JP2005056952A - Connection structure of circuit board - Google Patents

Connection structure of circuit board Download PDF

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Publication number
JP2005056952A
JP2005056952A JP2003284439A JP2003284439A JP2005056952A JP 2005056952 A JP2005056952 A JP 2005056952A JP 2003284439 A JP2003284439 A JP 2003284439A JP 2003284439 A JP2003284439 A JP 2003284439A JP 2005056952 A JP2005056952 A JP 2005056952A
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circuit board
flexible wiring
wiring board
slit
connection
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Jiyouji Hisanami
丈治 久波
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Kyocera Display Corp
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Kyocera Display Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To improve the reliability of connection by preventing the direct application of mechanical stress from a flexible wiring board on a connection portion between a hard circuit board and the flexible wiring board, without using a reinforcing means such as a double-sided adhesive tape. <P>SOLUTION: In connecting a connection lead 21 formed on an end 20a of the flexible wiring board 20 to an electrode terminal section 11 formed on one surface 10a of the hard circuit board 100 by soldering material etc., a slit 12 is provided on the hard circuit board 100, and the end 20a of the flexible circuit board 20 is pulled out from the other end 10b side of the hard circuit board 100 to the one end 10a side through the slit 12 to connect the connection lead 21 to the electrode terminal 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、回路基板の接続構造に関し、さらに詳しく言えば、回路基板とフレキシブル配線基板との間で接続の高い信頼性が得られる回路基板の接続構造に関するものである。   The present invention relates to a circuit board connection structure, and more particularly to a circuit board connection structure that provides high connection reliability between a circuit board and a flexible wiring board.

フレキシブル配線基板は、その可撓性により自在に引き回し可能であるため、例えば異なる高さ位置に配置される回路基板間や可動部側の回路基板と固定部側の回路基板間を接続する中継基板として多用されている。フレキシブル配線基板同士が接続されることもあるが、多くの場合、相手方基板は硬質回路基板であり、その接続の一例を図４および図５により説明する。なお、図４は硬質回路基板１０とフレキシブル配線基板２０とを分離して示す斜視図で、図５は接続部分の拡大断面図である。   Since the flexible wiring board can be freely routed due to its flexibility, for example, a relay board that connects between circuit boards arranged at different height positions or between a circuit board on the movable part side and a circuit board on the fixed part side It is often used as. Although flexible wiring boards may be connected to each other, in many cases, the counterpart board is a hard circuit board, and an example of the connection will be described with reference to FIGS. 4 is a perspective view showing the hard circuit board 10 and the flexible wiring board 20 separately, and FIG. 5 is an enlarged sectional view of a connection portion.

接続手段としては、コネクタ，ハンダ付け，異方性導電フィルムなどが知られているが、この例は、硬質回路基板１０の一方の面１０ａに形成されている電極端子部１１にフレキシブル配線基板２０をハンダ付けする場合のものである。   As the connection means, a connector, soldering, an anisotropic conductive film, and the like are known. In this example, the flexible wiring board 20 is connected to the electrode terminal portion 11 formed on one surface 10a of the hard circuit board 10. This is for soldering.

フレキシブル配線基板２０の端部２０ａには、ベースフィルムとソルダレジスト樹脂膜を窓状に除去して内部のリード線２１ａの一部を露出させた接続リード部２１が形成されており、リフローハンダによる場合には、例えば硬質回路基板１０の電極端子部１１にクリームハンダＡを塗布したのち、その上にフレキシブル配線基板２０の接続リード部２１を重ね図示しない加熱炉にて加熱してハンダ付けする。   The end portion 20a of the flexible wiring board 20 is formed with a connection lead portion 21 in which the base film and the solder resist resin film are removed in a window shape to expose a part of the inner lead wire 21a. In this case, for example, after applying cream solder A to the electrode terminal portion 11 of the hard circuit board 10, the connection lead portion 21 of the flexible wiring board 20 is overlaid thereon and heated in a heating furnace (not shown) for soldering.

