JP2005051193A - 静電放電保護回路 - Google Patents
静電放電保護回路 Download PDFInfo
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- JP2005051193A JP2005051193A JP2003385306A JP2003385306A JP2005051193A JP 2005051193 A JP2005051193 A JP 2005051193A JP 2003385306 A JP2003385306 A JP 2003385306A JP 2003385306 A JP2003385306 A JP 2003385306A JP 2005051193 A JP2005051193 A JP 2005051193A
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- 239000010409 thin film Substances 0.000 claims abstract description 11
- 230000003068 static effect Effects 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims description 5
- 238000000707 layer-by-layer assembly Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005421 electrostatic potential Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Drying Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】各々がゲート及びソース/ドレインを具える複数の薄膜トランジスタと、
規定された場所において前記薄膜トランジスタのゲートのいくつかによって集積的に形成され、少なくとも1つの前記ゲートの後部又はエッジの一部を構成する、少なくとも1つの点構造とを具える。
【選択図】図1
Description
101、601 TFT
102 ゲート
104 誘電体層
106 半導体層
108 ソース/ドレイン
110、404a、404b、604a、604b、610、804a、804b 点構造
402 共通ライン
406 データライン
500 ESD装置
502 擬似ESD装置
504 他の装置
506 擬似ESD構造
508、510 導電ライン
602 擬似ゲート
606、806 擬似データライン
608 擬似ソース/ドレイン
Claims (17)
- 静電放電保護回路の構造において、
各々がゲート及びソース/ドレインを具える複数の薄膜トランジスタと、
規定された場所において前記薄膜トランジスタのゲートのいくつかによって集積的に形成され、少なくとも1つの前記ゲートの後部又はエッジの一部を構成する、少なくとも1つの点構造とを具えることを特徴とする静電放電保護回路の構造。 - 請求項1に記載の静電放電保護回路の構造において、前記ソース/ドレインを直線的にレイアウトしたことを特徴とする静電放電保護回路の構造。
- 請求項1に記載の静電放電保護回路の構造において、前記点構造を、ソース/ドレインが位置する場所から離れた領域において配置したことを特徴とする静電放電保護回路の構造。
- 請求項1に記載の静電放電保護回路の構造において、前記点構造の形状が、前記ゲートから延びる鋭角構造又は次第に細くなる構造から成ることを特徴とする静電放電保護回路の構造。
- 第1配線と交差する場合の静電放電機能を改善する静電放電保護回路の構造において、
各々がゲート及びソース/ドレインを具える複数の薄膜トランジスタと、
各々の前記薄膜トランジスタのソース/ドレインに結合し、前記第1配線と交差する第2配線と、
各々が前記第1配線及び第2配線の交点の付近において形成され、前記第1配線及び第2配線の少なくとも一方に結合する少なくとも1つの点構造とを具えることを特徴とする静電放電保護回路。 - 請求項5に記載の静電放電保護回路の構造において、前記ゲートの後部又はエッジの少なくとも一部を構成する少なくとも1つの第1点構造をさらに具えることを特徴とする静電放電保護回路。
- 請求項6に記載の静電放電保護回路の構造において、前記第1点構造を、前記ソース/ドレインから離れた領域において配置したことを特徴とする静電放電保護回路。
- 請求項5に記載の静電放電保護回路の構造において、前記ソース/ドレインを直線的にレイアウトしたことを特徴とする静電放電保護回路。
- 静電放電保護回路の構造において、前記静電放電保護回路が第1配線に結合し、該静電放電保護回路の構造が、
複数の静電放電装置と、
最も外側の部分において前記静電放電装置と隣接して配置された少なくとも1つの擬似静電放電装置とを具え、前記擬似静電放電装置が、
各々が擬似ゲート及び擬似ソース/ドレインを具える複数の擬似薄膜トランジスタと、
前記第1配線にかろうじて達するように延びる、前記擬似薄膜トランジスタの擬似ソース/ドレインに結合する擬似第2配線と、
前記擬似第2配線の端の付近において配置された前記第1配線のエッジを形成する少なくとも1つの点構造とを具えることを特徴とする静電放電保護回路の構造。 - 請求項9に記載の静電放電保護回路の構造において、前記擬似第2配線の後部を形成する少なくとも1つの第1点構造をさらに具えることを特徴とする静電放電保護回路の構造。
- 請求項9に記載の静電放電保護回路の構造において、前記擬似ゲートの後部及びエッジの少なくとも一部を形成する少なくとも1つの第2点構造をさらに具えることを特徴とする静電放電保護回路の構造。
- 請求項9に記載の静電放電保護回路の構造において、前記擬似ソース/ドレインを直線的にレイアウトしたことを特徴とする静電放電保護回路の構造。
- 静電放電保護回路の構造において、前記静電放電保護回路が第1配線に結合し、該静電放電保護回路の構造が、
複数の静電放電装置と、
最も外側の部分において前記静電放電装置に隣接して配置された少なくとも1つの擬似静電放電装置とを具え、前記擬似静電放電装置が、
各々が擬似ゲート及び擬似ソース/ドレインを具える複数の擬似薄膜トランジスタと、
前記擬似薄膜トランジスタの擬似ソース/ドレインに結合し、前記第1配線と交差する擬似第2配線と、
前記第1配線と擬似第2配線との交点の付近において配置され、前記第1配線及び擬似第2配線の少なくとも一方に結合する少なくとも1つの点構造とを具えることを特徴とする静電放電保護回路の構造。 - 請求項13に記載の静電放電保護回路の構造において、前記点構造の一部が前記第1配線に結合し、前記点構造の他の部分が前記擬似第2配線に結合することを特徴とする静電放電保護回路の構造。
- 請求項13に記載の静電放電保護回路の構造において、前記ゲートの後部又はエッジの少なくとも一部を形成する第1点構造をさらに具えることを特徴とする静電放電保護回路の構造。
- 請求項15に記載の静電放電保護回路の構造において、前記第1点構造を、前記ソース/ドレインから離れた少なくとも1つの領域において配置したことを特徴とする静電放電保護回路の構造。
- 請求項13に記載の静電放電保護回路の構造において、前記ソース/ドレインを直線的にレイアウトしたことを特徴とする静電放電保護回路の構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092120768A TWI220313B (en) | 2003-07-30 | 2003-07-30 | Electrostatic discharge circuit |
Publications (1)
Publication Number | Publication Date |
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JP2005051193A true JP2005051193A (ja) | 2005-02-24 |
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JP2003385306A Pending JP2005051193A (ja) | 2003-07-30 | 2003-11-14 | 静電放電保護回路 |
