JP2004174801A - Resin sealing device - Google Patents

Resin sealing device Download PDF

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Publication number
JP2004174801A
JP2004174801A JP2002341966A JP2002341966A JP2004174801A JP 2004174801 A JP2004174801 A JP 2004174801A JP 2002341966 A JP2002341966 A JP 2002341966A JP 2002341966 A JP2002341966 A JP 2002341966A JP 2004174801 A JP2004174801 A JP 2004174801A
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Japan
Prior art keywords
resin
cavity
substrate
resin material
sealing device
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JP2002341966A
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JP4326786B2 (en
Inventor
Hiroshi Uragami
浩 浦上
Takeru Nakagawa
長 中川
Kinya Fujino
欣也 藤野
Shinji Takase
慎二 高瀬
Hideki Tokuyama
秀樹 徳山
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing device which prevents a defect such as a void or a wire deformation from occurring during sealing a chip mounted on a substrate with a resin and uses a resin material effectively. <P>SOLUTION: A bottom force 1 is equipped with a cavity 5, a gas flow path 7 communicating with the cavity 5 and a heater 8. A top force 2 is equipped with a substrate mounting part 11 on which the substrate 14 is mounted and a gas flow path 13 which sucks the substrate 14. The chip 15 is mounted on the main face of the substrate 14 and the electrodes of the substrate 14 and the chip 15 are connected together by means of a wire 16. In addition, a conveying unit 3 for conveying a resin material 4 is installed between the bottom force 1 and the top force 2 in a freely advancing/receding manner. The resin material 4 is stamped to the size and shape of the cavity 5 and thermally melted into a molten resin 17 using a heater 8 after being arranged in the cavity 15. Next, the chip 15 and the wire 16 are soaked in the molten resin 17 after clamping the mold while the cavity 5 is decompressed by the gas flow path 7 and a molded object is formed by curing the molten resin 17. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体パッケージ等を製造する際に使用される樹脂封止装置に関するものである。
【０００２】
【従来の技術】
従来の、半導体パッケージ等のパッケージを製造する際の樹脂封止について、その概略を以下に示す。まず、半導体チップ等のチップ状の電子部品（以下「チップ」という。）が装着されたリードフレーム、プリント基板等や、Ｃｕによる再配線を施したシリコン基板等の半導体基板（以下総称して「基板」という。）を、相対向する金型群のうちの一方の金型に載置する。次に、金型群を型締めして、金型群が有するキャビティに、ランナ部及びゲート部と呼ばれる樹脂流路を順次経由して、溶融樹脂を加圧して注入する。次に、注入された溶融樹脂を硬化させて硬化樹脂を形成し、成形品を形成する。次に、金型を型開きした後に、成形品を取り出す（例えば、特許文献１参照）。更に、この成形品をダイシングして、最終製品であるパッケージを完成させる。
【０００３】
【特許文献１】
特開２００１−１３５６５８号公報（第５頁、図３）
【０００４】
【発明が解決しようとする課題】
しかしながら、上記従来の技術によれば、第１に、基板とチップとの電極同士がワイヤボンディングによって接続される構成においては、次のような問題が発生するおそれがある。近年における半導体チップの端子数の増大、チップのスタック化、パッケージの薄型化等による、ワイヤ長の長大化・ワイヤ間隔の狭小化という傾向に起因して、注入された溶融樹脂の流動によって、ワイヤの変形・切断・接触等の不良が発生するおそれがある。この問題の対策としては、溶融樹脂の注入速度を遅くすることが考えられる。しかし、この場合には、注入中において溶融樹脂の粘性が徐々に増加することから溶融樹脂中のガスが抜けにくくなるので、ボイド（気泡）や未充填部という不良が発生する原因になる。
第２に、近年、基板の種類やボンディングの有無・方式のいかんを問わず、コストダウンのために基板について大型化の要請が強くなっている。大型の基板においては、長距離を流動する溶融樹脂の粘性が増加しやすくなるので、ワイヤの変形等、ボイドや未充填部という不良がいっそう発生しやすくなっている。
第３に、樹脂流路における硬化樹脂は廃棄されるので、樹脂材料の有効利用を図ることができないという問題もある。
【０００５】
本発明は、上述の課題を解決するためになされたものであり、基板に装着されたチップを封止樹脂によって樹脂封止し、又は、再配線を施した基板を封止樹脂で覆って樹脂封止する際に、不良の発生を防止するとともに樹脂材料の有効利用を可能にする、樹脂封止装置を提供することを目的とする。
【０００６】
【課題を解決するための手段】
上述の技術的課題を解決するために、本発明に係る樹脂封止装置は、パッケージを製造する工程において、相対向する金型群と樹脂封止用の樹脂材料とを使用して、基板の主面において樹脂材料を溶融させて溶融樹脂を形成し、該溶融樹脂を硬化させて封止樹脂を形成する樹脂封止装置であって、金型群のうち上型における所定の位置に基板を搬送して載置する基板搬送手段と、金型群のうち下型に設けられているとともに主面の少なくとも一部が配設されるべきキャビティと、キャビティに樹脂材料を供給する樹脂材料供給手段と、下型に設けられ、キャビティに供給された樹脂材料を加熱して溶融させることにより溶融樹脂を生成する加熱手段と、金型群を型締め又は型開きするプレス手段と、少なくとも基板と封止樹脂とを有する成形品を取り出す成形品搬出手段とを備えるとともに、封止樹脂は、金型群が型締めされ主面の少なくとも一部がキャビティにおける溶融樹脂に浸漬された状態で、該溶融樹脂を硬化させることにより形成されたことを特徴とする。
【０００７】
これによれば、キャビティに供給された樹脂材料を加熱して生成した溶融樹脂に、基板の主面の少なくとも一部が浸漬した状態で、溶融樹脂が硬化する。これにより、基板の主面から見た溶融樹脂は、キャビティの深さ方向を短時間に流動するにすぎないので、キャビティ内の基板の全領域において均一かつ短時間に流動する。したがって、ボイドや未充填部等の不良の発生が防止される。また、基板の主面にワイヤが存在する場合においても、ワイヤに加えられる応力が低減されるので、ワイヤの変形等の不良の発生が防止される。また、樹脂流路が不要になり、樹脂流路に硬化樹脂が形成されることがないので、樹脂材料の有効利用が可能になる。
