JP2003309077A - Method for measuring temperature of vertical furnace and method for heat treating and boat used therefor - Google Patents
Method for measuring temperature of vertical furnace and method for heat treating and boat used thereforInfo
- Publication number
- JP2003309077A JP2003309077A JP2002114338A JP2002114338A JP2003309077A JP 2003309077 A JP2003309077 A JP 2003309077A JP 2002114338 A JP2002114338 A JP 2002114338A JP 2002114338 A JP2002114338 A JP 2002114338A JP 2003309077 A JP2003309077 A JP 2003309077A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- boat
- vertical
- processed
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、縦型炉の温度測定
方法及び熱処理方法並びにそれに用いるボートに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature measuring method and heat treatment method for a vertical furnace, and a boat used therefor.
【０００２】[0002]
【背景技術及び発明が解決しようとする課題】酸化、拡
散処理等に用いられる縦型炉では、ボートに搭載された
複数枚の被処理対を一度にバッチ処理している。この複
数枚の被処理体間の処理の均一性を確保するには、縦型
炉内の処理ゾーンにて温度の均一性を確保することが極
めて重要である。BACKGROUND ART In a vertical furnace used for oxidation, diffusion, etc., a plurality of processed pairs mounted on a boat are batch processed at once. In order to ensure the processing uniformity among the plurality of objects to be processed, it is extremely important to ensure the temperature uniformity in the processing zone in the vertical furnace.
【０００３】従来、縦型炉内の温度分布を測定するため
に、縦型反応容器（プロセスチューブ）とその周囲のヒ
ータとの間の空間に、熱電対などの温度検出部を配置
し、処理中に亘って縦型反応容器内の温度分布を測定
し、その測定結果に基づいて、ゾーン分割された各ヒー
タを温度制御していた。Conventionally, in order to measure the temperature distribution in a vertical furnace, a temperature detecting part such as a thermocouple is arranged in a space between a vertical reaction vessel (process tube) and a heater around the vertical reaction vessel to perform processing. The temperature distribution in the vertical reaction vessel was measured throughout, and the temperature of each zone-divided heater was controlled based on the measurement result.
【０００４】本発明は、より精度の高いヒータ制御を実
現できる縦型炉の温度測定方法及び熱処理方法並びにそ
れに用いるボートを提供することを目的とする。An object of the present invention is to provide a vertical furnace temperature measuring method and heat treatment method capable of realizing more accurate heater control, and a boat used therefor.
【０００５】[0005]
【課題を解決するための手段】本発明の一態様に係る縦
型炉の温度測定方法は、ボートに複数の被処理体と温度
検出部とを搭載し、縦型反応管内の処理位置に設定する
工程と、前記縦型反応管内を、ヒータにより所定温度に
設定する工程と、前記ボートに搭載された温度検出部に
より、前記ボート雰囲気の温度分布を測定する工程とを
有する。According to one embodiment of the present invention, there is provided a vertical furnace temperature measuring method, in which a boat is provided with a plurality of objects to be processed and a temperature detecting portion, and the temperature is set at a processing position in a vertical reaction tube. And a step of setting the inside of the vertical reaction tube to a predetermined temperature with a heater, and a step of measuring a temperature distribution of the boat atmosphere by a temperature detection unit mounted on the boat.
【０００６】ボートに搭載された被処理体の近傍にて温
度検出が可能となり、検出精度を高めてより正確な温度
設定が可能となる。The temperature can be detected in the vicinity of the object to be processed mounted on the boat, and the detection accuracy can be improved to set the temperature more accurately.
【０００７】ボート雰囲気の温度分布を測定するには、
温度検出部に設けられた少なくとも一つの温度検出素子
を縦軸方向に沿って移動させてもよいし、縦軸方向に沿
って設けられた複数の温度検出素子によりそれぞれ温度
検出してもよい。To measure the temperature distribution of the boat atmosphere,
At least one temperature detecting element provided in the temperature detecting unit may be moved along the vertical axis direction, or the temperature may be detected by each of the plurality of temperature detecting elements provided along the vertical axis direction.
【０００８】温度測定に用いられるボートでは、両端の
フランジを連結する複数の支柱に被処理体が支持され
る。温度検出部は、その複数の支柱の少なくとも１本に
設けられた中空部に配置してもよく、あるいは被処理体
の支持機能を有しない別の少なくとも１本の支柱に設け
られた中空部に設けても良い。In a boat used for temperature measurement, an object to be processed is supported by a plurality of columns connecting flanges at both ends. The temperature detecting portion may be arranged in a hollow portion provided in at least one of the plurality of columns, or in a hollow portion provided in another at least one column having no function of supporting the object to be processed. It may be provided.
