JP2004009189A

JP2004009189A - Polishing tool and polishing member

Info

Publication number: JP2004009189A
Application number: JP2002164536A
Authority: JP
Inventors: Makoto Ueno; 上野　信
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-06-05
Filing date: 2002-06-05
Publication date: 2004-01-15

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing tool in which operability and stability are excellent, a surface to be polished can be polished to a desired shape by an easy operation, durability of the polishing surface is high, polishing using a vicinity of an outer edge can be continuously carried out and a rough polishing part can be simultaneously finishing-polished just after this. <P>SOLUTION: The polishing tool has a rotatable disc-like rotation base plate member 2 in which a polishing surface 72 for rough polishing is provided on one surface; a plurality of movable base plate member 3 provided with a polishing surface 71 for accurate polishing on one surface, connected and provided on a peripheral edge of the rotation base plate member 2 so that the polishing surface 72 for rough polishing and the polishing surface 71 for accurate polishing are positioned at the same side and rotatable making an axis passing through a connection part with the rotation base plate member 2, extending in a tangent direction of a peripheral edge of the rotation base plate member 2 and parallel to the polishing surface 72 for rough polishing; a retaining means for retaining it so that the polishing surface 71 for accurate polishing of the respective movable base plate member 3 becomes the approximately the same plane against the polishing surface for rough polishing of the rotation base plate member 2. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は、サンダー等に装着することによって、被研磨面を所定の形状に研磨する研磨具であって、例えば、車両の板金修理等に好適に用いることができる研磨具に係り、特に、変形可能な環状部に精研用研磨部材を具備し、前記変形可能な環状部の内側に粗研用研磨部材を具備する研磨具に関する。
【０００２】
【従来の技術】
理解を容易にするために、例えば、自動車等の車輌の塗装面に生じた傷や凹みを修理する板金修理に関し、その下地の作成の手順を簡単に説明すると、図１６に示すように鋼板５０上に順に塗装されたプライマー５１、サフェーサ５２、ペイント５３等の塗膜を、サンダー等によって除去する塗膜除去処理がある。
【０００３】
また、その塗膜除去処理と同時あるいはその処理後に、図１７に示すように円滑（平滑）なフェザーエッジＦを、サンダー等によって形成する処理がある。
【０００４】
そして、この塗膜が除去されフェザーエッジＦが形成された損傷部Ｄの凹みをスライヂングハンマ等にて、適正な形状に修正した後に、パテを充填して硬化させ、パテの充填部分を形成する。
【０００５】
ここでフェザーエッジＦを形成する処理とは、塗膜が除去された損傷部Ｄの鋼板５０の面から正常な塗膜面に向けて滑らかな傾斜（約２７〜５４度）を付ける処理である。なお、このフェザーエッジＦを形成する処理は、後に損傷部Ｄにパテを充填する際、パテＰの密着性を良くするために行うとともにパテＰの硬化に伴う体積の減少を抑制して極力平坦なパテの充填面が得られるようにするための処理である。
【０００６】
なお、以下の説明では損傷部Ｄを同義として被研磨面Ｄと称する場合がある。
【０００７】
従来、このフェザーエッジＦを作成する処理においては、ディスクサンダー、ダブルアクションサンダー等の回転式の研磨装置Ｓが一般的に用いられている。これら回転式の研磨装置Ｓは、図１８に示すように圧縮空気や電力を動力源とする回転機構１０１を有し、その回転機構１０１に設けられた回転軸１０２に、表面側に研磨面１０３を有する円形の研磨具１０４が着脱自在に設けられている。そして、その回転機構１０１により回転される研磨具１０４を損傷部Ｄに接触させて研磨する。
【０００８】
また、これらの研磨装置Ｓは損傷部Ｄを単に研磨するものの他、その研磨時に発生する塵埃（研磨屑等）を所定の箇所に設けられた吸引装置によって捕捉しながら研磨する集塵タイプの研磨装置もある。
【０００９】
ここで、前記の塗料除去処理およびフェザーエッジを形成する処理に一般的に用いられるディスクサンダーおよびダブルアクションサンダーを説明すると、ディスクサンダーでは、研磨装置Ｓの回転軸１０２と研磨具１０４の回転中心が同一線上に設けられており、研磨具１０４が研磨装置Ｓの回転軸１０２の回転に伴い回転（自転）する構造となっている。
【００１０】
一方、ダブルアクションサンダーにおいては、研磨装置Ｓの回転軸１０２と研磨具１０４の回転中心が同一線上に設けられ、研磨装置Ｓの回転軸１０２が研磨具１０４を自転させると共に、回転軸１０２が研磨装置Ｓの所定の一点を中心として公転するようになっている。したがって研磨具１０４は、自転しながら所定の一点に対して公転するようになっている。
【００１１】
研磨装置Ｓに支持される研磨具１０４は、研磨装置Ｓの回転軸１０２に支持される心棒１０５を備えた円形の保持板１０６と、その保持板１０６の下面に固定され下面側に研磨材であるサンドペーパを着脱自在に有する研磨パッド１０７とからなり、研磨装置Ｓの回転軸１０２の回転に伴い研磨パッド１０７が回転する構造となっている。なお、保持板１０６は樹脂材等の剛体であり、研磨パッド１０７は硬質スポンジ等の弾性部材にて構成されている。
【００１２】
これらの研磨装置Ｓを使用するにあたっては、例えば、図１８に示すように研磨具１０４が損傷部Ｄに対して若干傾斜して接触するように研磨装置Ｓを両手で保持して研磨する。すなわち、研磨パッド１０４の外周縁の一部分のみを損傷部Ｄに接触させ、この接触した部分すなわち端部１０８を用いて研磨する。なお、研磨具１０４の端部１０８を用いて研磨する理由は、損傷部Ｄに対する研磨パッド１０７の接触面積および接触圧力を研磨状態に応じて容易に変更することができるからである。
【００１３】
【発明が解決しようとする課題】
ところが、この種の研磨装置Ｓの操作に不慣れな人が使用すると削りすぎや削りむらが見られた。特に、研磨具の端部を用い研磨する塗膜除去処理やフェザーエッジを形成する処理などにおいては、これらの現象が顕著に見られた。
【００１４】
これらの要因としては、第１に研磨具の端部での研磨時には損傷部に対する接触面積が小さくなり、損傷部と研磨具との接触圧力の調節が困難となるためである。第２に、研磨パッドが硬質スポンジ等の弾性部材にて構成されているため、僅かな接触圧力の変動および接触角度の変化によって研磨パッドが大きく変形して損傷部に対する研磨具の安定性が損なわれるためである。
【００１５】
また、前記要因により従来の研磨具を用いた研磨では、損傷部Ｄの凹みに対する研磨装置Ｓの操作方向が限られていた。具体的には、図１６に示すように研磨装置Ｓの進行方向に向かって研磨具を傾斜させながらの研磨を行えなかった。すなわち、研磨装置Ｓを引く方向に研磨具Ｓを操作し、研磨しなければならなかった。
【００１６】
この要因としては、研磨装置Ｓに加える押圧力が、高速回転する研磨具の端部に作用し更に研磨具の変形量が多くなり安定性が損なわれるためである。また、研磨具の端部が損傷部Ｄの凹みの中に存在する僅かな凸部にひっかかり、研磨装置を押す方向に操作することが困難だからである。
【００１７】
このように従来の研磨具を使用して良好な研磨面を得るには、高度の熟練技術を要するとともに慎重な操作が必要とされていた。
【００１８】
また、研磨パッドは硬質スポンジ等の弾性部材にて構成されているため、外縁付近を用いた研磨を連続的に行った場合には、研磨パッドが局所的に劣化し、研磨具の早期交換が必要であった。
【００１９】
また、損傷部Ｄの塗膜除去処理、フェザーエッジを形成する処理、硬化したパテの表面を研磨する処理、プライマサフェーサの表面を研磨する処理においては、まず目の粗い粗研用研磨面が設けられている研磨具を用いて荒研磨を行い、続いて、目の細かい精研用研磨面が設けられている研磨具を用いて、前記荒研磨で生じた研磨目を消す仕上げ研磨を行っていた。
【００２０】
本発明は、前記事項に鑑みてなされたものであり、操作性および安定性に優れ、容易な操作で被研磨面を所望の形状に研磨することができ、研磨面の耐久性が高く、外縁付近を用いた研磨を連続的に行うことが可能であり、荒研磨部分をこの荒研磨直後に同時的に仕上げ研磨することができる研磨具を提供することを目的とする。
【００２１】
【課題を解決するための手段】
請求項１に記載の本発明は、一方の表面に粗研用研磨材を保持する粗研用研磨面が設けられた回転可能な円盤状の回転基板部材と、一方の表面に精研用研磨部材を保持する精研用研磨面を具備し、前記粗研用研磨面と前記精研用研磨面とが同じ側になるように前記回転基板部材の周縁に接続して設けられると共に、前記回転基板部材との接続部を通過し、前記回転基板部材の周縁の接線方向に延伸し、前記粗研用研磨面に平行である軸線を中心として回動可能である複数の可動基板部材と、前記各可動基板部材の前記精研用研磨面が、前記回転基板部材の前記粗研用研磨面に対して、ほぼ同一平面となるように保持する保持手段とを有する研磨具である。
【００２２】
請求項２に記載の本発明は、請求項１に記載の研磨具において、前記回転基板部材の外周縁を等分した箇所に、前記各可動基板部材が設けられている研磨具である。
【００２３】
請求項３に記載の本発明は、請求項１または請求項２に記載の研磨具において、前記各可動基板部材の外端縁は、前記回転基板部材外周縁の円よりも大きく、かつ中心が同一である円の円弧を形成する研磨具である。
【００２４】
請求項４に記載の本発明は、請求項１〜請求項３のいずれか１項に記載の研磨具において、前記回転基板部材と前記可動基板部材とに平行かつ所定の間隔をおいて設けられている保持板部材と、前記保持板部材と前記各可動基板部材との間に設けられている複数の弾性部材とを具備し、前記保持手段は、前記各可動基板部材が前記保持板部材側に回動したとき、前記各弾性部材の弾性によって、前記保持板部材から離反する方向に前記各可動基板部材を付勢する手段である研磨具である。
【００２５】
請求項５に記載の本発明は、請求項４に記載の研磨具において、前記回転基板部材に対する前記可動基板部材の回動範囲は、前記可動基板部材の精研用研磨面が前記回転基板部材の粗研用研磨面に対してほぼ同一平面上に存在する位置から、前記可動基板部材の一部が前記保持板部材に接触する位置までの範囲である研磨具である。
【００２６】
請求項６に記載の本発明は、請求項４または請求項５に記載の研磨具において、前記弾性部材は、前記複数の可動基板部材のそれぞれに対して少なくとも１つ設けられている研磨具である。
【００２７】
請求項７に記載の本発明は、請求項４〜請求項６のいずれか１項に記載の研磨具において、前記各研磨面と前記弾性部材と前記保持板部材とを貫通して設けられた集塵通路を有し、この集塵通路は負圧を吸気源とする吸引装置に接続される研磨具である。
【００２８】
請求項８に記載の本発明は、請求項１〜請求項７のいずれか１項に記載の研磨具において、前記粗研用研磨面は、前記回転基板部材に対して着脱自在の膜状の研磨部材からなり、前記精研用研磨面は、前記可動基板部材に対して着脱自在の膜状の研磨部材からなる研磨具である。
【００２９】
請求項９に記載の本発明は、変形可能な環状部を具備する研磨具に使用する膜状の研磨部材において、一方の面に前記研磨具の変形可能な環状部への装着部を備え、他方の面に研磨面を備えて、前記研磨具における変形可能な環状部に対応してリング状に形成した研磨部材である。
【００３０】
【発明の実施の形態】
以下、本発明の一実施形態を、図面を参照して詳細に説明する。
【００３１】
まず、本実施の形態に係る研磨具を、図１を参照して概略的に説明すると、研磨具は、研磨装置Ｓの回転軸１０２に着脱自在に設けられその回転軸１０２の回転に伴い一体的に回転する円形の保持板部材（保持板）１と、保持板部材１の下方に平行且つ所定の間隔を開けて設けられた回転基板部材２および複数の可動基板部材３からなる円形の研磨板６と、その研磨板６と保持板部材１との間に設けられた弾性部材４と、研磨板６の下面に貼着する粘着シート７とを備えている。
【００３２】
そして、損傷部を研磨する研磨面５（図２参照）は、回転基板部材２および可動基板部材３を構成する研磨板６の下面側に相当し、その研磨面５に研磨部材となるサンドペーパが粘着シート７を介して貼着される。ここで下方および下面とは、本実施の形態に係る研磨具の使用状態において損傷部方向を示す。
【００３３】
また、保持板部材１を回転させる研磨装置Ｓとしては、前述したディスクサンダーやダブルアクションサンダー等の研磨装置が好ましいが、例えば、装飾品等に細工を施す小型の研磨装置（リューター）などであってもよい。なお、本実施の形態においては、集塵機能を有した集塵タイプのダブルアクションサンダーに装着する研磨具を例に説明している。
【００３４】