【０００８】
また、本発明に係る樹脂封止装置は、上述の樹脂封止装置において、樹脂材料はキャビティの寸法・形状に合わせて打錠されていることを特徴とする。
【０００９】
これによれば、下型に設けられたキャビティの寸法・形状に合わせて打錠されている樹脂材料に対して、下型に設けられた加熱手段からの熱が伝導しやすくなる。したがって、樹脂材料が短時間に軟化・溶融する。
【００１０】
また、本発明に係る樹脂封止装置は、上述の樹脂封止装置において、樹脂材料は所定の寸法に打錠されているとともに、キャビティの寸法・形状に合わせて複数個使用されていることを特徴とする。
【００１１】
これによれば、所定の寸法に打錠されている樹脂材料が、キャビティの寸法・形状に合わせて、すなわちキャビティの容積に合わせて、複数個使用される。これにより、異なる寸法・形状のキャビティに対して樹脂材料の個数を増減させることで対応できるので、樹脂材料の品種の削減が可能になる。したがって、樹脂材料の管理が容易になる。
【００１２】
また、本発明に係る樹脂封止装置は、上述の樹脂封止装置において、樹脂材料はキャビティの寸法・形状に合わせて所定量だけ供給される粒状体からなることを特徴とする。
【００１３】
これによれば、粒状体からなる樹脂材料が、キャビティの寸法・形状に合わせて、すなわち、キャビティの容積に合わせて、所定量だけ供給される。したがって、異なる寸法・形状のキャビティに対して、１種類の樹脂材料を発注・在庫すればよいので、樹脂材料の管理が極めて容易になる。
【００１４】
また、本発明に係る樹脂封止装置は、上述の樹脂封止装置において、樹脂材料供給手段は金型群の間においで進退可能に張設され離型性を有するフィルムからなるとともに、フィルムに樹脂材料が配設された状態で、フィルムがキャビティにおける型面に載置されることを特徴とする。
【００１５】
これによれば、キャビティの型面に対して、溶融樹脂が直接接触することに代わって、離型性を有するフィルムが接触する。したがって、キャビティの型面から、成形品が容易に離型する。
【００１６】
また、本発明に係る樹脂封止装置は、上述の樹脂封止装置において、基板は列状又は格子状に形成された複数の領域を有するとともに、該領域の各々がパッケージに対応することを特徴とする。
【００１７】
これによれば、１回の樹脂封止によって得られた成形品について、後工程でその成形品を切断することによって複数個のパッケージを得ることが可能になる。したがって、パッケージを製造する際の効率が、大幅に向上する。
【００１８】
【発明の実施の形態】
（第１の実施形態）
本発明の第１の実施形態に係る樹脂封止装置を、図１〜図３を参照して説明する。図１（Ａ），（Ｂ）は、本実施形態に係る樹脂封止装置において、キャビティに樹脂材料が供給される直前の状態と、樹脂材料が溶融して溶融樹脂が生成されて金型群が型締めする直前の状態とを、それぞれ示す部分断面図である。図２（Ａ），（Ｂ）は、金型群が型締めした状態であって、基板に装着されたチップが溶融樹脂に浸漬された状態と、溶融樹脂が硬化して硬化樹脂が形成された状態とを、それぞれ示す部分断面図である。図３は、金型群が型開きして成形品が搬出される直前の状態を示す部分断面図である。
【００１９】
図１に示されたように、本発明に係る樹脂封止装置には、相対向する金型群として、下型１と上型２とが設けられている。また、本装置には、下型１と上型２とを型締め又は型開きする、例えば、油圧、水圧、電動等によるプレス手段（図示なし）が設けられている。下型１と上型２との間には進退自在に搬送ユニット３が設けられており、この搬送ユニット３は、所定の寸法・形状に合わせて打錠された板状の樹脂材料４を、吸着して供給する。本実施形態においては、樹脂材料４は、キャビティ５の寸法・形状に合わせて、例えば、打錠することにより板状に成形されている。
【００２０】
下型１には、樹脂材料４が供給されて配設されるとともに、後述する溶融樹脂により充填されるキャビティ５が設けられている。また、下型１には、キャビティ５の側面の少なくとも１個所に連通して樹脂溜まり６が設けられ、樹脂溜まり６に連通して気体流路７が設けられている。この気体流路７は、配管とバルブとを介して減圧ポンプ（いずれも図示なし）に接続され、必要に応じて、例えば、圧縮空気タンクのような加圧源（図示なし）にも接続されている。更に、下型１におけるキャビティ５の近傍には、キャビティ５及びその周辺を加熱するためのヒータ８が設けられている。
【００２１】
ここで、樹脂材料４は、加熱されることにより溶融・硬化する熱硬化性樹脂から構成されている。また、樹脂材料４は、キャビティ５の寸法・形状に合わせて打錠されているので、配設された状態でキャビティ５における型面に密着する。本実施形態では、キャビティ５の上部における型締め部９に段差１０を設け、樹脂材料４を、この段差１０に合わせた形状に打錠している。
【００２２】
上型２には、凹状の基板載置部１１が設けられており、その基板載置部１１の底面（図では上側）には、更に吸着用凹部１２が設けられている。吸着用凹部１２には気体流路１３がつながっており、気体流路１３は、配管とバルブとを介して減圧ポンプ（いずれも図示なし）に接続されている。基板載置部１１には、基板１４が、気体流路１３によって吸着されている。基板１４は、格子状の複数の領域に分割されており、基板１４の主面における各領域にはチップ１５がそれぞれ装着され、基板１４と各チップ１５との電極同士（いずれも図示なし）は、ワイヤ１６によって電気的に接続されている。
【００２３】
以下、本実施形態に係る樹脂封止装置の動作を説明する。まず、図１（Ａ）に示すように、下型１と上型２とが型開きした状態で、基板搬送手段（図示なし）を使用して基板載置部１１に基板１４を載置し、気体流路１３によりこれを吸着する。また、搬送ユニット３を使用して、樹脂材料４を、吸着によって固定し、キャビティ５の真上まで搬送し、吸着を解除して落下させ、又は、搬送ユニット３を下降させ吸着を解除して、キャビティ５における型面の上に供給して配設する。
ここで、搬送ユニット３を適当な形状にすることにより、図示されていない基板搬送手段と搬送ユニット３とを共用することができる。
【００２４】
次に、図１（Ｂ）に示すように、ヒータ８によって樹脂材料４を加熱して溶融させ、溶融樹脂１７を生成し、ワイヤ１６が溶融樹脂１７の表面付近に位置するまで上型２を下降させる。これら加熱以降の一連の動作を、気体流路７を使用して下型１・上型２間の空間を減圧しながら行う。
【００２５】
次に、図２（Ａ）に示すように、引き続き下型１・上型２間の空間を減圧しながら、上型２を更に下降させて下型１と上型２とを型締めする。これにより、チップ１５とワイヤ１６とを溶融樹脂１７の中に浸漬させる。ここで、図１（Ａ）のキャビティ５を含む雰囲気が気体流路７を介して減圧されるので、溶融樹脂１７中のボイドが脱泡されて除去される。また、キャビティ５から溢れた溶融樹脂１７は、樹脂溜まり６に流れ込む。
【００２６】
次に、図２（Ｂ）に示すように、引き続きヒータ８によって溶融樹脂１７を加熱し硬化させて、硬化樹脂１８を形成する。この硬化樹脂１８と基板１４とは、図２（Ａ）に示されているチップ１５とワイヤ１６とも併せて、成形品１９を構成する。
【００２７】
次に、図３に示すように、上型２を上昇させて下型１と上型２とを型開きし、下型１から成形品１９を取り出す。また、必要に応じて、気体流路７を経由して圧縮空気を噴出させることにより、樹脂溜まり６において硬化した樹脂を下型１から離型させることもできる。その後に、気体流路１３による吸着を解除して、成形品１９をその下方に挿入された搬送ユニット３に引き渡し、搬送ユニット３を使用して成形品１９をトレイ等の収納手段又は次工程に搬送する。そして、成形品がダイシングされることにより、最終製品である各領域ごとのパッケージが完成する。
【００２８】
本実施形態の特徴は、キャビティ５の寸法・形状に合わせて打錠された樹脂材料４を加熱して、キャビティ５に予め溶融樹脂１７が短時間に形成されることである。また、その溶融樹脂１７の中に、キャビティ５を含む空間を減圧しながら下型１と上型２とを型締めすることにより、基板１４に装着されたチップ１５とワイヤ１６とが浸漬されることである。
これらにより、第１に、基板１４から見た溶融樹脂１７は、キャビティ５の深さ方向を短時間に流動するにすぎないので、キャビティ５内の基板１４の全領域において均一かつ短時間に流動する。第２に、ワイヤ１６から見た溶融樹脂１７は、ワイヤ１６のループを倒す方向又は変形させやすい方向には流動せず、最もループを変形させにくい方向、すなわちループを低くする方向に流動する。第３に、溶融樹脂１７中に存在するボイドが、脱泡されて除去される。
【００２９】
