JP2003342399A - Prepreg and laminated plate having inner layer circuit obtained by using this prepreg - Google Patents
Prepreg and laminated plate having inner layer circuit obtained by using this prepregInfo
- Publication number
- JP2003342399A JP2003342399A JP2002153531A JP2002153531A JP2003342399A JP 2003342399 A JP2003342399 A JP 2003342399A JP 2002153531 A JP2002153531 A JP 2002153531A JP 2002153531 A JP2002153531 A JP 2002153531A JP 2003342399 A JP2003342399 A JP 2003342399A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- copper foil
- epoxy resin
- resin composition
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ビルドアップ配線
板等の多層配線板の製造に使用されるプリプレグ及びこ
のプリプレグを用いてなる内層回路入り積層板に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg used for manufacturing a multilayer wiring board such as a build-up wiring board, and a laminated board with an inner layer circuit using the prepreg.
【０００２】[0002]
【従来の技術】近年では、電子機器用の回路基板とし
て、電子機器の高機能化、高密度化等の技術トレンドの
推移に伴い、多層配線板が多く利用されるようになって
いるが、これらの多層配線板の中でも、高密度な孔加
工、配線等が可能なビルドアップ配線板が年々増加傾向
にあり、特に、ビルドアップ層を形成する材料として、
パラ系アラミド繊維基材であるパラ系アラミド不織布を
用いたものが、その優れたレーザー加工性等の観点から
注目され、また、広範に使用されている。2. Description of the Related Art In recent years, multilayer circuit boards have come to be widely used as circuit boards for electronic devices, along with the transition of technological trends such as higher functionality and higher density of electronic devices. Among these multilayer wiring boards, the number of build-up wiring boards capable of high-density hole processing and wiring is increasing year by year, and in particular, as a material for forming the build-up layers,
The one using a para-aramid nonwoven fabric, which is a para-aramid fiber base material, has attracted attention from the viewpoint of its excellent laser processability and has been widely used.
【０００３】その一方で、有機繊維不織布を用いたプリ
プレグにおいては、加熱加圧成型後の絶縁層強度が織布
（例えば、ガラス布等）を用いた場合と比較して劣る傾
向が否めず、これに関しては、上記パラ系アラミド不織
布においても、例外ではなく、かかる絶縁層強度の弱さ
が、外層銅箔のピール強度（銅箔密着強度）の弱さにも
反映され、衝撃時、或いは熱衝撃時に、銅ランド剥がれ
による部品外れが発生しやすい等の実装信頼性上の問題
を引き起こし、ひいては、ランド、パターン等の更なる
ファイン化の阻害要因となっていた。On the other hand, in the prepreg using the organic fiber non-woven fabric, the strength of the insulating layer after heat and pressure molding tends to be inferior to the case of using a woven fabric (for example, glass fabric). In this regard, even in the above para-aramid nonwoven fabric, the weakness of the insulating layer strength is reflected in the weakness of the peel strength (copper foil adhesion strength) of the outer layer copper foil, and it is not affected by the impact or heat. At the time of impact, there was a problem in mounting reliability such as the possibility of component detachment due to peeling of copper lands, which in turn impeded further refinement of lands and patterns.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記事由に
鑑みてなされたもので、その目的とするところは、部品
実装の信頼性を更に向上せしめる観点から、パラ系アラ
ミド不織布を基材とする絶縁層における銅箔密着強度を
高め、部品実装信頼性の更なる向上に寄与し得るプリプ
レグ及びこれを用いてなる内層回路入り積層板を提供す
ることにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to use a para-aramid nonwoven fabric as a base material from the viewpoint of further improving the reliability of component mounting. Another object of the present invention is to provide a prepreg capable of increasing the adhesion strength of a copper foil in an insulating layer and contributing to further improvement of component mounting reliability, and a laminated board with an inner layer circuit using the prepreg.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に、請求項１に係る発明のプリプレグにあっては、パラ
系アラミド繊維を用いてなるアラミド不織布を基材と
し、これにエポキシ樹脂、硬化剤、硬化促進剤を含有す
るエポキシ樹脂組成物を含んでなるエポキシ樹脂組成物
ワニスを含浸、半硬化せしめたプリプレグであって、前
記アラミド不織布の空隙率が、３０〜５５％であること
を特徴とするものである。なお、ここでいうエポキシ樹
脂組成物とは、エポキシ樹脂、硬化剤、硬化促進剤を含
んでなり、硬化後に絶縁層を形成する未硬化の混合物
（溶媒を除く）をいう。また、エポキシ樹脂組成物ワニ
スとは、上記エポキシ樹脂組成物を溶媒で希釈した流動
性を有する混合物をいう。更に、ここでいう溶媒とは、
メチルエチルケトンその他の、通常、積層板用樹脂の希
釈に使用される溶媒をいう。また、ここでいう空隙率と
は、アラミド不織布の見掛密度とアラミド不織布の真密
度の比より算出した空隙率（％）をいう。In order to solve the above problems, in the prepreg of the invention according to claim 1, an aramid nonwoven fabric made of para aramid fiber is used as a base material, and an epoxy resin, A prepreg obtained by impregnating and semi-curing an epoxy resin composition varnish containing an epoxy resin composition containing a curing agent and a curing accelerator, wherein the aramid nonwoven fabric has a porosity of 30 to 55%. It is a feature. The epoxy resin composition as used herein refers to an uncured mixture (excluding solvent) that contains an epoxy resin, a curing agent, and a curing accelerator, and forms an insulating layer after curing. The epoxy resin composition varnish refers to a fluid mixture obtained by diluting the epoxy resin composition with a solvent. Furthermore, the solvent here means
Methyl ethyl ketone and other solvents that are usually used for diluting resin for laminates. The porosity referred to here is the porosity (%) calculated from the ratio of the apparent density of the aramid nonwoven fabric and the true density of the aramid nonwoven fabric.
【０００６】請求項２に係る発明のプリプレグにあって
は、請求項１記載のプリプレグにおいて、前記パラ系ア
ラミド繊維が、ポリ（パラ-フェニレンテレフタラミ
ド）或いはポリ（パラ-フェニレン／３,４’-ジフェニ
ルエーテルテレフタラミド）の繊維のいずれかまたは両
者の混合物であることを特徴とするものである。In the prepreg of the invention according to claim 2, in the prepreg according to claim 1, the para-aramid fiber is poly (para-phenylene terephthalamide) or poly (para-phenylene / 3,4). '-Diphenyl ether terephthalamide) fiber or a mixture of both.
【０００７】請求項３に係る発明のプリプレグにあって
は、請求項１または請求項２記載のプリプレグにおい
て、前記プリプレグ総質量に占める前記エポキシ樹脂組
成物の含有率が、５５〜５８質量％であることを特徴と
するものである。なお、ここでいうプリプレグ総質量に
占めるエポキシ樹脂組成物の含有率とは、プリプレグ総
質量[単位面積当り]とエポキシ樹脂組成物の質量[単位
面積当り]（前記プリプレグ総質量[単位面積当り]と基
材質量[単位面積当り]とから算出される。）とから算出
した含有率（質量％）をいう。In the prepreg of the invention according to claim 3, in the prepreg according to claim 1 or 2, the content of the epoxy resin composition in the total mass of the prepreg is 55 to 58% by mass. It is characterized by being. The content of the epoxy resin composition in the total mass of the prepreg here means the total mass of the prepreg [per unit area] and the mass of the epoxy resin composition [per unit area] (the total mass of the prepreg [per unit area]). And the mass of the base material [per unit area].).
