JP2005019900A - Electronic device - Google Patents

Electronic device Download PDF

Info

Publication number
JP2005019900A
JP2005019900A JP2003185918A JP2003185918A JP2005019900A JP 2005019900 A JP2005019900 A JP 2005019900A JP 2003185918 A JP2003185918 A JP 2003185918A JP 2003185918 A JP2003185918 A JP 2003185918A JP 2005019900 A JP2005019900 A JP 2005019900A
Authority
JP
Japan
Prior art keywords
resin material
electronic device
electronic component
component element
ground electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003185918A
Other languages
Japanese (ja)
Other versions
JP2005019900A5 (en
Inventor
Hiromi Nobe
ひろみ 野辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2003185918A priority Critical patent/JP2005019900A/en
Publication of JP2005019900A publication Critical patent/JP2005019900A/en
Publication of JP2005019900A5 publication Critical patent/JP2005019900A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device which protects an electronic component element by shielding electromagnetic wave well without using a shield case and can be thinned. <P>SOLUTION: In the electronic device which is formed by mounting an electronic component element 4 on a wiring substrate 1 and coating the electronic component element 4 with an electric insulating first resin material 2, an annular ground electrode pattern 5 surrounding a mounting region of the electronic component element 4 is formed in an upper surface of the wiring substrate 1 outside the first resin material 2, and the first resin material 2 is coated with a conductive second resin material 3 which is electrically connected to the ground electrode pattern 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、携帯電話機やパーソナルコンピュータ等の通信機器、電子機器に組み込まれる電子装置に関するものである。
【０００２】
【従来の技術】
従来より、携帯電話機等の通信機器に高周波回路を備えた電子装置が用いられている。
【０００３】
かかる従来の電子装置としては、例えば図４に示す如く、複数枚の絶縁層を積層してなる配線基板２１の内部に高周波回路やグランド配線等を埋設するとともに、前記配線基板２１の上面にＩＣ素子、チップインダクタやチップコンデンサ，ダイオード，チップ抵抗器等の電子部品素子２３を搭載し、更に電子部品素子２３を被覆するようにして金属製のシールドケース２２を取着した構造のものが知られている（例えば、特許文献１参照。）。
【０００４】
前記シールドケース２２は、電子装置の使用時、これをグランド電位に保持しておくことにより、電子部品素子２３を電磁的にシールドするためのものである。これによって、外部からの電磁波を遮蔽して電子装置の回路特性を安定化させるとともに、電子部品素子２３を正常に動作させることができる。このようなシールドケース２２は、例えば、一面を開口させた筐体状の形状をなし、シールドケース２１と電子部品素子２３とが接触しないように、シールドケース２１−電子部品素子２３間に一定の間隔を設けた状態で配線基板２１に取り付けられる。
【０００５】
【特許文献１】
特開２００１−１９６７８１号公報
【０００６】
【発明が解決しようとする課題】
ところで、上述した従来の電子装置においては、シールドケース２１を取りつける際に、シールドケースが傾いたり、取り付け位置にばらつきを生じることがあり、これらのことを考慮すると、シールドケース２１−電子部品素子２３間には、ある程度の間隔が設けられるように設計する必要がある。しかしながら、シールドケース２１−電子部品素子２３間にある程度の間隔を設けると、その分、余分な空間が発生することから、電子装置が高背化してしまうという問題があった。
【０００７】
本発明は上述の問題点に鑑み案出されたもので、その目的は、シールドケースを使用することなく電磁波を良好に遮蔽して電子部品素子を保護することができ、且つ薄型化への対応が可能な電子装置を提供することにある。
【０００８】
【課題を解決するための手段】
本発明の電子装置は、配線基板上に電子部品素子を搭載するとともに、該電子部品素子を電気絶縁性の第１樹脂材で被覆してなる電子装置において、前記配線基板の上面で、前記第１樹脂材の外側に、前記電子部品素子の搭載領域を囲繞する環状のグランド電極パターンを形成するとともに、前記第１樹脂材を、導電性を有し、前記グランド電極パターンに電気的に接続される第２樹脂材で被覆したことを特徴とするものである。
【０００９】
また、本発明の電子装置は、前記第２樹脂材の外周部が前記グランド電極パターン上に位置していることを特徴とするものである。
【００１０】
更に、本発明の電子装置は、前記グランド電極パターンの上面と内周面との間の角部に切り欠きを形成し、前記第２樹脂材の外周部を、前記切り欠きを構成するグランド電極パターンの内面と上面との間に形成される角部の位置と合致させたことを特徴とするものである。
【００１１】
本発明の電子装置によれば、電気絶縁性の第１樹脂材で被覆された電子部品素子を、導電性を有する第２樹脂材で被覆し、該第２樹脂材をグランド電極パターンに電気的に接続していることから、電子装置の使用時、第２樹脂材をグランド電位に保持することにより、シールドケースを設けることなく電磁波を遮蔽して電子装置の回路特性を安定化させるとともに電子部品素子を正常に動作させることができるようになる。しかもこの場合、従来の電子装置のようにシールドケースと電子部品素子との間に余分なスペースを確保する必要はないことから、電子装置を薄型化することが可能となる。
【００１２】
また、本発明の電子装置によれば、第２樹脂材の外周部を、電子部品素子の搭載領域を囲繞する環状のグランド電極パターンに接続させたことから、電子装置の使用時、第２樹脂材全体を確実にグランド電位に保持することができるようになり、電磁波の遮蔽効果を高めて、電子装置をよりいっそう安定して動作させることができるとともに、電子部品素子に対する外部からの電磁波の影響を有効に抑えることが可能となる。
【００１３】
更に、本発明の電子装置によれば、グランド電極パターンの上面と内周面との間の角部に切り欠きを形成し、第２樹脂材の外周部を、前記切り欠きを構成するグランド電極パターンの内面と上面との間に形成される角部の位置と合致させることにより、第２樹脂材とグランド電極パターンとの接触面積を増加させ、第２樹脂材とグランド電極パターンとの密着強度を向上させて電子部品素子の気密性を高めることができる。
【００１４】
【発明の実施の形態】
以下、本発明を添付図面に基づいて詳細に説明する。
【００１５】
図１は本発明の一実施形態に係る電子装置の断面図であり、同図に示す電子装置は、大略的に、配線基板１と、第１樹脂材２、第２樹脂材３とで構成されている。
【００１６】
前記配線基板１は、複数個の絶縁層を厚み方向に積層してなる略矩形状の積層体により構成されており、これら絶縁層間には多数の回路配線６が介在され、これらの回路配線６を絶縁層中に埋設されているビアホール導体７等を介して相互に電気的に接続させている。
【００１７】
このような配線基板１を構成する絶縁層の材質としては、例えばガラスセラミックス等のセラミック材料が用いられ、個々の絶縁層の厚みは例えば５０μｍ〜３００μｍに設定される。
【００１８】
尚、前記配線基板１は、絶縁層がセラミック材料から成る場合、セラミック原料の粉末に適当な有機溶剤、有機溶媒等を添加・混合して得たセラミックグリーンシートを複数枚積層した上、これをプレス成形し、しかる後、この積層体を高温で焼成し、外形加工することによって製作される。
【００１９】
また、前記配線基板１の内部に設けられる回路配線６やビアホール導体７の材質としては、例えば、銀を主成分とする導電材料が好適に用いられ、個々の回路配線の厚みは、例えば５μｍ〜２０μｍに設定される。
【００２０】
一方、配線基板１の主面にはグランド電極パターン５や前記回路配線６と接続される接続パッド８、表面配線（図示せず）が設けられている。
【００２１】
前記グランド電極パターン５は、配線基板１上面の外周に沿って環状に配置され、配線基板１内部のビアホール導体７などを介して配線基板１の側面に形成される外部接続導体（図示せず）に接続される。前記外部接続導体は、電子装置が実装されるマザーボードに設けられたグランド配線に電気的に接続されており、これによりグランド配線パターン５は、電子装置の使用時、グランド電位に保持されるようになっている。
【００２２】
尚、グランド電極パターン５、接続パッド８は、例えば、Ａｇ、Ａｇ−Ｐｄ、Ａｇ−Ｐｔ等のＡｇ系粉末、ホウ珪酸系低融点ガラスフリット、エチルセルロース等の有機バインダー、有機溶剤等を含有してなる導体ペーストを従来周知のスクリーン印刷等によって、配線基板１の最上層に対応するセラミックグリーンシート上に塗布し、焼成することによって形成される。
