JP2003347848A - Surface mounted crystal oscillator - Google Patents
Surface mounted crystal oscillatorInfo
- Publication number
- JP2003347848A JP2003347848A JP2002150634A JP2002150634A JP2003347848A JP 2003347848 A JP2003347848 A JP 2003347848A JP 2002150634 A JP2002150634 A JP 2002150634A JP 2002150634 A JP2002150634 A JP 2002150634A JP 2003347848 A JP2003347848 A JP 2003347848A
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- terminal
- oscillator
- mounting
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は接合型とした表面実
装用の水晶発振器（以下、表面実装発振器とする）を産
業上の技術分野とし、特に接合強度を維持した表面実装
発振器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a junction type crystal oscillator for surface mounting (hereinafter referred to as a surface mounting oscillator) as an industrial technical field, and more particularly to a surface mounting oscillator which maintains a bonding strength.
【０００２】[0002]
【従来の技術】（発明の背景）表面実装発振器は小型・
軽量であることから、特に携帯機器例えば携帯電話に周
波数の基準源として採用される。このようなものの一つ
に、例えば水晶振動子１の底面にＩＣチップを収容した
実装基板２を接合したものがある。2. Description of the Related Art (Background of the Invention) Surface mount oscillators are
Because of its light weight, it is used as a frequency reference source especially in portable equipment such as mobile phones. One of such devices is, for example, a device in which a mounting substrate 2 containing an IC chip is bonded to the bottom surface of a crystal unit 1.
【０００３】（従来技術の一例）第２図は一従来例を説
明する接合型の表面実装発振器の図である。表面実装発
振器は水晶振動子１と実装基板２とからなる。水晶振動
子１は底面に水晶端子３を有する表面実装容器４内に水
晶片５を密閉封入してなる。水晶端子３は水晶片５の図
示しない励振電極と電気的に接続する。ここでは、底面
の４角部にアース端子を含めた水晶端子３を有する。表
面実装容器４は例えば積層セラミックからなり、例えば
シーム溶接によって金属カバー６を被せて密閉される。(Example of Prior Art) FIG. 2 is a diagram of a junction type surface mount oscillator for explaining a conventional example. The surface mount oscillator includes a crystal unit 1 and a mounting board 2. The crystal unit 1 has a crystal blank 5 hermetically sealed in a surface mount container 4 having a crystal terminal 3 on the bottom surface. The crystal terminal 3 is electrically connected to an excitation electrode (not shown) of the crystal blank 5. Here, a crystal terminal 3 including a ground terminal is provided at the four corners of the bottom surface. The surface mount container 4 is made of, for example, a laminated ceramic, and is sealed with a metal cover 6 by, for example, seam welding.
【０００４】実装基板２は同様に積層セラミックからな
り、凹所内にＩＣチップ７を収容する。ＩＣチップ７は
水晶振動子１とともに図示しない発振回路を構成する。
そして、底面にＩＣチップ７を接続した電源、アース及
び出力等の実装端子８を底面及び側面に有する。また、
開口面側である上面の４角部には水晶振動子１との水晶
接合端子９を有する。The mounting substrate 2 is also made of a laminated ceramic, and accommodates an IC chip 7 in a recess. The IC chip 7 forms an oscillation circuit (not shown) together with the crystal unit 1.
Further, mounting terminals 8 such as a power supply, a ground, an output, and the like having an IC chip 7 connected to the bottom surface are provided on the bottom surface and side surfaces. Also,
At the four corners of the upper surface, which is the opening surface side, there are crystal bonding terminals 9 for connecting to the crystal resonator 1.