したがって、本実施形態によれば、キャビティ５内における基板１４の全領域において、キャビティ５の深さ方向に、均一かつ短時間に溶融樹脂１７が流動するので、溶融樹脂１７の粘度等の特性が変化しにくくなるとともに、ワイヤ１６に対して過大な外力が加わらない。このことにより、大型の基板１４を使用する場合においても、ボイド、未充填部、ワイヤ１６の変形等の不良の発生が防止されるとともに、短時間で樹脂封止が行われる。また、樹脂流路が不要になり、樹脂流路に不要な硬化樹脂が形成されることがないので、樹脂材料の有効利用が可能になる。また、予め打錠された樹脂材料４を使用することにより、樹脂材料４自体に含まれるガスが低減されるので、このことによっても溶融樹脂１７におけるボイドの発生が防止される。更に、キャビティ５を含む雰囲気が減圧されるので、このことによっても溶融樹脂１７におけるボイドの発生が防止される。
【００３０】
（第２の実施形態）
本発明の第２の実施形態に係る樹脂封止装置を、図４を参照して説明する。図４（Ａ），（Ｂ）は、本実施形態に係る樹脂封止装置において、キャビティに樹脂材料が供給される直前の状態と、樹脂材料が溶融し溶融樹脂が生成され金型群が型締めする直前の状態とを、それぞれ示す部分断面図である。
【００３１】
本実施形態によれば、図４（Ａ）に示されたように、第１の実施形態における樹脂材料４（図１参照）に代えて、キャビティ５の大きさに対して十分小さい所定の寸法に打錠された円板状の樹脂材料２０を、複数個使用する。この樹脂材料２０は、キャビティ５の寸法・形状に合わせて、すなわちキャビティ５の容積に合わせて、適当な個数だけ使用される。
【００３２】
以下、本実施形態に係る樹脂封止装置の動作を説明する。まず、図４（Ａ）に示すように、円板状の樹脂材料２０を、キャビティ５の容積に合わせた適当な個数だけ、キャビティ５の型面上に供給して配設する。
【００３３】
次に、図４（Ｂ）に示すように、樹脂材料２０を、下型１・上型２間の空間が減圧されている状態で加熱して溶融させる。以下、第１の実施形態の図２（Ａ）と同様に、下型１と上型２とを型締めすることにより、チップ１５とワイヤ１６とを溶融樹脂１７の中に浸漬させる。その後に、図２（Ｂ）と同様に、溶融樹脂１７を硬化させることにより成形品１９を形成する。そして、図３と同様に、成形品１９を取り出してトレイ等の収納手段又は次工程に搬送する。
【００３４】
本実施形態によれば、第１の実施形態と同様に、溶融樹脂１７がキャビティ５内の基板１４の全領域において均一かつ短時間に流動する。したがって、大型の基板１４においても、ボイド、未充填部、ワイヤ１６の変形等の不良の発生が防止されるとともに、樹脂材料の有効利用が可能になる。
更に、キャビティ５の大きさに対して十分小さい所定の寸法に打錠された樹脂材料２０を、複数個使用する。これにより、異なる寸法・形状を有する複数の種類のキャビティ５に対して、図１の樹脂材料４をその種類に応じた品種だけ用意することに代えて、樹脂材料２０の個数を増減させることによって対応することができる。したがって、樹脂材料の品種を削減することができるので、樹脂材料の発注管理・在庫管理等が容易になる。
【００３５】
なお、本実施形態では、複数個使用する樹脂材料２０の形状を円板状とした。これに限らず、三角形、四角形、六角形等の多角形、特に正多角形の形状を有する樹脂材料２０を使用することもできる。
【００３６】
（第３の実施形態）
本発明の第３の実施形態に係る樹脂封止装置を、図５を参照して説明する。図５（Ａ），（Ｂ）は、本実施形態に係る樹脂封止装置において、キャビティに樹脂材料が供給される直前の状態と、樹脂材料が供給された直後の状態とを、それぞれ示す部分断面図である。
【００３７】
本実施形態に係る樹脂封止装置によれば、図５（Ａ），（Ｂ）に示されたように、第１の実施形態における樹脂材料４（図１参照）に代えて、顆粒樹脂のような粒状体からなる樹脂材料２１が、キャビティ５の寸法・形状に合わせて、すなわちキャビティ５の容積に合わせて、キャビティ５に所定量だけ供給される。その際には、図５（Ｂ）に示されたように、樹脂材料２１が均一に加熱され短時間に溶融するように、樹脂材料２１がキャビティ５に均一に堆積することが好ましい。そこで、本実施形態に係る樹脂封止装置には、図５（Ａ）に示された樹脂材料供給ユニット２２が設けられている。
【００３８】
図５（Ａ），（Ｂ）に示されたように、樹脂材料供給ユニット２２は、樹脂材料２１が貯留される貯留箱２３と、貯留箱２３の底板に近接して設けられたシャッタ板２４とから構成されている。貯留箱２３の底板には複数の開口２５が、シャッタ板２４には複数の開口２６が、同じピッチでそれぞれ設けられている。これらの開口２５，２６の断面形状は、樹脂材料２１の粒径や表面状態に応じて、下側が狭まっているテーパ状になっていてもよい。
【００３９】
以下、本実施形態に係る樹脂封止装置の動作を説明する。まず、図５（Ａ）に示すように、シャッタ板２４により貯留箱２３の開口２５が閉鎖された状態で、貯留箱２３に、キャビティ５の容積に合わせて計量された、所定量の樹脂材料２１を供給する。この場合において、樹脂材料２１の粒径や表面状態に応じて、樹脂材料供給ユニット２２に振動素子（図示なし）を設けて、樹脂材料供給ユニット２２を振動させてもよい。これにより、樹脂材料２１を、貯留箱２３において均一に堆積するようにして供給することができる。
【００４０】
次に、図５（Ｂ）に示すように、シャッタ板２４を水平移動させ、貯留箱２３の開口２５とシャッタ板２４の開口２６とが重なるようにして、キャビティ５に樹脂材料２１を落下させる。この場合においても、振動素子を使用して、樹脂材料供給ユニット２２を振動させることができる。これにより、樹脂材料２１を、キャビティ５において均一に堆積するようにして供給することができる。以下、第１の実施形態と同様に、樹脂材料２１を、下型１・上型２間の空間が減圧されている状態で溶融させる。そして、図２（Ｂ）と同様に、溶融樹脂を硬化させて成形品を形成し、図３と同様に、成形品を取り出してトレイ等の収納手段又は次工程に搬送する。
【００４１】
本実施形態によれば、第１の実施形態と同様に、溶融樹脂がキャビティ５内の基板１４の全領域において均一かつ短時間に流動する。したがって、大型の基板１４においても、ボイド、未充填部、ワイヤ１６の変形等の不良の発生が防止されるとともに、樹脂材料の有効利用が可能になる。
更に、キャビティ５の容積に合わせて計量された、所定量の樹脂材料２１が、キャビティ５に供給される。これにより、異なる形状・寸法を有するキャビティ５に対して、図１の樹脂材料４を複数の品種だけ用意することに代えて、粒状体からなる樹脂材料２１の供給量を増減させることにより対応することができる。したがって、１品種の樹脂材料２１を使用した樹脂封止が可能になるので、樹脂材料の発注管理・在庫管理等が極めて容易になる。
【００４２】
（第４の実施形態）
本発明の第４の実施形態に係る樹脂封止装置を、図６を参照して説明する。本実施形態は、硬化した後に基板に対する密着性が大きい樹脂材料の使用と、パッケージの薄型化という、近年の要請に対応するものである。図６（Ａ），（Ｂ）は、本実施形態に係る樹脂封止装置において、樹脂材料がキャビティに供給される前に搬送されている状態と、樹脂材料がキャビティに供給された直後の状態とを、それぞれ示す部分断面図である。
【００４３】
本実施形態に係る樹脂封止装置によれば、図６（Ａ）に示されたように、下型１と上型２との間に、離型性を有するフィルム２７が張設される。そして、そのフィルム２７の上に、キャビティ５の大きさに対して十分小さい所定の寸法に打錠された円板状の樹脂材料２０が、配設されている。下型２には、フィルム２７を吸着するための気体流路２８が設けられている。
【００４４】
このフィルム２７は、耐熱性と離型性とを有する材料から構成されており、いわゆるｒｏｌｌ−ｔｏ−ｒｏｌｌ方式により金型間において張設されている。また、フィルム２７の材料は、例えば、四フッ化エチレン（ＰＴＦＥ），エチレン−四フッ化エチレン（ＥＴＦＥ），ポリエチレンテレフタレート（ＰＥＴ），ポリ四フッ化−六フッ化エチレン（ＦＥＰ），ポリプロピレン（ＰＰ），ポリ塩化ビニリデン（ＰＢＤＣ）や、フッ素含浸ガラスクロス等である。
【００４５】
以下、本実施形態に係る樹脂封止装置の動作を説明する。まず、下型１と上型２との金型間の外側で、円板状の樹脂材料２０を、キャビティ５の容積に合わせた適当な個数だけフィルム２７の上に供給する。
【００４６】
次に、図６（Ａ）に示すように、フィルム２７上に樹脂材料２０が配設された状態で、複数の樹脂材料２０がキャビティ５の真上に位置するまで、フィルム２７を巻き取って移動させる。
【００４７】
次に、図６（Ｂ）に示すように、フィルム２７を下降させて、フィルム２７を介してキャビティ５の型面上に複数個の樹脂材料２０を配設する。これにより、キャビティ５に樹脂材料２０が供給される。したがって、この工程におけるフィルム２７は、樹脂材料供給手段として機能する。また、適当な張力を加えながらフィルム２７を下降させ、キャビティ５内において、気体流路２８によってフィルム２７を吸着する。これにより、フィルム２７は、しわが生じることなくキャビティ５の型面に密着する。