【００２３】
また、前記グランド電極パターン５は、その厚みは例えば５μｍ〜８０μｍに設定され、特に５０μｍ以上に設定しておけば、後述する第１樹脂材２の形成に際して液状樹脂を塗布した際、硬化する前の液状樹脂が配線基板１上面から流れ出るのを塞き止めるダムとしての役割も果たすようになる。従って、第１樹脂材の形成に際して、粘性が低く流れやすい液状樹脂を使用する場合には、グランド電極パターン５の厚みを５０μｍ以上にしておくことが好ましい。
【００２４】
このような配線基板１の上面には、集積回路部品素子やチップインダクタ、チップコンデンサ、チップ抵抗器、ダイオード等の電子部品素子４が実装される。
【００２５】
この電子部品素子４は、配線基板１上面に被着されている接続パッド８に半田等の導電性接着剤を介して電気的に接続され、これらの電子部品素子４と配線基板１内部の回路配線６とで所定の電気回路を構成している。尚、本実施例では１個の電子部品素子４を配線基板１に搭載している。
【００２６】
そして電子部品素子４は、電気絶縁性を有する第１樹脂材２及び導電性を有する第２樹脂材３によって順次被覆されている。
【００２７】
第１樹脂材２は、電子部品素子４を外部からの衝撃より保護する保護膜と、第２樹脂材と電子部品素子４とが短絡するのを防止する絶縁膜と、電子部品素子４を気密封止するための封止層としての機能を有している。
【００２８】
また、このような第１樹脂材２は、エポキシ樹脂等の熱硬化性樹脂に硬化剤、硬化促進剤、その他必要に応じて無機質充填剤などを添加・混合したものを、従来周知のスクリーン印刷法等により電子部品素子４を覆うように塗布し、しかる後、加熱硬化することにより形成され、電子部品素子４の上面から第１樹脂材２の上面までの距離は、例えば、０．１０ｍｍ〜０．３０ｍｍの範囲になるように設定される。
【００２９】
一方、第２樹脂材３は、配線基板１のグランド電極パターン５と電気的に接続されており、電子装置の使用時、第２樹脂材３をグランド電位に保持することにより、外部からの電磁波を良好に遮蔽して電子装置の回路特性を安定化させるとともに電子部品素子を正常に動作させることができるようになる。しかもこの場合、従来の電子装置のようにシールドケースと電子部品素子との間に余分なスペースを確保する必要はないことから、電子装置を薄型化することが可能となる。
【００３０】
このような第２樹脂材３は、例えば、先に述べた第１樹脂材と同様のエポキシ樹脂、あるいはシリコン樹脂、ポリイミド樹脂等の樹脂にＡｕ、Ａｇ、Ｃｕ等の導電性粒子及び硬化剤、硬化促進剤、その他必要に応じて無機質充填剤を添加・混合したものを、従来周知のスクリーン印刷法等により、前記第１樹脂材を覆うようにして塗布し、しかる後、熱硬化させることにより形成され、その厚みは、例えば、０．０５ｍｍ〜０．２０ｍｍに設定される。
【００３１】
尚、前記導電性粒子の含有量は、第２樹脂材全体の重量に対して、例えば７５〜８８ｗｔ％の範囲に設定される。
【００３２】
また、前記第２樹脂材３は、その外周部が電子部品素子４の搭載領域を囲繞する環状のグランド電極パターン５に接続されていることから、電子装置の使用時、第２樹脂材全体を確実にグランド電位に保持することができるようになり、電磁波の遮蔽効果を高めて、電子装置をよりいっそう安定して動作させることができるとともに、電子部品素子に対する外部からの電磁波の影響を有効に抑えることが可能となる。従って、第２樹脂材３は、その外周部をグランド電極パターン５に接続するようにして配置させることが好ましい。
【００３３】
更にグランド電極パターン５は、図２に示すように、その上面と内周面との間の角部に切り欠き９を有しており、第２樹脂材３の外周部を、切り欠き９を構成するグランド電極パターン５の内面と上面との間に形成される角部１０と合致するようにして配置させているため、第２樹脂材３とグランド電極パターン５との接触面積を増加させ、第２樹脂材３とグランド電極パターン５との密着強度を向上させて電子部品素子４の気密性を高めることができる。
【００３４】
またグランド電極パターン５に上述のような切り欠き９を設けておくことにより、第２樹脂材３の形成に際して液状樹脂を塗布した際、硬化する前の液状樹脂が配線基板１上面から流れ出るのを塞き止めることもできる。
【００３５】
かくして上述した電子装置は、配線基板１に搭載されている電子部品素子４を電気絶縁性の第１樹脂材２によって被覆し、該第１樹脂材２を導電性を有する第２樹脂材３によって被覆することにより、シールドケースを使用することなく外部からの電磁波を導電性を有する第２樹脂材３によって遮蔽し、電子装置を安定して動作させることができるようになる。
【００３６】
尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更、改良が可能である。
【００３７】
上述の実施形態においては、グランド電極パターン５を、その外周縁が配線基板１上面の外周縁に合致するようにして配置したが、これに代えてグランド電極パターン５の外周縁を、配線基板１の外周縁よりも内側に所定距離だけ離間して配置するようにしてもよい。このようにすれば、配線基板１を大型基板の分割による“多数個取り”の手法により製造する場合であっても、大型基板の分割・切断時、グランド電極パターン５と切断用のカッターとが接触することはないことから、グランド電極パターン５のエッジが大型基板の切断に伴い下地より剥離するといった不都合を生じることがない。
【００３８】
また、上述の実施形態においては、電子部品素子４は、配線基板１上面に設けられている接続パッド８に半田等の導電性接着剤介して電気的に接続させるようにしていたが、これに代えて、図３に示す如く金属細線等のボンディング材１１を介して接続パッド８に電気的に接続するようにしてもよい。この場合、電子部品素子４とともにボンディング材１１も覆うようにして第１樹脂材２で被覆することが重要である。
【００３９】
更に、上述の実施形態においては、１個の電子部品素子４を配線基板１に搭載させたが、複数個の電子部品素子４を搭載するようにしてもよいことは言うまでもない。その場合、複数個の電子部品素子４のうち最も背高な電子部品素子の上面を第１樹脂材上面から、例えば０．１０ｍｍ〜０．３０ｍｍ程度離間させておくことが好ましい。
【００４０】
また更に、上述の実施形態においては、配線基板１をガラスセラミックスにより形成するようにしたが、これに代えて、アルミナセラミックス等の他のセラミック材料やガラス布基材エポキシ樹脂等の有機材料を用いて配線基板１を形成するようにしても構わない。
【００４１】
【発明の効果】
本発明の電子装置によれば、電気絶縁性の第１樹脂材で被覆された電子部品素子を、導電性を有する第２樹脂材で被覆し、該第２樹脂材をグランド電極パターンに電気的に接続していることから、電子装置の使用時、第２樹脂材をグランド電位に保持することにより、シールドケースを設けることなく電磁波を遮蔽して電子装置の回路特性を安定化させるとともに電子部品素子を正常に動作させることができるようになる。しかもこの場合、従来の電子装置のようにシールドケースと電子部品素子との間に余分なスペースを確保する必要がないことから、電子装置を薄型化することが可能となる。
【００４２】
また、本発明の電子装置によれば、第２樹脂材の外周部を、電子部品素子の搭載領域を囲繞する環状のグランド電極パターンに接続させたことから、電子装置の使用時、第２樹脂材全体を確実にグランド電位に保持することができるようになり、電磁波の遮蔽効果を高めて、電子装置をよりいっそう安定して動作させることができるとともに、電子部品素子に対する外部からの電磁波の影響を有効に抑えることが可能となる。
【００４３】
更に、本発明の電子装置によれば、グランド電極パターンの上面と内周面との間の角部に切り欠きを形成し、第２樹脂材の外周部を、前記切り欠きを構成するグランド電極パターンの内面と上面との間に形成される角部の位置と合致させることにより、第２樹脂材とグランド電極パターンとの接触面積を増加させ、第２樹脂材とグランド電極パターンとの密着強度を向上させて電子部品素子の気密性を高めることができる。
【図面の簡単な説明】
【図１】本発明の電子装置の断面図である。
【図２】図１の電子装置の第１樹脂材２及び第２樹脂材３を省略した要部断面図である。
【図３】本発明の他の実施形態に係る電子装置の断面図である。
【図４】従来の電子装置の断面図である。
【符号の説明】
１・・・配線基板
２・・・第１樹脂材
３・・・第２樹脂材
４・・・電子部品素子
５・・・グランド電極パターン[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a communication device such as a mobile phone and a personal computer, and an electronic device incorporated in the electronic device.
[0002]
[Prior art]
Conventionally, an electronic device provided with a high-frequency circuit is used in communication equipment such as a mobile phone.
[0003]
As such a conventional electronic device, for example, as shown in FIG. 4, a high frequency circuit, a ground wiring or the like is embedded in a wiring substrate 21 formed by laminating a plurality of insulating layers, and an IC is formed on the upper surface of the wiring substrate 21. An electronic component element 23 such as an element, a chip inductor, a chip capacitor, a diode, or a chip resistor is mounted, and a metal shield case 22 is attached so as to cover the electronic component element 23. (For example, refer to Patent Document 1).
