JP2004295718A - Liquid cooling system for information processor - Google Patents
Liquid cooling system for information processor Download PDFInfo
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- JP2004295718A JP2004295718A JP2003089679A JP2003089679A JP2004295718A JP 2004295718 A JP2004295718 A JP 2004295718A JP 2003089679 A JP2003089679 A JP 2003089679A JP 2003089679 A JP2003089679 A JP 2003089679A JP 2004295718 A JP2004295718 A JP 2004295718A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は、デスクトップ型もしくはノート型パーソナルコンピュータやサーバ等の小型情報処理装置の液体冷却システムに関する。
【０００２】
【従来の技術】
電子機器の冷却装置についての従来技術は、電子機器内の発熱部材と金属筐体壁との間に金属板又はヒートパイプを介在させて発熱部材を熱的に金属筐体壁と接続することによって、発熱部材で発熱する熱を金属筐体壁で放熱するものであった。
【０００３】
また、特許文献１には電子機器の発熱部材を液冷する技術が開示されており、これによると、電子機器内の半導体素子発熱部材で発生した熱を受熱ヘッドで受け取り、受熱ヘッド内の冷却液がフレキシブルチューブを通って表示装置の金属製筐体に設けられた放熱ヘッドに輸送されて、半導体素子発熱部材で発生した熱を冷却液を介して放熱ヘッドを通し金属筐体から効率的に放熱する構造となっている。更に、放熱面である金属製筐体の壁面に直接取り付けられたヒートパイプに伝達され、更に、放熱面である金属製筐体の壁面に直接取り付けられたヒートパイプの他端に熱接続されて放熱される構造が開示されている。
【０００４】
特許文献２や特許文献３には蛇行した流路を形成した受熱ヘッドについて開示されている。
【０００５】
また、特許文献４には同一な流路断面積の複数配管を持った受熱ヘッドについて開示されている。
【０００６】
【特許文献１】
特開平７−１４２８８６号公報
【特許文献２】
特開平６−２６６４７４号公報
【特許文献３】
特開２００１−１３３１７４号公報
【特許文献４】
特開２００１−１０２８３５号公報
【０００７】
【発明が解決しようとする課題】
パソコンやサーバは、本体部に内臓されたＣＰＵ、ＭＰＵ等（以下、ＣＰＵと云う）から熱を発生するが、発生熱によって回路動作が不安定になったり、機構類の熱変形を引き起こす虞がある。特に、最近ではＣＰＵの動作周波数が一層高くなるのに伴って発熱量の増大を来しており、更なる冷却機能の向上が望まれている。
【０００８】
従来技術では、蛇行配管や複数配管による液冷システムの受熱方式により受熱面の全領域でほぼ一定の冷却機能を得る技術が開示されている。しかしながら、一般にＣＰＵ等は発熱する１０ｍｍ角程度の半導体素子が有機（もしくはセラミック）の中継基板に実装されている構造になっており、それがマザーボードにはんだ付けもしくはマザーボードに実装されたソケットに装着される。受熱ヘッドは流路を形成するため半導体素子より大きな構造となる。また、受熱ヘッドをＣＰＵに取り付けた状態での受熱ヘッドの温度分布はＣＰＵの中心部から同心円状に遠くなるほど低くなる。すなわちＣＰＵ等を効率よく冷却するシステムには受熱ヘッドの均一化を図る必要は無く熱いところをより冷やすという分布を持たせた冷却のほうが効果的である。
【０００９】
また、冷却には受熱ヘッドの中を流れる冷媒との接水面積を多くする、冷媒の流量を多くする、冷媒と受熱ヘッドの温度差を大きくすることが効果的であることが知られている。流量を多くするには冷媒の輸送手段（一般にポンプ）の性能を上げる必要がある。性能を上げるにはポンプを大きくするかパワーをあげることになるが、近年の電子機器の高密度化や省電力化に伴い実装するエリアを確保できないのでポンプを大きくできないし消費電力もあげられない。また、騒音の面からもポンプの能力は極力抑えたい要求がある。
【００１０】
蛇行配管で接水面積を多くするには受熱ヘッド全面に流路を形成することが考えられるが、その場合冷媒が流路を通る過程で受熱ヘッドから熱を受取るため肝心のＣＰＵ中心部に到達するころには冷媒の温度は上昇しＣＰＵ中心部と冷媒の温度差が大きくとれず効果的な冷却が行えない。
【００１１】
同一な流路断面積を持った複数配管を受熱ヘッドに配置した場合、各配管の流量は同一であるためＣＰＵ中心部を冷却する能力の流量が受熱ヘッド周辺に位置した配管にも流れることになり冷やさなくても良いところを一生懸命冷やしている無駄な冷却を行うことになることと総流量が各配管の本数倍になるのでポンプ性能を大きくする必要がある。
【００１２】