【０００８】請求項４に係る発明のプリプレグにあって
は、請求項１乃至請求項３のいずれかに記載のプリプレ
グにおいて、前記硬化剤が、フェノールノボラック系樹
脂であることを特徴とするものである。The prepreg of the invention according to claim 4 is characterized in that, in the prepreg according to any one of claims 1 to 3, the curing agent is a phenol novolac resin. is there.
【０００９】請求項５に係る発明の内層回路入り積層板
にあっては、請求項１乃至請求項４のいずれかに記載の
プリプレグと、銅箔と、内層回路形成面を備える内層材
とを、前記内層回路形成面が前記プリプレグに接と接し
ていて、且つ、前記銅箔と、前記内層材とで、前記プリ
プレグを挟むように、積層、一体化してなることを特徴
とするものである。According to a fifth aspect of the present invention, there is provided an inner layer circuit-containing laminated board comprising the prepreg according to any one of the first to fourth aspects, a copper foil, and an inner layer material having an inner layer circuit forming surface. The inner layer circuit forming surface is in contact with the prepreg, and the copper foil and the inner layer material are laminated and integrated so as to sandwich the prepreg. .
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施形態を説明す
る。なお、本発明のプリプレグ及びこのプリプレグを用
いてなる内層回路入り積層板等は、下記の実施形態にの
み限定されるものではなく、本発明の要旨を逸脱しない
範囲内において種々変更を加え得ることは勿論である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. In addition, the prepreg of the present invention and the laminated board with an inner layer circuit including the prepreg are not limited to the following embodiments, and various modifications may be made without departing from the scope of the present invention. Of course.
【００１１】即ち、本発明のプリプレグにあっては、パ
ラ系アラミド繊維を用いてなるアラミド不織布を基材と
し、これにエポキシ樹脂、硬化剤、硬化促進剤を含有す
るエポキシ樹脂組成物を含んでなるエポキシ樹脂組成物
ワニスを含浸、半硬化せしめたプリプレグであって、前
記アラミド不織布の空隙率が、３０〜５５％であること
を特徴とするものである。かかるパラ系アラミド繊維と
して、ポリ（パラ-フェニレンテレフタラミド[ＰＰＴ
Ａ]）或いはポリ（パラ-フェニレン／３,４’-ジフェニ
ルエーテルテレフタラミド [ＰＰＯＤＴＡ]）の繊維の
いずれかまたは両者の混合物等を例示することができ
る。この場合において、上記基材が上記パラ系アラミド
繊維を８５〜１００質量％含有するアラミド不織布を好
適に使用することができる。That is, in the prepreg of the present invention, an aramid non-woven fabric made of para-aramid fiber is used as a base material, and an epoxy resin composition containing an epoxy resin, a curing agent and a curing accelerator is contained therein. A prepreg impregnated with a varnish of an epoxy resin composition and semi-cured, wherein the aramid nonwoven fabric has a porosity of 30 to 55%. As such a para-aramid fiber, poly (para-phenylene terephthalamide [PPT
A]) or poly (para-phenylene / 3,4'-diphenyl ether terephthalamide [PPODTA]) fibers, or a mixture of both. In this case, an aramid nonwoven fabric containing 85 to 100% by mass of the para-aramid fiber as the base material can be preferably used.
【００１２】即ち、上記した様に、従来のパラ系アラミ
ド繊維不織布を用いたプリプレグにおいては、加熱加圧
成型後の絶縁層強度がガラスクロス等を用いた場合と比
較して劣る傾向が否めず、かかる絶縁層強度の弱さが、
外層銅箔のピール強度（銅箔密着強度）の弱さにも反映
され、衝撃時、或いは熱衝撃時に、銅ランド剥がれによ
る部品外れが発生しやすい等の実装信頼性上の問題を引
き起こし、ひいては、ランド、パターン等の更なるファ
イン化の阻害要因となっていた。That is, as described above, in the prepreg using the conventional para-aramid fiber nonwoven fabric, the strength of the insulating layer after hot press molding tends to be inferior to the case of using glass cloth or the like. , The weakness of the insulation layer
It is also reflected in the weak peel strength (copper foil adhesion strength) of the outer layer copper foil, causing mounting reliability problems such as component detachment due to copper land peeling during impact or thermal shock, and eventually However, it has been an obstacle to further refinement of land, patterns and the like.
【００１３】このため、当初、本願出願人は、かかるパ
ラ系アラミド繊維不織布を用いたプリプレグ外層銅箔の
銅箔密着強度の強化を図るべく、基材であるパラ系アラ
ミド繊維不織布内部にエポキシ樹脂組成物を充分多量に
浸透せしめ、このパラ系アラミド繊維不織布内部に浸透
せしめたエポキシ樹脂組成物硬化物のパラ系アラミド繊
維不織布に対するアンカー効果により、外層銅箔の銅箔
密着強度の強化が実現できるものと考え、アラミド不織
布の空隙率に着目し、このアラミド不織布の空隙率の高
いものを使用すれば、より多量のエポキシ樹脂組成物を
アラミド不織布の空隙部に浸透でき、上記パラ系アラミ
ド繊維不織布に対するアンカー効果が増大し、結果とし
て外層銅箔の銅箔密着強度の強化に繋がるものと考え
た。そこで、かかる仮説に基づき、検討を行なったが、
予期した結果は得られなかった（例えば、後述の比較例
１、３、４）。[0013] Therefore, initially, in order to enhance the copper foil adhesion strength of the prepreg outer layer copper foil using such a para-aramid fiber non-woven fabric, the applicant of the present invention has an epoxy resin inside the para-aramid fiber non-woven fabric as a base material. A sufficiently large amount of the composition is permeated, and the epoxy resin composition cured product permeated into the para-aramid fiber nonwoven fabric is anchored to the para-aramid fiber nonwoven fabric by the anchoring effect, whereby the copper foil adhesion strength of the outer copper foil can be enhanced. Considering that, by paying attention to the porosity of the aramid non-woven fabric, if a high porosity of this aramid non-woven fabric is used, a larger amount of the epoxy resin composition can penetrate into the voids of the aramid non-woven fabric, and the para-aramid fiber non-woven fabric described above. It is thought that the anchor effect on the copper foil is increased, and as a result, the copper foil adhesion strength of the outer layer copper foil is strengthened. Therefore, based on this hypothesis, we conducted an examination.
The expected result was not obtained (for example, Comparative Examples 1, 3, and 4 described below).
【００１４】そこで、かかる外層銅箔の銅箔密着強度を
支配する因子としては、パラ系アラミド繊維不織布内部
に浸透せしめたエポキシ樹脂組成物硬化物のパラ系アラ
ミド繊維不織布に対するアンカー効果の寄与もさること
ながら、銅箔接着面近傍に存在する樹脂組成物の銅箔接
着面に対するアンカー効果の寄与も無視できないものと
考えるに至り、結局、銅箔接着面近傍に存在するエポキ
シ樹脂組成物の量と基材中に浸透したエポキシ樹脂組成
物の量のバランスの重要性に思い至った。即ち、このア
ラミド不織布の空隙率が高すぎると、投入した殆どのエ
ポキシ樹脂組成物が、アラミド不織布の空隙部に収容さ
れ、エポキシ樹脂組成物硬化物のパラ系アラミド繊維不
織布に対するアンカー効果は増大する一方、銅箔接着面
近傍に存在するエポキシ樹脂組成物の量が不足し、銅箔
接着面近傍に存在するエポキシ樹脂組成物硬化物の銅箔
接着面に対するアンカー効果の寄与が小さく、結果とし
て、銅箔密着強度（銅箔ピール強度）の向上に繋がらな
いと考えられたからである。Therefore, as a factor controlling the copper foil adhesion strength of the outer layer copper foil, the contribution of the anchor effect of the cured epoxy resin composition impregnated into the para-aramid fiber nonwoven fabric to the para-aramid fiber nonwoven fabric is also taken into consideration. However, it came to be considered that the contribution of the anchor effect to the copper foil bonding surface of the resin composition existing in the vicinity of the copper foil bonding surface cannot be ignored, and eventually, the amount of the epoxy resin composition existing in the vicinity of the copper foil bonding surface and The importance of the balance of the amount of the epoxy resin composition that has penetrated into the substrate has come to mind. That is, if the porosity of this aramid nonwoven fabric is too high, most of the added epoxy resin composition is accommodated in the voids of the aramid nonwoven fabric, and the anchor effect of the cured epoxy resin composition on the para-aramid fiber nonwoven fabric is increased. On the other hand, the amount of the epoxy resin composition present near the copper foil bonding surface is insufficient, the contribution of the anchor effect to the copper foil bonding surface of the epoxy resin composition cured product present near the copper foil bonding surface is small, and as a result, This is because it was considered that this would not lead to an improvement in copper foil adhesion strength (copper foil peel strength).
