JP2004034300A - Micro-extruder - Google Patents

Micro-extruder Download PDF

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Publication number
JP2004034300A
JP2004034300A JP2002190094A JP2002190094A JP2004034300A JP 2004034300 A JP2004034300 A JP 2004034300A JP 2002190094 A JP2002190094 A JP 2002190094A JP 2002190094 A JP2002190094 A JP 2002190094A JP 2004034300 A JP2004034300 A JP 2004034300A
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Japan
Prior art keywords
mold
workpiece
micro
magnet
support
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Pending
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JP2002190094A
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Japanese (ja)
Inventor
Shinji Matsui
松井　真二
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Elionix Kk
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Elionix Kk
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Priority to JP2002190094A priority Critical patent/JP2004034300A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro-extruder which prevents the positional shift of a mold and a material to be processed and keeps the parallelism of the mold and the material to be processed. <P>SOLUTION: In the micro-extruder for mutually pressing the mold 1 supported by a mold support 2 and the material 4 to be processed supported by a support part 5 to transfer the pattern of the mold 1 to the material 4 to be processed, a magnet 8 is arranged to either one of the mold support 2 or the support part 5 of the material 4 to be processed and a magnetic body or the magnet 8 is arranged to the other one of them. The relative movement of the mold 1 and the material 4 to be processed in the direction crossing the pressing direction between them at a right angle is prevented by magnetic attraction force. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は微小型押成形装置に係り、特に型と被加工材を互いに押し付ける際に型と被加工材の位置ずれを防ぎ、型と被加工材との平行度を維持することができる微小型押成形装置に関するものである。
【０００２】
【従来の技術】
近年、微小型押成形（ナノインプリントとも言う）技術が注目されている。ナノインプリント技術は、凹凸のパターンを形成した型を、基板上の液状ポリマー（被加工材）などに押し付け、パターンを転写するものである。ナノインプリント技術を半導体や光素子あるいはナノ構造材料形成など、新たな応用へ展開しようという試みがなされており、このナノインプリント技術は１０ｎｍに近い構造体を安価に大量生産でき、かつ高精度化を可能とする技術である。
このナノインプリントに用いられる型押成形装置には、型と被加工材を平行に接触あるいは固定する機構が不可欠となる。従来の型押成形装置では、型の支持部材平面と被加工材の支持部材平面との平行度は機械加工精度に依存している。
【０００３】
上述した従来の方法においては、転写回数とともに、型の支持部材平面と被加工材の支持部材平面との平行度が劣化していく。また、型と被加工材をセットする際には、型あるいは被加工材とこれらの支持部材の平行度を厳密に保つ必要もある。
しかしながら、このように微小型押成形装置において、加工開始から終了までの間、型と被加工材が位置ずれを起こさないように保持するのは難しかった。特に、加工前の被加工面が平面である場合、型と接触する瞬間に両者の平行度が確保されないと両者の間ですべり現象が発生し、正確な型押しができなかった。
【０００４】
【発明が解決しようとする課題】
本発明は、上述した従来技術の問題点に鑑み、型と被加工材の位置ずれを防ぎ、型と被加工材の平行度を維持することができる微小型押成形装置を提供することを目的としている。
【０００５】
【課題を解決するための手段】