フレキシブル配線基板２０にはしばしば曲げ応力がかけられる。例えば、硬質回路基板１０が液晶駆動回路基板で、フレキシブル配線基板２０を介して図示しない液晶パネルに接続され、その液晶パネルの裏面側に配置されるような場合、フレキシブル配線基板２０はほぼ１８０゜折り曲げられることになる。   Bending stress is often applied to the flexible wiring board 20. For example, when the hard circuit board 10 is a liquid crystal drive circuit board and is connected to a liquid crystal panel (not shown) via the flexible wiring board 20 and is disposed on the back side of the liquid crystal panel, the flexible wiring board 20 is approximately 180 °. It will be bent.

この折り曲げ時の曲げ応力からハンダ付け部分を保護（補強）するため、従来では、図５に示すように、フレキシブル配線基板２０を両面粘着テープ３０により硬質回路基板１０に固定するようにしている。しかしながら、両面粘着テープ３０の粘着力は経年的に劣化し、また、周囲の温度や湿度などによっても劣化することがあるため、信頼性が高いとは言えない。   In order to protect (reinforce) the soldered portion from the bending stress at the time of bending, conventionally, the flexible wiring board 20 is fixed to the hard circuit board 10 by a double-sided adhesive tape 30 as shown in FIG. However, the adhesive strength of the double-sided pressure-sensitive adhesive tape 30 deteriorates over time, and may deteriorate due to ambient temperature, humidity, etc., so it cannot be said that the reliability is high.

劣化が始まると外部の振動や衝撃などによって剥がれやすくなり、実際に剥がれてしまうと、ハンダ付け部分に直接に機械的ストレスが加わって断線してしまうことがある。なお、確実な固定方法としてはネジ止めがあるが、両面粘着テープよりも部品コストがかかるうえに作業工数が増えるため好ましくない。また、ネジ止めするスペースを必要とするため、小型化・薄型化の要求が厳しい機器には適用できない。   When the deterioration starts, it becomes easy to peel off due to external vibration or impact, and if it actually peels off, it may break due to mechanical stress directly applied to the soldered portion. A secure fixing method is screwing, which is not preferable because it costs more parts than double-sided adhesive tape and increases the number of work steps. In addition, since it requires a space for screwing, it cannot be applied to devices that are demanded to be small and thin.

したがって、本発明の課題は、両面粘着テープなどの補強手段によることなく、回路基板とフレキシブル配線基板との接続部分に対して、フレキシブル配線基板側からの機械的ストレスが直接に加わらないようにして、接続の信頼性を高めることにある。   Therefore, an object of the present invention is to prevent mechanical stress from the flexible wiring board side from being directly applied to the connection portion between the circuit board and the flexible wiring board without using reinforcing means such as double-sided adhesive tape. , To improve the reliability of the connection.

上記課題を解決するため、本発明は、回路基板の一方の面に形成されている電極端子部に、フレキシブル配線基板の一方の端部に形成されている接続リード部を所定の導電接続手段を介して接続する回路基板の接続構造において、上記回路基板は上記フレキシブル配線基板の一方の端部を挿通可能なスリットを備え、上記フレキシブル配線基板の一方の端部が上記回路基板の他方の面側から上記スリットを通して上記回路基板の一方の面側に引き出されて、上記接続リード部と上記電極端子部とが所定の導電接続手段を介して接続されていることを特徴としている。   In order to solve the above-described problems, the present invention provides a predetermined conductive connection means for connecting a connection lead formed on one end of a flexible wiring board to an electrode terminal formed on one surface of a circuit board. In the circuit board connection structure to be connected via the circuit board, the circuit board is provided with a slit through which one end of the flexible wiring board can be inserted, and one end of the flexible wiring board is on the other surface side of the circuit board. The connection lead portion and the electrode terminal portion are connected to each other through a predetermined conductive connection means.

本発明には、上記回路基板の他方の面において、上記フレキシブル配線基板の上記スリットから出た部分が上記フレキシブル配線基板の一方端部と同方向に折り曲げられる態様と、これとは逆に、上記フレキシブル配線基板の上記スリットから出た部分が上記フレキシブル配線基板の一方の端部と反対方向に折り曲げられる態様のいずれも含まれる。   In the present invention, on the other side of the circuit board, the part of the flexible wiring board that protrudes from the slit is bent in the same direction as one end of the flexible wiring board. Any of the aspects in which the portion of the flexible wiring board that protrudes from the slit is bent in the direction opposite to one end of the flexible wiring board is included.