研磨装置Ｓに着脱自在に設けられる保持板部材１は、樹脂や金属等からなる円形の板であり、そのほぼ中心位置に研磨装置Ｓの回転軸１０２に係合する心棒２１が設けられている。そして、この心棒２１が研磨装置Ｓの回転軸に支持され、保持板部材１は研磨装置Ｓの回転軸１０２の回転に伴い回転する。ここで、研磨装置Ｓの回転軸１０２には雄ねじが形成され、保持板部材１に設けられる心棒２１には雌ねじが形成されている。このため研磨装置Ｓに対して保持板部材１を容易に着脱することができる。
【００３５】
保持板部材１の下面には、回転基板部材２および可動基板部材３を構成する円形の研磨板６が弾性部材４を介して保持板部材１と平行且つ所定の間隔を開けて設けられている。この研磨板６は厚さ２ｍｍのＰＶＣ（ポリ塩化ビニル）等の樹脂素材から製作される円板であり、その外径は保持板部材１に比べて若干大きく設けられている。
【００３６】
また、研磨板６には、図６に示すようにその中心から半径方向に向かって半径の約１／２程進んだ点を通り且つ、円形状の研磨板６の中心と同心的な円を描く第１切断線９が設けられている。また、この第１切断線９の円周等分１８箇所には第１切断線９から研磨板６の端部（外周縁）に向かって放射状に延びる複数の第２切断線１０が設けられている。
【００３７】
このため研磨板６は、第１切断線９の内方にて構成される円形のパネル２５と、第１切断線９の外方にて構成され、第１切断線９および第２切断線１０にて分割された複数の略扇状のパネル２６とで構成されている。また、円形のパネル２５および略扇状のパネル２６は研磨板６の下面に設けられた粘着シート７を介して接続されているために各パネル２５、２６は所定の位置から相対的にずれることなく円形の研磨板６を形成している。
【００３８】
また、第１切断線９は約１ｍｍ程の幅を有するため、第１切断線９の内側にて構成される円形のパネル２５に対して第１切断線９の外側に構成される複数の略扇状のパネル２６は、パネル２５とパネル２６との接続部を通過し、円形のパネル２５の周縁の接線方向に延伸し（伸び）、パネル２５の下面に平行な軸線である第１切断線９を軸に、各々の外側を個別に上下に、すなわちパネル２６の厚さ方向に回動することができる。すなわち、本実施の形態では、第１切断線９の内側を構成する円形のパネル２５が回転基板部材２となり、その第１切断線９の外側を構成する複数の略扇状のパネル２６が可動基板部材３となる。以下、円形のパネル２５を回転基板部材２と称し、略扇状のパネル２６を可動基板部材３と称する。
【００３９】
上述のように、各パネル２６の外周縁が各パネル２６の厚さ方向、すなわち上下方向に個別に回動することができる構成によって、変形可能な環状部を構成する。また、複数の略扇状パネル２６の下面には、粘着シート７を介して目の細かい精研用のサンドペーパがリング状に設けられ、精研用研磨面７１が形成されている。また、パネル２５の下面には、粘着シート７を介して目の粗い粗研用のサンドペーパが、精研用研磨面７１に囲まれて設けられ、ほぼ円形の粗研用研磨面７２が形成されている。
【００４０】
なお、粘着シート７の表面（研磨板６に接触している面の裏面）に、例えば、マジックテープ（登録商標）等、フックとループとを備えた支持体からなるファスナーの一方の支持体を、上記精研用サンドペーパと上記粗研用サンドペーパとを着脱交換自在に装着するために設け、サンドペーパ装着部を形成するようにしてもよい。
【００４１】
この場合、上記各サンドペーパにおいて砥粒が装着されている面とは反対側の面には、上記ファスナーの他方の支持体が設けられ、上記粘着シート７の表面への装着部を形成する。
【００４２】
ここで、上記ファスナーを用いて、粘着シート７に上記各サンドペーパを装着する場合の、上記各サンドペーパとしての研磨部材８０の構成を、図１１を用いて説明する。
【００４３】
研磨部材８０は、研磨具１００に設けられ、変形可能な環状部である可動基板部材３に貼り付けて使用する膜状で環状の研磨部材８１と、研磨部材８１の内側で、研磨具１００の回転基板部材２に貼り付けて使用する膜状で円形状の研磨部材８２とによって構成される。
【００４４】
ここで、研磨部材８１と研磨部材８２とは円形の切断線８１Ｃによって分割され、研磨部材８１の内径と、研磨部材８２の外径とがほぼ一致している。また、切断線８１Ｃの直径は、研磨具１００の回転基板部材２の直径とほぼ等しくなっている。
【００４５】
研磨部材８１は、一方の面に研磨具１００の変形可能な環状部である可動基板部材３への装着部（ファスナー）８１Ａを備え、他方の面に研磨面８１Ｂを備えており、研磨具１００の可動基板部材３に対応してリング状に形成されている。
【００４６】
研磨部材８２は、一方の面に研磨具１００の回転基板部材２への装着部（ファスナー）８２Ａを備え、他方の面に研磨面８２Ｂを備えており、研磨具１００の回転基板部材２に対応して円形状に形成されている。
【００４７】
また、研磨部材８１と研磨部材８２とから構成される研磨部材８０には、損傷部Ｄの研磨時に発生する塵埃（研磨屑）を捕捉する集塵孔が複数設けられている。具体的には、研磨部材８２のほぼ中央に設けられている集塵孔１１Ａと、切断線８１Ｃ上の円周等分３箇所に設けられている複数の集塵孔１２Ａと、研磨部材８１上の円周３等分箇所に設けられ且つ隣接した集塵孔１２Ａの間に位置するように設けられている複数の集塵孔１３Ａとが設けられている。
【００４８】
なお、集塵孔１２Ａは、研磨部材８１と研磨部材８２とに跨って設けられているので、リング状の研磨部材８１においては、内周縁の円周３等分箇所に、ほぼ半円状の切り欠きとなって存在する。
【００４９】
そして、研磨部材８１、研磨部材８２を、研磨具１００に装着した場合、後述する第１集塵孔１１（図６参照）に集塵孔１１Ａが合致し、第２集塵孔１２（図６参照）に集塵孔１２Ａが合致し、第３集塵孔１３（図６参照）に集塵孔１３Ａが合致するようになっている。
【００５０】
このように、上記ファスナーを用いて、粘着シート７に研磨部材８０を装着するようにすれば、研磨部材８０である各サンドペーパを容易に貼り替えること、すなわち着脱交換することができる。
【００５１】
また、本実施の形態では互いに隣接した可動基板部材３の各パネル２６同士は、第２切断線１０によって切り離され、粘着シート７により保持されているが、研磨板６に設けられた第２切断線１０の断面形状をＶ字形状の溝などにして、可動基板部材３の各パネル２６同士を切り離さなさずに接続した状態にしておいてもよい。
【００５２】
要するに、可動基板部材３における各パネル２６は、隣接したパネルに対して外周縁が上下方向に相対的に変形可能な構成であればよいものである。
【００５３】
また、本実施の形態では回転基板部材２と可動基板部材３とを粘着シート７を介して連結しているが、第１切断線９が設けられる箇所に薄肉接続部や蝶番等を設け、回転基板部材２と可動基板部材３とを相対的に回動可能に連結してもよい。ここで薄肉接続部とは、任意の部材に、断面が例えばＶ字形状の溝を設けることにより、線状の薄肉部分を形成し、その薄肉部分を軸として上記任意の部材の一方の部分を上記任意の部材の他方の部分に対して回動自在に構成する回動手段の一形態である。
【００５４】
このように、本実施の形態に係る研磨具は損傷部Ｄに接触する研磨面５が内外複数の面にて構成されるとともに、研磨板６の端部に相当する可動基板部材３の損傷部Ｄに接触している部分のパネル２６の外周縁が研磨板６の中心側を構成する回転基板部材２に対して上下に回動し、しかも、回転基板部材２に対応する研磨面には粗研用研磨面が設けられ、環状の可動基板部材３に対応する研磨面にはリング状の精研用研磨面が設けられた構造となっている。
【００５５】
また、回転基板部材２および可動基板部材３を構成する研磨板６や精研用研磨面７１、粗研用研磨面７２には、損傷部Ｄの研磨時に発生する塵埃（研磨屑）を捕捉する集塵孔が複数設けられている。具体的には、回転基板部材２の中央に設けられる第１集塵孔１１と、第１切断線９上の複数箇所、すなわち円周等分３箇所に設けられる第２集塵孔１２と、可動基板部材３上に設けられ且つ隣接した第２集塵孔１２の間に位置する第３集塵孔１３とからなる（図６参照）。
【００５６】
なお、これら集塵孔１１、１２、１３に関する説明は、保持板部材１と研磨板６との間に設けられる弾性部材４の説明とともにその詳細を説明する。
【００５７】
弾性部材４は図７〜図９に示すように、回転基板部材２を構成する円形のパネル２５を保持板部材１に固定する第１支持部材１４と、可動基板部材３を構成する略扇状のパネル２６を保持板部材１に固定する第２支持部材１５と、集塵孔１１、１２、１３と連通した集塵通路４０を研磨具内部に形成するための側壁部材１６とを備える。
【００５８】
第１支持部材１４は、図７に示すように回転基板部材２とほぼ等しい直径を有し、その円周方向に複数に等分割（本例においては３分割）された略扇状の外形を有する複数個（３個）の硬質スポンジ１７からなる。そして、回転基板部材２および保持板部材１に各々接着されている。なお、この状態において互いに隣接した第１支持部材１４の間には間隙１９が設けられており、この間隙１９を介して第１集塵孔１１と第２集塵孔１２とが連通している。このため第１集塵孔１１と第２集塵孔１２とは連続した一つの通路をなす。
【００５９】
なお、第１支持部材１４は、弾力性を有する硬質スポンジからなるが回転基板部材２に対する支持面積が大きく、その結果、回転基板部材２は保持板部材１に対して相対的に大きく動くことはなく、ほぼ固定される。
【００６０】
第２支持部材１５は、円柱状に形成された複数の硬質スポンジ２３と、その各硬質スポンジ２３の外周に巻き付くように設けられたコイルスプリング２４とからなる。これらの硬質スポンジ２３およびコイルスプリング２４は各可動基板部材３の略中央に一つずつ設けられている。
【００６１】
なお、第２支持部材１５の断面積は、回転基板部材２を保持板部材１に固定する第１支持部材１４に較べて十分小さく手指で容易に撓めることができる。このため保持板部材１と可動基板部材３との固定状態は、前記回転基板部材２と第１支持部材１４との固定強度に比べて十分小さく、可動基板部材３を保持板部材１側に容易に接近させることができる程度に固定されている。
【００６２】
このため可動基板部材３に、面に対して交差する方向、例えば垂直方向の外力（押圧力）が作用すると、可動基板部材３は回転基板部材２との接続部、すなわち、第１切断線９の接線方向に延伸する直線を軸に、保持板部材１に接近する方向に回動する（図１０参照）。また、可動基板部材３に作用した外力が除かれるとコイルスプリング２４の張力および円柱状の硬質スポンジ２３の復元力により、可動基板部材３は回転基板部材２と面一（同一平面）となる位置に復帰する。可動基板部材３に外力（押圧力）を加え続けた場合には、可動基板部材３の上面側が保持板部材１の側縁に接触して、可動基板部材３の上下方向の回動が規制される。
【００６３】
可動基板部材３の上下方向の回動範囲は、保持板部材１の直径や形状を変えるなどして容易に変更することができる。また、弾性部材４の厚みを変えることによっても変更することができる。可動基板部材３の上下方向の回動範囲はその範囲内において研磨具を操作した場合、良好な被研磨面が容易に得られる範囲とする。具体的には、可動基板部材３が回転基板部材２と面一となる位置から上方に向かい２０度傾斜する範囲とするのが望ましい。
【００６４】
続いて、前記複数の集塵孔１１、１２、１３と連通した集塵通路４０を研磨具内部に形成する側壁部材１６について説明する。この側壁部材１６は、断面矩形のリング状に形成された硬質スポンジからなり、保持板部材１の直径と略同等、または僅かに大きい内径を有し且つ研磨板６の直径にほぼ等しい外径を有する。そして、研磨板６の縁に添って接着されている。なお、図７に記載の仮想線Ｌは保持板部材１の端部を示している。
【００６５】
そして、研磨板６に側壁部材１６を配置した状態では、図８に示すように可動基板部材３と保持板部材１との間に形成される弾性部材４の厚みに等しい空間は、側壁部材１６が外気との隔壁となり外気と遮断された集塵通路４０が研磨具内に形成される。そして、この集塵通路４０に対して第２集塵孔１２、第３集塵孔１３が連通し開口する。
【００６６】
ここで前記保持板部材１には、保持板部材１を貫通して集塵通路４０に接続する吸引口４１が設けられている（図９参照）。この吸引孔４１は研磨装置Ｓに設けられた負圧を吸気源とする吸引装置に接続されており、研磨時に発生する塵埃は、集塵孔１１、１２、１３→集塵通路４０→吸引孔４１→吸引装置を経て補足される。なお、図８および図９は図７のＡ−Ａ’端面図およびＢ−Ｂ’端面図である。
【００６７】
このように本実施形態の研磨具では、被研磨面と研磨面との間に発生する研磨時の塵埃を集塵通路４０から吸込み、負圧源を有する吸引装置に効率良く導くことができる。
【００６８】
次に、本実施の形態に係る研磨具の使用方法を説明する。
【００６９】
損傷部Ｄに残る旧塗膜を除去する場合には、まず、旧塗膜に対して可動基板部材３に取り付けたサンドペーパと、回転基板部材２に取り付けたサンドペーパの周縁を接触させて研磨する。このとき、粗研用研磨面７２に貼着するサンドペーパは６０番〜８０番のサンドペーパを用い、精研用研磨面７１に貼着するサンドペーパは１２０番〜２４０番のサンドペーパを用いる。なお、損傷部Ｄの研磨状態に応じて、上記サンドペーパの砥粒の粒度を換えてもよい。
【００７０】
なお、この旧塗膜の除去に使用する研磨装置Ｓとしては、通常、ディスクサンダーが用いられる。研磨装置Ｓに支持される心棒２１が保持板部材１の中心に設けられているタイプの本実施形態の研磨具を用いる。
【００７１】
その後、旧塗膜が除去された損傷部Ｄに対してフェザーエッジＦを形成する。このフェザーエッジＦを形成する処理では、まず、図４、図５に示すように研磨具の可動基板部材３を用い旧塗膜が除かれた損傷部Ｄから正規の塗膜に掛けてフェザーエッジＦを形成する。なお、ここで傾斜角が一定のフェザーエッジを短時間で形成するには始めに大まかなフェザー傷を損傷部Ｄにつけると良い。ここでフェザー傷とはフェザーエッジＦの研磨量を一定にするための目安となる荒削りをいう。
【００７２】
そして、フェザー傷を取り除くように研磨してなめらかなフェザーエッジに整える。なお、フェザーエッジを形成する処理ではダブルアクションサンダーが用いられるため、研磨具には本実施の形態に係る研磨具が採用される。
【００７３】
フェザーエッジを整える場合には凹みの内方から外方に向かって研磨具を移動する操作方法、および凹みの外方から凹みの内方に向かって研磨具を移動する操作方法にて行うことができる。このとき、本実施の形態の研磨具は被研磨面に対する研磨具の安定性が高いため、研磨装置Ｓの進行方向に向かって研磨具を傾斜させて研磨することもでき、従来よりも短時間でフェザーエッジを形成することができる。
【００７４】
ここで、ダブルアクションサンダーに研磨具１００を装着して、自動車のパネル面に施された塗装を除去したときの研磨具１００の特性について説明する。
【００７５】
まず、上記塗装の塗装面に、研磨具１００の精研用研磨面７１と、粗研用研磨面７２の外周の一部とが接触するように、ダブルアクションサンダーを操作して起点を定め、この起点から、上記接触面に加える圧力を除々に減少させながら、一定の速度で一直線状にサンダーを移動させる。
【００７６】
そうすると、研磨具１００の上記塗装面に対する振れが少ないので、研磨具１００の軌跡がほぼ一直線状に描かれる。
【００７７】
なお、研磨具１００の振れが少ない理由として、研磨具１００の端部に相当する箇所が面（可動基板部材３）で構成されているため研磨具１００の塗装面に対する接触面積の変化が少なく、また、保持板部材１と可動基板部材３との間に設けられている弾性部材４によって、研磨具１００に加わる余分な力が吸収されるため、研磨具１００の塗膜面に対する接触圧力の変動が少ないことが考えられる。
