JP2004166006A - Quartz oscillator for surface mount - Google Patents

Quartz oscillator for surface mount Download PDF

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Publication number
JP2004166006A
JP2004166006A JP2002330006A JP2002330006A JP2004166006A JP 2004166006 A JP2004166006 A JP 2004166006A JP 2002330006 A JP2002330006 A JP 2002330006A JP 2002330006 A JP2002330006 A JP 2002330006A JP 2004166006 A JP2004166006 A JP 2004166006A
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JP
Japan
Prior art keywords
crystal
terminal
glass
electrode
silicon substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002330006A
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Japanese (ja)
Inventor
Kozo Ono
公三 小野
Akio Chiba
亜紀雄 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2002330006A priority Critical patent/JP2004166006A/en
Priority to US10/706,517 priority patent/US7034441B2/en
Publication of JP2004166006A publication Critical patent/JP2004166006A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mount oscillator in which miniaturization is promoted, oscillation characteristics are made excellent and design is made easy. <P>SOLUTION: In the quartz oscillator of surface mount for sealing a quartz crystal piece in a container, the container consists of a plate-like silicon substrate having a quartz crystal terminal connected to an external terminal for the surface mount inside and of a concave glass having a movable ion of Na+, Li+ or the like, and is constituted by anode joining of the silicon substrate with the glass. Also, the external terminal and the quartz crystal terminal are electrically connected by an electrode-through hole provided at a lower part of the metal body with the quartz crystal terminal as the metal body. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は表面実装用の水晶振動子(以下、表面実装振動子とする)を産業上の技術分野とし、特に小型化を促進する表面実装振動子に関する。
【0002】
【従来の技術】
(発明の背景)表面実装振動子は小型・軽量であることから、特に携帯型の電子機器に周波数及び時間の基準源として発振器等に広く採用される。近年では、ますますの小型化指向から、さらに小さな表面実装振動子が求められている。
【0003】
(従来技術の一例)第4図は一従来例を説明する表面実装振動子の図で、同図(a)は断面図、同図(b)はカバー3を除く平面図、同図(c)は水晶片2の平面図である。
【0004】
表面実装振動子は実装基板1としての容器本体内に水晶片2を収容し、カバー3を被せて密閉封入してなる。容器本体は底壁4と枠壁5からなる積層セラミックからなる。そして、外表面に表面実装用の外部端子6を有し、内部に一対の水晶端子7を有する。一対の水晶端子7は積層面及び端面を経て外部端子6と電気的に接続する。
【0005】
水晶片2は両主面に励振電極8を有し、例えば一端部両側に引出電極9を延出する。そして、引出電極9の延出した一端部両側を図示しない導電性接着剤等によって水晶端子7上に固着し、電気的・機械的に接続する。
【0006】
カバー3は例えば金属からなり、例えば実装基板1の枠壁5上面に設けられた図示しない金属リングや金属膜にシームやビーム溶接によって接合される。
【0007】
【発明が解決しようとする課題】
(従来技術の問題点)しかしながら、上記構成の表面実装振動子では、実装基板1は積層セラミックからなるので、グリーンシートの積層及び焼成の製造工程上、枠壁5の厚みは一定値以上の幅を必要とする。したがって、容器内の内底面面積が損なわれる。
【0008】
一方、水晶片2は板面面積が大きいほど、振動特性を良好にするとともに、例えば容量比C0/C1を小さくして設計の自由度を増し、その設計を容易にする。なお、C0は等価並列容量(電極間容量)、C1は等価直列容量である。このことから、実装基板1の外形寸法は小さくして、内底面面積は大きい容器が求められる。
【0009】
また、第5図に示したように実装基板1を平板状として、凹状としたセラミックからなるカバー3をガラスや樹脂封止したものがある。符号10はガラス又は樹脂材である。このようなものでは、一体成形なので絶縁カバー3の枠幅を小さくできて内底面面積を大きくできる。しかし、ガラス封止の場合には接合材としてのガラスの強度が小さく耐衝撃特性に問題があり、樹脂封止の場合には湿気等の外気が侵入して振動特性を低下させる問題があった。
【0010】
(発明の目的)本発明は小型化を促進して、振動特性を良好にして設計を容易にした表面実装振動子を提供することを目的とする。
【0011】
【特許文献1】特許願2000−13170
【非特許文献1】先端材料辞典、 年発行、P629〜630.
