JP2003317060A - Ic card - Google Patents

Ic card

Info

Publication number
JP2003317060A
JP2003317060A JP2002118732A JP2002118732A JP2003317060A JP 2003317060 A JP2003317060 A JP 2003317060A JP 2002118732 A JP2002118732 A JP 2002118732A JP 2002118732 A JP2002118732 A JP 2002118732A JP 2003317060 A JP2003317060 A JP 2003317060A
Authority
JP
Japan
Prior art keywords
card
antenna coil
base material
card base
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002118732A
Other languages
Japanese (ja)
Inventor
Tsukasa Kusanagi
司 草薙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2002118732A priority Critical patent/JP2003317060A/en
Publication of JP2003317060A publication Critical patent/JP2003317060A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide a contactless IC card having a structure that prevents the connection state of the connection part between an antenna coil and an antenna coil connection terminal from being broken when stress is applied to the connection part. <P>SOLUTION: The IC card is provided with an IC module having a card base material wherein the antenna coil is incorporated, an insulating substrate in part of the card base material, an IC chip provided on the other surface side of the insulating substrate, and the antenna coil connection terminal connected to the IC chip, and characterized in that the card base material is equipped with a reinforcing plate reinforcing the connection part between the antenna coil connection terminal and the antenna coil. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、アンテナコイルを
用いて電磁誘導により通信を行うＩＣカードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card that communicates by electromagnetic induction using an antenna coil.

【０００２】[0002]

【従来技術】従来、カード基材のアンテナコイルとアン
テナコイル接続端子との接続は、導伝ペースト、ハン
ダ、ＡＣＦなどにより接続状態にしてある。しかしなが
ら、カード基材は、樹脂製であるために、カード基材に
曲げ応力が加わると、アンテナコイルとアンテナコイル
接続端子との接続部分が切断され、機能しなくなる危険
性がある。2. Description of the Related Art Conventionally, an antenna coil of a card base material and an antenna coil connecting terminal are connected to each other by a conductive paste, solder, ACF or the like. However, since the card base material is made of resin, if a bending stress is applied to the card base material, there is a risk that the connection portion between the antenna coil and the antenna coil connection terminal will be cut off and will not function.

【０００３】[0003]

【発明が解決しようとする課題】そこで、本発明は、カ
ード基材に曲げ応力が加わった場合でも、アンテナコイ
ルとアンテナコイル接続端子との接続部分に応力が加わ
ることで、接続部分の接続状態が切断されることを防止
した構造を有するＩＣカードを提供する。Therefore, according to the present invention, even when bending stress is applied to the card substrate, stress is applied to the connecting portion between the antenna coil and the antenna coil connecting terminal, so that the connection state of the connecting portion is improved. (EN) Provided is an IC card having a structure for preventing the disconnection.

【０００４】[0004]

【課題を解決するための手段】本発明のＩＣカードは、
アンテナコイルが内蔵されたカード基材と、前記カード
基材の一部に、絶縁性基板と、該絶縁性基板の他方の面
側に設けられたＩＣチップと該ＩＣチップに接続された
アンテナコイル接続端子とを有するＩＣモジュールが設
けられたＩＣカードであって、前記カード基材に、前記
アンテナコイル接続端子と前記アンテナコイルとの接続
部を補強する補強板が具備されていることを特徴とす
る。The IC card of the present invention comprises:
A card base material having an antenna coil built-in, an insulating substrate on a part of the card base material, an IC chip provided on the other surface side of the insulating substrate, and an antenna coil connected to the IC chip An IC card provided with an IC module having a connection terminal, wherein the card base material is provided with a reinforcing plate that reinforces a connection portion between the antenna coil connection terminal and the antenna coil. To do.

【０００５】また、本発明のＩＣカードは、前記補強板
が、シート形状を有し、前記絶縁性基板と平行に設けら
れていることを特徴とする。Further, the IC card of the present invention is characterized in that the reinforcing plate has a sheet shape and is provided in parallel with the insulating substrate.