【００７８】
これらの要因により研磨具の安定性が向上し、研磨具１００の軌跡が一直線上に整列する。よって、研磨具１００を装着したダブルアクションサンダーは、フェザーエッジを形成する処理並びに塗膜の除去処理などにおいて、所望の範囲のみを確実に研磨することが可能となる。
【００７９】
また、研磨具１００の研磨状態では、塗膜面に沿う方向に対する研磨量の変動が少ない。すなわち、塗膜面の方向での研磨量の勾配が緩やかになる。
【００８０】
この理由としては、研磨具１００の端部を使った研磨時において、研磨具１００が塗装面と面にて接触し、その面の回転方向（幅）に対応した広い研磨面積にて研磨することができるためであると考えることができる。また、保持板部材１と可動基板部材３との間に設けられる弾性部材４により、研磨具１００に作用する不必要な抑圧力が吸収され塗膜面に対する接触圧力の変動が少なくなるためであると考えることができる。
【００８１】
このように研磨具１００を装着したダブルアクションサンダーでは、例えば、フェザーエッジを形成する処理などにおいて、損傷部と正規の塗装面との間になだらかな傾斜を所定の角度にて容易に形成することができる。
【００８２】
また、研磨具１００は、一方の表面に粗研用研磨材を保持する粗研用研磨面７２が設けられた回転可能な内側の回転基板部材２と、一方の表面に精研用研磨部材を保持する外側の環状の精研用研磨面７１を具備し、粗研用研磨面７２と精研用研磨面７１とが同じ側になるように回転基板部材２の周縁に接続して設けられると共に、回転基板部材２との接続部を通過し、回転基板部材２の周縁に接線方向に延伸し、粗研用研磨面７２に平行である軸線を中心として回動可能である複数の可動基板部材３と、各可動基板部材３の精研用研磨面７１が、回転基板部材２の粗研用研磨面７２に対して、ほぼ同一平面となるように保持する保持手段である弾性部材４とを有する。
【００８３】
したがって、研磨面が複数の面にて構成されており、研磨具１００の端部を用いての研磨時には、可動基板部材３に設けられる研磨面と、回転基板部材２の外周縁の研磨面とを被研磨面Ｄに接触させて研磨する。すなわち、本発明の研磨具では、内側の粗研用研磨面７２によって研磨した部分を外側の環状の精研用研磨面７１が通過して研磨することになる。
【００８４】
すなわち、研磨具１００を回転しながら、この中心部が先行するように（図１６に示すように研磨装置Ｓを引く方向に）移動すると、粗研に続いて精研を行うこととなり、あらためて研磨具（サンドペーパ）を交換して、粗研、精研を行う必要がなく、能率が向上すると共に、さほどの熟練度を要することなく粗研、精研を行うことができ、フェザーエッジの加工を容易に行い得ることとなる。
【００８５】
また、研磨具１００の端部を用いての研磨時には、研磨面と被研磨面Ｄとの接触面積が大きく変化することなく、また、研磨具と被研磨面Ｄとの接触圧力を容易に調節することができる。このため被研磨面Ｄに対する研磨具の安定性が向上し、熟練技術を有さずとも、慎重な作業をすることなく容易な操作で被研磨面Ｄを所望の形状に研磨することができる。
【００８６】
また、図１６に示すように、研磨装置Ｓの進行方向に向かって研磨具１００を傾斜させながらの研磨を行っても、研磨面が所定の形状を保ちながら変形するため安定感が損なわれることなく良好な研磨面を得ることができる。また、研磨具１００の端部を用いて連続的に研磨を行っても、研磨具１００は被研磨面Ｄに対して可動基板部材３の研磨面にて接触しているため、研磨具１００の外縁付近の部分である端部に無理が生じることなくこの端部の劣化を抑制することができ、サンドペーパの局所的な磨耗を抑制することができる。
【００８７】
さらに、研磨面が、回転基板部材２に対応して設けられた粗研用研磨面７２と、可動基板部材３に対応して、粗研用研磨面７２の外側に設けられた精研用研磨面７１とで構成され、研磨具１００を塗装面に対してやや傾け、精研用研磨面７１と、粗研用研磨面７２の外周縁である端部とを同時に塗装面に接触させて、上述したように研磨装置を図１６に示すように引く方向（図１６において「×」印が付されていない方向）に操作して塗装面の研磨を行うと、荒研磨と仕上げ研磨とを１回の研磨作業で行うことができる。
【００８８】
また、研磨具１００は、回転基板部材２と可動基板部材３とに平行かつ所定の間隔をおいて設けられている保持板部材１と、保持板部材１と各可動基板部材３との間に設けられている複数の弾性部材４とを具備し、各弾性部材４の弾性によって、保持板部材１から可動基板部材３へ向かう方向に、可動基板部材３を付勢し、可動基板部材３に設けられている精研用研磨面７１が、回転基板部材２に設けられている粗研用研磨面７２に対してほぼ同一平面に位置している。また、付勢保持手段である弾性部材４が可動基板部材３と保持板部材１との間に直立するように設けられている。
【００８９】
したがって、研磨具１００では、可動基板部材３の付勢において安定したバネ定数を得ることができ、研磨具１００と損傷部との接触による軽微な振動を、付勢手段である弾性部材４にて吸収することができる。そして、損傷部を研磨するときの研磨具１００の安定性がより向上する。
【００９０】
また、研磨具１００は、回転基板部材２がほぼ円盤状の部材であり、この円盤状部材の外周縁円周を等分した箇所に、各可動基板部材３が設けられている。
【００９１】
したがって、研磨具１００によれば、可動基板部材３と回転基板部材２との接続線が円弧を描くため、回転基板部材２から可動基板部材３にかけての屈曲部分を、損傷部の凹み内面に対してスムーズに接触させることができる。また、回転基板部材２の外周縁を等分した複数箇所に可動基板部材３が設けられているため、損傷部に対する研磨具１００の回転に伴う接触（回転）抵抗が全周に亘り均一となり研磨具１００の回転が安定する。
【００９２】
また、研磨具１００によれば、各可動基板部材３の外端縁が、回転基板部材２の外周縁の円よりも大きく、かつ中心が同一である円の円弧を形成しているので、損傷部の凹み内面に対して可動基板部材３の外端縁をスムーズに接触させることができる。
【００９３】
また、研磨具１００によれば、回転基板部材２に対する可動基板部材３の回動範囲が、可動基板部材３の精研用研磨面７１が回転基板部材２の粗研用研磨面７２に対してほぼ同一平面上に存在する位置から、可動基板部材３の一部が保持板部材１に接触する位置までの範囲であるので、可動基板部材３の可動範囲が予め設定されており、研磨装置の操作に不慣れな人でも、その可動範囲内において研磨すれば、損傷部と研磨具１００との接触角度を適切な範囲に保つことができる。
【００９４】
また、研磨具１００によれば、弾性部材４が、複数の可動基板部材３のそれぞれに対して少なくとも１つ設けられているので、個々の可動基板部材３に対して付勢手段が設けられていることになり、各可動基板部材３が個別に所定の接触圧力にて損傷部に接触する。よって研磨具１００の端部を用いた研磨時において、より精度の高い研磨を行うことができる。また、各可動基板部材３に設ける弾性部材４の数を任意に設定することで、所望の復元力（弾発力）を有する可動基板部材３を得ることができる。
【００９５】
また、研磨具１００に、精研用研磨面７１、粗研用研磨面７２と弾性部材４と保持板部材１とを貫通して設けられた集塵通路を設け、この集塵通路を、負圧を吸気源とする吸引装置に接続すれば、研磨時に研磨面に発生する塵埃を上記集塵通路を利用して吸引装置に導くことができる。すなわち集塵タイプの研磨装置に対応した研磨具を得ることができる。
【００９６】
また、研磨具１００において、粗研用研磨面７２を回転基板部材２に対して着脱自在の膜状の研磨部材で構成し、精研用研磨面７１を、可動基板部材３に対して着脱自在の膜状の研磨部材で構成すれば、精研用研磨面７１や粗研用研磨面７２が消耗した場合、これらを構成する研磨部材を交換して、精研用研磨面７１や粗研用研磨面７２を容易に更新することができる。
【００９７】
ところで、研磨具１００を用いて、フェザーエッジを形成する場合、損傷部に塗りこめられ硬化したパテを研磨する場合、パテやその周辺の塗膜の表面に塗られて硬化したプライマサフェーサを研磨する場合について説明する。
【００９８】
まず、フェザーエッジＦＥ１を形成する場合について説明する。
【００９９】
図１２は、フェザーエッジＦＥ１の断面を示す図であり、図１３は、研磨具１００を用いて形成されたフェザーエッジＦＥ１の状態を示す断面図である。
【０１００】
損傷部Ｄ１の旧塗膜を除去した後に形成されたフェザーエッジＦＥ１は、図１２に示すように、鋼板ＳＳ１の表面に重ねて順に塗布されたプライマＡＦ２とサフェーサＡＦ３と上塗りＡＦ４とによって形成された塗膜ＡＦ１の塗膜表面ＡＦ５と、損傷部Ｄ１の鋼板ＳＳ１の表面との間に形成されている。
【０１０１】
すなわち、フェザーエッジＦＥ１は、損傷部Ｄ１の鋼板ＳＳ１の表面が露出している部位と損傷部Ｄ１の鋼板ＳＳ１の表面をプライマＡＦ２が覆っている部位との境目であるエッジＥＧ１と塗膜ＡＦ１の塗膜表面ＡＦ１との間で、エッジＥＧ１から塗膜表面ＡＦ１に向かって形成されている滑らかな傾斜部である。
【０１０２】
ここで、塗膜ＡＦ１のプライマＡＦ２の硬さは「Ｆ〜Ｈ」、サフェーサＡＦ３の硬さは「ＨＢ〜Ｈ」、上塗りＡＦ４の硬さは「Ｈ〜２Ｈ」である。
【０１０３】
上記硬さを示す「Ｆ」、「Ｈ」、「ＨＢ」、「２Ｈ」は、鉛筆の芯の先端を尖らせて、塗膜に垂直に１ｋｇｆ（９．８Ｎ）の力で押し当て、この１ｋｇｆの荷重を加えたまま上記鉛筆を引っ張って、塗膜に傷がつくか否かを試験して判定される上記塗膜の硬度であり、たとえば、「２Ｈ」の硬度の鉛筆の芯で傷がつき、しかも「Ｈ」の硬度の鉛筆の芯で傷がつかない塗膜であれば、この塗膜の塗膜硬度は「Ｈ」ということになる。なお、ＨＢ、Ｆ、Ｈ、２Ｈの順に硬さが増す。
【０１０４】
車輌の損傷部Ｄ１を補修する場合に発生する不具合、たとえば、損傷部Ｄ１に塗り込めたパテＰＴ１（図１４参照）が乾燥するときにパテＰＴ１の収縮によって生じる段差（パテＰＴ１と塗膜ＡＦ１との間の段差）をできるだけ少なくするために、フェザーエッジＦＥ１の幅Ｗ１をできるだけ大きくすることが望ましい。
【０１０５】
次に、研磨具１００を用いて、損傷部Ｄ１と塗膜ＡＦ１との間にフェザーエッジＦＥ１を形成する場合について、図１３を用いて説明する。
【０１０６】
損傷部Ｄ１の旧塗膜を除去し鋼板ＳＳ１を露出させた後、鋼板ＳＳ１と塗膜ＡＦ１とに、矢印ＡＲ１３１の方向に回転中心ＣＲ１を中心にして回転（自転）する研磨具１００を押し当てて、図１３に示すように、エッジＥＧ１に沿って、矢印ＡＲ１３２の方向に移動しフェザーエッジＦＥ１を形成する。
【０１０７】
この場合、研磨具１００の進行方向において、塗膜ＡＦ１や鋼板ＳＳ１に対して研磨具１００が僅かに離反するように、しかも、塗膜ＡＦ１よりも鋼板ＳＳ１のほうに若干強く研磨具１００を押し当てる。
【０１０８】
なお、精研用研磨面７１の外径はたとえば１２ｃｍであり、粗研用研磨面７２の外径はたとえば８ｃｍであり、研磨具１００の回転中心ＣＲ１は、たとえば、エッジＥＧ１よりも塗膜ＡＦ１側に僅かにずれた位置（エッジＥＧ１からたとえば１ｃｍ離れた位置）を、エッジＥＧ１に沿って移動する。また、塗膜ＡＦ１の厚さはたとえば１２０μｍであるものとする。
【０１０９】
ここで、図１３に示す各断面ＣＳ１〜ＣＳ３は、精研用研磨面７１にたとえば＃１８０のサンドペーパを装着し、粗研用研磨面７２にたとえば＃１２０のサンドペーパを装着して、精研用研磨面７１と粗研用研磨面７２とを構成し、フェザーエッジＦＥ１を形成した場合のフェザーエッジＦＥ１の断面形状を示す図である。
【０１１０】
断面ＣＳ１は、フェザーエッジＦＥ１の形状を、塗膜ＡＦ１の厚み方向と、精研用研磨面７１と粗研用研磨面７２とによって削られた部分の大きさを誇張してモデル化して示した図である。
【０１１１】
精研用研磨面７１や粗研用研磨面７２などの研磨面に装着したサンドペーパの番手を示す数字が小さくなると、このサンドペーパの砥粒の径が大きくなり、塗膜ＡＦ１を研磨した場合、塗膜ＡＦ１に深く傷が入り、研磨性が良くなる。一方、上記研磨面に装着したサンドペーパの番手を示す数字が大きくなると、このサンドペーパの砥粒の径が小さくなり、塗膜ＡＦ１を研磨した場合、塗膜ＡＦ１に入る傷が浅くなり、研磨性が悪くなる。
【０１１２】
断面ＣＳ１の断面ＣＳ１１の部分では、粗研用研磨面７２に装着された＃１２０のサンドペーパによって研磨されることにより、塗膜ＡＦ１に約１００μｍの深さの傷が多数入り、高さ１００μｍの三角形状の集合によって、フェザーエッジＦＥ１の断面が形成される。
【０１１３】
続いて、その後（粗研用研磨面７２で研磨された後）、＃１８０のサンドペーパが装着された精研用研磨面７１で研磨するので、上記高さ１００μｍの三角形状の上記断面の頂点から４０μｍの部分が削られて消失し、高さが６０μｍの多数の台形形状の集合によって、フェザーエッジＦＥ１の断面が形成される。
【０１１４】
断面ＣＳ１の断面ＣＳ１２の部分では、精研用研磨面７１に装着された＃１８０のサンドペーパのみによって研磨されることにより、塗膜ＡＦ１に約４０μｍの深さの傷が多数入り、高さ４０μｍの多数の三角形状の断面の集合によって、フェザーエッジＦＥ１の断面が形成される。
【０１１５】
断面ＣＳ２は、フェザーエッジＦＥ１の形状を、塗膜ＡＦ１の厚み方向と、精研用研磨面７１と粗研用研磨面７２とによって削られた部分の大きさを誇張してモデル化して示すと共に、断面ＣＳ１よりも、実際の形状に近い状態を示した図である。
【０１１６】
断面ＣＳ２の断面ＣＳ２１の部分では、断面ＣＳ１の断面ＣＳ１１の部分に比べ、各台形の高さが、エッジＥＧ１からフェザーエッジの外縁ＥＧ２の方向に向かうに従って次第に高くなっている。この理由はフェザーエッジの外縁ＥＧ２からエッジＥＧ１に近づくに従って、研磨具１００の回転（自転）方向と研磨具１００の送り方向（移動方向）との間の交差角が直角に近くなり、精研用研磨面７１と粗研用研磨面７２との砥粒が、塗膜ＡＦ１を次第に多く削り取るようになるからであり、また、研磨具１００を塗膜ＡＦ１よりも鋼板ＳＳ１にやや強い力で押し付けているために、鋼板ＳＳ１に近い側の塗膜ＡＦ１がやや多く削られるからである。
【０１１７】
断面ＣＳ２の断面ＣＳ２２の部分では、精研用研磨面７１が、粗研用研磨面７２と精研用研磨面７１との境界を回動中心として、塗膜ＡＦ１から離反する方向に容易に撓むので、断面ＣＳ１の断面ＣＳ１２の部分に比べ、各三角形の高さが、エッジＥＧ１からフェザーエッジの外縁ＥＧ２の方向に向かうに従って次第に高くなっている。
【０１１８】
断面ＣＳ３は、断面ＣＳ２をマクロ的に見た場合（ただし塗膜ＡＦ１の厚み方向の寸法を拡大した場合）の、フェザーエッジＦＥ１の形状を示す図である。
【０１１９】
断面ＣＳ３からわかるように、フェザーエッジＦＥ１は、エッジＥＧ１からフェザーエッジの外縁ＥＧ２に向かって、ほぼ一直線状に滑らかに長く（広く）形成され、すなわち、図１３では、約７ｃｍの長さ（幅）Ｗ１の滑らかなフェザーエッジが形成されている。
【０１２０】
なお、このように、フェザーエッジＦＥ１がほぼ一直線状に広く形成されるためには、研磨具１００を用い、さらに、精研用研磨面７１（精研用研磨面７１を形成するサンドペーパ）の砥粒の番手と、粗研用研磨面７２（粗研用研磨面７２を形成するサンドペーパ）の砥粒の番手と、精研用研磨面７１の外径と、粗研用研磨面７２の外径と、研磨具１００の中心ＣＲ１の軌跡の位置と、塗膜ＡＦ１の硬さとのバランスが概ねとれていることが必要である。