【非特許文献2】豊田中央研究所R&Dレビュー、Vol.28、No4(1993.12)P53〜54
【0012】
【課題を解決するための手段】
(着目点及び適用)本発明は上記の非特許文献1及び2で示される陽極接合技術に着目して、表面実装振動子の容器を形成した。
【0013】
(解決手段)本発明の請求項1では、表面実装振動子の容器は表面実装用の外部端子と接続する水晶端子を内部に有する平板状のシリコン基板と、可動イオンを有する凹状としたガラスからなり、前記シリコン基板と前記ガラスとを陽極接合した構成とする。
【0014】
これにより、凹状としたガラスの枠幅を小さくできる。また、ガラスや樹脂封止に比較して接着剤を使用しないので、強度を高めて湿気の侵入を防止する。請求項2では、可動イオンをNa+又はLi+とするので、陽極接合を可能にする。
【0015】
請求項3では、前記外部端子と前記水晶端子とは前記水晶端子を金属体として、前記金属体の下部に設けた電極貫通孔によって電気的に接続した構成とする。これにより、金属体が電極貫通孔を遮蔽して密閉を確実にする。
【0016】
請求項4では、前記外部端子と前記水晶端子とは前記シリコン基板と前記ガラスとの界面を横断したAl(アルミニウム)電極によって電気的に接続した構成とする。これにより、前記シリコン基板と前記ガラスとの界面をAl電極が横断するので、陽極接合を維持して密閉度を維持する。
【0017】
請求項5では、外部端子を有する実装基板の水晶端子上に水晶片を電気的・機械的に接続して密閉封入してなる表面実装用の水晶振動子において、前記水晶端子は金属体からなり、前記金属体の下部に設けた電極貫通孔によって前記外部端子と電気的に接続して水晶振動子を構成する。
【0018】
請求項5は請求項3の電極導出時の密閉方法が、実装基板とカバーとの他の接合方法の場合であっても適用できることを明確にしたもので、これにより実装基板を積層することなく単層基板でも密閉構造とした容器を得ることができる。以下、本発明の実施例を説明する。
【0019】
【実施例】
第1図は本発明の一実施例を説明する表面実装振動子の図で、同図(a)は断面図、同図(b)はカバー3を除く平面図、同図(c)は底面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。
【0020】
表面実装振動子は実装基板1と凹状としたカバー3からなる容器内に水晶片2を収容してなる。実装基板1はシリコン基板からなり、一端部両側の表面に金属膜11を設けて金属板12を銀ロウ等によって接合する。そして、外表面(裏面)からエッチングによって金属板に当接(到達)する貫通孔13を形成する。なお、金属板12は水晶片2の一端部両側を電気的・機械的に接続する水晶端子7として機能する。
【0021】
貫通孔13の内表面には金属膜11及び金属板12と電気的に接続する電極が形成されて電極貫通孔とし、外表面の一端部両側に外部端子6として延出する。このとき、外表面の他端部両側にもダミー用の外部端子6が設けられる。各電極は例えば蒸着によって下地電極としてのCr上にCu及びAuを積層する。
【0022】
カバー3はここではパイレックス(登録商標)ガラスからなり、Na+とした可動イオンを含む。そして、実装基板1の外周面にカバー3の枠壁上面を当接し、加熱(300〜400℃)しながらカバー3側に500V程度の負電圧を印加する。なお、実装基板1とカバー3の当接面は鏡面研磨される。
【0023】
このようなものでは、非特許文献1及び2に示されるように陽極接合が行われる。すなわち、カバー3(パイレックス(登録商標)ガラス)に含まれる可動イオンNa+が移動して、実装基板1(シリコン基板)との界面にNa+イオン欠乏層ができ、大きな静電引力を生じる。そして、両者の界面は化学結合に至る。したがって、結合強度は格段に上がる。
【0024】