【００１５】これに対して、エポキシ樹脂組成物硬化物
のパラ系アラミド繊維不織布に対するアンカー効果と銅
箔接着面近傍に存在するエポキシ樹脂組成物硬化物の銅
箔接着面に対するアンカー効果の銅箔密着強度に対する
寄与のバランスが、銅箔接着面近傍に存在するエポキシ
樹脂組成物の量と基材中に浸透したエポキシ樹脂組成物
の量のバランスに依存するものと仮定すると、これを規
定すると考えられるアラミド不織布の空隙率を最適化す
ることにより、パラ系アラミド繊維不織布を用いたプリ
プレグに直接積層した外層銅箔の銅箔密着強度を極大化
できるものと考えられる。本発明は、かかる観点よりな
されたものであって、鋭意、検討の結果、本発明を完成
するに至ったものである。On the other hand, the anchor effect of the cured epoxy resin composition to the para-aramid fiber nonwoven fabric and the anchor effect of the cured epoxy resin composition existing near the copper foil bonding surface to the copper foil bonding surface are adhered to the copper foil. Assuming that the balance of the contribution to the strength depends on the balance between the amount of the epoxy resin composition existing in the vicinity of the copper foil bonding surface and the amount of the epoxy resin composition that has penetrated into the substrate, it is considered to define this. It is considered that by optimizing the porosity of the aramid nonwoven fabric, the copper foil adhesion strength of the outer copper foil directly laminated on the prepreg using the para-aramid fiber nonwoven fabric can be maximized. The present invention has been made from such a viewpoint, and as a result of earnest studies and studies, the present invention has been completed.
【００１６】即ち、本発明のプリプレグの典型的な実施
形態としては、パラ系アラミド繊維を用いてなるアラミ
ド不織布を基材とし、これにエポキシ樹脂、硬化剤、硬
化促進剤を含有するエポキシ樹脂組成物を含んでなるエ
ポキシ樹脂組成物ワニスを含浸、半硬化せしめたプリプ
レグであって、前記アラミド不織布の空隙率が、３０〜
５５％であるものが、例示可能であり、これと、銅箔
と、内層回路形成面を備える内層材とを、前記内層回路
形成面が前記プリプレグに接するように、前記銅箔と、
前記内層材とで、前記プリプレグを挟むように、積層、
一体化して内層回路入り積層板とすることができる。That is, as a typical embodiment of the prepreg of the present invention, an epoxy resin composition containing an aramid non-woven fabric made of para-aramid fiber as a base material and containing an epoxy resin, a curing agent and a curing accelerator therein. It is a prepreg which is impregnated with an epoxy resin composition varnish containing a material and is semi-cured, wherein the aramid nonwoven fabric has a porosity of 30 to
It is possible to exemplify 55%, copper foil, and an inner layer material having an inner layer circuit forming surface such that the inner layer circuit forming surface is in contact with the prepreg, and the copper foil,
The inner layer material is laminated so as to sandwich the prepreg,
It can be integrated into a laminated board with an internal circuit.
【００１７】そして、かかるパラ系アラミド繊維基材内
層回路入り積層板においては、パラ系アラミド繊維を用
いてなるアラミド不織布を基材とし、これにエポキシ樹
脂組成物ワニスを含浸、半硬化せしめ、且つ、前記アラ
ミド不織布の空隙率が、３０〜５５％であるものを外層
銅箔と直接積層するプリプレグとして使用しているた
め、銅箔接着面近傍に存在するエポキシ樹脂組成物の量
と基材中に浸透したエポキシ樹脂組成物の量のバランス
が良好となり、パラ系アラミド不織布を基材とするプリ
プレグに直接積層した外層銅箔においても充分な銅箔密
着強度を安定的に確保でき、結果として、部品実装信頼
性の向上に寄与できるというものである。Further, in such a laminated board with a para-aramid fiber base material inner layer circuit, an aramid nonwoven fabric made of para-aramid fiber is used as a base material, which is impregnated with a varnish of an epoxy resin composition and semi-cured, and Since the aramid nonwoven fabric having a porosity of 30 to 55% is used as a prepreg for directly laminating with an outer layer copper foil, the amount of the epoxy resin composition present in the vicinity of the copper foil bonding surface and the base material A good balance of the amount of the epoxy resin composition that has penetrated into the, it is possible to stably ensure sufficient copper foil adhesion strength even in the outer layer copper foil directly laminated to the prepreg based on a para-aramid nonwoven fabric, and as a result, It is possible to contribute to the improvement of component mounting reliability.
【００１８】この場合において、前記プリプレグ総質量
に占める前記エポキシ樹脂組成物の好適な含有率として
は、５５〜５８質量％が適当である。即ち、このように
材料構成を設計することにより、銅箔接着面近傍に存在
するエポキシ樹脂組成物の量が充分であり、充分な銅箔
密着強度を安定的に確保できる一方、プリプレグの絶縁
層の熱膨張係数低減が実現でき、シリコンチップの熱膨
張係数との差異も低減され、結果として、部品実装信頼
性の更なる向上にも寄与できるというものである。な
お、上記の各種含有率の算出に用いたエポキシ樹脂組成
物の質量は、これらのエポキシ樹脂組成物の硬化反応
が、揮発成分の放出等を伴うものでないと考えられるの
で、硬化前、半硬化状態、硬化後（即ち、絶縁体を形成
した後）の硬化反応の各ステージで実質的には、殆ど変
化しないものと考えられる。In this case, a suitable content of the epoxy resin composition in the total mass of the prepreg is 55 to 58 mass%. That is, by designing the material composition in this way, the amount of the epoxy resin composition existing in the vicinity of the copper foil bonding surface is sufficient, and sufficient copper foil adhesion strength can be stably ensured, while the insulating layer of the prepreg is formed. The thermal expansion coefficient can be reduced, the difference from the thermal expansion coefficient of the silicon chip can be reduced, and as a result, the component mounting reliability can be further improved. The mass of the epoxy resin composition used for the calculation of the above various contents is considered to be such that the curing reaction of these epoxy resin compositions does not involve the release of volatile components, etc. It is considered that the state and the curing reaction after curing (that is, after forming the insulator) do not substantially change at each stage of the curing reaction.