[0004]
The shield case 22 is for electromagnetically shielding the electronic component element 23 by holding it at a ground potential when the electronic device is used. As a result, the electromagnetic characteristics from the outside can be shielded to stabilize the circuit characteristics of the electronic device, and the electronic component element 23 can be operated normally. Such a shield case 22 has, for example, a housing shape with an opening on one surface, and a constant gap between the shield case 21 and the electronic component element 23 so that the shield case 21 and the electronic component element 23 do not come into contact with each other. It is attached to the wiring board 21 with a space provided.
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-196781
[Problems to be solved by the invention]
By the way, in the above-described conventional electronic device, when the shield case 21 is attached, the shield case may be inclined or the mounting position may vary. Taking these into consideration, the shield case 21 -the electronic component element 23. It is necessary to design so that a certain amount of space is provided between them. However, if a certain amount of space is provided between the shield case 21 and the electronic component element 23, an extra space is generated correspondingly, resulting in a problem that the electronic device becomes taller.
[0007]
The present invention has been devised in view of the above-mentioned problems, and the object thereof is to protect an electronic component element by properly shielding electromagnetic waves without using a shield case, and to cope with a reduction in thickness. An object of the present invention is to provide an electronic device capable of performing the above.
[0008]
[Means for Solving the Problems]
An electronic device according to the present invention is an electronic device in which an electronic component element is mounted on a wiring board and the electronic component element is covered with an electrically insulating first resin material. An annular ground electrode pattern surrounding the electronic component element mounting region is formed on the outer side of one resin material, and the first resin material is electrically conductive and electrically connected to the ground electrode pattern. It is characterized by being covered with the second resin material.
[0009]
The electronic device of the present invention is characterized in that an outer peripheral portion of the second resin material is located on the ground electrode pattern.
[0010]
Furthermore, in the electronic device according to the present invention, a notch is formed at a corner between the upper surface and the inner peripheral surface of the ground electrode pattern, and the outer peripheral portion of the second resin material is a ground electrode constituting the notch. It is characterized in that it matches the position of the corner formed between the inner surface and the upper surface of the pattern.
[0011]
According to the electronic device of the present invention, the electronic component element covered with the electrically insulating first resin material is covered with the conductive second resin material, and the second resin material is electrically connected to the ground electrode pattern. Therefore, when the electronic device is used, the second resin material is held at the ground potential, thereby shielding the electromagnetic wave without providing a shield case and stabilizing the circuit characteristics of the electronic device. The element can be operated normally. In addition, in this case, since it is not necessary to secure an extra space between the shield case and the electronic component element as in the conventional electronic device, the electronic device can be thinned.
[0012]
According to the electronic device of the present invention, since the outer peripheral portion of the second resin material is connected to the annular ground electrode pattern surrounding the mounting area of the electronic component element, the second resin is used when the electronic device is used. The entire material can be reliably held at the ground potential, the electromagnetic wave shielding effect can be enhanced, the electronic device can be operated more stably, and the influence of external electromagnetic waves on the electronic component element Can be effectively suppressed.
[0013]