【０００９】本発明の一態様に係る縦型炉の温度測定で
は、ボートにはダミーの被処理体を搭載することができ
る。この場合、実処理前にボート雰囲気の温度分布が予
備測定される。このとき、縦型反応管内には、実処理中
に導入されるガスと実質的に同じ供給量にて、不活性ガ
スを導入することができる。ガス流量に依存して温度が
変化するため、流量は実質的同一とするが、予備温度測
定時にはプロセスガスは不要であるので、不活性ガスを
用いることができる。In the temperature measurement of the vertical furnace according to one aspect of the present invention, a dummy object to be processed can be mounted on the boat. In this case, the temperature distribution of the boat atmosphere is preliminarily measured before the actual processing. At this time, the inert gas can be introduced into the vertical reaction tube at substantially the same supply amount as the gas introduced during the actual treatment. Since the temperature changes depending on the gas flow rate, the flow rates are substantially the same, but an inert gas can be used because the process gas is not required during the preliminary temperature measurement.
【００１０】本発明の他の態様に係る熱処理方法は、ダ
ミー被処理体を用いた上述の温度予備測定工程と、実処
理用ボートに複数の被処理体を搭載して、前記縦型反応
管内の処理位置に前記実処理用ボートを設定する工程
と、前記反応管内を前記ヒータによりプロセス温度に設
定すると共に、プロセスガスを導入して前記複数の被処
理体を熱処理する工程と、前記ヒータにより昇温される
温度を、前記反応管外で測定する工程と、前記反応管外
で測定された温度を、前記温度予備測定工程により測定
された温度分布に基づいて修正して、前記ヒータを制御
する工程とを有する。In a heat treatment method according to another aspect of the present invention, the above-mentioned temperature preliminary measurement step using a dummy object to be processed and a plurality of objects to be processed are mounted on an actual processing boat, The step of setting the actual processing boat at the processing position, the step of setting the process temperature in the reaction tube by the heater, the step of introducing a process gas to heat-treat the plurality of objects, and the heater. The step of measuring the temperature to be raised outside the reaction tube, the temperature measured outside the reaction tube are corrected based on the temperature distribution measured in the temperature preliminary measurement step, and the heater is controlled. And a step of performing.
【００１１】実処理時には縦型反応管外にてヒータの昇
温を測定しながらも、事前に測定した被処理体近傍の温
度測定データにより補正ができるので、より正確なヒー
タ制御が可能である。Even when the temperature rise of the heater is measured outside the vertical reaction tube during actual processing, the temperature can be corrected based on the temperature measurement data in the vicinity of the object to be processed, so that more accurate heater control is possible. .
【００１２】本発明のさらに他の態様に係るボートは、
被処理体の支持機能と温度検出部の搭載機能とを併せ持
つ構造を定義している。A boat according to still another aspect of the present invention is
It defines a structure that has both the function of supporting the object to be processed and the function of mounting the temperature detector.
【００１３】[0013]
【発明の実施の形態】以下、本発明の一実施形態につい
て、図面を参照して説明する。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.
【００１４】（縦型熱処理炉及び実処理用ボートの説
明）図１は、本発明の一実施形態に用いられる縦型熱処
理炉の一例を示す断面図である。図１において、この縦
型熱処理炉１０は、アウターシェル１２の内側に断熱材
１４が設けられ、この断熱材１４に複数ゾーン例えば３
ゾーンに分割されたヒータ１６が設けられている。この
ヒータ１６に囲まれた領域に、石英製のプロセスチュー
ブ（縦型反応管）１８が配置されている。このプロセス
チューブ１８には、ガス導入管２０と排気管２２が連結
されている。(Description of Vertical Heat Treatment Furnace and Actual Treatment Boat) FIG. 1 is a sectional view showing an example of a vertical heat treatment furnace used in an embodiment of the present invention. In FIG. 1, this vertical heat treatment furnace 10 is provided with a heat insulating material 14 inside an outer shell 12, and the heat insulating material 14 has a plurality of zones, for example, 3
A heater 16 divided into zones is provided. A process tube (vertical reaction tube) 18 made of quartz is arranged in a region surrounded by the heater 16. A gas introduction pipe 20 and an exhaust pipe 22 are connected to the process tube 18.
【００１５】プロセスチューブ１８内に挿脱される熱処
理治具であるボート３０は、ボートエレベータ３２に配
置された保温筒３４上に立設して支持される。このボー
ト３０には、複数枚の被処理体例えば半導体ウエハ３６
が水平に支持され、一度に複数枚の半導体ウエハ３６が
バッチ処理される。このボート３０は、両端のフランジ
３０Ａ，３０Ｂと、それらを連結する支柱３０Ｃを有
し、各支柱３０Ｃには半導体ウエハ３６を支持する溝
（図示せず）が設けられている。The boat 30, which is a heat treatment jig to be inserted into and removed from the process tube 18, is erected and supported on a heat retaining cylinder 34 arranged in the boat elevator 32. In this boat 30, a plurality of objects to be processed, for example, semiconductor wafers 36
Are horizontally supported, and a plurality of semiconductor wafers 36 are batch processed at one time. The boat 30 has flanges 30A and 30B at both ends and columns 30C connecting them, and each column 30C is provided with a groove (not shown) for supporting the semiconductor wafer 36.