【０００６】更に、本発明のＩＣカードは、前記補強板
が、前記カード基材を構成する重ね合わされた複数のシ
ートの間に設けられていることを特徴とする。Further, the IC card of the present invention is characterized in that the reinforcing plate is provided between a plurality of stacked sheets which constitute the card base material.

【０００７】また、本発明のＩＣカードは、前記ＩＣカ
ードが、接触非接触共用ＩＣカードであることを特徴と
する。Also, the IC card of the present invention is characterized in that the IC card is a contact / contactless shared IC card.

【０００８】[0008]

【発明の実施の形態】以下、本発明のＩＣカードの実施
形態について図面を参照して説明する。図１は、本発明
のＩＣカードに係る実施形態の平面図、図２は、図１の
Ａ−Ａ線断面図、図３は、本発明のＩＣカードに用いる
ＩＣモジュールの断面図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an IC card of the present invention will be described below with reference to the drawings. 1 is a plan view of an embodiment of an IC card of the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is a sectional view of an IC module used in the IC card of the present invention.

【０００９】本発明のＩＣカード１は、アンテナコイル
２が内蔵されたカード基材３と、カード基材３の一部に
形成された凹部４に埋設されたＩＣモジュール７とを有
している。カード基材３は、積層された２枚のコアシー
ト５ａ，５ｂと、このコアシート５ａ，５ｂの両面にそ
れぞれ積層されたオーバーシート６ａ，６ｂとが、接着
剤を介してまたは介さずに、プレス機により加圧加熱し
て一体化されている。The IC card 1 of the present invention has a card base material 3 in which the antenna coil 2 is built in, and an IC module 7 embedded in a recess 4 formed in a part of the card base material 3. . The card base material 3 includes two core sheets 5a and 5b that are laminated, and over sheets 6a and 6b that are laminated on both surfaces of the core sheets 5a and 5b, respectively, with or without an adhesive. It is integrated by pressing and heating with a press machine.

【００１０】カード基材には、塩化ビニール樹脂やＰＥ
Ｔの他、各種の材料を採用でき、例えば、ポリプロピレ
ン樹脂、ポリカーボネート樹脂、アクリル樹脂、ポリス
チレン樹脂、ＡＢＳ樹脂、ポリアミド樹脂、ポリアセタ
ール樹脂等が挙げられる。The card base material is vinyl chloride resin or PE.
In addition to T, various materials can be adopted, and examples thereof include polypropylene resin, polycarbonate resin, acrylic resin, polystyrene resin, ABS resin, polyamide resin, polyacetal resin and the like.

【００１１】カード基材３に形成されたアンテナコイル
２は、塩化ビニール、ポリエチレンテレフタレート（Ｐ
ＥＴ）等のコアシート５ａ上に、フォトエッチングや導
電性インキ等によるスクリーン印刷により、ループを形
成したアンテナコイル２のレイアウトが描かれることで
設けられている。したがって、アンテナコイル２は、カ
ード基材３に内蔵され、カード表面に表れない。The antenna coil 2 formed on the card substrate 3 is made of vinyl chloride, polyethylene terephthalate (P
It is provided by drawing the layout of the loop-formed antenna coil 2 on the core sheet 5a such as ET) by screen-printing with photo-etching or conductive ink or the like. Therefore, the antenna coil 2 is built in the card base material 3 and does not appear on the card surface.

