JP2003340637A - Base plate for circular saw having noise preventing function and circular saw - Google Patents
Base plate for circular saw having noise preventing function and circular sawInfo
- Publication number
- JP2003340637A JP2003340637A JP2002151649A JP2002151649A JP2003340637A JP 2003340637 A JP2003340637 A JP 2003340637A JP 2002151649 A JP2002151649 A JP 2002151649A JP 2002151649 A JP2002151649 A JP 2002151649A JP 2003340637 A JP2003340637 A JP 2003340637A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- substrate
- circular saw
- zigzag
- slits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Sawing (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、金属材料、木質系
材料などを加工するためのサーキュラソー用基板および
この基板を用いたサーキュラソーに関するものであっ
て、特に切断中の基板の振動や騒音を抑制する基板およ
びサーキュラソーに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circular saw substrate for processing a metal material, a wood-based material, etc. and a circular saw using this substrate, and particularly to vibration and noise of the substrate during cutting. The present invention relates to a substrate and a circular saw that suppresses heat.
【０００２】[0002]
【従来の技術】従来より、金属材料や木質系材料の切断
加工を行うのに、円板状の基板の周縁に多結晶ダイヤモ
ンド焼結体のチップが設けられたサーキュラソーが使用
される。このサーキュラソーで切断を行う際、主として
基板の振動により騒音が発生し、状況によっては基板外
周に設けられたチップ間の刃底部分から亀裂が発生し、
基板が破壊するという問題も起こっていた。このことか
ら、作業環境の改善や安全性のために基板の振動を抑制
することが望まれている。2. Description of the Related Art Conventionally, a circular saw having a polycrystalline diamond sintered body chip provided on the periphery of a disk-shaped substrate has been used for cutting metal materials and wood-based materials. When cutting with this circular saw, noise is mainly generated by vibration of the substrate, and in some circumstances cracks occur from the blade bottom portion between the chips provided on the outer periphery of the substrate,
There was also the problem of the board breaking. Therefore, it is desired to suppress the vibration of the substrate for improving the working environment and safety.
【０００３】基板の振動を抑制できるものとしては、様
々な提案がなされており、例えば特開昭６３−１５０１
号公報に記載のものがある。この基板の一部を図３に示
す。この提案は、台金の外周域より中周域に向けて振り
幅が溝間隔より長いジグザグ状の切溝によって交互に形
成された細長い舌片を形成し、図３（ｂ）に示すように
この舌片の先端部が隣接する舌片基部と部分的な面接触
状態になるように接触部２ｃを有するものである。Various proposals have been made for suppressing the vibration of the substrate, for example, Japanese Patent Laid-Open No. 63-1501.
There is one described in the publication. A part of this substrate is shown in FIG. This proposal forms slender tongue pieces alternately formed by zigzag kerfs whose swing width is longer than the groove interval from the outer peripheral area of the base metal to the inner peripheral area, and as shown in FIG. 3 (b). The tongue piece has a contact portion 2c so that the tip portion of the tongue piece is in partial surface contact with the adjacent tongue piece base portion.
【０００４】[0004]
【発明が解決しようとする課題】上記の提案では、舌片
の接触を部分的にして弱い面接触とし、この部分の摩擦
により振動エネルギーを抑制して減衰するとともに、台
金に大きなずれが生じても元に戻るようにするものであ
る。この提案は、弱い面接触により効果的に騒音を防止
できる効果があるが、この弱い面接触は切溝を形成する
ための高エネルギービームの高熱を利用して舌片を変形
させることにより形成させるために、面接触状態を制御
して、常に騒音防止効果の高いスリットを形成するには
高度の技術を必要とした。In the above-mentioned proposal, the tongue is partially contacted with a weak surface contact, and the frictional energy of this part suppresses and damps the vibration energy and causes a large deviation in the base metal. However, it is something that should be restored. This proposal has the effect of effectively preventing noise by weak surface contact, but this weak surface contact is formed by deforming the tongue piece by utilizing the high heat of the high energy beam for forming the kerf. Therefore, advanced technology was required to control the surface contact state and always form slits with a high noise prevention effect.
【０００５】以上のようなことから、振動を抑制する効
果が大きいスリットの形成が容易で、台金に大きなずれ
が生じても元に戻ることが可能であり、基板に亀裂が発
生しにくく安全性の高いサーキュラソー用基板およびサ
ーキュラソーを提案するものである。From the above, it is easy to form a slit having a great effect of suppressing vibration, and it is possible to return to the original state even if a large deviation occurs in the base metal. It proposes a circular saw substrate and a circular saw having high properties.
【０００６】[0006]
【課題を解決するための手段】本発明のサーキュラソー
用基板の第１の特徴は、円板状の台金にスリットが設け
られたサーキュラソー用基板であって、前記スリット
は、前記台金の外周側から内周側に向けて振り幅が溝間
隔より長いジグザグ状の切溝により形成されるととも
に、前記ジグザグ状の切溝により形成された細長い舌片
を有する第１スリットと、前記第１スリットの内周側に
設けられ、前記台金の外周側から内周側に向けて振り幅
が溝間隔より長いジグザグ状の切溝により形成されると
ともに、前記ジグザグ状の切溝により形成された細長い
舌片を有する第２スリットとからなり、前記第１スリッ
トの最内周側の舌片に前記第２スリットの最外周側の切
溝が形成され、前記第１スリットおよび第２スリットに
は樹脂が充填されてなることである。A first feature of a substrate for a circular saw of the present invention is a substrate for a circular saw in which a slit is provided in a disc-shaped base metal, and the slit is the base metal. A first slit having a slender tongue piece formed by the zigzag cut groove, the swing width of which is longer from the outer circumference side to the inner circumference side of the zigzag cut groove; One slit is provided on the inner peripheral side and is formed by a zigzag-shaped cut groove whose swing width is longer from the outer peripheral side of the base metal toward the inner peripheral side than the groove interval, and is formed by the zigzag-shaped cut groove. And a second slit having an elongated tongue piece, and an outermost kerf of the second slit is formed on the innermost tongue piece of the first slit, and the first slit and the second slit are formed. Is not filled with resin It is.
