JP2003298385A - At cut crystal resonator and its manufacturing method - Google Patents
At cut crystal resonator and its manufacturing methodInfo
- Publication number
- JP2003298385A JP2003298385A JP2002096721A JP2002096721A JP2003298385A JP 2003298385 A JP2003298385 A JP 2003298385A JP 2002096721 A JP2002096721 A JP 2002096721A JP 2002096721 A JP2002096721 A JP 2002096721A JP 2003298385 A JP2003298385 A JP 2003298385A
- Authority
- JP
- Japan
- Prior art keywords
- cut
- vibrating piece
- crystal
- pair
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明に属する技術分野】本発明は、携帯情報機器に用
いられる水晶振動子に関し、特にフォトリソエッチング
加工により製造されるＡＴカット水晶振動子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal unit used in portable information equipment, and more particularly to an AT-cut crystal unit manufactured by photolithography etching.
【０００２】[0002]
【従来の技術】図３は、従来の水晶振動子を示す平面図
である。水晶振動子１０は、水晶ウエハからの切り離し
部４が1ヶ所で、振動片１の支持部の中央にあった。支
持部は、導電性接着剤３により、ケース２に固定され、
励振電極と電気的に導通している。2. Description of the Related Art FIG. 3 is a plan view showing a conventional crystal oscillator. The crystal unit 10 was provided with a single cut-off portion 4 from the crystal wafer at the center of the support portion of the resonator element 1. The support portion is fixed to the case 2 by the conductive adhesive 3,
It is electrically connected to the excitation electrode.
【０００３】[0003]
【発明が解決しようとする課題】しかし、このような従
来の方法には次のような課題があった。従来の切り離し
部４が1ヶ所しかないものでは、振動片１を水晶ウエハ
から切り離したときに切り離し部４にクラックが発生す
ることがある。そして、切り離し部４の微小な水晶片
が、ケース２に支持された振動片１の電極表面に付着し
てドライブ特性の劣化を生じていた。However, such a conventional method has the following problems. In the case where the conventional separating portion 4 has only one place, cracks may occur in the separating portion 4 when the vibrating piece 1 is separated from the crystal wafer. Then, the minute crystal piece of the separating portion 4 adheres to the electrode surface of the vibrating piece 1 supported by the case 2 to cause deterioration of drive characteristics.
【０００４】[0004]
【課題を解決するための手段】本発明は、振動片の一辺
に一対の取り出し電極を有し、取り出し電極から振動片
の外周方向に延設された一対の切り離し部を有し、切り
離し部を導電接着剤でケースに固定したＡＴカット圧電
振動子とした。ここで切り離し部の間隔を、圧電振動片
の取り出し電極を有する辺の幅をＷとしたとき、0.５Ｗ
から0.9Ｗとすると良い。ここで、振動片の幅一杯に切
り離し部の間隔を広げると、切り離し時に振動片の側面
に大きなクラックが発生する。また、切り離し部の間隔
を狭めると、導電接着剤の塗布時に電気的にショートを
発生することがある。According to the present invention, there is provided a pair of extraction electrodes on one side of a vibrating piece, and a pair of separating portions extending from the extracting electrodes in the outer peripheral direction of the vibrating piece. The AT-cut piezoelectric vibrator was fixed to the case with a conductive adhesive. Here, when the width of the side having the extraction electrode of the piezoelectric vibrating piece is W, the distance between the separated portions is 0.5 W
To 0.9W is recommended. Here, if the separation portion is widened to fill the width of the resonator element, a large crack is generated on the side surface of the resonator element during separation. Further, if the distance between the cut-off portions is narrowed, an electrical short circuit may occur when the conductive adhesive is applied.
【０００５】本発明では振動片の水晶ウエハからの切り
離し部を２ヶ所にして、切り欠きノッチをつけることで
容易に振動片を切り離し、ケースに支持する際に支持部
表面を水晶クラック片の発生が無いように導電性接着剤
で覆うように塗布し、接着することでケースと振動子を
電気的機械的に接続することができ、クラック片の発生
や飛散を接着剤により防止することにより、ドライブ特
性の安定した振動子の製造が可能となり、上記課題を解
決できる。According to the present invention, the vibrating piece is easily separated by forming the notch notch at two places where the vibrating piece is separated from the crystal wafer, and when supporting the vibrating piece on the case, crystal crack pieces are generated on the surface of the supporting portion. It is possible to electrically and mechanically connect the case and the vibrator by applying by coating so as to cover with a conductive adhesive so that there is no, and by preventing the occurrence of crack pieces and scattering by the adhesive, It is possible to manufacture a vibrator with stable drive characteristics, and solve the above problems.
