JP2005028152A - Fingerprint recognizing integrated circuit - Google Patents

Fingerprint recognizing integrated circuit Download PDF

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JP2005028152A
JP2005028152A JP2004217843A JP2004217843A JP2005028152A JP 2005028152 A JP2005028152 A JP 2005028152A JP 2004217843 A JP2004217843 A JP 2004217843A JP 2004217843 A JP2004217843 A JP 2004217843A JP 2005028152 A JP2005028152 A JP 2005028152A
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fingerprint
integrated circuit
fingerprint recognition
sensor
recognition integrated
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Tomoshi Shigematsu
智志 重松
Yasuyuki Tanabe
泰之 田辺
Shinichiro Muto
伸一郎 武藤
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Nippon Telegraph and Telephone Corp
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Nippon Telegraph and Telephone Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a fingerprint recognizing integrated circuit with which a fingerprint recognizing system can be constituted on an LSI chip and an extremely small fingerprint recognizing system can be constituted. <P>SOLUTION: The fingerprint recognizing circuit is obtained by mounting on a single integrated circuit a sensor means to detect the fingerprint of a finger as electric signals by laying a plurality of sensor circuits to convert unevenness of the fingerprint to the electric signals and bringing the finger into contact with the same, a fingerprint memory means constituted of memory circuits to which fingerprint data are preliminarily registered, and a fingerprint recognizing means to collate the electric signals transmitted from the sensor means with the fingerprint data in the fingerprint memory means. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、指紋認識集積回路に係り、特に、指紋の凹凸を感知するセンサを集積回路上に複数敷き詰めた指紋センサとして用いられる指紋認識集積回路に関する。   The present invention relates to a fingerprint recognition integrated circuit, and more particularly to a fingerprint recognition integrated circuit that is used as a fingerprint sensor in which a plurality of sensors for detecting unevenness of a fingerprint are spread on an integrated circuit.

図９は、従来の指紋認識システムの構成を示す。従来の指紋認識を行う指紋認識システムは、指紋を採取する指紋読み取り装置１０、読み取った指紋をデータベース３０内の指紋データと照合する外部認証装置２０、認識結果に基づいて処理を行う処理装置４０から構成される（例えば、特許文献１参照）。   FIG. 9 shows a configuration of a conventional fingerprint recognition system. A conventional fingerprint recognition system that performs fingerprint recognition includes a fingerprint reading device 10 that collects fingerprints, an external authentication device 20 that compares the read fingerprint with fingerprint data in a database 30, and a processing device 40 that performs processing based on the recognition result. (For example, refer patent document 1).

なお、出願人は、本明細書に記載した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を出願時までに発見するには至らなかった。
特開平５−７３６８６号公報 The applicant has not yet found prior art documents related to the present invention by the time of filing other than the prior art documents specified by the prior art document information described in this specification.
JP-A-5-73686

しかしながら、上記従来の指紋認識システムにおける構成は、システム全体が大きなものになってしまい、任意の場所に応用することは不可能である。また、それぞれの装置が分離しているため、これらの装置間でのデータ転送時に情報を改ざんし、不正な認識を行うことが可能となってしまうという問題がある。   However, the configuration of the above-described conventional fingerprint recognition system makes the entire system large and cannot be applied to any place. In addition, since each device is separated, there is a problem that it is possible to tamper with information during data transfer between these devices and perform unauthorized recognition.

図１は、本発明の原理構成図である。本発明の指紋認識集積回路１００は、指紋による凹凸を電気信号に変換する１個のセンサ回路を備え、指を接触させることにより該指の指紋を電気信号として検出するセンサ手段１１０と、予め指紋データを登録するメモリ回路から構成される指紋記憶手段１２０と、センサ手段１１０から送出された電気信号と指紋記憶手段１２０内の指紋データとの照合を行う指紋認識手段１３０との組を１つの画素として集積回路上に搭載する。   FIG. 1 is a principle configuration diagram of the present invention. The fingerprint recognition integrated circuit 100 of the present invention includes one sensor circuit that converts unevenness due to a fingerprint into an electrical signal, and detects a fingerprint of the finger as an electrical signal by touching the finger, and a fingerprint in advance. A set of a fingerprint storage unit 120 composed of a memory circuit for registering data and a fingerprint recognition unit 130 for collating the electrical signal sent from the sensor unit 110 with the fingerprint data in the fingerprint storage unit 120 is one pixel. Is mounted on an integrated circuit.