上述の目的を達成するため、本発明は、型支持部により支持された型と被加工材支持部により支持された被加工材を互いに押し付けて被加工材に型のパターンを転写する微小型押成形装置において、前記型支持部又は被加工材支持部のいずれか一方に磁石を配置し、他方に磁性体又は磁石を配置し、磁気吸引力により前記型と被加工材との間の押し付け方向と直交する方向への相対移動を防止するようにしたことを特徴とするものである。
【０００６】
本発明によれば、型と被加工材とを互いに押し付ける際に、型を支持する型支持部と被加工材を支持する被加工材支持部との間に磁気吸引力を働かせることができる。したがって、磁気吸引力により前記型と被加工材との間の押し付け方向と直交する方向への相対移動を防止することができ、高精度な型押成形が可能になる。
【０００７】
本発明の１態様によれば、前記型支持部又は被加工材支持部の少なくとも一方に弾性体を配置し、前記型および被加工材の少なくとも一方を弾性体を介して支持させたことを特徴とする。
本発明によれば、型と被加工材とを押し付ける際に、型および被加工材の少なくとも一方を弾性体を介して弾性力により支持させることができる。したがって、型のパターン面と被加工材の被加工面のいずれか一方を他方に対して倣うように変位させることにより、型と被加工材の平行度を維持することができ、型のパターン面と被加工材の被加工面を均一に押圧することが可能になる。
【０００８】
本発明の１態様によれば、前記磁石は電磁石からなることを特徴とする。
また、本発明の１態様によれば、前記弾性体は、ゴム又は圧縮コイルバネ又は流体を封入したバッグからなることを特徴とする。
【０００９】
【発明の実施の形態】
以下、本発明に係る微小型押成形装置の実施形態を図１及び図２を参照して説明する。
図１は、本発明に係る微小型押成形装置の全体構成を示す概略図である。図１に示すように、微小型押成形装置は、型１を支持する型支持部２と、型を鉛直方向に駆動する移動機構３と、被加工材４を支持する被加工材支持部５と、被加工材４を保持してＸ，Ｙ方向に移動可能なＸＹステージ６とを備えている。型１には、下面に転写用の凹凸のパターンが形成されている。
【００１０】
上述の構成において、被加工材４の型押成形に際しては、まずはじめに被加工材４が固定されたＸＹステージ６を用い、被加工材上で型押成形を行う位置を型１の直下へ移動させる。次に、型１を移動機構３により被加工材４に除々に接近させ、型１と被加工材４との間の位置ずれを防ぐとともに型１の下面（パターン面）と被加工材の上面（被加工面）を平行に接触させ、型１を所定の圧力で被加工材４に押し付ける。その後、被加工材４を硬化させ、型１を被加工材４より引き離すことで、被加工材４に型１のパターンを転写することができる。
【００１１】
図２に、図１に示す微小型押成形装置における、型支持部２および被加工材支持部５の詳細を示す。図２に示すように、型１は支持部材７に固定されるようになっており、型１と支持部材７の間に磁石８と弾性体９が配置されている。すなわち、型支持部２は支持部材７と磁石８と弾性体９とから構成されている。一方、被加工材４は、支持部材１０に固定されるようになっており、被加工材４と支持部材１０の間に磁性体１１が配置されている。すなわち、被加工材支持部５は支持部材１０と磁性体１１とから構成されている。磁石８は電磁石又は永久磁石により構成されている。また弾性体９は、ゴム又は圧縮コイルバネ又は流体を封入したバッグから構成されている。なお、磁性体１１は磁石に代えることもできる。
【００１２】
図２に示す構成において、型１と被加工材４とを互いに押し付ける際に、型１を支持する型支持部２と被加工材４を支持する被加工材支持部５との間に磁気吸引力を働かせることができる。したがって、磁気吸引力により型１と被加工材４との間の押し付け方向Ａと直交する方向への相対移動を防止することができ、高精度な型押成形が可能になる。また、型１と被加工材４とを押し付ける際に、型１を弾性体９を介して弾性力により支持させることができる。したがって、型１のパターン面を被加工材４の被加工面に対して倣うように変位させることにより、型１と被加工材４の平行度を維持することができ、型１のパターン面と被加工材４の被加工面を均一に押圧することが可能になる。なお、この構成において、弾性体９に磁性体あるいは磁石を入れ込んだ素材を用い、弾性体と磁石あるいは磁性体の作用をひとつの素材でまかなう構造としてもかまわない。
【００１３】
上述したように、図２に示す構成において、型１と被加工材４が押しつけられる過程において、型１のパターン面と被加工材４の被加工面の平行度を、弾性体９で維持することにより、押し付け力の不均一を吸収し、磁石８と磁性体１１との間に作用する磁気吸引力で型１と被加工材４の位置ずれを防ぐことができる。本発明に係る微小型押成形装置の他の実施形態として、型と被加工材を上下逆に固定してもよい。すなわち、型１を磁性体１１（すなわち支持部材１０）に、被加工材４を磁石８（すなわち支持部材７）に固定してもよい。この形態にあっても、図２に示す実施形態と同様の作用効果を奏する。
【００１４】
【発明の効果】
以上説明したように、本発明の微小型押成形装置によれば、加工開始から終了までの間、型と被加工材の位置ずれを防ぎ、型のパターン面と被加工材の被加工面の平行度を維持することができる。このため、高精度に型押成形が行える。
【図面の簡単な説明】
【図１】本発明に係る微小型押成形装置の全体構成を示す概略図である。
【図２】図１に示す微小型押成形装置における、型支持部および被加工材支持部の詳細を示す図である。
【符号の説明】
１　　型
２　　型支持部
３　　型の移動機構
４　　被加工材
５　　被加工材支持部
６　　ＸＹステージ
７　　型支持部材
８　　磁石
９　　弾性体
１０　　被加工材支持部材
１１　　磁性体[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro die forming apparatus, and more particularly to a micro die capable of preventing displacement of a die and a workpiece when pressing the die and the workpiece together, and maintaining parallelism between the die and the workpiece. The present invention relates to a pressing device.