【０００７】第２の特徴は、前記ジグザグ状の切溝の振
り幅における中心軸は、前記基板の半径方向に一致する
か、前記スリットの中心部における半径方向に対して４
５°以内としたことである。なお、スリットの中心部と
は、第１スリットおよび第２スリットの領域内で振り幅
方向の中心かつ振り幅と直角方向の中心である点を指
す。A second feature is that the center axis in the swing width of the zigzag-shaped kerf coincides with the radial direction of the substrate or is 4 relative to the radial direction at the central portion of the slit.
That is within 5 °. The central portion of the slit refers to a point that is the center in the swing width direction and the center in the direction perpendicular to the swing width in the region of the first slit and the second slit.
【０００８】第３の特徴は、前記第１スリットと前記第
２スリットを組み合わせた一対のスリットを、前記台金
の周方向に等間隔に形成したことである。A third feature is that a pair of slits, which are a combination of the first slits and the second slits, are formed at equal intervals in the circumferential direction of the base metal.
【０００９】第４の特徴は、前記樹脂は、フェノール
系、ポリイミド系、エポキシ系またはシリコン系のいず
れかよりなる熱硬化性樹脂としたことである。A fourth feature is that the resin is a thermosetting resin made of any one of phenol type, polyimide type, epoxy type and silicon type.
【００１０】第５の特徴は、前記樹脂には、ＳｉＣ、ア
ルミナ、ＳｉＯ２のうちのいずれか一つまたは二つ以上
を含有することである。A fifth feature is that the resin contains one or more of SiC, alumina and SiO 2 .
【００１１】第６の特徴は、上記の基板を用い、基板の
外周に多結晶ダイヤモンド、単結晶ダイヤモンドまたは
ＣＢＮ焼結体からなる切れ刃を接合したサーキュラソー
としたことである。A sixth feature is that the above-mentioned substrate is used, and a cutting edge made of polycrystalline diamond, single crystal diamond or a CBN sintered body is joined to the outer periphery of the substrate to provide a circular saw.
【００１２】[0012]
【発明の実施の形態】本発明のサーキュラソー用基板を
図１に示す。基板１は薄板円板状の台金からなり、外周
には切れ刃となるチップを接合するための刃台５が設け
られている。刃台５間には刃底６が形成されており、チ
ップを刃台５にろう付けする際に隣接する刃台５に熱が
拡散しないようになっている。基板１には、第１スリッ
ト２ａと第２スリット２ｂを組み合わせた一対のスリッ
ト２が複数個設けられており、基板１の周方向において
等間隔に設けられている。これらのスリット２は、振り
幅が溝間隔より長いジグザグ状の切溝であり、 基板１
の外周側から内周側に向けてジグザグ状に形成される。
ジグザグ状の切溝とすることにより、切溝の間には細長
い舌片３が形成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A circular saw substrate of the present invention is shown in FIG. The substrate 1 is made of a thin disk-shaped base metal, and a blade base 5 for joining chips to be cutting edges is provided on the outer periphery thereof. A blade bottom 6 is formed between the blade bases 5 so that heat does not diffuse to the adjacent blade bases 5 when the chips are brazed to the blade bases 5. The substrate 1 is provided with a plurality of pairs of slits 2 that are a combination of the first slits 2a and the second slits 2b, and are provided at equal intervals in the circumferential direction of the substrate 1. These slits 2 are zigzag kerfs whose swing width is longer than the groove interval.
Is formed in a zigzag shape from the outer peripheral side to the inner peripheral side.
By forming the zigzag cut grooves, elongated tongue pieces 3 are formed between the cut grooves.
【００１３】第１スリット２ａの最内周側の舌片３に
は、第２スリット２ｂの最外周側の切溝が形成されてい
る。このようにすることで、第１スリット２ａと第２ス
リット２ｂがかみ合うように重複することになり、剪断
歪み量の和が増え広範囲な周波数に対して振動を減衰す
ることができるので、切削加工時に発生する複雑な振動
を抑制する効果が生まれる。The tongue piece 3 on the innermost peripheral side of the first slit 2a is formed with a kerf on the outermost peripheral side of the second slit 2b. By doing so, the first slits 2a and the second slits 2b are overlapped so as to engage with each other, the sum of the shear strain amounts increases, and the vibrations can be damped in a wide range of frequencies. The effect of suppressing the complicated vibration that sometimes occurs is born.
【００１４】一対のスリット２でジグザグ状の切溝の振
り幅における中心軸ｐは、基板１の半径方向に一致する
か、スリット２の中心部ｏにおける半径線ｒに対し４５
°以内としている。このようにすることで、チップの部
分で発生して基板１中心方向に向かって伝わる振動を効
果的に減衰できる。The central axis p in the swing width of the zigzag kerf formed by the pair of slits 2 coincides with the radial direction of the substrate 1 or is 45 with respect to the radial line r at the central portion o of the slit 2.