また、本発明の指紋認識集積回路１００は、センサ手段１１０と指紋記憶手段１２０と指紋認識手段１３０とを２次元状に配置したものである。
また、本発明の指紋認識集積回路１００は、センサ手段１１０を指紋記憶手段１２０または指紋認識手段１３０の上に形成したものである。
また、本発明の指紋認識集積回路１００は、画素を複数有するものである。
また、本発明の指紋認識集積回路１００は、さらに、全体の認識結果を集計する集計装置を有し、画素毎の指紋認識手段１３０は、画素単位で照合を行って、認識結果を集計装置に送るようにしたものである。 Also, the fingerprint recognition integrated circuit 100 of the present invention comprises a sensor means 110, a fingerprint storage means 120, and a fingerprint recognition means 130 arranged in a two-dimensional manner.
In the fingerprint recognition integrated circuit 100 of the present invention, the sensor means 110 is formed on the fingerprint storage means 120 or the fingerprint recognition means 130.
The fingerprint recognition integrated circuit 100 of the present invention has a plurality of pixels.
In addition, the fingerprint recognition integrated circuit 100 of the present invention further includes a counting device that counts the entire recognition results, and the fingerprint recognition means 130 for each pixel performs collation in units of pixels, and the recognition results are stored in the counting device. It is what I sent.

また、本発明の指紋認識集積回路１００のセンサ手段１１０は、接触面を有し、該接触面の凹凸を静電容量に変換する素子を含む。
また、本発明の指紋認識集積回路１００のセンサ手段１１０は、発光回路と、指の皮膚で反射した該発光回路からの光を受ける受光回路とを含む。
また、本発明の指紋認識集積回路１００のセンサ手段１１０は、２つの金属面と、該金属面の間に充填された緩衝剤とから構成され、指紋の凹凸による緩衝剤の収縮に基づいて、金属面間の静電容量変化に変換する。 In addition, the sensor means 110 of the fingerprint recognition integrated circuit 100 of the present invention includes a device having a contact surface and converting the unevenness of the contact surface into a capacitance.
The sensor means 110 of the fingerprint recognition integrated circuit 100 of the present invention includes a light emitting circuit and a light receiving circuit that receives light from the light emitting circuit reflected by the finger skin.
The sensor means 110 of the fingerprint recognition integrated circuit 100 of the present invention is composed of two metal surfaces and a buffer filled between the metal surfaces, and based on the shrinkage of the buffer due to the unevenness of the fingerprint, Convert to capacitance change between metal surfaces.

また、本発明の指紋認識集積回路１００のセンサ手段１１０は、２つの金属面と、該金属面間に充填された緩衝剤とから構成され、指紋の凹凸に基づいて、緩衝剤の空洞部分を介して、上層金属面と下層金属面とが接触することにより、２つの金属面が等電位になるように構成する。
また、本発明の指紋認識集積回路１００は、センサ手段１１０と指紋認識手段とを配線により結線し、センサ手段１１０と指紋認識手段との間の配線が、半導体集積回路１００の基板上に層間膜を挟んで配置する。 Further, the sensor means 110 of the fingerprint recognition integrated circuit 100 of the present invention is composed of two metal surfaces and a buffer filled between the metal surfaces, and the cavity portion of the buffer is formed based on the unevenness of the fingerprint. Thus, the upper metal surface and the lower metal surface are in contact with each other so that the two metal surfaces are equipotential.
In the fingerprint recognition integrated circuit 100 of the present invention, the sensor means 110 and the fingerprint recognition means are connected by wiring, and the wiring between the sensor means 110 and the fingerprint recognition means is provided on the substrate of the semiconductor integrated circuit 100 with an interlayer film. Arranged between.

上記のように、本発明は、指紋の凹凸を感知するセンサ（センサ手段１１０）を集積回路１００上に複数敷き詰め、指紋センサとして用いる。また、このセンサが採取した指紋を同じ集積回路に混載した指紋認識手段で認識し、予め登録しておいた、指紋との照合を高速に行う。これにより、従来より大幅に小さい指紋認識システムを構築でき、ＩＣカード等の指紋認識による認証を取り入れることが可能となる。   As described above, in the present invention, a plurality of sensors (sensor means 110) for detecting the unevenness of a fingerprint are spread on the integrated circuit 100 and used as a fingerprint sensor. Further, the fingerprint collected by this sensor is recognized by a fingerprint recognition unit embedded in the same integrated circuit, and collation with a fingerprint registered in advance is performed at high speed. This makes it possible to construct a fingerprint recognition system that is significantly smaller than before, and to incorporate authentication by fingerprint recognition of an IC card or the like.