【０１２１】
このように、上記各要因（精研用研磨面７１の砥粒の番手、粗研用研磨面７２の砥粒の番手、精研用研磨面７１の外径、粗研用研磨面７２の外径、研磨具１００の中心ＣＲ１の軌跡の位置、塗膜ＡＦ１の硬さ）のバランスがとれていれば、上記各要因の特性を示す値を、上述の値以外の値にしてもよい。
【０１２２】
たとえば、塗膜ＡＦ１の硬さが若干硬くなった場合には、たとえば、粗研用研磨面７２を＃８０の番手のサンドペーパで構成し、精研用研磨面７１を＃１２０の番手のサンドペーパで構成するようにしてもよい。また、上記各組み合わせの他に、塗膜ＡＦ１の硬さの変化に応じて、粗研用研磨面７２が精研用研磨面７１よりも、一定の割合で粗くなるように構成してもよい。
【０１２３】
また、たとえば、粗研用研磨面７２の外径と精研用研磨面７１の外径の大きさを変更してもよい。
【０１２４】
次に、精研用研磨面７１と粗研用研磨面７２とを同じ番手（たとえば＃１２０の番手のサンドペーパ）のサンドペーパで構成し、他の条件は、断面ＣＳ３を形成した場合と同様の条件にして、フェザーエッジＦＥ１を形成した場合について、図１３の断面ＣＳ４と断面ＣＳ５とを用いて説明する。
【０１２５】
なお、図１３における断面ＣＳ４は、フェザーエッジＦＥ１の形状を、塗膜ＡＦ１の厚み方向と、精研用研磨面７１と粗研用研磨面７２とによって削られた部分の大きさを誇張してモデル化して、断面ＣＳ２のように示した図である。
【０１２６】
断面ＣＳ４の断面ＣＳ４１の部分は、断面ＣＳ２の断面ＣＳ２１の部分とほぼ同様にフェザーエッジＦＥ１の断面が形成されているが、断面ＣＳ４１の部分のフェザーエッジを形成する各台形の高さが、断面ＣＳ２１の部分のフェザーエッジを形成する各台形の高さよりも低くなっている。つまり、断面ＣＳ４１の部分の塗膜の厚さが、断面ＣＳ２１の部分の塗膜の厚さよりもかなり薄くなっており、塗膜ＡＦ１がほとんど残っていない。
【０１２７】
この理由は、＃１２０のサンドペーパが装着された粗研用研磨面７２によって塗膜ＡＦ１が削られ、その後（粗研用研磨面７２で研磨された後）を、粗研用研磨面７２と同じ番手の＃１２０のサンドペーパが装着された精研用研磨面７１で研磨するので、＃１８０の番手のサンドペーパが装着された精研用研磨面７１で研磨する場合よりも、塗膜ＡＦ１が多量に削り取られてしまうからである。
【０１２８】
断面ＣＳ４の断面ＣＳ４２の部分は、断面ＣＳ２の断面ＣＳ２２の部分とほぼ同様にフェザーエッジＦＥ１の断面が形成されているが、精研用研磨面７１のサンドペーパの目が粗くなっているために、研磨目が断面ＣＳ２２の部分よりも粗くなっている。
【０１２９】
断面ＣＳ５は、断面ＣＳ４をマクロ的に見た場合（ただし塗膜ＡＦ１の厚み方向の寸法を拡大した場合）のフェザーエッジＦＥ１の形状を示す図である。
【０１３０】
断面ＣＳ５からわかるように、フェザーエッジＦＥ１は、エッジＥＧ１からフェザーエッジの外縁ＥＧ２に向かって、ほぼ一直線状に形成されてはおらず、精研用研磨面７１で研磨された面と粗研用研磨面７２で研磨された面との間の境界ＥＧ３のところで折れ曲がっている。すなわち、エッジＥＧ１と境界ＥＧ３との間では、フェザーエッジはほとんど形成されておらず、境界ＥＧ３からフェザーエッジＦＥ１の外縁ＥＧ３に、幅約２ｃｍ（精研用研磨面７１の半径と粗研用研磨面７２の半径との差）のフェザーエッジが形成されている。
【０１３１】
すでに理解されるように、研磨具１００を用い、さらに、精研用研磨面７１（精研用研磨面７１を形成するサンドペーパ）の砥粒の番手と、粗研用研磨面７２（粗研用研磨面７２を形成するサンドペーパ）の砥粒の番手と、精研用研磨面７１の外径と、粗研用研磨面７２の外径と、研磨具１００の中心ＣＲ１軌跡の位置と、塗膜ＡＦ１の硬さとのバランスをとってフェザーエッジＦＥ１を形成すれば、幅の広いフェザーエッジを容易に形成することができる。
【０１３２】
次に、損傷部Ｄ１に塗られ硬化したパテＰＴ１を、研磨具１００を用いて研磨する場合について説明する。
【０１３３】
図１４は、損傷部Ｄ１にフェザーエッジＦＥ１が形成され、パテＰＴ１が塗りこめられ、この塗りこめられたパテＰＴ１が硬化した状態における損傷部Ｄ１およびその近傍の断面を示す図である。
【０１３４】
修理部分の仕上がりを良好にして、修理した部分と損傷しなかった部分との見分けがつきにくいようにするためには、パテＰＴ１が硬化した後、この硬化したパテＰＴ１の表面ＰＴ２を研磨し、塗膜ＡＦ１の表面ＡＦ５とパテＰＴ１の表面ＰＴ２との間の平滑性をできるだけ保つ必要がある。
【０１３５】
すなわち、硬化したパテＰＴ１の表面ＰＴ２の盛り上がりを極力無くして、損傷前の塗膜の表面とできるだけ同じ形状にし、さらに、硬化したパテＰＴ１の表面ＰＴ２の周辺の塗膜ＡＦ１の表面ＡＦ５となだらかにつながるようにする必要がある。
【０１３６】
そこで、研磨具１００を以下のように用いて、上記平滑性を得るように研磨する。
【０１３７】
回転（自転）している研磨具１００の粗研用研磨面７２をパテＰＴ１の表面ＰＴ２に押し当て、精研用研磨面７１を塗膜ＡＦ１の表面ＡＦ５に押し当てて、研磨具１００の精研用研磨面７１と粗研用研磨面７２との間の境目が、図１４に示すパテＰＴ１の表面ＰＴ２と塗膜ＡＦ１の表面ＡＦ５との境界ＥＧ４に沿うように、オペレータが研磨具１００を移動させる。
【０１３８】
ここで、パテＰＴ１の表面ＰＴ２に粗研用研磨面７２を押し当てて、塗膜ＡＦ１の表面ＡＦ５に精研用研磨面７１を押し当てる理由は、パテＰＴ１の硬さが、一般的には、塗膜ＡＦ１の硬さよりも硬く形成されており、研磨性の良い（研磨量の多い）粗研用研磨面７２によって、盛り上がって硬化しているパテＰＴ１の表面ＰＴ２を研磨して、平らにする必要があるからである。
【０１３９】
上述のように研磨することによって、パテＰＴ１の表面ＰＴ２がまず粗研用研磨面７２で研磨されて平らな面が形成され、その直後を精研用研磨面７１が研磨して、パテＰＴ１の表面ＰＴ２におけるペーパー目の目消しが行われるので、パテＰＴ１の表面ＰＴ２を平らに研磨する作業とパテＰＴ１の表面ＰＴ２の目消し作業とが、研磨具１００を１回通過させるだけでほぼ同時に行われる。
【０１４０】
また、上述のように研磨することによって、塗膜ＡＦ１の表面ＡＦ５は、粗研用研磨面７２よりも研磨性がやや劣る精研用研磨面７１のみによって研磨されるので、パテＰＴ１の表面ＰＴ２よりも研磨される量が少ない。
【０１４１】
したがって、上述のように研磨するだけで、すなわち、研磨具１００のオペレータに特殊な操作や技能を要求することなく、塗膜ＡＦ１の表面ＡＦ５とパテＰＴ１の表面ＰＴ２との間を平滑にすることができる。
【０１４２】
なお、ここで、精研用研磨面７１と粗研用研磨面７２とに、同一の番手のペーパーを装着して上述の研磨を行ったとすると、パテＰＴ１の表面ＰＴ２よりも柔らかい塗膜ＡＦ１の表面ＡＦ５がパテＰＴ１の表面ＰＴ２よりも多く削り取られてしまい、塗膜ＡＦ１の表面ＡＦ５とパテＰＴ１の表面ＰＴ２との間の平滑にすることが困難になる。すなわち、高度の技能や研磨具１００の特殊な操作無しでは、塗膜ＡＦ１の表面ＡＦ５とパテＰＴ１の表面ＰＴ２との間を平滑にすることが難しい。
【０１４３】
次に、硬化し研磨されたパテＰＴ１の表面ＰＴ２とその周辺の塗膜ＡＦ１の表面ＡＦ５とに塗布され硬化したプライマサフェーサＳＦ１を、研磨具１００を用いて研磨する場合について説明する。
【０１４４】
図１５は、硬化し研磨されたパテＰＴ１の表面ＰＴ２とその周辺の塗膜ＡＦ１の表面ＡＦ５とに塗布され硬化したプライマサフェーサＳＦ１およびその周辺の状態を示す断面図である。
【０１４５】
硬化したパテＰＴ１を研磨する場合と同様に、修理部分の仕上がりを良好にして、修理した部分と損傷しなかった部分との見分けがつきにくいようにするためには、硬化し研磨されたパテＰＴ１の表面に塗られたプライマサフェーサＳＦ１が硬化した後、この硬化したプライマサフェーサＳＦ１の表面ＳＦ２を研磨し、塗膜ＡＦ１の表面ＡＦ５とプライマサフェーサＳＦ１の表面ＳＦ２との間の平滑生をできるだけ保つ必要がある。
【０１４６】
すなわち、硬化したプライマサフェーサＳＦ１の表面ＳＦ２の盛り上がりを極力無くして、損傷前の塗膜の表面とできるだけ同じ形状にし、さらに、硬化したプライマサフェーサＳＦ１の表面ＳＦ２の周辺の塗膜ＡＦ１の表面ＡＦ５となだらかにつながるようにする必要がある。
【０１４７】
そこで、図１５に示す状態において、たとえば、硬化したプライマサフェーサＳＦ１が、塗膜ＡＦ１よりも硬い場合、図１４で硬化したパテＰＴ１を研磨したときと同様に、研磨具１００の粗研用研磨面７２を、プライマサフェーサＳＦ１の表面ＳＦ２に押し当てて、研磨具１００の精研用研磨面７１を、塗膜ＡＦ１の表面ＡＦ２に押し当てて、研磨具１００の精研用研磨面７１と粗研用研磨面７２との間の境目が、図１５に示すプライマサフェーサＳＦ１の表面ＳＦ２と塗膜ＡＦ１の表面ＡＦ５との境界ＥＧ５に沿うように、オペレータが研磨具１００を移動させる。
【０１４８】
一方、塗膜ＡＦ１が、硬化したプライマサフェーサＳＦ１よりも硬い場合、図１４で硬化したパテＰＴ１を研磨したときとは逆に、研磨具１００の粗研用研磨面７２を、塗膜ＡＦ１の表面ＡＦ２に押し当てて、研磨具１００の精研用研磨面７１を、プライマサフェーサＳＦ１の表面ＳＦ２に押し当てて、研磨具１００の精研用研磨面７１と粗研用研磨面７２との間の境目が、図１５に示すプライマサフェーサＳＦ１の表面ＳＦ２と塗膜ＡＦ１の表面ＡＦ５との境界ＥＧ５に沿うように、オペレータが研磨具１００を移動させる。
【０１４９】
上述のように研磨するだけ、すなわち、研磨具１００のオペレータに特殊な操作や技能を要求することなく、図１４で硬化したパテＰＴ１を研磨したときと同様に、塗膜ＡＦ１の表面ＡＦ５とプライマサフェーサＳＦ１の表面ＳＦ２との間の平滑性を保つことができる。
【０１５０】
【発明の効果】
本発明によれば、操作性および安定性に優れ、容易な操作で被研磨面を所望の形状に研磨することができ、研磨面の耐久性が高く、外縁付近を用いた研磨を連続的に行うことが可能であり、荒研磨部分をこの荒研磨直後に同時的に仕上げ研磨することができるという効果を奏する。
【図面の簡単な説明】
【図１】本発明の実施の形態に係る研磨具の分解斜視図。
【図２】本発明の実施の形態に係る研磨具を装着した研磨装置。
【図３】本発明の実施の形態に係る研磨具の正面図。
【図４】本発明の実施の形態に係る研磨具を装着した研磨装置の使用状態を示す図。
【図５】本発明の実施の形態に係る研磨具の端部の可動状態を示す図。
【図６】本発明の実施の形態に係る研磨具の研磨板を示す図。
【図７】本発明の実施の形態に係る研磨具のＣ−Ｃ’断面図。
【図８】本発明の実施の形態に係る研磨具のＡ−Ａ’断面図。
【図９】本発明の実施の形態に係る研磨具のＢ−Ｂ’断面図。
【図１０】本発明の実施の形態に係る研磨具の可動基板部材の可動時におけるＡ−Ａ’断面図。
【図１１】本発明の実施の形態に係る研磨部材の斜視図。
【図１２】フェザーエッジの断面を示す図。
【図１３】研磨具を用いて形成されたフェザーエッジの状態を示す断面図。
【図１４】損傷部にフェザーエッジが形成され、パテが塗りこめられ、この塗りこめられたパテが硬化した状態における損傷部およびその近傍の断面を示す断面図。
【図１５】硬化し研磨されたパテの表面とその周辺の塗膜の表面とに塗布され硬化したプライマサフェーサおよびその周辺の状態を示す断面図。
【図１６】塗膜除去処理に係る従来の研磨装置の使用状態を示す図。
【図１７】従来のフェザーエッジを形成する処理に係る従来の研磨装置の使用状態を示す図。
【図１８】従来の研磨装置の使用状態を示す図。
【符号の説明】
１　保持板部材
２　回転基板部材
３　可動基板部材
４　弾性部材
５　研磨面
６　研磨板
７　粘着シート
９　第１切断線
１０　第２切断線
１１　第１集塵孔
１２　第２集塵孔
１３　第３集塵孔
１４　第１支持部材
１５　第２支持部材
１６　側壁部材
１７　略扇状の硬質スポンジ
１９　間隙
２１　心棒
２３　円柱状の硬質スポンジ
２４　コイルスプリング
２５　円形のパネル
２６　略線状のパネル
４０　集塵通路
４１　吸引孔
７１　精研用研磨面
７２　粗研用研磨面
８０　研磨部材
８１　精研用研磨部材
８１Ａ　装着部
８１Ｂ　研磨面
８２　粗研用研磨部材
８２Ａ　装着部
８２Ｂ　研磨面
１００　研磨具
１０１　回転機構
１０２　回転軸
１０３　研磨面
１０４　研磨具
１０５　心棒
１０６　保持板
１０７　研磨パッド
１０８　研磨パッドの端部
Ｓ　研磨装置
Ｆ　フェザーエッジ
Ｄ　損傷部（被研磨面）[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a polishing tool for polishing a surface to be polished into a predetermined shape by being mounted on a sander or the like, and for example, relates to a polishing tool that can be suitably used for repair of a sheet metal of a vehicle, and particularly relates to a deformation tool. The present invention relates to a polishing tool having a polishing member for fine polishing in a possible annular portion and a polishing member for rough polishing inside the deformable annular portion.
[0002]
[Prior art]
In order to facilitate understanding, for example, regarding a sheet metal repair for repairing a scratch or a dent generated on a painted surface of a vehicle such as an automobile, a procedure for preparing a base is briefly described as shown in FIG. There is a paint film removing process for removing paint films such as the primer 51, the surfacer 52, and the paint 53, which are applied in order, by a sander or the like.
[0003]
Further, there is a process of forming a smooth (smooth) feather edge F by sander or the like as shown in FIG. 17 simultaneously with or after the coating film removing process.