【０００５】このようなものでは、水晶振動子１の底面
に実装基板２の上面を対向させて、水晶端子３と水晶接
合端子９とをクリーム半田１０で接合する。通常では、
接合強度を高めるために例えばシリコン系の接着剤11が
対向する２辺の中央部に塗布される。これにより、例え
ば表面実装発振器のセット基板に対する搭載時に、高熱
によってクリーム半田１０が溶融しても、水晶振動子１
と実装基板２との位置ズレや脱離を防止する。なお、位
置ズレ等を引き起こすと、水晶振動子１と実装基板２と
の間の浮遊容量が変化し、発振特性に影響を与える。In such a device, the crystal terminal 3 and the crystal bonding terminal 9 are bonded by cream solder 10 with the upper surface of the mounting substrate 2 facing the bottom surface of the crystal resonator 1. Usually,
In order to increase the bonding strength, for example, a silicon-based adhesive 11 is applied to the center of the two opposing sides. Thus, for example, when the cream solder 10 is melted by high heat when the surface mount oscillator is mounted on the set substrate,
And the mounting substrate 2 are prevented from being displaced or separated. When a displacement or the like is caused, the stray capacitance between the crystal unit 1 and the mounting substrate 2 changes, which affects oscillation characteristics.
【０００６】[0006]
【発明が解決しようとする課題】（従来技術の問題点）
しかしながら、上記構成の表面実装発振器では、近年の
小型化（例えば平面外形が4×2.5ｍｍ）及びクリーム半
田１０の溶融による位置ズレ等を防止するために接着剤
11を併用することに起因して次の問題があった。すなわ
ち、小型化の進行するほど、塗布できる接着剤11は微量
になる。このため、接着剤11の流動性によって高さが損
なわれ、水晶片５の底面に確実に接することを保証でき
なくなる。このため、接着剤11の粘度を高めればよい
が、この場合はディスペンサ等との関係から安定した塗
布が困難になる。[Problems to be Solved by the Invention]
However, in the surface-mounted oscillator having the above-described configuration, an adhesive is used in order to reduce the size in recent years (for example, the planar outer shape is 4 × 2.5 mm) and to prevent the displacement of the cream solder 10 due to melting.
There were the following problems due to the use of 11. That is, as the miniaturization progresses, the amount of the adhesive 11 that can be applied becomes smaller. For this reason, the height is impaired by the fluidity of the adhesive 11, and it cannot be ensured that the adhesive 11 comes into contact with the bottom surface of the crystal blank 5 reliably. Therefore, the viscosity of the adhesive 11 may be increased, but in this case, stable application becomes difficult due to the relationship with the dispenser or the like.
【０００７】（発明の目的）本発明は、接着剤による水
晶振動子と実装基板との接合を確実にした接合型の表面
実装発振器を提供することを目的とする。(Object of the Invention) An object of the present invention is to provide a bonding type surface mount oscillator in which bonding between a crystal unit and a mounting substrate by an adhesive is ensured.
【０００８】[0008]
【課題を解決するための手段】本発明では、上記の解決
課題に鑑み、例えばガラスコーティング等の底上材によ
って接着剤の高さを維持した。以下、本発明の一実施例
を説明する。In the present invention, in consideration of the above-mentioned problems, the height of the adhesive is maintained by a bottom material such as a glass coating. Hereinafter, an embodiment of the present invention will be described.
【０００９】[0009]
【実施例】第１図は本発明の一実施例を説明する表面実
装発振器の図である。なお、前従来例と同一部分には同
番号を付与してその説明は簡略又は省略する。表面実装
発振器は前述したように水晶振動子１の底面に実装基板
２の開口面側となる上面を接合してなる。この実施例で
は実装基板２の対向する２辺の上面に底上材としてのガ
ラスコーティングを設ける。そして、底上材上に接着剤
11を塗布して位置決めし、熱硬化によって実装基板２を
水晶振動子１の底面に接合する。その後、クリーム半田
１０を高熱炉で溶融して、水晶端子３と水晶接合端子９
とを接続する。FIG. 1 is a diagram of a surface mount oscillator illustrating an embodiment of the present invention. The same parts as those in the prior art are assigned the same reference numerals, and the description thereof will be simplified or omitted. As described above, the surface mount oscillator is formed by joining the bottom surface of the crystal unit 1 to the upper surface which is the opening side of the mounting substrate 2. In this embodiment, a glass coating is provided on the upper surface of two opposing sides of the mounting board 2 as a bottom material. And adhesive on the bottom material
11 is applied and positioned, and the mounting substrate 2 is joined to the bottom surface of the crystal unit 1 by thermosetting. Thereafter, the cream solder 10 is melted in a high-temperature furnace, and the crystal terminal 3 and the crystal bonding terminal 9 are melted.