It is within °. By doing so, it is possible to effectively damp the vibration generated in the chip portion and transmitted toward the center of the substrate 1.
【００１５】第１スリット２ａおよび第２スリット２ｂ
には樹脂が充填されている。このように樹脂が充填され
ていることで、舌片３と樹脂が面接触状態になり、スリ
ット２付近に発生した振動エネルギーは熱エネルギーに
変換されて減衰される。この樹脂は、フェノール系、ポ
リイミド系、エポキシ系またはシリコン系のいずれかよ
りなる熱硬化性樹脂を用いることが好ましい。これは、
低コストで作業が容易であるとともに、これらの熱硬化
性樹脂を用いることで、熱による樹脂の劣化と剥離を防
いで制振効果を持続させ、万一剥離した場合でも、再度
樹脂を充填することを容易にするためである。また、樹
脂には助剤としてダイヤモンド、ＣＢＮ、ＳｉＣ、アル
ミナ、ＳｉＯ２などが使用できるが、ＳｉＣ、アルミ
ナ、ＳｉＯ ２うちのいずれか一つまたは二つ以上を含有
することが好ましい。これにより、比較的低コストで歪
みエネルギーを効率よく熱エネルギーに変換させて制振
効果を高めることができる。First slit 2a and second slit 2b
Is filled with resin. In this way the resin is filled
The tongue piece 3 and the resin are in surface contact with each other,
Vibrational energy generated near
Converted and attenuated. This resin is phenolic,
Either a polyimide, epoxy or silicone type
It is preferable to use the following thermosetting resin. this is,
Low cost and easy to work with, these thermosets
The use of a heat-resistant resin prevents deterioration and peeling of the resin due to heat.
In order to maintain the vibration damping effect, and even if it is peeled off,
This is because it is easy to fill the resin. Also the tree
For fats, diamond, CBN, SiC,
Mina, SiOTwoCan be used, but SiC, aluminum
Na, SiO TwoContains any one or more of
Preferably. This allows distortion at a relatively low cost.
Vibration is efficiently converted from heat energy into heat energy
The effect can be enhanced.
【００１６】上記のようなサーキュラソー用基板の外周
に多結晶ダイヤモンド、単結晶ダイヤモンドまたはＣＢ
Ｎ焼結体からなる切れ刃を接合し、騒音防止効果の高い
サーキュラソーとすることができる。Polycrystalline diamond, single crystal diamond or CB is provided on the outer periphery of the circular saw substrate as described above.
By joining the cutting edges made of N sintered body, it is possible to obtain a circular saw having a high noise prevention effect.
【００１７】[0017]
【実施例】（実施例１）本発明のサーキュラソーの第１
の実施例として、図１に示すようなスリット２ａおよび
２ｂを形成した基板１を製作した。直径２５５ｍｍ、厚
み２ｍｍ、材質はＳＫＳ５の円板状の基板１を準備し、
外周部に所定の形状の刃台５および刃底６を形成し、レ
ーザービームにより外周スリット４、第１スリット２ａ
および第２スリット２ｂを形成した。外周スリット４は
溝幅０．１〜０．３ｍｍ、刃底６から基板１中心に向か
うように長さ５ｍｍとし、等間隔に４ヶ形成した。スリ
ット２ａおよび２ｂは溝幅０．１〜０．３ｍｍ、ジグザ
グ状の振り幅は最大３０ｍｍ、溝間隔（舌片３の幅）８
ｍｍとし、第１スリット２ａは舌片３が３ヶ、第２スリ
ット２ｂは舌片３が３ヶとなるように加工した。ジグザ
グ状の切溝の振り幅における中心軸ｐは、スリット中心
部ｏにおける半径線ｒに一致（傾きを０°）させて５等
配に形成し、スリット２ａおよび２ｂを形成する位置
は、スリット２全体が半径ｒ上において中央部になるよ
うにした。なお、これらのスリット２ａおよび２ｂのす
べての端部は切溝が割れ目になって広がらないように溝
幅より大きい直径の円形穴を形成した。このスリット２
ａおよび２ｂの溝内に、エポキシ樹脂にＳｉＣの助剤を
混合した樹脂を充填し、乾燥させた。以上のようにして
製作した基板１の刃台５に、所定の大きさの焼結ダイヤ
モンドチップをろう付けし、本発明のサーキュラソーと
した。EXAMPLES Example 1 First Circular Saw of the Present Invention
As an example, a substrate 1 having slits 2a and 2b as shown in FIG. 1 was manufactured. Prepare a disk-shaped substrate 1 having a diameter of 255 mm, a thickness of 2 mm, and a material of SKS5.
A blade stand 5 and a blade bottom 6 having a predetermined shape are formed on the outer peripheral portion, and the outer peripheral slit 4 and the first slit 2a are formed by a laser beam.
And the 2nd slit 2b was formed. The outer peripheral slits 4 had a groove width of 0.1 to 0.3 mm, a length of 5 mm from the blade bottom 6 toward the center of the substrate 1, and four peripheral slits 4 were formed at equal intervals. The slits 2a and 2b have a groove width of 0.1 to 0.3 mm, a zigzag swing width of up to 30 mm, and a groove interval (width of the tongue piece 3) 8
The first slit 2a was processed to have three tongue pieces 3 and the second slit 2b was processed to have three tongue pieces 3. The central axis p in the swing width of the zigzag-shaped kerf is formed in 5 equal parts so as to coincide with the radial line r in the slit central portion o (inclination is 0 °), and the slits 2a and 2b are formed at the slit positions. The whole 2 is located at the center on the radius r. In addition, all end portions of these slits 2a and 2b were formed with circular holes having a diameter larger than the groove width so that the kerfs did not spread as cracks. This slit 2
A resin obtained by mixing an epoxy resin with an auxiliary agent of SiC was filled in the grooves a and 2b and dried. A sintered diamond tip of a predetermined size was brazed to the blade stand 5 of the substrate 1 manufactured as described above to obtain the circular saw of the present invention.
