JP2004363212A - Wiring board with through-hole conductor - Google Patents

Wiring board with through-hole conductor Download PDF

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Publication number
JP2004363212A
JP2004363212A JP2003157723A JP2003157723A JP2004363212A JP 2004363212 A JP2004363212 A JP 2004363212A JP 2003157723 A JP2003157723 A JP 2003157723A JP 2003157723 A JP2003157723 A JP 2003157723A JP 2004363212 A JP2004363212 A JP 2004363212A
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JP
Japan
Prior art keywords
hole
wiring board
diameter
conductor
glass
Prior art date
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Pending
Application number
JP2003157723A
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Japanese (ja)
Inventor
Yasuto Takeuchi
靖人 竹内
Satoshi Yamaguchi
山口　　聡
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Proterial Ltd
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Hitachi Metals Ltd
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Filing date
Publication date
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Priority to JP2003157723A priority Critical patent/JP2004363212A/en
Priority to PCT/JP2004/007354 priority patent/WO2004110116A1/en
Publication of JP2004363212A publication Critical patent/JP2004363212A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board made of glass with a through-hole conductor which is hard to cause omission and a continuity failure, etc. <P>SOLUTION: The wiring board is provided with the through-hole conductor wherein a through-hole formed in the wiring board formed of glass, ceramic or silicon is filled with conductive paste and solidified. The through-hole has a minimal value of a diameter smaller than a certain portal aperture diameter in each end surface in the middle of both end surfaces. Further, the minimum diameter is larger than eight times the average diameter of filled conductor particles. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明はスルーホール導体を持った配線基板に関し、特にＧＭＲ素子などを形成するのに適したガラスなどからできた配線基板のように脱落の生じやすいスルーホール導体を持った配線基板に関するものである。
【０００２】
【従来の技術】
プリント配線基板に開けたスルーホールに充填して導体とするのに適した導電ペーストが特許文献１に記載されている。この導電ペーストは導体粒子として銅の微粒子の表面に銀を被覆したものを用い、エポキシ樹脂を主成分とするペーストで混練されたものである。特許文献１に記載されている導電ペーストは、プリント配線基板のプリプレグ（ガラスエポキシ、紙フェノール、コンポジット、アラミドエポキシ等の材料から構成される）に開けたスルーホールに充填するのに適したものである。
【０００３】
ところが、ＧＭＲ（巨大磁気抵抗）素子など機能素子はその特性を十分に発揮させるにはガラスなどからできた配線基板に形成するのが望ましい。ガラスなどの配線基板上に形成した機能素子から導かれているリード線は、その配線基板上にプリント配線して作られ、そのリード線の端子を同じ配線基板の反対面に作られることが多い。配線基板の一面上に形成したリード線からその配線基板の他面に形成した端子までは、配線基板に開けたスルーホールを通して導体が設けられている。