And connect.
【００１０】このような構成であれば、接着剤11が微量
であっても、底上材によって高さが確保される。したが
って、実装基板２を水晶端子３の底面に確実に接合でき
る。With such a configuration, even if the amount of the adhesive 11 is very small, the height is ensured by the bottom material. Therefore, the mounting substrate 2 can be securely joined to the bottom surface of the crystal terminal 3.
【００１１】[0011]
【他の事項】上記実施例ではガラスコーティングによっ
て底上材を形成したが、これに限らず例えばメタライズ
層であっても突出部でもよく、要は底上材として機能す
ればよい。また、接着剤11の流出を防止するために底上
材の中央に例えば孔を設けたりしてもよく、これらも自
在に変更できる。また、接着剤11は実装基板２の上面に
設けたが、水晶振動子１の底面側に塗布したとしても同
様である。Others In the above embodiment, the bottom material is formed by glass coating. However, the present invention is not limited to this. For example, a metallized layer or a protruding portion may be used. Further, for example, a hole may be provided in the center of the upper member to prevent the adhesive 11 from flowing out, and these may be freely changed. Although the adhesive 11 is provided on the upper surface of the mounting substrate 2, the same applies even when applied on the bottom surface of the crystal unit 1.
【００１２】さらには、実装基板２の底面側を水晶振動
子１の底面側に接合した場合でも適用できる。但し、こ
の場合は開口部がなく平坦面で面積が充分なので、本実
施例の場合の方が有効である。Further, the present invention can be applied to a case where the bottom surface of the mounting substrate 2 is joined to the bottom surface of the crystal unit 1. However, in this case, since there is no opening and a flat surface has a sufficient area, the case of this embodiment is more effective.
【００１３】[0013]
【発明の効果】本発明は、例えばガラスコーティング等
の底上材によって接着剤の高さを維持したので、水晶振
動子と実装基板との接合を確実にした接合型の表面実装
発振器を提供できる。According to the present invention, since the height of the adhesive is maintained by a bottom material such as a glass coating, it is possible to provide a bonding type surface mount oscillator in which the bonding between the crystal unit and the mounting substrate is ensured. .
【図１】本発明の一実施例を説明する表面実装振動子の
一部破断の分解断面図である。FIG. 1 is an exploded cross-sectional view of a surface-mounted vibrator for explaining an embodiment of the present invention, which is partially broken.
【図２】従来例を説明する図で、同図（ａ）は表面実装
振動子の一部破断の分解断面図、同図（ｂ）は実装基板
の平面図である。FIGS. 2A and 2B are diagrams illustrating a conventional example, wherein FIG. 2A is an exploded cross-sectional view of a surface-mounted vibrator with a partial cutaway, and FIG. 2B is a plan view of a mounting board.