[0004]
Then, after the coating film is removed and the dent of the damaged portion D where the feather edge F is formed is corrected to an appropriate shape with a sliding hammer or the like, the putty is filled and cured to form a filled portion of the putty. I do.
[0005]
Here, the process of forming the feather edge F is a process of giving a smooth inclination (about 27 to 54 degrees) from the surface of the steel plate 50 of the damaged portion D from which the coating film has been removed toward the normal coating film surface. . The process of forming the feather edge F is performed to improve the adhesion of the putty P when filling the damaged portion D with the putty later, and at the same time, suppressing the decrease in volume accompanying the hardening of the putty P to minimize the flattening. This is a process for obtaining a good putty filling surface.
[0006]
In the following description, the damaged portion D may be referred to as the polished surface D as synonymously.
[0007]
Conventionally, in the processing for creating the feather edge F, a rotary polishing apparatus S such as a disk sander or a double action sander is generally used. As shown in FIG. 18, these rotary polishing apparatuses S have a rotary mechanism 101 using compressed air or electric power as a power source, and a rotary shaft 102 provided in the rotary mechanism 101 has a polishing surface 103 on the front side. Is provided detachably. Then, the polishing tool 104 rotated by the rotation mechanism 101 is brought into contact with the damaged portion D to perform polishing.
[0008]
These polishing apparatuses S not only polish the damaged portion D, but also dust-collecting type polishing in which dust (polishing dust and the like) generated during the polishing is captured by a suction device provided at a predetermined location. There are also devices.
[0009]
Here, a disk sander and a double action sander generally used for the paint removal processing and the processing for forming the feather edge will be described. In the disk sander, the rotation axis 102 of the polishing apparatus S and the rotation center of the polishing tool 104 are rotated. The polishing tool 104 is provided on the same line, and has a structure in which the polishing tool 104 rotates (rotates) with the rotation of the rotating shaft 102 of the polishing apparatus S.
[0010]
On the other hand, in the double action sander, the rotation axis of the polishing apparatus S and the rotation center of the polishing tool 104 are provided on the same line, the rotation axis 102 of the polishing apparatus S rotates the polishing tool 104, and the rotation axis 102 The device S revolves around a predetermined point. Therefore, the polishing tool 104 revolves around a predetermined point while rotating.
[0011]
The polishing tool 104 supported by the polishing apparatus S includes a circular holding plate 106 having a mandrel 105 supported by the rotating shaft 102 of the polishing apparatus S, and a polishing material fixed to the lower surface of the holding plate 106 and having a polishing material on the lower surface side. The polishing pad 107 has a certain sandpaper detachably, and has a structure in which the polishing pad 107 rotates with the rotation of the rotating shaft 102 of the polishing apparatus S. The holding plate 106 is made of a rigid material such as a resin material, and the polishing pad 107 is made of an elastic member such as a hard sponge.
[0012]
In using these polishing apparatuses S, for example, the polishing apparatus S is held with both hands and polished so that the polishing tool 104 comes into contact with the damaged portion D with a slight inclination as shown in FIG. That is, only a part of the outer peripheral edge of the polishing pad 104 is brought into contact with the damaged portion D, and polishing is performed using the contacted portion, that is, the end portion 108. The reason for polishing using the end portion 108 of the polishing tool 104 is that the contact area and contact pressure of the polishing pad 107 with respect to the damaged portion D can be easily changed according to the polishing state.
[0013]
[Problems to be solved by the invention]
However, if a person unfamiliar with the operation of this type of polishing apparatus S uses the material, excessive shaving or uneven shaving was observed. In particular, these phenomena were remarkably observed in a coating film removing process for polishing using an end portion of a polishing tool and a process for forming a feather edge.
[0014]
The first factor is that the polishing area at the end of the polishing tool has a small contact area with the damaged portion during polishing, making it difficult to adjust the contact pressure between the damaged portion and the polishing tool. Second, since the polishing pad is formed of an elastic member such as a hard sponge, a slight change in contact pressure and a change in contact angle greatly deforms the polishing pad, thereby impairing the stability of the polishing tool against a damaged portion. This is because
[0015]
In addition, in the polishing using the conventional polishing tool due to the above factors, the operation direction of the polishing apparatus S with respect to the depression of the damaged portion D is limited. Specifically, as shown in FIG. 16, it was not possible to perform polishing while inclining the polishing tool in the direction of travel of the polishing apparatus S. That is, it was necessary to operate the polishing tool S in the direction in which the polishing apparatus S was pulled to perform polishing.
[0016]
This is because the pressing force applied to the polishing apparatus S acts on the end of the polishing tool rotating at a high speed, further increasing the amount of deformation of the polishing tool, and impairing the stability. Further, the end of the polishing tool is caught by a slight convex portion existing in the recess of the damaged portion D, and it is difficult to operate the polishing device in the pressing direction.
[0017]
As described above, in order to obtain a good polished surface using a conventional polishing tool, a high level of skill and a careful operation are required.
[0018]
In addition, since the polishing pad is made of an elastic member such as a hard sponge, if polishing using the vicinity of the outer edge is performed continuously, the polishing pad is locally deteriorated, and early replacement of the polishing tool is required. Was needed.
[0019]
In the process of removing the coating of the damaged portion D, forming the feather edge, polishing the surface of the cured putty, and polishing the surface of the primer surfacer, a rough polishing surface for rough polishing is first provided. Rough polishing is performed using a polishing tool that has been provided, and then, finish polishing is performed using a polishing tool provided with a fine polishing surface for fine polishing using a polishing tool that eliminates the polishing line generated by the rough polishing. Was.
[0020]
The present invention has been made in view of the above circumstances, has excellent operability and stability, can polish a surface to be polished into a desired shape by an easy operation, has high durability of the polished surface, and has an outer edge. An object of the present invention is to provide a polishing tool capable of continuously performing polishing using the vicinity thereof and capable of simultaneously finish-polishing a rough polishing portion immediately after the rough polishing.
[0021]
[Means for Solving the Problems]
The present invention according to claim 1 is a rotatable disk-shaped rotating substrate member provided with a rough polishing surface for holding a rough polishing abrasive on one surface, and a fine polishing surface on one surface. A polishing surface for fine polishing for holding the member, the polishing surface for rough polishing and the polishing surface for fine polishing are provided so as to be connected to a peripheral edge of the rotating substrate member such that the polishing surface is on the same side; A plurality of movable substrate members that pass through a connection portion with the substrate member, extend in a tangential direction of a peripheral edge of the rotating substrate member, and are rotatable around an axis parallel to the polishing surface for rough polishing; Holding means for holding the polishing surface for fine polishing of each movable substrate member so as to be substantially flush with the polishing surface for rough polishing of the rotary substrate member.
[0022]
According to a second aspect of the present invention, there is provided the polishing tool according to the first aspect, wherein each of the movable substrate members is provided at a position where an outer peripheral edge of the rotary substrate member is equally divided.
[0023]
According to a third aspect of the present invention, in the polishing tool according to the first or second aspect, an outer edge of each of the movable substrate members is larger than a circle of an outer peripheral edge of the rotating substrate member, and a center thereof is set. This is a polishing tool that forms the same circular arc.
[0024]
According to a fourth aspect of the present invention, in the polishing tool according to any one of the first to third aspects, the polishing tool is provided parallel to the rotating substrate member and the movable substrate member at a predetermined interval. A holding plate member, and a plurality of elastic members provided between the holding plate member and each of the movable substrate members, wherein the holding means is configured such that each of the movable substrate members is on the side of the holding plate member. The polishing tool is means for urging each of the movable substrate members in a direction away from the holding plate member by the elasticity of each of the elastic members when rotated.
[0025]
According to a fifth aspect of the present invention, in the polishing tool according to the fourth aspect, a turning range of the movable substrate member with respect to the rotating substrate member is such that a polishing surface for fine polishing of the movable substrate member is the rotating substrate member. A polishing tool ranging from a position substantially on the same plane as the polishing surface for rough polishing to a position where a part of the movable substrate member contacts the holding plate member.
[0026]
According to a sixth aspect of the present invention, in the polishing tool according to the fourth or fifth aspect, the elastic member is a polishing tool provided at least one for each of the plurality of movable substrate members. is there.
[0027]
According to a seventh aspect of the present invention, in the polishing tool according to any one of the fourth to sixth aspects, the polishing tool is provided so as to penetrate the polishing surfaces, the elastic member, and the holding plate member. It has a dust collection passage, and this dust collection passage is a polishing tool connected to a suction device that uses a negative pressure as an intake source.
[0028]
According to an eighth aspect of the present invention, in the polishing tool according to any one of the first to seventh aspects, the polishing surface for rough polishing has a film shape detachable from the rotating substrate member. The polishing tool is made of a polishing member, and the polishing surface for fine polishing is a film-like polishing member detachable from the movable substrate member.
[0029]
The present invention according to claim 9, in a film-shaped polishing member used for a polishing tool having a deformable annular portion, provided with a mounting portion to the deformable annular portion of the polishing tool on one surface, A polishing member provided with a polishing surface on the other surface and formed in a ring shape corresponding to a deformable annular portion of the polishing tool.
[0030]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
[0031]
First, the polishing tool according to the present embodiment will be schematically described with reference to FIG. 1. The polishing tool is detachably provided on a rotating shaft 102 of a polishing apparatus S, and is integrated with the rotation of the rotating shaft 102. A circular polishing plate comprising a circularly rotating holding plate member (holding plate) 1, a rotating substrate member 2 and a plurality of movable substrate members 3 provided below and parallel to the holding plate member 1 at predetermined intervals. The polishing apparatus includes a plate 6, an elastic member 4 provided between the polishing plate 6 and the holding plate member 1, and an adhesive sheet 7 attached to a lower surface of the polishing plate 6.
[0032]
The polishing surface 5 (see FIG. 2) for polishing the damaged portion corresponds to the lower surface side of the polishing plate 6 constituting the rotating substrate member 2 and the movable substrate member 3, and the polishing surface 5 is provided with sandpaper as a polishing member. It is adhered via the adhesive sheet 7. Here, the lower and lower surfaces indicate the direction of the damaged part in the use state of the polishing tool according to the present embodiment.
[0033]
As the polishing device S for rotating the holding plate member 1, a polishing device such as the above-mentioned disc sander or double action sander is preferable. May be. In the present embodiment, an example is described in which a polishing tool is attached to a dust collecting type double action sander having a dust collecting function.
[0034]
The holding plate member 1 that is detachably provided to the polishing apparatus S is a circular plate made of resin, metal, or the like, and a mandrel 21 that engages with the rotating shaft 102 of the polishing apparatus S is provided at substantially the center position. . The mandrel 21 is supported by the rotating shaft of the polishing device S, and the holding plate member 1 rotates with the rotation of the rotating shaft 102 of the polishing device S. Here, a male screw is formed on the rotating shaft 102 of the polishing apparatus S, and a female screw is formed on the mandrel 21 provided on the holding plate member 1. Therefore, the holding plate member 1 can be easily attached to and detached from the polishing apparatus S.
[0035]
On the lower surface of the holding plate member 1, a circular polishing plate 6 constituting the rotating substrate member 2 and the movable substrate member 3 is provided in parallel with the holding plate member 1 at a predetermined interval via an elastic member 4. . The polishing plate 6 is a disk made of a resin material such as PVC (polyvinyl chloride) having a thickness of 2 mm, and has an outer diameter slightly larger than that of the holding plate member 1.
[0036]
Also, as shown in FIG. 6, the polishing plate 6 passes a point which is advanced from the center by about 1/2 of the radius in the radial direction and is concentric with the center of the circular polishing plate 6. A first cutting line 9 to be drawn is provided. A plurality of second cutting lines 10 extending radially from the first cutting line 9 toward the end (outer peripheral edge) of the polishing plate 6 are provided at 18 equally-divided portions of the first cutting line 9. I have.
[0037]
For this reason, the polishing plate 6 includes a circular panel 25 formed inside the first cutting line 9, and a round panel 25 formed outside the first cutting line 9, and the first cutting line 9 and the second cutting line 10. And a plurality of substantially fan-shaped panels 26 divided by. Moreover, since the circular panel 25 and the substantially fan-shaped panel 26 are connected via the adhesive sheet 7 provided on the lower surface of the polishing plate 6, the panels 25 and 26 do not relatively shift from a predetermined position. A circular polishing plate 6 is formed.
[0038]
Also, since the first cutting line 9 has a width of about 1 mm, a plurality of substantially panels formed outside the first cutting line 9 with respect to the circular panel 25 formed inside the first cutting line 9. The fan-shaped panel 26 passes through the connecting portion between the panels 25 and extends (extends) in the tangential direction of the peripheral edge of the circular panel 25, and the first cutting line 9 which is an axis parallel to the lower surface of the panel 25. , Each can be individually turned up and down on the outside, that is, in the thickness direction of the panel 26. That is, in the present embodiment, the circular panel 25 constituting the inside of the first cutting line 9 becomes the rotating substrate member 2, and the plurality of substantially fan-shaped panels 26 constituting the outside of the first cutting line 9 constitute the movable substrate It becomes member 3. Hereinafter, the circular panel 25 is referred to as the rotating substrate member 2, and the substantially fan-shaped panel 26 is referred to as the movable substrate member 3.
[0039]
As described above, the deformable annular portion is formed by the configuration in which the outer peripheral edge of each panel 26 can be individually rotated in the thickness direction of each panel 26, that is, in the vertical direction. On the lower surface of the plurality of substantially fan-shaped panels 26, fine sandpaper for fine polishing is provided in a ring shape via the adhesive sheet 7, and a polishing surface 71 for fine polishing is formed. On the lower surface of the panel 25, a rough rough sandpaper is provided through the adhesive sheet 7 so as to be surrounded by the fine polishing surface 71, and a substantially circular rough polishing surface 72 is formed. ing.
[0040]
On the surface of the adhesive sheet 7 (the back side of the surface in contact with the polishing plate 6), for example, one support of a fastener including a support having hooks and loops such as Velcro (registered trademark) is attached. Alternatively, the sandpaper for fine polishing and the sandpaper for rough polishing may be provided so as to be detachably and interchangeably mounted to form a sandpaper mounting portion.
[0041]
In this case, the other support of the fastener is provided on the surface of the sandpaper opposite to the surface on which the abrasive grains are mounted, and forms a mounting portion on the surface of the adhesive sheet 7.
[0042]
Here, the configuration of the polishing member 80 as each sandpaper when the above-mentioned sandpaper is attached to the adhesive sheet 7 using the above fastener will be described with reference to FIG. 11.
[0043]
The polishing member 80 is provided on the polishing tool 100, and is a film-shaped annular polishing member 81 which is used by being attached to the movable substrate member 3 which is a deformable annular portion. It is composed of a film-shaped and circular polishing member 82 used by being attached to the rotating substrate member 2.
[0044]
Here, the polishing member 81 and the polishing member 82 are divided by a circular cutting line 81C, and the inner diameter of the polishing member 81 substantially matches the outer diameter of the polishing member 82. The diameter of the cutting line 81C is substantially equal to the diameter of the rotating substrate member 2 of the polishing tool 100.
[0045]
The polishing member 81 has a mounting portion (fastener) 81A for the movable substrate member 3 which is a deformable annular portion of the polishing tool 100 on one surface, and a polishing surface 81B on the other surface. The movable substrate member 3 is formed in a ring shape.
[0046]
The polishing member 82 has a mounting portion (fastener) 82A for attaching the polishing tool 100 to the rotating substrate member 2 on one surface, and a polishing surface 82B on the other surface, and corresponds to the rotating substrate member 2 of the polishing tool 100. And is formed in a circular shape.
[0047]
The polishing member 80 including the polishing member 81 and the polishing member 82 is provided with a plurality of dust collecting holes for catching dust (polishing debris) generated when the damaged portion D is polished. More specifically, a dust collecting hole 11A provided substantially at the center of the polishing member 82, a plurality of dust collecting holes 12A provided at three equally spaced parts on the cutting line 81C, And a plurality of dust collection holes 13A provided at three equally-divided circumferences and located between adjacent dust collection holes 12A.