【０００４】
【特許文献１】
特開２００２−２８９０３８号公報。
【０００５】
【発明が解決しようとする課題】
ガラスなどの配線基板に開けたかかるスルーホールに設ける導体として前記特許文献１に開示された導電ペーストを用いると、スルーホールに充填した導電ペーストが固化してできた導体が固化後にスルーホールから脱落することがあった。同様な問題はセラミック、シリコンなどからできた配線基板のように導体ペーストの樹脂が付着しにくい材料からなる配線基板においても生じることが判明した。
【０００６】
そこで本発明は脱落や導通不良などの生じにくいスルーホール導体を持ったガラスなどでできた配線基板を提供することを目的としている。
【０００７】
【課題を解決するための手段】
本発明のスルーホール導体を持った配線基板は、ガラス、セラミックあるいはシリコンからできた配線基板の両端面間に開けられたスルーホール内に、導体粒子を混練したぺ−ストを充填固化した導体を有するものにおいて、
前記スルーホールは、前記両端面それぞれにある入口開口の直径よりも小さい直径の極小値を両端面の途中に持ち、
その極小直径は前記充填固化した導体が含んでいる導体粒子の平均直径の８倍よりも大きいことを特徴とする。
【０００８】
前記スルーホール導体を持った配線基板において、スルーホールの直径の極小値は前記端面にある小さい側の入口開口直径の９０％未満であることが好ましい。
【０００９】
前記スルーホール導体を持った配線基板において、前記直径の極小値が８０μｍよりも大きいことが好ましい。
【００１０】
本発明のスルーホール導体を持った配線基板は、ガラス、セラミックあるいはシリコンからできた配線基板の両端面間に開けられたスルーホール内に、導体粒子を混練したぺ−ストを充填固化した導体を有するものにおいて、
前記スルーホールは、前記両端面それぞれにある入口開口の中心軸が互いに偏芯していることを特徴とする。
【００１１】
前記スルーホール導体を持った配線基板において、前記両端面それぞれにある入口開口の中心軸の偏芯が両入口開口の半径の差よりも大きいことが好ましい。
【００１２】
【発明の実施の形態】
以下図面を参照しながら本発明を実施例について詳しく説明する。図１はＧＭＲ素子を形成した配線基板を上面図で示すものであり、図２は図１の配線基板を底面図で示す。また、図３と図４は本発明の第一実施例を示し、図３は図１に示すガラス配線基板のスルーホール導体を含む部分の拡大断面図で、図４は図３に示すガラス配線基板で導体を充填する前のスルーホールを拡大断面図で示し、あわせてレジストマスクを二点鎖線で示している。図５と図６は本発明の第二実施例を示し、図５は図４に対応するスルーホールの拡大断面図を、図６は図５のスルーホールの平面図を示している。
【００１３】
図１と図２を参照して、配線基板１は約７００μｍ厚さをしたガラス配線基板であり、そのほぼ中央にＧＭＲ素子２が形成されている。ＧＭＲ素子から引き出されている４本のリード線３１，３２，３３，３４それぞれがガラス配線基板の４隅近くに設けられたスルーホール導体４に接続されており各スルーホール導体４はガラス配線基板１の裏面で端子５に接続されている。
【００１４】
図３から明らかなようにガラス配線基板裏面の端子５と表面のリード線３１，３２，３３，３４との間がスルーホール導体４で接続されているので、スルーホール導体は脱落や導通不良などの欠陥のないことが要求される。
【００１５】
図４にスルーホール導体を充填するための本発明の第一実施例によるスルーホール６の拡大断面図を示している。同図で、ガラス配線基板１に開けられたスルーホール６はガラス配線基板１の両端面１１，１２それぞれに入口開口を持ち、上側端面１１に大きな開口６１を、下側端面１２に小さい開口６２を持っている。この図では、上側端面１１にある開口６１がスルーホール６の最大直径となっている。更に両端面の途中に直径が極小となった部分があり、図に示す例では上側端面の開口６１から約６００μｍの深さのところに直径が極小となった部分がある。図で最大直径をｄ１，小さい側の開口直径をｄ２、極小となっている部分の直径をｄ３として示している。
【００１６】
第一実施例におけるスルーホール６では、途中にある極小直径ｄ３は最大の開口直径ｄ１及び小さい側の開口直径ｄ２よりも小さく、スルーホールに充填固化した導体４が含んでいる導体粒子の平均直径の８倍よりも大きい。
【００１７】
図４に２点鎖線で示すように、３００＋−１０μｍ径をした孔９１を持ったレジストマスク９をガラス基板上に載せて、サンドブラストによって約６００μｍ深さの穴を開け、その穴を開けることによって残りの部分には欠けを生じさせてスルーホールとした。ここで１５０ｍｍ直径のガラス基板を用いてスルーホール８０００個を同時に作った。基板の一方の端面上にあるスルーホールの開口直径ｄ１は３５０＋−４０μｍ、小さい側の開口直径ｄ２は１４０＋−４０μｍ、極小部直径ｄ３は８０〜１２０μｍであった。すべてのスルーホール６において、小さい側の開口直径ｄ２は極小部直径ｄ３よりも大であった。
【００１８】
銀で被覆された銅微粒子（直径分布は約１μｍ〜約１０μｍで、平均直径は約７μｍであった。）の８０〜９５質量％をエポキシ樹脂と混練したペーストをガラス基板に刷り込んでスルーホール中にペーストを充填した。それを１７０〜２８０℃に加熱してペーストを固化した上で、ガラス基板の両端面から突出している導体の部分を研磨してスルーホール導体４とした。