【０００６】[0006]
【発明の実施形態】以下に本発明の実施例を図面により
説明する。図1は本発明の振動片切り離し形状を説明す
る図である。セラミックパッケージで大きさが3.2×2.5
ｍｍのケース２に搭載される振動片１は長さ（Ｌ）が2.
0ｍｍ程度、幅（Ｗ）が1.0〜1.3ｍｍ程度の大きさであ
る。振動片１の表面には励振電極１２と、励振電極１２
に接続された一対の取り付け電極１３が一つの片上にあ
る。切り離し部４の形状は2ヶ所のピッチ（ｐ）が0.8ｍ
ｍ程度、切り欠きノッチ寸法（ａ）が0.1ｍｍ程度の大
きさである。このような振動片を水晶ウエハから切り離
した後、図２に示すようにケース２に支持し、切り離し
部４表面に導電性接着剤３を塗布することで、水晶クラ
ック片の脱落・電極表面への付着が無くなり、ドライブ
特性の安定した振動子が製造できる。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram for explaining a vibrating piece separating shape of the present invention. Size of ceramic package is 3.2 × 2.5
The length (L) of the resonator element 1 mounted on the case 2 of 2 mm is 2.
The size is about 0 mm and the width (W) is about 1.0 to 1.3 mm. The excitation electrode 12 and the excitation electrode 12 are provided on the surface of the vibrating piece 1.
There is a pair of mounting electrodes 13 connected to one on one piece. The shape of the separation part 4 has a pitch (p) of 0.8m at two locations.
The notch notch size (a) is about 0.1 mm. After separating such a vibrating piece from the crystal wafer, it is supported by the case 2 as shown in FIG. 2, and the conductive adhesive 3 is applied to the surface of the separating part 4 to remove the crystal crack piece and to the electrode surface. It is possible to manufacture a vibrator with stable drive characteristics by eliminating the adhesion of.
【０００７】[0007]
【発明の効果】このように本発明によれば、水晶の小片
が振動片の表面に付着することがなく、水晶振動子のド
ライブ特性の向上が実現できる。As described above, according to the present invention, it is possible to improve the drive characteristics of the crystal unit without causing the small piece of crystal to adhere to the surface of the vibrating piece.
【図１】本発明の振動片形状を説明する図である。FIG. 1 is a diagram illustrating the shape of a resonator element according to the present invention.
【図２】本発明の支持形態を説明する図である。FIG. 2 is a diagram illustrating a supporting form of the present invention.
【図３】従来の振動子支持形態を説明する図である。FIG. 3 is a diagram for explaining a conventional vibrator support mode.
１ 振動片 ２ ケース ３ 導電性接着剤 ４ 切り離し部 １２ 励振電極 １３ 取り付け電極 1 vibrating piece 2 cases 3 Conductive adhesive 4 Separation section 12 Excitation electrode 13 Mounting electrode
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０３Ｈ 9/02 Ｈ０１Ｌ 41/18 １０１Ａ 9/10 41/22 Ｚ ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H03H 9/02 H01L 41/18 101A 9/10 41/22 Z
Claims (6)
し、前記一対の取り出し電極から前記振動片の外周方向
に延設された一対の切り離し部を有し、前記切り離し部
を導電接着剤でケースに固定したＡＴカット圧電振動
子。1. A pair of extraction electrodes is provided on one side of a vibrating piece, and a pair of disconnecting portions is provided extending from the pair of extracting electrodes in the outer peripheral direction of the vibrating piece. AT cut piezoelectric vibrator fixed to the case with.
片の前記取り出し電極を有する辺の幅をＷとすると、0.
５Ｗから0.9Ｗである請求項１記載のＡＴカット圧電振
動子。2. When the width of the side of the piezoelectric vibrating reed having the lead-out electrode is W, the distance between the cut-off portions is 0.
The AT-cut piezoelectric vibrator according to claim 1, which is 5 W to 0.9 W.