上述のように、本発明の指紋認識集積回路によれば、指紋を採取するセンサ装置を集積回路上に形成し、認識装置、指紋メモリを同じ集積回路上に形成することにより、指紋認識システムを集積回路上に構成でき、非常に小さい指紋認識システムを実現することができる。   As described above, according to the fingerprint recognition integrated circuit of the present invention, the sensor device for collecting the fingerprint is formed on the integrated circuit, and the recognition device and the fingerprint memory are formed on the same integrated circuit. A very small fingerprint recognition system that can be configured on an integrated circuit can be realized.

さらに、集積回路の基板上に層間膜等を挟みセンサ装置と認識装置とを挟む配線層を形成して、認識装置がセンサ装置の容量を測定することにより、単純な構成で微細化を可能とし、指紋データの解像度を向上させることが可能である。さらに、発光回路が発光し、指の反射に対して受光回路での受光の強度で指紋の凹凸を検知することにより、センサ装置に対して指を直接接触させないため、センサ装置の形状を変化させる必要がなく、高信頼性のセンサ装置を構成することができる。   In addition, a wiring layer that sandwiches the sensor device and the recognition device is formed on the substrate of the integrated circuit, and the recognition device measures the capacitance of the sensor device, thereby enabling miniaturization with a simple configuration. It is possible to improve the resolution of fingerprint data. Furthermore, since the light emitting circuit emits light and the unevenness of the fingerprint is detected by the intensity of light received by the light receiving circuit with respect to the reflection of the finger, the shape of the sensor device is changed so that the finger is not in direct contact with the sensor device. There is no need, and a highly reliable sensor device can be configured.

また、センサ回路に金属パッドと上層金属の２つの金属面を緩衝剤で挟むことにより、指が触れると緩衝剤の収縮により金属間の距離が変化することにより、指の接触部分の指紋の凹凸を検知することが可能であり、微細化が可能であるため、指紋データの解像度を向上させることができると共に、保護膜で保護することで、金属等に直接指が触れることがなく、センサ回路の劣化を防止できる。   In addition, by sandwiching the metal surface of the metal pad and the upper layer metal with a buffer in the sensor circuit, the distance between the metals changes due to the contraction of the buffer when the finger touches, so that the unevenness of the fingerprint at the contact portion of the finger Can be detected and can be miniaturized, so that the resolution of fingerprint data can be improved, and by protecting with a protective film, the finger does not touch the metal etc. directly, and the sensor circuit Can be prevented.

また、センサ回路に金属パッドと上層金属の２つの金属面の間が空洞となるように、緩衝剤で挟む構成とするとにより、指の接触時における緩衝剤の収縮による電位の変化を測定することにより、微細化が可能であり、指紋データの解像度を向上させることが可能である。さらに、センサ装置を認識装置や指紋メモリ等の論理回路部分の上に構成することにより、指紋認識集積回路のサイズを小さくすることが可能であり、消費電力を削減することができる。また、サイズが小さくなることから、同程度の面積が許容されるセンサ装置では、認識装置において大規模な回路を用いることができ、認識精度や認識速度が向上する。   In addition, the sensor circuit is configured to be sandwiched with a buffering agent so that a gap is formed between the two metal surfaces of the metal pad and the upper metal layer, thereby measuring a change in potential due to the contraction of the buffering agent at the time of finger contact. Therefore, miniaturization is possible and the resolution of fingerprint data can be improved. Further, by configuring the sensor device on a logic circuit portion such as a recognition device or a fingerprint memory, the size of the fingerprint recognition integrated circuit can be reduced, and power consumption can be reduced. In addition, since the size is reduced, in a sensor device that allows a comparable area, a large-scale circuit can be used in the recognition device, and recognition accuracy and recognition speed are improved.

さらに、センサ回路、認識回路、指紋メモリの組を１つの画素とすることにより、並列処理が可能となり、全体の認識処理時間を短縮することができる。また、画素数を数えることにより、容易にセンサ回路の面積の変更、解像度の変更が容易になる。   Furthermore, by using a combination of the sensor circuit, the recognition circuit, and the fingerprint memory as one pixel, parallel processing can be performed, and the entire recognition processing time can be shortened. Further, by counting the number of pixels, it is easy to change the area of the sensor circuit and change the resolution.