[0048]
Since the dust collection holes 12A are provided across the polishing member 81 and the polishing member 82, in the ring-shaped polishing member 81, substantially semicircular portions are formed at three equally-spaced portions on the inner peripheral edge. It exists as a notch.
[0049]
When the polishing member 81 and the polishing member 82 are mounted on the polishing tool 100, the dust collection holes 11A match the first dust collection holes 11 (see FIG. 6) described later, and the second dust collection holes 12 (FIG. 6). 12), and the dust collecting hole 13A matches the third dust collecting hole 13 (see FIG. 6).
[0050]
As described above, if the polishing member 80 is attached to the adhesive sheet 7 using the fastener, the sandpaper as the polishing member 80 can be easily replaced, that is, the sandpaper can be replaced.
[0051]
Further, in the present embodiment, the panels 26 of the movable substrate member 3 adjacent to each other are separated by the second cutting line 10 and held by the adhesive sheet 7, but the second cutting provided on the polishing plate 6 is performed. The cross-sectional shape of the line 10 may be a V-shaped groove or the like, and the panels 26 of the movable substrate member 3 may be connected without being separated.
[0052]
In short, each panel 26 of the movable substrate member 3 only needs to have a configuration in which the outer peripheral edge can be relatively deformed vertically with respect to the adjacent panel.
[0053]
Further, in the present embodiment, the rotating substrate member 2 and the movable substrate member 3 are connected via the adhesive sheet 7, but a thin connection portion, a hinge, and the like are provided at a position where the first cutting line 9 is provided, and the rotation is performed. The substrate member 2 and the movable substrate member 3 may be relatively rotatably connected. Here, the thin connection portion means that a linear thin portion is formed in any member by providing a groove having a V-shaped cross section, and one portion of the arbitrary member is formed with the thin portion as an axis. This is an embodiment of a rotating means configured to be rotatable with respect to the other portion of the above-mentioned arbitrary member.
[0054]
As described above, in the polishing tool according to the present embodiment, the polishing surface 5 in contact with the damaged portion D is composed of a plurality of inner and outer surfaces, and the damaged portion of the movable substrate member 3 corresponding to the end of the polishing plate 6. The outer peripheral edge of the portion of the panel 26 that is in contact with D rotates up and down with respect to the rotating substrate member 2 constituting the center side of the polishing plate 6, and the polishing surface corresponding to the rotating substrate member 2 has a rough surface. A polishing surface for polishing is provided, and a polishing surface corresponding to the ring-shaped movable substrate member 3 is provided with a ring-shaped polishing surface for fine polishing.
[0055]
Further, the polishing plate 6, the polishing surface 71 for fine polishing, and the polishing surface 72 for rough polishing constituting the rotating substrate member 2 and the movable substrate member 3 capture dust (polishing debris) generated during polishing of the damaged portion D. A plurality of dust collection holes are provided. Specifically, a first dust collecting hole 11 provided at the center of the rotating board member 2, a second dust collecting hole 12 provided at a plurality of positions on the first cutting line 9, that is, three equally-divided circumferential positions, A third dust collecting hole 13 is provided on the movable substrate member 3 and located between the adjacent second dust collecting holes 12 (see FIG. 6).
[0056]
The details of the dust collecting holes 11, 12, and 13 will be described in detail together with the description of the elastic member 4 provided between the holding plate member 1 and the polishing plate 6.
[0057]
As shown in FIGS. 7 to 9, the elastic member 4 has a first support member 14 for fixing a circular panel 25 constituting the rotating substrate member 2 to the holding plate member 1 and a substantially fan-shaped member constituting the movable substrate member 3. The polishing apparatus includes a second support member 15 for fixing the panel 26 to the holding plate member 1, and a side wall member 16 for forming a dust collection passage 40 communicating with the dust collection holes 11, 12, and 13 inside the polishing tool.
[0058]
As shown in FIG. 7, the first support member 14 has a diameter substantially equal to that of the rotating substrate member 2 and has a substantially fan-shaped outer shape divided into a plurality of equal parts (in this example, three parts) in the circumferential direction. It comprises a plurality (three) of hard sponges 17. Then, they are bonded to the rotating substrate member 2 and the holding plate member 1, respectively. In this state, a gap 19 is provided between the first support members 14 adjacent to each other, and the first dust collection hole 11 and the second dust collection hole 12 communicate with each other through the gap 19. . Therefore, the first dust collection hole 11 and the second dust collection hole 12 form one continuous passage.
[0059]
The first support member 14 is made of a resilient hard sponge, but has a large support area for the rotating board member 2, and as a result, the rotating board member 2 does not move relatively large with respect to the holding plate member 1. No, almost fixed.
[0060]
The second support member 15 includes a plurality of hard sponges 23 formed in a columnar shape, and a coil spring 24 provided to be wound around the outer periphery of each hard sponge 23. The hard sponge 23 and the coil spring 24 are provided one by one at substantially the center of each movable substrate member 3.
[0061]
The cross-sectional area of the second support member 15 is sufficiently smaller than that of the first support member 14 for fixing the rotating substrate member 2 to the holding plate member 1, and can be easily bent by fingers. Therefore, the fixed state between the holding plate member 1 and the movable substrate member 3 is sufficiently smaller than the fixing strength between the rotating substrate member 2 and the first support member 14, and the movable substrate member 3 can be easily moved to the holding plate member 1 side. Is fixed so that it can be approached.
[0062]
Therefore, when an external force (pressing force) acts on the movable substrate member 3 in a direction intersecting the surface, for example, a vertical direction, the movable substrate member 3 is connected to the rotating substrate member 2, that is, the first cutting line 9. Pivot about a straight line extending in the tangential direction to the holding plate member 1 (see FIG. 10). Further, when the external force acting on the movable substrate member 3 is removed, the movable substrate member 3 becomes flush with the rotating substrate member 2 (same plane) due to the tension of the coil spring 24 and the restoring force of the cylindrical hard sponge 23. Return to. When an external force (pressing force) is continuously applied to the movable substrate member 3, the upper surface side of the movable substrate member 3 comes into contact with the side edge of the holding plate member 1, and the vertical rotation of the movable substrate member 3 is restricted. You.
[0063]
The vertical rotation range of the movable substrate member 3 can be easily changed by changing the diameter or shape of the holding plate member 1 or the like. Further, it can be changed by changing the thickness of the elastic member 4. The vertical rotation range of the movable substrate member 3 is a range in which a good polished surface can be easily obtained when the polishing tool is operated within the range. Specifically, it is desirable that the movable substrate member 3 be inclined upward by 20 degrees from a position flush with the rotating substrate member 2.
[0064]
Next, the side wall member 16 that forms the dust collection passage 40 communicating with the plurality of dust collection holes 11, 12, 13 inside the polishing tool will be described. The side wall member 16 is formed of a hard sponge formed in a ring shape having a rectangular cross section, and has an inner diameter substantially equal to or slightly larger than the diameter of the holding plate member 1 and an outer diameter substantially equal to the diameter of the polishing plate 6. Have. And it is adhered along the edge of the polishing plate 6. Note that a virtual line L shown in FIG. 7 indicates an end of the holding plate member 1.
[0065]
When the side wall member 16 is disposed on the polishing plate 6, the space equal to the thickness of the elastic member 4 formed between the movable substrate member 3 and the holding plate member 1 as shown in FIG. Is a partition wall for the outside air, and a dust collection passage 40 blocked from the outside air is formed in the polishing tool. Then, the second dust collecting hole 12 and the third dust collecting hole 13 communicate with and open to the dust collecting passage 40.
[0066]
Here, the holding plate member 1 is provided with a suction port 41 penetrating through the holding plate member 1 and connected to the dust collection passage 40 (see FIG. 9). The suction hole 41 is connected to a suction device provided in the polishing device S and using a negative pressure as an air suction source. Dust generated during polishing is collected by the dust collection holes 11, 12, 13 → the dust collection passage 40 → the suction hole. 41 → Supplemented via the suction device. 8 and 9 are an AA 'end view and a BB' end view of FIG.
[0067]
As described above, in the polishing tool of the present embodiment, dust generated during polishing between the polished surface and the polished surface can be sucked from the dust collection passage 40 and efficiently guided to the suction device having the negative pressure source.
[0068]
Next, a method of using the polishing tool according to the present embodiment will be described.
[0069]
When removing the old paint film remaining in the damaged portion D, first, the sandpaper attached to the movable substrate member 3 and the peripheral edge of the sandpaper attached to the rotating substrate member 2 are brought into contact with the old paint film and polished. At this time, the sandpaper adhered to the polishing surface 72 for rough grinding uses a sandpaper of No. 60 to No. 80, and the sandpaper adhered to the polishing surface 71 for fine polishing uses a sandpaper of No. 120 to 240. The grain size of the abrasive grains of the sandpaper may be changed according to the polishing state of the damaged portion D.
[0070]
In addition, as a polishing apparatus S used for removing the old coating film, a disk sander is usually used. A polishing tool of the present embodiment of a type in which a shaft 21 supported by the polishing apparatus S is provided at the center of the holding plate member 1 is used.
[0071]
Thereafter, a feather edge F is formed on the damaged portion D from which the old coating film has been removed. In the process of forming the feather edge F, first, as shown in FIGS. 4 and 5, the damaged substrate D from which the old coating is removed is applied to the regular coating by using the movable substrate member 3 of the polishing tool. Form F. Here, in order to form a feather edge having a constant inclination angle in a short time, it is preferable to first make a rough feather scratch on the damaged portion D. Here, the feather flaw refers to rough cutting which is a standard for making the polishing amount of the feather edge F constant.
[0072]
Then, it is polished so as to remove the feather flaw to prepare a smooth feather edge. Since the double action sander is used in the process of forming the feather edge, the polishing tool according to the present embodiment is employed as the polishing tool.
[0073]
When preparing the feather edge, it is possible to perform the operation method of moving the polishing tool from the inside of the dent to the outside and the operation method of moving the polishing tool from the outside of the dent to the inside of the dent. it can. At this time, since the polishing tool of the present embodiment has high stability of the polishing tool with respect to the surface to be polished, the polishing tool can be polished by inclining the polishing tool toward the direction of travel of the polishing apparatus S, and the polishing tool can be polished for a shorter time than before. Can form a feather edge.
[0074]
Here, the characteristics of the polishing tool 100 when the polishing tool 100 is mounted on the double action sander and the paint applied to the panel surface of the automobile is removed will be described.
[0075]
First, the starting point is determined by operating the double action sander such that the fine polishing surface 71 of the polishing tool 100 and a part of the outer periphery of the rough polishing surface 72 are in contact with the coating surface of the coating, From this starting point, the sander is moved linearly at a constant speed while gradually reducing the pressure applied to the contact surface.
[0076]
Then, the trajectory of the polishing tool 100 is drawn substantially in a straight line because the run of the polishing tool 100 with respect to the painted surface is small.
[0077]
In addition, the reason why the run-out of the polishing tool 100 is small is that the portion corresponding to the end portion of the polishing tool 100 is constituted by the surface (the movable substrate member 3), so that the change in the contact area of the polishing tool 100 with the painted surface is small. In addition, since the elastic member 4 provided between the holding plate member 1 and the movable substrate member 3 absorbs an extra force applied to the polishing tool 100, the contact pressure of the polishing tool 100 against the coating film surface varies. May be small.
[0078]
These factors improve the stability of the polishing tool, and the trajectory of the polishing tool 100 is aligned on a straight line. Therefore, the double action sander to which the polishing tool 100 is attached can reliably polish only a desired range in a process of forming a feather edge, a process of removing a coating film, and the like.
[0079]
In addition, when the polishing tool 100 is in the polished state, the amount of polishing in the direction along the coating film surface varies little. That is, the gradient of the polishing amount in the direction of the coating film surface becomes gentle.
[0080]
The reason for this is that, when polishing using the end portion of the polishing tool 100, the polishing tool 100 comes into contact with the surface to be painted, and performs polishing with a wide polishing area corresponding to the rotation direction (width) of the surface. Can be considered. Further, the elastic member 4 provided between the holding plate member 1 and the movable substrate member 3 absorbs unnecessary suppression force acting on the polishing tool 100 and reduces the fluctuation of the contact pressure on the coating film surface. Can be considered.
[0081]
In the double action sander equipped with the polishing tool 100 as described above, for example, in a process of forming a feather edge, a gentle slope between a damaged portion and a regular painted surface can be easily formed at a predetermined angle. Can be.
[0082]
The polishing tool 100 includes a rotatable inner rotating substrate member 2 provided with a rough polishing surface 72 for holding a rough polishing material on one surface, and a fine polishing member on one surface. An outer annular polishing surface 71 for holding is provided, which is connected to the periphery of the rotating substrate member 2 so that the polishing surface 72 for rough polishing and the polishing surface 71 for fine polishing are on the same side. A plurality of movable substrate members that pass through a connection with the rotating substrate member 2, extend tangentially to the periphery of the rotating substrate member 2, and are rotatable around an axis parallel to the rough polishing surface 72. 3 and an elastic member 4 serving as holding means for holding the polishing surface 71 for fine polishing of each movable substrate member 3 so as to be substantially flush with the polishing surface 72 for rough polishing of the rotary substrate member 2. Have.
[0083]
Therefore, the polishing surface is composed of a plurality of surfaces, and when polishing using the end of the polishing tool 100, the polishing surface provided on the movable substrate member 3 and the polishing surface on the outer peripheral edge of the rotary substrate member 2 Is brought into contact with the surface to be polished D and polished. In other words, in the polishing tool of the present invention, the portion polished by the inner rough polishing surface 72 is polished by passing the outer annular fine polishing surface 71.
[0084]
In other words, when the polishing tool 100 is rotated and the center moves forward (in the direction in which the polishing apparatus S is pulled as shown in FIG. 16), fine polishing is performed after rough polishing, and polishing is performed again. It is not necessary to change the tool (sandpaper) to perform rough grinding and fine grinding, and the efficiency is improved, and rough grinding and fine grinding can be performed without requiring much skill. It can be done easily.
[0085]
In addition, when polishing using the end of the polishing tool 100, the contact area between the polishing surface and the surface D to be polished does not largely change, and the contact pressure between the polishing tool and the surface D to be polished is easily adjusted. can do. For this reason, the stability of the polishing tool with respect to the surface D to be polished is improved, and the surface D to be polished can be polished into a desired shape by an easy operation without careful work without any skill.
[0086]
Further, as shown in FIG. 16, even when polishing is performed while the polishing tool 100 is inclined in the direction of travel of the polishing apparatus S, the polished surface is deformed while maintaining a predetermined shape, and the sense of stability is impaired. And a good polished surface can be obtained. Further, even when polishing is continuously performed using the end portion of the polishing tool 100, the polishing tool 100 is in contact with the surface D to be polished on the polishing surface of the movable substrate member 3. Deterioration of this end portion can be suppressed without causing excessive force in the end portion near the outer edge, and local wear of the sandpaper can be suppressed.
[0087]
Furthermore, the polishing surface is provided for the rough polishing surface 72 provided corresponding to the rotating substrate member 2 and the fine polishing polishing surface provided for the movable substrate member 3 outside the rough polishing surface 72. The polishing tool 100 is slightly inclined with respect to the painted surface, and the polishing surface 71 for fine polishing and the end portion which is the outer peripheral edge of the polishing surface 72 for rough polishing are simultaneously brought into contact with the painted surface, As described above, when the polishing apparatus is operated in the pulling direction as shown in FIG. 16 (the direction not marked with “x” in FIG. 16) to polish the painted surface, the rough polishing and the finish polishing are performed one at a time. It can be performed in a single polishing operation.