これらのことから、従来の実装基板1としての積層セラミックよりもカバー3の枠幅を小さくできるので、内底面面積を大幅に広げられる。したがって、大きな水晶片2を使用できて、振動特性を良好にして設計の自由度を増す。また、凹状としたカバー3をガラスや樹脂によって封止したものに比較すると、耐衝撃性を向上して外気の侵入を防止できる。
【0025】
さらに、この実施例では、実装基板1の表面に金属膜11を設けて金属板12を接合して外表面からエッチングするので、密閉度を確実にする。但し、これに限らず、例えばエッチングによって貫通孔13を設け、貫通孔13を含めて内表面及び外表面に金属膜11を設けた後、金属板12を接合してもよい。
【0026】
また、金属板12を銀ロウ等によって接合するとしたが、例えば表面に厚膜の金を形成して裏面からエッチングしてもよく、要は表面に遮蔽体としてのバンプ等を含めた金属体を設けて電極の形成された貫通孔13によって電極が導出されていればよい。
【0027】
【他の事項】
上記実施例では一層とした実装基板1に設けた金属板12及び貫通孔13によって密閉度を維持したが、陽極接合においては界面にAl(アルミニウム)電極が横断しても密閉度は維持されるとしているので(前述の非特許文献1、p630)、電極をAlとして界面を横断して外部端子6と接続しても良い(第2図)。
【0028】
また、カバー3はパイレックス(登録商標)ガラスとしたが、例えば特許文献2で示されるデビトロンガラスでもよく、基本的にはNa+やLi+イオン等の可動イオンが含まれていれば良い。
【0029】
また、表面実装振動子として説明したが、例えば第3図に示したように実装基板1と水晶片2との間にICチップ14を搭載して表面実装発振器を構成する場合でも適用でき、要するに水晶片2を収容する場合に適用でき、本発明はこれを排除するものではない。なお、図では電極の導出構造は省略しており、外部端子6はICチップの電源、出力、アース端子等と電気的に接続する。
【0030】
【発明の効果】
本発明は、表面実装振動子の容器を、基本的に、表面実装用の外部端子6と接続する水晶端子7を内部に有する平板状のシリコン基板と、可動イオンを有する凹状としたガラスからなり、前記シリコン基板と前記ガラスとを陽極接合した構成とするので、小型化を促進して、振動特性を良好にして設計を容易にした表面実装振動子を提供できる。
【図面の簡単な説明】
【図1】本発明の一実施例を説明する表面実装振動子の図で、同図(a)は断面図、同図(b)はカバー3を除く平面図、同図(c)は底面図である。
【図2】本発明の他の実施例を説明する表面実装振動子の断面図である。
【図3】本発明の他の適用例を示す表面実装発振器の断面図である。
【図4】従来例を説明する表面実装振動子の図で、同図(a)は断面図、同図(b)はカバー3を除く平面図、同図(c)は水晶片2の図である。
【図5】従来例の他例を説明する表面実装振動子の図で、同図(a)は断面図、同図(b)はカバー3を除く平面図である。
【符号の説明】
1 実装基板、2 水晶片、3 カバー、4 底壁、5 枠壁、6 外部端子、7 水晶端子、8 励振電極、9 引出電極、10 ガラス又は樹脂材、11
金属膜、12 金属板、13 貫通孔、14 ICチップ。
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a crystal resonator for surface mounting (hereinafter, referred to as a surface mounting resonator) as an industrial technical field, and particularly to a surface mounting resonator which promotes miniaturization.