図２は、本発明の指紋認識集積回路の基本構成を示す。同図に示す構成は、指紋を採取するセンサ装置１１０を集積回路チップ上に形成し、読み取ったデータを認識する認識装置１３０、認識する指紋の見本となる指紋メモリ１２０を同じチップ上に形成するものである。   FIG. 2 shows the basic configuration of the fingerprint recognition integrated circuit of the present invention. In the configuration shown in the figure, a sensor device 110 for collecting a fingerprint is formed on an integrated circuit chip, a recognition device 130 for recognizing read data, and a fingerprint memory 120 as a sample of the recognized fingerprint are formed on the same chip. Is.

また、センサ装置１１０は、大きさ数μｍのセンサ回路１１１を複数並べたものであり、認識装置１３０は、通常の論理回路で構成された認識を行う回路である。この構成では、指紋認識システムを集積回路チップ上に構成でき、非常に小さい指紋認識システムが実現可能となる。このため、ＩＣカードのような小さく薄いもの等、任意の場所に指紋認識システムを組み込むことが可能となる。   The sensor device 110 includes a plurality of sensor circuits 111 each having a size of several μm, and the recognition device 130 is a recognition circuit configured by a normal logic circuit. In this configuration, the fingerprint recognition system can be configured on an integrated circuit chip, and a very small fingerprint recognition system can be realized. For this reason, it is possible to incorporate the fingerprint recognition system in an arbitrary place such as a small and thin IC card.

さらに、センサ装置１１０や認識装置１３０等が一つの集積回路チップ上にあるため、これらの装置間のデータ転送時にデータの改ざんが不可能になり、不正な認識を防ぐことが可能となる。   Furthermore, since the sensor device 110, the recognition device 130, and the like are on one integrated circuit chip, it becomes impossible to tamper with data when transferring data between these devices, and unauthorized recognition can be prevented.

以下、図面と共に本発明の実施例を説明する。
［第１の実施例］
図３は、本発明の第１の実施例のセンサ回路の構成を示す。同図に示す構成は、接触面３０１、層間膜３０２、配線層３０３、及び基板３０４から構成される。 Embodiments of the present invention will be described below with reference to the drawings.
[First embodiment]
FIG. 3 shows the configuration of the sensor circuit of the first embodiment of the present invention. The configuration shown in the figure includes a contact surface 301, an interlayer film 302, a wiring layer 303, and a substrate 304.

同図に示すセンサ回路１１１は、接触面３０１の静電容量を測定し、接触面が触れている部分の指紋の凹凸を検知するものである。集積回路の基板３０４上に層間膜等挟み、センサ回路１１１と認識装置１３０の容量を測定する。この構成は非常に単純であり、微細化が可能なため、読み込む指紋データの解像度を向上させることが可能である。   The sensor circuit 111 shown in the figure measures the electrostatic capacitance of the contact surface 301 and detects the unevenness of the fingerprint of the part touched by the contact surface. An interlayer film or the like is sandwiched on the substrate 304 of the integrated circuit, and the capacitances of the sensor circuit 111 and the recognition device 130 are measured. Since this configuration is very simple and can be miniaturized, it is possible to improve the resolution of fingerprint data to be read.

［第２の実施例］
図４は、本発明の第２の実施例のセンサ回路の構成を示す。同図に示す構成は、層間膜３０２、配線層３０３、基板３０４、発光回路３０５、受光回路３０６及び、透明保護膜３０７から構成される。同図に示すセンサ回路１１１は、発光回路３０５が発し、指の皮膚に反射して、当該センサ回路１１１に戻ってきた光を受光回路３０６が受光し、その光の強度でセンサ回路１１１の上部の指紋の凹凸を検知するものである。集積回路の基板３０４上に層間膜３０２を挟み、センサ回路１１１と認識装置１３０間を結ぶ配線が通る２つの配線層３０３が形成され、この配線を用いて、認識回路１３０は、発光回路３０５の発光の制御や、各受光回路３０６の受光強度の測定を行う。発光回路３０５と受光回路３０６は、透明な保護膜で覆われる。発光回路３０５が発する光は、透明保護膜３０７を透過し、指に反射し、再び透明保護膜３０７を透過して受光回路に届く。 [Second Embodiment]
FIG. 4 shows the configuration of the sensor circuit of the second embodiment of the present invention. The configuration shown in the figure includes an interlayer film 302, a wiring layer 303, a substrate 304, a light emitting circuit 305, a light receiving circuit 306, and a transparent protective film 307. In the sensor circuit 111 shown in the figure, the light receiving circuit 306 receives the light emitted from the light emitting circuit 305, reflected from the skin of the finger, and returned to the sensor circuit 111. It detects the unevenness of the fingerprint. Two wiring layers 303 are formed through a wiring connecting the sensor circuit 111 and the recognition device 130 with the interlayer film 302 interposed between the substrate 304 of the integrated circuit, and the recognition circuit 130 uses the wirings to Control of light emission and measurement of received light intensity of each light receiving circuit 306 are performed. The light emitting circuit 305 and the light receiving circuit 306 are covered with a transparent protective film. The light emitted from the light emitting circuit 305 passes through the transparent protective film 307, is reflected by the finger, passes through the transparent protective film 307 again, and reaches the light receiving circuit.