【００１６】プロセスチューブ１８とヒータ１６との間
の空間に、この縦型熱処理炉１０に常設された、例えば
熱電対などにて形成された第１の温度検出部４０が設け
られている。この第１の温度検出部４０は、プロセスチ
ューブ１８の外に配置されることで、プロセスの悪影響
を受けないようにしている。この第１の温度検出部４０
がプロセスチューブ１８内に配置されると、例えばその
表面の汚染などによって検出温度が経時的に変化するか
らである。In the space between the process tube 18 and the heater 16, there is provided a first temperature detector 40, which is permanently installed in the vertical heat treatment furnace 10 and formed by, for example, a thermocouple. The first temperature detector 40 is arranged outside the process tube 18 so that the process is not adversely affected. This first temperature detector 40
This is because, when is placed in the process tube 18, the detected temperature changes with time due to, for example, contamination of the surface thereof.
【００１７】この第１の温度検出部４０にて、縦型熱処
理炉１０の縦軸方向の各位置での温度が検出されて、熱
処理中での処理ゾーンの温度分布が計測される。計測さ
れた温度分布は、メモリ５０に予め格納された補正用温
度データに基づいて温度制御部５２にて補正され、その
補正後の温度分布に基づいて、ヒータ１６を各ゾーン毎
に独立して制御している。The first temperature detector 40 detects the temperature at each position in the vertical axis direction of the vertical heat treatment furnace 10 and measures the temperature distribution in the treatment zone during the heat treatment. The measured temperature distribution is corrected by the temperature control unit 52 based on the correction temperature data stored in the memory 50 in advance, and the heater 16 is independently provided for each zone based on the corrected temperature distribution. Have control.
【００１８】図１に示すメモリ５０に格納される補正用
温度データの計測に用いられる、温度計測用ボート６０
の一例を図２に示す。図２に示すボート６０も、図１に
示す処理用ボート３０と同様に、両端のフランジ６１，
６２と、それら連結する複数の例えば５本の支柱６３を
有する。保温筒３４に搭載される側のフランジ６２に
は、保温筒３４に係止される被係止部６２Ａが設けられ
ている。図３に示すように、４本の支柱６３は中実構造
であり、図１の処理用ボート３０と同じく、半導体ウエ
ハ３６と同じ形状のダミーウエハ３６Ａを支持する支持
部として例えば溝６３Ａが形成されている。残りの１本
の支柱６３は、半導体ウエハ３６を支持する機能は無
く、図３及び図４に示すように中空部６４を有してい
る。この中空部６４内には、図４に示すように、補正用
温度データを測定するための第２の温度検出部６５が配
置される。この第２の温度検出部６５は、縦軸方向の複
数箇所に温度検出素子例えば熱電対を有する。A temperature measuring boat 60 used for measuring the correction temperature data stored in the memory 50 shown in FIG.
An example is shown in FIG. The boat 60 shown in FIG. 2 also has flanges 61 at both ends, similar to the processing boat 30 shown in FIG.
62 and a plurality of, for example, five support columns 63 connected to each other. The flange 62 on the side mounted on the heat retaining cylinder 34 is provided with a locked portion 62A that is locked to the heat retaining cylinder 34. As shown in FIG. 3, the four pillars 63 have a solid structure, and like the processing boat 30 of FIG. ing. The remaining one pillar 63 does not have a function of supporting the semiconductor wafer 36, and has a hollow portion 64 as shown in FIGS. 3 and 4. In the hollow portion 64, as shown in FIG. 4, a second temperature detecting portion 65 for measuring the correction temperature data is arranged. The second temperature detecting section 65 has temperature detecting elements such as thermocouples at a plurality of positions in the vertical axis direction.
【００１９】（温度補正データの測定工程）図１のメモ
リ５０に格納される補正用温度データは、例えば洗浄の
ためにプロセスチューブが交換される毎に計測される。
このために、図１に示す実処理用ボート３０に代えて、
図２〜４に示す温度計測用ボート６０が用いられる。(Step of Measuring Temperature Correction Data) The correction temperature data stored in the memory 50 of FIG. 1 is measured every time the process tube is replaced for cleaning, for example.
For this purpose, instead of the actual processing boat 30 shown in FIG.
The temperature measurement boat 60 shown in FIGS. 2 to 4 is used.
【００２０】この温度計測用ボート６０には、図２に示
す通りダミーウエハ３６Ａが、実処理時と同じ枚数だけ
搭載される。As shown in FIG. 2, dummy wafers 36A are mounted on the temperature measuring boat 60 in the same number as in the actual processing.