【００１９】
このようにして形成した８０００個のスルーホール導体を持った１５０ｍｍ直径のガラス基板を用いて、図１〜３に示すように端子５、リード線３１，３２，３３，３４、ＧＭＲ素子２を形成した上で、図１に示す大きさに切断してガラス配線基板１とした。それらの形成工程中の取り扱いではスルーホール導体の脱落は生じなかった。また、この処理工程後に行った、スルーホール導体の通電テストでは、導通不良は観察されなかった。
【００２０】
この実施例ではスルーホール導体の極小直径は、導体が含んでいる銅微粒子すなわち導体粒子の平均直径の８倍よりも大きく、具体的には８０〜１２０μｍなので、導体粒子が極小直径の部分に９５から２２７個程度存在させていることになり、スルーホール導体の他の部分の断面は極小直径の面積とほぼ同じかそれよりも大きな面積をしているので、更に多くの導体粒子を存在させていることになる。またスルーホールの開口と極小部分との直径差があまり大きくないので導電ペーストの加熱固化時の収縮の差があまり大きくなく、導体の収縮による切断が生じなかったものと考えられる。これらの理由によって通電テストで導通が良かったものと考えられる。
【００２１】
更に第一実施例で極小部直径ｄ３が８０〜１２０μｍで、小さい側の入口開口直径ｄ２は１４０＋−４０μｍであったので、極小部直径ｄ３は小さい側の入口開口直径ｄ２の９０％未満であった。小さい側の入口開口直径ｄ２と極小部直径ｄ３との差が大きいので、導電ペーストを約２００℃加熱して固化した後の導体とガラス部分の収縮の差によるスルーホールから導体の抜け落ちや弛みを防止することができた。
【００２２】
図５に本発明の第二実施例によるスルーホール導体を充填するためのスルーホール形状の拡大断面図を、図６にそのスルーホールの平面図を示している。それらの図でスルーホール７はガラス配線基板１のそれぞれの端面から開けられた２個の穴７１，７２からできており、それらの穴はスルーホール７の内部で連通している。両端面それぞれにある入口開口の中心軸（図５で中心軸を一点鎖線で示している）が互いに偏芯しており、この図に示した例では、大きい側の穴７１の入口開口直径ｄ４が約３００μｍで、小さい側の穴７２の入口開口直径ｄ５が約１５０μｍであり、それらの偏芯は１００μｍとしたので、それらの半径の差以上の偏芯となっている。このスルーホール７に充填した導体も抜け落ちや弛みを防止することができた。しかし第二実施例のものでは、ガラス基板の両端面から穴をそれぞれ開ける必要がある。
【００２３】
【発明の効果】
以上詳しく説明したように、本発明のスルーホール導体を持った配線基板で、その配線基板としてガラス、セラミック、シリコンのように導電ペーストが付着しにくい材料を用いた場合にも、スルーホール導体の脱落や断線を防止することができ、信頼性のある配線基板とすることができる。
【図面の簡単な説明】
【図１】ＧＭＲ素子を形成したガラス配線基板を上面図で示すものである。
【図２】図１に示すガラス配線基板の底面図である。
【図３】図１に示すガラス配線基板のスルーホール導体を含む部分の拡大断面図を示す。
【図４】図３に示す配線ガラス基板で、導体を充填する前の第一実施例によるスルーホールを拡大断面図で示し、あわせてレジストマスクを二点鎖線で示す。
【図５】図４に対応する第二実施例によるスルーホールの拡大断面図である。
【図６】図５のスルーホールの平面図である。
【符号の説明】
１ ガラス配線基板
１１，１２ 端面
２ ＧＭＲ素子
３１，３２，３３，３４ リード線
４ スルーホール導体
５ 端子
６，７ スルーホール
６１，６２ 開口
７１，７２ 穴
９ レジストマスク
９１ 孔[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring board having a through-hole conductor, and more particularly to a wiring board having a through-hole conductor that is likely to fall off, such as a wiring board made of glass or the like suitable for forming a GMR element or the like. .
[0002]
[Prior art]
Patent Document 1 discloses a conductive paste suitable for filling a through-hole formed in a printed wiring board into a conductor. This conductive paste uses copper particles coated with silver as the conductive particles and is kneaded with a paste containing an epoxy resin as a main component. The conductive paste described in Patent Document 1 is suitable for filling a through hole formed in a prepreg (made of a material such as glass epoxy, paper phenol, composite, or aramid epoxy) of a printed wiring board. is there.