【００４８】
以下、第１の実施形態の図１（Ｂ）と同様に、樹脂材料２０を、下型１・上型２間の空間が減圧されている状態で加熱して溶融させる。その後に、第１の実施形態の図２（Ａ）と同様に、型締めすることによりチップ１５とワイヤ１６とを溶融樹脂１７の中に浸漬させ、図２（Ｂ）と同様に、溶融樹脂１７を硬化させることにより成形品１９を形成する。そして、図３と同様に、成形品１９を、離型性を有するフィルム２７から引き離して下型１から取り出し、これをトレイ等の収納手段又は次工程に搬送する。
【００４９】
本実施形態によれば、第１の実施形態と同様に、溶融樹脂１７がキャビティ５内の基板１４の全領域において均一かつ短時間に流動する。したがって、大型の基板１４においても、ボイド、未充填部、ワイヤ１６の変形等の不良の発生が防止されるとともに、樹脂材料の有効利用が可能になる。更に、第２の実施形態と同様に、樹脂材料の品種を削減することができるので、樹脂材料の発注管理・在庫管理等が容易になる。加えて、フィルム２７を使用することにより、成形品１９とキャビティ５の型面との間の離型性が向上する。
【００５０】
なお、本実施形態では、複数個使用する樹脂材料２０の形状を円板状とした。これに限らず、多角形の形状を有する樹脂材料２０を使用してもよく、粒状体の樹脂材料（図５の樹脂材料２１）を使用することもできる。
【００５１】
なお、ここまでの各実施形態においては、型締め部９において、例えば、シリコーン樹脂からなるシール部材を、下型１又は上型２に設けられた凹部に嵌装してもよい。このシール部材としては、四角形又は円形の断面を有する枠状の部材を使用することができる。
【００５２】
また、相対向する金型群のうち下型１を、次のように分割した構成にしてもよい。すなわち、下型１を、キャビティ５を有するキャビティブロックとその周りに位置する周辺ブロックとに分割して、キャビティブロックを昇降自在の構成にするとともに、基板１４の外周部が周辺ブロックによって保持される構成にしてもよい。この場合には、図２（Ｂ）の段階で、硬化樹脂１８が形成された後にキャビティブロックを下降させて、基板１４の外周部が周辺ブロックによって保持された状態で、下型１の側から成形品１９を離型する。したがって、基板１４に対する硬化後の密着強度が大きい溶融樹脂１７を使用した場合においても、チップ１５とワイヤ１６とに大きな応力が加わることなく、成形品１９を下型１の側から離型することができる。
【００５３】
また、樹脂材料４，２０，２１を熱硬化性樹脂から構成されることとした。これに限らず、樹脂材料４，２０，２１を、熱可塑性樹脂から構成されることとしてもよい。この場合には、樹脂材料４，２０，２１を加熱溶融して型締めした後に、金型温度を下げて溶融樹脂を硬化させることになる。
【００５４】
また、減圧ポンプ（図示なし）を設けて、キャビティ５を含む空間を減圧することとした。これに限らず、樹脂材料４，２０，２１に含まれるガスの量や成形品１９に要求される品質等との関係で、減圧ポンプを使用しない構成を採用することも可能である。
【００５５】
また、基板１４とチップ１５との電極同士を電気的に接続するための導電性材料として、ワイヤ１６を使用した。これに限らず、基板１４の主面に設けられた電極とチップ１５の電極とを相対向させて電気的に接続する、いわゆるフリップチップの構成に対して本発明を適用することもできる。
【００５６】
また、本発明が適用される基板１４は、格子状の複数の領域に分割され、基板１４の主面における各領域には、チップ１５がそれぞれ装着されているものとした。この基板１４としては、パッケージになるべき領域が列状又は格子状に設けられていればよい。また、基板１４の形状としては、円形，正方形、長方形（短冊状）、その他の多角形のいずれであってもよい。また、円形は、完全な円形の他に、完全な円形の一部が切り落とされて除去された形状や、切り欠き部（ノッチ）等が設けられている形状であってもよい。
【００５７】
また、本発明が適用される基板１４の材質としては、リードフレームのような金属でもよく、通常のプリント基板のような樹脂ベースのものであってもよい。また、金属ベース基板や、セラミック基板に対して、本発明を適用してもよい。更に、シリコン基板，化合物半導体基板，ＳＯＩ基板等の半導体基板であって、それらの主面にＣｕ等を使用して再配線した、いわゆるウエーハレベルパッケージ用の基板に対しても、本発明を適用することができる。
【００５８】
また、基板１４としては、半導体基板以外に、例えば、チップコンデンサ等の半導体以外の電子部品を製造する際に使用される基板に対しても、本発明を適用することができる。
【００５９】
また、１枚の基板１４を、上型２に吸着して固定した。これに限らず、１枚又は複数枚の基板を四角形又は円形の枠状の治具に固定して、基板と一体になった状態でその治具を上型２に固定してもよい。このような治具を使用することにより、現在使用している短冊形のリードフレームやプリント基板についても、それらの異なる品種に対して共通の基板載置部１１で、すなわち共通の上型２で対応することができる。また、各品種について、複数枚を同時に処理することができる。
【００６０】
また、本発明は、上述の各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。
【００６１】
【発明の効果】
本発明によれば、キャビティに供給された樹脂材料を加熱して生成した溶融樹脂に、基板の主面の少なくとも一部を浸漬させることによって、その主面に封止樹脂が形成される。これにより、基板の主面から見た溶融樹脂は、キャビティの深さ方向を短時間に流動するにすぎないので、キャビティ内の基板の全領域において均一かつ短時間に流動する。したがって、ボイドや未充填部等の不良の発生が防止される。また、基板の主面にワイヤが存在する場合においても、ワイヤの変形等の不良の発生が防止される。
更に、樹脂流路が不要になり、樹脂流路に硬化樹脂が形成されることがないので、樹脂材料の有効利用が可能になる。
加えて、所定の寸法に打錠された樹脂材料、又は粒状体からなる樹脂材料が、キャビティの容積に合わせて、所定の個数又は量だけキャビティに供給される。これにより、異なる寸法・形状のキャビティに対して、少ない品種の樹脂材料を使用して対応できる。したがって、樹脂材料の管理が容易になる。
したがって、本発明は、不良の発生を防止し、樹脂材料の有効利用が可能になるとともに、樹脂材料の管理が容易になる樹脂封止装置を提供することができるという、優れた実用的な効果を奏するものである。
【図面の簡単な説明】
【図１】（Ａ），（Ｂ）は、本発明の第１の実施形態に係る樹脂封止装置において、キャビティに樹脂材料が供給される直前の状態と、樹脂材料が溶融し溶融樹脂が生成され金型群が型締めする直前の状態とを、それぞれ示す部分断面図である。
【図２】（Ａ），（Ｂ）は、本発明の第１の実施形態に係る樹脂封止装置において、金型群が型締めした状態であって、基板に装着されたチップが溶融樹脂に浸漬された状態と、溶融樹脂が硬化して硬化樹脂が形成された状態とを、それぞれ示す部分断面図である。
【図３】本発明の第１の実施形態に係る樹脂封止装置において、金型群が型開きして成形品が搬出される直前の状態を示す部分断面図である。
【図４】（Ａ），（Ｂ）は、本発明の第２の実施形態に係る樹脂封止装置において、キャビティに樹脂材料が供給される直前の状態と、樹脂材料が溶融し溶融樹脂が生成され金型群が型締めする直前の状態とを、それぞれ示す部分断面図である。
【図５】（Ａ），（Ｂ）は、本発明の第３の実施形態に係る樹脂封止装置において、キャビティに樹脂材料が供給される直前の状態と、樹脂材料が供給された直後の状態とを、それぞれ示す部分断面図である。
【図６】（Ａ），（Ｂ）は、本発明の第４の実施形態に係る樹脂封止装置において、樹脂材料がキャビティに供給される前に搬送されている状態と、樹脂材料がキャビティに供給された直後の状態とを、それぞれ示す部分断面図である。
【符号の説明】
１ 下型
２ 上型
３ 搬送ユニット（樹脂材料供給手段，成形品搬出手段）
４，２０ 樹脂材料
５ キャビティ
６ 樹脂溜まり
７，１３，２８ 気体流路
８ ヒータ（加熱手段）
９ 型締め部
１０ 段差
１１ 基板載置部
１２ 吸着用凹部
１４ 基板
１５ チップ
１６ ワイヤ
１７ 溶融樹脂
１８ 硬化樹脂
１９ 成形品
２１ 樹脂材料（粒状体）
２２ 樹脂材料供給ユニット（樹脂材料供給手段）
２３ 貯留箱
２４ シャッタ板
２５，２６ 開口
２７ フィルム（樹脂材料供給手段）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin sealing device used when manufacturing a semiconductor package or the like.
