine circuit pattern 3 to be described later can be wired with high density by the lead frame 1 alone. Consists of. In consideration of thermal conductivity, the metal plate 2 is preferably made of a metal whose main component is at least one selected from, for example, copper, iron, aluminum, and nickel. A plurality of separation grooves 4 are formed in the metal plate 2 by a well-known etching process or press process applied to both surfaces thereof. Each separation groove 4 has an opening formed through the lower surface from the upper surface of the metal plate 2, and the plurality of circuit patterns 3 and the external connection terminal pieces 5 are connected to the metal plate by the separation groove 4. 2 plane directions.

前記回路パターン３には、例えばＩＣ、トランジスタ、抵抗、コンデンサ、トランスなどの電子部品６を接続する接続片７が形成される。本実施例では、表面実装タイプの電子部品６が半田付け接続できるように、電子部品６の端子電極８に対応して孔のない接続片７が設けられているが、リードスルー実装タイプの電子部品６であれば、電子部品５のリードが挿通する孔を備えた接続片７とするのが好ましい。これらの複数の回路パターン３と、この回路パターン３に接続する電子部品６とにより、混成集積回路の主回路部分となる部品搭載部11が形成される。   In the circuit pattern 3, a connection piece 7 for connecting an electronic component 6 such as an IC, a transistor, a resistor, a capacitor, or a transformer is formed. In this embodiment, the connection piece 7 without a hole is provided corresponding to the terminal electrode 8 of the electronic component 6 so that the surface mounting type electronic component 6 can be connected by soldering. If it is the component 6, it is preferable to set it as the connection piece 7 provided with the hole which the lead | read | reed of the electronic component 5 penetrates. The plurality of circuit patterns 3 and the electronic component 6 connected to the circuit pattern 3 form a component mounting portion 11 that becomes a main circuit portion of the hybrid integrated circuit.

部品搭載部11の外側には、この部品搭載部11を囲むように矩形枠状の枠体20が設けられる。この枠体20は、島状に独立した各回路パターン３と、これに連なる各端子片５をそれぞれ支持するもので、隣り合う回路パターン３や端子片５との電気的な短絡を避けるために、樹脂やセラミックスなどの絶縁性材料で形成される。また、枠体20の内側において、回路パターン３と電子部品６からなる部品搭載部11は、例えば樹脂モールドなどで密封されておらず、外気に触れて露出した状態となっている。すなわち本実施例では、リードフレーム１による回路パターン３と端子片５を支持する部材として枠体20だけが設けられ、枠体20の内部に形成された空間部に部品搭載部11が配置される構成になっている。   A rectangular frame 20 is provided outside the component mounting portion 11 so as to surround the component mounting portion 11. The frame body 20 supports each circuit pattern 3 independent in an island shape and each terminal piece 5 connected to the circuit pattern 3 in order to avoid an electrical short circuit between the adjacent circuit pattern 3 and the terminal piece 5. It is made of an insulating material such as resin or ceramic. Further, inside the frame body 20, the component mounting portion 11 composed of the circuit pattern 3 and the electronic component 6 is not sealed with, for example, a resin mold, and is exposed to the outside air. That is, in the present embodiment, only the frame body 20 is provided as a member for supporting the circuit pattern 3 and the terminal piece 5 by the lead frame 1, and the component mounting portion 11 is disposed in the space formed inside the frame body 20. It is configured.

なお、枠体20の内側に異物が侵入するのを防止するために、枠体20の開口部上面に着脱自在な蓋を設けてもよい。但し、その場合も蓋は枠体20と同様に絶縁性材料で構成し、かつ部品搭載部11とは非接触に配置するのが好ましい。   In order to prevent foreign matter from entering the inside of the frame body 20, a detachable lid may be provided on the upper surface of the opening of the frame body 20. However, in this case as well, it is preferable that the lid is made of an insulating material as in the case of the frame body 20, and is arranged in a non-contact manner with the component mounting portion 11.