また、より好ましくは、上記フレキシブル配線基板の一部分が接着手段を介して上記回路基板の他方の面に固定される態様も本発明に含まれる。   More preferably, a mode in which a part of the flexible wiring board is fixed to the other surface of the circuit board via an adhesive means is also included in the present invention.

本発明によれば、回路基板にフレキシブル配線基板を接続するにあたって、フレキシブル配線基板の接続リード部を有する一方の端部が、回路基板の他方の面側からスリットを通して電極端子部が形成されている回路基板の一方の面側に引き出されて所定の導電接続手段を介して接続される。
したがって、フレキシブル配線基板にかけられる曲げ，引っ張りの双方を含む機械的なストレスがスリットの挿通部分でベクトル分解されて緩和されるため、回路基板との接続部分に直接に加わることがなく、仮に補強手段としての両面粘着テープが剥がれたとしても、接続の信頼性を維持することができる。 According to the present invention, when connecting the flexible wiring board to the circuit board, one end portion having the connection lead portion of the flexible wiring board is formed with the electrode terminal portion through the slit from the other surface side of the circuit board. It is pulled out to one surface side of the circuit board and connected through predetermined conductive connection means.
Therefore, since mechanical stress including both bending and pulling applied to the flexible wiring board is reduced by vector decomposition at the slit insertion part, it is not directly applied to the connection part with the circuit board, but temporarily strengthening means Even if the double-sided adhesive tape is peeled off, the connection reliability can be maintained.

次に、図１ないし図３により、本発明の実施形態について説明するが、本発明はこれに限定されるものてはない。なお、この実施形態の説明において、硬質回路基板とフレキシブル配線基板のうち、フレキシブル配線基板については、先の図４，図５で説明したフレキシブル配線基板２０の構成と同じであってよいためその説明は省略し、図１の斜視図には本発明に含まれる硬質回路基板１００のみを示す。   Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 3, but the present invention is not limited to this. In the description of this embodiment, of the hard circuit board and the flexible wiring board, the flexible wiring board may be the same as the configuration of the flexible wiring board 20 described above with reference to FIGS. Is omitted, and only the rigid circuit board 100 included in the present invention is shown in the perspective view of FIG.

図１は硬質回路基板１００を裏面側、すなわち電極端子部１１が形成されている一方の面１０ａとは反対側の他方の面１０ｂ側から見た斜視図である。硬質回路基板１００は、フレキシブル配線基板２０の少なくとも端部２０ａを挿通するためのスリット１２を備えている。   FIG. 1 is a perspective view of the hard circuit board 100 as viewed from the back surface side, that is, the other surface 10b side opposite to the one surface 10a on which the electrode terminal portions 11 are formed. The hard circuit board 100 includes a slit 12 for inserting at least the end 20a of the flexible wiring board 20.

スリット１２は電極端子部１１に沿って配置される。この第１実施形態において、電極端子部１１が硬質回路基板１００の端縁１０ｃ側に位置されているのに対して、スリット１２は端縁１０ｃ側とは反対の基板中央部側に配置されている。   The slit 12 is disposed along the electrode terminal portion 11. In the first embodiment, the electrode terminal portion 11 is located on the edge 10c side of the hard circuit board 100, whereas the slit 12 is disposed on the substrate center side opposite to the edge 10c side. Yes.

このため、電極端子部１１の引き回し配線１１ａはスリット１２の脇を通って基板中央部側に向けて配線されている。なお、スリット１２の溝幅は、通常使用されるフレキシブル配線基板２０の厚さからして実寸で１ｍｍ程度が好ましい。   For this reason, the routing wiring 11a of the electrode terminal portion 11 is routed through the side of the slit 12 toward the central portion of the substrate. In addition, the groove width of the slit 12 is preferably about 1 mm in actual size from the thickness of the flexible wiring board 20 that is normally used.