１ 水晶振動子、２ 実装基板、３ 水晶端子、４ 表
面実装容器、５ 水晶片、６ 金属カバー、７ ＩＣチ
ップ、８ 実装端子、９ 水晶接合端子、１０クリーム
半田、１１ 接着剤、１２ 底上材．Reference Signs List 1 crystal oscillator, 2 mounting substrate, 3 crystal terminal, 4 surface mounting container, 5 crystal chip, 6 metal cover, 7 IC chip, 8 mounting terminal, 9 crystal bonding terminal, 10 cream solder, 11 adhesive, 12 on bottom Material.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5J079 BA43 HA03 HA07 HA09 HA28 HA29 5J108 BB02 EE03 GG03 GG11 GG15 GG16 ────────────────────────────────────────────────── ─── Continuation of front page F term (reference) 5J079 BA43 HA03 HA07 HA09 HA28 HA29 5J108 BB02 EE03 GG03 GG11 GG15 GG16
Claims (2)
する水晶振動子と、前記水晶振動子とともに発振回路を
構成するＩＣチップを収容して底面に実装端子を上面に
前記水晶端子と接続する水晶接合端子を有する実装基板
とを備え、前記水晶端子と前記水晶接合端子とを半田に
よって接続するとともに前記水晶振動子と前記実装基板
とを接着剤によって接合してなる表面実装用の水晶発振
器において、前記接着剤の塗布される前記水晶振動子の
底面又は及び前記実装基板の上面に前記接着剤の底上材
を設けたことを特徴とする水晶発振器。A quartz resonator having a crystal terminal hermetically sealed with a quartz piece sealed therein, and an IC chip that forms an oscillation circuit together with the crystal oscillator is accommodated, and a mounting terminal is provided on the bottom surface and the crystal terminal is provided on the top surface. A mounting substrate having a crystal bonding terminal to be connected, a surface mounting crystal formed by connecting the crystal terminal and the crystal bonding terminal by soldering and bonding the crystal oscillator and the mounting substrate by an adhesive. In the oscillator, a top material of the adhesive is provided on a bottom surface of the crystal unit to which the adhesive is applied or on an upper surface of the mounting substrate.
求項１の水晶発振器。2. The crystal oscillator according to claim 1, wherein said bottom material is a glass coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002150634A JP4034593B2 (en) | 2002-05-24 | 2002-05-24 | Crystal oscillator for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002150634A JP4034593B2 (en) | 2002-05-24 | 2002-05-24 | Crystal oscillator for surface mounting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003347848A true JP2003347848A (en) | 2003-12-05 |
| JP4034593B2 JP4034593B2 (en) | 2008-01-16 |
Family
ID=29768448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002150634A Expired - Fee Related JP4034593B2 (en) | 2002-05-24 | 2002-05-24 | Crystal oscillator for surface mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4034593B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013034024A (en) * | 2012-11-13 | 2013-02-14 | Ngk Spark Plug Co Ltd | Package |
| WO2015045906A1 (en) * | 2013-09-24 | 2015-04-02 | 株式会社村田製作所 | Crystal oscillator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000353919A (en) * | 1999-06-10 | 2000-12-19 | Nippon Dempa Kogyo Co Ltd | Surface mounted crystal oscillator |
| JP2001007647A (en) * | 1999-06-25 | 2001-01-12 | Nippon Dempa Kogyo Co Ltd | Temperature compensation crystal oscillator of surface mounting type |
| JP2001177345A (en) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | Piezoelectric oscillator |
-
2002
- 2002-05-24 JP JP2002150634A patent/JP4034593B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000353919A (en) * | 1999-06-10 | 2000-12-19 | Nippon Dempa Kogyo Co Ltd | Surface mounted crystal oscillator |
| JP2001007647A (en) * | 1999-06-25 | 2001-01-12 | Nippon Dempa Kogyo Co Ltd | Temperature compensation crystal oscillator of surface mounting type |
| JP2001177345A (en) * | 1999-12-15 | 2001-06-29 | Murata Mfg Co Ltd | Piezoelectric oscillator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013034024A (en) * | 2012-11-13 | 2013-02-14 | Ngk Spark Plug Co Ltd | Package |
| WO2015045906A1 (en) * | 2013-09-24 | 2015-04-02 | 株式会社村田製作所 | Crystal oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4034593B2 (en) | 2008-01-16 |
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