【００２１】この温度計測用ボート６０を図１に示す保
温筒３４に立設させ、ボートエレベータ３２を上昇させ
る。これにより、図１に示す実処理用ボート３０と同じ
く、縦型熱処理炉１０の処理位置に温度計測用ボート６
０が配置される（図５参照）。The temperature measuring boat 60 is erected on the heat retaining cylinder 34 shown in FIG. 1 and the boat elevator 32 is raised. As a result, like the actual processing boat 30 shown in FIG. 1, the temperature measuring boat 6 is placed at the processing position of the vertical heat treatment furnace 10.
0 is placed (see FIG. 5).
【００２２】この後、ガス導入管２０よりガスを導入し
ながら、ガス排気管２２にて排気させると共に、ヒータ
１６を実処理時と同じように昇温させる。なお、ガス導
入管２０より導入されるガスは、実処理時と同じ流量に
て同じガスを導入してもよいが、不活性ガスのみを導入
しても良い。補正用温度データの測定時には、熱処理を
行う必要が無いからである。ただし、不活性ガスの流量
は実処理時に導入される全てのガスのトータル流量と実
質的に同じとすることが好ましい。ガス流量に依存して
ボート６０の雰囲気温度が変化するからであり、補正用
温度測定時にも実処理時と同じ条件（ガス種とウエハが
ダミーである点とが異なる）とすることが好ましいから
である。Thereafter, while introducing gas from the gas introducing pipe 20, the gas is exhausted through the gas exhaust pipe 22 and the heater 16 is heated in the same manner as in the actual processing. As the gas introduced from the gas introduction pipe 20, the same gas may be introduced at the same flow rate as in the actual processing, but only the inert gas may be introduced. This is because it is not necessary to perform heat treatment when measuring the correction temperature data. However, it is preferable that the flow rate of the inert gas is substantially the same as the total flow rate of all the gases introduced during the actual treatment. This is because the atmospheric temperature of the boat 60 changes depending on the gas flow rate, and it is preferable to set the same conditions as in actual processing (difference in gas type and dummy wafer) when measuring the correction temperature. Is.
【００２３】以上の条件下で、縦型熱処理炉の縦軸方向
の各位置での温度を、プロセスチューブ１８の外側に配
置された第１の温度検出部４０と、ボート６０に搭載さ
れた第２の温度検出部６５とにより、それぞれ検出す
る。Under the above conditions, the temperature at each position in the vertical axis direction of the vertical heat treatment furnace is controlled by the first temperature detecting section 40 arranged outside the process tube 18 and the first temperature detecting section 40 mounted on the boat 60. The temperature detector 65 and the temperature detector 65 of FIG.
【００２４】図５に示すように、ボート６０に搭載され
た第２の温度検出部６５は、プロセスチューブ１８内に
配置されると共に、同じくボート６０に搭載されたダミ
ーウエハ３６Ａの直ぐ近くにて温度検出が可能である。
一方、第１の温度検出部４０はプロセスチューブ１８の
外側に配置されることで、プロセスチューブ１８内のガ
スの影響を受けないばかりか、第２の温度検出部６５よ
りもヒータ１６に近い位置に配置されている。よって、
縦軸方向にて同じ位置であっても、第１，第２の温度検
出部４０，６５での各検出温度間には格差が生じてい
る。本来、熱処理されるウエハの近くの温度を測定する
ことが望ましいので、第２の温度検出部６５にて検出さ
れた温度により、第１の温度検出部４０にて検出された
温度を補正すれば、精度の高い温度検出が可能となる。As shown in FIG. 5, the second temperature detector 65 mounted on the boat 60 is disposed in the process tube 18, and the temperature is set in the immediate vicinity of the dummy wafer 36A also mounted on the boat 60. It can be detected.
On the other hand, the first temperature detection unit 40 is arranged outside the process tube 18, so that the first temperature detection unit 40 is not affected by the gas in the process tube 18 and is closer to the heater 16 than the second temperature detection unit 65. It is located in. Therefore,
Even at the same position in the vertical axis direction, there is a difference between the temperatures detected by the first and second temperature detectors 40 and 65. Originally, it is desirable to measure the temperature in the vicinity of the wafer to be heat-treated, so that the temperature detected by the first temperature detection unit 40 should be corrected by the temperature detected by the second temperature detection unit 65. It is possible to detect the temperature with high accuracy.