本発明の目的は、情報処理装置のＣＰＵ等の局所発熱部品に適用して有用な液冷技術を提供し、従来技術にない特有な受熱効果が得られる構成を提案することにある。
【００１３】
【課題を解決するための手段】
前記目的を達成するための第１の手段は、複数配管を有する受熱ヘッドのそれぞれの冷媒流路に流量制御手段を備えることによって達成される。流量制御手段はそれぞれの流路断面積を変えることや流路に流れを妨げる抵抗体を設けることで達成できる。前記目的を達成するための第２の手段は、流れを妨げる抵抗体を温度によって大きく形状が変化する物質（例えばバイメタル）で構成し冷媒の温度が高い場合は抵抗体に流路を開放させ流路抵抗を小さくし流量を増やし、冷媒の温度が低い場合には抵抗体に流路を遮断させ流路抵抗を大きくし流量を制限し、高温度部に冷媒を集中して流すことで達成できる。
【００１４】
【発明の実施の形態】
以下、本発明の実施形態について、図面を参照して説明する。
本発明の実施形態に係るノート型パソコンの液冷技術について、図面を用いて以下説明する。図１は、本発明の実施形態に係るノート型パソコンの液冷に関する全体構成を示すものである。図１によると、ノート型パソコンは、操作釦群を有するパソコン本体部１と、前記本体部１に回動支持される液晶表示部を有する表示部２と、から構成され、パソコン本体部１は、メインシャーシに支持されたマザーボード（制御回路基板）３が配置され、マザーボード３にはコンピュータを動作させるのに必要な各種電気・電子素子、集積回路、電子回路群等が搭載され、コンピュータの動作時に発熱源となるＣＰＵ４等もこのマザーボード３上に配置されている。図１において、ＣＰＵ４はＷ／Ｊ（受熱ヘッドとしてのウォータージャケット）の下に配されていて、ＣＰＵ４から発生する熱を受熱ヘッドに熱伝達している。
【００１５】
本発明の実施形態に関する液冷の基本的な構成は、パソコン本体部内に収容された最大の発熱源であるＣＰＵ４上に受熱ヘッド（Ｗ／Ｊ）９を固定して、ＣＰＵ発生熱を受熱ヘッド９内の冷却熱で回収し、受熱ヘッド９に接続され且つ冷却液を充填したチューブ１０が液晶表示板と表面カバー間に持ち来されて表面カバー又は筐体を通して熱放散されるものである。
【００１６】
上記構成による冷却液循環方式の冷却システムにおいて以下に本発明の特徴となる受熱ヘッドの詳細について説明する。
図２は本発明の一実施例の上断面図で矢印は各流路２１に流れる冷媒の流量の大きさと向き２２を示している。図３（ｂ）は図２のＡＡ線上の横断面図である。図３（ａ）は（ｂ）における受熱ヘッドのベース２３の温度分布２４を実線で各流路の流量特性２５を棒グラフで示している。
【００１７】
図２に示すように受熱ヘッドは冷媒が流れる流路とその流路を形成する仕切り板２６と外枠２７と発熱体に接するベース２３と天板２８と感温流量制限手段の一実施例であるバイメタル２９で構成されている。ベースと外枠と仕切り板は一体整形されたものでもかまわないしそれぞれ独立に形成し後に接着等で構成してもかまわない。また、それらは熱伝導の良い金属で構成するのが好ましい。さらに受熱ヘッドには冷媒が受熱ヘッドに流れこむ流入口３０とその反対側に受熱ヘッドから熱を奪った冷媒が流れ出る流出口３１を備える。バイメタルは温度差による膨張収縮の量が大きい高膨張金属の板３２と温度差による膨張収縮の量が小さい低膨張金属の板３３を貼り合わせて構成されている。温度上昇することで高膨張金属側の延び量が大きくなるので高膨張金属側に凸の状態に曲がる。
バイメタルは各流路の流出口側に高膨張金属側を各流路の流入口側に向け外枠もしくは仕切り板に取り付ける。バイメタルはベースもしくは天板に取付けても良い。
【００１８】
以下に本発明の受熱ヘッドの動作について説明する。ＣＰＵが起動するとＣＰＵに熱的に接続されたベースの温度上昇が始まる。温度分布は図２（ａ）に示したようにＣＰＵの真上をピークとし周辺に行くにしたがって低くなる。受熱ヘッドや受熱ヘッド内の冷媒の温度上昇にしたがって取付けられたバイメタルが温度上昇し流出口側に変形をはじめる。ＣＰＵ真上の温度の高い流路に取付けられたバイメタルの変形が大きく周囲に行くほど変形は小さくなる。それに伴い変形の大きなバイメタルを有する流路の流路抵抗は小さくなるため温度の高くなるＣＰＵに近い流路ほど流量を多くする制御が可能になる。それにより各流路の流量を図２（ａ）の棒グラフのように制御可能になり、制御しない場合よりもハッチング部３４の流量分を削減可能となる。これにより必要以上の流量を流す必要が無くなるのでポンプの能力を低く抑えることができる。以上によりポンプの小型化や省電力化が可能になる。
【００１９】
あらかじめ必要流量がわかっている場合には感温流量制限手段を使わずとも図４のように等しい厚さの仕切り板を不等ピッチで各流路に必要流量が流れるように配置することで可能である。また、厚さの異なる仕切り板を等ピッチに配置する図５の形態でも実現可能である。
【００２０】
流路断面積の異なる受熱ヘッドの別の製造方法として図６乃至図８に示すように、円形又は楕円形又は四角形のそれぞれ異なる太さのパイプ３５をベース上に横一列に配置し熱伝導接着剤もしくははんだ付け３６により形成する方法もある。この製造方法によれば流路がパイプの内径になり流路として閉じているので天板は不要とすることが可能。また、四角形のパイプを使って形成する場合はＣＰＵとの接触面をフラットに形成することが可能となるのでベースも不要とすることが可能である。なお、図６乃至図８は本実施形態における図２でのＡＡ部断面を示している。