[0003]
However, it is desirable to form a functional element such as a GMR (giant magnetoresistance) element on a wiring substrate made of glass or the like in order to sufficiently exhibit its characteristics. Lead wires that are led from functional elements formed on a wiring board such as glass are made by printed wiring on the wiring board, and the terminals of the lead wires are often made on the opposite surface of the same wiring board . A conductor is provided from a lead wire formed on one surface of the wiring substrate to a terminal formed on the other surface of the wiring substrate through a through hole formed in the wiring substrate.
[0004]
[Patent Document 1]
JP-A-2002-289038.
[0005]
[Problems to be solved by the invention]
If the conductive paste disclosed in Patent Document 1 is used as a conductor provided in such a through hole opened in a wiring board such as glass, the conductor formed by solidification of the conductive paste filled in the through hole drops from the through hole after solidification. There was something to do. It has been found that a similar problem occurs in a wiring board made of a material to which a resin of a conductive paste is unlikely to adhere, such as a wiring board made of ceramic, silicon, or the like.
[0006]
Accordingly, it is an object of the present invention to provide a wiring board made of glass or the like having through-hole conductors that are unlikely to cause dropout or poor conduction.
[0007]
[Means for Solving the Problems]
The wiring board having the through-hole conductor of the present invention is a wiring board made of glass, ceramic or silicon, and a through-hole formed between both end faces of the wiring board is filled with a paste filled with paste mixed with conductive particles and solidified. In having
The through-hole has a minimum value of the diameter smaller than the diameter of the inlet opening at each of the both end surfaces in the middle of both end surfaces,
The minimum diameter is characterized by being greater than eight times the average diameter of the conductive particles contained in the solidified conductor.
[0008]
In the wiring board having the through-hole conductor, it is preferable that the minimum value of the diameter of the through-hole is less than 90% of the diameter of the entrance opening on the small side on the end face.
[0009]
In the wiring board having the through-hole conductor, it is preferable that the minimum value of the diameter is larger than 80 μm.
[0010]
The wiring board having the through-hole conductor of the present invention is a wiring board made of glass, ceramic or silicon, and a through-hole formed between both end faces of the wiring board is filled with a paste filled with paste mixed with conductive particles and solidified. In having
The through-holes are characterized in that the central axes of the inlet openings at the respective end faces are eccentric to each other.
[0011]
In the wiring board having the through-hole conductor, it is preferable that the eccentricity of the center axis of the entrance opening at each of the both end surfaces is larger than the difference between the radii of both entrance openings.
[0012]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a top view showing a wiring board on which a GMR element is formed, and FIG. 2 is a bottom view showing the wiring board of FIG. 3 and 4 show a first embodiment of the present invention. FIG. 3 is an enlarged sectional view of a portion including a through-hole conductor of the glass wiring board shown in FIG. 1, and FIG. 4 is a glass wiring shown in FIG. The through hole before the conductor is filled with the substrate is shown in an enlarged sectional view, and the resist mask is shown by a two-dot chain line. 5 and 6 show a second embodiment of the present invention. FIG. 5 is an enlarged sectional view of the through hole corresponding to FIG. 4, and FIG. 6 is a plan view of the through hole of FIG.
[0013]
Referring to FIGS. 1 and 2, a wiring board 1 is a glass wiring board having a thickness of about 700 μm, and a GMR element 2 is formed substantially at the center thereof. Each of the four lead wires 31, 32, 33, and 34 drawn from the GMR element is connected to through-hole conductors 4 provided near four corners of the glass wiring board. 1 is connected to the terminal 5 on the back surface.
[0014]
As is clear from FIG. 3, since the terminals 5 on the back surface of the glass wiring board and the lead wires 31, 32, 33, 34 on the front surface are connected by the through-hole conductors 4, the through-hole conductors fall off or have poor conduction. Is required to be free of defects.