枠体20の外側に突出する端子片５は、必要に応じてその先端が下方に折り曲げられる。この端子片５の先端面は、枠体20の下面よりも下方に位置しており、完成した混成集積回路を例えばプリント基板（図示せず）などの被取付部に載置した時に、端子片５の先端部が、プリント基板に設けたスルーホールに挿入するようになっている。これにより、枠体20の下面全体がプリント基板の表面に当接する安定した状態で、端子片５とプリント基板のスルーホールとを半田付け接続することが可能になる。   The terminal piece 5 protruding to the outside of the frame 20 has its tip bent downward as required. The front end surface of the terminal piece 5 is located below the lower surface of the frame body 20, and when the completed hybrid integrated circuit is placed on a mounted portion such as a printed board (not shown), the terminal piece The tip of 5 is inserted into a through hole provided in the printed circuit board. As a result, the terminal piece 5 and the through hole of the printed circuit board can be soldered and connected in a stable state in which the entire lower surface of the frame 20 is in contact with the surface of the printed circuit board.

次に、本発明による混成集積回路の製造方法を、図２に基づき各工程にしたがって説明する。先ず図２（ａ）に示すように、平板状の金属板２から所望の形状のリードフレーム１を得るリードフレーム製造工程が行なわれる。ここでのリードフレーム１は、銅箔やリン青銅のような熱伝導性と電気伝導性が良好な材料からなる金属板２から、エッチングやプレスなどの加工により分離溝４を形成することで得られ、最終的な混成集積回路の電流が流れる部分と外部へのリード取り出し部分に対応したパターン形状を有している。この実施例では、外部へのリード取り出し部分がリードフレーム１の一側（上側）および他側（下側）に沿って端子片５として設けられており、各端子片５の一端はリードフレーム１の周囲に形成された枠状部12に繋がれていると共に、端子片５の他端は対応する回路パターン３に繋がれている。これにより回路パターン３と端子片５は、リードフレーム１の初期状態において全て枠状部12に支持される。   Next, a method for manufacturing a hybrid integrated circuit according to the present invention will be described in accordance with each step with reference to FIG. First, as shown in FIG. 2A, a lead frame manufacturing process for obtaining a lead frame 1 having a desired shape from a flat metal plate 2 is performed. Here, the lead frame 1 is obtained by forming a separation groove 4 from a metal plate 2 made of a material having good thermal conductivity and electrical conductivity, such as copper foil or phosphor bronze, by processing such as etching or pressing. The final hybrid integrated circuit has a pattern shape corresponding to a portion through which a current flows and a lead extraction portion to the outside. In this embodiment, lead-out portions to the outside are provided as terminal pieces 5 along one side (upper side) and the other side (lower side) of the lead frame 1, and one end of each terminal piece 5 is at the lead frame 1. And the other end of the terminal strip 5 is connected to the corresponding circuit pattern 3. As a result, the circuit pattern 3 and the terminal strip 5 are all supported by the frame-like portion 12 in the initial state of the lead frame 1.

こうして、所望の形状のリードフレーム１が得られると、次に電子部品６をリードフレーム１に例えば半田付けなどで接続する電子部品６の実装工程に移行する。半田付けの方法としては、例えば半田ペーストを回路パターン３の各接続片７に印刷して、この接続片７に電子部品２の端子電極８を貼り付け、高温の温度槽（炉）を通すことにより半田ペーストを融解して一括して接続するのが一般的である。また、リードスルー実装タイプの電子部品６であれば、電子部品６のリードを接続片７の孔に挿通し、この電子部品６のリードと接続片７との間に半田を融解付着させればよい。なお、電子部品６はリードフレーム１の片面のみならず両面に装着してもよい。   When the lead frame 1 having a desired shape is obtained in this manner, the electronic component 6 is connected to the lead frame 1 by, for example, soldering or the like. As a soldering method, for example, a solder paste is printed on each connection piece 7 of the circuit pattern 3, the terminal electrode 8 of the electronic component 2 is attached to the connection piece 7, and a high temperature bath (furnace) is passed. Generally, the solder paste is melted and connected together. In the case of the electronic component 6 of the lead-through mounting type, if the lead of the electronic component 6 is inserted into the hole of the connection piece 7 and solder is melted and adhered between the lead of the electronic component 6 and the connection piece 7 Good. The electronic component 6 may be mounted not only on one side of the lead frame 1 but also on both sides.