【００２１】
図９はモジュール化された発熱体３７へ適用した場合の実施例である。このように各流路にバイメタルを備えた受熱ヘッドを用いることで、発熱体３８が受熱ヘッド中心に存在しない場合やモジュール内で発熱に分布がある場合でも必要最低限の流量で冷却が可能になる。またモジュールなどは使う機能により発熱する部品が異なる場合がある。ある機能を使っている場合にはＡの部品が発熱し、また、別の機能を使った場合にはＢの部品が発熱するような場合でも、その時々で選択的に自動で流量を集中できるので、発熱に柔軟に対応できる。
【００２２】
【発明の効果】
以上のように本発明によれば、パソコンやサーバのようにＣＰＵ等の局所発熱体を配置する情報処理装置の液体冷却システムに用いられ、前記局所発熱体から効率的に熱を奪い放熱部へ輸送することが可能になる。必要最小限の流量での冷却が可能となるためポンプの能力を低く抑えることができる。これにより、ポンプの小型化や省電力化が期待でき、より小型の情報処理装置への適用が期待できる。
【図面の簡単な説明】
【図１】本発明の実施形態に係るノート型パソコンの液冷システムに関する全体構成を示す図である。
【図２】本発明の第一の実施形態をしめす図である。
【図３】本発明の第一の実施形態における流量制御動作をしめす図である。
【図４】本発明の第二の実施形態をしめす図である。
【図５】本発明の第三の実施形態しめす図である。
【図６】本発明の第四の実施形態しめす図である。
【図７】本発明の第五の実施形態しめす図である。
【図８】本発明の第六の実施形態しめす図である。
【図９】本発明の第七の実施形態しめす図である。
【符号の説明】
１：本体部、２：表示部、３：マザーボード、４：ＣＰＵ、９：受熱ヘッド、１０：チューブ、２１：流路、２２：流量の大きさと向き、２３：ベース、２４：温度分布、２５：各流路の流量特性、２６：仕切り板、２７：外枠、２８：天板、２９：バイメタル、３０：流入口、３１：流出口、３２：高膨張金属の板、３３：低膨張金属の板、３４：削減可能な流量、３５：パイプ、３６：熱伝導接着剤もしくははんだ付け、３７：モジュール、３８：発熱体、[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a liquid cooling system for a small information processing device such as a desktop or notebook personal computer or server.
[0002]
[Prior art]
The related art of a cooling device for an electronic device includes a metal plate or a heat pipe interposed between a heat generating member in the electronic device and a metal housing wall to thermally connect the heat generating member to the metal housing wall. The heat generated by the heat generating member is radiated by the metal housing wall.
[0003]
Patent Document 1 discloses a technique for liquid-cooling a heat-generating member of an electronic device. According to this technology, heat generated by a semiconductor-element heat-generating member in the electronic device is received by a heat-receiving head, and cooling inside the heat-receiving head is performed. The liquid is transported through the flexible tube to the heat radiating head provided on the metal casing of the display device, and the heat generated by the semiconductor element heating member is efficiently passed from the metal casing through the heat radiating head through the cooling liquid. It has a structure to radiate