[0088]
In addition, the polishing tool 100 includes a holding plate member 1 provided in parallel with the rotating substrate member 2 and the movable substrate member 3 at a predetermined interval, and between the holding plate member 1 and each of the movable substrate members 3. A plurality of elastic members 4 are provided, and the elasticity of each elastic member 4 urges the movable substrate member 3 in a direction from the holding plate member 1 to the movable substrate member 3 so that the movable substrate member 3 The provided polishing surface 71 for fine polishing is located substantially on the same plane as the polishing surface 72 for rough polishing provided on the rotating substrate member 2. Further, an elastic member 4 serving as an urging and holding means is provided so as to stand upright between the movable substrate member 3 and the holding plate member 1.
[0089]
Therefore, in the polishing tool 100, a stable spring constant can be obtained when the movable substrate member 3 is biased, and slight vibration due to contact between the polishing tool 100 and the damaged portion is reduced by the elastic member 4 serving as the biasing means. Can be absorbed. Then, the stability of the polishing tool 100 when polishing the damaged portion is further improved.
[0090]
Further, in the polishing tool 100, the rotating substrate member 2 is a substantially disk-shaped member, and each movable substrate member 3 is provided at a position obtained by equally dividing the outer circumference of the disk-shaped member.
[0091]
Therefore, according to the polishing tool 100, since the connection line between the movable substrate member 3 and the rotating substrate member 2 draws an arc, the bent portion from the rotating substrate member 2 to the movable substrate member 3 is bent with respect to the concave inner surface of the damaged portion. Contact can be made smoothly. In addition, since the movable substrate member 3 is provided at a plurality of portions equally dividing the outer peripheral edge of the rotating substrate member 2, the contact (rotation) resistance associated with the rotation of the polishing tool 100 with respect to the damaged portion becomes uniform over the entire circumference and the polishing is performed. The rotation of the tool 100 is stabilized.
[0092]
Further, according to the polishing tool 100, the outer edge of each movable substrate member 3 is larger than the circle of the outer peripheral edge of the rotating substrate member 2 and forms an arc of a circle having the same center. The outer edge of the movable substrate member 3 can be smoothly brought into contact with the inner surface of the recess of the portion.
[0093]
Further, according to the polishing tool 100, the range of rotation of the movable substrate member 3 with respect to the rotating substrate member 2 is such that the polishing surface 71 for fine polishing of the movable substrate member 3 is Since the range is from a position existing on substantially the same plane to a position where a part of the movable substrate member 3 comes into contact with the holding plate member 1, the movable range of the movable substrate member 3 is set in advance. Even a person who is unfamiliar with the operation can keep the contact angle between the damaged part and the polishing tool 100 in an appropriate range by polishing within the movable range.
[0094]
According to the polishing tool 100, since at least one elastic member 4 is provided for each of the plurality of movable substrate members 3, urging means is provided for each of the movable substrate members 3. That is, each movable substrate member 3 individually contacts the damaged portion at a predetermined contact pressure. Therefore, at the time of polishing using the end portion of the polishing tool 100, polishing with higher precision can be performed. In addition, by arbitrarily setting the number of elastic members 4 provided on each movable substrate member 3, the movable substrate member 3 having a desired restoring force (elastic force) can be obtained.
[0095]
In addition, the polishing tool 100 is provided with a dust collecting passage provided through the polishing surface 71 for fine polishing, the polishing surface 72 for rough polishing, the elastic member 4 and the holding plate member 1, and this dust collecting passage is If it is connected to a suction device that uses pressure as a suction source, dust generated on the polished surface during polishing can be guided to the suction device using the dust collection passage. That is, a polishing tool corresponding to a dust collecting type polishing apparatus can be obtained.
[0096]
In the polishing tool 100, the rough polishing surface 72 is formed of a film-like polishing member detachable from the rotating substrate member 2, and the fine polishing surface 71 is detachable from the movable substrate member 3. When the polishing surface 71 for fine polishing or the polishing surface 72 for rough polishing is worn out, the polishing members constituting these are replaced, and the polishing surface 71 for fine polishing or the rough polishing The polished surface 72 can be easily updated.
[0097]
By the way, when the feather edge is formed by using the polishing tool 100, when the hardened putty applied to the damaged portion is polished, the hardened primer surfacer applied to the surface of the putty and the surrounding coating film is polished. The case will be described.
[0098]
First, the case where the feather edge FE1 is formed will be described.
[0099]
FIG. 12 is a diagram illustrating a cross section of the feather edge FE1, and FIG. 13 is a cross-sectional diagram illustrating a state of the feather edge FE1 formed using the polishing tool 100.
[0100]
As shown in FIG. 12, the feather edge FE1 formed after removing the old coating film of the damaged portion D1 was formed by the primer AF2, the surfacer AF3, and the topcoat AF4, which were sequentially applied on the surface of the steel sheet SS1. It is formed between the coating film surface AF5 of the coating film AF1 and the surface of the steel sheet SS1 of the damaged portion D1.
[0101]
In other words, the feather edge FE1 is a boundary between the portion where the surface of the steel sheet SS1 of the damaged portion D1 is exposed and the portion where the primer AF2 covers the surface of the steel plate SS1 of the damaged portion D1 and the coating film AF1. It is a smooth slope formed between the edge EG1 and the coating film surface AF1 between the coating film surface AF1.
[0102]
Here, the hardness of the primer AF2 of the coating film AF1 is "F to H", the hardness of the surfacer AF3 is "HB to H", and the hardness of the overcoat AF4 is "H to 2H".
[0103]
“F”, “H”, “HB”, and “2H” indicating the hardness are sharpened with the tip of a pencil lead and pressed vertically against the coating film with a force of 1 kgf (9.8 N). The hardness of the paint film is determined by pulling the pencil while applying a load of 1 kgf to determine whether the paint film is damaged. For example, the hardness of the pencil is 2H. If the coating film is not damaged by a pencil lead having a hardness of "H", the coating film hardness of this coating film is "H". Note that the hardness increases in the order of HB, F, H, and 2H.
[0104]
A defect that occurs when the damaged portion D1 of the vehicle is repaired, for example, a step caused by the shrinkage of the putty PT1 when the putty PT1 applied to the damaged portion D1 (see FIG. 14) dries (the putty PT1 and the coating film AF1). It is desirable to increase the width W1 of the feather edge FE1 as much as possible in order to minimize the step between them.
[0105]
Next, a case where the feather edge FE1 is formed between the damaged portion D1 and the coating film AF1 using the polishing tool 100 will be described with reference to FIG.
[0106]
After removing the old coating film of the damaged portion D1 and exposing the steel plate SS1, the polishing tool 100 that rotates (rotates) about the rotation center CR1 in the direction of the arrow AR131 is pressed against the steel plate SS1 and the coating film AF1. Then, as shown in FIG. 13, it moves in the direction of arrow AR132 along edge EG1 to form feather edge FE1.
[0107]
In this case, in the advancing direction of the polishing tool 100, the polishing tool 100 is pressed so that the polishing tool 100 slightly separates from the coating film AF1 and the steel sheet SS1, and is slightly stronger than the coating film AF1. Hit it.
[0108]
Note that the outer diameter of the polishing surface 71 for fine polishing is, for example, 12 cm, the outer diameter of the polishing surface 72 for rough polishing is, for example, 8 cm, and the rotation center CR1 of the polishing tool 100 is, for example, the coating film AF1 rather than the edge EG1. A position slightly shifted to the side (a position separated from the edge EG1 by, for example, 1 cm) is moved along the edge EG1. The thickness of the coating film AF1 is, for example, 120 μm.
[0109]
Here, for each of the cross sections CS1 to CS3 shown in FIG. 13, for example, a sandpaper of # 180 is mounted on the polishing surface 71 for fine polishing, and a sandpaper of, for example, # 120 is mounted on the polishing surface 72 for rough polishing. It is a figure which comprises the grinding | polishing surface 71 and the grinding | polishing surface 72 for rough grinding, and shows the cross-sectional shape of the feather edge FE1 at the time of forming the feather edge FE1.
[0110]
The cross section CS1 shows the shape of the feather edge FE1 by exaggerating the thickness direction of the coating film AF1 and the size of the portion cut by the polishing surface 71 for fine polishing and the polishing surface 72 for rough polishing. FIG.
[0111]
When the number of the sandpaper attached to the polishing surface such as the polishing surface 71 for fine polishing or the polishing surface 72 for rough polishing becomes smaller, the diameter of the abrasive grains of this sandpaper becomes larger. The film AF1 is deeply scratched, and the polishing property is improved. On the other hand, when the number indicating the number of the sandpaper attached to the polished surface increases, the diameter of the abrasive grains of the sandpaper decreases, and when the coating film AF1 is polished, the scratches entering the coating film AF1 become shallower, and the polishing property decreases. become worse.
[0112]
In the portion of the cross section CS11 of the cross section CS1, a large number of scratches having a depth of about 100 μm are formed in the coating film AF1 by being polished by a # 120 sandpaper attached to the polishing surface 72 for rough polishing, and a triangle having a height of 100 μm. The cross section of the feather edge FE1 is formed by the set of shapes.
[0113]
Subsequently (after being polished by the lapping surface 72 for rough lapping), the polished surface is polished by the lapping surface 71 for refining with sandpaper # 180. A portion of 40 μm is shaved and disappears, and a cross section of the feather edge FE1 is formed by a collection of a large number of trapezoids having a height of 60 μm.
[0114]
In the section of the cross section CS12 of the cross section CS1, by being polished only by the # 180 sandpaper attached to the polishing surface 71 for fine polishing, a large number of scratches having a depth of about 40 μm are formed in the coating film AF1, and the coating film AF1 having a height of 40 μm is formed. A cross section of the feather edge FE1 is formed by a set of a large number of triangular cross sections.
[0115]
The cross section CS2 shows the shape of the feather edge FE1 by exaggerating and modeling the thickness direction of the coating film AF1 and the size of the portion cut by the fine polishing surface 71 and the rough polishing surface 72. FIG. 3 is a diagram showing a state closer to the actual shape than the cross section CS1.
[0116]
In the section CS21 of the section CS2, the height of each trapezoid gradually increases from the edge EG1 toward the outer edge EG2 of the feather edge as compared to the section CS11 of the section CS1. The reason for this is that as the outer edge EG2 of the feather edge approaches the edge EG1, the crossing angle between the rotation (rotation) direction of the polishing tool 100 and the feed direction (moving direction) of the polishing tool 100 becomes closer to a right angle, and is used for fine polishing. This is because the abrasive grains between the polishing surface 71 and the rough polishing surface 72 gradually scrape off the coating film AF1 and press the polishing tool 100 against the steel plate SS1 with a slightly stronger force than the coating film AF1. This is because the coating film AF1 on the side closer to the steel sheet SS1 is slightly removed.
[0117]
At the section CS22 of the section CS2, the polishing surface 71 for fine polishing easily bends in a direction away from the coating film AF1 about the boundary between the polishing surface 72 for rough polishing and the polishing surface 71 for fine polishing. Therefore, the height of each triangle gradually increases from the edge EG1 toward the outer edge EG2 of the feather edge as compared with the section CS12 of the cross section CS1.
[0118]
The cross section CS3 is a diagram showing the shape of the feather edge FE1 when the cross section CS2 is viewed macroscopically (however, when the dimension in the thickness direction of the coating film AF1 is enlarged).
[0119]
As can be seen from the cross section CS3, the feather edge FE1 is formed smoothly and long (wide) almost linearly from the edge EG1 to the outer edge EG2 of the feather edge, that is, in FIG. 13, the length (width) is about 7 cm. ) A smooth feather edge of W1 is formed.
[0120]
In order to form the feather edge FE1 in such a manner that the feather edge FE1 is broadly formed substantially linearly, the polishing tool 100 is used, and the polishing surface 71 for fine polishing (sandpaper forming the polishing surface 71 for fine polishing) is further ground. The grain count, the grain count of the rough polishing surface 72 (sandpaper forming the rough polishing surface 72), the outer diameter of the fine polishing surface 71, and the outer diameter of the rough polishing surface 72 It is necessary that the position of the locus of the center CR1 of the polishing tool 100 and the hardness of the coating film AF1 are roughly balanced.
[0121]
As described above, each of the above factors (the number of the abrasive grains of the polishing surface 71 for fine polishing, the number of the abrasive particles of the polishing surface 72 for rough polishing, the outer diameter of the polishing surface 71 for fine polishing, the outer diameter of the polishing surface 72 for rough polishing). As long as the diameter, the position of the locus of the center CR1 of the polishing tool 100, and the hardness of the coating film AF1) are balanced, the values indicating the characteristics of the above factors may be set to values other than the above values.
[0122]
For example, when the hardness of the coating film AF1 becomes slightly hard, for example, the rough polishing surface 72 is composed of # 80 sandpaper, and the fine polishing surface 71 is # 120 sandpaper. You may make it comprise. In addition to the above combinations, the polishing surface 72 for rough polishing may be configured to be coarser at a fixed rate than the polishing surface 71 for fine polishing in accordance with a change in the hardness of the coating film AF1. .
[0123]
Further, for example, the outer diameter of the rough polishing surface 72 and the outer diameter of the fine polishing surface 71 may be changed.
[0124]
Next, the polishing surface 71 for fine polishing and the polishing surface 72 for rough polishing are formed of sandpaper of the same count (for example, sandpaper of count # 120), and other conditions are the same as those in the case where the cross section CS3 is formed. The case where the feather edge FE1 is formed will be described with reference to the cross section CS4 and the cross section CS5 in FIG.
[0125]
The cross section CS4 in FIG. 13 exaggerates the shape of the feather edge FE1 in the thickness direction of the coating film AF1 and the size of the portion cut by the polishing surface 71 for fine polishing and the polishing surface 72 for rough polishing. It is the figure modeled and shown like cross section CS2.
[0126]
The section of the section CS41 of the section CS4 has a cross section of the feather edge FE1 substantially similar to the section of the section CS21 of the section CS2. However, the height of each trapezoid forming the feather edge of the section of the section CS41 is different from the section of the section CS41. The height of each trapezoid forming the feather edge of the portion of CS21 is lower. That is, the thickness of the coating film in the section of the cross section CS41 is considerably smaller than the thickness of the coating film in the section of the cross section CS21, and almost no coating film AF1 remains.
[0127]
The reason for this is that the coating film AF1 is shaved by the rough-grinding polishing surface 72 on which the # 120 sandpaper is mounted, and thereafter (after being polished by the rough-grinding polishing surface 72), the coating film AF1 is the same as the rough-grinding polishing surface 72. Since the polishing is performed on the polishing surface 71 for fine polishing on which the sandpaper of # 120 is mounted, the coating film AF1 is larger in amount than the polishing on the polishing surface 71 for fine polishing on which the sandpaper of # 180 is mounted. It is because it is scraped off.
[0128]
The section of the section CS42 of the section CS4 has a cross section of the feather edge FE1 substantially similar to the section of the section CS22 of the section CS2. However, since the sandpaper of the polishing surface 71 for fine polishing is coarse, The polished line is coarser than the section of the cross section CS22.
[0129]
The cross section CS5 is a diagram showing the shape of the feather edge FE1 when the cross section CS4 is viewed macroscopically (when the dimension in the thickness direction of the coating film AF1 is enlarged).
[0130]
As can be seen from the cross section CS5, the feather edge FE1 is not formed substantially linearly from the edge EG1 to the outer edge EG2 of the feather edge, and the surface polished by the polishing surface 71 for fine polishing and the polishing for rough polishing are performed. It is bent at the boundary EG3 between the polished surface at the surface 72. That is, the feather edge is hardly formed between the edge EG1 and the boundary EG3, and the width from the boundary EG3 to the outer edge EG3 of the feather edge FE1 is about 2 cm (the radius of the polishing surface 71 for fine polishing and the polishing for rough polishing). A feather edge (difference from the radius of the surface 72) is formed.