全ての電子部品６を実装した後は、図２（ｂ）に示すような枠体20の成形工程に移行する。これは例えば部品搭載部11を囲むようにして、リードフレーム１に枠体20の形状に対応した型を装着し、この型内に樹脂を流し込んで枠体20を形成した後、リードフレーム１から型を取り外すことで行なわれる。こうして枠体20の内部には、外部接続用の端子片５を除く実質的な混成集積回路の主要部分が形成される。   After all the electronic components 6 have been mounted, the process proceeds to the frame 20 forming step as shown in FIG. For example, a mold corresponding to the shape of the frame body 20 is mounted on the lead frame 1 so as to surround the component mounting portion 11, and after the resin is poured into the mold to form the frame body 20, the mold is removed from the lead frame 1. It is done by removing. Thus, a substantial part of the hybrid integrated circuit excluding the terminal piece 5 for external connection is formed inside the frame body 20.

リードフレーム１の回路パターン３や端子片５を枠体20で保持すると、次のリードフレーム１の切断行程では、図２（ｃ）に示すように、リードフレーム１の不要な部分である周囲部である枠状部12が切断除去され、枠体20の外側に外部接続用の端子片５だけが残る。回路パターン３や端子片５は、リードフレーム１の周辺部を切り落とすことによって独立した島状のパターンとなるが、前の枠体20の成形工程で各回路パターン３や端子片５が枠体20に保持されているので、脱落する虞れはない。好ましくは、端子片５間のピッチは一般的な混成集積回路で使用されている2.54mm（1/10インチ）の整数倍となっている。最後に、各端子片５を所望の形状に折り曲げることで、図１に示す混成集積回路が完成する。   When the circuit pattern 3 and the terminal piece 5 of the lead frame 1 are held by the frame body 20, in the next cutting process of the lead frame 1, as shown in FIG. The frame-shaped part 12 is cut and removed, and only the terminal pieces 5 for external connection remain outside the frame body 20. The circuit pattern 3 and the terminal piece 5 become independent island patterns by cutting off the peripheral portion of the lead frame 1, but each circuit pattern 3 and the terminal piece 5 are formed in the frame body 20 in the previous frame 20 forming process. Since there is no fear of dropping off. Preferably, the pitch between the terminal pieces 5 is an integral multiple of 2.54 mm (1/10 inch) used in a general hybrid integrated circuit. Finally, each terminal piece 5 is bent into a desired shape to complete the hybrid integrated circuit shown in FIG.

なお、上記一連の製造工程では、半田付け作業時における枠体20への熱影響を避けるために、電子部品６をリードフレーム１に搭載して半田付けを行ない、次に樹脂の枠体20を形成し、続いてリードフレーム１の不必要な部分を切除するようにしたが、その工程を変えてもよい。例えば、最初に電子部品６を半田付け接続していない単体のリードフレーム１に樹脂の枠体20を形成し、次に電子部品６をリードフレーム１に半田付け接続してから、リードフレーム１の不必要な部分を切除してもよい。さらに、単体のリードフレーム１に樹脂の枠体20を形成し、リードフレーム１の不必要な部分を切除してから、電子部品６をリードフレーム１に搭載して半田付け接続する工程を行なってもよい。   In the above-described series of manufacturing processes, in order to avoid thermal influence on the frame body 20 during the soldering operation, the electronic component 6 is mounted on the lead frame 1 and soldered, and then the resin frame body 20 is mounted. Although the formation and the unnecessary part of the lead frame 1 are subsequently cut off, the process may be changed. For example, a resin frame 20 is first formed on a single lead frame 1 to which the electronic component 6 is not soldered and connected, and then the electronic component 6 is soldered and connected to the lead frame 1. Unnecessary parts may be excised. Further, a resin frame 20 is formed on the single lead frame 1 and unnecessary portions of the lead frame 1 are cut off, and then the electronic component 6 is mounted on the lead frame 1 and soldered and connected. Also good.

このようにして組立てられた混成集積回路は、電流が流れる箇所である回路パターン３や端子片５が、いずれも金属板２を加工成形して得たリードフレーム１で構成されるので、混成集積回路としてより多くの電流を流すことが可能になる。それにも拘らず、本実施例では枠体20の内側にある部品搭載部11が外気に触れる状態で露出しているので、回路パターン３や電子部品６からの放熱性がよく、大電流を取り扱えるものでありながら、部品実装部11における温度上昇を抑制できる。   In the hybrid integrated circuit assembled in this way, the circuit pattern 3 and the terminal piece 5, where current flows, are both composed of the lead frame 1 obtained by processing and forming the metal plate 2. As a circuit, more current can be passed. Nevertheless, in the present embodiment, the component mounting portion 11 inside the frame 20 is exposed in a state where it is exposed to the outside air, so that heat dissipation from the circuit pattern 3 and the electronic component 6 is good and a large current can be handled. Although it is a thing, the temperature rise in the component mounting part 11 can be suppressed.