【００１９】[0019]
【実施例】以下、本発明を実施例によって具体的に説明
する。なお、以下の表１、及び表２に示す実施例１〜１
１、比較例１〜４におけるプリプレグ、及びこれらを評
価するために、これらのプリプレグと、内層回路形成面
を備える内層材とを、積層して作製する内層回路入り積
層板等の評価用試料は、下記のように作製した。また、
プリプレグ作成に用いたアラミド不織布は、パラ系アラ
ミド繊維とバインダー成分を公知の湿式抄造方法にて所
望の坪量（ｇ/ｍ2）に抄紙し、その後の加熱加圧加工
（カレンダー加工）により、所定の厚み（密度）に仕上
げる公知の方法により作製したものを使用した。なお、
上記バインダー成分としては、大日本インキ化学工業
[株]製 ＥＮ−０２７０（水分散性エポキシ樹脂）、或
いは、デュポン[株]製のｍ−アラミドを使用した。ま
た、本実施例においては、パラ系アラミド繊維不織布と
してデュポン[株]製 Ｋ−４９（ＰＰＴＡ）を使用し
た。また、基材であるアラミド不織布の空隙率は、〔１
００−[１００×（見掛密度）／（真密度）] 〕の計算
式にしたがって算出した。この場合のアラミド不織布の
見掛密度は、ＪＩＳ−Ｐ８１１８の紙厚計を用いてＪＩ
Ｓ−Ｐ８１１８に準拠して基材厚みを計測し、これと既
知の坪量値に基づいて見掛密度を算出した。一方、基材
であるアラミド不織布の真密度については、基材を水中
に浸漬し、水中重量を測定、大気中での重量値と併せて
アルキメデス法で算出した。EXAMPLES The present invention will be specifically described below with reference to examples. In addition, Examples 1 to 1 shown in Table 1 and Table 2 below.
1, prepregs in Comparative Examples 1 to 4, and in order to evaluate these, prepregs and an inner layer material having an inner layer circuit forming surface are laminated to produce inner layer circuit-containing laminates and other evaluation samples. Was prepared as follows. Also,
The aramid non-woven fabric used for preparing the prepreg is made by forming the para-aramid fiber and the binder component into a desired basis weight (g / m 2 ) by a known wet papermaking method, and then applying heat and pressure (calendering), What was produced by the well-known method of finishing to a predetermined thickness (density) was used. In addition,
As the binder component, Dainippon Ink and Chemicals
EN-0270 (water-dispersible epoxy resin) manufactured by Co., Ltd. or m-aramid manufactured by DuPont Co., Ltd. was used. In addition, in this example, K-49 (PPTA) manufactured by DuPont Co., Ltd. was used as the para-aramid fiber nonwoven fabric. In addition, the porosity of the aramid nonwoven fabric as the base material is [1
00- [100 × (apparent density) / (true density)]]. The apparent density of the aramid non-woven fabric in this case was measured by using JIS-P8118 paper thickness gauge.
The substrate thickness was measured according to S-P8118, and the apparent density was calculated based on this and the known basis weight value. On the other hand, the true density of the aramid nonwoven fabric as the base material was calculated by the Archimedes method by immersing the base material in water, measuring the weight in water, and combining it with the weight value in the atmosphere.
【００２０】＜エポキシ樹脂組成物ワニスの調製＞
［エポキシ樹脂組成物ワニス（Ａ）の調製］エポキシ樹
脂として、ＶＧ３１０１[メチルエチルケトン（以下、
「ＭＥＫ」という。）含有比率２０％]（三井化学[株]
製）を、１０．９質量部、臭素化エポキシ樹脂として、
商品名：「Ｅｐｉｃｌｏｎ１５３」[ＭＥＫ含有比率４
０％]（大日本インキ[株]製）を１８．５質量部、商品
名：「Ｅｐｉｃｌｏｎ１１２１Ｎ」[ＭＥＫ含有比率２
０％] （大日本インキ[株]製）を３１．２質量部、硬化
剤[フェノールノボラック系]として、商品名：「フェノ
ライトＴＤ−２０９３」[ＭＥＫ含有比率４０％] （大
日本インキ[株]製）を２１．０質量部、硬化促進剤とし
て２Ｅ４ＭＺ[２−エチル−４−メチルイミダゾール]
（四国化成[株]製）を０．０４質量部、溶剤としてＭＥ
Ｋを２０質量部配合して、エポキシ樹脂組成物ワニス
（Ａ）を調製した。<Preparation of Epoxy Resin Composition Varnish> [Preparation of Epoxy Resin Composition Varnish (A)] As an epoxy resin, VG3101 [methyl ethyl ketone (hereinafter,
It is called "MEK". ) Content 20%] (Mitsui Chemicals Co., Ltd.
10.9 parts by mass as a brominated epoxy resin,
Product name: "Epiclon 153" [MEK content ratio 4
0%] (manufactured by Dainippon Ink & Co., Inc.), 18.5 parts by mass, trade name: “Epiclon 1121N” [MEK content ratio 2
0%] (Dainippon Ink Co., Ltd.) as 31.2 parts by mass and a curing agent [phenol novolac type] under the trade name: "Phenolite TD-2093" [MEK content ratio 40%] (Dainippon Ink Co., Ltd.) 21.0 parts by mass, 2E4MZ [2-ethyl-4-methylimidazole] as a curing accelerator.
(Shikoku Kasei Co., Ltd.) 0.04 parts by mass, ME as a solvent
20 parts by mass of K was blended to prepare an epoxy resin composition varnish (A).
【００２１】［エポキシ樹脂組成物ワニス（Ｂ）の調
製］エポキシ樹脂として、ＶＧ３１０１[ＭＥＫ含有比
率２０％]（三井化学[株]製）を、１０．９質量部、臭
素化エポキシ樹脂として、商品名：「Ｅｐｉｃｌｏｎ１
５３」[ＭＥＫ含有比率４０％]（大日本インキ[株]製）
を１８．５質量部、商品名：「Ｅｐｉｃｌｏｎ１１２１
Ｎ」[ＭＥＫ含有比率２０％] （大日本インキ[株]製）
を３１．２質量部、硬化剤[フェノールノボラック系]と
して、商品名：「エピキュアＹＬＨ１２９Ｂ６５」[Ｍ
ＥＫ含有比率３５％] （[ビスフェノールＡノボラック
系]ジャパンエポキシレジン[株]製）を２２．０質量
部、硬化促進剤として２Ｅ４ＭＺ[２−エチル−４−メ
チルイミダゾール]（四国化成[株]製）を０．０４質量
部、溶剤としてＭＥＫを２０質量部配合して、エポキシ
樹脂組成物ワニス（Ｂ）を調製した。[Preparation of epoxy resin composition varnish (B)] As an epoxy resin, 10.9 parts by mass of VG3101 [MEK content ratio 20%] (manufactured by Mitsui Chemicals, Inc.) was used as a brominated epoxy resin Name: "Epiclon1
53 "[MEK content ratio 40%] (manufactured by Dainippon Ink and Chemicals, Inc.)
18.5 parts by mass, trade name: "Epiclon 1121
N "[MEK content ratio 20%] (manufactured by Dainippon Ink and Chemicals, Inc.)
31.2 parts by mass as a curing agent [phenol novolac-based], trade name: "Epicure YLH129B65" [M
EK content ratio 35%] ([bisphenol A novolac type] Japan Epoxy Resin [manufactured by Japan]] 22.0 parts by mass, 2E4MZ [2-ethyl-4-methylimidazole] (manufactured by Shikoku Chemicals Co., Ltd.) as a curing accelerator. ) Was mixed with 20 parts by mass of MEK as a solvent to prepare an epoxy resin composition varnish (B).
【００２２】［エポキシ樹脂組成物ワニス（Ｃ）の調
製］エポキシ樹脂として、ＶＧ３１０１[ＭＥＫ含有比
率２０％]（三井化学[株]製）を、１０．９質量部、臭
素化エポキシ樹脂として、商品名：「Ｅｐｉｃｌｏｎ１
５３」[ＭＥＫ含有比率４０％]（大日本インキ[株]製）
を１５．１質量部、商品名：「Ｅｐｉｃｌｏｎ１１２１
Ｎ」[ＭＥＫ含有比率２０％] （大日本インキ[株]製）
を２９．９質量部、硬化剤[非ノボラック系]として、ジ
シアンジアミド（日本カーバイド[株]製）を３．３質量
部、硬化促進剤として２Ｅ４ＭＺ[２−エチル−４−メ
チルイミダゾール]（四国化成[株]製）を０．０６質量
部、溶剤としてＭＥＫを２０質量部配合して、エポキシ
樹脂組成物ワニス（Ｃ）を調製した。[Preparation of Epoxy Resin Composition Varnish (C)] As an epoxy resin, 10.9 parts by mass of VG3101 [MEK content ratio 20%] (manufactured by Mitsui Chemicals, Inc.) was used as a brominated epoxy resin. Name: "Epiclon1
53 "[MEK content ratio 40%] (manufactured by Dainippon Ink and Chemicals, Inc.)
15.1 parts by mass, trade name: "Epiclon 1121
N "[MEK content ratio 20%] (manufactured by Dainippon Ink and Chemicals, Inc.)
29.9 parts by mass, curing agent [non-novolak-based] 3.3 parts by mass of dicyandiamide (manufactured by Nippon Carbide Co., Ltd.), and 2E4MZ [2-ethyl-4-methylimidazole] (Shikoku Kasei) as a curing accelerator. (Manufactured by Co., Ltd.) and 20 parts by mass of MEK as a solvent were mixed to prepare an epoxy resin composition varnish (C).
【００２３】＜プリプレグの作製＞上記のアラミド不織
布基材（パラ系アラミド繊維含有率：９４質量％）を上
記エポキシ樹脂組成物ワニスに含浸させ、乾燥ゾーンで
１６０℃、５〜７分間の加熱処理を行い、溶媒を揮発さ
せると共に、含浸した樹脂組成物を半硬化することによ
り作製した。樹脂組成物の含有量調整は、トリーターの
ギャップ調整により行った。なお、作製したプリプレグ
の「樹脂流れ」の評価は、ＩＰＣ規格（ＩＰＣ−ＴＭ−
６５０ ２．３．１７）により行なった。<Preparation of prepreg> The epoxy resin composition varnish is impregnated with the above-mentioned aramid non-woven fabric substrate (para-aramid fiber content: 94% by mass) and heat-treated at 160 ° C. for 5 to 7 minutes in a drying zone. Then, the solvent was volatilized, and the impregnated resin composition was semi-cured. The content of the resin composition was adjusted by adjusting the gap of the treater. The evaluation of the "resin flow" of the prepared prepreg was conducted according to the IPC standard (IPC-TM-
650 2.3.17).
【００２４】＜評価用試料の作製＞
内層回路入り多層銅張り積層板 ＦＲ−４グレードの
内層材[厚み：０．８ｍｍ、銅箔（１８μｍ片粗化箔）
の表面に残銅率５０％の成型性評価用パターンを形成
し、さらにその表面に黒化処理層を形成した内層回路形
成面を備えるもの]の表裏に各１枚の上記プリプレグ、
もしくは上記樹脂付き銅箔を配置して１７０℃、４０
分、３０ｋｇ／ｃｍ2での加熱加圧成型により作製し
た。<Preparation of Evaluation Sample> Multilayer Copper Clad Laminate with Inner Layer Circuit FR-4 grade inner layer material [thickness: 0.8 mm, copper foil (18 μm piece roughened foil)]
Which has an inner layer circuit forming surface on which a pattern for moldability evaluation with a residual copper rate of 50% is formed on the surface of the above, and a blackening treatment layer is further formed on the surface thereof]
Alternatively, the resin-coated copper foil is placed at 170 ° C. and 40
Min, 30 kg / cm 2 by heat and pressure molding.
【００２５】ＴＭＡ測定用試料 上記プリプレグを
１枚、上記条件（１７０℃、４０分、３０ｋｇ／ｃ
ｍ2）で両面に、銅箔（ＧＴＳ：厚み １８μｍ）を配
置して加熱加圧成型した。この後、表面の銅箔をエッチ
ング除去し、３ｍｍ×４０ｍｍのＴＭＡ測定用試料を作
製した。即ち、内層回路入り多層銅張り積層板では表層
のみの熱膨張係数が測定できないため、プリプレグ１枚
のみの成型品を別途作製し、ＴＭＡでを評価することと
したものである。Sample for TMA measurement One piece of the above prepreg under the above conditions (170 ° C., 40 minutes, 30 kg / c
m 2 ), copper foil (GTS: thickness 18 μm) was placed on both sides, and heat press molding was performed. Then, the copper foil on the surface was removed by etching to prepare a 3 mm × 40 mm TMA measurement sample. That is, since the coefficient of thermal expansion of only the surface layer cannot be measured in a multilayer copper clad laminate with an inner layer circuit, a molded product having only one prepreg is separately prepared and evaluated by TMA.
【００２６】上記のように作製した評価用試料の評価は
具体的には、以下のように行なった。これらの評価結果
についても併せて、表１、及び表２に示す。Specifically, the evaluation samples prepared as described above were evaluated as follows. The results of these evaluations are also shown in Tables 1 and 2.
【００２７】＜評価＞
銅箔ピール強度（銅箔密着強度） 上記内層回路入り
多層銅張り積層板の表層の銅箔をＪＩＳ−Ｃ６４８１に
準拠して測定した。<Evaluation> Copper Foil Peel Strength (Copper Foil Adhesion Strength) The copper foil on the surface layer of the multilayer copper clad laminate containing the inner layer circuit was measured according to JIS-C6481.
【００２８】吸湿ハンダ耐熱性 上記内層回路入り多
層銅張り積層板の表層の銅箔をエッチングにより除去
し、５ｃｍ×５ｃｍの試験片として吸湿処理（沸騰水
[１００℃]浸漬）後のハンダ耐熱性（２８８℃）を評価
した。Moisture absorption solder heat resistance The copper foil on the surface layer of the multilayer copper clad laminate containing the inner layer circuit is removed by etching, and a moisture absorption treatment (boiling water) is performed as a 5 cm x 5 cm test piece.
The solder heat resistance (288 ° C.) after [100 ° C. immersion] was evaluated.
【００２９】i） Ｄ-２/１００：上記試験片（６個）を
吸湿処理（沸騰水[１００℃]浸漬２時間）した後、２８
８℃のハンダ中に２０秒間浸漬し、その後のフクレ発生
の有無を目視にて確認し、１箇所でもフクレ発生の認め
られた試験片を不合格品、まったく、フクレ発生の認め
られない試験片のみを合格品として判定した。I) D-2 / 100: The above test pieces (6 pieces) were subjected to moisture absorption treatment (immersion in boiling water [100 ° C.] for 2 hours), and then 28
Immerse in solder at 8 ° C for 20 seconds, and visually check for swelling after that, and reject a test piece in which blistering was found even in one place, or a test piece in which no blistering was found. Only the products were judged as acceptable products.
【００３０】ii) Ｄ-６/１００：沸騰水[１００℃]浸漬
時間を６時間とした以外は、i）とまったく同様に行な
った。Ii) D-6 / 100: Completely the same as i) except that the immersion time in boiling water [100 ° C.] was 6 hours.
【００３１】冷熱試験（実装信頼性評価） 上記内層
回路入り多層銅張り積層板に集積回路パッケージをハン
ダバンプにより表面実装したものについて、−６０℃〜
１６０℃の冷熱サイクル試験を２００回繰り返した後
に、上記ハンダバンプの導通不良率により評価した。即
ち、この冷熱サイクル試験後に、上記ハンダバンプの導
通性を保持しているもののみを合格品、それ以外のもの
を不合格品とし、全供試サンプルに占める前記不合格品
の割合を不良率（％）とした。なお、ハンダバンプは、
１４ｍｍ角のシリコンチップ１個当り４５個×４５個の
計２０２５個形成し、このチップを基板上に５０個搭載
し、１評価当り計約１０万個のバンプ接続信頼性を測定
した。Cooling / heat test (evaluation of mounting reliability) For the above-mentioned multilayer copper clad laminate with inner layer circuit, an integrated circuit package was surface-mounted by solder bumps, from -60 ° C.
After repeating the cooling / heating cycle test at 160 ° C. 200 times, the solder bump was evaluated by the defective conduction rate. That is, after this thermal cycling test, only those that retain the conductivity of the solder bumps are acceptable products, and other products are rejected products, and the percentage of the rejected products in all test samples is the defective rate ( %). In addition, the solder bump is
A total of 2025 45 × 45 silicon chips of 14 mm square were formed, 50 chips were mounted on the substrate, and a bump connection reliability of 100,000 silicon chips per evaluation was measured.
【００３２】熱膨張係数（αｘｙ） 上記ＴＭＡ測定
用試料について、面方向における熱膨張係数（αｘｙ）
をＴＭＡを用いて５０℃〜１５０℃で１０℃／分の昇温
条件で測定した（引張法）。Thermal expansion coefficient (αxy) Thermal expansion coefficient (αxy) in the plane direction of the TMA measurement sample.
Was measured at a temperature rise condition of 10 ° C./min at 50 ° C. to 150 ° C. using TMA (tensile method).
【００３３】以上の評価結果を表１、及び表２に示す。The above evaluation results are shown in Tables 1 and 2.
【００３４】[0034]
【表１】 [Table 1]
【表２】
以上の評価結果より、表１、及び表２にみられるよう
に、実施例１〜１１の結果から、上記したように、本発
明のプリプレグに使用するアラミド不織布の空隙率が、
３０〜５５％、更に、好ましくは、３８〜４８％の範囲
内にあるものを使用すると、アラミド不織布の空隙率が
その範囲内にないもの（比較例１〜４）と比較して、銅
箔密着強度（銅箔ピール強度）が向上することが認めら
れる。これは、銅箔接着面近傍に存在するエポキシ樹脂
組成物の量と基材中に浸透したエポキシ樹脂組成物の量
のバランスが良好となったことによるものと解釈するこ
とができる。[Table 2] From the above evaluation results, as shown in Table 1 and Table 2, from the results of Examples 1 to 11, as described above, the porosity of the aramid nonwoven fabric used in the prepreg of the present invention was
When using a copper foil having a porosity of 30 to 55%, and more preferably 38 to 48%, a copper foil is obtained as compared with a non-aramid nonwoven fabric having a porosity not within the range (Comparative Examples 1 to 4). It is recognized that the adhesion strength (copper foil peel strength) is improved. This can be interpreted as a good balance between the amount of the epoxy resin composition existing near the copper foil bonding surface and the amount of the epoxy resin composition that has penetrated into the substrate.
【００３５】即ち、この場合、アラミド不織布の空隙率
が高すぎると、投入した殆どのエポキシ樹脂組成物が、
アラミド不織布の空隙部に収容され、エポキシ樹脂組成
物硬化物のパラ系アラミド繊維不織布に対するアンカー
効果は増大する一方、銅箔接着面近傍に存在するエポキ
シ樹脂組成物の量が不足し、銅箔接着面近傍に存在する
エポキシ樹脂組成物硬化物の銅箔接着面に対するアンカ
ー効果の寄与が小さく、結果として、銅箔密着強度（銅
箔ピール強度）の向上に繋がらず、逆に、アラミド不織
布の空隙率が低すぎると、投入したエポキシ樹脂組成物
が、アラミド不織布の内部に浸透し難くなり、エポキシ
樹脂組成物硬化物のパラ系アラミド繊維不織布に対する
アンカー効果の寄与が小さく、仮に銅箔接着面近傍に存
在するエポキシ樹脂組成物の量が充分で、銅箔接着面近
傍に存在するエポキシ樹脂組成物硬化物の銅箔接着面に
対するアンカー効果が充分大きいレベルにあったとして
も、結果として、銅箔密着強度（銅箔ピール強度）の向
上に繋がらないものと考えられる。結局、プリプレグに
使用するアラミド不織布の空隙率が、上記範囲内にある
ものを使用した場合において、銅箔接着面近傍に存在す
るエポキシ樹脂組成物の量と基材中に浸透したエポキシ
樹脂組成物の量のバランスが良好となり、充分な銅箔密
着強度を安定的に確保できるものと考えられる。That is, in this case, if the porosity of the aramid nonwoven fabric is too high, most of the loaded epoxy resin composition is
The anchor effect of the cured epoxy resin composition on the para-aramid fiber nonwoven fabric is increased by being accommodated in the voids of the aramid non-woven fabric, while the amount of the epoxy resin composition existing near the copper foil bonding surface is insufficient and the copper foil bonding The contribution of the anchor effect to the copper foil bonding surface of the cured epoxy resin composition existing in the vicinity of the surface is small, and as a result, it does not lead to improvement of the copper foil adhesion strength (copper foil peel strength), and conversely, the voids of the aramid nonwoven fabric. If the rate is too low, the input epoxy resin composition becomes difficult to permeate the inside of the aramid nonwoven fabric, and the contribution of the anchor effect to the para-aramid fiber nonwoven fabric of the cured epoxy resin composition is small. The amount of the epoxy resin composition present in the resin is sufficient, and the anchoring effect of the cured epoxy resin composition present near the copper foil bonding surface on the copper foil bonding surface There Even in sufficiently large level, as a result, it is considered that does not lead to the improvement of the copper foil adhesion strength (copper foil peeling strength). After all, when the porosity of the aramid nonwoven fabric used for the prepreg is within the above range, the amount of the epoxy resin composition existing near the copper foil bonding surface and the epoxy resin composition that has penetrated into the base material It is considered that the balance of the amount of the copper foil becomes good and a sufficient copper foil adhesion strength can be stably secured.
【００３６】一方、本発明のプリプレグにおいては、実
施例１に示すように、プリプレグ総質量に占めるエポキ
シ樹脂組成物の含有率が、５５〜５８質量％である場合
には、プリプレグ総質量に占めるエポキシ樹脂組成物の
含有率が、かかる範囲内に無い実施例８、９と比較し
て、充分な銅箔密着強度を安定的に確保できる一方、プ
リプレグの絶縁層の熱膨張係数低減が実現でき、プリプ
レグの絶縁層とシリコンチップとの熱膨張係数との差異
も低減され、結果として、部品実装信頼性の更なる向上
に寄与し得ることとなる。この場合において、充分な銅
箔密着強度を安定的に確保できるのは、銅箔接着面近傍
に存在するエポキシ樹脂組成物の量が充分であるため、
上記した銅箔接着面近傍に存在するエポキシ樹脂組成物
硬化物の銅箔接着面に対するアンカー効果が充分に働く
ためと考えられる。なお、ここでいう熱膨張係数とは、
シート状物のシート面方向における熱膨張係数 （αｘ
ｙ）（以下、「熱膨張係数」という。）をいう。On the other hand, in the prepreg of the present invention, as shown in Example 1, when the content of the epoxy resin composition in the total mass of the prepreg is 55 to 58% by mass, it accounts for the total mass of the prepreg. Compared with Examples 8 and 9 in which the content of the epoxy resin composition is not within such a range, sufficient copper foil adhesion strength can be stably ensured, and reduction in the thermal expansion coefficient of the insulating layer of the prepreg can be realized. Also, the difference in the coefficient of thermal expansion between the insulating layer of the prepreg and the silicon chip is reduced, and as a result, it is possible to contribute to further improvement in component mounting reliability. In this case, it is possible to stably ensure sufficient copper foil adhesion strength, because the amount of the epoxy resin composition existing near the copper foil bonding surface is sufficient,
It is considered that the above-mentioned anchor effect of the cured epoxy resin composition existing in the vicinity of the copper foil bonding surface sufficiently works on the copper foil bonding surface. The coefficient of thermal expansion referred to here is
Thermal expansion coefficient (αx
y) (hereinafter referred to as "coefficient of thermal expansion").