heat. Furthermore, the heat is transmitted to a heat pipe directly attached to the wall surface of the metal casing that is a heat dissipation surface, and further thermally connected to the other end of the heat pipe that is directly attached to the wall surface of the metal casing that is a heat dissipation surface. A structure for dissipating heat is disclosed.
[0004]
Patent Documents 2 and 3 disclose heat receiving heads having a meandering flow path.
[0005]
Patent Document 4 discloses a heat receiving head having a plurality of pipes having the same flow path cross-sectional area.
[0006]
[Patent Document 1]
JP-A-7-142886 [Patent Document 2]
JP-A-6-266474 [Patent Document 3]
JP 2001-133174 A [Patent Document 4]
JP 2001-102835 A
[Problems to be solved by the invention]
A personal computer or a server generates heat from a CPU, an MPU, or the like (hereinafter, referred to as a CPU) incorporated in a main body. However, the generated heat may cause unstable circuit operation or thermal deformation of mechanisms. is there. In particular, recently, as the operating frequency of the CPU has been further increased, the amount of heat generated has increased, and further improvement of the cooling function is desired.
[0008]
The prior art discloses a technique for obtaining a substantially constant cooling function over the entire area of a heat receiving surface by a heat receiving method of a liquid cooling system using meandering pipes or a plurality of pipes. However, in general, a CPU or the like has a structure in which a semiconductor element of about 10 mm square that generates heat is mounted on an organic (or ceramic) relay board, which is soldered to a motherboard or mounted in a socket mounted on the motherboard. You. The heat receiving head has a larger structure than the semiconductor element because it forms a flow path. Further, the temperature distribution of the heat receiving head in a state where the heat receiving head is attached to the CPU becomes lower as the distance from the center of the CPU becomes concentric. That is, in a system for efficiently cooling a CPU or the like, it is not necessary to make the heat receiving head uniform, and cooling having a distribution of cooling a hot place is more effective.