[0002]
[Prior art]
The outline of the conventional resin sealing at the time of manufacturing a package such as a semiconductor package is shown below. First, a lead frame, a printed board, or the like on which a chip-shaped electronic component (hereinafter, referred to as a “chip”) such as a semiconductor chip is mounted, or a semiconductor substrate (hereinafter, collectively referred to as “silicon substrate” on which rewiring is performed using Cu) A substrate is placed on one of the opposing mold groups. Next, the mold group is clamped, and the molten resin is pressurized and injected into a cavity of the mold group via a resin flow path called a runner portion and a gate portion in sequence. Next, the injected molten resin is cured to form a cured resin, thereby forming a molded product. Next, after opening the mold, the molded product is taken out (for example, see Patent Document 1). Further, the molded product is diced to complete a package as a final product.
[0003]
[Patent Document 1]
JP 2001-135658 A (page 5, FIG. 3)
[0004]
[Problems to be solved by the invention]
However, according to the above-described conventional technology, first, in a configuration in which electrodes of a substrate and a chip are connected by wire bonding, the following problem may occur. Due to the trend of longer wire length and narrower wire spacing due to the recent increase in the number of terminals of semiconductor chips, stacking of chips, thinning of packages, etc., the flow of injected molten resin has There is a possibility that defects such as deformation, cutting, contact, etc. may occur. As a countermeasure against this problem, it is conceivable to reduce the injection speed of the molten resin. However, in this case, since the viscosity of the molten resin gradually increases during the injection, it becomes difficult for the gas in the molten resin to escape, thereby causing defects such as voids (bubbles) and unfilled portions.
Second, in recent years, regardless of the type of substrate, the presence / absence of bonding, and the method, there has been a strong demand for larger substrates for cost reduction. In the case of a large-sized substrate, the viscosity of the molten resin flowing over a long distance tends to increase, so that defects such as voids and unfilled portions such as deformation of a wire are more likely to occur.
Third, since the cured resin in the resin flow path is discarded, there is also a problem that the resin material cannot be effectively used.
[0005]
The present invention has been made to solve the above-described problem, and a chip mounted on a substrate is resin-sealed with a sealing resin, or a substrate on which rewiring has been performed is covered with a sealing resin. An object of the present invention is to provide a resin sealing device that prevents the occurrence of defects and enables effective use of a resin material when sealing.
[0006]
[Means for Solving the Problems]
In order to solve the above-mentioned technical problem, the resin sealing device according to the present invention uses a mold group and a resin material for resin sealing that face each other in a process of manufacturing a package, and forms a substrate. A resin sealing device for melting a resin material on a main surface to form a molten resin and curing the molten resin to form a sealing resin, wherein a substrate is placed at a predetermined position in an upper mold of a mold group. A substrate transfer means for transferring and mounting, a cavity provided in the lower mold of the mold group and at least a part of the main surface to be disposed, and a resin material supply means for supplying a resin material to the cavity Heating means provided in the lower mold to generate a molten resin by heating and melting the resin material supplied to the cavity; press means for clamping or opening the mold group; and sealing at least the substrate. Molding with resin The molding resin is formed by curing the molten resin while the mold group is clamped and at least a part of the main surface is immersed in the molten resin in the cavity. It is characterized by having been done.
[0007]
According to this, the molten resin is cured while at least a part of the main surface of the substrate is immersed in the molten resin generated by heating the resin material supplied to the cavity. Thereby, the molten resin viewed from the main surface of the substrate flows only in a short time in the depth direction of the cavity, and thus flows uniformly and in a short time in the entire region of the substrate in the cavity. Therefore, occurrence of defects such as voids and unfilled portions is prevented. Further, even when the wires are present on the main surface of the substrate, the stress applied to the wires is reduced, so that occurrence of defects such as deformation of the wires is prevented. Further, a resin flow path is not required, and a cured resin is not formed in the resin flow path, so that the resin material can be effectively used.
[0008]
The resin sealing device according to the present invention is characterized in that, in the above-described resin sealing device, the resin material is tableted in accordance with the size and shape of the cavity.
[0009]
According to this, the heat from the heating means provided in the lower mold is easily conducted to the resin material tableted according to the size and shape of the cavity provided in the lower mold. Therefore, the resin material softens and melts in a short time.
[0010]
In the resin sealing device according to the present invention, in the resin sealing device described above, the resin material is tableted to a predetermined size and a plurality of resin materials are used according to the size and shape of the cavity. Features.
[0011]
According to this, a plurality of resin materials compressed to a predetermined size are used according to the size and shape of the cavity, that is, according to the volume of the cavity. Accordingly, the number of resin materials can be increased or decreased for cavities having different sizes and shapes, so that the types of resin materials can be reduced. Therefore, management of the resin material becomes easy.
[0012]
Further, a resin sealing device according to the present invention is characterized in that, in the above-described resin sealing device, the resin material is formed of a granular material supplied in a predetermined amount according to the size and shape of the cavity.
[0013]
According to this, the resin material composed of the granular material is supplied in a predetermined amount according to the size and shape of the cavity, that is, according to the volume of the cavity. Therefore, it is only necessary to order and stock one type of resin material for cavities having different dimensions and shapes, which greatly facilitates the management of the resin material.
[0014]
Further, in the resin sealing device according to the present invention, in the above-described resin sealing device, the resin material supply means is formed of a film having a releasability that is stretched so as to be able to advance and retreat between the mold groups, The film is placed on the mold surface in the cavity while the resin material is provided.
[0015]
According to this, instead of the molten resin being in direct contact with the mold surface of the cavity, the film having releasability comes into contact. Therefore, the molded product is easily released from the mold surface of the cavity.
[0016]
The resin sealing device according to the present invention is characterized in that, in the above-described resin sealing device, the substrate has a plurality of regions formed in a row or a lattice, and each of the regions corresponds to a package. And
[0017]
According to this, it is possible to obtain a plurality of packages by cutting the molded product in a subsequent step with respect to the molded product obtained by one resin sealing. Therefore, the efficiency in manufacturing the package is greatly improved.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
A resin sealing device according to a first embodiment of the present invention will be described with reference to FIGS. FIGS. 1A and 1B show a state immediately before a resin material is supplied to a cavity and a mold group formed by melting a resin material to generate a molten resin in a resin sealing device according to the present embodiment. FIG. 2 is a partial sectional view showing a state immediately before mold clamping. 2A and 2B show a state in which the mold group is clamped, in which the chip mounted on the substrate is immersed in the molten resin, and the molten resin is cured to form a cured resin. FIG. 3 is a partial cross-sectional view showing a state in which the cover is folded. FIG. 3 is a partial cross-sectional view showing a state immediately before a mold group is opened and a molded product is carried out.
[0019]
As shown in FIG. 1, the resin sealing device according to the present invention includes a lower mold 1 and an upper mold 2 as opposing mold groups. Further, the apparatus is provided with press means (not shown) for clamping or opening the lower mold 1 and the upper mold 2 by, for example, hydraulic pressure, hydraulic pressure, electric power, or the like. A transport unit 3 is provided between the lower mold 1 and the upper mold 2 so as to be able to advance and retreat, and the transport unit 3 is provided with a plate-shaped resin material 4 that has been compressed to a predetermined size and shape. Supply by suction. In the present embodiment, the resin material 4 is formed into a plate shape by, for example, tableting according to the size and shape of the cavity 5.
[0020]
The lower mold 1 is provided with a cavity 5 into which a resin material 4 is supplied and arranged, and which is filled with a molten resin described later. The lower mold 1 is provided with a resin reservoir 6 communicating with at least one portion of the side surface of the cavity 5, and is provided with a gas passage 7 communicating with the resin reservoir 6. The gas flow path 7 is connected to a pressure reducing pump (both not shown) through a pipe and a valve, and is connected to a pressurizing source (not shown) such as a compressed air tank as required. ing. Further, a heater 8 for heating the cavity 5 and its periphery is provided near the cavity 5 in the lower mold 1.
[0021]
Here, the resin material 4 is made of a thermosetting resin that is melted and hardened by being heated. In addition, since the resin material 4 is tableted according to the size and shape of the cavity 5, the resin material 4 comes into close contact with the mold surface in the cavity 5 in a state where the resin material 4 is provided. In the present embodiment, a step 10 is provided in the mold clamping portion 9 above the cavity 5, and the resin material 4 is tableted into a shape corresponding to the step 10.