[0002]
[Prior art]
2. Description of the Related Art In recent years, attention has been paid to a micro embossing (also referred to as nanoimprint) technique. In the nanoimprint technique, a pattern on which an uneven pattern is formed is pressed against a liquid polymer (workpiece) or the like on a substrate to transfer the pattern. Attempts have been made to apply nanoimprint technology to new applications, such as the formation of semiconductors, optical devices, or nanostructured materials. This nanoimprint technology enables mass production of structures close to 10 nm at low cost and enables high precision. It is a technology to do.
In the embossing apparatus used for the nanoimprint, a mechanism for contacting or fixing the mold and the workpiece in parallel is indispensable. In the conventional embossing apparatus, the parallelism between the plane of the support member of the mold and the plane of the support member of the workpiece depends on the machining accuracy.
[0003]
In the above-described conventional method, the degree of parallelism between the plane of the support member of the mold and the plane of the support member of the workpiece deteriorates with the number of transfers. Further, when setting the mold and the workpiece, it is necessary to maintain strict parallelism between the mold or the workpiece and these supporting members.
However, it has been difficult to hold the mold and the workpiece so as not to cause a positional shift from the start to the end of the processing in the micro stamping apparatus. In particular, when the surface to be processed is flat before processing, if the parallelism between the two is not secured at the moment of contact with the mold, a slip phenomenon occurs between the two, and accurate embossing cannot be performed.
[0004]
[Problems to be solved by the invention]
The present invention has been made in view of the above-described problems of the related art, and has as its object to provide a micro stamping apparatus capable of preventing displacement of a mold and a workpiece and maintaining parallelism between the mold and the workpiece. And
[0005]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a micro stamping method for transferring a mold pattern onto a workpiece by pressing the mold supported by the mold support and the workpiece supported by the workpiece support against each other. In the molding apparatus, a magnet is arranged on one of the mold support portion and the workpiece support portion, and a magnetic body or magnet is arranged on the other, and a pressing direction between the mold and the work material by a magnetic attraction force. Characterized in that relative movement in a direction perpendicular to the direction is prevented.
[0006]
According to the present invention, when the mold and the workpiece are pressed against each other, a magnetic attraction force can be exerted between the mold supporting portion supporting the mold and the workpiece supporting portion supporting the workpiece. Therefore, relative movement in the direction orthogonal to the pressing direction between the mold and the workpiece can be prevented by the magnetic attraction force, and highly accurate embossing can be performed.
[0007]
According to one aspect of the present invention, an elastic body is disposed on at least one of the mold support portion or the workpiece support portion, and at least one of the mold and the workpiece is supported via an elastic body. And
According to the present invention, when pressing the mold and the workpiece, at least one of the mold and the workpiece can be supported by the elastic force via the elastic body. Therefore, by displacing one of the pattern surface of the mold and the work surface of the workpiece so as to follow the other, the parallelism between the mold and the work material can be maintained, and the pattern surface of the mold can be maintained. Thus, the work surface of the work material can be pressed uniformly.
[0008]
According to one aspect of the present invention, the magnet comprises an electromagnet.
Further, according to one aspect of the present invention, the elastic body is made of rubber, a compression coil spring, or a bag in which fluid is sealed.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a micro stamping device according to the present invention will be described with reference to FIGS.
FIG. 1 is a schematic view showing the entire configuration of a micro stamping apparatus according to the present invention. As shown in FIG. 1, the micro stamping apparatus includes a mold support 2 for supporting the mold 1, a moving mechanism 3 for driving the mold in the vertical direction, and a work support 5 for supporting the work 4. And an XY stage 6 that can hold the workpiece 4 and move in the X and Y directions. On the lower surface of the mold 1, an uneven pattern for transfer is formed.
[0010]
In the above-described configuration, when embossing the workpiece 4, first, the XY stage 6 to which the workpiece 4 is fixed is used, and the position where the embossing is performed on the workpiece is moved directly below the mold 1. Let it. Next, the mold 1 is gradually approached to the workpiece 4 by the moving mechanism 3 to prevent the displacement between the mold 1 and the workpiece 4, and the lower surface (pattern surface) of the mold 1 and the upper surface of the workpiece (Work surface) are brought into parallel contact, and the mold 1 is pressed against the work material 4 at a predetermined pressure. Thereafter, the pattern of the mold 1 can be transferred to the workpiece 4 by curing the workpiece 4 and separating the mold 1 from the workpiece 4.
[0011]
FIG. 2 shows details of the mold support portion 2 and the workpiece support portion 5 in the micro stamping apparatus shown in FIG. As shown in FIG. 2, the mold 1 is fixed to a support member 7, and a magnet 8 and an elastic body 9 are arranged between the mold 1 and the support member 7. That is, the mold support portion 2 includes the support member 7, the magnet 8, and the elastic body 9. On the other hand, the workpiece 4 is fixed to the support member 10, and the magnetic body 11 is arranged between the workpiece 4 and the support member 10. That is, the workpiece support portion 5 includes the support member 10 and the magnetic body 11. The magnet 8 is constituted by an electromagnet or a permanent magnet. The elastic body 9 is made of rubber, a compression coil spring, or a bag in which a fluid is sealed. Note that the magnetic body 11 can be replaced with a magnet.