【００１８】（実施例２）第２の実施例として、図２に
示すようなスリット２を形成した基板１を製作した。直
径３００ｍｍ、厚み２ｍｍで、材質ＳＫＳ５の円板状の
基板１を準備し、実施例１と同様にスリット加工を行っ
た。外周スリット４は溝幅０．１〜０．３ｍｍ、刃底６
から基板１中心に向かうように長さ５ｍｍとし、等間隔
に４ヶ形成した。スリット２ａおよび２ｂは溝幅０．１
〜０．３ｍｍ、ジグザグ状の振り幅は最大４０ｍｍ、溝
間隔（舌片の幅）７ｍｍとし、第１スリット２ａは舌片
３が４ヶ、第２スリット２ｂは舌片３が４ヶとなるよう
に加工した。ジグザグ状の切溝の振り幅における中心軸
ｐは、スリット中心部ｏにおける半径線ｒに対し傾きα
を３０°として５等配に形成し、スリット２ａおよび２
ｂを形成する位置は、スリット２全体が半径ｒ上におい
て中央部になるようにした。なお、これらのスリット２
ａおよび２ｂのすべての端部は切溝が割れ目になって広
がらないように溝幅より大きい直径の円形穴を形成し
た。このスリット２ａおよび２ｂの溝内に、シリコン樹
脂にアルミナの助剤を混合した樹脂を充填し、乾燥させ
た。以上のようにして製作した基板１の刃台５に、所定
の大きさの焼結ダイヤモンドチップをろう付けし、本発
明のサーキュラソーとした。(Embodiment 2) As a second embodiment, a substrate 1 having slits 2 as shown in FIG. 2 was manufactured. A disk-shaped substrate 1 having a diameter of 300 mm and a thickness of 2 mm and made of a material SKS5 was prepared, and slit processing was performed in the same manner as in Example 1. The outer peripheral slit 4 has a groove width of 0.1 to 0.3 mm and a blade bottom 6
The length was set to 5 mm from the center to the center of the substrate 1, and four pieces were formed at equal intervals. The slits 2a and 2b have a groove width of 0.1.
~ 0.3 mm, zigzag swing width is 40 mm at maximum, groove spacing (width of tongue) is 7 mm, first slit 2a has 4 tongues 3, and second slit 2b has 4 tongues 3. Processed as follows. The central axis p in the swing width of the zigzag kerf is inclined α with respect to the radial line r in the slit central portion o.
Formed into 5 equal parts with 30 ° as the slits 2a and 2
The position where b is formed is such that the entire slit 2 is at the center on the radius r. In addition, these slits 2
All the ends of a and 2b were formed with circular holes having a diameter larger than the groove width so that the kerf did not spread as a crack. A resin obtained by mixing a silicon resin with an alumina auxiliary was filled in the grooves of the slits 2a and 2b and dried. A sintered diamond tip of a predetermined size was brazed to the blade stand 5 of the substrate 1 manufactured as described above to obtain the circular saw of the present invention.
【００１９】（実施例３）第３の実施例として、直径６
００ｍｍ、厚み６ｍｍで、材質ＳＫＳ５の円板状の基板
１を準備し、実施例１と同様にスリット加工を行った。
外周スリット４は溝幅０．１〜０．３ｍｍ、刃底６から
基板１中心に向かうように長さ５ｍｍとし、等間隔に４
ヶ形成した。スリット２ａおよび２ｂは溝幅０．１〜
０．３ｍｍ、ジグザグ状の振り幅は最大７０ｍｍ、溝間
隔（舌片の幅）１０ｍｍとし、第１スリット２ａは舌片
３が３ヶ、第２スリット２ｂは舌片３が３ヶとなるよう
に加工した。ジグザグ状の切溝の振り幅における中心軸
ｐは、スリット中心部ｏにおける半径線ｒに対し傾きα
を４５°として５等配に形成し、スリット２ａおよび２
ｂを形成する位置は、スリット２全体が半径ｒ上におい
て中央部になるようにした。なお、これらのスリット２
ａおよび２ｂのすべての端部は切溝が割れ目になって広
がらないように溝幅より大きい直径の円形穴を形成し
た。このスリット２ａおよび２ｂの溝内に、エポキシ樹
脂にアルミナの助剤を混合した樹脂を充填し、乾燥させ
た。以上のようにして製作した基板１の刃台５に、所定
の大きさの焼結ダイヤモンドチップをろう付けし、本発
明のサーキュラソーとした。(Third Embodiment) As a third embodiment, a diameter of 6
A disk-shaped substrate 1 having a material of SKS5 and having a thickness of 00 mm and a thickness of 6 mm was prepared, and slit processing was performed in the same manner as in Example 1.
The outer peripheral slit 4 has a groove width of 0.1 to 0.3 mm, a length of 5 mm from the blade bottom 6 toward the center of the substrate 1, and 4 at equal intervals.
Formed. The slits 2a and 2b have a groove width of 0.1.