Furthermore, according to the electronic device of the present invention, a notch is formed at a corner between the upper surface and the inner peripheral surface of the ground electrode pattern, and the outer periphery of the second resin material is formed on the ground electrode constituting the notch. By matching the position of the corner formed between the inner surface and the upper surface of the pattern, the contact area between the second resin material and the ground electrode pattern is increased, and the adhesion strength between the second resin material and the ground electrode pattern is increased. The airtightness of the electronic component element can be improved.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
[0015]
FIG. 1 is a cross-sectional view of an electronic device according to an embodiment of the present invention. The electronic device shown in FIG. 1 is roughly composed of a wiring board 1, a first resin material 2, and a second resin material 3. Has been.
[0016]
The wiring board 1 is constituted by a substantially rectangular laminate formed by laminating a plurality of insulating layers in the thickness direction, and a large number of circuit wirings 6 are interposed between these insulating layers. Are electrically connected to each other via via hole conductors 7 embedded in the insulating layer.
[0017]
As a material of the insulating layer constituting such a wiring board 1, for example, a ceramic material such as glass ceramics is used, and the thickness of each insulating layer is set to 50 μm to 300 μm, for example.
[0018]
When the insulating layer is made of a ceramic material, the wiring board 1 is formed by laminating a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent, organic solvent, etc. to the ceramic raw material powder. The laminate is manufactured by press molding and then firing the laminate at a high temperature and processing the outer shape.
[0019]
Moreover, as a material of the circuit wiring 6 and the via-hole conductor 7 provided in the wiring board 1, for example, a conductive material mainly composed of silver is preferably used, and the thickness of each circuit wiring is, for example, 5 μm to It is set to 20 μm.
[0020]
On the other hand, the main surface of the wiring board 1 is provided with a ground electrode pattern 5, connection pads 8 connected to the circuit wiring 6, and surface wiring (not shown).
[0021]
The ground electrode pattern 5 is arranged in an annular shape along the outer periphery of the upper surface of the wiring board 1, and is an external connection conductor (not shown) formed on the side surface of the wiring board 1 via the via-hole conductor 7 and the like inside the wiring board 1. Connected to. The external connection conductor is electrically connected to a ground wiring provided on a motherboard on which the electronic device is mounted, so that the ground wiring pattern 5 is held at the ground potential when the electronic device is used. It has become.
[0022]
The ground electrode pattern 5 and the connection pad 8 contain, for example, an Ag-based powder such as Ag, Ag-Pd, or Ag-Pt, a borosilicate-based low-melting glass frit, an organic binder such as ethyl cellulose, an organic solvent, or the like. The conductive paste is formed on a ceramic green sheet corresponding to the uppermost layer of the wiring substrate 1 by screen printing or the like, and is fired.
[0023]
Further, the thickness of the ground electrode pattern 5 is set to, for example, 5 μm to 80 μm, and in particular, if it is set to 50 μm or more, when the liquid resin is applied during the formation of the first resin material 2 described later, before being cured. The liquid resin also serves as a dam that blocks the liquid resin from flowing out from the upper surface of the wiring board 1. Therefore, when the first resin material is formed, when the liquid resin having low viscosity and easy to flow is used, the thickness of the ground electrode pattern 5 is preferably set to 50 μm or more.
[0024]
On the upper surface of the wiring substrate 1, an electronic component element 4 such as an integrated circuit component element, a chip inductor, a chip capacitor, a chip resistor, or a diode is mounted.
[0025]
The electronic component element 4 is electrically connected to a connection pad 8 attached to the upper surface of the wiring board 1 via a conductive adhesive such as solder, and the electronic component element 4 and a circuit inside the wiring board 1 are connected. The wiring 6 constitutes a predetermined electric circuit. In the present embodiment, one electronic component element 4 is mounted on the wiring board 1.
[0026]
The electronic component element 4 is sequentially covered with a first resin material 2 having electrical insulation and a second resin material 3 having conductivity.
[0027]