[0022]
The upper die 2 is provided with a concave substrate mounting portion 11, and a suction concave portion 12 is further provided on the bottom surface (the upper side in the figure) of the substrate mounting portion 11. A gas flow path 13 is connected to the suction concave portion 12, and the gas flow path 13 is connected to a pressure reducing pump (both not shown) via a pipe and a valve. A substrate 14 is adsorbed on the substrate mounting part 11 by a gas flow path 13. The substrate 14 is divided into a plurality of grid-like regions. Chips 15 are mounted on respective regions on the main surface of the substrate 14, and electrodes of the substrate 14 and the respective chips 15 (both not shown) are connected to each other. , Wires 16.
[0023]
Hereinafter, the operation of the resin sealing device according to the present embodiment will be described. First, as shown in FIG. 1 (A), the substrate 14 is placed on the substrate placing part 11 by using a substrate carrying means (not shown) in a state where the lower mold 1 and the upper mold 2 are opened. This is adsorbed by the gas flow path 13. In addition, using the transfer unit 3, the resin material 4 is fixed by suction, transferred to a position directly above the cavity 5, and released and dropped, or the transfer unit 3 is lowered to release the suction. , Is supplied and arranged on the mold surface in the cavity 5.
Here, by forming the transfer unit 3 in an appropriate shape, a substrate transfer unit (not shown) and the transfer unit 3 can be shared.
[0024]
Next, as shown in FIG. 1B, the resin material 4 is heated and melted by the heater 8 to generate a molten resin 17, and the upper die 2 is moved until the wire 16 is positioned near the surface of the molten resin 17. Lower it. A series of operations after the heating are performed while depressurizing the space between the lower mold 1 and the upper mold 2 using the gas flow path 7.
[0025]
Next, as shown in FIG. 2A, the upper mold 2 is further lowered while the space between the lower mold 1 and the upper mold 2 is further depressurized, and the lower mold 1 and the upper mold 2 are clamped. Thereby, the chip 15 and the wire 16 are immersed in the molten resin 17. Here, since the atmosphere including the cavity 5 in FIG. 1A is depressurized through the gas flow path 7, voids in the molten resin 17 are defoamed and removed. Further, the molten resin 17 overflowing from the cavity 5 flows into the resin pool 6.
[0026]
Next, as shown in FIG. 2B, the molten resin 17 is subsequently heated and cured by the heater 8 to form a cured resin 18. The cured resin 18 and the substrate 14 together with the chip 15 and the wire 16 shown in FIG.
[0027]
Next, as shown in FIG. 3, the upper mold 2 is lifted to open the lower mold 1 and the upper mold 2, and the molded article 19 is taken out from the lower mold 1. Further, if necessary, the resin cured in the resin reservoir 6 can be released from the lower mold 1 by jetting compressed air through the gas flow path 7. Thereafter, the adsorption by the gas flow path 13 is released, and the molded article 19 is delivered to the transport unit 3 inserted below the molded article 19, and the molded article 19 is transferred to the storage means such as a tray or the next step using the transport unit 3. Transport. Then, by dicing the molded product, a package for each region as a final product is completed.
[0028]
The feature of the present embodiment is that the resin material 4 tableted according to the size and shape of the cavity 5 is heated, and the molten resin 17 is previously formed in the cavity 5 in a short time. The chip 15 and the wire 16 mounted on the substrate 14 are immersed in the molten resin 17 by clamping the lower mold 1 and the upper mold 2 while reducing the space including the cavity 5. That is.
First, the molten resin 17 viewed from the substrate 14 flows only in a short time in the depth direction of the cavity 5, and thus flows uniformly and in a short time in the entire region of the substrate 14 in the cavity 5. I do. Second, the molten resin 17 viewed from the wire 16 does not flow in a direction in which the loop of the wire 16 is inclined or easily deformed, but flows in a direction in which the loop is hardly deformed, that is, a direction in which the loop is lowered. Third, voids existing in the molten resin 17 are removed by defoaming.
[0029]
Therefore, according to the present embodiment, the molten resin 17 flows uniformly and in a short time in the depth direction of the cavity 5 in the entire region of the substrate 14 in the cavity 5, so that the characteristics such as the viscosity of the molten resin 17 are reduced. It does not easily change, and no excessive external force is applied to the wire 16. Thus, even when the large substrate 14 is used, defects such as voids, unfilled portions, and deformation of the wires 16 are prevented from occurring, and resin sealing is performed in a short time. In addition, the resin flow path is not required, and an unnecessary cured resin is not formed in the resin flow path, so that the resin material can be effectively used. In addition, by using the resin material 4 that has been compressed in advance, the gas contained in the resin material 4 itself is reduced, which also prevents the occurrence of voids in the molten resin 17. Further, since the pressure of the atmosphere including the cavity 5 is reduced, the occurrence of voids in the molten resin 17 is also prevented.
[0030]
(Second embodiment)
A resin sealing device according to a second embodiment of the present invention will be described with reference to FIG. FIGS. 4A and 4B show a state immediately before the resin material is supplied to the cavity and a state in which the resin material is melted to generate a molten resin and the mold group is formed in the resin sealing device according to the present embodiment. It is a fragmentary sectional view showing a state immediately before fastening.
[0031]
According to the present embodiment, as shown in FIG. 4A, the predetermined size sufficiently smaller than the size of the cavity 5 is used instead of the resin material 4 (see FIG. 1) in the first embodiment. A plurality of disk-shaped resin materials 20 are used. The resin material 20 is used in an appropriate number according to the size and shape of the cavity 5, that is, according to the volume of the cavity 5.
[0032]
Hereinafter, the operation of the resin sealing device according to the present embodiment will be described. First, as shown in FIG. 4A, an appropriate number of disk-shaped resin materials 20 are supplied and arranged on the mold surface of the cavity 5 in accordance with the volume of the cavity 5.
[0033]
Next, as shown in FIG. 4B, the resin material 20 is heated and melted in a state where the space between the lower mold 1 and the upper mold 2 is reduced in pressure. Hereinafter, similarly to FIG. 2A of the first embodiment, the tip 15 and the wire 16 are immersed in the molten resin 17 by clamping the lower die 1 and the upper die 2. Thereafter, similarly to FIG. 2B, the molded article 19 is formed by curing the molten resin 17. Then, similarly to FIG. 3, the molded article 19 is taken out and transported to a storage means such as a tray or the next step.
[0034]
According to the present embodiment, similarly to the first embodiment, the molten resin 17 flows uniformly and in a short time in the entire region of the substrate 14 in the cavity 5. Therefore, even in the case of the large-sized substrate 14, the occurrence of defects such as voids, unfilled portions, and deformation of the wires 16 is prevented, and the resin material can be effectively used.
Further, a plurality of resin materials 20 which are tableted to a predetermined size sufficiently smaller than the size of the cavity 5 are used. Thus, for a plurality of types of cavities 5 having different dimensions and shapes, instead of preparing the resin material 4 of FIG. Can respond. Therefore, since the types of resin materials can be reduced, order management and inventory management of the resin materials can be easily performed.
[0035]
In the present embodiment, the shape of the resin material 20 used is a disk. However, the present invention is not limited thereto, and a resin material 20 having a polygonal shape such as a triangle, a quadrangle, and a hexagon, particularly a regular polygonal shape may be used.
[0036]
(Third embodiment)
A resin sealing device according to a third embodiment of the present invention will be described with reference to FIG. FIGS. 5A and 5B respectively show a state immediately before the resin material is supplied to the cavity and a state immediately after the resin material is supplied to the resin sealing device according to the present embodiment. It is sectional drawing.
[0037]
According to the resin sealing device according to the present embodiment, as shown in FIGS. 5A and 5B, a granular resin is used instead of the resin material 4 (see FIG. 1) in the first embodiment. A predetermined amount of the resin material 21 made of such a granular material is supplied to the cavity 5 according to the size and shape of the cavity 5, that is, according to the volume of the cavity 5. In this case, as shown in FIG. 5B, it is preferable that the resin material 21 is uniformly deposited on the cavity 5 so that the resin material 21 is uniformly heated and melted in a short time. Therefore, the resin sealing device according to the present embodiment is provided with the resin material supply unit 22 shown in FIG.