[0002]
[Prior art]
(Background of the Invention) Since a surface mount resonator is small and lightweight, it is widely used as an oscillator and the like as a frequency and time reference source particularly for portable electronic equipment. In recent years, smaller and smaller surface mount resonators have been demanded from the trend toward further miniaturization.
[0003]
(Example of Prior Art) FIGS. 4A and 4B are views of a surface-mount vibrator for explaining a conventional example, wherein FIG. 4A is a sectional view, FIG. 4B is a plan view excluding a cover 3, and FIG. () Is a plan view of the crystal blank 2.
[0004]
The surface mount resonator is configured such that a crystal blank 2 is accommodated in a container body as a mounting substrate 1, covered with a cover 3, and hermetically sealed. The container body is made of a laminated ceramic having a bottom wall 4 and a frame wall 5. It has an external terminal 6 for surface mounting on the outer surface and a pair of crystal terminals 7 inside. The pair of crystal terminals 7 are electrically connected to the external terminals 6 via the laminated surface and the end surface.
[0005]
The crystal blank 2 has excitation electrodes 8 on both main surfaces, for example, extending extraction electrodes 9 on both sides of one end. Then, both ends of the extended one end of the extraction electrode 9 are fixed on the crystal terminal 7 with a conductive adhesive (not shown) or the like, and are electrically and mechanically connected.
[0006]
The cover 3 is made of, for example, metal, and is joined to a metal ring or metal film (not shown) provided on the upper surface of the frame wall 5 of the mounting board 1 by seam or beam welding.
[0007]
[Problems to be solved by the invention]
(Problems of the prior art) However, in the surface mounting resonator having the above configuration, since the mounting substrate 1 is made of a laminated ceramic, the thickness of the frame wall 5 has a width of a certain value or more in the manufacturing process of laminating and firing the green sheets. Need. Therefore, the area of the inner bottom surface in the container is impaired.
[0008]
On the other hand, the larger the plate surface area of the crystal blank 2, the better the vibration characteristics, and, for example, the capacity ratio C0 / C1 is reduced to increase the degree of freedom of design, thereby facilitating the design. C0 is an equivalent parallel capacitance (capacity between electrodes), and C1 is an equivalent series capacitance. For this reason, a container having a small external dimension of the mounting substrate 1 and a large inner bottom surface area is required.
[0009]
In addition, as shown in FIG. 5, there is a case in which the mounting substrate 1 is formed in a flat plate shape and a cover 3 made of a concave ceramic is sealed with glass or resin. Reference numeral 10 is a glass or resin material. In such a case, since it is integrally molded, the frame width of the insulating cover 3 can be reduced and the inner bottom surface area can be increased. However, in the case of glass sealing, the strength of glass as a bonding material is small, and there is a problem in impact resistance. In the case of resin sealing, there is a problem that external air such as moisture enters and the vibration characteristics are reduced. .
[0010]
(Object of the Invention) An object of the present invention is to provide a surface mount resonator which facilitates miniaturization, improves vibration characteristics and facilitates design.
[0011]
[Patent Document 1] Patent Application 2000-13170
[Non-patent document 1] Dictionary of advanced materials, published year, P629-630.
[Non-Patent Document 2] Toyota Central R & D Review, Vol. 28, No4 (1993.12) P53-54
[0012]
[Means for Solving the Problems]
(Points of Attention and Application) The present invention focused on the anodic bonding technology described in Non-Patent Documents 1 and 2 above, and formed a container for a surface-mounted vibrator.
[0013]
(Solution) According to claim 1 of the present invention, the container of the surface mount resonator is made of a flat silicon substrate having a crystal terminal inside which is connected to an external terminal for surface mounting, and a concave glass having movable ions. In this case, the silicon substrate and the glass are anodically bonded.