The first resin material 2 includes a protective film that protects the electronic component element 4 from external impact, an insulating film that prevents the second resin material and the electronic component element 4 from being short-circuited, and the electronic component element 4. It has a function as a sealing layer for hermetically sealing.
[0028]
In addition, such a first resin material 2 is obtained by adding and mixing a thermosetting resin such as an epoxy resin with a curing agent, a curing accelerator, and other inorganic fillers if necessary. The electronic component element 4 is applied so as to cover the electronic component element 4 by a method or the like, and then heated and cured. The distance from the upper surface of the electronic component element 4 to the upper surface of the first resin material 2 is, for example, 0.10 mm to It is set to be in the range of 0.30 mm.
[0029]
On the other hand, the second resin material 3 is electrically connected to the ground electrode pattern 5 of the wiring board 1, and when the electronic device is used, the second resin material 3 is held at the ground potential, thereby causing an electromagnetic wave from the outside. It is possible to stabilize the circuit characteristics of the electronic device and to make the electronic component element operate normally. In addition, in this case, since it is not necessary to secure an extra space between the shield case and the electronic component element as in the conventional electronic device, the electronic device can be thinned.
[0030]
Such a second resin material 3 is made of, for example, the same epoxy resin as the first resin material described above, or conductive particles such as Au, Ag, Cu, and a curing agent on a resin such as a silicon resin or a polyimide resin, By applying a curing accelerator and other inorganic fillers added and mixed as necessary, by covering the first resin material by a conventionally known screen printing method, etc., and then thermally curing. It is formed and its thickness is set to 0.05 mm to 0.20 mm, for example.
[0031]
In addition, content of the said electroconductive particle is set to the range of 75-88 wt% with respect to the weight of the whole 2nd resin material, for example.
[0032]
In addition, since the outer peripheral portion of the second resin material 3 is connected to the annular ground electrode pattern 5 that surrounds the mounting area of the electronic component element 4, the entire second resin material is used when the electronic device is used. It is possible to reliably hold the ground potential, enhance the shielding effect of electromagnetic waves, make the electronic device operate more stably, and effectively influence the influence of external electromagnetic waves on the electronic component elements It becomes possible to suppress. Therefore, it is preferable to arrange the second resin material 3 so that the outer peripheral portion thereof is connected to the ground electrode pattern 5.
[0033]
Further, as shown in FIG. 2, the ground electrode pattern 5 has a notch 9 at a corner portion between the upper surface and the inner peripheral surface, and the outer peripheral portion of the second resin material 3 is provided with the notch 9. Since it is arranged so as to coincide with the corner portion 10 formed between the inner surface and the upper surface of the ground electrode pattern 5 to be configured, the contact area between the second resin material 3 and the ground electrode pattern 5 is increased, The adhesion strength between the second resin material 3 and the ground electrode pattern 5 can be improved to improve the airtightness of the electronic component element 4.
[0034]
Further, by providing the notch 9 as described above in the ground electrode pattern 5, when the liquid resin is applied when forming the second resin material 3, the liquid resin before curing flows out from the upper surface of the wiring substrate 1. It can also be blocked.
[0035]
Thus, in the electronic device described above, the electronic component element 4 mounted on the wiring board 1 is covered with the first resin material 2 having electrical insulation, and the first resin material 2 is covered with the second resin material 3 having conductivity. By covering, an electromagnetic wave from the outside can be shielded by the second resin material 3 having conductivity without using a shield case, and the electronic device can be operated stably.
[0036]
In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible within the range which does not deviate from the summary of this invention.
[0037]