[0038]
As shown in FIGS. 5A and 5B, the resin material supply unit 22 includes a storage box 23 in which the resin material 21 is stored, and a shutter plate 24 provided near the bottom plate of the storage box 23. It is composed of A plurality of openings 25 are provided in the bottom plate of the storage box 23, and a plurality of openings 26 are provided in the shutter plate 24 at the same pitch. The cross-sectional shape of these openings 25 and 26 may be tapered such that the lower side is narrowed according to the particle size and surface condition of the resin material 21.
[0039]
Hereinafter, the operation of the resin sealing device according to the present embodiment will be described. First, as shown in FIG. 5A, a predetermined amount of resin material measured in accordance with the volume of the cavity 5 is stored in the storage box 23 in a state where the opening 25 of the storage box 23 is closed by the shutter plate 24. 21 is supplied. In this case, a vibrating element (not shown) may be provided in the resin material supply unit 22 to vibrate the resin material supply unit 22 according to the particle size and the surface state of the resin material 21. Thereby, the resin material 21 can be supplied so as to be uniformly deposited in the storage box 23.
[0040]
Next, as shown in FIG. 5 (B), the shutter plate 24 is moved horizontally so that the opening 25 of the storage box 23 and the opening 26 of the shutter plate 24 overlap, and the resin material 21 is dropped into the cavity 5. . Also in this case, the resin material supply unit 22 can be vibrated using the vibration element. Thereby, the resin material 21 can be supplied so as to be uniformly deposited in the cavity 5. Hereinafter, similarly to the first embodiment, the resin material 21 is melted in a state where the space between the lower mold 1 and the upper mold 2 is reduced in pressure. Then, similarly to FIG. 2B, the molten resin is cured to form a molded product, and similarly to FIG. 3, the molded product is taken out and transported to a storage means such as a tray or the next step.
[0041]
According to the present embodiment, the molten resin flows uniformly and in a short time in the entire region of the substrate 14 in the cavity 5 as in the first embodiment. Therefore, even in the case of the large-sized substrate 14, the occurrence of defects such as voids, unfilled portions, and deformation of the wires 16 is prevented, and the resin material can be effectively used.
Further, a predetermined amount of the resin material 21 measured according to the volume of the cavity 5 is supplied to the cavity 5. Accordingly, for the cavities 5 having different shapes and dimensions, instead of preparing the resin material 4 of FIG. 1 for a plurality of types, the supply amount of the resin material 21 made of granular material is increased or decreased. be able to. Therefore, resin encapsulation using one kind of resin material 21 becomes possible, and order management and inventory management of the resin material become extremely easy.
[0042]
(Fourth embodiment)
A resin sealing device according to a fourth embodiment of the present invention will be described with reference to FIG. The present embodiment responds to recent demands for using a resin material having high adhesion to a substrate after being cured and for reducing the thickness of a package. FIGS. 6A and 6B show a state in which the resin material is conveyed before being supplied to the cavity and a state immediately after the resin material is supplied to the cavity in the resin sealing device according to the present embodiment. And FIG.
[0043]
According to the resin sealing device according to the present embodiment, as shown in FIG. 6A, a film 27 having releasability is stretched between the lower mold 1 and the upper mold 2. Then, on the film 27, a disk-shaped resin material 20 tableted to a predetermined size sufficiently smaller than the size of the cavity 5 is provided. The lower die 2 is provided with a gas flow path 28 for adsorbing the film 27.
[0044]
The film 27 is made of a material having heat resistance and releasability, and is stretched between molds by a so-called roll-to-roll method. The material of the film 27 is, for example, ethylene tetrafluoride (PTFE), ethylene-tetrafluoroethylene (ETFE), polyethylene terephthalate (PET), polytetrafluoro-hexafluoroethylene (FEP), polypropylene (PP ), Polyvinylidene chloride (PBDC), fluorine impregnated glass cloth, and the like.
[0045]
Hereinafter, the operation of the resin sealing device according to the present embodiment will be described. First, a disc-shaped resin material 20 is supplied onto the film 27 in an appropriate number according to the volume of the cavity 5 outside the mold between the lower mold 1 and the upper mold 2.
[0046]
Next, as shown in FIG. 6 (A), with the resin material 20 disposed on the film 27, the film 27 is wound up until the plurality of resin materials 20 are located directly above the cavities 5. Move.
[0047]
Next, as shown in FIG. 6B, the film 27 is lowered, and a plurality of resin materials 20 are disposed on the mold surface of the cavity 5 via the film 27. Thereby, the resin material 20 is supplied to the cavity 5. Therefore, the film 27 in this step functions as a resin material supply unit. Further, the film 27 is lowered while applying an appropriate tension, and the film 27 is sucked by the gas flow path 28 in the cavity 5. Thereby, the film 27 adheres to the mold surface of the cavity 5 without wrinkling.
[0048]
Hereinafter, similarly to FIG. 1B of the first embodiment, the resin material 20 is heated and melted in a state where the space between the lower mold 1 and the upper mold 2 is reduced in pressure. Thereafter, the chip 15 and the wire 16 are immersed in the molten resin 17 by clamping as in FIG. 2A of the first embodiment, and the molten resin is The molded article 19 is formed by hardening 17. Then, similarly to FIG. 3, the molded product 19 is separated from the film 27 having a releasing property, taken out from the lower mold 1, and transported to a storage means such as a tray or the next step.
[0049]
According to the present embodiment, similarly to the first embodiment, the molten resin 17 flows uniformly and in a short time in the entire region of the substrate 14 in the cavity 5. Therefore, even in the case of the large-sized substrate 14, the occurrence of defects such as voids, unfilled portions, and deformation of the wires 16 is prevented, and the resin material can be effectively used. Further, as in the second embodiment, since the types of resin materials can be reduced, order management and inventory management of the resin materials can be facilitated. In addition, the use of the film 27 improves the releasability between the molded product 19 and the mold surface of the cavity 5.
[0050]
In the present embodiment, the shape of the resin material 20 used is a disk. However, the present invention is not limited thereto, and a resin material 20 having a polygonal shape may be used, or a granular resin material (the resin material 21 in FIG. 5) may be used.
[0051]
In each of the embodiments described above, for example, a sealing member made of a silicone resin may be fitted in the concave portion provided in the lower mold 1 or the upper mold 2 in the mold clamping portion 9. As the sealing member, a frame-shaped member having a square or circular cross section can be used.
[0052]
Further, the lower mold 1 of the opposing mold groups may be divided as follows. That is, the lower mold 1 is divided into a cavity block having the cavity 5 and a peripheral block located around the cavity block, so that the cavity block can be raised and lowered, and the outer peripheral portion of the substrate 14 is held by the peripheral block. It may be configured. In this case, at the stage of FIG. 2 (B), the cavity block is lowered after the cured resin 18 is formed, and the outer peripheral portion of the substrate 14 is held by the peripheral block while the lower block 1 is held. The molded product 19 is released. Therefore, even when the molten resin 17 having a high adhesion strength after curing to the substrate 14 is used, the molded product 19 is released from the lower mold 1 without applying a large stress to the chip 15 and the wire 16. Can be.
[0053]
Further, the resin materials 4, 20, 21 are made of a thermosetting resin. However, the invention is not limited thereto, and the resin materials 4, 20, and 21 may be made of a thermoplastic resin. In this case, after the resin materials 4, 20, and 21 are heated and melted and clamped, the mold temperature is lowered to cure the molten resin.
[0054]
Further, a decompression pump (not shown) is provided to depressurize the space including the cavity 5. However, the present invention is not limited to this, and it is also possible to adopt a configuration that does not use a decompression pump, depending on the amount of gas contained in the resin materials 4, 20, and 21 and the quality required for the molded product 19.
[0055]
Further, a wire 16 was used as a conductive material for electrically connecting the electrodes of the substrate 14 and the chip 15 to each other. The present invention is not limited to this, and the present invention can also be applied to a so-called flip-chip configuration in which electrodes provided on the main surface of the substrate 14 and electrodes of the chip 15 are electrically opposed to each other.
[0056]
Further, the substrate 14 to which the present invention is applied is divided into a plurality of lattice-like regions, and the chip 15 is mounted on each region on the main surface of the substrate 14. The substrate 14 only needs to be provided with regions to be packaged in a row or a grid. The shape of the substrate 14 may be any of a circle, a square, a rectangle (a strip), and other polygons. Further, the circular shape may be a shape in which a part of the complete circle is cut off and removed, or a shape provided with a notch (notch) or the like, in addition to the complete circle.