【００２５】本実施の形態では、縦軸方向にて同じ位置
にある第１，第２の温度検出部４０，６５の温度検出素
子にて、それぞれ温度検出される。そして、例えば温度
制御部５２が、同じ高さ位置の２種の検出温度間の差分
を求め、この差分が補正用温度データとして各位置毎に
図１のメモリ５０に記憶される。必要により、ヒータ１
６の昇温開始から所定時間毎に上述の温度検出を行い、
その所定時間毎に、第１，第２の温度検出部４０，６５
での各検出温度間の差分を温度制御部５２が求め、その
差分をメモリ５０に記憶させても良い。In the present embodiment, the temperature is detected by the temperature detecting elements of the first and second temperature detecting portions 40 and 65 located at the same position in the vertical axis direction. Then, for example, the temperature control unit 52 obtains a difference between two types of detected temperatures at the same height position, and the difference is stored in the memory 50 of FIG. 1 as correction temperature data for each position. If necessary, heater 1
The above temperature detection is performed every predetermined time from the start of the temperature rise of 6,
At every predetermined time, the first and second temperature detecting units 40, 65
The temperature control unit 52 may obtain the difference between the respective detected temperatures and the difference may be stored in the memory 50.
【００２６】（実処理工程）この実処理工程では、図１
に示す実処理用ボート３０に半導体ウエハ３６を搭載
し、保温筒３４に立設させて、ボートエレベータ３２に
よりボート３０をプロセスチューブ１８内に搬入させ
る。(Actual Processing Step) In this actual processing step, as shown in FIG.
The semiconductor wafer 36 is mounted on the actual processing boat 30 shown in FIG. 1, is set upright on the heat insulating cylinder 34, and the boat 30 is carried into the process tube 18 by the boat elevator 32.
【００２７】この後、ガス導入管２０よりプロセスガス
を導入し、ヒータ１６を昇温させる。このとき、第１の
温度検出部４０にて縦軸方向の各位置の温度を検出す
る。図１に示す温度制御部５２では、検出された温度を
メモリ５０内の補正用温度データに基づいて、半導体ウ
エハ３６近傍の温度に補正する。そして、その補正後の
温度データに基づいてヒータ１６を制御して、熱処理中
の処理ゾーンの温度が設定されたプロセス温度としてほ
ぼ均一になるようにフィードバック制御する。Thereafter, the process gas is introduced through the gas introduction pipe 20 to raise the temperature of the heater 16. At this time, the first temperature detection unit 40 detects the temperature at each position in the vertical axis direction. The temperature controller 52 shown in FIG. 1 corrects the detected temperature to a temperature near the semiconductor wafer 36 based on the correction temperature data in the memory 50. Then, the heater 16 is controlled based on the corrected temperature data, and feedback control is performed so that the temperature of the processing zone during the heat treatment becomes substantially uniform as the set process temperature.
【００２８】（温度計測用ボートの変形例）図６に示す
温度計測用ボート７０には、中空部６４内にて縦軸方向
に移動可能な例えば一つの温度検出素子例えば熱電対を
有する第２の温度検出部７１が設けられている。なお、
第２の温度検出部７１に複数の熱電対を設けても良い。
この第２の温度検出部７１は、上下動機構７２により上
下動可能となっている。(Modified Example of Temperature Measuring Boat) The temperature measuring boat 70 shown in FIG. 6 has, for example, a second temperature detecting element movable in the longitudinal direction within the hollow portion 64, such as one temperature detecting element such as a thermocouple. The temperature detecting section 71 is provided. In addition,
A plurality of thermocouples may be provided in the second temperature detector 71.
The second temperature detecting section 71 can be moved up and down by a vertical movement mechanism 72.
【００２９】この温度補正用ボート７０を図５のボート
６０に代えて用いる場合、上下動機構７２により第２の
温度検出部７１を縦軸方向にて移動させ、少なくとも一
つの熱電対によって複数箇所での温度が検出される。そ
の他の動作は図５の場合と全く同じである。この温度検
出は、第２の温度検出部７１を停止させる度に行っても
よいし、比較的低速にて連続移動中に実施しても良い。When the temperature compensating boat 70 is used in place of the boat 60 of FIG. 5, the vertical movement mechanism 72 moves the second temperature detecting portion 71 in the vertical axis direction, and at least one thermocouple couples it to a plurality of locations. The temperature at is detected. Other operations are exactly the same as in the case of FIG. This temperature detection may be performed every time the second temperature detection unit 71 is stopped, or may be performed during continuous movement at a relatively low speed.
【００３０】（その他の変形例）図２〜図４では、ダミ
ーウエハ３６Ａを支持する４本の支柱６３以外にさらに
もう１本の中空構造の支柱６３を設けた。この他、ダミ
ーウエハ３６Ａを支持する４本の支柱６３の少なくとも
１本を中空構造とし、それに第２の温度検出部６５また
は７１を搭載しても良い。すなわち、ダミーウエハ３６
Ａの支持機能と第２の温度検出部６５，７１の搭載機能
とを、少なくとも１本の支柱６３にて兼用させても良
い。(Other Modifications) In FIGS. 2 to 4, in addition to the four columns 63 for supporting the dummy wafer 36A, another column 63 having a hollow structure is provided. In addition, at least one of the four columns 63 supporting the dummy wafer 36A may have a hollow structure, and the second temperature detector 65 or 71 may be mounted therein. That is, the dummy wafer 36
The support function of A and the mounting function of the second temperature detection units 65 and 71 may be combined by at least one support column 63.