In the above-described embodiment, the ground electrode pattern 5 is arranged so that the outer peripheral edge thereof matches the outer peripheral edge of the upper surface of the wiring board 1. Instead, the outer peripheral edge of the ground electrode pattern 5 is replaced with the wiring board 1. You may make it arrange | position by a predetermined distance apart inside the outer peripheral edge. In this way, even when the wiring board 1 is manufactured by the “multi-piece” method by dividing the large substrate, the ground electrode pattern 5 and the cutting cutter are separated at the time of dividing / cutting the large substrate. Since there is no contact, there is no inconvenience that the edge of the ground electrode pattern 5 is peeled off from the base when the large substrate is cut.
[0038]
In the above-described embodiment, the electronic component element 4 is electrically connected to the connection pad 8 provided on the upper surface of the wiring board 1 via a conductive adhesive such as solder. Instead, as shown in FIG. 3, it may be electrically connected to the connection pad 8 via a bonding material 11 such as a fine metal wire. In this case, it is important to cover the bonding material 11 together with the electronic component element 4 with the first resin material 2.
[0039]
Furthermore, in the above-described embodiment, one electronic component element 4 is mounted on the wiring board 1, but it goes without saying that a plurality of electronic component elements 4 may be mounted. In that case, it is preferable that the upper surface of the tallest electronic component element among the plurality of electronic component elements 4 is separated from the upper surface of the first resin material by, for example, about 0.10 mm to 0.30 mm.
[0040]
Furthermore, in the above-described embodiment, the wiring substrate 1 is formed of glass ceramics. Instead, other ceramic materials such as alumina ceramics or organic materials such as glass cloth base epoxy resins are used. Thus, the wiring substrate 1 may be formed.
[0041]
【The invention's effect】
According to the electronic device of the present invention, the electronic component element covered with the electrically insulating first resin material is covered with the conductive second resin material, and the second resin material is electrically connected to the ground electrode pattern. Therefore, when the electronic device is used, the second resin material is held at the ground potential, thereby shielding the electromagnetic wave without providing a shield case and stabilizing the circuit characteristics of the electronic device. The element can be operated normally. In addition, in this case, since it is not necessary to secure an extra space between the shield case and the electronic component element as in the conventional electronic device, the electronic device can be thinned.
[0042]
According to the electronic device of the present invention, since the outer peripheral portion of the second resin material is connected to the annular ground electrode pattern surrounding the mounting area of the electronic component element, the second resin is used when the electronic device is used. The entire material can be reliably held at the ground potential, the electromagnetic wave shielding effect can be enhanced, the electronic device can be operated more stably, and the influence of external electromagnetic waves on the electronic component element Can be effectively suppressed.
[0043]
Furthermore, according to the electronic device of the present invention, a notch is formed at a corner between the upper surface and the inner peripheral surface of the ground electrode pattern, and the outer periphery of the second resin material is formed on the ground electrode constituting the notch. By matching the position of the corner formed between the inner surface and the upper surface of the pattern, the contact area between the second resin material and the ground electrode pattern is increased, and the adhesion strength between the second resin material and the ground electrode pattern is increased. The airtightness of the electronic component element can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an electronic device of the present invention.
2 is a cross-sectional view of a principal part in which the first resin material 2 and the second resin material 3 of the electronic device of FIG. 1 are omitted.
FIG. 3 is a cross-sectional view of an electronic device according to another embodiment of the present invention.
FIG. 4 is a cross-sectional view of a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... 1st resin material 3 ... 2nd resin material 4 ... Electronic component element 5 ... Ground electrode pattern