[0009]
It is known that it is effective for cooling to increase the water contact area with the refrigerant flowing in the heat receiving head, increase the flow rate of the refrigerant, and increase the temperature difference between the refrigerant and the heat receiving head. . In order to increase the flow rate, it is necessary to improve the performance of the means for transporting the refrigerant (generally, a pump). To increase the performance, the pump must be increased or the power must be increased.However, the mounting area cannot be secured due to the recent increase in density and power saving of electronic devices, so the pump cannot be enlarged and the power consumption cannot be increased. . In addition, there is a demand for minimizing the capacity of the pump in terms of noise.
[0010]
In order to increase the water contact area with a meandering pipe, it is conceivable to form a flow path on the entire surface of the heat receiving head, but in this case, the refrigerant reaches the central part of the CPU to receive heat from the heat receiving head while passing through the flow path At this time, the temperature of the refrigerant rises, and the temperature difference between the central part of the CPU and the refrigerant cannot be made large, so that effective cooling cannot be performed.
[0011]
When a plurality of pipes having the same flow path cross-sectional area are arranged in the heat receiving head, the flow rate of each pipe is the same, so that the flow rate of the ability to cool the central portion of the CPU also flows to the pipes located around the heat receiving head. It is necessary to increase the pump performance because unnecessary cooling is performed so as to cool the part that does not need to be cooled, and the total flow rate becomes several times the number of pipes.
[0012]
An object of the present invention is to provide a useful liquid cooling technique applied to a local heat-generating component such as a CPU of an information processing apparatus, and to propose a configuration in which a unique heat receiving effect not obtained in the related art can be obtained.
[0013]
[Means for Solving the Problems]
A first means for achieving the above object is achieved by providing a flow control means in each of the refrigerant flow paths of a heat receiving head having a plurality of pipes. The flow rate control means can be achieved by changing the cross-sectional area of each flow path or by providing a flow-blocking resistor in the flow path. A second means for achieving the above object is to form a resistor that obstructs the flow from a substance (for example, a bimetal) whose shape changes greatly depending on the temperature, and to open the flow path to the resistor when the temperature of the refrigerant is high. This can be achieved by reducing the path resistance and increasing the flow rate, and, when the temperature of the refrigerant is low, blocking the flow path by the resistor to increase the flow path resistance and restricting the flow rate, and allowing the refrigerant to flow intensively in the high temperature part. .
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
A liquid cooling technique for a notebook personal computer according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an overall configuration relating to liquid cooling of a notebook personal computer according to an embodiment of the present invention. Referring to FIG. 1, the notebook computer includes a personal computer main body 1 having a group of operation buttons, and a display unit 2 having a liquid crystal display unit which is rotatably supported by the main body 1. A motherboard (control circuit board) 3 supported by a main chassis is arranged. The motherboard 3 is mounted with various electric / electronic elements, integrated circuits, and electronic circuits necessary for operating the computer. The CPU 4 and the like, which sometimes generate heat, are also arranged on the motherboard 3. In FIG. 1, the CPU 4 is disposed under a W / J (water jacket as a heat receiving head) and transfers heat generated from the CPU 4 to the heat receiving head.
[0015]
The basic configuration of liquid cooling according to the embodiment of the present invention is as follows. A heat receiving head (W / J) 9 is fixed on a CPU 4 which is a largest heat source housed in a personal computer main body, and heat generated by the CPU is received by the heat receiving head. A tube 10 connected to the heat receiving head 9 and filled with a cooling liquid is collected between the liquid crystal display panel and the front cover and is dissipated through the front cover or housing.
[0016]
The details of the heat receiving head, which is a feature of the present invention, in the cooling liquid circulation type cooling system having the above configuration will be described below.