【００１２】また、ＩＣモジュール７は、絶縁性基板８
と、この絶縁性基板８の一方の面に形成された外部装置
用の接続端子９と、絶縁性基板８の他方の面側に設けら
れたＩＣチップ１０と該ＩＣチップ１０に接続された配
線パターン１１とを有している。ＩＣチップ１０と配線
パターン１１とは、チップ接続ワイヤ１２ａにより接続
され、更に配線パターン１１の底面の所定部分と、アン
テナコイル２の端部とが導伝ペースト１３により接続状
態となっている。The IC module 7 has an insulating substrate 8
A connecting terminal 9 for an external device formed on one surface of the insulating substrate 8, an IC chip 10 provided on the other surface side of the insulating substrate 8, and a wiring connected to the IC chip 10. Pattern 11. The IC chip 10 and the wiring pattern 11 are connected by a chip connection wire 12a, and a predetermined portion of the bottom surface of the wiring pattern 11 and the end of the antenna coil 2 are connected by the conductive paste 13.

【００１３】また、外部装置用の接続端子９とＩＣチッ
プ１０とは、図３に示すように、絶縁性基板８に形成さ
れたボンディングホール１５を通じて、チップ接続ワイ
ヤ１２ｂと直接接続されている。Further, the connection terminal 9 for the external device and the IC chip 10 are directly connected to the chip connection wire 12b through the bonding hole 15 formed in the insulating substrate 8 as shown in FIG.

【００１４】そして、図１に示すように、カード基材３
を平面状態とした場合に、導伝ペースト１３によるアン
テナ接続配線パターン１１とアンテナコイル２との接続
部と重なる位置を含む領域には、カード基材３を構成す
る積層された２枚のコアシート５ａ，５ｂの間に、この
接続部を曲げ応力などから補強するための補強板１４が
それぞれ備えられている。Then, as shown in FIG. 1, the card substrate 3
In a planar state, in the area including the position where the conductive paste 13 overlaps the connection portion between the antenna connection wiring pattern 11 and the antenna coil 2, the two core sheets stacked to form the card substrate 3 are stacked. Reinforcing plates 14 are provided between 5a and 5b to reinforce this connecting portion from bending stress and the like.

【００１５】カード基材３に補強板１４を内蔵する場合
には、２枚のコアシート５ａ，５ｂと、このコアシート
５ａ，５ｂの両面にそれぞれ積層されたオーバーシート
６ａ，６ｂとを重ね合わせる際に、補強板１４を２枚の
コアシート５ａ，５ｂの間に挟み込んだ状態として、接
着剤を介してまたは介さずに、プレス機により加圧加熱
して一体化することで設ける。When the reinforcing plate 14 is built in the card base material 3, two core sheets 5a and 5b and oversheets 6a and 6b respectively laminated on both sides of the core sheets 5a and 5b are superposed. At this time, the reinforcing plate 14 is provided by sandwiching it between the two core sheets 5a and 5b by pressurizing and heating with a press machine to integrate them with or without an adhesive.

【００１６】この補強板１４としては、例えばガラスエ
ポキシ樹脂、ステンレス、セラミック等が使用され、ま
た、補強板１４の厚みは、５０μｍ程度のシート状もの
が適応され、特にカード基材３の長手方向に対する曲げ
応力からアンテナ接続配線パターン１１とアンテナコイ
ル２との接続部の接着への影響を少なくするために、こ
のシート状の補強板１４を絶縁性基板８と平行に設ける
ことが好ましい。As the reinforcing plate 14, for example, glass epoxy resin, stainless steel, ceramics or the like is used, and the reinforcing plate 14 is a sheet having a thickness of about 50 μm. In order to reduce the influence of bending stress on the connection between the antenna connection wiring pattern 11 and the antenna coil 2 on the adhesive, it is preferable to provide the sheet-shaped reinforcing plate 14 in parallel with the insulating substrate 8.