【００３７】また、実施例１に示すように、積層成型の
際のプリプレグの「樹脂流れ」値を、１０％〜２５％の
範囲に設計することが、内層回路入り積層板の銅箔ピー
ル強度を安定的に確保する観点から、重要であることが
判った。これは、「樹脂流れ」が、実施例１０に示すよ
うに、１０％未満ではプリプレグの硬化が進みすぎてい
るため、積層成型の際に、樹脂が銅箔、基材に充分に浸
透しにくく、銅箔密着強度が低下する一方、実施例１１
に示すように、「樹脂流れ」が２５％を越えるとプリプ
レグ中の樹脂組成物の硬化が不充分で、積層成型の際に
樹脂の流動性が過剰になり、プリプレグ表層近傍に存在
する樹脂組成物の存在量が低下する結果、銅箔密着強度
の劣化を招くものと考えられるからである。Further, as shown in Example 1, it is necessary to design the "resin flow" value of the prepreg at the time of laminate molding in the range of 10% to 25% so that the copper foil peel strength of the laminate containing the inner layer circuit can be improved. It was found to be important from the viewpoint of ensuring stable. This is because when the "resin flow" is less than 10% as shown in Example 10, the curing of the prepreg is too advanced, and therefore the resin is difficult to sufficiently penetrate into the copper foil and the base material during the lamination molding. While the copper foil adhesion strength decreases, Example 11
As shown in, when the "resin flow" exceeds 25%, the resin composition in the prepreg is insufficiently cured, the fluidity of the resin becomes excessive during the lamination molding, and the resin composition existing in the vicinity of the surface layer of the prepreg. This is because it is considered that as a result of the decrease in the existing amount of the substance, the adhesion strength of the copper foil is deteriorated.
【００３８】さらに、エポキシ樹脂組成物に使用する硬
化剤が、フェノールノボラック系樹脂である場合（実施
例１、実施例７）には、ジシアンジアミドを硬化剤とし
て使用した場合（実施例４）と比較して、良好な吸湿ハ
ンダ耐熱性を示し、プリプレグの絶縁層の耐熱性向上に
寄与し得ることが判った。Furthermore, when the curing agent used in the epoxy resin composition is a phenol novolac resin (Examples 1 and 7), it is compared with the case where dicyandiamide is used as the curing agent (Example 4). As a result, it was found that it exhibits good moisture absorption solder heat resistance and can contribute to the improvement of heat resistance of the insulating layer of the prepreg.
【００３９】したがって、上記プリプレグと、銅箔と、
内層回路形成面を備える内層材とを、前記内層回路形成
面が前記プリプレグに接するように、前記銅箔と、前記
内層材とで、前記プリプレグを挟むように、積層、一体
化してなる本発明の内層回路入り積層板においては、パ
ラ系アラミド不織布を基材とするプリプレグに直接積層
した外層銅箔においても充分な銅箔密着強度を安定的に
確保できることとなる。Therefore, the prepreg, the copper foil,
An inner layer material having an inner layer circuit forming surface, the copper foil and the inner layer material are laminated and integrated so that the inner layer circuit forming surface is in contact with the prepreg so that the prepreg is sandwiched. In the laminated board with an inner layer circuit, sufficient copper foil adhesion strength can be stably ensured even in the outer layer copper foil directly laminated on the prepreg based on the para-aramid nonwoven fabric.
【００４０】[0040]
【発明の効果】以上のように、請求項１〜請求項２に係
る発明のプリプレグにあっては、パラ系アラミド繊維を
用いてなるアラミド不織布を基材とし、これにエポキシ
樹脂、硬化剤、硬化促進剤を含有するエポキシ樹脂組成
物を含んでなるエポキシ樹脂組成物ワニスを含浸、半硬
化せしめたプリプレグであって、前記アラミド不織布の
空隙率が、３０〜５５％であることを特徴とするので、
銅箔接着面近傍に存在するエポキシ樹脂組成物の量と基
材中に浸透したエポキシ樹脂組成物の量のバランスが良
好となり、充分な銅箔密着強度を安定的に確保できると
いう優れた効果を奏する。As described above, in the prepreg of the invention according to claims 1 and 2, an aramid nonwoven fabric made of para-aramid fiber is used as a base material, and an epoxy resin, a curing agent, A prepreg impregnated with an epoxy resin composition varnish containing an epoxy resin composition containing a curing accelerator and semi-cured, wherein the aramid nonwoven fabric has a porosity of 30 to 55%. So
A good balance between the amount of the epoxy resin composition existing in the vicinity of the copper foil bonding surface and the amount of the epoxy resin composition that has penetrated into the base material becomes good, and it is possible to stably secure sufficient copper foil adhesion strength. Play.
【００４１】請求項３に係る発明のプリプレグにあって
は、請求項１または請求項２記載のプリプレグにおい
て、前記プリプレグ総質量に占める前記エポキシ樹脂組
成物の含有率が、５５〜５８質量％であることを特徴と
するので、銅箔接着面近傍に存在する前記エポキシ樹脂
組成物の量が充分であり、充分な銅箔密着強度を安定的
に確保できる一方、プリプレグの絶縁層の熱膨張係数低
減が実現でき、シリコンチップの熱膨張係数との差異も
低減され、結果として、部品実装信頼性の向上にも寄与
できるという優れた効果を奏する。In the prepreg of the invention according to claim 3, in the prepreg according to claim 1 or 2, the content of the epoxy resin composition in the total mass of the prepreg is 55 to 58% by mass. Since it is characterized in that the amount of the epoxy resin composition present in the vicinity of the copper foil bonding surface is sufficient, and sufficient copper foil adhesion strength can be stably ensured, while the thermal expansion coefficient of the insulating layer of the prepreg. It is possible to realize the reduction, the difference from the thermal expansion coefficient of the silicon chip is reduced, and as a result, it is possible to contribute to the improvement of the component mounting reliability.
【００４２】請求項４に係る発明のプリプレグにあって
は、請求項１乃至請求項３のいずれかに記載のプリプレ
グにおいて、前記硬化剤が、フェノールノボラック系樹
脂であることを特徴とするので、プリプレグの絶縁層の
耐熱性向上に寄与し得るという優れた効果を奏する。The prepreg of the invention according to claim 4 is characterized in that, in the prepreg according to any one of claims 1 to 3, the curing agent is a phenol novolac resin. It has an excellent effect that it can contribute to the improvement of the heat resistance of the insulating layer of the prepreg.