0.3 mm, the maximum zigzag swing width is 70 mm, the groove spacing (width of the tongue) is 10 mm, and the first slit 2a has three tongues 3 and the second slit 2b has three tongues 3. Processed into. The central axis p in the swing width of the zigzag kerf is inclined α with respect to the radial line r in the slit central portion o.
To 45 ° to form 5 equal parts, and slits 2a and 2
The position where b is formed is such that the entire slit 2 is at the center on the radius r. In addition, these slits 2
All the ends of a and 2b were formed with circular holes having a diameter larger than the groove width so that the kerf did not spread as a crack. A resin obtained by mixing an epoxy resin with an auxiliary agent of alumina was filled in the grooves of the slits 2a and 2b and dried. A sintered diamond tip of a predetermined size was brazed to the blade stand 5 of the substrate 1 manufactured as described above to obtain the circular saw of the present invention.
【００２０】（実施例４）第４の実施例として、直径２
５０ｍｍ、厚み４．５ｍｍで、材質ＳＫＳ５の円板状の
基板１を準備し、実施例１と同様にスリット加工を行っ
た。外周スリット４は溝幅０．１〜０．３ｍｍ、刃底６
から基板１中心に向かうように長さ５ｍｍとし、等間隔
に４ヶ形成した。スリット２ａおよび２ｂは溝幅０．１
〜０．３ｍｍ、ジグザグ状の振り幅は最大３５ｍｍ、溝
間隔（舌片の幅）７ｍｍとし、第１スリット２ａは舌片
３が３ヶ、第２スリット２ｂは舌片３が３ヶとなるよう
に加工した。ジグザグ状の切溝の振り幅における中心軸
ｐは、スリット中心部ｏにおける半径線ｒに対し傾きα
を４５°として５等配に形成し、スリット２ａおよび２
ｂを形成する位置は、スリット２全体が半径ｒ上におい
て中央部になるようにした。なお、これらのスリット２
ａおよび２ｂのすべての端部は切溝が割れ目になって広
がらないように溝幅より大きい直径の円形穴を形成し
た。このスリット２ａおよび２ｂの溝内に、シリコン樹
脂にＳｉＣの助剤を混合した樹脂を充填し、乾燥させ
た。以上のようにして製作した基板１の刃台５に、所定
の大きさの焼結ダイヤモンドチップをろう付けし、本発
明のサーキュラソーとした。(Embodiment 4) As a fourth embodiment, a diameter of 2
A disk-shaped substrate 1 having a thickness of 50 mm and a thickness of 4.5 mm and made of a material SKS5 was prepared, and slit processing was performed in the same manner as in Example 1. The outer peripheral slit 4 has a groove width of 0.1 to 0.3 mm and a blade bottom 6
The length was set to 5 mm from the center to the center of the substrate 1, and four pieces were formed at equal intervals. The slits 2a and 2b have a groove width of 0.1.
~ 0.3 mm, maximum zigzag swing width is 35 mm, groove spacing (width of tongue) is 7 mm, first slit 2a has 3 tongues 3, and second slit 2b has 3 tongues 3. Processed as follows. The central axis p in the swing width of the zigzag kerf is inclined α with respect to the radial line r in the slit central portion o.
To 45 ° to form 5 equal parts, and slits 2a and 2
The position where b is formed is such that the entire slit 2 is at the center on the radius r. In addition, these slits 2
All the ends of a and 2b were formed with circular holes having a diameter larger than the groove width so that the kerf did not spread as a crack. A resin obtained by mixing a silicon resin with an auxiliary agent of SiC was filled in the grooves of the slits 2a and 2b and dried. A sintered diamond tip of a predetermined size was brazed to the blade stand 5 of the substrate 1 manufactured as described above to obtain the circular saw of the present invention.
【００２１】（比較例）比較例として、図３（ａ）に示
すようなスリット２を形成した基板１を製作した。実施
例２と同じサイズおよび材質の基板１を準備し、スリッ
ト加工を行った。外周スリット４は溝幅０．１〜０．３
ｍｍ、刃底６から基板１中心に向かうように長さ５ｍｍ
とし、等間隔に４ヶ形成した。スリット２は溝幅０．１
〜０．３ｍｍ、ジグザグ状の振り幅は最大４０ｍｍ、溝
間隔（舌片の幅）７ｍｍとしたが、上記の実施例のよう
に第１スリット２ａおよび第２スリット２ｂのように１
組のスリット２の領域内で２本の切溝により形成したも
のではなく、１本の連続した切溝で形成されており、舌
片３の数は１組のスリットの領域内で同じ数とするため
に８ヶとなるように加工した。ジグザグ状の切溝の振り
幅における中心軸ｐは、スリット２中心部ｏにおける半
径線ｒに対し傾きαを３０°として５等配に形成し、ス
リット２を形成する位置は、スリット２全体が半径ｒ上
において中央部になるようにした。なお、このスリット
２のすべての端部は切溝が割れ目になって広がらないよ
うに溝幅より大きい直径の円形穴を形成した。このスリ
ット２の溝内に、シリコン樹脂にアルミナの助剤を混合
した樹脂複合材を充填し、乾燥させた。以上のようにし
て製作した基板１の刃台５に、所定の大きさの焼結ダイ
ヤモンドチップをろう付けし、比較例のサーキュラソー
とした。Comparative Example As a comparative example, a substrate 1 having slits 2 as shown in FIG. 3A was manufactured. A substrate 1 of the same size and material as in Example 2 was prepared and slit processing was performed. The outer peripheral slit 4 has a groove width of 0.1 to 0.3.
mm, length 5 mm from the blade bottom 6 toward the center of the substrate 1
And four pieces were formed at equal intervals. The slit 2 has a groove width of 0.1
.About.0.3 mm, the zigzag swing width was 40 mm at maximum, and the groove interval (width of the tongue) was 7 mm. However, as in the above-described embodiment, the first slit 2a and the second slit 2b have a width of 1 mm.