【００１７】[0017]

【発明の効果】以上のように、本発明のＩＣカードは、
カード基材内部のアンテナコイル接続端子とアンテナコ
イルとの接続部付近に補強板が設けられているので、カ
ード基材に曲げ応力が加わった場合でも、アンテナコイ
ル接続端子とアンテナコイルとを接続している導伝ペー
ストの部分に応力が加わりにくいので、これらの接続状
態が切断されることを防止することができるという効果
がある。As described above, the IC card of the present invention is
Since the reinforcing plate is provided near the connection between the antenna coil connection terminal and the antenna coil inside the card base material, the antenna coil connection terminal and antenna coil can be connected even when bending stress is applied to the card base material. Since stress is less likely to be applied to the portion of the conductive paste that is formed, it is possible to prevent disconnection of these connected states.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のＩＣカードに係る実施形態の平面図で
ある。FIG. 1 is a plan view of an embodiment of an IC card of the present invention.

【図２】図１のＡ−Ａ線断面図である。FIG. 2 is a sectional view taken along the line AA of FIG.

【図３】本発明のＩＣカードに用いるＩＣモジュールの
断面図である。FIG. 3 is a cross-sectional view of an IC module used in the IC card of the present invention.

【符号の説明】[Explanation of symbols]

１ 本発明の実施形態のＩＣカード ２ アンテナコイル ３ カード基材 ４ 凹部 ５ａ，５ｂ コアシート ６ａ，６ｂ オーバーシート ７ ＩＣモジュール ８ 絶縁性基板 ９ 外部装置用の接続端子 １０ ＩＣチップ １１ 配線パターン １２ チップ接続ワイヤ １３ 導伝ペースト １４ 補強板 １５ ボンディングホール 1 IC card according to an embodiment of the present invention 2 antenna coil 3 card base materials 4 recess 5a, 5b core sheet 6a, 6b Oversheet 7 IC module 8 Insulating substrate 9 Connection terminals for external devices 10 IC chip 11 wiring pattern 12 chip connection wire 13 Derivative paste 14 Reinforcement plate 15 Bonding hole

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 アンテナコイルが内蔵されたカード基材
と、前記カード基材の一部に、絶縁性基板と、該絶縁性
基板の他方の面側に設けられたＩＣチップと該ＩＣチッ
プに接続されたアンテナコイル接続端子とを有するＩＣ
モジュールが設けられたＩＣカードであって、 前記カード基材に、前記アンテナコイル接続端子と前記
アンテナコイルとの接続部を補強する補強板が具備され
ていることを特徴とするＩＣカード。1. A card base material having an antenna coil built-in, an insulating substrate on a part of the card base material, an IC chip provided on the other surface side of the insulating substrate, and the IC chip. IC having connected antenna coil connection terminal
An IC card provided with a module, characterized in that the card base material is provided with a reinforcing plate that reinforces a connection portion between the antenna coil connection terminal and the antenna coil. 【請求項２】 前記補強板が、シート形状を有し、前記
絶縁性基板と平行に設けられていることを特徴とする請
求項１記載のＩＣカード。2. The IC card according to claim 1, wherein the reinforcing plate has a sheet shape and is provided in parallel with the insulating substrate. 【請求項３】 前記補強板が、前記カード基材を構成す
る重ね合わされた複数のシートの間に設けられているこ
とを特徴とする請求項１記載のＩＣカード。3. The IC card according to claim 1, wherein the reinforcing plate is provided between a plurality of stacked sheets that form the card base material. 【請求項４】 前記ＩＣカードが、接触非接触共用ＩＣ
カードであることを特徴とする請求項１記載のＩＣカー
ド。4. The IC card is a contact / contactless shared IC
The IC card according to claim 1, which is a card.
JP2002118732A 2002-04-22 2002-04-22 Ic card Withdrawn JP2003317060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002118732A JP2003317060A (en) 2002-04-22 2002-04-22 Ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002118732A JP2003317060A (en) 2002-04-22 2002-04-22 Ic card

Publications (1)

Publication Number Publication Date
JP2003317060A true JP2003317060A (en) 2003-11-07

Family

ID=29535488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002118732A Withdrawn JP2003317060A (en) 2002-04-22 2002-04-22 Ic card

Country Status (1)

Country Link
JP (1) JP2003317060A (en)

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US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
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