Country Status (3)
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US (1) | US7005707B2 (ja) |
JP (1) | JP2005051193A (ja) |
TW (1) | TWI220313B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006154795A (ja) * | 2004-10-29 | 2006-06-15 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
JP2008176256A (ja) * | 2007-01-19 | 2008-07-31 | Samsung Sdi Co Ltd | 有機電界発光表示装置 |
JP2018531403A (ja) * | 2015-09-28 | 2018-10-25 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | アレイ基板、その製造方法、対応する表示パネル及び電子装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI255959B (en) * | 2004-02-23 | 2006-06-01 | Toppoly Optoelectronics Corp | Method of manufacturing thin film transistor array |
TWI283381B (en) * | 2006-05-26 | 2007-07-01 | Au Optronics Corp | Active device array substrate |
KR101301155B1 (ko) * | 2006-12-12 | 2013-09-03 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판 및 이의 제조방법 |
TWI447475B (zh) | 2009-09-07 | 2014-08-01 | Au Optronics Corp | 觸控面板 |
KR102133453B1 (ko) * | 2013-09-24 | 2020-07-14 | 삼성디스플레이 주식회사 | 정전기 방전 패턴을 포함하는 터치 센서 |
DE102014218694A1 (de) * | 2014-09-17 | 2016-03-17 | Mahle International Gmbh | Verfahren zur Herstellung eines Wärmeübertragers |
CN104300009B (zh) * | 2014-10-31 | 2017-02-15 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制备方法、电路结构、电子设备 |
TWI600946B (zh) * | 2015-04-07 | 2017-10-01 | 群創光電股份有限公司 | 顯示面板 |
CN105487317B (zh) | 2016-01-25 | 2019-04-02 | 京东方科技集团股份有限公司 | 一种基板及显示装置 |
CN205845952U (zh) * | 2016-07-28 | 2016-12-28 | 京东方科技集团股份有限公司 | 一种阵列基板及显示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07287249A (ja) * | 1994-04-19 | 1995-10-31 | Oki Electric Ind Co Ltd | 薄膜トランジスタアレイ及びその検査方法 |
JPH103087A (ja) * | 1996-06-18 | 1998-01-06 | Advanced Display:Kk | アクティブマトリクス型液晶表示装置およびその製法 |
JPH11282016A (ja) * | 1997-11-25 | 1999-10-15 | Toshiba Corp | 静電気対策を施した電極配線基板とこれを用いた表示装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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GB9416899D0 (en) * | 1994-08-20 | 1994-10-12 | Philips Electronics Uk Ltd | Manufacture of electronic devices comprising thin-film circuitry |
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2003
- 2003-07-30 TW TW092120768A patent/TWI220313B/zh not_active IP Right Cessation
- 2003-11-06 US US10/703,259 patent/US7005707B2/en not_active Expired - Lifetime
- 2003-11-14 JP JP2003385306A patent/JP2005051193A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07287249A (ja) * | 1994-04-19 | 1995-10-31 | Oki Electric Ind Co Ltd | 薄膜トランジスタアレイ及びその検査方法 |
JPH103087A (ja) * | 1996-06-18 | 1998-01-06 | Advanced Display:Kk | アクティブマトリクス型液晶表示装置およびその製法 |
JPH11282016A (ja) * | 1997-11-25 | 1999-10-15 | Toshiba Corp | 静電気対策を施した電極配線基板とこれを用いた表示装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006154795A (ja) * | 2004-10-29 | 2006-06-15 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
JP2008176256A (ja) * | 2007-01-19 | 2008-07-31 | Samsung Sdi Co Ltd | 有機電界発光表示装置 |
US8035298B2 (en) | 2007-01-19 | 2011-10-11 | Samsung Mobile Display Co., Ltd. | Organic light emitting display having electrostatic discharge protection |
JP2018531403A (ja) * | 2015-09-28 | 2018-10-25 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | アレイ基板、その製造方法、対応する表示パネル及び電子装置 |
US10598995B2 (en) | 2015-09-28 | 2020-03-24 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method, and corresponding display panel and electronic device |
Also Published As
Publication number | Publication date |
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TW200504992A (en) | 2005-02-01 |
TWI220313B (en) | 2004-08-11 |
US7005707B2 (en) | 2006-02-28 |
US20050023614A1 (en) | 2005-02-03 |
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