The slits 2 are not formed by two kerfs in the area of the slit 2, but are formed by one continuous kerf, and the number of the tongues 3 is the same in the area of one set of slits. In order to do so, it was processed into 8 pieces. The central axis p in the swing width of the zigzag kerf is formed in 5 equal parts with an inclination α of 30 ° with respect to the radial line r in the central part o of the slit 2, and the slit 2 is formed at a position where the entire slit 2 is formed. The center of the radius r is set. A circular hole having a diameter larger than the groove width was formed at each end of the slit 2 so that the kerf would not spread as a crack. A resin composite material in which a silicon resin was mixed with an alumina auxiliary was filled in the groove of the slit 2 and dried. A sintered diamond tip of a predetermined size was brazed to the blade stand 5 of the substrate 1 manufactured as described above to obtain a circular saw of a comparative example.
【００２２】（実験例１）スリット形状の違いによるせ
ん断歪み量の大きさを確認するため、実施例２および比
較例のサーキュラソーを使用してＣＡＥにより解析を行
った。その結果、実施例２のサーキュラソーの方が各周
波数におけるせん断歪み量の和が大きく、振動エネルギ
ーを効果的に吸収できる形状であることがわかった。(Experimental Example 1) In order to confirm the magnitude of the amount of shear strain due to the difference in slit shape, analysis was performed by CAE using the circular saws of Example 2 and Comparative Example. As a result, it was found that the circular saw of Example 2 had a larger sum of shear strain amounts at each frequency and had a shape capable of effectively absorbing vibration energy.
【００２３】（実験例２）基板の減衰状態を比較するた
め、実施例１〜４および比較例のサーキュラソーを使用
して、打撃試験を行った。試験方法は、基板の中央部を
固定した状態で、その基板のスリットのほぼ中央部を鉄
製の振り子により打撃し、打撃直後の初期波形と０．２
ｓ経過した時の波形を一度に計測し、１０Ｌｏｇ１０Ａ
／Ｃの対数減衰能値を算出して比較した。その結果、実
施例１〜４のサーキュラソーはいずれも比較例のサーキ
ュラソーに比べて、減衰能が１０〜１５％向上した。(Experimental Example 2) In order to compare the attenuation states of the substrates, impact tests were conducted using the circular saws of Examples 1 to 4 and Comparative Example. The test method was as follows. With the central part of the substrate fixed, approximately the central part of the slit of the substrate was hit with an iron pendulum, and the initial waveform immediately after the impact and 0.2
Waveform when s has elapsed is measured at once and 10Log10A
/ C logarithmic attenuation values were calculated and compared. As a result, each of the circular saws of Examples 1 to 4 had a damping capacity improved by 10 to 15% as compared with the circular saw of the comparative example.
【００２４】（実験例３）基板の強度を確認するため、
実施例１〜４および比較例のサーキュラソーを使用し
て、強度試験を行った。試験方法は、基板の中央部を固
定した状態で、基板の端部に荷重をかけたときの撓み量
を測定する方法で行った。その結果、実施例１〜４のサ
ーキュラソーは比較例のものに比べて３〜５％向上し、
比較例より低下しないことがわかった。(Experimental Example 3) In order to confirm the strength of the substrate,
A strength test was conducted using the circular saws of Examples 1 to 4 and Comparative Example. The test method was a method of measuring the amount of bending when a load was applied to the end portion of the substrate while the central portion of the substrate was fixed. As a result, the circular saws of Examples 1 to 4 were improved by 3 to 5% as compared with those of Comparative Example,
It was found that it did not decrease as compared with the comparative example.
【００２５】[0025]
【発明の効果】以上説明したように、本発明のスリット
形状は基板の強度を低下させずに振動の減衰性能を高く
することができ、騒音防止効果に優れている。As described above, the slit shape of the present invention can enhance the vibration damping performance without lowering the strength of the substrate and is excellent in the noise prevention effect.
【図１】本発明のサーキュラソー用基板の例を示した部
分側面図である。FIG. 1 is a partial side view showing an example of a circular saw substrate of the present invention.
【図２】本発明のサーキュラソー用基板の別の例を示し
た部分側面図である。FIG. 2 is a partial side view showing another example of the circular saw substrate of the present invention.
【図３】従来のサーキュラソー用基板の例を示した図
で、（ａ）は部分側面図、（ｂ）はスリットの一部を拡
大した図である。FIG. 3 is a view showing an example of a conventional circular saw substrate, (a) is a partial side view, and (b) is an enlarged view of a part of a slit.