[0057]
Further, the material of the substrate 14 to which the present invention is applied may be a metal such as a lead frame or a resin-based material such as a normal printed circuit board. Further, the present invention may be applied to a metal base substrate or a ceramic substrate. Further, the present invention is also applied to a semiconductor substrate such as a silicon substrate, a compound semiconductor substrate, an SOI substrate, etc., which is a substrate for a so-called wafer level package whose main surface is re-wired using Cu or the like. can do.
[0058]
In addition, the present invention can be applied to a substrate used when manufacturing electronic components other than a semiconductor, such as a chip capacitor, other than the semiconductor substrate as the substrate 14.
[0059]
Further, one substrate 14 was fixed to the upper mold 2 by suction. The present invention is not limited to this, and one or a plurality of substrates may be fixed to a square or circular frame-shaped jig, and the jig may be fixed to the upper mold 2 while being integrated with the substrate. By using such a jig, the strip type lead frame and the printed circuit board currently used can be shared by the common board placing portion 11 for the different types, that is, by the common upper mold 2. Can respond. In addition, for each type, a plurality of sheets can be processed simultaneously.
[0060]
In addition, the present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed without departing from the spirit of the present invention. You can do it.
[0061]
【The invention's effect】
According to the present invention, at least a part of the main surface of the substrate is immersed in the molten resin generated by heating the resin material supplied to the cavity, whereby the sealing resin is formed on the main surface. Thereby, the molten resin viewed from the main surface of the substrate flows only in a short time in the depth direction of the cavity, and thus flows uniformly and in a short time in the entire region of the substrate in the cavity. Therefore, occurrence of defects such as voids and unfilled portions is prevented. Further, even when wires are present on the main surface of the substrate, occurrence of defects such as deformation of the wires is prevented.
Further, the resin flow path is not required, and the cured resin is not formed in the resin flow path, so that the resin material can be effectively used.
In addition, a predetermined number or amount of the resin material compressed into a predetermined size or a resin material made of a granular material is supplied to the cavity according to the volume of the cavity. Accordingly, it is possible to cope with cavities having different sizes and shapes by using a small number of types of resin materials. Therefore, management of the resin material becomes easy.
Therefore, the present invention has an excellent practical effect that it is possible to provide a resin sealing device that prevents the occurrence of defects, enables effective use of the resin material, and facilitates the management of the resin material. Is played.
[Brief description of the drawings]
FIGS. 1A and 1B are views showing a state immediately before a resin material is supplied to a cavity and a state in which a resin material is melted and a molten resin is melted in a resin sealing device according to a first embodiment of the present invention; FIG. 6 is a partial cross-sectional view illustrating a state immediately before the mold group is closed by the generated mold group.
FIGS. 2A and 2B are views showing a state in which a mold group is clamped in a resin sealing device according to a first embodiment of the present invention, and a chip mounted on a substrate is a molten resin; FIG. 2 is a partial cross-sectional view showing a state where the resin is immersed in the resin and a state where the molten resin is cured to form a cured resin.
FIG. 3 is a partial cross-sectional view showing a state immediately before a mold group is opened and a molded product is carried out in the resin sealing device according to the first embodiment of the present invention.
FIGS. 4A and 4B show a resin sealing device according to a second embodiment of the present invention in a state immediately before a resin material is supplied to a cavity, and when a resin material is melted and molten resin is melted. FIG. 6 is a partial cross-sectional view illustrating a state immediately before the mold group is closed by the generated mold group.
FIGS. 5A and 5B show a state immediately before a resin material is supplied to a cavity and a state immediately after a resin material is supplied to a resin sealing device according to a third embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing a state.
FIGS. 6A and 6B show a resin sealing device according to a fourth embodiment of the present invention in a state where a resin material is conveyed before being supplied to a cavity; And FIG. 7 is a partial cross-sectional view showing a state immediately after being supplied.
[Explanation of symbols]
1 lower mold
2 Upper type
3 Conveyance unit (resin material supply means, molded product unloading means)
4,20 resin material
5 cavities
6 Resin pool
7,13,28 Gas flow path
8 heater (heating means)
9 Mold clamping part
10 steps
11 Substrate mounting part
12 Suction recess
14 Substrate
15 chips
16 wires
17 molten resin
18 Cured resin
19 Molded product
21 Resin material (granular body)
22 Resin material supply unit (resin material supply means)
23 storage box
24 Shutter plate
25, 26 opening
27 Film (resin material supply means)

Claims (6)

パッケージを製造する工程において、相対向する金型群と樹脂封止用の樹脂材料とを使用して、基板の主面において前記樹脂材料を溶融させて溶融樹脂を形成し、該溶融樹脂を硬化させて封止樹脂を形成する樹脂封止装置であって、
前記金型群のうち上型における所定の位置に前記基板を搬送して載置する基板搬送手段と、
前記金型群のうち下型に設けられているとともに前記主面の少なくとも一部が配設されるべきキャビティと、
前記キャビティに前記樹脂材料を供給する樹脂材料供給手段と、
前記下型に設けられ、前記キャビティに供給された樹脂材料を加熱して溶融させることにより前記溶融樹脂を生成する加熱手段と、
前記金型群を型締め又は型開きするプレス手段と、
少なくとも前記基板と前記封止樹脂とを有する成形品を取り出す成形品搬出手段とを備えるとともに、
前記封止樹脂は、前記金型群が型締めされ前記主面の少なくとも一部が前記キャビティにおける溶融樹脂に浸漬された状態で、該溶融樹脂を硬化させることにより形成されたことを特徴とする樹脂封止装置。In the step of manufacturing the package, using the opposed mold group and the resin material for resin sealing, the resin material is melted on the main surface of the substrate to form a molten resin, and the molten resin is cured. A resin sealing device for forming a sealing resin by
Substrate transporting means for transporting and placing the substrate at a predetermined position in the upper mold of the mold group,
A cavity provided in the lower mold of the mold group and at least a part of the main surface is to be arranged,
Resin material supply means for supplying the resin material to the cavity,
Heating means provided in the lower mold, generating the molten resin by heating and melting the resin material supplied to the cavity,
Press means for clamping or opening the mold group,
A molded product carrying means for taking out a molded product having at least the substrate and the sealing resin, and
The sealing resin is formed by curing the molten resin while the mold group is clamped and at least a part of the main surface is immersed in the molten resin in the cavity. Resin sealing device. 請求項１に記載された樹脂封止装置において、
前記樹脂材料は前記キャビティの寸法・形状に合わせて打錠されていることを特徴とする樹脂封止装置。The resin sealing device according to claim 1,
The resin sealing device is characterized in that the resin material is tableted according to the size and shape of the cavity. 請求項１に記載された樹脂封止装置において、
前記樹脂材料は所定の寸法に打錠されているとともに、前記キャビティの寸法・形状に合わせて複数個使用されていることを特徴とする樹脂封止装置。The resin sealing device according to claim 1,
A resin sealing device, wherein the resin material is tableted to a predetermined size and a plurality of the resin materials are used in accordance with the size and shape of the cavity. 請求項１に記載された樹脂封止装置において、
前記樹脂材料は前記キャビティの寸法・形状に合わせて所定量だけ供給される粒状体からなることを特徴とする樹脂封止装置。The resin sealing device according to claim 1,
The resin sealing device is characterized in that the resin material is a granular material supplied in a predetermined amount according to the size and shape of the cavity. 請求項１〜４のいずれか１つに記載された樹脂封止装置において、
前記樹脂材料供給手段は前記金型群の間においで進退可能に張設され離型性を有するフィルムからなるとともに、
前記フィルムに前記樹脂材料が配設された状態で、前記フィルムが前記キャビティにおける型面に載置されることを特徴とする樹脂封止装置。The resin sealing device according to any one of claims 1 to 4,
The resin material supply means is formed of a film having a releasability that is stretched between the mold groups so as to be able to advance and retreat,
The resin sealing device, wherein the film is placed on a mold surface in the cavity while the resin material is provided on the film. 請求項１〜５のいずれか１つに記載された樹脂封止装置において、
前記基板は列状又は格子状に形成された複数の領域を有するとともに、該領域の各々が前記パッケージに対応することを特徴とする樹脂封止装置。The resin sealing device according to any one of claims 1 to 5,
The resin sealing device, wherein the substrate has a plurality of regions formed in a row or a lattice, and each of the regions corresponds to the package.
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