[0014]
Thereby, the frame width of the concave glass can be reduced. In addition, since no adhesive is used as compared with glass or resin sealing, the strength is increased to prevent moisture from entering. According to the second aspect, since the movable ions are Na + or Li +, anodic bonding is enabled.
[0015]
According to a third aspect of the present invention, the external terminal and the crystal terminal are electrically connected to each other through an electrode through hole provided in a lower portion of the metal body using the crystal terminal as a metal body. Thereby, the metal body shields the electrode through-hole and ensures sealing.
[0016]
According to a fourth aspect of the present invention, the external terminal and the crystal terminal are electrically connected by an Al (aluminum) electrode crossing an interface between the silicon substrate and the glass. Thus, the Al electrode crosses the interface between the silicon substrate and the glass, so that the anodic bonding is maintained and the degree of sealing is maintained.
[0017]
According to a fifth aspect of the present invention, there is provided a crystal resonator for surface mounting, wherein a crystal piece is electrically and mechanically connected to a crystal terminal of a mounting substrate having external terminals and hermetically sealed, wherein the crystal terminal is made of a metal body. The crystal resonator is electrically connected to the external terminal through an electrode through hole provided below the metal body.
[0018]
Claim 5 clarifies that the sealing method at the time of deriving the electrode of claim 3 can be applied even in the case of another joining method between the mounting board and the cover, and thereby, without laminating the mounting boards. A container having a closed structure can be obtained even with a single-layer substrate. Hereinafter, examples of the present invention will be described.
[0019]
【Example】
1A and 1B are diagrams of a surface-mounted vibrator for explaining an embodiment of the present invention. FIG. 1A is a sectional view, FIG. 1B is a plan view excluding a cover 3, and FIG. FIG. The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified or omitted.
[0020]
The surface-mount vibrator has a crystal blank 2 housed in a container including a mounting board 1 and a cover 3 having a concave shape. The mounting substrate 1 is made of a silicon substrate, and a metal film 11 is provided on the surface on both sides of one end, and the metal plate 12 is joined by silver brazing or the like. Then, a through-hole 13 is formed from the outer surface (rear surface) to abut (reach) the metal plate by etching. The metal plate 12 functions as a crystal terminal 7 for electrically and mechanically connecting both ends of the crystal piece 2 at one end.
[0021]
Electrodes electrically connected to the metal film 11 and the metal plate 12 are formed on the inner surface of the through hole 13 to form an electrode through hole, and extend as external terminals 6 on both sides of one end of the outer surface. At this time, dummy external terminals 6 are provided on both sides of the other end of the outer surface. For each electrode, Cu and Au are laminated on Cr as a base electrode by, for example, vapor deposition.
[0022]
The cover 3 is made of Pyrex (registered trademark) glass and contains mobile ions of Na +. Then, the upper surface of the frame wall of the cover 3 is brought into contact with the outer peripheral surface of the mounting substrate 1, and a negative voltage of about 500 V is applied to the cover 3 while heating (300 to 400 ° C.). The contact surface between the mounting board 1 and the cover 3 is mirror-polished.
[0023]
In such a case, anodic bonding is performed as shown in Non-Patent Documents 1 and 2. That is, the mobile ions Na + contained in the cover 3 (Pyrex (registered trademark) glass) move to form a Na + ion deficient layer at the interface with the mounting substrate 1 (silicon substrate), thereby generating a large electrostatic attraction. And the interface of both leads to a chemical bond. Therefore, the coupling strength is significantly increased.
[0024]
For these reasons, the frame width of the cover 3 can be made smaller than that of the conventional multilayer ceramic as the mounting substrate 1, so that the area of the inner bottom surface can be greatly increased. Therefore, a large crystal blank 2 can be used, and the vibration characteristics are improved, and the degree of freedom in design is increased. In addition, compared to a case where the concave cover 3 is sealed with glass or resin, the impact resistance is improved and the invasion of outside air can be prevented.
[0025]
Furthermore, in this embodiment, since the metal film 11 is provided on the surface of the mounting substrate 1 and the metal plate 12 is joined and etched from the outer surface, the degree of sealing is ensured. However, the present invention is not limited to this. For example, the through holes 13 may be provided by etching, the metal films 11 may be provided on the inner surface and the outer surface including the through holes 13, and then the metal plates 12 may be joined.
[0026]
In addition, although the metal plate 12 is bonded by silver brazing or the like, for example, a thick film of gold may be formed on the surface and then etched from the back surface. It is sufficient that the electrode is led out through the through hole 13 in which the electrode is formed.
[0027]
[Other matters]
In the above embodiment, the sealing is maintained by the metal plate 12 and the through-hole 13 provided on the single-layer mounting board 1. However, in the anodic bonding, the sealing is maintained even if an Al (aluminum) electrode crosses the interface. (Non-Patent Document 1, p630 described above), the electrode may be made of Al and connected to the external terminal 6 across the interface (FIG. 2).
[0028]
Further, although the cover 3 is made of Pyrex (registered trademark) glass, it may be made of, for example, devitron glass disclosed in Patent Document 2, and basically only needs to contain mobile ions such as Na + and Li + ions.
[0029]
Also, the surface mount resonator has been described. However, for example, as shown in FIG. 3, the present invention can be applied to a case where the IC chip 14 is mounted between the mounting substrate 1 and the crystal blank 2 to form a surface mount oscillator. The present invention can be applied to the case where the crystal blank 2 is housed, and the present invention does not exclude this. In the figure, the lead-out structure of the electrodes is omitted, and the external terminals 6 are electrically connected to a power supply, an output, a ground terminal and the like of the IC chip.
[0030]
【The invention's effect】
According to the present invention, a container for a surface-mounting vibrator basically includes a flat silicon substrate having a crystal terminal 7 connected to an external terminal 6 for surface mounting inside, and a concave glass having movable ions. In addition, since the silicon substrate and the glass are configured to be anodically bonded, it is possible to provide a surface mount resonator that facilitates miniaturization, improves vibration characteristics, and facilitates design.
[Brief description of the drawings]
FIGS. 1A and 1B are diagrams of a surface-mounted vibrator for explaining an embodiment of the present invention, wherein FIG. 1A is a sectional view, FIG. 1B is a plan view excluding a cover 3, and FIG. FIG.
FIG. 2 is a cross-sectional view of a surface-mount vibrator for explaining another embodiment of the present invention.
FIG. 3 is a sectional view of a surface mount oscillator showing another application example of the present invention.
4 (a) is a sectional view, FIG. 4 (b) is a plan view excluding a cover 3, and FIG. 4 (c) is a view of a crystal blank 2; It is.
5A and 5B are diagrams of a surface-mounted vibrator for explaining another example of the conventional example, wherein FIG. 5A is a cross-sectional view and FIG. 5B is a plan view excluding a cover 3;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mounting board, 2 crystal pieces, 3 covers, 4 bottom walls, 5 frame walls, 6 external terminals, 7 crystal terminals, 8 excitation electrodes, 9 extraction electrodes, 10 glass or resin material, 11
Metal film, 12 metal plate, 13 through hole, 14 IC chip.