れたＡＴカット水晶振動子において、水晶片の切り離し
部が2箇所もつことを特徴とするＡＴカット水晶振動
子。3. An AT-cut crystal unit manufactured by photolithographic etching, wherein the crystal unit has two cut-off portions.
し、容易に振動片を切り離せることが特徴とするＡＴカ
ット水晶振動子。4. An AT-cut quartz crystal resonator having a notch in the cut-off portion so that the resonator element can be easily cut off.
導電性接着剤を塗布することを特徴とするＡＴカット水
晶振動子。5. An AT-cut crystal unit, wherein a conductive adhesive is applied to the surfaces of the two cut-off portions of the crystal piece.
を介して振動片を形成し、前記振動片に励振電極と、励
振電極に接続され前記切り離し部に接する取り出し電極
を形成し、ケース上に前記振動子を配置し、前記取り出
し電極と前記切り離し部に導電性接着剤により前記ケー
スと前記振動片を電気的機械的に接続するＡＴカット水
晶振動子の製造方法。6. A vibrating piece is formed on a piezoelectric vibrator wafer via a pair of separating parts, and an exciting electrode and an extraction electrode connected to the exciting electrode and in contact with the separating part are formed on the vibrating piece. A method of manufacturing an AT-cut crystal oscillator, wherein the oscillator is disposed in the case, and the case and the vibrating piece are electrically and mechanically connected to the extraction electrode and the separation portion by a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002096721A JP2003298385A (en) | 2002-03-29 | 2002-03-29 | At cut crystal resonator and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002096721A JP2003298385A (en) | 2002-03-29 | 2002-03-29 | At cut crystal resonator and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003298385A true JP2003298385A (en) | 2003-10-17 |
Family
ID=29387510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002096721A Pending JP2003298385A (en) | 2002-03-29 | 2002-03-29 | At cut crystal resonator and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003298385A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005130070A (en) * | 2003-10-22 | 2005-05-19 | Toyo Commun Equip Co Ltd | Crystal oscillator element and manufacturing method thereof, and surface-mounted crystal device employing same |
| JP2007142526A (en) * | 2005-11-15 | 2007-06-07 | Epson Toyocom Corp | Piezoelectric wafer and piezoelectric device |
| JP2011019206A (en) * | 2009-06-10 | 2011-01-27 | Seiko Epson Corp | Method of manufacturing piezoelectric vibrating piece, and method of manufacturing piezoelectric vibrator |
| JP2017118307A (en) * | 2015-12-24 | 2017-06-29 | 株式会社大真空 | Crystal wafer |
| JP2017135512A (en) * | 2016-01-26 | 2017-08-03 | 株式会社大真空 | Manufacturing method of crystal vibration device |
| JP2019154026A (en) * | 2018-03-01 | 2019-09-12 | 株式会社大真空 | Piezoelectric vibration device |
-
2002
- 2002-03-29 JP JP2002096721A patent/JP2003298385A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005130070A (en) * | 2003-10-22 | 2005-05-19 | Toyo Commun Equip Co Ltd | Crystal oscillator element and manufacturing method thereof, and surface-mounted crystal device employing same |
| JP4507551B2 (en) * | 2003-10-22 | 2010-07-21 | エプソントヨコム株式会社 | Quartz crystal resonator element, method for manufacturing the same, and surface mount crystal device using the crystal resonator element |
| JP2007142526A (en) * | 2005-11-15 | 2007-06-07 | Epson Toyocom Corp | Piezoelectric wafer and piezoelectric device |
| JP2011019206A (en) * | 2009-06-10 | 2011-01-27 | Seiko Epson Corp | Method of manufacturing piezoelectric vibrating piece, and method of manufacturing piezoelectric vibrator |
| JP2017118307A (en) * | 2015-12-24 | 2017-06-29 | 株式会社大真空 | Crystal wafer |
| JP2017135512A (en) * | 2016-01-26 | 2017-08-03 | 株式会社大真空 | Manufacturing method of crystal vibration device |
| JP2019154026A (en) * | 2018-03-01 | 2019-09-12 | 株式会社大真空 | Piezoelectric vibration device |
| JP7206924B2 (en) | 2018-03-01 | 2023-01-18 | 株式会社大真空 | piezoelectric vibration device |
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