【００３１】上述した補正用温度測定工程は、実処理工
程の前に実施したが、実処理工程中にて同時に実施して
も良い。この場合、上述のボート６０，７０が実処理ボ
ートとして使用される。このとき、図１の第１の温度検
出部４０とメモリ５０とは不要である。実処理中に第２
の温度検出部６５または７１にて温度検出し、その検出
温度に基づいて温度制御部５２がヒータ１６を制御すれ
ばよい。Although the above-mentioned temperature measuring step for correction is carried out before the actual processing step, it may be carried out simultaneously during the actual processing step. In this case, the above-mentioned boats 60 and 70 are used as actual processing boats. At this time, the first temperature detection unit 40 and the memory 50 of FIG. 1 are unnecessary. Second during actual processing
The temperature detector 65 or 71 may detect the temperature, and the temperature controller 52 may control the heater 16 based on the detected temperature.
【００３２】また、本発明の熱処理方法は、酸化または
拡散処理などの常圧処理のほか、減圧処理にも適用でき
る。第２の温度検出部６５または７１が配置される中空
部６４が、減圧雰囲気から真空シールされていれば良
い。石英同士の接合でもその接合部の耐真空強度を確保
することが可能であり、中空部６４が形成される支柱６
３の肉厚を、耐真空を考慮して設定すればよい。The heat treatment method of the present invention can be applied not only to atmospheric pressure treatment such as oxidation or diffusion treatment, but also to reduced pressure treatment. The hollow portion 64 in which the second temperature detecting portion 65 or 71 is arranged may be vacuum-sealed from the reduced pressure atmosphere. Even if the quartz pieces are joined together, the vacuum resistance strength of the joined portion can be ensured, and the pillar 6 in which the hollow portion 64 is formed is formed.
The thickness of 3 may be set in consideration of vacuum resistance.
【００３３】以上の通り本実施の形態によれば、より厳
密な温度管理が求められる処理が実施される縦型炉に
て、被処理体の近傍にて精度高く温度検出することが可
能となる。よって、処理特性の要求が厳しい処理を、厳
密な温度管理下で実施することができ、処理の歩留まり
を向上させることができる。As described above, according to the present embodiment, it becomes possible to detect the temperature in the vicinity of the object to be processed with high accuracy in the vertical furnace in which the process requiring more strict temperature control is carried out. . Therefore, it is possible to carry out a process having strict requirements for processing characteristics under strict temperature control, and it is possible to improve the process yield.
【００３４】なお、本発明は上記実施形態に限定される
ものではなく、本発明の要旨の範囲内で種々の変形実施
が可能である。例えば、図１に示す第１の温度検出部４
０の位置は、プロセスチューブ１８の外であればよく、
必ずしも図１に示す位置に設定するものに限らない。The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the gist of the present invention. For example, the first temperature detector 4 shown in FIG.
The position of 0 may be outside the process tube 18,
The position is not necessarily set to the position shown in FIG.
【図１】本発明の一実施形態に係る縦型熱処理炉の断面
図である。FIG. 1 is a cross-sectional view of a vertical heat treatment furnace according to an embodiment of the present invention.
【図２】温度データ計測用ボートの概略説明図である。FIG. 2 is a schematic explanatory view of a boat for measuring temperature data.
【図３】図２に示すボートでのダミーウエハの支持状態
を説明するための概略説明図である。FIG. 3 is a schematic explanatory view for explaining a supporting state of dummy wafers in the boat shown in FIG.
【図４】図２に示すボート中の１本の支柱内に配置され
る第２の温度検出部を示す概略説明図である。FIG. 4 is a schematic explanatory view showing a second temperature detection unit arranged in one column of the boat shown in FIG.
【図５】図２に示す温度データ計測用ボートを縦型熱処
理炉に搬入した状態を示す概略断面図である。5 is a schematic cross-sectional view showing a state in which the boat for temperature data measurement shown in FIG. 2 is carried into a vertical heat treatment furnace.
【図６】温度データ計測用ボートの変形例を示す概略説
明である。FIG. 6 is a schematic explanation showing a modified example of the temperature data measuring boat.