[0015]
FIG. 4 is an enlarged sectional view of the through hole 6 for filling the through hole conductor according to the first embodiment of the present invention. In the figure, a through hole 6 formed in the glass wiring board 1 has an inlet opening on each of both end faces 11 and 12 of the glass wiring board 1, and a large opening 61 is formed on the upper end face 11 and a small opening 62 is formed on the lower end face 12. have. In this figure, the opening 61 in the upper end face 11 has the maximum diameter of the through hole 6. Further, there is a portion where the diameter is extremely small in the middle of both end surfaces, and in the example shown in the figure, there is a portion where the diameter is extremely small at a depth of about 600 μm from the opening 61 on the upper end surface. In the figure, the maximum diameter is indicated by d1, the opening diameter on the smaller side is indicated by d2, and the diameter of the minimum part is indicated by d3.
[0016]
In the through hole 6 in the first embodiment, the minimum diameter d3 in the middle is smaller than the maximum opening diameter d1 and the opening diameter d2 on the small side, and the average diameter of the conductor particles contained in the conductor 4 filled and solidified in the through hole It is larger than 8 times.
[0017]
As shown by a two-dot chain line in FIG. 4, a resist mask 9 having a hole 91 having a diameter of 300 + -10 μm is placed on a glass substrate, and a hole having a depth of about 600 μm is formed by sandblasting. The remaining part was chipped to form a through hole. Here, 8000 through holes were simultaneously formed using a glass substrate having a diameter of 150 mm. The opening diameter d1 of the through hole on one end surface of the substrate was 350 + -40 μm, the opening diameter d2 on the smaller side was 140 + -40 μm, and the minimum diameter d3 was 80 to 120 μm. In all the through holes 6, the opening diameter d2 on the smaller side was larger than the diameter d3 of the minimum portion.
[0018]
A paste obtained by kneading 80 to 95% by mass of silver-coated copper fine particles (having a diameter distribution of about 1 μm to about 10 μm and an average diameter of about 7 μm) with an epoxy resin was imprinted on a glass substrate, and the paste was passed through a through-hole. Was filled with the paste. After heating to 170 to 280 ° C. to solidify the paste, the conductor portions protruding from both end surfaces of the glass substrate were polished to form through-hole conductors 4.
[0019]
As shown in FIGS. 1 to 3, the terminal 5, the lead wires 31, 32, 33, and 34, and the GMR element 2 are formed using a glass substrate having a diameter of 150 mm having 8000 through-hole conductors formed in this manner. After that, it was cut into the size shown in FIG. No dropout of the through-hole conductor occurred during handling during those forming steps. In addition, in a conduction test of the through-hole conductor performed after this processing step, no conduction failure was observed.
[0020]
In this embodiment, the minimum diameter of the through-hole conductor is greater than eight times the average diameter of the copper fine particles contained in the conductor, that is, the average diameter of the conductor particles, specifically 80 to 120 μm. From about 227, and the cross section of the other part of the through-hole conductor has an area almost equal to or larger than the area of the minimum diameter. Will be. In addition, it is considered that the difference in diameter between the opening of the through hole and the extremely small portion is not so large, and the difference in shrinkage when the conductive paste is heated and solidified is not so large, and it is considered that no cut due to shrinkage of the conductor occurred. It is considered that conduction was good in the energization test for these reasons.
[0021]
Further, in the first embodiment, since the minimum part diameter d3 is 80 to 120 μm and the small side entrance opening diameter d2 is 140 + −40 μm, the minimum part diameter d3 is less than 90% of the small side entrance opening diameter d2. Was. Since the difference between the entrance opening diameter d2 on the small side and the diameter d3 of the minimum part is large, the conductor paste may be dropped or slack from the through hole due to the difference in contraction between the conductor and the glass part after the conductive paste is heated and solidified at about 200 ° C. Could be prevented.
[0022]
FIG. 5 is an enlarged sectional view of a through-hole shape for filling a through-hole conductor according to a second embodiment of the present invention, and FIG. 6 is a plan view of the through-hole. In these figures, the through hole 7 is made up of two holes 71 and 72 formed from the respective end surfaces of the glass wiring board 1, and these holes communicate with each other inside the through hole 7. The center axes of the inlet openings at both end surfaces (the center axes are indicated by dashed lines in FIG. 5) are eccentric to each other, and in the example shown in this figure, the inlet opening diameter d4 of the hole 71 on the larger side. Is about 300 μm, the entrance opening diameter d5 of the hole 72 on the smaller side is about 150 μm, and their eccentricity is 100 μm. Therefore, the eccentricity is larger than the difference between their radii. The conductor filled in the through hole 7 was also prevented from falling off and loosening. However, in the second embodiment, it is necessary to make holes from both end surfaces of the glass substrate.