Claims (5)

水晶片を容器内に密閉封入してなる表面実装用の水晶振動子において、前記容器は表面実装用の外部端子と接続する水晶端子を内部に有する平板状のシリコン基板と、可動イオンを有する凹状としたガラスからなり、前記シリコン基板と前記ガラスとを陽極接合したことを特徴とする水晶振動子。In a crystal resonator for surface mounting in which a crystal piece is hermetically sealed in a container, the container has a flat silicon substrate having a crystal terminal connected to an external terminal for surface mounting inside, and a concave shape having movable ions. A quartz crystal resonator, wherein the silicon substrate and the glass are anodically bonded. 前記可動イオンはNa+又はLi+である請求項1の水晶振動子。2. The crystal unit according to claim 1, wherein said movable ions are Na + or Li +. 前記外部端子と前記水晶端子とは前記水晶端子を金属体として、前記金属体の下部に設けた電極貫通孔によって電気的に接続した請求項1の水晶振動子。2. The crystal unit according to claim 1, wherein the external terminal and the crystal terminal are electrically connected to each other by an electrode through hole provided below the metal body, with the crystal terminal being a metal body. 前記外部端子6と前記水晶端子とは前記シリコン基板と前記ガラスとの界面を横断したAl(アルミニウム)電極によって電気的に接続した請求項1の水晶振動子。2. The crystal unit according to claim 1, wherein said external terminal and said crystal terminal are electrically connected by an Al (aluminum) electrode crossing an interface between said silicon substrate and said glass. 外部端子を有する実装基板の水晶端子上に水晶片を電気的・機械的に接続して密閉封入してなる表面実装用の水晶振動子において、前記水晶端子は金属体からなり、前記金属体の下部に設けた電極貫通孔によって前記外部端子と電気的に接続したことを特徴とする水晶振動子。In a crystal resonator for surface mounting, in which a crystal piece is electrically and mechanically connected to a crystal terminal of a mounting board having external terminals and hermetically sealed, the crystal terminal is made of a metal body, A crystal unit electrically connected to the external terminal through an electrode through hole provided in a lower part.
JP2002330006A 2002-11-13 2002-11-13 Quartz oscillator for surface mount Pending JP2004166006A (en)

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JP2006279872A (en) * 2005-03-30 2006-10-12 Kyocera Kinseki Corp Piezoelectric vibrator, manufacturing method therefor, and manufacturing method of piezoelectric oscillator using the piezoelectric vibrator
JP2009022003A (en) * 2007-07-11 2009-01-29 Samsung Electro-Mechanics Co Ltd Method of manufacturing crystal vibrator
JP2009071655A (en) * 2007-09-14 2009-04-02 Nippon Dempa Kogyo Co Ltd Piezoelectric device and method of manufacturing piezoelectric device
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JP2006279872A (en) * 2005-03-30 2006-10-12 Kyocera Kinseki Corp Piezoelectric vibrator, manufacturing method therefor, and manufacturing method of piezoelectric oscillator using the piezoelectric vibrator
JP2009022003A (en) * 2007-07-11 2009-01-29 Samsung Electro-Mechanics Co Ltd Method of manufacturing crystal vibrator
JP2009071655A (en) * 2007-09-14 2009-04-02 Nippon Dempa Kogyo Co Ltd Piezoelectric device and method of manufacturing piezoelectric device
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JP2010103479A (en) * 2008-09-26 2010-05-06 Seiko Instruments Inc Electronic component and its production method
JP5184648B2 (en) * 2008-11-28 2013-04-17 セイコーインスツル株式会社 Method for manufacturing piezoelectric vibrator
WO2010061469A1 (en) * 2008-11-28 2010-06-03 セイコーインスツル株式会社 Piezoelectric oscillator manufacturing method, piezoelectric oscillator, oscillator, electronic device, and radio clock
US8427250B2 (en) 2008-11-28 2013-04-23 Seiko Instruments Inc. Piezoelectric vibrator manufacturing method, piezoelectric vibrator, oscillator, electronic device, and radio-controlled timepiece
JP2010193029A (en) * 2009-02-17 2010-09-02 Seiko Instruments Inc Electronic component, electronic appliance, and method of manufacturing electronic component
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US8305150B2 (en) 2010-03-09 2012-11-06 Nihon Dempa Kogyo Co., Ltd Surface mount crystal oscillator and manufacturing method of the same
JP2012147497A (en) * 2010-03-09 2012-08-02 Nippon Dempa Kogyo Co Ltd Sheeted ceramic base and method of manufacturing the same
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