１ 基板 ２ スリット ２ａ 第１スリット ２ｂ 第２スリット ２ｃ 舌片の接触部 ３ 舌片 ４ 外周スリット ５ 刃台 ６ 刃底 ７ 取付穴 ｐ スリットの振り幅における中心軸 ｒ スリット中心部を通る半径線 ｏ スリットの中心 α スリットの角度 1 substrate 2 slits 2a 1st slit 2b 2nd slit 2c Contact part of tongue 3 tongue 4 perimeter slit 5 blades 6 blade bottom 7 mounting holes p The central axis of the slit width r Radial line passing through the center of the slit o Center of slit Angle of α slit
フロントページの続き (72)発明者 川西 眞 兵庫県加東郡滝野町河高字黒石1816番174 号 株式会社アライドマテリアル播磨製作 所内 Ｆターム(参考） 3C040 AA01 GG37 Continued front page (72) Inventor Makoto Kawanishi 1816 174 Kuroishi, Kakuishi, Takino-cho, Kato-gun, Hyogo Prefecture No. Allied Material Harima Manufacturing Co., Ltd. In-house F-term (reference) 3C040 AA01 GG37
Claims (6)
ーキュラソー用基板であって、 前記スリットは、前記台金の外周側から内周側に向けて
振り幅が溝間隔より長いジグザグ状の切溝により形成さ
れるとともに、前記ジグザグ状の切溝により形成された
細長い舌片を有する第１スリットと、 前記第１スリットの内周側に設けられ、前記台金の外周
側から内周側に向けて振り幅が溝間隔より長いジグザグ
状の切溝により形成されるとともに、前記ジグザグ状の
切溝により形成された細長い舌片を有する第２スリット
とからなり、前記第１スリットの最内周側の舌片に前記
第２スリットの最外周側の切溝が形成され、前記第１ス
リットおよび第２スリットには樹脂が充填されてなるこ
とを特徴とするサーキュラソー用基板。1. A circular saw substrate having a disc-shaped base metal provided with slits, wherein the slits have a zigzag width in which a swing width is longer than a groove interval from an outer peripheral side to an inner peripheral side of the base metal. A first slit having a slender tongue formed by the zigzag cut groove and a first slit formed in the zigzag cut groove, and provided from the outer peripheral side of the base metal. The second slit is formed by a zigzag-shaped cut groove having a swing width toward the circumferential side and is longer than the groove interval, and the second slit has an elongated tongue piece formed by the zigzag-shaped cut groove. A circular saw substrate, wherein a groove on the outermost peripheral side of the second slit is formed in the tongue piece on the innermost peripheral side, and the first slit and the second slit are filled with resin.
中心軸は、前記基板の半径方向に一致するか、前記スリ
ットの中心部における半径方向に対して４５°以内であ
ることを特徴とする請求項１記載のサーキュラソー用基
板。2. The center axis in the swing width of the zigzag kerf is coincident with the radial direction of the substrate or is within 45 ° with respect to the radial direction in the central portion of the slit. The substrate for a circular saw according to claim 1.
組み合わせた一対のスリットを、前記台金の周方向に等
間隔に形成したことを特徴とする請求項１または２記載
のサーキュラソー用基板。3. The circular saw substrate according to claim 1, wherein a pair of slits, which are a combination of the first slits and the second slits, are formed at equal intervals in the circumferential direction of the base metal. .
系、エポキシ系またはシリコン系のいずれかよりなる熱
硬化性樹脂であることを特徴とする請求項１〜３のいず
れかに記載のサーキュラソー用基板。4. The circular saw according to any one of claims 1 to 3, wherein the resin is a thermosetting resin made of any one of phenol, polyimide, epoxy and silicon. substrate.
Ｏ２のうちのいずれか一つまたは二つ以上を含有するこ
とを特徴とする請求項１〜４のいずれかに記載のサーキ
ュラソー用基板。5. The resin includes SiC, alumina, Si
The substrate for circular saw according to any one of claims 1 to 4, which contains any one or more of O 2 .
に、多結晶ダイヤモンド、単結晶ダイヤモンドまたはＣ
ＢＮ焼結体からなる切れ刃を接合したことを特徴とする
サーキュラソー。6. A polycrystalline diamond, a single crystal diamond or C on the outer periphery of the substrate according to claim 1.
A circular saw having a cutting edge made of a BN sintered body joined thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002151649A JP4236240B2 (en) | 2002-05-27 | 2002-05-27 | Circular saw substrate having a noise prevention function and circular saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002151649A JP4236240B2 (en) | 2002-05-27 | 2002-05-27 | Circular saw substrate having a noise prevention function and circular saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003340637A true JP2003340637A (en) | 2003-12-02 |
| JP4236240B2 JP4236240B2 (en) | 2009-03-11 |
Family
ID=29769160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002151649A Expired - Fee Related JP4236240B2 (en) | 2002-05-27 | 2002-05-27 | Circular saw substrate having a noise prevention function and circular saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4236240B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006142689A (en) * | 2004-11-22 | 2006-06-08 | Tenryu Saw Mfg Co Ltd | Disc cutter |
| CN104096907A (en) * | 2014-06-27 | 2014-10-15 | 苏州原点工业设计有限公司 | Efficient denoising handheld electric saw |
| US9463518B2 (en) | 2011-01-31 | 2016-10-11 | Black & Decker Inc. | Saw blade with reduced modal frequencies in the operating frequency range |
| US10279407B2 (en) | 2015-10-30 | 2019-05-07 | Black & Decker Inc. | Circular saw blades |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD813635S1 (en) | 2016-12-13 | 2018-03-27 | Black & Decker Inc. | Circular saw blade |
| JP7470877B2 (en) | 2021-09-23 | 2024-04-18 | 兼房株式会社 | Disk-shaped rotary tool |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190876A (en) * | 1984-10-08 | 1986-05-09 | Hiroshi Ishizuka | Super abrasive grain electrodeposition circular saw |
| JPS61187664U (en) * | 1985-05-15 | 1986-11-22 | ||
| JPS6234719A (en) * | 1985-08-01 | 1987-02-14 | Hiroshi Ishizuka | Circular saw for cutting hard material |
| JPH0453701A (en) * | 1990-06-22 | 1992-02-21 | Tani Seikiyo Kk | Metal base plate of circular saw |