この構成は、センサ回路１１１に対し、非接触であり、測定時にセンサ回路１１１の形状を変化させる必要もないため、信頼性の高いセンサ装置１１０を構成することが可能となる。
［第３の実施例］
図５は、本発明の第３の実施例のセンサ回路の構成を示す。 This configuration is non-contact with respect to the sensor circuit 111, and it is not necessary to change the shape of the sensor circuit 111 at the time of measurement. Therefore, the highly reliable sensor device 110 can be configured.
[Third embodiment]
FIG. 5 shows the configuration of a sensor circuit according to a third embodiment of the present invention.

同図に示すセンサ回路１１１は、層間膜３０２、配線層３０３、基板３０４、パッド３０８、保護膜３０９、上層金属３１０、及び緩衝剤３１１から構成される。同図に示すセンサ回路１１１は、金属パッド３０８と上層金属３１０の２つの金属面を柔軟な緩衝剤３１１で挟んだものであり、指紋の凸部が触れると、その圧力により、緩衝剤３１１が収縮し、金属間の距離が変化し、このとき変化するパッド３０８の容量を測定し、センサ回路１１１上に触れている部分の指紋の凹凸を検知するものである。集積回路の基板上に層間膜３０２等を挟みセンサ回路１１１と認識装置１３０を結ぶ配線が通る配線層３０３が形成され、この配線を用いて、認識回路１３０は、各センサ回路１１１の容量を測定する。また、上層金属の表面は保護膜３０９で保護する。   A sensor circuit 111 shown in the figure includes an interlayer film 302, a wiring layer 303, a substrate 304, a pad 308, a protective film 309, an upper metal 310, and a buffer 311. The sensor circuit 111 shown in the figure is obtained by sandwiching two metal surfaces of a metal pad 308 and an upper metal 310 with a flexible buffer 311. When the convex portion of the fingerprint touches, the buffer 311 is caused by the pressure. The distance between the metals changes, and the capacitance of the pad 308 that changes at this time is measured to detect the unevenness of the fingerprint that touches the sensor circuit 111. A wiring layer 303 through which a wiring connecting the sensor circuit 111 and the recognition device 130 passes is formed on the substrate of the integrated circuit with the interlayer film 302 or the like interposed therebetween, and the recognition circuit 130 measures the capacitance of each sensor circuit 111 using this wiring. To do. Further, the surface of the upper layer metal is protected by a protective film 309.

この構成は、非常に単純であり、微細化が可能なため、読み込む指紋データの解像度を向上させることが可能である。また、保護膜３０９で保護することが可能なために金属等に直接触れるとがなく、センサ回路１１１の劣化を防ぐことが可能である。さらに、保護膜３０９は不透明でよく、保護膜上への印刷等も可能である。   Since this configuration is very simple and can be miniaturized, the resolution of fingerprint data to be read can be improved. Further, since it can be protected by the protective film 309, there is no direct contact with metal or the like, and deterioration of the sensor circuit 111 can be prevented. Further, the protective film 309 may be opaque and printing on the protective film is also possible.