Claims (3)

配線基板上に電子部品素子を搭載するとともに、該電子部品素子を電気絶縁性の第１樹脂材で被覆してなる電子装置において、
前記配線基板の上面で、前記第１樹脂材の外側に、前記電子部品素子の搭載領域を囲繞する環状のグランド電極パターンを形成するとともに、前記第１樹脂材を、導電性を有し、前記グランド電極パターンに電気的に接続される第２樹脂材で被覆したことを特徴とする電子装置。In an electronic device in which an electronic component element is mounted on a wiring board and the electronic component element is covered with an electrically insulating first resin material,
On the upper surface of the wiring board, outside the first resin material, an annular ground electrode pattern surrounding the electronic component element mounting region is formed, and the first resin material has conductivity, An electronic device comprising a second resin material that is electrically connected to a ground electrode pattern. 前記第２樹脂材の外周部が前記グランド電極パターン上に位置していることを特徴とする請求項１に記載の電子装置。The electronic device according to claim 1, wherein an outer peripheral portion of the second resin material is located on the ground electrode pattern. 前記グランド電極パターンの上面と内周面との間の角部に切り欠きを形成し、前記第２樹脂材の外周部を、前記切り欠きを構成するグランド電極パターンの内面と上面との間に形成される角部の位置と合致させたことを特徴とする請求項１または請求項２に記載の電子装置。A notch is formed at a corner between the upper surface and the inner peripheral surface of the ground electrode pattern, and the outer peripheral portion of the second resin material is interposed between the inner surface and the upper surface of the ground electrode pattern constituting the notch. The electronic device according to claim 1, wherein the electronic device matches a position of a corner to be formed.
JP2003185918A 2003-06-27 2003-06-27 Electronic device Pending JP2005019900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003185918A JP2005019900A (en) 2003-06-27 2003-06-27 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003185918A JP2005019900A (en) 2003-06-27 2003-06-27 Electronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009032310A Division JP2009111428A (en) 2009-02-16 2009-02-16 Electronic device