１０ 縦型熱処理炉 １２ アウターシェル １４ 断熱材 １６ ヒータ １８ プロセスチューブ（縦型反応管） ２０ ガス導入管 ２２ 排気管 ３０ 実処理用ボート ３２ ボートエレベータ ３４ 保温筒 ４０ 第１の温度検出部 ５０ メモリ ５２ 温度制御部 ６０ 温度計測用ボート ６１，６２ フランジ ６３ 支柱 ６４ 中空部 ６５ 第２の温度検出部 ７０ 温度計測用ボート ７１ 第２の温度検出部 ７２ 上下動機構 10 Vertical heat treatment furnace 12 Outer shell 14 Insulation 16 heater 18 Process tube (vertical reaction tube) 20 gas introduction pipe 22 Exhaust pipe 30 Boats for actual processing 32 boat elevator 34 Insulation tube 40 First temperature detector 50 memory 52 Temperature control unit 60 Temperature measuring boat 61,62 Flange 63 props 64 hollow 65 Second temperature detector 70 Temperature Measuring Boat 71 Second temperature detector 72 Vertical movement mechanism
フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） // Ｃ２３Ｃ 16/52 Ｃ２３Ｃ 16/52 Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) // C23C 16/52 C23C 16/52
Claims (11)
とを搭載し、縦型反応管内の処理位置に設定する工程
と、 前記縦型反応管内を、ヒータにより所定温度に設定する
工程と、 前記ボートに搭載された温度検出部により、前記ボート
雰囲気の温度分布を測定する工程と、を有することを特
徴とする縦型炉の温度測定方法。1. A step of mounting a plurality of objects to be processed and a temperature detection unit on a boat and setting the processing position in a vertical reaction tube, and a step of setting a predetermined temperature in the vertical reaction tube by a heater. And a step of measuring a temperature distribution of the boat atmosphere by a temperature detection unit mounted on the boat, the method for measuring temperature in a vertical furnace.
素子を、縦軸方向に沿って移動させて、前記ボート雰囲
気の温度分布を測定することを特徴とする縦型炉の温度
測定方法。2. The temperature distribution of the boat atmosphere according to claim 1, wherein at least one temperature detection element provided in the temperature detection unit is moved along a vertical axis direction. Vertical furnace temperature measurement method.
数の温度検出素子によりそれぞれ温度検出して、前記ボ
ート雰囲気の温度分布を測定することを特徴とする縦型
炉の温度測定方法。3. The temperature detection unit according to claim 1, wherein the temperature detection unit measures the temperature distribution of the boat atmosphere by detecting the temperature with each of a plurality of temperature detection elements provided along the longitudinal axis thereof. Measuring method for vertical furnace temperature.
前記被処理体が支持され、前記複数の支柱の少なくとも
１本に設けられた中空部に前記温度検出部が配置されて
いることを特徴とする縦型炉の温度測定方法。4. The hollow boat according to claim 1, wherein the boat is supported by a plurality of columns that connect flanges at both ends, and the processing target is supported by at least one of the columns. A temperature measuring method for a vertical furnace, characterized in that the temperature detecting section is disposed in the section.
体が支持され、前記複数の支柱とは別の少なくとも１本
の支柱に設けられた中空部に前記温度検出部が配置され
ていることを特徴とする縦型炉の温度測定方法。5. The object to be processed according to claim 1, wherein the object to be processed is supported by a plurality of columns that connect the flanges on both ends, and the at least one column other than the plurality of columns is provided. A temperature measuring method for a vertical furnace, wherein the temperature detecting unit is disposed in the hollow portion.
れ、実処理前に前記ボート雰囲気の温度分布を予備測定
することを特徴とする縦型炉の温度測定方法。6. The boat according to claim 1, wherein the plurality of dummy objects to be processed are mounted on the boat, and the temperature distribution of the boat atmosphere is preliminarily measured before actual processing. Vertical furnace temperature measurement method.
スと実質的に同じ供給量にて、不活性ガスが縦型反応管
内に導入されることを特徴とする縦型炉の温度測定方
法。7. The inert gas according to claim 6, wherein the inert gas is introduced into the vertical reaction tube at a supply amount substantially the same as that of the gas introduced during the actual treatment during the preliminary measurement step. And a method for measuring the temperature of a vertical furnace.
工程と、 実処理用ボートに複数の被処理体を搭載して、前記縦型
反応管内の処理位置に前記実処理用ボートを設定する工
程と、 前記反応管内を前記ヒータによりプロセス温度に設定す
ると共に、プロセスガスを導入して前記複数の被処理体
を熱処理する工程と、 前記ヒータにより昇温される温度を、前記反応管外で測
定する工程と、 前記反応管外で測定された温度を、前記温度予備測定工
程により測定された温度分布に基づいて修正して、前記
ヒータを制御する工程と、を有することを特徴とする熱
処理方法。8. The temperature preliminary measurement step according to claim 6 or 7, wherein a plurality of objects are mounted on an actual processing boat, and the actual processing boat is set at a processing position in the vertical reaction tube. The step of setting the inside of the reaction tube to the process temperature by the heater and introducing the process gas to heat-treat the plurality of objects to be processed, and the temperature raised by the heater is set to the temperature outside the reaction tube. And a step of controlling the heater by correcting the temperature measured outside the reaction tube based on the temperature distribution measured by the temperature preliminary measurement step. Heat treatment method.