【００４３】請求項５に係る発明の内層回路入り積層板
にあっては、請求項１乃至請求項４のいずれかに記載の
プリプレグと、銅箔と、内層回路形成面を備える内層材
とを、前記内層回路形成面が前記プリプレグに接と接し
ていて、且つ、前記銅箔と、前記内層材とで、前記プリ
プレグを挟むように、積層、一体化してなることを特徴
とするので、パラ系アラミド不織布を基材とするプリプ
レグに直接積層した外層銅箔においても充分な銅箔密着
強度を安定的に確保できるという優れた効果を奏する。According to a fifth aspect of the present invention, there is provided an inner layer circuit-containing laminated plate comprising the prepreg according to any one of the first to fourth aspects, a copper foil, and an inner layer material having an inner layer circuit forming surface. The inner layer circuit forming surface is in contact with the prepreg, and the copper foil and the inner layer material are laminated and integrated so as to sandwich the prepreg. Even in an outer layer copper foil directly laminated on a prepreg having a base aramid non-woven fabric as a base material, it is possible to stably secure sufficient adhesion strength of the copper foil.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 1/03 ６１０ Ｈ０５Ｋ 1/03 ６１０Ｕ 3/46 3/46 Ｔ // Ｃ０８Ｌ 63:00 Ｃ０８Ｌ 63:00 (72)発明者 石田 武弘 大阪府門真市大字門真1048番地松下電工株 式会社内 Ｆターム(参考） 4F072 AA04 AA07 AB06 AB29 AD23 AD29 AE01 AE02 AG03 AH02 AH22 AJ04 AK05 AK14 AL13 4F100 AB17B AB33B AK33A AK33C AK33D AK33E AK47A AK47C AK47D AK47E AK53A AK53C AK53D AK53E AL01A AL01C AL01D AL01E AL05A AL05C AL05D AL05E AT00A AT00C AT00D AT00E BA03 BA04 BA05 BA07 BA10B BA10E BA13 CA02 DG01A DG01C DG01D DG01E DG15A DG15C DG15D DG15E DJ00A DJ00C DJ00D DJ00E EJ02 EJ022 EJ17 EJ172 EJ42 EJ422 EJ68 EJ682 EJ82 EJ822 GB43 JL11 JM01A JM01C JM01D JM01E YY00A YY00C YY00D YY00E 4J036 AA01 AA06 DC31 DC40 FB08 JA08 5E346 AA12 CC05 CC09 EE06 EE09 HH11 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H05K 1/03 610 H05K 1/03 610U 3/46 3/46 T // C08L 63:00 C08L 63:00 (72) Inventor Takehiro Ishida 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. F-term within the company (reference) 4F072 AA04 AA07 AB06 AB29 AD23 AD29 AE01 AE02 AG03 AH02 AH22 AJ04 AK05 AK14 AL13 4F100 AB17B AB33B33C AK33AAK 33AAK33AAK33AAK33AAK33AAK AK47C AK47D AK47E AK53A AK53C AK53D AK53E AL01A AL01C AL01D AL01E AL05A AL05C AL05D AL05E AT00A AT00C AT00D AT00E BA03 BA04 BA05 BA07 BA10B BA10E BA13 CA02 DG01A DG01C DG01D DG01E DG15A DG15C DG15D DG15E DJ00A DJ00C DJ00D DJ00E EJ02 EJ022 EJ17 EJ172 EJ42 EJ422 EJ68 EJ682 EJ82 EJ822 GB43 JL11 JM01A JM01C JM01D JM01E YY00A YY00C YY00D YY00E 4J036 AA01 AA06 DC31 DC40 FB08 JA08 5E346 AA12 CC05 CC09 EE06 EE09 HH11
Claims (5)
ド不織布を基材とし、これにエポキシ樹脂、硬化剤、硬
化促進剤を含有するエポキシ樹脂組成物を含んでなるエ
ポキシ樹脂組成物ワニスを含浸、半硬化せしめたプリプ
レグであって、前記アラミド不織布の空隙率が、３０〜
５５％であることを特徴とするプリプレグ。1. An aramid non-woven fabric comprising para-aramid fiber as a base material, which is impregnated with an epoxy resin composition varnish comprising an epoxy resin composition containing an epoxy resin, a curing agent and a curing accelerator, A prepreg that is semi-cured, wherein the aramid nonwoven fabric has a porosity of 30 to
Prepreg characterized by being 55%.
-フェニレンテレフタラミド）或いはポリ（パラ-フェニ
レン／３,４’-ジフェニルエーテルテレフタラミド）の
繊維のいずれかまたは両者の混合物であることを特徴と
する請求項１記載のプリプレグ。2. The para-aramid fiber is made of poly (para
-Phenylene terephthalamide) or poly (para-phenylene / 3,4'-diphenyl ether terephthalamide) fibers or a mixture of both.
キシ樹脂組成物の含有率が、５５〜５８質量％であるこ
とを特徴とする請求項１または請求項２記載のプリプレ
グ。3. The prepreg according to claim 1, wherein the content of the epoxy resin composition in the total mass of the prepreg is 55 to 58 mass%.
樹脂であることを特徴とする請求項１乃至請求項３のい
ずれかに記載のプリプレグ。4. The prepreg according to claim 1, wherein the curing agent is a phenol novolac resin.
のプリプレグと、銅箔と、内層回路形成面を備える内層
材とを、前記内層回路形成面が前記プリプレグに接と接
していて、且つ、前記銅箔と、前記内層材とで、前記プ
リプレグを挟むように、積層、一体化してなる内層回路
入り積層板。5. The prepreg according to any one of claims 1 to 4, a copper foil, and an inner layer material having an inner layer circuit forming surface, wherein the inner layer circuit forming surface is in contact with the prepreg. An inner-layer circuit-containing laminate obtained by laminating and integrating the copper foil and the inner layer material so as to sandwich the prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002153531A JP2003342399A (en) | 2002-05-28 | 2002-05-28 | Prepreg and laminated plate having inner layer circuit obtained by using this prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002153531A JP2003342399A (en) | 2002-05-28 | 2002-05-28 | Prepreg and laminated plate having inner layer circuit obtained by using this prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003342399A true JP2003342399A (en) | 2003-12-03 |
Family
ID=29770546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002153531A Pending JP2003342399A (en) | 2002-05-28 | 2002-05-28 | Prepreg and laminated plate having inner layer circuit obtained by using this prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003342399A (en) |
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|---|---|---|---|---|
| JP2007083467A (en) * | 2005-09-21 | 2007-04-05 | Japan Vilene Co Ltd | Composite sheet |
| JP2007294487A (en) * | 2006-04-20 | 2007-11-08 | Matsushita Electric Works Ltd | Prepreg, and process for manufacturing printed wiring board |
| JP2012126133A (en) * | 2010-12-14 | 2012-07-05 | Shinyoung Co Ltd | Multiple bonding material |
| WO2012124307A1 (en) * | 2011-03-14 | 2012-09-20 | 住友ベークライト株式会社 | Prepreg for build-up |
| JP2012191109A (en) * | 2011-03-14 | 2012-10-04 | Sumitomo Bakelite Co Ltd | Prepreg for buildup |
| JP2012191108A (en) * | 2011-03-14 | 2012-10-04 | Sumitomo Bakelite Co Ltd | Prepreg for buildup |
| JP2013209626A (en) * | 2012-02-28 | 2013-10-10 | Sumitomo Bakelite Co Ltd | Prepreg and prepreg manufacturing method |
| EP3492525A4 (en) * | 2016-07-28 | 2020-04-08 | Sumitomo Bakelite Co., Ltd. | Composite molded article, intermediate for composite molded article, method of manufacturing composite molded article, and interior material for transport device |
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| TWI491323B (en) * | 2011-03-14 | 2015-07-01 | Sumitomo Bakelite Co | A prepreg for use in build-up process |
| KR101907713B1 (en) * | 2011-03-14 | 2018-10-12 | 스미토모 베이클리트 컴퍼니 리미티드 | Prepreg for buildup |
| JP2013209626A (en) * | 2012-02-28 | 2013-10-10 | Sumitomo Bakelite Co Ltd | Prepreg and prepreg manufacturing method |
| EP3492525A4 (en) * | 2016-07-28 | 2020-04-08 | Sumitomo Bakelite Co., Ltd. | Composite molded article, intermediate for composite molded article, method of manufacturing composite molded article, and interior material for transport device |
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