［第４の実施例］
図６は、本発明の第４の実施例のセンサ回路の構成を示す。同図に示す構成は、基本的には、図５に示す第３の実施例と同様の構成であるが、金属パッド３０８と上層金属３１０との２つの金属面をパッド３０８上は空洞３１２になるように、柔軟な緩衝剤で挟んだもので、指紋の凸部が触れると、その圧力により緩衝剤が収縮し、適当な電位の与えられた上層金属３１０が金属パット３０８に接触し、このとき変化するパット３０８の電位を測定したセンサ回路１１１上に触れている部分の指紋の凹凸を検知するものである。集積回路の基板３０４上に層間膜３０２等を挟み、センサ回路１１１と認識装置１３０とを結ぶ配線が通る配線層３０３が形成され、この配線を用いて認識回路１３０は各センサ回路１１１の電位を測定する。また、上層金属３１０の表面は保護膜３０９で保護する。 [Fourth embodiment]
FIG. 6 shows a configuration of a sensor circuit according to a fourth embodiment of the present invention. The configuration shown in the figure is basically the same as that of the third embodiment shown in FIG. 5 except that the two metal surfaces of the metal pad 308 and the upper metal 310 are formed into a cavity 312 on the pad 308. In this way, when the convex part of the fingerprint is touched with a soft buffering agent, the buffering agent contracts due to the pressure, and the upper layer metal 310 to which an appropriate potential is applied contacts the metal pad 308. The unevenness of the fingerprint of the part touching the sensor circuit 111 where the potential of the pad 308 that changes is measured. A wiring layer 303 through which a wiring connecting the sensor circuit 111 and the recognition device 130 passes is formed by sandwiching the interlayer film 302 and the like on the substrate 304 of the integrated circuit, and the recognition circuit 130 uses the wiring to change the potential of each sensor circuit 111. taking measurement. Further, the surface of the upper metal 310 is protected by a protective film 309.

この構成は、非常に単純であり、微細化が可能なために読み込む指紋データの解像度を向上させることが可能である。また、保護膜で保護することが可能であるため金属等に直接触れることがなく、センサ回路１１１の劣化を防ぐことができる。さらに、保護膜３０９は不透明でよく、保護膜３０９への印刷等も可能である。   This configuration is very simple and can be miniaturized, so that the resolution of the fingerprint data to be read can be improved. Further, since it can be protected with a protective film, the sensor circuit 111 can be prevented from being deteriorated without directly touching a metal or the like. Further, the protective film 309 may be opaque, and printing on the protective film 309 is also possible.

［第５の実施例］
図７は、本発明の第５の実施例の指紋認識集積回路１００の構成を示す。同図に示す指紋認識集積回路１００は、図２の基本構成に対して、センサ装置１１０を認識装置１３０や指紋メモリ１２０等の論理回路部分の上に形成するものである。 [Fifth embodiment]
FIG. 7 shows the configuration of a fingerprint recognition integrated circuit 100 according to the fifth embodiment of the present invention. The fingerprint recognition integrated circuit 100 shown in the figure is configured such that the sensor device 110 is formed on a logic circuit portion such as the recognition device 130 and the fingerprint memory 120 with respect to the basic configuration of FIG.

はじめに、集積回路の基板３０４上に通常の論理回路プロセスで認識装置１３０や指紋メモリ１２０の回路を形成する。この後、当該集積回路上に、センサ装置１１０を形成することで、この構成を実現することができる。この構成にすることによって、指紋認識集積回路１００のチップサイズを小さくすることが可能となり、センサ回路１１０から認識装置１３０への配線も短縮できるため、この指紋認識集積回路１００の消費電力を削減することが可能となる。また、認識装置１３０にセンサ装置１１０と同程度の面積が許されるため、認識装置１３０により、複雑で大規模な回路を用いることが可能となり、認識精度や認識速度の向上が可能となる。   First, the circuits of the recognition device 130 and the fingerprint memory 120 are formed on the substrate 304 of the integrated circuit by a normal logic circuit process. Thereafter, this configuration can be realized by forming the sensor device 110 on the integrated circuit. With this configuration, the chip size of the fingerprint recognition integrated circuit 100 can be reduced, and the wiring from the sensor circuit 110 to the recognition device 130 can be shortened. Therefore, the power consumption of the fingerprint recognition integrated circuit 100 is reduced. It becomes possible. Further, since the recognition device 130 is allowed to have the same area as the sensor device 110, the recognition device 130 can use a complicated and large-scale circuit, and the recognition accuracy and the recognition speed can be improved.

［第６の実施例］
図８は、本発明の第６の実施例の指紋認識集積回路１００の構成を示す。同図（Ａ）は、図３の指紋認識集積回路１００に対し、センサ装置１１０内のセンサ回路個々または、数個毎に認識回路１３０や指紋データを保持する指紋メモリ１２０の組を１つの画素に設定するものである。 [Sixth embodiment]
FIG. 8 shows the configuration of a fingerprint recognition integrated circuit 100 according to the sixth embodiment of the present invention. In FIG. 3A, the fingerprint recognition integrated circuit 100 of FIG. 3 has a pixel group consisting of a recognition circuit 130 and a fingerprint memory 120 holding fingerprint data for each sensor circuit in the sensor device 110 or for several pieces. Is set to