| JPH07148612A (en) * | 1993-08-24 | 1995-06-13 | Fgw Forschungs Gemein Werkzeuge & Werkstoff Ev | Circular saw blade |
| JPH07241725A (en) * | 1994-03-05 | 1995-09-19 | Tani Tec:Kk | Rotary saw |
| JPH11129203A (en) * | 1997-10-28 | 1999-05-18 | Kanefusa Corp | Base metal for circular saw with vibration damping function |
| JPH11235668A (en) * | 1998-02-20 | 1999-08-31 | Norton Kk | Rotary substrate for round saw |
| JP2000120777A (en) * | 1998-10-14 | 2000-04-25 | Kanefusa Corp | Metal plate having damping function |
| JP2000153405A (en) * | 1998-11-19 | 2000-06-06 | Asahi Diamond Industrial Co Ltd | Saw blade |
| JP2001038525A (en) * | 1999-08-02 | 2001-02-13 | Tenryu Saw Mfg Co Ltd | Rotary saw |
-
2002
- 2002-05-27 JP JP2002151649A patent/JP4236240B2/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190876A (en) * | 1984-10-08 | 1986-05-09 | Hiroshi Ishizuka | Super abrasive grain electrodeposition circular saw |
| JPS61187664U (en) * | 1985-05-15 | 1986-11-22 | ||
| JPS6234719A (en) * | 1985-08-01 | 1987-02-14 | Hiroshi Ishizuka | Circular saw for cutting hard material |
| JPH0453701A (en) * | 1990-06-22 | 1992-02-21 | Tani Seikiyo Kk | Metal base plate of circular saw |
| JPH07148612A (en) * | 1993-08-24 | 1995-06-13 | Fgw Forschungs Gemein Werkzeuge & Werkstoff Ev | Circular saw blade |
| JPH07241725A (en) * | 1994-03-05 | 1995-09-19 | Tani Tec:Kk | Rotary saw |
| JPH11129203A (en) * | 1997-10-28 | 1999-05-18 | Kanefusa Corp | Base metal for circular saw with vibration damping function |
| JPH11235668A (en) * | 1998-02-20 | 1999-08-31 | Norton Kk | Rotary substrate for round saw |
| JP2000120777A (en) * | 1998-10-14 | 2000-04-25 | Kanefusa Corp | Metal plate having damping function |
| JP2000153405A (en) * | 1998-11-19 | 2000-06-06 | Asahi Diamond Industrial Co Ltd | Saw blade |
| JP2001038525A (en) * | 1999-08-02 | 2001-02-13 | Tenryu Saw Mfg Co Ltd | Rotary saw |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006142689A (en) * | 2004-11-22 | 2006-06-08 | Tenryu Saw Mfg Co Ltd | Disc cutter |
| JP4526933B2 (en) * | 2004-11-22 | 2010-08-18 | 天龍製鋸株式会社 | Disc cutter |
| US9463518B2 (en) | 2011-01-31 | 2016-10-11 | Black & Decker Inc. | Saw blade with reduced modal frequencies in the operating frequency range |
| US9821390B2 (en) | 2011-01-31 | 2017-11-21 | Black & Decker Inc. | Saw blade with reduced modal frequencies in the operating frequency range |
| CN104096907A (en) * | 2014-06-27 | 2014-10-15 | 苏州原点工业设计有限公司 | Efficient denoising handheld electric saw |
| US10279407B2 (en) | 2015-10-30 | 2019-05-07 | Black & Decker Inc. | Circular saw blades |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4236240B2 (en) | 2009-03-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4794835A (en) | Plate-like rotary body with vibration-suppressing characteristics and method of manufacturing same | |
| US20060243115A1 (en) | Circular saw having wiper tips | |
| JP2003340637A (en) | Base plate for circular saw having noise preventing function and circular saw | |
| US20030056633A1 (en) | Cutting disc core with noise reduction | |
| JP2006142689A (en) | Disc cutter | |
| US20140260878A1 (en) | Circular Saw Plate with Thickness Discontinuity | |
| JP4318254B2 (en) | Rotary saw substrate and rotary saw using the same | |
| JP2519166B2 (en) | Substrate for cutter | |
| JP2869731B2 (en) | Circular saw blade with silencing rivets | |
| JP4406302B2 (en) | Manufacturing method of rotary saw | |
| JP2005324295A (en) | Tip saw | |
| JP2000254822A (en) | Chip saw | |
| JPH06226638A (en) | Diamond blade | |
| CN221161021U (en) | Diamond saw blade | |
| JP2936219B2 (en) | Circular saw | |
| JP2000108039A (en) | Base plate for cutter | |
| JP2811294B2 (en) | Circular saw blade structure | |
| JP3211231U (en) | Tip saw | |
| KR200247030Y1 (en) | Circle saw structure | |
| CN214136732U (en) | Radian block tooth diamond saw blade | |
| JP3000263U (en) | Diamond blade | |
| JPH0847816A (en) | Circular saw | |
| CN215787188U (en) | Metal saw blade matrix with high material discharging efficiency | |
| JP2013173195A (en) | Circular saw blade | |
| KR200235727Y1 (en) | Device for reinforcing the shank of cutting wheel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050428 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080401 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080528 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080605 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080702 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080828 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080908 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20081215 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20081215 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4236240 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111226 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111226 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121226 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121226 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131226 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |