JP2004029790A - Resin composition for molding multi-fiber optical connector ferrule - Google Patents
Resin composition for molding multi-fiber optical connector ferrule Download PDFInfo
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Abstract
Description
【０００１】
【発明の属する技術分野】
本発明は光通信において、光ファイバを位置決め保持して結合を実現する多心光コネクタフェルールの成形に用いる樹脂組成物と、その組成物を用いた多心光コネクタフェルールに関するものである。
【０００２】
【従来の技術】
図１は樹脂成形により得られた光コネクタフェルールの一例の斜視図である。図面において、１は光コネクタフェルール本体、２は嵌合ピン挿入用穴、３は光ファイバ挿入用穴、４は光ファイバ挿入用開口部である。
【０００３】
このような光コネクタフェルールの成形は、嵌合ピン挿入用穴及び光ファイバ挿入用穴を形成するための成形ピンを金型内に装備し、該金型内にトランスファ成形により熱硬化性樹脂を主体とする樹脂組成物を注入し、硬化することにより成形させる（類似の技術として例えば特許文献１）。
【０００４】
上記樹脂組成物は硬化前は固体粉末で、これをタブレット状に固めたものを使用しており、成形機のポット内で溶融した後、プランジャで加圧し、金型内のランナを通ってゲートからキャビティ内に注入した後硬化させる。
【０００５】
上記樹脂組成物は熱硬化性のエポキシ樹脂に多量のシリカ粉を充填剤として配合したものであり、このような充填剤を高充填することにより、樹脂の線膨張係数、成形収縮率が小さく、非常に寸法精度の高い成形品が得られる。
【０００６】
【特許文献１】特公昭６１−５５６４７号公報
【０００７】
【発明が解決しようとする課題】
上述のように、光コネクタフェルールに用いられる樹脂は、線膨張係数、成形収縮率をできるだけ小さくし、寸法精度を良くするために多量のシリカからなる充填剤が含まれている。そのために、金型内での流動性が良くなく、ゲートからキャビティに樹脂が注入される際の圧力によって金型内に装備された嵌合ピン挿入用穴及び光ファイバ挿入用穴を形成するための成形ピンを動かし易いという問題があった。
【０００８】
又キャビティ内での樹脂の流動性が悪いために、金型への転写性が良くなく、平坦な形状になり難く、さらに成形時の残留歪により、成形後放置することにより経時的に変形し易いという問題点があった。
【０００９】
【課題を解決するための手段】
上述の問題点を解決するために、種々検討の結果、シリカ粉末の形状と含有量および滑材の含有量を特定することにより、樹脂の流動性が良くなることがわかった。
【００１０】
即ち、本発明多芯光コネクタフェル―ル成形用樹脂組成物の特徴は、形状が粒状、球状、破砕状の角を丸めたもののいずれかであるシリカ粉末からなる充填剤を７５重量％以上、９０重量％以下の充填率で含有し、かつ該シリカ粉末の粒径が最大粒径１００μｍ以下、中心粒径２０μｍ以下の粒度分布を有し、さらに上記滑剤を０．３重量％以上、１．０重量％以下の充填率で含有していることにある。好ましくは、エポキシ樹脂、球状のシリカ粉末、シランカップリング剤及び滑剤を必須成分とする。
【００１１】
本発明の樹脂組成物は、シリカ粉末からなる充填剤が７５〜９０重量％と高充填であるため、線膨張係数、成形収縮率が小さく、寸法精度にすぐれた成形品が得られる。
【００１２】
しかも、シリカ粉末充填剤の最大粒径を１００μｍ以下、中心粒径を２０μｍとして粒径を小さくし、形状も粒状もしくは破砕状の角をおとして丸くしたものを用いるため、流動性が良くなり、金型転写性が良くなって平坦な形状となる。又流動性が良くなるので成形時の残留歪が生じにくくなり、長期にわたって変形がおこりにくく、寸法安定性にすぐれる。
【００１３】
さらに滑剤を加えることにより、金型と樹脂の間の滑りが良くなり、流動性が改善される。滑剤としては、ステアリン酸鉛、ステアリン酸亜鉛等のステアリン酸塩やワックス類が好適である。又その含有量は０．３％以下では効果はなく、１．０％を越えると滑剤が成形後金型表面に残って金型が汚れやすく、またシリカ粉末と樹脂の密着性を害うおそれがある。
【００１４】
本発明に用いられる樹脂としては、エポキシ樹脂が最も一般的であるが、フェノール樹脂、尿素樹脂、メラミン樹脂、シリコン樹脂等の熱硬化性樹脂が挙げられる。又シリカ粉末、シランカップリング剤、滑剤の他に必要に応じて、添加剤として硬化促進剤、難燃剤、離型剤、カーボン、低応力化剤等を添加することができる。
【００１５】
又シランカップリング剤の配合により、シリカ粉末充填剤とベースレジンの接着力をより強固にし、高強度化が達成され、コネクタ同士を着脱する際にも破損しにくくなる。
【００１６】
上記の樹脂組成物は、金型内に注入してトランスファ成形により光コネクタフェルールを成形することができる。その際、金型のゲートを通過する時の樹脂の溶融粘度が５０ｐｏｉｓｅ以上、５００ｐｏｉｓｅ以下であることが好ましい。さらに好ましい条件としては、金型温度が１６０℃以上、１９０℃以下、樹脂の注入速度が０．０３ｃｃ／ｓｅｃ以上、５．００ｃｃ／ｓｅｃ以下、ゲート断面積が０．３ｍｍ２以上、２．０ｍｍ２以下が挙げられる。
【００１７】
上記の光コネクタフェルールの成形方法においては、金型のゲートを通過する時の樹脂の溶融粘度が５０ｐｏｉｓｅ以上、５００ｐｏｉｓｅ以下と低粘度であるため、低圧で樹脂を注入することができ、金型内に装備した成形ピンを動かすおそれがない。又樹脂の流動性が良くなるので、金型への転写性が良く平坦な形状に成形でき、さらに成形時に残留歪が発生し難いので長時間放置しても変形し難い。ゲート通過時の樹脂の溶融粘度が５０ｐｏｉｓｅ未満の低粘度で形成した場合には、樹脂の流れが良くなりすぎて金型内の隙間に樹脂が流れ込み、多量のバリが発生してしまう。
【００１８】
また、本発明多心光コネクタフェルールは上記の樹脂組成物を用いて製造されたことを特徴とする。本発明樹脂は流動性が良いので、金型内に装備した成形ピンが動き難く、しかも金型転写性にすぐれ、長期放置後の変形量が少ない光コネクタフェルールが得られる。
【００１９】
【発明の実施の形態】
その１：成形ピンを装備した金型をトランスファ成形機にセットし、エポキシ樹脂からなる成形樹脂材料を、金型温度１８０℃、注入速度０．５ｃｃ／ｓｅｃ、注入圧力１００ｋｇ／ｃｍ２の条件で５分間加圧し、硬化させて図１に示す多心光コネクタフェルールを得た。なお、ゲート断面積は１ｍｍ２とし、ゲート通過時の樹脂の溶融粘度は表１に示す５条件に調整した。
【００２０】
各光コネクタフェルールに外径１２５μｍφのシングルモード光ファイバを挿入固定し、基準となるマスタコネクタと結合した際の波長１．３μｍにおける接続損失をそれぞれについて各２０コ測定し、各心の平均値を比較した。又各光コネクタフェルールについて、金型転写性を評価するために、光コネクタフェルール下面中央部の反り量を表面粗さ計で測定し、さらに１年間常温で放置した後の変形量を同様に表面粗さ計で測定し、評価した。評価の結果は表１の通りである。
【００２１】
【表１】
上記の成形方法により成形された光コネクタフェルールは、平均接続損失０．３５ｄＢ以下、反り量０．４μｍ以下、１年後の変形量を０．２μｍ以下に抑えることができると共に、バリの発生もみられなかった。
【００２３】
その２：フェノールノボラック型エポキシ樹脂に、表２に示した含有率、形状、粒径分布を有する７種類のシリカ粉末充填剤と、微量のシランカップリング剤、滑剤、硬化促進剤、カーボンを配合し熱ロールにかけて混練した後、冷却粉砕して、本発明ならびに比較例の成形用樹脂組成物を得た。この樹脂組成物をトランスファ成形機内にセットされた金型内に注入し、温度１５０℃で５分、注入圧力１００ｋｇ／ｃｍ２の条件でトランスファ成形して図１に示す多心光コネクタフェルールを得た。
【００２４】
各光コネクタフェルールについて、金型転写性を評価するために、コネクタフェルール下面中央部の反り量を表面粗さ計で測定、さらに、１年間常温で放置した後の変形量を同様に表面粗さ計で測定した。又嵌合ピン挿入用穴の強度を評価するために、挿入用穴にステンレス製嵌合ピンを５．５ｍｍ挿入し、コネクタフェルール端面から５ｍｍ突き出たピン部分を５ｍｍ／ｍｉｎの加圧速度でフェルール外側の肉厚の最も薄い方向へ加圧した時の破断強度を測定した。評価結果を表２に示す。
【００２５】
【表２】
表２より分るように、本発明の樹脂組成物を用いた光コネクタフェルールは、反り量は０．４μｍ以下、１年後の変形量０．２μｍ以下、ガイド穴強度１．０ｋｇ以上と十分な値を示し、同時に成形収縮率も０．４％以下と、寸法精度も良好であった。
これに対して、シリカ粉末の含有量が７０重量％の比較例１は線膨張係数が大きく、破砕状シリカを用いた比較例２、及びシリカ最大粒径１１０μｍ、中心粒径２５μｍの比較例３はいずれも反り量、１年放置後の変形量ともに大きかった。
【００２７】
又上記試作した光コネクタフェルールに、外径１２５μｍφのシングルモード光ファイバを挿入固定し、１．３μｍ波長における接続損失を測定したところ、４心の平均接続損失はいずれも０．３ｄＢ以下と良好であった。
【００２８】
【発明の効果】
以上説明したように、本発明の光コネクタフェルール成形用樹脂組成物によれば、樹脂の流動性が良いので、金型内に装備した成形ピンが動き難く、しかも金型転写性にすぐれ、長期放置後の変形量が少ない光コネクタフェルールが得られる。
【００２９】
本発明の成形用樹脂組成物により得られた光コネクタフェルールは線膨張係数、成形収縮率が小さく、寸法精度にすぐれ、又樹脂の流動性が良く、金型転写性が良好なことから、平坦な形状となり、残留歪が生じにくく、長期にわたって変形しにくく、寸法安定性にすぐれている。
【００３０】
さらに、シランカップリング剤の配合により、シリカ粉末充填剤とベースレジンとの接着力が強固で、コネクタ同士の着脱の際にも損傷しにくい。さらに又、滑剤を加えることにより、金型と樹脂の間の滑りが良くなり、流動性が一層改善される。
【図面の簡単な説明】
【図１】光コネクタフェルールの一例の斜視図である。
【符号の説明】
１ 光コネクタフェルール
２ 嵌合ピン挿入用穴
３ 光ファイバ挿入用穴
４ 光ファイバ挿入用開口部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a resin composition used for molding a multi-core optical connector ferrule that realizes coupling by positioning and holding an optical fiber in optical communication, and a multi-core optical connector ferrule using the composition.
[0002]
[Prior art]
FIG. 1 is a perspective view of an example of an optical connector ferrule obtained by resin molding. In the drawings, 1 is an optical connector ferrule main body, 2 is a fitting pin insertion hole, 3 is an optical fiber insertion hole, and 4 is an optical fiber insertion opening.
[0003]
In molding such an optical connector ferrule, a molding pin for forming a fitting pin insertion hole and an optical fiber insertion hole is provided in a mold, and a thermosetting resin is formed in the mold by transfer molding. A resin composition as a main component is injected and cured to be molded (for example, Patent Document 1 discloses a similar technique).
[0004]
The above-mentioned resin composition is a solid powder before curing, which is used by solidifying it into a tablet.After melting in a pot of a molding machine, pressurizing with a plunger, and passing through a runner in a mold, a gate is formed. And then cured.
[0005]
The resin composition is obtained by blending a large amount of silica powder as a filler into a thermosetting epoxy resin.By filling such a filler at a high level, the coefficient of linear expansion of the resin and the molding shrinkage are small, A molded product with extremely high dimensional accuracy can be obtained.
[0006]
[Patent Document 1] Japanese Patent Publication No. 61-55647
[Problems to be solved by the invention]
As described above, the resin used in the optical connector ferrule contains a large amount of a filler made of silica in order to minimize the linear expansion coefficient and the molding shrinkage and improve the dimensional accuracy. Therefore, the fluidity in the mold is not good, and the pressure when the resin is injected from the gate into the cavity is used to form the fitting pin insertion hole and the optical fiber insertion hole provided in the mold. There is a problem that the molding pin is easily moved.
[0008]
In addition, because the flowability of the resin in the cavity is poor, the transferability to the mold is not good, and it is difficult to obtain a flat shape. There was a problem that it was easy.
[0009]
[Means for Solving the Problems]
As a result of various studies to solve the above problems, it has been found that by specifying the shape and content of the silica powder and the content of the lubricant, the fluidity of the resin is improved.
[0010]
That is, the feature of the resin composition for molding ferrule of the multi-core optical connector of the present invention is that a filler composed of a silica powder having a granular, spherical, or crushed shape with rounded corners is 75% by weight or more, The silica powder has a filling rate of 90% by weight or less, and the silica powder has a particle size distribution with a maximum particle size of 100 μm or less and a central particle size of 20 μm or less. That is, it is contained at a filling rate of 0% by weight or less. Preferably, an epoxy resin, a spherical silica powder, a silane coupling agent and a lubricant are essential components.
[0011]
Since the resin composition of the present invention has a high filling ratio of 75 to 90% by weight of a filler made of silica powder, a molded product having a small linear expansion coefficient and a small molding shrinkage and excellent dimensional accuracy can be obtained.
[0012]
In addition, the maximum particle size of the silica powder filler is 100 μm or less, the central particle size is 20 μm, the particle size is reduced, and the shape is rounded with rounded or crushed corners. The mold transferability is improved, resulting in a flat shape. In addition, since fluidity is improved, residual strain during molding is less likely to occur, deformation is less likely to occur over a long period of time, and dimensional stability is excellent.
[0013]
By further adding a lubricant, the slip between the mold and the resin is improved, and the fluidity is improved. As the lubricant, stearates such as lead stearate and zinc stearate and waxes are suitable. If the content is less than 0.3%, there is no effect, and if it exceeds 1.0%, the lubricant remains on the mold surface after molding and the mold is easily stained, and the adhesion between the silica powder and the resin may be impaired. There is.
[0014]
As the resin used in the present invention, an epoxy resin is the most common, and a thermosetting resin such as a phenol resin, a urea resin, a melamine resin, and a silicone resin is exemplified. In addition to the silica powder, the silane coupling agent and the lubricant, if necessary, a curing accelerator, a flame retardant, a release agent, carbon, a stress reducing agent, etc. can be added as additives.
[0015]
In addition, by the addition of the silane coupling agent, the adhesive force between the silica powder filler and the base resin is further strengthened, the strength is increased, and the connectors are hardly damaged when detached.
[0016]
The above resin composition can be injected into a mold to form an optical connector ferrule by transfer molding. At this time, the resin preferably has a melt viscosity of 50 poise or more and 500 poise or less when passing through the gate of the mold. More preferably, the mold temperature is 160 ° C. or more and 190 ° C. or less, the resin injection rate is 0.03 cc / sec or more and 5.00 cc / sec or less, and the gate cross-sectional area is 0.3 mm 2 or more and 2.0 mm or less. 2 or less.
[0017]
In the molding method of the optical connector ferrule described above, the resin has a low melt viscosity of 50 poise or more and 500 poise or less when passing through the gate of the mold. There is no danger of moving the molding pin equipped on the vehicle. In addition, since the fluidity of the resin is improved, the resin can be molded into a flat shape with good transferability to a mold. Further, since residual distortion hardly occurs during molding, it is hardly deformed even if left for a long time. If the resin has a low melt viscosity of less than 50 poise when passing through the gate, the flow of the resin becomes too good, and the resin flows into the gaps in the mold, causing a large amount of burrs.
[0018]
Further, a multi-core optical connector ferrule of the present invention is manufactured using the above resin composition. Since the resin of the present invention has good fluidity, a molding pin provided in a mold is difficult to move, and an optical connector ferrule having excellent mold transferability and a small amount of deformation after long-term standing can be obtained.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Part 1: A mold equipped with a molding pin is set in a transfer molding machine, and a molding resin material made of an epoxy resin is molded under the conditions of a mold temperature of 180 ° C., an injection speed of 0.5 cc / sec, and an injection pressure of 100 kg / cm 2 . Pressing for 5 minutes and curing were performed to obtain a multi-core optical connector ferrule shown in FIG. The gate cross-sectional area was 1 mm 2, and the melt viscosity of the resin when passing through the gate was adjusted to the five conditions shown in Table 1.
[0020]
A single-mode optical fiber having an outer diameter of 125 μm φ is inserted and fixed in each optical connector ferrule, and connection loss at a wavelength of 1.3 μm when coupled with a master connector serving as a reference is measured for each of 20 pieces, and an average value of each core is measured. Compared. For each optical connector ferrule, in order to evaluate the mold transferability, measure the amount of warpage at the center of the lower surface of the optical connector ferrule with a surface roughness meter, and further measure the amount of deformation after leaving at room temperature for one year. It was measured and evaluated with a roughness meter. Table 1 shows the results of the evaluation.
[0021]
[Table 1]
The optical connector ferrule molded by the above-described molding method can suppress the average splice loss of 0.35 dB or less, the amount of warpage of 0.4 μm or less, and the deformation after one year to 0.2 μm or less, and generate burrs. I couldn't.
[0023]
Part 2: Seven kinds of silica powder fillers having the content, shape, and particle size distribution shown in Table 2 and a small amount of a silane coupling agent, a lubricant, a curing accelerator, and carbon are mixed with a phenol novolak type epoxy resin. Then, the mixture was kneaded with a hot roll and then cooled and pulverized to obtain a molding resin composition of the present invention and a comparative example. This resin composition was injected into a mold set in a transfer molding machine, and was subjected to transfer molding at a temperature of 150 ° C. for 5 minutes under an injection pressure of 100 kg / cm 2 to obtain a multi-core optical connector ferrule shown in FIG. Was.
[0024]
For each optical connector ferrule, to evaluate the mold transferability, measure the amount of warpage at the center of the lower surface of the connector ferrule with a surface roughness meter, and then measure the amount of deformation after standing at room temperature for one year. It was measured with a meter. In order to evaluate the strength of the fitting pin insertion hole, a stainless fitting pin is inserted 5.5 mm into the insertion hole, and the pin portion protruding 5 mm from the connector ferrule end face is pressed at a pressing speed of 5 mm / min. The breaking strength when pressing in the direction of the thinnest outer wall was measured. Table 2 shows the evaluation results.
[0025]
[Table 2]
As can be seen from Table 2, the optical connector ferrule using the resin composition of the present invention has a warpage of 0.4 μm or less, a deformation after one year of 0.2 μm or less, and a guide hole strength of 1.0 kg or more. At the same time, the molding shrinkage was 0.4% or less, and the dimensional accuracy was also good.
On the other hand, Comparative Example 1 having a silica powder content of 70% by weight had a large linear expansion coefficient and Comparative Example 2 using crushed silica, and Comparative Example 3 having a silica maximum particle size of 110 μm and a central particle size of 25 μm. In each case, the amount of warpage and the amount of deformation after being left for one year were both large.
[0027]
Further, a single mode optical fiber having an outer diameter of 125 μm was inserted and fixed in the optical connector ferrule manufactured above, and the connection loss at a 1.3 μm wavelength was measured. The average connection loss of the four cores was 0.3 dB or less. there were.
[0028]
【The invention's effect】
As described above, according to the resin composition for molding an optical connector ferrule of the present invention, since the fluidity of the resin is good, the molding pins provided in the mold are difficult to move, and the mold transferability is excellent, and the An optical connector ferrule with a small amount of deformation after standing is obtained.
[0029]
The optical connector ferrule obtained by using the molding resin composition of the present invention has a low linear expansion coefficient, a small molding shrinkage, excellent dimensional accuracy, good flowability of the resin, and good mold transferability. It is hardly deformed over a long period of time, and has excellent dimensional stability.
[0030]
Further, by the addition of the silane coupling agent, the adhesive force between the silica powder filler and the base resin is strong, and the connector is hardly damaged when detached. Furthermore, by adding a lubricant, the slip between the mold and the resin is improved, and the fluidity is further improved.
[Brief description of the drawings]
FIG. 1 is a perspective view of an example of an optical connector ferrule.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Optical connector ferrule 2 Fitting pin insertion hole 3 Optical fiber insertion hole 4 Optical fiber insertion opening
Claims (3)
滑剤を０．３重量％以上、１．０重量％以下の充填率を含有していることを特徴とする多心光コネクタフェルール成形用樹脂組成物。A filler made of a silica powder having a shape of any of granular, spherical, or crushed and having rounded corners is contained at a filling ratio of 75% by weight or more and 90% by weight or less, and the particle size of the silica powder is the largest. Having a particle size distribution with a particle size of 100 μm or less and a central particle size of 20 μm or less,
A resin composition for molding a ferrule for a multi-core optical connector, comprising a filling ratio of 0.3% by weight or more and 1.0% by weight or less of a lubricant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003165181A JP3726908B2 (en) | 1993-01-20 | 2003-06-10 | Multi-fiber optical connector ferrule molding resin composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2616893 | 1993-01-20 | ||
| JP3747293 | 1993-02-01 | ||
| JP2003165181A JP3726908B2 (en) | 1993-01-20 | 2003-06-10 | Multi-fiber optical connector ferrule molding resin composition |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5315993A Division JPH06278157A (en) | 1993-01-20 | 1993-11-22 | Molding method of light connector ferrule and molding resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004029790A true JP2004029790A (en) | 2004-01-29 |
| JP3726908B2 JP3726908B2 (en) | 2005-12-14 |
Family
ID=31191752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003165181A Expired - Lifetime JP3726908B2 (en) | 1993-01-20 | 2003-06-10 | Multi-fiber optical connector ferrule molding resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3726908B2 (en) |
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2003
- 2003-06-10 JP JP2003165181A patent/JP3726908B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3726908B2 (en) | 2005-12-14 |
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