図２に硬質回路基板１００にフレキシブル配線基板２０を接続した状態を示す。この接続にあたっては、フレキシブル配線基板２０の端部２０ａを硬質回路基板１００の他方の面（裏面）１０ｂ側からスリット１２に挿通して硬質回路基板１００の一方の面（表面）１０ａ側に引き出し、接続リード部２１を図２において反時計方向にほぼ直角に折り曲げて電極端子部１１に重ねたのち、例えば上記従来例で説明したのと同様な方法によってハンダ付けする。   FIG. 2 shows a state where the flexible wiring board 20 is connected to the hard circuit board 100. In this connection, the end 20a of the flexible wiring board 20 is inserted into the slit 12 from the other surface (back surface) 10b side of the hard circuit board 100 and pulled out to the one surface (front surface) 10a side of the hard circuit board 100, The connection lead portion 21 is bent substantially at a right angle in the counterclockwise direction in FIG. 2 and stacked on the electrode terminal portion 11, and then soldered by the same method as described in the above-described conventional example, for example.

硬質回路基板１００の他方の面１０ｂ側については、フレキシブル配線基板２０のスリット１２から出ている部分を、電極端子部１１に接続されている端部２０ａと同方向、すなわち図２において時計方向に向けてほぼ直角に折り曲げて、フレキシブル配線基板２０を硬質回路基板１００の他方の面１０ｂに沿わせる。このとき、両面粘着テープ３０にてフレキシブル配線基板２０を硬質回路基板１００に固定することが好ましい。   With respect to the other surface 10b side of the hard circuit board 100, the portion protruding from the slit 12 of the flexible wiring board 20 is in the same direction as the end 20a connected to the electrode terminal portion 11, that is, clockwise in FIG. The flexible printed circuit board 20 is bent along the other surface 10b of the hard circuit board 100 by bending it at a substantially right angle. At this time, it is preferable to fix the flexible wiring board 20 to the hard circuit board 100 with the double-sided adhesive tape 30.

このように、フレキシブル配線基板２０の一部分がスリット１２内に挿通され、接続リード部２１がほぼ１８０゜方向転換されて電極端子部１１に接続されているため、仮に両面粘着テープ３０が何らかの原因で剥がれたとしても、フレキシブル配線基板２０にかけられる曲げや引っ張りの機械的ストレスが接続部分に直接加わることがない。   In this way, a part of the flexible wiring board 20 is inserted into the slit 12 and the connection lead portion 21 is turned by approximately 180 ° and connected to the electrode terminal portion 11. Even if it peels off, the bending or pulling mechanical stress applied to the flexible wiring board 20 is not directly applied to the connection portion.

また、両面粘着テープ３０を貼り付けるにしても、その貼り付け面が電極端子部１１とは反対側の裏面１０ｂであるため、従来例よりも面積的に大きな両面粘着テープ３０を使用することができる。   Moreover, even if the double-sided adhesive tape 30 is affixed, since the affixing surface is the back surface 10b opposite to the electrode terminal portion 11, it is possible to use the double-sided adhesive tape 30 that is larger in area than the conventional example. it can.

次に、図３の断面図により、本発明の第２実施形態について説明する。この第２実施形態において上記第１実施形態と異なる点は、電極端子部１１に対してスリット１２が硬質回路基板１００の端縁１０ｃ寄りに配置されている点である。したがって、電極端子部１１の引き回し配線１１ａはスリット１２の脇を迂回することなく、基板中央部側に向けて配線されている。   Next, a second embodiment of the present invention will be described with reference to the cross-sectional view of FIG. The second embodiment is different from the first embodiment in that the slit 12 is disposed closer to the edge 10 c of the hard circuit board 100 with respect to the electrode terminal portion 11. Therefore, the routing wiring 11a of the electrode terminal portion 11 is wired toward the central portion of the substrate without bypassing the side of the slit 12.

この第２実施形態においては、フレキシブル配線基板２０の端部２０ａを硬質回路基板１００の他方の面１０ｂ側からスリット１２に挿通して硬質回路基板１００の一方の面１０ａ側に引き出し、接続リード部２１を図３において時計方向にほぼ直角に折り曲げて電極端子部１１に重ねたのち、例えば上記従来例で説明したのと同様な方法によってハンダ付けする。   In the second embodiment, the end portion 20a of the flexible wiring board 20 is inserted into the slit 12 from the other surface 10b side of the hard circuit board 100 and pulled out to the one surface 10a side of the hard circuit board 100, thereby connecting lead portions. In FIG. 3, 21 is bent at a substantially right angle in the clockwise direction and superimposed on the electrode terminal portion 11, and then soldered by the same method as described in the above-described conventional example, for example.