支持する支持部と、 前記複数の支柱の少なくとも１本に設けられた中空部
と、 前記中空部内に配置された温度検出部と、を有すること
を特徴とするボート。9. A flange at both ends, a plurality of pillars connecting the flanges at both ends, a support portion provided on each of the plurality of pillars and supporting a plurality of objects to be processed, and at least one of the plurality of pillars. A boat having a hollow portion provided in a book and a temperature detecting portion arranged in the hollow portion.
と、 前記複数の支柱のうち、前記少なくとも１本以外の他の
支柱にそれぞれ設けられ、複数の被処理体を支持する支
持部と、 前記中空部内に配置された温度検出部と、を有すること
を特徴とするボート。10. A flange at both ends, a plurality of pillars connecting the flanges at both ends, a hollow portion provided in at least one of the plurality of pillars, and at least one of the plurality of pillars other than the at least one pillar. A boat, comprising: a support portion that is provided on each of the other columns and that supports a plurality of objects to be processed; and a temperature detection portion that is disposed inside the hollow portion.
とも一つの温度検出素子を有することを特徴とするボー
ト。11. The boat according to claim 10, wherein the temperature detection unit has at least one temperature detection element movable in the hollow portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002114338A JP2003309077A (en) | 2002-04-17 | 2002-04-17 | Method for measuring temperature of vertical furnace and method for heat treating and boat used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002114338A JP2003309077A (en) | 2002-04-17 | 2002-04-17 | Method for measuring temperature of vertical furnace and method for heat treating and boat used therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003309077A true JP2003309077A (en) | 2003-10-31 |
Family
ID=29396189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002114338A Withdrawn JP2003309077A (en) | 2002-04-17 | 2002-04-17 | Method for measuring temperature of vertical furnace and method for heat treating and boat used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003309077A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012042772A1 (en) * | 2010-09-29 | 2012-04-05 | 株式会社アルバック | Thin film manufacturing method and thin film manufacturing apparatus |
-
2002
- 2002-04-17 JP JP2002114338A patent/JP2003309077A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012042772A1 (en) * | 2010-09-29 | 2012-04-05 | 株式会社アルバック | Thin film manufacturing method and thin film manufacturing apparatus |
| JP5560344B2 (en) * | 2010-09-29 | 2014-07-23 | 株式会社アルバック | Thin film manufacturing method |
| US9145605B2 (en) | 2010-09-29 | 2015-09-29 | Ulvac, Inc. | Thin-film forming method and thin-film forming apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101585287B1 (en) | Heat treatment apparatus and control method thereof | |
| JP2003282578A (en) | Heat treatment device and manufacturing method for semiconductor | |
| US4937434A (en) | Heat treatment apparatus and heat treatment method | |
| JP5028352B2 (en) | Temperature control method, temperature correction value acquisition method, semiconductor manufacturing method, substrate processing apparatus | |
| KR101482039B1 (en) | Heat treatment apparatus and heat treatment method | |
| JP3688264B2 (en) | Heat treatment method and heat treatment apparatus | |
| US5626680A (en) | Thermal processing apparatus and process | |
| JP4393009B2 (en) | Vertical heat treatment equipment | |
| JP2003309077A (en) | Method for measuring temperature of vertical furnace and method for heat treating and boat used therefor | |
| JPH03145121A (en) | Temperature controller for heat treatment of semiconductor | |
| JPH09145491A (en) | Temperature control device of heat treatment furnace | |
| JP2002208591A (en) | Heat treatment apparatus | |
| JPH0729838A (en) | Vertical furnace for semiconductor fabrication system | |
| JP2002110556A (en) | Heat treatment apparatus | |
| JPH0693439B2 (en) | Semiconductor wafer heat treatment equipment | |
| JP3114063B2 (en) | Semiconductor manufacturing equipment | |
| JP3130908B2 (en) | Temperature measurement method for heat treatment furnace for substrates | |
| JP4783029B2 (en) | Heat treatment apparatus and substrate manufacturing method | |
| US20230422348A1 (en) | Substrate processing apparatus and substrate processing method | |
| JP2002134491A (en) | Heat treatment apparatus | |
| JP2005217317A (en) | Substrate processing equipment | |
| JP2004071794A (en) | Substrate treatment equipment | |
| JPH0637025A (en) | Heat treatment apparatus | |
| JP2008085206A (en) | Semiconductor-wafer thermal treatment boat and method for heat-treating semiconductor wafer | |
| JPH08203795A (en) | Reaction furnace for semiconductor manufacture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050705 |