また、リードフレーム１に電子部品６が直接半田付け接続されていると、外部接続用の端子片５を被取付部である例えばプリント基板に半田付け接続する際に、リードフレーム１に加わった熱が速やかに伝導して、電子部品６と回路パターン３との間に付着する半田が溶融する虞れがある。しかし本実施例では、部品搭載部11が樹脂などの封止部でパッケージングされておらず、部品搭載部11の外側にある枠体20以外は、リードフレーム１を支持する部材が存在しないので、溶解した半田はそこに止まって別の部位に流れることはなく、流れ出した半田により電子部品６の端子電極８間がショートする不具合を確実に回避できる。   Further, when the electronic component 6 is directly soldered and connected to the lead frame 1, the heat applied to the lead frame 1 when the external connection terminal piece 5 is soldered and connected to, for example, a printed circuit board. May be conducted quickly and the solder adhered between the electronic component 6 and the circuit pattern 3 may be melted. However, in this embodiment, the component mounting portion 11 is not packaged by a sealing portion such as resin, and there is no member that supports the lead frame 1 except for the frame body 20 outside the component mounting portion 11. The melted solder does not stop there and flow to another part, and it is possible to reliably avoid a short circuit between the terminal electrodes 8 of the electronic component 6 due to the flowed solder.

しかも、枠体20の内側にある部品搭載部11は、枠体20の開口部から直接目視できる。そのため、電子部品６そのもののトラブルや、電子部品６の実装に関するトラブルを直ぐに確認できるという利点もある。   In addition, the component mounting portion 11 inside the frame body 20 can be directly seen from the opening of the frame body 20. Therefore, there is an advantage that troubles of the electronic component 6 itself and troubles related to mounting of the electronic component 6 can be confirmed immediately.

以上のように、本実施例における混成集積回路は、部品搭載部11を形成する回路パターン３と外部接続用の端子部たる端子片５とを含むリードフレーム１と、回路パターン３に接着される電子部品６と、部品搭載部11の外側に設けられ、この部品搭載部11が露出するようにリードフレーム１を支持する枠体20とにより構成される。   As described above, the hybrid integrated circuit in this embodiment is bonded to the circuit pattern 3 and the lead frame 1 including the circuit pattern 3 that forms the component mounting portion 11 and the terminal piece 5 that is a terminal portion for external connection. The electronic component 6 and a frame body 20 that is provided outside the component mounting portion 11 and supports the lead frame 1 so that the component mounting portion 11 is exposed.

また、本実施例における混成集積回路の製造方法は、回路パターン３とこの回路パターン３に連結する外部接続用の端子片５が周囲部である枠状部12に繋がるようにリードフレーム１を加工形成する工程と、リードフレーム１の回路パターン３に電子部品６を半田付け接続して部品搭載部11を形成する工程と、部品搭載部11の外側にあって、この部品搭載部11が露出するようにリードフレーム１を支持する枠体20を形成する工程と、回路パターン３と端子片５を残してリードフレーム１の周囲部である枠状部12を除去する工程とを含んでいる。   Further, in the method of manufacturing a hybrid integrated circuit according to the present embodiment, the lead frame 1 is processed so that the circuit pattern 3 and the external connection terminal piece 5 connected to the circuit pattern 3 are connected to the frame-like portion 12 as the peripheral portion. Forming the component mounting portion 11 by soldering and connecting the electronic component 6 to the circuit pattern 3 of the lead frame 1, and exposing the component mounting portion 11 outside the component mounting portion 11. Thus, a step of forming the frame body 20 for supporting the lead frame 1 and a step of removing the frame-like portion 12 which is the peripheral portion of the lead frame 1 while leaving the circuit pattern 3 and the terminal piece 5 are included.