硬質回路基板１００の他方の面１０ｂ側については、フレキシブル配線基板２０のスリット１２から出ている部分を、電極端子部１１に接続されている端部２０ａとは反対方向、すなわち図３において時計方向に向けてほぼ直角に折り曲げて、フレキシブル配線基板２０を硬質回路基板１００の他方の面１０ｂに沿わせる。この場合においても、両面粘着テープ３０にてフレキシブル配線基板２０を硬質回路基板１００に固定することが好ましい。   With respect to the other surface 10b side of the hard circuit board 100, the portion protruding from the slit 12 of the flexible wiring board 20 is in a direction opposite to the end 20a connected to the electrode terminal portion 11, that is, clockwise in FIG. The flexible printed circuit board 20 is bent along the other surface 10b of the hard circuit board 100 by bending it at a substantially right angle. Even in this case, it is preferable to fix the flexible wiring board 20 to the hard circuit board 100 with the double-sided adhesive tape 30.

この第２実施形態においても、フレキシブル配線基板２０の一部分がスリット１２内に挿通され、接続リード部２１が方向転換されて電極端子部１１に接続されているため、上記第１実施形態と同様な作用・効果が得られる。   Also in the second embodiment, since a part of the flexible wiring board 20 is inserted into the slit 12 and the connection lead portion 21 is changed in direction and connected to the electrode terminal portion 11, it is the same as in the first embodiment. Action and effect are obtained.

上記各実施形態では、電極端子部１１と接続リード部２１とをハンダ付けするようにしているが、本発明は、ハンダ付けに代えて異方性導電フィルムなどの異方性導電接着材を用いる場合にも有効である。また、フレキシブル配線基板２０の接続リード部２１の形状も図４に示す窓枠状の形態に限定されるものではない。さらに、回路基板も硬質回路基板に限定されるものではなく、フレキシブル回路基板であってもよい。   In each of the above embodiments, the electrode terminal portion 11 and the connection lead portion 21 are soldered, but the present invention uses an anisotropic conductive adhesive such as an anisotropic conductive film instead of soldering. It is also effective in some cases. Further, the shape of the connection lead portion 21 of the flexible wiring board 20 is not limited to the window frame shape shown in FIG. Further, the circuit board is not limited to the hard circuit board, and may be a flexible circuit board.

本発明は、液晶パネルの分野で大きく曲げられて用いられるＴＣＰ（ｔａｐｅ ｃａｒｒｉｅｒ ｐａｃｋａｇｅ）やＣＯＦ（ｃｈｉｐ ｏｎ ｆｉｌｍ）などのフレキシブル配線基板と液晶駆動回路基板との接続に好適であるが、これに限られず、他の電気・電子機器に用いられるフレキシブル配線基板と回路基板との接続に広く利用可能である。   The present invention is suitable for connection between a flexible wiring board such as TCP (Tape Carrier Package) and COF (Chip on Film), which is greatly bent in the field of liquid crystal panels, and a liquid crystal driving circuit board, but is not limited thereto. However, it can be widely used to connect a flexible wiring board and a circuit board used in other electric / electronic devices.

本発明の第１実施形態に含まれる硬質回路基板を示す斜視図。The perspective view which shows the hard circuit board contained in 1st Embodiment of this invention. 本発明の第１実施形態による接続部分を示す拡大断面図。The expanded sectional view which shows the connection part by 1st Embodiment of this invention. 本発明の第２実施形態による接続部分を示す拡大断面図。The expanded sectional view which shows the connection part by 2nd Embodiment of this invention. ハンダ付けによって接続される従来例に係る硬質回路基板とフレキシブル配線基板とを分離して示す斜視図。The perspective view which isolate | separates and shows the hard circuit board and flexible wiring board which concern on the prior art example connected by soldering. 上記従来例に係る硬質回路基板とフレキシブル配線基板との接続部分を示す拡大断面図。The expanded sectional view which shows the connection part of the hard circuit board which concerns on the said prior art example, and a flexible wiring board.