同図（Ｂ）は、前述の第５の実施例と同様に、基板３０４上に設けられた論理回路装置の上層のセンサ層に認識回路１３０を設け、さらに当該論理回路装置の上層のセンサ層にセンサ装置１１０を搭載し、１つの画素に設定するものである。センサ装置１１０と認識回路１３０と指紋メモリ１２０の組を画素と呼び、認識は画素毎あるいは、周囲の画素との協力によって行われる。認識結果は集計装置に送られ、全体の認識結果が集計される。   In FIG. 5B, similarly to the fifth embodiment, the recognition circuit 130 is provided in the upper sensor layer of the logic circuit device provided on the substrate 304, and the upper sensor layer of the logic circuit device is provided. The sensor device 110 is mounted on a single pixel. A set of the sensor device 110, the recognition circuit 130, and the fingerprint memory 120 is called a pixel, and recognition is performed for each pixel or in cooperation with surrounding pixels. The recognition results are sent to a totaling device, and the total recognition results are totaled.

縮することが可能である。また、画素の数を変えることで、容易に読み取り部の面積を変更したり、読み取りの解像度を変更したりすることが可能である。また、同図（Ｂ）に示すように、前述の第５の実施例と同様にセンサ装置１１０と認識装置１３０等の論理回路を重ねることにより、面積や消費電力を削減することが可能となる。 It is possible to shrink. Also, by changing the number of pixels, it is possible to easily change the area of the reading unit or change the reading resolution. Further, as shown in FIG. 5B, the area and power consumption can be reduced by overlapping the logic circuits such as the sensor device 110 and the recognition device 130 as in the fifth embodiment. .

なお、本発明は、上記の実施例に限定されることなく、特許請求の範囲内で種々変更・応用が可能である。   The present invention is not limited to the above-described embodiments, and various modifications and applications are possible within the scope of the claims.

本発明は、指紋認識を行う指紋認識システムに適用することができる。   The present invention can be applied to a fingerprint recognition system that performs fingerprint recognition.

本発明の原理構成図である。It is a principle block diagram of this invention. 本発明の指紋認識集積回路１００の基本構成図である。1 is a basic configuration diagram of a fingerprint recognition integrated circuit 100 of the present invention. 本発明の第１の実施例のセンサ回路の構成図である。It is a block diagram of the sensor circuit of the 1st Example of this invention. 本発明の第２の実施例のセンサ回路の構成図である。It is a block diagram of the sensor circuit of the 2nd Example of this invention. 本発明の第３の実施例のセンサ回路の構成図である。It is a block diagram of the sensor circuit of the 3rd Example of this invention. 本発明の第４の実施例のセンサ回路の構成図である。It is a block diagram of the sensor circuit of the 4th Example of this invention. 本発明の第５の実施例の指紋認識集積回路１００の構成図である。It is a block diagram of the fingerprint recognition integrated circuit 100 of the 5th Example of this invention. 本発明の第６の実施例の指紋認識集積回路１００の構成図である。It is a block diagram of the fingerprint recognition integrated circuit 100 of the 6th Example of this invention. 従来の指紋認識システムの構成図である。It is a block diagram of the conventional fingerprint recognition system.

符号の説明Explanation of symbols

１００…指紋認識集積回路、１１０…センサ装置、センサ手段、１１１…センサ回路、１２０…指紋メモリ、指紋記憶手段、１３０…認識装置、認識回路、指紋認識手段、３０１…接触面、３０２…層間膜、３０３…配線層、３０４…基板、３０５…発光回路、３０６…受光回路、３０７…透明保護膜、３０８…パッド。
DESCRIPTION OF SYMBOLS 100 ... Fingerprint recognition integrated circuit, 110 ... Sensor apparatus, sensor means, 111 ... Sensor circuit, 120 ... Fingerprint memory, fingerprint storage means, 130 ... Recognition apparatus, recognition circuit, fingerprint recognition means, 301 ... Contact surface, 302 ... Interlayer film , 303: wiring layer, 304 ... substrate, 305 ... light emitting circuit, 306 ... light receiving circuit, 307 ... transparent protective film, 308 ... pad.