Publications (2)

Publication Number Publication Date
JP2005019900A true JP2005019900A (en) 2005-01-20
JP2005019900A5 JP2005019900A5 (en) 2006-01-05

Family

ID=34185188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003185918A Pending JP2005019900A (en) 2003-06-27 2003-06-27 Electronic device

Country Status (1)

Country Link
JP (1) JP2005019900A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009008243A1 (en) * 2007-07-09 2009-01-15 Tatsuta System Electronics Co., Ltd. High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same
JP2009111428A (en) * 2009-02-16 2009-05-21 Kyocera Corp Electronic device
WO2010021262A1 (en) * 2008-08-19 2010-02-25 株式会社村田製作所 Circuit module and method for manufacturing same
JP2011091451A (en) * 2011-02-07 2011-05-06 Kyocera Corp Electronic apparatus
JP2011254114A (en) * 2011-09-20 2011-12-15 Kyocera Corp Electronic device
KR101101568B1 (en) * 2009-11-20 2012-01-02 삼성전기주식회사 High frequency package and method for manufacturing the same
CN111799185A (en) * 2020-07-03 2020-10-20 徐彩芬 Tube core packaging structure and preparation method thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009008243A1 (en) * 2007-07-09 2009-01-15 Tatsuta System Electronics Co., Ltd. High frequency module having shielding and heat dissipating characteristics and method for manufacturing the same
WO2010021262A1 (en) * 2008-08-19 2010-02-25 株式会社村田製作所 Circuit module and method for manufacturing same
JP4525866B2 (en) * 2008-08-19 2010-08-18 株式会社村田製作所 Circuit module and manufacturing method thereof
JPWO2010021262A1 (en) * 2008-08-19 2012-01-26 株式会社村田製作所 Circuit module and manufacturing method thereof
US8240035B2 (en) 2008-08-19 2012-08-14 Murata Manufacturing Co., Ltd. Circuit module and manufacturing method for the same
JP2009111428A (en) * 2009-02-16 2009-05-21 Kyocera Corp Electronic device
KR101101568B1 (en) * 2009-11-20 2012-01-02 삼성전기주식회사 High frequency package and method for manufacturing the same
JP2011091451A (en) * 2011-02-07 2011-05-06 Kyocera Corp Electronic apparatus
JP2011254114A (en) * 2011-09-20 2011-12-15 Kyocera Corp Electronic device
CN111799185A (en) * 2020-07-03 2020-10-20 徐彩芬 Tube core packaging structure and preparation method thereof
CN111799185B (en) * 2020-07-03 2022-04-19 徐彩芬 Tube core packaging structure and preparation method thereof

Similar Documents

Publication Publication Date Title
KR20230034994A (en) Semiconductor device and manufacturing method thereof
CN101401206B (en) Circuit module, wireless communication apparatus and circuit module manufacturing method
US9609754B2 (en) Package for mounting electronic element, electronic device, and imaging module
JPWO2014017228A1 (en) module
US9591747B2 (en) Module board
JP3894091B2 (en) IC chip built-in multilayer substrate and manufacturing method thereof
KR101693747B1 (en) Electronic components embedded substrate and manufacturing method thereof
JP2008034778A (en) Circuit module
JP2005026263A (en) Hybrid integrated circuit
JP4057968B2 (en) Electronic equipment
JP4051326B2 (en) Manufacturing method of electronic device
JP2005019900A (en) Electronic device
JP2005101365A (en) Electronic device
JP6224525B2 (en) Wiring board and electronic device
JP2009111428A (en) Electronic device
JP2011091451A (en) Electronic apparatus
JP6250943B2 (en) Wiring board
JP2011254114A (en) Electronic device
JP3872378B2 (en) Electronic equipment
JP3847190B2 (en) Wiring board
JP3935833B2 (en) Electronic equipment
JP3878878B2 (en) Wiring board
JP7433766B2 (en) Circuit boards, electronic components and electronic modules
JP2007201517A (en) Semiconductor device
JP2003078103A (en) Circuit board

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20051111

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081216

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090407

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090608

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090714