[0012]
In the configuration shown in FIG. 2, when the mold 1 and the workpiece 4 are pressed against each other, magnetic attraction occurs between the mold support 2 supporting the mold 1 and the workpiece support 5 supporting the workpiece 4. You can work out the power. Therefore, relative movement between the mold 1 and the workpiece 4 in a direction orthogonal to the pressing direction A can be prevented by the magnetic attraction force, and highly accurate embossing can be performed. Further, when pressing the mold 1 and the workpiece 4, the mold 1 can be supported by the elastic force via the elastic body 9. Therefore, by displacing the pattern surface of the mold 1 so as to follow the work surface of the work material 4, the parallelism between the mold 1 and the work material 4 can be maintained, and the pattern surface of the mold 1 The work surface of the work material 4 can be pressed uniformly. In this configuration, a material in which a magnetic material or a magnet is inserted into the elastic body 9 may be used, and the function of the elastic body and the magnet or the magnetic body may be covered by one material.
[0013]
As described above, in the configuration shown in FIG. 2, in the process of pressing the mold 1 and the workpiece 4, the parallelism between the pattern surface of the mold 1 and the workpiece surface of the workpiece 4 is maintained by the elastic body 9. Thereby, the uneven pressing force can be absorbed, and the displacement between the mold 1 and the workpiece 4 can be prevented by the magnetic attraction force acting between the magnet 8 and the magnetic body 11. As another embodiment of the micro stamping apparatus according to the present invention, the mold and the workpiece may be fixed upside down. That is, the mold 1 may be fixed to the magnetic body 11 (that is, the support member 10), and the workpiece 4 may be fixed to the magnet 8 (that is, the support member 7). Even in this embodiment, the same operation and effect as those of the embodiment shown in FIG. 2 are obtained.
[0014]
【The invention's effect】
As described above, according to the micro stamping apparatus of the present invention, the displacement between the mold and the workpiece is prevented from the start to the end of the processing, and the pattern surface of the mold and the workpiece surface of the workpiece are prevented. Parallelism can be maintained. For this reason, embossing can be performed with high precision.
[Brief description of the drawings]
FIG. 1 is a schematic view showing the entire configuration of a micro stamping apparatus according to the present invention.
FIG. 2 is a view showing details of a mold support portion and a workpiece support portion in the micro stamping apparatus shown in FIG.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 mold 2 mold support 3 mold moving mechanism 4 work material 5 work material support 6 XY stage 7 mold support member 8 magnet 9 elastic body 10 work material support member 11 magnetic body

Claims (4)

型支持部により支持された型と被加工材支持部により支持された被加工材を互いに押し付けて被加工材に型のパターンを転写する微小型押成形装置において、
前記型支持部又は被加工材支持部のいずれか一方に磁石を配置し、他方に磁性体又は磁石を配置し、磁気吸引力により前記型と被加工材との間の押し付け方向と直交する方向への相対移動を防止するようにしたことを特徴とする微小型押成形装置。In a micro stamping apparatus that presses a mold supported by a mold support and a workpiece supported by a workpiece support to transfer a pattern of the mold to the workpiece,
A magnet is disposed on one of the mold support portion and the workpiece support portion, and a magnetic body or magnet is disposed on the other, and a direction perpendicular to the pressing direction between the mold and the workpiece by magnetic attraction. A minute embossing device characterized by preventing relative movement to the mold. 前記型支持部又は被加工材支持部の少なくとも一方に弾性体を配置し、前記型および被加工材の少なくとも一方を弾性体を介して支持させたことを特徴とする請求項１記載の微小型押成形装置。2. The micro-mold according to claim 1, wherein an elastic body is disposed on at least one of the mold support portion and the workpiece support portion, and at least one of the mold and the workpiece is supported via an elastic body. Stamping equipment. 前記磁石は電磁石からなることを特徴とする請求項１又は２記載の微小型押成形装置。3. The apparatus according to claim 1, wherein the magnet comprises an electromagnet. 前記弾性体は、ゴム又は圧縮コイルバネ又は流体を封入したバッグからなることを特徴とする請求項２又は３記載の微小型押成形装置。4. The micro-molding and molding apparatus according to claim 2, wherein the elastic body is made of rubber, a compression coil spring, or a bag in which a fluid is sealed.
JP2002190094A 2002-06-28 2002-06-28 Micro-extruder Pending JP2004034300A (en)

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