Claims (10)

指紋による凹凸を電気信号に変換する１個のセンサ回路を備え、指を接触させることにより該指の指紋を電気信号として検出するセンサ手段と、
予め指紋データを登録するメモリ回路から構成される指紋記憶手段と、
前記センサ手段から送出された前記電気信号と前記指紋記憶手段内の指紋データとの照合を行う指紋認識手段との組を１つの画素として集積回路上に搭載したことを特徴とする指紋認識集積回路。 Sensor means comprising one sensor circuit for converting irregularities due to fingerprints into electrical signals, and detecting the fingerprints of the fingers as electrical signals by contacting the fingers;
Fingerprint storage means comprising a memory circuit for registering fingerprint data in advance;
A fingerprint recognition integrated circuit characterized in that a set of the fingerprint recognition means for collating the electrical signal sent from the sensor means with the fingerprint data in the fingerprint storage means is mounted on the integrated circuit as one pixel. . 請求項１記載の指紋認識集積回路において、
前記センサ手段と前記指紋記憶手段と前記指紋認識手段とを２次元状に配置したことを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit of claim 1, wherein
2. A fingerprint recognition integrated circuit, wherein the sensor means, the fingerprint storage means, and the fingerprint recognition means are two-dimensionally arranged. 請求項１記載の指紋認識集積回路において、
前記センサ手段を前記指紋記憶手段または前記指紋認識手段の上に形成したことを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit of claim 1, wherein
A fingerprint recognition integrated circuit, wherein the sensor means is formed on the fingerprint storage means or the fingerprint recognition means. 請求項１又は２記載の指紋認識集積回路において、
前記画素を複数有することを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit according to claim 1 or 2,
A fingerprint recognition integrated circuit comprising a plurality of the pixels. 請求項４記載の指紋認識集積回路において、
さらに、全体の認識結果を集計する集計装置を有し、
画素毎の前記指紋認識手段は、画素単位で前記照合を行って、認識結果を前記集計装置に送ることを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit according to claim 4.
Furthermore, it has a counting device that counts the overall recognition results,
The fingerprint recognition integrated circuit, wherein the fingerprint recognition means for each pixel performs the collation for each pixel and sends a recognition result to the counting device. 請求項１乃至５のいずれか１項に記載の指紋認識集積回路において、
前記センサ手段は、接触面を有し、該接触面の凹凸を静電容量に変換する素子を含むことを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit according to any one of claims 1 to 5,
The fingerprint recognition integrated circuit according to claim 1, wherein the sensor means has a contact surface and includes an element for converting irregularities of the contact surface into a capacitance. 請求項１乃至５のいずれか１項に記載の指紋認識集積回路において、
前記センサ手段は、発光回路と、指の皮膚で反射した該発光回路からの光を受ける受光回路とを含むことを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit according to any one of claims 1 to 5,
2. The fingerprint recognition integrated circuit according to claim 1, wherein the sensor means includes a light emitting circuit and a light receiving circuit that receives light from the light emitting circuit reflected by a finger skin. 請求項１乃至５のいずれか１項に記載の指紋認識集積回路において、
前記センサ手段は、２つの金属面と、該金属面の間に充填された緩衝剤とから構成され、指紋の凹凸による緩衝剤の収縮に基づいて、前記金属面間の静電容量変化に変換することを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit according to any one of claims 1 to 5,
The sensor means is composed of two metal surfaces and a buffer filled between the metal surfaces, and converts the capacitance change between the metal surfaces based on the shrinkage of the buffer due to fingerprint irregularities. A fingerprint recognition integrated circuit. 請求項１乃至５のいずれか１項に記載の指紋認識集積回路において、
前記センサ手段は、２つの金属面と、該金属面間に充填された緩衝剤とから構成され、指紋の凹凸に基づいて、前記緩衝剤の空洞部分を介して、上層金属面と下層金属面とが接触することにより、２つの金属面が等電位になるように構成することを特徴とする指紋認識集積回路。 The fingerprint recognition integrated circuit according to any one of claims 1 to 5,
The sensor means is composed of two metal surfaces and a buffer filled between the metal surfaces, and an upper metal surface and a lower metal surface through the cavity of the buffer based on the unevenness of the fingerprint. The fingerprint recognition integrated circuit is configured such that two metal surfaces are equipotential by contacting with each other. 請求項１乃至９のいずれか１項に記載の指紋認識集積回路において、
前記センサ手段と前記指紋認識手段とを配線により結線し、前記センサ手段と前記指紋認識手段との間の前記配線を、半導体集積回路の基板上に層間膜を挟んで配置することを特徴とする指紋認識集積回路。
The fingerprint recognition integrated circuit according to any one of claims 1 to 9,
The sensor means and the fingerprint recognition means are connected by wiring, and the wiring between the sensor means and the fingerprint recognition means is arranged on a substrate of a semiconductor integrated circuit with an interlayer film interposed therebetween. Fingerprint recognition integrated circuit.
JP2004217843A 2004-07-26 2004-07-26 Fingerprint recognizing integrated circuit Pending JP2005028152A (en)

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