[0131]
As already understood, the polishing tool 100 is used, and further, the count of the abrasive grains on the polishing surface 71 for fine polishing (sandpaper forming the polishing surface 71 for fine polishing) and the polishing surface 72 for rough polishing (for rough polishing) The number of the abrasive grains of the sandpaper that forms the polishing surface 72, the outer diameter of the polishing surface 71 for fine polishing, the outer diameter of the polishing surface 72 for rough polishing, the position of the center CR1 locus of the polishing tool 100, and the coating film If the feather edge FE1 is formed in balance with the hardness of the AF1, a wide feather edge can be easily formed.
[0132]
Next, a case in which the putty PT1 applied to the damaged portion D1 and cured is polished using the polishing tool 100 will be described.
[0133]
FIG. 14 is a diagram showing a cross section of the damaged portion D1 and the vicinity thereof in a state where the feather edge FE1 is formed on the damaged portion D1, the putty PT1 is applied, and the applied putty PT1 is cured.
[0134]
After the putty PT1 has been cured, the surface PT2 of the cured putty PT1 is polished to improve the finish of the repaired portion so that it is difficult to distinguish the repaired portion from the undamaged portion. It is necessary to keep the smoothness between the surface AF5 of the coating film AF1 and the surface PT2 of the putty PT1 as much as possible.
[0135]
That is, the swelling of the surface PT2 of the cured putty PT1 is minimized to make it as same as possible the shape of the surface of the coating before damage, and further, the surface AF5 of the coating AF1 around the surface PT2 of the cured putty PT1 is smooth. You need to be connected.
[0136]
Therefore, the polishing is performed using the polishing tool 100 as described below so as to obtain the above-described smoothness.
[0137]
The polishing surface 72 for rough polishing of the rotating polishing tool 100 is pressed against the surface PT2 of the putty PT1, and the polishing surface 71 for fine polishing is pressed against the surface AF5 of the coating film AF1. The operator adjusts the polishing tool 100 so that the boundary between the polishing surface 71 and the polishing surface 72 for rough polishing is along the boundary EG4 between the surface PT2 of the putty PT1 and the surface AF5 of the coating film AF1 shown in FIG. Move.
[0138]
Here, the reason why the rough polishing surface 72 is pressed against the surface PT2 of the putty PT1 and the fine polishing surface 71 is pressed against the surface AF5 of the coating film AF1 is that the hardness of the putty PT1 is generally low. The surface PT2 of the putty PT1 which is raised and hardened is polished by the rough polishing surface 72, which is formed to be harder than the hardness of the coating film AF1 and has good polishing properties (has a large amount of polishing), and is flattened. It is necessary to do it.
[0139]
By polishing as described above, the surface PT2 of the putty PT1 is first polished by the rough polishing surface 72 to form a flat surface. Immediately thereafter, the fine polishing surface 71 is polished to form the putty PT1. Since the paper pattern on the surface PT2 is erased, the operation of flattening the surface PT2 of the putty PT1 and the operation of blanking the surface PT2 of the putty PT1 are performed almost simultaneously only by passing the polishing tool 100 once. Be done.
[0140]
In addition, by polishing as described above, the surface AF5 of the coating film AF1 is polished only by the polishing surface 71 for fine polishing, which is slightly less polished than the polishing surface 72 for rough polishing. The amount to be polished is smaller than that.
[0141]
Therefore, it is possible to smooth the surface between the surface AF5 of the coating film AF1 and the surface PT2 of the putty PT1 only by polishing as described above, that is, without requiring a special operation or skill to the operator of the polishing tool 100. Can be.
[0142]
Here, assuming that the above-described polishing is performed by attaching the same number of papers to the polishing surface 71 for fine polishing and the polishing surface 72 for rough polishing, the coating film AF1 softer than the surface PT2 of the putty PT1. The surface AF5 is shaved more than the surface PT2 of the putty PT1, and it becomes difficult to smooth the surface AF5 of the coating film AF1 and the surface PT2 of the putty PT1. That is, it is difficult to smooth the surface AF5 of the coating film AF1 and the surface PT2 of the putty PT1 without a high level of skill or a special operation of the polishing tool 100.
[0143]
Next, the case where the primer surfacer SF1 applied to the hardened and polished surface PT2 of the putty PT1 and the surrounding surface AF5 of the coating film AF1 and hardened using the polishing tool 100 is polished will be described.
[0144]
FIG. 15 is a cross-sectional view showing the cured and polished surface PT2 of the putty PT1 and the surface AF5 of the coating film AF1 around the cured surface and the cured primer surfacer SF1 and its surroundings.
[0145]
As in the case of polishing the hardened putty PT1, the hardened and polished putty PT1 is used in order to improve the finish of the repaired portion so that it is difficult to distinguish the repaired portion from the undamaged portion. After the primer surfacer SF1 applied to the surface of the substrate is cured, the surface SF2 of the cured primer surfacer SF1 is polished to maintain as smooth as possible the surface AF5 of the coating film AF1 and the surface SF2 of the primer surfacer SF1. There is.
[0146]
That is, the rise of the surface SF2 of the cured primer surfacer SF1 is minimized to have the same shape as the surface of the coating before damage, and the surface AF5 of the coating AF1 around the surface SF2 of the cured primer surfacer SF1. It needs to be connected smoothly.
[0147]
Therefore, in the state shown in FIG. 15, for example, when the cured primer surfacer SF1 is harder than the coating film AF1, as in the case of polishing the cured putty PT1 in FIG. 72 is pressed against the surface SF2 of the primer surfacer SF1, and the polishing surface 71 for fine polishing of the polishing tool 100 is pressed against the surface AF2 of the coating film AF1, so that the polishing surface 71 for fine polishing and the rough polishing The operator moves the polishing tool 100 so that the boundary between the polishing surface 72 for use and the boundary EG5 between the surface SF2 of the primer surfacer SF1 and the surface AF5 of the coating film AF1 shown in FIG.
[0148]
On the other hand, when the coating film AF1 is harder than the cured primer surfacer SF1, the polishing surface 72 for rough polishing of the polishing tool 100 is changed to the surface of the coating film AF1, contrary to the case where the cured putty PT1 is polished in FIG. By pressing against the AF2, the polishing surface 71 for fine polishing of the polishing tool 100 is pressed against the surface SF2 of the primer surfacer SF1, and between the polishing surface 71 for fine polishing and the polishing surface 72 for rough polishing of the polishing tool 100. The operator moves the polishing tool 100 so that the boundary is along the boundary EG5 between the surface SF2 of the primer surfacer SF1 and the surface AF5 of the coating film AF1 shown in FIG.
[0149]
The surface AF5 and the primer of the coating film AF1 are polished in the same manner as when the cured putty PT1 is polished in FIG. 14 without polishing only as described above, that is, without requiring the operator of the polishing tool 100 to perform any special operation or skill. The smoothness between the surfacer SF1 and the surface SF2 can be maintained.
[0150]
【The invention's effect】
According to the present invention, excellent operability and stability, the surface to be polished can be polished to a desired shape by an easy operation, the durability of the polished surface is high, and polishing using the outer edge vicinity can be continuously performed. It is possible to perform finish polishing of the rough polished portion at the same time immediately after the rough polishing.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a polishing tool according to an embodiment of the present invention.
FIG. 2 shows a polishing apparatus equipped with a polishing tool according to an embodiment of the present invention.
FIG. 3 is a front view of the polishing tool according to the embodiment of the present invention.
FIG. 4 is a diagram showing a use state of the polishing apparatus equipped with the polishing tool according to the embodiment of the present invention.
FIG. 5 is a diagram showing a movable state of an end portion of the polishing tool according to the embodiment of the present invention.
FIG. 6 is a view showing a polishing plate of the polishing tool according to the embodiment of the present invention.
FIG. 7 is a sectional view taken along the line CC ′ of the polishing tool according to the embodiment of the present invention.
FIG. 8 is an AA ′ cross-sectional view of the polishing tool according to the embodiment of the present invention.
FIG. 9 is a sectional view taken along the line BB ′ of the polishing tool according to the embodiment of the present invention.
FIG. 10 is a cross-sectional view taken along the line AA ′ of the polishing tool according to the embodiment of the present invention when the movable substrate member is movable.
FIG. 11 is a perspective view of a polishing member according to the embodiment of the present invention.
FIG. 12 is a diagram showing a cross section of a feather edge.
FIG. 13 is a sectional view showing a state of a feather edge formed by using a polishing tool.
FIG. 14 is a cross-sectional view showing a cross section of a damaged portion and its vicinity in a state where a feather edge is formed on the damaged portion, putty is applied, and the applied putty is cured;
FIG. 15 is a cross-sectional view showing a cured and polished surface of a putty and a surface of a coating film around the cured and polished primer surfacer and a state around the primer surfacer.
FIG. 16 is a diagram showing a use state of a conventional polishing apparatus for a coating film removing process.
FIG. 17 is a diagram illustrating a use state of a conventional polishing apparatus according to a conventional process of forming a feather edge.
FIG. 18 is a view showing a use state of a conventional polishing apparatus.
[Explanation of symbols]
1 Holding plate member
2 Rotating board member
3 movable board member
4 Elastic members
5 Polished surface
6 polishing plate
7 Adhesive sheet
9 First cutting line
10 Second cutting line
11 1st dust collection hole
12 Second dust collection hole
13 Third dust collection hole
14 First support member
15 Second support member
16 Side wall members
17 Hard fan-shaped hard sponge
19 gap
21 mandrel
23 Cylindrical hard sponge
24 coil spring
25 circular panel
26 Substantially linear panel
40 dust collection passage
41 Suction hole
71 Polished surface for fine polishing
72 Polished surface for rough grinding
80 polishing member
81 Polishing member for fine polishing
81A mounting part
81B Polished surface
82 Polishing member for rough grinding
82A mounting part
82B polished surface
100 polishing tool
101 Rotation mechanism
102 rotation axis
103 Polished surface
104 polishing tool
105 mandrel
106 holding plate
107 polishing pad
108 End of polishing pad
S polishing machine
F Feather edge
D Damaged part (polished surface)

Claims

一方の表面に粗研用研磨材を保持する粗研用研磨面が設けられた回転可能な円盤状の回転基板部材と；
一方の表面に精研用研磨部材を保持する精研用研磨面を具備し、前記粗研用研磨面と前記精研用研磨面とが同じ側になるように前記回転基板部材の周縁に接続して設けられると共に、前記回転基板部材との接続部を通過し、前記回転基板部材の周縁の接線方向に延伸し、前記粗研用研磨面に平行である軸線を中心として回動可能である複数の可動基板部材と；
前記各可動基板部材の前記精研用研磨面が、前記回転基板部材の前記粗研用研磨面に対して、ほぼ同一平面となるように保持する保持手段と；
を有することを特徴とする研磨具。A rotatable disk-shaped rotating substrate member provided with a roughening polishing surface for holding a roughening abrasive on one surface;
A polishing surface for fine polishing for holding a polishing member for fine polishing is provided on one surface, and is connected to a peripheral edge of the rotating substrate member such that the polishing surface for rough polishing and the polishing surface for fine polishing are on the same side. Is provided, and passes through a connection portion with the rotating substrate member, extends in a tangential direction of a peripheral edge of the rotating substrate member, and is rotatable around an axis parallel to the rough polishing surface. A plurality of movable substrate members;
Holding means for holding the polishing surface for fine polishing of each movable substrate member substantially flush with the polishing surface for rough polishing of the rotary substrate member;
A polishing tool comprising:

請求項１に記載の研磨具において、
前記回転基板部材の外周縁を等分した箇所に、前記各可動基板部材が設けられていることを特徴とする研磨具。The polishing tool according to claim 1,
A polishing tool, wherein each of the movable substrate members is provided at a position obtained by equally dividing an outer peripheral edge of the rotating substrate member.

請求項１または請求項２に記載の研磨具において、
前記各可動基板部材の外端縁は、前記回転基板部材外周縁の円よりも大きく、かつ中心が同一である円の円弧を形成することを特徴とする研磨具。The polishing tool according to claim 1 or claim 2,
A polishing tool, wherein an outer edge of each of the movable substrate members is larger than a circle of an outer peripheral edge of the rotating substrate member and forms an arc of a circle having the same center.

請求項１〜請求項３のいずれか１項に記載の研磨具において、
前記回転基板部材と前記可動基板部材とに平行かつ所定の間隔をおいて設けられている保持板部材と；
前記保持板部材と前記各可動基板部材との間に設けられている複数の弾性部材と；
を具備し、前記保持手段は、前記各可動基板部材が前記保持板部材側に回動したとき、前記各弾性部材の弾性によって、前記保持板部材から離反する方向に前記各可動基板部材を付勢する手段であることを特長とする研磨具。The polishing tool according to any one of claims 1 to 3,
A holding plate member provided in parallel with the rotating substrate member and the movable substrate member at a predetermined interval;
A plurality of elastic members provided between the holding plate member and the movable substrate members;
Wherein the holding means attaches each of the movable substrate members in a direction away from the holding plate member by the elasticity of each of the elastic members when each of the movable substrate members rotates toward the holding plate member. A polishing tool characterized in that it is a means for energizing.

請求項４に記載の研磨具において、
前記回転基板部材に対する前記可動基板部材の回動範囲は、前記可動基板部材の精研用研磨面が前記回転基板部材の粗研用研磨面に対してほぼ同一平面上に存在する位置から、前記可動基板部材の一部が前記保持板部材に接触する位置までの範囲であることを特徴とする研磨具。The polishing tool according to claim 4,
The rotation range of the movable substrate member with respect to the rotating substrate member, from a position where the polishing surface for fine polishing of the movable substrate member is substantially coplanar with the polishing surface for rough polishing of the rotating substrate member, A polishing tool, wherein a part of the movable substrate member is in a range up to a position where the movable substrate member contacts the holding plate member.

請求項４または請求項５に記載の研磨具において、
前記弾性部材は、前記複数の可動基板部材のそれぞれに対して少なくとも１つ設けられていることを特徴とする研磨具。The polishing tool according to claim 4 or claim 5,
A polishing tool, wherein at least one elastic member is provided for each of the plurality of movable substrate members.

請求項４〜請求項６のいずれか１項に記載の研磨具において、
前記各研磨面と前記弾性部材と前記保持板部材とを貫通して設けられた集塵通路を有し、この集塵通路は負圧を吸気源とする吸引装置に接続されることを特徴とする研磨具。The polishing tool according to any one of claims 4 to 6,
It has a dust collection passage provided through each of the polishing surface, the elastic member and the holding plate member, and the dust collection passage is connected to a suction device using a negative pressure as an intake source. Polishing tool.

請求項１〜請求項７のいずれか１項に記載の研磨具において、
前記粗研用研磨面は、前記回転基板部材に対して着脱自在の膜状の研磨部材からなり、前記精研用研磨面は、前記可動基板部材に対して着脱自在の膜状の研磨部材からなることを特徴とする研磨具。The polishing tool according to any one of claims 1 to 7,
The rough polishing surface is made of a film-like polishing member detachable from the rotating substrate member, and the fine polishing surface is made of a film-like polishing member detachable from the movable substrate member. A polishing tool characterized in that:

変形可能な環状部を具備する研磨具に使用する膜状の研磨部材において、一方の面に前記研磨具の変形可能な環状部への装着部を備え、他方の面に研磨面を備えて、前記研磨具における変形可能な環状部に対応してリング状に形成したことを特徴とする研磨部材。In a film-shaped polishing member used for a polishing tool having a deformable annular portion, a mounting portion for the deformable annular portion of the polishing tool is provided on one surface, and a polishing surface is provided on the other surface, A polishing member formed in a ring shape corresponding to a deformable annular portion of the polishing tool.