こうした混成集積回路の構成および製造方法によれば、リードフレーム１は回路基板上に形成した配線パターンのような制約を受けず、配線パターンの数倍の厚さに形成することができるので、より大きな流すことができる。また、リードフレーム１を支持する枠体20の内側では、部品搭載部11である回路パターン３や電子部品６がいずれも外気に触れるように露出しているので、部品搭載部11からの放熱性がよく、またリードフレーム１に熱が加わって電子部品６と回路パターン３との間の半田が溶融しても、別の部位に流れることがない。さらに、電子部品６そのもののトラブルや、電子部品６の実装に関するトラブルを直接目視で確認でき、製品としての評価や故障解析が容易にできる。   According to the configuration and manufacturing method of such a hybrid integrated circuit, the lead frame 1 can be formed several times as thick as the wiring pattern without being restricted by the wiring pattern formed on the circuit board. It can flow big. Moreover, since the circuit pattern 3 and the electronic component 6 which are the component mounting part 11 are exposed so that it may touch outside air inside the frame 20 which supports the lead frame 1, the heat dissipation from the component mounting part 11 is carried out. In addition, even when heat is applied to the lead frame 1 and the solder between the electronic component 6 and the circuit pattern 3 is melted, it does not flow to another part. Furthermore, troubles in the electronic component 6 itself and troubles related to the mounting of the electronic component 6 can be directly visually confirmed, and product evaluation and failure analysis can be facilitated.

なお、本実施例は上記各実施例に限定されるものではなく、種々の変形実施が可能である。   In addition, a present Example is not limited to said each Example, A various deformation | transformation implementation is possible.

本発明における混成集積基板は、例えばパワー系と制御系が混在する電源装置やノイズフィルタに限らず、同様のあらゆる電子機器への適用が可能である。   The hybrid integrated substrate according to the present invention is not limited to, for example, a power supply device and a noise filter in which a power system and a control system are mixed, and can be applied to all similar electronic devices.

本発明の好ましい実施例を示す混成集積回路の全体斜視図である。1 is an overall perspective view of a hybrid integrated circuit showing a preferred embodiment of the present invention. 同上、本発明による混成集積回路の製造工程を示す概略説明図である。FIG. 3 is a schematic explanatory view showing the manufacturing process of the hybrid integrated circuit according to the present invention.

符号の説明Explanation of symbols

１ リードフレーム
３ 回路パターン
５ 端子片
６ 電子部品
11 部品搭載部
12 枠状部（周囲部）
20 枠体 1 Lead frame 3 Circuit pattern 5 Terminal piece 6 Electronic component
11 Parts mounting part
12 Frame (periphery)
20 frame

Claims (2)

部品搭載部を形成する回路パターンと外部接続用の端子部とを含むリードフレームと、前記回路パターンに接着される電子部品と、前記部品搭載部の外側に設けられ、該部品搭載部が露出するように前記リードフレームを支持する枠体とからなることを特徴とする混成集積回路。 A lead frame including a circuit pattern forming a component mounting portion and a terminal portion for external connection, an electronic component bonded to the circuit pattern, and provided outside the component mounting portion, and the component mounting portion is exposed. Thus, a hybrid integrated circuit comprising a frame body supporting the lead frame. 回路パターンとこの回路パターンに連結する外部接続用の端子部が周囲部に繋がるようにリードフレームを加工形成する工程と、前記リードフレームの回路パターンに電子部品を半田付け接続して部品搭載部を形成する工程と、前記部品搭載部の外側にあって、該部品搭載部が露出するように前記リードフレームを支持する枠体を形成する工程と、前記回路パターンと前記端子部を残して前記リードフレームの周囲部を除去する工程とを含むことを特徴とする混成集積回路の製造方法。
A process of forming a lead frame so that a circuit pattern and a terminal part for external connection connected to the circuit pattern are connected to the peripheral part, and a component mounting part by soldering and connecting an electronic component to the circuit pattern of the lead frame Forming a frame body outside the component mounting portion and supporting the lead frame so that the component mounting portion is exposed; leaving the circuit pattern and the terminal portion; And a step of removing a peripheral portion of the frame.
JP2003300339A 2003-08-25 2003-08-25 Method for manufacturing hybrid integrated circuit Expired - Fee Related JP4461476B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149779A (en) * 2012-01-19 2013-08-01 Semiconductor Components Industries Llc Semiconductor device
WO2022185515A1 (en) * 2021-03-05 2022-09-09 三菱電機株式会社 Semiconductor module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149779A (en) * 2012-01-19 2013-08-01 Semiconductor Components Industries Llc Semiconductor device
WO2022185515A1 (en) * 2021-03-05 2022-09-09 三菱電機株式会社 Semiconductor module
EP4303916A4 (en) * 2021-03-05 2024-04-17 Mitsubishi Electric Corporation Semiconductor module

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