FIG. 2 is a top cross-sectional view of one embodiment of the present invention, and arrows indicate the magnitude and direction 22 of the flow rate of the refrigerant flowing through each flow path 21. FIG. 3B is a cross-sectional view taken along line AA of FIG. FIG. 3A shows the temperature distribution 24 of the base 23 of the heat receiving head in FIG. 3B by a solid line and the flow rate characteristic 25 of each flow path by a bar graph.
[0017]
As shown in FIG. 2, the heat receiving head is an embodiment of a flow path through which the refrigerant flows, a partition plate 26 forming the flow path, an outer frame 27, a base 23 in contact with the heating element, a top plate 28, and a temperature-sensitive flow rate limiting means. It is composed of a certain bimetal 29. The base, the outer frame, and the partition plate may be formed integrally, or may be formed independently of each other and then formed by bonding or the like. Further, they are preferably made of a metal having good heat conductivity. Further, the heat receiving head is provided with an inlet 30 through which the refrigerant flows into the heat receiving head and an outlet 31 through which the refrigerant whose heat has been removed from the heat receiving head flows out on the opposite side. The bimetal is formed by bonding a high expansion metal plate 32 having a large amount of expansion and contraction due to a temperature difference and a low expansion metal plate 33 having a small amount of expansion and contraction due to a temperature difference. As the temperature rises, the amount of extension on the high expansion metal side increases, so that the high expansion metal side is bent in a convex state.
The bimetal is attached to an outer frame or a partition plate with the high expansion metal side on the outflow side of each flow path and the inflow side of each flow path. The bimetal may be attached to the base or top plate.
[0018]
Hereinafter, the operation of the heat receiving head of the present invention will be described. When the CPU is started, the temperature of the base thermally connected to the CPU starts to rise. As shown in FIG. 2A, the temperature distribution has a peak just above the CPU and decreases toward the periphery. As the temperature of the heat receiving head and the temperature of the refrigerant in the heat receiving head rises, the temperature of the attached bimetal rises and starts to deform toward the outlet. The deformation of the bimetal attached to the high-temperature channel just above the CPU is large, and the deformation becomes small as it goes to the surroundings. Accordingly, since the flow path resistance of the flow path having a bimetal having large deformation decreases, the flow rate can be controlled to increase as the flow path becomes closer to the CPU where the temperature becomes higher. As a result, the flow rate of each flow path can be controlled as shown in the bar graph of FIG. 2A, and the flow rate of the hatched portion 34 can be reduced as compared with the case where the flow rate is not controlled. This eliminates the necessity of flowing an excessive flow rate, so that the capacity of the pump can be reduced. As described above, the size and power consumption of the pump can be reduced.
[0019]
If the required flow rate is known in advance, it is possible to arrange the partition plates of equal thickness as shown in FIG. It is. Further, it is also possible to realize the embodiment shown in FIG. 5 in which partition plates having different thicknesses are arranged at equal pitches.
[0020]
As shown in FIGS. 6 to 8, as another method of manufacturing heat receiving heads having different flow path cross-sectional areas, pipes 35 having different diameters of circular, elliptical or square shapes are arranged in a row in a row on a base, and heat conduction bonding is performed. There is also a method of forming by using an agent or soldering 36. According to this manufacturing method, since the flow path becomes the inner diameter of the pipe and is closed as the flow path, the top plate can be eliminated. Further, in the case of using a rectangular pipe, the contact surface with the CPU can be formed flat, so that the base is not required. 6 to 8 show cross sections taken along the line AA in FIG. 2 in the present embodiment.
[0021]
FIG. 9 shows an embodiment in which the present invention is applied to a modularized heating element 37. In this way, by using the heat receiving heads provided with the bimetals in the respective flow paths, even when the heating element 38 does not exist at the center of the heat receiving head or when the heat generation is distributed in the module, the cooling can be performed at a minimum necessary flow rate. Become. In addition, a module or the like may generate different heat-generating components depending on the function used. Even if the part A generates heat when using a certain function and the part B generates heat when using another function, the flow can be selectively and automatically concentrated at each time. Therefore, it can respond flexibly to heat generation.