[0023]
【The invention's effect】
As described in detail above, in a wiring board having a through-hole conductor of the present invention, glass, ceramic, and a material to which a conductive paste is unlikely to adhere, such as silicon, are used as the wiring board. Dropping and disconnection can be prevented, and a reliable wiring board can be obtained.
[Brief description of the drawings]
FIG. 1 is a top view showing a glass wiring substrate on which a GMR element is formed.
FIG. 2 is a bottom view of the glass wiring board shown in FIG.
FIG. 3 is an enlarged cross-sectional view of a portion including a through-hole conductor of the glass wiring board shown in FIG.
FIG. 4 is an enlarged sectional view of the through-hole according to the first embodiment before the conductor is filled in the wiring glass substrate shown in FIG. 3, and a resist mask is indicated by a two-dot chain line.
FIG. 5 is an enlarged sectional view of a through hole according to the second embodiment corresponding to FIG. 4;
FIG. 6 is a plan view of the through hole of FIG. 5;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Glass wiring board 11,12 End surface 2 GMR element 31,32,33,34 Lead wire 4 Through hole conductor 5 Terminal 6,7 Through hole 61,62 Opening 71,72 Hole 9 Resist mask 91 Hole

Claims (5)

ガラス、セラミックあるいはシリコンからできた配線基板の両端面間に開けられたスルーホール内に、導体粒子を混練したぺ−ストを充填固化した導体を有するものにおいて、
前記スルーホールは、前記両端面それぞれにある入口開口の直径よりも小さい直径の極小値を両端面の途中に持ち、
その極小直径は前記充填固化した導体が含んでいる導体粒子の平均直径の８倍よりも大きいことを特徴とするスルーホール導体を持った配線基板。In a through-hole opened between both end surfaces of a wiring substrate made of glass, ceramic or silicon, a conductor having a paste filled and solidified with paste mixed with conductive particles,
The through-hole has a minimum value of the diameter smaller than the diameter of the inlet opening at each of the both end surfaces in the middle of both end surfaces,
A wiring board having a through-hole conductor, wherein the minimum diameter is larger than eight times the average diameter of the conductive particles contained in the solidified conductor. 前記スルーホールの直径の極小値は前記端面にある小さい側の入口開口直径の９０％未満であることを特徴とする請求項１記載のスルーホール導体を持った配線基板。2. The wiring board having a through-hole conductor according to claim 1, wherein the minimum value of the diameter of the through-hole is less than 90% of the diameter of the entrance opening on the smaller side at the end face. 前記直径の極小値が８０μｍよりも大きいことを特徴とする請求項１あるいは２記載のスルーホール導体を持った配線基板。3. The wiring board according to claim 1, wherein the minimum value of the diameter is larger than 80 [mu] m. ガラス、セラミックあるいはシリコンからできた配線基板の両端面間に開けられたスルーホール内に、導体粒子を混練したぺ−ストを充填固化した導体を有するものにおいて、
前記スルーホールは、前記両端面それぞれにある入口開口の中心軸が互いに偏芯していることを特徴とするスルーホール導体を持った配線基板。In a through-hole opened between both end surfaces of a wiring substrate made of glass, ceramic or silicon, a conductor having a paste filled and solidified with paste mixed with conductive particles,
A wiring board having through-hole conductors, wherein the through-holes have center axes of entrance openings formed on both end surfaces thereof eccentric to each other. 前記両端面それぞれにある入口開口の中心軸の偏芯が両入口開口の半径の差よりも大きいことを特徴とする請求項４記載のスルーホール導体を持った配線基板。5. The wiring board having a through-hole conductor according to claim 4, wherein the eccentricity of the center axis of the entrance opening at each of the both end faces is larger than the difference between the radii of both entrance openings.
JP2003157723A 2003-06-03 2003-06-03 Wiring board with through-hole conductor Pending JP2004363212A (en)

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