符号の説明Explanation of symbols

１００ 硬質回路基板
１０ａ 硬質回路基板の一方の面
１０ｂ 硬質回路基板の他方の面
１０ｃ 硬質回路基板の端縁
１１ 電極端子部
１２ スリット
２０ フレキシブル配線基板
２０ａ フレキシブル配線基板の端部
２１ 接続リード部
３０ 両面粘着テープ DESCRIPTION OF SYMBOLS 100 Hard circuit board 10a One surface of a hard circuit board 10b The other surface of a hard circuit board 10c Edge of a hard circuit board 11 Electrode terminal part 12 Slit 20 Flexible wiring board 20a End part of a flexible wiring board 21 Connection lead part 30 Both surfaces Adhesive tape

Claims (4)

回路基板の一方の面に形成されている電極端子部に、フレキシブル配線基板の一方の端部に形成されている接続リード部を所定の導電接続手段を介して接続する回路基板の接続構造において、
上記回路基板は上記フレキシブル配線基板の一方の端部を挿通可能なスリットを備え、上記フレキシブル配線基板の一方の端部が上記回路基板の他方の面側から上記スリットを通して上記回路基板の一方の面側に引き出されて、上記接続リード部と上記電極端子部とが所定の導電接続手段を介して接続されていることを特徴とする回路基板の接続構造。 In the circuit board connection structure in which the connection lead part formed at one end of the flexible wiring board is connected to the electrode terminal part formed on one surface of the circuit board via a predetermined conductive connection means.
The circuit board includes a slit through which one end of the flexible wiring board can be inserted, and one end of the flexible wiring board passes from the other surface side of the circuit board through the slit to one surface of the circuit board. A circuit board connection structure, wherein the connection lead portion and the electrode terminal portion are connected to each other through predetermined conductive connection means. 上記回路基板の他方の面において、上記フレキシブル配線基板は上記スリットから出た部分が上記フレキシブル配線基板の一方の端部と同方向に折り曲げられている請求項１に記載の回路基板の接続構造。   2. The circuit board connection structure according to claim 1, wherein a portion of the flexible wiring board protruding from the slit is bent in the same direction as one end of the flexible wiring board on the other surface of the circuit board. 上記回路基板の他方の面において、上記フレキシブル配線基板は上記スリットから出た部分が上記フレキシブル配線基板の一方の端部と反対方向に折り曲げられている請求項１に記載の回路基板の接続構造。   2. The circuit board connection structure according to claim 1, wherein a portion of the flexible wiring board protruding from the slit is bent in a direction opposite to one end of the flexible wiring board on the other surface of the circuit board. 上記フレキシブル配線基板の一部分が接着手段を介して上記回路基板の他方の面に固定されている請求項１ないし３のいずれか１項に記載の回路基板の接続構造。   4. The circuit board connection structure according to claim 1, wherein a part of the flexible wiring board is fixed to the other surface of the circuit board through an adhesive means. 5.
JP2003284439A 2003-07-31 2003-07-31 Connection structure of circuit board Pending JP2005056952A (en)

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US7798823B2 (en) 2007-11-29 2010-09-21 Fujitsu Limited Electronic device and printed circuit board unit
US8876344B2 (en) 2009-12-17 2014-11-04 Sharp Kabushiki Kaisha Vehicle headlamp with excitation light source, light emitting part and light projection section
US8833991B2 (en) 2010-02-10 2014-09-16 Sharp Kabushiki Kaisha Light emitting device, with light guide member having smaller exit section, and illuminating device, and vehicle headlight including the same
JP2011243370A (en) * 2010-05-17 2011-12-01 Sharp Corp Light emitting device, illuminating device, and vehicle headlamp
US9816677B2 (en) 2010-10-29 2017-11-14 Sharp Kabushiki Kaisha Light emitting device, vehicle headlamp, illumination device, and laser element
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JPWO2016129278A1 (en) * 2015-02-12 2017-11-24 古河電気工業株式会社 Flexible substrate, component with flexible substrate, and method for manufacturing component with flexible substrate
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