[0022]
【The invention's effect】
As described above, according to the present invention, it is used in a liquid cooling system of an information processing apparatus in which a local heating element such as a CPU is arranged, such as a personal computer or a server, and efficiently removes heat from the local heating element to a radiator. It becomes possible to transport. Since cooling can be performed at a minimum necessary flow rate, the capacity of the pump can be reduced. As a result, miniaturization and power saving of the pump can be expected, and application to a smaller information processing device can be expected.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an overall configuration of a liquid cooling system for a notebook personal computer according to an embodiment of the present invention.
FIG. 2 is a diagram showing a first embodiment of the present invention.
FIG. 3 is a diagram illustrating a flow control operation according to the first embodiment of the present invention.
FIG. 4 is a view showing a second embodiment of the present invention.
FIG. 5 is a view showing a third embodiment of the present invention.
FIG. 6 is a view showing a fourth embodiment of the present invention.
FIG. 7 is a view showing a fifth embodiment of the present invention.
FIG. 8 is a view showing a sixth embodiment of the present invention.
FIG. 9 is a view showing a seventh embodiment of the present invention.
[Explanation of symbols]
1: body part, 2: display part, 3: motherboard, 4: CPU, 9: heat receiving head, 10: tube, 21: flow path, 22: size and direction of flow rate, 23: base, 24: temperature distribution, 25 : Flow characteristics of each flow path, 26: partition plate, 27: outer frame, 28: top plate, 29: bimetal, 30: inlet, 31: outlet, 32: high expansion metal plate, 33: low expansion metal Plate, 34: reducible flow rate, 35: pipe, 36: heat conductive adhesive or soldering, 37: module, 38: heating element,
Claims (4)
前記受熱ヘッドは複数の流路を有し、それぞれの流路の冷却液の流量制御手段を備えたことを特徴とする情報処理装置の液冷システム。In a liquid cooling system of an information processing apparatus, a heat receiving head through which a coolant flows in and out of at least one heat generating unit including a CPU is fixed, and heat generated by the heat generating unit is transmitted to the coolant to radiate heat.
A liquid cooling system for an information processing apparatus, wherein the heat receiving head has a plurality of flow paths and a flow rate control unit for a cooling liquid in each flow path.
前記流量制御手段は、冷却液温度あるいは受熱ヘッド温度を検出し流量制御をおこなうことを特徴とする情報処理装置の液冷システム。The liquid cooling system for an information processing apparatus according to claim 1,
A liquid cooling system for an information processing apparatus, wherein the flow control means detects a cooling liquid temperature or a heat receiving head temperature and performs flow control.
前記流量制御手段は、バイメタルあるいは形状記憶合金から成ることを特徴とする情報処理装置の液冷システム。The liquid cooling system for an information processing apparatus according to claim 2,
A liquid cooling system for an information processing apparatus, wherein the flow control means is made of a bimetal or a shape memory alloy.
前記流量制御手段は、円形又は楕円形又は四角形のそれぞれ異なる太さのパイプを組合せて形成されるか、異なる厚さの仕切り板を同一のピッチで形成されるか、
同一の厚さの仕切り板を異なるピッチで形成されるか、のいずれかの構造を有することを特徴とする情報処理装置の液冷システム。The liquid cooling system for an information processing apparatus according to claim 2,
The flow rate control means is formed by combining pipes of different diameters of circular or oval or square, or partition plates of different thickness are formed at the same pitch,
A liquid cooling system for an information processing apparatus, comprising a structure in which partition plates having the same thickness are formed at different pitches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003089679A JP2004295718A (en) | 2003-03-28 | 2003-03-28 | Liquid cooling system for information processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003089679A JP2004295718A (en) | 2003-03-28 | 2003-03-28 | Liquid cooling system for information processor |
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